Multilayer ceramic capacitor and mounting structure thereof

Abstract

To provide a multilayer ceramic capacitor and a mounting structure in which warpage is suppressed to a minimum even when the multilayer ceramic capacitor is thinned, and mountability is not deteriorated.SOLUTION: A multilayer ceramic capacitor includes: first and second internal electrodes 3 and 4; a main body part in which first and second electrodes are alternately stacked in a first direction with a dielectric layer 5 interposed therebetween; first and second external electrodes located on a first surface; and third and fourth external electrodes located on a second surface. The first internal electrode includes a first part 31 having a first capacitance forming part 31d and first and second lead parts 31a and 31b. The second internal electrode includes: a second part 41 having a second capacitance forming part 41d and third and fourth lead parts 41a and 41b. The first electrode includes first and second confirmation electrodes 51a and 51b, and the second electrode includes third and fourth confirmation electrodes 52a and 52b. The first and second extraction parts are connected to the first and third external electrodes, and the third and fourth extraction parts are connected to the second and fourth external electrodes.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a multilayer ceramic capacitor and a mounting structure thereof. [Background technology]

[0002] Conventional multilayer ceramic capacitors are described in, for example, Patent Documents 1 and 2. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-167368 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-140183 Summary of the Invention

[0004] The multilayer ceramic capacitor of the present disclosure comprises a substantially rectangular parallelepiped main body portion formed by alternately stacking first and second internal electrodes and first and second electrodes with dielectric layers sandwiched therebetween in a first direction, the main body portion having first and second side faces, first and second faces, and first and second end faces, which face each other in the first direction; first and second external electrodes located on the first faces; and third and fourth external electrodes located on the second faces, wherein the first internal electrodes have a first capacitance forming portion, a first lead portion, and a second lead portion. the second internal electrode includes a second portion having a second capacitance forming portion, a third lead portion, and a fourth lead portion, the first electrode has a first confirmation electrode and a second confirmation electrode, the second electrode has a third confirmation electrode and a fourth confirmation electrode, the first lead portion and the second lead portion are led out to the first surface and the second surface, respectively, and are connected to the first external electrode and the third external electrode, respectively, and the third lead portion and the fourth lead portion are led out to the first surface and the second surface, respectively, and are connected to the second external electrode and the fourth external electrode, respectively.

[0005] The mounting structure of the multilayer ceramic capacitor of the present disclosure comprises the above-mentioned multilayer ceramic capacitor and a substrate having a mounting surface, and the multilayer ceramic capacitor is mounted on the mounting surface so that the first side surface is perpendicular to the mounting surface. [Brief explanation of the drawings]

[0006] The objects, features, and advantages of the present disclosure will become more apparent from the following detailed description and drawings. [Figure 1] FIG. 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is an exploded perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure. [Figure 3A] FIG. 3 is a cross-sectional view taken along the line IIIA-IIIA in FIG. 1. [Figure 3B] FIG. 3 is a cross-sectional view taken along the line IIIB-IIIB in FIG. [Figure 4A] FIG. 2 is a side view showing the electrode patterns of three multilayer ceramic capacitors. [Figure 4B] FIG. 4B is an enlarged view of section IVB of FIG. 4A. [Figure 5A] 4B is a diagram showing a cross section taken along the cutting line AA in FIG. 4A. FIG. [Figure 5B] 4B is a diagram showing a cross section taken along the cutting line BB in FIG. 4A. FIG. [Figure 5C] 4B is a diagram showing a cross section taken along the cutting line CC in FIG. 4A. FIG. [Figure 6A] 4B is a diagram showing a cross section of the fired multilayer ceramic capacitor taken along the cutting line AA in FIG. 4A, viewed from a perpendicular plane (first direction X) different from adjacent end faces. [Figure 6B] 4B is a diagram showing a cross section of the fired multilayer ceramic capacitor taken along the cutting line BB in FIG. 4A, viewed from a perpendicular plane (first direction X) different from adjacent end faces. [Figure 6C]4B is a diagram showing a cross section of the fired multilayer ceramic capacitor taken along the cutting line CC in FIG. 4A, viewed from a perpendicular plane (first direction X) different from adjacent end faces. [Figure 7] 1 is a side view showing a mounting structure according to an embodiment of the present disclosure. [Figure 8A] 1A and 1B are diagrams showing electrode patterns of a multilayer ceramic capacitor; [Figure 8B] 1A and 1B are diagrams showing electrode patterns of a multilayer ceramic capacitor; [Figure 8C] 1A and 1B are diagrams showing electrode patterns of a multilayer ceramic capacitor; [Figure 8D] 1A and 1B are diagrams showing electrode patterns of a multilayer ceramic capacitor; [Figure 9A] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 9B] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 9C] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 9D] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 9E] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 10A] 10A and 10B are diagrams showing electrode patterns of a multilayer ceramic capacitor according to still another embodiment. [Figure 10B] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 10C] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 10D] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 10E] 10A and 10B are diagrams illustrating electrode patterns of a multilayer ceramic capacitor according to another embodiment. [Figure 11] FIG. 10 is a perspective view showing a multilayer ceramic capacitor according to another embodiment of the present disclosure. [Figure 12] FIG. 10 is an exploded perspective view showing a multilayer ceramic capacitor according to another embodiment of the present disclosure. [Figure 13] 13 is a cross-sectional view taken along the line XIII-XIII in FIG. 11. [Figure 14A] 14 is a diagram showing an electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 14B] 14 is a diagram showing an electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 14C] 14 is a diagram showing an electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 14D] 14 is a diagram showing an electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 15A] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 15B] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 15C] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 15D] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 16A] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 16B] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 16C] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. [Figure 16D] 14 is a diagram showing another example of the electrode pattern of the multilayer ceramic capacitor according to the embodiment of FIGS. 12 and 13. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0007] First, we will explain the multilayer ceramic capacitor having the configuration that forms the basis of the multilayer ceramic capacitor of the present disclosure. In the conventional technology described in Patent Document 1, in order to achieve a thin design and improve three-dimensional mountability, external electrodes are formed only on the top and end surfaces of the element, and these top and end surfaces are covered with a coating layer to prevent the element from cracking or chipping. However, the complicated process and structure raise concerns about a decrease in yield.

[0008] Furthermore, the prior art described in Patent Document 2 does not mention element height, and when it comes to thin, low-profile elements that can be mounted in three dimensions, especially in elements with main-surface electrodes that do not have lead-out portions on the end faces, the left and right positions of the effective area cannot be determined due to deviations in the cutting position, and the widths of the left and right margins differ, making it easy for warping to occur during firing, which can lead to poor electrical connection to the substrate and ultimately to mounting defects.

[0009] Therefore, there is a demand for a multilayer ceramic capacitor and a mounting structure thereof that can minimize warpage and do not impair mountability even when thinned with a simple structure.

[0010] Hereinafter, embodiments of the multilayer ceramic capacitor and mounting structure of the present disclosure will be described with reference to the drawings. The drawings referred to below are schematic, and the dimensional ratios and the like shown in the drawings are not necessarily accurately depicted. In addition, in this specification, a Cartesian coordinate system XYZ is defined for convenience.

[0011] FIG. 1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure, FIG. 2 is an exploded perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure, FIG. 3A is a cross-sectional view taken along section line IIIA-IIIA in FIG. 1, and FIG. 3B is a cross-sectional view taken along section line IIIB-IIIB in FIG. 1. FIG. 4A is a side view showing the electrode patterns of three multilayer ceramic capacitors, and FIG. 4B is an enlarged view of section IVB in FIG. 4A. Note that FIG. 1 omits the internal electrodes located inside the main body, and FIG. 2 omits the external electrodes located on the surface of the main body. Furthermore, the cross-sectional lines AA, BB, and CC in FIGS. 4A and 4B correspond to the cut lines of the laminate of the three ceramic capacitors before firing.

[0012] The multilayer ceramic capacitor 1 of this embodiment includes a substantially rectangular parallelepiped main body 2 in which first internal electrodes 3 and second internal electrodes 4, and first electrodes and second electrodes are alternately stacked in a first direction X with rectangular dielectric layers 5 sandwiched therebetween, the main body 2 having a first surface 2a and a second surface 2b, a first side surface 2c and a second side surface 2d, and a first end surface 2e and a second end surface 2f, a first external electrode 7a and a second external electrode 8a located on the first surface 2a, and a third external electrode 7b and a fourth external electrode 8b located on the second surface 2b.

[0013] The first surface 2a and the second surface 2b face each other in a second direction Z that is perpendicular to the first direction X and parallel to the short-side direction of the dielectric layer. The first side surface 2c and the second side surface 2d face each other in the first direction X. The first end surface 2e and the second end surface 2f face each other in a third direction Y that is perpendicular to the first direction X and the second direction Z and parallel to the longitudinal direction of the dielectric layer 5.

[0014] As shown in Fig. 2, the first internal electrode 3 includes a first portion 31 having a first capacitance forming portion 31d, a first lead portion 31a, and a second lead portion 31b. As shown in Fig. 2, the second internal electrode 4 includes a second portion 41 having a second capacitance forming portion 41d, a third lead portion 41a, and a fourth lead portion 41b. The first lead portion 31a and the second lead portion 31b are led to the first surface 2a and the second surface 2b, respectively, and connected to the first external electrode 7a and the third external electrode 7b, respectively. The third lead portion 41a and the fourth lead portion 41b are led to the first surface 2a and the second surface 2b, respectively, and connected to the second external electrode 8a and the fourth external electrode 8b, respectively.

[0015] The first electrode includes a first confirmation electrode 51a provided so that at least one side is connected at the intersection of the first capacitance-forming portion 31d and the first lead-out portion 31a, and a second confirmation electrode 51b provided so that at least one side is connected at the intersection of the first capacitance-forming portion 31d and the second lead-out portion 31b. The second electrode includes a third confirmation electrode 52a provided so that at least one side is connected at the intersection of the second capacitance-forming portion 41d and the third lead-out portion 41a, and a fourth confirmation electrode 52b provided so that at least one side is connected at the intersection of the second capacitance-forming portion 41d and the fourth lead-out portion 41b.

[0016] The first internal electrode 3 further includes a first dummy portion 32 electrically isolated from the first portion 31. The second internal electrode 4 further includes a second dummy portion 42 electrically isolated from the second portion 41. The first dummy portion 32 includes a first dummy lead portion 32a extending to the first surface 2a and a second dummy lead portion 32b extending to the second surface 2b. The second dummy portion 42 includes a third dummy lead portion 42a extending to the first surface 2a and a fourth dummy lead portion 42b extending to the second surface 2b. The first dummy lead portion 32a and the second dummy lead portion 32b are connected to the second external electrode 8a and the fourth external electrode 8b, respectively. The third dummy lead portion 42a and the fourth dummy lead portion 42b are connected to the first external electrode 7a and the third external electrode 7b, respectively.

[0017] With this configuration, it is possible to provide a multilayer ceramic capacitor 1 that has a simple structure and is thin, yet minimizes warping and does not reduce mountability, and a mounting structure 100 using the same (see FIG. 7).

[0018] The multilayer ceramic capacitor 1 includes a main body 2, a first external electrode 7a, a second external electrode 8a, a third external electrode 7b, and a fourth external electrode 8b. Hereinafter, the first external electrode 7a, the second external electrode 8a, the third external electrode 7b, and the fourth external electrode 8b may be collectively referred to as the external electrodes 7, 8.

[0019] 2, the first internal electrodes 3 and the second internal electrodes 4 are alternately stacked in the first direction X with the dielectric layers 5 sandwiched therebetween. Hereinafter, the first internal electrodes 3 and the second internal electrodes 4 may be collectively referred to as the internal electrodes 3, 4.

[0020] The first internal electrode 3 and the second internal electrode 4 are made of a conductive material and may be made of a metal material such as Ni (nickel), Cu (copper), Ag (silver), Sn (tin), Pt (platinum), Pd (palladium), Au (gold), or an alloy material containing these metal materials, or a co-material powder containing the same ceramic powder as the dielectric layer as its main component.

[0021] The dielectric layer 5 is made of an insulating material. The dielectric layer 5 may be made of a dielectric material (ceramic material) such as BaTiO3 (barium titanate), CaTiO3 (calcium titanate), SrTiO3 (strontium titanate), or BaZrO3 (barium zirconate) as a main component. In this specification, the term "main component" refers to the component with the highest concentration (mol %) in the material, member, etc. of interest.

[0022] The main component of the dielectric layer 5 may be a high-dielectric-constant material. The high-dielectric-constant material may be, for example, a perovskite-type ferroelectric material containing the above-mentioned dielectric material. The dielectric layer 5 may contain a rare earth element such as Y (yttrium), Dy (dysprosium), Ho (holmium), Gd (gadolinium), or Tb (terbium). Furthermore, the dielectric layer 5 may contain, as a sintering aid, a glass component mainly composed of SiO2 (silica).

[0023] The first direction X is also referred to as the stacking direction, the second direction Z is also referred to as the height direction, and the third direction Y is also referred to as the length direction.

[0024] As shown in FIG. 2, the side surfaces 2c and 2d of the main body 2 are formed with side cover portions 6. This protects the first internal electrode 3 and the second internal electrode 4 from the external environment. The side cover portions 6 may be formed with one or more dielectric layers. The dielectric layers forming the side cover portions 6 may have the same composition, dimensions, etc. as the dielectric layer 5.

[0025] The third lead portion 41a and the fourth lead portion 41b extend from the second capacitance forming portion 41d. When viewed from the first direction (stacking direction) X, the first capacitance forming portion 31d and the second capacitance forming portion 41d of the first portion 31 overlap each other. When a potential difference occurs between the first capacitance forming portion 31d and the second capacitance forming portion 41d, a capacitance is generated in the dielectric layer 5 sandwiched between the first capacitance forming portion 31d and the second capacitance forming portion 41d.

[0026] As shown in Fig. 3A, the first external electrode 7a connects the multiple first lead portions 31a to one another. The first external electrode 7a is positioned so as to cover the multiple first lead portions 31a. The second external electrode 8a connects the multiple third lead portions 41a to one another, similar to the first external electrode 7a shown in Fig. 3A. The second external electrode 8a is positioned so as to cover the multiple third lead portions 41a.

[0027] As shown in Fig. 3B, the third external electrode 7b connects the plurality of second lead portions 31b to one another. The third external electrode 7b is positioned so as to cover the plurality of second lead portions 31b. The fourth external electrode 8b connects the plurality of fourth lead portions 41b to one another, similar to the third external electrode 7b shown in Fig. 3B. The fourth external electrode 8b is positioned so as to cover the plurality of fourth lead portions 41b.

[0028] The first external electrode 7a, the second external electrode 8a, the third external electrode 7b, and the fourth external electrode 8b may each be composed of one or more conductive layers. The first conductive layer in contact with the first surface 2a and the second surface 2b (i.e., connected to the internal electrodes 3 and 4) may be formed using a thin-film formation technique such as plating, sputtering, or vapor deposition, or a thick-film formation technique such as screen printing or gravure printing. The second conductive layer, the third conductive layer, and the like located on the first conductive layer may be formed using a thin-film formation technique such as electroplating. The first conductive layer may be composed of a metal material such as Ni, Cu, Ag, Pd, or Au, or an alloy material containing these metal materials or these metal materials. The second conductive layer, the third conductive layer, and the like may be composed of a metal material such as Ni, Cu, Au, or Sn.

[0029] Because the first dummy lead portion 32a is connected to the second external electrode 8a, the connection strength between the main body portion 2 and the second external electrode 8a can be increased, and as a result, the reliability of the electrical connection between the second internal electrode 4 and the second external electrode 8a can be improved. Moreover, because the second dummy lead portion 32b is connected to the fourth external electrode 8b, the connection strength between the main body portion 2 and the fourth external electrode 8b can be increased, and as a result, the reliability of the electrical connection between the second internal electrode 4 and the fourth external electrode 8b can be improved.

[0030] The first dummy lead portion 32a may overlap the third lead portion 41a when viewed in the stacking direction (X direction). In this case, as shown in Fig. 1, the second external electrode 8a can be formed in a rectangular shape with its longitudinal direction in the first direction X, and the width of the second external electrode 8a in the second direction Z can be reduced. As a result, the second external electrode 8a can be easily formed, and the risk of leakage current occurring between the second external electrode 8a and another external electrode having a polarity different from that of the second external electrode 8a can be reduced.

[0031] The second dummy lead portion 32b may overlap the fourth lead portion 41b when viewed from the stacking direction (X direction). In this case, as shown in Fig. 1, the fourth external electrode 8b can be formed in a rectangular shape with its longitudinal direction in the first direction X, and the width of the fourth external electrode 8b in the third direction Y can be reduced. As a result, the fourth external electrode 8b can be easily formed. Furthermore, it is possible to reduce the risk of leakage current occurring between the fourth external electrode 8b and another external electrode having a polarity different from that of the fourth external electrode 8b.

[0032] Since the third dummy lead portion 42a is extended to the first surface 2a and connected to the first external electrode 7a, the connection strength between the main body portion 2 and the first external electrode 7a can be increased, and as a result, the reliability of the electrical connection between the first internal electrode 3 and the first external electrode 7a can be improved.

[0033] The fourth dummy lead-out portion 42b is extended to the second surface 2b and connected to the third external electrode 7b, thereby increasing the connection strength between the main body portion 2 and the third external electrode 7b, and as a result, improving the reliability of the electrical connection between the first internal electrode 3 and the third external electrode 7b.

[0034] The third dummy lead portion 42a may overlap the first lead portion 31a when viewed from the stacking direction (X direction). In this case, as shown in Fig. 1, the first external electrode 7a can be formed in a rectangular shape with its longitudinal direction in the first direction X, and the width of the first external electrode 7a in the third direction Y can be reduced. As a result, the first external electrode 7a can be easily formed. Furthermore, it is possible to reduce the risk of leakage current occurring between the first external electrode 7a and another external electrode having a polarity different from that of the first external electrode 7a.

[0035] The fourth dummy lead portion 42b may overlap the second lead portion 31b when viewed from the stacking direction (X direction). In this case, as shown in Fig. 1, the third external electrode 7b can be formed into a rectangular shape with its longitudinal direction in the first direction X, and the width of the third external electrode 7b in the third direction Y can be reduced. As a result, the third external electrode 7b can be easily formed. Furthermore, it is possible to reduce the risk of leakage current occurring between the third external electrode 7b and another external electrode having a polarity different from that of the third external electrode 7b.

[0036] When viewed from a direction perpendicular to the first surface 2a, the first external electrode 7a and the third external electrode 7b may overlap, and the second external electrode 8a and the fourth external electrode 8b may overlap. In this case, as shown in FIG. 3B , the first internal electrode 3 and the second internal electrode 4 can each be symmetrical with respect to a line L1 that passes through the centroid C1 of the side surfaces 2c and 2d and extends in the longitudinal direction (Y direction). As a result, when fabricating the main body 2, it is possible to reduce warping of the main body 2 due to the difference in firing shrinkage between the metal or alloy material that forms the internal electrodes 3 and 4 and the ceramic material that forms the dielectric layer 5. This in turn makes it possible to improve the connection reliability between the multilayer ceramic capacitor 1 and an external substrate.

[0037] Furthermore, if the effective height H is 80% or less of the height T, it is possible to prevent a decrease in the yield of the pre-fired laminate due to cutting misalignment. Furthermore, if the effective height H is 70% or less of the height T, it is possible to prevent delamination after firing due to adhesion of the marginal portions.

[0038] Fig. 4A is a side view showing the electrode patterns of three multilayer ceramic capacitors. Fig. 4B is an enlarged view of section IVB of Fig. 4A. Figs. 5A to 5C are views showing cross sections taken along the cutting lines AA, BB, and CC of Figs. 4A and 4B, respectively. Fig. 5A shows the cross section taken along the cutting line AA of Fig. 4A, Fig. 5B shows the cross section taken along the cutting line BB of Fig. 4A, and Fig. 5C shows the cross section taken along the cutting line CC of Fig. 4A. 6A to 6C are cross-sectional views of a fired multilayer ceramic capacitor taken along the cutting lines AA, BB, and CC in FIG. 4A, viewed from a different vertical plane (first direction X) than the adjacent end faces. FIG. 6A shows a cross-section of the fired multilayer ceramic capacitor taken along the cutting line AA in FIG. 4A, FIG. 6B shows a cross-section of the fired multilayer ceramic capacitor taken along the first direction X perpendicular to the cutting line BB in FIG. 4A, and FIG. 6C shows a cross-section of the fired multilayer ceramic capacitor taken along the first direction X perpendicular to the cutting line CC in FIG. 4A. Note that FIG. 6A shows a multilayer ceramic capacitor with a warpage rate D of 0%, FIG. 6B shows a multilayer ceramic capacitor with a warpage rate D of 10% or less, and FIG. 6C shows a multilayer ceramic capacitor with a warpage rate D of 10% or more. Note that the cutting lines AA, BB, and CC in FIGS. 4A and 4B indicate the cutting positions when dividing three multilayer ceramic capacitors into three pieces during the cutting process. Therefore, Figures 5A to 5C show the cut surfaces exposed after cutting the laminate of three multilayer ceramic capacitors, and Figures 6A to 6C show that the warpage of the laminate after firing varies depending on the area of ​​the exposed cut surface of the internal electrode.

[0039] Let T1 be the actual thickness of the main body 2 after firing, T2 be the distance in a direction parallel to the thickness direction between two parallel planes that contact the main body 2 after firing on both sides in the thickness direction, T1 / T2 be the warpage rate D, S be the measured area of ​​the region of the first extracted portion 31a and the first confirmation electrode 51a exposed on the first surface 2a before firing, S0 be the area of ​​the region of the first extracted portion 31a and the first confirmation electrode 51a exposed on the designed first surface 2a, and M be the expansion rate of the region of the first extracted portion 31a and the first confirmation electrode 51a exposed on the first surface 2a due to firing. When the expansion rate M of the first extracted portion 31a and the first confirmation electrode 51a is M = {(S / S0)-1} × 100, if the warpage rate D is 10% or less, the expansion rate M is selected in the range of 0≦M≦36%. This makes it possible to determine whether the multilayer ceramic capacitor 1 is good or bad after firing in the green laminate inspection step before the firing step, thereby improving production efficiency.

[0040] Next, an example of a method for manufacturing the multilayer ceramic capacitor 1 will be described.

[0041] First, a powder containing a dielectric material such as BaTiO3, CaTiO3, or SrTiO3, or a mixture thereof, as a main component, is prepared as the material for the dielectric layer 5. An organic vehicle is added to the powder to prepare a ceramic slurry. Next, a ceramic green sheet (hereinafter simply referred to as a green sheet) is produced using a sheet forming method such as a doctor blade method or a die coater method. The thickness of the green sheet may be, for example, about 0.5 to 10 μm.

[0042] Next, a conductive paste is prepared by mixing 1 to 30 parts by weight of a powder mainly composed of a metal material such as Ni, Cu, Ag, Pd, or a mixture thereof with a ceramic powder, which is the main component of the dielectric, as the material for the first internal electrode 3 and the second internal electrode 4. Subsequently, using the prepared conductive paste, a first pattern sheet is formed on the main surface of a green sheet, on which an electrode pattern to become the first internal electrode 3 is printed, and a second pattern sheet is formed on the main surface of a green sheet, on which an electrode pattern to become the second internal electrode 4 is printed. For printing the electrode patterns, a printing method such as screen printing or gravure printing can be used.

[0043] Next, a predetermined number of first pattern sheets and second pattern sheets are alternately stacked on top of a predetermined number of stacked ceramic green sheets, and then a predetermined number of ceramic green sheets are stacked on top of them to produce a temporary laminate. The temporary laminate is then pressed in the stacking direction to obtain a base laminate. The laminate can be pressed using, for example, an isostatic press. The base laminate is cut at desired locations to produce green element components that will become the main body 2. The cut green element components are placed in a pot containing abrasive powder, media, etc., and rotated and polished to remove corners. Subsequently, the green element components are degreased in air, an inert gas, or a reducing atmosphere, and then fired in a reducing atmosphere. The firing temperature may be, for example, approximately 1000 to 1300°C. Subsequently, a reoxidation treatment is performed in a nitrogen atmosphere. Alternatively, a step may be added in which the reoxidized element components are placed in a pot containing abrasive powder, media, etc., and rotated and polished to remove corners and firing burrs from the element components. Through these steps, the main body 2 is obtained.

[0044] The first external electrode 7a, the second external electrode 8a, the third external electrode 7b, and the fourth external electrode 8b are formed on the first surface 2a and the second surface 2b of the obtained main body 2, thereby manufacturing the multilayer ceramic capacitor 1. The first external electrode 7a and the second external electrode 8a can be formed using the thin film formation technique or the thick film formation technique described above.

[0045] Next, a mounting structure 100 according to an embodiment of the present disclosure will be described. FIG. 7 is a side view showing the mounting structure according to an embodiment of the present disclosure. The mounting structure 100 of this embodiment includes a multilayer ceramic capacitor 1 and a substrate 10. The substrate 10 has a mounting surface 10a. As shown in FIG. 7, the substrate 10 has at least one first substrate electrode 11a and at least one second substrate electrode 11b located on the mounting surface 10a. An electric circuit to which the multilayer ceramic capacitor 1 is electrically connected may be located on the mounting surface 10a.

[0046] The multilayer ceramic capacitor 1 is mounted on the mounting surface 10a so that the side surfaces 2c and 2d are perpendicular to the mounting surface 10a. In other words, the multilayer ceramic capacitor 1 is mounted on the mounting surface 10a so that the first internal electrode 3 and the second internal electrode 4 are perpendicular to the mounting surface 10a.

[0047] In the multilayer ceramic capacitor 1, at least one of the first external electrode 7a and the third external electrode 7b is electrically connected to the first substrate electrode 11a, and at least one of the second external electrode 8a and the fourth external electrode 8b is electrically connected to the second substrate electrode 11b. The multilayer ceramic capacitor 1 may be mounted on the substrate 10, for example, by joining the first external electrode 7a and the second external electrode 8a to the first substrate electrode 11a and the second substrate electrode 11b, respectively, via a conductive bonding material 12. Examples of the conductive bonding material 12 that can be used include solder and brazing filler metal.

[0048] The multilayer ceramic capacitor 1 may be mounted on the substrate 10, for example, by electrically connecting the first external electrode 7a and the third external electrode 7b to the two first substrate electrodes 11a, respectively, and electrically connecting the second external electrode 8a and the fourth external electrode 8b to the two second substrate electrodes 11b, respectively. In this case, the first external electrode 7a and the second external electrode 8a may be joined to the first substrate electrode 11a and the second substrate electrode 11b, respectively, via a conductive bonding material 12. The third external electrode 7b and the fourth external electrode 8b may be electrically connected to the first substrate electrode 11a and the second substrate electrode 11b, respectively, via connecting members such as bonding wires.

[0049] When the multilayer ceramic capacitor 1 has a first external electrode 7a and a second external electrode 8a, the multilayer ceramic capacitor 1 may be mounted on the mounting surface 10a by joining the third external electrode 7b to the first substrate electrode 11a and the fourth external electrode 8b to the second substrate electrode 11b, as shown in FIG. 7.

[0050] The mounting structure 100 includes the multilayer ceramic capacitor 1, and therefore is a highly reliable mounting structure.

[0051] As the multilayer ceramic capacitor of the example, a large number of multilayer ceramic capacitors 1 shown in Figures 1, 2, 3A, 3B, 4A, 4B, 5A to 5C, and 6A to 6C were manufactured. The manufacturing procedure is as follows.

[0052] (1) A green sheet is formed using barium titanate as the main component. (2) On the green sheet, internal electrodes as shown in Figures 3A and 3B and anchor tabs to facilitate the formation of external electrodes on the upper and lower main surfaces (first surface 2a and second surface 2b) are formed by gravure printing. (3) The internal electrode pattern is designed so that the external electrodes have the same polarity on the upper and lower main surfaces. (4) In order to check the cutting position after lamination, the internal electrode pattern is formed with a pattern for checking cutting misalignment, the area of ​​which extends from the lead-out portion to the effective portion. (5) For the internal electrodes and anchor tabs, select Ni conductive paste. (6) A cover layer is laminated on the uppermost surface (the left and right side surfaces) of the laminate, and the laminate is laminated so that the positions of the cross-sectional lines AA and BB in FIGS. 4A and 4B alternate. (7) The unfired laminate is cut at the desired position, and the cut unfired laminate is inspected by a visual inspection machine to select non-defective products, with the electrode spacing being 30 to 100% of the design value as the criteria for judgment. (8) The obtained green body is subjected to barrel polishing in a container containing polishing powder and media to obtain a surface-treated green body. (9) The selected and surface-treated green bodies before firing are degreased in air, an inert gas atmosphere, or a reducing atmosphere, and then fired at 1100°C in a reducing atmosphere. (10) The obtained porcelain is heat treated in a nitrogen atmosphere and then barrel polished again in a container containing polishing powder and media to obtain a porcelain body from which firing burrs and the like have been removed. (11) The surface of the obtained porcelain body on which the internal electrodes and anchor tabs are exposed is used as the main surface of the product, and the first layer of the external electrode is formed directly by electroless Cu plating, and the second and third external electrode layers of Ni and Sn are formed on top of that by conventional electrolytic plating. (12) Depending on the specifications of the interposer, lead portions forming the second and third external electrodes may be provided. Also, multiple plating layers of Ni, Sn, solder, etc. on the first layer of the external electrodes may not be provided.

[0053] The dimensions of the multilayer ceramic capacitor of the example are as follows: The gap between the end faces is 1.9mm±0.2mm. The width between the sides is 0.7mm±0.2mm. The gap between the main surfaces is 0.5mm±0.1mm Warpage rate in the main surface direction is 4% or less, The thickness of one porcelain layer is 1.2 μm ± 0.1 μm.

[0054] The comparative example was fabricated as follows (1) to (7).

[0055] (1) A green sheet is formed using barium titanate as the main component in the same manner as in the above example. (2) To form a sheet-like normal laminated structure, the internal electrodes are formed by gravure printing and the external electrodes by dipping. (3) For the internal electrodes, select Ni conductive paste. (4) Cover layers are placed on top and bottom, and two types of electrode sheets are stacked alternately. (5) The laminated body is cut at the desired position, barrel polished in a pot containing polishing powder and media, degreased in air, an inert gas atmosphere, or a reducing atmosphere, and fired in a reducing atmosphere at 1100°C. (6) The obtained porcelain is heat-treated in a nitrogen atmosphere and then barrel-polished in a container containing polishing powder and media to obtain a porcelain body. (7) The obtained ceramic body has a first external electrode layer formed on the surface where the internal electrode is exposed by dipping conductive Cu paste, and then the second and third external electrode layers are formed on top of that using conventional electroplating, Ni, Sn, etc.

[0056] The dimensions of the comparative multilayer ceramic capacitor are: The distance between the end faces is 1.9mm±0.2mm. The gap between the sides is 0.7mm±0.2mm. The spacing between the main surfaces is 0.5mm±0.1mm. The thickness of one porcelain layer is 1.2 μm ± 0.1 μm.

[0057] The evaluation method was to measure the capacitance and leakage current using an electrical characteristic evaluation device, and products with capacitance that met the capacitance tolerance of ±15° were deemed to be good products. 100 good products were selected as samples, and the warpage rate was evaluated. The appearance defect rate for warpage rates of 4% or more was calculated. The calculation results are shown in Tables 1 and 2 below.

[0058] [Table 1]

[0059] [Table 2]

[0060] The average warpage rate of 100 good multilayer ceramic capacitors of the example and 100 good multilayer ceramic capacitors of the comparative example was measured, and the good capacitors were cut and the cross sections were examined to check for internal defects. The average warpage rate of the 100 good multilayer ceramic capacitors of the example was 4.3%, and no internal defects were found. However, the average warpage rate of the 100 good multilayer ceramic capacitors of the comparative example was 12.1%, and internal defects due to warpage were found in five of them. This demonstrates that the multilayer ceramic capacitors of the example can be prevented from warping externally and the quality of their internal structure can be determined by excluding capacitors with lead electrode areas of 30% or more during visual inspection of the green laminate. Therefore, the multilayer ceramic capacitor 1 of the present disclosure enables efficient production of highly reliable multilayer ceramic capacitors.

[0061] 8A to 8D are diagrams showing various patterns of the first confirmation electrode 51a and the second confirmation electrode 51b, and FIGS. 9A to 9E are diagrams showing other patterns of the first confirmation electrode 51a and the second confirmation electrode 51b. FIGS. 10A to 10E are diagrams showing further other patterns of the first confirmation electrode 51a and the second confirmation electrode 51b. The first confirmation electrode 51a and the second confirmation electrode 51b may be configured in an equilateral triangular shape that is separated and insulated from the internal electrode 3, as shown in FIG. 8A. Alternatively, as shown in FIG. 8B, two first confirmation electrodes 51a may be formed in a right-angled triangular shape on both sides of the first lead portion 31a, integrally connected to the first capacitance-forming portion 31d and the first lead portion 31a, and two second confirmation electrodes 51b may be formed in a right-angled triangular shape on both sides of the second lead portion 31b, integrally connected to the first capacitance-forming portion 31d and the second lead portion 31b. 8C, two first confirmation electrodes 51a may be formed on either side of first lead portion 31a in contact only with first lead portion 31a and spaced apart from first capacitance-forming portion 31d in a right-angled triangle shape, and two second confirmation electrodes 51b may be formed on either side of second lead portion 31b in contact only with second lead portion 31b and spaced apart from first capacitance-forming portion 31d in a right-angled triangle shape.Furthermore, as shown in FIG. 8D, one first confirmation electrode 51a and one second confirmation electrode 51b may be formed in point contact with first lead portions 31a and 31b in a regular triangle shape and spaced apart from first capacitance-forming portion 31d.

[0062] 9A, the first confirmation electrode 51a may be formed in a right-angled triangle shape connected to the first lead portion 31a and the first capacitance forming portion 31d, and the second confirmation electrode 51b may be formed in a right-angled triangle shape connected to the second lead portion 31b and the first capacitance forming portion 31d. As shown in FIG. 9B, the first confirmation electrode 51a may be formed in a right-angled triangle shape recessed inward from the first surface 2a and connected to the first lead portion 31a and the first capacitance forming portion 31d, and the second confirmation electrode 51b may be formed in a right-angled triangle shape recessed inward from the second surface 2b and connected to the second lead portion 31b and the first capacitance forming portion 31d.

[0063] 9C, the first confirmation electrode 51a may be formed in a rectangular shape connected to the first lead portion 31a and the first capacitance forming portion 31d, and the second confirmation electrode 51b may be formed in a rectangular shape connected to the second lead portion 31b and the first capacitance forming portion 31d. As shown in FIG. 9D, in the case of a multilayer ceramic capacitor having a first effective electrode extension 31c, the first confirmation electrode 51a may be formed by a right-angled triangular portion connected to the first lead portion 31a and the first capacitance forming portion 31d and a right-angled triangular portion connected to the first lead portion 31a and the first effective electrode extension 31c, and the second confirmation electrode 51b may be formed by a right-angled triangular portion connected to the second lead portion 31b and the first capacitance forming portion 31d and a right-angled triangular portion connected to the second lead portion 31b and the first effective electrode extension 31c.

[0064] Furthermore, as shown in FIG. 9E, in the case of a multilayer ceramic capacitor having a first effective electrode extension 31c, the first confirmation electrode 51a may be composed of a right-angled triangular portion that is connected to the first extraction portion 31a and the first capacitance forming portion 31d and recessed inward from the first surface 2a, and a right-angled triangular portion that is connected to the first extraction portion 31a and the first effective electrode extension 31c and recessed inward from the first surface 2a, and the second confirmation electrode 51b may be composed of a right-angled triangular portion that is connected to the second extraction portion 31b and the first capacitance forming portion 31d and recessed inward from the second surface 2b, and a right-angled triangular portion that is connected to the second extraction portion 31b and the first effective electrode extension 31c and recessed inward from the second surface 2b.

[0065] Furthermore, as shown in FIG. 10A , in the case of a multilayer ceramic capacitor having a first effective electrode extension 31c, the first confirmation electrode 51a may be composed of a rectangular portion connected to the first lead portion 31a and the first capacitance forming portion 31d and recessed inward from the first surface 2a, and a rectangular portion connected to the first lead portion 31a and the effective electrode extension 31c and recessed inward from the first surface 2a, and the second confirmation electrode 51b may be composed of a rectangular portion connected to the second lead portion 31b and the first capacitance forming portion 31d and recessed inward from the second surface 2b, and a rectangular portion connected to the second lead portion 31b and the effective electrode extension 31c and recessed inward from the second surface 2b. Also, as shown in FIG. 10B, the first confirmation electrode 51a may be configured by a portion connected to the first lead-out portion 31a and the first capacitance forming portion 31d and formed in a triangular shape with its hypotenuse curved inward from the first surface 2a, and the second confirmation electrode 51b may be configured by a portion connected to the second lead-out portion 31b and the first capacitance forming portion 31d and formed in a triangular shape with its hypotenuse curved inward from the second surface 2b.

[0066] As shown in FIG. 10C, the first confirmation electrode 51a may be configured as a triangular portion connected to the first lead-out portion 31a and the first capacitance forming portion 31d, recessed inward from the first surface 2a, and having an inwardly curved hypotenuse, and the second confirmation electrode 51b may be configured as a triangular portion connected to the second lead-out portion 31b and the first capacitance forming portion 31d, recessed inward from the second surface 2b, and having an inwardly curved hypotenuse. Furthermore, as shown in FIG. 10D , the first confirmation electrode 51a may be composed of a triangular portion connected to the first lead portion 31a and the first capacitance forming portion 31d, with its hypotenuse curving inward from the first surface 2a, and a triangular portion connected to the first lead portion 31a and the first effective electrode extension portion 31c, with its hypotenuse curving inward from the first end surface 2e. The second confirmation electrode 51b may be composed of a triangular portion connected to the second lead portion 31b and the first capacitance forming portion 31d, with its hypotenuse curving inward from the second surface 2b, and a triangular portion connected to the second lead portion 31b and the first effective electrode extension portion 31c, with its hypotenuse curving inward from the first end surface 2e.

[0067] 10E, the first confirmation electrode 51a may be composed of a portion connected to the first lead portion 31a and the first capacitance forming portion 31d, recessed inward from the first surface 2a, and formed in a triangular shape with its hypotenuse curved inward, and a portion connected to the first lead portion 31a and the first effective electrode extension portion 31c, recessed inward from the first end surface 2e, and formed in a triangular shape with its hypotenuse curved inward.The second confirmation electrode 51b may be composed of a portion connected to the second lead portion 31b and the first capacitance forming portion 31d, recessed inward from the second surface 2b, and formed in a triangular shape with its hypotenuse curved inward, and a portion connected to the second lead portion 31b and the first effective electrode extension portion 31c, recessed inward from the first end surface 2e, and formed in a triangular shape with its hypotenuse curved inward.

[0068] The effects of the present disclosure can also be extended to multilayer ceramic capacitors that do not have external electrodes for testing on their end faces and have multiple terminals on the first and second surfaces 2a and 2b, which are the upper and lower surfaces of the element. For example, FIG. 11 is a perspective view showing a multilayer ceramic capacitor 1a according to another embodiment of the present disclosure, which has four terminals on the first and second surfaces 2a and 2b, which are the upper and lower surfaces of the element. FIG. 12 is an exploded perspective view showing a multilayer ceramic capacitor 1a according to another embodiment of the present disclosure. FIG. 13 is a cross-sectional view showing a multilayer ceramic capacitor 1a according to another embodiment of the present disclosure. FIG. 13 shows a cross section taken along the line XIII-XIII in FIG. 11. The same reference numerals are used to refer to parts corresponding to those in the above-described embodiment.

[0069] Similar to the multilayer ceramic capacitor 1 described above, the multilayer ceramic capacitor 1a of this embodiment includes a substantially rectangular parallelepiped main body 2 in which first internal electrodes 3 and second internal electrodes 4 and first electrodes and second electrodes are alternately stacked in a first direction X with rectangular dielectric layers 5 sandwiched therebetween, the main body 2 having a first surface 2a and a second surface 2b, a first side surface 2c and a second side surface 2d, and a first end surface 2e and a second end surface 2f, a first external electrode 7a and a second external electrode 8a located on the first surface 2a, and a third external electrode 7b and a fourth external electrode 8b located on the second surface 2b.

[0070] The multilayer ceramic capacitor 1a of this embodiment has a configuration in which a fifth external electrode 7c, a sixth external electrode 8c, a seventh external electrode 7d, an eighth external electrode 8d, a fifth lead portion 31e, a sixth lead portion 31f, a fifth dummy electrode 32c, and a sixth dummy electrode 32d are added to the above-mentioned multilayer ceramic capacitor 1.

[0071] 1, 2, 3A, 3B, 4A, 4B, 5A to 5C, 6A to 6C, 7, 8A to 8D, 9A to 9E, and 10A to 10E, the multilayer ceramic capacitor 1a also includes a fifth confirmation electrode 57c provided at the intersection of the first capacitance-forming portion 31d and the first extended portion 31a, a seventh confirmation electrode 57d provided at the intersection of the first capacitance-forming portion 31d and the second extended portion 31b, a sixth confirmation electrode 56a provided at the intersection of the second capacitance-forming portion 41d and the third extended portion 41a, and an eighth confirmation electrode 56b provided at the intersection of the second capacitance-forming portion 41d and the fourth extended portion 41b.

[0072] 14A to 14D are diagrams showing electrode patterns of the multilayer ceramic capacitor 1a according to the embodiment shown in FIGS. 12 and 13. The same reference numerals are used to designate parts corresponding to those in the above-described embodiments. As shown in FIG. 14A, the multilayer ceramic capacitor 1a may have a fifth confirmation electrode 57c having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the first lead portion 31a, and a seventh confirmation electrode 57d having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the second lead portion 31b.

[0073] As shown in FIG. 14B, the configuration may also include a fifth confirmation electrode 57c having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the first extraction portion 31a on the fifth dummy electrode 32c side, a seventh confirmation electrode 57d having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the second extraction portion 31b on the sixth dummy electrode 32d side, a ninth confirmation electrode 59a having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the fifth extraction portion 31e on the fifth dummy electrode 32c side, and a tenth confirmation electrode 59b having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the sixth dummy electrode 32d side.

[0074] Furthermore, as shown in FIG. 14C, the multilayer ceramic capacitor 1a may have a configuration including a fifth confirmation electrode 57c having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the first lead portion 31a on the fifth dummy electrode 32c side, a seventh confirmation electrode 57d having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the second lead portion 31b on the sixth dummy electrode 32d side, an eleventh confirmation electrode 60a having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the fifth lead portion 31e on the first dummy lead portion 32a side, and a twelfth confirmation electrode 60b having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the sixth lead portion 31f on the second dummy lead portion 32b side.

[0075] As shown in FIG. 14D, the multilayer ceramic capacitor 1a also has a fifth confirmation electrode 57c having a right-angled triangular shape connected to an intersection of the first capacitance forming portion 31d and the first lead portion 31a on the fifth dummy electrode 32c side, a seventh confirmation electrode 57d having a right-angled triangular shape connected to an intersection of the first capacitance forming portion 31d and the second lead portion 31b on the sixth dummy electrode 32d side, and a ninth confirmation electrode 57d having a right-angled triangular shape connected to an intersection of the first capacitance forming portion 31d and the fifth lead portion 31e on the fifth dummy electrode 32c side. The configuration may include an electrode 59a, a tenth confirmation electrode 59b in the shape of a right triangle connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the sixth dummy electrode 32d side, an eleventh confirmation electrode 60a in the shape of a right triangle connected to the intersection of the first capacitance forming portion 31d and the fifth extraction portion 31e on the first dummy extraction portion 32a side, and a twelfth confirmation electrode 60b in the shape of a right triangle connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the second dummy extraction portion 32b side.

[0076] 15A to 15D are diagrams showing other examples of the electrode pattern of the multilayer ceramic capacitor 1a according to the embodiment shown in Fig. 12 and Fig. 13. As shown in Fig. 15A, the multilayer ceramic capacitor 1a may have a configuration including a fifth confirmation electrode 57c having a right-angled triangular shape connected to an intersection of the first capacitance forming portion 31d and the first lead portion 31a on the fifth dummy electrode 32c side and recessed inward from the first surface 2a, and a seventh confirmation electrode 57d having a right-angled triangular shape connected to an intersection of the first capacitance forming portion 31d and the second lead portion 31b on the sixth dummy electrode 32d side and recessed inward from the second surface 2b.

[0077] As shown in FIG. 15B, the multilayer ceramic capacitor 1a may also have a configuration including: a fifth confirmation electrode 57c having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the first lead portion 31a on the fifth dummy electrode 32c side and recessed inward from the first surface 2a; a seventh confirmation electrode 57d having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the second lead portion 31b on the sixth dummy electrode 32d side and recessed inward from the second surface 2b; a ninth confirmation electrode 59a having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the fifth lead portion 31e on the fifth dummy electrode 32c side and recessed inward from the first surface 2a; and a tenth confirmation electrode 59b having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the sixth lead portion 31f on the sixth dummy electrode 32d side and recessed inward from the second surface 2b.

[0078] As shown in FIG. 15C, the multilayer ceramic capacitor 1a also has a fifth confirmation electrode 57c in the shape of a right triangle connected to an intersection of the first capacitance forming portion 31d and the first lead portion 31a on the side of the fifth dummy electrode 32c and recessed inward from the first surface 2a, and a seventh confirmation electrode 57b in the shape of a right triangle connected to an intersection of the first capacitance forming portion 31d and the second lead portion 31b on the side of the sixth dummy electrode 32d and recessed inward from the second surface 2b. The configuration may include an eleventh confirmation electrode 60a having a right-angled triangular shape connected to the intersection of the electrode 57d, the first capacitance forming portion 31d, and the fifth extraction portion 31e on the first dummy extraction portion 32a side and recessed inward from the first surface 2a, and an eleventh confirmation electrode 60b having a right-angled triangular shape connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the second dummy extraction portion 32b side and recessed inward from the second surface 2b.

[0079] As shown in FIG. 15D , the multilayer ceramic capacitor 1a also includes a fifth confirmation electrode 57c having a right-angled triangular shape and recessed inward from the first surface 2a, connected to an intersection of the first capacitance forming portion 31d and the first lead portion 31a on the fifth dummy electrode 32c side, a seventh confirmation electrode 57d having a right-angled triangular shape and recessed inward from the second surface 2b, connected to an intersection of the first capacitance forming portion 31d and the second lead portion 31b on the sixth dummy electrode 32d side, and a seventh confirmation electrode 57d having a right-angled triangular shape and recessed inward from the second surface 2b, and a seventh confirmation electrode 57d having a right-angled triangular shape and recessed inward from the first surface 2a, connected to an intersection of the first capacitance forming portion 31d and the fifth lead portion 31e on the fifth dummy electrode 32c side, the ninth confirmation electrode 59a may have a right-angled triangular shape; a tenth confirmation electrode 59b connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the sixth dummy electrode 32d side and recessed inward from the second surface 2b; an eleventh confirmation electrode 60a connected to the intersection of the first capacitance forming portion 31d and the fifth extraction portion 31e on the first dummy extraction portion 32a side and recessed inward from the first surface 2a; and a twelfth confirmation electrode 60b connected to the intersection of the first capacitance forming portion 31d and the sixth extraction portion 31f on the second dummy extraction portion 32b side and recessed inward from the second surface 2b.

[0080] 16A to 16D are diagrams showing other examples of the electrode pattern of the multilayer ceramic capacitor 1a according to the embodiment shown in Fig. 12 and Fig. 13. As shown in Fig. 16A, the multilayer ceramic capacitor 1a has a triangular first confirmation electrode 51a connected to the first capacitance forming portion 31d between the first lead portion 31a and the fifth dummy electrode 32c, and a triangular second confirmation electrode 51b connected to the first capacitance forming portion 31d between the second lead portion 31b and the sixth dummy electrode 32d.

[0081] As shown in FIG. 16B, the multilayer ceramic capacitor 1a also has a triangular first confirmation electrode 51a connected to the first capacitance forming portion 31d between the first lead portion 31a and the fifth dummy electrode 32c, a triangular second confirmation electrode 51b connected to the first capacitance forming portion 31d between the second lead portion 31b and the sixth dummy electrode 32d, a triangular thirteenth confirmation electrode 61a connected to the first capacitance forming portion 31d between the fifth lead portion 31e and the fifth dummy electrode 32c, and a triangular fourteenth confirmation electrode 61b connected to the first capacitance forming portion 31d between the first lead portion 31a and the sixth dummy electrode 32d.

[0082] As shown in FIG. 16C, the multilayer ceramic capacitor 1a also has a triangular first confirmation electrode 51a connected to the first capacitance forming portion 31d between the first lead portion 31a and the fifth dummy electrode 32c, a triangular second confirmation electrode 51b connected to the first capacitance forming portion 31d between the second lead portion 31b and the sixth dummy electrode 32d, a triangular fifteenth confirmation electrode 62a connected to the first capacitance forming portion 31d between the fifth lead portion 31e and the first dummy lead portion 32a, and a triangular sixteenth confirmation electrode 62b connected to the first capacitance forming portion 31d between the sixth lead portion 31f and the second dummy lead portion 32b.

[0083] As shown in FIG. 16D, the multilayer ceramic capacitor 1a also includes a triangular first confirmation electrode 51a connected to the first capacitance forming portion 31d between the first lead portion 31a and the fifth dummy electrode 32c, a triangular second confirmation electrode 51b connected to the first capacitance forming portion 31d between the second lead portion 31b and the sixth dummy electrode 32d, and a triangular thirteenth confirmation electrode 51b connected to the first capacitance forming portion 31d between the fifth lead portion 31e and the fifth dummy electrode 32c. The configuration may include an electrode 61a, a triangular 14th confirmation electrode 61b connected between the first lead portion 31a and the sixth dummy electrode 32d of the first capacitance forming portion 31d, a triangular 15th confirmation electrode 62a connected between the fifth lead portion 31e and the first dummy lead portion 32a of the first capacitance forming portion 31d, and a triangular 16th confirmation electrode 62b connected between the sixth lead portion 31f and the second dummy lead portion 32b of the first capacitance forming portion 31d.

[0084] As described in relation to Figures 6A to 6C, from the relationship between the magnification rate M of the total areas S0 and S of the first lead portion 31a, the second lead portion 31b, the first confirmation electrode 51a, and the second confirmation electrode 51b when cut along the cutting lines AA, BB, and CC and the warpage rate D, by selecting the magnification rate M in the range of 0≦M≦36%, it is possible to determine whether the multilayer ceramic capacitor 1 is good or bad after firing, and even if the capacitor is made thin with a simple structure, it is possible to minimize warpage, not reduce mountability, and improve production efficiency.

[0085] According to the multilayer ceramic capacitor of the present disclosure, it is possible to provide a multilayer ceramic capacitor that has a simple structure and is thin, yet minimizes warpage and does not reduce mountability.

[0086] According to the mounting structure of the present disclosure, since it includes the multilayer ceramic capacitor described above, it is possible to provide a mounting structure with excellent reliability.

[0087] The multilayer ceramic capacitor according to the present disclosure can be embodied in the following configurations (1) to (5).

[0088] (1) A substantially rectangular parallelepiped main body portion formed by alternately stacking first and second internal electrodes, and first and second electrodes with dielectric layers sandwiched therebetween in a first direction, the main body portion having first and second side faces, first and second faces, and first and second end faces, which face each other in the first direction; a first external electrode and a second external electrode located on the first surface; a third external electrode and a fourth external electrode located on the second surface, the first internal electrode includes a first portion having a first capacitance forming portion, a first lead portion, and a second lead portion; the second internal electrode includes a second portion having a second capacitance forming portion, a third lead portion, and a fourth lead portion; the first electrode includes a first confirmation electrode and a second confirmation electrode; the second electrode includes a third confirmation electrode and a fourth confirmation electrode; the first lead portion and the second lead portion are led out to the first surface and the second surface, respectively, and connected to the first external electrode and the third external electrode, respectively; the third lead portion and the fourth lead portion are led out to the first surface and the second surface, respectively, and connected to the second external electrode and the fourth external electrode, respectively.

[0089] (2) the first confirmation electrode is located so as to connect to at least one side at a point where the first capacitance forming portion and the first lead portion intersect; the second confirmation electrode is located so as to be connected to at least one side at a point where the first capacitance forming portion and the second lead portion intersect, the third confirmation electrode is located so as to be connected to at least one side at a location where the second capacitance forming portion and the third lead portion intersect, The multilayer ceramic capacitor according to the above configuration (2), wherein the fourth confirmation electrode is located so as to be connected to at least one side at a location where the second capacitance forming portion and the fourth lead portion intersect.

[0090] (3) The first internal electrode further includes a first dummy portion electrically isolated from the first portion, the second internal electrode further includes a second dummy portion electrically isolated from the second portion, the first dummy portion includes a first dummy lead portion extending to the first surface and a second dummy lead portion extending to the second surface, the second dummy portion includes a third dummy lead portion extending to the first surface and a fourth dummy lead portion extending to the second surface, the first dummy lead portion and the second dummy lead portion are connected to the second external electrode and the fourth external electrode, respectively; The multilayer ceramic capacitor according to the above configuration (1) or (2), wherein the third dummy lead portion and the fourth dummy lead portion are connected to the first external electrode and the third external electrode, respectively.

[0091] (4) A multilayer ceramic capacitor according to any one of the above configurations (1) to (3), wherein T1 is the thickness of the main body portion before firing, T2 is the distance in a direction parallel to the thickness direction between two parallel planes that contact the main body portion after firing on both sides in the thickness direction, T1 / T2 is the warpage rate D, S is the measured area of ​​the region exposed on the first surface of the first lead portion after firing, S0 is the area of ​​the region exposed on the first surface in the design of the first lead portion, and M is the expansion rate of the region exposed on the first surface of the first lead portion due to firing, where M={(S / S0)-1}×100, and when the warpage rate D is 10% or less, the expansion rate M is in the range of 0≦M≦36%.

[0092] (5) The dielectric layer is rectangular, the first surface and the second surface face each other in a second direction that is perpendicular to the first direction and parallel to a short-side direction of the dielectric layer; The multilayer ceramic capacitor according to any one of the above configurations (1) to (4), wherein the first end face and the second end face face each other in a third direction that is perpendicular to the first direction and the second direction and parallel to the longitudinal direction of the dielectric layer.

[0093] The mounting structure of the multilayer ceramic capacitor according to the present disclosure can be implemented in the following configuration (6).

[0094] (6) A multilayer ceramic capacitor according to any one of the above configurations (1) to (5), a substrate having a mounting surface, The multilayer ceramic capacitor is mounted on the mounting surface so that the first side surface is perpendicular to the mounting surface.

[0095] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure. It goes without saying that all or part of the components constituting each of the above-described embodiments can be combined as appropriate within the scope of not contradicting each other. [Explanation of symbols]

[0096] 1,1a multilayer ceramic capacitor 2 Main body 2a 1st page 2b 2nd side 2c 1st side 2d second side 2e 1st end face 2f 2nd end face 3 1st internal electrode 4 Second internal electrode 5 Dielectric Layer 7,8 External electrode 7a 1st external electrode 7b Third external electrode 8a 2nd external electrode 8b 4th external electrode 31 Part 1 31a 1st drawer 31b 2nd drawer 31d 1st capacitance forming part 32 First dummy part 32a First dummy drawer 32b Second dummy drawer 41 Part 2 41a 3rd drawer 41b 4th drawer 41d Second capacitance forming part 7a 1st external electrode 8a 2nd external electrode 42a Third dummy drawer 42b 4th dummy drawer 51a 1st confirmation electrode 51b 2nd confirmation electrode 52a Third confirmation electrode 52b Fourth confirmation electrode 57c 5th confirmation electrode 56a 6th confirmation electrode 57d 7th confirmation electrode 56b 8th confirmation electrode 59a 9th confirmation electrode 59b 10th confirmation electrode 60a 11th confirmation electrode 60b 12th confirmation electrode 61a 13th confirmation electrode 61b 14th confirmation electrode 62a 15th confirmation electrode 62b 16th confirmation electrode 100 Mounting Structure

Claims

1. a substantially rectangular parallelepiped main body portion formed by alternately stacking first internal electrodes and second internal electrodes with dielectric layers sandwiched therebetween in a first direction, the main body portion having a first side surface and a second side surface opposing each other in the first direction, a first face and a second face opposing each other, and a first end face and a second end face opposing each other; a first external electrode and a second external electrode located on the first surface; a third external electrode and a fourth external electrode located on the second surface, The first internal electrode is a first capacitance forming portion; a first lead portion connected to the first capacitance forming portion and the first external electrode; a second lead portion connected to the first capacitance forming portion and the third external electrode; a first electrode portion formed integrally and continuously with the first capacitance forming portion and the first lead portion; a second electrode portion formed integrally and continuously with the first capacitance forming portion and the second lead portion, The second internal electrode is a second capacitance forming portion; a third lead portion connected to the second capacitance forming portion and the second external electrode; a fourth lead portion connected to the second capacitance forming portion and the fourth external electrode; a third electrode portion formed integrally and continuously with the second capacitance forming portion and the third lead portion; a fourth electrode portion formed integrally and continuously with the second capacitance forming portion and the fourth lead portion, At least one of the first electrode portion, the second electrode portion, the third electrode portion, and the fourth electrode portion has a length in a direction perpendicular to the first end face that is greater than a length in a direction perpendicular to the first face.

2. 2. The multilayer ceramic capacitor according to claim 1, wherein at least one of the first electrode portion, the second electrode portion, the third electrode portion, and the fourth electrode portion is formed in a right-angled triangle shape.

3. 2. The multilayer ceramic capacitor according to claim 1, wherein at least one of the first electrode portion, the second electrode portion, the third electrode portion, and the fourth electrode portion is formed in a rectangular shape.

4. The multilayer ceramic capacitor according to claim 1 , wherein the first electrode portion is recessed inward from the first surface.

5. 2. The multilayer ceramic capacitor according to claim 1, wherein the first electrode portion is formed in a right-angled triangular shape, and a hypotenuse of the first electrode portion is curved inward from the second surface.

6. 2. The multilayer ceramic capacitor according to claim 1, wherein a distance between the first surface and the second surface of the main body is smaller than a distance between the first side surface and the second side surface.

7. 2. The multilayer ceramic capacitor according to claim 1, wherein a distance between the first surface and the second surface of the main body is smaller than a distance between the first end surface and the second end surface.

8. 2. The multilayer ceramic capacitor according to claim 1, wherein no external electrodes are formed on the first end face and the second end face of the body portion.

9. 4. The multilayer ceramic capacitor according to claim 1, wherein T1 is a thickness of the main body portion before firing, T2 is a distance in a direction parallel to the thickness direction between two parallel planes that contact the main body portion after firing on both sides in the thickness direction, T1 / T2 is a warpage rate D, S is a measured area of ​​a region of the first lead portion that is exposed on the first surface after firing, S0 is a designed area of ​​the region of the first lead portion that is exposed on the first surface, and M is an expansion rate of the region of the first lead portion that is exposed on the first surface due to firing, where M={(S / S0)-1}×100, and when the warpage rate D is 10% or less, the expansion rate M is in a range of 0≦M≦36%.

10. the dielectric layer is rectangular; the first surface and the second surface face each other in a second direction that is perpendicular to the first direction and parallel to a short-side direction of the dielectric layer; 4. The multilayer ceramic capacitor according to claim 1, wherein the first end face and the second end face face each other in a third direction that is perpendicular to the first direction and the second direction and parallel to a longitudinal direction of the dielectric layers.

11. The multilayer ceramic capacitor according to any one of claims 1 to 3, a substrate having a mounting surface, The multilayer ceramic capacitor is mounted on the mounting surface so that the first side surface is perpendicular to the mounting surface.

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