Terminal board

Abstract

To provide a terminal board capable of suppressing an increase in size.SOLUTION: An input terminal board 23 is arranged on a base 251 that serves as a cooler. The input terminal board 23 includes a plurality of bus bars 30 arranged along the base 251, and a resin body 40 having a main body portion that surrounds and holds intermediate portions of the plurality of bus bars 30. The main body portion includes a first resin part 41 that covers, among surfaces of the bus bars 30, at least a lower surface 301 facing the base 251, and a second resin part 42 that is interposed between adjacent bus bars 30 and integrally covers the plurality of bus bars 30 and the first resin part 41. The first resin part 41 has higher thermal conductivity than the second resin part 42. A portion of the first resin part 41 exposed from the second resin part 42 is thermally connected to the base 251.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The disclosure herein relates to terminal blocks. [Background technology]

[0002] Patent Document 1 discloses a terminal block. The contents of the prior art documents are incorporated by reference as explanations of the technical elements in this specification. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-117643 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, multiple bus bars are integrated with a resin body that holds the bus bars by insert molding. The middle portions of the bus bars are covered with resin, which traps heat. In particular, in high-current applications such as power conversion devices for vehicle drivetrains, self-heating of the bus bars may reduce connection reliability. Increasing the cross-sectional area of ​​the bus bars, such as their thickness or width, to suppress self-heating increases the size of the terminal block. Further improvements in terminal blocks are needed in the above and other aspects not mentioned.

[0005] One disclosed object is to provide a terminal block that can suppress an increase in size. [Means for solving the problem]

[0006] One aspect of the disclosure is a terminal block disposed on the cooler (251), A plurality of bus bars (30) arranged along the cooler; a resin body (40) having a main body (401) that surrounds and holds intermediate portions of the plurality of bus bars; Equipped with the main body portion includes a first resin portion (41) that covers at least a lower surface (301) of the bus bars that faces the cooler, and a second resin portion (42) that is interposed between adjacent bus bars and integrally covers the plurality of bus bars and the first resin portion; The first resin part has better thermal conductivity than the second resin part, The portion of the first resin portion that is exposed from the second resin portion is thermally connected to the cooler.

[0007] According to the disclosed terminal block, by providing the first resin portion, which has excellent thermal conductivity, on the underside of the busbar, heat dissipation is improved and the physical size can be suppressed compared to a configuration in which the second resin portion is provided on the underside. Furthermore, by providing the second resin portion between the busbars, insulation between the busbars can be ensured and the physical size can be suppressed.

[0008] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims are intended to exemplarily indicate the corresponding parts of the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 illustrates a power conversion circuit and a drive system. [Figure 2] FIG. 2 is a plan view showing the power conversion device. [Figure 3] FIG. 2 is a plan view showing the terminal block according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 10 is a cross-sectional view showing a modified example. [Figure 6] FIG. 10 is a cross-sectional view showing a modified example. [Figure 7] FIG. 10 is a cross-sectional view showing a modified example. [Figure 8] FIG. 10 is a cross-sectional view showing a terminal block according to a second embodiment. [Figure 9] FIG. 10 is a cross-sectional view showing a modified example. [Figure 10] FIG. 10 is a cross-sectional view showing a terminal block according to a third embodiment. [Figure 11] FIG. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 10 is a cross-sectional view showing a terminal block according to a fourth embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing a terminal block according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments will be described with reference to the drawings. Note that in each embodiment, corresponding components are designated by the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment previously described may be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments may be partially combined together even if not explicitly stated, provided that there is no particular problem with the combination.

[0011] (First embodiment) The terminal block of this embodiment is applied to a mobile body that uses a rotating electric machine as a drive source. Examples of the mobile body include electric vehicles such as battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), and plug-in hybrid electric vehicles (PHEVs), electric flying bodies such as drones and electric vertical take-off and landing aircraft (eVTOLs), ships, construction machinery, and agricultural machinery. BEV is an abbreviation for Battery Electric Vehicle. HEV is an abbreviation for Hybrid Electric Vehicle. eVTOL is an abbreviation for electronic Vertical Take-Off and Landing aircraft. An example in which the terminal block is applied to a vehicle will be described below.

[0012] <Drive system> As shown in FIG. 1, a vehicle drive system 1 includes a DC power supply 2, a motor generator 3, and a power conversion circuit 4.

[0013] The DC power supply 2 is a DC voltage source composed of a rechargeable secondary battery. The secondary battery may be, for example, a lithium-ion battery or a nickel-metal hydride battery. The motor generator 3 is a three-phase AC rotating electric machine. The motor generator 3 functions as a drive source for the vehicle, that is, an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion circuit 4 converts power between the DC power supply 2 and the motor generator 3.

[0014] <Power conversion circuit> 1 shows an example of a power conversion circuit 4. The power conversion circuit 4 shown in FIG.

[0015] The inverter 5 is a DC-AC conversion circuit. In accordance with switching control by the control circuit, the inverter 5 converts a DC voltage into a three-phase AC voltage and outputs it to the motor generator 3. This drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 5 converts the three-phase AC voltage generated by the motor generator 3 in response to rotational force from the wheels into a DC voltage in accordance with switching control by the control circuit and outputs it to the DC power supply side. In this way, the inverter 5 performs bidirectional power conversion between the DC power supply 2 and the motor generator 3.

[0016] The inverter 5 is configured with upper and lower arm circuits 8 for three phases. The upper and lower arm circuits 8 are sometimes referred to as legs. The upper and lower arm circuits 8 are connected to a P line 9, which is a power supply line on the high potential side, and an N line 10, which is a power supply line on the low potential side. The P line 9 is connected to the positive electrode of the DC power supply 2, and the N line 10 is connected to the negative electrode of the DC power supply 2. The upper and lower arm circuit 8 has an upper arm 8H and a lower arm 8L. The upper arm 8H and the lower arm 8L are connected in series between the P line 9 and the N line 10, with the upper arm 8H on the P line 9 side.

[0017] The connection point between the upper arm 8H and the lower arm 8L is connected to the winding 3a of the corresponding phase in the motor generator 3 via an output line 11. The inverter 5 has six arms. Each arm is configured with a switching element. The number of switching elements constituting each arm is not particularly limited. There may be one or more. When there are more than one switching elements, the multiple switching elements connected in parallel to each other are turned on and off at the same timing by a common gate drive signal (drive voltage).

[0018] The illustrated switching element is an n-channel MOSFET 12. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. In the upper arm 8H, a drain terminal of the MOSFET 12 is connected to a P line 9. In the lower arm 8L, a source terminal of the MOSFET 12 is connected to an N line 10. The source terminal of the MOSFET 12 in the upper arm 8H and the drain terminal of the MOSFET 12 in the lower arm 8L are connected to each other.

[0019] A freewheeling diode 13 is connected in antiparallel to each MOSFET 12. The diode 13 may be a parasitic diode (body diode) of the MOSFET 12, or may be provided separately from the parasitic diode. The anode terminal of the diode 13 is connected to the source terminal of the corresponding MOSFET 12, and the cathode terminal is connected to the drain terminal.

[0020] The switching element is not limited to the MOSFET 12. For example, an IGBT may be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. In the case of an IGBT, a freewheeling diode is also connected in anti-parallel.

[0021] The smoothing capacitor 6 mainly smoothes the DC voltage supplied from the DC power supply 2. The smoothing capacitor 6 is connected to a P line 9 and an N line 10. The positive electrode of the smoothing capacitor 6 is connected to the P line 9 between the DC power supply 2 and the inverter 5. The negative electrode of the smoothing capacitor 6 is connected to the N line 10 between the DC power supply 2 and the inverter 5.

[0022] Y capacitor 7 removes noise, for example, noise caused by the switching operation of inverter 5. Y capacitor 7 has two Y capacitor elements 7H and 7L. Y capacitor elements 7H and 7L are connected in series between P line 9 and N line 10, with Y capacitor element 7H on the P line 9 side.

[0023] The connection point between Y capacitor element 7H and Y capacitor element 7L is electrically connected to the vehicle ground. The vehicle ground is the ground potential (reference potential) in the vehicle. The vehicle ground is sometimes referred to as the body ground, chassis ground, etc. The connection point between Y capacitor elements 7H and 7L is electrically connected to a component that provides the ground potential in the vehicle, such as the body or chassis, via a bus bar or the like (not shown).

[0024] Y capacitor elements 7H and 7L remove noise components leaking from inverter 5 by channeling the noise components to the vehicle ground. Y capacitor elements 7H and 7L can remove not only noise components leaking from inverter 5 but also noise components flowing through P line 9 and N line 10.

[0025] The power conversion circuit 4 may include a drive circuit for a switching element constituting the inverter 5 or the like. The drive circuit supplies a drive voltage to the gate of the MOSFET 12 of the corresponding arm based on a drive command from the control circuit. The drive circuit drives the corresponding MOSFET 12, i.e., turns it on and off, by applying the drive voltage. The drive circuit is sometimes referred to as a driver.

[0026] The power conversion circuit 4 may include a control circuit for the switching element. The control circuit generates a drive command for operating the MOSFET 12 and outputs it to the drive circuit. The control circuit generates the drive command based on, for example, a torque request input from a higher-level ECU (not shown) and signals detected by various sensors. ECU is an abbreviation for Electronic Control Unit.

[0027] The various sensors include, for example, a current sensor, a rotation angle sensor, and a voltage sensor. The current sensor detects the phase current flowing through the winding 3a of each phase. The rotation angle sensor detects the rotation angle of the rotor of the motor generator 3. The voltage sensor detects the voltage across the smoothing capacitor 6. The control circuit outputs, for example, a PWM signal as a drive command. The control circuit is configured with, for example, a processor and a memory. PWM is an abbreviation for Pulse Width Modulation.

[0028] <Power conversion device> Fig. 2 shows an example of a power conversion device including a terminal block. Fig. 2 shows a simplified structure of the power conversion device. The power conversion device 20 shown in Fig. 2 provides the above-described power conversion circuit 4. The illustrated power conversion device 20 includes a semiconductor module 21, a capacitor module 22, an input terminal block 23, an output terminal block 24, and a housing 25. First, the elements of the power conversion device 20 other than the capacitor module 22 will be described.

[0029] In the following, the extension direction of the bus bars that make up the input terminal block is referred to as the Y direction, and the arrangement direction of the multiple bus bars is referred to as the X direction. The direction perpendicular to both the Y direction and the X direction is referred to as the Z direction. The X direction, Y direction, and Z direction are mutually perpendicular. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X direction and Y direction, is referred to as the planar shape. The planar view from the Z direction is sometimes simply referred to as the planar view.

[0030] The semiconductor module 21 constitutes the upper and lower arm circuits 8, i.e., the inverter 5. The semiconductor module 21 may also be called a power module, a semiconductor device, etc. The semiconductor module 21 includes a plurality of semiconductor elements 211, a sealing body 212, a plurality of main terminals 213, etc.

[0031] The semiconductor element 211 is formed by forming a switching element on a semiconductor substrate made of silicon (Si) or a wide bandgap semiconductor with a wider bandgap than silicon. The switching element has a vertical structure so that the main current flows in the thickness direction of the semiconductor substrate. Examples of wide bandgap semiconductors include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond.

[0032] The illustrated semiconductor element 211 is formed by forming the above-described n-channel MOSFET 12 and diode 13 on a semiconductor substrate made of SiC. The MOSFET 12 has a vertical structure so that a main current flows in the thickness direction of the semiconductor element 211 (semiconductor substrate). The semiconductor element 211 has main electrodes (not shown) on both sides in the thickness direction of the semiconductor element 211. The semiconductor element 211 has, as main electrodes, a source electrode on the front surface and a drain electrode on the back surface. The source electrode is formed on a part of the front surface. The drain electrode is formed on almost the entire back surface.

[0033] A main current flows between the drain electrode and the source electrode. The semiconductor element 211 has a pad (not shown) that is a signal electrode on the surface where the source electrode is formed. The illustrated semiconductor element 211 is arranged so that its plate thickness direction is approximately parallel to the Z direction. The semiconductor element 211 includes three semiconductor elements 211H that constitute the upper arms 8H for three phases and three semiconductor elements 211L that constitute the lower arms 8L for three phases.

[0034] The encapsulant 212 encapsulates some of the other elements that make up the semiconductor module 21. The remaining parts of the other elements are exposed to the outside of the encapsulant 212. The encapsulant 212 encapsulates parts of the semiconductor element 211, the main terminals 213, and the like. The encapsulant 212 is made of, for example, resin. The encapsulant 212 is molded by transfer molding using, for example, epoxy resin. The encapsulant 212 forms the outer shell of the main body.

[0035] The main terminals 213 are external connection terminals for electrically connecting the semiconductor module 21 to an external device, and are terminals electrically connected to the main electrodes of the semiconductor element 211. The main terminals 213 include a P-terminal 213P, an N-terminal 213N, and an O-terminal 213O. The P-terminal 213P is electrically connected to the drain electrode of the semiconductor element 211H. The N-terminal 213N is electrically connected to the source electrode of the semiconductor element 211L. The illustrated P-terminal 213P and N-terminal 213N protrude to the outside from a side surface of the sealing body 212 facing the capacitor module 22. The protruding portions of the P-terminal 213P and the N-terminal 213N are aligned in the Y direction.

[0036] The O terminal 213O is electrically connected to the connection point (midpoint) between the source electrode of the semiconductor element 211H and the drain electrode of the semiconductor element 211L. The illustrated O terminal 213O protrudes to the outside from the side surface of the sealing body 212 opposite to the side surface from which the P terminal 213P and the N terminal 213N protrude. The O terminal 213O protrudes to the outside from the side surface opposite to the surface facing the capacitor module 22. In addition to the main terminal 213, the external connection terminals also include signal terminals (not shown) electrically connected to pads.

[0037] In addition to the above-mentioned elements, the semiconductor module 21 also includes a wiring member (not shown). The wiring member provides a wiring function that electrically connects the main electrodes of the semiconductor element 211 to the main terminals 213. The wiring member provides a heat dissipation function that dissipates heat from the semiconductor element 211. The wiring member may be, for example, a substrate in which metal bodies are arranged on both sides of an insulating base material, or a heat sink that is a metal member. The heat sink may be provided as part of a lead frame. The wiring member may be entirely sealed by the sealing body 212, or a portion thereof may be exposed from the sealing body 212. Exposing the wiring member can improve heat dissipation properties.

[0038] The semiconductor module 21 described above is disposed on a base 251 of a housing 25. A main body of the semiconductor module 21 may be fixed to the base 251 via a bonding material, or may be thermally connected to the base 251 via a TIM (thermal interface material). TIM is an abbreviation for Thermal Interface Material.

[0039] 2, the semiconductor module 21 is shown in a simplified form. The power conversion device 20 may include a plurality of semiconductor modules 21. For example, the power conversion device 20 may include three semiconductor modules 21 that configure the upper and lower arm circuits 8 for one phase, or six semiconductor modules 21 that configure one arm. The power conversion device 20 may also include one semiconductor module 21 that configures the upper and lower arm circuits 8 for three phases.

[0040] The capacitor module 22 provides the smoothing capacitor 6. The capacitor module 22 includes a case 221, a capacitor element 222, a sealing resin body 223, and a bus bar 224. The illustrated capacitor module 22 is arranged side by side with respect to the semiconductor module 21 in the X direction.

[0041] The case 221 may be formed using a metal material such as aluminum, or may be formed using a resin material such as PPS or PBT. The case 221 has a cylindrical shape with a bottom and one side open in the Z direction. The case 221 houses a plurality of capacitor elements 222. The bottom wall of the case 221 faces the base 251 in the Z direction. The case 221 is thermally connected to the base 251. The case 221 may be fixed to the base 251 via a bonding material, or may be thermally connected to the base 251 via a TIM.

[0042] The capacitor element 222 is, for example, a film capacitor element. The capacitor element 222 is formed, for example, by winding a film around an axis approximately parallel to the Z direction. The capacitor element 222 has a substantially rectangular shape in plan view. The capacitor element 222 has electrodes on both end surfaces in the Z direction. The electrodes are sometimes referred to as metallikon electrodes. A positive P electrode is provided on one surface of the capacitor element 222, and a negative N electrode is provided on the back surface.

[0043] The capacitor module 22 includes a plurality of capacitor elements 222. The capacitor elements 222 are aligned in at least one direction perpendicular to the Z direction. The illustrated capacitor elements 222 are aligned in the X and Y directions.

[0044] The sealing resin body 223 is formed using an electrically insulating resin material such as epoxy resin. The illustrated sealing resin body 223 is formed by potting. The sealing resin body 223 is filled into the case 221 and seals the capacitor element 222. The sealing resin body 223 seals a portion of the bus bar 224.

[0045] Bus bars 224 are metal plates made of a metal with good conductivity, such as Cu. Bus bars 224 are connected to corresponding electrodes of capacitor elements 222. A portion of each bus bar 224 is sealed by sealing resin body 223, and the other portion protrudes outside sealing resin body 223.

[0046] Bus bars 224 include P bus bar 224P connected to the P electrode and N bus bar 224N connected to the N electrode. P bus bar 224P and N bus bar 224N each have a portion covered by sealing resin body 223 and a portion (protruding portion) disposed outside sealing resin body 223. The protruding portion includes a terminal portion (first terminal portion) connected to semiconductor module 21 and a terminal portion (second terminal portion) connected to input terminal block 23.

[0047] A first terminal portion of P bus bar 224P is electrically connected to P terminal 213P. A first terminal portion of N bus bar 224N is electrically connected to N terminal 213N. The first terminal portion of bus bar 224 may be directly joined to P terminal 213P and N terminal 213N, or may be electrically connected to P terminal 213P and N terminal 213N via another bus bar. A second terminal portion of bus bar 224 is electrically connected to bus bar 30 of input terminal block 23.

[0048] The terminal block includes a plurality of bus bars and a resin body that holds the bus bars. The terminal block includes an input terminal block 23 and an output terminal block 24. The input terminal block 23 electrically connects the capacitor module 22 to a DC power supply (not shown). The input terminal block 23 electrically connects the DC power supply to a semiconductor module that constitutes a power conversion circuit. The output terminal block 24 electrically connects the semiconductor module 21, i.e., the inverter 5, to the motor generator 3 (not shown). The output terminal block 24 may be integrally provided with a current sensor that detects phase currents flowing through the windings 3a of each phase of the motor generator 3.

[0049] The illustrated input terminal block 23 is aligned with the capacitor module 22 in the Y direction. The output terminal block 24 is aligned with the semiconductor module 21 in the X direction. The semiconductor module 21 is disposed between the capacitor module 22 and the output terminal block 24 in the X direction. Details of the terminal block (input terminal block 23) will be described later.

[0050] The housing 25 houses other elements that make up the power conversion device 20. The housing 25 may be a metal housing made of a metal material such as aluminum, or a resin housing made of a resin material. It may also be a housing containing a metal material and a resin material. To dissipate heat generated by the semiconductor module 21, the capacitor module 22, etc., it is preferable to use a housing containing a metal material, more preferably a metal housing. The housing 25 may be made of a single member or may be made of a combination of multiple members.

[0051] The illustrated housing 25 has a base 251 and a side wall 252. The housing 25 is formed using a metal material including aluminum. The base 251 supports the semiconductor module 21, the capacitor module 22, the input terminal block 23, and the output terminal block 24. The semiconductor module 21, the capacitor module 22, the input terminal block 23, and the output terminal block 24 are arranged on one surface of the base 251. The illustrated base 251 forms the bottom wall of the housing 25. The side wall 252 is continuous with the base 251. The side wall 252, together with the base 251, defines an accommodation section.

[0052] The base 251 provides a cooling function. For this reason, the base 251 is sometimes referred to as a cooler. The illustrated base 251 cools the semiconductor module 21, the capacitor module 22, the input terminal block 23, and the output terminal block 24. Each of the semiconductor module 21, the capacitor module 22, the input terminal block 23, and the output terminal block 24 is thermally connected to the base 251. The base 251 may be a heat sink. The heat sink may have fins on the back side. The base 251 may have a flow path through which a coolant flows.

[0053] Although an example in which a part of the housing 25 also functions as a cooler has been shown, the present invention is not limited to this. The power conversion device 20 may include a cooler instead of the housing 25, or may include a cooler separate from the housing 25.

[0054] <Terminal block> Fig. 3 is a plan view showing an example of a terminal block. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. The terminal block illustrated in Fig. 3 and Fig. 4 is an input terminal block 23. The input terminal block 23 will be described below as an example of a terminal block.

[0055] The input terminal block 23 includes a plurality of bus bars 30 and a resin body 40. The bus bars 30 are plate materials made of a metal with good conductivity, such as Cu. The bus bars 30 include a P bus bar 30P and an N bus bar 30N. The illustrated bus bars 30 have their plate thickness direction as the Z direction and extend roughly in the Y direction. The two bus bars 30 are arranged at roughly the same positions as each other in the Z direction and the Y direction. The two bus bars 30 are lined up along the base 251. The two bus bars 30 are lined up in the X direction. The two bus bars 30 run parallel to each other.

[0056] The busbars 30 are held in the resin body 40. The busbars 30 may be held in the resin body 40 by insert molding, or by press-fitting. The busbars 30 may be held in the resin body 40 by a combination of insert molding and press-fitting. The illustrated busbars 30 are held in the resin body 40 by insert molding. The busbars 30 are insert parts into the resin body 40. The middle portion of each busbar 30 in the extension direction is held in the resin body 40.

[0057] Both ends of the bus bar 30 exposed from the resin body 40 are electrically connected to the connection target. The connection method is not particularly limited. For example, soldering, resistance welding, laser welding, fastening, etc. can be used. The P bus bar 30P constitutes at least a part of the P line 9 described above. The N bus bar 30N constitutes at least a part of the N line 10. One end of the P bus bar 30P is electrically connected to a second terminal portion of the P bus bar 224P of the capacitor module 22. The other end of the P bus bar 30P is electrically connected to the DC power supply 2 through an opening (not shown) provided in the side wall 252. One end of the N bus bar 30N is electrically connected to a second terminal portion of the N bus bar 224N of the capacitor module 22. The other end of the N bus bar 30N is electrically connected to the DC power supply 2 through an opening (not shown) provided in the side wall 252.

[0058] Bus bar 30 has bottom surface 301, top surface 302, and side surface 303. Bottom surface 301 is the surface that faces base 251, which is the cooler, in the Z direction. Top surface 302 is the surface opposite bottom surface 301 in the Z direction. Side surface 303 is a surface that connects bottom surface 301 and top surface 302. Side surfaces 303 of P bus bar 30P and N bus bar 30N face each other in the X direction.

[0059] The resin body 40 is formed using a resin material. Examples of the resin material include PBT and PPS. The resin body 40 has a main body 401 that surrounds and holds intermediate portions of the bus bars 30. The illustrated main body 401 has a generally rectangular shape in plan view. One of the ends of each bus bar 30 protrudes from one of the side surfaces of the main body 401 in the Y direction, and the other of the ends protrudes from the opposite side surface of the main body 401. The resin body 40 has fixing portions 402 that are continuous with the main body 401. The fixing portions 402 are provided on both ends of the main body 401 in the X direction. An insert collar for fastening the fixing portion 402 to the housing 25 is integrally provided with the fixing portion 402.

[0060] The main body 401 includes a first resin part 41 and a second resin part 42. The first resin part 41 has better thermal conductivity than the second resin part 42. The first resin part 41 is formed using a material with higher thermal conductivity than the second resin part. The illustrated first resin part 41 and second resin part 42 are formed using PPS. The first resin part 41 has better thermal conductivity than the second resin part 42 due to a different content of filler, such as metal oxide filler, which has a large effect on thermal conductivity. On the other hand, the first resin part 41 and the second resin part 42 have inferior fluidity during molding.

[0061] The first resin portion 41 covers at least the lower surface 301 of the surface of the busbar 30. The first resin portion 41 may cover at least the lower surface 301 over the entire length of the portion of the busbar 30 that is covered by the main body portion 401, or may cover at least the lower surface 301 over a portion of the busbar 30 in the extension direction. The second resin portion 42 is interposed between adjacent busbars 30, and integrally covers the multiple busbars 30 and the first resin portion 41.

[0062] In the illustrated main body 401, the first resin portion 41 covers the bus bar 30 in a portion of the extending direction of the bus bar 30. The first resin portion 41 covers the lower surface 301, the upper surface 302, and the side surface 303. The first resin portion 41 has a lower surface covering portion 411 that covers the lower surface 301, an upper surface covering portion 412 that covers the upper surface 302, and a side surface covering portion 413 that covers the side surface 303. In the arrangement region of the first resin portion 41, the first resin portion 41 surrounds the bus bar 30.

[0063] The thickness of first resin portion 41 covering busbar 30 may be substantially uniform over the entire area, or may vary partially. In the illustrated first resin portion 41, the portion covering the surfaces of busbar 30 excluding lower surface 301 is thicker than the portion covering lower surface 301. Specifically, thickness t2 of upper surface covering portion 412 is greater than thickness t1 of lower surface covering portion 411. Thickness t3 of side surface covering portion 413 is greater than thickness t1 of lower surface covering portion 411. Thicknesses t2 and t3 are substantially equal.

[0064] The illustrated second resin portion 42 is interposed between adjacent bus bars 30 via a side covering portion 413. The second resin portion 42 covers the bus bar 30 over the entire length of the portion of the bus bar 30 that is covered by the main body portion 401. The second resin portion 42 covers the bus bar 30 as well as the first resin portion 41. The lower surface of the second resin portion 42 that faces the base 251 is substantially flush with the lower surface of the lower surface covering portion 411 of the first resin portion 41. As a result, the lower surface of the lower surface covering portion 411 is exposed from the second resin portion 42. The lower surface of the lower surface covering portion 411 is thermally connected to the base 251. The illustrated input terminal block 23 is thermally connected to the base 251 via a thermal conductive member 26 such as a TIM. The lower surfaces of the lower surface covering portion 411 and the second resin portion 42 are thermally connected to the base 251 via the thermal conductive member 26.

[0065] In the illustrated power conversion device 20, the metal housing 25 (base 251) is electrically connected to a component that provides a ground potential in a vehicle, such as the body or chassis. That is, the base 251 provides the ground potential (vehicle ground). The bus bar 30 is thermally connected to the base 251 via the lower surface covering portion 411 of the first resin portion 41 and the heat conductive member 26. The heat conductive member 26 is a dielectric interposed between the bus bar 30 and the vehicle ground. A Y capacitor element 7H is configured between the P bus bar 30P and the base 251 (vehicle ground). Similarly, a Y capacitor element 7L is configured between the N bus bar 30N and the base 251 (vehicle ground).

[0066] The input terminal block 23 described above may be obtained, for example, by two-stage insert molding. Specifically, the first resin portion 41 may be molded using the bus bar 30 as an insert part, and then the second resin portion 42 may be molded using the bus bar 30 and the first resin portion 41 as insert parts. Insert molding and press-fitting may also be combined. Specifically, the first resin portion 41 may be molded using the bus bar 30 as an insert part, and then the bus bar 30 and the first resin portion 41 may be press-fitted into the through-hole of the second resin portion 42.

[0067] The same configuration as that of the input terminal block 23 may be applied to the output terminal block 24. The resin body of the output terminal block 24 may have a first resin portion and a second resin portion.

[0068] <Summary of the First Embodiment> The terminal block of this embodiment is used in a power conversion device 20 through which a large current flows. For example, an input terminal block 23 is disposed on a base 251, which is a cooler. A resin body 40 of the input terminal block 23 has a main body 401 that surrounds and holds intermediate portions of multiple bus bars 30. The main body 401 includes a first resin portion 41 that covers at least the lower surface 301 of the surface of the bus bars 30 that faces the base 251, and a second resin portion 42 that is interposed between adjacent bus bars 30 and integrally covers the multiple bus bars 30 and the first resin portion 41. The first resin portion 41 has superior thermal conductivity to the second resin portion 42. The portion of the first resin portion 41 that is exposed from the second resin portion 42 is thermally connected to the base 251.

[0069] By providing the first resin portion 41, which has excellent thermal conductivity, on the underside 301 of the busbar 30, heat (self-heating) generated in the busbar 30 due to current flow can be more easily dissipated to the base 251 (cooler) than in a configuration in which the second resin portion 42 is disposed on the underside 301. In other words, heat dissipation can be improved. Because of the high heat dissipation, there is no need to increase the cross-sectional area of ​​the busbar 30, such as the thickness or width of the busbar 30, in order to suppress self-heating. This makes it possible to suppress an increase in the size of the input terminal block 23 (terminal block).

[0070] As described above, increasing thermal conductivity reduces fluidity during molding. In other words, moldability decreases. By providing the second resin portion 42, which has lower thermal conductivity than the first resin portion 41, i.e., higher fluidity, between the bus bars 30, insulation between the bus bars 30 can be ensured. Since it is not necessary to increase the distance between the bus bars 30 to ensure the insulation distance, an increase in physical size can be suppressed. As described above, the terminal block of this embodiment can suppress an increase in physical size.

[0071] Furthermore, if the temperature of the bus bar 30 exceeds a predetermined temperature due to self-heating, the physical properties of the material constituting the bus bar 30 change, for example, the yield point decreases. This may result in a decrease in the reliability of the connection between the bus bar 30 and other components, such as the bus bar 224 of the capacitor module 22. According to this embodiment, the bus bar 30 can be effectively cooled, thereby suppressing a decrease in the reliability of the connection. The above-described effect is not limited to the input terminal block 23. An output terminal block 24 having a structure similar to that of the illustrated input terminal block 23 can also achieve the same effect.

[0072] As illustrated, the first resin portion 41 may cover the side surface 303 of the bus bar 30, at least the opposing surface of adjacent bus bars 30. This increases the creepage distance between adjacent bus bars 30. This allows the size of the terminal block to be reduced. Furthermore, heat generated by the bus bar 30 can be transferred to the base 251 side not only via the bottom surface covering portion 411 but also via the side surface covering portion 413. This increases the heat transfer area, further improving heat dissipation.

[0073] As illustrated, the first resin portion 41 may surround the busbar 30 by covering the upper surface 302 of the busbar 30. Because the first resin portion 41 surrounds the periphery of the busbar 30, solid insulation is provided between the busbars 30, allowing the size of the terminal block to be further reduced. In addition, heat generated by the busbar 30 can be transferred to the base 251 side via the upper surface covering portion 412. This further improves heat dissipation.

[0074] As shown in the example, the portion of first resin portion 41 that covers the surfaces excluding bottom surface 301 may be thicker than the portion that covers bottom surface 301. Because resin hardens from the thinnest portions, peeling is likely to occur in the thicker portions due to resin sink. By making top surface covering portion 412 and side surface covering portion 413 thicker, top surface covering portion 412 and side surface covering portion 413 can be peeled off from busbar 30, thereby reducing thermal stress acting on bottom surface covering portion 411. This prevents bottom surface covering portion 411 from peeling off from busbar 30 and ensures heat dissipation.

[0075] As illustrated, the bus bar 30 constituting the input terminal block 23 may be thermally connected to the base 251 (cooler) that provides the ground potential via the first resin portion 41 and the heat conductive member 26. In this configuration, the bus bar 30, the first resin portion 41, the heat conductive member 26, and the base 251 function as the Y capacitor elements 7H and 7L. This simplifies the configuration compared to a configuration in which the Y capacitor elements 7H and 7L are provided separately. Furthermore, providing the Y capacitor elements 7H and 7L can eliminate noise.

[0076] As illustrated, the plurality of bus bars 30 may be inserted into the resin body 40. This can improve the adhesion of the resin body 40 to the bus bars 30.

[0077] <Modification> 5, a configuration may be adopted in which the heat conductive member 26 is not interposed between the input terminal block 23 (terminal block) and the base 251 (cooler). The bus bar 30 may be thermally connected to the base 251 via the first resin portion 41 (lower surface covering portion 411).

[0078] The arrangement of the first resin portion 41 is not limited to the above example. For example, as shown in FIG. 6, the first resin portion 41 may have only a lower surface covering portion 411. Heat generated in the bus bar 30 due to current flow can be dissipated to the base 251 side via the lower surface covering portion 411. As shown in FIG. 7, the first resin portion 41 may have the lower surface covering portion 411 and the side surface covering portion 413 without the upper surface covering portion 412. This increases the creepage distance between adjacent bus bars 30. This allows the size of the terminal block to be reduced. Furthermore, heat generated in the bus bar 30 can be transferred to the base 251 side via not only the lower surface covering portion 411 but also the side surface covering portion 413. This increases the heat transfer area, further improving heat dissipation.

[0079] (Second embodiment) This embodiment is a modification of the preceding embodiment as a basic configuration, and the description of the preceding embodiment can be used. As shown in this embodiment, a structure that makes it difficult for the first resin portion to peel off may be adopted.

[0080] Fig. 8 is a cross-sectional view showing a terminal block according to this embodiment. Fig. 8 corresponds to Fig. 4. In this embodiment, too, an input terminal block 23 is shown as an example of a terminal block.

[0081] 8, the bus bar 30 has a through hole 31 penetrating in the plate thickness direction. The first resin portion 41 is disposed in the through hole 31 and has a connecting portion 414 connecting the lower surface covering portion 411 and the upper surface covering portion 412. The connecting portion 414 connects the lower surface covering portion 411 and the upper surface covering portion 412. The other configurations are the same as those described in the preceding embodiment.

[0082] <Summary of the second embodiment> As illustrated, busbar 30 may have through-hole 31. In addition, first resin portion 41 may have connecting portion 414 disposed in through-hole 31 and continuing to lower surface covering portion 411 and upper surface covering portion 412. Providing connecting portion 414 can improve the adhesion of first resin portion 41 to lower surface 301 and upper surface 302. For example, it can prevent lower surface covering portion 411 from peeling off busbar 30, and efficiently release heat generated by busbar 30 to base 251.

[0083] <Modification> As shown in FIG. 9 , the busbar 30 may have a roughened portion 32 in a portion covered by the first resin portion 41. The roughened portion 32 is a portion (roughened layer) whose surface has been roughened by, for example, laser roughening, knurling, or roughening plating. By providing the roughened portion 32, the first resin portion 41 becomes entangled with the irregularities, thereby improving the adhesion between the busbar 30 and the first resin portion 41. This makes it possible to prevent the first resin portion 41 from peeling off from the busbar 30. In FIG. 9 , the roughened portion 32 is provided around the entire periphery of the busbar 30. Alternatively, the roughened portion 32 may be provided only on the lower surface 301, or only on the lower surface 301 and the side surface 303, which is the opposing surface.

[0084] The configuration shown in this embodiment can be combined with the configurations shown in the preceding embodiments. (Third Embodiment) This embodiment is a modification based on the preceding embodiment, and the description of the preceding embodiment can be used. In the preceding embodiment, the first resin portion is disposed in the main body portion. In addition to this, the first resin portion may be provided so as to cover the underside of the connection portion.

[0085] Fig. 10 is a cross-sectional view showing the terminal block according to this embodiment. Fig. 10 is a cross-sectional view corresponding to line XX in Fig. 3. In Fig. 10, the second terminal portion of bus bar 224 (P bus bar 224P) to be connected is indicated by a dashed dotted line.

[0086] Bus bar 30 has a connection portion 33 for connecting to capacitor module 22 at one of its ends protruding from main body portion 401. Bus bar 224, which forms a current path together with bus bar 30, is connected to connection portion 33. Bus bar 30 is provided with a clinching stud bolt 331 at connection portion 33. In other words, a fastening member is press-fitted and fixed to bus bar 30. Bus bar 224 and bus bar 30 are connected by fastening using clinching stud bolt 331 and a nut (not shown).

[0087] The first resin portion 41 covers at least the lower surface 301 over the entire length of the portion of the bus bar 30 that is covered by the main body portion 401. The illustrated first resin portion 41 covers the lower surface 301, the upper surface 302, and the side surface 303, as in the preceding embodiment. The first resin portion 41 is continuous with the portion that constitutes the main body portion 401 and has an extension portion 415 that covers the lower surface of the connection portion 33. The connection portion 33 is thermally connected to the base 251 via the extension portion 415 (first resin portion 41). The illustrated connection portion 33 is thermally connected to the base 251 via the extension portion 415 and the heat conduction member 26. The other configurations are the same as those described in the preceding embodiment.

[0088] <Summary of the third embodiment> As illustrated, the busbar 30 may have a connection portion 33 to which a busbar 224 (metal plate) that forms a current path together with the busbar 30 is connected. The first resin portion 41 may have an extension portion 415 that is continuous with the portion that constitutes the main body 401 and covers the lower surface of the connection portion 33. Heat is generated when current is applied due to the resistance component of the connection portion between the busbars 30 and 224. In the example described above, heat is generated due to the contact resistance between the busbars 30 and 224. That is, the busbar 30 generates heat particularly at the connection portion 33. The first resin portion 41 extends to cover the lower surface of the connection portion 33, allowing the heat from the connection portion 33 to be efficiently dissipated. This effectively prevents a decrease in the connection reliability between the busbar 30 and other components, such as the busbar 224.

[0089] <Modification> Although an example in which the bus bar 30 is provided with the clinching stud bolt 331 has been shown, the present invention is not limited to this. A clinching nut may be provided instead of the clinching stud bolt 331. An insert bolt or an insert nut may also be provided. The bus bar 30 does not necessarily have to have an integrated fastening member.

[0090] The fixing method is not limited to fastening. Soldering, laser welding, resistance welding, etc. may also be used. Whichever method is used, heat is generated by the resistance component at the interface between bus bar 30 and the metal plate material, and therefore, extension portion 415 of first resin portion 41 can efficiently dissipate the heat.

[0091] Although an example of the connection portion with bus bar 224 has been shown for bus bar 30, the present invention is not limited to this. For example, extension portion 415 may be provided so as to cover the lower surface of the connection portion with the DC power supply.

[0092] FIG. 11 is an enlarged plan view of the periphery of input terminal block 23 in power conversion device 20. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11. In FIG. 12, bus bar 28 is indicated by a dashed line. As shown in FIGS. 11 and 12, extension portion 415 may be provided to cover the underside of connection portion 33 with bus bar 28 (metal plate material) for connecting Y capacitor 27. Y capacitor 27 provides Y capacitor 7 shown in FIG. 1. Connection portion 33 is, for example, resistance weld portion 332. Heat from resistance weld portion 332 (connection portion 33) can be efficiently dissipated via extension portion 415. Furthermore, since bus bar 28 cools, Y capacitor 27 can be cooled. This reduces thermal stress acting on Y capacitor 27.

[0093] The configuration shown in this embodiment can be combined with the configuration shown in the first embodiment and the configuration shown in the second embodiment.

[0094] (Fourth embodiment) This embodiment is a modification of the preceding embodiment as a basic form, and the description of the preceding embodiment can be used. As shown in this embodiment, a structure that can suppress the progression of peeling may be adopted.

[0095] FIG. 13 is a cross-sectional view showing a terminal block according to this embodiment. FIG. 13 corresponds to FIG. 10. The bus bar 30 has a step portion 34 on the lower surface 301 in a portion covered by the first resin portion 41. The step portion 34 is a recess, a protrusion, or an uneven portion. An example of the step portion 34 is a recess. The step portion 34 is provided at multiple locations in the extension direction of the bus bar 30. The lower surface covering portion 411 of the first resin portion 41 also extends into the recess of the step portion 34. The other configurations are the same as those described in the preceding embodiment.

[0096] <Summary of the Fourth Embodiment> As illustrated, bus bar 30 may have step portion 34 at the portion of lower surface 301 that is covered by first resin portion 41. Even if peeling occurs, the direction of peeling changes at step portion 34, so that the progression of peeling can be suppressed. By suppressing the progression of peeling, heat generated in bus bar 30 can be efficiently released to the base 251 side.

[0097] The configuration shown in this embodiment can be combined with the configuration shown in the first embodiment, the second embodiment, and the third embodiment.

[0098] (Fifth embodiment) This embodiment is a modification of the preceding embodiment as a basic form, and the description of the preceding embodiment can be used. As shown in this embodiment, the adhesion of the first resin portion to the cooler side may be increased.

[0099] Fig. 14 is a cross-sectional view showing the terminal block according to this embodiment. Fig. 14 corresponds to Fig. 4. The first resin portion 41 has a roughened portion 416 on the surface facing the base 251. The lower surface covering portion 411 includes the roughened portion 416 provided on the surface layer on the base 251 side. The roughened portion 416 is provided over almost the entire surface facing the base 251. A heat conductive member 26 is interposed between the example input terminal block 23 and the base 251. The heat conductive member 26 is entangled with the irregularities of the roughened portion 416 and is in close contact.

[0100] The roughened portion 416 may be formed by recesses and projections provided on a mold for molding the first resin portion 41. In other words, it may be formed by embossing. The roughened portion 416 may be formed by etching or the like after molding the first resin portion 41. The other configurations are the same as those described in the preceding embodiment.

[0101] <Summary of the Fifth Embodiment> As illustrated, the first resin part 41 may have a roughened part 416 on the surface facing the base 251, which is the cooler. This increases the contact area with the base 251, thereby improving heat dissipation. Also, peeling of the first resin part 41 from the base 251 can be suppressed.

[0102] <Modification> Although an example in which the heat conducting member 26 is interposed between the input terminal block 23 (terminal block) and the base 251 has been shown, the present invention is not limited to this. As shown in FIG. 5, a configuration in which the heat conducting member 26 is not interposed may also be used.

[0103] The configuration shown in this embodiment can be combined with the configuration shown in the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment.

[0104] (Other embodiments) The disclosure in this specification and drawings, etc. is not limited to the exemplified embodiments. The disclosure encompasses the exemplified embodiments and modifications thereto by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and / or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure encompasses the omission of parts and / or elements from the embodiments. The disclosure encompasses the substitution or combination of parts and / or elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. Some disclosed technical scopes are defined by the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the claims.

[0105] The disclosure in the specification, drawings, etc. is not limited by the claims. The disclosure in the specification, drawings, etc. encompasses the technical ideas described in the claims, and extends to more diverse and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure in the specification, drawings, etc. without being bound by the claims.

[0106] When an element or layer is referred to as being "on," "coupled," "connected," or "bonded," it may be directly coupled, connected, or bonded to another element or layer, and intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly coupled," "directly connected," or "directly bonded" to another element or layer, no intervening elements or layers are present. Other terms used to describe relationships between elements should be construed in a similar manner (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," etc.). As used in this specification, the term "and / or" includes any and all combinations of the associated listed item or items. That is, reference to A and / or B means at least one of A and B, and can include A only, B only, or both A and B.

[0107] Spatially relative terms such as "inside," "outside," "back," "below," "low," "top," "top," and the like are used herein to facilitate the description of one element or feature's relationship to other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device during use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures were turned over, elements described as "below" or "directly below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "bottom" can encompass both an orientation of top and bottom. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used in this specification would be interpreted accordingly.

[0108] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0109] <Technical philosophy 1> A terminal block disposed on the cooler (251), a plurality of bus bars (30) arranged along the cooler; a resin body (40) having a main body (401) that surrounds and holds intermediate portions of the plurality of bus bars; Equipped with the main body portion includes a first resin portion (41) that covers at least a lower surface (301) of the bus bar that faces the cooler, and a second resin portion (42) that is interposed between adjacent bus bars and integrally covers the plurality of bus bars and the first resin portion, the first resin portion has higher thermal conductivity than the second resin portion, The terminal block has a portion of the first resin portion exposed from the second resin portion that is thermally connected to the cooler.

[0110] <Technical philosophy 2> The terminal block described in Technical Idea 1, wherein the first resin portion has an upper surface (302) opposite the lower surface and a side surface (303) connected to the lower surface, and covers at least the opposing surfaces of adjacent bus bars.

[0111] <Technical philosophy 3> The terminal block according to Technical Idea 2, wherein the first resin portion covers the upper surface and thereby surrounds the bus bar.

[0112] <Technical philosophy 4> The terminal block according to Technical Idea 2 or Technical Idea 3, wherein the first resin portion has a thickness greater than that of the portion covering the lower surface of the bus bar than that of the portion covering the lower surface.

[0113] <Technical philosophy 5> The bus bar has a through hole (31), The terminal block according to Technical Idea 3, wherein the first resin portion is disposed in the through hole and has a connecting portion (414) that connects the portion covering the lower surface and the portion covering the upper surface.

[0114] <Technical philosophy 6> The terminal block according to any one of Technical Ideas 1 to 5, wherein the bus bar has a roughened portion (32) in a portion covered with the first resin portion.

[0115] <Technical philosophy 7> The bus bar has a connection portion (33) to which a metal plate (224) that forms a current path together with the bus bar is connected. The terminal block according to any one of Technical Ideas 1 to 6, wherein the first resin portion has an extension portion (415) that is continuous with the portion that constitutes the main body portion and covers the lower surface of the connection portion.

[0116] <Technical philosophy 8> The terminal block according to any one of Technical Ideas 1 to 7, wherein the bus bar has a step portion (34) on the lower surface at a portion covered by the first resin portion.

[0117] <Technical philosophy 9> The terminal block according to any one of Technical Concepts 1 to 8, wherein the first resin portion has a roughened portion (416) on a surface facing the cooler.

[0118] <Technical Thought 10> A terminal block according to any one of Technical Ideas 1 to 9 for electrically connecting a DC power source and a semiconductor module constituting a power conversion circuit, It is disposed on the cooler via a heat conducting member (26), the cooler provides a ground potential; The bus bar is thermally connected to the cooler via the first resin portion and the heat conduction member.

[0119] <Technical Thought 11> 11. The terminal block according to any one of Technical Ideas 1 to 10, wherein the plurality of bus bars are insert parts into the resin body. [Explanation of symbols]

[0120] 1... drive system, 2... DC power supply, 3... motor generator, 3a... winding, 4... power conversion circuit, 5... inverter, 6... smoothing capacitor, 7... Y capacitor, 7H, 7L... Y capacitor element, 8... upper and lower arm circuit, 8H... upper arm, 8L... lower arm, 9... P line, 10... N line, 11... output line, 12... MOSFET, 13... diode, 20... power conversion device, 21... semiconductor module, 211, 211H, 211L... semiconductor element, 212... sealing body, 213... main terminal, 213N... N terminal, 213O... O terminal, 213P... P terminal, 22... capacitor module, 221... case, 222... capacitor element, 223... sealing resin body, 224... bus bar, 224N...N bus bar, 224P...P bus bar, 23...input terminal block, 24...output terminal block, 25...casing, 251...base, 252...side wall, 26...thermal conductive member, 27...Y capacitor, 28...bus bar, 30...bus bar, 301...bottom surface, 302...top surface, 303...side surface, 30N...N bus bar, 30P...P bus bar, 31...through hole, 32...roughened portion, 33...connection portion, 331...clinching stud bolt, 332...resistance welded portion, 34...step portion, 40...resin body, 401...main body portion, 402...fixing portion, 41...first resin portion, 411...bottom surface covering portion, 412...top surface covering portion, 413...side surface covering portion, 414...connection portion, 415...extension portion, 416...roughened portion, 42...second resin portion

Claims

1. A terminal block disposed on the cooler (251), a plurality of bus bars (30) arranged along the cooler; a resin body (40) having a main body (401) that surrounds and holds intermediate portions of the plurality of bus bars; Equipped with the main body portion includes a first resin portion (41) that covers at least a lower surface (301) of the bus bar that faces the cooler, and a second resin portion (42) that is interposed between adjacent bus bars and integrally covers the plurality of bus bars and the first resin portion, the first resin portion has higher thermal conductivity than the second resin portion, The terminal block is configured such that a portion of the first resin portion that is exposed from the second resin portion is thermally connected to the cooler.

2. 2. The terminal block according to claim 1, wherein the first resin portion has an upper surface (302) opposite the lower surface and a side surface (303) connected to the lower surface, and covers at least the opposing surfaces of adjacent bus bars.

3. The terminal block according to claim 2 , wherein the first resin portion covers the upper surface to surround the bus bar.

4. 4. The terminal block according to claim 2, wherein a portion of the first resin portion that covers the surface of the bus bar excluding the lower surface is thicker than a portion that covers the lower surface.

5. The bus bar has a through hole (31), The terminal block according to claim 3 , wherein the first resin portion has a connecting portion (414) disposed in the through hole and continuing to a portion covering the lower surface and a portion covering the upper surface.

6. The terminal block according to any one of claims 1 to 3, wherein the bus bar has a roughened portion (32) in a portion covered by the first resin portion.

7. The bus bar has a connection portion (33) to which a metal plate (224) that forms a current path together with the bus bar is connected. The terminal block according to any one of claims 1 to 3, wherein the first resin portion has an extension portion (415) that is continuous with the portion that constitutes the main body and covers the underside of the connection portion.

8. The terminal block according to any one of claims 1 to 3, wherein the bus bar has a step portion (34) on the lower surface at a portion covered by the first resin portion.

9. The terminal block according to any one of claims 1 to 3, wherein the first resin portion has a roughened portion (416) on a surface facing the cooler.

10. The terminal block according to any one of claims 1 to 3, which electrically connects a DC power source and a semiconductor module that constitutes a power conversion circuit, It is disposed on the cooler via a heat conducting member (26), the cooler provides a ground potential; The bus bar is thermally connected to the cooler via the first resin portion and the thermal conduction member.

11. The terminal block according to any one of claims 1 to 3, wherein the plurality of bus bars are insert parts into the resin body.

Images