Substrate machining device

Abstract

To efficiently collect cutting dust generated by cutting machining by a simple method.SOLUTION: A substrate machining device comprises: a stage (5) on which a substrate (10) is placed; a router (3) which performs cutting machining on the substrate; a router movement mechanism (410) which moves the router in a first direction and a second direction orthogonal to each other; a stage movement mechanism (220) which moves the stage between a first position where cutting machining of the substrate is performed and a second position different from the first position; and a nozzle (6) which has a hollow region (690) surrounded by side surface portions, and in which the side surface portions are formed with a first long hole (601) through which a router bit of the router can be inserted into the hollow region and a second long hole (611) through which portions (1031, 1032) being the target of machining by the router of the substrate placed on the stage are introduced into the hollow region; and a nozzle drive mechanism (7) which drives the nozzle such that cutting dust staying in the hollow region of the nozzle falls from the nozzle by its own weight.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Some board processing devices for processing printed circuit boards remove unnecessary portions of a workpiece (printed circuit board before processing) by cutting. In this type of board processing device, dust generated when cutting the workpiece is sucked and collected by a dust collector (for example, Patent Documents 1 to 4). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-67971 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-52097 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-135128 [Patent Document 4] Japanese Patent Application Laid-Open No. 2012-156354 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned substrate processing apparatus, some of the generated dust is not collected by the dust collector and remains around the apparatus. Therefore, in order to remove the dust that has accumulated around the apparatus, workers or the like must periodically clean up the area.

[0005] One object of the present invention is to efficiently collect cutting dust generated during cutting processing by a substrate processing device in a simple manner. [Means for solving the problem]

[0006] a stage moving mechanism for moving the stage between a first position where the router cuts the substrate and a second position where the substrate is placed, the second position being different from the first position; a nozzle having a hollow area surrounded by a side portion, the side portion having a first slot through which a router bit of the router can be inserted into the hollow area, and a second slot through which a portion of the substrate placed on the stage to be processed by the router can enter the hollow area when the stage is moved from the second position to the first position; a nozzle driving mechanism for driving the nozzle so that cutting dust remaining in the hollow area of ​​the nozzle falls from the nozzle under its own weight; and a base above which the stage, the router, and the nozzle are disposed, the base having a through hole formed therein for collecting cutting dust that has fallen from the nozzle. [Effects of the Invention]

[0007] According to the above-described aspect, cutting dust generated during cutting processing by the substrate processing device can be efficiently collected in a simple manner. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a plan view illustrating an example of the configuration of a nozzle. [Figure 3] FIG. 2 is a cross-sectional view illustrating an example of the configuration of a nozzle. [Figure 4] FIG. 2 is a vertical cross-sectional view illustrating an example of the configuration of a nozzle. [Figure 5] 1 is a block diagram illustrating an example of a functional configuration of a substrate processing apparatus according to an embodiment. [Figure 6] FIG. 4 is a flowchart illustrating a cutting process procedure performed by the substrate processing apparatus according to the embodiment. [Figure 7]FIG. 10 is a vertical cross-sectional view illustrating a first modified example of the nozzle configuration. [Figure 8] 8A and 8B are side views illustrating a second modified example of the nozzle configuration. [Figure 9] FIG. 10 is a side view illustrating a third modified example of the nozzle configuration. [Figure 10] FIG. 10 is a side view illustrating a fourth modified example of the nozzle configuration. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The X-axis, Y-axis, and Z-axis in the drawings are shown for the purpose of defining planes and directions in an article, such as a substrate processing apparatus, shown in the drawings. The X-axis, Y-axis, and Z-axis are mutually orthogonal and form a right-handed system. In the following description, when each of the X-axis, Y-axis, and Z-axis directions is associated with the direction of the X-axis, Y-axis, and Z-axis arrows shown in the drawings, a "+" or "-" symbol is added. For example, the "+X direction" refers to the direction in which the X-axis arrow advances from a reference surface, member, position, etc., and the "-X direction" refers to the direction in which the X-axis arrow advances from a reference surface, member, position, etc., opposite to the direction of the arrow.

[0010] In this specification, the -Z direction is sometimes referred to as the vertical downward direction, and the Z-axis direction is sometimes referred to as the up-down direction. In this specification, "up" and "above" refer to the +Z direction as viewed from a reference surface, component, position, etc., and "down" and "below" refer to the -Z direction as viewed from a reference surface, component, position, etc. For example, when describing "component B being placed on component A," component B is placed in the +Z direction as viewed from component A. Furthermore, when describing "the top surface of component A," this surface includes the surface located at the end of component A in the +Z direction and facing the +Z direction. These directions and surfaces associated with these directions are terms used for convenience of explanation, and their correspondence with the X-axis, Y-axis, and Z-axis directions may change depending on the installation orientation of the substrate processing apparatus, etc. For example, a surface referred to as the "top surface" in this specification may also be referred to as the "bottom surface," "side surface," etc.

[0011] The aspect ratios and relative sizes of components in each diagram are merely schematic representations and do not necessarily correspond to the relationships in an actual substrate processing apparatus. For the sake of convenience, the relative sizes of components may be exaggerated or may differ from the external shapes of components used in an actual substrate processing apparatus. Furthermore, for the sake of convenience, some cross-sectional views show the cross-sectional configuration of a substrate processing apparatus cut along imaginary cutting lines that cannot be accurately shown in plan views.

[0012] In this specification, the terms "not shown," "not shown," "not shown," and the like are intended to mean that the component to which the term is attached, or the reference numerals and leading lines that clearly indicate the component, are not shown in the figure. For example, "first component not shown" is intended to mean both that the part representing the first component (e.g., a shape, line, etc.) is not shown in the figure, and that the reference numerals and leading lines that clearly indicate the part corresponding to the first component in the figure are not included in the figure. Also, underlined reference numerals in the figure indicate the entire component, including multiple parts that are distinguished by multiple reference numerals.

[0013] The substrate processing device exemplified in the following description is a device that performs cutting on a substrate, which is a workpiece. The substrate may be a printed circuit board such as a printed wiring board or a printed circuit board, but is not limited to a specific one.

[0014] Fig. 1 is a perspective view of a substrate processing apparatus according to an embodiment. Fig. 2 is a plan view illustrating an example of the configuration of a nozzle. Fig. 3 is a horizontal cross-sectional view illustrating an example of the configuration of a nozzle. Fig. 4 is a vertical cross-sectional view illustrating an example of the configuration of a nozzle. The horizontal cross-sectional view of Fig. 3 may be a cross-sectional view of the nozzle in Fig. 2 taken along line A-A', and the vertical cross-sectional view of Fig. 4 may be a cross-sectional view of the nozzle in Fig. 2 taken along line B-B'.

[0015] The substrate processing apparatus 1 illustrated in FIGS. 1 to 4 includes a base 2, a router 3, a router stage 4, a pull-in stage 5, a nozzle 6, a nozzle drive mechanism 7, and a control panel 8.

[0016] The router stage 4 includes a router mounting unit 400 for mounting the router 3, and a movement mechanism 410 that can move the router mounting unit 400 in a first direction and a second direction that are perpendicular to each other. The movement mechanism 410 may include a first movement mechanism 411 that moves the router mounting unit 400 in the first direction, and a second movement mechanism 412 that moves the first movement mechanism 411 in the second direction. The router stage 4 is attached to a stage support unit 210 that stands upright above the upper surface 201 of the base 2, so that the first direction is the vertical direction (Z-axis direction) and the second direction is the horizontal direction (X-axis direction). The first movement mechanism 411 and the second movement mechanism 412 may have a known configuration and are not limited to a specific configuration. The router 3 is attached to the router mounting portion 400 with the router bit 310 extending in the -Z direction from the main body 300 of the router 3 and the axial direction of the rotation axis of the router bit 310 oriented in the first direction (Z-axis direction).

[0017] The retraction stage 5 is a stage on which the substrate 10, which is the workpiece, is placed, and is attached to a retraction stage movement mechanism 220 provided on the upper surface 201 of the base 2. The retraction stage 5 includes a substrate support unit 510 erected above the upper surface 501. The substrate support unit 510 may be provided with a suction mechanism at its upper end that suction-holds the substrate 10 and supports it, but the method by which the substrate support unit 510 supports the substrate 10 is not limited to a specific method. The retraction stage movement mechanism 220 is configured to move the retraction stage 5 in a horizontal direction (Y-axis direction) perpendicular to the first and second directions that are the movement directions of the router 3. The retraction stage movement mechanism 220 is configured to move the retraction stage 5 between a first position where the processing target portion of the substrate 10 placed on the retraction stage 5 can be cut by the router 3, and a second position moved from the first position in the -Y direction. The retraction stage movement mechanism 220 may have a known configuration and is not limited to a specific configuration.

[0018] The nozzle 6 is a cylindrical component that prevents the spread of cutting dust and other particles generated when the substrate 10 is cut by the router 3. The nozzle 6 illustrated in FIGS. 1 to 4 has a rectangular cylindrical shape with both ends open in the direction of extension of the axial core U (see FIG. 4) (hereinafter referred to as the "axial core direction U"). During cutting, the axial core direction U corresponds to a second direction (the X-axis direction) among the directions of movement of the router 3, and the nozzle 6 is disposed below the router 3 with one side surface 600 of the rectangular cylinder oriented as the top surface (hereinafter referred to as the "top surface 600"). A first elongated hole 601 extending in the X-axis direction is formed in the top surface 600 of the nozzle 6. The first elongated hole 601 is sized to allow the router bit 310 of the router 3 to be inserted therethrough and to allow the router 3 to move in the X-axis direction with the router bit 310 inserted therethrough. Side portions 610 and 620 extending downward from the top surface portion 600 are connected to both ends in the Y-axis direction of the top surface portion 600 of the nozzle 6, and a second elongated hole 611 is formed in the side surface portion 610 located at the end in the -Y direction, which draws the portion to be processed on the substrate 10 on the retracting stage 5 into a hollow region 690 (see FIG. 3) of the nozzle 6 when the retracting stage 5 is moved from the second position to the first position. The material of the nozzle 6 can be, for example, a metal material such as stainless steel, but is not limited to a specific material.

[0019] 2 has two product areas 1001 and 1002 cut out as two printed circuit boards, and ears (disposable boards) 1011 and 1012 that hold the two product areas 1001 and 1002 together. The two product areas 1001 and 1002 are spaced apart by a slit 1040 extending in the Y-axis direction and are aligned in the X-axis direction. The first ear 1011 holds the product areas 1001 and 1002 together at the ends of the product areas 1001 and 1002 on the +Y-direction side, and the second ear 1012 holds the product areas 1001 and 1002 together at the ends of the product areas 1001 and 1002 on the +Y-direction side. First ear 1011 is continuous with product area 1001 by connecting portion 1031, which is formed by partially forming slit 1041 along the boundary with product area 1001, and is continuous with product area 1002 by connecting portion 1032, which is formed by partially forming slit 1042 along the boundary with product area 1002. Second ear 1012 is continuous with product area 1001 by connecting portion 1033, which is formed by partially forming slit 1043 along the boundary with product area 1001, and is continuous with product area 1002 by connecting portion 1034, which is formed by partially forming slit 1044 along the boundary with product area 1002.

[0020] In the substrate processing apparatus 1 of this embodiment, the substrate 10 is placed on the retracting stage 5, which has been moved to the second position illustrated in FIG. 2, and then the retracting stage 5 is moved to a first position (i.e., in the +Y direction). The first position of the retracting stage 5 may be a position in the XY plane where the positions of the slits 1041 and 1042 formed along the boundary between the product areas 1001 and 1002 and the first ear 1011 are within the opening area of ​​the first elongated hole 601 in the upper surface 600 of the nozzle 6, more specifically, where the router bit 301 can cut the connection portions 1031 and 1032 between the product areas 1001 and 1002 and the first ear 1010 (see FIG. 3). The nozzle 6 is attached to the rotation fulcrum 702 of the nozzle drive mechanism 7 so that, when cutting the substrate 10, the axial direction U is aligned with the X-axis direction and the position of the second elongated hole 611 formed in the side surface 610 in the Z-axis direction is a position where the substrate 10 can be inserted.

[0021] That is, when the retracting stage 5 moves from the second position to the first position, the processing target portion of the substrate 10 at the end on the +Y direction side passes through the second elongated hole 611 of the nozzle 6 and enters the hollow region 690 of the nozzle 6. Therefore, in the substrate processing apparatus 1 of this embodiment, cutting of the substrate 10 is performed in the hollow region 690 of the nozzle 6. Therefore, cutting dust generated when the router 3 cuts the connection portions 1031 and 1032 of the substrate 10, and the first ear portions 1011 cut off from the product regions 1001 and 1002, remain in the hollow region 690 of the nozzle 6. Furthermore, when the retracting stage 5 reaches the first position, the end on the -Y direction side of the substrate 10 extends outward from the nozzle 6 (in the -Y direction beyond the side portion 610). Therefore, contamination of the surfaces of the product regions 1001 and 1002 of the substrate 10 due to the diffusion of cutting dust generated in the hollow region 690 of the nozzle 6 can be suppressed.

[0022] Furthermore, as described above, the nozzle 6 in the substrate processing apparatus 1 of this embodiment is attached to the rotation fulcrum 702 of the nozzle drive mechanism 7. The rotation fulcrum 702 is connected to the rotation shaft of the motor 701 and is coupled to the side surface 620 of the nozzle 6 so that the axial direction U of the nozzle 6 can be rotated between a first rotation position (orientation) along the X-axis direction and a second rotation position (orientation) along the Z-axis direction (see FIG. 4). The motor 701 of the nozzle drive mechanism 7 is fixed to the upper surface 201 of the base 2 by a metal fitting 703. Furthermore, as illustrated in FIG. 4, the base 2 is formed with a through-hole 230 that enables the nozzle 6 to be moved to the second rotation position by the nozzle drive mechanism 7 and that collects cutting dust and ears 1011 that fall from the hollow region 690 of the nozzle 6 that has been moved to the second rotation position.

[0023] The substrate processing apparatus 1 of the present embodiment described above performs cutting of the substrate 10 using the router 3 within the hollow region 690 of the nozzle 6, preventing the spread of cutting dust. Furthermore, residues such as cutting dust in the hollow region 690 of the nozzle 6 are collected through the through-hole 230 in the base 2 by rotating the nozzle 6 so that the open end faces downward (second rotation position) and allowing the nozzle 6 to fall under its own weight. As illustrated by the two-dot chain line in FIG. 4 , the open end of the lower end of the nozzle 6 moved to the second rotation position is positioned below the upper surface 201 of the base 2, thereby preventing the scattering of cutting dust on the base 2 due to the rising of cutting dust falling from the open end. Therefore, the substrate processing apparatus 1 of the present embodiment can efficiently collect cutting dust using a simpler method than the processing apparatuses described in Patent Documents 1 to 4 that collect cutting dust using a dust collector. The nozzle 6 in the substrate processing apparatus 1 of the present embodiment is not limited to a nozzle having a hollow region 690 with a specific spatial shape. For example, the inner peripheral surface of the nozzle 6 is not limited to a shape formed by combining planes whose transverse cross section ( FIG. 3 ) and longitudinal cross section ( FIG. 4 ) are rectangular, and may have a shape that allows cutting dust, the first ear 1011, and the like to easily fall off when the nozzle 6 is moved to the second rotation position (for example, a shape in which the lower end is tapered or inverted tapered, or a concave bottom surface that receives cutting dust and the like during cutting). Furthermore, the substrate processing apparatus 1 may be capable of changing the position of the nozzle 6 in the Y-axis direction, for example, by making the nozzle drive mechanism 7 movable in the Y-axis direction. For example, by moving the nozzle 6 in the +Y direction after cutting and rotating the nozzle 6 at a position farther away from the retraction stage 5 and the substrate 10, cutting dust in the hollow region 690 of the nozzle 6 can be more reliably prevented from diffusing and remaining in the area where cutting is performed.

[0024] 5 is a block diagram illustrating an example of the functional configuration of a substrate processing apparatus according to an embodiment. As illustrated in FIG. 5, the substrate processing apparatus 1 according to this embodiment can be considered as an apparatus including a cutting unit 100 and a control panel 8 that controls the operation of the cutting unit 100.

[0025] The cutting unit 100 may include a router 3, a movement mechanism 410 for the router stage 4, a retraction stage movement mechanism 220, and a nozzle drive mechanism 7. The movement mechanism 410 for the router stage 4 may include a first movement mechanism 411 that moves the router 3 in a first direction (Z-axis direction), and a second movement mechanism 412 that moves the router 3 in a second direction (X-axis direction). Each part of the cutting unit 100 is connected to a communication section 802 of the control panel 8, and operates in accordance with control signals from the control panel 8.

[0026] The control panel 8 includes a control unit 800, a storage unit 801, a communication unit 802, an input unit 803, and a display unit 804, which are interconnected by a bus 805. The control unit 800 controls the operation of the cutting unit 100 according to programs, control information, and the like stored in the storage unit 801. The control unit 800 generates control signals for controlling the operation of each component of the cutting unit 100 and transmits the control signals to each component of the cutting unit 100 via the communication unit 802. The functions of the control unit 800 are provided by a processor such as a central processing unit (CPU) that executes a program. The storage unit 801 stores, for example, a control program for controlling the operation of the cutting unit 100 (described later with reference to FIG. 6 ), setting information referenced by the processor that executes the control program, and the like. The storage device that provides the function of the storage unit 801 includes a read-only memory (ROM) and a random-access memory (RAM) as a main storage device. The storage device that provides the function of the storage unit 801 may also include an auxiliary storage device such as a hard disk drive (HDD) or a solid-state drive (SSD). The input unit 803 accepts input of setting information and the like related to the control of the cutting processing unit 100. The functions of the input unit 803 are provided by, for example, various switches arranged on an operation panel, an input device such as a keyboard, etc. The display unit 804 visualizes and displays various information related to the control of the cutting processing unit 100. The functions of the display unit 804 are provided by, for example, a display device such as a liquid crystal display arranged on the operation panel, a 7-segment display, a pilot lamp, etc. Some or all of the functions of the input unit 803 and the display unit 804 may be provided by, for example, a single piece of hardware that combines the functions of the input unit 803 and the display unit 804, such as a touch panel display.

[0027] The control panel 8 is not limited to a specific hardware configuration. The control panel 8 may be designed and manufactured as a control device dedicated to controlling the cutting processing unit 100, or may be a combination of a general-purpose computer such as a personal computer and a control program recorded on a computer-readable recording medium. The hardware of the control panel 8 may include a single piece of hardware that provides the functions shown by multiple blocks in FIG. 5, for example, hardware that integrates a processor as the control unit 800 and a memory as the storage unit 801. The hardware of the control panel 8 may also include multiple pieces of hardware that provide the functions shown by a single block in FIG. 5, for example, multiple separate processors that function as the control unit 800.

[0028] FIG. 6 is a flow diagram illustrating the procedure for cutting using a substrate processing apparatus according to one embodiment. The procedure illustrated in FIG. 6 may be the procedure for separating the first ear portion 1011 of the substrate 10 illustrated in FIG. 2 from the product regions 1001 and 1002. The cutting process illustrated in FIG. 6 is started with the router 3, the retracting stage 5, and the nozzle 6 moved to a predetermined initial position. The initial position of the nozzle 6 may be the first rotation position described above with reference to FIGS. 1 to 4, in which the axial direction U faces the X-axis direction. The initial position of the retracting stage 5 may be a position where the substrate 10 does not interfere with the nozzle 6 when the substrate 10 is placed on the retracting stage 5, as illustrated by the dashed line in FIG. 2. The initial position of the router 3 may be a position that does not prevent the substrate 10 from being placed on the retracting stage 5 and from entering the hollow region 690 of the nozzle 6. The router 3, the retraction stage 5, and the nozzle 6 are moved to their initial positions by sending control signals from the control unit 800 of the control panel 8 to each of the router movement mechanism 410, the retraction stage movement mechanism 220, and the nozzle drive mechanism 7.

[0029] After the router 3, the retracting stage 5, and the nozzle 6 are moved to their initial positions, the substrate 10, which is the workpiece (object to be processed), before processing, is placed on the retracting stage 5 (step S1). In step S1, the substrate 10 is taken out of a storage case by, for example, a transfer robot that works in conjunction with the substrate processing apparatus 1, and placed on the retracting stage 5. The substrate 10 may also be taken out of the storage case and placed on the retracting stage 5 by an operator.

[0030] Next, the retracting stage 5 is moved to a cutting position (first position) (step S2). In step S2, the control unit 800 sends a control signal to the retracting stage moving mechanism 220 to move the retracting stage 5 from the second position to the first position. The cutting position is a position where the router bit 310 inserted through the first slot 601 can cut the target area of ​​the substrate 10 (e.g., the boundary between the product areas 1001 and 1002 and the first lug 1011 shown in FIGS. 2 and 3 ) that has been inserted into the hollow region 690 through the second slot 611 of the nozzle 6. The amount of movement from the second position to the first position may be a fixed value or a variable value that changes depending on the dimensions of the substrate 10 before processing that is placed on the retracting stage 5. When the amount of movement from the second position to the first position is a variable value, the control unit 800 calculates the amount of movement from the second position to the first position and sends a control signal corresponding to the calculated amount of movement to the retracting stage moving mechanism 220.

[0031] After step S2, the router 3 cuts the substrate 10 (step S3). In step S3, the control unit 800 transmits, for example, control signals specifying the amount of movement of the router 3 in the X-axis direction and the Z-axis direction to the first movement mechanism (Z-axis movement mechanism) 411 and the second movement mechanism (X-axis movement mechanism) 412 of the router movement mechanism 410, respectively, and transmits a control signal to the router 3 to drive (rotate) the router bit 310. In step S3, the router 3, for example, inserts the router bit 310 into the first elongated hole 601 from one end side of the longitudinal direction (X-axis direction) of the first elongated hole 601 of the nozzle 6, and then cuts the substrate 10 while moving the router bit 310 toward the other end side of the first elongated hole 601 while rotating it at a predetermined rotation speed. For example, the router bit 310 cuts the connection portion 1131 between the product region 1001 and the first ear 1011 while moving in the +X direction through the slit 1041 between the product region 1001 and the first ear 1011, and then cuts the connection portion 1132 between the product region 1002 and the first ear 1011 while moving in the +X direction through the slit 1042 between the product region 1002 and the first ear 1011. At this time, cutting dust generated by cutting the connection portions 1131 and 1132 accumulates in the hollow region 690 of the nozzle 6. Furthermore, when the router 3 finishes cutting the connection portions 1131 and 1132, the first ear 1011, which has been cut off from the product regions 1001 and 1002, falls under its own weight and accumulates in the hollow region 690.

[0032] After step S3, the router 3 and the retracting stage 5 are moved to a predetermined retreat position such as the initial position described above (step S4). In step S4, the control unit 800 transmits control signals to the router movement mechanism 410 and the retracting stage movement mechanism 220, respectively, to move the router 3 and the retracting stage 5 to positions that will not interfere with the rotational movement of the nozzle 6 in the next step S5, for example.

[0033] After step S4, the nozzle 6 is rotated 90 degrees in the first rotation direction (step S5). In step S5, the control unit 800 transmits a control signal to the nozzle drive mechanism 7, which rotates the nozzle 6 about a rotation axis in the Y-axis direction perpendicular to the axial direction U of the nozzle 6, to rotate the nozzle 6 90 degrees. In the substrate processing apparatus 1 described above with reference to FIGS. 1 to 4, when the nozzle drive mechanism 7 rotates the nozzle 6 90 degrees, the axial direction U of the nozzle 6 becomes the up-down direction. Therefore, cutting dust and first ears 1011 remaining in the hollow region 690 fall due to their own weight from the opening end of the nozzle 6 in the axial direction U that has moved toward the lower end of the nozzle 6, and pass through the through-hole 230 in the base 2 to be collected in a collection container.

[0034] After step S5, the nozzle 6 is rotated 90 degrees in a second rotation direction opposite to the first rotation direction (step S6). In step S6, the control unit 800 sends a control signal to the nozzle drive mechanism 7 to rotate the nozzle 6 90 degrees in the direction opposite to that of step S5. When step S6 is completed, the cutting process for cutting the first ear 1011 from the substrate 10 is completed. For example, if the substrate 10 placed on the retracting stage 5 has the second ear 1012 illustrated in FIG. 2, after step S6, the retracting stage 5 can be rotated 180 degrees about the Z-axis direction as the rotation axis and steps S2 to S6 can be performed again to cut the second ear 1012 from the product regions 1001 and 1002.

[0035] As described above, the substrate processing apparatus 1 of this embodiment does not require a dust collection device for collecting cutting dust, thereby reducing the introduction cost and running cost of the substrate processing apparatus 1. The rotation angle of the nozzle 6 is not limited to the above-mentioned 90 degrees, and may be any angle that allows the cutting dust and the first ear 1011 in the hollow region 690 to fall from the open end. Furthermore, the cutting process on the substrate 10 using the router 3 is not limited to the process of cutting off the ear 1011 described above, and may also be a drilling process, a chamfering process, or the like.

[0036] FIG. 7 is a vertical cross-sectional view illustrating a first modified example of the nozzle configuration. In the substrate processing apparatus 1 controlled by the procedure illustrated in FIG. 6, the nozzle 6 always has the same opening end that moves downward and upward when rotated 90 degrees in step S5. In such a case, the nozzle 6 may have a closed shape (closed end 650) at the end of the axial direction U that moves upward, as illustrated in FIG. 7. By defining one end of the nozzle 6 in the axial direction U as the open end 651 and the other end as the closed end 650, for example, air flow within the hollow region 690 is suppressed. Therefore, for example, cutting dust remaining in the hollow region 690 when the nozzle 6 is rotated can be prevented from being dispersed outside the hollow region 690 by the air flow and remaining around the substrate processing apparatus 1 (e.g., on the upper surface 201 of the base 2).

[0037] 8A and 8B are side views illustrating a second modified example of the nozzle configuration. The nozzle 6 illustrated in FIGS. 8A and 8B may have an open end 651 at one end in the axial direction U and a closed end at the other end. A lid 660 is attached to the open end 651, allowing the opening of the open end 651 to be freely opened and closed. Specifically, as illustrated in FIG. 8A , an upper surface 600, which serves as the upper end of the nozzle 6 during cutting, and an end portion of the lid 660, which serves as the upper end of the lid 660 covering the open end 651, are connected by a hinge 661 so as to be freely opened and closed. Therefore, during cutting, the open end 651 of the nozzle 6 is covered by the lid 660, and the hollow region 690 of the nozzle 6 is in communication with the outside space only through the first elongated hole 601 and the second elongated hole 611. This further prevents cutting dust generated in the hollow region 690 during cutting from diffusing into the outside space of the nozzle 6. Furthermore, when the cutting process is completed and the nozzle 6 is rotated 90 degrees in the first rotation direction, as illustrated in Fig. 8B, the lid 660 rotates by its own weight around the hinge 661 as a rotation fulcrum, and the open end 651 of the nozzle 6 is opened. This allows cutting dust and the first ear 1011 remaining in the hollow region 690 of the nozzle 6 to fall from the open end 651 of the nozzle 6 and be collected. Furthermore, when the nozzle 6 is rotated 90 degrees in the second rotation direction, the open end 651 of the nozzle 6 returns to the state where it is closed by the lid 660, as illustrated in Fig. 8A, and therefore, cutting dust remaining in the hollow region 690 without falling can be prevented from diffusing into the space outside the nozzle 6.

[0038] 9A and 9B are side views illustrating a third modified example of the nozzle configuration. The nozzle 6 illustrated in FIGS. 9A and 9B is configured such that, instead of rotating the nozzle so as to change the orientation of the axial direction U by the nozzle drive mechanism 7, a side portion (bottom portion) 630 located below the hollow region 690 can be opened and closed during cutting. Specifically, as illustrated in FIG. 9A, a first member has an upper surface portion 600 in which a first elongated hole 601 is formed, side surfaces 610 and 620 extending downward from the upper surface portion 600, and an open lower end 652. A second member (bottom portion 630) is connected to the first member so that the open lower end 652 of the first member can be opened and closed. A hinge 662 connects the first member to the second member. The first member has an upper surface portion 600 in which a first elongated hole 601 is formed, side surfaces 610 and 620 extending downward from the upper surface portion 600, and an open lower end 652. The hinge 662 is connected to the motor 701 of the nozzle drive mechanism 7 via a transmission mechanism (not shown), allowing the bottom portion 630 to be held in a closed position with the open lower end 652 of the first member. In this example, the motor 701 and the hinge 662 are connected so that the hinge 662 moves to open the bottom portion 630 when the motor 701 rotates in a predetermined direction. This allows the bottom portion 630 to open and allow cutting dust and other debris to fall from the hollow region 690 only when collecting cutting dust and other debris, as illustrated in FIG. 9B . When a nozzle 6 having such a configuration is used, both ends in the axial direction U can be closed, preventing cutting dust and other debris from diffusing into the hollow region 690. Furthermore, when a nozzle 6 having such a configuration is used, restrictions on the placement of the router 3 and other components around the nozzle 6 are alleviated compared to when the entire nozzle 6 is rotated by the nozzle drive mechanism 7, as shown in FIGS. 4 and 7 . The nozzle drive mechanism 7 that opens and closes the bottom surface portion 630 of the nozzle 6 is not limited to a mechanism that rotates the bottom surface portion 630 around the hinge 662. The nozzle drive mechanism 7 may be a mechanism that opens and closes the bottom surface portion 630 by sliding it in the X-axis direction or the Y-axis direction using a solenoid or the like, for example.

[0039] FIG. 10 is a side view illustrating a fourth modified nozzle configuration. The nozzle 6 illustrated in FIG. 10 may be rectangular tubular, and a dust diffusion prevention member 671 that can contact the upper and lower surfaces of the substrate 10 is attached to a second elongated hole 611 through which the workpiece substrate 10 enters. The dust diffusion prevention member 671 may be flexible, such as a rubber sheet, so as not to scratch the upper and lower surfaces of the substrate 10. The dust diffusion prevention member 671 can prevent cutting dust in the hollow region 690 from diffusing into the space outside the nozzle 6 through the gap between the second elongated hole 611 and the substrate 10, for example, when the clearance between the second elongated hole 611 and the substrate 10 is large. The dust diffusion prevention member 671 may be attached to the outer peripheral surface of the nozzle 6 instead of the inner peripheral surface of the nozzle 6 as illustrated in FIG. 10. The dust diffusion prevention member 671 is not limited to a sheet-like member, and may be, for example, a brush-like member.

[0040] The features of the above-described embodiment will be summarized below. The substrate processing apparatus according to the above-described embodiment includes a stage for placing a substrate thereon, a router for cutting the substrate, a router movement mechanism for moving the router in a first direction and a second direction that are perpendicular to each other, a stage movement mechanism for moving the stage between a first position where the substrate is cut by the router and a second position different from the first position where the substrate is placed, a nozzle having a hollow area surrounded by side portions, the side portions having a first elongated hole through which a router bit of the router can be inserted into the hollow area, and a second elongated hole through which a portion of the substrate placed on the stage to be processed by the router enters the hollow area when the stage is moved from the second position to the first position, a nozzle drive mechanism for driving the nozzle so that cutting dust remaining in the hollow area of ​​the nozzle falls from the nozzle under its own weight, and a base above which the stage, the router, and the nozzle are disposed, and which has a through hole formed therein for collecting cutting dust that has fallen from the nozzle.

[0041] In the substrate processing apparatus according to the above embodiment, the nozzle has a cylindrical shape with at least one end in the axial direction open, and the nozzle drive mechanism rotates the nozzle so that the rotational position of the nozzle can be changed between a first rotational position in which the axial direction of the nozzle is approximately horizontal and a second rotational position in which the axial direction of the nozzle is approximately vertical.

[0042] In the substrate processing apparatus according to the above embodiment, the nozzle has an open end which becomes the lower end when the nozzle is in the second rotation position.

[0043] In the substrate processing apparatus according to the above embodiment, the nozzle has a lid attached to the one end, which is the lower end when the nozzle is in the second rotation position on the side portion, so as to close the opening at the one end when the nozzle is in the first rotation position and to open the opening at the one end when the nozzle is in the second rotation position.

[0044] In the substrate processing apparatus according to the above embodiment, the lower end of the nozzle when in the second rotation position is lower than the upper end of the through hole formed in the base.

[0045] In the substrate processing apparatus according to the above embodiment, the nozzle comprises a first member having an open lower portion of the hollow region and a second member that opens and closes the open lower portion of the first member, and the nozzle driving mechanism moves the second member between a position that closes the open lower portion of the first member and a position that opens the region.

[0046] The present invention is not limited to the above-described embodiments, and may be variously modified, substituted, or altered without departing from the spirit of the technical idea. Furthermore, if the technical idea can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea. [Industrial Applicability]

[0047] As described above, the present invention can efficiently collect cutting dust generated during cutting processing by a substrate processing device using a simple method that does not require a dust collection device, thereby reducing the introduction costs and running costs of substrate processing devices used in the manufacture of printed circuit boards. [Explanation of symbols]

[0048] 1 Substrate processing equipment 2 pedestal 220 Retractable stage movement mechanism 230 through hole 3. Router 310 router bit 4 Router Stage 410 (Router) Moving mechanism 5 Retractable Stage 6 nozzles 600 Side part (top part) 610, 620 side part 630 Side part (bottom part) 660 Lid 661, 662 hinges 601, 611 long hole 7 Nozzle drive mechanism 701 Motor 8 Control Panel 100 Cutting Unit 10 Substrate 1001, 1002 Product area 1011, 1012 Ears

Claims

1. a stage on which a substrate is placed; a router for cutting the substrate; a router movement mechanism that moves the router in a first direction and a second direction that are orthogonal to each other; a stage moving mechanism that moves the stage between a first position where the substrate is cut by the router and a second position where the substrate is placed, the second position being different from the first position; a nozzle having a hollow area surrounded by a side surface, the side surface having a first slot through which a router bit of the router can be inserted into the hollow area, and a second slot through which a portion of the substrate placed on the stage that is to be processed by the router can enter the hollow area when the stage is moved from the second position to the first position; a nozzle driving mechanism that drives the nozzle so that cutting dust remaining in the hollow region of the nozzle falls from the nozzle by its own weight; a base on which the stage, the router, and the nozzle are disposed and which has a through hole formed therein for collecting cutting dust dropped from the nozzle; A substrate processing device comprising:

2. the nozzle has a cylindrical shape with at least one end in an axial direction being open, the nozzle drive mechanism rotates the nozzle so that the rotational position of the nozzle can be changed between a first rotational position where the axial direction of the nozzle is substantially horizontal and a second rotational position where the axial direction of the nozzle is substantially vertical. The substrate processing apparatus according to claim 1 .

3. The substrate processing apparatus according to claim 2 , wherein the nozzle has an open end which is a lower end when the nozzle is in the second rotation position.

4. 3. The substrate processing apparatus of claim 2, wherein the nozzle has a lid attached to the one end, which is the lower end when the nozzle is in the second rotation position on the side portion, so as to close the opening at the one end when the nozzle is in the first rotation position and to open the opening at the one end when the nozzle is in the second rotation position.

5. The substrate processing apparatus according to claim 3 , wherein the lower end of the nozzle when in the second rotation position is located below an upper end of the through hole formed in the base.

6. the nozzle includes a first member having an open lower portion of the hollow region, and a second member that opens and closes the open lower portion of the first member; the nozzle driving mechanism moves the second member between a position where the lower open area of ​​the first member is closed and a position where the lower open area is opened. The substrate processing apparatus according to claim 1 .

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