Wiring board and method for manufacturing wiring board

Abstract

To provide a wiring board which can suppress peeling of a wiring layer.SOLUTION: A wiring board 10 has: a core layer 20 having a through hole 21; a magnetic resin 50 filled into the through hole 21; a pad 30A of a wiring layer 30 formed on the upper surface of the magnetic resin 50; and a first wedge part 38 bitten into a core layer 20 from the pad 30A side. The pad 30A has such a structure that a metal film 32A, a metal layer 33A, a metal film 34, and a metal layer 35A are laminated in this order on the upper surface of the magnetic resin 50. The first wedge part 38 is continuously and integrally formed with the metal film 32A. The first wedge part 38 extends toward the core layer 20 from the metal film 32A.SELECTED DRAWING: Figure 2

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