Magnetic component, and coil device

The magnetic component design with a thermally conductive box-shaped member and potting material efficiently dissipates heat, reducing size and managing thermal issues in power conversion devices.

JP2025176322APending Publication Date: 2025-12-04PANASONIC AUTOMOTIVE SYST CO LTD
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Patent Information

Application Number
JP2024082372
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-05-21
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Magnetic components in power conversion devices, such as inductors and transformers, generate significant heat during operation, necessitating efficient heat dissipation to address both thermal management and miniaturization needs.

Method used

A magnetic component design incorporating a box-shaped member made of a thermally conductive material with a heat dissipation path formed by a potting material that conducts heat from the component body to a heat dissipation portion, connected to a cooling surface via thermal conduction.

Benefits of technology

This design effectively reduces the size of magnetic components while enhancing heat dissipation, thereby addressing both thermal management and miniaturization challenges.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a magnetic component mounted on a coil device and capable of miniaturization.SOLUTION: The disclosed magnetic component includes a component main body, a box-shaped member, and a potting material. The component main body is a heat dissipation target. The box-shaped member is formed into a box shape with one side open using a plate-like member that has thermal conductivity. The box-shaped member has an opening, multiple side portions, and a heat dissipation portion. The top part faces the opening. The side portions extend from the top part to the opening. The heat dissipation portion is formed at an end of at least one of the side portions out of the multiple opening sides. The potting material has at least thermal conductivity and is filled in the box-shaped member through the opening. The top part of the box-shaped member is thermally connected to a first main surface of the component main body. The box-shaped member forms a heat dissipation path that transports heat from the component main body through the top part to the heat dissipation portion by thermal conduction.SELECTED DRAWING: Figure 4
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Description

[Technical Field]

[0001] The present disclosure relates to magnetic components and coil devices. [Background technology]

[0002] Conventionally, in power conversion devices (coil devices) such as on-board chargers and DC-DC converters installed in electric vehicles, magnetic components such as inductors and transformers generate a lot of heat when converting large currents and high voltages. For this reason, there is a demand for technology that can efficiently dissipate heat from the magnetic components installed in coil devices.

[0003] For example, Patent Document 1 discloses a technology relating to a reactor device equipped with a coil for power factor correction or smoothing, in which a metal case containing a transformer core and a heat sink is filled with a potting resin material, and heat generated in the transformer core is transported to the metal case via the heat sink and dissipated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6268509 Summary of the Invention [Problem to be solved by the invention]

[0005] In this situation, there is a demand for miniaturization of in-vehicle coil devices due to, for example, limitations on mounting space.

[0006] One of the problems that the present disclosure aims to solve is to reduce the size of magnetic components mounted in a coil device. [Means for solving the problem]

[0007] A magnetic component according to the present disclosure comprises a component body, a box-shaped member, and a potting material. The component body is a heat dissipation target. The box-shaped member is formed into a box shape with one side open using a thermally conductive plate-like member. The box-shaped member has an opening, multiple side surfaces, and a heat dissipation portion. The top surface faces the opening. The multiple side surfaces extend from the top surface to the opening. The heat dissipation portion is formed on the end of at least one of the multiple side surfaces on the opening side. The potting material has at least thermal conductivity and is filled inside the box-shaped member from the opening. The top surface of the box-shaped member is thermally connected to a first main surface of the component body. The box-shaped member forms a heat dissipation path that transports heat from the component body via the top surface to the heat dissipation portion by thermal conduction. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to reduce the size of magnetic components mounted in a coil device. Note that the effects described herein are not necessarily limited to those described herein, and may be any of the effects described in this specification. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a front view showing an example of the configuration of a transformer assembly having a heat dissipation structure according to an embodiment. [Figure 2] FIG. 2 is a top view showing an example of the configuration of the transformer assembly of FIG. [Figure 3] FIG. 3 is a left side view showing an example of the configuration of the transformer assembly of FIG. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the configuration of the transformer assembly of FIG. [Figure 5] FIG. 5 is a perspective view showing an example of the configuration of the metal case of FIG. [Figure 6] FIG. 6 is a perspective view showing an example of the configuration of the metal case of FIG. [Figure 7]FIG. 7 is a diagram for explaining an example of an assembly process for the transformer assembly according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining an example of an assembly process for the transformer assembly according to the embodiment. [Figure 9] FIG. 9 is a diagram for explaining the miniaturization of a transformer assembly achieved by the heat dissipation structure according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of a heat dissipation structure, a magnetic component, a coil device (power conversion device), a vehicle, and a manufacturing method according to the present disclosure will be described with reference to the drawings.

[0011] In the description of the present disclosure, components having the same or substantially the same functions as those described above with respect to the previously-mentioned drawings may be given the same reference numerals, and descriptions thereof may be omitted as appropriate. Furthermore, even when the same or substantially the same parts are shown, the dimensions and proportions may be different depending on the drawing. Furthermore, for example, in order to ensure the visibility of the drawings, reference numerals may be given to only the main components in the description of each drawing, and reference numerals may not be given to components having the same or substantially the same functions as those described above with respect to the previously-mentioned drawings.

[0012] In the description of this disclosure, expressions such as orthogonal, horizontal, vertical, parallel, identical, coincident, and the same position are not limited to strictly orthogonal, horizontal, vertical, parallel, identical, coincident, and the same position, but also include cases where they can be considered as orthogonal, horizontal, vertical, parallel, identical, coincident, and the same position.

[0013] FIG. 1 is a front view showing an example of the configuration of a transformer assembly 2 having a heat dissipation structure 3 according to an embodiment. FIG. 2 is a top view showing an example of the configuration of the transformer assembly 2 of FIG. 1. FIG. 3 is a left side view showing an example of the configuration of the transformer assembly 2 of FIG. 1. FIG. 4 is a cross-sectional view showing an example of the configuration of the transformer assembly 2 of FIG. 1.

[0014] 1 to 4 each illustrate the transformer assembly 2 mounted on an on-board charger 1. Fig. 4 illustrates a cross section of the IV-IV plane (ZX plane) of Figs. 2 and 3 as viewed from the lower side of Fig. 2 or the right side (+Y side) of Fig. 3.

[0015] In the description of the present disclosure, the direction from the transformer assembly 2 toward the housing 11 of the on-board charger 1 is defined as the +Z direction. Also, directions along the cooling surface 101 of the housing 11 of the on-board charger 1 that are perpendicular to the Z direction are defined as the X direction and the Y direction. In other words, the cooling surface 101 is defined as a plane parallel to the XY plane.

[0016] The on-board charger 1 according to the present disclosure is an example of a power conversion device (coil device). This power conversion device is mounted on a vehicle (mobile object) such as an electric vehicle, but may also be mounted on other devices of the mobile object, such as a charging device at a charging station, amusement equipment, or an uninterruptible power supply. For example, the on-board charger 1 may be a power conversion device that converts AC power supplied from an external single-phase or three-phase AC power source into DC power and supplies the converted DC power to a load mounted on the vehicle. This load may be, for example, a battery, an inverter, a motor, or various electrical components.

[0017] Note that the mobile body that can be equipped with the on-board charger 1 (coil device) according to the present disclosure may be, for example, a passenger car, a freight vehicle, a van, a motorcycle, an electric kick scooter, construction machinery, agricultural machinery, an airplane, or any other mobile body configured to be driven or to drive its accessories (electrical equipment) using power from a battery. Examples of such electrical equipment include navigation systems, audio systems, air conditioners, power windows, defoggers, ECUs (Electronic Control Units), GPS (Global Positioning System) modules, and cameras. The battery of the mobile body may be any battery capable of storing power for driving the travel motor (main motor) and electrical equipment mounted on the mobile body, and any battery, such as a lithium-ion battery, a nickel-metal hydride battery, or an all-solid-state battery, may be used as appropriate.

[0018] The on-board charger 1 according to the present disclosure may be provided with, for example, a noise filter that suppresses (removes) noise from entering the on-board charger 1 from an external AC power supply and from leaking noise from the on-board charger 1 to the AC power supply. Furthermore, for example, a power conversion circuit is provided downstream of the noise filter that converts AC power supplied from an external single-phase or three-phase AC power supply via the noise filter into DC power and outputs the converted DC power to a battery. This power conversion circuit may be provided with, for example, a power factor correction (PFC) circuit that rectifies and smooths the AC voltage from the external AC power supply after noise removal by the noise filter to generate a DC voltage. Furthermore, for example, a DC-DC conversion circuit is provided downstream of the PFC circuit in the power conversion circuit that converts the DC voltage generated by the PFC circuit back into AC voltage and then rectifies and smooths the converted AC voltage to generate a DC voltage of an arbitrary set voltage.

[0019] Each component of the on-board charger 1, such as the noise filter, PFC circuit, and DC-DC conversion circuit, includes magnetic components such as a transformer (electrical transformer), a transformer-integrated printed circuit board, various inductors such as chokes, reactors, or assemblies including these components (e.g., the transformer assembly 2). In the present disclosure, a device such as a power conversion device incorporating these magnetic components is referred to as a coil device. That is, the on-board charger 1 and each component of the on-board charger 1, such as the noise filter, PFC circuit, and DC-DC conversion circuit (DC-DC converter), are examples of coil devices. Herein, a coil device incorporating magnetic components including a transformer may be referred to as a transformer device. Alternatively, a coil device and a transformer device may be collectively referred to as a transformer-coil device. The following description of the coil device according to the present disclosure continues, taking the on-board charger 1 as an example. In the on-board charger 1, when converting large currents and high voltages, the magnetic components generate a lot of heat. Therefore, there is a demand for technology that efficiently dissipates heat from the magnetic components incorporated in the on-board charger 1.

[0020] The magnetic components of the on-board charger 1 according to the present disclosure are arranged, for example, on the cooling surface 101 of the housing 11 of the on-board charger 1 for cooling purposes. As shown in FIGS. 1 to 4 , a transformer assembly 2 as an example of a magnetic component according to the present disclosure is arranged on the cooling surface 101 of the housing 11 in a state where some or all of the components, such as a transformer 4 (component body) and a metal case 5, are integrally assembled (modularized). The transformer assembly 2 is detachably fixed to the cooling surface 101 of the housing 11 by a fixing member 65 such as a screw. Note that the transformer assembly 2 may be fixed to the cooling surface 101 of the housing 11 by welding or by a non-detachable bonding using an adhesive. Here, the housing 11 according to the embodiment is an example of an external cooling member.

[0021] As shown in FIG. 4, a hole 15 for fixing the transformer assembly 2 with a fixing member 65 is provided on the cooling surface 101 side (-Z side) of the housing 11 of the on-board charger 1 according to the present disclosure. Also, as shown in FIGS. 2 and 3, a positioning pin 13 formed in a cylindrical or conical shape is provided on the cooling surface 101 side (-Z side) of the housing 11. The positioning pin 13 determines the position of the transformer assembly 2 on the cooling surface 101 of the housing 11. The positioning pin 13 extends from the cooling surface 101 on the cooling surface 101 side of the housing 11 in a direction away from the cooling surface 101 (-Z direction).

[0022] The magnetic components of the on-board charger 1 according to the present disclosure and the cooling surface 101 of the housing 11 are thermally connected. Here, being thermally connected means being configured to allow heat exchange. Heat transfer between the magnetic components of the on-board charger 1 and the cooling surface 101 of the housing 11 is achieved by, for example, thermal conduction, but other forms may be used in addition to or instead of thermal conduction. This heat transfer may also be achieved via other components of the on-board charger 1.

[0023] The housing 11 of the on-board charger 1 according to the present disclosure is formed of a metal material such as die-cast. The housing 11 of the on-board charger 1 constitutes a liquid-cooling type cooling mechanism that uses a coolant such as antifreeze as the working fluid. For example, a coolant flow path (not shown) extending in a direction (for example, horizontally) along the cooling surface 101 is formed inside the housing 11 of the on-board charger 1. In other words, the housing 11 of the on-board charger 1 has a flow path formed therein that runs within one surface (cooling surface).

[0024] The cooling mechanism of the on-board charger 1 according to the present disclosure may be configured to enable heat exchange between the cooling surface 101 of the housing 11 and, for example, the outside of the housing 11. This is not limited to a liquid-cooling (water-cooling) mechanism using a coolant such as antifreeze or water as the working fluid, and any other cooling method may be used as appropriate. For example, a forced-air cooling mechanism or a natural-air cooling mechanism using any gas such as air as the working fluid may be used. For example, a cooling mechanism using any refrigerant such as HFC (hydrofluorocarbon) as the working fluid may be used. Furthermore, the flow path for the working fluid, such as the coolant, formed in the housing 11 of the on-board charger 1 according to the present disclosure may branch in at least two directions within a single plane along the cooling surface. However, the flow path does not branch in a direction perpendicular to the cooling surface. In other words, if the housing 11 of the on-board charger 1 has an intersection where flow paths in at least two directions intersect, each flow path extends from the intersection in a direction parallel to the cooling surface but does not extend in a direction perpendicular to the cooling surface. In this way, in the on-board charger 1 according to the present disclosure, the cooling mechanism for the entire system is configured by a flow path that runs only within one plane inside the housing 11.

[0025] As shown in FIG. 4, a transformer assembly 2 as an example of a magnetic component according to the present disclosure includes a transformer 4, a metal case 5, a heat conductive member 61, and a potting material 63.

[0026] As shown in Fig. 4, a transformer 4 as an example of a component body of a magnetic component according to the present disclosure has multiple cores 41 and multiple windings 42. The multiple windings 42 are arranged in a space formed by the multiple cores 41. For example, the multiple windings 42 include a primary winding (coil) and a secondary winding (coil). Furthermore, as shown in Figs. 1 and 2, the transformer 4 as an example of a component body of a magnetic component according to the present disclosure has multiple connectors 45.

[0027] Each of the multiple connectors 45 electrically connects the transformer 4 and other electronic components of the on-board charger 1. In the transformer 4, each connector 45 is electrically connected to one of the windings 42. Each connector 45 has a pair of blades 46 electrically connected to a pair of leads 43 (see FIG. 7 ) of each winding 42 of the transformer 4. Here, the pair of leads 43 of each winding 42 are portions extending from both ends of each winding 42, and include a lead extending from the "winding start" and a lead extending from the "winding end" of each winding 42. One of the multiple connectors 45 is electrically connected to the primary-side circuit configuration of the circuit configuration including the transformer 4 of the on-board charger 1. The other of the multiple connectors 45 is electrically connected to the secondary-side circuit configuration.

[0028] For example, the input and output leads 43 (see FIG. 7) of the winding 42 on the -Z side in FIG. 4 are electrically connected to the input and output blades 46 of the connector 45 that are disposed through the notch 53 in the front portion 502 of the metal case 5, as shown in FIGS. 1 and 2. For example, the input and output leads 43 of the winding 42 on the +Z side in FIG. 4 are electrically connected to the input and output blades 46 of the connector 45 that are disposed through the notch 53 in the rear portion 504 of the metal case 5, as shown in FIG. 2.

[0029] The heat dissipation structure 3 according to the present disclosure can be applied to various coils formed by winding wires 42, such as copper wire, in the same phase around a core 41 made of a magnetic material. In other words, the number of winding wires 42 in the magnetic component according to the present disclosure can be changed as appropriate. For example, the heat dissipation structure 3 according to the present disclosure may be applied to a three-phase, four-wire common mode choke coil made up of four winding wires.

[0030] Furthermore, in the magnetic component according to the present disclosure, the shape of the core 41 is arbitrary, and various core shapes can be used as appropriate. Furthermore, the core 41 may be formed of a single core 41, or may be formed by assembling (connecting) multiple cores 41 as shown in FIG.

[0031] For example, in the example of FIG. 4, the core 41 is configured by assembling one T-shaped core, two U-shaped cores, and one C-shaped core (shunt core).

[0032] For example, the T core is disposed on the side (-Z side) of the top surface 501 of the metal case 5. As shown in FIG. 4, the T core has a T-shaped cross section and includes a rectangular flat plate portion parallel to the XY plane and a columnar portion extending cylindrically from the center of the flat plate portion toward the +Z side. Two U cores are disposed on the opposite side (+Z side) of the top surface 501 of the T core, on the side (+Y side) of the front surface 502 of the metal case 5 and the side (-Y side) of the back surface 504. As shown in FIG. 4, each U core has a U-shaped cross section and includes a rectangular flat plate portion parallel to the XY plane and a recessed portion recessed semi-cylindrically from the -Z side to the +Z side in the center of the flat plate portion. In other words, when two U cores are assembled, they have a shape similar to a rectangular flat plate with a cylindrical shape hollowed out. Therefore, when one T core and two U cores are assembled, a cylindrical space extending in the Z direction is formed inside them.

[0033] An R core formed as a circular plate is placed in the cylindrical space formed by one T core and two U cores. The multiple windings 42 of the transformer 4 are also formed in a circular shape and are arranged in the Z direction via the R core.

[0034] 5 and 6 are perspective views showing an example of the configuration of the metal case 5 of FIG. 1. The metal case 5 is formed using a plate-shaped member made of a material with heat dissipation (thermal conductivity). The metal case 5 is formed into a box shape by bending a plate-shaped member made of a material with high heat dissipation (thermal conductivity), such as metal, for example, by performing bending processing (e.g., press processing). Specifically, the metal case 5 is formed into a box shape with one side open, and is a box-shaped member that covers the transformer 4, which is an example of a component main body. As an example, the metal case 5 is formed from a metal material such as aluminum or die-cast. Note that the metal case 5 is not limited to metal, and may be formed from a carbon-based material such as graphite. Here, the metal case 5 according to the embodiment is an example of a box-shaped member.

[0035] 5 and 6, the metal case 5 has a top surface portion 501, a front surface portion 502, a left side surface portion 503, a rear surface portion 504, and a right side surface portion 505. In the description of this disclosure, when the front surface portion 502, the left side surface portion 503, the rear surface portion 504, and the right side surface portion 505 are not to be distinguished from one another, they may be collectively referred to as "side surfaces."

[0036] Top surface portion 501 is a plate-like portion that constitutes the -Z side of metal case 5. Front surface portion 502 is a plate-like portion that extends in the +Z direction from the +Y side end of top surface portion 501. Left side surface portion 503 is a plate-like portion that extends in the +Z direction from the -X side end of top surface portion 501. Back surface portion 504 is a plate-like portion that extends in the +Z direction from the -Y side end of top surface portion 501. Right side surface portion 505 is a plate-like portion that extends in the +Z direction from the +X side end of top surface portion 501.

[0037] Two adjacent side surfaces of the metal case 5 are joined by welding or an adhesive (not shown), or the gap therebetween is filled with a sealant (not shown). These adhesives and sealants preferably have thermal conductivity. The +Z side end of each side surface of the metal case 5 forms an opening 507. In other words, the metal case 5 is formed in a box shape that opens toward the +Z side, with the top surface 501 as the bottom.

[0038] In addition, at least two adjacent portions of the top surface portion 501, front surface portion 502, left side surface portion 503, back surface portion 504, and right side surface portion 505 may be formed as different members and then joined by welding or adhesive (not shown).

[0039] At least two adjacent portions of the top surface portion 501, the front surface portion 502, the left side surface portion 503, the back surface portion 504, and the right side surface portion 505 may be formed by, for example, bending (e.g., pressing).

[0040] As an example, front surface portion 502 may be a plate-shaped portion extending to the +X side from the Y+ side end of left side surface portion 503 which extends in the +Z direction from the -X side end of top surface portion 501.

[0041] As another example, front surface portion 502 may be formed by a plate-shaped first portion extending to the +X side from the Y+ side end of left side surface portion 503, which extends in the +Z direction from the -X side end of top surface portion 501, and a plate-shaped second portion extending to the -X side from the Y+ side end of right side surface portion 505, which extends in the +Z direction from the +X side end of top surface portion 501.

[0042] As another example, it may be formed by a plate-shaped first portion extending toward the +X side from the Y+ side end of left side surface portion 503, which extends in the +Z direction from the -X side end of top surface portion 501, a plate-shaped second portion extending toward the -X side from the Y+ side end of right side surface portion 505, which extends in the +Z direction from the +X side end of top surface portion 501, and a plate-shaped third portion extending in the +Z direction from the +Y side end of top surface portion 501.

[0043] 1 to 6, fixed portions 51 (heat dissipation portions) are formed on each of left side surface portion 503 and right side surface portion 505 of metal case 5, for example, by bending (e.g., pressing). Specifically, fixed portion 51 formed on left side surface portion 503 is a plate-like portion that extends from the +Z side end of left side surface portion 503 to the -X side along the XY plane. Fixed portion 51 formed on right side surface portion 505 is a plate-like portion that extends from the +Z side end of right side surface portion 505 to the +X side along the XY plane.

[0044] As shown in FIGS. 4 to 6 , each fixing portion 51 has a hole 511 formed therein. When the transformer assembly 2 is placed at a predetermined position on the cooling surface 101 of the housing 11, the hole 511 of each fixing portion 51 coincides with the position of the corresponding hole 15 of the housing 11 in the XY plane. For example, when the transformer assembly 2 is placed at a predetermined position on the cooling surface 101 of the housing 11, the transformer assembly 2 is fastened to the housing 11 by a fixing member 65 such as a screw that passes through the hole 511 of each fixing portion 51 and is inserted into the hole 15 of the housing 11. As a result, the fixing portion 51 of the metal case 5 is pressure-bonded to the cooling surface 101 of the housing 11 and thermally connected thereto. In other words, the surface of the fixing portion 51 opposite to the top surface 501 (the +Z side) forms the heat dissipation surface 301 of the transformer assembly 2 (see FIG. 8 ).

[0045] A heat conducting member 61 may be provided between the fixing portion 51 of the metal case 5 and the cooling surface 101. This heat conducting member 61 may be a part of the heat conducting member 61 provided between the transformer core 41 and the cooling surface 101, or may be another heat conducting member 61 formed independently using a thermal interface material or the like. The positions and number of the holes 511 in each fixing portion 51 can be changed as appropriate.

[0046] As shown in FIGS. 2, 5, and 6, each fixing portion 51 has a hole 512 formed therein. The hole 512 of each fixing portion 51 fits into a corresponding positioning pin 13 of the housing 11, thereby defining a predetermined position on the cooling surface 101 of the housing 11 where the transformer assembly 2 is to be placed. For example, the hole 512 formed in the fixing portion 51 of the right side surface 505 is slightly larger than the outer shape of the positioning pin 13 of the housing 11. On the other hand, the hole 512 formed in the fixing portion 51 of the left side surface 503 is larger than the hole 512 formed in the fixing portion 51 of the right side surface 505. This defines the position of the transformer assembly 2 on the cooling surface 101 of the housing 11, while absorbing misalignment between the hole 511 of the metal case 5 and the hole 15 of the housing 11, which may be caused by variations during manufacturing, for example. The positions and number of the holes 512 in each fixing portion 51 can be changed as appropriate.

[0047] 1 and 5 to 6, notch portions 53 are formed in each of front portion 502 and rear portion 504 of metal case 5 by, for example, cutting or punching (for example, pressing). Specifically, notch portion 53 formed in front portion 502 is a portion recessed from a part of the end portion (for example, the center) on the +Z side of front portion 502 toward the -Z side along the ZX plane. Notch portion 53 formed in rear portion 504 is a portion recessed from a part of the end portion (for example, the center) on the +Z side of rear portion 504 toward the -Z side along the ZX plane.

[0048] 1 and 2, in the transformer assembly 2, a connector 45 is disposed in each cutout 53, penetrating the cutout 53. Therefore, the position and size of each cutout 53 are determined by the arrangement and outer shape of the connector 45 of the transformer 4.

[0049] The arrangement of the fixing portion 51 and the cutout portion 53 on each side portion of the metal case 5 can be changed as appropriate depending on the routing of the winding 42 of the transformer 4, i.e., the position of the leads 43, the shape of the housing 11, the arrangement of other components of the transformer assembly 2 of the vehicle charger 1, etc.

[0050] As an example, the fixing portions 51 may be provided on any two portions of the side surface of the metal case 5, and the notches 53 may be provided on the other two portions.

[0051] As another example, the notch 53 may be provided in one of the side surfaces of the metal case 5, and the fixing portion 51 may be provided in at least one of the other three portions. In other words, in the transformer assembly 2, the two connectors 45 may be provided on one side surface of the metal case 5.

[0052] As another example, at least one of the side surfaces of the metal case 5 may be provided with both the fixing portion 51 and the notch portion 53.

[0053] As another example, the notch 53 may be provided as a hole at another position on the top surface 501 of the metal case 5 or at the end of the side surface (portion on the +Z side).

[0054] 4, in the transformer assembly 2, the transformer 4 is disposed inside the metal case 5. That is, the transformer assembly 2 has a structure in which the periphery of the transformer 4 is covered by the box-shaped metal case 5 made of a metal material. With this configuration, the metal case 5 can function as a case that shields against external electromagnetic noise, dissipates heat from the transformer 4, and fixes the transformer 4 to the housing 11.

[0055] Note that the metal case 5 may be fixed to the housing 11 by components of the on-board charger 1 or the transformer assembly 2 outside the metal case 5. For example, the transformer assembly 2 including the metal case 5 may be biased by an elastic member such as a spring, that is, fixed by a spring press against the housing 11. In other words, the fixing portion 51 is not an essential component of the metal case 5, and may not be provided.

[0056] As one example, the end portion of at least one side surface of the metal case 5 on the side of the opening 507 may itself function as a heat dissipation portion that is thermally connected, for example, in contact with the cooling surface 101 of the housing 11 when the metal case 5 is attached to the housing 11. As another example, instead of the fixing portion, the metal case 5 may be provided with a heat dissipation portion similar to the fixing portion 51 except that it does not have the holes 511, 512. In this way, the metal case 5 may function as a case that both shields against electromagnetic noise to the outside and dissipates heat from the transformer 4.

[0057] As another example, metal case 5 may be provided with a heat dissipation section similar to fixed section 51, but without hole 511, instead of the fixed section. In this case, hole 512 may be formed in the heat dissipation section, which may function as a positioning section that determines the position of metal case 5 in housing 11. In other words, metal case 5 may function as a case that shields against external electromagnetic noise, dissipates heat from transformer 4, and positions metal case 5 in housing 11.

[0058] The first main surface (-Z side surface) of the transformer 4 is in contact with and thermally connected to the top surface 501 of the metal case 5 while it is disposed inside the metal case 5. Specifically, the -Z side surface (first main surface) of the core 41 (e.g., a T-core) of the transformer 4 and the +Z side surface of the top surface 501 of the metal case 5 are thermally connected. As a result, heat from the core 41 is transported from the top surface 501 through each side surface to the fixed part 51 by, for example, thermal conduction. That is, in the transformer assembly 2, the heat from the core 41 is routed to the surface (the +Z side surface of the fixed part 51) along the cooling surface 101 of the housing 11 in which the horizontal flow path is formed.

[0059] The thermal conductive member 61 is made of a thermal interface material (TIM). The thermal conductive member 61 may be any material that fills the gap between the transformer 4 and the cooling surface 101 of the housing 11 to reduce contact thermal resistance, and may be formed in various forms such as a gap filler, a heat dissipation pad, thermally conductive grease, or potting.

[0060] 4, the heat conduction member 61 is disposed on the second main surface of the transformer 4 on the side of the opening 507 (+Z side) of the metal case 5 of the transformer assembly 2. That is, the heat conduction member 61 is disposed between the transformer 4 and the cooling surface 101 of the housing 11 when the transformer assembly 2 is disposed in a predetermined position on the cooling surface 101 of the housing 11. Specifically, the heat conduction member 61 reduces the contact thermal resistance in the heat transport path between the +Z side surface (second main surface) of the core 41 (e.g., U core) of the transformer 4 and the cooling surface 101 of the housing 11.

[0061] The potting material 63 is formed of a heat dissipation buffer material that has at least heat dissipation (thermal conductivity) and electrical insulation properties. As shown in FIG. 4 , the potting material 63 is filled inside the metal case 5. That is, the potting material 63 functions as a heat dissipation path for transporting heat from the transformer 4. Specifically, the potting material 63 transports heat from the core 41 and each winding 42 of the transformer 4 to the housing 11 through the metal case 5 and the heat conductive member 61. The potting material 63 is filled inside the metal case 5 through the opening 507 in a state where the top surface 501 of the metal case 5 is positioned below the opening 507 in the direction of gravity, for example, with the +Z direction being the direction of gravity. The potting material 63 is filled in the gap between the transformer 4 and the metal case 5. The potting material 63 is also filled inside the transformer 4, such as between the multiple cores 41 and between each core 41 and each winding 42.

[0062] Each part of the transformer 4 is held by a potting material 63. That is, the potting material 63 functions as a fixing member that fixes the transformer 4 disposed inside the metal case 5. Note that if an insulating treatment is applied to each component of the transformer 4 or if a sufficient insulating distance is ensured, the potting material 63 does not need to have electrical insulation properties.

[0063] Here, a method for manufacturing the transformer assembly 2 according to the present disclosure will be described with reference to the drawings.

[0064] 7 and 8 are diagrams for explaining an example of an assembly process for the transformer assembly 2 according to the embodiment.

[0065] Prior to the assembly process, a plate-shaped member made of a material with high heat dissipation (thermal conductivity), such as metal, is bent while forming notches 53 to form a box-shaped metal case 5, as shown in FIGS. 5 and 6. Then, gaps between adjacent side surfaces of the metal case 5 are filled by joining them with welding or an adhesive (not shown), or by filling them with a sealing material (not shown). These steps may be performed as part of the assembly process of the transformer assembly 2.

[0066] (First pattern) First, the transformer 4 is placed inside the metal case 5 with the top surface 501 of the metal case 5 positioned below the opening 507 in the direction of gravity (see FIG. 6). Next, with the transformer 4 placed inside the metal case 5 (see FIG. 7), the potting material 63 is filled into the metal case 5 through the opening 507. Thereafter, the potting material 63 is allowed to penetrate into the transformer 4 inside the metal case 5.

[0067] (Second pattern) First, with the top surface 501 of the metal case 5 positioned below the opening 507 in the direction of gravity (see FIG. 6), the inside of the metal case 5 is filled with potting material 63 through the opening 507. Next, the transformer 4 is placed inside the metal case 5 filled with the potting material 63 (see FIG. 7). Thereafter, the potting material 63 is allowed to penetrate into the transformer 4 inside the metal case 5.

[0068] (Third pattern) First, with the top surface 501 of the metal case 5 positioned lower in the direction of gravity than the opening 507 (see FIG. 6), the inside of the metal case 5 is filled with potting material 63 through the opening 507. Next, the transformer 4 is placed inside the metal case 5 filled with the potting material 63 (see FIG. 7). After that, the potting material 63 is left to permeate into the transformer 4 inside the metal case 5. After the potting material 63 has permeated into the transformer 4, additional potting material 63 is filled into the inside of the metal case 5 through the opening 507.

[0069] In this way, the transformer 4 and the potting material 63 are placed inside the metal case 5 by any of the processes of the first to third patterns. As a result, the transformer assembly 2 is in a state where each part of the transformer 4 is held by the potting material 63 inside the metal case 5 and is thermally connected to the metal case 5.

[0070] As an example, with the top surface 501 of the metal case 5 positioned lower than the opening 507 in the direction of gravity, the potting material 63 is filled from the internal space of the transformer 4 to the opening 507 side (+Z side). For example, the potting material 63 is filled from the back surface of the core 41 (e.g., a U-core) to the opening 507 side (+Z side). Here, the back surface of the core 41 refers to, for example, the bottom surface of a recess formed in the U-core. For example, with the top surface 501 of the metal case 5 positioned lower than the opening 507 in the direction of gravity, the potting material 63 is filled from the internal cylindrical space of the transformer 4 formed by the core 41 to the opening 507 side (+Z side).

[0071] As an example, the potting material 63 is filled from the cutout portion 53 of the metal case 5 to the side of the top surface portion 501 (-Z side) in a state where the top surface portion 501 of the metal case 5 is positioned lower in the direction of gravity than the opening 507. Note that when the potting material 63 is filled in a state where the connector 45 is attached to the cutout portion 53 and the gap between the cutout portion 53 and the connector 45 is filled with a sealant, adhesive, or the like, the potting material 63 may be filled from the cutout portion 53 to the side of the opening 507 (+Z side).

[0072] As an example, the potting material 63 is filled from the end of the metal case 5 on the opening 507 side to the top surface 501 side (-Z side) with the top surface 501 of the metal case 5 positioned below the opening 507 in the direction of gravity.

[0073] In the case of a last-in installation method (first pattern) in which the potting material 63 is filled after the transformer 4 is placed, the potting material 63 can be filled to the very limit, but it takes time to fill. In the case of a first-in installation method (second pattern) in which the potting material 63 is filled first and then the transformer 4 is placed, the filling time can be shortened compared to the first pattern, but it is difficult to fill the potting material 63 to the very limit. Therefore, it is preferable to use a third pattern process that combines first-in installation and last-in installation, which shortens the filling time and enables the potting material 63 to be filled to the very limit.

[0074] 8, the heat conductive member 61 is attached to the side of the core 41 of the transformer 4 where the opening 507 is located (upward in the direction of gravity). The surface of the heat conductive member 61 opposite to the core 41 (+Z side) forms the heat dissipation surface 301 of the transformer assembly 2 together with the surface of the fixing part 51 facing the opening 507 (+Z side). For example, when attached to the transformer assembly 2, the surfaces of the fixing part 51 and the heat conductive member 61 facing the opening 507 (+Z side) are located within a single plane (XY plane). For example, the surface of the connector 45 facing the opening 507 (+Z side) is located within the heat dissipation surface 301, or is located closer to the upper surface 501 than the heat dissipation surface 301 (-Z side).

[0075] The connector 45 of the transformer 4 may be assembled to the transformer 4 before the potting material 63 is filled, or after the potting material 63 is filled.

[0076] The transformer assembly 2 thus assembled is then attached to the housing 11 with its heat dissipation surface 301 facing the cooling surface 101 of the housing 11. In other words, the attachment direction (+Z direction) in which the transformer assembly 2 according to the present disclosure is attached to the housing 11 is different from the filling direction (-Z direction) of the potting material 63 in the assembling process of the transformer assembly 2.

[0077] As described above, the heat dissipation structure 3 according to the present disclosure has a metal case 5 formed in a box shape with one side open, which covers a transformer 4 as an example of a component body. Furthermore, the transformer assembly 2 as an example of a magnetic component according to the present disclosure has the heat dissipation structure 3, which enables heat from the transformer 4 to be dissipated by routing it to the heat dissipation surface 301 using the metal case 5. This heat dissipation surface 301 faces and is thermally connected to the cooling surface 101 of the housing 11 when the transformer assembly 2 is assembled in the housing 11.

[0078] 9 is a diagram illustrating the miniaturization of a transformer assembly 2 using a heat dissipation structure 3 according to an embodiment. FIG. 9 illustrates a transformer assembly 2 having a heat dissipation structure 3 according to the present disclosure, as well as a comparative example of a transformer assembly 9 that does not have the heat dissipation structure 3 according to the present disclosure.

[0079] As described above, by filling the potting material 63 from the side of the opening 507 with the top surface 501 of the metal case 5 positioned below the opening 507 in the direction of gravity, the potting material 63 can also be filled into the gap between the top surface 501 of the metal case 5 and the core of the transformer 4 arranged inside the metal case 5. That is, in the heat dissipation structure 3 according to the present disclosure, the top surface 501 of the metal case 5 and the transformer 4 arranged inside the metal case 5 are thermally connected directly or via the potting material 63. This allows heat from the portion far from the cooling surface 101, i.e., the side of the top surface 501 of the transformer 4 (-Z side), to be drawn by the metal case 5 to the heat dissipation surface 301 (the surface on the +Z side of the fixing portion 51).

[0080] On the other hand, in the transformer assembly 9 of the comparative example, the metal case 91 has a bottom surface portion (flat portion on the +Z side) and a side surface portion. That is, in the metal case 91 of the comparative example, an opening is provided in a portion (portion on the -Z side) that corresponds to the top surface portion 501 according to the present disclosure when the transformer assembly 9 is assembled to the housing 11. In this configuration, the bottom surface portion of the metal case 91 is thermally connected to the cooling surface 101 of the housing 11 via the thermal conductive member 61. In addition, the potting material 63 is filled from the opening side (-Z side) with the bottom surface portion (portion on the +Z side) of the metal case 91 positioned lower than the opening in the direction of gravity.

[0081] In the transformer assembly 9 of the comparative example, a heat sink 92 must be provided in addition to the metal case 91 to dissipate heat from the opening side (-Z side) of the transformer 4. This heat sink 92 is, for example, an L-shaped metal plate, but it may also be a U-shaped metal plate or a box-shaped metal plate with one side open. The heat sink 92 is thermally connected to the opening side (-Z side) of the transformer 4 via a potting material 63 or a heat conduction member 61 for reducing contact thermal resistance. The heat sink 92 transports heat from the transformer 4 on the opening side (-Z side) to the potting material 63 on the heat dissipation surface 301 side.

[0082] Therefore, in the direction (Z direction) perpendicular to the heat dissipation surface 301, the height H1 of the transformer assembly 2 having the heat dissipation structure 3 according to the present disclosure can be made lower than the height H2 of the transformer assembly 9 of the comparative example that requires the heat sink 92. Specifically, with the heat dissipation structure 3 according to the present disclosure, the transformer assembly 2 can be made smaller by the thickness of the heat conduction member 61 and the heat sink 92 without impairing the heat dissipation performance of the portion far from the cooling surface 101 in the direction (Z direction) perpendicular to the heat dissipation surface 301.

[0083] In addition, in the heat dissipation structure 3 of the present disclosure, heat from the side (-Z side) of the top surface 501 of the transformer 4 is transported by the metal case 5 from the top surface 501 through each side surface portion to the fixed portion 51, and is thereby drawn to the heat dissipation surface 301.

[0084] On the other hand, in the comparative example transformer assembly 9, the other end of the heat sink 92 that is thermally connected to the transformer 4 is positioned to the side of the transformer 4 in order to route heat from the opening side (-Z side) of the transformer 4 to the heat dissipation surface 301.

[0085] Therefore, in the horizontal plane (XY plane) parallel to the heat dissipation surface 301, the width W1 of the transformer assembly 2 having the heat dissipation structure 3 according to the present disclosure can be made smaller than the width W2 of the transformer assembly 9 of the comparative example that requires the heat sink 92. Specifically, with the heat dissipation structure 3 according to the present disclosure, the transformer assembly 2 can be made smaller in size in the horizontal plane (XY plane) parallel to the heat dissipation surface 301 by the thickness of the two heat sinks 92 and the potting material 63.

[0086] Furthermore, in the heat dissipation structure 3 according to the present disclosure, the filling direction (-Z direction) of the potting material 63 into the metal case 5 differs from the mounting direction (+Z direction) of the transformer assembly 2 to the housing 11. Therefore, according to the heat dissipation structure 3 according to the present disclosure, the notch 53 can be provided on the upper side in the filling direction (-Z direction) of the potting material 63, i.e., on the lower side (+Z side) in the mounting direction (+Z direction) to the housing 11. Furthermore, potting can be performed during the assembly process of the transformer assembly 2 to form the transformer assembly 2 into a subunit. Furthermore, a connector 45 can be attached to this subunit transformer assembly 2 and attached to the housing 11. Furthermore, potting can be eliminated during the process of attaching the transformer assembly 2 to the housing 11.

[0087] On the other hand, in the transformer assembly 9 of the comparative example, the filling direction (+Z direction) of the potting material 63 into the metal case 91 coincides with the mounting direction (+Z direction) of the transformer assembly 9 to the housing 11. Therefore, in the transformer assembly 9 of the comparative example, the connection portion that electrically connects the transformer 4 to the circuit configuration of the on-board charger 1 is provided on the opening side (-Z side) of the metal case 91. Furthermore, if the transformer assembly 9 of the comparative example has a substantially cylindrical metal case 91 that does not have a bottom surface portion (flat portion on the +Z side), the height H2 in the direction perpendicular to the heat dissipation surface 301 (Z direction) can be reduced to approximately the same as the height H1 of the transformer assembly 2 having the heat dissipation structure 32 according to the present disclosure. Alternatively, by forming a recessed bathtub structure in part of the housing 11 and filling the potting material 63 with the transformer 4 placed in the bathtub structure, the height H2 in the direction perpendicular to the heat dissipation surface 301 (Z direction) can be reduced to approximately the same as the height H1 of the transformer assembly 2 having the heat dissipation structure 32 according to the present disclosure. However, in these cases, potting must be performed in the process of attaching the device to the housing 11.

[0088] Therefore, with the heat dissipation structure 3 according to the present disclosure, the connector 45 for electrically connecting the transformer 4 to the circuit configuration of the on-board charger 1 can be disposed on the housing 11 side, thereby improving the degree of freedom in arranging each part of the on-board charger 1. Of course, the transformer assembly 2 having the heat dissipation structure 3 according to the present disclosure may have the connector 45 disposed on the side of the top surface 501 (-Z side). Furthermore, the transformer assembly 2 can be divided into sub-units by potting during the assembly process of the transformer assembly 2. Furthermore, the connector 45 can be assembled to this sub-unit transformer assembly 2 and attached to the housing 11. Furthermore, potting can be eliminated during the process of attaching the transformer assembly 2 to the housing 11.

[0089] Furthermore, the heat dissipation structure 3 according to the present disclosure pots the transformer 4 disposed inside the box-shaped metal case 5. Therefore, the heat dissipation structure 3 according to the present disclosure facilitates insulation from the housing 11, i.e., ensures insulation, similar to the case where the transformer assembly 9 of the comparative example has a substantially cylindrical metal case 91 without a bottom surface (a flat portion on the +Z side) or where a recessed bathtub structure is formed in part of the housing 11. Furthermore, since the potting material 63 can be cured for each magnetic component, including the transformer assembly 2, productivity can be improved. Furthermore, a vacuum device for filling the potting material 63 can be made cheaper and easier to apply, reducing costs for stabilizing filling quality. Furthermore, the potting material 63 can hold the main body of the component disposed inside the metal case 5, such as the transformer 4, and thus vibration control for the onboard charger 1 can be achieved while reducing the number of vibration control structures, such as support members and fixing members, such as molds.

[0090] Furthermore, if the filling direction (-Z direction) of the potting material 63 into the metal case 5 differs from the mounting direction (+Z direction) of the transformer assembly 2 to the housing 11, the positions of the components of the transformer assembly 2 on the heat dissipation surface 301 side (+Z side) may not fit within a range that can be considered to be a single plane, or it may not be easy to do so, due to variations in the machining accuracy of the core 41 of the transformer 4, the assembly accuracy of the transformer 4, and the machining accuracy of the metal case 5. If the positions of the components of the transformer assembly 2 on the heat dissipation surface 301 side (+Z side) do not fit within a range that can be considered to be a single plane, contact thermal resistance may increase when the transformer assembly 2 is mounted to the housing 11, potentially reducing the heat dissipation efficiency of the transformer 4. In light of this, in the heat dissipation structure 3 according to the present disclosure, a thermally conductive member 61 is disposed on the heat dissipation surface 301 side (+Z side) of the transformer assembly 2, i.e., on the side of the opening 507 of the transformer 4. This allows the contact thermal resistance to be reduced when the transformer assembly 2 is attached to the housing 11, even if the filling direction (-Z direction) of the potting material 63 into the inside of the metal case 5 is different from the attachment direction (+Z direction) of the transformer assembly 2 to the housing 11.

[0091] According to at least one of the embodiments described above, it is possible to reduce the size of magnetic components such as the transformer assembly 2 mounted on a coil device of an on-board charger 1 (power conversion device) or the like.

[0092] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents.

[0093] (Addendum) The above description of the embodiments discloses the following techniques. (1) a component body to be subjected to heat dissipation; a box-shaped member formed using a thermally conductive plate-like member in a box shape with one side open, the box-shaped member having an opening, an upper surface portion facing the opening, a plurality of side surfaces extending from the upper surface portion to the opening, and a heat dissipation portion formed at an end portion of at least one of the plurality of side surfaces on the opening side; a potting material that has at least thermal conductivity and is filled into the box-shaped member through the opening, the top surface portion of the box-shaped member is thermally connected to a first main surface of the component body, the box-shaped member forms a heat dissipation path that transports heat from the component body via the upper surface portion to the heat dissipation portion by thermal conduction; Magnetic parts. (2) the heat dissipation portion extends from an end portion of at least one of the side surface portions on the opening side along the top surface portion, a surface of the heat dissipation portion opposite to the upper surface portion forms a heat dissipation surface; The magnetic component according to (1) above. (3) the heat dissipation portion of the box-shaped member is a fixing portion that fixes the box-shaped member, which is attached to an external cooling member in an attachment direction different from a filling direction of the potting material from the opening toward the upper surface portion, to the external cooling member. The magnetic component according to (2) above. (4) the heat dissipation portion of the box-shaped member is a positioning portion that defines a position of the box-shaped member on the external cooling member, the box-shaped member being attached to the external cooling member in an attachment direction that is different from a filling direction of the potting material from the opening toward the upper surface portion. The magnetic component according to (2) or (3) above. (5) a thermal conduction member formed of a thermal interface material and disposed on a second main surface of the component body opposite the first main surface; a surface of the heat conduction member opposite to the second main surface of the component body, together with a surface of the heat dissipation portion opposite to the top surface portion, forming a heat dissipation surface; The magnetic component according to any one of (1) to (4) above. (6) the potting material is filled into the box-shaped member through the opening in a state in which the upper surface of the box-shaped member is positioned lower than the opening in the direction of gravity and the component main body is disposed inside the box-shaped member. The magnetic component according to any one of (1) to (5) above. (7) The potting material is filled from the internal space of the component body arranged inside the box-shaped member to the opening side. The magnetic component according to any one of (1) to (6) above. (8) At least one of the side surface portions has a notch recessed from an end portion on the opening side toward the top surface portion. The magnetic component according to any one of (1) to (7) above. (9) a connector disposed through the notch and electrically connecting the component body to an external device; The magnetic component according to (8) above. (10) The potting material is filled from the notch portion to the upper surface portion side. The magnetic component according to (8) or (9) above. (11) The component body is a transformer or a coil. A magnetic component according to any one of (1) to (10) above. (12) The magnetic component according to any one of (1) to (11) above, a housing having a flow path for a cooling liquid formed therein, the flow path running within one plane; When the magnetic component is attached to the housing, the heat dissipation portion of the magnetic component is thermally connected to the housing. Coil device. (13) A power supply circuit including a plurality of electronic components including the magnetic component according to any one of (1) to (11) above, which converts AC power supplied from an external single-phase or three-phase AC power source into DC power and outputs the converted DC power. Coil device (on-board charger). (14) The power converter is configured by a plurality of electronic components including the magnetic component, converts AC power supplied from an external single-phase or three-phase AC power source into DC power, and outputs the converted DC power. The coil device (on-board charger) according to (12) above. (15) A power supply / transformer including a plurality of electronic components including the magnetic component according to any one of (1) to (11) above, converting input DC power into DC power of a predetermined voltage value, and outputting the converted DC power. Coil device (DCDC converter). (16) The power converter is configured by a plurality of electronic components including the magnetic component, converts input DC power into DC power of a predetermined voltage value, and outputs the converted DC power. The coil device (DC-DC converter) according to (12) above. (17) A coil device according to any one of (12) to (16) above; a battery that is charged using the DC power converted by the coil device. vehicle. (18) a component body to be heat dissipated is disposed inside the box-shaped member, the component body being formed using a thermally conductive plate-like member and having one open side, the box-shaped member having an opening, a top surface portion facing the opening, a plurality of side surfaces extending from the top surface portion to the opening, and a heat dissipation portion formed at an end portion of at least one of the plurality of side surfaces on the opening side; a potting material having at least thermal conductivity is filled into the box-shaped member in which the component main body is disposed through the opening; The potting material is allowed to penetrate into the component body, the top surface portion of the box-shaped member is in contact with and thermally connected to a first main surface of the component body, the box-shaped member forms a heat dissipation path that transports heat from the component body via the upper surface portion to the heat dissipation portion by thermal conduction; Manufacturing methods for magnetic components. (19) a heat sink formed at an end of at least one of the side surfaces of the box-shaped member, the heat sink being formed at the opening side of the box-shaped member; the heat sink being formed at the opening side of the box-shaped member; and a heat sink being formed at the end of the box-shaped member, the heat sink being formed at the opening side of the box-shaped member. The heat sink is formed by using a plate-like member having thermal conductivity and having an opening, an upper surface portion facing the opening, a plurality of side surfaces extending from the upper surface portion to the opening, and a heat sink being formed at the end of at least one of the side surfaces of the box-shaped member. The heat sink is filled with a potting material having at least thermal conductivity from the opening side into the interior of the box-shaped member. A component body to be subjected to heat dissipation is placed inside the box-shaped member filled with the potting material; The potting material is allowed to penetrate into the component body, the top surface portion of the box-shaped member is in contact with and thermally connected to a first main surface of the component body, the box-shaped member forms a heat dissipation path that transports heat from the component body via the upper surface portion to the heat dissipation portion by thermal conduction; Manufacturing methods for magnetic components. (20) a heat sink formed at an end of at least one of the side surfaces of the box-shaped member, the heat sink being formed at the opening side of the box-shaped member; the heat sink being formed at the opening side of the box-shaped member; and a heat sink being formed at the end of the box-shaped member, the heat sink being formed at the opening side of the box-shaped member. The heat sink is formed by using a plate-like member having thermal conductivity and having an opening, an upper surface portion facing the opening, a plurality of side surfaces extending from the upper surface portion to the opening, and a heat sink being formed at the end of at least one of the side surfaces of the box-shaped member. The heat sink is filled with a potting material having at least thermal conductivity from the opening side into the interior of the box-shaped member. A component body to be subjected to heat dissipation is placed inside the box-shaped member filled with the potting material; The potting material is allowed to penetrate into the component body, The potting material is additionally filled into the inside of the box-shaped member through the opening, the top surface portion of the box-shaped member is in contact with and thermally connected to a first main surface of the component body, the box-shaped member forms a heat dissipation path that transports heat from the component body via the upper surface portion to the heat dissipation portion by thermal conduction; Manufacturing methods for magnetic components. [Explanation of symbols]

[0094] 1 On-board charger 11. Housing 13 Locating pin 15 Hole 101 Cooling surface 2 Transformer assembly (magnetic parts) 3 Heat dissipation structure 301 Heat radiation surface 4 Transformer (main body) 41 cores 42 windings 43 Lead 45 connector 46 Blades 5 Metal case 51 Fixed part 511 Hole 512 Hole 53 Cutout 501 Top part 502 Front 503 Left side part 504 Back section 505 Right side part 507 Opening 61 Thermal Conduction Materials 63 Potting material 65 Fixing member 9 Transformer assembly (magnetic parts) 91 Metal Case 92 Heat sink

Claims

1. a component body to be subjected to heat dissipation; a box-shaped member formed using a thermally conductive plate-like member in a box shape with one side open, the box-shaped member having an opening, an upper surface portion facing the opening, a plurality of side surfaces extending from the upper surface portion to the opening, and a heat dissipation portion formed at an end portion of at least one of the plurality of side surfaces on the opening side; a potting material having at least thermal conductivity and filled into the box-shaped member through the opening, the top surface portion of the box-shaped member is thermally connected to a first main surface of the component body, the box-shaped member forms a heat dissipation path that transports heat from the component body via the upper surface portion to the heat dissipation portion by thermal conduction; Magnetic parts.

2. the heat dissipation portion extends from an end portion of at least one of the side surface portions on the opening side along the top surface portion, a surface of the heat dissipation portion opposite to the upper surface portion forms a heat dissipation surface; The magnetic component according to claim 1 .

3. the heat dissipation portion of the box-shaped member is a fixing portion that fixes the box-shaped member, which is attached to an external cooling member in an attachment direction different from a filling direction of the potting material from the opening toward the upper surface portion, to the external cooling member. The magnetic component according to claim 2 .

4. the heat dissipation portion of the box-shaped member is a positioning portion that defines a position of the box-shaped member on the external cooling member, the box-shaped member being attached to the external cooling member in an attachment direction that is different from a filling direction of the potting material from the opening toward the upper surface portion. The magnetic component according to claim 2 .

5. a thermal conduction member formed of a thermal interface material and disposed on a second main surface of the component body opposite the first main surface; a surface of the heat conduction member opposite to the second main surface of the component body, which forms a heat dissipation surface together with a surface of the heat dissipation portion opposite to the top surface portion; The magnetic component according to claim 1 .

6. the potting material is filled into the box-shaped member through the opening in a state in which the upper surface of the box-shaped member is positioned lower than the opening in the direction of gravity and the component main body is disposed inside the box-shaped member. The magnetic component according to claim 1 .

7. The potting material is filled from the internal space of the component body arranged inside the box-shaped member to the opening side. The magnetic component according to claim 1 .

8. At least one of the side surface portions has a notch recessed from an end portion on the opening side toward the top surface portion. The magnetic component according to claim 1 .

9. a connector disposed through the notch and electrically connecting the component body to an external device; The magnetic component according to claim 8.

10. The potting material is filled from the notch portion to the upper surface portion side. The magnetic component according to claim 8.

11. The component body is a transformer. The magnetic component according to claim 1 .

12. A magnetic component according to any one of claims 1 to 11; a housing having a flow path for a cooling liquid formed therein, the flow path running within one plane; When the magnetic component is attached to the housing, the heat dissipation portion of the magnetic component is thermally connected to the housing. Coil device.

Citation Information

Patent Citations

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