Ring frame, wafer dividing method, and dividing device

Abstract

To prevent a sheet from breaking when expanded during division into wafers.SOLUTION: A dividing device (1) expands a sheet (S) attached to a ring frame (F) so as to cover an opening (F1) and divides the wafers starting from a modified layer (W1) formed on the wafer (W) attached to the sheet. The dividing device includes a gripping mechanism (11) that grips both sides of the ring frame, a dividing mechanism (12) that divides the wafers by expanding the sheet at the opening of the ring frame by relatively separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer attached to the sheet, and a ring member (43) that is arranged inside the inner circumferential surface of the ring frame and has a shape whose cross section is in contact with the sheet when the dividing mechanism expands the sheet.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a ring frame, a wafer dividing method, and a wafer dividing device. [Background technology]

[0002] Patent Document 1 discloses a method for dividing a wafer by expanding a tape attached to the wafer. In this dividing method, the amount of tape expansion must be increased due to the smaller chips. Patent Document 1 also includes a step in which the tape is expanded and then attached to a ring frame for support. This step necessitates re-attaching the tape, which increases the processing time.

[0003] A known method that does not require re-taping is disclosed in Patent Document 2. In Patent Document 2, tape is attached to a ring frame and a wafer, and then the tape at the opening of the ring frame is expanded to separate the wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-063793 [Patent Document 2] Japanese Patent Application Publication No. 2024-036560 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in Patent Document 2, when the expansion amount of the tape is increased, a strong stress is locally applied to the tape by the ring frame or the expansion restriction ring, causing the tape to break due to expansion, which is a problem.

[0006] The present invention has been made in consideration of these points, and one of its objects is to provide a ring frame, a wafer dividing method, and a wafer dividing device that can prevent the sheet that expands when the wafer is divided from breaking. [Means for solving the problem]

[0007] A ring frame according to one embodiment of the present invention is a ring frame having an opening in the center, and a chamfer is formed at the corner between the inner peripheral surface and at least one of two opposing surfaces connected to the inner peripheral surface.

[0008] One embodiment of the present invention relates to a method for dividing a wafer, which involves expanding a sheet that covers an opening in a ring frame and dividing the wafer starting from a division starting point formed on a wafer attached to the sheet. The method comprises a sheet adhering step of adhering the sheet to the surface of the ring frame that connects to the chamfered portion to cover the opening of the ring frame and adhering the wafer to the sheet, and a dividing step of separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer, folding the sheet at the chamfered portion to expand the sheet at the opening of the ring frame, and dividing the wafer starting from the division starting point.

[0009] One embodiment of the wafer dividing method of the present invention is a dividing method in which a sheet attached to a ring frame is expanded to cover the opening, and the wafer is divided starting from a division starting point formed on the wafer attached to the sheet, and the dividing method comprises: a gripping step in which both surfaces of the ring frame, including the portion where the sheet is attached, are gripped by a gripping mechanism; a ring member placement step in which a ring member having a cross section shaped so that an arc-shaped portion thereof contacts the sheet on the inside of the inner surface of the ring frame; and a dividing step in which the ring frame and the wafer are separated in a direction perpendicular to the surface of the wafer, the sheet in the opening portion of the ring frame is expanded, and the wafer is divided starting from the division starting point.

[0010] One embodiment of the dividing device of the present invention is a dividing device that expands a sheet attached to a ring frame to cover the opening, and divides a wafer starting from a division starting point formed on the wafer attached to the sheet, and includes a gripping mechanism that grips both sides of the ring frame including the portion where the sheet is attached, a dividing mechanism that expands the sheet at the opening portion of the ring frame by relatively separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer attached to the sheet, thereby dividing the wafer, and a ring member that is positioned inside the inner surface of the ring frame and has a shape whose cross section is in an arc-shaped form that abuts against the sheet when the sheet is expanded by the dividing mechanism.

[0011] One embodiment of the dividing device of the present invention is a dividing device that expands a sheet attached to a ring frame to cover the opening, and divides a wafer starting from a division starting point formed on the wafer attached to the sheet, and includes a gripping mechanism that grips both sides of the ring frame including the portion where the sheet is attached, and a dividing mechanism that expands the sheet at the opening portion of the ring frame by relatively separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer attached to the sheet, thereby dividing the wafer.The gripping mechanism includes a loading table on which the sheet attached to the ring frame is placed with the sheet facing downward, and a cover plate that clamps the ring frame placed on the loading table from above, and the cover plate has a cylindrical portion that enters the inside of the inner surface of the ring frame and brings its lower end into contact with the sheet, and whose tip cross section is shaped to abut against the sheet. [Effects of the Invention]

[0012] According to the present invention, the chamfered portion of the ring frame and the arc-shaped cross sections of the ring member and cylindrical portion come into contact with the sheet and expand it, thereby preventing strong local stress from being applied to the sheet during the expansion, thereby preventing the sheet from breaking when it is expanded during wafer division. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic perspective view of a dividing device according to a first embodiment. [Figure 2] FIG. 2A is an explanatory diagram of a holding step according to the first embodiment, and FIG. 2B is an explanatory diagram of a ring member arranging step according to the first embodiment. [Figure 3] FIG. 3A is an explanatory diagram of the dividing step of the first embodiment, and FIG. 3B is an explanatory diagram of the shrinking step of the first embodiment. [Figure 4] FIG. 4A is an explanatory diagram of the holding step in the second embodiment, and FIG. 4B is an explanatory diagram of the dividing step in the second embodiment. [Figure 5] FIG. 5A is an explanatory diagram of a holding step in the third embodiment, and FIG. 5B is an explanatory diagram of a dividing step in the third embodiment. [Figure 6] FIG. 10 is a partial cross-sectional view of a dividing device and a ring frame according to a modified example. [Figure 7] FIG. 10 is a partial cross-sectional view of a dividing device and a ring frame according to another modified example. DETAILED DESCRIPTION OF THE INVENTION

[0014] [First embodiment] Hereinafter, devices according to embodiments will be described with reference to the accompanying drawings. FIG. 1 is a schematic perspective view of a splitting device according to a first embodiment. The present invention is not limited to the following embodiments, and can be practiced by making appropriate modifications within the scope of the present invention. For the sake of convenience, some components may be omitted in the following drawings.

[0015] As shown in FIG. 1, the dividing apparatus 1 is configured to divide a wafer W supported on a ring frame F via a sheet S into individual chips C (see FIG. 3A) by expanding the sheet S.

[0016] A grid-like dividing line L is provided on the surface of the wafer W, and various devices (not shown) are formed in each area defined by the dividing line L. The wafer W may be a semiconductor wafer in which devices such as ICs and LSIs are formed on a semiconductor substrate such as silicon or gallium arsenide, or an optical device wafer in which optical devices such as LEDs are formed on an inorganic material substrate such as ceramic, glass, or sapphire. The wafer W is attached to a sheet S attached to a ring frame F, and a work set WS consisting of the wafer W, ring frame F, and sheet S is carried into the dividing apparatus 1.

[0017] The ring frame F of the work set WS has a central opening F1 that is covered by a heat-shrinkable sheet S, and the wafer W is attached to the sheet S inside the opening F1. A modified layer W1 (see FIG. 2A) is formed inside the wafer W as a starting point for division along the planned division line L. The modified layer W1 is a region where the density, refractive index, mechanical strength, and other physical properties inside the wafer W become different from those of the surrounding area due to laser irradiation, resulting in a lower strength than the surrounding area. The modified layer W1 may be, for example, a melting treatment region, a crack region, a dielectric breakdown region, a refractive index change region, or a mixture of these.

[0018] In the following description, a modified layer W1 formed inside the wafer W is used as an example of the dividing starting point, but the invention is not limited to this configuration. The dividing starting point may be any point that serves as a starting point when dividing the wafer W, and may be formed, for example, by a laser-processed groove, a cut groove, or a scribe line. Furthermore, the sheet S may be made of any material that is stretchable and heat-shrinkable, and is not particularly limited.

[0019] 2A is a partial cross-sectional view of the dividing device 1 according to the first embodiment. As shown in FIG. 2A, the dividing device 1 includes a gripping mechanism 11 that grips both sides of the ring frame F of the work set WS, and a dividing mechanism 12 that expands the sheet S at the opening F1 of the ring frame F to divide the wafer W.

[0020] The gripping mechanism 11 includes a mounting table 14 on which the sheet S attached to the ring frame F is placed with the sheet S facing downward, and a cover plate 15 that sandwiches the ring frame F placed on the mounting table 14 from above.

[0021] Circular openings 16 and 17, each having a larger diameter than a holding table 19 (described later), are formed in the center of the loading table 14 and the cover plate 15. When the cover plate 15 is placed on the loading table 14, the ring frame F, including the portion to which the sheet S is attached, is held by the cover plate 15 and the loading table 14. In this state, the wafer W and a portion of the sheet S are exposed to the outside through the circular openings 16 and 17 of the loading table 14 and the cover plate 15.

[0022] In the gripping mechanism 11, the cover plate 15 is placed over the ring frame F on the mounting table 14, and the cover plate 15 is fixed to the mounting table 14 by, for example, a clamp unit (not shown).

[0023] The dividing mechanism 12 includes a holding table 19 capable of suction-holding the wafer W via the sheet S of the work set WS, and a lifting mechanism 20 for moving the holding table 19 and the gripping mechanism 11 up and down relative to each other.

[0024] The holding table 19 is provided at a position and size that allows it to be placed inside the circular openings 16, 17 of the loading table 14 and the cover plate 15. The holding table 19 is supported by a plurality of support columns 21, and a porous plate 23 is placed on the upper surface of the holding table 19. This porous plate 23 forms a holding surface 24 on the upper surface of the holding table 19 that holds the wafer W by suction.

[0025] The holding surface 24 is connected to a suction source 26 (not shown in FIG. 1) through a flow path in the holding table 19, and the wafer W is held by suction due to the negative pressure generated on the holding surface 24. In addition, an opening / closing valve 27 (not shown in FIG. 1) is provided in the flow path connecting the holding surface 24 to the suction source 26, and the opening / closing valve 27 switches between suction holding of the holding surface 24 and suction release.

[0026] A plurality of rollers 29 are provided around the entire outer peripheral edge of the holding table 19. With the wafer W held on the holding surface 24, the plurality of rollers 29 are brought into rolling contact with the sheet S around the wafer W from below. By bringing the plurality of rollers 29 into rolling contact with the sheet S, friction generated at the outer peripheral edge of the holding table 19 when the sheet S is expanded is reduced.

[0027] The lifting mechanism 20 is composed of four electric cylinders that support the four corners of the loading table 14. By controlling the amount of protrusion of the cylinder rod 31 of the lifting mechanism 20, the holding table 19 and the gripping mechanism 11 are moved up and down relative to each other, and the distance between the wafer W on the holding table 19 and the ring frame F gripped by the gripping mechanism 11 is adjusted. As a result, the ring frame F and the wafer W are spaced apart relative to each other in the direction perpendicular to the surface of the wafer W attached to the sheet S.

[0028] The dividing device 1 further includes a circular ring member 43. The ring member 43 is disposed on the same side of the sheet S as the bonding surface of the wafer W, i.e., on the upper side, and is shaped to be smaller than the inner diameter of the ring frame F and larger than the outer diameter of the plurality of roller units 29 arranged in a ring shape on the outer periphery of the holding table 19. A chamfered portion 44 is formed at the corner of the inner lower end of the ring member 43 by R machining or the like. Therefore, as shown in an enlarged view in FIG. 2A, when viewed in a cross section perpendicular to the direction in which the ring member 43 extends in a ring shape, the chamfered portion 44 at the inner lower end is formed in a smoothly curved and bulging arc shape.

[0029] The ring member 43 is provided so as to be movable in the vertical direction by a ring moving mechanism 45. The ring moving mechanism 45 can be, for example, an air cylinder device, but an actuator such as a feed screw device may be used instead.

[0030] A thermal shrinkage mechanism 50 for thermally shrinking the sheet S is provided above the gripping mechanism 11. The thermal shrinkage mechanism 50 includes a pair of heaters 51. The pair of heaters 51 are arranged opposite each other across the center of the wafer W. Each heater 51, for example, irradiates a spot with far-infrared rays having a peak waveform of 3 μm to 25 μm that is not easily absorbed by metal materials, thereby suppressing heating of various parts of the device and enabling heating of only a predetermined location of the ring-shaped sheet S between the outer periphery of the wafer W and the inner periphery of the ring frame F. The thermal shrinkage mechanism 50 further includes a rotation mechanism 52 for rotating the pair of heaters 51 about the center of the wafer W as an axis, and a radial advance / retract mechanism 53 for moving the pair of heaters 51 forward and backward in the radial direction of the wafer W.

[0031] The dividing device 1 is also provided with a control unit (not shown) that controls all the components of the device. The control unit is composed of a processor that executes various processes, a memory, etc. The memory is composed of one or more storage media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application.

[0032] Next, a method for dividing the wafer W using the dividing apparatus 1 will be described in detail with reference to Figures 2 and 3. Figure 2A is an explanatory diagram of the holding step of the first embodiment, and Figure 2B is an explanatory diagram of the ring member arrangement step of the first embodiment. Figure 3A is an explanatory diagram of the dividing step of the first embodiment, and Figure 3B is an explanatory diagram of the shrinking step of the first embodiment. It is assumed here that a modified layer W1 serving as a dividing starting point is formed inside the wafer W along the planned dividing line L (see Figure 1).

[0033] First, as shown in FIG. 2A , a gripping process is performed. In the gripping process, a wafer W is placed on the holding table 19 via a sheet S, and a ring frame F is placed on the mounting table 14. Then, both sides of the ring frame F, including the portion of the wafer W around which the sheet S is attached, are sandwiched and gripped from above and below by the mounting table 14 and cover plate 15 of the gripping mechanism 11. This allows the holding table 19 and the gripping mechanism 11 to hold the work set WS. At this time, the holding table 19 has a larger diameter than the wafer W, and roller portions 29 on the outer peripheral edge of the holding table 19 come into contact with the sheet S between the wafer W and the ring frame F from below. In addition, the opening / closing valve 27 is closed, and the suction force from the suction source 26 to the holding table 19 is cut off.

[0034] 2B, after the gripping step, a ring member placement step is carried out. In the ring member placement step, the ring member 43 is moved downward by the ring movement mechanism 45. This movement causes the ring member 43 to be placed (advance) inside the inner circumferential surface of the ring frame F, and the chamfered portion 44 on the lower end side of the ring member 43 comes into contact with the upper surface of the sheet S.

[0035] As shown in FIG. 3A, the dividing process is carried out after the ring member arrangement process. In the dividing process, the holding mechanism 11 is moved downward by the lifting mechanism 20, thereby relatively pushing up the holding table 19. This pushing up separates the ring frame F and the wafer W in a direction perpendicular to the surface of the wafer W (up and down), and the sheet S at the opening F1 of the ring frame F is expanded radially. As a result, an external force is applied to the modified layer W1 (see FIG. 2B) of the wafer W via the sheet S, and the wafer W is divided into individual chips C starting from the modified layer W1 (division starting point) where the strength has decreased. The sheet S is also expanded until adjacent chips C are completely separated, forming spaces between the multiple chips C.

[0036] At this time, the ring member 43 is also moved downward by the ring movement mechanism 45 so as to follow the downward movement of the gripping mechanism 11, and the state in which the ring member 43 is disposed inside the inner circumferential surface of the ring frame F is maintained. Therefore, when the sheet S is expanded, the chamfered portion 44 on the lower end side of the ring member 43 inside the ring frame F comes into contact with the upper surface of the sheet S, bending the sheet S. In other words, the ring member 43 has a shape in which the cross section of a circular arc comes into contact with the sheet S.

[0037] Furthermore, while the gripping mechanism 11 is moved downward to expand the sheet S, the on-off valve 27 is closed, and the expansion of the sheet S is not hindered by the suction force of the holding table 19. Then, after the wafer W is divided into individual chips C and spaces are formed between the chips C, the on-off valve 27 is opened and a suction force is generated in the holding table 19 (see FIG. 3B). With the sheet S in an expanded state, the chips C are suction-held by the holding table 19 via the sheet S, and therefore the sheet S does not shrink, and the spaces between adjacent chips C are maintained.

[0038] 3B, a shrinking process is carried out after the dividing process. In the shrinking process, the lifting mechanism 20 moves the gripping mechanism 11 upward, bringing the holding table 19 relatively closer to the gripping mechanism 11, and the force that expands the sheet S is no longer applied. At this time, a suction force is generated in the holding table 19, so that the chips C are sucked and held by the holding table 19 via the sheet S, and the sheet S on the holding table 19 does not become loose or wrinkled.

[0039] Meanwhile, the tension in the sheet S between the outer periphery of the wafer W and the inner periphery of the ring frame F is relaxed. A pair of heaters 51 is positioned above the portion between the outer periphery of the wafer W and the inner periphery of the ring frame F, and the portion of the sheet S where the tension has been relaxed is heated by the pair of heaters 51, causing it to thermally shrink. At this time, the heaters 51 are rotated by driving the rotation mechanism 52, and the entire sheet S between the outer periphery of the wafer W and the inner periphery of the ring frame F is heated and thermally shrunk.

[0040] In the shrinking process, while the sheet S around the wafer W is thermally shrunk, the sheet S is suction-held on the holding table 19, maintaining the spacing between the chips C. Therefore, only the sheet S around the wafer W can be thermally shrunk, and after the suction holding by the holding table 19 is released, the sheet S is fixed in place while maintaining the spacing between the chips C. After the shrinking process, the open / close valve 27 is closed, the suction holding of the sheet S by the holding table 19 is released, and the work set WS can be transported.

[0041] According to the first embodiment, when the sheet S is expanded in the dividing step, the arc-shaped cross section of the lower end of the ring member 43 inside the ring frame F comes into contact with the upper surface of the sheet S, causing the sheet S to bend. Therefore, when the sheet S is expanded, it is possible to prevent strong local stress from being applied to the sheet S at the angular portion of the inner edge of the ring frame F. This makes it possible to prevent the sheet S from breaking as it is expanded in the dividing step of the wafer W.

[0042] Next, other embodiments of the present invention will be described. In the following description, the same reference numerals may be used to designate components that are the same as or equivalent to those in the embodiments described before the embodiment, and the description thereof may be omitted or simplified.

[0043] [Second embodiment] A second embodiment of the present invention will be described with reference to Figures 4A and 4B. Figure 4A is an explanatory diagram of the gripping step of the second embodiment, and Figure 4B is an explanatory diagram of the dividing step of the second embodiment. As shown in Figures 4A and 4B, in the second embodiment, the ring member 43 and ring moving mechanism 45 of the first embodiment are omitted, and the cover plate 15 is modified to include a cylindrical portion 61.

[0044] In the second embodiment, the cylindrical portion 61 is disposed at a position that forms the circular opening 17 of the cover plate 15 and is formed so as to protrude downward. The cylindrical portion 61 is provided so as to enter the inside of the inner circumferential surface that forms the opening F1 of the ring frame F, and so as to have the outer circumferential surface of the cylindrical portion 61 come into contact with the inner circumferential surface of the ring frame F. Furthermore, the cylindrical portion 61 is provided so that, with the ring frame F sandwiched from above by the cover plate 15 while entering the inside of the inner circumferential surface of the ring frame F, the lower end of the cylindrical portion 61 is aligned in the vertical direction with the lower surface of the ring frame F. Therefore, with the cylindrical portion 61 entering the inside of the inner circumferential surface of the ring frame F, the lower end of the cylindrical portion 61 can abut (contact) against (be brought into contact with) the sheet S attached to the ring frame F.

[0045] The inner lower end side of the cylindrical portion 61 is rounded. Therefore, as shown in an enlarged view in Fig. 4A, when viewed in a cross section perpendicular to the circumferential direction of the cylindrical portion 61, the inner lower end side of the cylindrical portion 61 is formed into a smoothly curved and bulging arc shape.

[0046] 4A, in the gripping step of the second embodiment, when the ring frame F is gripped by the mounting table 14 and the cover plate 15, the cylindrical portion 61 enters the inside of the inner circumferential surface of the ring frame F. Therefore, at the same time as the ring frame F is gripped, the cylindrical portion 61 is arranged (enters) the inside of the inner circumferential surface of the ring frame F, and the portion of the cylindrical portion 61 whose cross section is an arc at the lower end side comes into contact with the upper surface of the sheet S.

[0047] 4B, in the dividing step of the second embodiment, the sheet S at the opening F1 of the ring frame F is expanded in the radial direction, as in the first embodiment. At this time, the lower end side of the cylindrical portion 61 inside the ring frame F comes into contact with the upper surface of the sheet S, causing the sheet S to bend. In other words, the cylindrical portion 61 has a shape in which the cross section of the lower end (tip) has an arcuate portion that comes into contact with the sheet S.

[0048] In the second embodiment, by forming the cylindrical portion 61, similar to the ring member 43 in the first embodiment, it is possible to prevent strong local stress from being applied to the sheet S at the angular portion of the inner edge of the ring frame F when the sheet S expands. This makes it possible to prevent the sheet S from breaking when it expands in the process of dividing the wafers W, also in the second embodiment. Furthermore, because the cylindrical portion 61 is integrated with the cover plate 15, it is possible to omit the ring member 43 and ring moving mechanism 45 of the first embodiment.

[0049] [Third embodiment] A third embodiment of the present invention will be described with reference to Figures 5A and 5B. Figure 5A is an explanatory diagram of the gripping step of the third embodiment, and Figure 5B is an explanatory diagram of the dividing step of the third embodiment. As shown in Figures 5A and 5B, in the third embodiment, the ring member 43 and ring moving mechanism 45 of the first embodiment are omitted, and a chamfered portion F2 is formed on the ring frame F.

[0050] In the third embodiment, the chamfered portion F2 is formed by rounding or the like at the corner between the inner circumferential surface that forms the opening F1 of the ring frame F and the bottom surface that is connected to the lower part of the inner circumferential surface. Therefore, as shown in an enlarged view in Fig. 5A, when viewed in a cross section perpendicular to the direction in which the ring frame F extends in an annular shape, the chamfered portion F2 on the inner lower end side is formed in a smoothly curved and bulging arc shape.

[0051] In the third embodiment, before the holding step shown in Fig. 5A, a sheet S is attached to the underside of the ring frame F, which is the surface that connects to the chamfered portion F2, to close the opening F1 of the ring frame F, and a sheet attaching step is performed in which the wafer W is attached to the sheet S. Also, in the third embodiment, after the holding step shown in Fig. 5A is performed, the dividing step shown in Fig. 5B is performed, and the sheet S at the opening F1 of the ring frame F is expanded in the radial direction, as in the first embodiment. At this time, the chamfered portion F2 inside the ring frame F comes into contact with the upper surface of the sheet S, bending the sheet S and creating a valley fold at the chamfered portion F2.

[0052] In the third embodiment, by forming the chamfered portion F2, it is possible to suppress the ring frame F from locally applying strong stress to the sheet S when the sheet S is expanded, similar to the ring member 43 in the first embodiment. This makes it possible to prevent the sheet S from breaking when it is expanded in the process of dividing the wafers W, also in the third embodiment. Furthermore, since the chamfered portion F2 is formed on the ring frame F, it is possible to omit providing the ring member 43 and the ring moving mechanism 45 as in the first embodiment, or forming the cylindrical portion 61 as in the second embodiment.

[0053] The present invention is not limited to the above-described embodiments, and various modifications can be made to the embodiments. In the above-described embodiments, the size and shape shown in the accompanying drawings are not limited to these, and can be modified as appropriate within the scope of the effects of the present invention. In addition, the present invention can be modified as appropriate without departing from the scope of the object of the present invention.

[0054] In the third embodiment, the chamfered portion F2 of the ring frame F is formed only on the lower side, which is one side in the thickness direction of the ring frame F, but this is not limited to this and the chamfered portion F2 may be formed on both the upper and lower sides of the inner peripheral surface that forms the opening F1, as shown in Fig. 6. In short, the ring frame F of the third embodiment may have the chamfered portion F2 formed at the corner between the inner peripheral surface and at least one of the two opposing surfaces (both the upper and lower surfaces) that are connected to the inner peripheral surface, and the sheet S may be attached to the surface where the chamfered portion F2 is formed.

[0055] As shown in FIG. 7, the chamfered portion F2 of the ring frame F may be formed by a tapered surface whose cross section is inclined in the vertical direction.

[0056] Furthermore, the chamfered portion 44 of the ring member 43 in the first embodiment and the tip side of the cylindrical portion 61 in the second embodiment may also be formed with a tapered surface like the chamfered portion F2 in FIG. [Industrial Applicability]

[0057] As described above, the present invention has the effect of preventing the expanded sheet from breaking when dividing a wafer attached to a sheet starting from a division starting point. [Explanation of symbols]

[0058] 1:Dividing device 11: Gripping mechanism 12:Dividing mechanism 14: Placement table 15: Cover plate 43: Ring member 61: Cylindrical part F: Ring frame F1:Aperture F2: Chamfered part S: Seat W: wafer W1: Splitting starting point (modified layer)

Claims

1. A ring frame having a central opening, A ring frame having a chamfer formed at a corner between an inner peripheral surface and at least one of two opposing surfaces connected to the inner peripheral surface.

2. A dividing method for dividing a wafer at a dividing starting point formed on a wafer attached to a sheet by expanding the sheet that covers an opening of a ring frame, the method comprising: a sheet adhering step of adhering the sheet to a surface of the ring frame according to claim 1 that is connected to the chamfered portion to close the opening of the ring frame, and adhering the wafer to the sheet; a dividing step of separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer, folding the sheet at the chamfered portion to expand the sheet at the opening of the ring frame, and dividing the wafer starting from the dividing starting point.

3. A dividing method for dividing a wafer at a dividing starting point formed on a wafer attached to a ring frame by expanding a sheet attached to the sheet so as to close an opening of the ring frame, the method comprising: a gripping step of gripping both surfaces of the ring frame, including the portion to which the sheet is attached, with a gripping mechanism; a ring member arranging step of arranging a ring member having a cross section shaped such that a portion of the circular arc abuts against the sheet on the inner circumferential surface of the ring frame; a dividing step of separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer, expanding the sheet at the opening of the ring frame, and dividing the wafer starting from the dividing starting point.

4. A dividing device that divides a wafer at a dividing starting point formed on a wafer attached to a ring frame by expanding a sheet that is attached to the sheet so as to close an opening of the ring frame, a gripping mechanism that grips both sides of the ring frame, including the portion where the sheet is attached; a dividing mechanism that divides the wafer by expanding the sheet at the opening portion of the ring frame by relatively separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer attached to the sheet; A dividing device comprising: a ring member that is arranged inside the inner circumferential surface of the ring frame and has a cross-sectional shape that is an arc-shaped portion that contacts the sheet when the sheet is expanded by the dividing mechanism.

5. A dividing device that divides a wafer at a dividing starting point formed on a wafer attached to a ring frame by expanding a sheet that is attached to the sheet so as to close an opening of the ring frame, a gripping mechanism that grips both sides of the ring frame, including the portion where the sheet is attached; a dividing mechanism that divides the wafer by relatively separating the ring frame and the wafer in a direction perpendicular to the surface of the wafer attached to the sheet, thereby expanding the sheet at the opening of the ring frame, the gripping mechanism includes a mounting table on which the sheet attached to the ring frame is placed with the sheet facing downward, and a cover plate that sandwiches the ring frame placed on the mounting table from above; The cover plate is a dividing device having a cylindrical portion that enters the inside of the inner surface of the ring frame and contacts the sheet with its lower end, and has a tip with an arc-shaped cross section that abuts against the sheet.

Images