Display unit

Abstract

To achieve heat dissipation corresponding to vertical installation and horizontal installation of a display unit.SOLUTION: A display unit has an exterior, a power circuit board arranged inside the exterior, and heat sinks. The exterior has suction holes near the power circuit board. In either case of horizontal installation or vertical installation, the power circuit board is arranged to be lower than a center position of the display unit. The heat sinks are arranged respectively on a front side and a rear side of the power circuit board. A heat dissipation channel formed by the heat sink on the front side of the power circuit board and a heat dissipation channel formed by the heat sink on the rear side of the power circuit board, are different in direction from each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a display device. [Background technology]

[0002] In recent years, display devices have come to use high-definition display panels and LEDs (Light Emitting Diodes) as backlight sources. As a result, the display performance and system control performance of display devices have improved, but power consumption has also increased, leading to increased heat generation from various electrical components such as system circuits and power supply circuits, as well as from circuit boards.

[0003] Furthermore, as vertically shot videos become more common, improvements in the display performance and system control performance of display devices are required to enable viewing of vertically shot videos more clearly. For example, in live broadcasts and e-commerce, display devices are required to support a wide color gamut and to display high dynamic range (HDR).

[0004] Under these circumstances, there is a need for a single display device that can be used in both landscape and portrait orientations. To address this need, methods for cooling the main heat-generating components of a display device have been devised, assuming that a single display device can be used in both landscape and portrait orientations.

[0005] Patent Document 1 discloses a display device that can form a heat dissipation flow path regardless of the installation direction by arranging the heat sink attached to the circuit board at an angle, whether the display device is installed horizontally or vertically.

[0006] Patent Document 2 discloses a display device that has an intake fan and an exhaust fan to realize a heat dissipation structure that is compatible with both horizontal and vertical installation. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent Publication No. 2015-11045 [Patent Document 2] Patent Publication No. 2021-124593 Summary of the Invention [Problem to be solved by the invention]

[0008] However, even if the heat sink is arranged at an angle as in Patent Document 1, it may be difficult to form a heat dissipation flow path, and the presence of an oblique heat dissipation flow path may increase flow path resistance. Also, as in Patent Document 2, the duct from intake to exhaust may become large and long, which may increase costs and flow path resistance. Therefore, in consideration of the above problems, the present invention aims to achieve heat dissipation that is compatible with both horizontal and vertical installation of the display device, and to obtain a more stable heat dissipation effect. [Means for solving the problem]

[0009] A display device having an exterior, a power supply circuit board arranged inside the exterior, and a heat sink, wherein the exterior has an air intake hole near the power supply circuit board, and in either the horizontal or vertical installation, the power supply circuit board is arranged below the center position of the display device, the heat sinks are arranged on the front and back sides of the power supply circuit board, and the heat dissipation flow path formed by the heat sink on the front side of the power supply circuit board and the heat dissipation flow path formed by the heat sink on the back side of the power supply circuit board are in different directions. [Effects of the Invention]

[0010] According to the present invention, heat dissipation compatible with both horizontal and vertical installation of the display device can be realized, and a stable heat dissipation effect can be obtained. [Brief explanation of the drawings]

[0011] [Figure 1]FIG. 2 is an exploded perspective view of the display device according to the first embodiment when installed horizontally. [Figure 2] FIG. 2 is an exploded perspective view of the display device according to the first embodiment when installed vertically. [Figure 3] FIG. 2 is a perspective view showing a power supply circuit board according to the first embodiment. [Figure 4] FIG. 2 is a cross-sectional view showing the power supply circuit board according to the first embodiment. [Figure 5] FIG. 2 is a rear view showing the display device according to the first embodiment. [Figure 6] FIG. 10 is a perspective view showing a power supply circuit board according to a second embodiment. [Figure 7] FIG. 10 is a perspective view showing a heat sink according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0013] [First embodiment] A first embodiment of the present invention will be described below with reference to FIGS.

[0014] Fig. 1 is an exploded perspective view of a display device according to a first embodiment when installed horizontally. Fig. 2 is an exploded perspective view of a display device according to a first embodiment when installed vertically. Fig. 3 is a perspective view showing a power supply circuit board according to the first embodiment. Fig. 4(a) is an AA cross-sectional view showing a power supply circuit board according to the first embodiment. Fig. 4(b) is a BB cross-sectional view showing a power supply circuit board according to the first embodiment.

[0015] As shown in FIGS. 1 and 2, the display device 1 includes a display panel 2 for displaying images, and the surrounding exterior includes a bezel 7 on the front side and a rear cover 11 on the rear side. The bezel 7 and rear cover 11 are often made of metal such as aluminum or iron, and are formed by pressing or machining, but may also be molded from a resin material. The display panel 2 is a liquid crystal display panel, an OLED (Organic Light Emitting Diode) panel, or the like. Note that various types of display panel 2 can be selected, and panels other than those illustrated may also be used. In this embodiment, a case where the display panel 2 is a liquid crystal display panel will be described.

[0016] A backlight unit 3 is disposed behind the display panel 2. The backlight unit 3 mainly includes an optical sheet 9 disposed behind the display panel 2, and a light source substrate 8 mounted with multiple light sources (not shown) disposed behind the optical sheet 9. The backlight unit 3 is covered by a case component such as a chassis 10. In this embodiment, a backlight using light-emitting diodes (LEDs) is used as the light source, but this is not limiting. The optical sheet 9 is a sheet- or plate-shaped member that optically adjusts the light from the light source substrate 8 and irradiates it onto the display panel 2. It is composed of a diffuser plate for uniforming the amount of light in the surface direction and a prism sheet for controlling the direction of light emission. In this embodiment, multiple optical sheets 9 are provided. Materials used for the optical sheet 9 include polycarbonate and polyethylene terephthalate. Considering strength and heat dissipation and uniformity of the heat from the light source substrate 8, the chassis 10 is preferably made of a metal material such as iron, aluminum, or an alloy thereof, formed by pressing or machining.

[0017] Various circuit boards are arranged between the chassis 10 and the rear cover 11. That is, the circuit boards are arranged inside the exterior of the display device 1. These include a system circuit board 6 that controls the system of the display device 1 and a power supply circuit board 4 that supplies power. In this embodiment, a fan 5 is provided in the display device 1 to cool the above boards and the backlight unit 3. In particular, as the brightness of the backlight unit 3 increases, the power consumption of the power supply circuit board 4 increases, and the amount of heat generated also increases. Therefore, the presence of the cooling fan 5 is desirable. Furthermore, air intakes 12 and 13 and exhaust holes 14 are provided in the rear cover 11 to form heat dissipation paths for the various boards. For efficient cooling in a horizontal installation as shown in FIG. 1, the air intake 12 is provided below the rear cover 11, and the exhaust hole 14 and fan 5 are provided above. On the other hand, in a vertical installation as shown in FIG. 2, an air intake 13 is provided near the power supply circuit board 4, which generates a large amount of heat, in other words, on the side of the rear of the rear cover, to form a heat dissipation path for exhausting heat via the exhaust hole 14 and fan 5. The intake and exhaust holes are typically shaped like multiple round holes with a diameter of approximately 1 to 5 mm, but may also be polygonal or irregularly shaped. While intake holes 12 and 13 are provided on the rear side of rear cover 11 in FIGS. 1 and 2, intake holes may also be provided on the bottom or side of the rear cover. Furthermore, if bezel 7 is extended, intake holes may also be provided on the bottom or side of bezel 7. In the case of horizontal installation as shown in FIG. 1, a horizontal flow path 15 is formed from intake hole 12 to exhaust hole 14. This cools system circuit board 6, power supply circuit board 4, backlight unit 3, and other components. In the case of vertical installation as shown in FIG. 2, a vertical flow path 16 is formed from intake hole 13 to exhaust hole 14. This cools system circuit board 6, power supply circuit board 4, backlight unit 3, and other components, as in FIG. 1.

[0018] By forming a heat dissipation flow path that is compatible with both horizontal and vertical installation as shown in Figures 1 and 2, efficient cooling of the entire display device and the circuit board can be achieved. In particular, by arranging the power supply circuit board 4 below the center of the display device 1 in both horizontal and vertical installations, the power supply circuit board, which generates a lot of heat, is located near the air intake vents 14, thereby achieving efficient cooling. On the other hand, the various electronic components on the power supply circuit board 4 also need to be kept within their rated temperatures. Figure 3 explains the configuration for cooling the electronic components on the power supply circuit board 4 that generate a lot of heat.

[0019] As shown in FIG. 3, the power supply circuit board 4 has various electronic components mounted on a printed circuit board 20. The printed circuit board 20 is mounted with a semiconductor 21, which is a heat-generating element, other electronic components 25, and a connector 26 for connecting the circuit boards together. In this embodiment, the printed circuit board 20 has a base material made of phenolic resin or epoxy resin. The semiconductor 21 is a component such as a diode or transistor. The other electronic components 25 are electronic components such as capacitors, coils, and transformers, but various other components of various sizes are also provided for constructing various power supply circuit configurations. The semiconductor 21, which generates a large amount of heat among these electronic components, may be provided with a heat sink or fins to further promote cooling. Here, the configuration of the display device 1 compatible with horizontal and vertical installation will be described with reference to FIG. 4.

[0020] The semiconductor 21 is fixed to a heat transfer member 24. The heat transfer member 24 is arranged on the front side 17 and the back side 18 so as to sandwich and penetrate the printed circuit board 20, and is fixed to a heat sink (front) 22 on the front side 17 and to a heat sink (back) 23 on the back side 18. Various heat sinks may be fixed to multiple semiconductors. These fixing methods are preferably mechanical fixing using adhesives or screws, and adhesives with high thermal conductivity are more effective. In the case of screw fixing, the heat sink can be threaded.

[0021] The heat transfer member 24 is preferably made of a metal component such as aluminum or iron, or a material with good heat dissipation properties, such as a graphite sheet. The heat sink (front) 22 and the heat sink (rear) 23 are also preferably made of a metal material, preferably an aluminum-based compound. To form the fin shape, they are extruded. The heat sink (front) 22 and the heat sink (rear) 23 are formed to extend in a nearly vertical direction. When configured as shown in Figures 3 and 4, the heat sink maximizes its heat dissipation effect when air flows along the length of the fins. Therefore, the heat sink (front) 22 forms a vertical flow path 16 from the intake hole 13 to the exhaust hole 14. When installed horizontally, the heat sink (rear) 23 forms a horizontal flow path 15 from the intake hole 12 to the exhaust hole 14. This allows the semiconductor to be cooled via the heat sink and the heat transfer member.

[0022] Although this configuration has been specifically described for the power supply circuit board 4, a similar configuration can be used for the system circuit board 4 or other boards that have electronic components that generate a lot of heat.

[0023] Next, a method for achieving more efficient cooling will be described with reference to FIG. 5. FIG. 5 is a rear view of a display device according to a first embodiment. In addition to FIGS. 1 to 4, an airflow direction vane 30 is provided. The airflow direction vane 30 is disposed around the power supply circuit board 4, with an opening formed in the power supply circuit board 4 and a shape that allows it to be close to the power supply circuit board 4. By extending the airflow direction vane to the vicinity of the air intake holes 12 and 13, the heat dissipation flow paths on the front side 17 and back side 18 of the printed circuit board 20 are easily separated when the display device is installed horizontally or vertically, thereby improving the cooling effect. This is because the air from the air intake holes 12 and 13 does not pass through the heat sink or heat-generating components, preventing the formation of a flow path in another location, and thus facilitating the formation of a flow path in the electronic components to be cooled. As shown in FIG. 5, the airflow direction vane 30 serves as an auxiliary component that facilitates the formation of the flow path (horizontal) 15 and the flow path (vertical) 16. The airflow direction vane 30 is preferably made of a metal sheet or a resin plate material, but may also be made of a resin-molded material or shape. Furthermore, when the airflow direction plate 30 is in the shape of a plate, it can be bent and placed up to the vicinity of the air intake hole. Furthermore, extending the airflow direction plate 30 up to the vicinity of the fan 5 can also provide greater effects.

[0024] As described above, the configuration of this embodiment makes it possible to realize heat dissipation compatible with both horizontal and vertical installations, and to obtain a stable heat dissipation effect.

[0025] [Second embodiment] Next, a second embodiment of the present invention will be described with reference to the drawings, with the configuration of the second embodiment being described in detail with respect to the parts that are different from the first embodiment.

[0026] FIG. 6 is a perspective view showing a power supply circuit board according to the second embodiment.

[0027] In the first embodiment, the front side of the printed circuit board is a heat sink suitable for vertical installation, and the back side is a heat sink suitable for horizontal installation. As shown in FIG. 6, the power supply circuit board 104 has semiconductors and other electronic components mounted on a printed circuit board 120. The semiconductors are fixed to a heat transfer member 124 on the printed circuit board 120. The heat transfer member 124 is arranged on the front side 117 and the back side 118 so as to penetrate the printed circuit board 120, and is fixed to a heat sink (front) 122 on the front side 117 and a heat sink (back) 123 on the back side 118. The heat sink (front) 122 and the heat sink (back) 123 are formed to extend in a substantially vertical direction. When configured as shown in FIGS. 3 and 4, when the heat sink (front) 122 is installed horizontally, a flow path (horizontal) 115 is formed in the heat sink (front) 122 from the intake hole 12 to the exhaust hole 14 shown in FIGS. 1 and 2. When installed vertically, the heat sink (back) 123 forms a flow path (vertical) 116 from the intake hole 13 to the exhaust hole 14. This allows the semiconductor to be cooled via the heat sink and the heat transfer member.

[0028] As described above, this embodiment has shown an example in which cooling is possible even if the direction in which the flow passages are formed is changed from that of the first embodiment during installation.

[0029] [Third embodiment] Next, a third embodiment of the present invention will be described with reference to the drawings. In this embodiment, the configuration of the parts that are different from the first to second embodiments will be described in detail.

[0030] FIG. 8 is a perspective view showing a heat sink according to the third embodiment.

[0031] As shown in FIG. 8, the heat sink (sheet metal) is not an extruded material or shape as in the first and second embodiments, but rather a fin-shaped product formed by bending sheet metal. Such a shape may be used as a heat sink for a power circuit board. Aluminum alloy is preferable as the material, but this is not a limitation. Another feature of this material is that it can be used as a thin material, with a thickness of approximately 0.1 to 2.0 mm being preferable. When attaching it to a heat transfer member or semiconductor, it can be fixed with screws or adhesive, as in the first and second embodiments. In particular, when fixing with screws, it is possible to leave a portion of the seating surface and process a female thread, or to use a tapping screw that cuts its own thread into the groove.

[0032] It may also be used in combination with an extruded heat sink like in the first and second embodiments. For example, the front and back sides of the power supply circuit board may be sandwiched between extruded material and a heat sink (sheet metal) on the back side, and the configuration may be changed accordingly. Naturally, there is no problem with reversing the configuration between the front and back sides.

[0033] As described above, the configuration of this embodiment makes it possible to realize heat dissipation compatible with both horizontal and vertical installations even if the shape and forming method of the heat sink are changed, and a stable heat dissipation effect can be obtained.

[0034] [Other embodiments] While the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the present invention. For example, the present invention is applicable not only to display devices but also to devices having a light source on the entire surface, such as lighting devices.

[0035] The disclosure of this embodiment includes the following configuration.

[0036] [Configuration 1] A display device having an exterior, a power supply circuit board disposed inside the exterior, and a heat sink, the exterior has an air intake hole near the power supply circuit board, In either the horizontal installation or the vertical installation, the power supply circuit board is disposed below the center position of the display device, the heat sinks are disposed on the front and rear sides of the power supply circuit board, The heat dissipation flow path formed by the heat sink on the front side of the power supply circuit board and the heat dissipation flow path formed by the heat sink on the back side of the power supply circuit board are in different directions. A display device characterized by:

[0037] [Configuration 2] The heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board have heat dissipation paths formed in directions substantially perpendicular to each other. 2. The display device according to configuration 1,

[0038] [Configuration 3] the power supply circuit board has an electronic component to which a heat transfer member is fixed, The heat transfer member is fixed to the heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board. 3. The display device according to configuration 1 or 2.

[0039] [Configuration 4] a wind direction plate that separates the front side and the back side of the power supply circuit board from each other around the power supply circuit board; The wind direction plate extends to the air intake hole of the exterior. 4. The display device according to any one of configurations 1 to 3.

[0040] [Configuration 5] The display device described in any one of configurations 1 to 4, wherein the heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board are made of a metal material formed by extrusion molding.

[0041] [Configuration 6] The display device according to any one of configurations 1 to 4, wherein the heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board are heat sinks formed by bending a metal sheet.

Claims

1. A display device having an exterior, a power supply circuit board disposed inside the exterior, and a heat sink, the exterior has an air intake hole near the power supply circuit board, In either the horizontal installation or the vertical installation, the power supply circuit board is disposed below the center position of the display device, the heat sinks are disposed on the front and rear sides of the power supply circuit board, The heat dissipation flow path formed by the heat sink on the front side of the power supply circuit board and the heat dissipation flow path formed by the heat sink on the back side of the power supply circuit board are in different directions. A display device characterized by:

2. The heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board have heat dissipation paths formed in directions substantially perpendicular to each other.

2. The display device according to claim 1.

3. the power supply circuit board has an electronic component to which a heat transfer member is fixed, The heat transfer member is fixed to the heat sink on the front side of the power supply circuit board and the heat sink on the back side of the power supply circuit board.

2. The display device according to claim 1.

4. a wind direction plate that separates the front side and the back side of the power supply circuit board from each other around the power supply circuit board; The wind direction plate extends to the air intake hole of the exterior.

2. The display device according to claim 1.

5. 2. The display device according to claim 1, wherein the heat sink on the front side of the power supply circuit board and the heat sink on the rear side of the power supply circuit board are made of a metal material formed by extrusion molding.

6. 2. The display device according to claim 1, wherein the heat sink on the front side of the power supply circuit board and the heat sink on the rear side of the power supply circuit board are heat sinks formed by bending a metal sheet.

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