Cutting chip collection system and cutting chip collection method

Abstract

To provide a cutting chip collection system capable of efficiently moving cutting chips of a tape member in a duct to an exit of the duct.SOLUTION: A cutting chip collection system 1 comprises: a sub duct 32 for receiving cutting chips of a tape member; a main duct 31 that is connected with the sub duct and has a first opening in communication with the sub duct; a first cutting chip transportation unit for moving the cutting chips in the sub duct to the main duct using air; a second cutting chip transportation unit for moving the cutting chips moved from the sub duct into the main duct through the first opening to an exit of the main duct using air; a first sensor for detecting residence of cutting chips at a first portion on the downstream side of the first cutting chip transportation unit in the sub duct; a second sensor for detecting residence of cutting chips at a second portion on the downstream side of the second cutting chip transportation unit in the main duct; and a control unit 62 for controlling operation of the first cutting chip transportation unit and the second cutting chip transportation unit on the basis of detection results of the first sensor and the second sensor.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a chip collection system and a chip collection method for collecting chips of a tape member discharged from a tape feeder. [Background technology]

[0002] BACKGROUND ART Conventionally, in a component mounting device that mounts components on a board, a chip recovery system is known that automatically recovers chips of a tape member discharged from a tape feeder serving as a component supply unit (for example, Patent Document 1 listed below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 131165 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a chip collection system that can efficiently move chips of a tape member in a duct to the outlet of the duct. [Means for solving the problem]

[0005] A chip collection system according to one embodiment of the present disclosure includes a sub-duct that receives chips of a tape material discharged from a tape feeder provided in a component mounting device; a main duct to which the sub-duct is connected and having a first opening that communicates with the sub-duct; a first chip transport unit installed in the sub-duct that moves the chips in the sub-duct to the main duct by air; a second chip transport unit that moves the chips moved from the sub-duct into the main duct through the first opening to an outlet of the main duct by air; a first sensor that detects the accumulation of chips in the sub-duct at a first location downstream of the first chip transport unit; a second sensor that detects the accumulation of chips in the main duct at a second location downstream of the second chip transport unit; and a control unit that controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor.

[0006] A chip collection method according to one subject of the present disclosure is a chip collection method carried out by a chip collection system including: a sub-duct that receives chips of a tape material discharged from a tape feeder provided in a component mounting device; a main duct to which the sub-duct is connected and which has a first opening that communicates with the sub-duct; a first chip transport unit installed in the sub-duct that moves the chips in the sub-duct to the main duct by air; and a second chip transport unit that moves the chips moved from the sub-duct into the main duct through the first opening to an outlet of the main duct by air, wherein the method obtains a detection result from a first sensor that detects the accumulation of chips in a first portion of the sub-duct downstream of the first chip transport unit and a detection result from a second sensor that detects the accumulation of chips in a second portion of the main duct downstream of the second chip transport unit, and controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor. [Effects of the Invention]

[0007] The chip collection device of the present disclosure provides a chip collection system that can efficiently move chips of the tape member inside the duct to the outlet of the duct. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a chip recovery system according to an embodiment together with a work line of a component mounting device. [Figure 2] FIG. 2 is a side view of the component mounting device according to the embodiment. [Figure 3] FIG. 3 is a cross-sectional view of a part of the component mounting device and a part of the chip recovery system according to the embodiment. [Figure 4] FIG. 4 is a perspective view of the chip collection system according to the embodiment. [Figure 5A] FIG. 5A is a diagram showing an example of a schematic plan view of a chip collection system according to an embodiment. [Figure 5B] FIG. 5B is an enlarged view of a portion of FIG. 5A. [Figure 6] FIG. 6 is a cross-sectional view illustrating a first example of the shutter and its peripheral configuration according to the present embodiment. [Figure 7] FIG. 7 is a cross-sectional view illustrating a first example of the configuration of the shutter and its surroundings according to the present embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] FIG. 10 is a cross-sectional view illustrating a second example of the shutter and its peripheral configuration according to the present embodiment. [Figure 11] FIG. 11 is a cross-sectional view illustrating a second example of the shutter and its peripheral configuration according to the present embodiment. [Figure 12] FIG. 12 is a cross-sectional view illustrating a third example of the shutter and its peripheral configuration according to the present embodiment. [Figure 13]FIG. 13 is a cross-sectional view illustrating a third example of the shutter and its peripheral configuration according to the present embodiment. [Figure 14] FIG. 14 is a cross-sectional view illustrating a third example of the shutter and its peripheral configuration according to the present embodiment. [Figure 15] FIG. 15 is a cross-sectional view illustrating a fourth example of the shutter and its peripheral configuration according to the present embodiment. [Figure 16] FIG. 16 is a cross-sectional view illustrating a fourth example of the shutter and its peripheral configuration according to the present embodiment. [Figure 17] FIG. 17 is a cross-sectional view for explaining another example of the shutter and its peripheral configuration according to the present embodiment. [Figure 18] FIG. 18 is a perspective view for explaining the configuration of the recovery unit according to this embodiment. [Figure 19] FIG. 19 is a cross-sectional view for explaining the configuration of the recovery unit according to this embodiment. [Figure 20] FIG. 20 is a perspective view for explaining the configuration of the cover member. [Figure 21] FIG. 21 is a diagram showing an example of a control unit and a valve to be controlled by the control unit in the embodiment. [Figure 22] FIG. 22 is a diagram showing an example of a control unit and its controlled objects when the shutter and its peripheral configuration are the second example in this embodiment. [Figure 23] FIG. 23 is a diagram showing an example of a control unit and its controlled object when the shutter and its peripheral configuration are the third example in this embodiment. [Figure 24] FIG. 24 is a flowchart showing a first example of a chip collection method of the chip collection system according to the present embodiment. [Figure 25] FIG. 25 is a diagram for explaining a first example of the operation of the chip collection system according to the embodiment. [Figure 26] FIG. 26 is a diagram for explaining a second example of the operation of the chip collection system according to the embodiment. [Figure 27]FIG. 27 is a diagram for explaining a third example of the operation of the chip collection system according to the present embodiment. [Figure 28] 28 is a flowchart showing an example of a chip collection method using the chip collection system according to this embodiment. [Figure 29] FIG. 29 is a cross-sectional view illustrating the configuration of the collection section when the blower is used as an air blower. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Findings that formed the basis of this disclosure) In Patent Document 1, scraps of the tape material cut by the tape cutter fall under their own weight and are received in a sub-duct (receiving section), and then moved to a main duct (recovery path) by air blown out from an air blower installed in the sub-duct, and then sent to the air outlet side of the main duct by air discharged from an air blower installed in the main duct.

[0010] In the conventional chip collection system described above, one air blower is provided on the most upstream side of the main duct, and the chip collection system is configured to blow air from the air blower with a large discharge force, sending the chips in the main duct all the way to the air outlet.

[0011] However, if more than a certain amount of chips accumulate in the chip receiving portion of the main duct, it becomes difficult to move the accumulated chips using the air blower, making it difficult to move the chips efficiently.

[0012] A chip collection system according to a first aspect of the present disclosure includes a sub-duct that receives chips of a tape material discharged from a tape feeder provided in a component mounting device; a main duct to which the sub-duct is connected and having a first opening that communicates with the sub-duct; a first chip transport unit installed in the sub-duct that moves the chips in the sub-duct to the main duct by air; a second chip transport unit that moves the chips moved from the sub-duct into the main duct through the first opening to an outlet of the main duct by air; a first sensor that detects the accumulation of chips in the sub-duct at a first location downstream of the first chip transport unit; a second sensor that detects the accumulation of chips in the main duct at a second location downstream of the second chip transport unit; and a control unit that controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor.

[0013] According to this, the operation of the first chip transport unit and the second chip transport unit is controlled depending on whether chips are accumulated in a first portion downstream of the first chip transport unit and whether chips are accumulated in a second portion downstream of the second chip transport unit, so that, for example, chips can be prevented from accumulating in an amount greater than a predetermined amount, and thus chips of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0014] A chip collection system according to a second aspect of the present disclosure is a chip collection system according to the first aspect, wherein the first portion includes a portion where the subduct receives the chips discharged from the tape feeder or a portion near that portion.

[0015] According to this, the operation of the first chip conveying section and the second chip conveying section is controlled depending on whether chips are accumulated in the first portion where the sub-duct receives the chips, so that, for example, it is possible to prevent chips from accumulating in an amount greater than a predetermined amount.

[0016] A chip collection system according to a third aspect of the present disclosure is a chip collection system according to the first or second aspect, wherein the second portion includes a portion where the main duct receives the chips discharged from the sub-duct or a portion near that portion.

[0017] According to this, the operation of the first chip transport unit and the second chip transport unit is controlled depending on whether chips are accumulated in the first portion where the sub-duct receives the chips and whether chips are accumulated in the second portion where the main duct receives the chips, so that, for example, it is possible to prevent chips from accumulating more than a predetermined amount, and therefore, it is possible to efficiently move chips of the tape member inside the duct to the outlet of the duct.

[0018] A chip collection system according to a fourth aspect of the present disclosure is a chip collection system according to any one of the first to third aspects, wherein the control unit changes the operating time of the first chip transport unit to a longer time when the first sensor detects accumulation of chips.

[0019] According to this, when chips accumulate in the first area where the subduct receives the chips, the operating time of the first chip transport section is changed to a longer time, thereby preventing chips from accumulating in the first area to an amount greater than a predetermined amount.

[0020] A chip collection system according to a fifth aspect of the present disclosure is a chip collection system according to any one of the first to fourth aspects, wherein the control unit changes the operating time of the second chip transport unit to a longer time when the second sensor detects accumulation of chips.

[0021] According to this, when chips accumulate in the second area where the main duct receives the chips, the operating time of the second chip transport section is changed to a longer time, thereby preventing chips from accumulating in the second area to more than a predetermined amount.

[0022] A chip collection system according to a sixth aspect of the present disclosure is a chip collection system according to any one of the first to fifth aspects, wherein at least a portion of the wall surface of the main duct or the sub-duct has irregularities.

[0023] Therefore, the chips are piled up with a space between them and at least a part of the wall surface of the main duct or the sub-duct, which makes it easier for the air from the first chip conveying section or the second chip conveying section to pass through the space between the chips and at least a part of the wall surface, thereby allowing the chips to be moved efficiently.

[0024] A chip collection system according to a seventh aspect of the present disclosure is a chip collection system according to any one of the first to sixth aspects, wherein at least a portion of the wall surface of the main duct or the sub-duct has a convex curved surface facing outward from the duct.

[0025] Therefore, the chips are piled up with a space between them and at least a part of the wall surface of the main duct or the sub-duct, which makes it easier for the air from the first chip conveying section or the second chip conveying section to pass through the space between the chips and at least a part of the wall surface, thereby allowing the chips to be moved efficiently.

[0026] A chip collection system according to an eighth aspect of the present disclosure is a chip collection system according to any one of the first to seventh aspects, wherein at least one of the main duct and the sub-duct defines a first flow path through which air flows in a first direction, and a second flow path connected to the first flow path and through which air flows in a direction intersecting the first direction, and at least one of the main duct and the sub-duct has a second opening arranged on the side of the first flow path facing the first direction, and a first filter that covers the second opening, allows air to pass through, but does not allow the chips to pass through.

[0027] This allows the air flowing in the first direction to easily pass through the second opening, and the air flow rate can be maintained at a constant level or higher with less energy consumption, thereby allowing chips to be moved efficiently.

[0028] A chip collection system according to a ninth aspect of the present disclosure is a chip collection system according to any one of the first to eighth aspects, further comprising a chip collection path through which the chips moved in the traveling direction fall, a chute through which the chips falling from the chip collection path pass, and a container installed below the chute for collecting the chips that have passed through the chute, wherein the chip collection path has an air blower that uses air to move the chips in the traveling direction, and the chute has a third opening at its upper part that is arranged on the side downstream of the air from the air blower, and a second filter that covers the third opening and allows air to pass through but does not allow the chips to pass through.

[0029] This allows the air flowing in the direction of travel to easily pass through the third opening, making it possible to maintain a constant air flow rate or higher with less energy consumption, thereby enabling chips to be moved efficiently.

[0030] A chip collection method according to a tenth aspect of the present disclosure is a chip collection method carried out by a chip collection system including: a sub-duct that receives chips of a tape material discharged from a tape feeder provided in a component mounting device; a main duct to which the sub-duct is connected and which has a first opening that communicates with the sub-duct; a first chip transport unit installed in the sub-duct that moves the chips in the sub-duct to the main duct by air; and a second chip transport unit that moves the chips moved from the sub-duct into the main duct through the first opening to an outlet of the main duct by air, wherein the chip collection method obtains a detection result from a first sensor that detects the accumulation of chips in a first portion of the sub-duct downstream of the first chip transport unit and a detection result from a second sensor that detects the accumulation of chips in a second portion of the main duct downstream of the second chip transport unit, and controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor.

[0031] According to this, the operation of the first chip transport unit and the second chip transport unit is controlled depending on whether chips are accumulated in a first portion downstream of the first chip transport unit and whether chips are accumulated in a second portion downstream of the second chip transport unit, so that, for example, chips can be prevented from accumulating in an amount greater than a predetermined amount, and thus chips of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0032] (Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0033] 1 shows a work line 2 on which a chip collection system 1 according to this embodiment is installed. The work line 2 has a configuration in which multiple (here, three) component mounting devices 3a-3c (hereinafter, each of the component mounting devices 3a-3c will also be referred to as a component mounting device 3) that mount components on a board KB are lined up in one direction, and adjacent component mounting devices 3 exchange boards KB to mount components on the boards KB. In this embodiment, the direction in which the boards KB are exchanged on the work line 2 (the left-right direction, the direction in which the component mounting devices 3a-3c are lined up) is referred to as the X direction, the horizontal direction (front-back direction) perpendicular to the X direction is referred to as the Y direction, and the up-down direction is referred to as the Z direction. The chip collection system 1 is an example of a chip collection device.

[0034] 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the top of the base 11. A work space 13 that is covered by the cover member 12 is formed above the base 11. A board transport unit 14 that extends in the X direction through the work space 13 is installed on the top surface of the base 11. The board transport unit 14 is made up of a pair of conveyor mechanisms lined up in the Y direction. The board transport unit 14 transports the board KB in the X direction and positions the board KB at a predetermined work position within the work space 13.

[0035] 2, feeder carriages 15 are attached to the front and rear ends of base 11. A plurality of tape feeders 16 are attached to each feeder carriage 15 and aligned in the X direction (see also FIG. 1). Each tape feeder 16 takes in carrier tape 18 as a tape member unwound from tape reel 17 held by feeder carriage 15, transports it in the Y direction (the direction toward board transport section 14), and supplies components BH stored on carrier tape 18 to component supply position 16K.

[0036] In Figure 2, two mounting heads 21 are provided above the base 11 so as to be movable by a head movement mechanism 22. Each mounting head 21 has a nozzle 21N extending downward. The head movement mechanism 22 is, for example, a Cartesian coordinate robot, and moves the two mounting heads 21 independently within a horizontal plane. Each mounting head 21 picks up a component BH supplied to a component supply position 16K by the tape feeder 16 by adsorbing it to the lower end of the nozzle 21N (Figure 2).

[0037] 2, the component mounting apparatus 3 includes a control device 23. The control device 23 controls the operations of the board transport unit 14, the tape feeder 16, the mounting head 21, the head moving mechanism 22, and the like.

[0038] When performing a component mounting operation, the component mounting device 3 first operates the board transport unit 14 to receive the board KB from an upstream device and position it at the work position. After positioning the board KB at the work position, the component mounting device 3 operates the tape feeder 16 to supply components BH to the component supply position 16K, and then operates the head moving mechanism 22 to have the mounting head 21 repeatedly perform a component transfer operation. During the component transfer operation, the mounting head 21 picks up the components BH supplied by the tape feeder 16 and mounts the components BH on the board KB.

[0039] Each component mounting device 3 mounts the components BH to be mounted on the board KB by repeatedly performing the component transfer operation using the mounting head 21, and then operates the board transport unit 14 to transport the board KB downstream. In this way, each of the three component mounting devices 3 mounts a component BH on the board KB, and when the component mounting device 3 located furthest downstream transports the board KB, the component mounting operation on that board KB on the work line 2 is completed.

[0040] Next, the chip collection system 1 will be described. First, cutting of the carrier tape 18 will be described. As shown in FIG. 2, the feeder cart 15 provided in each component mounting device 3 has a tape cutter 24 and a chute 25. The tape cutter 24 is provided below the tape feeder 16 and cuts the carrier tape 18 after the tape feeder 16 has finished supplying components BH. As also shown in FIG. 3 (an enlarged view of area RY in FIG. 2), the chute 25 is provided below the tape cutter 24. The chute 25 guides chips KZ of the carrier tape 18 that are cut by the tape cutter 24 and fall under their own weight, and discharges them outside the feeder cart 15 from a discharge opening 25K at the bottom end.

[0041] In this way, chips KZ of the carrier tape 18 are generated from each of the component mounting devices 3 that make up the work line 2, and the amount of chips KZ of the carrier tape 18 generated throughout the entire work line 2 is enormous. The chip collection system 1 in this embodiment automatically collects the large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual intervention, thereby facilitating the disposal of the chips KZ.

[0042] 1, 4, and 5A, the chip collection system 1 includes two rows of main ducts 31, a plurality of sub-ducts 32, and a collection section 80. Each of the two rows of main ducts 31 extends in the direction of extension of the work line 2 (X direction) below the work line 2 which extends in the X direction (more specifically, below each of the plurality of component mounting devices 3), and has an opening on each of the upstream side (one end) and downstream side (the other end). Hereinafter, the air outlet of the main duct 31 will be referred to as outlet 31D.

[0043] 4 and 5A, the main duct 31 is formed by connecting a plurality of duct pieces 41 in series in one direction (the X direction, which is the direction in which the component mounting devices 3 are arranged). As shown in Fig. 3, the duct piece 41 has a hollow shape with a rectangular cross section and includes two pairs of walls that face each other in the Y direction and the Z direction.

[0044] In Figure 4, the main duct 31 is formed by combining two types of duct pieces 41: a main duct piece 41M and a sub-duct piece 41S, which is a duct piece for adjusting the distance (adjustment duct piece). The main duct piece 41M has an opening 41K formed in one of two walls corresponding to the Y direction. Because the main duct 31 has multiple main duct pieces 41M, multiple openings 41K are provided in the main duct 31 in the direction in which the main duct 31 extends (X direction). In the second embodiment of the chip collection system, the opening 41K is an example of a first opening.

[0045] 1, 2, and 4, the subducts 32 are each installed on the floor surface FL below the feeder cart 15, and each subduct 32 is connected to two walls facing each other in the front and rear (Y direction) of the two rows of main ducts 31 so as to cover the openings 41K (see also FIG. 5A). The subducts 32 include a plurality of subducts 32 facing the main ducts 31 in the front row of the two rows of main ducts 31, and a plurality of subducts 32 facing the main ducts 31 in the rear row. The subducts 32 facing the main ducts 31 in the front row are connected to and communicate with openings 41K provided in the front walls of the main ducts 31 in the front row. Furthermore, the subducts 32 facing the main ducts 31 in the rear row are connected to and communicate with openings 41K provided in the rear walls of the main ducts 31 in the rear row.

[0046] As shown in FIG. 5A , chips KZ discharged from the component mounting device 3a are received by four sub-ducts 32a and transferred to the main duct 31a to which the four sub-ducts 32a are connected. Two of the four sub-ducts 32a located at the front receive chips KZ discharged from one of the front feeder carriages 15 provided in the component mounting device 3a. Two of the four sub-ducts 32a located at the rear receive chips KZ discharged from one of the front feeder carriages 15 provided in the component mounting device 3a. The four sub-ducts 32a are sub-ducts located below the component mounting device 3a out of the multiple sub-ducts 32. The main duct 31a is a part of the main duct 31 located below the component mounting device 3a. In other words, the main duct 31a is one of the multiple divided areas that make up the main duct 31 and that corresponds to the area below the component mounting device 3a among the multiple divided areas that are arranged in series with each other.

[0047] Similarly, chips KZ discharged from the component mounting device 3b are received by four sub-ducts 32b of the sub-ducts 32 located below the component mounting device 3b and then transferred to the main duct 31b to which the four sub-ducts 32b are connected. The two sub-ducts 32b located at the front of the four sub-ducts 32b receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3b. The two sub-ducts 32b located at the rear of the four sub-ducts 32b receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3b. The four sub-ducts 32b are sub-ducts located below the component mounting device 3b of the multiple sub-ducts 32. The main duct 31b is a part of the main duct 31 located below the component mounting device 3b. In other words, the main duct 31b is one of the divided areas that make up the main duct 31 and that corresponds to the area below the component mounting device 3b among the divided areas that are arranged in series with each other.

[0048] Similarly, chips KZ discharged from the component mounting device 3c are received by four sub-ducts 32c of the sub-ducts 32 located below the component mounting device 3c and then transferred to the main duct 31c to which the four sub-ducts 32c are connected. The two sub-ducts 32c located at the front of the four sub-ducts 32c receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3c. The two sub-ducts 32c located at the rear of the four sub-ducts 32c receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3c. The four sub-ducts 32c are sub-ducts located below the component mounting device 3c of the multiple sub-ducts 32. The main duct 31c is a part of the main duct 31 located below the component mounting device 3c. In other words, the main duct 31c is one of the divided areas that make up the main duct 31 and that corresponds to the area below the component mounting device 3c among the divided areas that are arranged in series with each other.

[0049] 3, an opening 32K that opens upward (toward the tape feeder 16) is provided in the upper wall of each subduct 32. The subduct 32 receives, through the opening 32K, chips KZ of the carrier tape 18 that fall under their own weight through the corresponding chute 25 located directly above (i.e., chips KZ discharged from the tape feeder 16). In the first embodiment of the chip collection system, the opening 32K is an example of a first opening.

[0050] 3 and 5A, an air blower 51 is provided inside each sub-duct 32. The air blower 51 is made of, for example, a pipe-shaped member extending in the X direction, and is provided with a plurality of air outlets 51N lined up in the X direction. As shown in FIG. 3, each air outlet 51N opens toward the opening 41K of the main duct 31. This allows each air blower 51 to blow air toward the opening 41K of the main duct 31, thereby moving chips in the sub-duct 32 to the main duct 31. The opening 41K is an example of a second opening.

[0051] Each of the sub-ducts 32 is provided with one air blower 51. Four sub-ducts 32a arranged at the bottom of component mounting device 3a are provided with four air blowers 51a, respectively. Four sub-ducts 32b arranged at the bottom of component mounting device 3b are provided with four air blowers 51b, respectively. Four sub-ducts 32c arranged at the bottom of component mounting device 3c are provided with four air blowers 51c, respectively. The air blowers 51 are an example of a first chip conveying section.

[0052] Furthermore, a sensor 58 for detecting accumulation of chips KZ is provided in the first region 35 downstream of the air blower 51 in each sub-duct 32. The sensor 58 is provided at a height reached by a first amount of accumulated chips KZ. In other words, when the sensor 58 detects the presence of an object (chips KZ), it indicates that a first amount of chips KZ has accumulated in the first region 35. The first amount is, for example, the amount of chips KZ that can be moved in a predetermined period or less by air at a flow rate that can be blown out by the air blower 51. The sensor 58 is a sensor that detects the presence or absence of an object, and is, for example, a laser sensor, an infrared sensor, or an ultrasonic sensor. The sensor 58 is an example of a first sensor. The first region 35 may be a region where the sub-duct 32 receives chips KZ discharged from the tape feeder 16. In other words, the first region 35 may be a region directly below the opening 32K. The first portion 35 need not necessarily be the portion that receives the chips KZ, as long as it is a portion near the portion where the subduct 32 receives the chips KZ discharged from the tape feeder 16. The portion near the portion that receives the chips KZ is, for example, a portion that is closer to the opening 32K than the opening 41K through which the subduct 32 discharges the chips to the main duct 31.

[0053] As described above, in this embodiment, an air blower 51 is provided for each sub-duct 32 (FIG. 5A). For example, of the sub-ducts 32, sub-duct 32a, which is located below component mounting device 3a, has air blower 51a and sensor 58a arranged therein, sub-duct 32b, which is located below component mounting device 3b, has air blower 51b and sensor 58b arranged therein, and sub-duct 32c, which is located below component mounting device 3c, has air blower 51c and sensor 58c arranged therein.

[0054] In FIG. 5B , the sub-duct 32 forms a first flow path through which air flows in the X direction, and the main duct 31 forms a second flow path through which air flows in the Y direction. That is, at least one of the main duct 31 and the sub-duct 32 forms a first flow path through which air flows in the X direction and a second flow path connected to the first flow path and through which air flows in the Y direction intersecting the X direction. The sub-duct 32 has an opening 36 and a filter 37. The opening 36 is disposed on the side surface of the first flow path facing the Y direction. The filter 37 covers the opening 36 and allows air to pass through but blocks chips. The filter 37 is a member having multiple through-holes smaller than the size of the chips or dust. The filter 37 may be, for example, a plate-like member having multiple through-holes smaller than the size of the chips or dust, or may be a mesh. The opening 36 may also be a multiple through-holes smaller than the size of the chips or dust. That is, the multiple through-holes may be provided directly in the main duct 31.

[0055] In this way, the opening 36 and the filter 37 may be provided at the end of the Y direction in the main duct 31 and the sub-duct 32, where the air direction changes from the Y direction to the X direction. This allows air passing through the sub-duct 32 in the Y direction to be discharged through the opening 36 and the filter 37, making it possible to maintain the air flow velocity at a certain level or higher with less energy consumption. Note that Fig. 5B is an enlarged view of a portion of Fig. 5A.

[0056] 4, the multiple air blowers 51 located on the front side of the main duct 31 and lined up in the X direction are each connected to a first air supply path 52A extending in the X direction in front of the main duct 31. Furthermore, the multiple air blowers 51 located on the rear side of the main duct 31 and lined up in the X direction are each connected to a second air supply path 52B extending in the X direction behind the main duct 31.

[0057] 3 and 5A, a shutter 53 for opening and closing an opening 41K is provided on the wall of a main duct piece 41M that constitutes the main duct 31.

[0058] 4, the first air supply passage 52A arranged in front of the main duct 31 and the second air supply passage 52B arranged in the rear of the main duct 31 are each connected to a control valve 61. The control valve 61 is connected to an air generation source (supply source) not shown.

[0059] The operation of the control valve 61 is controlled by a control unit 62 (FIG. 4), and the air generated by the air generation source is supplied to the first air supply path 52A or the second air supply path 52B. When air is supplied to the first air supply path 52A by the control valve 61, air is blown out from each of the plurality of air blowers 51 arranged in the plurality of sub-ducts 32 arranged on the front side of the plurality of sub-ducts 32. When air is supplied to the second air supply path 52B by the control valve 61, air is blown out from each of the plurality of air blowers 51 arranged in the plurality of sub-ducts 32 arranged on the rear side of the plurality of sub-ducts 32.

[0060] Each of the plurality of air blowers 51 is provided with a valve 63 (for example, a solenoid valve or an electric valve) that opens and closes to control the on / off of air blowing from the air blower 51. As shown in Fig. 21, the opening and closing of the plurality of valves 63 corresponding to the plurality of air blowers 51 is controlled by a control unit 62.

[0061] The control unit 62 may be configured, for example, by a processor that executes a program and a memory (non-volatile memory) that stores the program. The control unit 62 may be configured, for example, by a dedicated circuit.

[0062] 4 and 5A, a plurality of air blowers 71 are provided in the main duct 31. These plurality of air blowers 71 are arranged in series in the extension direction of the main duct 31. Furthermore, a shutter 72 having a configuration similar to the shutter 53 is provided downstream of each of the plurality of air blowers 71 in the main duct 31. In this embodiment, the air blowers 71 are provided in the sub-duct piece 41S (i.e., between the two main duct units). The plurality of air blowers 71 move the chips KZ that have been moved from each sub-duct 32 into the main duct 31 through the opening 41K to the outlet 31D of the main duct 31. Specifically, each of the plurality of air blowers 71 blows air toward the outlet 31D of the main duct 31, thereby moving the chips KZ in the main duct to the outlet 31D of the main duct 31. The plurality of air blowers 71 are an example of a plurality of second chip conveying units.

[0063] Furthermore, a sensor 73 for detecting accumulation of chips KZ is provided in a second portion downstream of the air blower 71 in each main duct 31. The sensor 73 is provided at a height where a second amount of accumulated chips KZ reaches. In other words, when the sensor 73 detects the presence of an object (chips KZ), it indicates that a second amount of chips KZ has accumulated in the second portion. The second amount is, for example, the amount of chips KZ that can be moved in a predetermined period or less by air at a flow rate that can be blown out by the air blower 71. The sensor 73 is a sensor that detects the presence or absence of an object, and is, for example, a laser sensor, an infrared sensor, or an ultrasonic sensor. The sensor 73 is an example of a second sensor. The second portion is a portion where the main duct 31 receives the chips KZ discharged from the sub-duct 32. In other words, the second portion is a portion immediately downstream of the opening 32K. The second portion need not be the portion that receives the chips KZ, as long as it is a portion near the portion where the main duct 31 receives the chips KZ discharged from the sub-duct 32. The portion near the portion that receives the chips KZ is, for example, a portion that is closer to the opening 41K than the portion where the main duct 31 discharges the chips to the next main duct 31.

[0064] As described above, in this embodiment, an air blower 71 is provided for each main duct unit, i.e., at a position that separates two (one or more) of the openings 41K (FIG. 5A). That is, the plurality of air blowers 71 are installed in the plurality of divided regions of the main duct 31, respectively, with one air blower 71 disposed in each of the plurality of divided regions. For example, the air blower 71a and the sensor 73a are disposed in the main duct 31a disposed below the component mounting device 3a of the main duct 31, the air blower 71b and the sensor 73b are disposed in the main duct 31b disposed below the component mounting device 3b of the main duct 31, and the air blower 71c and the sensor 73c are disposed in the main duct 31c disposed below the component mounting device 3c of the main duct 31.

[0065] 4, the multiple air blowers 71 are connected to air supply pipes 71T (FIG. 4) that extend in the X direction, and the air supply pipes 71T are connected to a control valve 61. When the control unit 62 controls the control valve 61 to supply air to each air blower 71 through the air supply pipes 71T, air is blown out from the air blower 71.

[0066] Each of the plurality of air blowers 71 is provided with a valve 64 (electromagnetic valve or electric valve) that opens and closes to control the on / off of air blowing from the air blower 71. As shown in Fig. 21, the opening and closing of the plurality of valves 64 corresponding to the plurality of air blowers 71 is controlled by a control unit 62.

[0067] The outlet 31D of the main duct 31 is connected to the collection section 80. The collection section 80 receives the chips KZ discharged from the outlet 31D of the main duct 31.

[0068] Figures 6 and 7 are cross-sectional views for explaining a first example of the shutter and its peripheral configuration according to this embodiment. Figure 6 shows the shutter 53 in a closed state, and Figure 7 shows the shutter 53 in an open state. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 6. Figure 9 is a cross-sectional view taken along line IX-IX in Figure 7. Figures 6 and 7 are enlarged views of the main duct 31 and the sub-duct 32 in Figure 3.

[0069] The shutter 53 opens and closes the opening 41K at the connection between the sub-duct 32 and the main duct 31. The shutter 53 is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first edge of the partition plate. The shutter 53 is movable between a closed position (first position) in which the opening 41K is closed and the opening 41K is closed, and an open position (second position) in which the opening 41K is open. When air is not being blown out from the air blower 51, the shutter 53 is in a state in which the edge of the shutter 53 farther from the rotation shaft 55 abuts against the lower end of the opening 41K due to its own weight, and is positioned in the closed position. When air is blown out from the air blower 51 from this state, the shutter 53 is pushed by the air and moves to the open position, and the chips KZ in the sub-duct 32 move from the opening 41K into the main duct 31. When the air blower 51 stops blowing air, the shutter 53 returns to the closed position by its own weight.

[0070] In this embodiment, the shutter 53 is arranged to be able to swing freely within a vertical plane (here, within the YZ plane), and is positioned in a closed position that closes the opening 41K when the air blower 51 is not blowing air, and is positioned in an open position that is pushed by the air blown out by the air blower 51 and opens the opening 41K when the air blower 51 is blowing air.

[0071] The shutter 53 may have a rotation shaft 55 and may have a first plate portion 54a closer to the rotation shaft 55 and a second plate portion 54b farther from the rotation shaft 55. The first plate portion 54a and the second plate portion 54b are connected in a state of being bent convexly in the air flow direction. That is, the shutter 53 may have a shape that is bent convexly in the air flow direction. Note that the shutter 53 may have a bent shape or a curved shape as long as it has a shape that is bent convexly in the air flow direction. The shutter 53 may also have a portion that is disposed obliquely with respect to the air flow direction so as to be disposed downstream of the rotation shaft 55 in the air flow direction. With this configuration, when air is blown out by the air blower 51, the shutter 53 is easily pushed up by the air flow at the rotation shaft 55.

[0072] The main duct 31 is also provided with a restriction mechanism 56 that restricts the shutter 53 to a closed state. The restriction mechanism 56 is switchable between a restriction state in which the shutter 53 is restricted to the closed position and an open state in which the movement of the shutter 53 is not restricted. The restriction mechanism 56 is a pin that moves in and out of the main duct 31. As shown in FIG. 8, the restriction mechanism 56 is positioned in a position where it interferes with the shutter 53 by moving into the main duct 31. As a result, the restriction mechanism 56 enters a restriction state in which it restricts the shutter 53 from moving from the closed state to the open state. As shown in FIG. 9, the restriction mechanism 56 is positioned in a position where it does not interfere with the shutter 53 by moving from inside the main duct 31 to outside the main duct 31. As a result, the restriction mechanism 56 enters an open state in which it does not restrict the movement of the shutter 53. The restriction mechanism 56 is moved by an actuator such as a cylinder or a motor, and the movement of the restriction mechanism 56 is controlled by the control unit 62.

[0073] When the air blower 51 is not blowing air, the control unit 62 maintains the restriction by the restriction mechanism 56, thereby controlling the shutter 53 to the closed state. In other words, when the air blower 51 is not blowing air, the control unit 62 controls the restriction mechanism 56 to the restricted state, thereby controlling the shutter 53 to the closed state. On the other hand, when the air blower 51 is blowing air, the control unit 62 releases the restriction by the restriction mechanism 56, thereby controlling the shutter 53 to the open state.

[0074] Although the restriction mechanism 56 has been described as being provided in the main duct 31, it may be provided in the shutter 53. When the restriction mechanism 56 is provided in the shutter 53, the restriction mechanism 56 may restrict the movement of the shutter 53 by switching between a state in which it is caught by a locking portion provided in the main duct 31 (restricted state) and a state in which it is not caught (unrestricted state).

[0075] Furthermore, although the restricting mechanism 56 is exemplified as a pin, it is not limited to a pin as long as it can restrict the movement of the shutter 53 .

[0076] Figures 10 and 11 are cross-sectional views for explaining a second example of the shutter and its peripheral configuration according to this embodiment. Figure 10 shows the shutter 53 in a closed state, and Figure 11 shows the shutter 53 in an open state. Figures 10 and 11 are enlarged views of the main duct 31 and the sub-duct 32 in Figure 3.

[0077] The second example differs from the first example in that it does not have the restriction mechanism 56 and has a cylinder 57 for opening and closing the shutter 53. The cylinder 57 moves the shutter 53 from the closed position to the open position. After moving the shutter 53 to the open position, the cylinder 57 maintains the shutter 53 in the open position until it moves to the closed position. The cylinder 57 moves the shutter 53 from the open position to the closed position. After moving the shutter 53 to the closed position, the cylinder 57 maintains the shutter 53 in the closed position until it moves to the open position. The cylinder 57 is controlled by the control unit 62.

[0078] The control unit 62 controls the opening and closing of the shutter 53 by driving the cylinder 57. When the air blower 51 is not blowing air, the control unit 62 controls the shutter 53 to a closed state by driving the cylinder 57 to move the shutter 53 from an open position to a closed position. On the other hand, when the air blower 51 is blowing air, the control unit 62 controls the shutter 53 to an open state by moving the shutter 53 from the closed position to the open position.

[0079] Subsequently, the shutter 53 may be configured as in the third and fourth examples.

[0080] Figures 12 to 14 are cross-sectional views illustrating a third example of the shutter and its peripheral configuration according to this embodiment. Figure 12 shows the shutter 53 in a closed state, Figure 13 shows the shutter 53 transitioning from the closed state to the open state, and Figure 14 shows the shutter 53 in an open state. Figures 12 to 14 are enlarged views of the main duct 31 and the sub-duct 32 in Figure 3.

[0081] The third example differs from the first example in the shape of the shutter 53A. Like the first example, the shutter 53A has a rotation shaft 55 and includes a first plate portion 54Aa closer to the rotation shaft 55 and a second plate portion 54Ab farther from the rotation shaft 55. The shutter 53A has an opening 54Ac. The opening 54Ac is provided, for example, in the second plate portion 54Ab. The opening 54Ac penetrates the second plate portion 54Ab. The opening 54Ac is an example of a third opening. The second plate portion 54Ab has a wing shape that receives lift in a direction that causes the shutter 53A to open due to air flowing from the opening 54Ac toward a second side opposite the first side. The shutter 53A has a wing shape in which the area of ​​a first surface on the downstream side of the air is larger than the area of ​​a second surface on the upstream side of the air. Here, the first side is the side of the first plate portion 54Aa of the shutter 53A that is closer to the rotation shaft 55. The second side is the side of the second plate portion 54Ab of the shutter 53A that is farther from the rotation shaft 55.

[0082] In the third example, the restriction mechanism 56 is controlled in the same manner as in the first example, and therefore a description thereof will be omitted.

[0083] In the third example, the restricting mechanism 56 may not be provided.

[0084] Figures 15 and 16 are cross-sectional views for explaining a fourth example of the shutter and its peripheral configuration according to the present embodiment. Figure 15 shows the shutter 53 in a closed state, and Figure 16 shows the shutter 53 in an open state. Figures 15 and 16 are enlarged views of the main duct 31 and the sub-duct 32 in Figure 3.

[0085] The shutter 53 opens and closes the opening 41K at the connection between the sub-duct 32 and the main duct 31. The shutter 53 is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first edge of the partition plate. The shutter 53 is movable between a closed position (first position) in which the opening 41K is closed and the opening 41K is closed, and an open position (second position) in which the opening 41K is open. When air is not being blown out from the air blower 51, the shutter 53 is in a state in which the edge of the shutter 53 farther from the rotation shaft 55 abuts against the lower end of the opening 41K due to its own weight, and is positioned in the closed position. When air is blown out from the air blower 51 from this state, the shutter 53 is pushed by the air and moves to the open position, and the chips KZ in the sub-duct 32 move from the opening 41K into the main duct 31. When the air blower 51 stops blowing air, the shutter 53 returns to the closed position by its own weight.

[0086] In this embodiment, the shutter 53 is arranged to be able to swing freely within a vertical plane (here, within the YZ plane), and is positioned in a closed position that closes the opening 41K when the air blower 51 is not blowing air, and is positioned in an open position that is pushed by the air blown out by the air blower 51 and opens the opening 41K when the air blower 51 is blowing air.

[0087] The shutter 53 may have a rotation axis 55 and a first plate portion 54a closer to the rotation axis 55 and a second plate portion 54b farther from the rotation axis 55. The first plate portion 54a and the second plate portion 54b are connected in a state of being bent convexly in the air flow direction. That is, the shutter 53 may have a shape bent convexly in the air flow direction. Note that the shutter 53 may have a bent shape or a curved shape as long as it has a shape bent convexly in the air flow direction. As described above, since the shutter 53 has a curved shape, the surface area is larger and the shutter 53 is heavier than a flat shutter. Therefore, when air is flowing, the area pressed by the air is larger, and the force from the air is greater, making it easier to open. Furthermore, since the shutter has a larger weight, it can be more easily returned to the closed state under its own weight when air is not flowing.

[0088] Moreover, the shutter 53 may have a portion disposed at an angle to the air flow direction so as to be disposed downstream of the air flow from the rotation shaft 55. With this configuration, when air is blown out by the air blower 51, the shutter 53 is more likely to be pushed up by the air flow on the rotation shaft 55.

[0089] In the first to fourth examples, the shutters 53, 53A have a curved shape including the first plate portions 54a, 54Aa and the second plate portions 54b, 54Ab, but are not limited to this and may not have a curved shape. In other words, they may be configured as flat shutters.

[0090] Note that the main duct 31 may be provided with an opening 33 as shown in FIG. 17 . The opening 33 may be provided with a filter 34 that does not allow chips or external dust to pass through. The filter 34 is a member having a plurality of through holes smaller than the size of the chips or dust. The filter 34 may be, for example, a plate-like member having a plurality of through holes smaller than the size of the chips or dust, or may be a mesh. The opening 33 may also be a plurality of through holes smaller than the size of the chips or dust. In other words, the plurality of through holes may be provided directly in the main duct 31. This allows air to be taken in from outside the main duct 31 even when the shutter 53 is closed, thereby preventing negative pressure from being created inside the main duct 31.

[0091] Fig. 18 is a perspective view for explaining the configuration of the collection unit according to this embodiment. Fig. 19 is a cross-sectional view for explaining the configuration of the collection unit according to this embodiment. Fig. 19 is a cross-sectional view of the collection unit cut near the center in the X direction on the YZ plane.

[0092] The collection section 80 includes a chip collection path 81, a chute 82, a container 83, and a cover member 84.

[0093] The chip collecting path 81 collects chips KZ from the outlet 31D of the main duct 31 and forms a space for dropping the chips KZ moved in the traveling direction. The chip collecting path 81 extends in a direction (Y direction) intersecting the extension direction (X direction) of the main duct 31. The chip collecting path 81 has a passage section 81a arranged upstream of the traveling direction in which the chips KZ move in the chip collecting path 81, and a chip rising and falling section 81b arranged downstream. The passage section 81a has openings 81Ka and 81Kb connected to the main duct 31 and has a hollow shape with a rectangular cross section. The passage section 81a extends in the Y direction (horizontal direction). The main duct 31 is connected to the passage section 81a in a state where it communicates with the openings 81Ka and 81Kb provided in the wall of the passage section 81a. The main duct 31 is connected to the passage section 81a so as to cover the openings 81Ka and 81Kb. The chip rising and dropping section 81b, located downstream of the passage section 81a, is arranged to extend obliquely upward along the Y direction. The chip rising and dropping section 81b is a section that raises and then drops the chips KZ collected in the passage section 81a. The chip rising and dropping section 81b is connected to the chute 82 in a communicating state. Specifically, an opening 81Kc provided on the underside of the downstream end of the chip rising and dropping section 81b is connected to face an opening 82Ka of the chute 82.

[0094] Here, a plurality of air blowers 91 are arranged in the chip collecting path 81 along the moving direction of the chips KZ. The plurality of air blowers 91 are arranged in the chip collecting path 81 and move the chips KZ to the container 83. The plurality of air blowers 91 move the chips in the chip collecting path 81 to the container 83 by blowing air toward the outlet of the chip collecting path 81. In other words, the plurality of air blowers 91 move the chips KZ in the chip collecting path in the moving direction by air. Of the plurality of air blowers 91, the air blower 91a arranged in the passage portion 81a moves the chips KZ received from the main duct 31 in the passage portion 81a to the chip rising and falling portion 81b. In addition, the air blower 91b, which is one of the multiple air blowers 91 and is arranged in the chip rising and falling section 81b, moves the chips KZ that have been moved to the chip rising and falling section 81b to the opening 81Kc and drops them from the opening 81Kc toward the chute 82.

[0095] Furthermore, sensors 92a and 92b are provided in a third portion of the chip collecting path 81 downstream of the air blower 91 to detect the accumulation of chips KZ. The sensors 92a and 92b are provided at a height reached by a third amount of accumulated chips KZ. In other words, when the sensors 92a and 92b detect the presence of an object (chips KZ), this indicates that a third amount of chips KZ has accumulated in the third portion. The third amount is, for example, the amount of chips KZ that can be moved within a predetermined period of time by air at a flow rate that can be blown out by the air blower 91. The sensors 92a and 92b are sensors that detect the presence or absence of an object, and are, for example, a laser sensor, an infrared sensor, or an ultrasonic sensor. The third portion is a portion of the chip collecting path 81 where chips KZ are discharged from the main duct 31. In other words, the third portion is a portion immediately downstream of the openings 81Ka and 81Kb. The third portion does not have to be the portion that receives the chips KZ, as long as it is a portion near the portion where the chip collecting path 81 receives the chips KZ discharged from the main duct 31. The portion near the portion that receives the chips KZ is, for example, a portion in the chip collecting path 81 that is closer to the opening 81Ka than the air blower 91b, and a portion in the chip collecting path 81 that is closer to the opening 81Kb than the opening 82Ka.

[0096] Each of the plurality of air blowers 91 is provided with a valve 65 (a solenoid valve or an electric valve) that opens and closes to control the on / off of air blowing from the air blower 91. As shown in Fig. 21, the opening and closing of the plurality of valves 65 corresponding to the plurality of air blowers 91 is controlled by a control unit 62.

[0097] The chute 82 is a cylindrical member with a rectangular cross section that passes through the chips KZ that fall from the chip collection path 81 (i.e., move in the Z direction). The chute 82 is arranged along the Z direction. That is, the chute 82 has a space that penetrates in the Z direction. The chute 82 also has an opening 82Kb and a filter 85. The opening 82Kb is arranged on the side of the upper part of the chute 82, on the side downstream of the air from the air blower 91b. The filter 85 covers the opening 82Kb, allowing air to pass through but not allowing the chips KZ to pass through. The filter 85 is a member having a plurality of through holes that are smaller than the size of the chips or dust. The filter 85 may be, for example, a plate-like member having a plurality of through holes that are smaller than the size of the chips or dust, or may be a mesh. The opening 82Kb may also be a plurality of through holes that are smaller than the size of the chips or dust. That is, the plurality of through holes may be provided directly in the chute 82.

[0098] The container 83 is disposed below the chute 82 and stores the chips KZ that have passed through the chute 82. For example, the container 83 is a box-shaped member that is open at the top. The container 83 may be provided with wheels 83a so that the container 83 can be easily moved on the floor surface FL.

[0099] The cover member 84 is disposed at a position extending the outlet of the chute 82 and is flexible. The cover member 84 is, for example, a sheet-like member. As shown in FIG. 20, the cover member 84 is disposed on the periphery of the outlet of the chute 82. The cover member 84 is, for example, disposed on all four sides of the outlet of the chute 82, which has a rectangular cross section. The cover member 84 also has slits 84a extending in the Z direction (vertical direction). The cover member 84 may be four sheet-like members disposed on each side of the outlet of the chute 82. FIG. 20 is a perspective view for explaining the configuration of the cover member.

[0100] Although the opening 36 and the filter 37 are provided in the main duct 31 and the sub-duct 32 at the point where the air direction changes from the Y direction to the X direction and at the end of the Y direction before the change, the opening and the filter may be provided in the chip collecting path 81. For example, the opening and the filter may be provided in the main duct 31 and the chip collecting path 81 at the point where the air direction changes from the X direction to the Y direction and at the end of the chip collecting path 81 in the X direction before the change. This allows the air passing through the main duct 31 in the X direction to be discharged through the opening and the filter, making it possible to maintain the air flow velocity at a constant level or higher with less energy consumption.

[0101] FIG. 21 is a diagram showing an example of a control unit and its controlled object when the shutter and its peripheral configuration are the first and fourth examples in this embodiment.

[0102] As described above, the control unit 62 controls the opening and closing of each valve 63 to control the on / off of the air blower 51 corresponding to that valve 63. Moreover, the control unit 62 controls the opening and closing of each valve 64 to control the on / off of the air blower 71 corresponding to that valve 64. That is, the control unit 62 controls the operations of the air blowers 51 and 71. Moreover, the control unit 62 may control the opening and closing of each valve 65 to control the on / off of the air blower 91 corresponding to that valve 65. That is, the control unit 62 also controls the operation of the air blower 91.

[0103] The control unit 62 moves the chips KZ in the sub-duct 32 to the main duct 31 using the multiple air blowers 51, and then independently controls the multiple air blowers 71 to move the chips KZ to the outlet 31D of the main duct 31. Specifically, the control unit 62 independently controls the operation of the multiple air blowers 71 so that the amount of chips KZ moved per unit time by each of the multiple air blowers 71 does not exceed a predetermined amount. This prevents the chips KZ from becoming difficult to move in the main duct 31, and allows the chips KZ to be moved efficiently.

[0104] Furthermore, the control unit 62 controls the opening and closing of the valves 63, 64, 65 based on the detection results of the sensors 58, 73, 92, thereby controlling the on / off of the air blowers 51, 71, 91. When the sensor 58 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 51 to be longer than the standard time. When the sensor 73 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 71 to be longer than the standard time. When the sensor 92 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 91 to be longer than the standard time.

[0105] FIG. 22 is a diagram showing an example of a control unit and its controlled objects when the shutter and its peripheral configuration are the second example in this embodiment.

[0106] In the second example, compared to the first example, the control targets of the control unit 62 further include the regulating mechanism 56. As described above, the control unit 62 controls the shutter 53 to the closed state by maintaining the regulation by the regulating mechanism 56 when the air blower 51 is not blowing air. In other words, the control unit 62 controls the shutter 53 to the closed state by controlling the regulating mechanism 56 to the regulated state when the air blower 51 is not blowing air. On the other hand, the control unit 62 controls the shutter 53 to the open state by releasing the regulation by the regulating mechanism 56 when the air blower 51 is blowing air. Note that in the second example, the control of the valves 63, 64, and 65 by the control unit 62 is the same as in the first example.

[0107] FIG. 23 is a diagram showing an example of a control unit and its controlled object when the shutter and its peripheral configuration are the third example in this embodiment.

[0108] In the third example, compared to the first example, the control targets of the control unit 62 further include a cylinder 57. As described above, the control unit 62 controls the opening and closing of the shutter 53 by driving the cylinder 57. By driving the cylinder 57, the control unit 62 controls the shutter 53 to a closed state by moving the shutter 53 from an open position to a closed position when the air blower 51 is not blowing air. On the other hand, the control unit 62 controls the shutter 53 to an open state by moving the shutter 53 from a closed position to an open position when the air blower 51 is blowing air. Note that in the third example, the control of the valves 63, 64, and 65 by the control unit 62 is the same as in the first example.

[0109] FIG. 24 is a flowchart showing a first example of a chip collection method of the chip collection system according to the present embodiment.

[0110] The control unit 62 of the chip collection system 1 acquires control information indicating whether or not the air blower 51 is blowing air (S11). The control unit 62 may acquire, as the control information, the determination result as to whether or not the air blower 51 is blowing air, or may acquire, as the control information, status information indicating the operating status of the air blower 51 (status indicating whether or not air is being blown out), or may acquire, as the control information, a history of control instructions given by the control unit 62 to the air blower 51.

[0111] The control unit 62 determines whether the air blower 51 is blowing air or not based on the control information (S12).

[0112] If the air blower 51 is blowing air (Yes in S12), the control unit 62 controls the shutter 53 to an open state (S13).

[0113] If the air blower 51 is not blowing air (No in S12), the control unit 62 controls the shutter 53 to the closed state (S14).

[0114] FIG. 25 is a diagram for explaining a first example of the operation of the chip collection system according to this embodiment.

[0115] First, the control unit 62 operates the multiple air blowers 51 over periods P1 and P2. That is, the control unit 62 turns on the blowing of the multiple air blowers 51 (multiple air blowers 51a to 51c) during periods P1 and P2 to move the chips KZ in the multiple sub-ducts 32 to the main duct 31. When the sensors 58a to 58c detect accumulation of chips KZ, the control unit 62 may control the air blowers 51a to 51c to operate for a period longer than the period P1 and P2 combined (standard time). Here, when the accumulation of chips KZ is detected by any one of the sensors 58a to 58c, the control unit 62 may control the air blowers 51a to 51c to operate for a period longer than the period P1 and the period P2 added together (standard time), or when the accumulation of chips KZ is detected by any one of the sensors 58a to 58c, the control unit 62 may control only the air blower 51 corresponding to the sensor 58 that detected the accumulation to operate for a period longer than the period P1 and the period P2 added together (standard time).

[0116] Next, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the multiple air blowers 71 in the main duct 31 in order from the air blowers 71 furthest from the outlet 31D of the main duct 31. Specifically, the control unit 62 operates the air blower 71a arranged in the main duct 31a over periods P3 and P4. That is, the control unit 62 turns on the air blowing of the air blower 71a during periods P3 and P4 to move the chips KZ in the main duct 31a to the main duct 31b. When the sensor 73a detects accumulation of the chips KZ, the control unit 62 may control the air blower 71a to operate for a period longer than the period P3 and P4 (standard time).

[0117] Furthermore, the control unit 62 operates the air blower 71b over periods P4 and P5. That is, the control unit 62 turns on the air blower 71b during periods P4 and P5 to move the chips KZ in the main duct 31b to the main duct 31c. The air blower 71b operates simultaneously with the air blower 71a during period P4, which overlaps with the air blower 71a. In this way, the air blowers 71a and 71b installed in the main ducts 31a and 31b, which are two adjacent divided regions, are controlled by the control unit 62 so that the periods of their operations to move the chips KZ overlap. When the sensor 73b detects accumulation of chips KZ, the control unit 62 may control the air blower 71b to operate for a period longer than the sum of periods P4 and P5 (standard time).

[0118] Furthermore, the control unit 62 operates the air blower 71c over periods P5 and P6. That is, the control unit 62 turns on the air blower 71c during periods P5 and P6 to move the chips KZ in the main duct 31c toward the outlet 31D of the main duct 31. The air blower 71c operates simultaneously with the air blower 71b during period P5, which overlaps with the air blower 71b. In this way, the air blowers 71b and 71c installed in the main ducts 31b and 31c, which are two adjacent divided regions, are controlled by the control unit 62 so that the periods of their operations to move the chips KZ overlap. When the sensor 73c detects accumulation of chips KZ, the control unit 62 may control the air blower 71c to operate for a period longer than the sum of periods P5 and P6 (standard time).

[0119] Furthermore, the control unit 62 operates the air blower 91a over periods P6 and P7. That is, the control unit 62 turns on the air blower 91a during periods P6 and P7 to move the chips KZ in the passage 81a to the chip rising and falling section 81b. The air blower 91a operates simultaneously with the air blower 71c during period P6, which overlaps with the operation of the air blower 71c. In this way, the control unit 62 controls the air blower 71c installed in the main duct 31c and the air blower 91a installed in the chip collecting path 81 so that the periods of operation for moving the chips KZ overlap. When the sensor 92a detects accumulation of chips KZ, the control unit 62 may control the air blower 91a to operate for a period longer than the period P6 and P7 combined (standard time). When the sensor 92b detects accumulation of chips KZ, the control unit 62 may control the air blower 91b to operate for a period longer than the sum of the periods P7 and P8 (standard time).

[0120] Furthermore, when one of the sensors 58a-58c, 73a-73c, 92a, and 92b detects accumulation of chips KZ, the control unit 62 may operate the air blower corresponding to the sensor that detected the accumulation in the period immediately after the timing of the detection of the accumulation. Thereafter, the operation may be continued in the order of the time chart shown in Fig. 25, starting with the air blower corresponding to the sensor that detected the accumulation. For example, when the sensor 58a detects accumulation of chips in period P4, the control unit 62 may operate the air blowers 51a-51c in periods P5 and P6. The control unit 62 may then control the air blowers 51, 71, and 91 from the next period P7 onwards as period P3 in Fig. 25.

[0121] FIG. 26 is a diagram for explaining a second example of the operation of the chip collection system according to the present embodiment.

[0122] The second example differs from the first example in that the control unit 62 controls the air blower 71a to operate simultaneously during period P2, which overlaps with the operation of the multiple air blowers 51. Another difference is that, as a result of advancing the operation timing of the air blower 71a so that it operates during period P2 as described above, the air blowers 71a to 71c, 91a, and 91b operate over the period P2 to period P7. Other operations are the same as those in the first example.

[0123] FIG. 27 is a diagram for explaining a third example of the operation of the chip collection system according to the present embodiment.

[0124] The third example differs from the first example in that the control unit 62 operates the air blowers 91a, 91b during periods P7 to P9 when the multiple air blowers 51a to 51c and the multiple air blowers 71a to 71c are not operating. In other words, the control unit 62 operates the air blower 91a during periods P7 to P9 when the multiple air blowers 51a to 51c and the multiple air blowers 71a to 71c are not operating.

[0125] As described above, the chip collection system 1 executes the chip collection method.

[0126] FIG. 28 is a flowchart showing a second example of a chip collection method using the chip collection system according to this embodiment.

[0127] The control unit 62 of the chip collection system 1 acquires the detection results of the sensors 58a-58c, 73a-73c, 92a, and 92b (S1). The control unit 62 only needs to acquire the detection result of at least one of the sensors 58a-58c, 73a-73c, 92a, and 92b, and does not need to acquire the detection results of all of the sensors 58a-58c, 73a-73c, 92a, and 92b.

[0128] The control unit 62 controls the operation of the air blowers 51a-51c, 71a-71c, 91a, 91b based on the detection results of the sensors 58a-58c, 73a-73c, 92a, 92b (S2). When the accumulation of chips KZ is detected by one of the sensors 58a-58c, 73a-73c, 92a, 92b, the control unit 62 operates the air blower corresponding to the sensor that detected the accumulation, for a period immediately after the timing at which the accumulation is detected.

[0129] The chip collection system 1 according to this embodiment includes a sub-duct 32, a main duct 31, an air blower 51, a shutter 53, and a control unit 62. The sub-duct 32 has an opening 32K (first opening) for receiving chips KZ of the carrier tape (tape member) 18 discharged from a tape feeder 16 provided in the component mounting device 3, and an opening 41K for discharging the chips KZ to the main duct 31. The main duct 31 is connected to the sub-duct 32 through the opening 41K (second opening). The air blower 51 is installed in the sub-duct 32 and blows air toward the opening 41K to move the chips KZ in the sub-duct 32 to the main duct 31. The shutter 53 opens and closes the opening 41K. The control unit 62 controls the opening and closing of the shutter 53. The control unit 62 controls the shutter 53 to be in a closed state when the air blower 51 is not blowing out air.

[0130] According to this, when the air blower 51 is not blowing out air, the shutter 53 is controlled to the closed state, so that when air is not being blown out, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter 53. Therefore, it is possible to prevent chips from flowing back, and chips can be transported efficiently.

[0131] The chip collection system 1 according to this embodiment further includes a regulating mechanism 56. The regulating mechanism 56 regulates the shutter to a closed state. When the air blower 51 is not blowing air, the control unit 62 maintains the regulation by the regulating mechanism 56, thereby controlling the shutter 53 to a closed state. When the air blower 51 is blowing air, the control unit 62 releases the regulation by the regulating mechanism 56, thereby controlling the shutter 53 to an open state.

[0132] According to this, by using the regulating mechanism 56 to maintain the shutter 53 in a closed state, the shutter 53 is controlled to a closed state when the air blower 51 is not blowing air, and therefore, it is possible to suppress air from flowing back from the downstream side to the upstream side of the shutter 53 when air is not being blown out. Therefore, it is possible to suppress the backflow of chips KZ. Furthermore, when the air blower 51 is blowing air, the shutter 53 is controlled to an open state by releasing the restriction by the regulating mechanism 56, and therefore, it is possible to efficiently transport chips.

[0133] The chip recovery system 1 according to this embodiment further includes a cylinder 57. The cylinder 57 is a cylinder for opening and closing the shutter 53. The control unit 62 drives the cylinder 57 to control the opening and closing of the shutter 53.

[0134] According to this, by using the cylinder 57 to maintain the shutter 53 in a closed state, the shutter 53 is controlled to be in a closed state when the air blower 51 is not blowing air, so that it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter 53 when air is not being blown out. Therefore, it is possible to prevent the chips KZ from flowing back. Furthermore, since the shutter 53 is controlled to be in an open state using the cylinder 57 when the air blower 51 is blowing air, it is possible to efficiently transport the chips.

[0135] In the chip collection system 1 according to the present embodiment, the shutter 53 is a partition plate for closing the opening 41K, and is rotatable on a rotation shaft 55 near a first side of the partition plate. The partition plate has a shape that is curved convexly in the air flow direction.

[0136] According to this, the shutter 53 has a shape that is curved convexly in the air flow direction, and therefore it is easy to receive air from the air blower 51. Therefore, when the air blower 51 is blowing air, the shutter 53 can be easily opened by the pressing force of the air.

[0137] In the chip recovery system 1 according to the present embodiment, the shutter 53A is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first side of the partition plate. The shutter 53A has an opening 54Ac. The shutter 53A has a wing shape that receives lift in a direction that opens the shutter 53A due to air flowing from the opening 54Ac toward a second side opposite the first side.

[0138] According to this, since the shutter 53A has a wing shape, the lift force of the air from the air blower 51 can make the shutter 53A open easily.

[0139] The chip collection system 1 according to this embodiment includes a sub-duct 32, a main duct 31, an air blower 51 (first chip conveying section), an air blower 71 (second chip conveying section), a sensor 58 (first sensor), a sensor 73 (second sensor), and a control section 62. The sub-duct 32 receives chips KZ of the tape member 18 discharged from a tape feeder provided in the component mounting device 3. The main duct 31 is connected to the sub-duct 32 and has an opening 31K (first opening) communicating with the sub-duct 32. The air blower 51 is installed in the sub-duct 32 and uses air to move the chips KZ in the sub-duct 32 to the main duct 31. The air blower 71 uses air to move the chips KZ that have been moved from the sub-duct 32 into the main duct 31 through the opening 31K to an outlet of the main duct 31. The sensor 58 detects accumulation of chips KZ in a first portion 35 downstream of the air blower 51 in the sub-duct 32. The sensor 73 detects accumulation of chips KZ in a second portion downstream of the air blower 71 in the main duct 31. The control unit 62 controls the operations of the air blower 51 and the air blower 71 based on the detection results of the sensor 58 and the sensor 73.

[0140] According to this, the operations of the air blower 51 and the air blower 71 are controlled depending on whether or not the chips KZ are accumulated in the first portion 35 downstream of the air blower 51 and whether or not the chips KZ are accumulated in the second portion downstream of the air blower 71, so that it is possible to prevent the chips KZ from accumulating in an amount greater than a predetermined amount, for example. Therefore, the chips of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0141] In the chip collection system 1 according to this embodiment, the first portion 35 includes a portion where the subduct 32 receives the chips KZ discharged from the tape feeder or a portion in the vicinity of this portion.

[0142] According to this, the operation of the air blower 51 and the air blower 71 is controlled depending on whether or not chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, so that, for example, it is possible to prevent chips from accumulating in an amount greater than a predetermined amount.

[0143] In the chip collection system 1 according to this embodiment, the second region includes a region where the main duct 31 receives the chips KZ discharged from the sub-duct 32 or a region in the vicinity of this region.

[0144] According to this, since the operation of the air blower 51 and the air blower 71 is controlled depending on whether or not the chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, and whether or not the chips KZ are accumulated in the second portion where the main duct 31 receives the chips KZ, it is possible to prevent the chips KZ from accumulating in an amount greater than a predetermined amount, for example. Therefore, the chips KZ of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0145] In the chip collection system 1 according to this embodiment, when the sensor 58 detects accumulation of chips KZ, the control unit 62 changes the operating time of the air blower 51 to a longer time.

[0146] According to this, when chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, the operating time of the air blower 51 is changed to a longer time, thereby preventing the chips KZ from accumulating in the first portion 35 by more than a predetermined amount.

[0147] In the chip collection system 1 according to this embodiment, when the sensor 73 detects accumulation of chips KZ, the control unit 62 changes the operating time of the air blower 71 to a longer time.

[0148] According to this, when chips KZ accumulate in the second portion where the main duct 31 receives the chips KZ, the operating time of the air blower 71 is changed to a longer time, thereby preventing the chips KZ from accumulating in the second portion by more than a predetermined amount.

[0149] In the chip collection system 1 according to this embodiment, at least one of the main duct 31 and the sub-duct 32 forms a first flow path through which air flows in the Y direction (first direction), and a second flow path that is connected to the first flow path and through which air flows in the X direction that intersects with the Y direction. At least one of the main duct 31 and the sub-duct 32 has an opening 36 (second opening) that is arranged on a side surface on the Y direction side of the first flow path, and a filter 37 (first filter) that covers the opening 36, allows air to pass through, but does not allow chips KZ to pass through.

[0150] This allows the air flowing in the Y direction to easily pass through the opening 36, and the air flow velocity can be maintained at a constant level or higher with less energy consumption. This allows the chips KZ to be moved efficiently.

[0151] The chip collection system 1 according to this embodiment further includes a chip collection path 81, a chute 82, and a container 83. The chip collection path 81 drops the chips KZ that have been moved in the traveling direction. The chute 82 passes the chips KZ that drop from the chip collection path 81. The container 83 is installed below the chute 82 and collects the chips KZ that have passed through the chute 82. The chip collection path 81 has an air blower 91 that uses air to move the chips KZ in the traveling direction. The chute 82 has an opening 82Kb (third opening) at its top that is located on the side downstream of the air from the air blower 91, and a filter 85 that covers the opening 82Kb and allows air to pass through but does not allow the chips KZ to pass through.

[0152] This allows the air flowing in the direction of travel to easily pass through the opening 82Kb, and the air flow rate can be maintained at a constant level or higher with less energy consumption, allowing the chips KZ to be moved efficiently.

[0153] In the above-described embodiment, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the control unit 62 of the chip recovery system 1 of the above-described embodiment is a program that causes a computer to execute each step included in the flowchart shown in the figure.

[0154] As another example of the air blower 91, a blower that blows out air by rotating an impeller (or fan) may be used. FIG. 29 is a cross-sectional view illustrating the configuration of the collection unit when a blower is used as the air blower. As shown in FIG. 29, the collection unit 180 is equipped with air blowers 191a and 191b that are realized by blowers. The air blower 191a is disposed in the passage section 81a, and the air blower 191b is disposed in the chip rising and falling section 81b. In this way, by realizing the air blowers 191a and 191b as blowers that blow out air by rotating an impeller, the valve 65 and the like are not required, and the chips KZ can be transported with a simple configuration.

[0155] In the above-described embodiment, the air blowers 51, 71, 91, and 191 are not limited to those that transport chips by air, as long as they are capable of transporting chips. For example, a device for transporting chips, such as a conveyor, may be provided in place of each of the air blowers 51, 71, 91, and 191.

[0156] At least a portion of the wall surface of the main duct 31 or the sub-duct 32 may have an uneven shape or a convex curved surface on the outside of the duct. The uneven shape may be, for example, an embossed shape or a corrugated shape. At least a portion of the wall surface of the main duct 31 or the sub-duct 32 may be, for example, the bottom surface of the main duct 31 or the sub-duct 32, or may include side surfaces in addition to the bottom surface. Therefore, the chips KZ are deposited with a space between them and at least a portion of the wall surface of the main duct 31 or the sub-duct 32. This allows air from the air blower 51 or the air blower 71 to easily pass through the space between the chips KZ and at least a portion of the wall surface, thereby efficiently moving the chips KZ.

[0157] The following cases are also included in this disclosure:

[0158] (1) Each of the above devices is specifically a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function when the microprocessor operates in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to a computer to achieve a predetermined function.

[0159] (2) Some or all of the components constituting each of the above devices may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions when the microprocessor operates in accordance with the computer program.

[0160] (3) Some or all of the components constituting each of the above devices may be configured as an IC card or a standalone module that can be attached to each device. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its functions when the microprocessor operates according to a computer program. The IC card or module may be tamper-resistant.

[0161] (4) The present disclosure may be embodied as the methods described above, a computer program for implementing these methods on a computer, or a digital signal comprising the computer program.

[0162] The present disclosure may also be the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray (registered trademark) Disc), semiconductor memory, etc. Alternatively, the present disclosure may be the digital signal recorded on such a recording medium.

[0163] Furthermore, the present disclosure may also be applied to transmitting the computer program or the digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0164] The present disclosure may also be a computer system including a microprocessor and a memory, wherein the memory stores the computer program, and the microprocessor operates in accordance with the computer program.

[0165] The program or the digital signal may also be implemented by another independent computer system by recording it on the recording medium and transferring it, or by transferring it via the network or the like.

[0166] (5) The above-described embodiments and modifications may be combined with each other. [Industrial Applicability]

[0167] This can be realized as a chip collection system that can efficiently move chips from the tape material inside the duct to the outlet of the duct. [Explanation of symbols]

[0168] 1. Chip collection system 2 Work Line 3. Component placement device 16 Tape Feeder 18 Carrier tape (tape material) 31 Main Duct 31D Exit 32 Subduct 32K, 33, 36 opening 34, 37 Filter 35 Part 1 41K aperture 51, 71, 91, 191 Air blower 53, 53A shutter 54a, 54Aa First plate section 54b, 54Ab 2nd plate part 54Ac opening 55 Rotation axis 56 Regulatory Mechanisms 57 cylinders 58, 58a-58c, 73, 73a-73c, 92, 92a, 92b Sensors 62 Control Unit 80 Collection Department 81 Chip collection path 81a Passage 81b Chip rising and dropping section 81Ka, 81Kb, 81Kc aperture 82 shots 83 Container 83a wheels 84 Cover member 84a Break KZ chips BH parts KB board

Claims

1. a sub-duct for receiving scraps of a tape member discharged from a tape feeder provided in the component mounting device; a main duct to which the sub-duct is connected and having a first opening communicating with the sub-duct; a first chip transport unit installed in the sub-duct and configured to move the chips in the sub-duct to the main duct by air; a second chip transport unit that moves the chips, which have been moved from the sub-duct into the main duct through the first opening, to an outlet of the main duct by air; a first sensor configured to detect accumulation of the chips in a first portion of the sub-duct downstream of the first chip transport section; a second sensor configured to detect accumulation of the chips in a second portion of the main duct downstream of the second chip transport section; a control unit that controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor. Chip collection system.

2. The first portion includes a portion where the subduct receives the chips discharged from the tape feeder or a portion adjacent to the portion. The chip collection system of claim 1 .

3. The second portion includes a portion where the main duct receives the chips discharged from the sub-duct or a portion in the vicinity of the portion. The chip collection system of claim 2 .

4. The control unit changes the operation time of the first chip transport unit to a longer time when the first sensor detects that the chips are accumulated. The chip collection system according to any one of claims 1 to 3.

5. The control unit changes the operation time of the second chip transport unit to a longer time when the second sensor detects that the chips are accumulated. The chip collection system of claim 4.

6. At least a part of the wall surface of the main duct or the sub-duct has irregularities. The chip collection system according to any one of claims 1 to 3.

7. At least a part of the wall surface of the main duct or the sub-duct has a convex curved surface facing outward from the duct. The chip collection system according to any one of claims 1 to 3.

8. At least one of the main duct and the sub-duct defines a first flow path through which air flows in a first direction, and a second flow path connected to the first flow path and through which air flows in a direction intersecting the first direction, At least one of the main duct and the sub-duct has a second opening arranged on a side surface of the first flow path on the first direction side, and a first filter covering the second opening, allowing air to pass through but not allowing the chips to pass through. The chip collection system according to any one of claims 1 to 3.

9. moreover, a chip collection path through which the chips moved in the traveling direction fall; a chute through which the chips falling from the chip collecting path pass; a container disposed below the chute for accommodating the chips that have passed through the chute; The chip collecting passage has an air blower that moves the chips in the traveling direction by air, The chute has a third opening at an upper portion thereof, the third opening being disposed on a side surface downstream of the air from the air blower, and a second filter covering the third opening, allowing air to pass through but not allowing the chips to pass through. The chip collection system according to any one of claims 1 to 3.

10. a main duct connected to the sub-duct and having a first opening communicating with the sub-duct; a first chip transport unit installed in the sub-duct and moving the chips in the sub-duct to the main duct by air; and a second chip transport unit that moves the chips moved from the sub-duct into the main duct through the first opening to an outlet of the main duct by air, a detection result of a first sensor that detects accumulation of chips in a first portion of the sub-duct downstream of the first chip transport section, and a detection result of a second sensor that detects accumulation of chips in a second portion of the main duct downstream of the second chip transport section, are acquired; The operation of the first chip transport unit and the second chip transport unit is controlled based on the detection results of the first sensor and the second sensor. Chip collection method.

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