Memory device having defective address cache and method thereof

JP2025174878AActive Publication Date: 2025-11-28WINBOND ELECTRONICS CORP
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Patent Information

Application Number
JP2025071088
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2025-04-23
Publication Date
2025-11-28
Estimated Expiration
2045-04-23

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Abstract

PURPOSE: To provide a memory device having a defective address cache and a method thereof.SOLUTION: A memory device includes a plurality of memory dies and a reserved die stacked on the memory dies and configured to repair a target memory die among the plurality of memory dies. Each of the reserved dies and memory dies can include a failure address cache that records failure address information of the memory device. The failure address cache is configured to receive an input address signal and output a hit signal or a miss signal, indicating whether the input address signal indicates that the failure address stored in the failure address cache is hit or missed. The memory device is configured to control access to the memory dies and the reserved dies based on the hit signal or the miss signal.SELECTED DRAWING: Figure 2A
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Citation Information

Patent Citations

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    JP2014071932A

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    US20130176763A1

  • Stacked memory and manufacturing method therefor

    WO2023013065A1