Electronic device

Abstract

To provide an electronic device capable of more efficiently cooling a heat-generating electronic component.SOLUTION: An electronic device 10 comprises a heat-generating storage device 60, a fan 30 including a metal housing, a heat sink 29 provided adjacent to the fan 30 and dissipating heat by airflow from the fan 30 flowing toward a vent 41, a CPU 25a, and a heat pipe 28 which transfers heat from the CPU 25a to the heat sink 29. The storage device 60 is thermally connected from the planar part 30da of the fan 30 to the planar part 29ba of the heat sink 29.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic device having heat-generating electronic components. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with a cooling module for cooling heat-generating elements such as a CPU. The cooling module described in Patent Document 1 is configured with a heat pipe that absorbs and transports heat generated by the CPU and other components, and a heat sink and fan that expel the heat transported by the heat pipe to the outside of the housing. Patent Document 2 exemplifies various heat sinks. In addition to the CPU, electronic devices also include electronic components that generate heat, such as SSDs. The SSD described in Patent Document 3 is provided with a heat sink. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2024-2802 [Patent Document 2] Japanese Patent Application Publication No. 2023-008497 [Patent Document 3] Japanese Patent Application Publication No. 2024-46416 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent electronic devices, electronic components such as SSDs have become more powerful and tend to generate more heat, and there is a concern that a heat sink such as that in Patent Document 3 alone will not provide sufficient cooling, resulting in a decrease in processing power due to throttling, etc.

[0005] SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device that can more efficiently cool heat-generating electronic components. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, an electronic device according to an embodiment of the present invention comprises a first electronic component that generates heat, a fan having a metal casing, and a heat sink that is arranged adjacent to the fan and dissipates heat as the airflow from the fan flows toward an air vent, and the first electronic component is thermally connected from the metal casing of the fan to the heat sink. [Effects of the Invention]

[0007] In the electronic device according to the present invention, heat-generating electronic components can be cooled more efficiently. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment, viewed from above. [Figure 2] FIG. 2 is a plan view schematically showing the internal structure of the housing. [Figure 3] FIG. 3 is a perspective view of the rear edge of the housing as seen from the bottom side. [Figure 4] FIG. 4 is a schematic side cross-sectional view of the rear edge of the housing and its surrounding area. [Figure 5] FIG. 5 is a perspective view showing a storage device and a heat dissipation structure inside an electronic device, and their surroundings. [Figure 6] FIG. 6 is an exploded perspective view of the storage device and thermal pad shown in FIG. 5, with the storage device and thermal pad removed. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell notebook PC. The electronic device 10 has a configuration in which a cover 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0011] The cover 11 is a thin, flat, box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin, flat box. A keyboard device 18 and a touchpad 19 face the top surface 12a of the housing 12. Hereinafter, the housing 12 and each component mounted thereon will be described based on the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (top and bottom) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may similarly be referred to as the Y direction and the Z direction. These directions are defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10, etc.

[0013] The housing 12 can be composed of a plate-like member 20 that forms the top surface 12a, a cover member 21 that forms the bottom surface 12b, and standing wall members 22 that form the four peripheral side surfaces 12c. The plate-like member 20 has a large rectangular opening 20a in which the keyboard device 18 is placed. A bezel 20b that surrounds the keyboard device 18 is formed around the opening 20a. The cover member 21 is formed in a plate shape (see FIG. 3). As will be described later, the housing 12 of this embodiment has a protrusion 48 near the Y2 edge of the cover member 21. The standing wall members 22 stand up between the four peripheral edges of the plate-like member 20 and the four peripheral edges of the cover member 21, and form a frame shape as a whole.

[0014] The hinge 14 is installed in a concave hinge arrangement groove 12d formed in the rear edge of the housing 12, and connects the housing 12 and the cover 11. The hinge 14 has a structure in which, for example, hinge shafts 14a (see FIG. 4) serving as rotation axes are supported at both longitudinal ends of a hinge housing 14b. The hinge 14 of this embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge arrangement groove 12d. The hinge 14 rotates integrally with the cover 11 while descending diagonally rearward (see FIG. 4). The hinge 14 has a structure that increases the rotation angle of the cover 11 in this way, a so-called drop-down structure. The hinge 14 may have a structure other than that described above.

[0015] Fig. 2 is a plan view that schematically shows the internal structure of the housing 12. Fig. 2 is a view of the inside of the housing 12 as seen from above with the plate-shaped member 20 removed.

[0016] 2, the housing 12 accommodates a cooling module 24, a motherboard 25, and a battery device 26. The housing 12 also accommodates various electronic and mechanical components such as a module card 59 and a storage device 60 (see FIG. 4).

[0017] The motherboard 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of this embodiment is equipped with a CPU (Central Processing Unit, second electronic component) 25a. In addition to the CPU 25a, the motherboard 25 can also be equipped with various other electronic components, such as a GPU (Graphics Processing Unit), memory, and a communication module.

[0019] The motherboard 25 has, for example, an upper surface (first surface 25A) as a mounting surface for the CPU 25a and the like, and a lower surface (second surface 25B) as an attachment surface for the housing 12.

[0020] Next, an example of the configuration of the cooling module 24 will be described.

[0021] The CPU 25a is a heat-generating element that generates the largest amount of heat among all the electronic components mounted in the housing 12. The cooling module 24 can absorb and dissipate the heat generated by the CPU 25a and expel it to the outside of the housing 12. The cooling module 24 may be configured to cool heat-generating elements other than the CPU 25a, such as a GPU. Furthermore, within the housing 12, a storage device 60 (see FIG. 4) also generates a considerable amount of heat. In particular, the amount of heat generated by recent storage devices 60 tends to increase as they become larger in capacity and faster. The storage device 60 and the heat dissipation structure 61 of the storage device 60 will be described later.

[0022] As shown in FIG. 2, the cooling module 24 of this embodiment includes a metal plate 27, a heat pipe (heat transporting portion) 28, a pair of heat sinks 29, 29, and a pair of fans 30, 30.

[0023] The metal plate 27 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 27 is a copper plate. The metal plate 27 extends in the X direction between the left and right fans 30. The metal plate 27 covers a portion (portion 25C) of the motherboard 25 disposed between the left and right fans 30 and the CPU 25a mounted on portion 25C from the first surface 25A side (Z1 side). The metal plate 27 functions as a heat diffusion member that absorbs and diffuses heat from the CPU 25a and other components. The metal plate 27 is connected to the surface of the CPU 25a. For example, thermally conductive grease and a copper block of approximately the same size as the outer shape of the CPU 25a are interposed between the metal plate 27 and the CPU 25a. Leaf springs 32 are attached to each edge of the metal plate 27 along the X direction. The leaf springs 32 are components that press the metal plate 27 against the CPU 25a.

[0024] The heat pipe 28 is a pipe-type heat transport device. The heat pipe 28 is configured by flattening a metal pipe to form a thin, elliptical cross section, with a working fluid sealed inside. Examples of the working fluid include water, alternative chlorofluorocarbons, acetone, and butane. The center of the heat pipe 28 in the longitudinal direction is fixed to the backside of the surface of the metal plate 27 that is connected to the CPU 25a. Both ends of the heat pipe 28 are fixed to the Z1-side surfaces (upper portions 29a) of the left and right heat sinks 29, respectively (see FIG. 4). The center of the longitudinal direction of each heat pipe 28 overlaps with the CPU 25a in the Z direction. This allows the heat pipe 28 to efficiently receive heat from the CPU 25a transferred to the metal plate 27 and transport it to the heat sinks 29 at both ends with high efficiency.

[0025] The heat sink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands in the Z direction on a predetermined base plate and extends in the Y direction. A gap is formed between adjacent fins of the heat sink 29, allowing air sent from the fan 30 to pass through. The heat sink 29 is made of a metal with high thermal conductivity, such as aluminum or copper. The heat sink 29 is disposed opposite the side surface 30a (outlet port 34) on the Y2 side of the fan 30.

[0026] The pair of fans 30, 30 are arranged side by side in the X direction, straddling the portion 25C of the motherboard 25 and the metal plate 27 between them, and face each other. Each fan 30 has an outlet 34 on its side surface 30a on the Y2 side. The outlet 34 is close to and faces the heat sink 29 behind it. A gap 56 between the heat sink 29 and the fan 30 is appropriately narrow. The heat sink 29 and the fan 30 may be in contact with each other. Each fan 30 has upper and lower surfaces 30c, 30d facing the Z direction, and may have an intake port 35 on the lower surface (metal housing) 30d on the Z2 side. The lower surface 30d is made of metal and forms part of the housing of the fan 30. In this embodiment, the upper surface 30c on the Z1 side of the fan 30 abuts against the lower surface 18a of the keyboard device 18 (see FIG. 4).

[0027] The fan 30 is a centrifugal fan that rotates an impeller 30e housed inside a housing by a motor (see FIG. 4). This allows the fan 30 to draw in air through an inlet 35 and discharge it from an outlet 34.

[0028] Fig. 3 is a perspective view of the rear edge of the housing 12 as seen from the bottom surface 12b side. Fig. 4 is a schematic side cross-sectional view of the rear edge of the housing 12 and its surrounding area.

[0029] 2 to 4, a hinge arrangement groove 12d recessed toward the Y1 side is provided in the Y2-side edge of the housing 12. The hinge arrangement groove 12d can be configured by a notch 20c formed in the plate-shaped member 20 and a rear wall 22A formed in a part of the standing wall member 22 on the Y2 side.

[0030] The cutout portion 20c is a recess formed by cutting out the rear edge portion of the plate-shaped member 20 on the Y1 side. The cutout portion 20c is formed in most of the longitudinal direction (X direction) of the bezel 20b on the Y2 side of the keyboard device 18.

[0031] The rear wall 22A is a portion of the standing wall member 22 on the Y2 side, most of which is recessed toward the Y1 side in the longitudinal direction (X direction). The rear wall 22A can be configured as a plate-shaped member standing along the Z direction. An upper end surface 22a of the rear wall 22A abuts against the lower surface 20d of the plate-shaped member 20. A heat sink 29 is disposed between the rear wall 22A and the discharge port 34 inside the housing 12. Reference numeral 36 denotes a frame member.

[0032] In the electronic device 10, each vent 41 can be divided into an area A1 at the end on the X1 side and an area A2 at the end on the X2 side. The vent 41 exhausts the air that is discharged from the outlet 34 of the fan 30 and passes through the left and right heat sinks 29 to the outside of the housing 12.

[0033] The ventilation opening 41 penetrates the rear wall 22A in the thickness direction (Y direction) and is partitioned into upper and lower sections by a horizontal partition wall 45 extending in the X direction.

[0034] The ventilation opening 41 is divided into a plurality of sections 41a in the X direction by a plurality of support columns 44b arranged, for example, along the longitudinal direction (X direction) of the rear wall 22A. The support columns 44b are rods extending along the upright direction (Z direction) of the rear wall 22A. The ventilation opening 41 is divided into a plurality of sections 41a (see FIG. 3). The ventilation opening 41 is disposed immediately behind the heat sink 29 and faces the heat sink 29.

[0035] A protrusion 48 that protrudes downward is formed on the bottom surface 12b of the housing 12. The protrusion 48 has a rectangular cylindrical shape that is long in the X direction and flattened in the Z direction. The length of the protrusion 48 in the X direction spans approximately the entire width of the housing 12 in the X direction. The protrusion 48 is provided at a position closer to the Y2 side in the front-to-rear direction (Y direction) of the bottom surface 12b. The protrusion 48 has a pair of side walls 48a, 48b that extend along its longitudinal direction (X direction). The side wall 48b on the Y2 side is located just before the rear wall 22A.

[0036] The lower part of the heat sink 29 is composed of a flat part 29ba on the Y1 side, a flat part 29bb on the Y2 side, and a downward protrusion 29bc formed between them. The upper part 29a and lower parts 29ba, 29bb, 29bc of the heat sink 29 are covered with fin-like parts formed by bending the upper and lower ends of fins as in Patent Document 2, or are covered with a metal plate separate from the fins. Depending on the conditions, the upper and lower parts of the heat sink 29 do not need to be covered with these.

[0037] The two flat surfaces 29ba, 29bb are at approximately the same height. The flat surface 29bb on the Y2 side is relatively small, ensuring that the downward protruding portion 29bc is correspondingly wide. The flat surface 29ba on the Y1 side is moderately wide in the Y direction. The downward protruding portion 29bc is inserted into the inner space 48c of the protruding portion 48 (see Figure 4), and the area of ​​the fins is correspondingly larger. The downward protruding portion 29bc may be omitted. The rear of the heat sink 29 faces the inner wall surface of the rear wall 22A and the ventilation hole 41 that penetrates the rear wall 22A. The heat sink 29 only needs to have a flat surface 29ba that is thermally connected to the storage device 60, and the shapes of other parts are not limited.

[0038] As shown in FIGS. 3 and 4, the housing 12 has a bottom vent 52 that opens to the bottom surface 12b. The bottom vent 52 is an opening for introducing air outside the housing 12 into the intake port 35 of the fan 30. In the plan view of the housing 12 shown in FIG. 2, the left and right fans 30 are arranged so as to straddle the side wall 48a in the Y direction. As shown in FIG. 4, the bottom vent 52 is formed in the cover member 21 at a position close to the side wall 48a of the protrusion 48. The bottom vent 52 may extend in the Y direction, for example, and may be configured as a plurality of slit-shaped openings that are narrow in the X direction and arranged in the X direction. The bottom vent 52 may open from the bottom surface 12b of the housing 12 to the side wall 48a.

[0039] The protrusion 48 may have an input / output port 54 at each of its longitudinal ends (left and right end faces). Examples of the input / output port 54 include an input / output port conforming to the HDMI (registered trademark) standard and an input / output port conforming to the USB 3.0 communication standard. This allows the electronic device 10 to accommodate input / output ports 54 that require a certain amount of height while minimizing the thickness of the housing 12. The protrusion 48 also functions as a rear leg that elevates the rear of the housing 12 placed on a surface such as a desk, relative to the front. This allows the keyboard device 18 of the electronic device 10 to assume a tilted position with its front lowered during use, improving operability. Reference numeral 55 in FIG. 3 denotes rubber legs that serve as legs when the electronic device 10 is placed on a surface. The rubber legs 55 on the Y2 side are provided on the bottom surface of the protrusion 48. The rubber legs 55 are not shown in FIG. 4.

[0040] In the electronic device 10, heat generated by heat generating elements such as the CPU 25a is transferred to the metal plate 27 and diffused, and is also efficiently transported to the left and right heat sinks 29 by the heat pipes 28. The left and right fans 30 draw outside air (cool air) from the bottom ventilation openings 52 into the intake ports 35 and discharge it from the exhaust ports 34.

[0041] Air discharged from the outlets 34 of the left and right fans 30 passes through the heat sink 29 and is cooled. The cooled air (warm air) is discharged to the outside of the housing 12 through the vents 41 belonging to the areas A1 and A2. In other words, the heat sink 29 is provided adjacent to the fan 30, and heat is dissipated by the airflow generated by the fan 30 flowing toward the vents 41. Reference numeral 58 in FIG. 2 denotes an airtight wall made of sponge, rubber, or the like, which restricts the airflow generated by the fan 30 so that it is directed toward the heat sink 29 and the vents 41.

[0042] In the inner space 48c of the protrusion 48, a module card 59 is provided at a position closer to the X2 side and corresponding to the area A2. The module card 59 is, for example, a WWAN (Wireless Wide Area Network) card or an AI (Artificial Intelligence) accelerator. In the inner space 48c of the protrusion 48, a memory device (first electronic component) 60 is provided at a position closer to the X1 side and corresponding to the area A1. The module card 59 and the memory device 60 have a thin, approximately rectangular plate shape that is long in the X direction. Since the module card 59 and the memory device 60 are provided in the inner space 48c, they are space-efficient. The module card 59 and the memory device 60 are provided at approximately bilaterally symmetrical positions.

[0043] Next, the storage device 60 and the heat dissipation structure 61 that dissipates heat from the storage device 60 will be described.

[0044] Fig. 5 is a perspective view showing a storage device 60 and a heat dissipation structure 61 provided inside the electronic device 10, as well as their surroundings. Fig. 6 is an exploded perspective view showing the storage device 60 and thermal pad 65 in Fig. 5 removed. The heat dissipation structure 61 includes a heat sink 29, a fan 30, and the storage device 60.

[0045] The storage device 60 is a card-type electronic module having a substantially rectangular substrate 60a that is slightly elongated in the left-right direction. A connection terminal 60aa is provided at one end (the X1 side in this case) of the substrate 60a, and a semicircular notch 60ab is formed at the other end (the X2 side in this case). A chip 60b including multiple storage elements 60ba is mounted on the substrate 60a. The chip 60b is generally surface-mounted on the top surface 60d on the Z1 side. The storage elements 60ba have a flat shape, with the Z1 side being flat. The storage elements 60ba have a relatively large area and heat generation. The storage device 60 may have a heat-conductive cover that contacts the storage elements 60ba and covers almost the entire surface on the Z1 side. The length of the storage device 60 in the X direction in this embodiment is slightly longer than the fan 30 and the heat sink 29. The storage device 60 is, for example, an SSD (Solid State Drive).

[0046] A connector 62 is provided near the right end of the motherboard 25. A connection terminal 60aa is inserted into and connected to a slot 62a of the connector 62. The connector 62 is a type of card edge socket, and is compatible with, for example, the M.2 (M.2) standard. A boss 63 is provided near the right end of the housing 12. The boss 63 is compatible with fixing a storage device 60 having standardized dimensions, and is a stepped cylinder made up of a base 63a and a protruding portion 63b. A female screw is formed in the hollow portion of the protruding portion 63b. The protruding portion 63b of the boss 63 is designed to fit into the notch 60ab.

[0047] In this way, along the X direction perpendicular to the Y direction in which the fan 30 and the heat sink 29 are arranged side by side, a connector 62 into which the connection terminal 60aa fits is provided on one X1 side of the fan 30 and the heat sink 29, and a boss 63 into which the notch 60ab fits is provided on the other X2 side. The connector 62 and the boss 63 act as a fixing means for the storage device 60, and are located on an extension of the gap 56.

[0048] As shown in Figure 6, air inlet 35 of fan 30 is circular. The fan 30 has an arc shape over a 90-degree range on the X1 and Y1 sides, but is linear on the Y2 and X2 sides. Therefore, the portion of the underside 30d on the Y2 side of air inlet 35 has a flat surface 30da of an appropriate area that continues in the X direction along gap 56. Flat surface 29ba of heat sink 29 and flat surface 30da of fan 30 have approximately the same length in the X direction, are arranged side by side with gap 56 between them, and are equal in height.

[0049] The storage device 60 is fixed by inserting the connection terminal 60aa into the slot 62a at a slight angle, then horizontally placing the periphery of the notch 60ab on the base 63a of the boss 63, and threading the screw 64 into the protrusion 63b. The storage device 60 is removable and replaceable.

[0050] A thermal pad 65 is attached to the upper side of the storage device 60. The thermal pad 65 is a type of TIM (Thermal Interface Material) that can efficiently transfer heat from the chip 60b to an object. The thermal pad 65 is made of, for example, a silicone material and has elasticity. The thermal pad 65 comes into contact with the chip 60b and is moderately compressed. The thermal pad 65 has a sufficient area to be able to come into contact with one or more memory elements 60ba that generate a large amount of heat among the multiple chips 60b, and in this embodiment, it covers almost the entire upper side of the storage device 60. Depending on the conditions, the thermal pad 65 may be omitted.

[0051] Incidentally, the connector 62 and boss 63, which serve as the base for fixing the memory device 60, are located on the extension of the gap 56, and therefore the chip 60b of the memory device 60 is thermally connected by contacting the thermal pad 65 from the flat surface 30da of the fan 30 to the flat surface 29ba of the heat sink 29.

[0052] With this configuration, the storage device 60 can use not only the heat sink 29 but also the flat surface 30da of the fan 30 as heat dissipation means, allowing for more efficient cooling. The heat sink 29 can be used efficiently as a shared heat dissipation means for both the CPU 25a and the storage device 60. The fan 30 blows air onto the heat sink 29, but the flat surface 30da, which is a metal casing, is also cooled by the airflow, allowing for cooling of the storage device 60. Furthermore, the amount of heat generated by the CPU 25a can increase with the processing load, causing the temperature of the heat sink 29 to rise accordingly, but the flat surface 30da of the fan 30 is not affected by the heat from the CPU 25a and can therefore effectively dissipate heat from the storage device 60.

[0053] The heat pipe 28 is thermally connected to the Z1 side of the heat sink 29, while the storage device 60 is thermally connected to the Z2 side. In other words, the heat pipe 28 and the storage device 60 are thermally connected to opposite sides of the heat sink 29, which reduces the thermal influence of each other. The storage device 60 does not have a dedicated heat dissipation means, which allows for a reduction in the number of parts.

[0054] The flat surface portion 29ba and the flat surface portion 30da have approximately the same contact area with the storage device 60 via the thermal pad 65, which is well balanced, but the contact area may differ to some extent depending on the thermal conditions, etc.

[0055] The flat surfaces 29ba and 30da are appropriately wide in the Y direction, allowing the storage device 60 to be placed thereon. The area of ​​the air inlet 35 has a certain amount of room, and it does not matter if the air inlet 35 is partially covered by the storage device 60. The length of the flat surfaces 29ba and 30da in the X direction is slightly shorter than that of the storage device 60, so the storage device 60 can be placed so as to straddle the flat surfaces 29ba and 30da in the X direction. The length of the flat surfaces 29ba and 30da in the X direction is appropriately long, and the gap 56 is appropriately narrow, so the contact area via the thermal pad 65 is wide. The multiple storage elements 60ba in the storage device 60, which generate a large amount of heat, overlap the flat surfaces 29ba and 30da in the X and Y directions, excluding the air inlet 35 and the gap 56, allowing for optimal heat transfer.

[0056] Users of the electronic device 10 often use the spaces on both the left and right sides of the touchpad 19 of the plate-shaped member 20 (see FIG. 1), which is the top surface of the housing 12, as palm rests to rest their hands. These areas are on the Y1 and Z1 sides of the housing 12. The storage device 60 is provided in the inner space 48c of the protruding portion 48, which corresponds to the Y2 and Z2 sides of the housing 12, and the fan 30, airtight wall 58, and battery device 26 act as partitions between the storage device 60 and the periphery of the touchpad 19. Therefore, the storage device 60 has almost no thermal effect on the palm rest, and the user does not feel any discomfort.

[0057] The heat dissipation structure 61 described above dissipates heat from the storage device 60, but a similar configuration may be applied to other heat-generating electronic components, such as the module card 59.

[0058] In addition to the above-mentioned outlets 34, each fan 30 may have an outlet on a side surface 30b (see FIG. 2) facing in the opposing direction, and may also have an air vent in the rear center of the housing separate from the left and right air vents A1 and A2. The outlets on the side surfaces 30b of the left and right fans 30 may face each other with part 25C between them, and air may be sent to both the top and bottom of the motherboard 25 and exhausted from the rear center air vent.

[0059] The present invention is not limited to the above-described embodiment, and can of course be freely modified within the scope of the gist of the present invention. [Explanation of symbols]

[0060] 10 Electronic equipment 12. Case 24 Cooling Module 25 Motherboard 25a CPU (second electronic component) 28 Heat pipe (heat transfer section) 29 Heatsink 29ba flat part 30 fans 30da flat part 34 Discharge port 35 Intake port 41 Ventilation 48 Protrusion 48c inner space 52 Bottom vent 54 input / output ports 56 Gap 59 Module Card 60 Memory device (first electronic component) 60a board 60aa connection terminal 60ab notch 60b chip 60ba memory element 61 Heat dissipation structure 62 connectors 63 Boss 65 Thermal Pad

Claims

1. a first electronic component that generates heat; a fan having a metal housing; a heat sink provided adjacent to the fan, the heat sink dissipating heat as the airflow from the fan flows toward the vent; and The first electronic component is thermally connected from the metal housing of the fan to the heat sink. An electronic device characterized by:

2. a second electronic component that generates heat; a heat transporting part that transports heat from the second electronic component to the heat sink; have An electronic device characterized by:

3. 3. The electronic device according to claim 2, The heat transporting part and the first electronic component are thermally connected to opposite sides of the heat sink. An electronic device characterized by:

4. 10. The electronic device according to claim 1, the first electronic component, the fan, and the heat sink are housed in a flat housing; The housing includes: a protrusion provided to protrude from the bottom surface and extending along the width direction; an input / output port provided on a side of the protrusion; and The first electronic component is provided on the protruding portion. An electronic device characterized by:

5. 10. The electronic device according to claim 1, the first electronic component has a substrate having a connection terminal on one end and a notch on the other end; A connector into which the connection terminal is fitted is provided on one side of the fan and the heat sink in a direction perpendicular to the direction in which the fan and the heat sink are arranged side by side, and a boss that fits into the notch is provided on the other side. An electronic device characterized by:

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