Recording apparatus and cleaning apparatus

Abstract

To solve such a problem that a position at which a cleaning liquid contacts a discharge surface has not been considered when spraying means sprays the cleaning liquid to the discharge surface.SOLUTION: A recording apparatus comprises: a recording section which includes a cavity filled with ink, an ink nozzle, a discharge surface on which the ink nozzle is formed, and a piezoelectric element that ejects the ink from the ink nozzle; a spraying section which has a spray nozzle that sprays a cleaning liquid and lands the cleaning liquid sprayed from the spray nozzle in a liquid droplet state on the ink nozzle; a moving section that moves a relative position between the ink nozzle and the spray nozzle within a partial region of the discharge surface; a control section that controls the moving section; and a detection section that detects vibration generated in the piezoelectric element due to landing of the cleaning liquid on the ink nozzle. The control section controls the relative position on the basis of the vibration detected by the detection section.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a recording device and a cleaning device. [Background technology]

[0002] There is known a recording apparatus having a head cleaning mechanism for cleaning the ejection surface of an inkjet head. The head cleaning mechanism described in Patent Document 1 has a spraying means. The spraying means sprays a cleaning liquid onto the ejection surface of the recording head. The spraying means has one or more spray nozzles for spraying the cleaning liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-233896 Summary of the Invention [Problem to be solved by the invention]

[0004] No consideration is given to the position where the cleaning liquid comes into contact with the ejection surface when the ejection means ejects the cleaning liquid onto the ejection surface. [Means for solving the problem]

[0005] The recording device of the present disclosure comprises: a recording unit that includes a cavity filled with ink, an ink nozzle communicating with the cavity, an ejection surface on which the ink nozzle is formed, and a piezoelectric element that ejects the ink from the ink nozzle, and records on a medium by ejecting the ink; an ejection unit that has an ejection nozzle that ejects cleaning liquid, and causes the cleaning liquid ejected from the ejection nozzle to land in droplets on the ink nozzle; a moving unit that moves the relative position of the ink nozzle and the ejection nozzle within a partial area of ​​the ejection surface; a control unit that controls the ejection unit and the moving unit; and a detection unit that detects vibrations that occur in the piezoelectric element when the cleaning liquid lands on the ink nozzle, and the control unit controls the relative position based on the vibrations detected by the detection unit.

[0006] The cleaning device disclosed herein is a cleaning device that cleans a recording unit having ink nozzles that eject ink, an ejection surface on which the ink nozzles are formed, and a piezoelectric element that ejects the ink into the ink nozzle, and is equipped with: an ejection unit that has an ejection nozzle that ejects cleaning liquid and causes the cleaning liquid ejected from the ejection nozzle to land in droplets on the ink nozzle; and a moving unit that moves the relative position of the ink nozzle and the ejection nozzle within a partial area of ​​the ejection surface, and the moving unit moves based on vibrations generated in the piezoelectric element when the cleaning liquid lands on the ink nozzle, and adjusts the relative position. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a printer. [Figure 2] FIG. 2 is a diagram showing a schematic configuration of a head unit and a cleaning liquid ejection unit. [Figure 3] FIG. 2 is a diagram showing a schematic configuration of a head unit and a cleaning liquid ejection unit. [Figure 4] FIG. 2 is a diagram showing the block configuration of a printer. [Figure 5] FIG. 2 is a diagram showing a schematic configuration of a head unit and a cleaning liquid ejection unit. [Figure 6]FIG. 2 is a diagram showing a schematic configuration of a head unit and a cleaning liquid ejection unit. [Figure 7] FIG. 2 is a diagram showing a schematic configuration of a cleaning liquid spraying unit. [Figure 8] FIG. 2 is a diagram showing a schematic configuration of a cleaning liquid spraying unit. [Figure 9] FIG. 4 is a diagram showing a schematic configuration of a support structure for a cleaning nozzle plate. [Figure 10] FIG. 4 is a diagram showing a schematic configuration of a support structure for a cleaning nozzle plate. DETAILED DESCRIPTION OF THE INVENTION

[0008] FIG. 1 shows the general configuration of a printer 1. FIG. 1 shows the general configuration of the printer 1 in a schematic plan view. The printer 1 corresponds to an example of a recording device. The printer 1 is an inkjet printer that ejects ink Li onto a medium P. The medium P is recording paper, a resin film, a fabric, or the like. The ink Li may be a pigment ink containing a pigment, or a dye ink containing a dye.

[0009] Several figures, including FIG. 1, illustrate an XYZ coordinate system. The Z axis is an axis perpendicular to the installation surface on which the printer 1 is installed. The +Z direction is a direction pointing upward from the installation surface. The -Z direction is a direction pointing from above toward the installation surface. The X axis is an axis perpendicular to the Z axis. The X axis is an axis parallel to the direction in which the head unit 10, described below, moves. The +X direction is a direction in which the head unit 10 moves from above the medium P toward the maintenance unit 50, described below. The -X direction is a direction from the maintenance unit 50 toward above the medium P. The Y axis is an axis perpendicular to the X axis and Z axis. The +Y direction is a direction opposite to the direction in which the medium P is transported by the transport mechanism 30, described below. The -Y direction is a direction in which the medium P is transported by the transport mechanism 30.

[0010] The printer 1 includes a head unit 10, a supply unit 20, a transport mechanism 30, a movement mechanism 40, and a maintenance unit 50. The printer 1 also includes a media cassette, a media supply mechanism, a paper output tray, etc. The media cassette, media supply mechanism, and paper output tray are not shown.

[0011] The head unit 10 ejects ink Li onto the medium P. The head unit 10 performs printing on the medium P by ejecting the ink Li onto the medium P. Printing corresponds to an example of recording. The head unit 10 corresponds to an example of a recording section. The head unit 10 has a nozzle plate 11, a head cover 13, and ejection elements 15. The ejection elements 15 will be described later.

[0012] The nozzle plate 11 is disposed at a position facing the medium P. The nozzle plate 11 has a nozzle surface 11a. The nozzle surface 11a is the surface facing the medium P and is the surface of the nozzle plate 11 in the -Z direction. The nozzle surface 11a corresponds to an example of an ejection surface. A plurality of nozzles N are formed in the nozzle surface 11a of the nozzle plate 11. The nozzles N are openings that eject ink Li. The nozzles N correspond to an example of an ink nozzle. The multiple nozzles N are arranged parallel or approximately parallel to the Y axis and form a nozzle row 12. The nozzle surface 11a has a plurality of nozzle rows 12.

[0013] The head unit 10 shown in FIG. 1 has four nozzle rows 12. The four nozzle rows 12 are a first nozzle row 12a, a second nozzle row 12b, a third nozzle row 12c, and a fourth nozzle row 12d. The multiple nozzle rows 12 are arranged in the order of the first nozzle row 12a, the second nozzle row 12b, the third nozzle row 12c, and the fourth nozzle row 12d from the -X direction. The multiple nozzle rows 12 may eject ink Li of the same color, or may eject ink Li of different colors. As an example, the four nozzle rows 12 eject black ink Li, cyan ink Li, magenta ink Li, and yellow ink Li, respectively. Any of the multiple nozzle rows 12 may eject white ink Li, metallic ink Li, etc.

[0014] The head cover 13 supports the nozzle plate 11. The head cover 13 covers a portion of the −Z direction surface of the nozzle plate 11. The head cover 13 is provided with an opening that exposes the nozzle surface 11a, which is the −Z direction surface of the nozzle plate 11.

[0015] The supply unit 20 supplies ink Li to the head unit 10. As an example, the supply unit 20 supplies ink Li of multiple colors to the head unit 10. The supply unit 20 includes multiple liquid supply sources 21, a holding unit 24, multiple supply flow paths 25, and multiple pressure adjustment units 26.

[0016] The liquid supply source 21 stores the ink Li. The liquid supply source 21 may be a cartridge that is detachable from the holding portion 24, or may be a tank into which the ink Li is injected. The liquid supply source 21 shown in FIG. 1 is a tank. The liquid supply source 21 shown in FIG. 1 has an injection portion 22 and a storage chamber 23. The injection portion 22 is configured to be able to inject the ink Li into the storage chamber 23. The storage chamber 23 stores the injected ink Li.

[0017] The supply unit 20 shown in FIG. 1 has four liquid supply sources 21. The four liquid supply sources 21 are a first liquid supply source 21a, a second liquid supply source 21b, a third liquid supply source 21c, and a fourth liquid supply source 21d. The first liquid supply source 21a contains ink Li to be supplied to the first nozzle row 12a. The second liquid supply source 21b contains ink Li to be supplied to the second nozzle row 12b. The third liquid supply source 21c contains ink Li to be supplied to the third nozzle row 12c. The fourth liquid supply source 21d contains ink Li to be supplied to the fourth nozzle row 12d. The first liquid supply source 21a, the second liquid supply source 21b, the third liquid supply source 21c, and the fourth liquid supply source 21d contain ink Li of different colors, as an example.

[0018] The holder 24 holds a plurality of liquid supply sources 21. The holder 24 shown in Fig. 1 holds a first liquid supply source 21a, a second liquid supply source 21b, a third liquid supply source 21c, and a fourth liquid supply source 21d. When the liquid supply source 21 is configured as a cartridge, the holder 24 detachably holds the liquid supply source 21.

[0019] The holder 24 holds a cleaning liquid supply source 98. The cleaning liquid supply source 98 contains the cleaning liquid Lc that is sprayed from the cleaning liquid spraying unit 70, which will be described later. The cleaning liquid supply source 98 may be a cartridge that is detachable from the holder 24, or may be a tank into which the cleaning liquid Lc is injected. The holder 24 shown in FIG. 1 holds the cleaning liquid supply source 98, but is not limited to this configuration. The cleaning liquid supply source 98 may be housed in a position different from the holder 24.

[0020] The supply flow paths 25 allow the ink Li contained in the liquid supply source 21 to flow to the head unit 10. The supply flow paths 25 are connected to the liquid supply source 21 and the head unit 10. The supply unit 20 shown in FIG. 1 has four supply flow paths 25. The four supply flow paths 25 are a first supply flow path 25a, a second supply flow path 25b, a third supply flow path 25c, and a fourth supply flow path 25d.

[0021] The first supply flow path 25a causes the ink Li stored in the first liquid supply source 21a to flow to the first nozzle row 12a of the head unit 10. The second supply flow path 25b causes the ink Li stored in the second liquid supply source 21b to flow to the second nozzle row 12b of the head unit 10. The third supply flow path 25c causes the ink Li stored in the third liquid supply source 21c to flow to the third nozzle row 12c of the head unit 10. The fourth supply flow path 25d causes the ink Li stored in the fourth liquid supply source 21d to flow to the fourth nozzle row 12d of the head unit 10.

[0022] The pressure adjustment unit 26 adjusts the pressure of the ink Li flowing into the head unit 10. The pressure adjustment unit 26 adjusts the pressure of the ink Li supplied to the nozzle row 12 of the head unit 10. The pressure adjustment unit 26 is provided in the supply flow path 25. The pressure adjustment unit 26 has, for example, a feed pump and a pressure sensor. The feed pump causes the ink Li in the supply flow path 25 to flow toward the head unit 10. The pressure sensor detects the pressure of the ink Li. The feed pump causes the ink Li to flow based on the pressure detection result by the pressure sensor.

[0023] The supply unit 20 shown in FIG. 1 has four pressure adjustment units 26. The four pressure adjustment units 26 are a first pressure adjustment unit 26a, a second pressure adjustment unit 26b, a third pressure adjustment unit 26c, and a fourth pressure adjustment unit 26d. The first pressure adjustment unit 26a is provided in the first supply flow path 25a. The first pressure adjustment unit 26a adjusts the pressure of the ink Li flowing through the first supply flow path 25a. The second pressure adjustment unit 26b is provided in the second supply flow path 25b. The second pressure adjustment unit 26b adjusts the pressure of the ink Li flowing through the second supply flow path 25b. The third pressure adjustment unit 26c is provided in the third supply flow path 25c. The third pressure adjustment unit 26c adjusts the pressure of the ink Li flowing through the third supply flow path 25c. The fourth pressure adjustment unit 26d is provided in the fourth supply flow path 25d. The fourth pressure adjustment unit 26d adjusts the pressure of the ink Li flowing through the fourth supply flow path 25d.

[0024] The transport mechanism 30 transports the medium P in a predetermined direction. The transport mechanism 30 moves the medium P to a position facing the head unit 10 by transporting the medium P in the -Y direction. The transport mechanism 30 includes a transport rod 34 having a transport roller 32, and a transport motor 36.

[0025] The transport rollers 32 come into contact with the medium P. The transport rollers 32 rotate to transport the medium P in a predetermined direction. The transport rod 34 shown in FIG. 1 has multiple transport rollers 32. The multiple transport rollers 32 are arranged along the X axis.

[0026] The transport rod 34 supports the transport roller 32. The transport rod 34 is rotated by the driving force of the transport motor 36. When the transport rod 34 rotates, the transport roller 32 rotates.

[0027] The transport motor 36 generates a driving force to rotate the transport rod 34. The transport motor 36 is connected to the transport rod 34 directly or via a transmission mechanism (not shown). The transport motor 36 rotates the transport roller 32 via the transport rod 34.

[0028] The movement mechanism 40 moves the head unit 10 along the X axis. The movement mechanism 40 moves the head unit 10 along the X axis over the medium P. The movement mechanism 40 moves the head unit 10 to a position opposite the maintenance unit 50, which is positioned in the +X direction. The movement mechanism 40 includes a carriage 42, a conveyor belt 44, a drive roller 46, and a pulley 47.

[0029] The carriage 42 carries the head unit 10 and multiple pressure adjustment units 26. The carriage 42 moves in the +X direction or the -X direction along the X axis. As the carriage 42 moves along the X axis, the head unit 10 moves along the X axis.

[0030] The conveyor belt 44 supports the carriage 42. The conveyor belt 44 rotates in one direction or the other. As the conveyor belt 44 rotates, the carriage 42 moves along the X-axis. The conveyor belt 44 is stretched by a drive roller 46 and a pulley 47.

[0031] The drive roller 46 stretches the conveyor belt 44 together with the pulley 47. The drive roller 46 is connected to a movement motor (not shown). The drive roller 46 rotates by the driving force generated by the movement motor. The rotation of the drive roller 46 causes the conveyor belt 44 to rotate.

[0032] The pulley 47 stretches the conveyor belt 44 together with the drive roller 46. The pulley 47 rotates in accordance with the rotation of the conveyor belt 44.

[0033] The maintenance unit 50 performs maintenance on the head unit 10. The maintenance unit 50 corresponds to an example of a cleaning device. The maintenance unit 50 is disposed in a position in the +X direction of an area where the medium P is transported by the transport mechanism 30. The maintenance unit 50 is disposed in a position in the -Z direction of the head unit 10 moved by the movement mechanism 40. The maintenance unit 50 is disposed in a position facing the -Z direction surface of the head unit 10. The maintenance unit 50 includes a cap unit 51, a cleaning unit 60, a liquid receiving unit 67, and a cleaning liquid spraying unit 70. In the maintenance unit 50 shown in FIG. 1, the liquid receiving unit 67, the cap unit 51, the cleaning unit 60, the cleaning liquid spraying unit 70 are arranged in this order from the -X direction to the +X direction. The maintenance unit 50 further includes a waste liquid tube 56, a suction pump 57, a waste liquid collection unit 58, and a tube switching unit 59.

[0034] The cap unit 51 applies negative pressure to the ink Li in the head unit 10 through the nozzle N. The ink Li in the head unit 10 is discharged from the head unit 10 by applying negative pressure. The cap unit 51 collects the discharged ink Li. The cap unit 51 has a cap 52, a cap holding unit 53, and a cap moving unit 54.

[0035] The cap 52 comes into contact with the head unit 10 and forms a suction space. The suction space is a space to which negative pressure is applied. The cap 52 is configured in a shape that covers the nozzle N within the suction space. The cap 52 is made of an elastic material such as rubber.

[0036] The cap holding portion 53 holds the cap 52. The cap holding portion 53 may hold the cap 52 via a compression coil spring (not shown). The cap holding portion 53 is moved along the Z axis by the cap moving portion 54. When the cap holding portion 53 moves in the +Z direction, the cap 52 comes into contact with the head unit 10 and forms a suction space.

[0037] The cap moving unit 54 moves the cap holding unit 53 along the Z axis. The cap moving unit 54 moves the cap 52 by moving the cap holding unit 53. The cap moving unit 54 moves the cap holding unit 53 in the +Z direction, and brings the cap 52 into contact with the head unit 10.

[0038] The liquid receiving portion 67 receives the ink Li that is discharged from the nozzles N by flushing. Flushing is an operation for discharging the ink Li from the nozzles N. Flushing is performed as a maintenance operation for the head unit 10. The liquid receiving portion 67 may receive the ink Li that is discharged from the nozzles N by pressurized cleaning. Pressurized cleaning is performed as a maintenance operation for the head unit 10.

[0039] The cleaning unit 60 cleans the nozzle surface 11a. The cleaning unit 60 collects any adhering matter adhering to the nozzle surface 11a. The adhering matter may be ink Li, substances contained in the ink Li, etc. The cleaning unit 60 has a cleaning body 61, a guide unit 62, an attachment unit 63, a support member 64, and a support member movement unit 65.

[0040] The cleaning element 61 comes into contact with the deposits and collects them. The cleaning element 61 is formed in the shape of a rectangular thin plate. The cleaning element 61 is made of a rubber material such as butyl rubber, silicone rubber, or fluorosilicone rubber, or a resin material such as fluororesin, polyethylene, or propylene terephthalate. The cleaning element 61 may also be made of a metal material such as stainless steel.

[0041] The guide part 62 regulates the collection position of the deposits on the cleaning body 61. The guide part 62 is provided at the end of the cleaning body 61 in the +Z direction. The guide part 62 is provided at a position in the +Y direction and a position in the -Y direction of the end of the cleaning body 61 in the +Z direction. The guide part 62 may be configured integrally with the cleaning body 61 or may be configured separately.

[0042] The cleaning element 61 is attached to the attachment part 63. The attachment part 63 is configured to be able to store the deposits collected by the cleaning element 61. The attachment part 63 may be configured integrally with the guide part 62.

[0043] The support member 64 supports the mounting part 63. The support member 64 is configured to be movable along the Z axis by a support member moving part 65. When the support member 64 moves along the Z axis, the cleaning element 61 attached to the mounting part 63 moves along the Z axis. When the support member 64 moves in the +Z direction, the cleaning element 61 moves to a collection position where it collects deposits. The support member 64 supports the mounting part 63 via a compression coil spring (not shown).

[0044] The support member moving unit 65 moves the support member 64 along the Z axis. The support member moving unit 65 moves the support member 64 along the Z axis, thereby moving the cleaning element 61 along the Z axis.

[0045] The cleaning liquid jetting unit 70 jets the cleaning liquid Lc in droplet form toward the nozzle surface 11a of the head unit 10. The cleaning liquid jetting unit 70 causes the cleaning liquid Lc to land in droplet form on the nozzle N. The cleaning liquid jetting unit 70 corresponds to an example of a jetting unit. The cleaning liquid jetting unit 70 includes a cleaning nozzle plate 71, a cleaning nozzle 72, a cleaning liquid tube 73, a pressure pump 74, a cover 75, a cover holding unit 76, a cover moving unit 77, a sealing member 78, a support table 81, an auxiliary table 82, and a slide mechanism 83. The detailed configuration of the cleaning liquid jetting unit 70 will be described later.

[0046] The waste liquid tube 56 allows ink Li and the like discharged from the cap unit 51, the liquid receiver 67, the cleaning unit 60, and the cleaning liquid spray unit 70 to flow to the waste liquid collection unit 58. The waste liquid tube 56 connects the waste liquid collection unit 58 with the cap unit 51, the liquid receiver 67, the cleaning unit 60, and the cleaning liquid spray unit 70. A suction pump 57 and a tube switching unit 59 are provided in the waste liquid tube 56.

[0047] The suction pump 57 sucks the inside of the waste liquid tube 56. When the suction pump 57 is driven, the ink Li, cleaning liquid Lc, etc. flow into the waste liquid collection unit 58. The suction pump 57 sucks when the cap 52 is in contact with the head unit 10, and reduces the pressure in the suction space. By reducing the pressure in the suction space, the suction pump 57 straightens the meniscus formed in the nozzle N.

[0048] The waste liquid collecting unit 58 collects ink Li, deposits, cleaning liquid Lc, etc. The waste liquid collecting unit 58 collects cleaning liquid Lc discharged from the cleaning liquid spraying unit 70 connected via the waste liquid tube 56. The waste liquid collecting unit 58 collects ink Li, etc. discharged from the cap unit 51, etc. connected via the waste liquid tube 56.

[0049] The tube switching unit 59 switches the connection destination of the waste liquid tube 56 to any one of the cap 52, the cleaning unit 60, the liquid receiving unit 67, and the cleaning liquid spraying unit 70. The waste liquid collecting unit 58 collects the ink Li and the like discharged from the connection destination switched by the tube switching unit 59.

[0050] FIG. 2 shows a schematic configuration of the head unit 10 and the cleaning liquid jetting unit 70. FIG. 2 shows a schematic configuration of the cleaning liquid jetting unit 70 when the head unit 10 has moved to a position facing the cleaning liquid jetting unit 70. The head unit 10 is moved to a position facing the cleaning liquid jetting unit 70 by a movement mechanism 40. FIG. 2 shows a YZ cross section of the head unit 10 and the cleaning liquid jetting unit 70. FIG. 2 shows an enlarged view of the nozzles N, ejection elements 15, etc. in the head unit 10. The number and sizes of the nozzles N, ejection elements 15, etc. shown in FIG. 2 differ from the actual number and sizes of the nozzles N, ejection elements 15, etc.

[0051] The head unit 10 is supported by a carriage 42 and moves to a position facing the cleaning liquid ejecting unit 70. The head unit 10 includes a nozzle plate 11, a head cover 13, a vibration plate 14, ejection elements 15, and a liquid flow path 17.

[0052] The nozzle plate 11 is provided with a plurality of nozzles N. The plurality of nozzles N are arranged parallel or approximately parallel to the Y axis to form a nozzle row 12. Of the plurality of nozzles N that form the nozzle row 12, one nozzle N and a nozzle N adjacent to the first nozzle N are arranged at a first nozzle interval. The nozzle N adjacent to the first nozzle N corresponds to an example of a second ink nozzle. The first nozzle interval corresponds to an example of a nozzle interval. The nozzle surface 11a of the nozzle plate 11 is the surface of the nozzle plate 11 in the -Z direction, and faces the cleaning liquid ejection unit 70.

[0053] 2 shows the first nozzle row 12a, which is one of the nozzle rows 12. The second nozzle row 12b, the third nozzle row 12c, and the fourth nozzle row 12d have the same configuration as the first nozzle row 12a.

[0054] The head cover 13 has a contact surface 13c that covers a portion of the nozzle surface 11a of the nozzle plate 11. The contact surface 13c is a protruding surface that protrudes in the -Z direction beyond the nozzle surface 11a. The contact surface 13c comes into contact with the cover 75 and the like.

[0055] The diaphragm 14 supports the ejection elements 15. The diaphragm 14 is disposed at a position in the +Z direction of the nozzle plate 11. The diaphragm 14 vibrates in response to the driving of the ejection elements 15. The diaphragm 14 transmits the vibration to the ink Li, causing the ink Li to be ejected from the nozzle N.

[0056] The ejection element 15 ejects the ink Li from the nozzle N. The ejection element 15 vibrates the vibration plate 14. By vibrating the vibration plate 14, the ejection element 15 ejects the ink Li filled in the liquid flow path 17 from the nozzle N. The ejection element 15 is made of a piezoelectric body. The ejection element 15 is provided corresponding to the nozzle N. The ejection element 15 corresponds to an example of a piezoelectric element.

[0057] The liquid flow path 17 is a path through which the ink Li flows. The liquid flow path 17 is filled with the ink Li. The liquid flow path 17 and the nozzle N are in communication with each other. The ink Li flowing through the liquid flow path 17 is ejected from the nozzle N. The liquid flow path 17 is a space surrounded by the nozzle plate 11 and the vibration plate 14. The liquid flow path 17 corresponds to an example of a cavity.

[0058] The cleaning liquid spraying unit 70 includes a cleaning nozzle plate 71 , a cleaning nozzle 72 , a cleaning liquid tube 73 , a pressure pump 74 , a cover 75 , a cover holding unit 76 , a cover moving unit 77 , a sealing member 78 , a support table 81 , an auxiliary table 82 , and a slide mechanism 83 .

[0059] The cleaning nozzle plate 71 has cleaning nozzles 72. The cleaning nozzle plate 71 corresponds to an example of a table. The cleaning nozzle plate 71 has one or more cleaning nozzles 72. The cleaning nozzle plate 71 shown in Figures 1 and 2 has one cleaning nozzle 72. The cleaning nozzle plate 71 has an ejection surface 71c on which the cleaning nozzles 72 are provided. The ejection surface 71c faces the nozzle surface 11a on which the nozzles N are provided. The ejection surface 71c corresponds to an example of an opposing surface.

[0060] The cleaning nozzle 72 sprays the cleaning liquid Lc. The cleaning nozzle 72 corresponds to an example of a spray nozzle. When the cleaning nozzle 72 sprays the cleaning liquid Lc under predetermined spray conditions, the cleaning liquid Lc turns into droplets due to the surface tension of the cleaning liquid Lc. The cleaning liquid Lc sprayed from the cleaning nozzle 72 lands in the form of droplets on the nozzle surface 11a or the nozzle N. The cleaning ability of the cleaning liquid Lc is improved by the cleaning liquid Lc landing in the form of droplets.

[0061] The spraying conditions for the cleaning liquid Lc include the shape of the cleaning nozzle 72, the distance between the nozzle N and the cleaning nozzle 72, the spray pressure, etc. The cleaning nozzle 72 is preferably a circular nozzle with a diameter 0.5 to 3 times the diameter of the nozzle N. The cleaning nozzle 72 is preferably positioned so that the distance along the Z axis between the cleaning nozzle 72 and the nozzle surface 11a is within a range of several mm. The spraying pressure of the cleaning nozzle 72 is preferably 1 MPa to 10 MPa. By adjusting a plurality of spraying conditions, the cleaning liquid Lc lands in the form of droplets on the nozzle surface 11a or the nozzle N.

[0062] The cleaning liquid Lc preferably has the same main solvent as the ink Li. When the ink Li is a water-based ink whose main solvent is water, pure water is used for the cleaning liquid Lc. When the ink Li is a solvent ink whose main solvent is an organic solvent, the organic solvent that is the main solvent of the ink Li is used for the cleaning liquid Lc. The cleaning liquid Lc may contain additives such as preservatives.

[0063] The cleaning liquid tube 73 is connected to the cleaning liquid supply source 98 and the cleaning nozzle plate 71. The cleaning liquid tube 73 causes the cleaning liquid Lc stored in the cleaning liquid supply source 98 to flow toward the cleaning nozzle 72.

[0064] The pressure pump 74 adjusts the pressure of the cleaning liquid Lc supplied to the cleaning nozzle 72. The pressure pump 74 is provided in the cleaning liquid tube 73. The pressure of the cleaning liquid Lc supplied to the cleaning nozzle 72 is adjusted by driving the pressure pump 74. The pressure pump 74 adjusts the pressure of the cleaning liquid Lc to a range of 1 MPa or more and 10 MPa or less.

[0065] The cover 75 prevents the cleaning liquid Lc from scattering when the cleaning nozzle 72 sprays the cleaning liquid Lc. The cover 75 has a lip surface 75c at the end in the +Z direction. The lip surface 75c comes into contact with the contacted surface 13c of the head unit 10, thereby forming an internal space 75a, which is a closed space. The cover 75 is made of an elastic material such as rubber.

[0066] A waste liquid tube 56 is connected to the cover 75. The cleaning liquid Lc sprayed into the internal space 75a of the cover 75 is discharged into the waste liquid tube 56. The cleaning liquid Lc discharged into the waste liquid tube 56 is collected in the waste liquid collection unit 58. The cover 75 shown in FIG. 2 is connected to the waste liquid tube 56 at the center of the surface in the -Z direction, but this is not limited to this. The connection position between the cover 75 and the waste liquid tube 56 is set as appropriate.

[0067] The cover holding portion 76 holds the cover 75. The cover holding portion 76 shown in FIG. 2 holds the cover 75 via a cover coil spring 76s. When the cover 75 comes into contact with the head unit 10, the cover 75 is pressed against the head unit 10 by the cover coil spring 76s. The cover holding portion 76 may hold a support table 81 and an auxiliary table 82.

[0068] The cover moving unit 77 moves the cover holding unit 76 along the Z axis. The cover moving unit 77 moves the cover holding unit 76 along the Z axis, thereby moving the cover 75 along the Z axis. When the cover moving unit 77 moves the cover holding unit 76 in the +Z direction, the lip surface 75c of the cover 75 comes into contact with the head unit 10.

[0069] The cover moving unit 77 moves the cover holding unit 76 along the X-axis and Y-axis. The cover holding unit 76 holds the support table 81 and the auxiliary table 82. The cover moving unit 77 moves the cover holding unit 76 along the X-axis and Y-axis, thereby moving the cleaning nozzle plate 71 along the X-axis and Y-axis.

[0070] The sealing member 78 seals the joint between the cleaning liquid tube 73 and the cover 75. The cleaning liquid tube 73 is inserted through an opening in the cover 75. The sealing member 78 is provided between the cleaning liquid tube 73 and the cover 75 at the position of the opening of the cover 75.

[0071] The support table 81 slidably supports the cleaning nozzle plate 71. The support table 81 is disposed within the internal space 75a formed by the cover 75. The support table 81 is disposed at a position on the -Z direction side of the cleaning nozzle plate 71. The support table 81 includes a first support member 81a and a second support member 81b.

[0072] The first support member 81a is configured to be slidable along the X axis. As the first support member 81a slides along the X axis, the cleaning nozzle plate 71 moves along the X axis. When the cleaning nozzle plate 71 moves along the X axis, the cleaning nozzle 72 moves along the X axis. The cleaning nozzle 72 moves along the X axis relative to the nozzle N of the head unit 10 that faces the cleaning liquid spraying unit 70.

[0073] The second support member 81b is configured to be slidable along the Y axis. As the second support member 81b slides along the Y axis, the cleaning nozzle plate 71 moves along the Y axis. When the cleaning nozzle plate 71 moves along the Y axis, the cleaning nozzle 72 moves along the Y axis. The cleaning nozzle 72 moves along the Y axis relative to the nozzle N of the head unit 10 that faces the cleaning liquid spraying unit 70.

[0074] The auxiliary table 82 supports the cleaning nozzle plate 71. The auxiliary table 82 is disposed within the internal space 75a formed by the cover 75. The auxiliary table 82 is disposed at a position in the -Z direction of the cleaning nozzle plate 71. When the support table 81 slides the cleaning nozzle plate 71, the auxiliary table 82 slidably supports the cleaning nozzle plate 71. The cleaning liquid spraying unit 70 shown in FIG. 2 includes the auxiliary table 82, but it does not necessarily have to include it.

[0075] The slide mechanism 83 slides the support table 81 within a plane parallel to the nozzle surface 11a. The slide mechanism 83 slides the cleaning nozzle plate 71 by sliding the support table 81. The slide mechanism 83 slides the cleaning nozzle plate 71 within a plane parallel to the nozzle surface 11a. As an example, the slide mechanism 83 slides the cleaning nozzle plate 71 along the X-axis and Y-axis. The X-axis and Y-axis correspond to examples of a first axis and a second axis, respectively. When the slide mechanism 83 slides the cleaning nozzle plate 71, the cleaning nozzle 72 moves relative to the nozzle N. The slide mechanism 83 moves the relative positions of the nozzle N and the cleaning nozzle 72 within the nozzle surface 11a. The slide mechanism 83 moves the cleaning nozzle 72 within a partial area of ​​the nozzle surface 11a. As an example, the partial area of ​​the nozzle surface 11a is an area including several nozzles N. The slide mechanism 83 corresponds to an example of a moving unit. The slide mechanism 83 includes a first vibration motor 83a and a second vibration motor 83b.

[0076] The first vibration motor 83a slides the first support member 81a along the X-axis. The first vibration motor 83a uses vibration as a driving force to slide the first support member 81a. The first vibration motor 83a slides the first support member 81a, thereby sliding the cleaning nozzle plate 71. When the cleaning nozzle plate 71 slides, the cleaning nozzle 72 moves along the X-axis.

[0077] The second vibration motor 83b slides the second support member 81b along the Y axis. The second vibration motor 83b uses vibration as a driving force to slide the second support member 81b. The second vibration motor 83b slides the cleaning nozzle plate 71 by sliding the second support member 81b. When the cleaning nozzle plate 71 slides, the cleaning nozzle 72 moves along the Y axis.

[0078] The cleaning nozzle 72 can be moved along the X-axis and Y-axis in the XY plane by a slide mechanism 83 including a first vibration motor 83a and a second vibration motor 83b. The slide mechanism 83 can adjust the spray position of the cleaning liquid Lc sprayed from the cleaning nozzle 72 with respect to the nozzle surface 11a.

[0079] The slide mechanism 83 shown in FIG. 2 includes a first vibration motor 83a and a second vibration motor 83b, but is not limited to this. The slide mechanism 83 may have any configuration as long as it is capable of moving the cleaning nozzle 72. The slide mechanism 83 is configured to be capable of moving the cleaning nozzle 72 along the X-axis and Y-axis, but is not limited to this. The slide mechanism 83 may rotate the cleaning nozzle plate 71 around a rotation axis parallel to the Z-axis. The cleaning nozzle 72 rotates around a rotation axis parallel to the Z-axis.

[0080] Fig. 3 shows a schematic configuration of the head unit 10 and the cleaning liquid jetting unit 70. Fig. 3 shows a schematic configuration of the cleaning liquid jetting unit 70 when the head unit 10 has moved to a position facing the cleaning liquid jetting unit 70. Fig. 3 shows an XZ cross section of the head unit 10 and the cleaning liquid jetting unit 70. Fig. 3 shows an enlarged view of the nozzles N, ejection elements 15, etc. in the head unit 10. The sizes of the nozzles N, ejection elements 15, etc. shown in Fig. 3 differ from the actual sizes of the nozzles N, ejection elements 15, etc.

[0081] The head unit 10 shown in FIG. 3 has four nozzles N arranged along the X axis. The four nozzles N are respectively included in a first nozzle row 12a, a second nozzle row 12b, a third nozzle row 12c, and a fourth nozzle row 12d. The interval between a nozzle N included in a first nozzle row 12 and a nozzle N adjacent to the first nozzle N along the X axis is set to a second nozzle interval. The nozzle N adjacent to the first nozzle N is included in a different nozzle row 12 from the first nozzle N. The second nozzle interval is set wider than the first nozzle interval along the Y axis between each nozzle N included in the nozzle row 12. The second nozzle interval corresponds to an example of a nozzle interval.

[0082] The positions of the nozzle N and the cleaning nozzle 72 included in each nozzle row 12 are adjusted by moving the nozzle N and the cleaning nozzle 72. As an example, the nozzle N is moved by moving the carriage 42, and the position of the nozzle N along the X axis relative to the cleaning nozzle 72 is adjusted. The cover moving unit 77 may be configured to be movable along the X axis and the Y axis. The positions of the nozzle N and the cleaning nozzle 72 are adjusted by moving the cover moving unit 77. The adjustment of the positions of the nozzle N and the cleaning nozzle 72 by moving the carriage 42 or the cover moving unit 77 is a coarser adjustment than the adjustment of the positions of the nozzle N and the cleaning nozzle 72 by moving the slide mechanism 83.

[0083] The positions of the nozzle N and the cleaning nozzle 72 are adjusted by the carriage 42 and the cover moving unit 77 to within a range that includes several nozzles N, including the predetermined nozzle N. After the positions of the nozzle N and the cleaning nozzle 72 are adjusted by the carriage 42 and the cover moving unit 77, the relative positions of the nozzle N and the cleaning nozzle 72 are finely adjusted by the slide mechanism 83. By finely adjusting the relative positions of the nozzle N and the cleaning nozzle 72, the slide mechanism 83 adjusts the position of the cleaning nozzle 72 to a position where the predetermined nozzle N and the cleaning nozzle 72 face each other.

[0084] 4 shows a block configuration of the printer 1. The printer 1 includes a head unit 10, a maintenance section 50, a control unit 110, a storage unit 120, and a communication interface .

[0085] The head unit 10 has a waveform detection circuit 19. The waveform detection circuit 19 detects vibrations that occur in the ejection elements 15. The waveform detection circuit 19 detects a residual waveform when the ejection elements 15 are driven based on a predetermined drive signal. The residual waveform is a waveform that is superimposed on a signal waveform based on the predetermined drive signal. The waveform detection circuit 19 detects, as a vibration waveform, vibrations that occur when the cleaning liquid Lc lands on the nozzles N. The waveform detection circuit 19 corresponds to an example of a detection unit.

[0086] The waveform detection circuit 19 detects the residual waveform when the ejection elements 15 for each nozzle N are driven based on a predetermined drive signal. The residual waveform changes depending on the malfunction status of the nozzle N, such as clogging. By acquiring the residual waveform of each nozzle N, the control unit 110 can determine the presence or absence of a malfunction in each nozzle N, the type of malfunction, etc. Examples of types of malfunction include the presence or absence of aggregates in the ink Li filled in the liquid flow path 17, and the presence or absence of deposits adhering to the nozzle plate 11 that forms the nozzle N.

[0087] The waveform detection circuit 19 detects, as a vibration waveform, vibrations caused by the cleaning liquid Lc landing on a specific nozzle N. The specific nozzle N is a nozzle N determined to be defective by detecting the residual waveform. The vibration waveform varies depending on the positional relationship between the position of the specific nozzle N and the landing position of the cleaning liquid Lc when the cleaning liquid Lc sprayed from the cleaning nozzle 72 lands on the nozzle N or the nozzle surface 11a. For example, the cleaning liquid Lc lands at the center position of the nozzle N's hole, the edge position of the nozzle N's hole, or a position spaced apart from the nozzle N's hole. A first vibration waveform when the cleaning liquid Lc lands at the center position, a second vibration waveform when the cleaning liquid Lc lands at the edge position, and a third vibration waveform when the cleaning liquid Lc lands at a position spaced apart are all different. The first vibration waveform, second vibration waveform, and third vibration waveform are examples of vibration waveforms. By acquiring the vibration waveform of the specific nozzle N, the control unit 110 can determine the positional relationship between the position of the specific nozzle N and the landing position of the cleaning liquid Lc.

[0088] The maintenance unit 50 is provided with a cleaning liquid spray unit 70. The cleaning liquid spray unit 70 has a position sensor 85. The position sensor 85 detects the position of the cleaning nozzle 72. As an example, the position sensor 85 detects the position of the cleaning nozzle plate 71. The position sensor 85 detects the position of the cleaning nozzle 72 based on the position of the cleaning nozzle plate 71. The position sensor 85 may detect the amount of movement of the cleaning nozzle plate 71 by the slide mechanism 83. The position sensor 85 detects the position of the cleaning nozzle 72 based on the amount of movement of the cleaning nozzle plate 71. The position sensor 85 is composed of the position sensor 85, an optical sensor, an encoder, etc.

[0089] The control unit 110 is a controller that controls the printer 1. As an example, the control unit 110 is a processor having a CPU (Central Processing Unit). The control unit 110 is composed of one or more processors. The control unit 110 corresponds to an example of a control unit. By executing firmware, the control unit 110 functions as a head drive control unit 111, a maintenance control unit 113, and a transport control unit 115. By executing firmware, the control unit 110 may function as a functional unit other than the head drive control unit 111, the maintenance control unit 113, and the transport control unit 115.

[0090] The head drive control unit 111 controls the driving of the head unit 10 and the drive roller 46. The head drive control unit 111 controls the driving of the head unit 10 and the drive roller 46 based on print data acquired via the communication interface 130. The head drive control unit 111 controls the ejection elements 15 of the head unit 10 based on the print data to eject ink Li onto the medium P. The head drive control unit 111 controls the driving of the drive roller 46 based on the print data to move the carriage 42 along the X axis. The head drive control unit 111 ejects ink Li onto the medium P while moving the carriage 42 along the X axis over the medium P. The head drive control unit 111 ejects ink Li onto the medium P, causing the printer 1 to print on the medium P.

[0091] The head drive control unit 111 outputs a predetermined drive signal to the ejection elements 15 for each nozzle N, driving the ejection elements 15. The head drive control unit 111 causes the waveform detection circuit 19 to detect vibrations that occur when the ejection elements 15 are driven. The head drive control unit 111 causes the waveform detection circuit 19 to detect a residual waveform included in the signal waveform. The head drive control unit 111 causes the waveform detection circuit 19 to output the residual waveform detected by the waveform detection circuit 19 to the control unit 110. The head drive control unit 111 acquires the residual waveform. Based on the residual waveform, the head drive control unit 111 determines which nozzle N has a malfunction and the type of malfunction of the nozzle N. The head drive control unit 111 generates nozzle information that indicates the address of the nozzle N where the malfunction has occurred and the type of malfunction of the nozzle N, and stores the information in the storage unit 120. The head drive control unit 111 may output the nozzle information to the maintenance control unit 113.

[0092] The maintenance control unit 113 causes the maintenance unit 50 to perform maintenance on the nozzles N. The maintenance control unit 113 controls the drive roller 46 and the maintenance unit 50. The maintenance control unit 113 controls the cap unit 51, cleaning unit 60, liquid receiving unit 67, and cleaning liquid spraying unit 70 included in the maintenance unit 50 to perform maintenance. The maintenance control unit 113 controls the suction pump 57 and tube switching unit 59 to collect the ink Li, cleaning liquid Lc, etc.

[0093] The maintenance control unit 113 controls the cap unit 51. The maintenance control unit 113 drives the drive roller 46 to move the head unit 10 to a position facing the cap unit 51. The maintenance control unit 113 controls the cap movement unit 54 to move the cap 52 along the Z axis. The maintenance control unit 113 brings the cap 52 into contact with the head unit 10 to form a suction space. The maintenance control unit 113 drives the suction pump 57 while the suction space is formed. The suction pump 57 applies negative pressure to the suction space. The maintenance control unit 113 applies negative pressure to the suction pump 57, thereby applying negative pressure to the ink Li in the liquid flow path 17 via the nozzle N. The ink Li in the liquid flow path 17 is discharged from the nozzle N into the suction space by applying negative pressure. The maintenance control unit 113 discharging the ink Li from the nozzle N to straighten the meniscus formed in the nozzle N.

[0094] The maintenance control unit 113 controls the cleaning unit 60. The maintenance control unit 113 drives the drive roller 46 to move the head unit 10 to a position facing the cleaning unit 60. The maintenance control unit 113 controls the support member moving unit 65 to move the cleaning element 61 in the +Z direction. The maintenance control unit 113 causes the cleaning element 61 to come into contact with adhering matter adhering to the nozzle surface 11a and collect the adhering matter.

[0095] The maintenance control unit 113 controls maintenance at the liquid receiving unit 67. The maintenance control unit 113 drives the drive roller 46 to move the head unit 10 to a position facing the liquid receiving unit 67. The maintenance control unit 113 causes the head unit 10 to perform flushing. Flushing is an operation of discharging ink Li from the nozzles N to the liquid receiving unit 67 by driving the ejection elements 15. The maintenance control unit 113 causes the head unit 10 to perform flushing and discharge the ink Li into the liquid receiving unit 67. The liquid receiving unit 67 stores the discharged ink Li. The maintenance control unit 113 operates the suction pump 57 to cause the ink Li stored in the liquid receiving unit 67 to be collected in the waste liquid collection unit 58.

[0096] The maintenance control unit 113 controls the cleaning liquid spraying unit 70. The maintenance control unit 113 drives the drive roller 46 to move the head unit 10 to a position facing the cleaning liquid spraying unit 70. The maintenance control unit 113 drives the cover moving unit 77 to move the cover 75 in the +Z direction. The maintenance control unit 113 brings the head unit 10 into contact with the lip surface 75c of the cover 75, forming an internal space 75a. The maintenance control unit 113 sprays the cleaning liquid Lc from the cleaning nozzle 72. The maintenance control unit 113 adjusts the spray pressure when spraying the cleaning liquid Lc, and causes the cleaning liquid Lc to land in droplets on the nozzle surface 11a or the nozzle N.

[0097] The maintenance control unit 113 acquires nozzle information including the address of the nozzle N where a malfunction has occurred and the type of malfunction of the nozzle N. The maintenance control unit 113 reads out the nozzle information stored in the storage unit 120. The maintenance control unit 113 may also acquire nozzle information output from the head drive control unit 111. The maintenance control unit 113 determines the nozzle Nt to be cleaned on which the cleaning liquid Lc will land, based on the address of the nozzle N included in the nozzle information. The maintenance control unit 113 determines the detailed landing position of the cleaning liquid Lc on the nozzle Nt to be cleaned, based on the type of malfunction included in the nozzle information. The detailed landing position is, for example, any of the center position of the hole of the nozzle Nt to be cleaned, the edge position of the hole, and a position spaced apart from the hole.

[0098] When the cleaning nozzle 72 is caused to eject the cleaning liquid Lc, the maintenance control unit 113 causes the waveform detection circuit 19 to detect the vibration of the ejection element 15 corresponding to the nozzle Nt to be cleaned, which is a predetermined nozzle N. The vibration waveform of the vibration detected by the waveform detection circuit 19 varies depending on the positional relationship between the position of the nozzle Nt to be cleaned and the landing position of the cleaning liquid Lc. The maintenance control unit 113 adjusts the landing position of the cleaning liquid Lc relative to the position of the nozzle Nt to be cleaned based on the vibration waveform. The maintenance control unit 113 operates the slide mechanism 83 to move the cleaning nozzle plate 71 having the cleaning nozzle 72. The maintenance control unit 113 moves the cleaning nozzle 72 to a position where the cleaning liquid Lc will land on the nozzle Nt to be cleaned. The maintenance control unit 113 causes the cleaning liquid Lc to land at any one of the center position of the hole of the nozzle Nt to be cleaned, the edge position of the hole, or a position spaced apart from the hole.

[0099] The waveform detection circuit 19 detects the vibration waveform of the ejection element 15 corresponding to the nozzle Nt to be cleaned when the cleaning liquid Lc lands on it. The waveform detection circuit 19 outputs detection data including the vibration waveform to the control unit 110. The maintenance control unit 113 acquires the detection data. Based on the detection data, the maintenance control unit 113 determines the positional relationship between the nozzle Nt to be cleaned and the cleaning nozzle 72. Based on the determined positional relationship, the maintenance control unit 113 drives the slide mechanism 83. By driving the slide mechanism 83, the maintenance control unit 113 slides the cleaning nozzle plate 71. By sliding the cleaning nozzle plate 71, the maintenance control unit 113 adjusts the landing position of the cleaning liquid Lc sprayed by the cleaning nozzle 72. Based on the vibration of the ejection element 15, the maintenance control unit 113 controls the relative position between the nozzle Nt to be cleaned and the cleaning nozzle 72.

[0100] The maintenance control unit 113 acquires position data indicating the position of the cleaning nozzle plate 71 output from the position sensor 85. Based on the position data and the detection data, the maintenance control unit 113 drives the slide mechanism 83. By driving the slide mechanism 83, the maintenance control unit 113 moves the cleaning nozzle plate 71 along the X-axis and Y-axis.

[0101] For example, when the cleaning nozzle 72 causes the cleaning liquid Lc to land at the center position of the hole of the nozzle Nt to be cleaned, the waveform detection circuit 19 detects a first vibration waveform indicating that the cleaning liquid Lc has landed at the center position. The waveform detection circuit 19 generates detection data indicating that the first vibration waveform has been detected and outputs the detection data to the control unit 110. The maintenance control unit 113 acquires the detection data. Based on the detection data, the maintenance control unit 113 determines that the cleaning liquid Lc has landed at the center position of the hole of the nozzle Nt to be cleaned.

[0102] The maintenance control unit 113 may switch the operation of the cleaning liquid ejection unit 70 between a nozzle cleaning mode and a nozzle surface cleaning mode. The nozzle cleaning mode is a mode in which the cleaning liquid Lc is ejected in droplet form onto the nozzles Nt to be cleaned. The nozzle cleaning mode corresponds to an example of the first mode. The nozzle surface cleaning mode is a mode in which the cleaning liquid Lc is ejected in shower form onto the nozzle surface 11a. The nozzle surface cleaning mode corresponds to an example of the second mode. The ejection pressure when the cleaning liquid Lc is ejected in the nozzle surface cleaning mode is lower than the ejection pressure when the cleaning liquid Lc is ejected in the nozzle cleaning mode. The ejection area when the cleaning liquid Lc is ejected in the nozzle surface cleaning mode is wider than the ejection area when the cleaning liquid Lc is ejected in the nozzle cleaning mode. The cleaning liquid Lc ejected in the nozzle surface cleaning mode is ejected in a liquid flow state onto the nozzle surface 11a. By ejecting the cleaning liquid Lc in the nozzle surface cleaning mode, it is possible to remove deposits adhering to the nozzle surface 11a.

[0103] The transport control unit 115 controls the transport mechanism 30 to transport the medium P. The transport control unit 115 rotates the transport roller 32 to transport the medium P to a position facing the head unit 10. The transport control unit 115 controls the transport direction, transport speed, transport start timing, etc. of the medium P by the transport mechanism 30.

[0104] The storage unit 120 stores various data, firmware, etc. The storage unit 120 stores nozzle information output from the head drive control unit 111. The storage unit 120 stores various maintenance conditions such as the spray pressure of the cleaning nozzle 72. The storage unit 120 is configured with semiconductor memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The storage unit 120 may function as a work area for the control unit 110.

[0105] The communication interface 130 is an interface circuit that connects to an external device for communication. The communication interface 130 connects to the external device via a wired or wireless connection in accordance with a predetermined communication protocol. The communication interface 130 includes a wired connector, a wireless communication port, etc. The wired connector is a USB (Universal Serial Bus) connector, etc. The wireless communication port is a Bluetooth communication port, etc. Bluetooth is a registered trademark. The communication interface 130 receives print data, etc. from the external device. The communication interface 130 sends status information indicating the print results, etc. to the external device.

[0106] FIG. 5 shows a schematic configuration of the head unit 10 and the cleaning liquid ejecting unit 70. FIG. 5 shows the state when the cleaning nozzle 72 ejects the cleaning liquid Lc. As an example, FIG. 5 shows that the nozzle N included in the third nozzle row 12c is the nozzle Nt to be cleaned based on the nozzle information. FIG. 5 shows an XZ cross section of the head unit 10 and the cleaning liquid ejecting unit 70. FIG. 5 shows an enlarged view of the nozzle N, ejection elements 15, etc. in the head unit 10.

[0107] FIG. 5 shows a state when the landing position of the cleaning liquid Lc is not adjusted by the maintenance control unit 113. The maintenance control unit 113 drives the carriage 42 and the cover moving unit 77 in advance to move the cleaning nozzle 72 to a position adjacent to the nozzle Nt to be cleaned. Because the accuracy of the movement position control by the carriage 42 and the cover moving unit 77 is lower than the accuracy of the movement position control by the slide mechanism 83, it is difficult to move the cleaning nozzle 72 to a position adjacent to the nozzle Nt to be cleaned. Furthermore, the landing position of the cleaning liquid Lc sprayed from the cleaning nozzle 72 fluctuates due to air currents and the like. When the maintenance control unit 113 does not adjust the landing position of the cleaning liquid Lc using the slide mechanism 83, the cleaning liquid Lc lands on the nozzle surface 11a or on a nozzle N other than the nozzle N to be cleaned. FIG. 5 shows a case where the cleaning liquid Lc lands on the nozzle surface 11a.

[0108] When the cleaning liquid Lc is sprayed onto the nozzle surface 11a, the waveform detection circuit 19 detects the vibration of the ejection element 15 corresponding to the nozzle Nt to be cleaned. The waveform detection circuit 19 detects the vibration as a vibration waveform and outputs the vibration waveform to the maintenance control unit 113. The maintenance control unit 113 determines the landing position of the cleaning liquid Lc based on the vibration waveform.

[0109] The waveform detection circuit 19 may detect vibrations of the ejection elements 15 corresponding to nozzles N other than the nozzle Nt to be cleaned. As an example, the waveform detection circuit 19 detects, as a vibration waveform, the vibrations of the ejection elements 15 corresponding to the nozzle N adjacent to the nozzle Nt to be cleaned or the ejection elements 15 corresponding to the nozzle N arranged in the vicinity of the nozzle Nt to be cleaned. The waveform detection circuit 19 detects the vibrations of the ejection elements 15 corresponding to one or more nozzles N other than the nozzle Nt to be cleaned. The waveform detection circuit 19 outputs the vibration waveforms of the ejection elements 15 corresponding to each nozzle N to the maintenance control unit 113. The maintenance control unit 113 determines the landing position of the cleaning liquid Lc based on each vibration waveform.

[0110] FIG. 6 shows a schematic configuration of the head unit 10 and the cleaning liquid ejecting unit 70. FIG. 6 shows the state when the cleaning nozzle 72 ejects the cleaning liquid Lc. As an example, FIG. 6 shows that the nozzle N included in the third nozzle row 12c is the nozzle Nt to be cleaned based on the nozzle information. FIG. 6 shows an XZ cross section of the head unit 10 and the cleaning liquid ejecting unit 70. FIG. 6 shows an enlarged view of the nozzle N, ejection elements 15, etc. in the head unit 10.

[0111] FIG. 6 shows a state where the landing position of the cleaning liquid Lc is adjusted by the maintenance control unit 113. The maintenance control unit 113 controls the slide mechanism 83 to move the cleaning nozzle plate 71 along the X-axis and Y-axis. Before driving the slide mechanism 83, the maintenance control unit 113 determines the landing position of the cleaning liquid Lc based on the vibration waveform of the ejection elements 15, etc., corresponding to the nozzle Nt to be cleaned. The maintenance control unit 113 calculates movement information including the movement direction and movement distance of the cleaning nozzle 72 from the determined landing position of the cleaning liquid Lc. The maintenance control unit 113 controls the slide mechanism 83 based on the movement information. The slide mechanism 83 slides the cleaning nozzle plate 71 along the X-axis and Y-axis according to the movement direction and movement distance included in the movement information. The sliding movement of the cleaning nozzle plate 71 slides the cleaning nozzle 72. The landing position of the cleaning liquid Lc is displaced in response to the sliding movement of the cleaning nozzle 72.

[0112] When the slide mechanism 83 slides the cleaning nozzle plate 71, the waveform detection circuit 19 detects the vibration of the ejection elements 15 corresponding to the nozzles Nt to be cleaned as a vibration waveform. The waveform detection circuit 19 detects the vibration as a vibration waveform at a predetermined timing. The waveform detection circuit 19 may detect the vibration of the ejection elements 15 corresponding to the nozzles Nt to be cleaned as a vibration waveform after the slide mechanism 83 slides the cleaning nozzle plate 71 based on the movement information. The waveform detection circuit 19 outputs the detected vibration waveform to the maintenance control unit 113. The maintenance control unit 113 acquires the detected vibration waveform.

[0113] The maintenance control unit 113 determines the landing position of the cleaning liquid Lc based on the vibration waveform. If the maintenance control unit 113 identifies the detected vibration waveform as a first vibration waveform, it determines that the landing position of the cleaning liquid Lc is the center position of the hole of the nozzle Nt to be cleaned. If the maintenance control unit 113 identifies the detected vibration waveform as a second vibration waveform, it determines that the landing position of the cleaning liquid Lc is the edge position of the hole of the nozzle Nt to be cleaned. The maintenance control unit 113 determines the landing position of the cleaning liquid Lc to be the center position or the edge position depending on the type of malfunction included in the nozzle information. The maintenance control unit 113 controls the slide mechanism 83 to stop the cleaning nozzle plate 71 at a position where the landing position of the cleaning liquid Lc is the center position or the edge position. The maintenance control unit 113 causes the cleaning nozzle 72 to spray the cleaning liquid Lc for a predetermined time so that the cleaning liquid Lc lands at the center position or the edge position.

[0114] The maintenance control unit 113 sprays the cleaning liquid Lc onto the cleaning nozzle 72 for a predetermined time, and then stops spraying the cleaning liquid Lc. After the maintenance control unit 113 stops spraying the cleaning liquid Lc, the head drive control unit 111 drives the ejection elements 15 corresponding to the nozzle Nt to be cleaned with a predetermined drive signal. The waveform detection circuit 19 detects a residual waveform contained in the vibration of the ejection elements 15 driven with the predetermined drive signal. The waveform detection circuit 19 outputs the detected residual waveform to the control unit 110. The head drive control unit 111 determines whether or not a malfunction has occurred in the nozzle Nt to be cleaned based on the detected residual waveform. If the head drive control unit 111 determines that no malfunction has occurred in the nozzle Nt to be cleaned, it outputs target nozzle information indicating that the nozzle Nt to be cleaned is normal to the maintenance control unit 113. The maintenance control unit 113 stops the maintenance operation for the nozzle Nt to be cleaned based on the target nozzle information.

[0115] The maintenance control unit 113 may eject the cleaning liquid Lc from the cleaning nozzle 72 for a predetermined time, and then adjust the landing position of the cleaning liquid Lc to a spaced position away from the hole of the nozzle Nt to be cleaned. The maintenance control unit 113 ejects the cleaning liquid Lc from the cleaning nozzle 72 for a predetermined time, and then moves the landing position of the cleaning liquid Lc to the spaced position. The maintenance control unit 113 causes the cleaning liquid Lc to land at the spaced position. The maintenance control unit 113 causes the cleaning liquid Lc to land on the nozzle surface 11a corresponding to the spaced position, thereby cleaning the nozzle surface 11a. The maintenance control unit 113 prevents the cleaning liquid Lc from landing on the nozzle Nt to be cleaned for more than a predetermined time.

[0116] The printer 1 includes a head unit 10 that includes a liquid flow path 17 filled with ink Li, a nozzle N communicating with the liquid flow path 17, a nozzle surface 11a in which the nozzle N is formed, and an ejection element 15 that ejects the ink Li from the ink N, and that performs printing on a medium P by ejecting the ink Li; a cleaning liquid ejection unit 70 that has a cleaning nozzle 72 that ejects cleaning liquid Li and causes the cleaning liquid Lc ejected from the cleaning nozzle 72 to land in droplets on the nozzle N; a slide mechanism 83 that moves the relative position of the nozzle N and the cleaning nozzle 72 within a partial area of ​​the nozzle surface 11a; a control unit 110 that controls the cleaning liquid ejection unit 70 and the slide mechanism 83; and a waveform detection circuit 19 that detects vibrations that occur in the ejection element 15 when the cleaning liquid Lc lands on the nozzle N. The control unit 110 controls the relative position based on the vibrations detected by the waveform detection circuit 19. The printer 1 can adjust the landing position of the cleaning liquid Lc in droplet form on the nozzles Nt to be cleaned by using the slide mechanism 83 to control the landing position of the cleaning liquid Lc.

[0117] The control unit 110 controls the relative position based on the vibration detected by the waveform detection circuit 19, thereby adjusting the landing position of the cleaning liquid Lc to either the center position of the hole of the nozzle N, the end position of the hole of the nozzle N, or a position further away from the hole than the end position. The printer 1 can adjust the landing position of the cleaning liquid Lc depending on the type of malfunction in the nozzle N.

[0118] The cleaning liquid spraying unit 70 includes a cleaning nozzle plate 71 having cleaning nozzles 72. The slide mechanism 83 moves the cleaning nozzle plate 71 along an X axis parallel to the nozzle surface 11a and a Y axis parallel to the nozzle surface 11a and perpendicular to the X axis. The printer 1 is able to precisely adjust the landing position of the cleaning liquid Lc within a partial area of ​​the nozzle surface 11a.

[0119] The control unit 110 drives the cleaning liquid jetting unit 70 in a nozzle cleaning mode in which the cleaning liquid Lc jetted from the cleaning nozzle 72 hits the nozzle N, or in a nozzle surface cleaning mode in which the cleaning liquid Lc jetted from the cleaning nozzle 72 is jetted onto the nozzle surface 11a. The printer 1 can switch between performing maintenance on the nozzles N and maintenance on the nozzle surface 11a as needed.

[0120] The maintenance unit 50 cleans the head unit 10, which has nozzles N that eject ink Li, a nozzle surface 11a in which the nozzles N are formed, and ejection elements 15 that cause the nozzles N to eject the ink Li. The maintenance unit 50 is equipped with a cleaning liquid ejection unit 70 that has a cleaning nozzle 72 that ejects cleaning liquid Lc and causes the cleaning liquid Lc ejected from the cleaning nozzle 72 to land in droplets on the nozzles N, and a slide mechanism 83 that moves the relative position of the nozzle N and the cleaning nozzle 72 within a partial area of ​​the nozzle surface 11a. The slide mechanism 83 adjusts the relative position based on vibrations that occur in the ejection elements 15 when the cleaning liquid Lc lands on the nozzles N. The printer 1 can adjust the landing position of the cleaning liquid Lc in droplet form on the nozzles Nt to be cleaned by using the slide mechanism 83 to control the landing position of the cleaning liquid Lc.

[0121] The maintenance control unit 113 may adjust the relative position of the nozzle to be cleaned Nt and the cleaning nozzle 72 based on the vibration of the ejection elements 15 corresponding to a nozzle N different from the nozzle to be cleaned Nt. As an example, the maintenance control unit 113 may detect the vibration of the ejection elements 15 corresponding to a dummy nozzle as a vibration waveform and adjust the relative position. A dummy nozzle is a nozzle N that is not used for printing and is formed in advance on the nozzle surface 11a. The positional relationship between the dummy nozzle and the other nozzles N is set in advance as position data.

[0122] The maintenance control unit 113 drives the slide mechanism 83 while the cleaning liquid Lc is being sprayed. The maintenance control unit 113 causes the cleaning liquid Lc to land in droplets on the dummy nozzles. The maintenance control unit 113 sets the position of the cleaning nozzle 72 when the cleaning liquid Lc lands on the dummy nozzles as a reference position. The maintenance control unit 113 moves the slide mechanism 83 based on the reference position and position data. The maintenance control unit 113 adjusts the landing position of the cleaning liquid Lc sprayed by the cleaning nozzle 72 based on the detection result by the position sensor 85, the reference position, and the position data.

[0123] FIG. 7 shows a schematic configuration of the cleaning liquid jetting unit 70. FIG. 7 shows a plan view of the cleaning liquid jetting unit 70 from the +Z direction. FIG. 7 shows the cleaning liquid jetting unit 70 equipped with a cleaning nozzle plate 71 having two cleaning nozzles 72. The two cleaning nozzles 72 are a first cleaning nozzle 72a and a second cleaning nozzle 72b. The first cleaning nozzle 72a and the second cleaning nozzle 72b are configured with the same nozzle shape. The second cleaning nozzle 72b corresponds to an example of a second jet nozzle.

[0124] The first cleaning nozzle 72a and the second cleaning nozzle 72b shown in FIG. 7 are arranged along the Y axis. The first cleaning nozzle 72a and the second cleaning nozzle 72b are arranged at a cleaning nozzle interval Dc. The cleaning nozzle interval Dc is set to be the same as the first nozzle interval or an integer multiple of the first nozzle interval. By setting the cleaning nozzle interval Dc to be the same as the first nozzle interval or an integer multiple of the first nozzle interval, the two cleaning nozzles 72 can land the cleaning liquid Lc on the two nozzles N or near the two nozzles N. This improves the maintainability of the nozzles N by spraying the cleaning liquid Lc.

[0125] 7, the first cleaning nozzle 72a and the second cleaning nozzle 72b are arranged along the Y axis, but are not limited to this. The first cleaning nozzle 72a and the second cleaning nozzle 72b may be arranged along the X axis. When the first cleaning nozzle 72a and the second cleaning nozzle 72b are arranged along the X axis, the cleaning nozzle spacing Dc is set to be the same as the second nozzle spacing or an integer multiple of the second nozzle spacing.

[0126] The cleaning nozzle plate 71 may have three or more cleaning nozzles 72. The three or more cleaning nozzles 72 include a first cleaning nozzle 72a. The three or more cleaning nozzles 72 are configured with the same nozzle shape as the first cleaning nozzle 72a. The three or more cleaning nozzles 72 eject the cleaning liquid Lc in droplet form onto the nozzle surface 11a.

[0127] The head unit 10 has a first nozzle N and a nozzle N adjacent to the first nozzle N, and the first nozzle N and the nozzle N adjacent to the first nozzle N are arranged at a first nozzle interval. The cleaning liquid spraying unit 70 has a second cleaning nozzle 72b, and the first cleaning nozzle 72a and the second cleaning nozzle 72b are arranged at a first nozzle interval or an interval that is an integer multiple of the first nozzle interval. The two cleaning nozzles 72 can cause the cleaning liquid Lc to land on the two nozzles N or near the two nozzles N. This improves the maintainability of the nozzles N by spraying the cleaning liquid Lc.

[0128] Fig. 8 shows a schematic configuration of the cleaning liquid spraying unit 70. Fig. 8 shows a plan view of the cleaning liquid spraying unit 70 from the +Z direction. Fig. 8 shows the cleaning liquid spraying unit 70 equipped with a cleaning nozzle plate 71 having multiple cleaning nozzles 72. The cleaning nozzle plate 71 shown in Fig. 8 has one first cleaning nozzle 72a and multiple third cleaning nozzles 72c.

[0129] The first cleaning nozzle 72a is the same as the first cleaning nozzle 72a shown in Fig. 7. The first cleaning nozzle 72a ejects the cleaning liquid Lc in the form of droplets onto the nozzle N or the nozzle surface 11a.

[0130] The third cleaning nozzle 72c sprays the cleaning liquid Lc under different spray conditions than the first cleaning nozzle 72a. The spray conditions include the nozzle shape including the nozzle diameter, the spray pressure, the spray time, etc. The third cleaning nozzle 72c sprays the cleaning liquid Lc in a liquid flow state onto the nozzle surface 11a. As an example, the third cleaning nozzle 72c sprays the cleaning liquid Lc at a spray pressure lower than the spray pressure of the first cleaning nozzle 72a. The nozzle diameter of the third cleaning nozzle 72c may be configured to be larger than the nozzle diameter of the first cleaning nozzle 72a. The third cleaning nozzle 72c is used to clean the nozzle surface 11a.

[0131] The first cleaning nozzle 72a and the third cleaning nozzle 72c may spray the cleaning liquid Lc simultaneously, or may spray the cleaning liquid Lc at different times. It is preferable that the first cleaning nozzle 72a and the third cleaning nozzle 72c spray the cleaning liquid Lc at different times. When operating the cleaning liquid spraying unit 70 in the nozzle cleaning mode, the maintenance control unit 113 causes the first cleaning nozzle 72a to spray the cleaning liquid Lc. When operating the cleaning liquid spraying unit 70 in the nozzle surface cleaning mode, the maintenance control unit 113 causes the third cleaning nozzle 72c to spray the cleaning liquid Lc. By having the first cleaning nozzle 72a and the third cleaning nozzle 72c spray the cleaning liquid Lc at different times, the detection accuracy of the vibration waveform detected by the waveform detection circuit 19 is improved.

[0132] Fig. 9 shows a schematic configuration of the support structure for the cleaning nozzle plate 71. Fig. 9 shows the support structure for the cleaning nozzle plate 71 in a plan view from the -Z direction. Fig. 9 shows a support structure that is different from the support structure for the cleaning nozzle plate 71 shown in Fig. 2. Fig. 9 shows a support table 81 and a slide mechanism 83 as the support structure for the cleaning nozzle plate 71. The support structure for the cleaning nozzle plate 71 shown in Fig. 9 does not include an auxiliary table 82.

[0133] The support table 81 is disposed in the center of the cleaning nozzle plate 71. The support table 81 is disposed at a position in the -Z direction of the cleaning nozzle 72. Similar to the support table 81 shown in FIG. 2, the support table 81 has a first support member 81a and a second support member 81b. The first support member 81a is configured to be movable along the X axis. The second support member 81b is configured to be movable along the Y axis.

[0134] The slide mechanism 83 slides the support table 81 within a plane parallel to the nozzle surface 11a. The slide mechanism 83 slides the cleaning nozzle plate 71 by sliding the support table 81. The slide mechanism 83 slides the cleaning nozzle plate 71 within a plane parallel to the nozzle surface 11a. When the slide mechanism 83 slides the cleaning nozzle plate 71, the cleaning nozzle 72 moves relative to the nozzle N. The slide mechanism 83 moves the relative positions of the nozzle N and the cleaning nozzle 72 within the nozzle surface 11a. The slide mechanism 83 moves the cleaning nozzle 72 within a partial area of ​​the nozzle surface 11a. The slide mechanism 83 includes a first vibration motor 83a and a second vibration motor 83b.

[0135] The first vibration motor 83a slides the first support member 81a along the X-axis. The first vibration motor 83a uses vibration as a driving force to slide the first support member 81a. The first vibration motor 83a slides the cleaning nozzle plate 71 by sliding the first support member 81a. When the cleaning nozzle plate 71 slides, the cleaning nozzle 72 moves along the X-axis. Although the first vibration motor 83a shown in FIG. 9 is disposed in a position on the -Y direction of the first support member 81a, this is not limiting. The first vibration motor 83a may also be disposed in a position on the +Y direction of the first support member 81a.

[0136] The second vibration motor 83b slides the second support member 81b along the Y axis. The second vibration motor 83b uses vibration as a driving force to slide the second support member 81b. The second vibration motor 83b slides the cleaning nozzle plate 71 by sliding the second support member 81b. When the cleaning nozzle plate 71 slides, the cleaning nozzle 72 moves along the Y axis. Although the second vibration motor 83b shown in FIG. 9 is disposed in a position on the +X direction of the second support member 81b, this is not limiting. The second vibration motor 83b may also be disposed in a position on the -X direction of the second support member 81b.

[0137] The cleaning nozzle 72 can be moved along the X-axis and Y-axis in the XY plane by a slide mechanism 83 including a first vibration motor 83a and a second vibration motor 83b. The slide mechanism 83 can adjust the landing position of the cleaning liquid Lc sprayed from the cleaning nozzle 72 on the nozzle surface 11a.

[0138] Fig. 10 shows a schematic configuration of the support structure for the cleaning nozzle plate 71. Fig. 10 shows the support structure for the cleaning nozzle plate 71 in a plan view from the -Z direction. Fig. 10 shows a support structure that is different from the support structure for the cleaning nozzle plate 71 shown in Figs. 2 and 9. Fig. 10 shows a support table 81 and a slide mechanism 83 as the support structure for the cleaning nozzle plate 71. The support structure for the cleaning nozzle plate 71 shown in Fig. 10 does not include an auxiliary table 82.

[0139] The support table 81 is disposed in the center of the cleaning nozzle plate 71. The support table 81 has a first support member 81a and a second support member 81b, similar to the support table 81 shown in FIG.

[0140] The first support member 81a is configured to be movable along the X-axis. The first support member 81a has a side parallel to the X-axis. The first vibration motor 83a comes into contact with the side parallel to the X-axis. The first support member 81a moves along the X-axis by the driving force of the first vibration motor 83a.

[0141] The second support member 81b is configured to be rotatable along a virtual rotation axis CL. The second support member 81b is configured, for example, in a circular shape. The second vibration motor 83b contacts the outer peripheral end of the second support member 81b. The second support member 81b rotates about the virtual rotation axis CL by the driving force of the second vibration motor 83b. The virtual rotation axis CL is a virtual axis that is perpendicular to the ejection surface 71c. The virtual rotation axis CL corresponds to an example of an orthogonal axis.

[0142] The first vibration motor 83a slides the first support member 81a along the X-axis. The first vibration motor 83a uses vibration as a driving force to slide the first support member 81a. The first vibration motor 83a slides the cleaning nozzle plate 71 by sliding the first support member 81a. When the cleaning nozzle plate 71 slides, the cleaning nozzle 72 moves along the X-axis. The first vibration motor 83a shown in FIG. 10 is disposed in the +Y direction of the first support member 81a, but is not limited to this. The first vibration motor 83a may also be disposed in the -Y direction of the first support member 81a.

[0143] The second vibration motor 83b rotates the second support member 81b around the imaginary rotation axis CL. The second vibration motor 83b rotates the second support member 81b using vibration as a driving force. The second vibration motor 83b rotates the cleaning nozzle plate 71 by rotating the second support member 81b. When the cleaning nozzle plate 71 rotates, the cleaning nozzle 72 rotates around the imaginary rotation axis CL. The second vibration motor 83b shown in FIG. 10 is positioned in the -X direction of the second support member 81b, but is not limited to this. The second vibration motor 83b is positioned so as to be able to come into contact with the outer circumferential edge of the second support member 81b.

[0144] The cleaning nozzle 72 can move within the XY plane by a slide mechanism 83 including a first vibration motor 83a and a second vibration motor 83b. The slide mechanism 83 can adjust the landing position of the cleaning liquid Lc sprayed from the cleaning nozzle 72 on the nozzle surface 11a.

[0145] The cleaning liquid jetting unit 70 includes a support table 81 having a cleaning nozzle plate 71. The slide mechanism 83 rotates the cleaning nozzle plate 71 about an imaginary rotation axis CL that is perpendicular to the jetting surface 71c of the cleaning nozzle plate 71 that faces the nozzle surface 11a. The slide mechanism 83 can adjust the landing position of the cleaning liquid Lc sprayed from the cleaning nozzle 72 on the nozzle surface 11a.

[0146] 2 and other figures, the slide mechanism 83 adjusts the relative position between the nozzle N and the cleaning nozzle 72 by sliding the cleaning nozzle 72, but is not limited to this. The slide mechanism 83 may also adjust the relative position between the nozzle N and the cleaning nozzle 72 by sliding the nozzle N. In this case, the slide mechanism 83 is configured to slide the head unit 10. [Explanation of symbols]

[0147] 1...printer, 10...head unit, 11...nozzle plate, 11a...nozzle surface, 12...nozzle row, 12a...first nozzle row, 12b...second nozzle row, 12c...third nozzle row, 12d...fourth nozzle row, 13...head cover, 13c...contact surface, 14...diaphragm, 15...ejection element, 17...liquid flow path, 19...waveform detection circuit, 20...supply unit, 21...liquid supply source, 21a...first liquid supply source, 21b...second liquid supply source, 21c...third liquid supply source, 21d...fourth liquid supply source, 22...injection section, 23...storage chamber, 24...holding section, 25...supply flow path, 25 a...first supply flow path, 25b...second supply flow path, 25c...third supply flow path, 25d...fourth supply flow path, 26...pressure adjustment unit, 26a...first pressure adjustment unit, 26b...second pressure adjustment unit, 26c...third pressure adjustment unit, 26d...fourth pressure adjustment unit, 30...conveying mechanism, 32...conveying roller, 34...conveying rod, 36...conveying motor, 40...moving mechanism, 42...carriage, 44...conveying belt, 46...driving roller, 47...pulley, 50...maintenance unit, 51...cap unit, 52...cap, 53...cap holding unit, 54...cap moving unit, 56...waste tube , 57...suction pump, 58...waste liquid collection section, 59...tube switching section, 60...cleaning section, 61...cleaning body, 62...guide section, 63...mounting section, 64...support member, 65...support member moving section, 67...liquid receiving section, 70...cleaning liquid spray section, 71...cleaning nozzle plate, 71c...spray surface, 72...cleaning nozzle, 72a...first cleaning nozzle, 72b...second cleaning nozzle, 72c...third cleaning nozzle, 73...cleaning liquid tube, 74...pressurizing pump, 75...cover, 75a...internal space, 75c...lip surface, 76...cover holding section, 76s...cover coil spring, 77...cover moving section Moving part, 78...sealing member, 81...support table, 81a...first support member, 81b...second support member, 82...auxiliary table, 83...slide mechanism, 83a...first vibration motor, 83b...second vibration motor, 85...position sensor, 98...cleaning liquid supply source, 110...control unit, 111...head drive control part, 113...maintenance control part, 115...transport control part, 120...memory unit, 130...communication interface, CL...virtual rotation axis, Dc...cleaning nozzle spacing, Lc...cleaning liquid, Li...ink, N...nozzle, Nt...nozzle to be cleaned, P...medium.

Claims

1. a recording unit including a cavity filled with ink, an ink nozzle communicating with the cavity, an ejection surface on which the ink nozzle is formed, and a piezoelectric element that ejects the ink from the ink nozzle, and that performs recording on a medium by ejecting the ink; an ejection unit having an ejection nozzle for ejecting a cleaning liquid, and causing the cleaning liquid ejected from the ejection nozzle to land in droplets on the ink nozzle; a moving unit that moves the relative positions of the ink nozzle and the ejection nozzle within a partial area of ​​the ejection surface; a control unit that controls the ejection unit and the movement unit; a detection unit that detects vibrations that occur in the piezoelectric element when the cleaning liquid lands on the ink nozzle, The control unit controls the relative position based on the vibration detected by the detection unit. Recording device.

2. the control unit controls the relative position based on the vibration detected by the detection unit, thereby adjusting the impact position of the cleaning liquid to one of a center position of the hole of the ink nozzle, an end position of the hole of the ink nozzle, and a spaced position that is farther from the hole than the end position. The recording device according to claim 1 .

3. the ejection unit includes a table having the ejection nozzle; the moving unit moves the table along a first axis parallel to the ejection surface and a second axis parallel to the ejection surface and perpendicular to the first axis; The recording device according to claim 1 .

4. the ejection unit includes a table having the ejection nozzle; the moving unit rotates the table around an orthogonal axis that is orthogonal to a surface of the table that faces the ejection surface. The recording device according to claim 1 .

5. the recording unit has a second ink nozzle adjacent to the ink nozzle, the ink nozzle and the second ink nozzle being arranged at a nozzle interval; The injection unit has a second injection nozzle, the jet nozzle and the second jet nozzle are arranged at the nozzle interval or at an interval that is an integer multiple of the nozzle interval; The recording apparatus according to claim 3 .

6. the control unit drives the ejection unit in a first mode in which the cleaning liquid ejected from the ejection nozzle lands on the ink nozzle, or in a second mode in which the cleaning liquid ejected from the ejection nozzle is ejected onto the ejection surface. The recording device according to claim 1 .

7. 1. A cleaning device for cleaning a recording unit having ink nozzles that eject ink, an ejection surface on which the ink nozzles are formed, and piezoelectric elements that cause the ink nozzles to eject the ink, an ejection unit having an ejection nozzle for ejecting a cleaning liquid, and causing the cleaning liquid ejected from the ejection nozzle to land in droplets on the ink nozzle; a moving unit that moves the relative positions of the ink nozzle and the ejection nozzle within a partial area of ​​the ejection surface, the moving unit moves based on vibrations generated in the piezoelectric element when the cleaning liquid lands on the ink nozzle, and adjusts the relative position. Cleaning equipment.

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