Cooling structure and electronic device

Abstract

To enable sufficient intake of air for cooling heat-generating components in an electronic device even when the overall height of a housing of the electronic device is limited.SOLUTION: A cooling structure for an electronic device includes: a first ventilation portion provided on a surface portion that forms a surface different from a front surface which is a surface that is exposed when the electronic device is mounted; and a second ventilation portion that exhausts air drawn into the housing of the electronic device by the first ventilation portion to the outside of the housing of the electronic device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a cooling structure for an electronic device. [Background technology]

[0002] Among electronic devices, there are some that are mounted on a rack and only have their front surfaces exposed when mounted. In such electronic devices, for example, an air intake port is provided on the front of the housing of the electronic device, and a blower (fan) and an exhaust port are provided on the rear of the housing, and cooling is achieved by configuring the air to flow from the front to the rear. On the other hand, among structures for cooling heat-generating components inside electronic devices, there are cooling structures that dissipate heat through fins inside the electronic device (for example, the heat sink described in Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-179382 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional electronic devices, when the overall height of the housing of the electronic device is limited, there is a problem that it is not possible to provide sufficient air intakes on the front of the housing for cooling, and there may be a shortage of air intake to cool the heat-generating components. Patent Document 1 does not particularly disclose the structure of the air intake port, and cannot solve the above problem when the overall height of the housing of the electronic device is limited.

[0005] The present disclosure is intended to solve the above-mentioned problems, and aims to provide a cooling structure that enables sufficient intake of air to cool heat-generating components in electronic devices, even in cases where the overall height of the housing of the electronic device is limited. [Means for solving the problem]

[0006] The cooling structure of the present disclosure is a cooling structure for an electronic device, a first ventilation portion provided on a surface portion that forms a surface different from a front surface that is an exposed surface when the electronic device is mounted; a second ventilation section that discharges the air drawn into the housing of the electronic device by the first ventilation section to the outside of the housing of the electronic device; Equipped with: [Effects of the Invention]

[0007] According to the present disclosure, it is possible to obtain a cooling structure that allows sufficient air to be drawn in to cool heat-generating components in an electronic device, even in cases where the overall height of the housing of the electronic device is limited. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating an example of an electronic device to which a cooling structure according to a first embodiment of the present disclosure is applied. [Figure 2] FIG. 2 is a schematic diagram illustrating an example of the internal structure of an electronic device to which a cooling structure according to a second embodiment of the present disclosure is applied and a first example of a heat dissipation fin portion. [Figure 3] FIG. 3 is a perspective view illustrating a second example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. [Figure 4] FIG. 4 is a perspective view illustrating a third example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. [Figure 5]FIG. 5 is a perspective view showing a fourth example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. [Figure 6] FIG. 6 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the third embodiment of the present disclosure is applied and a fifth example of a heat dissipation fin portion. [Figure 7] FIG. 7 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the fourth embodiment of the present disclosure is applied. [Figure 8] FIG. 8 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the fifth embodiment of the present disclosure is applied. [Figure 9] FIG. 9 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the sixth embodiment of the present disclosure is applied. [Figure 10] FIG. 10 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the seventh embodiment of the present disclosure is applied. [Figure 11] FIG. 11 is a schematic diagram illustrating an example of the internal structure of an electronic device in which the cooling structure according to the seventh embodiment of the present disclosure is not employed. DETAILED DESCRIPTION OF THE INVENTION

[0009] In order to explain the present disclosure in more detail, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0010] Embodiment 1 In the first embodiment, an example of a cooling structure formed in a housing of an electronic device will be described, which has a ventilation part on a surface different from the front surface of the housing of the electronic device.

[0011] The cooling structure according to the first embodiment has a first ventilation part and a second ventilation part, and the first ventilation part is provided on a surface of the housing of the electronic device that is different from the front surface. FIG. 1 is a perspective view showing an example of an electronic device 1 to which a cooling structure according to a first embodiment of the present disclosure is applied. The electronic device 1 may be, for example, a rack-mounted electronic device, and in a mounted state, only the front surface of the housing 2 is exposed, and some or all of the top, bottom, left side, or right side of the housing 2 may be surrounded by other components. In addition, in a mounted state, the electronic device 1 may have some of the top, bottom, left side, or right side of the housing 2 covered by other components. The other configuration may be, for example, a housing other than the electronic device 1 or a wall. In such an electronic device 1, the overall height (height a of the electronic device) of the housing 2 of the electronic device 1 may be limited, and in this case, components such as an interface 11 for connecting to an external device may be arranged on the front, and the front ventilation section 12 for intake of air may not be sufficiently provided on the front part 10. Therefore, the electronic device 1 shown in FIG. 1 has a cooling structure according to the first embodiment.

[0012] The first ventilation section 80 is provided on the surface section 70, which forms a surface different from the front surface, which is the surface exposed when the electronic device 1 is mounted. In the description, the surface section 70 on which the first ventilation section 80 is provided is also referred to as the "first ventilation surface section," meaning the surface section having the first ventilation section 80. The first ventilation section 80 functions as an intake section that draws outside air (external air) into the housing 2 of the electronic device 1. The first ventilation section 80 is configured with an opening. Specifically, the opening of the first ventilation section 80 shown in FIG. 1 includes a plurality of ventilation holes formed in the surface section 70. The flow rate of air drawn into the housing 2 of the electronic device 1 can be changed depending on the number of ventilation holes formed in the surface section 70 and the diameter of the ventilation holes. For example, the diameter of the ventilation holes formed in the surface section 70 can be reduced to increase the flow rate of air drawn into the housing 2. Increasing the flow rate of air inside the housing 2 can improve the cooling performance of heat-generating components. Furthermore, if heat dissipation fins that receive and dissipate heat from heat-generating components are provided inside the housing 2, the air with increased flow rate can be made to collide with the heat dissipation fins, further improving cooling performance.

[0013] The second ventilation section functions as an exhaust section that exhausts the air that has been drawn into the housing of the electronic device 1 by the first ventilation section 80 to the outside of the housing of the electronic device 1. Although not shown in Fig. 1, the second ventilation section is provided, for example, on the rear surface 20 of the housing 2 of the electronic device 1. The rear surface 20 is the surface of the housing 2 that faces the front surface 10, and forms the rear surface that is the surface when the housing 2 is viewed in the direction of arrow B. Note that arrow B indicates the direction from the rear side of the electronic device 1 toward the electronic device 1 in the normal state in which the electronic device 1 is mounted. The normal state is, for example, the state of use recommended by the manufacturer.

[0014] Here, in this description, the "front surface" of the electronic device 1 or the housing 2 in a state in which the electronic device 1 is mounted may also be expressed as the "front face." Similarly, the "rear surface" may also be expressed as the "rear face," the "top surface" may also be expressed as the "top face," the "bottom surface" may also be expressed as the "bottom face," the "left side surface" may also be expressed as the "first side surface," and the "right side surface" may also be expressed as the "second side surface."

[0015] The surface portion 70 on which the first ventilation portion 80 is provided is specifically at least one of the top surface portion 30 on the front side of the housing 2 of the electronic device 1, the bottom surface portion 40 on the front side, or the side surface portion on the front side (first side surface portion 50, second side surface portion 60).

[0016] The top surface 30 on the front side is a portion of the top surface 30 that forms the top surface, which is the surface when the housing 2 is viewed in the direction of arrow C, that is closer to the front surface 10 than the rear surface 20. Note that arrow C indicates the direction from the upper side of the exterior of the electronic device 1 toward the electronic device 1 in the normal state in which the electronic device 1 is mounted.

[0017] The bottom surface 40 on the front side is a portion of the bottom surface 40 that forms the bottom surface when the housing 2 is viewed in the direction of arrow D, and is closer to the front surface 10 than the rear surface 20. Note that arrow D indicates the direction from the outside underside of the electronic device 1 toward the electronic device 1 in the normal state in which the electronic device 1 is mounted.

[0018] The first side surface portion 50 of the side surface portions on the front side is a portion of the first side surface portion 50 that forms the left side surface, which is the surface when the housing 2 is viewed in the direction of arrow E, and is closer to the front surface portion 10 than the rear surface portion 20. Note that arrow E indicates the direction from the left side of the outside of the electronic device 1 toward the electronic device 1 in the normal state in which the electronic device 1 is mounted.

[0019] The second side surface portion 60 of the side surface portions on the front side is a portion that is closer to the front surface portion 10 than the rear surface portion 20 of the second side surface portion 60 that forms the right side surface, which is the surface when the housing 2 is viewed in the direction of the arrow F. The arrow F indicates the direction from the right side of the outside of the electronic device 1 toward the electronic device 1 in the normal state in which the electronic device 1 is mounted.

[0020] Here, particularly in the case of an electronic device 1 in which the top, bottom, left side, or right side of the housing 2 is entirely covered by other components when mounted, the surface portion 70 as the first ventilation surface portion on which the first ventilation portion 80 is provided may be configured as a stepped surface portion. In this configuration, the surface portion 70 is a stepped surface portion having a stepped surface formed so as to be lowered from the top, bottom, or side (left side, right side) of the housing 2 of the electronic device 1 toward the inside of the housing 2. 1 is formed to have a stepped surface formed so that the front side of the top surface of housing 2 of electronic device 1 is lowered from the position of the top surface of top surface 30 toward the inside of housing 2. Surface 70, which is a stepped surface shown in Fig. 1, is formed in a stepped shape such that the connection portion between the front surface of the rectangular parallelepiped housing and the top surface connected to the front surface is cut out. In addition, when the electronic device 1 is mounted, part or all of the top, bottom, left side, or right side of the housing 2 is surrounded by other structures, or when the electronic device 1 is mounted, part of the top, bottom, left side, or right side of the housing 2 is covered by other structures, the surface portion 70 may be configured as a stepped surface portion.

[0021] 1, the surface 70 as the first ventilation surface may be an inclined surface extending in a straight line from the edge of the front surface of the housing 2 of the electronic device 1 to the top surface, bottom surface, or side surface (left side surface, right side surface). By considering the design including this configuration, the degree of freedom in designing the electronic device 1 is improved. This also applies to the embodiments described below.

[0022] 1 is configured to have a front ventilation section 12 for intake around an interface 11 on a front surface 10, but in the present disclosure, if the front surface 10 does not have the front ventilation section 12, the electronic device may be configured without the front ventilation section 12. This also applies to the embodiments described below.

[0023] With the above-described configuration, the present disclosure makes it possible to configure an electronic device as a unit device in which, when implemented, no surfaces other than the front surface of the housing are exposed to the outside air, by providing a first ventilation section on the top, bottom, or side surface on the front side of the housing of the electronic device, so that sufficient air can be drawn in to cool heat-generating components in the electronic device.

[0024] This embodiment shows an example of the following configuration. A cooling structure for an electronic device, a first ventilation portion provided on a surface portion that forms a surface different from a front surface that is an exposed surface when the electronic device is mounted; a second ventilation section that discharges the air drawn into the housing of the electronic device by the first ventilation section to the outside of the housing of the electronic device; Equipped with A cooling structure characterized by: As a result, the present disclosure has the effect of providing a cooling structure that allows sufficient air to be drawn in to cool heat-generating components in an electronic device, even in cases where the overall height of the housing of the electronic device is limited. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0025] This embodiment further shows an example of an embodiment including the following configuration. The surface portion on which the first ventilation portion is provided is at least one of a top surface portion on the front side, a bottom surface portion on the front side, and a side surface portion on the front side of a housing of the electronic device. A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that allows sufficient air to be drawn in to cool heat-generating components of an electronic device when any of the top, bottom, or side surfaces of the housing of the electronic device is not covered by other components when the electronic device is mounted.

[0026] This embodiment shows an example of the following configuration. a housing that houses heat-generating components; a first ventilation section provided on a surface of the housing that forms a surface different from a front surface of the housing that is exposed when the electronic device is mounted; a second ventilation section that discharges the air drawn into the housing by the first ventilation section to the outside of the housing; Equipped with An electronic device characterized by: The present disclosure has the advantage of being able to provide an electronic device having a cooling structure that enables sufficient intake of air to cool heat-generating components in the electronic device, even in cases where the overall height of the housing of the electronic device is limited.

[0027] This embodiment further shows an example of an embodiment including the following configuration. The surface portion on which the first ventilation portion is provided is a stepped surface portion having a stepped surface formed so as to be lowered from a position of the top surface, bottom surface, or side surface of the housing toward the inside of the housing. A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that allows sufficient air to be drawn in to cool the heat-generating components of the electronic device, even if all of the top, bottom, or side surfaces of the housing of the electronic device are covered by other structures when the electronic device is mounted. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0028] This embodiment further shows an example of an embodiment including the following configuration. The first ventilation section is configured to include a plurality of ventilation holes. A cooling structure characterized by: As a result, the present disclosure has the effect of being able to provide a cooling structure in which the opening holes provided in the steps have a small diameter, thereby increasing the flow rate and causing the increased flow rate air to collide with the air downwind of the fins. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0029] Embodiment 2 In the first embodiment, an example of a cooling structure in which the first ventilation part is provided on a surface of the housing of the electronic device that is different from the front surface has been described. In the second embodiment, an example of a cooling structure inside the housing of an electronic device will be described. In the second embodiment, among the components according to the second embodiment, those components that are the same as the components according to the first embodiment that have already been described will not be described again.

[0030] The cooling structure according to the second embodiment of the present disclosure further includes a heat dissipation fin portion that is unique to the present disclosure. FIG. 2 is a schematic diagram illustrating an example of the internal structure of an electronic device to which a cooling structure according to a second embodiment of the present disclosure is applied and a first example of a heat dissipation fin portion. FIG. 2 shows the electronic device 1 as viewed from the direction of arrow E in FIG. 1, with the side of the housing 2 cut away to reveal the internal structure. The electronic device 1 shown in FIG. 2 has a housing 2 that houses a substrate 110 on which a heat-generating component 100 is mounted. A heat dissipation fin section 200 is placed on the upper surface of the heat generating component 100 in contact with the heat generating component 100 . The heat dissipation fin section 200 has a plurality of fins 200a that receive heat from the heat-generating components 100 of the electronic device 1 and dissipate the heat. The fins 200a are each in the form of a plate extending from the first ventilation section 80 side to the second ventilation section 90 side, and are arranged parallel to one another in the depth direction on the paper surface of FIG. The fin 200a has an inclined structure 203 that forms an inclination with respect to the direction in which air drawn into the housing 2 of the electronic device 1 will flow. Specifically, when the rear-side fin portion 202, which is the end portion on the second ventilation portion 90 side farthest from the first ventilation portion 80, is used as a reference, the fin 200a is formed so that the height direction length c of the rear-side fin portion 202 gradually decreases as it approaches the first ventilation portion 80 side, and reaches the height direction length b of the front-side fin portion 201, which is the end portion on the side of the first ventilation portion 80. In this way, the fin 200a forms an inclined structure portion 203 that is inclined from the height position of the rear-side fin portion 202 to the height position of the front-side fin portion 201. That is, the heat dissipation fin section 200 has an inclined structure section 203 that forms an inclination such that each fin 200a becomes shorter as it approaches the first ventilation section 80, with the fin 200a on the second ventilation section 90 side as the reference. By employing this configuration, pressure loss on the upwind side of fins 200a of heat dissipation fin section 200 can be reduced, and the flow velocity is less likely to decrease on the downwind side.

[0031] A second ventilation section 90 is provided on the rear surface 20 of the housing 2, similar to the second ventilation section in the embodiment already described. The second ventilation section 90 shown in FIG. 2 includes an exhaust fan 91 that exhausts the air inside the housing 2 of the electronic device 1 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0032] Next, cooling by the cooling structure of the electronic device 1 according to this embodiment will be described. For example, when the electronic device 1 starts operating, the exhaust fan 91 starts operating. When the exhaust fan 91 operates and air begins to be discharged from the second ventilation section 90 into the housing 2 of the electronic device 1, air begins to be drawn in through the ventilation holes of the first ventilation section 80 and the front ventilation section 12, creating an air flow. Furthermore, when the electronic device 1 starts operating, the heat-generating component 100 generates heat and transfers the heat to the heat dissipation fin section 200 . A portion of the air taken in through the ventilation holes of first ventilation section 80 collides with front-side fin section 201, causing heat to be dissipated from front-side fin section 201. As the air taken in through the ventilation holes of first ventilation section 80 travels further in the direction of second ventilation section 90, it collides with each of inclined structural sections 203, which are the tips in the height direction, along the slope of inclined structural sections 203 of fins 200b, causing heat to be dissipated from fins 200b. The air whose temperature has increased as a result of radiating heat from the fins 200b is discharged to the outside via the second ventilation section 90 and the exhaust fan 91. In this way, the air can be guided up to the leeward side of the tip of the heat dissipation fin section 200 in the height direction and collided therewith to cool the heat dissipation fins.

[0033] Here, a modified example of the heat dissipation fin portion 200 will be described. A second example of the heat dissipation fin section 200 will be described. FIG. 3 is a perspective view illustrating a second example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. The cooling structure of the electronic device 1 may be configured to include a heat dissipation fin section 200 as shown in FIG. The heat dissipation fin section 200 has a plurality of fins 200b that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. In the heat dissipation fin section 200, the fins 200b are arranged at intervals that combine different fin pitches. 3, in the heat dissipation fin section 200, for example, the fin pitch length d of the fin 200b is different from the fin pitch length e. By combining different fin pitches, it is possible to guide the flowing air so that it collides with many surfaces of the fin 200b. The fin pitch length is designed based on, for example, the results of a computational simulation or experimental results.

[0034] A third example of the heat dissipation fin section 200 will be described. FIG. 4 is a perspective view illustrating a third example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. The cooling structure of the electronic device 1 may be configured to include a heat dissipation fin section 200 as shown in FIG. The heat dissipation fin section 200 has a plurality of fins 200c that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. The heat dissipation fin section 200 is configured by combining fins 200c of different heights. 4, in the heat dissipation fin section 200, the height direction length f of the first fin 200c is different from the height direction length g of the second fin 200c. By combining fins 200c of different heights, it is possible to guide the flowing air so that it collides with many surfaces of the fins 200c. The fin height of each of the multiple fins 200c is designed based on, for example, the results of a simulation using calculations or experimental results.

[0035] A fourth example of the heat dissipation fin section 200 will be described. FIG. 5 is a perspective view illustrating a fourth example of a heat dissipation fin portion in the internal structure of an electronic device to which the cooling structure according to the second embodiment of the present disclosure is applied. The cooling structure of the electronic device 1 may be configured to include a heat dissipation fin section 200 as shown in FIG. The heat dissipation fin section 200 has a plurality of fins 200d that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. The heat dissipation fin section 200 is configured by combining fins 200d of different lengths. 5, in the heat dissipation fin section 200, the longitudinal length h of the first fin 200d is different from the longitudinal length i of the second fin 200d. By combining fins 200d of different lengths, it is possible to guide the flowing air so that it collides with many surfaces of the fins 200d. The fin length of each of the multiple fins 200d is designed based on, for example, the results of a computational simulation or experimental results.

[0036] The heat dissipation fin section 200 may be configured by combining the above-described configuration examples. That is, in the cooling structure of the electronic device 1, the heat dissipation fin section 200 may be a cooling structure that is configured by combining a configuration in which each fin has an inclined structure section that forms an inclination with respect to the direction in which the air drawn into the housing of the electronic device will flow, a configuration in which fins are arranged at intervals that combine different fin pitches, a configuration in which fins of different fin heights are combined, or a configuration in which fins of different fin lengths are combined.

[0037] The heat dissipation fin portion of this embodiment can be applied to the cooling structure described in the embodiment already described and the cooling structure described in the embodiment to be described later, thereby obtaining the same effects.

[0038] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; the heat dissipation fin section has an inclined structure section in which each fin forms an inclination with respect to the direction in which air drawn into the housing of the electronic device is expected to flow; A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to configure each of the multiple fins to guide air to the tip on the downwind side, thereby providing a cooling structure with further improved cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0039] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion has fins arranged at intervals that combine different fin pitches. A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to design and configure the fin pitch for each of the multiple fins so that air is guided all the way to the tip on the downwind side, thereby providing a cooling structure with improved cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0040] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is configured by combining fins of different fin heights. A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to design and configure the fin height for each of the multiple fins so that air is guided all the way to the tip on the downwind side, thereby providing a cooling structure with improved cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0041] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is configured by combining fins of different fin lengths. A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to design and configure the fin length for each of the multiple fins so that air is guided all the way to the tip on the downwind side, thereby providing a cooling structure with improved cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0042] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is a configuration in which each fin has an inclined structure portion that forms an inclination with respect to the direction in which air drawn into the housing of the electronic device is expected to flow; A configuration in which fins are arranged at intervals combining different fin pitches; Combining fins of different heights, or Combination of fins with different fin lengths, It is made up of a combination of A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to design and configure each of the multiple fins so that air is guided to the tip on the downwind side, thereby providing a cooling structure with improved cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0043] Embodiment 3 In the first and second embodiments already described, an example of a configuration has been illustrated and described in which the first ventilation surface portion in which the first ventilation portion is provided is a stepped surface portion having a stepped surface formed so that the front side of the top surface is lowered from the position of the top surface toward the inside of the housing. In embodiment 3, an example of a configuration is illustrated in which the first ventilation surface portion on which the first ventilation section is provided is a stepped surface portion having a stepped surface formed so that the front side of the side surface is lowered from the position of the side surface toward the inside of the housing. In embodiment 3, among the components of embodiment 3, those components that are similar to the components of embodiment 1 or embodiment 2 already described will be omitted from redundant description as appropriate.

[0044] The surface portion 70 in the cooling structure of the present disclosure is a stepped surface portion having a stepped surface formed so as to be lowered from the top, bottom, or side (left side, right side) of the housing 2 of the electronic device 1 toward the inside of the housing 2. In the present disclosure, a cooling structure according to a third embodiment includes a structure in which a first ventilation portion is provided on a stepped surface portion on a side surface side. FIG. 6 is a schematic diagram illustrating an example of the internal structure of electronic device 1 to which the cooling structure according to the third embodiment of the present disclosure is applied and a fifth example of heat dissipation fin section 200. In FIG. FIG. 6 shows the housing 2 of the electronic device 1 as seen from above, with the top surface of the housing 2 of the electronic device 1 cut away to reveal the internal structure. 6 is formed to have a stepped surface formed so that the front side of the side surface (right side surface) of the housing 2 of the electronic device 1 is lowered from the position of the right side surface of the second side surface portion 60, which is the right side surface portion, toward the inside of the housing 2. In other words, the surface portion 70 on which the first ventilation portion 80 is provided is a stepped surface portion having a stepped surface formed so that it is lowered from the position of the side surface of the housing 2 toward the inside of the housing 2. The stepped surface portion 70 shown in FIG. 6 is formed in a stepped shape such that the connection portion between the front surface of the rectangular parallelepiped housing and the right side surface connected to the front surface is cut out. In addition, when the electronic device 1 is mounted, part or all of the top, bottom, left side, or right side of the housing 2 is surrounded by other structures, or when the electronic device 1 is mounted, part of the top, bottom, left side, or right side of the housing 2 is covered by other structures, the surface portion 70 may be configured as a stepped surface portion. It should be noted that if the first ventilation section 80 can be provided without making the surface section 70 a stepped surface section, the surface section 70 does not have to be a stepped surface section.

[0045] The rear surface 20 of the housing 2 is provided with a second ventilation section 90 similar to the second ventilation section in the embodiment already described. A plurality of second ventilation sections 90 shown in FIG. 6 are provided, and each is arranged at a different position. Each of the plurality of second ventilation sections 90 shown in FIG. 6 includes an exhaust fan 91 that exhausts air inside the housing 2 of the electronic device 1 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0046] The cooling structure of the electronic device 1 may be configured to include a heat dissipation fin section 200 as shown in FIG. The heat dissipation fin section 200 has a plurality of fins 200e that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. The heat dissipation fin section 200 is configured by combining fins 200e of different lengths. As shown in FIG. 6 , in the heat dissipation fin section 200, the maximum longitudinal length j of the first fin 200e is different from the minimum longitudinal length k of the second fin 200e. Furthermore, in the heat dissipation fin section 200, each fin 200e is arranged in a direction away from the first ventilation section 80. The lengths of the fins 200e gradually decrease as they approach the first ventilation section 80, forming a slope, from the fin 200e located farthest from the first ventilation section 80 to the fin 200e located closest to the first ventilation section 80. This prevents the fins 200e located closer to the first ventilation section 80 from blocking the air drawn in through the first ventilation section 80, allowing the air to collide with the fin 200e located farthest from the first ventilation section 80, as shown in FIG. 6 .

[0047] Next, cooling by the cooling structure of the electronic device 1 according to this embodiment will be described. For example, when the electronic device 1 starts operating, the exhaust fan 91 starts operating. When the exhaust fan 91 operates and air begins to be discharged from the second ventilation section 90 into the housing 2 of the electronic device 1, air begins to be drawn in through the ventilation holes of the first ventilation section 80 and the front ventilation section 12, creating an air flow. Furthermore, when the electronic device 1 starts operating, the heat-generating component 100 generates heat and transfers the heat to the heat dissipation fin section 200 . The air taken in through the ventilation holes of the first ventilation section 80 collides with the fins 200e on the windward side of the heat dissipation fin section 200, causing heat to be dissipated from each of the fins 200e. As the air taken in through the ventilation holes of the first ventilation section 80 travels further in the direction of the second ventilation section 90 (downwind side), it collides with the fins 200e, causing heat to be dissipated from the fins 200e. The air whose temperature has increased as a result of radiating heat from the fins 200e is discharged to the outside via the plurality of second ventilation sections 90 and the exhaust fan 91.

[0048] As described above, by providing the air intake on the side surface, the cooling effect of the heat-generating components can be obtained even if the air intake in the depth direction is provided on the side surface.

[0049] This embodiment further shows an example of an embodiment including the following configuration. The surface portion on which the first ventilation portion is provided is a stepped surface portion having a stepped surface formed so as to be lowered from a position on the side surface of the housing toward the inside of the housing. A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that allows sufficient air to be drawn in to cool the heat-generating components of the electronic device, even if the top and bottom surfaces of the housing of the electronic device are covered by other components when the electronic device is mounted. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0050] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is a configuration in which each fin has an inclined structure portion that forms an inclination with respect to the direction in which air drawn into the housing of the electronic device is expected to flow; A configuration in which fins are arranged at intervals combining different fin pitches; Combining fins of different heights, or Combination of fins with different fin lengths, It is made up of a combination of A cooling structure characterized by: As a result, the present disclosure further has the effect of making it possible to design and configure each of the multiple fins so that air is guided to the tip on the downwind side, thereby providing a cooling structure that further improves cooling performance. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0051] Embodiment 4 In the second and third embodiments already described, examples of the configuration of the heat dissipation fin portion that is unique to the present disclosure have been described. In the fourth embodiment, an example of a configuration that improves cooling performance even when the heat dissipation fin portion has a general-purpose configuration will be described. In embodiment 4, among the components of embodiment 4, duplicate explanations will be omitted as appropriate for components that are similar to the components of embodiment 1, embodiment 2, or embodiment 3 that have already been described.

[0052] The cooling structure according to the fourth embodiment of the present disclosure has a configuration for guiding an air flow in a direction toward the heat dissipation fin portion. FIG. 7 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the fourth embodiment of the present disclosure is applied. FIG. 7 shows the electronic device 1 as viewed from the side, with the side of the housing 2 of the electronic device 1 cut away to reveal the internal structure. The electronic device 1 shown in FIG. 7 has a housing 2 that houses a substrate 110 on which a heat-generating component 100 is mounted. A heat dissipation fin section 200 is placed on the upper surface of the heat generating component 100 in contact with the heat generating component 100 . The heat dissipation fin section 200 has a plurality of fins 200f that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. The fins 200f are each in the form of a plate extending from the first ventilation section 80 side to the second ventilation section 90 side, and are arranged parallel to one another in the depth direction on the paper surface of FIG. The fins 200f shown in FIG. 7 have a general rectangular shape. However, it may be configured using the fins (200a, 200b, 200c, 200d, 200e) shown in the embodiment already described.

[0053] The rear surface 20 of the housing 2 is provided with a second ventilation section 90 similar to the second ventilation section in the embodiment already described. The second ventilation section 90 shown in FIG. 7 includes an exhaust fan 91 that exhausts air from inside the housing 2 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0054] The cooling structure according to this embodiment is configured to include a protrusion 300 that protrudes from the housing 2 of the electronic device 1 in a direction toward the heat dissipation fin section 200. Protrusion 300 has a shape that protrudes in a direction toward heat dissipation fin section 200 at a position facing the area where heat dissipation fin section 200 is provided. 7 is provided on the top surface 30 of the housing 2, and protrudes from a position facing the area where the heat dissipation fin section 200 is provided inside the housing 2 in a direction toward the heat dissipation fin section 200. As a result, air flowing inside the housing 2 is guided along the protrusion 300 toward the bottom surface 40, and is more likely to collide with the fins 200f of the heat dissipation fin section 200.

[0055] Next, cooling by the cooling structure of the electronic device 1 according to this embodiment will be described. For example, when the electronic device 1 starts operating, the exhaust fan 91 starts operating. When the exhaust fan 91 operates and air begins to be discharged from the second ventilation section 90 into the housing 2 of the electronic device 1, air begins to be drawn in through the ventilation holes of the first ventilation section 80 and the front ventilation section 12, creating an air flow. Furthermore, when the electronic device 1 starts operating, the heat-generating component 100 generates heat and transfers the heat to the heat dissipation fin section 200 . Part of the air drawn in through the ventilation holes of the first ventilation section 80 collides directly with the heat dissipation fin section 200, dissipating heat from the heat dissipation fin section 200, and part of the air is guided in the direction of the heat dissipation fin section 200 along the shape of the protrusion 300, where it collides with the heat dissipation fin section 200, dissipating heat from the heat dissipation fin section 200. The air taken in through the ventilation holes of the first ventilation section 80 further collides along the heat dissipation fin section 200 as it travels in the direction of the second ventilation section 90, and dissipates heat from the fins 200f. The air whose temperature has increased as a result of radiating heat from the fins 200f is discharged to the outside via the second ventilation section 90 and the exhaust fan 91. In this way, air can be guided from the upwind side of the heat dissipating fin section 200 to the downwind side thereof toward the heat dissipating fin section 200 and collided therewith to cool the heat dissipating fins.

[0056] The above-described structure eliminates the need to form the heat dissipation fins in a special shape, and the same effects as those of the previously described embodiments can be obtained at low cost.

[0057] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; a projection projecting in a direction toward the heat dissipation fin portion at a position facing the region where the heat dissipation fin portion is provided; A cooling structure characterized by: As a result, the present disclosure further provides an effect of providing a cooling structure that further improves cooling performance by using general-purpose heat dissipation fins, and also has the effect of enabling cost reduction by using general-purpose heat dissipation fins. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0058] Embodiment 5 In the fourth embodiment already described, an example of a cooling structure has been described in which the protrusions protruding in the direction toward the heat dissipation fins inside the housing guide the air flow toward the heat dissipation fins. In the fifth embodiment, an example of a configuration using a portion other than a protrusion will be described. In embodiment 5, among the components of embodiment 5, duplicate explanations will be omitted as appropriate for components that are similar to the components of embodiment 1, embodiment 2, embodiment 3, or embodiment 4 that have already been described.

[0059] The cooling structure according to the fifth embodiment of the present disclosure has a structure that forms a flow path. FIG. 8 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the fifth embodiment of the present disclosure is applied. FIG. 8 shows the housing 2 of the electronic device 1 as seen from above, with the top surface of the housing 2 of the electronic device 1 cut away to reveal the internal structure. The electronic device 1 shown in FIG. 8 has a housing 2 that houses a substrate 110 on which a heat generating component (100) is mounted. A heat dissipation fin section 200 is placed on the upper surface of the heat generating component (100) in contact with the heat generating component (100). A heat dissipation fin section 200 is placed on the upper surface of the heat generating component (100) in contact with the heat generating component (100). The heat dissipation fin section 200 has a plurality of fins that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. The fins are each in the form of a plate extending from the first ventilation portion 80 side to the second ventilation portion 90 side, and are arranged in parallel. The fins shown in FIG. 8 are of a general rectangular shape. However, the fins (200a, 200b, 200c, 200d, 200e) shown in the embodiment already described may also be used.

[0060] The rear surface 20 of the housing 2 is provided with a second ventilation section 90 similar to the second ventilation section in the embodiment already described. A plurality of second ventilation sections 90 shown in FIG. 8 are provided, and each is arranged at a different position. The second ventilation section 90 shown in FIG. 8 includes an exhaust fan 91 that exhausts air from inside the housing 2 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0061] The cooling structure according to this embodiment is configured to include a flow path forming structure. The flow path formation structure is a structure formed so as to guide the air taken in by the first ventilation portion 80 to the heat dissipation fin portion 200. Specifically, the flow path formation structure is configured by, for example, the partition plate 310 or a component mounted inside the housing 2 of the electronic device 1. 8 is arranged so as to extend along a position corresponding to the boundary between the face portion 70 on which the first ventilation section 80 is provided and the top face portion, which is the other face portion, and is also arranged so as to extend toward the rear face portion 20 on which the second ventilation section 90 is provided, within a range along the side surface of the heat dissipation fin section 200. With this configuration, a flow path is formed that starts from the first ventilation section 80 and the front ventilation section 12 and reaches the rear side of the heat dissipation fin section 200. Although not shown, a flow path can also be formed depending on the position of mounted components, such as large electronic components, mounted inside the housing 2 of the electronic device 1.

[0062] Next, cooling by the cooling structure of the electronic device 1 according to this embodiment will be described. For example, when the electronic device 1 starts operating, the exhaust fan 91 starts operating. When the exhaust fan 91 operates and air begins to be discharged from the second ventilation section 90 into the housing 2 of the electronic device 1, air begins to be drawn in through the ventilation holes of the first ventilation section 80 and the front ventilation section 12, creating an air flow. Furthermore, when the electronic device 1 starts operating, the heat-generating component 100 generates heat and transfers the heat to the heat dissipation fin section 200 . Part of the air drawn in through the ventilation holes of the first ventilation section 80 collides directly with the heat dissipation fin section 200, causing heat to be dissipated from the heat dissipation fin section 200, and part of the air is guided in the direction of the heat dissipation fin section 200 along the shape of the partition plate 310, where it collides with the heat dissipation fin section 200, causing heat to be dissipated from the heat dissipation fin section 200. The air that has collided with the heat dissipation fin section 200 further travels in the direction of the second ventilation section 90, colliding along the heat dissipation fin section 200 and dissipating heat from the fins. The air whose temperature has risen as a result of heat dissipation from the fins is discharged to the outside via the second ventilation section 90 and the exhaust fan 91. In this way, air can be guided from the upwind side of the heat dissipating fin section 200 to the downwind side thereof toward the heat dissipating fin section 200 and collided therewith to cool the heat dissipating fins.

[0063] According to the above-described configuration, a flow path like a duct is formed by the presence of a flow path forming structure using a partition plate or mounted components, and the intake air cannot flow anywhere other than the flow path forming structure, but will always collide with the heat dissipation fins and be exhausted. By arranging in this way, the intake air collides with the heat dissipation fins, and the same effect can be obtained with general-purpose heat dissipation fins as in the fourth embodiment already described with the above structure.

[0064] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; a flow path forming structure formed to guide the air taken in by the first ventilation portion to the heat dissipation fin portion; A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that enables air drawn into the housing of an electronic device to collide with heat dissipation fins. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0065] This embodiment further shows an example of an embodiment including the following configuration. The flow path forming structure is configured by at least one of a partition plate or a component mounted inside the electronic device. A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that makes it easier for air drawn into the housing of an electronic device to collide with the heat dissipation fin portion using a relatively simple configuration such as a partition plate or components mounted on the same board. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0066] Embodiment 6 In the fifth embodiment already described, an example of a configuration in which air taken into the housing of an electronic device is guided in the width direction of the heat dissipation fin portion has been described. In the sixth embodiment, an example of a configuration in which air taken into the housing of an electronic device is guided in the height direction of the heat dissipation fin portion will be described. In embodiment 6, among the components of embodiment 6, duplicate explanations will be omitted as appropriate for components that are similar to the components of embodiment 1, embodiment 2, embodiment 3, embodiment 4, or embodiment 5 that have already been described.

[0067] The cooling structure according to the sixth embodiment of the present disclosure has a configuration in which flow paths are formed in the height direction of the fins. FIG. 9 is a schematic diagram showing an example of the internal structure of electronic device 1 to which the cooling structure according to the sixth embodiment of the present disclosure is applied. FIG. 9 shows the electronic device 1 as viewed from the side, with the side of the housing 2 of the electronic device 1 cut away to reveal the internal structure. The electronic device 1 shown in FIG. 9 has a housing 2 that houses a substrate 110 on which a heat-generating component 100 is mounted. A heat dissipation fin section 200 is placed on the upper surface of the heat generating component 100 in contact with the heat generating component 100 . The heat dissipation fin section 200 has a plurality of fins that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. Similar to the fins 200f already described, the multiple fins are each plate-shaped extending from the first ventilation section 80 side to the second ventilation section 90 side, and are arranged parallel to the depth direction on the paper surface of Figure 9. The fins shown in FIG. 9 have a general-purpose rectangular shape, similar to the fins 200f already described. However, it may be configured using the fins (200a, 200b, 200c, 200d, 200e) shown in the embodiment already described.

[0068] The rear surface 20 of the housing 2 is provided with a second ventilation section 90 similar to the second ventilation section in the embodiment already described. The second ventilation section 90 shown in FIG. 9 includes an exhaust fan 91 that exhausts air from inside the housing 2 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0069] The cooling structure according to this embodiment is configured to include a current plate 320 . The current plate 320 is a plate-shaped member, and is arranged opposite the substrate 110 on which the heat-generating component 100 is mounted, so as to sandwich the heat dissipation fin section 200 therebetween. 9 is disposed so as to extend from a position corresponding to the boundary between face portion 70, on which first ventilation portion 80 is provided, and the top face portion, which is the other face portion, in parallel with and facing substrate 110 on which heat-generating component 100 is mounted, and reach the top of second ventilation portion 90 on rear face portion 20. With this configuration, a flow path is formed that starts from first ventilation portion 80 and front ventilation portion 12, passes through heat dissipation fin portion 200, and reaches second ventilation portion 90 on rear face portion 20. Furthermore, even if the height of the fins of the heat dissipation fin section 200 is low, the straightening plate 320 can be positioned in a position according to the height of the fins, making it easier to make the air flow collide with the heat dissipation fin section 200.

[0070] Next, cooling by the cooling structure of the electronic device 1 according to this embodiment will be described. For example, when the electronic device 1 starts operating, the exhaust fan 91 starts operating. When the exhaust fan 91 operates and air begins to be discharged from the second ventilation section 90 into the housing 2 of the electronic device 1, air begins to be drawn in through the ventilation holes of the first ventilation section 80 and the front ventilation section 12, creating an air flow. Furthermore, when the electronic device 1 starts operating, the heat-generating component 100 generates heat and transfers the heat to the heat dissipation fin section 200 . The air drawn in through the vent holes of the first ventilation part 80 is guided to flow between the substrate 110 and the rectifying plate 320, and collides with the heat dissipation fin part 200, causing the heat to be dissipated from the heat dissipation fin part 200. The air that has collided with the heat dissipation fin section 200 further travels in the direction of the second ventilation section 90, colliding along the heat dissipation fin section 200 and dissipating heat from the fins. The air whose temperature has increased as a result of radiating heat from the fins is discharged to the outside via the second ventilation section 90 and the exhaust fan 91. In this way, air can be guided from the upwind side of the heat dissipating fin section 200 to the downwind side thereof toward the heat dissipating fin section 200 and collided therewith to cool the heat dissipating fins.

[0071] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat-generating component may be mounted on a substrate, and the heat-generating component may be mounted on a substrate having a rectifying plate disposed therebetween. A cooling structure characterized by: As a result, the present disclosure has the effect of providing a cooling structure that makes it easier for air drawn into the housing of an electronic device to collide with the heat dissipation fin section, even when the height of the heat dissipation fin is low or the distance between the heat dissipation fin and the first ventilation section serving as an air intake is relatively far. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0072] Embodiment 7 In the already-described second, third, fourth, fifth, and sixth embodiments, examples of configurations have been described in which the position of the heat dissipation fin portion inside the housing of the electronic device may be any position. In the seventh embodiment, an example of a configuration will be described in which the position of the heat dissipation fin portion can provide redundancy in the event of a malfunction of the exhaust fan, for example. In embodiment 7, among the components of embodiment 6, duplicate explanations will be omitted as appropriate for components that are similar to the components of embodiment 1, embodiment 2, embodiment 3, embodiment 4, embodiment 5, or embodiment 6 that have already been described.

[0073] The cooling structure according to the seventh embodiment of the present disclosure is a structure in which the positions of the heat dissipation fin portion and the second ventilation portion, which is an exhaust portion, are fixed. FIG. 10 is a schematic diagram illustrating an example of the internal structure of an electronic device to which the cooling structure according to the seventh embodiment of the present disclosure is applied. FIG. 10 shows the housing 2 of the electronic device 1 as seen from above, with the top surface of the housing 2 of the electronic device 1 cut away to reveal the internal structure.

[0074] The electronic device 1 shown in FIG. 10 houses, inside a housing 2, a substrate 110 on which a heat generating component (100) is mounted. A heat dissipation fin section 200 is placed on the upper surface of the heat generating component (100) in contact with the heat generating component (100). A heat dissipation fin section 200 is placed on the upper surface of the heat generating component (100) in contact with the heat generating component (100).

[0075] The heat dissipation fin section 200 has a plurality of fins that receive heat from the heat-generating component 100 of the electronic device 1 and dissipate the heat. Similar to the fins 200f already described, the fins are each plate-shaped extending from the first ventilation portion 80 side to the second ventilation portion 90 side, and are arranged in parallel. The fins shown in FIG. 10 have a general-purpose rectangular shape, similar to the fins 200f already described. However, it may be configured using the fins (200a, 200b, 200c, 200d, 200e) shown in the embodiment already described.

[0076] The rear surface 20 of the housing 2 is provided with a second ventilation section 90 similar to the second ventilation section in the embodiment already described. A plurality of second ventilation sections 90 shown in FIG. 10 are provided, and each is arranged at a different position. Each of the plurality of second ventilation sections 90 shown in FIG. 10 includes an exhaust fan 91 for discharging air inside the housing 2 of the electronic device 1 to the outside. The exhaust fan 91 does not necessarily have to be provided in the second ventilation section 90, but may be configured to be provided outside the second ventilation section 90 or outside the electronic device 1 by being attached externally.

[0077] In the above-described configuration, the cooling structure according to this embodiment is configured such that the heat dissipation fin section 200 and the second ventilation section 90 are disposed adjacent to each other. That is, the heat dissipation fin section 200 is disposed in an area adjacent to the second ventilation section 90 inside the housing 2 of the electronic device 1.

[0078] Here, a supplementary explanation will be given as to the intention behind adopting a configuration in which the heat dissipation fin section 200 and the second ventilation section 90 are arranged adjacent to each other. FIG. 11 is a schematic diagram showing an example of the internal structure of electronic device 1 when the cooling structure according to the seventh embodiment of the present disclosure is not employed. 11, like FIG. 10, shows the housing 2 of the electronic device 1 as seen from above, with the top surface of the housing 2 of the electronic device 1 cut away to reveal the internal structure. The distance between the heat dissipation fin section 200 and the second ventilation section 90 shown in FIG. 11 is wider than the distance between the heat dissipation fin section 200 and the second ventilation section 90 shown in FIG. Consider a case where a malfunction occurs in one of the exhaust fans 91 (91a, 91b) in the multiple second ventilation sections 90 shown in Figures 10 and 11 and the exhaust fan 91a is the malfunctioning fan, and the exhaust fan 91b is the normally operating fan. 11, when the heat dissipation fin section 200 and the second ventilation section 90 are spaced apart, the air flow 2010 near the second ventilation section 90 acting as an exhaust section, which flows directly from the second ventilation section 90 on the exhaust fan 91a side to the second ventilation section 90 on the exhaust fan 91b side, becomes stronger than the air flow drawn in by the first ventilation section 80. This weakens the air flow 2000 near the first ventilation section 80 acting as an intake section, and reduces the amount of air drawn in. This further makes it difficult for air to collide with the heat dissipation fin section 200, reducing the cooling performance of the heat dissipation fin section 200. In contrast, the cooling structure in the previously described embodiment is designed so that pressure loss is high on the rear panel 20 side. Therefore, by arranging the heat dissipation fin section 200 and the second ventilation section 90 adjacent to each other and narrowing the gap as in the cooling structure shown in FIG. 10 , it is possible to prevent the airflow from the second ventilation section 90 on the exhaust fan 91a side from flowing directly toward the second ventilation section 90 on the exhaust fan 91b side from becoming too strong. Furthermore, air that flows back from the second ventilation section 90 on the exhaust fan 91a side is more easily guided toward the heat dissipation fin section 200. Furthermore, the airflow 1000 near the first ventilation section 80, which serves as an intake section, is less likely to weaken, and a reduction in the amount of intake air can be suppressed. This makes it possible to prevent a decrease in cooling performance even if a malfunction occurs in one of the exhaust fans 91a.

[0079] The above-described cooling structure prevents a short circuit from occurring when an exhaust fan fails, causing air to enter through the failed fan and be exhausted from an adjacent exhaust fan, thereby preventing a significant decrease in cooling performance.

[0080] This embodiment further shows an example of an embodiment including the following configuration. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; the heat dissipation fin portion is disposed in a region adjacent to the second ventilation portion within the housing of the electronic device. A cooling structure characterized by: As a result, the present disclosure further has the effect of being able to provide a cooling structure that can prevent air from entering through the exhaust section, even when multiple second ventilation sections are provided as exhaust sections. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0081] This embodiment further shows an example of an embodiment including the following configuration. an exhaust fan provided in the second ventilation section to exhaust air from inside the housing of the electronic device; A cooling structure characterized by: As a result, the present disclosure further has the effect of providing a cooling structure that makes it possible to prevent air from being drawn in through the second ventilation section even in the event of a breakdown of the exhaust fan. Furthermore, the present disclosure can provide an electronic device that achieves the same effects as those described above by applying the above configuration to the electronic device.

[0082] It should be noted that, within the scope of this disclosure, the embodiments may be freely combined, any component of each embodiment may be modified, or any component of each embodiment may be omitted.

[0083] The present disclosure is suitable for use in, for example, electronic devices having heat-generating components, because it provides a cooling structure that allows sufficient air to be drawn in to cool the heat-generating components in the electronic device, even in cases where the overall height of the housing of the electronic device is limited. [Explanation of symbols]

[0084] 1 electronic device, 2 housing, 10 front portion (front portion), 11 interface, 12 front ventilation hole, 20 rear portion (rear portion), 30 top surface portion (upper surface portion), 40 bottom surface portion (lower surface portion), 50 first side portion (left side portion), 60 second side portion (right side portion), 70 surface portion (first ventilation surface portion), 80 first ventilation portion (ventilation hole, intake portion, intake hole), 90 second ventilation portion (exhaust portion), 91 exhaust fan, 91a exhaust fan (abnormal occurrence fan), 91b exhaust fan (normal operation fan), 100 heat-generating component, 110 board, 200 heat dissipation fin portion, 200a fin, 200b fin, 200c fin, 200d fin, 200e fin, 200f fin, 201 front side fin portion, 202 Rear surface side fin portion, 203 inclined structure portion, 300 protrusion portion, 310 partition plate, 320 straightening plate, 1000 air flow near first ventilation portion, 1010 air flow near second ventilation portion, 2000 air flow near first ventilation portion, 2010 air flow near second ventilation portion, A direction (direction when electronic device is viewed from the outside toward the front), B direction (direction when electronic device is viewed from the outside toward the rear), C direction (direction when electronic device is viewed from the outside toward the top surface), D direction (direction when electronic device is viewed from the outside toward the bottom surface), E direction (direction when electronic device is viewed from the outside toward the left side), F direction (direction when electronic device is viewed from the outside toward the right side), a length in the height direction of electronic device, b length in the height direction of fin on the front side, c length in the height direction of fin on the rear side, d length of fin pitch, e length of fin pitch, f length in the height direction of first fin, g length in the height direction of second fin, h Longitudinal length of the first fin, i Longitudinal length of the second fin, j Maximum longitudinal length of the fin, k Minimum longitudinal length of the fin.

Claims

1. A cooling structure for an electronic device, a first ventilation portion provided on a surface portion that forms a surface different from a front surface that is an exposed surface when the electronic device is mounted; a second ventilation section that discharges the air drawn into the housing of the electronic device by the first ventilation section to the outside of the housing of the electronic device; Equipped with A cooling structure characterized by:

2. the surface portion on which the first ventilation portion is provided is at least one of a top surface portion on the front side, a side surface portion on the front side, and a bottom surface portion on the front side of a housing of the electronic device; The cooling structure according to claim 1 .

3. the surface portion on which the first ventilation portion is provided is a stepped portion having a stepped surface formed so as to be lowered from a position of the top surface, side surface, or bottom surface of the housing toward the inside of the housing; The cooling structure according to claim 1 .

4. The first ventilation section is configured to include a plurality of ventilation holes. The cooling structure according to any one of claims 1 to 3.

5. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; the heat dissipation fin section has an inclined structure section in which each fin forms an inclination with respect to the direction in which air drawn into the housing of the electronic device is expected to flow; The cooling structure according to any one of claims 1 to 3.

6. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion has fins arranged at intervals that combine different fin pitches. The cooling structure according to any one of claims 1 to 3.

7. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is configured by combining fins of different fin heights. The cooling structure according to any one of claims 1 to 3.

8. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is configured by combining fins of different fin lengths. The cooling structure according to any one of claims 1 to 3.

9. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat dissipation fin portion is a configuration in which each fin has an inclined structure portion that forms an inclination with respect to the direction in which air drawn into the housing of the electronic device is expected to flow; A configuration in which fins are arranged at intervals combining different fin pitches; Combining fins of different heights, or Combination of fins with different fin lengths, It is made up of a combination of The cooling structure according to any one of claims 1 to 3.

10. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; a projection projecting in a direction toward the heat dissipation fin portion at a position inside the housing of the electronic device opposite to the area where the heat dissipation fin portion is provided; The cooling structure according to any one of claims 1 to 3.

11. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; a flow path forming structure formed to guide the air taken in by the first ventilation portion to the heat dissipation fin portion; The cooling structure according to any one of claims 1 to 3.

12. The flow path forming structure is configured by at least one of a partition plate or a component mounted inside the electronic device. The cooling structure according to claim 11 .

13. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; The heat-generating component may be mounted on a substrate, and the heat-generating component may be mounted on a substrate having a rectifying plate disposed therebetween. The cooling structure according to any one of claims 1 to 3.

14. a heat dissipation fin unit having a plurality of fins that receive heat from heat-generating components of the electronic device and dissipate the heat; the heat dissipation fin portion is disposed in a region adjacent to the second ventilation portion within the housing of the electronic device. The cooling structure according to any one of claims 1 to 3.

15. an exhaust fan provided in the second ventilation section to exhaust air from inside the housing of the electronic device; The cooling structure according to claim 14 .

16. a housing that houses heat-generating components; a first ventilation section provided on a surface of the housing that forms a surface different from a front surface of the housing that is exposed when the electronic device is mounted; a second ventilation section that discharges the air drawn into the housing by the first ventilation section to the outside of the housing; Equipped with An electronic device characterized by:

Images