Substrate pressing device, flux coating device, roller cleaning device, and substrate pressing method

Abstract

To provide a substrate pressing device capable of preventing foreign matter from adhering to the solder precoat.SOLUTION: A disclosed substrate pressing device 10 includes: a substrate support part 24 that supports a second main surface 80b of the substrate 80 from below, which has a first main surface 80a on which a plurality of solder precoats are formed and the second main surface 80b on the opposite side; a roller 32 that presses the substrate 80 supported by the substrate support part 24 from the first main surface 80a side; and a roller cleaning device 50 that cleans the surface of the roller 32.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a substrate pressing device, a flux application device, a roller cleaning device, and a substrate pressing method. [Background technology]

[0002] A conventional technique is known in which a solder precoat is formed on a land of a substrate, and then a tool (e.g., a roller) is pressed against the solder precoat (e.g., Patent Document 1). Patent Document 1 discloses "a mounting substrate manufacturing method for soldering terminals of electronic components to lands of a substrate, the method comprising: a paste placement step of placing solder paste on the lands; a melting and solidification step of melting and solidifying the solder paste to form a solder precoat on the lands; a destruction step of destroying residue covering the surface of the precoat by pressing a tool against the precoat; a flux placement step of placing flux on the precoat; a component mounting step of mounting the electronic component on the substrate with the terminals of the electronic component aligned with the precoat; and a reflow step of heating the substrate to melt the precoat and solder the terminals to the lands." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 054384 Summary of the Invention [Problem to be solved by the invention]

[0004] When the process of pressing a roller against the solder precoat is repeatedly performed, foreign matter (e.g., flux residue or solder dregs) that peels off from the surface of the solder precoat may adhere to the roller and then adhere to the solder precoat of the next or subsequent substrate to be processed. If foreign matter adheres to the solder precoat, it may become difficult to properly mount components or may result in defective products due to short circuits. In light of these circumstances, one of the objectives of the present disclosure is to prevent foreign matter from adhering to the solder precoat. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a substrate pressing device, which includes a substrate support part that supports from below a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and an opposite second main surface, a roller that presses the substrate supported by the substrate support part from the first main surface side, and a roller cleaning device that cleans the surface of the roller.

[0006] Another aspect of the present disclosure relates to a flux application device including: a substrate support part that supports from below a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and an opposite second main surface; a roller that presses the substrate supported by the substrate support part from the first main surface side; a flux application part that applies flux to the plurality of solder precoats on the substrate pressed by the roller; and a roller cleaning device that cleans the surface of the roller.

[0007] Another aspect of the present disclosure relates to a roller cleaning device that cleans a roller removed from a substrate pressing device that includes a roller that presses a plurality of solder precoats on a substrate having the plurality of solder precoats formed thereon, the roller cleaning device including: a roller mounting portion to which the roller is detachably mounted; and a roller cleaning portion that cleans a surface of the roller mounted on the roller mounting portion.

[0008] Another aspect of the present disclosure relates to a substrate pressing method, the substrate pressing method including: a substrate supporting step of supporting from below a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and an opposite second main surface; a pressing step of pressing the supported substrate from the first main surface side with a roller; and a roller cleaning step of cleaning a surface of the roller. [Effects of the Invention]

[0009] According to the present disclosure, adhesion of foreign matter to the solder precoat can be suppressed. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a front view schematically showing the configuration of a substrate pressing device according to a first embodiment. [Figure 2] FIG. 2 is a side view schematically showing the configuration of a pressing unit. [Figure 3] FIG. 2 is a side view schematically showing the configuration of the cleaning unit. [Figure 4] FIG. 10 is a schematic side view illustrating the operation of the cleaning unit. [Figure 5] FIG. 10 is a front view schematically showing the configuration of a flux application device according to a second embodiment. [Figure 6] FIG. 2 is a schematic front view for explaining the operation of the flux application device. [Figure 7] FIG. 11 is a front view schematically showing the configuration of a substrate pressing device and a roller cleaning device according to a third embodiment. [Figure 8] FIG. 2 is a side view schematically showing the configuration of a pressing unit. [Figure 9] FIG. [Figure 10] FIG. 4 is a schematic side view showing the cleaning unit with the roller unit attached. [Figure 11] FIG. 10 is a schematic side view illustrating the operation of the cleaning unit. DETAILED DESCRIPTION OF THE INVENTION

[0011] The following describes examples of embodiments of a substrate pressing device, a flux application device, a roller cleaning device, and a substrate pressing method according to the present disclosure. However, the present disclosure is not limited to the examples described below. While the following description may use specific numerical values ​​and materials, other numerical values ​​and materials may be used as long as the effects of the present disclosure are obtained.

[0012] (Substrate pressing device) A substrate pressing device according to the present disclosure is an apparatus for pressing a substrate on which a plurality of solder precoats have been formed, and includes a substrate support portion, a roller, and a roller cleaning device.

[0013] The substrate support section supports the second main surface of the substrate from below. In addition to supporting the second main surface of the substrate from below, the substrate support section may also support the substrate by sandwiching its side surfaces. A plurality of solder precoats are formed on the first main surface of the substrate. The substrate may be supported by the substrate support section with the first main surface facing upward and the second main surface facing downward. The substrate may have a plurality of lands, at least some of which may be formed with solder precoats. The solder precoats may be formed by applying solder paste to the lands and then melting and solidifying the solder paste. An oxidation prevention film (e.g., flux residue) may be formed on the surface of the solder precoats. The substrate may be transported into and out of an area where the substrate support section is present along a predetermined transport direction.

[0014] The roller presses the substrate supported by the substrate support section from the first main surface side (or from above). This pressing action may cause foreign matter (e.g., an antioxidant film peeled off from the surface or solder residue) to adhere to the surface of the solder precoat on the roller surface. The roller may be connected to a pressing mechanism that applies a downward force to the roller. The pressing mechanism may move the roller horizontally while applying a downward force to the roller. The direction in which the pressing mechanism or the roller moves horizontally may be a direction intersecting (e.g., a direction perpendicular to) the predetermined conveying direction. The roller may have a rotation axis that extends horizontally perpendicular to the horizontal movement direction and be able to roll around the rotation axis.

[0015] After the roller presses the first main surface of the substrate (more specifically, the multiple solder precoats formed on the first main surface), electronic components may be mounted and soldered onto the pressed solder precoats. The size of the electronic components may be, for example, 0.4 mm long x 0.2 mm wide, 0.3 mm long x 0.15 mm wide, 0.25 mm long x 125 mm wide, 0.2 mm long x 0.1 mm wide, or 0.1 mm long x 0.5 mm wide. For example, the electronic components may include electronic components specified by JIS (Japanese Industrial Standards), such as 0402, 03015, 0201, and 01005.

[0016] The roller cleaning device cleans the surface of the roller. The roller cleaning device may clean the surface of the roller by, for example, contacting the surface of the roller, suctioning the surface of the roller without contact, or blowing air onto the surface of the roller. In addition to removing foreign matter from the surface of the roller, the roller cleaning device may also suck up the removed foreign matter using any type of suction mechanism. The roller cleaning device may have an adhesive roller that removes foreign matter from the surface of the roller by adhesive force. The roller cleaning device may be fixedly installed at a predetermined position within the substrate pressing device, or may be configured to move to follow the moving roller. The roller cleaning device may clean the surface of the roller while the substrate is being transported into or out of the substrate pressing device.

[0017] In the substrate pressing device having the above-described configuration, the rollers press the multiple solder precoats formed on the first main surface of the substrate, and the roller cleaning device cleans the surface of the roller used for pressing. Even if foreign matter adheres to the roller surface during the pressing operation, the foreign matter can be removed by the roller cleaning device. Even when multiple substrates are processed continuously in the substrate pressing device, timely cleaning of the roller surface can prevent foreign matter from moving from the roller to the solder precoat (i.e., adhesion of foreign matter to the solder precoat). Such substrate pressing operation and roller cleaning operation can be performed by automatic control within a single substrate pressing device, eliminating the need for labor for roller cleaning and preventing a decrease in device operating rate. Furthermore, by performing cleaning when substrates are loaded and unloaded, the takt time can be prevented from being extended by the cleaning.

[0018] The roller cleaning device may have a cleaning member that contacts the surface of the roller. The type of cleaning member is not particularly limited, and examples include a scraper, paper, cloth, nonwoven fabric, a brush, and a sponge. In addition to the cleaning member, the roller cleaning device may have a suction mechanism for sucking up foreign matter removed from the surface of the roller. The cleaning member may have a length sufficient to clean the entire surface of the roller in one go (i.e., a length greater than or equal to the length of the roller), or may have a length less than the length of the roller.

[0019] The roller may have a shape extending along its rotation axis. The roller cleaning device may have a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while contacting a portion of the roller in the longitudinal direction. In this configuration, the cleaning member may have a dimension in the longitudinal direction of the roller that is less than the length of the roller. By cleaning the surface of the roller by contacting the cleaning member with a portion of the roller in the longitudinal direction, it is easier to properly contact the surface of the roller, and therefore foreign matter on the surface of the roller can be easily removed, compared to when a (larger) cleaning member is contacted over the entire longitudinal direction of the roller. Furthermore, because the contact area between the roller and the cleaning member is small, the force pressing them against each other does not need to be very large, thereby allowing the device to be made more compact.

[0020] The roller cleaning device may have a roller rotation unit that rotates the roller while it is in contact with the cleaning member. In this case, even if the roller itself does not have a rotation mechanism, the roller can be driven to rotate by the roller rotation unit. Furthermore, as the roller rotates, the part of the roller that comes into contact with the cleaning member changes, making it easy to clean the surface of the roller all around. However, the roller itself may have a rotation mechanism, in which case the roller rotation unit may be omitted.

[0021] (Flux application device) The flux application device according to the present disclosure is an apparatus that presses a substrate on which a plurality of solder precoats have been formed and applies flux to the solder precoats on the pressed substrate. The flux application device according to the present disclosure includes a substrate support unit, a roller, a flux application unit, and a roller cleaning device. Note that in this specification, the term "flux application device" may be read as a "substrate pressing device" because, as described above, the flux application device also has the function of pressing the substrate.

[0022] The substrate support, rollers, and roller cleaning device may each be similar to those provided in the substrate pressing device described above.

[0023] The flux applicator applies flux to the solder pre-coats on the substrate pressed by the roller. The flux applicator may apply flux to the solder pre-coats by, for example, screen printing. However, the method of applying flux is not limited to screen printing.

[0024] The roller cleaning device may clean the roller surface while the flux application unit is applying flux to the multiple solder precoats. In this case, applying flux and cleaning the roller surface simultaneously can shorten the time required to process the substrate compared to performing the two tasks separately. Here, "cleaning the roller surface while applying flux" means that at least a portion of the time spent applying flux and at least a portion of the time spent cleaning the roller surface overlap. For example, this configuration encompasses both starting roller cleaning after the start of flux application and finishing roller cleaning before the end of flux application, and starting roller cleaning before the start of flux application and finishing roller cleaning after the end of flux application.

[0025] (roller cleaning device) The roller cleaning device according to the present disclosure is a device for cleaning rollers that press multiple solder precoats formed on a substrate. The roller cleaning device according to the present disclosure is provided separately from a substrate pressing device and cleans rollers that have been removed from the substrate pressing device. The roller cleaning device according to the present disclosure includes a roller mounting unit and a roller cleaning unit.

[0026] The roller is detachably attached to the roller mounting portion. The roller mounting portion may have a frame for supporting the roller. The roller mounting portion may be connectable to a roller cleaning portion.

[0027] The roller cleaning unit cleans the surface of the roller attached to the roller attachment unit, and the cleaning method may be the same as that of the substrate pressing device described above.

[0028] (Substrate pressing method) The substrate pressing method according to the present disclosure is a method for pressing a substrate having a plurality of solder precoats formed thereon. The substrate pressing method according to the present disclosure includes a substrate supporting step, a pressing step, and a roller cleaning step. The substrate supporting step, the pressing step, and the roller cleaning step may be performed in the same apparatus or in separate apparatuses.

[0029] In the substrate supporting step, a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface is supported from below. In addition to supporting the second main surface of the substrate from below, the substrate may also be supported by sandwiching its side surfaces.

[0030] In the pressing step, the supported substrate is pressed from the first main surface side with a roller. This can flatten the tops of the multiple solder precoats. During this pressing, foreign matter can adhere to the surface of the roller.

[0031] In the roller cleaning process, the roller surface is cleaned, which removes foreign matter adhering to the roller surface and prevents foreign matter from adhering to the solder precoat, even when multiple substrates are processed consecutively.

[0032] In the roller cleaning step, a cleaning member may be brought into contact with the surface of the roller. As the cleaning member, the above-mentioned examples can be used.

[0033] The roller may have a shape extending along its rotation axis. In the roller cleaning step, the cleaning member may be moved along the longitudinal direction of the roller while contacting a portion of the roller in the longitudinal direction. In this case, the cleaning member can be easily brought into close contact with the surface of the roller, thereby efficiently cleaning the roller surface.

[0034] In the roller cleaning step, the roller may be rotated in contact with a cleaning member, which makes it possible to easily clean the surface of the roller over the entire circumference.

[0035] As described above, according to the present disclosure, by cleaning the surface of the roller, it is possible to prevent foreign matter from adhering to the solder precoat formed on the substrate.

[0036] The following describes in detail exemplary embodiments of a substrate pressing device, a flux application device, a roller cleaning device, and a substrate pressing method according to the present disclosure, with reference to the accompanying drawings. The components and steps described above can be applied to the components and steps of the exemplary substrate pressing device, flux application device, roller cleaning device, and substrate pressing method described below. The components and steps of the exemplary substrate pressing device, flux application device, roller cleaning device, and substrate pressing method described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above-described embodiment. Among the components and steps of the exemplary substrate pressing device, flux application device, roller cleaning device, and substrate pressing method described below, components and steps that are not essential to the substrate pressing device, flux application device, roller cleaning device, and substrate pressing method according to the present disclosure may be omitted. Note that the diagrams shown below are schematic and do not accurately reflect the actual shapes and numbers of components.

[0037] First Embodiment A first embodiment of the present disclosure will be described. As shown in Figures 1 to 4, a substrate pressing device 10 of this embodiment includes a support unit 20, a pressing unit 30, and a cleaning unit 50. The support unit 20, the pressing unit 30, and the cleaning unit 50 are housed in a housing (not shown).

[0038] The support unit 20 supports a substrate 80 having a first main surface 80a on which a plurality of solder precoats (not shown) are formed and a second main surface 80b on the opposite side thereof. The support unit 20 includes a base 21, a moving table 22, a rotation mechanism 23, and a substrate support part 24.

[0039] The base 21 is a base element of the support unit 20, and is installed on the floor of a factory or the like. A control unit 70 for controlling each component of the substrate pressing device 10 is provided inside the base 21. The control unit 70 has a calculation device and a storage device in which a program executable by the calculation device (for example, a program for implementing the substrate pressing method of the present embodiment) is stored. Note that instead of or in addition to the control unit 70 built into the base 21, an external control device (for example, a cloud server) configured to be able to communicate with the substrate pressing device 10 may be provided.

[0040] The moving table 22 is provided on the base 21 and configured to be movable in the horizontal direction within a predetermined movement range. The horizontal movement of the moving table 22 is controlled by the control unit 70. By moving the moving table 22, the position of the substrate 80 in the horizontal direction can be adjusted.

[0041] The rotation mechanism 23 is provided on the moving table 22 and is configured to be rotatable around a vertical axis. The rotation operation of the rotation mechanism 23 is controlled by the control unit 70. The angular position of the substrate 80 can be adjusted by the rotation of the rotation mechanism 23.

[0042] The substrate support part 24 is provided on the rotation mechanism 23 and supports the second main surface 80b of the substrate 80 from below. A heater 25 for heating the substrate 80 is provided inside the substrate support part 24. The substrate support part 24 may have a suction mechanism (not shown) for suctioning the substrate 80. The substrate support part 24 may have a clamp mechanism (not shown) for clamping and fixing the side surfaces of the substrate 80.

[0043] The pressing unit 30 is disposed above the support unit 20. The pressing unit 30 includes a roller 32 that presses the substrate 80 supported by the support unit 20 (more specifically, the substrate support portion 24) from the first main surface 80a side, a pressing mechanism 37 for applying a pressing force to the roller 32, and a roller moving portion 43 for moving the roller 32 and the pressing mechanism 37 in the horizontal direction (the left-right direction in FIG. 1). The roller 32 has a shape that extends along its rotation axis (the rotation axis extending perpendicular to the plane of the paper in FIG. 1). The roller 32 has a roller shaft 33 that extends in the longitudinal direction, and a driven gear 34 is provided at one end of the roller shaft 33. The pressing mechanism 37 includes a main body portion 38 movably supported by the roller moving portion 43 and a shaft 39 extending downward from the main body portion 38. The roller 32 is rotatably supported at the lower end of the shaft 39 via a roller holder 35. The main body 38 and the shaft 39 are an air cylinder, and the shaft 39 can be raised and lowered by air pressure, which presses the roller 32 against the substrate 80. The roller moving unit 43 is a beam-shaped member extending horizontally (left and right in FIG. 1) and guides the movement of the roller 32 and the pressing mechanism 37. Note that the roller moving unit 43 is not shown in FIGS. 2 and 4.

[0044] The roller 32 and the pressing mechanism 37 are movable, guided by the roller moving section 43, between a pressing area for pressing the substrate 80 (i.e., the area where the roller 32 is located above the substrate 80) and a cleaning area for cleaning by the cleaning unit 50 (i.e., the area where the roller 32 docks with the cleaning unit 50).

[0045] The cleaning unit 50 is an element for cleaning the surface of the roller 32. The cleaning unit 50 has a cleaning member 51, a unit frame 52, a roller rotation unit 65, and a cleaning member movement unit 58. The cleaning unit 50 is an example of a roller cleaning device.

[0046] The cleaning member 51 comes into contact with and cleans the surface of the roller 32. The cleaning member 51 in this embodiment is configured as a scraper having a dimension shorter than the length of the roller 32, but is not limited to this.

[0047] The unit frame 52 movably supports the cleaning member 51 via a cleaning member moving portion 58. The unit frame 52 is formed in an angular U-shape that opens upward, and has a bottom surface portion 53, a first side wall portion 54 that rises from one end of the bottom surface portion 53, and a second side wall portion 56 that rises from the other end of the bottom surface portion 53. A first through hole 55 is formed in the first side wall portion 54, penetrating it in the thickness direction. A second through hole 57 is formed in the second side wall portion 56, penetrating it in the thickness direction.

[0048] The roller rotation unit 65 has a first motor 66 having an output shaft 67 and a drive gear 68 fixed to the tip of the output shaft 67. The first motor 66 is fixed to the first side wall portion 54 of the unit frame 52, and the output shaft 67 of the first motor 66 is inserted through the first through-hole 55. The roller rotation unit 65 is configured to rotate the roller 32 while it is in contact with the cleaning member 51. More specifically, as shown in FIG. 4 , the roller rotation unit 65 can rotate the roller 32 about its rotation axis by driving the first motor 66 while the drive gear 68 is meshed with the driven gear 34 of the roller 32 and the surface of the roller 32 is in contact with the cleaning member 51.

[0049] The cleaning member moving unit 58 includes a second motor 59 that rotates the feed screw 61, a moving base 63 that is connected to the feed screw 61 via a nut 62 and supports the cleaning member 51, and a guide unit 64 that guides the moving base 63 in the horizontal direction (the left-right direction in FIGS. 3 and 4). The feed screw 61 is inserted through the second through-hole 57 of the unit frame 52 and extends horizontally toward the first side wall unit 54. The moving base 63 that supports the cleaning member 51 moves horizontally while being guided by the guide unit 64 in conjunction with the rotation of the second motor 59 (i.e., the rotation of the feed screw 61). Due to this movement of the moving base 63, the cleaning member 51 moves along the longitudinal direction of the roller 32 while contacting a portion of the longitudinal direction of the roller 32, as indicated by the dashed double arrow in FIG. 4.

[0050] In the substrate pressing device 10 having the above-described configuration, the substrate 80 is supported from below by the support unit 20 (substrate supporting step). Next, the roller 32 of the pressing unit 30 presses the first main surface 80a of the substrate 80 supported by the support unit 20 (more specifically, the plurality of solder precoats formed on the first main surface 80a) (pressing step). Then, the surface of the roller 32 used for pressing is cleaned by the cleaning member 51 of the cleaning unit 50 (roller cleaning step). This cleaning is preferably performed in parallel with the loading and unloading of the substrate 80 into and out of the substrate pressing device 10.

[0051] Second Embodiment A second embodiment of the present disclosure will be described. A flux application device 100 of this embodiment differs from the board pressing device 10 of the first embodiment in that it includes a screen printing unit 110. The following mainly describes the differences from the first embodiment.

[0052] 5 and 6, the flux application device 100 includes a support unit 20, a pressing unit 30, and a cleaning unit 50, as well as a screen printing unit 110 housed together with these in a housing (not shown). The screen printing unit 110 is configured to apply flux F to multiple solder pre-coats on the substrate 80 pressed by the roller 32 of the pressing unit 30. The screen printing unit 110 includes a print head 111 and a screen mask 113. The screen printing unit 110 is an example of a flux application section.

[0053] The print head 111 is provided above the support unit 20 and the pressing unit 30. The print head 111 has at least one (two in this example) squeegee 112. At least one squeegee 112 is selectively lowered to apply the flux F. The print head 111 is movable in the horizontal direction (the left-right direction in FIGS. 5 and 6).

[0054] The screen mask 113 is provided below the print head 111. The screen mask 113 has a plurality of openings (not shown) formed therein that correspond to the plurality of solder precoats formed on the substrate 80. Flux F is applied to the plurality of solder precoats through these openings.

[0055] Furthermore, the support unit 20 of this embodiment includes an elevating mechanism 26 provided between the moving table 22 and the rotation mechanism 23. The elevating mechanism 26 is configured to raise and lower the rotation mechanism 23 and the substrate support part 24, thereby raising and lowering the substrate 80 between a lowered position (FIG. 5) for pressing the substrate 80 and an upper position (FIG. 6) for applying flux F to the solder precoat. The operation of the elevating mechanism 26 is controlled by the control part 70.

[0056] In the flux application device 100 having the above-described configuration, the roller 32 of the pressing unit 30 presses the first main surface 80a (more specifically, the plurality of solder pre-coats formed on the first main surface 80a) of the substrate 80 supported by the support unit 20. Thereafter, the screen printing unit 110 applies flux F to the pressed plurality of solder pre-coats. In parallel with this flux application, the surface of the roller 32 used for pressing is cleaned by the cleaning member 51 of the cleaning unit 50.

[0057] Third Embodiment A third embodiment of the present disclosure will be described. A roller cleaning device 200 of this embodiment differs from the cleaning unit 50 of the first embodiment in that it is separate from the substrate pressing device 10. The following mainly describes the differences from the first embodiment.

[0058] As shown in FIGS. 7 to 11 , in this embodiment, a roller cleaning device 200 for cleaning the rollers 32 of the substrate pressing device 10 is provided separately from the substrate pressing device 10. Therefore, the substrate pressing device 10 of this embodiment does not include a cleaning unit 50. Furthermore, as shown in FIGS. 8 and 9 , the pressing unit 30 of the substrate pressing device 10 has a roller unit 31 that can be attached to and detached from the pressing mechanism 37 using bolts 44. That is, the pressing mechanism 37 has a holding plate 41 in which at least one (two in this example) third through hole 42 is formed, and the pressing mechanism 37 and the roller unit 31 can be connected by screwing the bolts 44 into the screw holes 36 formed in the roller holder 35 via these third through holes 42. Conversely, the roller unit 31 can be removed from the pressing mechanism 37 by removing the bolts 44.

[0059] The roller cleaning device 200 has a base 210 that is placed on the floor, and a cleaning unit 50 and a roller mounting portion 220 that are provided on the base 210. As shown in Figures 10 and 11, the configuration of the cleaning unit 50 is the same as that of the first embodiment. The cleaning unit 50 is an example of a roller cleaning portion.

[0060] The roller 32 is detachably attached to the roller mounting portion 220. The roller mounting portion 220 includes a mounting frame 221 and a roller lifting mechanism 223. The mounting frame 221 is formed in an angular U-shape that opens downward, and a fourth through-hole 222 is provided in its top plate portion. The mounting frame 221 is fixed to the unit frame 52 of the cleaning unit 50. The roller lifting mechanism 223 includes a lifting unit 224 attached to the mounting frame 221, a shaft 225 extending downward from the lifting unit 224 and inserted into the fourth through-hole 222, and a mounting plate 226 connected to the lower end of the shaft 225. The lifting unit 224 may be configured with any type of actuator, such as an electric actuator. The mounting plate 226 has a structure similar to that of the holding plate 41 and includes at least one (two in this example) fifth through-hole 227 through which the bolt 44 can be inserted. The roller unit 31 can be attached to and detached from the mounting plate 226 using bolts 44 .

[0061] 11, in the roller cleaning device 200 having the above-described configuration, the roller 32 removed from the substrate pressing device 10 is attached to the roller attachment portion 220 and cleaned by the cleaning unit 50. The frequency of cleaning can be set as desired.

[0062] <<Notes>> The above description of the embodiments discloses the following techniques. (Technology 1) a substrate support portion configured to support from below the second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a roller that presses the substrate supported by the substrate support portion from the first main surface side; a roller cleaning device for cleaning the surface of the roller; A substrate pressing device comprising: (Technology 2) The substrate pressing device according to Technology 1, wherein the roller cleaning device has a cleaning member that contacts the surface of the roller. (Technology 3) The roller has a shape extending along its rotation axis, The substrate pressing device according to Art. 2, wherein the roller cleaning device has a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while contacting a portion of the roller in the longitudinal direction. (Technology 4) The substrate pressing device according to Technology 2 or 3, wherein the roller cleaning device has a roller rotation unit that rotates the roller while the roller is in contact with the cleaning member. (Technology 5) a substrate support portion configured to support from below the second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a roller that presses the substrate supported by the substrate support portion from the first main surface side; a flux applying unit that applies flux to the plurality of solder precoats on the substrate pressed by the roller; a roller cleaning device for cleaning the surface of the roller; A flux application device comprising: (Technology 6) The flux application device according to technique 5, wherein the roller cleaning device cleans the surface of the roller while the flux application unit applies flux to the plurality of solder precoats. (Technology 7) 7. The flux application device according to claim 5, wherein the roller cleaning device has a cleaning member that contacts the surface of the roller. (Technology 8) The roller has a shape extending along its rotation axis, The flux application device according to Technology 7, wherein the roller cleaning device has a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while contacting a part of the roller in the longitudinal direction. (Technology 9) The flux application device according to claim 7 or 8, wherein the roller cleaning device has a roller rotation unit that rotates the roller while in contact with the cleaning member. (Technology 10) A roller cleaning device for cleaning a roller removed from a substrate pressing device including a roller for pressing a plurality of solder precoats formed on a substrate, the roller comprising: a roller mounting portion to which the roller is detachably mounted; a roller cleaning unit that cleans the surface of the roller attached to the roller attachment unit; A roller cleaning device comprising: (Technology 11) The roller cleaning device according to technology 10, wherein the roller cleaning unit has a cleaning member that contacts the surface of the roller. (Technology 12) The roller has a shape extending along its rotation axis, The roller cleaning device according to technology 11, wherein the roller cleaning unit has a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while contacting a portion of the roller in the longitudinal direction. (Technology 13) 13. The roller cleaning device according to claim 11, wherein the roller cleaning unit has a roller rotation unit that rotates the roller while the roller is in contact with the cleaning member. (Technology 14) a substrate supporting step of supporting from below a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a pressing step of pressing the supported substrate from the first main surface side with a roller; a roller cleaning step of cleaning the surface of the roller; A substrate pressing method comprising: (Technology 15) The substrate pressing method according to technique 14, wherein in the roller cleaning step, a cleaning member is brought into contact with the surface of the roller. (Technology 16) The roller has a shape extending along its rotation axis, The substrate pressing method according to technique 15, wherein in the roller cleaning step, the cleaning member is moved along the longitudinal direction of the roller while being in contact with a part of the roller in the longitudinal direction. (Technology 17) 17. The substrate pressing method according to claim 15, wherein in the roller cleaning step, the roller is rotated in a state of being in contact with the cleaning member. [Industrial Applicability]

[0063] The present disclosure can be used for a substrate pressing device, a flux application device, a roller cleaning device, and a substrate pressing method. [Explanation of symbols]

[0064] 10: Substrate pressing device 20: Support unit 21: Foundation 22: Moving table 23: Rotation mechanism 24: Substrate support part 25: Heater 26: Lifting mechanism 30: Pressing unit 31: Roller unit 32: Laura 33: Roller shaft 34: Driven gear 35: Roller holder 36: screw hole 37: Pressing mechanism 38: Main body 39: Shaft 41: Retaining plate 42: Third through hole 43: Roller moving part 44: Bolt 50: Cleaning unit (roller cleaning device) 51: Cleaning materials 52: Unit Frame 53: Bottom part 54: First side wall 55: First through hole 56: Second side wall 57: Second through hole 58: Cleaning member moving part 59: Second motor 61: Lead screw 62: Nut 63: Mobile stand 64: Guide section 65: Roller rotation part 66: First motor 67: Output shaft 68: Drive gear 70: Control unit 80: Circuit board 80a: First main surface 80b: 2nd principal surface 100: Flux application device 110: Screen printing unit (flux application unit) 111: Print head 112: Squeegee 113: Screen Mask 200: Roller cleaning device 210: Bass 220: Roller mounting part 221: Mounting frame 222: 4th through hole 223: Roller lifting mechanism 224: Lifting section 225: Shaft 226: Mounting plate 227: 5th through hole F: Flux

Claims

1. a substrate support portion configured to support from below the second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a roller that presses the substrate supported by the substrate support portion from the first main surface side; a roller cleaning device for cleaning the surface of the roller; A substrate pressing device comprising:

2. The substrate pressing device according to claim 1 , wherein the roller cleaning device has a cleaning member that contacts the surface of the roller.

3. The roller has a shape extending along its rotation axis, 3. The substrate pressing device according to claim 2, wherein the roller cleaning device comprises a cleaning member moving section that moves the cleaning member along the longitudinal direction of the roller while keeping the cleaning member in contact with a portion of the roller in the longitudinal direction.

4. 4. The substrate pressing device according to claim 2, wherein the roller cleaning device has a roller rotating section that rotates the roller while the roller is in contact with the cleaning member.

5. a substrate support portion configured to support from below the second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a roller that presses the substrate supported by the substrate support portion from the first main surface side; a flux applying unit that applies flux to the plurality of solder precoats on the substrate pressed by the roller; a roller cleaning device for cleaning the surface of the roller; A flux application device comprising:

6. 6. The flux application device according to claim 5, wherein the roller cleaning device cleans the surface of the roller while the flux application unit applies flux to the plurality of solder precoats.

7. 7. The flux applying device according to claim 5, wherein the roller cleaning device has a cleaning member that contacts the surface of the roller.

8. The roller has a shape extending along its rotation axis, 8. The flux applying device according to claim 7, wherein the roller cleaning device comprises a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while keeping the cleaning member in contact with a portion of the roller in the longitudinal direction.

9. 8. The flux applying device according to claim 7, wherein the roller cleaning device has a roller rotating part that rotates the roller while the roller is in contact with the cleaning member.

10. A roller cleaning device for cleaning a roller removed from a substrate pressing device including a roller for pressing a plurality of solder precoats formed on a substrate, the roller comprising: a roller mounting portion to which the roller is detachably mounted; a roller cleaning unit that cleans the surface of the roller attached to the roller attachment unit; A roller cleaning device comprising:

11. The roller cleaning device according to claim 10 , wherein the roller cleaning section has a cleaning member that contacts the surface of the roller.

12. The roller has a shape extending along its rotation axis, The roller cleaning device according to claim 11 , wherein the roller cleaning unit includes a cleaning member moving unit that moves the cleaning member along the longitudinal direction of the roller while keeping the cleaning member in contact with a portion of the roller in the longitudinal direction.

13. The roller cleaning device according to claim 11 or 12, wherein the roller cleaning unit includes a roller rotating unit that rotates the roller while the roller is in contact with the cleaning member.

14. a substrate supporting step of supporting, from below, the second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite to the first main surface; a pressing step of pressing the supported substrate from the first main surface side with a roller; a roller cleaning step of cleaning the surface of the roller; A substrate pressing method comprising:

15. The substrate pressing method according to claim 14 , wherein the roller cleaning step brings a cleaning member into contact with the surface of the roller.

16. The roller has a shape extending along its rotation axis, The substrate pressing method according to claim 15 , wherein in the roller cleaning step, the cleaning member is moved along the longitudinal direction of the roller while being in contact with a portion of the roller in the longitudinal direction.

17. 17. The substrate pressing method according to claim 15, wherein in the roller cleaning step, the roller is rotated in a state of contact with the cleaning member.

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