Processing system

Abstract

To provide a processing system which can process an object properly.MEANS: A processing system includes: a holding device which rotatably holds an object; a rotation device which rotates the holding device; a beam radiation device which radiates an energy beam to the object; an object measuring device which measures the object; and a control device which controls at least one of the beam radiation device and the rotation device based on information on the object measured by the object measuring device and information on a rotation axis of the rotation device. The energy beam from the beam radiation device is radiated to the object held by the holding device to process the object.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the technical field of processing systems capable of processing objects with an energy beam. [Background technology]

[0002] Patent Document 1 describes a processing system that processes an object by irradiating the object with laser light. This type of processing system is required to process the object appropriately. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent Application No. 4,427,872 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measuring device that measures the object, and a control device that controls at least one of the beam irradiation device and the rotation device based on information about the object measured by the object measuring device and information about the rotation axis of the rotation device, and which processes the object by irradiating the energy beam from the beam irradiation device onto the object held by the holding device.

[0005] According to a second aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measuring device that measures the object, and a control device that controls at least one of the beam irradiation device and the rotation device based on the deviation between the object measured by the object measuring device and the rotation axis of the rotation device, and which processes the object by irradiating the energy beam from the beam irradiation device onto the object held by the holding device.

[0006] According to a third aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measuring device that measures the object, and a control device that controls at least one of the beam irradiation device and the rotation device based on information about the object measured by the object measuring device and information about at least one of the position and attitude of the rotation device, and which processes the object by irradiating the energy beam from the beam irradiation device onto the object held by the holding device.

[0007] According to a fourth aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, a beam measurement device that measures the energy beam from the beam irradiation device, and a control device that controls the beam irradiation device based on information about the energy beam measured by the beam measurement device, and which processes the object by irradiating the energy beam from the beam irradiation device onto the object held by the holding device.

[0008] According to a fifth aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measurement device that measures the object, a beam measurement device that measures the energy beam from the beam irradiation device, a movement device that moves at least one of the beam irradiation device and the beam measurement device, and a control device that controls at least the movement device, wherein the control device moves at least one of the beam irradiation device and the beam measurement device to a position where the beam measurement device can measure the energy beam from the beam irradiation device, and moves at least one of the beam irradiation device and the beam measurement device to a position where the object measurement device can measure at least a part of the beam measurement device.

[0009] According to a sixth aspect, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates an energy beam onto the object held by the holding device; an object measurement device that measures the object; a beam measurement device that measures the energy beam from the beam irradiation device; a movement device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information on at least one of the positions of the beam irradiation device and the beam measurement device; and a control device that controls at least the movement device, wherein the control device moves at least one of the beam irradiation device and the beam measurement device to an irradiation position where the beam irradiation device can irradiate at least a part of the beam measurement device with the energy beam, acquires irradiation position information on at least one of the position of the beam irradiation device and the position of the beam measurement device using the acquisition device, and controls at least one of the position of the beam irradiation device and the beam measurement device based on the irradiation position information.

[0010] According to a seventh aspect, there is provided a processing system comprising: a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates an energy beam onto the object held by the holding device; an object measurement device that measures the object; a beam measurement device that measures the energy beam from the beam irradiation device; a movement device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information on at least one of the position of the beam irradiation device and the position of the beam measurement device; and a control device that controls at least the movement device, wherein the control device moves at least one of the beam irradiation device and the beam measurement device to a measurement position where the object measurement device can measure at least a part of the beam measurement device, acquires measurement position information on at least one of the position of the beam irradiation device and the position of the beam measurement device using the acquisition device, and controls at least one of the position of the beam irradiation device and the beam measurement device based on the measurement position information.

[0011] According to an eighth aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measuring device that measures the three-dimensional shape of the surface of the object, and a control device that controls at least one of the beam irradiation device and the rotation device based on the measurement results of the object measuring device, and which processes the object by irradiating the energy beam from the beam irradiation device onto the object held by the holding device.

[0012] According to a ninth aspect, there is provided a processing system comprising a holding device for holding an object, a rotation device for rotating the holding device, a beam irradiation device for irradiating an energy beam onto the object held by the holding device, an object measuring device for measuring the object, and a control device for controlling the beam irradiation device based on the measurement results of the object by the object measuring device, wherein the beam irradiation device changes the irradiation position of the energy beam on the surface of the object along the surface of the object during the period in which the beam irradiation device irradiates the object with the energy beam, and the control device controls the beam irradiation device based on the measurement results of the object including processing marks caused by the energy beam.

[0013] According to a tenth aspect, there is provided a processing system comprising a holding device for holding an object, a rotation device for rotating the holding device, a beam irradiation device for irradiating the object held by the holding device with an energy beam, an object measuring device for measuring the object, a control device for controlling at least one of the beam irradiation device and the rotation device based on the measurement results of the object by the object measuring device, and a moving device for moving the rotation device, wherein the object measuring device measures the object each time the moving device moves the rotation device along a certain direction, and the control device controls at least one of the beam irradiation device and the moving device based on the measurement results of the object by the object measuring device during an irradiation period in which the beam irradiation device irradiates the object with the energy beam.

[0014] According to an eleventh aspect, there is provided a processing system comprising a holding device for holding an object, a rotation device for rotating the holding device, a beam irradiation device for irradiating an energy beam onto the object held by the holding device, an object measuring device for measuring the object, and a control device for controlling at least one of the beam irradiation device and the rotation device based on the measurement results of the object by the object measuring device, wherein the object measuring device measures the object each time the rotation device rotates the object by a predetermined rotation angle, and the control device controls the beam irradiation device based on the measurement results of the object by the object measuring device.

[0015] According to a twelfth aspect, there is provided a processing system comprising: a holding device for holding an object; a rotation device for rotating the holding device; a beam irradiation device for irradiating an energy beam onto the object held by the holding device; an object measuring device for measuring the object; a control device for controlling at least one of the beam irradiation device and the rotation device based on the measurement results of the object by the object measuring device; and a beam measuring device provided on the rotation device for measuring the energy beam from the beam irradiation device.

[0016] According to a thirteenth aspect, there is provided a processing system comprising a holding device that rotatably holds an object, a rotation device that rotates the holding device, a beam irradiation device that irradiates an energy beam onto the object held by the holding device, an object measuring device that measures the object, a change device that changes the irradiation position of the energy beam irradiated onto the object, and a control device that controls at least one of the rotation device and the change device, wherein the control device controls the rotation device and the change device to rotate the holding device and change the irradiation position based on information about the object measured by the object measuring device, and the object is processed by irradiating the energy beam from the beam irradiation device onto the object held by the holding device. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view schematically showing the appearance of the processing system of the present embodiment. [Figure 2] FIG. 2 is a system configuration diagram showing the system configuration of the machining system of this embodiment. [Figure 3] Each of FIGS. 3(a) to 3(c) is a cross-sectional view showing the removal process performed on the workpiece. [Figure 4] FIG. 4 is a cross-sectional view showing the configuration of the irradiation optical system. [Figure 5] FIG. 5 is a cross-sectional view showing the configuration of the rotation device. [Figure 6]FIG. 6 is a plan view showing the structure of the measurement device. [Figure 7] FIG. 7 is a cross-sectional view showing the structure of the measurement device. [Figure 8] FIG. 8 is a flowchart showing the flow of the processing operation. [Figure 9] FIG. 9 is a perspective view showing a workpiece being machined. [Figure 10] FIG. 10 is a cross-sectional view showing the processing light irradiated onto the workpiece. [Figure 11] FIG. 11 is a cross-sectional view showing another example of the processing light irradiated onto the workpiece. [Figure 12] FIG. 12 is a perspective view showing another example of processing light irradiated onto a workpiece. [Figure 13] FIG. 13 is a cross-sectional view showing an example of a beam damper. [Figure 14] FIG. 14 is a flowchart showing the flow of the first axis information generating operation. [Figure 15] FIG. 15 is a plan view showing a height image of a test work, which is an example of the measurement results of the test work. [Figure 16] FIG. 16 is a top view showing the test work. [Figure 17] Figure 17(a) is a top view showing an ideal test work in which the direction in which the rotation axis extends is parallel (or coincides) with the direction in which the stage moves, Figure 17(b) is a plan view showing a height image corresponding to the measurement results of the test work shown in Figure 17(a), Figure 17(c) is a top view showing a test work in which the direction in which the rotation axis extends is not parallel (or does not coincide) with the direction in which the stage moves, and Figure 17(d) is a plan view showing a height image corresponding to the measurement results of the test work shown in Figure 17(c). [Figure 18] FIG. 18 is a flowchart showing the flow of another example of the first axis information generating operation. [Figure 19]Figure 19(a) is a plan view showing a height image corresponding to the measurement results of an ideal test work in which the direction in which the rotation axis extends and the direction in which the stage moves are parallel (or coincident), and Figure 19(b) is a plan view showing a height image corresponding to the measurement results of a test work in which the direction in which the rotation axis extends and the direction in which the stage moves are not parallel (or do not coincide). [Figure 20] FIG. 20 is a flowchart showing the flow of the second axis information generating operation. [Figure 21] Figure 21(a) is a top view showing an ideal test work in which the direction in which the rotation axis extends and the scanning direction of the processing light are parallel (or coincident), Figure 21(b) is a plan view showing a height image corresponding to the measurement results of the test work shown in Figure 21(a), Figure 21(c) is a top view showing a test work in which the direction in which the rotation axis extends and the scanning direction of the processing light are not parallel (or do not coincide), and Figure 21(d) is a plan view showing a height image corresponding to the measurement results of the test work shown in Figure 21(c). [Figure 22] Each of FIG. 22(a) and FIG. 22(b) is a top view showing a workpiece in which a chucking error occurs. [Figure 23] FIG. 23 is a flowchart showing the flow of the third axis information generating operation (particularly, the operation of generating eccentricity error information). [Figure 24] FIG. 24 is a cross-sectional view showing the rotation of an ideal workpiece whose central axis coincides with the axis of rotation. [Figure 25] FIG. 25 is a graph showing the relationship between the position of the end point of the workpiece shown in FIG. 24 in the Z-axis direction and the rotation angle of the workpiece. [Figure 26] FIG. 26 is a cross-sectional view showing the rotation of a workpiece whose central axis is parallel to but not coincident with the axis of rotation. [Figure 27] FIG. 27 is a graph showing the relationship between the position of the end point of the workpiece shown in FIG. 26 in the Z-axis direction and the rotation angle of the workpiece. [Figure 28] FIG. 28 is a cross-sectional view showing the rotation of a workpiece whose central axis is parallel to but not coincident with the axis of rotation. [Figure 29]FIG. 29 is a graph showing the relationship between the position of the end point of the workpiece shown in FIG. 28 in the Z-axis direction and the rotation angle of the workpiece. [Figure 30] FIG. 30 is a cross-sectional view showing an example of the irradiation position of processing light EL controlled based on decentering error information. [Figure 31] FIG. 31 is a flowchart showing the flow of the third axis information generating operation (particularly, the operation of generating the argument error information). [Figure 32] FIG. 32 is a top view showing a workpiece in which an angular deviation error has occurred. [Figure 33] Figure 33(a) is a cross-sectional view showing how the processing head irradiates processing light onto the measurement device, Figure 33(b) is a plan view showing how the processing head irradiates processing light onto the measurement device, and Figure 33(c) is a graph showing the results of receiving processing light by a light receiving element provided in the measurement device. [Figure 34] FIG. 34 is a cross-sectional view showing the processing light. [Figure 35] FIG. 35(a) is a cross-sectional view showing processing light irradiated onto a workpiece from a direction twisted relative to the rotation axis, and FIG. 35(b) is a cross-sectional view showing processing light with a controlled aperture angle. [Figure 36] FIG. 36 is a cross-sectional view showing a measuring device that measures the processing light. [Figure 37] FIG. 37 is a cross-sectional view showing a measuring device that measures processing light. [Figure 38] FIG. 38 is a cross-sectional view showing a measuring device that measures processing light. [Figure 39] FIG. 39 is a cross-sectional view showing a measuring device that measures processing light. [Figure 40] FIG. 40(a) is a cross-sectional view showing an example of the relative baseline, the processed baseline, and the measurement baseline, and FIG. 40(b) is a plan view showing an example of the relative baseline, the processed baseline, and the measurement baseline. [Figure 41] FIG. 41 is a perspective view schematically showing the appearance of a processing system according to a first modified example. [Figure 42] FIG. 42 is a perspective view schematically showing the appearance of a processing system according to a second modified example. [Figure 43] FIG. 43 is a system configuration diagram showing the system configuration of the machining system of the second modified example. [Figure 44] FIG. 44 is a cross-sectional view showing the configuration of the irradiation optical system of the second modified example. [Figure 45] FIG. 45 is a perspective view schematically showing the appearance of a processing system according to a third modified example. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of a processing system will be described with reference to the drawings. Hereinafter, an embodiment of a processing system and a measuring member will be described using a processing system SYS that processes a workpiece W using processing light EL, which is a specific example of an energy beam. However, the present invention is not limited to the embodiment described below.

[0019] In the following description, the positional relationships of the various components that make up the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are assumed to be horizontal (i.e., predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-and-down direction). The rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may also be assumed to be horizontal.

[0020] (1) Structure of the machining system SYS First, the structure of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a perspective view schematically showing the appearance of the machining system SYS of this embodiment. Figure 2 is a system configuration diagram showing the system configuration of the machining system SYS of this embodiment.

[0021] 1 and 2, the processing system SYS includes a processing device 1, a measuring device 2, a stage device 3, and a control device 4. The processing device 1, the measuring device 2, and the stage device 3 are housed in a housing 5. However, the processing device 1, the measuring device 2, and the stage device 3 do not have to be housed in the housing 5. In other words, the processing system SYS does not have to include a housing 5 that houses the processing device 1, the measuring device 2, and the stage device 3. Note that in FIG. 1, the measuring device 2 is provided closer to the rotation device 35 than the processing device 1 in the X-axis direction, but the opposite arrangement is also possible.

[0022] The processing device 1 is capable of processing a workpiece W under the control of the control device 4. The workpiece W is an object that is processed by the processing device 1. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, a composite material such as CFRP (Carbon Fiber Reinforced Plastic), glass, ceramics, or an object made of any other material.

[0023] The processing device 1 may perform removal processing by irradiating the workpiece W with processing light EL to remove a portion of the workpiece W. The removal processing may include at least one of flattening, cylindrical processing, drilling, smoothing, cutting, and engraving (in other words, marking) to form (in other words, carve) any character or any pattern.

[0024] Here, an example of removal processing using the processing light EL will be described with reference to each of FIGS. 3(a) to 3(c). Each of FIGS. 3(a) to 3(c) is a cross-sectional view showing the removal processing performed on the workpiece W. As shown in FIG. 3(a), the processing device 1 irradiates the processing light EL onto a target irradiation area EA set (in other words, formed) on the surface of the workpiece W. When the processing light EL is irradiated onto the target irradiation area EA, the energy of the processing light EL is transmitted to the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA. When heat caused by the energy of the processing light EL is transmitted, the heat caused by the energy of the processing light EL melts the material constituting the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA. The melted material scatters in the form of droplets. Alternatively, the melted material evaporates due to the heat caused by the energy of the processing light EL. As a result, the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA are removed. That is, as shown in FIG. 3(b), a recess (in other words, a groove) is formed on the surface of the workpiece W. In this case, it can be said that the processing apparatus 1 processes the workpiece W using the principle of so-called thermal processing. Furthermore, the processing apparatus 1 moves the target irradiation area EA on the surface of the workpiece W using the galvanometer mirror 1214 described later. That is, the processing apparatus 1 scans the surface of the workpiece W with the processing light EL. As a result, as shown in FIG. 3(c), at least a portion of the surface of the workpiece W is removed along the scanning trajectory of the processing light EL (i.e., the movement trajectory of the target irradiation area EA). Therefore, the processing apparatus 1 can appropriately remove the portion of the workpiece W that is to be removed by causing the processing light EL to scan the surface of the workpiece W along a desired scanning trajectory that corresponds to the area to be removed.

[0025] On the other hand, depending on the characteristics of the processing light EL, the processing device 1 may also process the workpiece W using the principle of non-thermal processing (e.g., ablation processing). That is, the processing device 1 may perform non-thermal processing (e.g., ablation processing) on ​​the workpiece W. For example, when pulsed light having an emission time of picoseconds or less (or, in some cases, nanoseconds or femtoseconds or less) is used as the processing light EL, the material constituting the target irradiation area EA and a portion adjacent to the target irradiation area EA of the workpiece W instantaneously evaporates and scatters. Note that when pulsed light having an emission time of picoseconds or less (or, in some cases, nanoseconds or femtoseconds or less) is used as the processing light EL, the material constituting the target irradiation area EA and a portion adjacent to the target irradiation area EA of the workpiece W may sublimate without passing through a molten state. Therefore, it is possible to form recesses (in other words, grooves) on the surface of the workpiece W while minimizing the effect of heat caused by the energy of the processing light EL on the workpiece W.

[0026] When performing removal processing, the processing device 1 may form a riblet structure on the workpiece W. The riblet structure may be a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). The riblet structure may include a structure that can reduce noise generated when the fluid and the surface of the workpiece W move relative to each other. The riblet structure may include, for example, a structure in which grooves extending in a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged in a plurality of rows along a second direction (e.g., the X-axis direction) that is along the surface of the workpiece W and intersects the first direction.

[0027] When performing removal processing, the processing apparatus 1 may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. One example of the arbitrary structure is a structure that generates vortices in the flow of a fluid on the surface of the workpiece W. Another example of the arbitrary structure is a structure that imparts hydrophobic properties to the surface of the workpiece W. Another example of the arbitrary structure is a regularly or irregularly formed fine texture structure (typically an uneven structure) on the order of micrometers or nanometers. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure that have the function of reducing resistance caused by fluids (gas and / or liquid). The fine texture structure may also include a lotus leaf surface structure that has at least one of liquid repellency and self-cleaning properties (e.g., has the lotus effect). The fine texture structure may include at least one of a micro-protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, a honeycomb structure having a droplet collecting function, and a concave-convex structure that improves adhesion with a layer formed on the surface.

[0028] 1 and 2, in order to process the workpiece W, the processing device 1 includes a processing light source 11, a processing head 12, a head drive system 13, and a position measurement device .

[0029] The processing light source 11 emits, for example, at least one of infrared light, visible light, ultraviolet light, and extreme ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include pulsed light (i.e., multiple pulse beams). The processing light EL may be laser light. In this case, the processing light source 11 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD: Laser Diode)). The laser light source may include at least one of a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The processing light source 11 may include any light source (e.g., at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0030] The processing head 12 irradiates the workpiece W with the processing light EL from the processing light source 11. For this reason, the processing head 12 may also be referred to as a beam irradiation device. In the example shown in FIG. 1, a stage 32 on which the workpiece W can be placed is disposed below the processing head 12. For this reason, the processing head 12 irradiates the workpiece W with the processing light EL by emitting the processing light EL downward from the processing head 12. In order to irradiate the workpiece W with the processing light EL, the processing head 12 is equipped with an irradiation optical system 121. The irradiation optical system 121 will be described below with reference to FIG. 4. FIG. 4 is a cross-sectional view schematically showing the structure of the irradiation optical system 121.

[0031] 4, the irradiation optical system 121 includes, for example, a focusing position changing optical system 1210, an aperture angle changing optical system 1211, an ellipticity changing optical system 1212, an optical rotation optical system 1213, a galvanometer mirror 1214, and an fθ lens 1215. However, the irradiation optical system 121 does not necessarily have to include at least one of the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213.

[0032] The focusing position changing optical system 1210 is an optical element that can change the focusing position of the processing light EL (i.e., the convergence position of the processing light EL) along the traveling direction of the processing light EL. The focusing position changing optical system 1210 may include, for example, multiple lenses aligned along the traveling direction of the processing light EL. In this case, the focusing position of the processing light EL may be changed by moving at least one of the multiple lenses along its optical axis direction.

[0033] The aperture angle changing optical system 1211 is an optical component that can change the aperture angle of the processing light EL emitted from the processing head 12. In this embodiment, the "aperture angle of the processing light EL" may refer to the angle formed by the outermost ray of the processing light EL. Alternatively, the "aperture angle of the processing light EL" in this embodiment may refer to the angle formed by the outermost ray of the processing light EL and the principal ray of the processing light EL. In this case, the aperture angle changing optical system 1211 may be considered to essentially change the numerical aperture of the irradiation optical system 121. The aperture angle changing optical system 1211 may also be referred to as an aperture angle changing device.

[0034] The ellipticity changing optical system 1212 is an optical element capable of changing the ellipticity of the processing light EL emitted from the processing head 12. Specifically, the ellipticity changing optical system 1212 changes the ellipticity of the spot of the processing light EL in a plane intersecting an irradiation axis EX along the traveling direction of the processing light EL. For example, the ellipticity changing optical system 1212 may include an optical element (e.g., at least one of a toric lens and a cylindrical lens) having different refractive powers in two orthogonal directions, and may change the ellipticity by rotating the optical element around the optical axis or around an axis parallel to the optical axis. For example, the ellipticity changing optical system 1212 may include multiple optical elements, and the ellipticity may be changed by changing the spacing between the multiple optical elements in the optical axis direction. Here, at least one of the multiple optical elements may have asymmetric refractive power with respect to the optical axis. The irradiation axis EX is typically an axis extending along the principal ray of the processing light EL. The chief ray of the processing light EL may be a line connecting the center of gravity of the light quantity in a first cross section intersecting the traveling direction of the processing light EL and the center of gravity of the light quantity in a second cross section intersecting the traveling direction and different from the first cross section. In the example shown in Fig. 4, the illumination axis EX is parallel to the optical axis AX of the fθ lens 1215, but the illumination axis EX may be inclined with respect to the optical axis AX of the fθ lens 1215. In the example shown in Fig. 4, the illumination axis EX is parallel to the Z axis, but the illumination axis EX may be inclined with respect to the Z axis.

[0035] Note that changing the ellipticity may be considered to be substantially equivalent to changing at least one of the opening angle of the processing light EL in a first plane including the irradiation axis EX and the opening angle of the processing light EL in a second plane including the irradiation axis EX and intersecting the first plane. Therefore, the ellipticity changing optical system 1212 may be referred to as an opening angle changing optical system or an opening angle changing device. In this case, the opening angle changing optical system 1211 described above may function as at least a part of the ellipticity changing optical system 1212.

[0036] The optical rotation optical system 1213 is an optical element that can rotate the spot of the processing light EL around the optical axis AX (particularly, around the illumination axis EX) within a plane intersecting the illumination axis EX. In this embodiment, the optical rotation optical system 1213 rotates the direction in which the diameter of the spot of the processing light EL (i.e., the cross section of the processing light EL) on the entrance pupil plane of the fθ lens 1215 is maximized around the optical axis AX (particularly, around the illumination axis EX). In other words, the optical rotation optical system 1213 rotates the direction in which the diameter of the spot of the processing light EL (i.e., the cross section of the processing light EL) on the entrance pupil plane of the fθ lens 1215 is maximized around the optical axis AX (particularly, around the illumination axis EX). In this case, the optical rotation optical system 1213 may be considered to rotate the direction of the major axis or the minor axis of the spot of the processing light EL on the entrance pupil plane of the fθ lens 1215 around the optical axis AX (particularly, around the illumination axis EX). For example, the optical rotating optical system 1213 may include an optical element that can rotate around the optical axis, and the spot of the processing light EL may be rotated by rotating the optical element around the optical axis. Such an optical element may be called a beam rotator. Therefore, the optical rotating optical system 1213 may be called a beam rotating element. Note that the ellipticity changing optical system 1212 and the optical rotating optical system 1213 may be combined into one optical system.

[0037] The processing light EL that passes through the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213 is incident on the galvanometer mirror 1214. The galvanometer mirror 1214 deflects the processing light EL (i.e., changes the emission angle of the processing light EL) to change the emission direction of the processing light EL from the galvanometer mirror 1214. For this reason, the galvanometer mirror 1214 may also be referred to as a beam deflection device. Note that FIG. 4 shows an example in which the emission direction of the processing light EL from the galvanometer mirror 1214 is changed within the YZ plane. By changing the emission direction of the processing light EL from the galvanometer mirror 1214, the galvanometer mirror 1214 may change the irradiation position of the processing light EL relative to the processing head 12 (for example, the irradiation position of the processing light EL on the surface of the workpiece W). That is, the galvanometer mirror 1214 may change (i.e., move) the irradiation position of the processing light EL by deflecting the processing light EL. For this reason, the galvanometer mirror 1214 may be referred to as a beam irradiation position changing device. Note that FIG. 4 shows an example in which the irradiation position of the processing light EL is changed in the Y-axis direction. Furthermore, the galvanometer mirror 1214 may change the traveling direction of the processing light EL from the processing head 12 (i.e., the direction in which the irradiation axis EX extends) by changing the emission direction of the processing light EL from the galvanometer mirror 1214. That is, the galvanometer mirror 1214 may change at least one of the irradiation position and traveling direction of the processing light EL. For this reason, the galvanometer mirror 1214 may be referred to as a beam irradiation state changing device that can change the irradiation state of the processing light EL, including at least one of the irradiation position and traveling direction.

[0038] The galvanometer mirror 1214 includes, for example, an X-scan mirror 1214X and a Y-scan mirror 1214Y. Each of the X-scan mirror 1214X and the Y-scan mirror 1214Y is a variable tilt angle mirror whose angle with respect to the optical path of the processing light EL incident on each mirror can be changed. The X-scan mirror 1214X reflects the processing light EL toward the Y-scan mirror 1214Y. The X-scan mirror 1214X can swing or rotate about a rotation axis along the Y-axis. By swinging or rotating the X-scan mirror 1214X, the processing light EL scans the surface of the workpiece W along the X-axis direction. By swinging or rotating the X-scan mirror 1214X, the target irradiation area EA moves on the surface of the workpiece W along the X-axis direction. The Y-scan mirror 1214Y reflects the processing light EL toward the fθ lens 1215. The Y-scan mirror 1214Y can swing or rotate about a rotation axis along the X-axis. By swinging or rotating the Y scanning mirror 1214Y, the processing light EL scans along the Y-axis direction on the surface of the workpiece W. By swinging or rotating the Y scanning mirror 1214Y, the target irradiation area EA moves along the Y-axis direction on the surface of the workpiece W.

[0039] Such a galvanometer mirror 1214 enables the processing light EL to scan a processing shot area PSA that is determined based on the processing head 12. In other words, the galvanometer mirror 1214 enables the target irradiation area EA to move within the processing shot area PSA that is determined based on the processing head 12. The processing shot area PSA indicates an area (in other words, a range) where processing is performed by the processing apparatus 1 while the positional relationship between the processing head 12 and the workpiece W is fixed (i.e., without change). Typically, the processing shot area PSA is set to coincide with or be narrower than the maximum range that can be scanned by the processing light EL deflected by the galvanometer mirror 1214 while the positional relationship between the processing head 12 and the workpiece W is fixed. If the processing shot area PSA is smaller than the portion of the workpiece W to be processed, the following operations are repeated: processing a portion of the workpiece W by scanning the processing shot area PSA set on that portion with the processing light EL; and changing the relative positional relationship between the processing head 12 and the workpiece W to change the position of the processing shot area PSA on the workpiece W.

[0040] In addition to or instead of the galvanometer mirror 1214, the irradiation optical system 121 may include any optical element capable of deflecting the processing light EL (i.e., capable of changing at least one of the emission direction and irradiation position of the processing light EL). An example of such an optical element is a polygon mirror having multiple reflecting surfaces with different angles. The polygon mirror is rotatable so as to change the angle of incidence of the processing light EL with respect to one reflecting surface while the processing light EL is being irradiated onto that one reflecting surface and to switch the reflecting surface onto which the processing light EL is irradiated among multiple reflecting surfaces. The irradiation optical system 121 may also include a return light reduction optical system having a polarizing optical element.

[0041] The fθ lens 1215 is an optical system for emitting the processing light EL from the galvanometer mirror 1214 toward the workpiece W. In particular, the fθ lens 1215 is an optical element that can focus the processing light EL from the galvanometer mirror 1214 on a focusing surface that intersects with the optical axis AX of the fθ lens 1215. For this reason, the fθ lens 1215 may be referred to as a focusing optical system. The focusing surface of the fθ lens 1215 may be set on the exit side of the fθ lens 1215. The focusing surface of the fθ lens 1215 may be set on, for example, the surface of the workpiece W. In this case, the fθ lens 1215 can focus the processing light EL from the galvanometer mirror 1214 on the surface of the workpiece W.

[0042] 1 and 2, under the control of the control device 4, the head drive system 13 moves the processing head 12, and thus the irradiation optical system 121, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Therefore, the head drive system 13 may also be referred to as a moving device. FIG. 1 shows an example in which the head drive system 13 moves the processing head 12 along the Z-axis direction. In this case, the head drive system 13 may include, for example, a Z slider member 131 extending along the Z-axis direction. The Z slider member 131 is disposed on a support frame 6 that is disposed on a base plate 31 (described later) via a vibration isolation device. The support frame 6 may include, for example, a pair of leg members 61 that are disposed on the base plate 31 via a vibration isolation device and extend along the Z-axis direction, and a beam member 62 that is disposed on the pair of leg members 61 and extends along the X-axis direction so as to connect the upper ends of the pair of leg members 61. The Z slider member 131 is disposed on the beam member 62 via a support member 63 extending along the Z axis direction, for example. The machining head 12 is connected to the Z slider member 131 so as to be movable along the Z slider member 131.

[0043] When the machining head 12 moves, the positional relationship between the machining head 12 and the stage 32, which will be described later, changes. Furthermore, when the machining head 12 moves, the positional relationship between the machining head 12 and the rotation device 35, which will be described later and which is disposed on the stage 32, changes. Furthermore, when the machining head 12 moves, the positional relationship between the machining head 12 and the workpiece W held by the rotation device 35 changes. Therefore, moving the machining head 12 may be considered equivalent to changing the positional relationships between the machining head 12 and the stage 32, the rotation device 35, and the workpiece W. Furthermore, when the machining head 12 moves, the irradiation position of the processing light EL on the surface of the workpiece W moves relative to the surface of the workpiece W. In other words, the irradiation position of the processing light EL on the surface of the workpiece W changes on the surface of the workpiece W. Therefore, moving the machining head 12 may be considered equivalent to changing the irradiation position of the processing light EL on the surface of the workpiece W.

[0044] The position measurement device 14 is capable of measuring (in other words, detecting) the position of the machining head 12. In other words, the position measurement device 14 is a device that can acquire information regarding the position of the machining head 12. The position measurement device 14 may include, for example, at least one of an encoder and a laser interferometer.

[0045] The measuring device 2 is capable of measuring the workpiece W under the control of the control device 4. Note that the measuring device 2 may be referred to as an object measuring device or a workpiece measuring device because it measures an object called the workpiece W. In order to measure the workpiece W, the measuring device 2 includes a measuring head 21, a head drive system 22, and a position measuring device 23.

[0046] The measuring head 21 is capable of measuring the workpiece W under the control of the control device 4. In this embodiment, the measuring head 21 performs three-dimensional measurement of the surface of the workpiece W. That is, the measuring head 21 measures the three-dimensional shape of the surface of the workpiece W. For this reason, the measuring head 21 may be equipped with a three-dimensional measuring device 211 capable of measuring the three-dimensional shape of the surface of the workpiece W. Workpiece measurement information relating to the measurement results of the workpiece W by the measuring head 21 (that is, the measurement results of the workpiece W by the three-dimensional measuring device 211) is output from the measuring head 21 to the control device 4. The control device 4 controls the operation of the machining system SYS based on the workpiece measurement information. Specifically, the control device 4 controls the machining system SYS (for example, at least one of the machining device 1, the measuring device 2, and the stage device 3) based on the workpiece measurement information so that the machining system SYS can appropriately machine the workpiece W. Note that the measuring device 2, the measuring head 21, or the three-dimensional shape measuring device 211 may be referred to as an object information acquisition device or a workpiece information acquisition device, since they acquire workpiece measurement information relating to the three-dimensional shape of the surface of the workpiece W.

[0047] The three-dimensional measuring device 211 may perform non-contact measurement of the workpiece W. For example, the three-dimensional measuring device 211 may measure the workpiece W optically. That is, the three-dimensional measuring device 211 may measure the workpiece W using any measurement beam such as measurement light. For example, the three-dimensional measuring device 211 may measure the workpiece W using a light-section method that projects slit light onto the surface of the workpiece W and measures the shape of the projected slit light. For example, the three-dimensional measuring device 211 may measure the workpiece W using white light interferometry that measures the interference pattern between white light that has passed through the workpiece W and white light that has not passed through the workpiece W. For example, the three-dimensional measuring device 211 may measure the workpiece W using at least one of the following methods: a pattern projection method in which a light pattern is projected onto the surface of the workpiece W and the shape of the projected pattern is measured; a time-of-flight method in which light is projected onto the surface of the workpiece W and the distance to the workpiece W is measured from the time it takes for the projected light to return, performed at multiple positions on the workpiece W; a moire topography method (specifically, a grating illumination method or a grating projection method); a holographic interferometry method; an autocollimation method; a stereo method; an astigmatism method; a critical angle method; a knife-edge method; an interferometry method; and a confocal method. For example, the three-dimensional measuring device 211 may measure the workpiece W by capturing an image of the workpiece W illuminated with illumination light. In either case, the three-dimensional measuring device 211 may include a light source that emits measurement light ML (e.g., slit light, white light, or illumination light) and a light receiver that receives light from the workpiece W irradiated with the measurement light ML (e.g., reflected light of the measurement light). The three-dimensional measuring device 211 may measure the workpiece W by contact.

[0048] The measurement head 21 measures the workpiece W in units of measurement shot areas MSA. The measurement shot area MSA indicates the area (in other words, the range) where measurement is performed by the measurement head 21 while the positional relationship between the measurement head 21 and the workpiece W is fixed (i.e., without change). Typically, the measurement shot area MSA is set so that it coincides with the maximum range over which the measurement head 21 can irradiate the measurement light ML while the positional relationship between the measurement head 21 and the workpiece W is fixed (i.e., without change), or is an area narrower than that range. The measurement shot area MSA may also be referred to as the measurable range or measurable field of the measurement head 21.

[0049] In the example shown in FIG. 1, the measurement head 21 is aligned with the processing head 12 so that the measurement axis MX of the measurement head 21 does not coincide with the irradiation axis EX along the traveling direction of the processing light EL. In the example shown in FIG. 1, the measurement axis MX is parallel to the irradiation axis EX. Note that the measurement axis MX may be, for example, an axis extending along the optical axis of the optical system included in the measurement head 21. The measurement axis MX may be, for example, an axis extending along the chief ray of the measurement light ML from the measurement head 21. Note that, as will be explained in a first modified example below, the measurement axis MX does not have to be parallel to the irradiation axis EX.

[0050] Under the control of the control device 4, the head drive system 22 moves the measurement head 21 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. For this reason, the head drive system 22 may be referred to as a moving device. FIG. 1 shows an example in which the head drive system 22 moves the measurement head 21 along the Z-axis direction. In this case, the head drive system 22 may include, for example, a Z slider member 221 extending along the Z-axis direction. The Z slider member 221 may be disposed on the beam member 62 via a support member 64 extending in the Z-axis direction. The measurement head 21 is connected to the Z slider member 221 so as to be movable along the Z slider member 221.

[0051] When the measurement head 21 moves, the positional relationships between the measurement head 21 and the stage 32, the rotation device 35, and the workpiece W change. Therefore, moving the measurement head 21 may be considered equivalent to changing the positional relationships between the measurement head 21 and the stage 32, the rotation device 35, and the workpiece W.

[0052] The position measurement device 23 is capable of measuring (in other words, detecting) the position of the measurement head 21. In other words, the position measurement device 23 is a device that can acquire information regarding the position of the measurement head 21. The position measurement device 23 may include, for example, at least one of an encoder and a laser interferometer.

[0053] The stage device 3 includes a base 31, a stage 32, a stage drive system 33, a position measurement device , a rotation device 35, and a measurement device .

[0054] The surface plate 31 is placed on the bottom surface of the housing 5 (or on a support surface such as a floor on which the housing 5 is placed). A stage 32 is placed on the surface plate 31. A vibration isolation device (not shown) may be installed between the surface plate 31 and the bottom surface of the housing 5 or a support surface such as a floor on which the housing 5 is placed, in order to reduce transmission of vibrations from the surface plate 31 to the stage 32. Furthermore, the support frame 6 described above may be placed on the surface plate 31.

[0055] The stage 32 is a mounting device on which the workpiece W can be placed. The stage 32 may be capable of holding the workpiece W placed on the stage 32. Alternatively, the stage 32 may not be capable of holding the workpiece W placed on the stage 32. In this case, the workpiece W may be placed on the stage 32 in a clampless manner.

[0056] In this embodiment, a rotation device 35 is disposed on the stage 32. As will be described in detail later, the rotation device 35 is a device that rotates a chuck 353, which is a holding device that rotatably holds the workpiece W. Therefore, in this embodiment, the workpiece W may be placed on the stage 32, or may be held by the rotation device 35 via the chuck 353. The processing head 12 may irradiate the processing light EL onto the workpiece W placed on the stage 32, or may irradiate the processing light EL onto the workpiece W held by the rotation device 35. The measurement head 21 may measure the workpiece W placed on the stage 32, or may measure the workpiece W held by the rotation device 35. Unless otherwise specified below, it is assumed that the workpiece W is held by the rotation device 35. Note that, because the rotation device 35 rotates the chuck 353 that holds the workpiece W, the rotation device 35 may also be considered a device that rotates the workpiece W.

[0057] The stage drive system 33 moves the stage 32 under the control of the control device 4. For this reason, the stage drive system 33 may also be referred to as a moving device. When the stage 32 moves, the rotation device 35 disposed on the stage 32 also moves together with the stage 32. Furthermore, when the stage 32 moves, the workpiece W placed on the stage 32 or held by the rotation device 35 on the stage 32 also moves together with the stage 32. The stage drive system 33 moves the stage 32, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. In the example shown in FIG. 1, the stage drive system 33 moves the stage 32 along each of the X-axis and Y-axis. That is, in the example shown in FIG. 1, the stage drive system 33 moves the stage 32 along a direction along the XY plane that intersects with the respective traveling directions of the processing light EL and the measurement light ML. In this case, stage drive system 33 may include, for example, X slide member 331 extending along the X axis direction (two X slide members 331 arranged parallel to each other in the example shown in FIG. 1 ) and Y slide member 332 extending along the Y axis direction (one Y slide member 332 in the example shown in FIG. 1 ). The two X slide members 331 are arranged on base 31 so as to be aligned along the Y axis direction. Y slide member 332 is connected to the two X slide members 331 so as to be movable along the two X slide members 331. Stage 32 is connected to Y slide member 332 so as to be movable along Y slide member 332. Note that although a plurality of X slide members 331 are provided in the example of FIG. 1 , the number of X slide members may be one. Also, stage 32 may be configured to be levitated and supported above base 31 by air bearings.

[0058] When the stage 32 moves, the positional relationships between the stage 32, the rotation device 35, and the workpiece W, and the machining head 12 and the measurement head 21, respectively, change. Therefore, moving the stage 32 may be considered equivalent to changing the positional relationships between the stage 32, the rotation device 35, and the workpiece W, and the machining head 12 and the measurement head 21, respectively. Furthermore, when the stage 32 moves, the irradiation position of the processing light EL on the surface of the workpiece W moves relative to the surface of the workpiece W. In other words, the irradiation position of the processing light EL on the surface of the workpiece W changes on the surface of the workpiece W. Therefore, moving the stage 32 may be considered equivalent to changing the irradiation position of the processing light EL on the surface of the workpiece W.

[0059] The position measurement device 34 is capable of measuring (in other words, detecting) the position of the stage 32. In other words, the position measurement device 34 is a device that can acquire information related to the position of the stage 32. The position measurement device 34 may include, for example, at least one of an encoder and a laser interferometer. Because the position measurement device 34 is capable of acquiring information related to the position of the stage 32, the position measurement device 34 may also be referred to as a stage position information acquisition device.

[0060] As described above, the rotation device 35 is a device that rotates the chuck 353, which is a holding device that rotatably holds the workpiece W. Here, the configuration of the rotation device 35 will be described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing the configuration of the rotation device 35.

[0061] As shown in FIG. 5, the rotation device 35 includes a support frame 351 and a rotation motor 352. The support frame 351 is disposed on the stage 32. The rotation motor 352 is supported by the support frame 351. The rotation motor 352 operates to rotate a rotation shaft 3521. The rotation shaft 3521 may be a member extending along a direction intersecting the direction of gravity (the X-axis direction in the example shown in FIG. 5). That is, in the example shown in FIG. 5, the rotation motor 352 rotates the rotation shaft 3521 extending along the X-axis direction around a rotation axis 3522 extending along the X-axis direction. Note that the rotation axis 3522 is an axis that passes through the rotation center of the rotation shaft 3521 and extends along the rotation shaft 3521. However, the rotation shaft 3521 may extend along a direction different from the X-axis direction. The rotary motor 352 may rotate a rotary shaft 3521 extending in a direction different from the X-axis direction around a rotary axis 3522 extending in a direction different from the X-axis direction. The rotary shaft 3521 may be provided so that the angle of the rotary axis 3522 relative to the X-axis (for example, the angle in the XZ plane or the angle in the XY plane) is changeable. In other words, the rotary shaft 3521 may be movable in at least one of the θz direction and the θy direction. Although not shown in FIG. 5 , the rotation device 35 includes a rotary encoder for detecting the rotation angle of the rotary motor 352 or the rotation angle of the rotary shaft 3521, and the output thereof is output to the control device 4. This rotary encoder may be referred to as a rotation detection device capable of detecting the rotation angle of the rotation device.

[0062] A chuck 353 is connected to the rotating shaft 3521. The chuck 353 is a holding device capable of holding a workpiece W. In the example shown in FIG. 5, the chuck 353 holds the workpiece W by clamping the workpiece W in contact with a holding surface 3531 of the chuck 353 using multiple claws 3532 provided on the chuck 353. In particular, in the example shown in FIG. 5, the rotating shaft 3521 extends in the X-axis direction, and therefore the chuck 353 holds the workpiece W by clamping the workpiece W in contact with the holding surface 3531 along the YZ plane intersecting the X-axis using multiple claws 3532 extending along the X-axis direction. However, the method by which the chuck 353 holds the workpiece W is not limited to the method shown in FIG. 5.

[0063] The rotation motor 352 rotates the rotation shaft 3521, thereby rotating the chuck 353 connected to the rotation shaft 3521 about a rotation axis 3522. As a result, the workpiece W held by the chuck 353 also rotates about the rotation axis 3522. For this reason, it can be said that the rotation device 35 can function as a headstock that can rotate the workpiece W held by the chuck 353. In the example shown in FIG. 5, the rotation device 35 rotates the workpiece W about the X-axis.

[0064] 1 and 2, the measuring device 36 is a device capable of measuring the processing light EL from the processing head 12. For this reason, the measuring device 36 may be referred to as a beam measuring device. Furthermore, at least a portion of the measuring device 36 is measurable by the measuring head 21. In this case, at least a portion of the measuring device 36 may be considered to function as a mark (or index) measurable by the measuring head 21. Processing light measurement information regarding the measurement results of the processing light EL by the measuring device 36 and mark measurement information regarding the measurement results of the measuring device 36 by the measuring head 21 are output from the measuring head 21 to the control device 4. The control device 4 controls the operation of the processing system SYS based on at least one of the processing light measurement information and the marker measurement information. Specifically, the control device 4 controls the processing system SYS (e.g., at least one of the processing device 1, the measuring device 2, and the stage device 3) based on at least one of the processing light measurement information and the marker measurement information so that the processing system SYS can properly process the workpiece W.

[0065] Here, the structure of the measurement device 36 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a plan view showing the structure of the measurement device 36. Fig. 7 is a cross-sectional view showing the structure of the measurement device 36. Note that Fig. 7 corresponds to the cross-sectional view taken along line VI-VI' in Fig. 6.

[0066] As shown in FIGS. 6 and 7 (and further as shown in FIG. 5 described above), the measuring device 36 is disposed (i.e., provided) on the rotation device 35. In the example shown in FIGS. 5 to 7, the measuring device 36 is disposed on a support frame 351 of the rotation device 35. Since the measuring device 36 measures the processing light EL and the measurement head 21 measures at least a part of the measuring device 36, the measuring device 36 may be disposed on an upper surface 3511 of the support frame 351 (i.e., the surface facing the processing head 12 and the measurement head 21). However, the measuring device 36 may be disposed on a surface other than the upper surface of the support frame 351. The measuring device 36 may be disposed on a member other than the support frame 351. For example, the measuring device 36 may be disposed on the stage 32. At least a part of the measuring device 36 may be detachable from the support frame 351. Alternatively, the measuring device 36 may be integrated with the support frame 351. Furthermore, multiple measuring devices 36 may be disposed on the support frame 351. The measuring device 36 may be disposed on the chuck 353. A plurality of measuring devices 36 may be disposed on the chuck 353.

[0067] As shown in FIGS. 6 and 7 , the measurement device 36 includes a beam transmitting member 361 and a light receiving element 362. The beam transmitting member 361 is a plate-like member extending along the XY plane. The beam transmitting member 361 has a rectangular shape in the XY plane, but may have any other shape (for example, a circle or an ellipse). The beam transmitting member 361 has a flat plate shape, but may have a curved shape. The size of one side of the beam transmitting member 361 is, for example, several millimeters to several tens of millimeters, but may have any other size. The light receiving element 362 includes a light receiving surface 3621 extending along the XY plane. The shape of the light receiving surface 3621 in the XY plane is rectangular, but may have any other shape (for example, a circle or an ellipse). The size of one side of the light receiving surface 3621 may be the same as the size of one side of the beam transmitting member 361, or may be smaller or larger than the size of one side of the beam transmitting member 361.

[0068] The beam passing member 361 and the light receiving element 362 are disposed inside a depression 3512 (i.e., a recess) formed in the support frame 351. In other words, the beam passing member 361 and the light receiving element 362 are disposed in the depression 3512 recessed toward the -Z side from the upper surface 3511 of the support frame 351. However, at least one of the beam passing member 361 and the light receiving element 362 may be disposed at a position different from the depression 3512.

[0069] Within the recess 3512, the beam passing member 361 is disposed above the light receiving element 362. That is, the beam passing member 361 is disposed closer to the machining head 12 and the measuring head 21 than the light receiving element 362. In this case, as shown in FIG. 7 , the surface of the beam passing member 361 (specifically, the surface facing the machining head 12 and the measuring head 21, that is, the surface on the +Z side) may be located below the upper surface 3511. As a result, the measuring device 36 does not protrude from the surface of the support frame 351, which reduces the possibility that the workpiece W or the like will accidentally come into contact with the measuring device 36 (particularly the beam passing member 361). As a result, the possibility that the beam passing member 361 will be damaged and / or contaminated due to the workpiece W or the like coming into contact with the beam passing member 361 is reduced. However, the surface of the beam passing member 361 may be located at the same height as the upper surface 3511 or may be located above the upper surface 3511.

[0070] The beam passing member 361 includes a glass substrate 3611 and an attenuation film 3612 formed on at least a part of the surface of the glass substrate 3611. The attenuation film 3612 is a member capable of attenuating the processing light EL incident on the attenuation film 3612. Note that in this embodiment, "attenuation of the processing light EL by the attenuation film 3612" may include not only making the intensity of the processing light EL passing through the attenuation film 3612 smaller than the intensity of the processing light EL incident on the attenuation film 3612, but also blocking (i.e., shielding) the processing light EL incident on the attenuation film 3612. Therefore, when the processing light EL is incident on the attenuation film 3612, the processing light EL attenuated by the attenuation film 3612 is incident on the light receiving element 362 through the attenuation film 3612, or the processing light EL is blocked by the attenuation film 3612 and does not enter the light receiving element 362. The damping film 3612 may be made of a chromium film or a chromium oxide film.

[0071] At least one opening 363 is formed in the attenuation film 3612. In the example shown in FIGS. 6 to 7, a plurality of openings 363 are formed in the attenuation film 3612. The openings 363 are through-holes that penetrate the attenuation film 3612 in the Z-axis direction. Therefore, when the processing light EL is incident on the opening 363 formed in the attenuation film 3612, the processing light EL passes through the beam passing member 361 via the opening 363. In other words, the processing light EL is incident on the light receiving element 362 via the opening 363 without being attenuated or blocked by the attenuation film 3612.

[0072] In this way, the portion of the glass substrate 3611 where the attenuation film 3612 is formed (i.e., the portion where the opening 363 is not formed) functions as an attenuation region 364 that attenuates the processing light EL. On the other hand, the portion of the glass substrate 3611 where the attenuation film 3612 is not formed (i.e., the portion where the opening 363 is formed) functions as a passing region 365 that passes the processing light EL. In this case, the passing region 365 does not attenuate the processing light EL passing through it. However, the passing region 365 may attenuate the processing light EL passing through it. In other words, the passing region 365 does not need to be a region through which all (i.e., 100%) of the processing light EL incident on the passing region 365 passes, but may be a region through which only a portion of the processing light EL incident on the passing region 365 passes. However, the attenuation rate of the processing light EL by the passing region 365 is smaller than the attenuation rate of the processing light EL by the attenuation region 364. The attenuation region 364 is typically arranged adjacent to the passing region 365. That is, the pass region 365 is disposed within the attenuation region 364 .

[0073] Since the measurement device 36 is disposed on the support frame 3511 (i.e., disposed on the rotation device 35), the positional relationship between each of the attenuation region 364 and the passing region 365 and the rotation device 35 is fixed. In other words, the positional relationship between each of the attenuation region 364 and the passing region 365 and the rotation device 35 is a predetermined relationship that is known to the control device 4.

[0074] The passage area 365 formed by the opening 363 may form a mark (i.e., pattern) 366 having a predetermined shape in a plane (typically, the XY plane) along the surface of the damping film 3612. This mark 366 can function as a mark that can be measured by the measurement head 21.

[0075] For example, as shown in FIG. 6 , a mark 366 having a slit shape (this mark 366 may be referred to as a slit mark) may be formed on the beam transmitting member 361. The slit-shaped mark 366 is a mark formed by a passing region 365 having a single linear (e.g., slit-like) shape in a plane along the surface of the attenuation film 3612. In the example shown in FIG. 6 , a plurality of marks 366 having different angles with respect to the X-axis and the Y-axis are formed on the beam transmitting member 361. However, marks 366 having other shapes may also be formed on the beam transmitting member 361. For example, the beam transmitting member 361 may have a mark 366 formed by a plurality of linear passing regions 365 each extending along one direction and arranged along another direction intersecting the one direction (this mark 366 may be referred to as a fine mark). For example, the beam transmitting member 361 has a mark 366 formed by a passing region 365 having a rectangular shape in a plane along the surface of the attenuation film 3612 (this mark 366 may be referred to as a rectangular mark). For example, the beam passing member 361 may be formed with a mark 366 (this mark 366 may be referred to as a cross mark) formed by a plurality of linear passing regions 365 each extending along a first direction and arranged along a second direction intersecting the first direction, and a plurality of linear passing regions 365 each extending along a third direction intersecting the first direction and arranged along a fourth direction intersecting the third direction. For example, the beam passing member 361 may be formed with a mark (this mark 366 may be referred to as a search mark) formed by two first linear passing regions 365 each extending along a fifth direction and spaced apart along a sixth direction orthogonal to the fifth direction, and a second linear passing region 365 extending along a seventh direction inclined with respect to the fifth direction (i.e., intersecting obliquely).

[0076] The light receiving element 362 is a light receiving unit capable of receiving (e.g., detecting) the processing light EL that has entered the light receiving element 362 through the passing region 365 (i.e., the opening 363) on the light receiving surface 3621. The light receiving element 362 is a light receiving unit capable of receiving the processing light EL that has passed through the passing region 365 (i.e., the opening 363) on the light receiving surface 3621. An example of a light receiving unit is a photoelectric converter that can photoelectrically convert the received processing light EL.

[0077] When multiple passing regions 365 are formed in the beam passing member 361, the light receiving element 362 may be capable of receiving, at the light receiving surface 3621, the processing light EL that has entered the light receiving element 362 through each of the multiple passing regions 365. The light receiving surface 3621 may be formed on one photoelectric conversion surface of the photoelectric conversion element. For example, the light receiving element 362 may be capable of receiving, at a first portion of the light receiving surface 3621, the processing light EL that has entered the light receiving element 362 through the first passing region 365. For example, the light receiving element 362 may be capable of receiving, at a second portion of the light receiving surface 3621, the processing light EL that has entered the light receiving element 362 through the second passing region 365. Thus, in this embodiment, the measuring device 36 does not need to include multiple light receiving elements 362 that respectively correspond to the multiple passing regions 365. The measuring device 36 may simply include a light receiving element 362 that is common to the multiple passing regions 365. However, the measurement device 36 may include a plurality of light receiving elements 362 corresponding to the plurality of passing areas 365, respectively.

[0078] When the light-receiving element 362 receives the processing light EL through the passing region 365, the focusing position of the processing light EL may be set at or near the passing region 365 of the beam passing member 361. On the other hand, when the processing light EL is used to process the workpiece W, the focusing position of the processing light EL may be set at or near the surface of the workpiece W. For this reason, the control device 4 may set the focusing position of the processing light EL to an appropriate position by controlling the focus changing optical system 1210.

[0079] Considering that the workpiece W is processed by irradiation with the processing light EL, there is a possibility that at least a portion of the measuring device 36 may also be processed (essentially destroyed) by irradiation with the processing light EL. For this reason, the intensity of the processing light EL (e.g., the amount of energy per unit area in a plane intersecting the traveling direction of the processing light EL) may be controlled so that the intensity of the processing light EL irradiated to the measuring device 36 (e.g., the amount of energy per unit area on the light-receiving surface 3621 of the light-receiving element 362) is smaller than the intensity of the processing light EL irradiated to the workpiece W to process the workpiece W (e.g., the amount of energy per unit area on the surface of the workpiece W). For example, the control device 4 may reduce the intensity of the processing light EL by controlling the processing light source 11. For example, the control device 4 may reduce the intensity of the processing light EL by controlling a light-reducing member (not shown) arranged on the emission side of the processing light source 11.

[0080] The light reception result of the light receiving element 362 includes information about the state of the processing light EL incident on the light receiving element 362. For example, the light reception result of the light receiving element 362 includes information about the intensity of the processing light EL incident on the light receiving element 362 (specifically, the intensity in a plane intersecting the XY plane). More specifically, the light reception result of the light receiving element 362 includes information about the intensity distribution of the processing light EL in a plane along the XY plane. The light reception result of the light receiving element 362 is output to the control device 4 as the processing light measurement information described above. In addition, as described above, when the mark 366 is measured by the measurement head 21, the measurement result of the mark 366 by the measurement head 21 is output to the control device 4 as the mark measurement information described above.

[0081] 1 and 2, the control device 4 controls the operation of the machining system SYS. For example, the control device 4 may set machining conditions for the workpiece W and control at least one of the machining device 1, the measuring device 2, and the stage device 3 so that the workpiece W is machined in accordance with the set machining conditions.

[0082] The control device 4 controls the operation of the machining system SYS. The control device 4 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 4 functions as a device that controls the operation of the machining system SYS by the arithmetic device executing a computer program. This computer program is a computer program that causes the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 4, which will be described later. In other words, this computer program is a computer program that causes the control device 4 to function so as to cause the machining system SYS to perform the operations to be performed by the control device 4. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 4, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 4. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 4 via a network interface.

[0083] The control device 4 does not have to be provided inside the processing system SYS. For example, the control device 4 may be provided outside the processing system SYS as a server or the like. In this case, the control device 4 and the processing system SYS may be connected via a wired and / or wireless network (or a data bus and / or a communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a radio wave network is a network compliant with IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). The wireless network may be an infrared network. A network using optical communication may be used as the wireless network. In this case, the control device 4 and the processing system SYS may be configured to be able to send and receive various information via the network. The control device 4 may also be able to send information such as commands and control parameters to the processing system SYS via the network. The processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 4 via the network. The processing system SYS may also include a transmitting device that transmits information such as commands and control parameters to the control device 4 via the network (i.e., an output device that outputs information to the control device 4). Alternatively, a first control device that performs part of the processing performed by the control device 4 may be provided inside the processing system SYS, while a second control device that performs other part of the processing performed by the control device 4 may be provided outside the processing system SYS.

[0084] The recording medium for recording the computer program executed by the control device 4 may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, optical disk such as MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magnetic medium such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (e.g., a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 4 when the control device 4 (i.e., a computer) executes the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 4, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some of the hardware elements are mixed.

[0085] (2) Operation of the machining system SYS Next, the operation of the machining system SYS will be described. As described above, the machining system SYS performs a machining operation to machine at least a portion of the surface of the workpiece W using the machining light EL. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs an axis information generating operation using the measuring device 2 to generate rotation axis information related to the rotation axis 3522 of the rotation device 35. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs a light status information generating operation using the measuring device 36 to generate light status information related to the status of the machining light EL. Furthermore, before performing the machining operation (or after completing the machining operation or during the machining operation), the machining system SYS performs an origin information operation using the measuring device 36 to generate origin information related to the machining origin PO of the machining device 1 and the measurement origin MO of the measuring device 2. Therefore, the machining operation, axis information generating operation, light status information generating operation, and origin information generating operation will be described in order below.

[0086] For ease of explanation, the following describes the machining operation, axis information generating operation, light state information generating operation, and origin information generating operation that are performed when machining a cylindrical workpiece W held by the chuck 353. However, the machining operation, axis information generating operation, light state information generating operation, and origin information generating operation may also be performed on a workpiece W that has a shape other than a cylindrical shape. The machining operation, light state information generating operation, and origin information generating operation may also be performed on a workpiece W that is not held by the chuck 353 (i.e., placed on the stage 32).

[0087] (2-1) Machining operation First, a processing operation for processing at least a part of the surface of the workpiece W using processing light EL will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the flow of the processing operation.

[0088] As shown in FIG. 8 , first, the measurement head 21 measures the workpiece W held by the chuck 353 (step S11). In this case, the measurement head 21 may measure the workpiece W being rotated by the rotation device 35. That is, the measurement head 21 may measure the workpiece W during at least a portion of the period during which the rotation device 35 is rotating the workpiece W. Alternatively, the measurement head 21 may measure a stationary workpiece W. When the measurement head 21 measures a stationary workpiece W, the rotation device 35 may rotate the workpiece W by a predetermined angle each time the measurement head 21 measures a measurement target portion of the surface of the workpiece W for which a measurement shot area MSA is set, so that a new measurement target portion of the surface of the workpiece W that has not yet been measured by the measurement head 21 is included in the measurement shot area MSA. That is, the processing system SYS may alternately perform measurement of the workpiece W by the measurement head 21 and rotation of the workpiece W by the rotation device 35. Specifically, the measurement head 21 measures a first measurement target portion on the surface of the workpiece W, with a measurement shot area MSA set in the first measurement target portion on the surface of the workpiece W. Thereafter, under the control of the control device 4, the rotation device 35 rotates the workpiece W by a predetermined angle so that a measurement shot area MSA is set in a second measurement target portion on the surface of the workpiece W that is different from the first measurement target portion. Thereafter, the measurement head 21 measures a second measurement target portion on the surface of the workpiece W, with a measurement shot area MSA set in the second measurement target portion on the surface of the workpiece W. Similar operations are repeated thereafter. As a result, the measurement head 21 can sequentially measure multiple measurement target portions obtained by subdividing (compartmentalizing or segmenting) the surface of the workpiece W. At this time, the measurement target portion in which the measurement shot area MSA is set after the rotation device 35 rotates the workpiece W may partially overlap with the measurement target portion in which the measurement shot area MSA was set before the rotation device 35 rotated the workpiece W. In other words, the measurement target portion that the measurement head 21 plans to measure after the rotation device 35 rotates the workpiece W may partially overlap with the measurement target portion that the measurement head 21 has already measured before the rotation device 35 rotates the workpiece W.However, the measurement target portion in which the measurement shot area MSA is set after the rotation device 35 rotates the workpiece W does not have to overlap with the measurement target portion in which the measurement shot area MSA was set before the rotation device 35 rotated the workpiece W. In other words, the measurement target portion that the measurement head 21 plans to measure after the rotation device 35 rotates the workpiece W does not have to overlap with the measurement target portion that the measurement head 21 has already measured before the rotation device 35 rotated the workpiece W.

[0089] Furthermore, when the measurement head 21 measures a stationary workpiece W, the stage 32 may move the workpiece W by a predetermined movement amount each time the measurement head 21 measures a measurement target portion of the surface of the workpiece W for which a measurement shot area MSA is set, so that a new measurement target portion of the surface of the workpiece W that has not yet been measured by the measurement head 21 is included in the measurement shot area MSA. The movement direction of the workpiece W at this time may be a direction parallel to the rotation axis 3522 of the rotation device 35. Note that the movement direction of the workpiece W may also be a direction intersecting the rotation axis 3522. In this way, the processing system SYS may alternate between measurement of the workpiece W by the measurement head 21 and movement of the workpiece W by the stage 32.

[0090] Thereafter, the control device 4 sets processing conditions for the workpiece W based on the workpiece measurement information regarding the measurement results of the workpiece W by the measurement head 21 in step S11 (step S12). The processing conditions may include, for example, conditions related to the processing light EL. The conditions related to the processing light EL may include, for example, conditions related to at least one of the intensity of the processing light EL, the irradiation timing of the processing light EL, and the irradiation time of the processing light EL. The processing conditions may include, for example, conditions related to the movement of the processing head 12. The conditions related to the movement of the processing head 21 may include, for example, conditions related to at least one of the movement speed of the processing head 12, the movement timing of the processing head 12, and the movement amount of the processing head 12. The processing conditions may include, for example, conditions related to the movement of the stage 32. The conditions related to the movement of the stage 32 may include, for example, conditions related to at least one of the movement speed of the stage 32, the movement timing of the stage 32, and the movement amount of the stage 32. The processing conditions may include, for example, conditions related to the rotation of the workpiece W by the rotation device 35. The conditions regarding the rotation of the workpiece W may include, for example, conditions regarding at least one of the rotation speed of the workpiece W, the rotation timing of the workpiece W, and the rotation amount of the workpiece W (that is, the rotation angle).

[0091] Thereafter, the processing system SYS processes the workpiece W in accordance with the processing conditions set in step S12 (step S13). That is, the processing head 12 irradiates the processing light EL onto the workpiece W and moves in accordance with the processing conditions set in step S12. The stage 32 moves in accordance with the processing conditions set in step S12. The rotation device 35 rotates the workpiece W in accordance with the processing conditions set in step S12.

[0092] The machining head 12 may machine the workpiece W by irradiating the workpiece W being rotated by the rotation device 35 with the processing light EL. That is, the machining head 12 may machine the workpiece W by irradiating the workpiece W with the processing light EL during at least a portion of the time period during which the rotation device 35 is rotating the workpiece W. Alternatively, the machining head 12 may machine the workpiece W by irradiating a stationary workpiece W with the processing light EL. When the machining head 12 irradiates a stationary workpiece W with the processing light EL, the rotation device 35 may rotate the workpiece W by a predetermined angle each time the machining head 12 processes a processing target portion of the surface of the workpiece W included in the processing shot area PSA so that a new processing target portion of the surface of the workpiece W that has not yet been processed by the machining head 12 is included in the processing shot area PSA. That is, the machining system SYS may alternate between machining the workpiece W by the machining head 12 (i.e., irradiating the workpiece W with the processing light EL by the machining head 12) and rotating the workpiece W by the rotation device 35. Specifically, the processing head 12 processes the first processing target portion on the surface of the workpiece W by irradiating the first processing target portion on the surface of the workpiece W with the processing light EL, while a processing shot area PSA is set in the first processing target portion on the surface of the workpiece W. Then, under the control of the control device 4, the rotation device 35 rotates the workpiece W by a predetermined angle so that the processing shot area PSA is set in a second processing target portion on the surface of the workpiece W that is different from the first processing target portion. Then, while a processing shot area PSA is set in the second processing target portion on the surface of the workpiece W, the processing head 12 processes the second processing target portion by irradiating the second processing target portion on the surface of the workpiece W with the processing light EL. Similar operations are repeated thereafter. As a result, the processing head 12 can sequentially process multiple processing target portions obtained by subdividing (compartmentalizing, segmenting) the surface of the workpiece W. At this time, the control device 4 may also move the workpiece W by a predetermined movement amount so that the processing shot area PSA is set in the second processing target portion on the surface of the workpiece W that is different from the first processing target portion. At this time, the direction of movement of the workpiece W is typically a direction along the rotation axis 3522 of the rotation device 35, but may also be a direction intersecting the rotation axis 3522.

[0093] In either case, the processing system SYS rotates the workpiece W with the rotation device 35 in order to process the surface of the workpiece W with the processing light EL (more specifically, rotates the chuck 353 that holds the workpiece W with the rotation device 35). In this case, the processing system SYS may be considered to be performing lathe processing on the surface of the workpiece W with the processing light EL. If the processing light EL is laser light, the processing system SYS may be considered to be performing laser lathe processing on the surface of the workpiece W with the processing light EL.

[0094] As shown in FIG. 9, which is a perspective view of the workpiece W being machined, the rotation device 35 rotates the workpiece W, allowing the machining head 12 to machine a band-shaped region Wb extending circumferentially on the surface of the workpiece W. In this case, the machining system SYS may repeat the operation of machining the band-shaped region Wb while moving the workpiece W and the processing light EL relative to each other. That is, the machining system SYS may machine the surface of the workpiece W with the processing light EL while moving the workpiece W and the processing light EL relative to each other. The machining system SYS may machine the band-shaped region Wb on the surface of the workpiece W with the processing light EL while moving the irradiation position of the processing light EL on the surface of the workpiece W relative to the surface of the workpiece W. Specifically, as shown in FIG. 9, the machining system SYS may machine the band-shaped region Wb on the surface of the workpiece W with the processing light EL while moving the irradiation position of the processing light EL on the surface of the workpiece W parallel to the rotation axis 3522. That is, the processing system SYS may alternately perform an operation of processing a band-shaped region Wb on the surface of the workpiece W with the processing light EL by rotating the workpiece W using the rotation device 35, and an operation of moving the irradiation position of the processing light EL on the surface of the workpiece W parallel to the rotation axis 3522 while stopping the rotation of the workpiece W by the rotation device 35. As a result, the processing system SYS can process the entire workpiece W (or the portion of the surface of the workpiece W that should be processed with the processing light EL). Note that the operation of moving the irradiation position of the processing light EL parallel to the rotation axis 3522 includes not only an operation of literally making the irradiation position of the processing light EL parallel to the rotation axis 3522, but also an operation of moving the irradiation position of the processing light EL in a direction that is not strictly parallel to the rotation axis 3522 but can be considered substantially parallel.

[0095] As described above, the machining head 12 irradiates the workpiece W with the processing light EL traveling along the Z-axis direction. That is, the machining head 12 irradiates the workpiece W with the processing light EL whose irradiation axis EX is parallel to the Z-axis. In this case, as shown in FIG. 10, which is a cross-sectional view showing the processing light EL irradiated onto the workpiece W, the machining head 12 may irradiate the workpiece W with the processing light EL from a direction intersecting the rotation axis 3522 of the rotating device 35 (i.e., the central axis CS of the workpiece W). That is, the machining head 12 may irradiate the workpiece W with the processing light EL whose irradiation axis EX intersects the rotation axis 3522. In this case, since the machining head 12 is disposed above the workpiece W, the machining head 12 may irradiate the upper surface of the workpiece W (i.e., the surface facing the machining head 12) with the processing light EL. That is, the machining head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL from a direction along the normal line NL of the portion.

[0096] Alternatively, as shown in FIG. 11 , which is a cross-sectional view showing another example of the processing light EL irradiated onto the workpiece W, the processing head 12 may irradiate the workpiece W with the processing light EL from a direction twisted with respect to the rotation axis 3522 of the rotating device 35 (i.e., the central axis CS of the workpiece W). That is, the processing head 12 may irradiate the workpiece W with the processing light EL whose irradiation axis EX is twisted with respect to the rotation axis 3522. The twist direction with respect to the rotation axis 3522 may also be referred to as a direction along an axis twisted with respect to the rotation axis 3522. In this case, the processing head 12 typically irradiates a portion of the surface of the workpiece W with the processing light EL from a direction intersecting the normal line NL to the portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with the processing light EL traveling along the irradiation axis EX that forms an angle greater than 0 degrees with the normal line NL to the portion. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with processing light EL traveling along an irradiation axis EX that forms an angle with the normal line NL of the portion greater than 30 degrees. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with processing light EL traveling along an irradiation axis EX that forms an angle with the normal line NL of the portion greater than 60 degrees. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with processing light EL traveling along an irradiation axis EX that forms an angle with the normal line NL of the portion greater than 70 degrees. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with processing light EL traveling along an irradiation axis EX that forms an angle with the normal line NL of the portion greater than 80 degrees. For example, the processing head 12 may irradiate a portion of the surface of the workpiece W with processing light EL traveling along an irradiation axis EX that forms an angle with the normal line NL of the portion greater than 90 degrees. Note that Figure 11 shows an example in which the processing head 12 irradiates a portion of the surface of the workpiece W with processing light EL that travels along an irradiation axis EX that forms an angle of 90 degrees with the normal NL of the portion.

[0097] When the processing light EL is irradiated onto the workpiece W from a twisted direction relative to the rotation axis 3522, the processing system SYS may change the irradiation position of the processing light EL along a direction intersecting the rotation axis 3522. Because the shape of the workpiece W is cylindrical, the direction intersecting the rotation axis 3522 (i.e., the direction intersecting the central axis CS of the workpiece W) corresponds to the radial direction of the workpiece W. Therefore, the processing system SYS may change the irradiation position of the processing light EL along the radial direction of the workpiece W. Note that even when the processing light EL is irradiated onto the workpiece W from a direction intersecting the rotation axis 3522, the processing system SYS may change the irradiation position of the processing light EL along a direction intersecting the rotation axis 3522.

[0098] For example, as shown in FIG. 11 , the processing system SYS may change the irradiation position of the processing light EL (in this case, the irradiation position may also mean the focusing position; the same applies below) along the Y-axis direction, which intersects the rotation axis 3522 and the irradiation axis EX. In this case, the processing system SYS may change the irradiation position of the processing light EL along the Y-axis direction so that the irradiation position of the processing light EL approaches the rotation axis 3522. For example, the processing system SYS may change the irradiation position of the processing light EL along the Y-axis direction so that the irradiation position of the processing light EL in a second period after the first period is closer to the rotation axis 3522 than the irradiation position of the processing light EL in a first period. In the example shown in FIG. 11 , the processing system SYS may change the irradiation position of the processing light EL along the Y-axis direction so that the irradiation position of the processing light EL moves toward the +Y side.

[0099] For example, as shown in FIG. 11 , the processing system SYS may change the irradiation position of the processing light EL along the Z-axis direction, which intersects with the rotation axis 3522 and is aligned with the irradiation axis EX. In this case, the change in the irradiation position changes the amount of defocus of the processing light EL irradiated onto the surface of the workpiece W. As a result, the change in the irradiation position changes the fluence of the processing light EL irradiated onto the surface of the workpiece W. As an example, when processing of the workpiece W has just begun, the processing system SYS may change the irradiation position of the processing light EL so that the surface of the workpiece W is irradiated with processing light EL having a relatively high fluence. Typically, the fluence is highest when the focusing position of the processing light EL is located on the surface of the workpiece W. Therefore, the processing system SYS may change the irradiation position of the processing light EL so that the focusing position of the processing light EL is located on the surface of the workpiece W. As a result, the amount of workpiece W machined per irradiation of the processing light EL is relatively large. This allows the processing system SYS to perform rough processing of the workpiece W relatively quickly. On the other hand, when finishing the workpiece W, in order to finely adjust the amount of processing of the workpiece W by relatively reducing the amount of processing of the workpiece W per irradiation of the processing light EL, the processing system SYS may change the irradiation position of the processing light EL so that processing light EL with a relatively low fluence is irradiated onto the surface of the workpiece W. Typically, the processing system SYS may change the irradiation position of the processing light EL so that the focusing position of the processing light EL is away from the surface of the workpiece W (i.e., so that defocused processing light EL is irradiated onto the surface of the workpiece W). Alternatively, the processing system SYS may lower the intensity of the processing light EL so that processing light EL with a relatively low fluence is irradiated onto the surface of the workpiece W.

[0100] 10 and 11 described above show an example in which the machining head 12 irradiates the surface of the workpiece W (e.g., the side surface of a cylindrical workpiece W) that intersects with a plane parallel to the holding surface 3531 (a surface along the YZ plane, see FIG. 5 ) of the chuck 353 with which the workpiece W comes into contact when the chuck 353 holds the workpiece W. That is, FIGS. 10 and 11 show an example in which the machining head 12 irradiates the surface of the workpiece W that extends along the rotation axis 3522 with the machining light EL. On the other hand, as shown in FIG. 12, which is a perspective view showing another example of the machining light EL irradiated to the workpiece W, the machining head 12 may irradiate the surface Ws of the workpiece W that intersects with the rotation axis 3522. Here, the machining light EL may be irradiated to the surface Ws of the workpiece W from a direction perpendicular to the direction of the rotation axis 3522 (X direction). The machining light EL may also be irradiated to the surface Ws of the workpiece W from a direction that is not perpendicular to but intersects with the direction of the rotation axis 3522 (X direction). The processing light EL may be irradiated onto the surface Ws of the workpiece W from a direction that is twisted relative to the direction of the rotation axis 3522. The processing light EL may also be irradiated onto the surface Ws of the workpiece W from the direction of the rotation axis 3522.

[0101] When the workpiece W is irradiated with the processing light EL, light generated as a result of the irradiation of the processing light EL may be emitted from the workpiece W. The light generated as a result of the irradiation of the processing light EL may include, for example, at least one of the following: reflected light of the processing light EL from the workpiece W, scattered light of the processing light EL from the workpiece W, and light of the processing light EL passing through the workpiece W. Alternatively, at least a portion of the processing light EL traveling toward the workpiece W may travel beyond the workpiece W without being irradiated on the workpiece W. In this case, the stage device 3 may be provided with a beam damper 37 capable of terminating the light generated as a result of the irradiation of the processing light EL and the portion of the processing light EL that is not irradiated on the workpiece W (hereinafter, these two will be collectively referred to as "unwanted light"). An example of the beam damper 37 is shown in FIG. 13. As shown in FIG. 13, the beam damper 37 is arranged (i.e., provided) on the opposite side of the processing head 12 with respect to the irradiation position of the processing light EL on the surface of the workpiece W. In the example shown in FIG. 13 , the beam damper 37 has a portion located on the -Z side of the irradiation position of the processing light EL on the surface of the workpiece W. The beam damper 37 has an irradiation surface 371 onto which the unwanted light is irradiated. Therefore, the irradiation surface 371 is located on the optical path of the unwanted light. The irradiation surface 371 may absorb or scatter the unwanted light. In this case, to reduce the possibility that the unwanted light irradiated onto the irradiation surface 371 returns to the processing head 12, the irradiation surface 371 may be arranged so as to be inclined with respect to the irradiation axis EX of the processing light EL. For example, the irradiation surface 371 may be arranged so that the angle formed between the irradiation surface 371 and the irradiation axis EX is an acute angle. Furthermore, the irradiation surface 371 does not have to be flat. For example, the irradiation surface 371 may be a curved surface including at least one of a convex surface, a concave surface, etc. Note that the irradiation surface 371 of the beam damper 37 may be located away from the focusing position of the processing light EL. The beam damper 37 may be attached to the stage 32, or may be attached to a member different from the stage 32 (for example, at least one of the surface plate 31 and the housing 5).

[0102] 8, the surface of the workpiece W machined by the processing light EL is measured by the measurement head 21 (step S14). At this time, the measurement of the workpiece W by the measurement head 21 may be performed in parallel with the processing of the workpiece W by the processing head 12. Specifically, the measurement head 21 may measure a second portion of the surface of the workpiece W that has already been machined by the processing light EL during at least a portion of the period in which the processing head 12 is irradiating a first portion of the surface of the workpiece W with the processing light EL. Alternatively, the measurement of the workpiece W by the measurement head 21 may be performed in a state in which the processing of the workpiece W by the processing head 12 is stopped.

[0103] Thereafter, the control device 4 determines whether or not the amount of machining of the workpiece W is appropriate based on the workpiece measurement information relating to the measurement results of the workpiece W by the measuring head 21 in step S14 (step S15). In other words, the control device 4 determines whether or not the amount of machining of the workpiece W based on the machining conditions set in step S12 is an appropriate amount that has been determined in advance or assumed.

[0104] If the result of the judgment in step S15 is that the amount of machining of the workpiece W is inappropriate (step S15: No), the control device 4 resets the machining conditions so that the amount of machining of the workpiece W is appropriate, based on the workpiece measurement information regarding the measurement results of the workpiece W by the measuring head 21 in step S14 (step S16). On the other hand, if the result of the judgment in step S15 is that the amount of machining of the workpiece W is appropriate (step S15: Yes), the control device 4 does not need to reset the machining conditions. Thereafter, the machining system SYS repeats the operations from step S13 to step S16 until machining of the workpiece W is completed (step S17).

[0105] As described above, in this embodiment, the machining system SYS pre-measures the workpiece W before machining in step S11, machines the workpiece W based on the results of the pre-measurement of the workpiece W in step S13, post-measures the workpiece W after machining in step S14, and resets the machining conditions based on the results of the post-measurement of the workpiece W in step S16. This allows the machining system SYS to appropriately machine the workpiece W. In particular, since the machining system SYS is equipped with both the machining head 12 and the measuring head 21, it is possible to perform the operations from step S11 to step S17 without removing the workpiece W from the chuck 353.

[0106] (2-2) Axis information generation operation Next, an axis information generating operation for generating rotational axis information regarding the rotation axis 3522 of the rotating device 35 using the measurement device 2 will be described. In this embodiment, the machining system SYS may perform at least one of the first to third axis information generating operations. The first axis information generating operation is an operation for generating, as rotational axis information, assembly error information regarding a deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. In the following description, the deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32 is referred to as an "assembly error (i.e., assembly error of the rotating device 35 relative to the stage 32)." The second axis information generating operation is an operation for generating, as rotational axis information, scanning error information regarding a deviation between the extension direction of the rotation axis 3522 and the movement direction of the irradiation position of the processing light EL on the surface of the workpiece W by the galvanometer mirror 1214 (i.e., the scanning direction of the processing light EL). In the following description, the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL by the galvanometer mirror 1214 is referred to as the "scanning error." The third axis information generation operation is an operation for generating, as rotation axis information, chucking error information related to the deviation between the rotation axis 3522 and the workpiece W held by the chuck 353. In the following description, the deviation between the rotation axis 3522 and the workpiece W held by the chuck 353 is referred to as the "chucking error." Below, the first to third axis information generation operations will be described in order.

[0107] The rotation axis information may be considered to be information regarding at least one of the position and attitude of the rotation axis 3522 (and thus at least one of the position and attitude of the rotation device 35). For example, the assembly error information may be considered to be information regarding at least one of the position and attitude of the rotation axis 3522 relative to the movement direction of the stage 32 (and thus at least one of the position and attitude of the rotation device 35). For example, the scanning error information may be considered to be information regarding at least one of the position and attitude of the rotation axis 3522 relative to the operation direction of the processing light EL (and thus at least one of the position and attitude of the rotation device 35). For example, the chucking error information may be considered to be information regarding at least one of the position and attitude of the rotation axis 3522 relative to the workpiece W (and thus at least one of the position and attitude of the rotation device 35). In this case, the control device 4 may be considered to be controlling at least one of the processing device 1 (e.g., the processing head 12) and the stage device 3 (e.g., the rotation device 35) based on information regarding at least one of the position and posture of the rotation axis 3522 (and thus at least one of the position and posture of the rotation device 35) in order to process the workpiece W.

[0108] (2-2-1) First axis information generation operation (assembly error) First, a first axis information generation operation will be described for generating assembly error information regarding an assembly error, which is a deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. Ideally, the extension direction of the rotation axis 3522 is parallel to (or coincides with) the movement direction of the stage 32. For example, in this embodiment, the rotation axis 3522 is an axis extending along the X-axis direction, and therefore the extension direction of the rotation axis 3522 is parallel to (or coincides with) the X-axis in a stage coordinate system used to control the position of the stage 32. However, in reality, due to the assembly accuracy when disposing the rotation device 35 on the stage 32 or the assembly accuracy when attaching the chuck 353 to the rotation shaft 352, the extension direction of the rotation axis 3522 may not be parallel to (or may not coincide with) the movement direction of the stage 32. Furthermore, due to the movement accuracy of the stage 32, the extension direction of the rotation axis 3522 may not be parallel to (or may not coincide with) the movement direction of the stage 32. Therefore, the machining system SYS performs a first axis information generating operation to generate assembly error information related to the deviation (i.e., assembly error) between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. The first axis information generating operation will be described below with reference to Fig. 14. Fig. 14 is a flowchart showing the flow of the first axis information generating operation.

[0109] 14, a test workpiece (hereinafter referred to as "test workpiece Wt") for performing the first axis information generating operation is held by the chuck 353 (step S21). At this time, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. Note that a workpiece whose roundness and straightness are known can be used as the test workpiece Wt.

[0110] The test workpiece Wt has a shape that allows the central axis CSt of the test workpiece Wt to ​​be calculated from the measurement results of the test workpiece Wt by the measurement device 2, for example. An example of such a test workpiece Wt is a cylindrical test workpiece Wt. FIG. 15 shows a height image of the test workpiece Wt, which is an example of the measurement results of the cylindrical test workpiece Wt by the measurement device 2. In the height images of FIG. 15 and FIGS. 17(b), 17(d), 19, 21(b), and 21(d) described below, the shading represents height information, with lighter colored areas representing higher heights (on the +Z axis side) and lighter colored areas representing lower heights (on the +Z axis side). As shown in FIG. 15, the height image of the test workpiece Wt is an image in which the portion along the central axis CSt is higher than the other portions. Because the shape of the test workpiece Wt is an ideal cylindrical shape, the control device 4 can calculate the central axis CSt of the test workpiece Wt from the measurement results of the test workpiece Wt by the measurement device 2. The calculated central axis CSt can be used as the rotation axis 3522. This is because, as described above, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. Note that if the workpiece W to be machined can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 instead of the test workpiece Wt in step S21.

[0111] Thereafter, the processing system SYS repeats the operation of measuring a portion of the test workpiece Wt using the measuring device 2 (step S22) and the operation of moving the stage 32 (step S24) until the operation of measuring a portion of the test workpiece Wt has been performed the required number of times. Specifically, for example, as shown in FIG. 16, which is a top view showing the test workpiece Wt, the measuring device 2 sets a measurement shot area MSA in a first measurement target portion Wt11 on the surface of the test workpiece Wt and measures the first measurement target portion Wt11. Thereafter, the processing system SYS moves the stage 32 along one direction. For example, the processing system SYS moves the stage 32 along one direction parallel to the direction in which the rotation axis 3522 should originally extend. For example, if the rotation axis 3522 should originally extend along the X-axis direction, the processing system SYS moves the stage 32 along the X-axis direction of the stage coordinate system. As the stage 32 moves, the measurement shot area MSA moves on the surface of the test workpiece Wt. At this time, the processing system SYS moves the stage 32 so that the measurement shot area MSA is set at a second measurement target portion Wt12 adjacent to the first measurement target portion Wt11 on the surface of the test workpiece Wt. Thereafter, the measuring device 2 measures the second measurement target portion Wt12. Thereafter, the same operation is repeated until the operation of measuring a portion of the test workpiece Wt has been performed the required number of times (step S23).

[0112] Thereafter, the control device 4 generates assembly error information based on the measurement results of the test workpiece Wt in step S22 (step S25). Here, the operation of generating assembly error information will be described with reference to Figures 17(a) to 17(d).

[0113] FIG. 17(a) shows an ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) is parallel to (or coincides with) the movement direction of the stage 32. A height image corresponding to the measurement results of this test workpiece Wt is shown in FIG. 17(b). This height image corresponds to an image generated by connecting multiple images corresponding to multiple measurement results of the test workpiece Wt along the movement direction of the measurement shot area MSA. As shown in FIG. 17(b), the control device 4 can calculate the rotation axis 3522 (central axis CSt) based on the test workpiece Wt reflected in the height image. In other words, the control device 4 can acquire information regarding the rotation axis 3522. Furthermore, because the measurement shot area MSA moves in conjunction with the movement of the stage 32, the height image of the test workpiece Wt is an image that extends along the movement direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the height image itself. Specifically, the control device 4 may calculate the direction connecting multiple images corresponding to multiple measurement results of the test workpiece Wt (for example, the longitudinal direction of the height image) as the movement direction of the stage 32. In the example shown in Fig. 17(b), the extension direction of the rotation axis 3522 and the movement direction of the stage 32 are parallel to each other (or coincide with each other), so the extension direction of the rotation axis 3522 calculated by the control device 4 and the movement direction of the stage 32 calculated by the control device 4 are parallel to each other (or coincide with each other).

[0114] On the other hand, Figure 17(c) shows a test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) and the direction of movement of the stage 32 are not parallel (or do not coincide). A height image corresponding to the measurement results of this test workpiece Wt is shown in Figure 17(d). As shown in Figure 17(d), in this case, the direction in which the rotation axis 3522 calculated by the control device 4 extends and the direction of movement of the stage 32 calculated by the control device 4 are not parallel (or do not coincide).

[0115] Therefore, the control device 4 can calculate the relationship (particularly the deviation) between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. As a result, the control device 4 can generate assembly error information related to the deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32.

[0116] 17, the control device 4 calculates the rotation axis 3522 (central axis CSt) using a height image corresponding to the measurement results of the test workpiece Wt. However, the control device 4 may additionally or instead calculate the rotation axis 3522 (central axis CSt) using the contour of the test workpiece Wt. In this case, the control device 4 may calculate the rotation axis 3522 (central axis CSt) as the midline of two sides of the contour of the test workpiece Wt that extend in the X-axis direction. In this case, as will be described later, the machining system SYS may repeat an operation of measuring a portion of the test workpiece Wt and an operation of moving the stage 32 in another direction (e.g., the Y-axis direction) that intersects with the direction in which the rotation axis 3522 should originally extend.

[0117] The assembly error information also includes information regarding an assembly error of the chuck 353 relative to the rotating shaft 352. In this case, after performing the procedure of FIG. 14 described above, the machining system SYS may rotate the rotation device 35 by a predetermined angle (e.g., 60 degrees) and then perform the procedure of FIG. 14. The control device 4 may repeat this procedure a predetermined number of times (e.g., six times, in which case the procedure of FIG. 14 is performed each time the rotation angle of the rotating shaft 352 becomes 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees), and calculate the deviation of the central axis CSt due to the assembly error by averaging the results of the procedure of FIG. 14 performed a predetermined number of times. Note that by rotating the test workpiece Wt and performing measurements multiple times in this manner, the influence of the test workpiece Wt's own weight deflection can be separated from the assembly error.

[0118] The generated assembly error information may be referenced by the control device 4 to perform the above-described machining operation. That is, the assembly error information may be referenced by the control device 4 during a machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL. Specifically, the control device 4 may control the machining system SYS based on the assembly error information so that, even if there is a misalignment between the extension direction of the rotation axis 3522 and the movement direction of the stage 32, the workpiece W can be machined in the same manner as when there is no misalignment between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. For example, the control device 4 may control at least one of the machining head 12 (particularly, the galvanometer mirror 1214) and the stage 32 based on the assembly error information so that, even if there is a misalignment between the extension direction of the rotation axis 3522 and the movement direction of the stage 32, the irradiation position of the machining light EL moves on the surface of the workpiece W in the same manner as when there is no misalignment between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. Typically, the control device 4 may control at least one of the machining head 12 (particularly the galvanometer mirror 1214) and the stage 32 based on the assembly error information so that the irradiation position of the machining light EL on the surface of the workpiece W moves along the extension direction of the rotation axis 3522. As a result, the machining system SYS can machine the workpiece W with higher precision compared to when the assembly error information is not used. Note that, since the control device 4 refers to the assembly error information during the machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL, the first axis information generation operation may be performed before the machining operation.

[0119] In addition to or instead of the control device 4 controlling at least one of the machining head 12 (particularly the galvanometer mirror 1214) and the stage 32 based on the assembly error information, the rotation device 35 may be reassembled to the stage 32 based on the assembly error information. Typically, the rotation device 35 may be reassembled to the stage 32 so that the direction in which the rotation axis 3522 extends and the direction in which the stage 32 moves are parallel to (or coincide with) each other. In this case, there is no misalignment between the direction in which the rotation axis 3522 extends and the direction in which the stage 32 moves, and therefore the machining system SYS can machine the workpiece W with higher precision.

[0120] In the above description, to generate assembly error information, the machining system SYS repeats the operation of measuring a portion of the test workpiece Wt and the operation of moving the stage 32 along one direction parallel to the direction in which the rotation axis 3522 should originally extend (in the above example, the X-axis direction). However, the machining system SYS may repeat the operation of measuring a portion of the test workpiece Wt and the operation of moving the stage 32 along another direction intersecting the direction in which the rotation axis 3522 should originally extend (for example, the Y-axis direction). In this case as well, the control device 4 can generate assembly error information related to the deviation between the direction in which the rotation axis 3522 extends and the direction in which the stage 32 moves.

[0121] In the above description, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. However, in reality, the chuck 353 may not be able to hold the test workpiece Wt so that the central axis CSt of the test workpiece Wt always coincides with the rotation axis 3522. Therefore, the chuck 353 may re-hold the test workpiece Wt each time the first axis information generating operation shown in FIG. 14 is completed. In other words, the test workpiece Wt may be removed from the chuck 353 each time the first axis information generating operation shown in FIG. 14 is completed, and then the test workpiece Wt may be re-held by the chuck 353. After the chuck 353 re-holds the test workpiece Wt, the machining system SYS may perform the first axis information generating operation shown in FIG. 14 again. As a result, multiple assembly errors are calculated by performing the first axis information generating operation multiple times. The control device 4 may generate assembly error information based on the multiple assembly errors calculated in this manner. For example, the control device 4 may generate assembly error information related to the average value of a plurality of assembly errors. As a result, the influence caused by the central axis CSt of the test workpiece Wt not coinciding with the rotation axis 3522 is reduced.

[0122] Furthermore, the deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32 may be considered to be equivalent to the deviation between the rotation axis 3522 and the running surface of the stage 32. For this reason, the assembly error may be referred to as a stage running error. Considering that the assembly error may be considered to be equivalent to the stage running error in this way, the machining system SYS may generate assembly error information (i.e., stage running error information related to the stage running error) by performing the operation shown in Fig. 18 in addition to or instead of the operation shown in Fig. 14.

[0123] Specifically, as shown in FIG. 18, the test workpiece Wt is held by the chuck 353 (step S31). If the workpiece W to be processed can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 instead of the test workpiece Wt in step S31.

[0124] Then, the processing system SYS processes multiple portions of the surface of the test workpiece Wt. Specifically, first, the processing system SYS sets a processing shot area PSA in a first processing target portion on the surface of the test workpiece Wt and processes at least a part of the first processing target portion (step S32). Then, the processing system SYS moves the stage 32 along one direction. For example, the processing system SYS moves the stage 32 along one direction parallel to the direction in which the rotation axis 3522 should originally extend (step S33). For example, if the rotation axis 3522 should originally extend along the X-axis direction, the processing system SYS moves the stage 32 along the X-axis direction of the stage coordinate system. As the stage 32 moves, the processing shot area PSA moves on the surface of the test workpiece Wt. At this time, the processing system SYS moves the stage 32 so that the processing shot area PSA is set in a second processing target portion on the surface of the test workpiece Wt, which is different from the first processing target portion. Thereafter, the processing system SYS processes at least a portion of the second processing target portion (step S34). At this time, the irradiation position of the processing light EL in the processing shot area PSA when processing at least a portion of the second processing target portion is the same as the irradiation position of the processing light EL in the processing shot area PSA when processing at least a portion of the first processing target portion. Therefore, the processing trace in the second processing target portion is located at a position that is separated from the processing trace in the first processing target portion by the movement amount of the stage 32 in step S33 along the movement direction of the stage 32 in step S33. Note that, although FIG. 18 shows an example in which two portions of the surface of the test workpiece Wt are processed, three or more portions of the surface of the test workpiece Wt may be processed.

[0125] Thereafter, the measuring device 2 measures the surface of the test workpiece Wt (particularly, the portions machined in steps S32 and S34, and the machining marks) (step S35).

[0126] Thereafter, the control device 4 generates assembly error information based on the measurement results of the test workpiece Wt in step S35 (step S36). Here, the operation of generating assembly error information will be described with reference to Figures 19(a) and 19(b).

[0127] FIG. 19(a) shows a height image corresponding to the measurement results of an ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the movement direction of the stage 32. As shown in FIG. 19(a), the control device 4 can calculate the rotation axis 3522 based on the test workpiece Wt reflected in the height image. Furthermore, as described above, multiple processing marks are spaced apart along the movement direction of the stage 32. Therefore, the control device 4 can calculate the movement direction of the stage 32 based on the relative positional relationship of the multiple processing marks reflected in the height image. Specifically, the control device 4 may calculate the direction along the line connecting the multiple processing marks as the movement direction of the stage 32. In the example shown in FIG. 19(a), the direction in which the rotation axis 3522 extends is parallel to (or coincides with) the movement direction of the stage 32. Therefore, the direction in which the rotation axis 3522 calculated by the control device 4 extends is parallel to (or coincides with) the movement direction of the stage 32 calculated by the control device 4.

[0128] 19(b) shows a height image corresponding to the measurement results of the test workpiece Wt in which the direction in which the rotation axis 3522 extends is not parallel to (or does not coincide with) the direction in which the stage 32 moves. As shown in FIG. 19(b), in this case, the direction in which the rotation axis 3522 extends calculated by the control device 4 is not parallel to (or does not coincide with) the direction in which the stage 32 moves calculated by the control device 4.

[0129] Therefore, the control device 4 can calculate the relationship (particularly the deviation) between the extension direction of the rotation axis 3522 and the movement direction of the stage 32. As a result, the control device 4 can generate assembly error information related to the deviation between the extension direction of the rotation axis 3522 and the movement direction of the stage 32.

[0130] (2-2-2) Second axis information generation operation (scanning error) Next, a second axis information generating operation will be described for generating scanning error information regarding a scanning error, which is a deviation between the extension direction of the rotation axis 3522 and the scanning direction of the processing light EL by the galvanometer mirror 1214. Ideally, the extension direction of the rotation axis 3522 is parallel to (or coincides with) the scanning direction of the processing light EL. For example, in this embodiment, the rotation axis 3522 is an axis extending along the X-axis direction, and therefore the extension direction of the rotation axis 3522 is parallel to (or coincides with) the scanning direction of the processing light EL by the X-scanning mirror 1214X provided in the galvanometer mirror 1214. However, in reality, the extension direction of the rotation axis 3522 may not be parallel to (or coincide with) the scanning direction of the processing light EL by the galvanometer mirror 1214 due to the assembly accuracy when the rotation device 35 is disposed on the stage 32 or the assembly accuracy when the chuck 353 is attached to the rotation shaft 352. Furthermore, due to assembly errors or scanning accuracy of the galvanometer mirror 1214, the extension direction of the rotation axis 3522 may not be parallel to (or may not coincide with) the scanning direction of the processing light EL. Therefore, the processing system SYS performs a second axis information generation operation to generate scanning error information related to the deviation between the extension direction of the rotation axis 3522 and the scanning direction of the processing light EL (i.e., scanning error). Note that if the extension direction of the rotation axis 3522 is parallel to the scanning direction of the processing light EL by the galvanometer mirror 1214, the second axis information generation operation may be omitted. The second axis information generation operation will be described below with reference to FIG. 20. FIG. 20 is a flowchart showing the flow of the second axis information generation operation.

[0131] 20, a test workpiece Wt for performing the second axis information generating operation is held by the chuck 353 (step S41). At this time, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. Note that the test workpiece Wt for performing the second axis information generating operation may be the same as the test workpiece Wt for performing the first axis information generating operation. If the workpiece W to be machined can be used as the test workpiece Wt, the workpiece W may be held by the chuck 353 in place of the test workpiece Wt in step S41.

[0132] Thereafter, the machining system SYS deflects the machining light EL using the galvanometer mirror 1214 to form a linear groove GV (see FIG. 21(a) and the like) on the surface of the test workpiece Wt (step S42). Specifically, for example, the machining system SYS controls the galvanometer mirror 1214 so that the irradiation position of the machining light EL moves on the surface of the test workpiece Wt along one direction parallel to the direction in which the rotation axis 3522 should originally extend, thereby forming a linear groove GV extending along one direction on the surface of the test workpiece Wt. For example, if the rotation axis 3522 should originally extend along the X-axis direction, the machining system SYS controls the X-scanning mirror 1214X to form a linear groove GV extending along the X-axis direction on the surface of the test workpiece Wt. While the test workpiece Wt is being irradiated with the machining light EL to form the groove GV, the machining head 12 and the stage 32 do not move.

[0133] Thereafter, the measuring device 2 measures the surface of the test workpiece Wt (particularly, the part where the linear groove GV was formed in step S42, which is the processing mark) (step S43).

[0134] Thereafter, the control device 4 generates scanning error information based on the measurement results of the test workpiece Wt in step S42 (step S44). Here, the operation of generating the scanning error information will be described with reference to Figures 21(a) to 21(d).

[0135] FIG. 21(a) shows an ideal test workpiece Wt in which the direction in which the rotation axis 3522 extends (i.e., the direction in which the central axis CSt extends) is parallel to (or coincides with) the scanning direction of the processing light EL. A height image corresponding to the measurement results of this test workpiece Wt is shown in FIG. 21(b). As shown in FIG. 21(b), the control device 4 can calculate the rotation axis 3522 (central axis CSt) based on the test workpiece Wt reflected in the height image. Furthermore, the control device 4 can calculate the scanning direction of the processing light EL based on the direction in which the groove GV reflected in the height image extends. This is because the groove GV extends along the scanning direction of the processing light EL, and therefore the extension direction of the groove GV is the same as the scanning direction of the processing light EL. In the example shown in Figure 21(b), the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL are parallel (or coincident), so the direction in which the rotation axis 3522 extends calculated by the control device 4 and the scanning direction of the processing light EL calculated by the control device 4 are parallel (or coincident).

[0136] On the other hand, Figure 21(c) shows a test workpiece Wt in which the extension direction of the rotation axis 3522 and the scanning direction of the processing light EL are not parallel (or do not coincide). A height image corresponding to the measurement results of this test workpiece Wt is shown in Figure 21(d). As shown in Figure 21(d), in this case, the extension direction of the rotation axis 3522 calculated by the control device 4 and the scanning direction of the processing light EL calculated by the control device 4 are not parallel (or do not coincide).

[0137] Therefore, the control device 4 can calculate the relationship (particularly the deviation) between the extension direction of the rotation axis 3522 and the scanning direction of the processing light EL. As a result, the control device 4 can generate scanning error information related to the deviation between the extension direction of the rotation axis 3522 and the scanning direction of the processing light EL.

[0138] 21, the control device 4 calculates the rotation axis 3522 (central axis CSt) using a height image corresponding to the measurement results of the test workpiece Wt. However, the control device 4 may additionally / instead calculate the rotation axis 3522 (central axis CSt) using the contour of the test workpiece Wt. In this case, the control device 4 may calculate the rotation axis 3522 (central axis CSt) as the midline of two sides of the contour of the test workpiece Wt that extend in the X-axis direction. In this case, as will be described later, the machining system SYS may repeat an operation of measuring a portion of the test workpiece Wt and an operation of moving the stage 32 in another direction (e.g., the Y-axis direction) that intersects with the direction in which the rotation axis 3522 should originally extend.

[0139] Furthermore, the machining system SYS may rotate the rotation device 35 by a predetermined angle (for example, 60 degrees) after performing the procedure of Fig. 20 described above, and then perform the procedure of Fig. 20. The control device 4 may repeat such a procedure a predetermined number of times (for example, six times; in this case, the procedure of Fig. 20 is performed each time the rotation angle of the rotary shaft 352 becomes 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees), and calculate the scanning error information by averaging the results of the procedure of Fig. 20 performed the predetermined number of times.

[0140] After performing the procedure of FIG. 20 described above, the machining system SYS may remove the test workpiece Wt from the chuck 353, hold it again by the chuck 353, and then perform the procedure of FIG.

[0141] The generated scanning error information may be referenced by the control device 4 to perform the above-described machining operation. That is, the scanning error information may be referenced by the control device 4 during a machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL. Specifically, the control device 4 may control the machining system SYS based on the scanning error information so that, even if there is a misalignment between the extension direction of the rotation axis 3522 and the scanning direction of the machining light EL, the workpiece W can be machined in the same way as when there is no misalignment between the extension direction of the rotation axis 3522 and the scanning direction of the machining light EL. For example, the control device 4 may control at least one of the machining head 12 (particularly, the galvanometer mirror 1214) and the stage 32 based on the scanning error information so that, even if there is a misalignment between the extension direction of the rotation axis 3522 and the scanning direction of the machining light EL, the irradiation position of the machining light EL moves on the surface of the workpiece W in the same way as when there is no misalignment between the extension direction of the rotation axis 3522 and the scanning direction of the machining light EL. Typically, the control device 4 may control at least one of the machining head 12 (particularly, the galvanometer mirror 1214) and the stage 32 based on the scanning error information so that the irradiation position of the machining light EL on the surface of the workpiece W moves along the direction in which the rotation axis 3522 extends. In addition, if the stage 32 does not move during machining, the control device 4 may control the machining head 12 (particularly, the galvanometer mirror 1214). As a result, the machining system SYS can machine the workpiece W with higher precision compared to a case in which the scanning error information is not used. In addition, since the control device 4 refers to the scanning error information during the machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL, the second axis information generation operation may be performed before the machining operation.

[0142] In the above description, to generate the scanning error information, the machining system SYS controls the galvanometer mirror 1214 so that the irradiation position of the processing light EL moves along one direction parallel to the direction in which the rotation axis 3522 should originally extend. However, the machining system SYS may also control the galvanometer mirror 1214 so that the irradiation position of the processing light EL moves along another direction intersecting the direction in which the rotation axis 3522 should originally extend. For example, the machining system SYS may control the Y-scan mirror 1214Y to form a linear groove GV extending along the Y-axis direction on the surface of the test workpiece Wt. In this case, too, the control device 4 can generate scanning error information related to the deviation between the direction in which the rotation axis 3522 extends and the scanning direction of the processing light EL.

[0143] In the above description, the test workpiece Wt is held by the chuck 353 so that the central axis CSt of the test workpiece Wt coincides with the rotation axis 3522. However, as described above, in reality, there is a possibility that the chuck 353 cannot hold the test workpiece Wt so that the central axis CSt of the test workpiece Wt always coincides with the rotation axis 3522. Therefore, the chuck 353 may re-hold the test workpiece Wt each time the second axis information generating operation shown in FIG. 20 is completed. In other words, each time the second axis information generating operation shown in FIG. 20 is completed, the test workpiece Wt may be removed from the chuck 353 and then re-held by the chuck 353. After the chuck 353 re-holds the test workpiece Wt, the machining system SYS may perform the second axis information generating operation shown in FIG. 20 again. As a result, multiple scanning errors are calculated by performing the second axis information generating operation multiple times. The control device 4 may generate scanning error information based on the multiple scanning errors calculated in this manner. For example, the control device 4 may generate scanning error information related to the average value of multiple scanning errors. As a result, the influence caused by the central axis CSt of the test workpiece Wt not coinciding with the rotation axis 3522 is reduced.

[0144] (2-2-3) Third axis information generation operation (chucking error) Next, a third axis information generating operation will be described, which generates chucking error information related to a chucking error, which is a deviation between the rotation axis 3522 and the workpiece W held by the chuck 353. Ideally, the chuck 353 holds the workpiece W so that the rotation axis 3522 coincides with the central axis CS of the workpiece W. However, due to factors such as the accuracy with which the workpiece W is attached to the chuck 353, the chuck 353 may not be able to hold the workpiece W so that the rotation axis 3522 coincides with the central axis CS. For example, as shown in FIG. 22(a), which is a top view showing a workpiece W in which a chucking error has occurred, the chuck 353 may hold the workpiece W in a state in which a chucking error has occurred, in which the rotation axis 3522 is parallel to but not coincident with the central axis CS. For example, as shown in FIG. 22(b), which is a top view showing a workpiece W in which a chucking error has occurred, the chuck 353 may hold the workpiece W in a state in which a chucking error has occurred, in which the rotation axis 3522 is not parallel to the central axis CS. For ease of explanation, a chucking error in which the rotation axis 3522 is parallel to but not aligned with the central axis CS is referred to as an "eccentricity error." The eccentricity error may be considered to be an error related to the positional relationship between the rotation axis 3522 and the central axis CS. A chucking error in which the rotation axis 3522 is not parallel to the central axis CS is referred to as an "arc angle error." The argument error may be considered to be an error related to the angular relationship between the rotation axis 3522 and the central axis CS. For this reason, the machining system SYS may generate eccentricity error information related to the eccentricity error as chucking error information by performing a third axis information generation operation. The machining system SYS may generate argument error information related to the argument error as chucking error information by performing a third axis information generation operation. Hereinafter, the operation for generating eccentricity error information and the operation for generating argument error information will be described in order.

[0145] (2-2-3-1) Operation for generating eccentricity error information First, the operation for generating eccentricity error information will be described with reference to Fig. 23. Fig. 23 is a flowchart showing the flow of the operation for generating eccentricity error information.

[0146] As shown in FIG. 23, the workpiece W is held by the chuck 353 (step S51). Thereafter, the machining system SYS repeats an operation of measuring at least a portion of the workpiece W using the measuring device 2 (step S52) and an operation of rotating the workpiece W by a predetermined angle using the rotation device 35 (step S54) until the workpiece W is rotated by a required angle greater than the predetermined angle. For example, the required angle may be at least 360 degrees. That is, the machining system SYS repeats an operation of measuring at least a portion of the workpiece W using the measuring device 2 (step S52) and an operation of rotating the workpiece W by the rotation device 35 (step S54) until the workpiece W rotates at least once. Here, the required angle may be greater than or equal to 360 degrees, or may be less than 360 degrees. Note that the machining head 12 does not need to move during the period in which the operations from step S52 to step S54 are being performed.

[0147] Thereafter, the control device 4 generates eccentricity error information based on the measurement results of the workpiece W in step S52 (step S55). Here, the operation of generating eccentricity error information will be described with reference to Figs.

[0148] FIG. 24 is a cross-sectional view showing an ideal rotation of the workpiece W in which the central axis CS coincides with the rotation axis 3522. As shown in FIG. 24, when the central axis CS coincides with the rotation axis 3522, even if the workpiece W is rotated by the rotation device 35, the position in one direction of the end point (end portion) located at the end of the surface of the workpiece W in one direction intersecting with the rotation axis 3522 does not change. For convenience of explanation, the following description will use, as the end point, an end point PZ located at the end of the surface of the workpiece W in the Z-axis direction intersecting with the rotation axis 3522. In this case, as shown in FIG. 25, which is a graph showing the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W shown in FIG. 24, even if the workpiece W is rotated by the rotation device 35, the position of the end point PZ in the Z-axis direction (i.e., the height) does not change. In other words, the position of the end point PZ in the Z-axis direction (i.e., the height) is a constant value regardless of the rotation angle θ.

[0149] 26 is a cross-sectional view showing the rotation of the workpiece W whose central axis CS is parallel to but not coincident with the rotation axis 3522. As shown in FIG. 26, when the central axis CS does not coincide with the rotation axis 3522, when the workpiece W is rotated by the rotation device 35, the position in one direction of the end point constituting the end of the surface of the workpiece W in one direction intersecting the rotation axis 3522 varies in accordance with the rotation of the workpiece W. Specifically, as shown in FIG. 27, which is a graph showing the relationship between the position in the Z-axis direction of the end point PZ of the workpiece W shown in FIG. 26 and the rotation angle θ of the workpiece W, when the workpiece W is rotated by the rotation device 35, the position in the Z-axis direction of the end point PZ (i.e., the height) varies sinusoidally in accordance with the rotation of the workpiece W. In other words, the position of the end point PZ in the Z-axis direction is a value that changes sinusoidally in accordance with the rotation angle θ. In this case, the amount of fluctuation in the position of the end point PZ in the Z-axis direction (i.e., the difference between the maximum and minimum values ​​of the position of the end point PZ in the Z-axis direction) increases as the amount of eccentricity error corresponding to the distance between the center axis CS and the rotation axis 3522 increases.

[0150] FIG. 28, like FIG. 26, is a cross-sectional view showing the rotation of the workpiece W whose central axis CS is parallel to but not coincident with the rotation axis 3522. However, the example shown in FIG. 28 differs from the example shown in FIG. 26, in that when the rotation angle θ is zero degrees, the end point PZ is spaced from the rotation axis 3522 not only in the Z-axis direction but also in the Y-axis direction, which intersects the Z-axis direction. This is in contrast to the example shown in FIG. 26, in which the end point PZ is spaced from the rotation axis 3522 only in the Z-axis direction when the rotation angle θ is zero degrees. In this case, as shown in FIG. 29, which is a graph showing the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W, when the workpiece W is rotated by the rotation device 35, the position (i.e., height) of the end point PZ in the Z-axis direction fluctuates sinusoidally in accordance with the rotation of the workpiece W. However, the fluctuation in the position of the end point PZ in the Z-axis direction shown in FIG. 29 differs from the fluctuation in the position of the end point PZ in the Z-axis direction shown in FIG. 29 in that the phases of the fluctuations are different.

[0151] Therefore, the control device 4 can calculate the eccentricity error by calculating the relationship between the position of the end point PZ of the workpiece W in the Z-axis direction and the rotation angle θ of the workpiece W based on the measurement results of the workpiece W by the measurement device 2. Specifically, the control device 4 calculates the amount of fluctuation in the position of the end point PZ in the Z-axis direction based on the relationship between the position of the end point PZ in the Z-axis direction and the rotation angle θ, and can calculate the distance between the central axis CS and the rotation axis 3522 from the amount of fluctuation. Furthermore, the control device 4 can calculate the phase of the fluctuation in the position of the end point PZ in the Z-axis direction based on the relationship between the position of the end point PZ in the Z-axis direction and the rotation angle θ, and can calculate the state of the workpiece W according to the rotation angle θ of the workpiece W from the phase (specifically, information about the direction in which the central axis CS of the workpiece W is located relative to the rotation axis 3522). In other words, the control device 4 can generate eccentricity error information related to the eccentricity error, which is the deviation between the central axis CS of the workpiece W and the rotation axis 3522.

[0152] The control device 4 may determine the rotation axis 3522 from the contour of the workpiece W, and determine the eccentricity error from the displacement of the rotation axis 3522 thus determined.

[0153] The generated eccentricity error information may be referenced by the control device 4 to perform the above-described machining operation. That is, the eccentricity error information may be referenced by the control device 4 during a machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL. Specifically, the control device 4 may control the machining system SYS based on the eccentricity error information so that the workpiece W can be machined in the same manner as when no eccentricity error occurs, even when an eccentricity error occurs. For example, the control device 4 may control the irradiation position of the machining light EL based on the eccentricity error information so that the surface of the workpiece W is irradiated with the machining light EL in the same manner as when no eccentricity error occurs, even when an eccentricity error occurs. Note that, in order for the control device 4 to refer to the eccentricity error information during a machining period in which the workpiece W is machined by irradiating the processing light EL to the workpiece W, the operation of generating the eccentricity error information may be performed before the machining operation.

[0154] FIG. 30 shows an example of the irradiation position of the processing light EL controlled based on the eccentricity error information. FIG. 30 shows an example in which the processing light EL is irradiated onto an end point of the workpiece W (specifically, end point PY located at the end in the Y-axis direction intersecting with the rotation axis 3522) from the direction of torsion relative to the rotation axis 3522. As shown in FIG. 30, when an eccentricity error occurs, the position of end point PY in the Y-axis direction fluctuates in accordance with the rotation of the workpiece W. In this case, the control device 4 may control the irradiation position of the processing light EL along the Y-axis direction (in this case, the focusing position) so that the processing light EL is irradiated onto end point PY. For example, the control device 7 may control the irradiation position of the processing light EL along the Y-axis direction (in this case, the focusing position) by controlling the galvanometer mirror 1214. As a result, the processing system SYS can machine the workpiece W with higher precision compared to when the eccentricity error information is not used.

[0155] (2-2-3-2) Operation for generating declination error information Next, the operation for generating the argument error information will be described with reference to Fig. 31. Fig. 31 is a flowchart showing the flow of the operation for generating the argument error information.

[0156] As shown in FIG. 31, the machining system SYS performs the above-described operations from step S51 to step S54, which are also performed in the operation of generating eccentricity error information. However, the machining system SYS performs the above-described operations from step S51 to step S54 at a plurality of different positions (e.g., two positions) on the workpiece W. Specifically, as shown in FIG. 32, which is a top view showing the workpiece W in which an angular deviation error has occurred, the machining system SYS repeats the operation of measuring the first measurement target portion W21 of the workpiece W using the measurement device 2 (step S52) and the operation of rotating the workpiece W by a predetermined angle using the rotation device 35 (step S54) until the workpiece W has rotated by the required angle (step S53). In other words, the machining system SYS performs the operations from step S51 to step S54 at the first position P1 of the workpiece W where the first measurement target portion W21 is located. Thereafter, the machining system SYS moves the stage 32 along the rotation axis 3522. At this time, the processing system SYS moves the stage 32 so that the measuring device 2 can measure the second measurement target portion W22 of the workpiece W (step S62). Because the stage 32 moves along the rotation axis 3522, the position of the second measurement target portion W22 in the direction along the rotation axis 3522 is different from the position of the first measurement target portion W21 in the direction along the rotation axis 3522. Thereafter, the processing system SYS repeats the operation of measuring the second measurement target portion W22 of the workpiece W using the measuring device 2 (step S52) and the operation of rotating the workpiece W by a predetermined angle using the rotation device 35 (step S54) until the workpiece W has rotated by the required angle (step S53). In other words, the processing system SYS performs the operations of steps S51 to S54 at the second position P2 of the workpiece W where the second measurement target portion W22 is located. The above operations are repeated until it is determined that it is not necessary to perform the operations of steps S51 to S54 at other positions of the workpiece W (step S61).

[0157] Thereafter, the control device 4 generates declination error information based on the measurement results of the workpiece W in step S52 (step S63). Specifically, the control device 4 calculates the eccentricity error at each of a plurality of different positions along the rotation axis 3522 based on the measurement results of the workpiece W in step S52. For example, as shown in FIG. 32, the control device 4 calculates the eccentricity error at a first position P1 and an eccentricity error at a second position P2. Thereafter, the control device 4 calculates the declination error (for example, the angle between the central axis CS and the rotation axis 3522) based on the calculated plurality of eccentricity errors. In other words, the control device 4 can generate declination error information related to the declination error, which is the deviation between the central axis CS of the workpiece W and the rotation axis 3522.

[0158] The generated declination error information may be referenced by the control device 4 to perform the above-described machining operation. Note that the control method using the declination error information may be the same as the control method using the eccentricity error information, and therefore a detailed description thereof will be omitted. As a result, the machining system SYS can machine the workpiece W with higher precision compared to a case where the declination error information is not used. Note that, since the control device 4 references the declination error information during the machining period in which the workpiece W is machined by irradiating the machining light EL onto the workpiece W, the operation of generating the declination error information may be performed prior to the machining operation.

[0159] Furthermore, assembly error information (particularly, assembly error when attaching the chuck 353 to the rotary shaft 352) may be generated by an operation similar to the third axis information generating operation.

[0160] (2-3) Optical status information generation operation Next, a description will be given of a light state information generation operation for generating light state information regarding the state of the processing light EL using the measurement device 36. In this embodiment, the light state information may include, for example, intensity distribution information regarding the intensity distribution of the processing light EL in the angular direction relative to the irradiation axis EX. The light state information may include, for example, traveling direction information regarding the traveling direction of the processing light EL. The light state information may include, for example, passage position information regarding the position where the processing light EL passes within a plane intersecting the traveling direction of the processing light EL. Therefore, the operation for generating intensity distribution information, the operation for generating traveling direction information, and the operation for generating passage position information will be described below in order.

[0161] (2-3-1) Operation for generating intensity distribution information First, the operation of generating intensity distribution information relating to the intensity distribution of the processing light EL in the angular direction relative to the irradiation axis EX will be described.

[0162] In order to generate the intensity distribution information, the processing system SYS measures the intensity distribution of the processing light EL using the measuring device 36. Below, with reference to Figures 33(a) to 33(c), the operation of measuring the intensity distribution of the processing light EL using the measuring device 36 will be described. Figure 33(a) is a cross-sectional view showing how the processing head 12 irradiates the measuring device 36 with the processing light EL, Figure 33(b) is a plan view showing how the processing head 12 irradiates the measuring device 36 with the processing light EL, and Figure 33(c) is a graph showing the result of receiving the processing light EL by the light receiving element 362 provided in the measuring device 36.

[0163] 33(a) and 33(b), the control device 4 controls the stage drive system 33 to move the stage 32 to a position where the processing head 12 can irradiate the processing light EL onto a mark 366 that constitutes a passing area 365 through which the processing light EL can pass (i.e., moves the rotation device 35 on which the measurement device 36 is disposed). That is, the control device 4 moves the stage 32 so that the mark 366 is positioned within the processing shot area PSA. At this time, the control device 4 may move the processing head 12 in addition to or instead of the stage 32. Thereafter, the control device 4 causes the processing head 12 to irradiate the processing light EL onto the mark 366.

[0164] 33(a) and 33(b), under the control of the control device 4, the processing head 12 deflects the processing light EL using the galvanometer mirror 1214, thereby causing the processing light EL to scan at least a portion of the surface of the measuring device 36 (specifically, the surface including the portion where the mark 366 is formed). In particular, the processing head 12 causes the processing light EL to scan at least a portion of the surface of the measuring device 36 so that the processing light EL (more specifically, the target irradiation area EA of the processing light EL) crosses the passing area 365 that constitutes the mark 366 within a plane along the XY plane. Note that the processing light EL may also be caused to scan at least a portion of the surface of the measuring device 36 by moving the stage 32 under the control of the control device 4.

[0165] As a result, the processing light EL is irradiated onto the mark 366 at a certain timing during the period during which the processing light EL scans at least a portion of the surface of the measuring device 36. In other words, the processing light EL is received by the light-receiving element 362 at a certain timing during the period during which the processing light EL scans at least a portion of the surface of the measuring device 36. As a result, as shown in FIG. 33(c), the control device 4 acquires a light-receiving signal indicating that the intensity of the processing light EL during the period during which at least a portion of the processing light EL is irradiated onto the passage region 365 constituting the mark 366 is higher than the intensity of the processing light EL during the period during which the processing light EL is not irradiated onto the passage region 365 constituting the mark 366. This signal indicates that the intensity of the processing light EL is higher during the period during which the processing light EL is irradiated onto the passage region 365 constituting the mark 366. In other words, the control device 4 can acquire information regarding the intensity distribution of the processing light EL as the processing light measurement information. In this case, it can also be said that the measuring device 36 measures the intensity distribution of the processing light EL. Note that the time (light-receiving timing) on ​​the horizontal axis of FIG. 33(c) can be interpreted as the relative positions of the processing light EL and the measuring device 36 along the scanning direction (Y-axis direction).

[0166] The processing system SYS repeats the operation of measuring the processing light EL while changing the relative positional relationship between the measuring device 36 and the processing head 12 in the direction along the irradiation axis EX, which is the traveling direction of the processing light EL. Specifically, the control device 4 moves at least one of the processing head 12 and the stage 32 so that the position of the measuring device 36 relative to the processing head 12 is a first position. The measuring device 36 then measures the processing light EL. The control device 4 then moves at least one of the processing head 12 and the stage 32 so that the position of the measuring device 36 relative to the processing head 12 is a second position different from the first position in the direction along the irradiation axis EX. Typically, the control device 4 moves at least one of the processing head 12 and the stage 32 along the irradiation axis EX (along the Z-axis direction in the example shown in FIG. 33(a)). The measuring device 36 then measures the processing light EL. That is, the measuring device 36 measures the processing light EL at a first position in the direction along the irradiation axis EX (i.e., the direction in which the processing light EL travels), and measures the processing light EL at a second position different from the first position in the direction along the irradiation axis EX (i.e., the direction in which the processing light EL travels). Here, the change in the distance between the focusing position of the processing light EL and the measuring device 36 in the direction along the irradiation axis EX may be a change by the focusing position changing optical system 1210.

[0167] Thereafter, the control device 4 generates intensity distribution information regarding the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, the processing light measurement information indicates the intensity distribution of the processing light EL on the surface of the beam passing member 361. Here, the operation of measuring the processing light EL is repeated while changing the relative positional relationship between the measurement device 36 and the processing head 12 in the direction along the irradiation axis EX. Therefore, as shown in FIG. 34, which is a cross-sectional view of the processing light EL, the processing light measurement information indicates the intensity distribution of the processing light EL on multiple surfaces PN that intersect with the irradiation axis EX and have different positions in the direction along the irradiation axis EX. The control device 4 may combine the intensity distributions of the processing light EL on multiple surfaces PN that have different positions in the direction along the irradiation axis EX, and generate intensity distribution information regarding the intensity distribution of the processing light EL in the angular direction relative to the irradiation axis EX from the combined three-dimensional intensity distribution. Alternatively, the control device 4 may estimate (in other words, complement) the intensity distribution PN of the processing light EL between multiple surfaces based on the intensity distribution of the processing light EL on multiple surfaces at different positions in the direction along the irradiation axis EX, and generate intensity distribution information regarding the intensity distribution of the processing light EL in the angular direction relative to the irradiation axis EX.

[0168] Alternatively, when measuring the processing light EL, the processing system SYS does not need to change the relative positional relationship between the measuring device 36 and the processing head 12 in the direction along the irradiation axis EX. Specifically, the control device 4 may control the relative positional relationship between the focusing position of the processing light EL and the measuring device 36 so that the focusing position of the processing light EL is away from the passing region 365 that forms the mark 366 in the direction along the irradiation axis EX. In other words, the control device 4 may control the relative positional relationship between the focusing position of the processing light EL and the measuring device 36 so that the measuring device 36 measures the processing light EL at a position different from the focusing position of the processing light EL in the direction along the irradiation axis EX. In other words, the control device 4 may control the relative positional relationship between the focusing position of the processing light EL and the measuring device 36 so that defocused processing light EL is irradiated onto the mark 366.

[0169] The control device 4 then generates intensity distribution information regarding the intensity distribution of the processing light EL based on the processing light measurement information. Specifically, as described above, the processing light measurement information indicates the intensity distribution of the processing light EL on the light-receiving surface 3621 of the light-receiving element 362. Furthermore, the distance between the focusing position of the processing light EL and the measurement device 36 in the direction along the irradiation axis EX (the so-called defocus amount) is known to the control device 4. This is because the control device 4 controls the relative positional relationship between the focusing position of the processing light EL and the measurement device 36 so that the focusing position of the processing light EL is spaced apart from the passing region 365 that constitutes the mark 366 in the direction along the irradiation axis EX. As a result, the control device 4 can estimate (in other words, complement) the intensity distribution of the processing light EL on multiple surfaces at different positions in the direction along the irradiation axis EX based on the intensity distribution and defocus amount of the processing light EL indicated by the processing light measurement information. In other words, the control device 4 can generate intensity distribution information regarding the intensity distribution of the processing light EL in the angular direction relative to the irradiation axis EX.

[0170] The generated intensity distribution information may be referenced by the control device 4 to perform the above-described processing operation. That is, the intensity distribution information may be referenced by the control device 4 during the processing period in which the workpiece W is processed by irradiating the processing light EL onto the workpiece W. Note that, since the control device 4 references the intensity distribution information during the processing period in which the workpiece W is processed by irradiating the processing light EL onto the workpiece W, the operation of generating the intensity distribution information may be performed before the processing operation.

[0171] For example, based on the intensity distribution information, the control device 4 may control at least one of the irradiation position and the traveling direction of the processing light EL so that the processing light EL is irradiated at a desired position on the workpiece W. In this case, the control device 4 may control at least one of the irradiation position and the traveling direction of the processing light EL by controlling the galvanometer mirror 1214.

[0172] For example, the control device 4 may calculate the aperture angle of the processing light EL based on the intensity distribution information and control the aperture angle of the processing light EL based on the calculated aperture angle so that the aperture angle of the processing light EL is a desired angle. In this case, the control device 4 may control the aperture angle of the processing light EL by controlling the aperture angle changing optical system 1211. Such aperture angle control may be performed, for example, when the processing light EL is irradiated onto the workpiece W from a torsional direction relative to the rotation axis 3522. For example, as shown in FIG. 35(a), which is a cross-sectional view showing the processing light EL irradiated onto the workpiece W from a torsional direction relative to the rotation axis 3522, if the aperture angle of the processing light EL is large, the processing light EL may unintentionally irradiate not only the portion of the surface of the workpiece W that should be irradiated with the processing light EL, but also portions of the surface of the workpiece W that should not be irradiated with the processing light EL. In other words, the processing light EL may unintentionally irradiate portions of the surface of the workpiece W that should not be irradiated with the processing light EL. 35(b), which is a cross-sectional view showing the processing light EL with the controlled opening angle, the control device 4 may reduce the opening angle of the processing light EL. As a result, the possibility that the processing light EL will be irradiated onto a portion of the surface of the workpiece W that should not be irradiated with the processing light EL is reduced.

[0173] Furthermore, the control device 4 may perform an operation of generating intensity distribution information after performing an operation of changing the aperture angle of the processing light EL by the aperture angle changing optical system 1211. The control device 4 may control the aperture angle of the processing light EL based on the intensity distribution information obtained by this generation operation.

[0174] Note that, under the control of the control device 4, the processing head 12 may irradiate the processing light EL onto a mark 366 having a plurality of slit shapes with different longitudinal directions. For example, under the control of the control device 4, the processing head 12 may irradiate a plurality of marks 366 whose longitudinal directions intersect (typically, are perpendicular) with the processing light EL. In this case, the control device 4 can calculate the ellipticity of the processing light EL based on the processing light measurement information. The control device 4 may control the ellipticity of the processing light EL based on the calculated ellipticity so that the ellipticity of the processing light EL becomes a desired ellipticity. In this case, the control device 4 may control the ellipticity of the processing light EL by controlling the ellipticity changing optical system 1212. Furthermore, based on the calculated ellipticity, the control device 4 may rotate the processing light EL around the optical axis AX (particularly, around the irradiation axis EX) so that the direction in which the diameter of the spot of the processing light EL on the entrance pupil plane of the fθ lens 1215 is the maximum becomes the desired direction. In this case, the control device 4 may rotate the processing light EL around the optical axis AX (particularly around the irradiation axis EX) by controlling the optical rotation optical system 1213. The control device 4 may perform an operation to generate intensity distribution information after performing an operation to change the ellipticity of the processing light by the optical rotation optical system 1213. The control device 4 may control the ellipticity of the processing light EL based on the intensity distribution information obtained by this generation operation.

[0175] (2-3-2) Operation of generating heading information Next, an operation for generating traveling direction information regarding the traveling direction of the processing light EL (i.e., the direction in which the irradiation axis EX extends) will be described. To generate the traveling direction information, the processing system SYS measures the processing light EL using the measurement device 36.

[0176] 36, which is a cross-sectional view showing the measuring device 36 that measures the processing light EL, the control device 4 moves the stage 32 (i.e., moves the rotation device 35 on which the measuring device 36 is disposed) so that the measuring device 36 can measure the processing light EL (i.e., so that the light-receiving element 362 can receive the processing light EL) while the processing light EL is being emitted from the processing head 12. At this time, the processing head 12 does not need to deflect the processing light EL using the galvanometer mirror 1214. The control device 4 acquires information regarding the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measured the processing light EL from the position measurement device 34.

[0177] Thereafter, the control device 4 assumes that the traveling direction of the processing light EL to be measured is along the Z axis (i.e., the irradiation axis EX is along the Z axis), and moves the stage 32 along the direction along the irradiation axis EX (i.e., the Z axis direction). That is, the control device 4 moves the measurement device 36 along the direction along the irradiation axis EX (i.e., the Z axis direction). Note that instead of or in addition to moving the stage 32 in the Z axis direction, the control device 4 may move the processing head 12 in the Z axis direction. As a result, the measurement device 36 measures the processing light EL again from a position along the irradiation axis EX (i.e., the Z axis direction) that is different from the position where the processing light EL was measured last time. That is, the measurement device 36 measures the processing light EL at a first position along the irradiation axis EX (i.e., the Z axis direction), and then measures the processing light EL at a second position along the irradiation axis EX (i.e., the Z axis direction) that is different from the first position. In this case, if the traveling direction of the processing light EL to be measured is actually along the Z axis, the measuring device 36 can measure the processing light EL even if the measuring device 36 moves along the direction along the irradiation axis EX (i.e., the Z axis direction). On the other hand, as shown in FIG. 37, which is a cross-sectional view of the measuring device 36 measuring the processing light EL, if the traveling direction of the processing light EL to be measured is not actually along the Z axis (i.e., the traveling direction of the processing light EL is inclined with respect to the Z axis), the measuring device 36 may not be able to measure the processing light EL simply by moving the measuring device 36 along the direction along the irradiation axis EX (i.e., the Z axis direction). For this reason, as shown in FIG. 38, which is a cross-sectional view of the measuring device 36 measuring the processing light EL, the control device 4 may move the stage 32 along a direction intersecting the irradiation axis EX (e.g., at least one of the X axis direction and the Y axis direction) in addition to the direction along the irradiation axis EX (i.e., the Z axis direction) so that the measuring device 36 can measure the processing light EL (i.e., so that the light receiving element 362 can receive the processing light EL). The control device 4 acquires, from the position measurement device 34, information relating to the position of the stage 32 when the measurement device 36 measures the processing light EL (that is, the position of the measurement device 36).

[0178] Thereafter, the control device 4 generates traveling direction information regarding the traveling direction of the processing light EL based on information regarding the position of the measurement device 36 when the measurement device 36 measured the processing light EL. Specifically, the control device 4 generates the traveling direction information based on information regarding the position of the measurement device 36 when the measurement device 36 measured the processing light EL before moving the measurement device 36 along the irradiation axis EX (i.e., the Z-axis direction) (hereinafter referred to as the "first measurement position") and information regarding the position of the measurement device 36 when the measurement device 36 measured the processing light EL after moving the measurement device 36 along the irradiation axis EX (i.e., the Z-axis direction) (hereinafter referred to as the "second measurement position"). For example, the control device 4 may generate the traveling direction information based on the first and second measurement positions in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis direction and the Y-axis direction). Specifically, when the first measurement position and the second measurement position are located at the same position in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis direction and the Y-axis direction), the traveling direction of the processing light EL is estimated to be along the Z-axis. On the other hand, when the first measurement position and the second measurement position are located at different positions in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis direction and the Y-axis direction), the traveling direction of the processing light EL is estimated to be inclined with respect to the Z-axis. In this case, the amount of inclination of the traveling direction of the processing light EL with respect to the Z-axis can be calculated from the distance between the first and second measurement positions in a direction intersecting the irradiation axis EX (e.g., at least one of the X-axis direction and the Y-axis direction) and the distance between the first and second measurement positions in a direction along the irradiation axis EX (i.e., the Z-axis direction). In this way, the control device 4 generates traveling direction information.

[0179] The generated traveling direction information may be referenced by the control device 4 to perform the above-described machining operation. That is, the traveling direction information may be referenced by the control device 4 during a machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL. For example, the control device 4 may control at least one of the irradiation position and the traveling direction of the machining light EL based on the traveling direction information so that the machining light EL is irradiated at a desired position on the workpiece W. In this case, the control device 4 may control at least one of the irradiation position and the traveling direction of the machining light EL by controlling the galvanometer mirror 1214. Note that a device disclosed in U.S. Patent Application Publication No. 2018 / 0169788 may be used as the galvanometer mirror 1214 to control the irradiation position and the traveling direction of the machining light EL. Furthermore, since the control device 4 references the traveling direction information during a machining period in which the workpiece W is machined by irradiating the workpiece W with the machining light EL, the operation of generating the traveling direction information may be performed prior to the machining operation.

[0180] (2-3-3) Operation to generate passing position information Next, an operation for generating passage position information relating to the position where the processing light EL passes within a plane intersecting the traveling direction of the processing light EL will be described. To generate the passage position information, the processing system SYS measures the processing light EL using the measurement device 36.

[0181] Specifically, as shown in FIG. 39, which is a cross-sectional view of a measuring device 36 that measures the processing light EL, the control device 4 controls the processing head 12 so that the irradiation position of the processing light EL on the processing head 12 is set to multiple positions. In this case, the control device 4 may change the irradiation position of the processing light EL on the processing head 12 by, for example, deflecting the processing light EL using a galvanometer mirror 1214. For example, the control device 4 may control the processing head 12 so that the irradiation position of the processing light EL on the processing head 12 is set to a first irradiation position IP#1. The measuring device 36 measures the processing light EL during the period when the irradiation position of the processing light EL on the processing head 12 is the first irradiation position IP#1. The control device 4 acquires, from the position measuring device 34, information regarding the position of the stage 32 (i.e., the position of the measuring device 36) when the measuring device 36 measured the processing light EL irradiated at the first irradiation position IP#1. Thereafter, the control device 4 may control the processing head 12 to set the irradiation position of the processing light EL relative to the processing head 12 to a second irradiation position IP#2. The second irradiation position IP#2 is different from the first irradiation position IP#1, for example, in a direction along a plane (e.g., a plane along the XY plane) intersecting the traveling direction of the processing light EL. During the period when the irradiation position of the processing light EL relative to the processing head 12 is the second irradiation position IP#2, the measurement device 36 measures the processing light EL. The control device 4 acquires information from the position measurement device 34 regarding the position of the stage 32 (i.e., the position of the measurement device 36) when the measurement device 36 measures the processing light EL irradiated at the second irradiation position IP#2.

[0182] The measuring device 36 may measure the processing light EL irradiated to the multiple irradiation positions via multiple marks 366. For example, the measuring device 36 may measure the processing light EL irradiated to the first irradiation position IP#1 via a first mark 366 (e.g., mark 366#1 in FIG. 39). For example, the measuring device 36 may measure the processing light EL irradiated to the second irradiation position IP#2 via a second mark 366 (e.g., mark 366#2 in FIG. 39). In this case, the measuring device 36 does not need to move within a plane intersecting the traveling direction of the processing light EL (e.g., a plane along the XY plane) during the period in which the measuring device 36 measures the processing light EL irradiated to the multiple irradiation positions. However, the measuring device 36 may move within a plane intersecting the traveling direction of the processing light EL (e.g., a plane along the XY plane) during at least a part of the period in which the measuring device 36 measures the processing light EL irradiated to the multiple irradiation positions.

[0183] Alternatively, the measurement device 36 may measure the processing light EL irradiated at multiple irradiation positions via a single mark 366. For example, the control device 4 may move the stage 32 (i.e., the measurement device 36) to a first stage position so that the mark 366 is located at a first irradiation position IP#1. While the mark 366 is located at the first irradiation position IP#1, the measurement device 366 measures the processing light EL irradiated at the first irradiation position IP#1 via the mark 366. Thereafter, the control device 4 may move the stage 32 (i.e., the measurement device 36) to a second stage position different from the first stage position so that the mark 366 is located at a second irradiation position IP#2. While the mark 366 is located at the second irradiation position IP#2, the measurement device 366 measures the processing light EL irradiated at the second irradiation position IP#2 via the mark 366.

[0184] Thereafter, the control device 4 generates passing position information regarding the position where the processing light EL passes within a plane intersecting the traveling direction of the processing light EL, based on information regarding the position of the measuring device 36 when the measuring device 36 measured the processing light EL. The generated passing position information may be referenced by the control device 4 to perform the above-described processing operation. That is, the passing position information may be referenced by the control device 4 during the processing period in which the workpiece W is processed by irradiating the workpiece W with the processing light EL. For example, the control device 4 may control at least one of the irradiation position and traveling direction of the processing light EL based on the passing position information so that the processing light EL is irradiated onto a desired position on the workpiece W. In this case, the control device 4 may control at least one of the irradiation position and traveling direction of the processing light EL by controlling the galvanometer mirror 1214. Note that, since the control device 4 references the passing position information during the processing period in which the workpiece W is processed by irradiating the workpiece W with the processing light EL, the operation of generating the passing position information may be performed prior to the processing operation.

[0185] When multiple marks 366 are used to measure the processing light EL irradiated at multiple irradiation positions, the positional relationship between the multiple marks 366 and the rotation axis 3522 may have a predetermined relationship. In other words, the relative positional relationship between the multiple marks 366 and the rotation axis 3522 may be known to the control device 4. In this case, the control device 4 can identify the relationship between the rotation axis 3522 and the irradiation position of the processing light EL based on the passing position information and information regarding the relative positional relationship between the multiple marks 366 and the rotation axis 3522. As a result, the control device 4 can irradiate the processing light EL at a desired position on the workpiece W rotating around the rotation axis 3522.

[0186] As described above, when a single mark 366 is used to measure the processing light EL irradiated at multiple irradiation positions, the stage 32 moves. In this case, the movement plane of the stage 32 (i.e., the plane along which the stage 32 moves, intersecting the traveling direction of the processing light EL) and the rotation axis 3522 may have a predetermined relationship. In other words, the relative positional relationship between the movement plane of the stage 32 and the rotation axis 3522 may be known to the control device 4. In this case, the control device 4 can identify the relationship between the rotation axis 3522 and the irradiation position of the processing light EL based on the passing position information and information regarding the relative positional relationship between the movement plane of the stage 32 and the rotation axis 3522. As a result, the control device 4 can irradiate the processing light EL at a desired position on the workpiece W rotating around the rotation axis 3522.

[0187] (2-4) Origin information generation operation Next, an origin information operation for generating origin information regarding the processing origin PO of the processing apparatus 1 and the measurement origin MO of the measuring apparatus 2 using the measuring device 36 will be described. The origin information may include information regarding the distance between the processing origin PO and the measurement origin MO. The origin information may include information regarding the distance between the equipment origin AO of the processing system SYS (e.g., the origin of a stage coordinate system used to control the position of the stage 32) and the processing origin PO. The origin information may include information regarding the distance between the equipment origin AO and the measurement origin MO. The processing origin PO corresponds to the position of the stage 32 when the center of the processing shot area PSA coincides with the reference position (e.g., the center) of the stage 32 and the focusing position of the processing light EL coincides with the surface of the stage 32. The measurement origin MO corresponds to the position of the stage 32 when the center of the measurement shot area MSA coincides with the reference position (e.g., the center) of the stage 32 and the focusing position of the measurement light ML coincides with the surface of the stage 32.

[0188] In the following description, the distance between the machining origin PO and the measurement origin MO will be referred to as the "relative baseline BLrlt," the distance between the apparatus origin AO and the machining origin PO will be referred to as the "machining baseline BLprc," and the distance between the apparatus origin AO and the measurement origin MO will be referred to as the "measurement baseline BLmsr." Examples of the relative baseline BLrlt, machining baseline BLprc, and measurement baseline BLmsr are shown in FIGS. 40(a) and 40(b). As shown in FIGS. 40(a) and 40(b), the relative baseline BLrlt may include at least one of a component ΔXrlt corresponding to the distance between the machining origin PO and the measurement origin PO in the X-axis direction, a component ΔYrlt corresponding to the distance between the machining origin PO and the measurement origin PO in the Y-axis direction, and a component ΔZrlt corresponding to the distance between the machining origin PO and the measurement origin PO in the Z-axis direction. The machining baseline BLprc may include at least one of a component ΔXprc corresponding to the distance between the device origin AO and the machining origin PO in the X-axis direction, a component ΔYprc corresponding to the distance between the device origin AO and the machining origin PO in the Y-axis direction, and a component ΔZprc corresponding to the distance between the device origin AO and the machining origin PO in the Z-axis direction. The measurement baseline BLmsr may include at least one of a component ΔXmsr corresponding to the distance between the device origin AO and the measurement origin MO in the X-axis direction, a component ΔYmsr corresponding to the distance between the device origin AO and the measurement origin MO in the Y-axis direction, and a component ΔZmsr corresponding to the distance between the device origin AO and the measurement origin MO in the Z-axis direction.

[0189] To generate the origin information, the control device 4 may set the device origin AO. However, if the origin information does not include information regarding the device origin AO, the control device 4 does not have to set the device origin AO. To set the device origin AO, the control device 4 controls the measurement head 21 to measure a reference mark formed on the rotation device 35 (or another member such as the stage 32) to define the device origin AO. In this embodiment, the device origin AO is set at a position having a predetermined positional relationship with the reference mark. In this case, the control device 4 acquires, from the position measurement device 34, information regarding the position of the stage 32 when the measurement head 21 measures the reference mark. Thereafter, the control device 4 may set the device origin AO to a position having a predetermined positional relationship with the acquired position of the stage 32.

[0190] Thereafter, the control device 4 calculates the positions of the processing origin PO and the measurement origin MO.

[0191] To calculate the position of the measurement origin MO, the control device 4 acquires the measurement result of the mark 366 by the measurement head 21. Specifically, the control device 4 controls the stage drive system 33 to move the stage 32 along each of the X-axis and Y-axis directions (i.e., move the measurement device 36) so that the reference of the measurement device 36 (e.g., the mark 366) is positioned at the center of the measurement shot area MSA. Furthermore, the control device 4 moves the stage 32 along the Z-axis direction so that the focusing position of the measurement light ML coincides with the surface of the rotation device 35 (specifically, the surface of the measurement device 36 arranged on the rotation device 35). At this time, the control device 4 may or may not move the measurement head 21 by controlling the head drive system 22. Thereafter, the measurement head 21 measures the mark 366. Furthermore, the control device 4 acquires from the position measurement device 34 the position of the stage 32 (i.e., the position of the measurement device 36) at the time when the measurement head 21 measured the mark 366. The position of the stage 32 acquired here corresponds to the position of the measurement origin MO. Therefore, the control device 4 can calculate the distance between the position of the stage 32 at the time when the measurement head 21 measures the mark 366 and the apparatus origin AO, and calculate the measurement baseline BLmsr based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time when the measurement head 21 measures the mark 366 and the processing origin PO, the position of which is calculated using a method described below, and calculate the relative baseline BLrlt based on the calculated distance.

[0192] After at least one of the relative baseline BLrlt and the measurement baseline BLmsr has been calculated, the control device 4 may move at least one of the stage 32 and the measurement head 21 based on at least one of the relative baseline BLrlt and the measurement baseline BLmsr while the measurement head 21 is measuring the workpiece W, etc. In other words, the control device 4 may control the position of at least one of the stage 32 and the measurement head 21 based on at least one of the relative baseline BLrlt and the measurement baseline BLmsr while the measurement head 21 is measuring the workpiece W, etc. As a result, the measurement shot area MSA can be set to an appropriate position in the stage coordinate system based on the apparatus origin AO. In other words, the machining system SYSa can appropriately machine the workpiece W based on the appropriate measurement results of the workpiece W by the measurement device 2.

[0193] Next, to calculate the position of the processing origin PO, the control device 4 acquires the measurement results (i.e., processing light measurement information) of the processing light EL by the measurement device 36 via the passing area 365 that constitutes the mark 366. Specifically, the control device 4 controls the stage drive system 33 to move the stage 32 along each of the X-axis and Y-axis directions (i.e., move the measurement device 36) so that the reference of the measurement device 36 (e.g., the mark 366) is positioned at the center of the processing shot area PSA. Furthermore, the control device 4 moves the stage 32 along the Z-axis direction so that the focusing position of the processing light EL coincides with the surface of the rotation device 35 (specifically, the surface of the measurement device 36 disposed on the rotation device 35). At this time, the control device 4 may or may not move the processing head 12 by controlling the head drive system 13. Thereafter, the processing head 12 irradiates the processing light EL onto the mark 366. As a result, the light receiving element 362 receives the processing light EL that has passed through the passing area 365 that constitutes the mark 366. The control device 4 acquires from the position measurement device 34 the position of the stage 32 (i.e., the position of the measurement device 36) at the time when the light receiving element 362 receives the processing light EL. The acquired position of the stage 32 corresponds to the position of the processing origin PO. Therefore, the control device 4 can calculate the distance between the position of the stage 32 at the time when the light receiving element 362 receives the processing light EL via the mark 366 and the device origin AO, and calculate the processing baseline BLprc based on the calculated distance. The control device 4 can calculate the distance between the position of the stage 32 at the time when the light receiving element 362 receives the processing light EL via the mark 366 and the measurement origin MO, the position of which is calculated using the method described above, and calculate the relative baseline BLrlt based on the calculated distance.

[0194] After at least one of the relative baseline BLrlt and the processing baseline BLprc is calculated, the control device 4 may move at least one of the stage 32 and the processing head 12 based on at least one of the relative baseline BLrlt and the processing baseline BLprc while the processing head 12 processes the workpiece W, etc. In other words, the control device 4 may control the position of at least one of the stage 32 and the processing head 12 based on at least one of the relative baseline BLrlt and the processing baseline BLprc while the processing head 12 processes the workpiece W, etc. As a result, the processing shot area PSA can be set to an appropriate position in the stage coordinate system based on the device origin AO. In other words, the processing system SYSa can properly process the workpiece W.

[0195] (3) Technical effects of the processing system SYS The processing system SYS described above can use the processing light EL to appropriately process the workpiece W. Furthermore, the processing system SYS can appropriately measure the workpiece W using the measurement light ML.

[0196] In particular, the machining system SYS can generate the above-mentioned rotation axis information using the measurement light ML and machine the workpiece W based on the rotation axis information. Therefore, the machining system SYS can appropriately machine the workpiece W that is held so as to rotate, compared to when the workpiece W is machined without using the rotation axis information.

[0197] Furthermore, the processing system SYS can generate the above-mentioned light state information using the measurement device 36 and process the workpiece W based on the light state information. Therefore, the processing system SYS can appropriately process the workpiece W using the processing light EL compared to when processing the workpiece W without using the light state information.

[0198] Furthermore, the processing system SYS can generate the above-mentioned origin information using the measuring device 36 and process the workpiece W based on the origin information. Therefore, the processing system SYS can properly process the workpiece W using the processing light EL compared to when processing the workpiece W without using the origin information.

[0199] (4) Variations Next, a modified example of the machining system SYS will be described.

[0200] (4-1) First Modification First, a machining system SYS of a first modified example (hereinafter, the machining system SYS of the first modified example will be referred to as a "machining system SYSa") will be described with reference to Fig. 41. Fig. 41 is a perspective view schematically showing the appearance of the machining system SYSa of the first modified example.

[0201] As shown in Fig. 41, the processing system SYSa of the first modified example differs from the above-described processing system SYS in that the measurement axis MX of the measurement head 21 intersects with the irradiation axis EX along the traveling direction of the processing light EL. In the example shown in Fig. 41, the irradiation axis EX is parallel to the Z axis, but the irradiation axis EX may be inclined with respect to the Z axis. In the example shown in Fig. 41, the measurement axis MX is inclined with respect to the Z axis, but the measurement axis EX may be parallel to the Z axis. Other features of the processing system SYSa may be the same as those of the processing system SYS.

[0202] (4-2) Second Modification Next, a processing system SYS of a second modified example (hereinafter, the processing system SYS of the second modified example will be referred to as a "processing system SYSb") will be described with reference to Fig. 42. Fig. 42 is a perspective view schematically showing the appearance of the processing system SYSb of the second modified example.

[0203] As shown in FIG. 42, the processing system SYSb of the second modified example differs from the above-described processing system SYS in that the measurement axis MX of the measurement head 21 coincides with the irradiation axis EX along the traveling direction of the processing light EL. In this case, as shown in FIG. 43, which is a system configuration diagram showing the system configuration of the processing system SYSb of the second modified example, the processing system SYSb differs from the processing system SYS in that it includes a processing device 1b instead of the processing device 1. Furthermore, the processing system SYSb differs from the processing system SYS in that it does not need to include the measuring device 2. Other features of the processing system SYSb may be the same as those of the processing system SYS. The processing device 1b differs from the processing device 1 in that it includes a processing head 12b instead of the processing head 12. Other features of the processing device 1b may be the same as those of the processing device 1. The processing head 12b differs from the processing head 12 in that it includes an irradiation optical system 121b instead of the irradiation optical system 121. Furthermore, the processing head 12b differs from the processing head 12 in that it includes a three-dimensional measuring device 211. Other features of the processing head 12b may be the same as those of the processing head 12.

[0204] The structure of the irradiation optical system 121b is shown in FIG. 44. As shown in FIG. 44, compared to the irradiation optical system 121, the irradiation optical system 121b includes a combining optical system 1216b. Other features of the irradiation optical system 121b may be the same as those of the irradiation optical system 121. The combining optical system 1216c combines the processing light EL that has passed through the focusing position changing optical system 1210, the aperture angle changing optical system 1211, the ellipticity changing optical system 1212, and the optical rotation optical system 1213 with the measurement light ML from the three-dimensional measuring device 211. For example, to combine the processing light EL and the measurement light ML, the combining optical system 1216b may include a polarizing beam splitter. Either the processing light EL or the measurement light ML that enters the polarizing beam splitter may be reflected by the polarization splitting surface of the polarizing beam splitter. The other of the processing light EL and the measurement light ML that enters the polarizing beam splitter may pass through the polarization splitting surface of the polarizing beam splitter. As a result, the polarizing beam splitter outputs the processing light EL and measurement light ML, which are incident on the polarizing beam splitter from different directions, in the same direction (specifically, toward the galvanometer mirror 1214). Therefore, the illumination axis EX of the processing light EL and the measurement axis MX of the measurement light ML coincide. Here, the illumination axis EX of the processing light EL and the measurement axis MX of the measurement light ML do not have to coincide (that is, they may be parallel to each other but slightly shifted laterally). Furthermore, the processing light EL and the measurement light ML may be combined and separated using a dichroic mirror instead of a polarizing beam splitter. In this case, the wavelengths of the processing light EL and the measurement light ML may be different from each other.

[0205] The machining system SYSb may include a measuring device 2.

[0206] (4-3) Third Modification Next, a processing system SYS of a third modified example (hereinafter, the processing system SYS of the third modified example will be referred to as a "processing system SYSc") will be described with reference to Fig. 45. Fig. 45 is a perspective view schematically showing the appearance of the processing system SYSc of the third modified example.

[0207] 45, the machining system SYSc of the third modified example differs from the above-described machining system SYS in which the rotary shaft 3521 extends in a direction intersecting the direction of gravity in that the rotary shaft 3521 extends in the direction of gravity. The machining system SYSc differs from the above-described machining system SYS in which the rotary shaft 3522 extends in a direction intersecting the direction of gravity in that the rotary shaft 3522 extends in the direction of gravity. Other features of the machining system SYSa may be the same as those of the machining system SYS.

[0208] (4-4) Other Modifications In the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with the processing light EL. However, the processing system SYS may also process the workpiece W by irradiating the workpiece W with an arbitrary energy beam. In this case, the processing system SYS may be provided with a beam source capable of irradiating the arbitrary energy beam in addition to or instead of the processing light source 11. Examples of the arbitrary energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0209] The requirements of the above-described embodiments may be combined as appropriate. Some of the requirements of the above-described embodiments may not be used. The requirements of the above-described embodiments may be replaced with requirements of other embodiments as appropriate. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in the above-described embodiments are incorporated herein by reference.

[0210] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and processing systems involving such modifications are also included in the technical idea of ​​the present invention. [Explanation of symbols]

[0211] 1 Processing equipment 11 Processing head 2. Measuring equipment 3 Stage equipment 32 stages 35 Rotating Device 3521 Rotating shaft 3522 Rotating shaft 36 Measuring equipment 361 Beam passing member 362 Photodetector 363 Aperture 364 Attenuation Region 365 Passage area 366 marks EL processing light ML measurement light double work SYS Machining System

Claims

1. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on information about the object measured by the object measuring device and information about the rotation axis of the rotation device; Equipped with The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

2. The control device controls at least one of the beam irradiation device and the rotation device based on a deviation between the rotation axis and the object. The processing system of claim 1 .

3. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a deviation between the object measured by the object measuring device and the rotation axis of the rotation device; Equipped with The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

4. The control device controls at least one of the beam irradiation device and the rotation device based on the angular relationship between the rotation axis and the central axis of the object. The processing system according to any one of claims 1 to 3.

5. The control device controls at least one of the beam irradiation device and the rotation device based on a positional relationship between the rotation axis and a central axis of the object. The processing system according to any one of claims 1 to 4.

6. The control device controls the irradiation position of the energy beam by the beam irradiation device based on the deviation between the rotation axis and the object. The processing system according to any one of claims 1 to 5.

7. The control device changes the irradiation position of the energy beam emitted by the beam irradiation device in a direction intersecting with the rotation axis based on the deviation between the rotation axis and the object. The processing system according to claim 6 .

8. The beam irradiation device includes a beam irradiation position changing device that changes the irradiation position of the energy beam with respect to the beam irradiation device. The processing system according to claim 6 or 7.

9. The beam irradiation device irradiates the energy beam at an irradiation position on the surface of the object in a direction intersecting a normal to the surface at the irradiation position. The processing system according to any one of claims 1 to 8.

10. The angle between the irradiation axis along the traveling direction of the energy beam irradiated at the irradiation position and the normal line is 60 degrees or more. The processing system according to claim 9.

11. The irradiation position of the energy beam is changeable in a direction intersecting the rotation axis. The processing system according to claim 9 or 10.

12. The irradiation position of the energy beam in a first period in which the beam irradiation device irradiates the object with the energy beam is closer to the rotation axis in a second period after the first period. The processing system according to any one of claims 1 to 11.

13. a beam damper that is provided on the opposite side of the beam irradiation device with respect to the irradiation position and that is irradiated with the energy beam; The processing system according to any one of claims 1 to 12.

14. the beam dumper has an irradiation surface onto which the energy beam is irradiated, The irradiation surface is inclined with respect to the irradiation axis along the traveling direction of the energy beam. The processing system of claim 13.

15. The angle between the irradiation surface and the irradiation axis is an acute angle. The processing system of claim 14.

16. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on information about the object measured by the object measurement device and information about at least one of the position and attitude of the rotation device; Equipped with The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

17. The object measuring device obtains information on at least one of the position and the orientation of the rotation device. The processing system of claim 16.

18. The beam irradiation device further includes a beam measurement device that is provided on the rotation device and that measures the energy beam from the beam irradiation device.

18. The processing system of claim 17.

19. The object measuring device measures at least one of the position and the orientation of the beam measuring device.

20. The processing system of claim 18.

20. The beam irradiation device further includes a beam measurement device for measuring the energy beam from the beam irradiation device.

20. The processing system of any one of claims 1 to 19.

21. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; a beam measurement device that measures the energy beam from the beam irradiation device; a control device that controls the beam irradiation device based on information about the energy beam measured by the beam measurement device; Equipped with The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

22. The beam measurement device measures the intensity distribution in an angular direction with respect to an irradiation axis along the direction in which the energy beam travels.

22. The processing system according to claim 20 or 21.

23. The control device controls the irradiation position of the energy beam based on the measurement result of the beam measurement device.

23. The processing system of claim 22.

24. The control device controls the direction in which the energy beam travels based on the measurement result of the beam measurement device.

24. The processing system according to claim 22 or 23.

25. The beam irradiation device includes a beam irradiation state changing device that changes at least one of the irradiation position of the energy beam relative to the beam irradiation device and the traveling direction of the energy beam from the beam irradiation device.

25. The processing system according to claim 23 or 24.

26. the beam irradiation device includes an aperture angle changing device for changing an aperture angle of the energy beam, The control device controls the aperture angle based on the measurement result of the beam measurement device.

26. The processing system of any one of claims 22 to 25.

27. When the beam irradiation device is a first beam angle changing device, the beam irradiation device includes a second beam angle changing device that changes at least one of a first beam angle of the energy beam on a first plane including an irradiation axis along a traveling direction of the energy beam and a second beam angle of the energy beam on a second plane including the irradiation axis and intersecting the first plane, The control device controls at least one of the first and second aperture angles based on the measurement result of the beam measurement device.

24. The processing system of claim 23.

28. The beam irradiation device includes a focusing optical system that focuses the energy beam, and a beam rotation member that changes the direction in which the diameter of the beam cross section at the entrance pupil of the focusing optical system takes the maximum value around the optical axis of the focusing optical system.

28. The processing system of any one of claims 20 to 27.

29. The beam measurement device measures the energy beam at a first position in the direction in which the energy beam travels, and measures the energy beam at a second position in the direction in which the energy beam travels that is different from the first position.

29. The processing system of any one of claims 20 to 28.

30. the beam measurement device measures the energy beam at a first position in a direction in which the energy beam travels; The first position in the traveling direction is different from a focusing position where the energy beam is focused.

30. The processing system of any one of claims 20 to 29.

31. The beam measurement device measures the direction in which the energy beam travels.

31. The processing system of any one of claims 20 to 30.

32. the beam measurement device measures the energy beam at a first position in a direction in which the energy beam travels, and measures the energy beam at a second position in the direction in which the energy beam travels that is different from the first position; measuring a direction in which the energy beam travels based on the first and second positions in a direction intersecting the direction in which the energy beam travels; 32. The processing system of claim 31.

33. The irradiation position of the energy beam is controlled based on the traveling direction of the energy beam measured by the beam measurement device.

33. The processing system according to claim 31 or 32.

34. The traveling direction of the energy beam is controlled based on the traveling direction of the energy beam measured by the beam measurement device.

34. The processing system of any one of claims 31 to 33.

35. The beam measurement device measures a position where the energy beam passes within a plane intersecting the direction in which the energy beam travels.

35. The processing system of any one of claims 20 to 34.

36. The beam measurement device measures the energy beam when the irradiation position of the energy beam with respect to the beam irradiation device is set to a first position, and measures the energy beam when the irradiation position of the energy beam with respect to the beam irradiation device is set to a second position different from the first position.

36. The processing system of any one of claims 20 to 35.

37. the beam measurement device includes a first beam passing portion provided in an attenuation region that attenuates the energy beam, and a second beam passing portion provided in the attenuation region and different from the first beam passing portion, The positional relationship between the first and second beam passing portions and the rotation axis is in a predetermined relationship.

37. The processing system of claim 36.

38. when the irradiation position of the energy beam is set to the first position, the beam measurement device receives the energy beam that has passed through the first beam passing portion; When the irradiation position of the energy beam is set to the second position, the beam measurement device receives the energy beam that has passed through the second beam passing portion.

38. The processing system of claim 37.

39. The rotation device is mounted on a moving stage that is movable along a plane that intersects with the direction of travel of the energy beam.

38. The processing system according to claim 36 or 37.

40. the beam measurement device includes a beam passing portion provided in an attenuation region that attenuates the energy beam; The rotation axis of the rotating device and the intersecting plane along which the moving stage moves have a predetermined relationship.

37. The processing system of claim 36.

41. when the moving stage is positioned at a first stage position, the beam measurement device receives the energy beam that has passed through the beam passing portion; When the moving stage is positioned at a second stage position different from the first stage position, the beam measurement device receives the energy beam that has passed through the beam passing portion.

41. The processing system of claim 40.

42. the beam measurement device includes a beam passing portion provided in an attenuation region that attenuates the energy beam; The positional relationship between the beam passing portion and the rotation device is a predetermined relationship.

42. The processing system of any one of claims 20 to 41.

43. The irradiation axis along the direction in which the energy beam from the beam irradiation device travels does not coincide with the measurement axis of the object measuring device.

43. The processing system of any one of claims 1 to 42.

44. The irradiation axis and the measurement axis are parallel to each other.

44. The processing system of claim 43.

45. The irradiation axis and the measurement axis intersect 44. The processing system of claim 43.

46. An irradiation axis along the direction in which the energy beam from the beam irradiation device travels coincides with a measurement axis of the object measuring device.

43. The processing system of any one of claims 1 to 42.

47. The object measuring device measures the surface of the object in three dimensions.

47. The processing system of any one of claims 1 to 46.

48. the control device controls the rotation device to rotate the object after the object is measured by the object measuring device; The object measuring device measures the object rotated by the rotation device.

48. The processing system of any one of claims 1 to 47.

49. The measurement range on the object rotated by the rotation device partially overlaps with the measurement range on the object before being rotated by the rotation device.

49. The processing system of claim 48.

50. The object measuring device measures the object being rotated by the rotation device.

48. The processing system of any one of claims 1 to 47.

51. a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; Furthermore, The control device moving at least one of the beam irradiation device and the beam measurement device so that the beam measurement device can measure the energy beam from the beam irradiation device; At least one of the beam irradiation device and the beam measurement device is moved so that at least a part of the beam measurement device can be measured by the object measurement device.

51. The processing system of any one of claims 1 to 50.

52. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; a control device that controls at least the moving device; Equipped with The control device moving at least one of the beam irradiation device and the beam measurement device so that the beam measurement device is at a position where it can measure the energy beam from the beam irradiation device; At least one of the beam irradiation device and the beam measurement device is moved to a position where the object measurement device can measure at least a part of the beam measurement device. Processing system.

53. The control device controls the moving device based on first information regarding a position of at least one of the beam irradiation device and the beam measurement device when the beam measurement device measures the energy beam from the beam irradiation device, and second information regarding a position of at least one of the beam irradiation device and the beam measurement device when the object measurement device measures at least a part of the beam measurement device. The processing system according to claim 51 or 52.

54. a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the position of the beam irradiation device and the position of the beam measurement device; an acquisition device that acquires information regarding at least one of the position of the beam irradiation device and the position of the beam measurement device; Furthermore, The control device moving at least one of the beam irradiation device and the beam measurement device to an irradiation position where the beam irradiation device can irradiate at least a part of the beam measurement device with the energy beam; acquiring irradiation position information relating to at least one of the position of the beam irradiation device that has moved to the irradiation position and the position of the beam measurement device using the acquisition device; At least one of the position of the beam irradiation device and the position of the beam measurement device is controlled based on the irradiation position information.

54. The processing system of any one of claims 1 to 53.

55. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information regarding at least one of the position of the beam irradiation device and the position of the beam measurement device; a control device that controls at least the moving device; Equipped with The control device moving at least one of the beam irradiation device and the beam measurement device to an irradiation position where the beam irradiation device can irradiate at least a part of the beam measurement device with the energy beam; acquiring irradiation position information relating to at least one of the position of the beam irradiation device that has moved to the irradiation possible position and the position of the beam measurement device using the acquisition device; At least one of the position of the beam irradiation device and the position of the beam measurement device is controlled based on the irradiation position information. Processing system.

56. a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information regarding at least one of the position of the beam irradiation device and the position of the beam measurement device; Furthermore, The control device moving at least one of the beam irradiation device and the beam measurement device to a measurement position where the object measurement device can measure at least a part of the beam measurement device; acquiring, using the acquisition device, measurement position information relating to at least one of the position of the beam irradiation device that has moved to the measurement position and the position of the beam measurement device; At least one of the position of the beam irradiation device and the position of the beam measurement device is controlled based on the measurement position information.

56. The processing system of any one of claims 1 to 55.

57. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a beam measurement device that measures the energy beam from the beam irradiation device; a moving device that moves at least one of the beam irradiation device and the beam measurement device; an acquisition device that acquires information regarding at least one of the position of the beam irradiation device and the position of the beam measurement device; a control device that controls at least the moving device; Equipped with The control device moving at least one of the beam irradiation device and the beam measurement device to a measurement position where the object measurement device can measure at least a part of the beam measurement device; acquiring, using the acquisition device, measurement position information relating to at least one of the position of the beam irradiation device that has moved to the measurement position and the position of the beam measurement device; At least one of the position of the beam irradiation device and the position of the beam measurement device is controlled based on the measurement position information. Processing system.

58. the beam irradiation device irradiates the object measured by the object measuring device with the energy beam; The object measuring device measures the object after the energy beam is irradiated.

58. The processing system of any one of claims 1 to 57.

59. The beam irradiation device irradiates the object being rotated by the rotation device with the energy beam.

59. The processing system of any one of claims 1 to 58.

60. the rotation device rotates the object irradiated with the energy beam by the beam irradiation device; The beam irradiation device irradiates the object rotated by the rotation device with the energy beam.

59. The processing system of any one of claims 1 to 58.

61. The beam irradiation device irradiates the energy beam from a direction intersecting the rotation axis of the rotation device.

61. The processing system of any one of claims 1 to 60.

62. The beam irradiation device irradiates the energy beam from a twisted direction with respect to the rotation axis of the rotation device.

61. The processing system of any one of claims 1 to 60.

63. The irradiation position at which the energy beam from the beam irradiation device is irradiated on the object is variable along a direction parallel to the rotation axis.

63. The processing system of claim 61 or 62.

64. the holding device includes a holding surface that comes into contact with the object when the object is held; The beam irradiation device irradiates the energy beam onto a surface of the object that intersects with a plane parallel to the holding surface.

64. The processing system of any one of claims 1 to 63.

65. The beam irradiation device irradiates the energy beam onto a surface of the object that intersects with the rotation axis of the rotation device.

65. The processing system of any one of claims 1 to 64.

66. The apparatus further includes a moving device that moves at least one of the beam irradiation device and the rotation device.

66. The processing system of any one of claims 1 to 65.

67. The beam irradiation device includes a beam irradiation position changing device that changes the irradiation position of the energy beam with respect to the beam irradiation device.

65. The processing system of any one of claims 1 to 64.

68. The rotation axis of the rotation device extends in a direction intersecting the direction of gravity.

68. The processing system of any one of claims 1 to 67.

69. The rotation axis of the rotation device extends in the direction of gravity.

68. The processing system of any one of claims 1 to 67.

70. While the holding device is rotated by the rotating device, laser lathing is performed on the surface of the object using a laser beam as the energy beam.

70. The processing system of any one of claims 1 to 69.

71. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures a three-dimensional shape of a surface of the object; a control device that controls at least one of the beam irradiation device and the rotation device based on the measurement results of the object measuring device; Equipped with The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

72. While the holding device is rotated by the rotating device, laser lathe processing is performed on the surface of the object using a laser beam as the energy beam.

72. The processing system of claim 71.

73. The control device controls at least one of the beam irradiation device and the rotation device based on a deviation between the object and the rotation axis of the rotation device, which is obtained from a measurement result of the object measurement device.

73. The processing system of claim 71 or 72.

74. The surface of the object can be processed with the energy beam while the object and the energy beam are moving relative to each other while the rotation of the rotating device is stopped.

72. The processing system of claim 71.

75. The relative movement is performed parallel to the rotation axis of the rotation device.

75. The processing system of claim 74.

76. a holding device for holding an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls the beam irradiation device based on a measurement result of the object by the object measurement device; Equipped with the beam irradiation device changes an irradiation position of the energy beam on the surface of the object along the surface of the object during a period in which the beam irradiation device irradiates the object with the energy beam; The control device controls the beam irradiation device based on a measurement result of the object including a processing mark caused by the energy beam. Processing system.

77. the beam irradiation device changes the irradiation position on the surface of the first object during a first period in which the beam irradiation device irradiates the first object with the energy beam to process the first object; The control device controls the beam irradiation device based on a measurement result of the first object including a processing mark caused by the energy beam during a second period in which the beam irradiation device irradiates the second object with the energy beam to process the second object.

77. The processing system of claim 76.

78. The control device generates direction information regarding a relationship between a direction in which the processing trace extends and a direction in which the rotation axis of the rotation device extends based on the measurement result of the first object, and controls the beam irradiation device based on the direction information during the second period.

78. The processing system of claim 77.

79. The control device controls the beam irradiation device so that the irradiation position of the energy beam on the surface of the second object moves along the direction in which the rotation axis extends during the second period.

79. The processing system of claim 77 or 78.

80. the beam irradiation device changes the irradiation position using a beam deflection device capable of deflecting the energy beam; The control device controls the beam deflection device so that, during the second period, the irradiation position of the energy beam on the surface of the second object moves along the direction in which the rotation axis extends.

80. The processing system of any one of claims 77 to 79.

81. Further, a moving device that moves the rotation device is provided, During the first period, the beam irradiation device processes a first region of the first object, and after the first region is processed, the movement device moves the rotation device, and after the rotation device moves, the beam irradiation device processes a second region of the first object; The control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the first object including processing marks of the first and second regions by the energy beam during the second period.

81. The processing system of any one of claims 77 to 80.

82. The control device generates positional relationship information regarding a relative positional relationship between the processing trace in the first region and the processing trace in the second region based on the measurement result of the first object, and controls at least one of the beam irradiation device and the moving device based on the positional relationship information during the second period.

82. The processing system of claim 81.

83. The positional relationship information includes information about a direction along a line connecting the processing mark in the first region and the processing mark in the second region.

83. The processing system of claim 81 or 82.

84. The control device controls at least one of the beam irradiation device and the movement device so that the irradiation position of the energy beam on the surface of the second object moves along the direction in which the rotation axis extends during the second period.

84. The processing system of claim 83.

85. a holding device for holding an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device; a moving device that moves the rotating device; Equipped with the object measuring device measures the object each time the moving device moves the rotating device along one direction; The control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the object by the object measuring device during an irradiation period in which the beam irradiation device irradiates the object with the energy beam. Processing system.

86. The control device generates direction information regarding a relationship between the one direction and a direction in which a rotation axis of the rotation device extends, based on the measurement result of the object, and controls at least one of the beam irradiation device and the moving device based on the direction information during the irradiation period.

86. The processing system of claim 85.

87. The control device controls at least one of the beam irradiation device and the movement device so that the irradiation position of the energy beam on the surface of the object moves along the direction in which the rotation axis extends during the irradiation period.

87. The processing system of claim 85 or 86.

88. the object measuring device measures the first object as the object each time the moving device moves the rotating device along the one direction while the holding device is holding the first object as the object; The control device controls at least one of the beam irradiation device and the moving device based on a measurement result of the first object by the object measuring device during the irradiation period in which the beam irradiation device irradiates the second object as the object with the energy beam.

88. The processing system of any one of claims 85 to 87.

89. The control device generates direction information regarding a relationship between the one direction and a direction in which a rotation axis of the rotation device extends, based on a measurement result of the first object, and controls at least one of the beam irradiation device and the moving device based on the direction information during the irradiation period.

89. The processing system of claim 88.

90. The control device controls at least one of the beam irradiation device and the movement device so that the irradiation position of the energy beam on the surface of the second object moves along the direction in which the rotation axis extends during the irradiation period.

90. The processing system of claim 88 or 89.

91. a holding device for holding an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device; Equipped with the object measuring device measures the object each time the rotation device rotates the object by a predetermined rotation angle; The control device controls the beam irradiation device based on the measurement result of the object by the object measurement device. Processing system.

92. the object measuring device measures an end portion of the object located at an end in a first intersecting direction intersecting a rotation axis of the rotation device each time the rotation device rotates the object by the predetermined rotation angle; The control device generates position information regarding the position of the end portion based on the measurement result of the object, and controls the beam irradiation device based on the position information.

92. The processing system of claim 91.

93. The object measuring device performs an operation of measuring the end portion at a first position on the object and a second position on the object that is different from the first position in a direction along the rotation axis each time the rotation device rotates the object by the predetermined rotation angle.

93. The processing system of claim 91 or 92.

94. The position information includes information regarding a relationship between a position of the end portion in the first intersecting direction and a rotation angle of the object around the rotation axis.

94. The processing system of claim 92 or 93.

95. The position information includes information regarding the phase of a change amount of the position of the end portion in the first intersecting direction with respect to the rotation angle.

95. The processing system of any one of claims 92 to 94.

96. The control device controls the beam irradiation device to change the irradiation position of the energy beam along a second intersecting direction intersecting the rotation axis.

96. The processing system of any one of claims 92 to 95.

97. a holding device for holding an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a control device that controls at least one of the beam irradiation device and the rotation device based on a measurement result of the object by the object measurement device; a beam measurement device provided on the rotation device and configured to measure the energy beam from the beam irradiation device; A processing system comprising:

98. The beam measurement device includes a beam passing member having an attenuation region for attenuating the energy beam and a passing region for passing the energy beam, and a detection unit for detecting the energy beam that has passed through the passing region.

98. The processing system of claim 97.

99. Further, a moving device that moves the rotation device is provided, The control device controls the position of the rotation device based on information about the position of the rotation device when the beam measurement device detects the energy beam and information about the position of the rotation device when the object measurement device measures at least a part of the beam measurement device.

99. The processing system of claim 97 or 98.

100. a holding device that rotatably holds an object; a rotation device that rotates the holding device; a beam irradiation device that irradiates the object held by the holding device with an energy beam; an object measuring device that measures the object; a changing device for changing the irradiation position of the energy beam irradiated on the object; a control device that controls at least one of the rotation device and the change device; Equipped with the control device controls the rotation device and the change device to rotate the holding device and change the irradiation position based on information about the object measured by the object measuring device; The object is processed by irradiating the object held by the holding device with an energy beam from the beam irradiation device. Processing system.

101. The beam irradiation device has the changing device 101. The processing system of claim 100.

102. The change device changes the irradiation position with respect to the beam irradiation device.

102. The processing system of claim 101.

103. The holding device is rotated and the irradiation position is moved while the object is being processed by the processing device.

103. The processing system of any one of claims 100 to 102.

104. the rotating device rotates the holding device around a rotation axis; The object is machined while the irradiation position is moved by the changing device in a direction parallel to the rotation axis and in a direction intersecting the rotation axis.

104. The processing system of any one of claims 100 to 103.

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