Bonding device and bonding method

Abstract

To provide a bonding device and a bonding method capable of suppressing a workpiece from peeling off and falling from an adhesive surface of a pad, and reducing a production loss in a bonding process.SOLUTION: A bonding device according to one embodiment bonds a workpiece to a target object. The bonding device includes a jig which is provided with a pad that holds a workpiece disposed below by an adhesive surface. The pad includes a first pad having an adhesive surface that is rectangular in plan view and formed in a ladder shape provided with a plurality of openings, and a second pad provided at a position different from that of the first pad.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The disclosed embodiments relate to a bonding apparatus and a bonding method. [Background technology]

[0002] Various techniques have been proposed in the past that include a jig with an adhesive surface that holds a workpiece and then bonds the held workpiece to an object (see, for example, Patent Document 1). For example, when the workpiece is a liquid crystal display and the object is a glass panel, the jig is provided with multiple cylindrical pads with adhesive surfaces. The liquid crystal display placed below the jig is then held by the adhesive surfaces of the multiple pads and bonded to the glass panel. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-151124 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional technology, there is a risk that the workpiece, the liquid crystal display, may peel off from the adhesive surface of the pad and fall, resulting in production loss during the bonding process. Specifically, on the contact surface of the liquid crystal display that comes into contact with the pad, various circuit boards are provided. Because the multiple pads are positioned to avoid such circuit boards, uneven pad placement can occur. Furthermore, warping can occur on the contact surface of the liquid crystal display due to manufacturing variations, etc. Such uneven pad placement and warping of the liquid crystal display can cause the liquid crystal display to peel off from the adhesive surface of the pad and fall, resulting in production loss during the bonding process.

[0005] One aspect of the embodiment has been made in consideration of the above, and aims to provide a bonding apparatus and a bonding method that can prevent the workpiece from peeling off and falling from the adhesive surface of the pad, thereby reducing production loss in the bonding process. [Means for solving the problem]

[0006] To solve the above problems and achieve the object, a bonding apparatus according to one aspect of the present invention bonds a workpiece to an object. The bonding apparatus includes a jig having a pad disposed therebelow that holds the workpiece on its adhesive surface. The pad has a rectangular adhesive surface in a plan view, and includes a first pad formed in a ladder shape with multiple openings, and a second pad disposed at a different position from the first pad. [Effects of the Invention]

[0007] In one aspect of the embodiment, the jig pad includes a first pad whose adhesive surface is rectangular in plan view and formed in a ladder shape with multiple openings. For example, if the adhesive surface of the pad is annular, uneven pad placement, warping of the workpiece, etc., can easily result in areas where stress acting in a direction that causes the workpiece to peel from the adhesive surface is concentrated, making the workpiece more likely to peel and fall from those areas. In contrast, by forming the adhesive surface of the pad in a ladder shape, stress acting in a direction that causes the workpiece to peel from the adhesive surface can be dispersed. This makes it more difficult for the workpiece to peel from the adhesive surface of the pad, preventing the workpiece from peeling and falling, and thereby reducing production loss in the bonding process. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing an example of how a display device is installed. [Figure 2] FIG. 2 is a plan view of the display device. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a flowchart showing the procedure of the bonding process performed by the bonding apparatus. [Figure 5A] FIG. 5A is a diagram for explaining the procedure of the bonding process performed by the bonding apparatus. [Figure 5B] FIG. 5B is a diagram for explaining the procedure of the bonding process performed by the bonding apparatus. [Figure 5C] FIG. 5C is a diagram for explaining the procedure of the bonding process performed by the bonding apparatus. [Figure 5D] FIG. 5D is a diagram for explaining the procedure of the bonding process performed by the bonding apparatus. [Figure 5E] FIG. 5E is a diagram for explaining the procedure of the bonding process performed by the bonding apparatus. [Figure 6] FIG. 6 is an enlarged plan view of a pad portion provided on the jig according to the first embodiment. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 8 is a diagram illustrating the shape of the pad according to the first embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] FIG. 10 is a cross-sectional view taken along line XX in FIG. [Figure 11] FIG. 11 is a diagram illustrating the shape of the pad according to the second embodiment. [Figure 12] FIG. 12 is a diagram illustrating the shape of the pad according to the third embodiment. [Figure 13] FIG. 13 is a diagram illustrating the shape of the pad according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a bonding apparatus and a bonding method disclosed in the present application will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments.

[0010] (First embodiment) First, a description will be given below of a product manufactured by the bonding apparatus according to the first embodiment. In the first embodiment, a display device (display device) is manufactured by the bonding apparatus.

[0011] An example of mounting a display device will now be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of mounting a display device. Fig. 1 is a diagram of a vehicle 1 viewed from inside a passenger compartment 2 of the vehicle 1 toward the front of the vehicle. Fig. 1 and the figures shown in Fig. 2 and subsequent figures described later are all schematic diagrams.

[0012] As shown in FIG. 1, a display device 10 is mounted on a vehicle 1. The display device 10 has a display screen 11 and displays various types of information, such as navigation information and audio information. The display device 10 is provided, for example, on an instrument panel 3 (hereinafter, may be referred to as "instrument panel 3") at the front of a vehicle interior 2. Note that the display device 10 is disposed between the driver's seat and the passenger seat on the instrument panel 3, but the position of the display device 10 is not limited to this and can be changed as appropriate depending on the type of vehicle 1, etc.

[0013] Depending on the mounting position of the display device 10, reflections from direct light may make it difficult to see the display screen 11. The display device 10 is configured to suppress such reflections, which will be described later.

[0014] In the above, an example is shown in which the display device 10 is mounted on a vehicle 1, but this is not limited to this, and the display device 10 may be mounted on other devices such as electrical appliances, personal computers, mobile phones, and other electronic devices.

[0015] Next, a configuration example of the display device 10 will be described with reference to FIGS. 2 and 3. FIG. 2 is a plan view of the display device 10. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. For ease of understanding, FIGS. 2 and 3 illustrate a three-dimensional Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis directions. Such Cartesian coordinate system may also be illustrated in other drawings used in the following description. Furthermore, the Cartesian coordinate system is the X-axis, Y-axis, and Z-axis directions when the display device 10 is in the state shown in the drawing, and does not limit the mounting direction or arrangement direction of the display device 10.

[0016] 2 and 3 show the state of the display device 10 in the manufacturing process. Specifically, during the manufacturing process, the display device 10 is transported while being supported by the support portion 200 shown by the imaginary line in FIG. 3. More specifically, the display device 10 is transported with the front surface 30a of the glass panel 30 (described later) facing downwards and supported by the support portion 200 from below the front surface 30a. This makes it possible to transport the display device 10 in a stable state. That is, the front surface 30a of the glass panel 30 is flat and has no other components provided thereon, making it easy to ensure an area for the support portion 200 to support, and therefore the display device 10 can be transported while being stably supported by the support portion 200.

[0017] Although not shown, if the rear surface 30b of the glass panel 30 is placed downward and the support section 200 supports the rear surface 30b from below, stress due to the weight of the liquid crystal display 20 may be generated in the adhesive 40, which will be described later. In contrast, by having the support section 200 support the front surface 30a of the glass panel 30 from below, the generation of the above-mentioned stress can be suppressed.

[0018] As described above, in the bonding apparatus according to this embodiment, the bonding process is performed with the front surface 30a of the glass panel 30 facing downward (bottom surface) to produce the display device 10, which will be described in detail later.

[0019] 2 and 3, the display device 10 includes a liquid crystal display 20, a glass panel 30, and an adhesive 40 (not visible in FIG. 2). Note that hereinafter, the liquid crystal display 20 may be referred to as an LCD (Liquid Crystal Display) 20.

[0020] The LCD 20 is formed, for example, in the shape of a rectangular parallelepiped. In the manufacturing process, the LCD 20 is set so that the front surface 20a faces downward (bottom surface) and the back surface 20b faces upward (top surface). A liquid crystal panel 21, which serves as a display screen, is provided on the front surface 20a of the LCD 20. The LCD 20 displays various information, such as navigation information, on the liquid crystal panel 21 by illuminating light emitted from a light source (not shown) through the liquid crystal panel 21.

[0021] A circuit board 22 is provided on the rear surface 20b of the LCD 20. The circuit board 22 is a board that controls the light source and the like. As shown in FIG. 2, the circuit board 22 is attached close to an end of the rear surface 20b of the LCD 20 (specifically, an end on the negative side of the Y axis).

[0022] The glass panel 30 is formed, for example, in the shape of a flat plate. The glass panel 30 is disposed so that the back surface 30b faces the front surface 20a of the LCD 20. The glass panel 30 is also disposed so as to cover the entire front surface 20a, including the liquid crystal panel 21 of the LCD 20. In this way, the glass panel 30 functions as a cover panel that protects the liquid crystal panel 21 of the LCD 20.

[0023] The adhesive 40 is provided between the LCD 20 and the glass panel 30, and bonds the LCD 20 and the glass panel 30 together. Specifically, the adhesive 40 bonds the front surface 20a of the LCD 20 to the back surface 30b of the glass panel 30. Note that the adhesive 40 may be a translucent resin (transparent optical resin) such as OCR (Optical Clear Resin) or OCA (Optical Clear Adhesive).

[0024] By filling the gap between the LCD 20 and the glass panel 30 with the adhesive 40 in this way, the reflectance when direct light is incident from the glass panel 30 side can be reduced compared to when there is no adhesive 40 between the LCD 20 and the glass panel 30 and there is an air layer between them. That is, reflection due to direct light can be suppressed. In other words, it is possible to suppress reflection due to direct light from making it difficult to see the liquid crystal panel 21 of the LCD 20, which is the display screen.

[0025] The bonding apparatus according to this embodiment is an apparatus that bonds an LCD 20 to a glass panel 30 to which an adhesive 40 has been applied. The LCD 20 is an example of a workpiece, and the glass panel 30 is an example of an object. The LCD 20, which is the workpiece, is an example of a display-related part.

[0026] Next, a bonding process performed by the bonding apparatus according to this embodiment will be described with reference to Fig. 4 and Figs. 5A to 5E. Fig. 4 is a flowchart showing the bonding process performed by the bonding apparatus. Figs. 5A to 5E are diagrams for explaining the bonding process performed by the bonding apparatus. Note that in Figs. 5A to 5E, the circuit board 22 is not shown for the sake of simplicity.

[0027] Before describing the bonding procedure, a configuration example of the bonding apparatus 100 will be described with reference to Fig. 5A etc. As shown in Fig. 5A, the bonding apparatus 100 includes a chamber 60, a mounting table 70, and a jig 80.

[0028] The chamber 60 is a processing container in which a bonding process and the like are performed. Specifically, the chamber 60 includes an upper chamber 61 and a lower chamber 62, and is configured to be separable in the vertical direction. The upper chamber 61 is disposed above the lower chamber 62. The upper chamber 61 and the lower chamber 62 are each formed in a rectangular parallelepiped (box-like) shape with one side open. The upper chamber 61 is configured to be invertible upside down, and by aligning the opening of the upper chamber 61 with the opening of the lower chamber 62, the upper chamber 61 and the lower chamber 62 can form a sealed internal space (see FIG. 5C ). Note that the upper chamber 61 is disposed so that the open side faces upward before the bonding process begins, but this is not limited to this.

[0029] The mounting table 70 is provided inside the lower chamber 62. The glass panel 30 is placed on the mounting table 70. Specifically, the glass panel 30 is placed on the mounting table 70 with the front surface 30a facing downward and the back surface 30b facing upward. The glass panel 30 is also placed with an adhesive 40 applied to the back surface 30b. Specifically, the adhesive 40 is applied to the glass panel 30 in an application device (not shown), and then a UV curing process is performed in which the adhesive 40 is irradiated with UV (ultraviolet) rays and cured. The glass panel 30 having the adhesive 40 that has been subjected to such a UV curing process is placed on the mounting table 70.

[0030] The mounting table 70 is provided with an elevating mechanism 71 that raises and lowers the mounting table 70. The elevating mechanism 71 includes a drive unit 71a and a support member 71b. The drive unit 71a is attached to the lower chamber 62 and drives the support member 71b to raise and lower in the vertical direction. The support member 71b is connected to the mounting table 70. As a result, the elevating mechanism 71 can raise and lower the mounting table 70 by driving the support member 71b to raise and lower in the vertical direction using the drive unit 71a.

[0031] The jig 80 is provided inside the upper chamber 61. Specifically, the jig 80 is fixed to a base 81 provided inside the upper chamber 61. The jig 80 is formed, for example, in the shape of a flat plate, and holds the LCD 20. More specifically, the jig 80 is provided with a pad 50 for holding the LCD 20. The pad 50 is attached to a surface 80a of the jig 80 opposite to the surface fixed to the base 81. Hereinafter, the surface 80a of the jig 80 may be referred to as the "mounting surface 80a."

[0032] The pad 50 will now be described with reference to Figures 6 and 7. Figure 6 is an enlarged plan view of the pad 50 portion provided on the jig 80 according to the first embodiment, and Figure 7 is a cross-sectional view taken along line VII-VII in Figure 6.

[0033] The pad 50 shown in the examples of Figures 6 and 7 is formed in a cylindrical shape. The detailed shape of the pad 50 according to this embodiment will be described later with reference to Figure 8 and the like.

[0034] The pad 50 is made of an elastic material such as rubber or resin. An opening 50a is formed in the center of the pad 50. The opening 50a is a through-hole that passes through the pad 50 in the vertical direction. The pad 50 sucks and holds the LCD 20 (see FIG. 7) through the opening 50a. Specifically, an air intake hole 83 is formed in a jig 80 to which the pad 50 is attached at a position corresponding to the opening 50a of the pad 50. The air intake hole 83 is connected to an intake device 85 (see FIG. 7) such as a pump via an intake pipe 84. Note that in FIG. 5A and other figures, the air intake hole 83, the intake pipe 84, and the intake device 85 are not shown for the sake of simplicity. By operating the suction device 85, air is sucked into the suction pipe 84, the suction hole 83 and the opening 50a (see arrow A), and the pad 50 thus sucks and holds the LCD 20 (see FIG. 7) through the opening 50a.

[0035] Furthermore, the pad 50 holds the LCD 20 by adhesion in addition to suction. Specifically, the pad 50 has an adhesive surface 50b. The adhesive surface 50b is formed on the surface of the pad 50 opposite to the surface that comes into contact with the mounting surface 80a of the jig 80. The contact between the adhesive surface 50b and the LCD 20 enables the pad 50 to hold the LCD 20 with the adhesive surface 50b.

[0036] Returning to Fig. 5A, the description of the bonding apparatus 100 will continue. A pressing pin 82 is provided on the jig 80 so as to be movable in the vertical direction. The pressing pin 82 is normally disposed at a position where it is not exposed from the jig 80. As will be described later, the pressing pin 82 is configured to advance from the jig 80 and become exposed to press the LCD 20 during the process of peeling the LCD 20 from the pad 50.

[0037] Next, a bonding procedure using the bonding apparatus 100 configured as described above will be described. The bonding apparatus 100 performs a process of bonding the LCD 20 to the glass panel 30. Specifically, as shown in FIG. 4, the LCD 20 and the glass panel 30 are placed in the bonding apparatus 100 (step S10). More specifically, as shown in FIG. 5A, the LCD 20 is placed on the jig 80. To be precise, the LCD 20 is placed on the jig 80 so that the back surface 20b contacts the adhesive surface 50b of the pad 50. Note that, hereinafter, the back surface 20b of the LCD 20 may be referred to as the "contact surface 20b." The glass panel 30 is placed on the mounting table 70 with the back surface 30b, to which the adhesive 40 is applied, facing upward.

[0038] Next, the bonding apparatus 100 holds the LCD 20 with the jig 80 (step S11). The LCD 20 is placed on the jig 80 so that it contacts the adhesive surface 50b of the pad 50, and the jig 80 holds the LCD 20 with the adhesive surface 50b of the pad 50. The jig 80 also operates an air suction device 85 (see FIG. 7) to suck and hold the LCD 20 through the opening 50a of the pad 50 (see arrow B in FIGS. 5A and 5B).

[0039] Next, the bonding apparatus 100 turns the upper chamber 61 upside down while the LCD 20 is held by the jig 80 (step S12). Fig. 5B shows the bonding apparatus 100 after the turning over.

[0040] Next, the bonding apparatus 100 lowers the upper chamber 61 (step S13), whereby the upper chamber 61 comes into contact with the lower chamber 62, forming an enclosed space within the chamber 60 (see FIG. 5C).

[0041] Next, the bonding apparatus 100 evacuates the chamber 60 using a decompression device (not shown) (step S14). Specifically, the chamber 60 is connected to a decompression device equipped with a pump or the like. By operating the decompression device, air is sucked out of the chamber 60, reducing the pressure (see arrow C), and creating a vacuum in the chamber 60. By evacuating the chamber 60 in this way, it is possible to prevent air bubbles from being generated between the adhesive 40 and the LCD 20 during the bonding process.

[0042] When the chamber 60 is evacuated, the suction force of the jig 80 to suction and hold the LCD 20 via the opening 50a of the pad 50 is reduced or eliminated. Therefore, in the evacuated chamber 60, the jig 80 holds the LCD 20 by the adhesive force of the adhesive surface 50b of the pad 50.

[0043] Next, the bonding apparatus 100 performs a bonding process (step S15). Specifically, as shown in Fig. 5D, the bonding apparatus 100 operates the lifting mechanism 71 to raise the mounting table 70, and bonds the glass panel 30 with the adhesive 40 placed on the mounting table 70 to the LCD 20 held by the jig 80.

[0044] When the bonding is complete, the bonding apparatus 100 lifts the upper chamber 61 while peeling the LCD 20 and the pad 50 off (step S16). Specifically, as shown in FIG. 5E, the pressing pins 82 are advanced from the jig 80 and exposed, and press the LCD 20. The bonding apparatus 100 also lifts the upper chamber 61. This causes the pad 50 (more precisely, the adhesive surface 50b of the pad 50) to peel off from the LCD 20, completing the bonding of the display device 10. The display device 10, for which bonding has been completed, is carried out of the bonding apparatus 10 by a carrying-out device (not shown).

[0045] Next, the detailed shape of the pad 50 according to this embodiment will be described with reference to FIGS. 8 to 10. FIG. 8 is a diagram illustrating the shape of the pad 50 according to the first embodiment. FIG. 8 is a plan view of a jig 80 having the pad 50. For ease of understanding, in FIG. 8 and other figures, the positions of the LCD 20, the circuit board 22, and the pressure pin 82 when the jig 80 holds the LCD 20 are shown by imaginary lines. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8, and FIG. 10 is a cross-sectional view taken along line XX in FIG. 8.

[0046] 8, the pad 50 includes a first pad 51 and a second pad 52. The pad 50 including the first pad 51 and the second pad 52 is attached to an effective area 80b on the attachment surface 80a of the jig 80 where the LCD 20 can be reliably adsorbed.

[0047] More specifically, as shown in Fig. 9, warpage may occur on the contact surface (rear surface) 20b of the LCD 20 due to manufacturing variations, etc. The example in Fig. 9 shows a state in which convex warpage has occurred on the contact surface 20b of the LCD 20.

[0048] If the LCD 20 is warped, the distance d between the mounting surface 80a of the jig 80 and the contact surface 20b of the LCD 20 is longer near the ends in the X-axis direction than near the center, which makes it easier for a gap to form between the pad 50 (first pad 51 in this case) and the LCD 20. If such a gap forms, air that sucks the LCD 20 may leak, potentially preventing the pad 50 from reliably adsorbing the LCD 20. Therefore, in this embodiment, an area on the mounting surface 80a of the jig 80 that can reliably adsorb the LCD 20 is set as an effective area 80b, even if the LCD 20 is warped, and the pad 50 is attached to the effective area 80b. This prevents air from leaking from the pad 50, thereby ensuring that the pad 50 can reliably adsorb and hold the LCD 20.

[0049] The pads 50 are arranged to avoid the circuit board 22 of the LCD 20. Specifically, since the circuit board 22 is attached close to the end of the LCD 20 on the negative side of the Y axis, the pads 50 are arranged close to the end 80a1 on the positive side of the Y axis on the attachment surface 80a. In other words, the pads 50 according to this embodiment are arranged in a biased manner.

[0050] The first pad 51 has an adhesive surface 51b, and the first pad 51 holds the LCD 20 on the adhesive surface 51b.

[0051] As shown in FIG. 8, the adhesive surface 51b of the first pad 51 is formed in a rectangular shape (here, a rounded rectangular shape) in a plan view. In other words, the adhesive surface 51b of the first pad 51 is formed in an elongated shape extending in the X-axis direction. The adhesive surface 51b of the first pad 51 is also formed in a ladder shape with a plurality of (here, three) openings 51a. Specifically, the adhesive surface 51b of the first pad 51 is formed so that the plurality of openings 51a are linearly arranged to form a ladder shape. In other words, the first pad 51 is formed in a shape in which three annular pads are linearly connected and integrated. Note that FIG. 8 shows an example in which there are three openings 51a, but this is not limited thereto and the number may be two or four or more. In addition, in FIG. 8, the adhesive surface 51b has rounded corners, but this is not limited thereto and the adhesive surface 51b may have an angular shape (for example, a right angle).

[0052] The first pad 51 sucks and holds the LCD 20 through the opening 51a. The first pad 51 is formed so that the opening 51a has a circular shape in a plan view. Although FIG. 8 shows an example in which the opening 51a has a circular shape, the shape is not limited to this. In other words, the opening 51a may have another shape, such as a triangular or rectangular shape, in a plan view.

[0053] The second pads 52 are provided at positions different from the first pads 51 on the mounting surface 80a of the jig 80. Therefore, the LCD 20 is held in an area corresponding to the first pads 51, and is also held by the second pads 52 in an area different from that area.

[0054] Specifically, the second pads 52 are provided so as to hold a portion of the LCD 20 closer to the end 20c side than the portion of the LCD 20 held by the first pads 51. In other words, the second pads 52 are arranged on the attachment surface 80a of the jig 80 at an end 80a1 side opposite to an end 80a2 of the LCD 20 corresponding to the circuit board 22, relative to the position at which the first pads 51 are arranged. Furthermore, the first pads 51 and the second pads 52 are provided at positions on the attachment surface 80a of the jig 80 so as to avoid the pressing pins 82.

[0055] There are a plurality of second pads 52 (two in this example), and as shown in FIG. 8, they are formed in a ring shape in a plan view. Specifically, the second pad 52 has an opening 52a formed in the center. The second pad 52 sucks and holds the LCD 20 through the opening 52a. The second pad 52 is formed so that the opening 52a has a circular shape in a plan view. Note that FIG. 8 shows an example in which the opening 52a is circular, but this is not limiting. That is, the opening 52a may have other shapes, such as a triangular shape or a rectangular shape, in a plan view. Note that FIG. 8 shows an example in which there are two second pads 52, but this is not limiting, and the number of second pads 52 may be one or three or more.

[0056] The force of attraction of the first pads 51 and the second pads 52 to the LCD 20 varies depending on the opening area of ​​the openings 51 a and 52 a. Therefore, the number of openings 51 a and 52 a, the opening area of ​​the openings 51 a and 52 a, etc. are set to values ​​that ensure the attraction force necessary to attract the LCD 20.

[0057] The second pad 52 has an adhesive surface 52b, and the second pad 52 holds the LCD 20 on the adhesive surface 52b.

[0058] The adhesive strength of the adhesive surfaces 51b, 52b of the first pad 51 and the second pad 52 varies depending on the area of ​​the adhesive surfaces 51b, 52b. Therefore, the area and shape of the adhesive surfaces 51b, 52b are set to values ​​and shapes that ensure the adhesive strength necessary to hold the LCD 20 by adhesion.

[0059] The pad 50 including the first pad 51 and the second pad 52 is configured as described above, which makes it difficult for the LCD 20 to peel off from the adhesive surfaces 51b, 52b of the pad 50. More specifically, as described above, when the chamber 60 (see FIG. 5C ) is evacuated, the jig 80 holds the LCD 20 by the adhesive force of the adhesive surfaces 51b, 52b of the pad 50. In this embodiment, in this state, it is possible to make it difficult for the LCD 20 to peel off from the adhesive surfaces 51b, 52b of the pad 50.

[0060] More specifically, as described above, the pad 50 is positioned to avoid the circuit board 22, resulting in a biased positioning. Therefore, as shown in Fig. 10, a force (moment) e acts on the LCD 20 held by the pad 50, causing the portion of the LCD 20 on the circuit board 22 side to move downward. This force e tends to generate stress in a direction that peels off the LCD 20 at the end 51x of the adhesive surface 51b of the pad 50 (first pad 51) on the circuit board 22 side.

[0061] Furthermore, as shown in FIG. 9, if the contact surface 20b of the LCD 20 has a convex warp, stress acting in a direction that peels off the LCD 20 is likely to occur at the left-right end portions 51y of the adhesive surface 51b of the pad 50 (first pad 51).

[0062] In this embodiment, the adhesive surface 51b of the first pad 51 is formed in a ladder shape, which can disperse stress that acts in a direction to peel the LCD 20 from the adhesive surface 51b. This makes it difficult for the LCD 20 to peel off from the adhesive surfaces 51b and 52b of the pad 50.

[0063] As described above, the bonding apparatus 100 according to the first embodiment bonds the LCD 20 (an example of a workpiece) to the glass panel 30 (an example of a target object). The bonding apparatus 100 includes a jig 80 provided with a pad 50 that holds the LCD 20 placed below with its adhesive surface 50b. The pad 50 includes a first pad 51 having a rectangular adhesive surface 51b in a plan view, and formed in a ladder shape with a plurality of openings 51a, and a second pad 52 provided at a position different from that of the first pad 51.

[0064] As described above, the pad 50 of the jig 80 according to the first embodiment includes a first pad 51 having a rectangular adhesive surface 51b in a plan view and formed in a ladder shape with multiple openings 51a. For example, if the adhesive surface of the pad is annular, uneven pad placement, warpage of the LCD, and other factors can easily cause stress concentrations in areas that cause the LCD 20 to peel from the adhesive surface, leading to the LCD 20 peeling and falling. In contrast, by forming the adhesive surface 50b of the first pad 51 in a ladder shape, stresses that cause the LCD 20 to peel from the adhesive surface 51b can be dispersed. This makes it difficult for the LCD 20 to peel from the adhesive surface 50b of the pad 50, preventing the LCD 20 from peeling and falling, thereby reducing production loss in the bonding process.

[0065] The first pad 51 also sucks and holds the LCD 20 through the opening 51a, so that the first pad 51 can hold the LCD 20 by suction as well as by holding the LCD 20 with the adhesive surface 51b, thereby making it possible to reliably hold the LCD 20 during the bonding process.

[0066] Moreover, the first pad 51 is formed so that the opening 51a has a circular shape in a plan view. This allows the opening 51a of the first pad 51 to be formed with a simple configuration. Furthermore, the adhesive force of the opening 51a with respect to the LCD 20 can be easily changed by changing the area of ​​the circle.

[0067] Furthermore, the second pads 52 are provided to hold a portion of the LCD 20 closer to the edge 20c than the portion of the LCD 20 held by the first pads 51. This prevents the LCD 20 held by the jig 80 from tilting. Specifically, as shown in FIG. 10 , a force e acts on the LCD 20 held by the pads 50 of the jig 80, causing the portion of the LCD 20 on the circuit board 22 side to be pushed down, making the LCD 20 prone to tilting relative to the horizontal direction, more specifically, prone to tilting around the X-axis. Even in this state, the second pads 52 are provided at positions that hold the edge 20c side of the LCD 20, thereby restricting the tilt of the LCD 20 in the horizontal direction (around the X-axis). As a result, the LCD 20 held by the jig 80 can be prevented from tilting.

[0068] The workpiece is a display-related component. Specifically, the workpiece is an LCD 20. This prevents the display-related component (LCD 20) from peeling off and falling off the adhesive surface 50b of the pad 50 in the bonding apparatus 100, thereby reducing production loss in the bonding process.

[0069] In the above example, the display-related part is an LCD 20, but the present invention is not limited to this example and may be any other type of part related to a display device, such as a substrate or a design panel. Also, in the above example, the workpiece is a display-related part, but the present invention is not limited to this example. In other words, the workpiece may be anything that can be bonded to an object.

[0070] (Second embodiment) Next, the pad 50 of the bonding apparatus 100 according to the second embodiment will be described with reference to Fig. 11. Fig. 11 is a diagram for explaining the shape of the pad 50 according to the second embodiment. Fig. 11 is also a plan view of a jig 80 having the pad 50 according to the second embodiment. In the following, the same reference numerals will be used to designate components common to the first embodiment, and descriptions thereof may be omitted.

[0071] The pad 50 according to the second embodiment includes a first pad 151 and a second pad 52. As shown in FIG. 11, the first pad 151 has an adhesive surface 151b formed in a rectangular shape in a plan view, and is formed in a ladder shape with a plurality of (three in this case) openings 151a. Specifically, the adhesive surface 151b of the first pad 151 is formed so that the plurality of openings 151a are arranged in a straight line, forming a ladder shape. Note that, although FIG. 11 shows an example in which there are three openings 151a, the number is not limited thereto, and two or four or more openings 151a may be provided.

[0072] The first pad 151 sucks and holds the LCD 20 through the opening 151a. The first pad 151 is formed so that the opening 151a has an elliptical shape in a plan view.

[0073] As described above, the first pad 151 according to the second embodiment is formed so that the opening 151a has an elliptical shape in a plan view. This allows the opening 151a of the first pad 151 to be formed with a simple configuration. The adhesive force of the opening 151a with respect to the LCD 20 can also be easily changed by changing the area of ​​the elliptical shape. Furthermore, when the opening 151a is elliptical, it is easier to increase the opening area compared to a circular opening. Therefore, when the LCD 20 is relatively large or heavy, by forming the opening 151a in an elliptical shape, the first pad 151 can easily ensure the adhesive force required to adsorb the LCD 20.

[0074] Furthermore, when opening 151a is elliptical, the area of ​​adhesive surface 151b can be made larger than when opening 151a is circular. Therefore, when LCD 20 is relatively large or heavy, making opening 151a elliptical increases the area of ​​adhesive surface 151b, and first pad 151 can easily ensure the adhesive force required to hold LCD 20 by adhesion.

[0075] (Third embodiment) Next, the pad 50 of the bonding apparatus 100 according to the third embodiment will be described with reference to Fig. 12. Fig. 12 is a diagram for explaining the shape of the pad 50 according to the third embodiment. Fig. 12 is a plan view of a jig 80 having the pad 50 according to the third embodiment.

[0076] The pad 50 according to the third embodiment includes a first pad 251 and a second pad 52. As shown in Fig. 12, the first pad 251 has an adhesive surface 251b formed in a rectangular shape in a plan view, and is formed in a ladder shape with a plurality of (here, three) openings 251a. Note that Fig. 12 shows an example in which there are three openings 251a, but the number is not limited to this and may be two or four or more.

[0077] The first pad 251 also has a notch 252. The notch 252 is formed in the adhesive surface 251b. More specifically, the notch 252 is formed by making the vicinity of the center of the adhesive surface 251b concave in a plan view.

[0078] In this way, by forming the notch 252 in the adhesive surface 251b, the area of ​​the adhesive surface 251b can be easily changed, more specifically, reduced, depending on the size, weight, etc. of the LCD 20. This makes it possible for the first pad 251 to easily ensure the adhesive force required to hold the LCD 20 by adhesion.

[0079] Furthermore, by forming the notches 252 in the adhesive surface 251b, the multiple openings 251a are formed so that the shapes and opening areas differ between the areas where the notches 252 are present and the areas where the notches 252 are not present. For example, the opening area of ​​the openings 251a near the center where the notches 252 are present is formed to be smaller than the opening area of ​​the openings 251a near the left and right ends where the notches 252 are not present. This makes it possible to easily change, or more specifically, reduce, the opening area of ​​the openings 251a depending on the size, weight, etc. of the LCD 20. This makes it possible for the first pad 251 to easily ensure the suction force required to suction the LCD 20.

[0080] (Fourth embodiment) Next, the pad 50 of the bonding apparatus 100 according to the fourth embodiment will be described with reference to Fig. 13. Fig. 13 is a diagram for explaining the shape of the pad 50 according to the fourth embodiment. Fig. 13 is a plan view of a jig 80 having the pad 50 according to the fourth embodiment.

[0081] The pad 50 according to the fourth embodiment is formed so that a first pad 351 and a second pad 352 are integrated together. In the adhesive surface 351b of the pad 50, a ladder-shaped portion is formed in a portion corresponding to the first pad 351, where a plurality of (here, three) openings 351a are provided.

[0082] Furthermore, a plurality of (here, two) openings 352a are provided in the adhesive surface 351b of the pad 50 in a portion corresponding to the second pad 352. Note that the number of openings 351a, 352a is merely an example and is not limited thereto, and can be set arbitrarily.

[0083] In this way, in the fourth embodiment, even if the pad 50 is formed so that the first pad 351 and the second pad 352 are integrated, it is possible to obtain the same effects as in the previous embodiments.

[0084] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0085] 20 LCD 30 Glass Panels 50 pads 51 First Pad 52 Second Pad 80 Jig 100 Bonding device

Claims

1. A bonding device that bonds a workpiece to an object, a jig provided with a pad that holds the workpiece placed below on an adhesive surface; The pad is a first pad having a ladder-like shape, the first pad having a rectangular adhesive surface in a plan view and a plurality of openings; a second pad provided at a position different from the first pad; A bonding apparatus comprising:

2. The first pad is The workpiece is sucked and held by suction through the opening. The bonding apparatus according to claim 1 .

3. The first pad is The opening is formed to have a circular shape in a plan view. The bonding apparatus according to claim 1 .

4. The first pad is The opening is formed to have an elliptical shape in a plan view. The bonding apparatus according to claim 1 .

5. The first pad is A notch formed on the adhesive surface The bonding apparatus according to claim 1 , comprising:

6. The second pad is The first pad is provided to hold a portion of the workpiece closer to the end of the workpiece than the portion of the workpiece held by the first pad. The bonding apparatus according to claim 1 .

7. The workpiece is Display-related parts: The bonding apparatus according to claim 1 .

8. a step of holding a workpiece placed below with a jig having a pad provided thereon, the pad including a first pad having a rectangular adhesive surface in a plan view and formed in a ladder shape with a plurality of openings, and a second pad provided at a position different from the first pad; and a step of bonding the workpiece held by the jig to an object; A bonding method including:

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