Temperature adjustment system, control device, device handling device, tester and device testing device

Abstract

To provide a temperature adjustment system capable of improving accuracy of temperature adjustment.SOLUTION: A temperature adjustment system 2 includes: a temperature adjustment device 60 that adjusts a temperature of a DUT 100 including a plurality of DTSs 130; a plurality of first acquisition devices 40 that respectively acquire first signals indicating an internal temperature of the DUT 100 output from the plurality of DTSs 130 and output second signals; and a control device 70 that controls the temperature adjustment device 60 by using the plurality of second signals output from the plurality of first acquisition devices 40.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a temperature adjustment system and control device used to adjust the temperature of a device under test (hereinafter simply referred to as "DUT" (Device Under Test)) such as a semiconductor integrated circuit element, as well as a device handling device, tester, and device testing device used to test the DUT. [Background technology]

[0002] An electronic device test apparatus includes a control device that calculates the temperature of the DUT using an analog signal output from a thermal diode provided in the DUT and controls a temperature adjustment device based on the calculation result (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2019 / 0101587 Summary of the Invention [Problem to be solved by the invention]

[0004] Typically, only one thermal diode is provided per DUT. However, during DUT testing, the entire circuitry of the DUT may not be driven simultaneously, but may be driven partially, resulting in uneven temperature distribution within the DUT. For this reason, if the thermal diode is located far from the driving part of the circuit, there may be an error between the actual temperature of the driving part and the measurement result from the thermal diode.

[0005] An object of the present invention is to provide a temperature adjustment system, a control device, a device handling device, a tester, and a device testing device that are capable of improving the accuracy of temperature adjustment. [Means for solving the problem]

[0006] [1] Aspect 1 of the present invention is a temperature adjustment system comprising: a temperature adjustment device that adjusts the temperature of a DUT having a plurality of first temperature detection circuits; a plurality of first acquisition devices that each acquire a first signal output from the first temperature detection circuits and indicating the internal temperature of the DUT and output a second signal; and a control device that controls the temperature adjustment device using the second signals output from the plurality of first acquisition devices.

[0007] [2] A second aspect of the present invention may be a temperature adjustment system in which, in the temperature adjustment system of the first aspect, the control device includes a selection unit that selects one or more second signals from the plurality of second signals output from the first acquisition device, and the control device controls the temperature adjustment device using the one or more second signals.

[0008] [3] A third aspect of the present invention may be a temperature adjustment system in which, in the temperature adjustment system of the second aspect, the control device includes a calculation unit that calculates a third signal using the one or more second signals selected by the selection unit, and the control device controls the temperature adjustment device using the third signal.

[0009] [4] A fourth aspect of the present invention may be a temperature adjustment system according to the second or third aspect, wherein the selection unit selects the one or more second signals based on a heat-generating portion of the DUT.

[0010] [5] A fifth aspect of the present invention may be a temperature adjustment system in the third or fourth aspect, wherein the calculation unit calculates the third signal based on a heat-generating portion of the DUT.

[0011] [6] A sixth aspect of the present invention may be a temperature adjustment system in which, in the temperature adjustment system of the first aspect, the control device includes a calculation unit that calculates a third signal using the plurality of second signals output from the first acquisition device, and the control device controls the temperature adjustment device using the third signal.

[0012] [7] A seventh aspect of the present invention may be the temperature adjustment system of the sixth aspect, wherein the calculation unit calculates the third signal based on a heat-generating portion of the DUT.

[0013] [8] Aspect 8 of the present invention may be a temperature control system in any one of aspects 1 to 7, wherein the control device is a temperature control system equipped with an identification unit that identifies a heat-generating portion of the DUT based on a test program currently being executed to test the DUT.

[0014] [9] A ninth aspect of the present invention may be a temperature adjustment system in any one of aspects 1 to 8, wherein the control device is equipped with an identification unit that identifies a heat-generating portion of the DUT based on a test of the DUT currently being performed.

[0015]

[10] Aspect 10 of the present invention may be a temperature control system in any one of aspects 1 to 9, wherein the plurality of second signals are output irregularly from the plurality of first acquisition devices, and the control device is equipped with a plurality of conversion units that convert the second signals from irregular signals to regular signals.

[0016]

[11] An eleventh aspect of the present invention may be a temperature adjustment system in any one of aspects 1 to 10, wherein the first acquisition device is a temperature adjustment system having an acquisition unit that acquires the first signal from the first temperature detection circuit using a test program that executes a test on the DUT.

[0017]

[12] A twelfth aspect of the present invention may be a temperature adjustment system according to any one of aspects 1 to 11, wherein the first acquisition device uses the first signal to generate the second signal.

[0018]

[13] A thirteenth aspect of the present invention may be a temperature adjustment system according to any one of the first to twelfth aspects, wherein the first signal output by the first temperature detection circuit is a first digital signal.

[0019]

[14] Aspect 14 of the present invention may be a temperature adjustment system in which, in any one of aspects 1 to 13, the first temperature detection circuit includes a measurement unit that measures the internal temperature of the DUT and a calibration unit that calibrates the measurement result of the measurement unit, and the first temperature detection circuit outputs the measurement result calibrated by the calibration unit to the first acquisition device as the first signal.

[0020]

[15] A fifteenth aspect of the present invention may be a temperature adjustment system according to any one of aspects 1 to 14, wherein, in a planar view of the DUT, the plurality of first temperature detection circuits are arranged apart from each other.

[0021]

[16] Aspect 16 of the present invention may be a temperature adjustment system according to any one of aspects 1 to 15, wherein the temperature adjustment system includes a second acquisition device that acquires a fourth signal output from a second temperature detection circuit provided in the DUT and indicates the internal temperature of the DUT, and outputs a fifth signal, and the control device controls the temperature adjustment device using the plurality of second signals and the fifth signal.

[0022]

[17] A seventeenth aspect of the present invention may be the temperature adjustment system of the sixteenth aspect, wherein the fourth signal output by the second temperature detection circuit is an analog signal.

[0023]

[18] According to an eighteenth aspect of the present invention, in the temperature adjustment system of the sixteenth or seventeenth aspect, the second temperature detection circuit may include a thermal diode.

[0024]

[19] A nineteenth aspect of the present invention may be a temperature control system in any one of aspects sixteen to eighteen, wherein the second acquisition device includes an A / D converter that converts the analog signal into a second digital signal, and the second acquisition device outputs the second digital signal as the fifth signal.

[0025]

[20] Aspect 20 of the present invention may be a temperature adjustment system according to any one of aspects 1 to 19, further comprising a temperature sensor provided on the DUT or a pusher that presses a carrier containing the DUT against a socket, and the control device controls the temperature adjustment device using the plurality of second signals and the detection results of the temperature sensor.

[0026]

[21] Aspect 21 of the present invention is a control device that controls a temperature adjustment device that adjusts the temperature of a DUT equipped with a plurality of first temperature detection circuits, wherein the control device controls the temperature adjustment device using a plurality of second signals output from a plurality of first acquisition devices, and each of the second signals is a signal output from the first acquisition device that acquires a first signal indicating the internal temperature of the DUT from the first temperature detection circuit.

[0027]

[22] Aspect 22 of the present invention is a control device according to aspect 21, wherein the control device includes a selection unit that selects one or more second signals from the plurality of second signals output from the first acquisition device, and the control device may be a control device that controls the temperature adjustment device using the one or more second signals.

[0028]

[23] Aspect 23 of the present invention is a control device according to aspect 22, wherein the control device includes a calculation unit that calculates a third signal using the one or more second signals selected by the selection unit, and the control device may be a control device that controls the temperature adjustment device using the third signal.

[0029]

[24] A twenty-fourth aspect of the present invention may be the control device of the twenty-second or twenty-third aspect, wherein the selection unit selects the one or more second signals based on a heat-generating portion of the DUT.

[0030]

[25] A twenty-fifth aspect of the present invention may be the control device of the twenty-third or twenty-fourth aspect, wherein the calculation unit calculates the third signal based on a heat-generating portion of the DUT.

[0031]

[26] Aspect 26 of the present invention is a control device according to aspect 21, wherein the control device includes a calculation unit that calculates a third signal using the plurality of second signals output from the first acquisition device, and the control device may be a control device that controls the temperature adjustment device using the third signal.

[0032]

[27] A twenty-seventh aspect of the present invention may be the control device of the twenty-sixth aspect, wherein the calculation unit calculates the third signal based on a heat-generating portion of the DUT.

[0033]

[28] Aspect 28 of the present invention is a control device in any one of aspects 21 to 27, wherein the control device may be a control device equipped with an identification unit that identifies a heat-generating portion of the DUT based on a test program currently executing a test of the DUT.

[0034]

[29] Aspect 29 of the present invention is a control device in any one of aspects 21 to 28, wherein the control device may be a control device equipped with an identification unit that identifies a heat-generating portion in the DUT based on a test of the DUT currently being performed.

[0035]

[30] Aspect 30 of the present invention may be a control device according to any one of aspects 21 to 29, wherein the plurality of second signals are output irregularly from the plurality of first acquisition devices, and the control device is a control device having a plurality of conversion units that convert the second signals from irregular signals to regular signals.

[0036]

[31] Aspect 31 of the present invention is a device handling device that handles a DUT having a plurality of first temperature detection circuits or a carrier containing the DUT and presses the DUT or the carrier against a socket, and is equipped with a temperature adjustment device that adjusts the temperature of the DUT and a control device of any one of aspects 21 to 30.

[0037]

[32] Aspect 32 of the present invention is a device handling device of aspect 31, wherein the device handling device is provided with a second acquisition device that acquires a fourth signal output from a second temperature detection circuit provided in the DUT and indicates the internal temperature of the DUT, and outputs a fifth signal corresponding to the internal temperature of the DUT, and the control device may be a device handling device that controls the temperature adjustment device using the plurality of second signals and the fifth signal.

[0038]

[33] A thirty-third aspect of the present invention may be the device handling device of the thirty-second aspect, wherein the fourth signal output by the second temperature detection circuit is an analog signal.

[0039]

[34] A thirty-fourth aspect of the present invention may be the device handling device of the thirty-second or thirty-third aspect, wherein the second temperature detection circuit includes a thermal diode.

[0040]

[35] Aspect 35 of the present invention may be a device handling device according to any one of aspects 32 to 34, wherein the second acquisition device includes an A / D converter that converts the analog signal into a second digital signal, and the second acquisition device outputs the second digital signal as the fifth signal.

[0041]

[36] Aspect 36 of the present invention may be a device handling device according to any one of aspects 31 to 35, further comprising a pusher that presses the DUT or the carrier against the socket, and a temperature sensor provided on the pusher, and the control device may be a device handling device that controls the temperature adjustment device using the plurality of second signals and the detection results of the temperature sensor.

[0042]

[37] Aspect 37 of the present invention is a tester having a plurality of first temperature detection circuits and for testing a DUT electrically connected to a socket or the DUT housed in a carrier electrically connected to the socket, the tester having a plurality of first acquisition devices that each acquire a first signal output from the first temperature detection circuit and indicating the internal temperature of the DUT and output a second signal.

[0043]

[38] Aspect 38 of the present invention may be a tester in which, in the tester of aspect 37, the first acquisition device is a tester having an acquisition unit that acquires the first signal from the first temperature detection circuit using a test program that executes a test of the DUT.

[0044]

[39] Aspect 39 of the present invention may be a tester according to aspect 37 or 38, wherein the first acquisition device generates the second signal using the first signal.

[0045]

[40] A fortieth aspect of the present invention may be the tester of any one of the thirty-seventh to thirty-ninth aspects, wherein the first signal output from the first temperature detection circuit is a first digital signal.

[0046]

[41] Aspect 41 of the present invention may be a tester in which, in any one of aspects 37 to 40, the first temperature detection circuit includes a measurement unit that measures the internal temperature of the DUT and a calibration unit that calibrates the measurement result of the measurement unit, and the first temperature detection circuit outputs the measurement result calibrated by the calibration unit to the first acquisition device as the first signal.

[0047]

[42] A forty-second aspect of the present invention may be the tester of any one of the thirty-seventh to forty-first aspects, wherein the plurality of first temperature detection circuits are arranged apart from one another in a plan view of the DUT.

[0048]

[43] Aspect 43 of the present invention is a device testing apparatus that has a plurality of first temperature detection circuits and tests a DUT electrically connected to a socket or a DUT housed in a carrier electrically connected to the socket, and is a device testing apparatus that has a temperature adjustment system of any one of aspects 1 to 20.

[0049]

[44] Aspect 44 of the present invention is a device testing apparatus for testing a DUT having a plurality of first temperature detection circuits, comprising a temperature adjustment device for adjusting the temperature of the DUT, a control device according to any one of aspects 21 to 30, and a tester according to any one of aspects 37 to 42.

[0050]

[45] Aspect 45 of the present invention is a device testing apparatus for testing a DUT having a plurality of first temperature detection circuits, the device testing apparatus comprising a device handling apparatus according to any one of aspects 31 to 36 and a tester according to any one of aspects 37 to 42. [Effects of the Invention]

[0051] According to the present invention, a plurality of first acquisition devices each acquire a first signal output from a first temperature detection circuit and indicating the internal temperature of the DUT, and each output a second signal, and a control device controls a temperature adjustment device using the plurality of second signals, thereby improving the accuracy of temperature adjustment. [Brief explanation of the drawings]

[0052] [Figure 1] FIG. 1 is a schematic cross-sectional view showing the overall configuration of a device testing apparatus according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a diagram for explaining the exchange of signals between the DUT, the tester, and the handler in the embodiment of the present invention. [Figure 3] FIG. 3 is a plan view showing the arrangement of the thermal diodes and DTS in the DUT according to the embodiment of the present invention. [Figure 4] FIG. 4 is a flowchart showing an example of a test program in the embodiment of the present invention. [Figure 5] FIG. 5 is a block diagram showing the overall configuration of a temperature adjustment system according to an embodiment of the present invention. [Figure 6] FIG. 6 is a block diagram showing details of the first acquisition device shown in FIG. [Figure 7] FIG. 7 is a fluid circuit diagram showing the configuration of a temperature adjustment device according to an embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view showing the configuration of a contact arm and a carrier according to another embodiment of the present invention. [Figure 9] FIG. 9 is a block diagram showing a modified example of the control device in the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0053] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0054] Figure 1 is a schematic cross-sectional view showing the overall configuration of the device testing apparatus 1 in this embodiment, Figure 2 is a diagram for explaining the exchange of signals between the DUT 100, tester 10, and handler 50 in this embodiment, Figure 3 is a plan view showing the arrangement of the thermal diode 120 and DTSs 130a to 130c within the DUT 100 in this embodiment, Figure 4 is a flowchart showing an example of a test program TP in this embodiment, Figure 5 is a block diagram showing the overall configuration of the temperature adjustment system 2 in this embodiment, Figure 6 is a block diagram showing details of the first acquisition device 40 shown in Figure 5, and Figure 7 is a fluid circuit diagram showing the configuration of the temperature adjustment device 60 in this embodiment.

[0055] 1 is an apparatus for testing the electrical characteristics of a DUT 100 such as a semiconductor integrated circuit device. The device testing apparatus 1 tests whether the DUT 100 operates properly while applying high or low temperature thermal stress to the DUT 100.

[0056] The device testing apparatus 1 includes a tester 10 and a handler 50. The tester 10 performs a test to measure and evaluate the electrical characteristics of a DUT 100. The tester 10 includes a mainframe 11 and a test head 12. The test head 12 is connected to the mainframe 11 via a cable 13. A socket 20 is attached to the top of the test head 12, and the socket 20 and the test head 12 are electrically connected to each other.

[0057] The handler 50 presses the DUT 100 against the socket 20, electrically connecting the DUT 100 and the socket 20. This electrically connects the DUT 100 and the test head 12 via the socket 20. The mainframe 11 is, for example, a computer that executes a program, and communicates with and controls a test module (not shown) of the test head 12 in accordance with the program. This test module is a wiring board on which electronic components such as test devices used to test the DUT 100 are mounted. This test module generates a test signal in accordance with an instruction from the mainframe 11 and inputs the test signal to the DUT 100. The tester 10 then measures and evaluates the output from the DUT 100 corresponding to the test signal.

[0058] Although not particularly limited, the DUT 100 is, for example, a semiconductor device. A specific example of the DUT 100 is an SoC (System on a Chip). The DUT 100 may also be a semiconductor device other than an SoC, such as a logic device or a memory device. The DUT 100 may also be a resin-molded device in which a semiconductor chip is packaged in a molding material such as a resin material, or may be an unpackaged bare die. When changing the type of the DUT 100, the socket 20 is replaced with one that matches the shape, number of pins, etc. of the DUT 100.

[0059] 2, the DUT 100 includes a main circuit 110 to be tested, as well as one thermal diode 120 and multiple (three in this embodiment) DTSs (Digital Temperature Sensors) 130a-130c. The thermal diode 120 and the DTSs 130a-130c are formed on a semiconductor substrate together with the main circuit 110 using semiconductor manufacturing techniques such as photolithography. The three DTSs 130a-130c have the same configuration, and in this embodiment, the DTSs 130a-130c are collectively referred to as "DTS 130."

[0060] 3, the thermal diode 120 and the multiple DTSs 130a to 130c are arranged at different positions in the DUT 100. Specifically, the multiple DTSs 130a to 130c are arranged at distances from one another in the DUT 100. The thermal diode 120 is also arranged at a distance from all of the DTSs 130a to 130c in the DUT 100. Therefore, as shown in FIG. 3, when the DUT 100 is seen through from above, the thermal diode 120 and the multiple DTSs 130a to 130c are distributed at distances from one another in the DUT 100.

[0061] The number of thermal diodes 120 in the DUT 100 is not particularly limited to the above, and for example, the DUT 100 may include multiple thermal diodes 120. Alternatively, the DUT 100 may not include any thermal diodes 120. Furthermore, the number of DTSs 130 included in the DUT 100 is not limited to the above, and the DUT 100 may include two or four or more DTSs 130. The arrangement of the thermal diodes 120 and DTSs 130 in the DUT 100 shown in FIG. 3 is merely an example.

[0062] The thermal diode 120 is an analog temperature detection circuit that outputs a fourth signal indicating the internal temperature of the DUT 100. The fourth signal output from the thermal diode 120 is an analog signal. The thermal diode 120 corresponds to an example of a "second temperature detection circuit" in the aspects of the present invention. Note that, instead of the thermal diode 120, the DUT 100 may include an element having temperature-dependent resistance characteristics or bandgap characteristics as the analog temperature detection circuit. Alternatively, instead of the thermal diode 120, a thermocouple may be embedded in the DUT 100 as the second temperature detection circuit.

[0063] In contrast, the DTS 130 is a digital temperature detection circuit that outputs a first signal indicating the internal temperature of the DUT 100. The first signal output from the DTS 130 is a digital signal. As shown in FIG. 2, the DTS 130 includes a measurement unit 131 and a calibration unit 132 that calibrates the measurement result of the measurement unit 131. The measurement unit 131 is a circuit that measures the internal temperature of the DUT 100, and includes, but is not limited to, an analog temperature sensor and an A / D converter that converts the measurement result of the temperature sensor into a digital signal. The calibration unit 132 is a circuit that calibrates the measurement result of the measurement unit 131. The DTS 130 is capable of outputting the measurement result calibrated by the calibration unit 132 to the tester 10 as a first signal. The DTS 130 corresponds to an example of a "first temperature detection circuit" in an aspect of the present invention.

[0064] Since the DTS 130 is disposed closer to the main circuit 110 than the thermal diode 120, it can measure the temperature of the DUT 100 with high accuracy. Furthermore, the output of the DTS 130 is calibrated with high accuracy in a pre-process test, and the calibration unit 132 calibrates the measurement results of the measurement unit 131 based on the calibration data, making it possible to detect the temperature of the DUT 100 with even higher accuracy.

[0065] As described above, the output of the DTS 130 is a digital signal, and therefore the DTS 130 is also electrically connected to the terminal 140 (see FIG. 7) of the DUT 100, which is electrically connected to the main circuit 110. Therefore, as shown in FIGS. 2 and 4, it is possible to use the test program TP executed by the tester 10 to acquire a first signal from the DTS 130 via the socket 20 to which this terminal 140 is electrically connected. On the other hand, the output of the thermal diode 120 is an analog signal, and therefore a dedicated terminal 140 is assigned to the thermal diode 120. Although not particularly limited, a specific example of such a DUT 100 can be a device provided by Synopsys, Inc.

[0066] 5, the tester 10 includes a test execution unit 30 and a plurality of (three in this embodiment) first acquisition devices 40a-40c. The test execution unit 30 executes a test on the DUT 100 using a test program TP. The plurality of first acquisition devices 40a-40c acquire first signals from the DTSs 130a-130c, respectively, and use the first signals to generate second signals for controlling the temperature adjustment device 60, which will be described later. The first acquisition device 40a acquires the first signal from the DTS 130a, the first acquisition device 40b acquires the first signal from the DTS 130b, and the first acquisition device 40c acquires the first signal from the DTS 130c.

[0067] The three first acquisition devices 40a to 40c have the same configuration, and in this embodiment, the first acquisition devices 40a to 40c are collectively referred to as "first acquisition devices 40." Note that the number of first acquisition devices 40 included in the tester 10 is not particularly limited to the above, and can be set according to the number of DTSs 130 included in the DUT 100.

[0068] The test execution unit 30 and the first acquisition devices 40a to 40c are functionally realized by, for example, a computer. Although not specifically shown, this computer is an electronic calculator equipped with a CPU, a main memory device (such as RAM), an auxiliary memory device (such as a hard disk or SSD), and an interface. This computer can functionally realize the test execution unit 30 and the first acquisition devices 40a to 40c by reading and executing a program stored in the auxiliary memory device.

[0069] The first acquisition device 40 generates a second signal using the first signal output from the DTS 130. As shown in FIG. 6, each first acquisition device 40 includes an acquisition unit 41, a normalization processing unit 42, an averaging processing unit 43, and a switching unit 44. Note that the first acquisition device 40 does not necessarily have to include at least one of the normalization processing unit 42, the averaging processing unit 43, and the switching unit 44. If the first acquisition device 40 does not include the normalization processing unit 42, the averaging processing unit 43, and the switching unit 44, the first acquisition device 40 outputs the first signal output from the DTS 130 as is as the second signal.

[0070] The acquisition unit 41 acquires a first signal from the DTS 130 using the test program TP executed by the tester 10 and outputs the first signal to the normalization processing unit 42. By acquiring the first signal using the test program TP in this way, the acquisition unit 41 can acquire the internal temperature of the DUT 100 while testing the DUT 100, enabling temperature detection with higher accuracy.

[0071] 2, 4, and 5, first, the test execution unit 30 transmits a request command written in the test program TP to the DUT 100. This request command is a signal requesting the DTS 130 to output a first signal. Based on this request command, the DTS 130 measures the internal temperature of the DUT 100 using the measurement unit 131, calibrates the measurement result using the calibration unit 132, and then transmits the first signal to the acquisition unit 41.

[0072] The test execution unit 30 transmits request commands at pinpoints in the test program TP. Although not particularly limited, the test execution unit 30 transmits the request commands to the DUT 100 at irregular intervals, for example, from 10 seconds to several hundred seconds. Although not particularly limited, more specifically, the irregular intervals at which the test execution unit 30 transmits the request commands are 10 seconds or more and 100 seconds or more.

[0073] Generally, a test program has branches, and the test to be executed varies depending on the branches, so the timing at which the test program sends a request command to the DUT (the elapsed time from the start of the test) is irregular rather than periodic. This point will be explained in detail using the example shown in Figure 4.

[0074] 4 includes test A, test B, test B', and test C, and one of test B and test B' is selectively executed based on condition X. That is, the test program (main program) TP of this embodiment includes tests with different test contents (e.g., equivalent to a test suite in which subprograms for executing individual tests are written).

[0075] 4, the position where request command b is written in test B is different from the position where request command b' is written in test B', so the timing at which request command b is sent in test B is different from the timing at which request command b' is sent in test B'. Also, because the test time of test B is different from the test time of test B', the timing at which request command c is sent in test C also varies depending on whether test B or test B' is selected under condition X. In this way, because test program TP has a branch (condition X), the timing at which acquisition unit 41 acquires the first signal from DTS 130 is unpredictable and irregular.

[0076] 4 is merely an example, and the number of tests and conditions constituting the test program can be determined arbitrarily. Furthermore, the type of each test and the order in which the tests are executed are not particularly limited and can be set arbitrarily. Specific examples of such tests include, but are not limited to, a contact test, a function test, a DC test, a scan test, and a power supply current test (power consumption test). A test program is configured by combining multiple types of tests and is configured to execute the tests sequentially.

[0077] Furthermore, a request command can be written in any test after the contact test. In the example shown in FIG. 4, one request command b, one request command b', and one request command c are sent in each of tests B, B', and C, but this is not limited to this, and the test program may include a test that does not send a request command. One test may also have multiple request commands. Furthermore, the test program may include a request command written between tests.

[0078] The normalization processing unit 42 shown in FIG. 6 performs normalization processing (data cleansing processing) on ​​the first signal acquired by the acquisition unit 41.

[0079] First, the normalization processing unit 42 determines whether the first signal is normal or abnormal. That is, the normalization processing unit 42 first determines the reliability of the first signal. Although not particularly limited, specifically, the normalization processing unit 42 determines whether the first signal is normal or abnormal by determining whether the absolute value of the internal temperature of the DUT 100 indicated by the first signal is within a predetermined range.

[0080] Alternatively, the normalization processing unit 42 may determine whether the first signal is normal or abnormal by determining whether the amount of change in the first signal is within a predetermined range. Specifically, in this case, the normalization processing unit 42 stores the first signal previously acquired by the acquisition unit 41. The normalization processing unit 42 then calculates the amount of change between the value of the previous first signal and the value of the first signal currently acquired by the acquisition unit 41. The normalization processing unit 42 then determines whether the amount of change is within a predetermined range, thereby determining whether the first signal is normal or abnormal. Alternatively, instead of the amount of change, Bollinger bands calculated based on multiple past first signals may be used.

[0081] If the normalization processing unit 42 determines that the first signal is normal, it outputs the first signal to the averaging processing unit 43. On the other hand, if the normalization processing unit 42 determines that the first signal is abnormal, it outputs a value different from the current first signal (a normal value within a predetermined range) as the first signal to the averaging processing unit 43. Although not particularly limited, when it is determined that the first signal is abnormal, the normalization processing unit 42 outputs, for example, the previous first signal that the normalization processing unit 42 determined to be normal to the averaging processing unit 43 instead of the current first signal.

[0082] Alternatively, the normalization processing unit 42 may store past first signals that the normalization processing unit 42 has determined to be normal, and when it determines that the first signal is abnormal, it may calculate a moving average of the current first signal and the past first signals and output the calculation result to the averaging processing unit 43. Note that this past first signal may be only the previous first signal, or may be multiple past first signals.

[0083] Alternatively, the normalization processing unit 42 may acquire and store the reference value Tsp set in the reference setting unit 72 of the handler 50 described below, and output this reference value Tsp as is to the averaging processing unit 43 when it determines that the first signal is abnormal.

[0084] By performing this normalization process, even if the first signal has an abnormal value or is missing due to miscontact or communication failure between the DUT 100 and the socket 20, a normal first signal can be output to the handler 50, thereby stabilizing the control of the temperature adjustment device 60 by the control device 70.

[0085] The averaging processing unit 43 performs averaging processing on the first signal output from the normalization processing unit 42, and outputs the calculation result as a second signal to the conversion unit 73 of the handler 50. As described above, the first signal is irregularly acquired from the DTS 130 by the acquisition unit 41, and therefore the second signal is also irregularly output from the averaging processing unit 43 to the conversion unit 73 of the handler 50. The tester 10 and the handler 50 are connected via a cable (not shown), and signals and data can be exchanged between the tester 10 and the handler 50 via GBIP communication. The tester 10 and the handler 50 may also be connected via a LAN.

[0086] Although not particularly limited, the following process can be given as a specific example of the averaging process. For example, the averaging process unit 43 stores past first signals output from the normalization process unit 42 and calculates a moving average of the current first signal and the past first signals. Note that this past first signal may be only the previous first signal, or may be multiple past first signals. By performing such averaging process on the first signals, it is possible to reduce noise contained in the first signals, thereby improving accuracy, and also to reduce the amount of data communication between the tester 10 and the handler 50.

[0087] The plurality of first signals averaged by the averaging processing unit 43 may be acquired by the acquiring unit 41 in response to a plurality of request commands during the same test, may be acquired across a plurality of tests, or may be a mixture of these. The averaging process performed by the averaging processing unit 43 is not particularly limited to the above, as long as it can improve accuracy and reduce the amount of data communication.

[0088] The switching unit 44 enables or disables the averaging processing unit 43. That is, the switching unit 44 switches between enabling and disabling the averaging processing by the averaging processing unit 43 on the first signal.

[0089] Specifically, when the switching unit 44 enables the averaging unit 43, the averaging unit 43 performs the above-mentioned averaging process on the first signal output from the normalization unit 42. On the other hand, when the switching unit 44 disables the averaging unit 43, the averaging unit 43 does not perform the averaging process on the first signal output from the normalization unit 42, and outputs the first signal as a second signal to the conversion unit 73 of the handler 50 as is.

[0090] The switching unit 44 may enable or disable the normalization processing unit 42. Specifically, when the switching unit 44 enables the normalization processing unit 42, the normalization processing unit 42 performs the above-described normalization processing on the first signal output from the acquisition unit 41. On the other hand, when the switching unit 44 disables the normalization processing unit 42, the normalization processing unit 42 does not perform the normalization processing on the first signal output from the acquisition unit 41, and outputs the first signal as is to the averaging processing unit 43.

[0091] Alternatively, the switching unit 44 may enable or disable the averaging processing unit 43 and also enable or disable the normalization processing unit 42. When the switching unit 44 enables both the normalization processing unit 42 and the averaging processing unit 43, the first signal on which both the normalization processing and the averaging processing have been performed is output as the second signal to the conversion unit 73 of the handler 50. On the other hand, when the switching unit 44 enables the normalization processing unit 42 and disables the averaging processing unit 43, the first signal on which only the normalization processing has been performed is output as the second signal to the conversion unit 73 of the handler 50. When the switching unit 44 disables the normalization processing unit 42 and enables the averaging processing unit 43, the first signal on which only the averaging processing has been performed is output as the second signal to the conversion unit 73 of the handler 50. Furthermore, when the switching unit 44 disables both the normalization processing unit 42 and the averaging processing unit 43, neither the normalization processing nor the averaging processing is performed, and the first signal acquired by the acquisition unit 41 is output as is to the conversion unit 73 of the handler 50 as the second signal.

[0092] An operator of the device test apparatus 1 can select whether to enable or disable the averaging processor 43 and the normalization processor 42 by operating the switching unit 44 depending on the reliability of the first signal and the amount of data communication.

[0093] 1, the handler 50 carries and presses the DUT 100 against the socket 20. The handler 50 includes a contact arm 51, a temperature adjustment device 60, a control device 70, and a second acquisition device 80 (see FIG. 5).

[0094] The contact arm 51 includes an arm body 52 and a pusher 53. The arm body 52 is equipped with an actuator (not shown) for horizontal movement, allowing it to move forward, backward, left, and right. The arm body 52 also includes an actuator (not shown) for vertical movement, allowing it to move up and down. The pusher 53 is provided at the tip of the arm body 52. ​​The pusher 53 is capable of holding the DUT 100 by vacuum suction or the like.

[0095] The upper part of the test head 12 enters the handler 50 through the opening, and the socket 20 is located inside the handler 50. Then, the arm body 52 moves horizontally while holding the DUT 100 on the pusher 53, thereby transporting the DUT 100 above the socket 20 located inside the handler 50. Next, the arm body 52 moves down, pressing the DUT 100 against the socket 20.

[0096] As shown in Fig. 7, an internal space 54 is formed in the pusher 53 of the contact arm 51. Flow paths 551, 552 formed in the arm body 52 communicate with this internal space 54, and the internal space 54 is connected to the temperature adjustment device 60 via these flow paths 551, 552. A temperature sensor 56 that detects the temperature of the DUT 100 is embedded in the pusher 53. The temperature sensor 56 is connected to the control device 70 so as to be able to transmit the detection result to the control device 70. Note that, for convenience of explanation, in Fig. 7, the DUT 100 is shown separated from the pusher 53; however, in reality, the DUT 100 is held by the contact arm 51 and is in contact with the pusher 53.

[0097] The temperature adjustment device 60 adjusts the temperature of the DUT 100 to enable high-temperature or low-temperature testing of the DUT 100 and to offset self-heating of the DUT 100. The temperature adjustment device 60 is a two-liquid mixing type temperature adjustment device that mixes a heating liquid and a cooling liquid at an arbitrary ratio and supplies the mixed liquid to the pusher. The temperature adjustment device 60 may be the device disclosed in U.S. Patent Application Publication No. 2019 / 302178 or U.S. Patent Application Publication No. 2015 / 0268295. Specifically, as shown in FIG. 7 , the temperature adjustment device 60 includes a first fluid supply source 61, a second fluid supply source 62, first to fifth flow paths 631 to 635, first to fourth switches 641 to 644, a flow rate regulator 645, and a temperature sensor 65.

[0098] The first fluid supply source 61 adjusts the temperature of a first fluid to a first temperature and supplies the first fluid to the first flow path 631 or the second flow path 632. On the other hand, the second fluid supply source 62 adjusts the temperature of a second fluid to a second temperature and supplies the second fluid to the second flow path 632 or the first flow path 631. The first and second temperatures are different from each other. For example, the first temperature is lower than the second temperature. In this case, the first fluid functions as a coolant and the second fluid functions as a hot medium. A specific example of the first and second fluids is brine, a fluorine-based inert solution.

[0099] The first switch 641 switches the supply source to the first flow path 631 between the first and second fluid supply sources 61 and 62. On the other hand, the second switch 642 switches the supply source to the second flow path 632 between the second and first fluid supply sources 62 and 61. The flow rate regulator 645 is provided in the second flow path 632, and regulates the flow rate of the fluid guided from the second flow path 632 to the third flow path 633. A three-port valve can be given as a specific example of the first and second switches 641 and 642 and the flow rate regulator 645.

[0100] The third flow path 633 communicates with the flow path 551 on the inlet side of the arm main body 52, and the mixed fluid flows through the internal space 54 of the pusher 53. At this time, heat is exchanged between the mixed fluid and the pusher 53, thereby heating or cooling the DUT 100.

[0101] The fourth flow path 634 is connected to a flow path 552 on the outlet side of the arm body 52. ​​The used mixed fluid is discharged to this fourth flow path 634 from the internal space 54 of the pusher 53. The third switch 643 switches the connection destination of the fourth flow path 634 to either the first or second fluid supply source 61, 62. On the other hand, the fluid that was not guided to the third flow path 633 is discharged from the flow rate regulator 645 to the fifth flow path 635. The fourth switch 644 switches the connection destination of the fifth flow path 635 to either the second or first fluid supply source 62, 61. A specific example of the third and fourth switches 643, 644 can be a three-port valve.

[0102] The temperature sensor 65 is provided in the third flow path 633. The temperature sensor 65 is connected to the control device 70 so as to be able to output the detection result. As a signal used to control the temperature adjustment device 60, the detection result of the temperature sensor 65 may be used instead of a fifth signal Ttd, which will be described later.

[0103] Note that instead of the method of adjusting the temperature of the DUT 100 via the pusher 53 (pusher cooling method) described above, a method of adjusting the temperature of the DUT 100 via the pusher 53 and carrier 200 (carrier cooling method) may be used as shown in Fig. 8. Fig. 8 is a cross-sectional view showing the configuration of a contact arm 51B and a carrier 200 in another embodiment of the present invention.

[0104] 8, a contact arm 51B holds a carrier 200 that houses a DUT 100 in a housing portion 210, and the carrier 200 is pressed against a socket 20, thereby electrically connecting the DUT 100 and the socket 20 via the carrier 200. A flow path 220 for passing a fluid is formed in the carrier 200. Although not particularly limited, the carrier 200 may be, for example, a carrier described in Japanese Patent Application Laid-Open No. 2023-16503.

[0105] 8, flow paths 553 and 554 are formed in the contact arm 51B. The flow path 553 is connected to the third flow path 633 of the temperature adjustment device 60, and a fluid whose temperature has been adjusted by the temperature adjustment device 60 is continuously supplied to the flow path 553. The flow paths 553 and 554 open at the tip surface of the pusher 53 so as to face the inlet and outlet of the flow path 220 of the carrier 200. When the contact arm 51B holds the carrier 200, the flow paths 553 and 554 of the contact arm 51B communicate with the flow path 220 of the carrier 200. Therefore, the fluid supplied to the flow path 553 of the contact arm 51B enters the flow path 220 of the carrier 200 and exchanges heat with the DUT 100, thereby adjusting the temperature of the DUT 100. The flow path 554 of the contact arm 51B is connected to the fourth flow path 634 of the temperature adjustment device 60 described above, and the fluid that has passed through the flow path 220 is discharged into the flow path 554 and collected in the temperature adjustment device 60.

[0106] Alternatively, although not specifically shown, instead of the contact arm 51, the handler 50 may be of a type that presses the DUT 100 accommodated in a test tray against the socket 20 using a Z drive device. In this case, the above-mentioned internal space 54 is formed in a pusher attached to the Z drive device.

[0107] Alternatively, although not specifically shown, a socket cooling method may be used instead of the pusher cooling method, in which a fluid is supplied into the socket 20 to adjust the temperature of the DUT 100 .

[0108] Furthermore, as a temperature adjustment device for adjusting the temperature of the DUT 100, instead of the above-mentioned two-liquid mixing type temperature adjustment device 60, other temperature adjustment devices including a gas mixing type, a chamber type, a hot plate type, and a Peltier type may be used.

[0109] The gas mixing method is a method in which a mixed fluid formed by mixing a continuously supplied gas (nitrogen or air) whose temperature is adjusted by a heater with intermittently supplied room temperature air is supplied to the socket. Although not particularly limited, this gas mixing method is, for example, a method such as that described in WO 2023 / 084612 or WO 2023 / 084613.

[0110] The chamber method adjusts the temperature of the DUT by controlling the ambient temperature inside the chamber using a heater and nitrogen gas. The hotplate method adjusts the temperature of the DUT by placing the DUT on a plate and heating the plate. The Peltier method adjusts the temperature of the DUT by heating or cooling a Peltier element that is in thermal contact with the DUT.

[0111] 1 and 5, the control device 70 uses the second signals output from the first acquisition devices 40a to 40c to control the temperature adjustment device 60. Specifically, the control device 70 controls the first and second fluid supply sources 61, 62, the first to fourth switches 641 to 644, and the flow rate regulator 645 of the temperature adjustment device 60.

[0112] 5, the control device 70 of this embodiment includes a target temperature setting unit 71 and a control unit 78 to control the temperature adjustment device 60. The control device 70 controls the temperature adjustment device 60 using a plurality of second signals output from the first acquisition devices 40a to 40c of the tester 10, thereby adjusting the temperature of the fluid supplied from the temperature adjustment device 60 to the internal space 54 of the pusher 53.

[0113] The control device 70 is functionally realized, for example, by a computer that controls the handler 50. Although not specifically shown, this computer is an electronic calculator equipped with a CPU, a main memory device (such as RAM), an auxiliary memory device (such as a hard disk or SSD), and an interface. This computer can functionally execute the target temperature setting unit 71 and the control unit 78 by reading and executing a program stored in the auxiliary memory device.

[0114] 5, target temperature setting unit 71 sets target temperature Tsp' using a plurality of second signals output from tester 10. This target temperature setting unit 71 includes a reference setting unit 72, a plurality of (three in this embodiment) conversion units 73a to 73c, an identification unit 74, a selection unit 75, a first calculation unit 76, and a correction unit 77. Note that the method of setting target temperature Tsp' by target temperature setting unit 71 is not particularly limited to the method described below.

[0115] The three conversion units 73a to 73c have the same configuration, and in this embodiment, the conversion units 73a to 73c are collectively referred to as "conversion unit 73." First acquisition devices 40a to 40c are connected to the conversion units 73a to 73c, respectively, with the first acquisition device 40a outputting a second signal to the conversion unit 73a, the first acquisition device 40b outputting a second signal to the conversion unit 73b, and the first acquisition device 40c outputting a second signal to the conversion unit 73c. ​​The number of conversion units 73 included in the target temperature setting unit 71 is not particularly limited to the above, and can be set according to the number of first acquisition devices 40 included in the tester 10.

[0116] The reference setting unit 72 stores a reference value (reference temperature) Tsp, which is an initial target temperature of the DUT 100 during testing, and outputs this reference value Tsp to the correction unit 77. This reference value Tsp is set in the reference setting unit 72 by, for example, being input to the control unit 70 by an operator of the device testing apparatus 1 via an input device.

[0117] Meanwhile, each conversion unit (synchronization unit) 73 receives a second signal from the first acquisition device 40 of the tester 10 described above. As described above, this second signal is output irregularly from the first acquisition device 40. Therefore, this conversion unit 73 converts the second signal from an irregular signal (asynchronous signal) to a regular signal (synchronous signal) and outputs the converted second signal to the selection unit 75. The reference value Tsp and a fifth signal Ttd (described later) are both regular signals, and the second signal is converted into a regular signal (synchronous signal) synchronized with these regular signals Tsp and Ttd.

[0118] Specifically, when the conversion unit 73 receives a second signal from the first acquisition device 40, it stores the second signal in a storage unit and outputs the second signal at regular time intervals to the selection unit 75. Then, when a new second signal is received from the first acquisition device 40, it updates the second signal stored in the storage unit and outputs the updated second signal at regular time intervals to the selection unit 75. Note that the conversion unit 73 may convert the second signal from an irregular signal to a regular signal using a Kalman filter.

[0119] In this way, in this embodiment, the conversion unit 73 converts the second signal from an irregular signal to a regular signal, so that even if the timing at which the acquisition unit 41 acquires the first signal is irregular due to branching of the test program to acquire the first signal during testing, the control device 70 can stably control the temperature adjustment device 60.

[0120] The identification unit 74 stores in advance the correspondence between the names of individual tests in the test program (for example, "Test A," "Test B," "Test B'," and "Test C" shown in FIG. 4) and the driving parts of the DUT 100. To explain this in more detail using the example shown in FIGS. 3 and 4, part 101 is associated as the part of the DUT 100 that is driven and generates heat when test B is executed. Similarly, part 102 is associated as the part that is driven and generates heat when test B' is executed, and part 103 is associated as the part that is driven and generates heat when test C is executed.

[0121] 5, the identification unit 74 is connected to the test execution unit 30 of the tester 10, and is able to acquire the name of the test being executed on the DUT 100 from the test execution unit 30. Based on the test name acquired from the test execution unit 30, the identification unit 74 identifies the part of the DUT 100 that is generating heat due to the execution of that test.

[0122] 3 and 4, when the test being executed is "Test B," the identifying unit 74 identifies the part 101 as the heat-generating part of the DUT 100. On the other hand, when the test being executed is "Test B'," the identifying unit 74 identifies the part 102 as the heat-generating part of the DUT 100, and when the test being executed is "Test C," the identifying unit 74 identifies the part 103 as the heat-generating part of the DUT 100. Then, the identifying unit 74 outputs the heat-generating part identified based on the test name to the selecting unit 75 and the first calculating unit 76.

[0123] The selection unit 75 stores in advance the positional relationship between the heat generating portions 101 to 103 in the DUT 100 and the DTSs 130a to 130c. Based on the heat generating portion identified by the identification unit 74, the selection unit 75 selects one or more second signals from the plurality of second signals output from the conversion units 73a to 73c.

[0124] For example, if one DTS 130 is included in the heat-generating area identified by the identification unit 74, the selection unit 75 selects one second signal from the multiple second signals output from the conversion units 73a to 73c. ​​The one second signal selected by the selection unit 75 is a second signal generated using the detection result of the DTS 130 included in the heat-generating area.

[0125] 3 and 4, when the identification unit 74 identifies the part 101 as a heat-generating part, the selection unit 75 outputs only the second signal using the detection result of the DTS 130a (i.e., the second signal from the conversion unit 73a) to the first calculation unit 76, but does not output the second signal using the detection results of the DTSs 130b and 130c (i.e., the second signal from the conversion units 73b and 73c) to the first calculation unit 76. On the other hand, when the identification unit 74 identifies the part 102 as a heat-generating part, the selection unit 75 outputs only the second signal using the detection result of the DTS 130b (i.e., the second signal from the conversion unit 73b) to the first calculation unit 76, but does not output the second signal using the detection results of the DTSs 130a and 130c (i.e., the second signal from the conversion units 73a and 73c) to the first calculation unit 76.

[0126] On the other hand, if there is no DTS 130 included in the heat generating area identified by the identification unit 74, the selection unit 75 selects two second signals from the multiple second signals output from the conversion units 73a to 73c. ​​The two selected second signals are signals generated using the detection results of two DTSs 130 close to the heat generating area.

[0127] 3 and 4, when the identification unit 74 identifies the area 103 as a heat-generating area, the selection unit 75 outputs two second signals (i.e., two second signals from the conversion units 73b and 73c) using the detection results of the two DTSs 130b and 130c that are close to the area 103 to the first calculation unit 76, but does not output the second signal (i.e., the second signal from the conversion unit 73a) using the detection result of the DTS 130a to the first calculation unit 76. Note that the number of second signals selected by the selection unit 75 is not particularly limited to the above, and for example, the selection unit 75 may select three or more second signals generated using the detection results of three or more DTSs 130 that are close to the heat-generating area.

[0128] The first calculation unit 76 also stores in advance the positional relationship between the heat-generating portions 101-103 and the DTSs 130a-130c in the DUT 100. When a plurality of second signals are input from the selection unit 75, the first calculation unit 76 calculates the internal temperatures of the DUT 100 corresponding to the heat-generating portions from the plurality of second signals using, for example, an interpolation method.

[0129] To explain this in more detail using the examples shown in Figures 3 and 4, when the identification unit 74 identifies the part 103 as the heat-generating part, the first calculation unit 76 calculates the internal temperature of the DUT 100 corresponding to the heat-generating part 103 from the two second signals output from the selection unit 75, for example using interpolation, based on the positional relationship between the heat-generating part 103 and the two DTSs 130b and 130c.

[0130] Then, the first calculation unit 76 outputs the calculation result as a third signal to the correction unit 77. On the other hand, when only one second signal is input from the selection unit 75, the first calculation unit 76 outputs the second signal as it is as a third signal to the correction unit 77 without performing any particular calculation. The first calculation unit 76 corresponds to an example of a "calculation unit" in an aspect of the present invention.

[0131] The target temperature setting unit 71 does not necessarily have to include the selection unit 75. In this case, the plurality of conversion units 73a-73b directly output a plurality of second signals to the first calculation unit 76. The first calculation unit 76 then calculates the internal temperature of the DUT 100 corresponding to the heat-generating portion identified by the identification unit 74 from the plurality of second signals output from the plurality of conversion units 73a-73b, for example, by using an interpolation method based on the positional relationship between the heat-generating portion and the plurality of DTSs 130. The first calculation unit 76 then outputs the calculation result as a third signal to the correction unit 77. The method by which the first calculation unit 76 calculates the internal temperature of the DUT 100 corresponding to the heat-generating portion from the plurality of second signals is not particularly limited to the interpolation method described above.

[0132] The correction unit 77 sets the target temperature Tsp' by correcting the reference value Tsp set by the reference setting unit 72 using the third digital signal output from the first calculation unit 76. Here, the third signal based on the first signal indicating the internal temperature of the DUT 100 with high accuracy should match the reference value Tsp. Therefore, in this embodiment, the correction unit 77 automatically adjusts the target temperature Tsp' by taking the third signal into account by adding the difference of the third signal from the reference value Tsp to the reference value Tsp. Specifically, the correction unit 77 includes a second calculation unit 771, an adjustment unit 772, and a third calculation unit 773. Note that the method of correcting the reference value Tsp by the correction unit 77 is not particularly limited to the method described below.

[0133] The second calculation unit 771 receives the reference value Tsp from the reference setting unit 72 and the third signal from the first calculation unit 76. Then, the second calculation unit 771 calculates the difference ΔT between the reference value Tsp and the third signal, and outputs this difference ΔT to the adjustment unit 772.

[0134] The adjustment unit 772 adjusts the difference ΔT calculated by the second calculation unit 771 and outputs the adjusted difference ΔT to the third calculation unit 773. Specifically, the adjustment unit 772 adjusts the difference ΔT by multiplying the difference ΔT by a gain constant K. For example, the gain constant K is set to less than 1 (K<1), and the adjustment unit 772 adjusts the difference ΔT so that the difference ΔT becomes smaller. This makes it possible to suppress sudden fluctuations in the third signal and stabilize the behavior of the control device 70. Note that the adjustment unit 772 may adjust the difference ΔT using PID control instead of the proportional control described above. Furthermore, when the reliability of the third signal is high, the gain constant K may be set to 1 (K=1) or may be set to a value greater than 1 (K>1).

[0135] The third calculation unit 773 receives the adjusted difference ΔT from the adjustment unit 772 and also receives the reference value Tsp from the reference setting unit 72. Then, the third calculation unit 773 calculates the target temperature Tsp′ by adding the difference ΔT adjusted by the adjustment unit 772 to the reference value Tsp, and outputs this target temperature Tsp′ to the control unit 78.

[0136] The control unit 78 controls the temperature adjustment device 60 based on the target temperature Tsp′ set by the target temperature setting unit 71. The control unit 78 includes a fourth calculation unit 781. The second acquisition device 80 is connected to the fourth calculation unit 781.

[0137] The second acquisition device 80 includes an A / D converter 81. This A / D converter 81 is connected to the socket 20 and also to the fourth calculation unit 781. As described above, the thermal diode 120 of the DUT 100 is connected to the terminal 140 of the DUT 100. When the DUT 100 is pressed against the socket 20, the thermal diode 120 and the A / D converter 81 are electrically connected via the terminal 140 of the DUT 100 and the contact 21 of the socket 20, and a fourth signal indicating the internal temperature of the DUT 100 is output from the thermal diode 120 to the A / D converter 81.

[0138] The fourth signal output from the thermal diode 120 is an analog signal, and is therefore continuously output from the thermal diode 120 to the A / D converter 81. A dedicated contact 21 is also assigned to the thermal diode 120, and the analog signal is constantly output from the thermal diode 120 to the A / D converter 81.

[0139] The A / D converter 81 converts the fourth signal output from the thermal diode 120 into a digital signal and outputs the digital signal as a fifth signal Ttd to the fourth calculation unit 781. Note that this fifth signal Ttd is a signal obtained by simply converting the analog signal output from the thermal diode 160 into a digital signal, and the A / D converter 81 does not perform any calculations such as corrections on the analog signal.

[0140] The fourth calculation unit 781 then calculates the difference between the target temperature Tsp′ input from the third calculation unit 773 of the target temperature setting unit 71 and the fifth signal Ttd input from the second acquisition device 80. The control unit 78 then calculates a control variable that reduces this difference using PID control, and adjusts the temperature of the fluid passing through the internal space 54 of the pusher 53 by PWM-controlling the temperature adjustment device 60 in accordance with this control variable. Specifically, the control unit 78 adjusts the flow rate of the fluid guided from the second flow path 632 to the third flow path 633 by PWM-controlling the flow rate regulator 645 in accordance with the above control variable. This adjusts the mixing ratio of the first fluid and the second fluid, i.e., the temperature of the mixed fluid.

[0141] Note that, instead of the output from the thermal diode 120, the detection result detected by the temperature sensor 56 provided on the pusher 53 of the contact arm 51 may be input to the fourth calculation unit 781. Alternatively, instead of the output from the thermal diode 120, the detection result detected by the temperature sensor 65 provided in the temperature adjustment device 60 may be input to the fourth calculation unit 781. Alternatively, instead of the output from the thermal diode 120, a correction value Tj′ obtained by correcting the junction temperature Tj with an analog signal from the thermal diode, as described in U.S. Patent Application Publication No. 2019 / 0101587, for example, may be input to the fourth calculation unit 781.

[0142] As described above, in this embodiment, the plurality of first acquisition devices 40a-40c acquire first signals output from the DTSs 130a-130c and indicating the internal temperatures of the DUTs, respectively, and output second signals, and the control device 70 uses the plurality of second signals to control the temperature adjustment device 60. As a result, even if the temperature distribution of the DUT 100 becomes uneven due to partial driving of the circuit of the DUT 100, it is possible to detect the temperature of the driven portion of the circuit being tested within the DUT 100, thereby improving the accuracy of temperature adjustment.

[0143] It should be noted that the above-described embodiments have been described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0144] For example, in the above-described embodiment, the correction unit 77 corrects the target temperature Tsp, but the object of correction by the correction unit 77 is not limited to this, and the correction unit 77 may correct the fifth signal Ttd output from the second acquisition device 80 that has acquired the fourth signal from the thermal diode 120.

[0145] In this case, as shown in FIG. 9 , the reference setting unit 72 inputs the reference value Tsp as the target temperature directly to the fourth calculation unit 781 of the control unit 78. A correction unit 77 is interposed between the second acquisition device 80 and the fourth calculation unit 781. The correction unit 77 corrects the fifth signal Ttd and inputs the corrected fifth signal Ttd′ to the fourth calculation unit 781. Although not shown, the correction unit 77 includes a second calculation unit 771 that calculates the difference between the third signal and the fifth signal Ttd, an adjustment unit 772 that adjusts the difference, and a third calculation unit 773 that adds the adjusted difference to the fifth signal Ttd. The fourth calculation unit 781 then calculates the difference between the reference value Tsp and the corrected fifth signal Ttd′, and the control unit 78 controls the temperature adjustment device 60 based on this difference. Note that FIG. 9 is a block diagram showing a modified example of the control device according to this embodiment.

[0146] In the above-described embodiment, the tester 10 includes the acquisition unit 41, the normalization processing unit 42, the averaging processing unit 43, and the switching unit 44, but this is not particularly limited to this. For example, the handler 50 may include at least one of the acquisition unit 41, the normalization processing unit 42, the averaging processing unit 43, and the switching unit 44. In the above-described embodiment, the handler 50 includes the target temperature setting unit 71 and the control unit 78, but this is not particularly limited to this. For example, the tester 10 may include at least one of the target temperature setting unit 71 and the control unit 78.

[0147] In the above embodiment, an example has been described in which temperature control using a plurality of second signals is applied to a semiconductor device testing apparatus 1 in a back-end process that includes a tester 10 and a handler 50. However, the temperature control using a plurality of second signals described above may also be applied to a semiconductor device testing apparatus in a front-end process that includes a prober. Alternatively, the temperature control using a plurality of second signals described above may also be applied to a burn-in apparatus or an SLT (System Level Test) apparatus. [Explanation of symbols]

[0148] 1...Device testing equipment 2. Temperature control system 10...Tester 30...Test execution section 40, 40a to 40c...First acquisition device 50...Handler 51...Contact arm 53... Pusher 54...Interior space 56...Temperature sensor 60…Temperature adjustment device 70...Control device 71…Target temperature setting section 72...Standard setting section 73, 73a to 73c...Conversion section 74…Specific part 75...Selection section 76...first calculation unit 77...Correction section 78...Control unit 80...Second acquisition device 81...A / D converter 100...DUT 101~103…parts 110…Main circuit 120...Thermal diode 130, 130a~130c…DTS 200...Career

Claims

1. a temperature adjustment device for adjusting the temperature of the DUT, the temperature adjustment device including a plurality of first temperature detection circuits; a plurality of first acquisition devices each acquiring a first signal indicating an internal temperature of the DUT output from the first temperature detection circuit and outputting a second signal; a control device that controls the temperature adjustment device using the second signals output from the first acquisition devices.

2. 10. The temperature adjustment system of claim 1, the control device includes a selection unit that selects one or more second signals from the plurality of second signals output from the first acquisition device; The control device controls the temperature adjustment device using the one or more second signals.

3. The temperature adjustment system according to claim 2, the control device includes a calculation unit that calculates a third signal using the one or more second signals selected by the selection unit, The control device controls the temperature adjustment device using the third signal.

4. 10. The temperature adjustment system of claim 1, the control device includes a calculation unit that calculates a third signal using the plurality of second signals output from the first acquisition device; The control device controls the temperature adjustment device using the third signal.

5. The temperature adjustment system according to any one of claims 1 to 4, The control device is a temperature adjustment system including an identification unit that identifies a heat-generating portion of the DUT based on a test program that is currently being executed to test the DUT.

6. The temperature adjustment system according to any one of claims 1 to 5, the plurality of second signals are outputted irregularly from the plurality of first acquisition devices; The control device is a temperature adjustment system including a plurality of conversion units that convert the second signal from an irregular signal to a regular signal.

7. The temperature adjustment system according to any one of claims 1 to 6, The first acquisition device is a temperature adjustment system including an acquisition unit that acquires the first signal from the first temperature detection circuit using a test program that executes a test on the DUT.

8. The temperature adjustment system according to any one of claims 1 to 7, A temperature adjustment system, wherein the first signal output by the first temperature detection circuit is a first digital signal.

9. A temperature adjustment system according to any one of claims 1 to 8, the temperature adjustment system includes a second acquisition device that acquires a fourth signal indicating an internal temperature of the DUT, the fourth signal being output from a second temperature detection circuit included in the DUT, and outputs a fifth signal; The control device controls the temperature adjustment device using the plurality of second signals and the fifth signal.

10. 10. The temperature regulation system of claim 9, A temperature adjustment system, wherein the fourth signal output by the second temperature detection circuit is an analog signal.

11. The temperature adjustment system according to any one of claims 1 to 10, a temperature sensor provided on the DUT or a pusher that presses a carrier containing the DUT against a socket; The control device controls the temperature adjustment device using the plurality of second signals and the detection result of the temperature sensor.

12. A control device for controlling a temperature adjustment device that adjusts a temperature of a DUT having a plurality of first temperature detection circuits, the control device controls the temperature adjustment device using a plurality of second signals output from a plurality of first acquisition devices; A control device in which each of the second signals is a signal output from the first acquisition device that acquires a first signal indicating the internal temperature of the DUT from the first temperature detection circuit.

13. A device handling apparatus that handles a DUT having a plurality of first temperature detection circuits or a carrier accommodating the DUT, and presses the DUT or the carrier against a socket, a temperature adjusting device for adjusting the temperature of the DUT; A device handling apparatus comprising: the control device according to claim 12.

14. 14. A device handling apparatus according to claim 13, comprising: a pusher for pressing the DUT or the carrier against the socket; a temperature sensor provided in the pusher, The control device controls the temperature adjustment device using the plurality of second signals and the detection result of the temperature sensor.

15. A tester for testing a DUT electrically connected to a socket or the DUT housed in a carrier electrically connected to the socket, the tester comprising a plurality of first temperature detection circuits, The tester includes a plurality of first acquisition devices that acquire first signals output from the first temperature detection circuit and indicating the internal temperature of the DUT, and output second signals, respectively.

16. 1. A device testing apparatus comprising a plurality of first temperature detection circuits, the device testing apparatus testing a DUT electrically connected to a socket or the DUT housed in a carrier electrically connected to the socket, A device testing apparatus comprising the temperature adjustment system according to any one of claims 1 to 11.

17. A device testing apparatus for testing a DUT having a plurality of first temperature detection circuits, a temperature adjusting device for adjusting the temperature of the DUT; The control device according to claim 12; A device testing apparatus comprising: the tester according to claim 15.

18. A device testing apparatus for testing a DUT having a plurality of first temperature detection circuits, A device handling apparatus according to claim 13 or 14; A device testing apparatus comprising: the tester according to claim 15.

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