Non-contact data transmitter / receiver and method of manufacturing the same

Abstract

To provide a non-contact data transmitter / receiver in which an external force applied to an IC chip can be reduced, and a method of manufacturing the same.SOLUTION: A non-contact data transmitter / receiver 10 comprises a substrate 50 having a principal surface 50a, an IC chip 20 formed on the substrate 50, an antenna connected to the IC chip, a first buffer part 1, and a second buffer part 2. The first buffer part 1 is formed outside the IC chip 20 in plan view to protrude from the principal surface 50a of the substrate 50. The second buffer part 2 covers at least a part of the IC chip 20 in plan view. A height of protrusion of the second buffer part 2 is lower than that of the first buffer part 1.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a contactless data transmitter / receiver and a method for manufacturing the same. [Background technology]

[0002] RFID tags are used for purposes such as distribution management. An RFID tag (a contactless data transmitter / receiver) includes an IC chip, an antenna connected to the IC chip, and a substrate. In RFID tags, protrusions made of resin or the like are sometimes formed around the IC chip on the surface of the substrate to prevent external force from being applied to the IC chip (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-196630 [Patent Document 2] Japanese Patent Application Laid-Open No. 2002-110713 Summary of the Invention [Problem to be solved by the invention]

[0004] The RFID tag is attached to the surface of the target object, such as a cylindrical container. When the surface on which an item is placed is curved and convex, the RFID tag will bend convexly, increasing the amount of protrusion of the IC chip. Therefore, when the RFID tag comes into contact with surrounding items, it may be more susceptible to external forces being applied to the IC chip. For example, consider a situation in which RFID tags are placed on the outer periphery of multiple cylindrical containers, each of which is placed close to one another. Because the outer periphery of the containers is curved and convex, the RFID tag may come into contact with the adjacent containers, potentially applying external forces to the IC chip.

[0005] An object of one aspect of the present invention is to provide a contactless data transmitter / receiver that can suppress external forces applied to an IC chip, and a method for manufacturing the same. [Means for solving the problem]

[0006] One aspect of the present invention provides a contactless data transmitter / receiver comprising a substrate having a main surface, an IC chip formed on the substrate, an antenna connected to the IC chip, one or more first buffer sections formed on the substrate outside the IC chip in a planar view and protruding from the main surface, and a second buffer section covering at least a portion of the IC chip in a planar view, wherein the protruding height of the second buffer section is shorter than the protruding height of the first buffer section.

[0007] It is preferable that the first buffer section is annular in shape surrounding the IC chip in a plan view and is connected to the second buffer section along the entire periphery.

[0008] It is preferable that a plurality of the first buffer sections are provided, and that the plurality of first buffer sections are arranged in a ring shape surrounding the IC chip in a plan view.

[0009] One aspect of the present invention provides a method for manufacturing a contactless data transmitter / receiver, the method comprising the steps of: preparing a contactless data transmitter / receiver comprising a substrate having a main surface, an IC chip formed on the substrate, and an antenna connected to the IC chip; forming one or more first convex portions protruding from the main surface of the substrate outside the IC chip in a planar view using a curable resin; forming second convex portions on the substrate using a curable resin, the second convex portions covering at least a portion of the IC chip in a planar view; and hardening the first convex portions and the second convex portions to form a first buffer portion and a second buffer portion having a protruding height lower than that of the first buffer portion. [Effects of the Invention]

[0010] According to one aspect of the present invention, it is possible to provide a non-contact data transmitter / receiver that can suppress external forces applied to an IC chip, and a method for manufacturing the same. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of a non-contact data transmitter / receiver according to a first embodiment. [Figure 2] 1 is a plan view of a portion of a non-contact data transmitter / receiver according to a first embodiment. [Figure 3] 3 is a plan view of a first buffer section and a second buffer section of the non-contact data transmitter / receiver according to the first embodiment. FIG. [Figure 4] 3 is a cross-sectional view of a first buffer section and a second buffer section of the non-contact data transmitter / receiver according to the first embodiment. FIG. [Figure 5] 3A to 3C are diagrams illustrating a method for manufacturing a non-contact data transmitter / receiver according to the first embodiment. [Figure 6] 1A and 1B are diagrams showing how to use a non-contact data transmitter / receiver according to a first embodiment. [Figure 7] 1A and 1B are diagrams showing how to use a non-contact data transmitter / receiver according to a first embodiment. [Figure 8] FIG. 10 is a plan view of a first buffer section and a second buffer section of a non-contact data transmitter / receiver according to a second embodiment. [Figure 9] 10 is a cross-sectional view of a first buffer section and a second buffer section of a non-contact data transmitter / receiver according to a second embodiment. FIG. [Figure 10] 10A to 10C are diagrams illustrating a method for manufacturing a non-contact data transmitter / receiver according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] The non-contact data transmitter / receiver of this embodiment will be specifically described below with reference to the drawings.

[0013] [Non-contact data transmitter / receiver] (first embodiment) FIG. 1 is a plan view showing a non-contact data transmitter / receiver 10 according to the first embodiment. FIG. 2 is a plan view of a portion of the non-contact data transmitter / receiver 10. FIG. 3 is a plan view of the first buffer section 1 and the second buffer section 2. FIG. 4 is a cross-sectional view of the first buffer section 1 and the second buffer section 2. FIG. 4 is a cross-sectional view taken along line A-A' in FIG. 3. The antenna 30 is not shown in FIGS. 3 and 4.

[0014] 1, the non-contact data transmitter / receiver 10 includes a substrate 50, an IC chip 20, an antenna 30, one or more first buffer sections 1, a second buffer section 2, and an adhesive layer 60 (see FIG. 4). The non-contact data transmitter / receiver 10 is an RFID (Radio Frequency Identification) tag.

[0015] The substrate 50 has, for example, a rectangular shape in a plan view. The surface on the +Z side of the substrate 50 is a first main surface 50a (main surface). The surface of the substrate 50 opposite to the first main surface 50a is a second main surface 50b (see FIG. 4).

[0016] The substrate 50 is formed of, for example, a resin substrate, a paper substrate, a ceramic substrate, or the like. Materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, and polycarbonate. The substrate 50 may be formed of a fiber-reinforced resin. For example, a substrate can be used in which glass fiber cloth is impregnated with epoxy resin and then thermally cured.

[0017] The longitudinal direction (left-right direction in FIG. 1) of the first main surface 50a of the substrate 50 is the X direction. One side of the X direction (right side in FIG. 1) is the +X side. The direction opposite the +X side is the -X side. The lateral direction (up-down direction in FIG. 1) of the first main surface 50a of the substrate 50 is the Y direction. The Y direction is perpendicular to the X direction. One side of the Y direction (upper side in FIG. 1) is the +Y side. The direction opposite the +Y side is the -Y side.

[0018] The Z direction is perpendicular to the X and Y directions. One direction in the Z direction is the +Z side. The direction opposite the +Z side is the -Z side. Viewing from the Z direction is called planar view. The up-down direction is tentatively defined according to Figure 4. The upper side (+Z side) in Figure 4 is the upper side. The lower side (+Z side) in Figure 4 is the lower side. The up-down direction defined here does not limit the position of the contactless data transmitter / receiver when in use.

[0019] The antenna 30 has two main line portions 31 and 32, two impedance adjustment portions 33 and 34, and two radiating portions 35 and 36. The antenna 30 is formed on a first main surface 50a of a substrate 50.

[0020] The two main line portions 31, 32 extend in directions away from each other along the longitudinal direction (X direction) of the base material 50. The two main line portions 31, 32 are positioned symmetrically with respect to the center of the longitudinal direction of the base material 50. The base ends of the main line portions 31, 32 are electrically connected to each other.

[0021] The tips (ends opposite the base ends) of the two main line portions 31 and 32 are connected to radiating portions 35 and 36, respectively. Main line portion 31 and radiating portion 35 form radiating element 37. Main line portion 32 and radiating portion 36 form radiating element 38.

[0022] The radiating sections 35, 36 have meander sections 39, 40, antenna ends 41, 42, and folded sections 43, 44, 45, 46. The base end of the meander section 39 is connected to the tip of the main line section 31. The base end of the meander section 40 is connected to the tip of the main line section 32. The length and number of folds of the meander sections 39, 40 are adjusted appropriately depending on the desired communication distance of the antenna 30.

[0023] The antenna end 41 is connected to the tip (the end opposite the base end) of the meander portion 39. The antenna end 42 is connected to the tip (the end opposite the base end) of the meander portion 40. The shape of the antenna ends 41, 42 is, for example, rectangular (square, oblong, etc.) in plan view.

[0024] The folded portions 43 and 44 each start from both ends of the width direction (Y direction) of the antenna end 41 and extend toward the main line portion 31 (-X side). The folded portions 45 and 46 each start from both ends of the width direction (Y direction) of the antenna end 42 and extend toward the main line portion 32 (+X side).

[0025] 2, the impedance adjustment parts 33, 34 include two first extending parts 51, 52, two inverted parts 53, 54, two second extending parts 55, 56, and two tip extending parts 57, 58. The two impedance adjustment parts 33, 34 are located symmetrically with respect to the center of the substrate 50 in the longitudinal direction. Each of the two impedance adjustment parts 33, 34 is formed in a U-shape.

[0026] Portions including the base ends of the first extending portions 51 and 52 are connected to the main line portions 31 and 32, respectively. The two first extending portions 51 and 52 extend in directions away from each other along the longitudinal direction of the base material 50 (X direction).

[0027] The two inverted portions 53, 54 connect the tips of the first extending portions 51, 52 and the base ends of the second extending portions 55, 56, respectively. The two inverted portions 53, 54 extend in the width direction (Y direction) of the base material 50 from the tips (ends opposite the base ends) of the first extending portions 51, 52. The inverted portions 53, 54 may have curved shapes that are convex in directions away from each other.

[0028] The two second extending portions 55, 56 extend from the tips of the inverted portions 53, 54 in directions approaching each other along the longitudinal direction (X direction) of the base material 50. The tips of the two second extending portions 55, 56 face each other.

[0029] The two tip extending portions 57, 58 protrude from the tips of the second extending portions 55, 56, respectively. The tip extending portion 57 extends in a direction (-X side) approaching the tip of the second extending portion 56. The tip extending portion 58 protrudes in a direction (+X side) approaching the tip of the second extending portion 55.

[0030] Of the two tip extensions 57, 58, at least the length portions including the tips are formed parallel to one another. The two tip extensions 57, 58 are formed spaced apart from one another in the width direction (Y direction) of the base material 50. The length portions including the tips of the two tip extensions 57, 58 face each other in the width direction of the base material 50.

[0031] The antenna 30 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The antenna 30 may also be formed from, for example, a metal foil, a thin metal film formed by plating or the like, a thin metal film formed by metal vapor deposition or the like, a metal plate, or the like.

[0032] The IC chip 20 is not particularly limited as long as it is capable of writing and reading information in a non-contact state via the antenna 30. Examples of the IC chip 20 include a non-contact IC tag, a non-contact IC label, and a non-contact IC card. The IC chip 20 is mounted on the first main surface 50a of the substrate 50.

[0033] The IC chip 20 has, for example, a rectangular shape in plan view having two sides along the Y direction and two sides along the X direction. The IC chip 20 has, for example, a rectangular shape with a dimension in the Y direction greater than a dimension in the X direction.

[0034] The IC chip 20 is disposed across the tip extension portions 57 and 58. The IC chip 20 is electrically connected to the tip extension portions 57 and 58.

[0035] 2 to 4, the first buffer section 1 is formed on the first main surface 50a of the base material 50. In this embodiment, a plurality of first buffer sections 1 (specifically, six) are provided. 3, the first buffer sections 1 are formed outside the IC chip 20 in plan view. The multiple first buffer sections 1 are arranged in a ring shape surrounding the IC chip 20 in plan view. More specifically, the multiple first buffer sections 1 are arranged in a ring shape centered on the center 20a of the IC chip 20. The multiple first buffer sections 1 are formed at intervals in the arrangement direction.

[0036] The multiple first buffer sections 1 are preferably located at positions that are rotationally symmetric about the center 20a of the IC chip 20 in a plan view. That is, the multiple first buffer sections 1 are preferably located at positions that are rotationally symmetric about the center 20a with n-fold symmetry (n is an integer of 2 or more). In this embodiment, the six first buffer sections 1 are located at positions that are rotationally symmetric about the center 20a of the IC chip 20 with six-fold symmetry.

[0037] The first buffer sections 1 are arranged at equal pitches around the center 20a of the IC chip 20. The angle α between the centers of adjacent first buffer sections 1 is, for example, 60°. The number of first buffer sections 1 is not particularly limited. The number of first buffer sections 1 is, for example, 4 to 10. The number of first buffer sections 1 may also be 4 to 6.

[0038] The shape of the first buffer section 1 in a plan view is, for example, a circular shape. Note that there is no particular limitation on the shape of the first buffer section 1 in a plan view. The shape of the first buffer section 1 in a plan view may be a polygonal shape (rectangular, triangular, etc.), an elliptical shape, etc.

[0039] As shown in FIG. 4, the first buffer section 1 is formed to protrude from the first main surface 50a toward the +Z side. The cross-sectional shape of the first buffer section 1 (the shape of the cross section along the Z direction) is, for example, a semi-ellipse. A semi-ellipse has a semicircle that is convex upward and straight lines hanging down from both ends of this semicircle. The cross-sectional shape of the first buffer section 1 is not particularly limited. The cross-sectional shape of the first buffer section 1 may be a semicircle, a polygon (rectangle, triangle, etc.), or the like.

[0040] The first buffer section 1 is formed higher than the IC chip 20. That is, the height H1 of the first buffer section 1 is greater than the height H20 of the IC chip 20. Because the first buffer section 1 is formed higher than the IC chip 20, when the non-contact data transmitter / receiver 10 comes into contact with another object, external force is less likely to be applied to the IC chip 20.

[0041] As shown in FIG. 3, the second buffer section 2 is formed on the first main surface 50a of the base material 50. In a plan view, the second buffer section 2 covers at least a portion of the IC chip 20. In this embodiment, the second buffer section 2 covers the entire IC chip 20 in a plan view. The second buffer section 2 encompasses the entire IC chip 20 in a plan view, and extends over an area wider than the IC chip 20.

[0042] In plan view, the second buffer section 2 has a circular shape centered on the center 20a of the IC chip 20. The outer diameter R2 of the second buffer section 2 is greater than, for example, the length L1 (dimension in the Y direction) and width W1 (dimension in the X direction) of the IC chip 20. The shape of the second buffer section 2 in plan view is not particularly limited. The shape of the second buffer section 2 in plan view may be a polygonal shape (rectangular, triangular, etc.), an elliptical shape, etc.

[0043] The outer diameter R2 of the second buffering section 2 is, for example, the same as or larger than the outer diameter R1 of the first buffering section 1. The outer diameter of the second buffering section 2 may be smaller than the outer diameter of the first buffering section 1. The outer diameter R2 of the second buffer section 2 is, for example, smaller than the inner diameter R3 of the first buffer section 1 (the diameter of the inscribed circle of the multiple first buffer sections 1). Therefore, the second buffer section 2 is formed apart from the first buffer section 1 in plan view. Note that the outer diameter of the second buffer section 2 may be the same as the diameter of the inscribed circle of the first buffer section 1 or larger than the inner diameter of the inscribed circle.

[0044] As shown in FIG. 4, the second buffer section 2 is formed to protrude from the first main surface 50a toward the +Z side. The cross-sectional shape of the second buffer section 2 (shape of the cross section along the Z direction) is, for example, a shape having a curved portion that is convex upward and straight lines hanging down from both ends of this curved portion. The cross-sectional shape of the second buffer section 2 is not particularly limited. The cross-sectional shape of the second buffer section 2 may be a semicircular shape, a polygonal shape (rectangular shape, triangular shape, etc.), etc.

[0045] The second buffer section 2 is formed higher than the IC chip 20. That is, the height H2 of the second buffer section 2 is greater than the height H20 of the IC chip 20. In this embodiment, the second buffer section 2 encompasses the entire IC chip 20. This makes it less likely that an external force will be applied to the IC chip 20 when the non-contact data transmitter / receiver 10 comes into contact with another item.

[0046] The height H2 of the second buffer section 2 is lower than the height H1 of the first buffer section 1. With this configuration, when the non-contact data transmitter / receiver 10 comes into contact with another item, the item is less likely to come into contact with the second buffer section 2. Therefore, external force is less likely to be applied to the IC chip 20.

[0047] The first buffer section 1 and the second buffer section 2 have cushioning properties. The first buffer section 1 and the second buffer section 2 may have, for example, a compressive modulus of elasticity (for example, in accordance with JIS K 7181) of 0.01 to 0.1 MPa. If the compressive modulus of elasticity is within this range, the cushioning performance of the first buffer section 1 and the second buffer section 2 can be improved.

[0048] The material of the first buffer section 1 and the second buffer section 2 can be, for example, a curable resin. Examples of the curable resin include ultraviolet curable resin and thermosetting resin. Examples of the curable resin include acrylic resin, epoxy resin, polyurethane resin, silicone resin, and phenolic resin. The material of the first buffer section 1 and the second buffer section 2 can be a foamable resin. The material of the first buffer section 1 and the material of the second buffer section 2 can be the same or different.

[0049] The adhesive layer 60 is formed on the second main surface 50b of the base material 50. The adhesive layer 60 is formed of, for example, a known adhesive. The non-contact data transmitter / receiver 10 has the adhesive layer 60, so that it can be attached to the surface of an article.

[0050] [Method for manufacturing a non-contact data transmitter / receiver] (First embodiment) A method for manufacturing the contactless data transmitter / receiver 10 will now be described. FIG. 5 is a diagram showing a method for manufacturing a non-contact data transmitter / receiver according to the first embodiment.

[0051] (1) Preparation process As shown in Fig. 5(A), a contactless data transmitter / receiver 10A is prepared. The contactless data transmitter / receiver 10A includes a substrate 50, an IC chip 20, and an antenna 30 (see Fig. 1). The contactless data transmitter / receiver 10A is an intermediate product in the manufacture of contactless data transmitters / receivers.

[0052] (2) First convex portion forming process 5(B), one or more first protrusions 11 are formed by supplying uncured curable resin to the first main surface 50a. The first protrusions 11 protrude from the first main surface 50a. The multiple first protrusions 11 are arranged, for example, in a ring shape surrounding the IC chip 20 in a plan view.

[0053] (3) Second convex portion forming process 5(C), uncured curable resin is supplied to the first main surface 50a to form the second protrusion 12. The second protrusion 12 covers at least a part of the IC chip 20 in plan view.

[0054] (4) Curing process As shown in Fig. 5(D), the first convex portion 11 and the second convex portion 12 are cured by ultraviolet irradiation or the like to form the first buffer portion 1 and the second buffer portion 2. In this way, the non-contact data transmitter / receiver 10 shown in Figs. 1 to 4 is obtained.

[0055] [Usage of contactless data transmitter / receiver] 6 and 7 are diagrams showing how the non-contact data transmitter / receiver is used. As shown in Fig. 6, the non-contact data transmitter / receiver 10 is placed on the surface of a target item. The non-contact data transmitter / receiver 10 can be placed, for example, on the outer circumferential surface of a cylindrical container 100. The non-contact data transmitter / receiver 10 can be attached to the outer circumferential surface of the container 100 by an adhesive layer 60 (see Fig. 4).

[0056] 7, it is assumed that a non-contact data transmitter / receiver 10 is installed on the outer peripheral surface of each of a plurality of containers 100, and the plurality of containers 100 are arranged in close proximity. When a non-contact data transmitter / receiver 10 comes into contact with an adjacent container 100, an external force is applied to the non-contact data transmitter / receiver 10 by the container 100.

[0057] Since the non-contact data transmitter / receiver 10 is installed on a curved convex surface, the IC chip 20 protrudes relatively greatly, which may make the IC chip 20 more susceptible to external forces. However, the non-contact data transmitter / receiver 10 is provided with the second buffer section 2 that covers the IC chip 20, so that the external forces applied to the IC chip 20 can be alleviated by the second buffer section 2.

[0058] [Advantages of the non-contact data transmitter / receiver and manufacturing method according to the embodiment] The non-contact data transmitter / receiver 10 of this embodiment is provided with a second buffer section 2 that covers at least a portion of the IC chip 20. When the non-contact data transmitter / receiver 10 is installed on a curved convex surface, the IC chip 20 may be susceptible to external force from other objects, but the external force applied to the IC chip 20 can be alleviated by the second buffer section 2. This makes it possible to make the IC chip 20 less susceptible to damage.

[0059] Since the multiple first buffer sections 1 are arranged in a ring shape surrounding the IC chip 20, the effect of mitigating external forces can be obtained regardless of the position, shape, etc. of the item that comes into contact with the non-contact data transmitter / receiver 10.

[0060] In the non-contact data transmitter / receiver 10, the first buffer section 1 and the second buffer section 2 can be easily formed.

[0061] According to the manufacturing method, the first buffer section 1 and the second buffer section 2 are formed using a curable resin. This makes it possible to easily manufacture the non-contact data transmitter / receiver 10 that can suppress external forces applied to the IC chip 20.

[0062] [Non-contact data transmitter / receiver] (Second embodiment) Fig. 8 is a plan view of the first buffer section 101 and the second buffer section 102 of the non-contact data transmitter / receiver 110 according to the second embodiment. Fig. 9 is a cross-sectional view of the first buffer section 101 and the second buffer section 102 of the non-contact data transmitter / receiver 110. Fig. 9 is a cross-sectional view taken along line B-B' in Fig. 8. The antenna 30 is omitted from Figs. 8 and 9. The antenna 30 is omitted from Figs. 8 and 9.

[0063] As shown in Fig. 8, the non-contact type data transmitter / receiver 110 differs from the non-contact type data transmitter / receiver 10 according to the first embodiment (see Figs. 8 and 9) in that the non-contact type data transmitter / receiver 110 is provided with a first buffer section 101 and a second buffer section 102 instead of the first buffer section 1 and the second buffer section 2. Hereinafter, the same reference numerals will be used to designate components common to the non-contact type data transmitter / receiver 10, and a description thereof will be omitted.

[0064] The first buffer section 101 is formed outside the IC chip 20 in plan view. The first buffer section 101 is formed in a ring shape surrounding the IC chip 20 in plan view. More specifically, the first buffer section 101 is formed in a ring shape centered on the center 20a of the IC chip 20. There are no particular limitations on the shape of the first buffer section 101 in a plan view, and the shape of the first buffer section 101 in a plan view may be a polygonal shape (rectangular, triangular, etc.), an elliptical shape, or the like.

[0065] 9, the first buffer section 101 is formed to protrude from the first main surface 50a to the +Z side. The cross-sectional shape of the first buffer section 101 (shape of the cross section along the Z direction) is not particularly limited, and may be, for example, a semi-elliptical shape, a semi-circular shape, a polygonal shape (rectangular shape, triangular shape, etc.), etc.

[0066] The first buffering section 101 is formed to be higher than the IC chip 20. That is, the height H101 of the first buffering section 101 is greater than the height H20 of the IC chip 20. Because the first buffering section 101 is formed to be higher than the IC chip 20, when the non-contact data transmitter / receiver 110 comes into contact with another object, an external force is less likely to be applied to the IC chip 20.

[0067] As shown in FIG. 8, the second buffer section 102 is formed on the first main surface 50a of the base material 50. In a plan view, the second buffer section 102 covers at least a portion of the IC chip 20. In this embodiment, the second buffer section 102 covers the entire IC chip 20 in a plan view. The second buffer section 102 encompasses the entire IC chip 20 in a plan view, and extends over an area wider than the IC chip 20.

[0068] In plan view, the second buffering section 102 has a circular shape centered at the center 20a of the IC chip 20. The second buffering section 102 is connected to the first buffering section 101 along the entire periphery. In other words, the second buffering section 102 is formed integrally with the first buffering section 101.

[0069] 9, the second buffering portion 102 is formed to protrude from the first main surface 50a toward the +Z side. The cross-sectional shape of the second buffering portion 102 (the shape of the cross section along the Z direction) is, for example, a shape that becomes thinner as it approaches the center. The outer surface of the second buffering portion 102 is concave.

[0070] The second buffer section 102 is formed to be higher than the IC chip 20. That is, the height H102 of the second buffer section 102 is greater than the height H20 of the IC chip 20. The second buffer section 102 encompasses, for example, the entire IC chip 20. This makes it less likely that an external force will be applied to the IC chip 20 when the non-contact data transmitter / receiver 110 comes into contact with another item.

[0071] The height H102 of the second buffering section 102 is lower than the height H101 of the first buffering section 101. With this configuration, when the non-contact data transmitter / receiver 110 comes into contact with another object, the object is less likely to come into contact with the second buffering section 102. Therefore, external force is less likely to be applied to the IC chip 20.

[0072] The first buffer section 101 and the second buffer section 102 have cushioning properties. The physical properties (compression modulus, etc.) and constituent materials of the first buffer section 101 and the second buffer section 102 may be the same as those of the first buffer section 1 and the second buffer section 2, respectively.

[0073] [Method for manufacturing a non-contact data transmitter / receiver] (Second embodiment) A method for manufacturing the contactless data transmitter / receiver 110 will now be described. FIG. 10 is a diagram showing a method for manufacturing a non-contact data transmitter / receiver according to the second embodiment.

[0074] (1) Preparation process As shown in FIG. 10(A), a non-contact data transmitter / receiver 10A (see FIG. 5(A)) is prepared.

[0075] (2) First convex portion forming process 10(B), an annular first protrusion 111 is formed by supplying uncured curable resin to the first main surface 50a. The first protrusion 111 protrudes from the first main surface 50a. The first protrusion 111 surrounds the IC chip 20 in a plan view. The first protrusion 111 may be semi-cured by ultraviolet irradiation or the like.

[0076] (3) Second convex portion forming process 10(C), uncured curable resin is supplied to the first main surface 50a to form the second protrusion 112. The second protrusion 112 covers the IC chip 20 in a plan view. The second protrusion 112 is integrated with the first protrusion 111.

[0077] (4) Curing process 10(D), the first convex portion 111 and the second convex portion 112 are hardened by ultraviolet irradiation or the like to form the first buffer portion 101 and the second buffer portion 102. In this way, the non-contact data transmitter / receiver 110 is obtained (see FIGS. 8 and 9).

[0078] [Usage of contactless data transmitter / receiver] The contactless data transmitter / receiver 110 is attached to the surface of the target item. For example, the contactless data transmitter / receiver 110 can be attached to the outer surface of a cylindrical container. The contactless data transmitter / receiver 110 can be attached to the outer surface of the container by an adhesive layer 60.

[0079] [Advantages of the non-contact data transmitter / receiver and manufacturing method according to the embodiment] The non-contact data transmitter / receiver 110 of this embodiment includes a second buffer section 102 that covers at least a portion of the IC chip 20. When the non-contact data transmitter / receiver 110 is installed on a curved convex surface, the IC chip 20 may be susceptible to external force from other objects, but the external force applied to the IC chip 20 can be alleviated by the second buffer section 102. This makes it possible to make the IC chip 20 less susceptible to damage.

[0080] In the non-contact data transmitter / receiver 110, the outer surface of the second buffer section 102 is formed in a concave shape, so that when the non-contact data transmitter / receiver 110 comes into contact with another object, external force is less likely to be applied to the IC chip 20.

[0081] Since the first buffer section 101 is formed in a ring shape surrounding the IC chip 20, it can provide the effect of mitigating external forces regardless of the position, shape, etc. of the article that comes into contact with the non-contact data transmitter / receiver 110.

[0082] According to the manufacturing method, the first buffer section 101 and the second buffer section 102 are formed using a curable resin. This makes it possible to easily manufacture the non-contact data transmitter / receiver 110 that can suppress external forces applied to the IC chip 20.

[0083] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention.

[0084] In the non-contact data transmitter / receiver 10 shown in FIG. 4, the IC chip 20 is provided on the first main surface 50a of the substrate 50, but the IC chip 20 may also be provided on the second main surface 50b of the substrate 50.

[0085] 1 has main line portions 31 and 32, impedance adjustment portions 33 and 34, and radiation portions 35 and 36, but the shape of the antenna is not particularly limited. The antenna may have a structure (e.g., a bowtie shape) having a first conductive portion and a second conductive portion extending in different directions. [Explanation of symbols]

[0086] 1,101...first buffer section, 2,102...second buffer section, 10,110...non-contact data transmitter / receiver, 20...IC chip, 50a...first main surface (main surface), 50...substrate, 30...antenna, H1, H101...height of first buffer section, H2, H102...height of second buffer section

Claims

1. a substrate having a main surface; an IC chip formed on the substrate; an antenna connected to the IC chip; one or more first buffer portions formed on the base material so as to protrude from the main surface outside the IC chip in a plan view; a second buffer portion that covers at least a portion of the IC chip in a plan view; Equipped with The protruding height of the second buffer portion is lower than the protruding height of the first buffer portion. Contactless data transmitter and receiver.

2. the first buffer portion is annular in shape surrounding the IC chip in a plan view and is connected to the second buffer portion along the entire periphery; 2. The non-contact data transmitter / receiver according to claim 1.

3. The first buffer section is provided in plurality, the plurality of first buffer portions are arranged in a ring shape surrounding the IC chip in a plan view; 2. The non-contact data transmitter / receiver according to claim 1.

4. preparing a contactless data transmitter / receiver including a substrate having a main surface, an IC chip formed on the substrate, and an antenna connected to the IC chip; forming one or more first protrusions protruding from the main surface of the base material using a curable resin outside the IC chip in a plan view; forming a second convex portion on the base material using a curable resin, the second convex portion covering at least a portion of the IC chip in a plan view; and hardening the first convex portion and the second convex portion to form a first buffer portion and a second buffer portion having a lower protruding height than the first buffer portion. A method for manufacturing a contactless data transmitter / receiver.

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