Multilayer composite article

Abstract

To provide a composite article designed to provide protection, high radio frequency transparency, high hydrophobicity, and / or structural integrity in a single multilayer structure.SOLUTION: Provided is a composite article that may include a structural substrate 110, a multilayer fluoropolymer film 130, and a low-melt fluoropolymer adhesion layer 120 that may include PVDF, the low-melt fluoropolymer adhesion layer contacting the structural substrate and the multilayer fluoropolymer film, the composite article having a first peak peel strength of 175 NPM or more.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure provides a method for providing protection, high radio frequency transparency, high hydrophobicity, and The present invention relates to composite articles designed to provide structural integrity and / or mechanical strength. Summary of the Invention [Problem to be solved by the invention]

[0002] High frequency (5GHz to 40GHz or more) transmission such as 5G antennas and terrestrial-satellite antennas Communications applications offer high speeds but are very sensitive to interference due to the short wavelengths of their signals. These sensitive parts of electronic equipment are protected from the outdoor elements where they are typically installed. protection is required, but this protective material must provide some functionality. For example, the material may have high RF transparency, high thermal conductivity to reduce water, ice, and / or snow accumulation, and It has a hydrophobic surface and structural integrity to form a protective shape around the communication device. Therefore, it is desirable to provide a multi-layer composite that exhibits improved performance in these functionalities. Materials are desired.

[0003] According to a first aspect, a composite article may include a structural substrate and a high melting point fluoropolymer layer. a multilayer fluoropolymer film in contact with the structural substrate and the fluoropolymer film; and a low melting point fluoropolymer adhesive layer capable of adhering to the adhesive. The adhesive layer may have a melting temperature A1 and the low melting point fluoropolymer adhesive layer may have a melting temperature A2. The melting temperature A2 may be lower than the melting temperature A1.

[0004] According to another aspect, a composite article includes a structural substrate, a multilayer fluoropolymer film, and a P and a low melting point fluoropolymer adhesive layer which may include VDF. The polymer adhesive layer may contact the structural substrate and the multilayer fluoropolymer film.

[0005] According to yet another aspect, a composite article comprises a structural substrate and a multilayer fluoropolymer filler. and a low melting point fluoropolymer adhesive layer which may include a PVDF-HFP copolymer. The low melting point fluoropolymer adhesive layer may be formed on the structural substrate and the multilayer fluoropolymer film. May come into contact with the rum.

[0006] According to yet another aspect, a composite article comprises a structural substrate, a multilayer fluoropolymer film, and The adhesive layer may include a transition layer and a low melting point fluoropolymer adhesive layer. The transition layer may comprise a multilayer fluoropolymer film and a low melting point PVDF. The low melting point fluoropolymer adhesive layer may further contact the low melting point fluoropolymer adhesive layer. The structural substrate and the transition layer may be in contact. [Brief explanation of the drawings]

[0007] Embodiments are illustrated by way of example and not limitation in the accompanying figures. [Figure 1] FIG. 1 includes a diagram of a composite article constructed in accordance with embodiments described herein. [Figure 2] FIG. 2 includes a diagram of another composite article constructed in accordance with embodiments described herein. [Figure 3a] FIG. 3a includes a plot of peel elongation versus load measured during peel strength testing of sample composite articles. [Figure 3b] FIG. 3b includes a plot of peel elongation versus load measured during peel strength testing of the sample composite articles.

[0008] Those skilled in the art will appreciate that elements in the figures have been illustrated for simplicity and clarity and are not necessarily It should be understood that it is not drawn to scale. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following discussion focuses on specific implementations and embodiments of the teachings. are provided to help describe particular embodiments and are within the scope of this disclosure or teachings. The disclosure and the information provided herein should not be construed as limitations on the scope or applicability of the present invention. It will be understood that other embodiments may be used based on the teachings.

[0010] "comprises," "comprising," "including" The words "deals," "including," "has," and "having" The words "and" or any other variations thereof are intended to cover a non-exclusive inclusion. For example, a method, article, or apparatus that includes a list of features does not necessarily qualify as a method, article, or apparatus that includes only those features. Including, but not limited to, any other features or characteristics not expressly listed. It may also include other features inherent in a method, article, or device. Unless otherwise specified, "or" refers to an inclusive or and not an exclusive or. For example, condition A or B is satisfied by one of the following: A is true (or exists) A exists), B is false (or does not exist), A is false (or does not exist), and B is true is (or exists), and both A and B are (or exist).

[0011] Also, the use of "a" or "an" describes elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This explanation is given for one or a few At least one, or the singular should be understood as including the plural and vice versa For example, where a single item is described herein, two items may be used instead of a single item. Similarly, where two or more items are described herein, In such cases, two or more items may be replaced by a single item.

[0012] The embodiments described herein generally comprise a structural substrate and a multilayer fluoropolymer film. and a low melting point fluoropolymer in contact with the structural substrate and the multilayer fluoropolymer film. and an adhesive layer.

[0013] For illustrative purposes, FIG. 1 illustrates a composite article 10 according to an embodiment described herein. As shown in FIG. 1, the composite article 100 includes a structural substrate 110 and a multilayer fluororesin. The polymer film 130 and its structural substrate 110 and multilayer fluoropolymer film 13 0, and a low melting point fluoropolymer adhesive layer 120 in contact with the adhesive layer 120.

[0014] According to certain embodiments, the multilayer fluoropolymer film 130 comprises a certain number of layers. According to certain embodiments, the multilayer fluoropolymer film 130 may include at least At least about 2 layers, for example, at least about 3 layers, or at least about 4 layers, or at least It may include at least about 5 layers, or at least about 6 layers, or at least about 7 layers. According to other embodiments, the multilayer fluoropolymer film 130 may include no more than about 12 layers. For example, the multilayer fluoropolymer may include up to about 11 layers, or up to about 10 layers. The number of layers of the polymer film 130 is within a range between any of the above minimum and maximum values. It will be appreciated that the number of layers in the multilayer fluoropolymer film 130 may be: It will be appreciated that the value may be any value between any of the minimum and maximum values ​​stated above.

[0015] According to certain embodiments, the multilayer fluoropolymer film 130 may include a certain number of full According to certain embodiments, the multi-layer fluoropolymer film may include a fluoropolymer layer. The film 130 may comprise at least about two fluoropolymer layers, for example, at least about three fluoropolymer layers. polymer layer, or at least about 4 fluoropolymer layers, or at least about 5 fluoropolymer layers polymer layer, or at least about 6 fluoropolymer layers, or at least about 7 full According to yet another embodiment, the multi-layer fluoropolymer The film 130 may comprise up to about 12 fluoropolymer layers, for example up to about 11 fluoropolymer layers. The multilayer fluoropolymer may comprise up to about 10 fluoropolymer layers. The number of fluoropolymer layers in the polymer film 130 is between the minimum and maximum values ​​listed above. It will be understood that the thickness of the multilayer fluoropolymer film 1 may be within the range of 1. The number of 30 fluoropolymer layers can be any value between one of the minimum and maximum values ​​listed above. It will be understood that this may be the case.

[0016] As shown for illustrative purposes in FIG. 1, the multilayer fluoropolymer film 130 comprises three (i.e., layer 131, layer 132, and layer 133).

[0017] According to certain embodiments, at least one of the multilayer fluoropolymer films 130 The layer may be a high melting point fluoropolymer layer.

[0018] According to yet another embodiment, the high melting point fluoropolymer film 130 The polymer layer was analyzed by Differential Scanning Calorimetry according to ASTM D4591. It may have a specific melting temperature A1 as measured using differential scanning calorimetry (DSC). The low melting point fluoropolymer adhesive layer 120 is measured according to a differential scanning calorimeter (DSC). According to a particular embodiment, the low melting point fluoropolymer may have a particular melting temperature A2 such that The melting temperature A2 of the polymer adhesive layer 120 is the high melting point fullerene of the fluoropolymer film 130. The melting temperature of the polymer layer may be less than A1.

[0019] According to yet other embodiments, A2 may be a specific amount less than A1. For example, A2 may be at least about 5 percent less than A1, e.g., may be at least about 10 percent or at least about 15 percent of A1 may be less than about 10 percent of A1, or may be at least about 20 percent of A1, or may be at least about 25 percent less than A1, or at least about 30 percent less than A1 percent, or at least about 35 percent of A1. or may be at least about 40 percent less than A1, or at least about 40 percent less than A1. may be at least about 45 percent or less than about 50 percent of A1. According to yet other embodiments, A2 may be less than about 85 percent of A1. or less, for example, less than about 80 percent of A1 or less; A2 may be less than about 75 percent of A1. A2 may be less than either the minimum or maximum value above. It is understood that the percentage may be less than A1, or any value in the range between Furthermore, A2 may be any value between the minimum and maximum values ​​above. It will be appreciated that the percentage may be any percentage.

[0020] According to certain embodiments, the structural substrate 110 may comprise certain materials, such as: The structural substrate 110 may comprise a thermoforming material. According to yet another embodiment, the structural substrate 110 may comprise a thermoplastic material. may comprise FR4 epoxy glass. According to yet another embodiment, the structural substrate 1 10 may comprise G10 epoxy glass. According to yet another embodiment, the structural group The material 110 may include high-density polyethylene (HDPE). According to yet another embodiment, the structural substrate 110 is made of polypropylene. According to yet another embodiment, the structural substrate 110 may comprise a polypropylene (PP). It may also contain polycarbonate (PC). The structural substrate 110 is made of polyethylene terephthalate (P According to yet another embodiment, the structural substrate 110 may include a glycol PET doped with Gycol (PETG) may also be included. According to this embodiment, the structural substrate 110 is made of FR4, G10, HDPE, or PP. , or PC, or PET, or PETG.

[0021] According to certain embodiments, the structural substrate 110 may be composed of certain materials. For example, the structural substrate 110 may be constructed from a thermoformable material. In accordance with other embodiments, the structural substrate 110 may be constructed from a thermoplastic material. According to an embodiment, the structural substrate 110 may be constructed from FR4 epoxy glass. According to yet another embodiment, the structural substrate 110 is constructed from G10 epoxy glass. According to yet another embodiment, the structural substrate 110 may be made of high density polyethylene. According to yet another embodiment, the structural substrate 11 may be made of HDPE. The outer shell 10 may be made of polypropylene (PP). For example, the structural substrate 110 may be made of polycarbonate (PC). According to another embodiment, the structural substrate 110 is made from polyethylene terephthalate (PET). According to yet another embodiment, the structural substrate 110 may be composed of a glycol In yet another embodiment, the polymer may be made of PET doped with PEG (PETG). According to this, the structural substrate 110 is made of FR4, G10, HDPE, PP, or PC, Alternatively, it may be made of any combination of PET or PETG.

[0022] According to certain embodiments, the structural substrate 110 may be a layer of a particular material. For example, the structural substrate 110 may be a layer of thermoforming material. The structural substrate 110 may be a layer of thermoplastic material. The substrate 110 may be a layer of FR4 epoxy glass. For example, the structural substrate 110 may be a layer of G10 epoxy glass. According to an embodiment, the structural substrate 110 may be a layer of high density polyethylene (HDPE) According to yet another embodiment, the structural substrate 110 is a layer of polypropylene (PP). According to yet another embodiment, the structural substrate 110 may be made of polycarbonate (P C). According to yet another embodiment, the structural substrate 110 may be a layer of polyethylene. According to yet another embodiment, the structure may be a layer of polyethylene terephthalate (PET). The fabrication substrate 110 may be a layer of glycol-doped PET (PETG). According to other embodiments, the structural substrate 110 is made of FR4, or G10, or HDPE, It may be a layer of any combination of PP, PC, PET, or PETG. stomach.

[0023] According to certain embodiments, the structural substrate 110 may be a substrate of a particular material. For example, the structural substrate 110 may be a substrate of a thermoforming material. In yet another embodiment, the structural substrate 110 may be a substrate of a thermoplastic material. For example, the structural substrate 110 may be a substrate of FR4 epoxy glass. According to an embodiment, the structural substrate 110 may be a substrate of G10 epoxy glass. According to another embodiment, the structural substrate 110 is a substrate of high density polyethylene (HDPE). According to yet another embodiment, the structural substrate 110 may be made of polypropylene (P According to yet another embodiment, the structural substrate 110 may be a substrate of polycarbonate. According to yet another embodiment, the structural substrate 1 may be a carbon dioxide (PC) substrate. 10 may be a polyethylene terephthalate (PET) substrate. According to an embodiment, the structural substrate 110 is a substrate of glycol-doped PET (PETG). According to yet other embodiments, the structural substrate 110 may be made of FR4, or G. 10, or HDPE, or PP, or PC, or PET, or PETG, any combination It may also be a composite substrate.

[0024] According to yet other embodiments, the structural substrate 110 may have a particular thickness. For example, the structural substrate 110 may be at least about 0.025 mm, e.g., at least about 0.03 mm, or at least about 0.035 mm, or at least about 0.04 mm, or at least at least about 0.05 mm, or at least about 0.06 mm, or at least about 0.07 mm, or is at least about 0.08 mm, or at least about 0.09 mm, or at least about 0.1 mm, or at least about 0.25 mm, or at least about 0.5 mm, or at least about It may have a thickness of 0.75 mm, or at least about 1.0 mm. According to an embodiment, the structural substrate 110 is about 2.6 mm or less, for example, about 2.5 mm or less, or is about 2.4 mm or less, or about 2.3 mm or less, or about 2.2 mm or less, or about 2.1 mm or less, or about 2.0 mm or less, or about 1.75 mm or less, or about 1.5 mm or less, or The thickness of the structural substrate 110 may be less than or equal to the above minimum. It will be appreciated that the thickness of the structural substrate 110 may range between any of the maximum values. It is further understood that the thickness may be any value between any of the minimum and maximum values ​​listed above. Let's solve it.

[0025] According to yet another embodiment, the structural substrate 110 is made of a material selected from the group consisting of acrylic, ... having a specific glass transition temperature as measured using a differential scanning calorimeter (DSC) For example, the structural substrate 110 may be at least about −150° C., e.g., at least about − 140°C, or at least about -130°C, or at least about -120°C, or at least about -110°C, or at least about -100°C, or at least about -75°C, or at least at least about -50°C, or at least about -25°C, or at least about 0°C, or at least about 2 5°C, or at least about 50°C, or at least about 75°C, or at least about 100 According to yet another embodiment, the structural substrate 110 may have a glass transition temperature of , about 350°C or less, for example, about 340°C or less, or about 330°C or less, or about 320°C or less or about 310°C or less, or about 300°C or less, or about 275°C or less, or about 250°C or less or about 225°C or less, or about 200°C or less. The glass transition temperature of the substrate 110 is within a range between any of the above minimum and maximum values. It will be appreciated that the glass transition temperature of the structural substrate 110 may be greater than or equal to the minimum value set forth above. It will be appreciated that the value may be any value between and any of the maximum values.

[0026] According to yet another embodiment, the structural substrate 110 is made of a PET film according to ASTM E2550. Specific molecular weights, as measured using Thermogravimetric Analysis (TGA), For example, the structural substrate 110 may have a melting temperature of at least about 50° C., e.g., at least about 60°C, or at least about 70°C, or at least about 80°C, or at least at least about 90°C, or at least about 100°C, or at least about 110°C, or at least about 120°C, or at least about 130°C, or at least about 140°C, or at least It may have a decomposition onset temperature of about 150° C. According to yet another embodiment, the structural substrate 1 10 is about 350°C or less, for example, about 340°C or less, or about 330°C or less, or about 320°C or less. °C or less, or about 310 °C or less, or about 300 °C or less, or about 275 °C or less, or about 250 C. or less, or about 225.degree. C. or less, or about 200.degree. C. or less. The decomposition initiation temperature of the structural substrate 110 is within a range between any of the above minimum and maximum values. It will be understood that the decomposition temperature of the structural substrate 110 may be less than the minimum value mentioned above. It will be appreciated that the value may be any value between and any of the maximum values.

[0027] According to still other embodiments, the multilayer fluoropolymer film 130 is, in particular, For example, the multilayer fluoropolymer film 130 may comprise polytetrafluoroethylene. According to yet another embodiment, the multi-layer film may comprise fluoroethylene (PTFE). The fluoropolymer film 130 is made of fluorinated ethylene propylene. According to yet another embodiment, the multilayer fluoropoly MerFilm 130 is a perfluoroalkoxyalkane (P According to yet another embodiment, the multilayer fluoropolymer film may comprise a fluoropolymer film. 130 may comprise modified PTFE (TFM). The fluoropolymer film 130 is made of tetrafluoroethylene, hexafluoropropane, Tetrafluoroethylene, Hexafluoropropylene, and Vinylidene Fluoride According to yet another embodiment, the polymer may comprise a terpolymer of: The multilayer fluoropolymer film 130 may include polyvinylidene fluoride (PVDF). According to yet another embodiment, the multilayer fluoropolymer film 130 may comprise a fluorinated Copolymer of vinylidene and hexafluoropropylene (P(VDF-HFP) or PV According to yet another embodiment, the multilayer fluoropolymer may comprise a fluoropolymer having a thickness of 1000 Å or less. The film 130 may be made of PTFE, FEP, PFA, TFM, THV, PVDF, and P(V DF)-HFP).

[0028] According to yet another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may comprise a specific material, for example, a multilayer fluoropolymer film 130 The fluoropolymer layer may include polytetrafluoroethylene (PTFE). According to another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The layer may include fluorinated ethylene propylene (FEP). According to the present invention, the fluoropolymer layer of the multilayer fluoropolymer film 130 is a perfluoropolymer. According to yet another embodiment, the multi-layer full The fluoropolymer layer of the fluoropolymer film 130 comprises modified PTFE (TFM). According to yet another embodiment, the fluoropolymer film 130 may The polypolymer layer is made of tetrafluoroethylene, hexafluoropropylene, and vinyl fluoride. According to yet another embodiment, the multilayer structure may include a terpolymer of thiazol-1-yl methyl ether (THV). The fluoropolymer layer of the fluoropolymer film 130 is made of polyvinylidene fluoride (PV According to yet another embodiment, the multilayer fluoropolymer film may include a fluoropolymer film having a thickness of 100 μm and a thickness of 100 μm. The fluoropolymer layer of 130 is a copolymer of vinylidene fluoride and hexafluoropropylene. It may also contain other polymers (P(VDF-HFP) or PVDF-HFP). According to an embodiment, the fluoropolymer layer of the multilayer fluoropolymer film 130 is PTF. Any combination of E, FEP, PFA, TFM, THV, PVDF, and P(VDF-HFP) It may include a combination.

[0029] According to yet another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may be made of a specific material, for example, a multi-layer fluoropolymer film. The fluoropolymer layer of Room 130 is made from polytetrafluoroethylene (PTFE). According to yet another embodiment, the multilayer fluoropolymer film 13 The fluoropolymer layer of 0 is made up of fluorinated ethylene propylene (FEP) According to yet another embodiment, the fluoropolymer film 130 may The polymer layer may be composed of perfluoroalkoxyalkane (PFA). According to yet another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may be made of modified PTFE (TFM). According to the present invention, the fluoropolymer layer of the multilayer fluoropolymer film 130 is made of tetrafluoroethylene. Terpolymer of ethylene, hexafluoropropylene, and vinylidene fluoride (THV) According to yet another embodiment, the multilayer fluoropolymer film may be made of The fluoropolymer layer of Room 130 is made up of polyvinylidene fluoride (PVDF). According to yet another embodiment, the fluoropolymer film 130 may include a The fluoropolymer layer is a copolymer of vinylidene fluoride and hexafluoropropylene (P It may be made of vinyl fluoride-based polymer (VDF-HFP) or polyvinyl chloride-based polymer (PVDF-HFP). According to an embodiment, the fluoropolymer layer of the multilayer fluoropolymer film 130 is PTF. Any combination of E, FEP, PFA, TFM, THV, PVDF, and P(VDF-HFP) It may be made up of a combination of

[0030] According to yet another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may be a layer of a specific material. For example, a multilayer fluoropolymer film 1 The fluoropolymer layer of 30 is a layer of polytetrafluoroethylene (PTFE) According to yet another embodiment, the fluoropolymer film 130 The polymer layer may be a layer of fluorinated ethylene propylene (FEP). According to this embodiment, the fluoropolymer layers of the multilayer fluoropolymer film 130 are In yet another embodiment, the layer may be a layer of perfluoroalkoxyalkane (PFA). According to the present invention, the fluoropolymer layer of the multilayer fluoropolymer film 130 is a modified PTFE ( According to yet another embodiment, a multi-layer fluoropolymer film may be used. The fluoropolymer layer of film 130 is made of tetrafluoroethylene, hexafluoropropylene, The layer may be a terpolymer layer of ethylene and vinylidene fluoride (THV). According to this embodiment, the fluoropolymer layers of the multilayer fluoropolymer film 130 are It may be a layer of polyvinylidene difluoride (PVDF). The fluoropolymer layers of the multilayer fluoropolymer film 130 are made of vinylidene fluoride and hexafluoroethylene. Copolymers with tetrafluoropropylene (P(VDF-HFP) or PVDF-HFP) According to yet another embodiment, the multilayer fluoropolymer film 13 The fluoropolymer layer of 0 is made of PTFE, FEP, PFA, TFM, THV, PVDF, and The layer may be a layer of any combination of P(VDF-HFP).

[0031] According to yet another embodiment, the high melting point fluoropolymer film 130 The fluoropolymer layer may comprise a specific material, for example, a multilayer fluoropolymer film. The high melting point fluoropolymer layer of 130 contains polytetrafluoroethylene (PTFE). According to yet another embodiment, the multilayer fluoropolymer film 130 may have a high melting point. The fluoropolymer layer may include fluorinated ethylene propylene (FEP). According to another embodiment, the high melting point fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may contain perfluoroalkoxyalkane (PFA). According to an embodiment, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 is According to yet another embodiment, the multi-layer fluororesin may comprise a modified PTFE (TFM). The high melting point fluoropolymer layer of the polymer film 130 is made of tetrafluoroethylene, hexafluoroethylene, fluoropropylene and terpolymers of vinylidene fluoride (THV) According to yet another embodiment, the high melting point fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may include polyvinylidene fluoride (PVDF). According to an embodiment, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 is Copolymer of vinylidene fluoride and hexafluoropropylene (P(VDF-HFP) or According to yet another embodiment, the multi-layer fluoropolymer may comprise a fluoropolymer. The high melting point fluoropolymer layer of the polymer film 130 is made of PTFE, FEP, PFA, TFM , THV, PVDF, and P(VDF-HFP).

[0032] According to yet another embodiment, the high melting point fluoropolymer film 130 The fluoropolymer layer may be made of a specific material, e.g., a multilayer fluoropolymer. The high melting point fluoropolymer layer of the film 130 is made of polytetrafluoroethylene (PTF According to yet another embodiment, the multilayer fluoropolymer may be composed of: The high melting point fluoropolymer layer of film 130 is fluorinated ethylene propylene (FEP). According to yet another embodiment, the multilayer fluoropolymer film may be made of The high melting point fluoropolymer layer of RUMU 130 is made of perfluoroalkoxyalkane (PFA). According to yet another embodiment, the multilayer fluoropolymer film may be made of The high melting point fluoropolymer layer of RUMU 130 is made of modified PTFE (TFM). According to yet another embodiment, the high melting point of the multilayer fluoropolymer film 130 The fluoropolymer layer is made of tetrafluoroethylene, hexafluoropropylene, and fluorine. The polymer may be a terpolymer of tetravinylidene fluoride (THV). According to an embodiment, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 is a poly It may be made of polyvinylidene fluoride (PVDF). For example, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 may be vinyl fluoride. Copolymer of ethylene and hexafluoropropylene (P(VDF-HFP) or PVDF- According to yet another embodiment, the multilayer fluoropolymer may be made of fluoropolymer (HFP). The high melting point fluoropolymer layer of the polymer film 130 is made of PTFE, FEP, PFA, TFM It may be made of any combination of THV, PVDF, and P(VDF-HFP). stomach.

[0033] According to yet another embodiment, the high melting point fluoropolymer film 130 The fluoropolymer layer may be a layer of a particular material. For example, a multi-layer fluoropolymer film may be used. The high-melting fluoropolymer layer of RUMU 130 is made of polytetrafluoroethylene (PTFE). According to yet another embodiment, the multilayer fluoropolymer film 13 The high melting point fluoropolymer layer of 0 is a layer of fluorinated ethylene propylene (FEP). According to yet another embodiment, the high melting point of the multilayer fluoropolymer film 130 The fluoropolymer layer may be a layer of perfluoroalkoxyalkane (PFA) According to yet another embodiment, the high melting point fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may be a layer of modified PTFE (TFM). According to the present invention, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 is a tetrafluoroethylene. fluoroethylene, hexafluoropropylene, and vinylidene fluoride (THV) According to yet another embodiment, the multi-layer fluoropolymer film may be a layer of fluoropolymer. The high melting point fluoropolymer layer of RUMU 130 is a layer of polyvinylidene fluoride (PVDF). According to yet another embodiment, the high The melting point fluoropolymer layer is a copolymer of vinylidene fluoride and hexafluoropropylene. It may also be a layer of P(VDF-HFP) or PVDF-HFP. According to an embodiment, the high melting point fluoropolymer layer of the multilayer fluoropolymer film 130 is PTFE, FEP, PFA, TFM, THV, PVDF, and P(VDF-HFP) Any combination of layers may be used.

[0034] According to yet another embodiment, the multilayer fluoropolymer film 130 may include a filler. According to certain embodiments, the filler may be titanium dioxide or carbon black. Lacquer, or graphite, or carbon nanotubes, or glass fiber, or glass biscuits or talc, or UV absorbing filler, or white pigment filler, or pigment filler, or Or any combination of these.

[0035] According to yet another embodiment, the fluoropolymer of the multilayer fluoropolymer film 130 The polymer layer may further comprise a filler. According to certain embodiments, the filler is titanium dioxide. Tan, or carbon black, or graphite, or carbon nanotubes, or glass Glass fiber, glass beads, talc, UV absorbing filler, white pigment filler, or pigment fillers, or any combination thereof.

[0036] According to yet another embodiment, the high melting point fluoropolymer film 130 The polyolefin layer may further comprise a filler. According to certain embodiments, the filler is a bifunctional polymer. Titanium oxide, or carbon black, or graphite, or carbon nanotubes, or Glass fiber, glass beads, talc, UV absorbing filler, or white pigment filler It may also contain fillers, or pigment fillers, or any combination thereof.

[0037] According to yet another embodiment, the multilayer fluoropolymer film 130 may be formed to a particular thickness. For example, the multilayer fluoropolymer film 130 may have a thickness of at least about 0. 0.005 mm, for example, at least about 0.010 mm, or at least about 0.015 mm; or at least about 0.020 mm, or at least about 0.025 mm, or at least about 0.03 mm, or at least about 0.035 mm, or at least about 0.04 mm, or At least about 0.05 mm, or at least about 0.06 mm, or at least about 0.07 mm, or at least about 0.08 mm, or at least about 0.09 mm, or less According to yet another embodiment, the multi-layer fluororesin may have a thickness of about 0.1 mm. The polymer film 130 may be about 0.25 mm or less, for example, about 0.24 mm or less, or about 0.23 mm or less, or about 0.22 mm or less, or about 0.21 mm or less, or about 0.20 mm or less, or about 0.19 mm or less, or about 0.18 mm or less, or about 0.17 mm or less , or 0.16 mm or less, or about 0.15 mm or less. The thickness of the polymer film 130 is within a range between any of the minimum and maximum values ​​listed above. It will be understood that the thickness of the multilayer fluoropolymer film 130 may be It will be further understood that the value may be any value between either of the minimum and maximum values.

[0038] According to yet another embodiment, the high melting point fluoropolymer layer is fluoropolymer compliant with ASTM D459 It also has a specific melting temperature, measured using a differential scanning calorimeter (DSC) according to For example, the high melting point fluoropolymer layer may have a temperature of at least about 250°C, e.g., at least or at least about 255°C, or at least about 260°C, or at least about 265°C, or at least about 270°C, or at least about 275°C, or at least about 280°C, or at least about 285°C, or at least about 290°C, or at least about 295°C, or at least It may have a melting temperature of about 300° C. According to yet another embodiment, the high melting point fluoropolymer The polymer layer can be heated to about 350° C. or less, for example, about 340° C. or less, or about 330° C. or less, or 320°C or less, or about 310°C or less, or about 300°C or less, or about 275°C or less, or about It may have a melting temperature of 250°C or less, or about 225°C or less, or about 200°C or less. The melting temperature of the high melting point fluoropolymer layer is within the range between any of the above minimum and maximum values. It will be understood that the melting temperature of the high melting point fluoropolymer layer may be within It will be understood that the value of , may be any value between any of the minimum and maximum values ​​listed above. .

[0039] According to yet another embodiment, the high melting point fluoropolymer layer has a particular thickness. For example, the high melting point fluoropolymer layer may be at least about 0.001 mm thick, e.g. At least about 0.005 mm, or at least about 0.01 mm, or at least about 0.0 15 mm, or at least about 0.02 mm, or at least about 0.25 mm, at least about 0.03 mm, or at least about 0.035 mm, or at least about 0.04 mm, or is at least about 0.05 mm, or at least about 0.06 mm, or at least about 0.0 7 mm, or at least about 0.08 mm, or at least about 0.09 mm, or at least at least about 0.1 mm, or at least about 0.25 mm, or at least about 0.5 mm, or less It may have a thickness of at least about 0.75 mm, or at least about 1.0 mm. According to other embodiments, the high melting point fluoropolymer layer may be about 0.25 mm or less, e.g. , about 0.24 mm or less, or about 0.23 mm or less, or about 0.22 mm or less, or about 0. 21 mm or less, or about 0.20 mm or less, or about 0.19 mm or less, or about 0.18 mm or less, or about 0.17 mm or less, or about 0.16 mm or less, or about 0.15 mm or less The thickness of the high melting point fluoropolymer layer may be any of the above minimum and maximum values. It will be understood that the range may be anywhere between 100 and 150. - the thickness of the layer may be any value between any of the minimum and maximum values ​​given above, Let it be understood.

[0040] According to yet another embodiment, the high melting point fluoropolymer layer is made of a specific fluoropolymer For example, the high melting point fluoropolymer layer may comprise a high melting point fluoropolymer at least about 25% by weight, for example, at least about 30% by weight, based on the total weight of the polymer layer; is at least about 35% by weight, or at least about 40% by weight, or at least about 45% by weight , or at least about 50% by weight, or at least about 55% by weight, or at least about 60% by weight %, or at least about 65% by weight of fluoropolymer content. According to another embodiment, the high melting point fluoropolymer layer comprises a total of 1000 fluoropolymer layers. about 100% by weight or less, for example, about 99% by weight or less, or about 98% by weight or less, is about 97% by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less than about 85% by weight, or less than about 80% by weight, or less than about 75% by weight The high melting point fluoropolymer layer may have a fluoropolymer content. It will be appreciated that the amount may fall within a range between any of the minimum and maximum values ​​recited above. Furthermore, the fluoropolymer content of the high melting point fluoropolymer layer must be within the above minimum and maximum values. It will be appreciated that the value may be any value between any of the values.

[0041] According to yet another embodiment, the high melting point fluoropolymer layer is a specific PTFE-containing For example, the high melting point fluoropolymer layer may comprise an amount of At least about 25% by weight, for example, at least about 30% by weight, or less, based on the total weight At least about 35% by weight, or at least about 40% by weight, or at least about 45% by weight, or at least about 45% by weight at least about 50% by weight, or at least about 55% by weight, or at least about 60% by weight, or The PTFE content may be at least about 65% by weight. If the high melting point fluoropolymer layer is about 10 times the total weight of the high melting point fluoropolymer layer, 0% by weight or less, such as about 99% by weight or less, or about 98% by weight or less, or about 97% by weight or less or less than about 96% by weight, or less than about 95% by weight, or less than about 90% by weight, or less than about 85% by weight % or less, or about 80% or less, or about 75% or less by weight of PTFE. The PTFE content of the high melting point fluoropolymer layer may be within either the minimum or maximum value above. It will be understood that the range may be any range therebetween. The PTFE content of the layer may be any value between any of the minimum and maximum values ​​listed above. It will be understood that.

[0042] According to yet another embodiment, the high melting point fluoropolymer layer has a particular filler content For example, the high melting point fluoropolymer layer may comprise a total of At least about 0.05% by weight, for example, at least about 0.1% by weight, or less at least about 1.0% by weight, or at least about 5% by weight, or at least about 10% by weight, or is at least about 20% by weight, or at least about 30% by weight, or at least about 40% by weight Alternatively, the filler content may be at least about 50% by weight. According to the embodiment, the high melting point fluoropolymer layer is About 75% by weight or less, for example, about 70% by weight or less, or about 65% by weight or less, or about 60% by weight or less % or less, or about 55% or less, or about 51% or less by weight of filler. The filler content of the high melting point fluoropolymer layer must be between the minimum and maximum values ​​listed above. It will be understood that the filling of the high melting point fluoropolymer layer may be in the range of It is understood that the agent content may be any value between any of the minimum and maximum values ​​listed above. Let's solve it.

[0043] According to yet another embodiment, the low melting point fluoropolymer adhesive layer is ASTM D4 591, and has a specific melting temperature measured using a differential scanning calorimeter (DSC). For example, the low melting point fluoropolymer adhesive layer may have a temperature of at least about 50°C, e.g., at least about 55°C, or at least about 60°C, or at least about 65°C, or at least about 70°C, or at least about 75°C, or at least about 80°C, or at least about 85°C or at least about 90°C, or at least about 95°C, or at least about 100°C According to yet another embodiment, a low melting point fluoropolymer adhesive may have a melting temperature. The layer is heated to about 270°C or less, for example, about 260°C or less, or about 250°C or less, or about 240°C or less. or about 230°C or less, or about 220°C or less, or about 210°C or less, or about 200°C or less or a melting temperature of about 175°C or less, or about 150°C or less, or about 125°C or less. The melting temperature of the low melting point fluoropolymer adhesive layer may be either the minimum or maximum value described above. It will be understood that the range may be within any of the above ranges. The melting temperature of the deposition layer may be any value between any of the minimum and maximum values ​​listed above. But it will be understood.

[0044] According to still other embodiments, the low melting point fluoropolymer adhesive layer 120 is, in particular, For example, the low melting point fluoropolymer adhesive layer 120 may comprise a polyfluorinated According to yet another embodiment, the low melting point fluoropolymer may comprise a polyvinylidene fluoride (PVDF). The polypolymer adhesive layer 120 is made of tetrafluoroethylene, hexafluoropropylene, and It may also include a terpolymer of vinylidene fluoride (THV). For example, the low melting point fluoropolymer adhesive layer 120 may be ethylene tetrafluoroethylene (Ethy The polymer may include Tetra Fluoro Ethylene (ETFE). For example, the low melting point fluoropolymer adhesive layer 120 may be ethylene chlorotrifluoroethylene (Et Other examples include polyethylene chlorotrifluoroethylene (ECTFE). According to an embodiment, the low melting point fluoropolymer adhesive layer 120 is a PVDF-HFP copolymer. According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 may include Alternatively, it may contain a mixture of PVDF and PTFE (PVDF / PTFE mixture). According to another embodiment, the low melting point fluoropolymer adhesive layer 120 is made of PVDF, THV, ETFE, ECTFE, PVDF-HFP copolymer, or PVDF / PTFE blend Any combination may be included.

[0045] According to still other embodiments, the low melting point fluoropolymer adhesive layer 120 is, in particular, For example, the low melting point fluoropolymer adhesive layer 120 may be made of It may be made of polyvinylidene fluoride (PVDF). According to the invention, the low melting point fluoropolymer adhesive layer 120 is made of tetrafluoroethylene, hexafluoroethylene, It is composed of a terpolymer of fluoropropylene and vinylidene fluoride (THV). According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is made of ethylene It is made up of ethylene tetrafluoroethylene (ETFE) According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 may be It may also be made of ethylene chlorotrifluoroethylene (ECTFE). According to another embodiment, the low melting point fluoropolymer adhesive layer 120 is PVDF-HFP According to yet another embodiment, the low melting point fluoropolymer may be a copolymer. The polymer adhesive layer 120 is a mixture of PVDF and PTFE (PVDF / PTFE mixture). According to yet another embodiment, the low melting point fluoropolymer adhesive The adhesive layer 120 is made of PVDF, THV, ETFE, ECTFE, or PVDF-HFP copolymer. , or a PVDF / PTFE blend.

[0046] According to still other embodiments, the low melting point fluoropolymer adhesive layer 120 is, in particular, For example, the low melting point fluoropolymer adhesive layer 120 may be a layer of polyfluoropolymer. According to yet another embodiment, the layer may be made of polyvinylidene fluoride (PVDF). The fluoropolymer adhesive layer 120 is made of tetrafluoroethylene, hexafluoropropylene, It may also be a layer of a terpolymer of ethylenediamine fluoride (TEF) and vinylidene fluoride (THV). According to an embodiment, the low melting point fluoropolymer adhesive layer 120 is made of ethylene tetrafluoroethylene. According to yet another embodiment, the layer may be made of low melting point fluoroethylene (ETFE). The polyolefin adhesive layer 120 is a layer of ethylene chlorotrifluoroethylene (ECTFE). According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 may be , a layer of PVDF-HFP copolymer. The melting point fluoropolymer adhesive layer 120 is a mixture of PVDF and PTFE (PVDF / PTFE). According to yet another embodiment, a layer of low melting point fluoropolymer (FE mixture) may be used. The adhesive layer 120 is made of PVDF, THV, ETFE, ECTFE, PVDF-HFP copolymer. The layer may be a layer of any combination of polymer or PVDF / PTFE blend.

[0047] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is For example, the low melting point fluoropolymer adhesive layer 120 may include a fluoropolymer content. , at least about 50% by weight based on the total weight of the low melting point fluoropolymer adhesive layer 120, e.g. For example, at least about 55% by weight, or at least about 60% by weight, or at least about 65% by weight %, or at least about 70% by weight, or at least about 75% by weight of fluoropolymer According to yet another embodiment, the low melting point fluoropolymer adhesive layer may have a content of 120 is about 100% by weight or less based on the total weight of the low melting point fluoropolymer adhesive layer 120; For example, about 99% by weight or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less % by weight or less, or about 95% by weight or less, or about 90% by weight or less, or about 85% by weight or less, may have a fluoropolymer content of about 80% by weight or less, or about 77% by weight or less. The fluoropolymer content of the low melting point fluoropolymer adhesive layer 120 is the minimum value set forth above. It will be understood that the range may be between any of the maximum values. The fluoropolymer content of the fluoropolymer adhesive layer 120 may be any of the minimum and maximum values ​​set forth above. It will be appreciated that the value may be any value between these.

[0048] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is For example, the low melting point fluoropolymer adhesive layer 120 may contain a low melting point At least about 50% by weight, for example, at least about 50% by weight of the total weight of the fluoropolymer adhesive layer 120 at least about 55% by weight, or at least about 60% by weight, or at least about 65% by weight, or PVDF content of at least about 70% by weight, or at least about 75% by weight. According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is About 100% by weight or less of the total weight of the fluoropolymer adhesive layer 120, for example, about 99% by weight % by weight or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less, or About 95% by weight or less, or about 90% by weight or less, or about 85% by weight or less, or about 80% by weight or less or about 77% by weight or less of PVDF content. The PVDF content of the adhesive layer 120 is within the range between any of the minimum and maximum values ​​listed above. It will be understood that the PVD of the low melting point fluoropolymer adhesive layer 120 may also be used. It is understood that the F content may be any value between any of the minimum and maximum values ​​listed above. Let's solve it.

[0049] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is May contain VDF-HFP copolymer content, e.g., low melting point fluoropolymer adhesive The layer 120 has a mass of at least about 50 wt. % of the total mass of the low melting point fluoropolymer adhesive layer 120. % by weight, for example, at least about 55% by weight, or at least about 60% by weight, or at least about 65% by weight, or at least about 70% by weight, or at least about 75% by weight PVD According to yet another embodiment, the low melting point F-HFP copolymer may have a F-HFP copolymer content. The low melting point fluoropolymer adhesive layer 120 is About 100% by weight or less, for example, about 99% by weight or less, or about 98% by weight or less, or about 97% by weight or less % by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less, or about 85% by weight or less, or about 80% by weight or less, or about 77% by weight or less PVDF-HF The low melting point fluoropolymer adhesive layer 120 may have a PVDF-P copolymer content. The HFP copolymer content may be within a range between any of the minimum and maximum values ​​listed above. Furthermore, it will be understood that the low melting point fluoropolymer adhesive layer 120 is made of PVDF-HF. The P copolymer content may be any value between any of the minimum and maximum values ​​listed above. It will be understood that.

[0050] According to yet another embodiment, the PVDF-HFP copolymer is a copolymer containing a specific HFP. For example, the PVDF-HFP copolymer may contain PVDF-HFP copolymer. At least about 0.5% by weight, for example, at least about 1% by weight, or less, based on the total weight of the composition. at least about 5% by weight, or at least about 10% by weight, or at least about 15% by weight, or It may have an HFP content of at least about 20% by weight, or at least about 25% by weight. According to yet another embodiment, the PVDF-HFP copolymer is about 50% by weight or less, for example, about 45% by weight or less, or about 40% by weight or less, based on the total weight of the copolymer % or less, or about 35% or less, or about 30% or less by weight of HFP. The HFP content of the PVDF-HFP copolymer may be either the minimum or maximum value above. It will be understood that the range may be within the range. The HFP content of the product may be any value between any of the minimum and maximum values ​​listed above. It will be understood that.

[0051] According to yet another embodiment, the PVDF-HFP copolymer is a copolymer containing a specific PVDF. For example, the PVDF-HFP copolymer may contain at least about 50% by weight, e.g., at least about 55% by weight, based on the total weight of the mer; or at least about 60% by weight, or at least about 65% by weight, or at least about 70% by weight, Alternatively, it may have a PVDF content of at least about 75% by weight. According to the analysis, the PVDF-HFP copolymer accounts for 100% of the total weight of the PVDF-HFP copolymer. about 100% by weight or less, for example, about 95% by weight or less, or about 90% by weight or less, or about 8 It may have a PVDF content of 5% by weight or less, or about 80% by weight or less. The PVDF content of the HFP copolymer must be within the range between any of the minimum and maximum values ​​listed above. It will be understood that the PVDF content of the PVDF-HFP copolymer may also be present. It is understood that the amount may be any value between any of the minimum and maximum values ​​listed above. Hello.

[0052] According to a particular embodiment, the low melting point fluoropolymer adhesive layer 120 is made of PVDF and PT According to still other embodiments, low melting point fluoropolymers may be used. The polymer adhesive layer 120 may be composed of a blend of PVDF and PTFE.

[0053] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is For example, the low melting point fluoropolymer adhesive layer 120 may contain a low melting point At least about 5% by weight, for example, at least about 5% by weight based on the total weight of the fluoropolymer adhesive layer 120 At least about 10% by weight, or at least about 20% by weight, or at least about 30% by weight, or at least about 10% by weight at least about 40% by weight, or at least about 50% by weight, or at least about 60% by weight, or may have a PVDF content of at least about 70% by weight, or at least about 75% by weight. According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is a low melting point fluoropolymer. about 100% by weight or less, for example, about 99% by weight or less, based on the total weight of the polyfluoropolymer adhesive layer 120 % or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less, or about 85% by weight or less, or about 80% by weight or less Alternatively, the PVDF content may be about 75% by weight or less. The PVDF content of the adhesive layer 120 is within a range between any of the minimum and maximum values ​​listed above. It will be understood that the low melting point fluoropolymer adhesive layer 120 may be made of PVDF. It is understood that the content may be any value between any of the minimum and maximum values ​​listed above. Let's do it.

[0054] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is For example, the low melting point fluoropolymer adhesive layer 120 may include a low melting point fluoropolymer. At least about 5% by weight, for example, at least about 5% by weight based on the total weight of the fluoropolymer adhesive layer 120 At least about 10% by weight, or at least about 20% by weight, or at least about 30% by weight, or at least about 10% by weight at least about 40% by weight, or at least about 50% by weight, or at least about 60% by weight, or may have a PTFE content of at least about 70% by weight, or at least about 75% by weight. According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is a low melting point fluoropolymer. about 100% by weight or less, for example, about 99% by weight or less, based on the total weight of the polyfluoropolymer adhesive layer 120 % or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less, or about 85% by weight or less, or about 80% by weight or less Alternatively, the PTFE content may be about 75% by weight or less. The PTFE content of the adhesive layer 120 is within a range between any of the minimum and maximum values ​​listed above. It will be understood that the PTFE of the low melting point fluoropolymer adhesive layer 120 may also be used. It is understood that the content may be any value between any of the minimum and maximum values ​​listed above. Let's do it.

[0055] According to yet another embodiment, the low melting point fluoropolymer adhesive layer 120 is formed to a specific thickness. For example, the low melting point fluoropolymer adhesive layer 120 may have a thickness of at least about 0. 001 mm, for example, at least about 0.0015 mm, or at least about 0.002 mm , or at least about 0.0025 mm, or at least about 0.005 mm, or at least at least about 0.0075 mm, or at least about 0.01 mm, or at least about 0.02 mm , or at least about 0.03 mm, or at least about 0.035 mm, or at least about 0.04 mm, or at least about 0.05 mm, or at least about 0.06 mm, or less at least about 0.07 mm, or at least about 0.08 mm, or at least about 0.09 mm In yet other embodiments, the thickness may be at least about 0.1 mm. For example, the low melting point fluoropolymer adhesive layer 120 may be about 0.25 mm or less, e.g., about 0.2 4mm or less, or about 0.23mm or less, or about 0.22mm or less, or about 0.21mm or less or less than about 0.20 mm, or less than about 0.19 mm, or less than about 0.18 mm, or Have a thickness of about 0.17 mm or less, or about 0.16 mm or less, or about 0.15 mm or less The thickness of the low melting point fluoropolymer adhesive layer 120 may be any of the minimum and maximum values ​​described above. It will be understood that the range may be anywhere between. The thickness of adhesive layer 120 may be any value between any of the minimum and maximum values ​​listed above. It will be understood that

[0056] According to still other embodiments, the composite article 100 may be manufactured according to ASTM D2520, It may have a specified dielectric constant as measured at 5 GHz according to Test Method C, e.g. , the composite article 100 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, measured at 5 GHz; or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 The composite article 10 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the zero dielectric constant may range between any of the above values. It should be noted that the dielectric constant of the composite article 100 may be any value between any of the values ​​above. Let's understand more.

[0057] According to other embodiments, the composite article 100 is resistant to corrosion according to ASTM D2520, Test Method C For example, the composite may have a specific dielectric constant as measured at 15 GHz according to The product 100 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, measured at 15 GHz. 0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less, Alternatively, the composite article 100 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the permittivity may range between any of the above values. It is further understood that the dielectric constant of the product 100 may be any value between any of the above values. Let's solve it.

[0058] According to yet another embodiment, the composite article 100 is manufactured according to ASTM D2520, Test Method It may have a particular dielectric constant as measured at 30 GHz according to Method C. For example, The composite article 100 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less The composite article 100 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the dielectric constant of the film may range between any of the values ​​recited above. It is further noted that the dielectric constant of composite article 100 may be any value between any of the above values. Let it be understood.

[0059] According to other embodiments, the composite article 100 is resistant to corrosion according to ASTM D2520, Test Method C For example, the composite may have a specific dielectric constant as measured at 40 GHz according to The product 100 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, measured at 40 GHz. 0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less, Alternatively, the composite article 100 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the permittivity may range between any of the above values. It is further understood that the dielectric constant of the product 100 may be any value between any of the above values. Let's solve it.

[0060] According to still other embodiments, the composite article 100 may be manufactured according to ASTM D2520, It may have a specified loss factor as measured at 5 GHz according to Test Method C. For example, the composite article 100 may have a .DELTA.F of about 0.5 or less, e.g., about 0.1 or less, measured at 5 GHz. is about 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less or about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of the composite article 100 may range between any of the values ​​above. It will be understood that the loss factor of composite article 100 may be within any of the above values. It will be further understood that the value may be any value therebetween.

[0061] According to other embodiments, the composite article 100 is resistant to corrosion according to ASTM D2520, Test Method C The composite may have a specific loss factor as measured at 15 GHz according to The article 100 has a .DELTA.f. of about 0.5 or less, e.g., about 0.1 or less, or about 0.05 or less, measured at 15 GHz. 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or Loss coefficient of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of the composite article 100 may be within a range between any of the above values. It will be understood that the loss factor of the composite article 100 may be any of the above values. It will be further understood that the value may be any value in between.

[0062] According to yet another embodiment, the composite article 100 is manufactured according to ASTM D2520, Test Method It may have a particular loss factor as measured at 30 GHz according to Method C, for example: The composite article 100 has a .DELTA.f. of about 0.5 or less, e.g., about 0.1 or less, measured at 30 GHz; about 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or a loss of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of the composite article 100 may be within a range between any of the values ​​above. It will be appreciated that the loss factor of the composite article 100 may be any of the above values. It will be further understood that the value may be any value between.

[0063] According to other embodiments, the composite article 100 is resistant to corrosion according to ASTM D2520, Test Method C The composite may have a specific loss factor as measured at 40 GHz according to The article 100 has a .DELTA.f. of about 0.5 or less, e.g., about 0.1 or less, or about 0.DELTA.f., measured at 40 GHz. 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or Loss coefficient of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of the composite article 100 may be within a range between any of the above values. It will be understood that the loss factor of the composite article 100 may be any of the above values. It will be further understood that the value may be any value in between.

[0064] According to yet another embodiment, the composite article 100 is resistant to ASTM D882 (up to 1 m for composite articles having a thickness of 1 mm or more, or ASTM D638 For composite articles having a specified tensile strength, for example, For example, the tensile strength of the composite article 100 is at least about 5 MPa, e.g., at least about 10 MPa, or at least about 20 MPa, or at least about 30 MPa, or at least about 40 MPa, or at least about 50 MPa, or at least about 60 MPa, or at least at least about 70 MPa, or at least about 80 MPa, or at least about 90 MPa, or at least at least about 100 MPa, or at least about 150 MPa, or at least about 200 MPa According to yet other embodiments, the tensile strength of the composite article 100 may be about 500 MPa or less, for example, about 450 MPa or less, or about 400 MPa or less The tensile strength of the composite article 100 may be within a range between any of the minimum and maximum values ​​listed above. It will be understood that the tensile strength of the composite article 100 may be within the above minimum and maximum values. It will be further understood that the value may be any value between any of the values.

[0065] According to yet another embodiment, the composite article 100 is resistant to ASTM D882 (up to 1 m for composite articles having a thickness of 1 mm or more, or ASTM D638 For example, the composite article may have a specific modulus of elasticity as measured according to For example, the elastic modulus of composite article 100 may be at least about 0.1 GPa, e.g., at least about 0. 5 GPa, or at least about 1 GPa, or at least about 5 GPa, or at least about 1 0 GPa, or at least about 15 GPa, or at least about 20 GPa, or less According to yet another embodiment, the impact strength of the composite article 100 may be about 25 GPa. The pressure is about 50 GPa or less, for example, about 45 GPa or less, or about 40 GPa or less. The modulus of elasticity of the composite article 100 may be within a range between any of the minimum and maximum values ​​listed above. It will be understood that the modulus of elasticity of the composite article 100 may be within the above minimum and maximum values. It will be further understood that the value may be any value between any of the values.

[0066] According to still other embodiments, the composite article 100 is rolled at a constant speed of 2 inches per minute. The specimens were pulled apart by an Instron mechanical test frame. Specific first peak peel, as measured using a 180° peel test performed on a For example, the composite article 100 may have a first peak peel strength of at least about 175 Newtons Per Linear Meter (NPM), e.g., At least about 200 NPM, or at least about 225 NPM, or at least about 250 NPM M, or at least about 275 NPM, or at least about 300 NPM, or at least about 325 NPM, or at least about 350 NPM, or at least about 375 NPM, or less At least about 400 NPM, or at least about 425 NPM, or at least about 450 NPM M, or at least about 475 NPM, or at least about 500 NPM, or at least about 525 NPM, or at least about 550 NPM, or at least about 575 NPM, or less At least about 600 NPM, or at least about 625 NPM, or at least about 650 NPM M, or at least about 675 NPM, or at least about 700 NPM, or at least about 725 NPM, or at least about 750 NPM, or at least about 775 NPM, or The first peak peel strength of the composite article 100 may be at least about 800 NPM. , and may range between any of the above values. The first peak peel strength of 0 may be any value between any of the above values. It will be further understood that alternative embodiments described herein further include a structural substrate and a multi-layer full a fluoropolymer film, a transition layer in contact with the multilayer fluoropolymer film, and a structural substrate. and a low melting point fluoropolymer adhesive layer in contact with the transition layer. do.

[0067] For illustrative purposes, FIG. 2 illustrates a composite article 20 according to an embodiment described herein. As shown in FIG. 1, composite article 200 includes a structural substrate 210 and a multi-layer full The polymer film 230, the transition layer 225, and the structural substrate 110 and the transition layer 225 and a low melting point fluoropolymer adhesive layer 220 in contact with the

[0068] Composite article 200 and all configurations described with respect to composite article 200 shown in FIG. The elements may also have any of the characteristics described herein in relation to the corresponding components in FIG. In particular, the composite article 200, structural substrate 210, and multi-layer structure shown in FIG. The properties of the fluoropolymer film 230 and the low melting point fluoropolymer adhesive layer 220 are , the composite article 100 shown in FIG. 1, the structural substrate 110, and the multilayer fluoropolymer film 114, respectively. The adhesive layer 120 is preferably a low melting point fluoropolymer adhesive layer. The scalar may have any of the corresponding characteristics.

[0069] According to certain embodiments, the transition layer 225 comprises a blend of PVDF and PTFE. According to yet another embodiment, the transition layer 225 may be made of PVDF, PTFE, and It may also consist of a mixture of

[0070] According to yet other embodiments, the transition layer 225 may include a specific PVDF content. For example, the transition layer 225 may comprise at least about 5% by weight, based on the total weight of the transition layer 225, For example, at least about 10% by weight, or at least about 20% by weight, or at least about 30% by weight. % by weight, or at least about 40% by weight, or at least about 50% by weight, or at least about 60% by weight, or at least about 70% by weight, or at least about 75% by weight PVDF content According to yet other embodiments, the transition layer 225 may have a total thickness of 100 μm. about 100% by weight or less, for example, about 99% by weight or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less % or less, or about 85% by weight or less, or about 80% by weight or less, or about 75% by weight or less P The PVDF content of the transition layer 225 may be within the above minimum and maximum values. It will be appreciated that the P of the transition layer 225 may be in a range between any of the above. The VDF content may be any value between any of the minimum and maximum values ​​listed above. , it will be understood.

[0071] According to yet other embodiments, the transition layer 225 may include a specific PTFE content. For example, the transition layer 225 may comprise at least about 5% by weight, based on the total weight of the transition layer 225, For example, at least about 10% by weight, or at least about 20% by weight, or at least about 30% by weight. % by weight, or at least about 40% by weight, or at least about 50% by weight, or at least about 60% by weight, or at least about 70% by weight, or at least about 75% by weight PTFE According to yet other embodiments, the transition layer 225 may have a total thickness of 100 μm. about 100% by weight or less, for example, about 99% by weight or less, or about 98% by weight or less, or about 97% by weight or less, or about 96% by weight or less, or about 95% by weight or less, or about 90% by weight or less % or less, or about 85% by weight or less, or about 80% by weight or less, or about 75% by weight or less P The PTFE content of the transition layer 225 may be within the above minimum and maximum values. It will be appreciated that the P of the transition layer 225 may be in a range between any of the above. The TFE content may be any value between any of the minimum and maximum values ​​listed above. , it will be understood.

[0072] According to certain embodiments, the transition layer 225 is subjected to differential scanning in accordance with ASTM D4591. It may have a specific melting temperature, as measured using a differential scanning calorimeter (DSC). The layer 225 can be heated to a temperature of at least about 50°C, for example, at least about 60°C, or at least about 70°C. °C, or at least about 80°C, or at least about 90°C, or at least about 100°C, or is at least about 110°C, or at least about 120°C, or at least about 130°C, or It may have a melting temperature of at least about 140°C, or alternatively at least about 150°C. According to other embodiments, the transition layer 225 can be heated to temperatures of about 350° C. or less, such as about 340° C. or less. , or about 330°C or less, or about 320°C or less, or about 310°C or less, or about 300°C or less , or about 275°C or less, or about 250°C or less, or about 225°C or less, or about 200°C The melting temperature of the transition layer 225 may be between the minimum and maximum values ​​listed above. It will be appreciated that the melting temperature of the transition layer 225 may be within any range therebetween. It is understood that the degree may be any value between any of the minimum and maximum values ​​listed above. Hello.

[0073] According to yet other embodiments, the transition layer 225 may have a particular thickness. For example, the transition layer 225 may be at least about 0.001 mm, e.g., at least about 0.0015 mm. mm, or at least about 0.002 mm, or at least about 0.0025 mm, or less at least about 0.005 mm, or at least about 0.0075 mm, or at least about 0.0 1 mm, or at least about 0.02 mm, or at least about 0.03 mm, or at least at least about 0.035 mm, or at least about 0.04 mm, or at least about 0.05 mm, Or at least about 0.06 mm, or at least about 0.07 mm, or at least about 0. 0.08 mm, or at least about 0.09 mm, or at least about 0.1 mm thick According to yet other embodiments, the transition layer 225 may be about 0.25 mm or less, e.g. For example, about 0.24 mm or less, or about 0.23 mm or less, or about 0.22 mm or less, or about 0.21 mm or less, or about 0.20 mm or less, or about 0.19 mm or less, or about 0.18 mm or less, or about 0.17 mm or less, or about 0.16 mm or less, or about 0.15 mm The thickness of the transition layer 225 may be between any of the minimum and maximum values ​​listed above. It will be appreciated that the thickness of the transition layer 225 may be within the range of It will be appreciated that it may be any value between either of the minimum and maximum values.

[0074] According to still other embodiments, the composite article 200 may be manufactured according to ASTM D2520, It may have a specified dielectric constant as measured at 5 GHz according to Test Method C, e.g. , the composite article 200 has a .DELTA.F. of about 5.0 or less, e.g., about 4.5 or less, measured at 5 GHz; or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 The composite article 20 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the zero dielectric constant may range between any of the above values. It is understood that the dielectric constant of composite article 200 may be any value between any of the above values. Let's understand more.

[0075] According to other embodiments, the composite article 200 is resistant to corrosion in accordance with ASTM D2520, Test Method C For example, the composite may have a specific dielectric constant as measured at 15 GHz according to Product 200 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, measured at 15 GHz. 0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less, Alternatively, the composite article 200 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the permittivity may range between any of the above values. It is further understood that the dielectric constant of the article 200 may be any value between any of the above values. Let's solve it.

[0076] According to yet another embodiment, the composite article 200 is manufactured according to ASTM D2520, Test Method It may have a particular dielectric constant as measured at 30 GHz according to Method C. For example, The composite 200 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less The composite article 200 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the dielectric constant of the film may range between any of the values ​​recited above. It is further noted that the dielectric constant of composite article 200 may be any value between any of the above values. Let it be understood.

[0077] According to other embodiments, the composite article 200 is resistant to corrosion in accordance with ASTM D2520, Test Method C For example, the composite may have a specific dielectric constant as measured at 40 GHz according to Product 200 has a .DELTA.F of about 5.0 or less, e.g., about 4.5 or less, or about 4.0 or less, measured at 40 GHz. 0 or less, or about 3.5 or less, or about 3.0 or less, or about 2.5 or less, or about 2.0 or less, Alternatively, the composite article 200 may have a dielectric constant of about 1.5 or less, or about 1.0 or less. It will be appreciated that the permittivity may range between any of the above values. It is further understood that the dielectric constant of the article 200 may be any value between any of the above values. Let's solve it.

[0078] According to still other embodiments, the composite article 200 may be manufactured according to ASTM D2520, It may have a specified loss factor as measured at 5 GHz according to Test Method C. For example, the composite article 200 may have a .DELTA.F of about 0.5 or less, e.g., about 0.1 or less, measured at 5 GHz. is about 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less or about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of composite article 200 may range between any of the values ​​above. It will be understood that the loss factor of composite article 200 may be within any of the above values. It will be further understood that the value may be any value therebetween.

[0079] According to other embodiments, the composite article 200 is resistant to corrosion in accordance with ASTM D2520, Test Method C The composite may have a specific loss factor as measured at 15 GHz according to The article 200 has a .DELTA.f. of about 0.5 or less, e.g., about 0.1 or less, or about 0.05 or less, measured at 15 GHz. 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or Loss coefficient of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of composite article 200 may be in a range between any of the above values. It will be appreciated that the loss factor of composite article 200 may be any of the above values. It will be further understood that the value may be any value in between.

[0080] According to yet another embodiment, the composite article 200 is manufactured according to ASTM D2520, Test Method It may have a particular loss factor as measured at 30 GHz according to Method C, for example: The composite article 200 has a .DELTA.F of about 0.5 or less, e.g., about 0.1 or less, measured at 30 GHz; about 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or a loss of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of composite article 200 may be within a range between any of the values ​​above. It will be appreciated that the loss factor of composite article 200 may be any of the above values. It will be further understood that the value may be any value between.

[0081] According to other embodiments, the composite article 200 is resistant to corrosion in accordance with ASTM D2520, Test Method C The composite may have a specific loss factor as measured at 40 GHz according to The article 200 has a .DELTA.f. of about 0.5 or less, e.g., about 0.1 or less, or about 0.05 or less, measured at 40 GHz. 0.05 or less, or about 0.01 or less, or about 0.005 or less, or about 0.001 or less, or Loss coefficient of about 0.0005 or less, or about 0.0001 or less, or about 0.00005 or less The loss factor of composite article 200 may be in a range between any of the above values. It will be appreciated that the loss factor of composite article 200 may be any of the above values. It will be further understood that the value may be any value in between.

[0082] According to yet another embodiment, the composite article 200 is resistant to ASTM D882 (up to 1 m for composite articles having a thickness of 1 mm or more, or ASTM D638 For composite articles having a specified tensile strength, for example, For example, the tensile strength of the composite article 200 is at least about 5 MPa, e.g., at least about 10 MPa, or at least about 20 MPa, or at least about 30 MPa, or at least about 40 MPa, or at least about 50 MPa, or at least about 60 MPa, or at least at least about 70 MPa, or at least about 80 MPa, or at least about 90 MPa, or at least at least about 100 MPa, or at least about 150 MPa, or at least about 200 MPa According to yet other embodiments, the tensile strength of the composite article 200 may be about 500 MPa or less, for example, about 450 MPa or less, or about 400 MPa or less The tensile strength of the composite article 200 may be within a range between any of the minimum and maximum values ​​listed above. It will be understood that the tensile strength of the composite article 200 may be within the above minimum and maximum values. It will be further understood that the value may be any value between any of the values.

[0083] According to yet another embodiment, the composite article 200 is resistant to ASTM D882 (up to 1 m for composite articles having a thickness of 1 mm or more, or ASTM D638 For example, the composite article may have a specific modulus of elasticity as measured according to For example, the elastic modulus of composite article 200 may be at least about 0.1 GPa, e.g., at least about 0. 5 GPa, or at least about 1 GPa, or at least about 5 GPa, or at least about 1 0 GPa, or at least about 15 GPa, or at least about 20 GPa, or less According to yet another embodiment, the impact strength of the composite article 200 may be about 25 GPa. The pressure is about 50 GPa or less, for example, about 45 GPa or less, or about 40 GPa or less. The modulus of elasticity of composite article 200 may be within a range between any of the minimum and maximum values ​​listed above. It will be appreciated that the modulus of elasticity of composite article 200 may be within the above minimum and maximum values. It will be further understood that the value may be any value between any of the values.

[0084] According to still other embodiments, the composite article 200 is rolled at a constant speed of 2 inches per minute. 180° peel tests performed on an Instron mechanical test frame, with the specimens pulled apart by For example, the composite may have a specific first peak peel strength, as measured using a The first peak peel strength of the article 200 is at least about 175 Newtons per linear meter (Nm). NPM), for example, at least about 200 NPM, or at least about 225 NPM, or less At least about 250 NPM, or at least about 275 NPM, or at least about 300 NPM M, or at least about 325 NPM, or at least about 350 NPM, or at least about 375 NPM, or at least about 400 NPM, or at least about 425 NPM, or less At least about 450 NPM, or at least about 475 NPM, or at least about 500 NPM M, or at least about 525 NPM, or at least about 550 NPM, or at least about 575 NPM, or at least about 600 NPM, or at least about 625 NPM, or less at least about 650 NPM, or at least about 675 NPM, or at least about 700 NPM M, or at least about 725 NPM, or at least about 750 NPM, or at least about 775 NPM, or at least about 800 NPM. It is understood that the peak peel strength of one may range between any of the above values. The first peak peel strength of the composite article 200 may be any value between any of the above values. It will be further understood that the present invention may be formed in accordance with the embodiments described herein. The composite articles are manufactured by casting, extrusion, skiving, etc. ess), molding process, static press lamination process, Calendaring lamination process, or any other process Certain processes, including roll to roll lamination processes, It will be understood that the insulating layer may be formed by a material other than silicon.

[0085] Many different aspects and embodiments are possible. After reading this specification, those skilled in the art will understand that these aspects and embodiments are It will be understood that this is illustrative only and is not intended to limit the scope of the invention. The embodiment may be according to any one or more of the following embodiments: . Embodiment 1. A multi-layer structure comprising a structural substrate and a high melting point fluoropolymer layer having a melting temperature A1. a layer fluoropolymer film and a low melting point fluoropolymer adhesive layer having a melting temperature A2; a low melting point fluoropolymer adhesive layer attached to a structural substrate and a multilayer fluoropolymer adhesive layer; and the composite article is in contact with the polyolefin polymer film, and the melting temperature A2 is less than the melting temperature A1.

[0086] Embodiment 2. A structural substrate, a multilayer fluoropolymer film, and a low melting point PVDF-containing a low melting point fluoropolymer adhesive layer; and contacts the structural substrate and the fluoropolymer laminate.

[0087] Embodiment 3. A structural substrate, a multilayer fluoropolymer film, and a PVDF-HFP copolymer and a low melting point fluoropolymer adhesive layer comprising a low melting point fluoropolymer. A composite article in which a fluoropolymer adhesive layer contacts a structural substrate and a fluoropolymer laminate.

[0088] Embodiment 4. Structural substrate, multilayer fluoropolymer film, PTFE and PVDF and a low melting point fluoropolymer adhesive layer. The transition layer contacts the multilayer fluoropolymer film and the low melting point fluoropolymer adhesive layer. A composite article in which a low melting point fluoropolymer adhesive layer contacts a structural substrate and a transition layer.

[0089] Embodiment 5. Any of embodiments 1, 2, 3, and 4, wherein the structural substrate comprises a thermoformable material. 3. The composite article according to claim 1.

[0090] Embodiment 6. Any of embodiments 1, 2, 3, and 4, wherein the structural substrate comprises a thermoplastic material. 1. The composite article according to claim 1 .

[0091] Embodiment 7. The structural substrate is FR4, or G10, or HDPE, or PP, or PC or PET, or PETG, or any combination thereof; 5. The composite article of any one of claims 2, 3, and 4.

[0092] Embodiment 8. The structure of embodiment 1, wherein the structural substrate comprises a thickness of at least about 0.025 mm. 5. The composite article of any one of claims 2, 3, and 4.

[0093] Embodiment 9. Any of embodiments 1, 2, and 3, wherein the structural substrate comprises a thickness of about 2.54 mm or less. and 4. A composite article according to any one of claims 1 to 4.

[0094] Embodiment 10. A structural substrate comprising a glass transition temperature of at least about -150°C. 5. The composite article of any one of embodiments 1, 2, 3, and 4.

[0095] Embodiment 11. The structural substrate of embodiment 1, wherein the structural substrate comprises a glass transition temperature of about 350° C. or less. 5. The composite article of any one of claims 2, 3, and 4.

[0096] Embodiment 12. The structural substrate of embodiment 1, wherein the structural substrate comprises a decomposition onset temperature of at least about 50°C. 1. A composite article according to any one of claims 2, 3 and 4.

[0097] Embodiment 13. The method of embodiment 1, wherein the structural substrate comprises a decomposition onset temperature that is about 350° C. or less. 1. A composite article according to any one of claims 2, 3 and 4.

[0098] Embodiment 14. The multilayer fluoropolymer film comprises at least two layers, or at least About 3 layers, or at least about 4 layers, or at least about 5 layers, or at least about 6 layers, or less 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising at least about 7 layers.

[0099] Embodiment 15. The multilayer fluoropolymer film of embodiment 1, wherein the multilayer fluoropolymer film comprises no more than about 9 layers. 5. The composite article of any one of claims 2, 3, and 4.

[0100] Embodiment 16. The multilayer fluoropolymer film is made of PTFE, FEP, or PF A, or TFM, or THV, or PVDF, or P(VDF-HFP), or 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising a combination of:

[0101] Embodiment 17. The multilayer fluoropolymer film comprises a PTFE layer, or an FEP layer, or PFA layer, or TFM layer, or THV layer, or PVDF layer, or P(VDF-HFP) layer or a combination thereof. A composite article of the above.

[0102] Embodiment 18. The multilayer fluoropolymer film of embodiment 16 and 18. A composite article according to any one of claims 17.

[0103] Embodiment 19. The filler is titanium dioxide, or carbon black, or graphite. , or carbon nanotubes, or glass fibers, or glass beads, or talc, or U V Absorbent filler, or white pigment filler, or pigment filler, or any combination thereof 19. The composite article of embodiment 18, comprising a combination of

[0104] Embodiment 20. The multilayer fluoropolymer film has a thickness of at least about 0.005 mm. 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising:

[0105] Embodiment 21. The multilayer fluoropolymer film comprises a thickness of about 0.25 mm or less. 10. The composite article of any one of embodiments 1, 2, 3, and 4.

[0106] Embodiment 22. The multilayer fluoropolymer film comprises a high melting point fluoropolymer layer. 10. The composite article of any one of embodiments 1, 2, 3, and 4.

[0107] Embodiment 23. The high melting point fluoropolymer layer has a melting temperature of at least about 250°C. 23. The composite article of any one of embodiments 1 and 22.

[0108] Embodiment 24. A method according to claim 1, wherein the high melting point fluoropolymer layer comprises a melting temperature of about 350°C or less. 23. The composite article of any one of embodiments 1 and 22.

[0109] Embodiment 25. The high melting point fluoropolymer layer has a thickness of at least about 0.001 mm. 23. The composite article of any one of embodiments 1 and 22, comprising:

[0110] Embodiment 26. An embodiment in which the high melting point fluoropolymer layer comprises a thickness of about 0.25 mm or less. 23. The composite article of any one of embodiments 1 and 22.

[0111] Embodiment 27. The high melting point fluoropolymer layer comprises a total weight of the high melting point fluoropolymer layer. 23. The method of claim 22, comprising at least about 25% by weight of fluoropolymer content. Composite goods.

[0112] Embodiment 28. The high melting point fluoropolymer layer comprises a total weight of the high melting point fluoropolymer layer. 23. The composite of embodiment 22, comprising a fluoropolymer content of about 100% by weight or less. Goods.

[0113] Embodiment 29. The method of any one of embodiments 1 and 22, wherein the high melting point fluoropolymer layer comprises PTFE. 10. The composite article according to any one of claims 1 to 9.

[0114] Embodiment 30. The high melting point fluoropolymer layer comprises a total of 100% by weight of the high melting point fluoropolymer layer. 30. The composite article of embodiment 29, comprising a PTFE content of at least about 25% by weight of the composite article. .

[0115] Embodiment 31. The high melting point fluoropolymer layer comprises a total of 1000 fluoropolymer layers. 30. The composite article of embodiment 29, comprising a PTFE content of about 100% or less by weight.

[0116] Embodiment 32. The method of any one of embodiments 1 and 22, wherein the high melting point fluoropolymer layer comprises a filler. 10. The composite article of any one of claims 1 to 9.

[0117] Embodiment 33. The high melting point fluoropolymer layer comprises a total weight of the high melting point fluoropolymer layer. 33. The composite of embodiment 32, comprising a filler content of at least about 0.05 wt.%. Product.

[0118] Embodiment 34. The high melting point fluoropolymer layer comprises a total weight of the high melting point fluoropolymer layer. 33. The composite article of embodiment 32, comprising a filler content of about 75% by weight or less.

[0119] Embodiment 35. The filler is titanium dioxide, or carbon black, or graphite. , or carbon nanotubes, or glass fibers, or glass beads, or talc, or U V Absorbent filler, or white pigment filler, or pigment filler, or any combination thereof 35. The composite article of any one of embodiments 32, 33, and 34, comprising a combination of

[0120] Embodiment 36. The method of embodiment 1, wherein the high melting point fluoropolymer layer is the outermost layer of the composite article. and 22. A composite article according to any one of claims 1 to 22.

[0121] Embodiment 37. The low melting point fluoropolymer adhesive layer has a melting temperature of at least about 50°C. 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising:

[0122] Embodiment 38. The low melting point fluoropolymer adhesive layer comprises a melting temperature of about 270°C or less. 10. The composite article of any one of embodiments 1, 2, 3, and 4.

[0123] Embodiment 39. The low melting point fluoropolymer adhesive layer is PVDF, or THV, or ET FE, or ECTFE, or PVDF-HFP copolymer, or any combination thereof 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising a laminate.

[0124] Embodiment 40. The low melting point fluoropolymer adhesive layer is Embodiment 39, comprising a fluoropolymer content of at least about 50 wt.% based on total weight. A composite article as described above.

[0125] Embodiment 41. The low melting point fluoropolymer adhesive layer is 39. The method of claim 39, comprising a fluoropolymer content of about 100 wt.% or less based on the total weight. A composite article of the above.

[0126] Embodiment 42. The low melting point fluoropolymer adhesive layer of embodiments 1 and 2 comprises PVDF. 1. A composite article according to any one of claims 1, 2, 3, and 4.

[0127] Embodiment 43. The low melting point fluoropolymer adhesive layer is 43. The composition of claim 42, comprising a PVDF content of at least about 25 wt.% based on the total weight. Composite goods.

[0128] Embodiment 44. The low melting point fluoropolymer adhesive layer is 43. The composite of embodiment 42, comprising a PVDF content of about 100 wt.% or less based on the total weight. Goods.

[0129] Embodiment 45. The low melting point fluoropolymer adhesive layer comprises a PVDF-HFP copolymer. 5. The composite article of any one of embodiments 1, 2, 3, and 4.

[0130] Embodiment 46. The low melting point fluoropolymer adhesive layer is The PVDF-HFP copolymer content is at least about 25% by weight based on the total weight. 46. ​​The composite article of embodiment 45.

[0131] Embodiment 47. The low melting point fluoropolymer adhesive layer is An embodiment comprising a PVDF-HFP copolymer content of about 100% by weight or less based on the total weight. 46. ​​A composite article according to claim 45.

[0132] Embodiment 48. A PVDF-HFP copolymer is used as the total component of a low melting point fluoropolymer adhesive layer. 48. The method of claim 46 or 47, comprising a HFP content of at least about 0.5% by weight. 10. The composite article of any one of claims 1 to 9.

[0133] Embodiment 49. A PVDF-HFP copolymer is used as the total component of a low melting point fluoropolymer adhesive layer. Any of embodiments 46 and 47, comprising an HFP content of about 50% by weight or less. 1. The composite article of claim 1.

[0134] Embodiment 50. A PVDF-HFP copolymer is used as the total component of a low melting point fluoropolymer adhesive layer. 48. The composition of claim 46 or 47, comprising a PVDF content of at least about 50% by weight. 10. The composite article of any one of claims 1 to 9.

[0135] Embodiment 51. A PVDF-HFP copolymer is used as the total component of a low melting point fluoropolymer adhesive layer. 48. Any of embodiments 46 and 47, comprising a PVDF content of about 99.5 wt.% or less by weight. A composite article according to any one of claims 1 to 4.

[0136] Embodiment 52. The low melting point fluoropolymer adhesive layer has a thickness of at least about 0.001 mm. 5. The composite article of any one of embodiments 1, 2, 3, and 4, comprising:

[0137] Embodiment 53. The low melting point fluoropolymer adhesive layer comprises a thickness of about 0.25 mm or less. 10. The composite article of any one of embodiments 1, 2, 3, and 4.

[0138] Embodiment 54. The composite article further comprises a transition layer, the transition layer comprising a multilayer fluoropolymer film. Any of embodiments 1, 2, 3, and 4, in contact with the film and the low melting point fluoropolymer adhesive layer. 1. The composite article according to claim 1 .

[0139] Embodiment 55. The method of embodiment 4, wherein the transition layer comprises PVDF and the transition layer comprises PTFE. 54. A composite article according to any one of claims 54.

[0140] Embodiment 56. The transition layer comprises at least about 5% by weight of PVDF, based on the total weight of the transition layer. 56. The composite article of embodiment 55, comprising:

[0141] Embodiment 57. The transition layer contains about 95% by weight or less of PVDF based on the total weight of the transition layer. 56. The composite article of embodiment 55, comprising an amount

[0142] Embodiment 58. The transition layer comprises at least about 5 wt. % PTFE, based on the total weight of the transition layer. 56. The composite article of embodiment 55, comprising:

[0143] Embodiment 59. The transition layer contains about 95% by weight or less of PTFE based on the total weight of the transition layer. 56. The composite article of embodiment 55, comprising an amount

[0144] Embodiment 60. The method of embodiment 55, wherein the transition layer comprises a melting temperature of at least about 50°C. A composite article of the above.

[0145] Embodiment 61. The method of embodiment 55, wherein the transition layer comprises a melting temperature of about 350° C. or less. Composite goods.

[0146] Embodiment 62. Embodiment 55, wherein the transition layer comprises a thickness of at least about 0.001 mm. A composite article as described above.

[0147] Embodiment 63. The method of embodiment 55, wherein the transition layer comprises a thickness of about 0.25 mm or less. Composite goods.

[0148] Embodiment 64. The combination of embodiments 1 and 2, wherein the transition layer comprises PVDF and the transition layer comprises PTFE. 1. A composite article according to any one of claims 1, 2, 3, and 4.

[0149] Embodiment 65. The transition layer comprises at least about 5% by weight of PVDF, based on the total weight of the transition layer. 65. The composite article of embodiment 64, comprising:

[0150] Embodiment 66. The transition layer contains about 95% by weight or less of PVDF based on the total weight of the transition layer. 65. The composite article of embodiment 64, comprising an amount

[0151] Embodiment 67. The transition layer comprises at least about 5% by weight of PTFE, based on the total weight of the transition layer. 65. The composite article of embodiment 64, comprising:

[0152] Embodiment 68. The transition layer contains about 95% by weight or less of PTFE, based on the total weight of the transition layer. 65. The composite article of embodiment 64, comprising an amount [Example]

[0153] The concepts described herein are further illustrated in the examples below and in the claims. The invention is not intended to limit the scope of the invention described therein.

[0154] Example 1 Two sample composite articles S1 and S2 were formed according to the embodiments described herein. Ta.

[0155] The sample composite article S1 has a low-melt fluoropolymer adhesive layer. Multi-layer fluororesin using a passive layer (LMA) and a transition layer (TL) Structural substrate bonded to a polymer film (Multilayer Fluoropolymer Film, MFF) The sample composite S1 consisted of SS / LM. The multilayer fluoropolymer film was A / TL / MFF. The total thickness of the multilayer fluoropolymer film was 0.066 mm. The structural substrate was a 0.381 mm thick FR4 substrate. The adhesive layer was a PVDF layer with an adhesive strength greater than 1.0 PLI. 50% by weight PTFE based on the total weight of the transition layer and 50% by weight P based on the total weight of the transition layer The multilayer fluoropolymer film was a PTFE-PVDF film containing 3 The first fluoropolymer layer (i.e., the transition layer) The overlying and contacting layer (the first layer) is made of 4% by weight of UV-absorbing carbon based on the total weight of the first layer. The first fluoropolymer layer (i.e., the first fluoropolymer layer) was a PTFE layer filled with fluorocarbon black. a layer overlying and in contact with the first fluoropolymer layer) is a second fluoropolymer layer The third layer was a PTFE layer filled with 8% by weight of TiO2 white pigment based on the total weight of the substrate. fluoropolymer layer (i.e., a layer overlying and in contact with a second fluoropolymer layer) ) was a transparent, hydrophobic PTFE surface layer. Composite article S1 was heated at a temperature of 177°C, 4M The lamination was carried out at a pressure of 1000 Pa and a residence time of 1 minute.

[0156] Sample composite article S2 is a low melting point fluoropolymer adhesive layer (LMA) and transition layer (TL). A structural substrate (SS) bonded to a multilayer fluoropolymer film (MFF) using The composition of sample composite article S2 was SS / LMA / TL / MFF. The polymer film has a total thickness of 0.066 mm. The structural substrate is 0.381 mm. The low melting point fluoropolymer adhesive layer was a low melting point fluoropolymer P having 4.5 wt% HFP based on the total weight of the adhesive layer and having an adhesive strength of more than 1.0 PLI The transition layer was a (VDF-HFP) copolymer layer. The transition layer was 50% by weight based on the total weight of the transition layer. % PTFE and 50 wt. % P(VDF-HFP) based on the total weight of the transition layer. , PTFE-P(VDF-HFP). The multilayer fluoropolymer film consisted of three The first fluoropolymer layer (i.e., the transition layer) contained a fluoropolymer layer. The overlapping and contacting layers are made of 4% by weight of UV absorbing carbon black based on the total weight of the first layer. The second fluoropolymer layer (i.e., the first The layer overlying and in contact with the second fluoropolymer layer The third full layer was a PTFE layer filled with 8% by weight of TiO2 white pigment. The fluoropolymer layer (i.e., the layer overlying and in contact with the second fluoropolymer layer) The composite article S2 was heated at a temperature of 177°C and 4 MPa. The laminate was applied at a pressure of 1000 kJ / cm2 and a residence time of 1 minute.

[0157] For comparison purposes, a comparative sample composite article CS1 was prepared.

[0158] The comparative sample composite CS1 is made of PTFE case film (PCF). The comparative sample composite article CS1 had a structure of SS / P. The structural substrate was a 0.381 mm thick FR4 substrate. The PTFE case The film had a thickness of 3 mils. Sample composite article CS1 was heated to a temperature of 177°C, 4 MPa. The lamination was carried out at a pressure of 0.15 MPa and a residence time of 1 min.

[0159] The sample composite articles S1 and S2 and the comparative sample composite article CS1 were tested to determine their first The first peak peel strength was determined by peeling the sample at a constant speed of 2 inches / minute. A 180° peel test was performed on an Instron mechanical test frame while pulling the It was used and tested.

[0160] FIG. 3a shows the peel elongation versus the applied load during the peel strength test of the sample composite article S1. Figure 3b includes a plot of the applied load during peel strength testing of sample composite article S2. The results of the peel strength tests are summarized in Table 1 below.

[0161] [Table 1]

[0162] In the general description or example, all of the activities described above are required. This does not mean that some of the specific tasks may not be required, and in addition to the tasks described, It should be noted that one or more further operations may be performed. The order listed is not necessarily the order in which they will be performed.

[0163] Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, benefits, advantages, solutions to problems, and any benefits, advantages, or solutions Any feature that may bring about or make more pronounced may be included in any or all of the claims. They should not be construed as critical, necessary, or essential features.

[0164] The specification and illustrations of the embodiments set forth herein are provided to illustrate and explain the general structure of the various embodiments. The specification and illustrative drawings are intended to provide a general understanding of the structures described herein. A comprehensive and comprehensive description of all elements and features of devices and systems that use the structure or method It is not intended that separate embodiments may be combined into a single embodiment. Although multiple embodiments may be provided, they may be described in the context of a single embodiment for the sake of brevity. The various features described may be provided separately or in any subcombination. Reference to a range of values ​​includes every individual value within that range. Embodiments may become apparent to those skilled in the art only after reading this specification. so that structural substitutions, logical substitutions, or other modifications can be made without departing from the spirit and scope of the present invention. Other embodiments of the present invention may be used and derived from the present disclosure. They should be considered illustrative rather than definitive.

Claims

1. A structural substrate; A multilayer fluoropolymer film comprising a high melting point fluoropolymer layer having a melting temperature A1. And, a low melting point fluoropolymer adhesive layer having a melting temperature A2. 、 The low melting point fluoropolymer adhesive layer is Contact with the film A composite article wherein said melting temperature A2 is less than said melting temperature A1.

2. A structural substrate; a multilayer fluoropolymer film; a low melting point fluoropolymer adhesive layer comprising PVDF, The low melting point fluoropolymer adhesive layer is Composite articles that come into contact with the body.

3. A structural substrate; a multilayer fluoropolymer film; a low melting point fluoropolymer adhesive layer comprising a PVDF-HFP copolymer. It is a product, The low melting point fluoropolymer adhesive layer is Composite articles that come into contact with the body.

4. 4. The method of claim 1, wherein the structural substrate comprises a thermoforming material. Composite goods.

5. 4. The method of claim 1, wherein the structural substrate comprises a thermoplastic material. A composite item.

6. The structural substrate comprises a glass transition temperature of at least about -150°C and not more than about 350°C.

4. The composite article of any one of claims 1, 2 and 3.

7. The multilayer fluoropolymer film is made of PTFE, FEP, PFA, or T FM, or THV, or PVDF, or P (VDF-HFP), or a combination thereof 4. The composite article of any one of claims 1, 2, and 3, comprising a combination.

8. 8. Any one of claims 6 and 7, wherein the multilayer fluoropolymer film comprises a filler. Item 1. A composite article according to item 1.

9. The filler is titanium dioxide, or carbon black, or graphite, or Carbon nanotubes, glass fibers, glass beads, talc, or UV absorbing filler filler, or white pigment filler, or pigment filler, or any combination thereof 9. The composite article of claim 8.

10. the high melting point fluoropolymer layer is Fluoropolymer content of at least about 25% by weight and not more than about 100% by weight.

10. The composite article of claim 9.

11. The low melting point fluoropolymer adhesive layer has a melting point of at least about 50°C and not more than about 270°C. The composite article of any one of claims 1, 2, and 3, comprising a temperature.

12. The low melting point fluoropolymer adhesive layer is PVDF, or THV, or ETFE, or ECTFE, or PVDF-HFP copolymer, or any combination thereof.

4. The composite article of any one of claims 1, 2, and 3.

13. 4. The method of claim 1, wherein the low melting point fluoropolymer adhesive layer comprises PVDF. A composite article according to any one of claims 1 to 4.

14. 10. The method of claim 9, wherein the low melting point fluoropolymer adhesive layer comprises a PVDF-HFP copolymer.

4. The composite article of any one of claims 1, 2, and 3.

15. The composite article further comprises a transition layer, the transition layer comprising:

4. The method of claim 1, wherein the adhesive layer is in contact with the adhesive layer.

1. The composite article of claim 1.

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