Semiconductor device, method of manufacturing semiconductor device, and power conversion device

Abstract

To provide a technique capable of suppressing bonding defects due to vibration of an exterior terminal during wire bonding.SOLUTION: A terminal holding part 16 of a resin case 9 includes a recess 8A that is recessed downward and a flat surface 8E extending from an opening of the recess 8A to an inner peripheral side. The recess 8A includes a side face 8B on an outer peripheral side, a side face 8D on an inner peripheral side, and a bottom face 8C connecting the side face 8B on the outer peripheral side and the side face 8D on the inner peripheral side. An exterior terminal 12 includes: a first extension part 12A having a tip side protruding upward and a base end side extending while being in contact with the side face 8B, of the recess 8A, on the outer peripheral side; a second extension part 12C extending while being in contact with the flat surface 8E of the terminal holding part 16, the second extension part being wire-bonded with a top face; and a bent part 12B provided between the first extension part 12A and the second extension part 12C and fixed to the recess 8A. The bent part 12B of the exterior terminal 12 is compressed in the recess 8A and fixed to the recess 8A by the reaction force received from the recess 8A.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor device, a method for manufacturing a semiconductor device, and a power conversion device. [Background technology]

[0002] Power modules as semiconductor devices are mounted in a wide variety of products, including industrial equipment, home appliances, and information terminals, and high productivity is required. In conventional semiconductor devices, the arrangement of exterior terminals attached to an outer resin case, which is a common component, is set so that products can be manufactured in a flexible manner to accommodate various specifications specified by the model or user. The exterior terminals are attached by press-fitting into terminal mounting holes pre-formed in the peripheral wall of the outer resin case (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-152525 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when an outsert case is used in a semiconductor device as in the technology described in Patent Document 1, the exterior terminals are not securely fixed. This is because the side portions of the exterior terminals that are perpendicular to the wire-bonded portions are fixed to the resin case by fitting with the resin case, but the wire-bonded portions are not fixed to the resin case. This insufficient fixation of the exterior terminals causes bonding defects due to vibration of the exterior terminals during wire bonding of metal wires, making it difficult to sort out defective products.

[0005] Therefore, an object of the present disclosure is to provide a technique capable of suppressing bonding defects caused by vibration of an exterior terminal during wire bonding. [Means for solving the problem]

[0006] A semiconductor device according to the present disclosure includes a circuit board including an insulating layer and a circuit pattern provided on an upper surface of the insulating layer, a semiconductor element mounted on the circuit pattern, a resin case provided to surround the circuit board in a top view, exterior terminals formed of a spring material and attached to terminal holding portions of the resin case, and an adhesive that bonds the resin case to the insulating layer exposed along a peripheral portion of the circuit board, wherein the terminal holding portion of the resin case includes a recess recessed downward and a flat surface extending inward from an opening of the recess. The recess includes an outer peripheral side surface, an inner peripheral side surface, and a bottom surface connecting the outer peripheral side surface and the inner peripheral side surface, and the exterior terminal includes a first extension portion whose tip side protrudes upward and whose base end side extends and contacts the outer peripheral side surface of the recess, a second extension portion that extends and contacts the flat surface of the terminal holding portion and is wire-bonded to the upper surface, and a curved portion that is provided between the first extension portion and the second extension portion and is fixed to the recess, and the curved portion of the exterior terminal is compressed within the recess and is fixed to the recess by the reaction force it receives from the recess. [Effects of the Invention]

[0007] According to the present disclosure, the second extension portion of the exterior terminal comes into contact with the flat surface of the terminal holding portion of the resin case, thereby suppressing rattling of the exterior terminal, thereby suppressing poor bonding caused by vibration of the exterior terminal during wire bonding. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a top view of a semiconductor device according to a first embodiment. [Figure 2] 2 is a cross-sectional view of the periphery of a terminal holding portion of the semiconductor device according to the first embodiment. FIG. [Figure 3] 2 is a perspective view showing a state before an exterior terminal is attached to a terminal holding portion according to the first embodiment. FIG. [Figure 4] 3 is a perspective view showing a state in which an exterior terminal is attached to a terminal holding portion according to the first embodiment. FIG. [Figure 5] 3 is a flowchart showing a manufacturing process of the semiconductor device according to the first embodiment. [Figure 6] 5A to 5C are cross-sectional views showing a process of preparing the circuit board according to the first embodiment. [Figure 7] 5 is a cross-sectional view showing a process of attaching the exterior terminal according to the first embodiment to the lower case. FIG. [Figure 8] 5 is a cross-sectional view showing a step of applying an adhesive to the circuit board according to the first embodiment. FIG. [Figure 9] 5A to 5C are cross-sectional views showing a bonding step of the lower case according to the first embodiment. [Figure 10] 5A and 5B are cross-sectional views showing a connecting step of the upper case according to the first embodiment. [Figure 11] 5A to 5C are cross-sectional views showing a wire bonding step according to the first embodiment. [Figure 12] FIG. 10 is a cross-sectional view of the periphery of a terminal holding portion of a semiconductor device according to a second embodiment. [Figure 13] FIG. 11 is a cross-sectional view of the periphery of a terminal holding portion of a semiconductor device according to a third embodiment. [Figure 14] 10 is a flowchart showing a manufacturing process of a semiconductor device according to a third embodiment. [Figure 15] FIG. 10 is a cross-sectional view of the periphery of a terminal holding portion of a semiconductor device according to a fourth embodiment. [Figure 16] FIG. 11 is a cross-sectional view of the periphery of a terminal holding portion of a semiconductor device according to a fifth embodiment. [Figure 17] FIG. 13 is a block diagram showing a configuration of a power conversion system to which a power conversion device according to a sixth embodiment is applied. DETAILED DESCRIPTION OF THE INVENTION

[0009] <First Embodiment> The first embodiment will be described below with reference to the drawings. Fig. 1 is a top view of a semiconductor device 202 according to the first embodiment. Fig. 2 is a cross-sectional view of the periphery of a terminal holding section 16 of the semiconductor device 202 according to the first embodiment. Fig. 3 is a perspective view showing a state before an exterior terminal 12 is attached to the terminal holding section 16 according to the first embodiment. Fig. 4 is a perspective view showing a state after the exterior terminal 12 is attached to the terminal holding section 16 according to the first embodiment.

[0010] As shown in Figures 1 and 2, the semiconductor device 202 includes a circuit board 1, a plurality of semiconductor elements 5, a resin case 9, a plurality of main electrodes 11, a plurality of exterior terminals 12, a plurality of metal wires 6, and an adhesive 10.

[0011] The circuit board 1 is an integrated component that includes a resin insulating layer 3, a metal plate 2 provided on the back surface of the insulating layer 3, and multiple circuit patterns 4 provided on the top surface of the insulating layer 3. The insulating layer 3 is formed from an insulating resin material obtained by mixing a thermosetting resin such as epoxy with an insulating filler such as alumina, silicon nitride, boron nitride, or silicon nitride. However, the insulating layer 3 is not limited to this, and may be formed from an inorganic material such as ceramic. The circuit pattern 4 is a metal plate formed from a metal material including, for example, copper or aluminum. The multiple circuit patterns 4 are patterned into arbitrary shapes and are electrically insulated from each other.

[0012] The semiconductor elements 5 are mounted on the plurality of circuit patterns 4 via solder, a sintered material, a conductive adhesive, or the like. A circuit is formed by wiring metal wires 6 between the electrodes of the semiconductor elements 5 and the electrodes of the circuit patterns 4. The metal wires 6 are made of a material containing, for example, gold, copper, or aluminum, and electrically connect the circuit patterns 4 and the semiconductor elements 5.

[0013] The semiconductor element 5 is, for example, an IGBT (Insulated Gate Bipolar Transistor) or a diode, each of which uses silicon (Si) as a semiconductor material. However, the semiconductor element 5 is not limited to this and may be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Furthermore, although the first embodiment describes an example in which the semiconductor element 5 uses Si as a semiconductor material, the semiconductor material of the semiconductor element 5 is not limited thereto and may be a wide bandgap semiconductor material such as silicon carbide (SiC), gallium nitride (GaN), or diamond (C). Here, the semiconductor element 5 is bonded to the circuit pattern 4 using a bonding material such as solder or a sintering paste containing silver.

[0014] The resin case 9 is formed in a rectangular frame shape when viewed from above, and is provided so as to surround the circuit board 1. The resin case 9 is adhered to the insulating layer 3 exposed along the peripheral edge of the circuit board 1 via an adhesive 10. As the adhesive 10, an insulating thermosetting adhesive that hardens when heated, or a thermoplastic adhesive that softens when heated but solidifies at room temperature, may be used. The material of the adhesive 10 may also be a resin material containing silicone, epoxy, acrylic, or the like.

[0015] The resin case 9 is provided with exterior terminals 12 that electrically connect, for example, external wiring (not shown) to the circuit board 1. The resin case 9 is also provided with main electrodes 11. Four mounting holes 9A are provided at the four corners of the resin case 9 for mounting heat dissipation fins (not shown) to the resin case 9.

[0016] Here, the resin case 9 is made of a thermoplastic resin material such as PPS (Polyphenylene Sulphide), PBT (Polybutylene Terephthalate), or a crystalline polymer.

[0017] In the semiconductor device 202, a gel-like sealing member (not shown), such as silicone gel, may be filled and hardened so as to cover the circuit board 1 within the resin case 9.

[0018] Next, the attachment structure of the resin case 9 and the exterior terminals 12 will be described. As shown in FIG. 2, the resin case 9 is composed of a lower case 8 and an upper case 7 placed on the lower case 8. The lower case 8 is a member that constitutes the lower part of the resin case 9 and includes a terminal holding portion 16 for attaching the exterior terminals 12. A plurality of terminal holding portions 16 are provided along the circumferential direction of the lower case 8 so that a plurality of exterior terminals 12 can be attached. The terminal holding portion 16 includes a recess 8A that is recessed downward and a flat surface 8E that extends inward from the opening of the recess 8A. The recess 8A includes an outer peripheral side surface 8B, an inner peripheral side surface 8D, and a bottom surface 8C that connects the outer peripheral side surface 8B and the inner peripheral side surface 8D.

[0019] The lower case 8 and the upper case 7 are connected with adhesive 10. The upper case 7 is a member that constitutes the upper part of the resin case 9. The upper case 7 is provided with a plurality of terminal insertion holes 7A that extend in the vertical direction so that first extension portions 12A of exterior terminals 12, which will be described later, can be inserted therethrough. The terminal insertion holes 7A penetrate the top and bottom surfaces of the upper case 7.

[0020] The exterior terminal 12 is formed from a spring material made of a metal material such as copper or aluminum. The exterior terminal 12 includes a first extending portion 12A whose tip end protrudes upward and whose base end extends and contacts the side surface 8B on the outer periphery of the recess 8A, a second extending portion 12C that extends and contacts the flat surface 8E of the terminal holding portion 16 and is wire-bonded to the upper surface, and a curved portion 12B that is U-shaped in cross section and is provided between the first extending portion 12A and the second extending portion 12C and fixed to the recess 8A.

[0021] The distance from chain line A to chain line B in the exterior terminal 12 before it is attached to the terminal holding portion 16 (see FIG. 3) is greater than the distance from chain line A to chain line B in the exterior terminal 12 after it is attached to the terminal holding portion 16 (see FIG. 4). The exterior terminal 12 is configured so that the distance between chain line A and chain line B changes before and after attachment due to deformation of the curved portion 12B, and thus a spring force is applied in the direction connecting chain line A and chain line B. That is, the distance between the tip of the second extension portion 12C of the exterior terminal 12 before it is attached to the terminal holding portion 16 shown in FIG. 3 and the first extension portion 12A that contacts the outer peripheral side surface 8B of the lower case 8 is greater than the distance between the tip of the second extension portion 12C of the exterior terminal 12 after it is attached to the terminal holding portion 16 shown in FIG. 4 and the first extension portion 12A that contacts the outer peripheral side surface 8B of the lower case 8.

[0022] Furthermore, the flat surface 8E of the terminal holding portion 16 is provided with a protrusion 15 for holding the tip of the second extending portion 12C of the exterior terminal 12.

[0023] 4 is attached to the resin case 9, the curved portion 12B of the exterior terminal 12 is compressed within the recess 8A of the terminal holding portion 16 and is fixed to the recess 8A by the reaction force received from the recess 8A. As a result, the fixation of the exterior terminal 12 to the resin case 9 is stabilized in the wire bonding process.

[0024] Next, a manufacturing method of semiconductor device 202 according to embodiment 1 will be described with reference to FIGS. 5 to 11. FIG. 5 is a flowchart showing the manufacturing process of semiconductor device 202 according to embodiment 1. FIG. 6 is a cross-sectional view showing the process of preparing circuit board 1 according to embodiment 1. FIG. 7 is a cross-sectional view showing the process of attaching exterior terminal 12 to lower case 8 according to embodiment 1. FIG. 8 is a cross-sectional view showing the process of applying adhesive 10 to circuit board 1 according to embodiment 1. FIG. 9 is a cross-sectional view showing the bonding process of lower case 8 according to embodiment 1. FIG. 10 is a cross-sectional view showing the connection process of upper case 7 according to embodiment 1. FIG. 11 is a cross-sectional view showing the wire bonding process according to embodiment 1.

[0025] 5 and 6, first, in step S101, a process of preparing a circuit board 1 is carried out. In this process, a semiconductor element 5 (see FIG. 1) is mounted on the circuit pattern 4 of the circuit board 1 via a bonding member, although this is not shown.

[0026] 5 and 7, in step S102, the exterior terminal 12 is inserted into the terminal holding portion 16 of the lower case 8 and attached to the lower case 8. In this step, the exterior terminal 12 is brought close to the recess 8A of the terminal holding portion 16 from above, and the exterior terminal 12 is pushed downward while the tip of the second extension portion 12C of the exterior terminal 12 is brought into contact with the inner surface 15A of the protrusion 15. As a result, the curved portion 12B of the exterior terminal 12 is compressed within the recess 8A of the terminal holding portion 16 and is fixed in the recess 8A by the reaction force received from the recess 8A.

[0027] Next, as shown in FIGS. 5 and 8, in step S103, adhesive 10 is applied to the peripheral edge of circuit board 1. An adhesive having insulating properties and curing properties when heated is used as adhesive 10. Preferably, a thermosetting adhesive that cures at or below the melting point of solder improves assembly without causing misalignment of semiconductor elements. Alternatively, a material containing silicone or a resin material containing epoxy or acrylic may be used as the material for adhesive 10.

[0028] Next, as shown in FIGS. 5 and 9, in step S104, a bonding process for the lower case 8 is performed. In this process, first, the lower case 8, to which the exterior terminals 12 are attached, is placed on the circuit board 1 on which the adhesive 10 has been placed. At this time, the adhesive 10 is allowed to wet and spread between the lower case 8 and the insulating layer 3 at the periphery of the circuit board 1. It is also preferable that the adhesive 10 be allowed to wet and spread not only between the lower case 8 and the periphery of the circuit board 1, but also between the lower case 8 and the side portion of the insulating layer 3 at the periphery of the circuit board 1. Next, although not shown, the fitted lower case 8 and circuit board 1 are placed in a curing oven and subjected to a heat treatment. The adhesive 10 is cured by heating, thereby bonding the lower case 8 and the periphery of the circuit board 1.

[0029] Next, as shown in FIGS. 5 and 10, in step S105, a process for connecting the upper case 7 is carried out. In this process, the upper case 7 is press-fitted onto the exterior terminal 12. Specifically, the upper case 7 is brought close to the exterior terminal 12 from above, and the first extension portion 12A of the exterior terminal 12 is inserted into the terminal insertion hole 7A of the upper case 7, while the upper case 7 is placed on the upper surface of the lower case 8 on which the adhesive 10 is placed. Further, although not shown, the upper case 7 is placed in a curing oven for heat treatment. The adhesive 10 is cured by heating, thereby bonding the lower case 8 and the upper case 7 together.

[0030] 5 and 11, a wire bonding process is performed in step S106. In this process, the circuit pattern 4 and the semiconductor element 5 are electrically connected using metal wires 6.

[0031] Through the above steps, the semiconductor device 202 according to the first embodiment is completed. In addition, as a sealing step, a gel-like sealing member (not shown), such as silicone gel, may be filled and hardened in the resin case 9 so as to cover the circuit board 1.

[0032] Here, the step S105 is the step of connecting the upper case 7, and the step S106 is the step of wire bonding, but the order is not limited to this, and the order of steps S105 and S106 may be interchanged.

[0033] As described above, in the first embodiment, the semiconductor device 202 includes the circuit board 1 including the insulating layer 3 and the circuit pattern 4 provided on the upper surface of the insulating layer 3, the semiconductor element 5 mounted on the circuit pattern 4, the resin case 9 provided to surround the circuit board 1 in a top view, the exterior terminals 12 formed of a spring material and attached to the terminal holding portion 16 of the resin case 9, and the adhesive 10 that bonds the resin case 9 to the insulating layer 3 exposed along the peripheral edge of the circuit board 1. The terminal holding portion 16 of the resin case 9 includes a recess 8A recessed downward and a flat surface 8E extending inward from the opening of the recess 8A, and the recess 8A includes an outer peripheral side surface 8B, an inner peripheral side surface 8D, and a bottom surface 8C connecting the outer peripheral side surface 8B and the inner peripheral side surface 8D. The exterior terminal 12 includes a first extending portion 12A whose tip side protrudes upward and whose base side extends and contacts the side surface 8B on the outer periphery of the recess 8A, a second extending portion 12C that extends and contacts the flat surface 8E of the terminal holding portion 16 and is wire-bonded to the upper surface, and a curved portion 12B that is provided between the first extending portion 12A and the second extending portion 12C and fixed to the recess 8A, and the curved portion 12B of the exterior terminal 12 is compressed within the recess 8A and is fixed to the recess 8A by the reaction force it receives from the recess 8A. The resin case 9 also includes a lower case 8 and an upper case 7 that is placed on the lower case 8.

[0034] Therefore, the second extension portion 12C of the outer terminal 12 comes into contact with the flat surface 8E of the terminal holding portion 16 of the resin case 9, thereby suppressing rattling of the outer terminal 12, thereby suppressing poor bonding caused by vibration of the outer terminal 12 during wire bonding.

[0035] Furthermore, the flat surface 8E of the terminal holding portion 16 is provided with a protrusion 15 for holding the tip of the second extending portion 12C of the exterior terminal 12.

[0036] Therefore, the external terminal 12 can be easily attached to the resin case 9 by bringing the external terminal 12 close to the recess 8A of the terminal holding portion 16 from above and pushing the external terminal 12 downward while bringing the tip of the second extension portion 12C of the external terminal 12 into contact with the inner surface 15A of the protrusion portion 15.

[0037] <Modification of the First Embodiment> 4 and other figures show that the curved portion 12B is U-shaped in cross section, but it may have any shape, for example a V-shape in cross section, as long as it is compressed within the recess 8A of the terminal holding portion 16 and is fixed to the recess 8A by the reaction force it receives from the recess 8A. In addition, the curved portion 12B may be a spring material that is a separate member from the exterior terminal 12.

[0038] Furthermore, the resin case 9 may not be composed of the lower case 8 and the upper case 7, but may be integrally formed. Here, only the differences from FIG. 5 will be described for the manufacturing method of the semiconductor device 202 when the resin case 9 is integrally formed. In step S102 shown in FIG. 5, the exterior terminals 12 are inserted into the terminal holding portions 16 of the resin case 9, and the exterior terminals 12 are attached to the resin case 9. In step S103, the resin case 9 is placed on the peripheral portion of the circuit board 1 via adhesive 10, and in step S104, the adhesive 10 is cured by heating to bond the resin case 9 to the peripheral portion of the circuit board 1. Furthermore, step S105 is unnecessary and is therefore omitted. Even when the resin case 9 is integrally formed, the same effects as when it is composed of the lower case 8 and the upper case 7 can be obtained.

[0039] <Embodiment 2> Next, a description will be given of a second embodiment. Fig. 12 is a cross-sectional view of the periphery of a terminal holding portion 16 of a semiconductor device 202 according to the second embodiment. Note that in the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0040] 12, in contrast to the first embodiment, the second embodiment has a notch 18 provided in the resin case 9 corresponding to the boundary between the second extending portion 12C and the curved portion 12B of the exterior terminal 12. The notch 18 is provided at the boundary between the flat surface 8E and the inner peripheral side surface 8D of the recess 8A, so that the exterior terminal 12 does not come into contact with the lower case 8 at the boundary between the second extending portion 12C and the curved portion 12B of the exterior terminal 12. The notch 18 may be a curved surface.

[0041] Furthermore, the inner peripheral side surface 8D of the recess 8A is formed in an inclined shape so that the opening side is closer to the outer peripheral side surface 8B than to the bottom surface 8C side, and therefore the width of the recess 8A is narrower on the opening side than on the bottom surface 8C side.

[0042] When attaching the exterior terminal 12, the exterior terminal 12 is brought close to the terminal holding portion 16 of the resin case 9 from above, and in the process, the curved portion 12B of the exterior terminal 12 temporarily comes into contact with the notch portion 18. When the exterior terminal 12 is further moved downward, the curved portion 12B that has come into contact with the notch portion 18 is compressed within the recess 8A. When the curved portion 12B moves downward beyond the intersection 17 of the inner peripheral side surface 8D of the recess 8A and the notch portion 18, the distance between the inner peripheral side surface 8D and the outer peripheral side surface 8B within the recess 8A increases, and the curved portion 12B expands and is fixed to the recess 8A.

[0043] At this time, the exterior terminal 12 can be fixed to the resin case 9 by pushing the exterior terminal 12 downward without compressing the curved portion 12B of the exterior terminal 12 in advance, which simplifies the manufacturing process of the semiconductor device 202.

[0044] As described above, in the second embodiment, the resin case 9 is provided with the notch 18 corresponding to the boundary between the second extending portion 12C and the curved portion 12B of the exterior terminal 12. Therefore, by preventing the exterior terminal 12 from coming into contact with the lower case 8 at this boundary, it becomes easier to insert the exterior terminal 12 into the terminal holding portion 16. As a result, the reliability of attachment of the exterior terminal 12 to the terminal holding portion 16 is improved.

[0045] Furthermore, the inner peripheral side surface 8D of the recess 8A is formed in an inclined shape so that the opening side is closer to the outer peripheral side surface 8B than the bottom surface 8C. Therefore, when the exterior terminal 12 is attached to the terminal holding portion 16, the curved portion 12B comes into contact with the inner peripheral side surface 8D, so that the exterior terminal 12 is fixed more firmly than in the first embodiment.

[0046] <Third Embodiment> Next, a third embodiment will be described. Fig. 13 is a cross-sectional view of the periphery of a terminal holding portion 16 of a semiconductor device 202 according to the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and the description thereof will be omitted.

[0047] 13, the shape of the upper case 7 in the third embodiment is different from that in the first embodiment. Specifically, a portion 19 on the lower end side of the terminal insertion hole 7A in the upper case 7 is tapered so that the width increases from the top to the bottom. Also, the manufacturing process in the third embodiment is partially different from that in the first embodiment.

[0048] The method for manufacturing the semiconductor device 202 according to the third embodiment will be described only in terms of the differences from the method for manufacturing the semiconductor device 202 according to the first embodiment. Fig. 14 is a flowchart showing the manufacturing steps of the semiconductor device 202 according to the third embodiment.

[0049] 14, steps S301 to S304 are the same as steps S101 to S104 in embodiment 1 (see FIG. 5). The difference from embodiment 1 is that after the wire bonding step (step S305), a connecting step (step S306) of the upper case 7 is performed.

[0050] As described above, in embodiment 3, the upper case 7 is provided with a terminal insertion hole 7A into which the first extension portion 12A of the exterior terminal 12 is inserted, and the lower end portion 19 of the terminal insertion hole 7A is formed in a tapered shape that widens from the top to the bottom.

[0051] Therefore, by press-fitting the upper case 7 into the exterior terminal 12 attached to the lower case 8, the exterior terminal 12 can be positioned in a predetermined position. Furthermore, even if the upper end position of the exterior terminal 12 is misaligned, the upper case 7 can be easily press-fit. By connecting the upper case 7 after the wire bonding process, contact between the wire bonder (not shown) and the resin case 9 can be suppressed even when the metal wire 6 is connected to a position close to the resin case 9, thereby achieving miniaturization of the semiconductor device 202.

[0052] <Fourth Embodiment> Next, a fourth embodiment will be described. Fig. 15 is a cross-sectional view of the periphery of a terminal holding portion 16 of a semiconductor device 202 according to the fourth embodiment. In the fourth embodiment, the same components as those described in the first to third embodiments are denoted by the same reference numerals, and the description thereof will be omitted. Furthermore, the method for manufacturing the semiconductor device 202 according to the fourth embodiment is the same as the method for manufacturing the semiconductor device 202 according to the first embodiment, and therefore the description thereof will be omitted.

[0053] In the fourth embodiment, the connection structure between the upper case 7 and the lower case 8 is different from that in the first embodiment.

[0054] 15, the lower end of the upper case 7 is provided with an upper case protrusion 20 that protrudes downward, and the upper end of the lower case 8 is provided with a lower case recess 21 that can fit into the upper case protrusion 20. By press-fitting the upper case protrusion 20 into the lower case recess 21, the upper case protrusion 20 and the lower case recess 21 fit together, and this fit connects the upper case 7 and the lower case 8. Furthermore, the contact portion between the upper case 7 and the lower case 8, excluding the fitting portion, may be formed in an inclined shape that increases in height from the inner periphery side to the outer periphery side of the resin case 9.

[0055] As described above, in embodiment 4, the lower end of the upper case 7 is provided with an upper case protrusion 20 that protrudes downward, and the upper end of the lower case 8 is provided with a lower case recess 21 that can fit into the upper case protrusion 20, and the upper case 7 and the lower case 8 are connected by fitting.

[0056] Therefore, the exterior terminals 12 can be firmly fixed by the upper case 7 and the lower case 8. Furthermore, since adhesive 10 is not required when connecting the upper case 7 and the lower case 8, heat treatment in a curing oven is not required.

[0057] In addition, the contact area between the upper case 7 and the lower case 8, excluding the mating portion, is formed in an inclined shape with a height increasing from the inner periphery of the resin case 9 toward the outer periphery, thereby preventing the sealing material (not shown) filled inside the resin case 9 from leaking to the outside through the mating portion between the upper case 7 and the lower case 8.

[0058] <Fifth Embodiment> Next, a fifth embodiment will be described. Fig. 16 is a cross-sectional view of the periphery of a terminal holding portion 16 of a semiconductor device 202 according to the fifth embodiment. In the fifth embodiment, the same components as those described in the first to fourth embodiments are denoted by the same reference numerals, and the description thereof will be omitted.

[0059] 16, in the fifth embodiment, unlike the fourth embodiment, in the region between adjacent terminal insertion holes 7A (see FIG. 2) where exterior terminals 12 are not attached, gap 22 is provided only on the inner circumferential side of the portion where upper case 7 and lower case 8 contact each other. In other words, gap 22 is provided on the sealing member (not shown) side between upper case protrusion 20 and lower case recess 21. The sealing member flows into gap 22, and thereby serves to bond upper case 7 and lower case 8 together.

[0060] As described above, in embodiment 5, in the area between adjacent terminal insertion holes 7A where no exterior terminal 12 is attached, a gap 22 is provided only on the inner circumferential side of the part where the upper case 7 and the lower case 8 contact each other.

[0061] Therefore, the sealing material that has flowed into the gap 22 can bond the upper case 7 and the lower case 8 together more firmly.

[0062] <Sixth Embodiment> In this embodiment, the semiconductor device 202 according to the above-described embodiments 1 to 5 is applied to a power conversion device. Although the application of the semiconductor device 202 according to the embodiments 1 to 5 is not limited to a specific power conversion device, a case where the semiconductor device 202 according to the embodiments 1 to 5 is applied to a three-phase inverter will be described below as embodiment 6.

[0063] FIG. 17 is a block diagram showing a configuration of a power conversion system to which a power conversion device 200 according to the sixth embodiment is applied.

[0064] The power conversion system shown in Fig. 17 is composed of a power supply 100, a power conversion device 200, and a load 300. The power supply 100 is a DC power supply and supplies DC power to the power conversion device 200. The power supply 100 can be configured from a variety of elements, such as a DC system, a solar cell, or a storage battery, or it may be configured from a rectifier circuit or an AC / DC converter connected to an AC system. The power supply 100 may also be configured from a DC / DC converter that converts DC power output from a DC system into predetermined power.

[0065] The power conversion device 200 is a three-phase inverter connected between the power source 100 and the load 300, and converts DC power supplied from the power source 100 into AC power and supplies the AC power to the load 300. As shown in Fig. 17 , the power conversion device 200 includes a main conversion circuit 201 that converts DC power into AC power and outputs it, and a control circuit 203 that outputs a control signal to the main conversion circuit 201 to control the main conversion circuit 201.

[0066] The load 300 is a three-phase electric motor driven by AC power supplied from the power conversion device 200. The load 300 is not limited to a specific application, but is an electric motor mounted on various electrical devices, and is used as an electric motor for, for example, a hybrid vehicle, an electric vehicle, a railroad car, an elevator, or an air conditioning device.

[0067] The power conversion device 200 will be described in detail below. The main conversion circuit 201 includes switching elements (not shown) and freewheeling diodes (not shown). By switching the switching elements, DC power supplied from the power supply 100 is converted into AC power and supplied to the load 300. There are various specific circuit configurations for the main conversion circuit 201, but the main conversion circuit 201 according to this embodiment is a two-level three-phase full-bridge circuit that can be configured with six switching elements and six freewheeling diodes connected in anti-parallel to each switching element. At least one of the switching elements and freewheeling diodes of the main conversion circuit 201 is configured with the semiconductor device 202 according to any one of the above-mentioned first to fifth embodiments. Two of the six switching elements are connected in series to form upper and lower arms, and each upper and lower arm forms one phase (U phase, V phase, W phase) of the full-bridge circuit. The output terminals of each upper and lower arm, i.e., the three output terminals of the main conversion circuit 201, are connected to the load 300.

[0068] The main conversion circuit 201 also includes a drive circuit (not shown) that drives each switching element, but the drive circuit may be built into the semiconductor device 202, or may be provided separately from the semiconductor device 202. The drive circuit generates drive signals that drive the switching elements of the main conversion circuit 201 and supplies them to the control electrodes of the switching elements of the main conversion circuit 201. Specifically, in accordance with control signals from a control circuit 203 (described later), the drive circuit outputs to the control electrodes of each switching element a drive signal that turns the switching element on and a drive signal that turns the switching element off. When maintaining a switching element in the on state, the drive signal is a voltage signal (on signal) that is equal to or greater than the threshold voltage of the switching element, and when maintaining a switching element in the off state, the drive signal is a voltage signal (off signal) that is equal to or less than the threshold voltage of the switching element.

[0069] The control circuit 203 controls the switching elements of the main conversion circuit 201 so that the desired power is supplied to the load 300. Specifically, it calculates the time (on time) that each switching element of the main conversion circuit 201 should be in the on state based on the power to be supplied to the load 300. For example, the main conversion circuit 201 can be controlled by PWM control, which modulates the on time of the switching elements according to the voltage to be output. Then, it outputs a control command (control signal) to a drive circuit provided in the main conversion circuit 201 so that an on signal is output to a switching element that should be in the on state at each time point, and an off signal is output to a switching element that should be in the off state at each time point. In accordance with this control signal, the drive circuit outputs an on signal or an off signal as a drive signal to the control electrode of each switching element.

[0070] In the power conversion device 200 according to this embodiment, the semiconductor devices 202 according to the first to fifth embodiments are applied as the switching elements and free wheel diodes of the main conversion circuit 201, and therefore, an improvement in yield can be realized.

[0071] In the present embodiment, an example has been described in which the semiconductor device 202 according to the first to fifth embodiments is applied to a two-level three-phase inverter, but the application of the semiconductor device 202 according to the first to fifth embodiments is not limited to this and can be applied to various power conversion devices. In the present embodiment, a two-level power conversion device is described, but a three-level or multi-level power conversion device may also be used, and when power is supplied to a single-phase load, the semiconductor device 202 according to the first to fifth embodiments may be applied to a single-phase inverter. Furthermore, when power is supplied to a DC load or the like, the semiconductor device 202 according to the first to fifth embodiments can also be applied to a DC / DC converter or an AC / DC converter.

[0072] Furthermore, the power conversion device to which the semiconductor device 202 according to any one of the first to fifth embodiments is applied is not limited to the case where the load is an electric motor, but can also be used, for example, as a power supply device for an electric discharge machine, a laser processing machine, an induction heating cooker, or a contactless power supply system, and can also be used as a power conditioner for a solar power generation system, a power storage system, etc.

[0073] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

[0074] Various aspects of the present disclosure are summarized below as appendices.

[0075] (Appendix 1) a circuit board including an insulating layer and a circuit pattern provided on an upper surface of the insulating layer; a semiconductor element mounted on the circuit pattern; a resin case provided to surround the circuit board in a top view; an exterior terminal formed of a spring material and attached to a terminal holding portion of the resin case; an adhesive that bonds the resin case and the insulating layer exposed along the peripheral edge of the circuit board, the terminal holding portion of the resin case includes a recess recessed downward and a flat surface extending from an opening of the recess toward an inner periphery, the recess includes an outer peripheral side surface, an inner peripheral side surface, and a bottom surface connecting the outer peripheral side surface and the inner peripheral side surface, the exterior terminal includes a first extending portion whose tip end protrudes upward and whose base end extends and contacts the outer peripheral side surface of the recess, a second extending portion which extends and contacts the flat surface of the terminal holding portion and is wire-bonded to an upper surface thereof, and a curved portion which is provided between the first extending portion and the second extending portion and is fixed to the recess, The bent portion of the exterior terminal is compressed within the recess and fixed to the recess by a reaction force received from the recess.

[0076] (Appendix 2) 2. The semiconductor device according to claim 1, wherein the flat surface of the terminal holding portion is provided with a protrusion for holding a tip of the second extension portion of the exterior terminal.

[0077] (Appendix 3) 3. The semiconductor device according to claim 1, wherein the resin case includes a lower case and an upper case disposed on the lower case.

[0078] (Appendix 4) 4. The semiconductor device according to claim 3, wherein the resin case has a notch corresponding to a boundary between the second extending portion and the curved portion of the exterior terminal.

[0079] (Appendix 5) 5. The semiconductor device according to claim 4, wherein the inner peripheral side surface of the recess is formed in an inclined shape so that the opening side is closer to the outer peripheral side surface than the bottom surface side.

[0080] (Appendix 6) the upper case is provided with a terminal insertion hole into which the first extension portion of the exterior terminal is inserted, 4. The semiconductor device according to claim 3, wherein a lower end portion of the terminal insertion hole is formed in a tapered shape that widens from top to bottom.

[0081] (Appendix 7) A lower end of the upper case is provided with an upper case protrusion that protrudes downward, a lower case recess that can be fitted onto the upper case protrusion is provided at an upper end of the lower case; 4. The semiconductor device according to claim 3, wherein the upper case and the lower case are connected by fitting.

[0082] (Appendix 8) A semiconductor device as described in Appendix 7, wherein the portion of the contact area between the upper case and the lower case, excluding the mating area, is formed in an inclined shape with a height that increases from the inner side to the outer side of the resin case.

[0083] (Appendix 9) the upper case is provided with a terminal insertion hole into which the first extension portion of the exterior terminal is inserted, 9. The semiconductor device according to claim 7, wherein in the area between adjacent terminal insertion holes where the exterior terminals are not attached, a gap is provided only on the inner circumferential side of the portion where the upper case and the lower case contact each other.

[0084] (Appendix 10) A method for manufacturing the semiconductor device according to claim 1, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the resin case and attaching the exterior terminal to the resin case; applying the adhesive to the peripheral edge of the circuit board; a step of placing the resin case on the peripheral edge portion of the circuit board via the adhesive; a bonding step of heating the adhesive to harden the adhesive and bond the resin case to the peripheral edge of the circuit board; A method for manufacturing a semiconductor device, comprising:

[0085] (Appendix 11) 11. The method for manufacturing a semiconductor device according to claim 10, further comprising, after the bonding step, a wire bonding step of electrically connecting the semiconductor element and the circuit pattern.

[0086] (Appendix 12) A method for manufacturing the semiconductor device according to claim 3, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the lower case and attaching the exterior terminal to the lower case; applying the adhesive to the peripheral edge of the circuit board; placing the lower case on the peripheral edge of the circuit board via the adhesive; a bonding step of heating the adhesive to harden it and bond the lower case and the peripheral portion of the circuit board together; a connecting step of inserting the first extension portion of the exterior terminal into a terminal insertion hole provided in the upper case and connecting the upper case to the lower case; A method for manufacturing a semiconductor device, comprising:

[0087] (Appendix 13) 13. The method for manufacturing a semiconductor device according to claim 12, further comprising, after the connecting step, a wire bonding step of electrically connecting the semiconductor element and the circuit pattern.

[0088] (Appendix 14) A method for manufacturing the semiconductor device according to claim 3, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the lower case and attaching the exterior terminal to the lower case; applying the adhesive to the peripheral edge of the circuit board; placing the lower case on the peripheral edge of the circuit board via the adhesive; a bonding step of heating the adhesive to harden it and bond the lower case and the peripheral portion of the circuit board together; a wire bonding step of electrically connecting the semiconductor element and the circuit pattern; a connecting step of inserting the first extension portion of the exterior terminal into a terminal insertion hole provided in the upper case and connecting the upper case to the lower case; A method for manufacturing a semiconductor device, comprising:

[0089] (Appendix 15) a main conversion circuit including the semiconductor device according to any one of Supplementary Note 1 to Supplementary Note 9, which converts input power and outputs the converted power; a control circuit that outputs a control signal to the main conversion circuit to control the main conversion circuit; A power conversion device comprising: [Explanation of symbols]

[0090] 1 circuit board, 3 insulating layer, 4 circuit pattern, 5 semiconductor element, 7 upper case, 7A terminal insertion hole, 8 lower case, 8A recess, 8B outer peripheral side surface, 8C bottom surface, 8D inner peripheral side surface, 8E flat surface, 9 resin case, 10 adhesive, 12 exterior terminal, 12A first extension portion, 12B curved portion, 12C second extension portion, 15 protrusion portion, 16 terminal holding portion, 18 cutout portion, 20 upper case convex portion, 21 lower case recess, 22 gap, 200 power conversion device, 201 main conversion circuit, 202 semiconductor device, 203 control circuit.

Claims

1. a circuit board including an insulating layer and a circuit pattern provided on an upper surface of the insulating layer; a semiconductor element mounted on the circuit pattern; a resin case provided to surround the circuit board in a top view; an exterior terminal formed of a spring material and attached to a terminal holding portion of the resin case; an adhesive that bonds the resin case and the insulating layer exposed along the peripheral edge of the circuit board, the terminal holding portion of the resin case includes a recess recessed downward and a flat surface extending from an opening of the recess toward an inner periphery, the recess includes an outer peripheral side surface, an inner peripheral side surface, and a bottom surface connecting the outer peripheral side surface and the inner peripheral side surface, The exterior terminal includes a first extending portion having a tip end protruding upward and a base end extending and contacting the outer peripheral side surface of the recess, a second extending portion extending and contacting the flat surface of the terminal holding portion and being wire-bonded to an upper surface thereof, and a curved portion provided between the first extending portion and the second extending portion and fixed to the recess, The bent portion of the exterior terminal is compressed within the recess and fixed to the recess by a reaction force received from the recess.

2. The semiconductor device according to claim 1 , wherein the flat surface of the terminal holding portion is provided with a protrusion for holding a tip of the second extension portion of the exterior terminal.

3. The semiconductor device according to claim 1 , wherein said resin case includes a lower case and an upper case disposed on said lower case.

4. The semiconductor device according to claim 3 , wherein the resin case has a notch at a boundary between the second extending portion and the curved portion of the exterior terminal.

5. The semiconductor device according to claim 4 , wherein the inner peripheral side surface of the recess is formed to be inclined so that the opening side is closer to the outer peripheral side surface than the bottom surface side.

6. the upper case is provided with a terminal insertion hole into which the first extension portion of the exterior terminal is inserted, 4. The semiconductor device according to claim 3, wherein a lower end portion of said terminal insertion hole is formed in a tapered shape that widens from the top to the bottom.

7. A lower end of the upper case is provided with an upper case protrusion that protrudes downward, a lower case recess that can be fitted onto the upper case protrusion is provided at an upper end of the lower case; 4. The semiconductor device according to claim 3, wherein said upper case and said lower case are connected by fitting.

8. 8. The semiconductor device according to claim 7, wherein a portion of the contact area between the upper case and the lower case, excluding a fitting portion, is formed in an inclined shape that increases in height from an inner periphery side of the resin case to an outer periphery side.

9. the upper case is provided with a terminal insertion hole into which the first extension portion of the exterior terminal is inserted, 8. The semiconductor device according to claim 7, wherein a gap is provided only on the inner periphery of a portion where the upper case and the lower case contact each other in an area between adjacent terminal insertion holes where the exterior terminals are not attached.

10. 10. A method for manufacturing a semiconductor device according to claim 1, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the resin case and attaching the exterior terminal to the resin case; applying the adhesive to the peripheral edge of the circuit board; a step of placing the resin case on the peripheral edge portion of the circuit board via the adhesive; a bonding step of heating the adhesive to harden the adhesive and bond the resin case to the peripheral edge of the circuit board; A method for manufacturing a semiconductor device, comprising:

11. The method for manufacturing a semiconductor device according to claim 10, further comprising, after said adhering step, a wire bonding step of electrically connecting said semiconductor element and said circuit pattern.

12. 4. A method for manufacturing a semiconductor device according to claim 3, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the lower case and attaching the exterior terminal to the lower case; applying the adhesive to the peripheral edge of the circuit board; placing the lower case on the peripheral edge of the circuit board via the adhesive; a bonding step of heating the adhesive to harden it and bond the lower case and the peripheral portion of the circuit board together; a connecting step of inserting the first extension portion of the exterior terminal into a terminal insertion hole provided in the upper case and connecting the upper case to the lower case; A method for manufacturing a semiconductor device, comprising:

13. 13. The method for manufacturing a semiconductor device according to claim 12, further comprising, after said connecting step, a wire bonding step of electrically connecting said semiconductor element and said circuit pattern.

14. 4. A method for manufacturing a semiconductor device according to claim 3, comprising: providing the circuit board; a step of inserting the exterior terminal into the terminal holding portion of the lower case and attaching the exterior terminal to the lower case; applying the adhesive to the peripheral edge of the circuit board; placing the lower case on the peripheral edge of the circuit board via the adhesive; a bonding step of heating the adhesive to harden it and bond the lower case and the peripheral portion of the circuit board together; a wire bonding step of electrically connecting the semiconductor element and the circuit pattern; a connecting step of inserting the first extension portion of the exterior terminal into a terminal insertion hole provided in the upper case and connecting the upper case to the lower case; A method for manufacturing a semiconductor device, comprising:

15. a main conversion circuit including the semiconductor device according to any one of claims 1 to 9, which converts input power and outputs the converted power; a control circuit that outputs a control signal to the main conversion circuit to control the main conversion circuit; A power conversion device comprising:

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