Electronic module, electronic device, imaging sensor module, imaging device, and display device

Abstract

To provide an electronic module capable of directly connecting a flexible wiring member and a wiring substrate in a small area, and an electronic device, an imaging sensor module, an imaging device, and a display device using the same.SOLUTION: An electronic module includes a flexible wiring member, a wiring board, and a conductive connecting member. The flexible wiring member includes a flexible base material, a first wiring layer formed on at least one surface of the flexible base material, and a first electrode formed on a tip portion not covered with a first insulating layer by the first wiring layer. The wiring board includes a base material provided with wiring, a second insulating layer having an opening formed on at least one surface of the base material, and a second electrode formed in the opening. The conductive connecting member connects the first electrode and the second electrode. A tip of the flexible wiring member is arranged above the opening when viewed in a plan view.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to an electronic module, an electronic device, an imaging sensor module, an imaging device, and a display device. [Background technology]

[0002] Patent Document 1 describes a technique for joining a flexible substrate to a circuit board by soldering. In the technique described in Patent Document 1, after overlapping the electrode pads of the circuit board and the solder terminals of the flexible substrate, when thermocompression bonding is performed from above the flexible substrate via solder, a stopper structure consisting of a rib portion with a dam portion interposed between them is formed at the tip of the flexible substrate.

[0003] Patent document 1 describes that the rib portion comes into contact with the circuit board during thermocompression bonding, thereby suppressing the pressure, and forming a gap for solder pools between the electrode pads on the circuit board and the solder terminals on the flexible substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-101026 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with the technology described in Patent Document 1, it was necessary to secure an area on the circuit board that was equivalent to the dam and rib portions of the flexible substrate so that the rib portions of the flexible substrate could come into contact with the circuit board. The present invention aims to provide an electronic module that can directly connect a flexible wiring member and a wiring board in a small area, as well as an electronic device, an imaging sensor module, an imaging device, and a display device that use the same. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided an electronic module comprising a flexible wiring member, a wiring board, and a conductive connecting member, wherein the flexible wiring member comprises a flexible base material, a first wiring layer formed on at least one surface of the flexible base material, and a first electrode formed by the first wiring layer at a tip portion not covered by the first insulating layer, the wiring board comprises a base material on which wiring is provided, a second insulating layer having an opening formed on at least one surface of the base material, and a second electrode formed in the opening, the conductive connecting member connects the first electrode and the second electrode, and the tip of the flexible wiring member is positioned above the opening when viewed in a plane. [Effects of the Invention]

[0007] According to the present invention, the flexible wiring member and the wiring board can be directly connected in a small area. [Brief explanation of the drawings]

[0008] [Figure 1A] 1 is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an electronic module according to a first embodiment of the present invention. [Figure 1B] 1 is a top view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an electronic module according to a first embodiment of the present invention. FIG. [Figure 2] 10 is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an electronic module according to a second embodiment of the present invention. FIG. [Figure 3A] 5A to 5C are cross-sectional views illustrating a method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 3B] 5A to 5C are cross-sectional views illustrating a method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 3C] 5A to 5C are cross-sectional views illustrating a method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 4A]5A to 5C are cross-sectional views showing another method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 4B] 5A to 5C are cross-sectional views showing another method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 4C] 5A to 5C are cross-sectional views showing another method for manufacturing the electronic module according to the first embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view showing an electronic component according to a third embodiment of the present invention. [Figure 6A] FIG. 10 is a schematic diagram showing an imaging unit according to a fourth embodiment of the present invention. [Figure 6B] FIG. 10 is a schematic diagram showing an imaging unit according to a fourth embodiment of the present invention. [Figure 6C] FIG. 10 is a schematic diagram showing an imaging unit according to a fourth embodiment of the present invention. [Figure 7A] FIG. 10 is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an imaging unit according to a fourth embodiment of the present invention. [Figure 7B] FIG. 10 is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an imaging unit according to a fourth embodiment of the present invention. [Figure 7C] FIG. 10 is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an imaging unit according to a fourth embodiment of the present invention. [Figure 8A] FIG. 11 is a cross-sectional view showing another structure of the connection portion between the flexible wiring member and the printed wiring board serving as the wiring substrate in the imaging unit according to the fourth embodiment of the present invention. [Figure 8B] FIG. 11 is a cross-sectional view showing another structure of the connection portion between the flexible wiring member and the printed wiring board serving as the wiring substrate in the imaging unit according to the fourth embodiment of the present invention. [Figure 8C] FIG. 11 is a cross-sectional view showing another structure of the connection portion between the flexible wiring member and the printed wiring board serving as the wiring substrate in the imaging unit according to the fourth embodiment of the present invention. [Figure 9]FIG. 10 is an explanatory diagram showing a schematic configuration of an imaging device as an example of an electronic device according to a fifth embodiment of the present invention. [Figure 10A] FIG. 13 is an explanatory diagram showing a schematic configuration of a display device as an example of an electronic device according to a sixth embodiment of the present invention. [Figure 10B] FIG. 13 is an explanatory diagram showing a schematic configuration of a display device as an example of an electronic device according to a sixth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiments and can be modified as appropriate without departing from the spirit of the present invention. In the drawings described below, elements having the same functions are designated by the same reference numerals, and their description may be omitted or simplified.

[0010] (Electronic Module) [First embodiment] The structure of an electronic module according to a first embodiment of the present invention will be described with reference to FIGS. 1A and 1B.

[0011] FIG. 1A is a cross-sectional view showing the structure of a connection portion between a flexible wiring member and a printed wiring board, which is a wiring substrate, in an electronic module according to this embodiment.

[0012] 1A, the electronic module 100 according to this embodiment includes a flexible wiring member 4 and a printed wiring board 9, which is a wiring substrate to which the flexible wiring member 4 is directly connected and mounted by soldering. The flexible wiring member 4 is a flexible film-like flexible printed wiring board. Unlike the flexible wiring member 4, the printed wiring board 9 is a hard, plate-like rigid printed wiring board.

[0013] The flexible wiring member 4 has a flexible substrate 1, a flexible wiring layer 2 which is a first wiring layer, and a coverlay 3 which is a first insulating layer. As will be described below, the flexible wiring member 4 is configured by having one or more conductor layers as the flexible wiring layer 2, and the conductor layers being stacked via the flexible substrate 1 as insulating layers. Note that in this embodiment, a case will be described in which the wiring layer in the flexible wiring member 4 is a single layer, but this is not limited to a single layer, and the wiring layer may be two or more layers.

[0014] The flexible substrate 1 is an insulating substrate made of resin or the like, for example, in the form of a sheet or film, and has flexibility and pliability. Therefore, the flexible wiring member 4 is configured to be deformable, such as by bending. The insulator constituting the flexible substrate 1 only needs to have electrical insulation properties. For example, polyimide, polyethylene terephthalate, etc. are used as the insulator constituting the flexible substrate 1.

[0015] The flexible wiring layer 2 is a conductor layer made of copper foil or other metal foil. The flexible wiring layer 2 has a wiring pattern. The flexible wiring layer 2 is formed on one or both sides of the flexible substrate 1. The conductor that makes up the flexible wiring layer 2 is a material that has higher electrical and thermal conductivity than an insulator, such as a metal such as copper, silver, or gold. It is sufficient that the flexible wiring layer 2 is formed on at least one side of the flexible substrate 1.

[0016] The coverlay 3 is an insulating layer that protects the circuit formed by the flexible wiring layer 2. The coverlay 3 is formed of a coverlay film, an overcoat, etc. The coverlay 3 is formed on the surface of the flexible substrate 1 on which the flexible wiring layer 2 is formed so as to cover the flexible wiring layer 2.

[0017] The coverlay 3 is not formed at the tip of the flexible wiring member 4, and the flexible wiring layer 2 is exposed. The exposed portion of the flexible wiring layer 2 forms a first electrode 5. A plurality of first electrodes 5 are arranged in a row at a predetermined pitch. In this way, the first electrode 5 is formed by the flexible wiring layer 2 exposed at the tip of the flexible wiring member 4.

[0018] The printed wiring board 9 serving as a wiring substrate has a printed wiring substrate 6 serving as a substrate, a wiring layer 7 serving as a second wiring layer, and a second insulating layer 8.

[0019] In this embodiment, the case where the printed wiring board 9 has four wiring layers will be described, but the number is not limited to four. The printed wiring board 9 may have a single layer or multiple layers, i.e., four or less layers or four or more layers.

[0020] The printed wiring substrate 6, which serves as the substrate, is, for example, a board-shaped insulating substrate made of a hard composite material or the like. Unlike the flexible substrate 1, the printed wiring substrate 6 is hard. The insulator constituting the printed wiring substrate 6 only needs to have electrical insulation properties. For example, the printed wiring substrate 6 may be an organic wiring board using a glass epoxy substrate, a ceramic wiring board using ceramics, or a metal core wiring board having a metal core layer. Furthermore, the substrate is not limited to a printed wiring substrate, but may also be a silicon substrate.

[0021] The wiring layer 7 is a conductor layer made of copper foil or other metal foil. The wiring layer 7 has a wiring pattern. The wiring layer 7 is formed on one or both sides of the printed wiring substrate 6. One or more wiring layers 7 are also formed inside the printed wiring substrate 6. FIG. 1A shows a case where a total of four wiring layers 7 are formed on both sides and inside the printed wiring substrate 6. The conductors constituting the wiring layer 7 are materials that have higher electrical and thermal conductivity than insulators, such as metals such as copper, silver, and gold. It is sufficient that the wiring layer 7 is formed on at least one side of the printed wiring substrate 6.

[0022] The second insulating layer 8 is an insulating protective film that protects the circuit formed by the wiring layer 7. In the first embodiment, the second insulating layer 8 is formed of a hardened liquid solder resist, a film-like solder resist, or the like. Note that the second insulating layer 8 may also be made of a highly insulating nitride or oxide such as SiN or Al2O3. The second insulating layer 8 is formed on the surface of the printed wiring substrate 6 on which the wiring layer 7 is formed, so as to cover the wiring layer 7.

[0023] An opening 12 is formed in the second insulating layer 8. The wiring layer 7 is exposed in the opening 12. The exposed portion of the wiring layer 7 forms a second electrode 10. A plurality of second electrodes 10 are arranged side by side at a predetermined pitch. In this way, the second electrode 10 is formed by the wiring layer 7 exposed in the opening 12. Note that, as long as electrical connection is possible, a protective film made of metal oxide or metal nitride may be provided on a portion of the second electrode 10.

[0024] The flexible wiring member 4 is mounted on the surface of the printed wiring board 9 on which the second electrode 10 is exposed, with the surface on which the first electrode 5 is formed facing the printed wiring board 9. The portion of the flexible wiring member 4 on which the first electrode 5 is exposed is called the tip portion. The first electrode 5 and the second electrode 10 are arranged opposite each other so that at least a portion of them overlap each other in a plan view perpendicular to the printed wiring board 9.

[0025] The tip of the flexible wiring member 4 is arranged so as to bend obliquely and drop into the opening 12 formed in the second insulating layer 8. The tip of the flexible wiring member 4 drops into the opening 12 with the first electrode 5 facing the second electrode 10 in the opening 12. In other words, the tip of the flexible wiring member 4 is fitted into the opening 12 with the first electrode 5 facing the second electrode 10 in the opening 12. As a result, the tip of the flexible wiring member 4 is arranged inside the opening 12. In other words, the tip of the flexible wiring member 4 is arranged above the opening 12 in a plan view.

[0026] It is not necessary that the entire tip of the flexible wiring member 4 is disposed within the opening 12. The tip of the flexible wiring member 4 may be partially disposed within the opening 12, for example, such that the portion of the tip on the printed wiring board 9 side drops into and fits within the opening 12.

[0027] The first electrode 5 exposed at the tip of the flexible wiring member 4 that falls into the opening and the second electrode 10 exposed at the opening 12 are connected via a conductive connecting member, solder 11. The first electrode 5 connected to the second electrode 10 is inclined at a predetermined angle relative to the second electrode 10 because the tip of the flexible wiring member 4 is bent obliquely into the opening 12.

[0028] The conductive connecting member, solder 11, is formed by heating and solidifying a solder-containing connecting material, and connects the first electrode 5 of the flexible wiring member 4 to the second electrode 10 of the printed wiring board 9. The solder-containing connecting material may be, for example, Sn-3.0%Ag-0.5%Cu solder or Sn-58%Bi solder supplied together with flux, or solder powder impregnated in a thermosetting resin or a thermoplastic resin. Alternatively, a solder precoat may be formed on the first electrode 5 or the second electrode 10 in advance, followed by supplying flux thereto. The solder-containing connecting material is not particularly limited, and may be any conductive material capable of electrically connecting and fixing the first electrode 5 and the second electrode 10 to each other. The conductive connecting member is not limited to solder, and may also be a metal or a resin, such as an anisotropic conductive film or an anisotropic conductive resin.

[0029] The tip of the flexible wiring member 4 connected to the printed wiring board 9 by the solder 11 in this manner is bent and falls into the opening 12 formed in the second insulating layer 8 of the printed wiring board 9. Meanwhile, the portion of the flexible wiring member 4 opposite the tip rides up onto the second insulating layer 8 of the printed wiring board 9. As a result, the flexible wiring member 4 has a portion in contact with the second insulating layer 8. The tip of the coverlay 3 on the side of the first electrode 5 is located inside the opening 12.

[0030] 1B is a top view showing the structure of a connection portion between a flexible wiring member 4 and a printed wiring board 9 in an electronic module 100 according to this embodiment. Fig. 1B shows the structure of electronic module 100 in a plan view from a direction perpendicular to printed wiring board 9 as seen from the flexible wiring member 4 side.

[0031] 1B, no coverlay 3 is formed on the tip of the flexible wiring member 4, and multiple first electrodes 5 are formed by the exposed flexible wiring layer 2. The multiple first electrodes 5 are arranged, for example, at a predetermined pitch in the width direction along the edge of the flexible wiring member 4.

[0032] Furthermore, openings 12 are formed in the second insulating layer 8 of the printed wiring board 9, exposing the wiring layer 7. In the openings 12, a plurality of second electrodes 10 are formed by the exposed wiring layer 7. The plurality of second electrodes 10 are arranged, for example, on one long side of the rectangular opening 12, so as to be lined up at a predetermined pitch in the direction along the long side.

[0033] In each of a plurality of corresponding pairs of first electrodes 5 and second electrodes 10, the first electrodes 5 and second electrodes 10 are arranged opposite to each other so that at least a portion of the electrodes overlap when viewed in a plan view perpendicular to the printed wiring board 9.

[0034] Furthermore, in a direction perpendicular to the direction in which the tip of the flexible wiring member 4 falls into the opening 12 and parallel to the printed wiring board 9, the width of the opening 12 is wider than the width of the tip of the flexible wiring member 4. That is, the width of the opening 12 in the direction in which the multiple second electrodes 10 are arranged is wider than the width of the tip of the flexible wiring member 4 in the direction in which the multiple first electrodes 5 are arranged. In this way, the width of the tip of the flexible wiring member 4 is narrower than the width of the opening 12 in the width direction of the tip. Therefore, the tip of the flexible wiring member 4 is positioned so that it is more likely to fall into the opening 12. As a result, the first electrode 5 and the second electrode 10 are more reliably connected via the solder 11.

[0035] Thus, according to this embodiment, even if the electrodes are arranged at a narrow pitch of 0.1 mm or less and the amount of solder-containing connecting material supplied onto the electrodes is small, the first electrode 5 and the second electrode 10 can be more reliably connected via the solder 11.

[0036] As described above, an electronic module 100 having the flexible wiring member 4 and the printed wiring board 9 is configured. Electronic components may be mounted on either or both of the printed wiring board 9 and the flexible wiring member 4. There are no particular limitations on the electronic components, and various electronic components may be mounted. In the sixth embodiment described below, a case will be described in which an image sensor element 15 is mounted on the printed wiring board 9 as an electronic component.

[0037] As the pixel count and frame rate of still and video images increase in digital still cameras and digital video cameras, there is a need to transfer large amounts of data between the image sensor and the image processing LSI (Large Scale Integration). Image sensors include CMOS (Complementary Metal Oxide Semiconductor) image sensors and CCD (Charge Coupled Device) image sensors. Furthermore, there is a demand for further miniaturization of image sensor modules to enable product miniaturization and improve the performance of in-camera image stabilization, which corrects image stabilization by moving the image sensor itself.

[0038] Generally, the printed wiring board of an image sensor module equipped with an image sensor and the printed wiring board equipped with an image processing LSI are connected by a flexible wiring board via a connector. The connector mechanically fixes the flexible wiring board with metal springs or the like, and brings the electrodes of the flexible wiring board into contact with the electrodes in the connector to establish electrical continuity.

[0039] However, the larger the data volume transferred from the image sensor to the image processing LSI, the greater the number of wires on the flexible wiring board. Meanwhile, because the connector mechanically fastens the flexible wiring board, the smaller the connector, the weaker the mechanical fastening force of the flexible wiring board, making it more difficult to establish electrical continuity between the connector and the electrodes on the flexible wiring board. This places a limit on how small the connector can be. If such a connector is used for connection, the larger the data transfer volume and the greater the number of wires on the flexible wiring board, the larger the connector and the larger the image sensor module.

[0040] Therefore, Patent Document 1 proposes a technique for directly connecting electrodes by thermocompression bonding using solder without using a connector. However, the technique described in Patent Document 1 requires securing an area equivalent to the rib and dam portions for suppressing the pressure and forming solder pools, making it difficult to connect in a small area.

[0041] When connection is made using solder 11 without a connector, the first electrode 5 and the second electrode 10 must each be in contact with the solder-containing connecting material while the solder-containing connecting material is heated to above the melting point of the solder.

[0042] However, when the intervals between the first electrodes 5 and the second electrodes 10 are narrow and the first electrodes 5 and the second electrodes 10 are arranged at a narrow pitch, the amount of solder-containing connecting material supplied onto the electrodes decreases, which makes it difficult for the first electrodes 5 and the second electrodes 10 to come into contact with the solder 11, and this can easily result in poor connection.

[0043] In contrast, in the present embodiment, the tip of the flexible wiring member 4 where the first electrode 5 is exposed is recessed into the opening 12 formed in the second insulating layer 8. As a result, the tip of the flexible wiring member 4 where the first electrode 5 is exposed is disposed within the opening 12. This arrangement of the tip of the flexible wiring member 4 including the first electrode 5 allows both the first electrode 5 and the second electrode 10 to be reliably contacted by the solder 11. As a result, according to the present embodiment, the first electrode 5 of the flexible wiring member 4 can be reliably connected to the second electrode 10 of the printed wiring board 9 via the solder 11. Furthermore, according to the present embodiment, there is no need to secure an area corresponding to structures such as ribs and dams, and therefore the first electrodes 5 and the second electrodes 10 can be connected with a narrow electrode pitch.

[0044] On the other hand, when connecting the first electrode 5 and the second electrode 10, if the solder-containing connecting material protrudes from between the first electrode 5 and the second electrode 10 and comes into contact with the adjacent electrode, there is a risk of a short circuit between the solder 11 and the electrode, resulting in a poor connection. In particular, when the first electrodes 5 and the second electrodes 10 are arranged at a narrow pitch, the narrow spacing between the electrodes may cause a short circuit between the electrodes.

[0045] In contrast, in this embodiment, the portion of the flexible wiring member 4 opposite the tip runs over the second insulating layer 8 of the printed wiring board 9. That is, the flexible wiring member 4 has a portion that is in contact with the second insulating layer 8. Therefore, at least a space is secured from the surface of the second electrode 10 of the printed wiring board 9 to the surface of the second insulating layer 8 on the side opposite the tip of the flexible wiring member 4. This space can hold the solder 11 when connecting the first electrode 5 and the second electrode 10, so in this embodiment, it is possible to prevent the solder 11 from protruding from between the first electrode 5 and the second electrode 10 and causing a short circuit.

[0046] Furthermore, if the solder-containing connecting material protrudes above the opening 12 in the second insulating layer 8, there is a concern that the solder 11 sandwiched between the flexible wiring member 4 on the second insulating layer 8 will move, causing a short circuit between the electrodes. Therefore, from the perspective of preventing a short circuit between the electrodes, it is desirable that the volume V of the solder-containing connecting material supplied between the first electrode 5 and the second electrode 10 be equal to or less than a predetermined amount. In other words, it is desirable that the volume V of the solder-containing connecting material satisfy the following formula (1), where S1 is the area of ​​the first electrode 5, S2 is the area of ​​the second electrode 10, and H1 is the height from the surface of the second electrode 10 to the surface of the second insulating layer 8. V<(S1+S2) / 2×H1 ……Formula (1)

[0047] If the volume V of the solder-containing connecting material satisfies the above formula (1), the solder will not protrude above the opening 12 formed in the second insulating layer 8.

[0048] Furthermore, it is desirable that the distance D1 between the first electrodes 5 and the distance D2 between the second electrodes 10 are equal to or greater than a predetermined distance from the viewpoint of preventing short circuits between the electrodes. That is, it is desirable that the distance D1 between the first electrodes 5 and the distance D2 between the second electrodes 10 satisfy the following formulas (2a) and (2b), respectively, where H2 is the height from the surface of the printed wiring substrate 6 to the surface of the second insulating layer 8 and L is the cross-sectional length in the short direction of the opening 12 in the second insulating layer 8. The cross-sectional length L in the short direction of the opening 12 is the length of the opening 12 in the direction along the surface of the printed wiring board 9, which is perpendicular to the direction in which the multiple second electrodes 10 are arranged. In formulas (2a) and (2b), V is the volume of the solder-containing connecting material supplied between the first electrode 5 and the second electrode 10, as described above. D1≧V / (H2×L) ……Formula (2a) D2≧V / (H2×L) ……Formula (2b)

[0049] By ensuring the distances D1 and D2 between the electrodes in this manner, the volume of the space between the electrodes becomes larger than the volume V of the solder-containing connecting material disposed between the first electrode 5 and the second electrode 10. As a result, short circuits are less likely to occur between adjacent first electrodes 5 and adjacent second electrodes 10.

[0050] In a typical printed wiring board 9, the thickness of the copper foil used as the second electrode 10 is approximately 5 to 20 μm, and the thickness of the second insulating layer 8 is 20 to 40 μm. In this case, when the width of the first electrode 5 and the width of the second electrode 10 are each 75 μm, it is desirable that the distance D1 between the first electrodes 5 and the distance D2 between the second electrodes 10 are each 66 μm or more. In a similar case, it is desirable that the distance D1 between the first electrodes 5 and the distance D2 between the second electrodes 10 are 88 μm or more when the width of the first electrode 5 and the width of the second electrode 10 are each 100 μm, and 175 μm or more when the widths are each 200 μm.

[0051] The area S1 of the first electrode 5 and the area S2 of the second electrode 10 may or may not be the same.

[0052] Furthermore, if the tip of the flexible wiring member 4 is in contact with the inner wall of the opening 12 formed in the second insulating layer 8, the tip of the flexible wiring member 4 is less likely to fall into the opening 12. Therefore, it is desirable that the tip of the flexible wiring member 4 and the inner wall of the opening 12 be spaced apart at a certain distance from each other. Specifically, taking into consideration the thermal expansion coefficient of the flexible wiring member 4 and the connection temperature of the solder 11, it is desirable that the tip of the flexible wiring member 4 and the inner wall of the opening 12 be spaced apart by at least the amount of expansion of the flexible wiring member 4 when connecting the first electrode 5 and the second electrode 10. It is desirable that such a positional relationship between the tip of the flexible wiring member 4 and the inner wall of the opening 12 be satisfied not only during heating for soldering with the solder 11 but also in the structure after soldering. Note that, for example, the linear expansion coefficient of the flexible wiring member 4 using polyimide as the flexible substrate 1 is 12 to 30 ppm / °C or less.

[0053] As described above, according to this embodiment, the flexible wiring member 4 and the printed wiring board 9 can be directly connected with a narrow electrode pitch without using a connector.

[0054] Example 1 An electronic module and a manufacturing method thereof according to Example 1 will be described. The flexible wiring member 4 was configured to have a 25 μm-thick polyimide as the flexible substrate 1, a 6 μm-thick copper foil as the flexible wiring layer 2, and a 15 μm-thick polyimide as the coverlay 3. The tip of the flexible wiring member 4 was not provided with the coverlay 3, and the copper foil of the flexible wiring layer 2 was exposed by a width of 0.8 mm in the cross-sectional direction of FIG. 1 and by 18 mm in the direction perpendicular to the cross section, to form a first electrode 5. The first electrodes 5 were 100 μm wide and arranged at a pitch of 200 μm with adjacent first electrodes 5 spaced 100 μm apart.

[0055] The printed wiring board 9 was a four-layer board with a total thickness of 500 μm, using FR-4 material as the printed wiring substrate 6 and copper foil as the wiring layer 7. In the printed wiring board 9, an opening 12 was formed in the 20 μm-thick second insulating layer 8, measuring 20 mm in width, 1 mm in length, and 20 μm in depth. The 12 μm-thick copper foil on the surface was exposed over a 1 mm width in the cross-sectional direction of FIG. 1A to form the second electrode 10. A Sn-3.0% Ag-0.5% Cu solder precoat was previously formed on the second electrode 10 as a solder-containing connecting material, and flux was then applied to the second electrode 10.

[0056] The first electrode 5 and the second electrode 10 were arranged to face each other and overlap at least partially in a plan view perpendicular to the printed wiring board 9. The tip of the flexible wiring member 4 was arranged to fall into an opening 12 formed in the second insulating layer 8. The portion of the flexible wiring member 4 opposite the tip was placed on the second insulating layer 8 of the printed wiring board 9. At this time, the tip of the coverlay 3 of the flexible wiring member 4 on the first electrode 5 side was arranged to be located inside the opening 12 formed in the second insulating layer 8 of the printed wiring board 9.

[0057] Thereafter, the tip end portion of flexible wiring member 4 was fixed to printed wiring board 9 with polyimide tape. In this state, reflow heating was performed so that the solder-containing connecting material reached a peak temperature of 220°C or higher and lower than 250°C, and first electrode 5 and second electrode 10 were connected by solder bonding. Thereafter, the polyimide tape was removed.

[0058] The linear expansion coefficient of the flexible wiring member 4 was approximately 15 ppm / °C. Therefore, taking into consideration that the extension of a 0.8 mm tip of the flexible wiring member 4 at 250°C would be approximately 30 μm, the tip of the flexible wiring member 4 was connected in a state where it was positioned approximately 50 μm away from the inner wall of the opening 12 in the second insulating layer 8. At this time, the tip of the flexible wiring member 4 was connected at an angle of approximately 2° with respect to the surface of the second electrode 10 of the printed wiring substrate 6.

[0059] By connecting with such a structure, it was possible to connect the flexible wiring member 4 and the printed wiring board 9 with a narrow electrode pitch of 200 μm.

[0060] [Second embodiment] The structure of an electronic module according to a second embodiment of the present invention will be described with reference to Fig. 2. Fig. 2 is a cross-sectional view showing the structure of a connection portion between a flexible wiring board and a printed wiring board in the electronic module according to this embodiment.

[0061] The basic structure of the electronic module according to this embodiment is almost the same as the structure of the electronic module according to Embodiment 1. The electronic module according to this embodiment differs from the first embodiment in the position of the tip of the coverlay 3 on the first electrode 5 side relative to the opening 12 formed in the second insulating layer 8.

[0062] As shown in FIG. 2, the electronic module 100 according to this embodiment, like the first embodiment, has a flexible wiring member 4 and a printed wiring board 9 to which the flexible wiring member 4 is directly connected and mounted by soldering.

[0063] As in the first embodiment, the tip of the flexible wiring member 4 is arranged so as to bend and drop into the opening 12 formed in the second insulating layer 8. The first electrode 5 exposed at the tip and the second electrode 10 exposed in the opening 12 are connected via solder 11, as in the first embodiment.

[0064] The tip of the flexible wiring member 4 connected to the printed wiring board 9 by the solder 11 in this manner is bent and recessed into the opening 12 formed in the second insulating layer 8, as in the first embodiment. The portion of the flexible wiring member 4 opposite to the tip also rises onto the second insulating layer 8 of the printed wiring board 9, as in the first embodiment.

[0065] On the other hand, in this embodiment, unlike the first embodiment, the end of the coverlay 3 on the first electrode 5 side is located outside the opening 12 formed in the second insulating layer 8. As a result, the end of the coverlay 3 on the first electrode 5 side is located on the second insulating layer 8. By arranging the coverlay 3 in this way so that the end of the coverlay 3 on the first electrode 5 side is located on the second insulating layer 8, in this embodiment, the area of ​​the tip of the flexible wiring member 4 that falls into the opening 12 can be made larger than in the first embodiment.

[0066] As described above, according to this embodiment, the area of ​​the tip of the flexible wiring member 4 that falls into the opening 12 is increased, thereby increasing the connection area between the first electrode 5 and the second electrode 10. That is, according to this embodiment, even when the electrodes are arranged at a narrow pitch of, for example, 0.1 mm or less and the amount of solder-containing connecting material supplied onto the electrodes is small, the first electrode 5 and the second electrode 10 can be more reliably brought into contact with the solder 11 and connected.

[0067] Example 2 An electronic module and a manufacturing method thereof according to Example 2 will be described. The flexible wiring member 4 was configured to have a 25 μm-thick polyimide as the flexible substrate 1, a 6 μm-thick copper foil as the flexible wiring layer 2, and a 15 μm-thick polyimide as the coverlay 3. The tip of the flexible wiring member 4 was not provided with the coverlay 3, and the copper foil of the flexible wiring layer 2 was exposed by a width of 1.4 mm in the cross-sectional direction of FIG. 2 and by 24.6 mm in the direction perpendicular to the cross section, to form a first electrode 5. The first electrodes 5 were 75 μm wide and arranged at a pitch of 150 μm, with adjacent first electrodes 5 spaced 75 μm apart.

[0068] The printed wiring board 9 was a four-layer board with a total thickness of 500 μm, consisting of a printed wiring substrate 6 made of FR-4 material and a wiring layer 7 made of copper foil. In the printed wiring board 9, an opening 12 was formed in the 20 μm-thick second insulating layer 8, measuring 25.6 mm wide, 1 mm long, and 20 μm deep. The opening 12 was also formed, exposing the 12 μm-thick copper foil on the surface by a width of 1 mm in the cross-sectional direction of FIG. 2, forming the second electrode 10. A Sn-3.0% Ag-0.5% Cu solder precoat was previously formed on the second electrode 10 as a solder-containing connecting material, and flux was then applied to the second electrode 10.

[0069] The first electrode 5 and the second electrode 10 were arranged to face each other and overlap at least partially when viewed in a plan view perpendicular to the printed wiring board 9. The tip of the flexible wiring member 4 was arranged to fall into an opening 12 formed in the second insulating layer 8. The portion of the flexible wiring member 4 opposite the tip was placed on the second insulating layer 8 of the printed wiring board 9. At this time, the tip of the coverlay 3 of the flexible wiring member 4 on the first electrode 5 side was arranged to be located outside the opening 12 formed in the second insulating layer 8 of the printed wiring board 9.

[0070] Thereafter, the tip end portion of the flexible wiring member 4 was pressed and fixed to the printed wiring board 9 with a force of 0.03 to 0.1 MPa using a tool T made of a magnetic material. In this state, induction heating was performed so that the solder-containing connecting material had a peak temperature of 220°C or higher and lower than 250°C, and the first electrode 5 and the second electrode 10 were connected by solder bonding.

[0071] The linear expansion coefficient of the flexible wiring member 4 was approximately 15 ppm / °C. Therefore, taking into consideration that the extension of a 0.8 mm tip of the flexible wiring member 4 at 250°C would be approximately 30 μm, the tip of the flexible wiring member 4 was connected in a state where it was positioned approximately 50 μm away from the inner wall of the opening 12 formed in the second insulating layer 8. At this time, the tip of the flexible wiring member 4 was connected at an angle of approximately 2° with respect to the surface of the second electrode 10 of the printed wiring substrate 6.

[0072] By connecting with such a structure, it was possible to connect the flexible wiring member 4 and the printed wiring board 9 with a narrow electrode pitch of 150 μm.

[0073] (Electronic module manufacturing method) Next, a manufacturing method for the electronic module 100 according to the first embodiment will be described with reference to Figures 3A to 3C. Figures 3A to 3C are cross-sectional views showing the manufacturing method for the electronic module 100 according to the first embodiment. The electronic module 100 according to the second embodiment can be manufactured in almost the same manner. The manufacturing method for the electronic module 100 includes a connection method for connecting the flexible wiring member 4 and the printed wiring board 9.

[0074] 3A, in printed wiring board 9, solder-containing connecting material 11a is supplied onto second electrode 10 exposed in opening 12 formed in second insulating layer 8. It is desirable that the volume V of the solder-containing connecting material satisfy formula (1) as described in the first embodiment.

[0075] Next, as shown in FIG. 3B , the first electrode 5 of the flexible wiring member 4 and the second electrode 10 of the printed wiring board 9 are aligned to face each other, and the tip of the flexible wiring member 4 is disposed so as to fall into the opening 12 formed in the second insulating layer 8. At this time, it is desirable that the solder-containing connecting material 11a has adhesiveness such as solder paste so that the tip of the flexible wiring member 4 can be temporarily fixed to the printed wiring board 9. Alternatively, the tip of the flexible wiring member 4 may be fixed to the printed wiring board 9 using, for example, a heat-resistant tape such as polyimide tape or a heat-resistant adhesive. In this way, the first electrode 5 and the second electrode 10 are brought into contact with the solder-containing connecting material 11a.

[0076] Furthermore, as explained in the first embodiment, it is desirable that the tip of the flexible wiring member 4 be disposed at a certain distance from the inner wall of the opening 12 and spaced apart from the inner wall.

[0077] Next, the tip of the flexible wiring member 4 is inserted into the opening 12 formed in the second insulating layer 8, and the first electrode 5 and the second electrode 10 are heated while in contact with the solder-containing connecting material 11a. This melts the solder in the solder-containing connecting material 11a. After heating, the solder joint is cooled by natural cooling, cooling with a cooler, or the like. In this way, the first electrode 5 and the second electrode 10 are connected via the solder 11, as shown in FIG. 3C. This ensures that the first electrode 5 and the second electrode 10 are connected securely and prevents the solder 11 from protruding from between the first electrode 5 and the second electrode 10, which could cause a short circuit.

[0078] The means for melting the solder is not particularly limited and may be, for example, total heating such as reflow heating. Alternatively, for example, contact-type local heating such as with a soldering iron, spot reflow using hot air or a lamp, or non-contact local heating such as laser, induction heating, or dielectric heating may be used. By using non-contact local heating, even if electronic components with low heat resistance are mounted on one or both of the printed wiring board 9 and the flexible wiring member 4, the printed wiring board 9 and the flexible wiring member 4 can be connected without affecting the electronic components.

[0079] In the above, the case where the solder-containing connecting material 11a is supplied onto the second electrode 10 has been described, but instead of or in addition to this, the solder-containing connecting material 11a can also be supplied onto the first electrode 5. The manner in which the solder-containing connecting material 11a is supplied is also not particularly limited, and for example, the solder-containing connecting material 11a can be supplied in a paste form or in the form of a precoat.

[0080] Next, another method for manufacturing the electronic module 100 according to the first embodiment will be described with reference to Figures 4A to 4C. Figures 4A to 4C are cross-sectional views showing another method for manufacturing the electronic module 100 according to the first embodiment. The electronic module 100 according to the second embodiment can be manufactured in almost the same manner. The manufacturing method for the electronic module 100 includes a connection method for connecting the flexible wiring member 4 and the printed wiring board 9.

[0081] 4A, in printed wiring board 9, solder-containing connecting material 11a is supplied onto second electrode 10 exposed in opening 12 formed in second insulating layer 8. It is desirable that the volume V of the solder-containing connecting material satisfy formula (1) as described in the first embodiment.

[0082] 4B, the first electrode 5 of the flexible wiring member 4 and the second electrode 10 of the printed wiring board 9 are aligned to face each other, and the tip of the flexible wiring member 4 is positioned so as to fall into the opening 12 formed in the second insulating layer 8. In this way, the first electrode 5 and the second electrode 10 are brought into contact with the solder-containing connecting material 11a.

[0083] Furthermore, as explained in the first embodiment, it is desirable that the tip of the flexible wiring member 4 be disposed at a certain distance from the inner wall of the opening 12 and spaced apart from the inner wall.

[0084] Next, the tip of the flexible wiring member 4 is held down with tool T. Furthermore, while still being held down with tool T, the tip of the flexible wiring member 4 is lowered into an opening 12 formed in the solder resist, and the first electrode 5 and the second electrode 10 are heated while being in contact with the solder-containing connecting material 11a. This melts the solder in the solder-containing connecting material 11a. After heating, the solder joint is cooled by natural cooling, cooling with a cooler, or the like. In this way, the first electrode 5 and the second electrode 10 are connected via the solder 11, as shown in FIG. 5C . This ensures a reliable connection between the first electrode 5 and the second electrode 10 and prevents the solder 11 from protruding from between the first electrode 5 and the second electrode 10, thereby preventing a short circuit.

[0085] The tool T, which is a jig for pressing the tip of the flexible wiring member 4, is not particularly limited, and may be, for example, a heating tool such as a soldering iron. Furthermore, when the heating to melt the solder is performed by localized heating using hot air, the tool T may be the nozzle itself from which the hot air is blown. Furthermore, when localized heating is performed using light from a lamp, laser, or the like, a light guide plate that guides the light may be used as the tool T. By using such a tool T, the flexible wiring member 4 and the printed wiring board 9 can be connected while improving the locality of the localized heating. Similarly, when the heating to melt the solder is performed by dielectric heating, a dielectric material may be used as the tool T, and when the heating is performed by induction heating, a magnetic material may be used as the tool T to improve heating efficiency.

[0086] Furthermore, the tip of the tool T that presses the tip of the flexible wiring member 4 may have a slope such that the tip side of the flexible wiring member 4 is lower than the side opposite to the tip of the flexible wiring member 4. In other words, the tool T may have a slope that is inclined so that the distance between the tool T and the second electrode 10 becomes narrower toward the tip side of the flexible wiring member 4, causing the tip of the flexible wiring member 4 to fall into the opening 12.

[0087] By providing such a slope at the tip of the tool T, when the tip of the flexible wiring member 4 is pressed with the tool T, the first electrode 5 and the second electrode 10 can be connected in a state where they are in reliable contact with the solder-containing connecting material 11a at the tip side of the flexible wiring member 4. On the other hand, on the opposite side of the tip of the flexible wiring member 4, a space is secured between the first electrode 5 and the second electrode 10, and connection can be made in a state where the solder 11 does not protrude from between the first electrode 5 and the second electrode 10 and cause a short circuit.

[0088] In the above, the case where the solder-containing connecting material 11a is supplied onto the second electrode 10 has been described, but instead of or in addition to this, the solder-containing connecting material 11a can also be supplied onto the first electrode 5. The manner in which the solder-containing connecting material 11a is supplied is also not particularly limited, and for example, the solder-containing connecting material 11a can be supplied in a paste form or in the form of a precoat.

[0089] (electronic parts) [Third embodiment] An electronic component according to a third embodiment of the present invention will be described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing the electronic component according to this embodiment.

[0090] In this embodiment, an imaging unit will be described that uses, as electronic components, an electronic module 100 having a flexible wiring member 4 and a printed wiring board 9. The flexible wiring member 4, the printed wiring board 9, and the electronic module 100 having these are as described in the first and second embodiments.

[0091] 5, the imaging unit 19 according to this embodiment includes an imaging sensor module 14 and a flexible wiring member 4. The imaging sensor module 14 includes a printed wiring board 9, an imaging sensor element 15 as an imaging element, a frame 17, and a cover glass 16.

[0092] The flexible wiring member 4 has a flexible base material 1, a flexible wiring layer 2, and a coverlay 3. The coverlay 3 is not formed at the tip of the flexible wiring member 4, and the flexible wiring layer 2 is exposed. The exposed portion of the flexible wiring layer 2 forms a first electrode 5.

[0093] The printed wiring board 9 has a printed wiring base material 6, a wiring layer 7, and a second insulating layer 8. The wiring layer 7 is exposed in an opening 12 formed in the second insulating layer 8. The exposed portion of the wiring layer 7 forms a second electrode 10.

[0094] The flexible wiring member 4 is mounted on the surface of the printed wiring board 9 on which the second electrode 10 is exposed, with the surface on which the first electrode 5 is formed facing the printed wiring board 9. The first electrode 5 and the second electrode 10 are arranged opposite each other so that at least a portion of them overlap each other in a plan view perpendicular to the printed wiring board 9.

[0095] The tip of the flexible wiring member 4 is disposed so as to fall into an opening 12 formed in the second insulating layer 8. The first electrode 5 exposed at the tip and the second electrode 10 exposed in the opening 12 are connected via solder 11.

[0096] The tip of the flexible wiring member 4 connected to the printed wiring board 9 by the solder 11 is bent and dropped into the opening 12 formed in the second insulating layer 8 of the printed wiring board 9. On the other hand, the portion of the flexible wiring member 4 opposite to the tip runs up onto the solder resist of the printed wiring board 9.

[0097] In the image sensor module 14, an image sensor element 15 is mounted on the surface of the printed wiring board 9 opposite to the surface to which the flexible wiring member 4 is connected. A frame 17 is arranged around the periphery of the surface of the printed wiring board 9 on which the image sensor element 15 is mounted. A cover glass 16 is formed on the frame 17 so as to face the image sensor element 15 without making contact with it. The image sensor element 15 is disposed in a hollow space surrounded by the frame 17 and the cover glass 16. The image sensor element 15 is electrically connected to a wire pad 23 on the printed wiring board 9 through a metal wire 18.

[0098] In this embodiment, the case where frame portion 17 is provided is described, but the location where it is disposed is not limited to the periphery of printed wiring board 9. Furthermore, image sensor element 15 may be disposed, for example, inside a hollow printed wiring board with a countersunk portion, such as a cavity board.

[0099] According to this embodiment, flexible wiring member 4 and printed wiring board 9 can be connected in a smaller area than when a connector is used, and therefore imaging sensor module 14 can be made smaller.

[0100] The imaging unit 19 including the imaging sensor module 14 can be used as an imaging device such as a digital still camera or a digital video camera as an electronic device. That is, the imaging device as an electronic device can be configured to have a housing and the imaging unit 19 including the imaging sensor module 14 housed in the housing.

[0101] (imaging unit) [Fourth embodiment] An imaging unit according to a fourth embodiment of the present invention will be described with reference to FIGS. Fig. 6A is a top view showing an imaging unit 400 according to this embodiment, Fig. 6B is a cross-sectional view taken along line AA' in Fig. 6A, and Fig. 6C is a cross-sectional view taken along line BB' in Fig. 6A.

[0102] The imaging unit 400 is made up of an imaging sensor module 14, an image stabilization unit 410, and a flexible wiring member 4. As in the third embodiment, the imaging sensor module 14 has an imaging sensor element 15 mounted on a printed wiring board 9, and is made up of a frame 17 and a cover glass 16. As in the third embodiment, the imaging sensor element 15 is electrically connected to wire pads 23 on the printed wiring board 9 via metal wires 18.

[0103] As in the third embodiment, the printed wiring board 9 and the flexible wiring member 4 are connected with solder 11 to form the electronic module 100. Furthermore, in this embodiment, the connection between the flexible wiring member 4 and the printed wiring board 9 is reinforced with resin 21 as described below. Furthermore, by providing resin 21, a structure is achieved in which peeling between the printed wiring board 9 and the flexible wiring member 4 is unlikely to occur.

[0104] 7A, 7B and 7C show the structure of the connection portion between the flexible wiring member 4 and the printed wiring board 9 in the cross-sectional views taken along the lines AA', BB' and CC' in FIG. 6A, respectively.

[0105] The flexible wiring member 4 is composed of a flexible substrate 1 having flexibility, a flexible wiring layer 2, and a coverlay 3. The coverlay 3 is not formed at the tip of the flexible wiring member 4, and the flexible wiring layer 2 is exposed. The exposed portion of the flexible wiring layer 2 forms a first electrode 5.

[0106] The printed wiring board 9 is composed of a printed wiring substrate 6, a wiring layer 7, and a second insulating layer 8. An opening 12 is formed in the second insulating layer 8. The wiring layer 7 exposed in the opening 12 forms a second electrode 10.

[0107] As shown in Fig. 7A, the first electrode 5 and the second electrode 10 are connected by solder 11. The tip of the flexible wiring member 4 is arranged so as to bend obliquely and drop into an opening 12 formed in the second insulating layer 8. The second electrode 10 of the printed wiring board 9 is connected to a wire pad 23 by a via 13. The printed wiring board 9 has a base material of glass epoxy material, and the wiring layer 7 is made of metal.

[0108] As shown in Figure 7B, the connection portion between the flexible wiring member 4 and the printed wiring board 9 is reinforced with resin 21 so as to cover the coverlay 3 at both ends in the pitch direction of the wiring, i.e., the pitch direction of the first electrode 5 and the second electrode 10.

[0109] As shown in FIG. 7C, at both ends reinforced with resin 21, resin 21 and solder 11 are formed to be separated from each other with space 20 interposed therebetween.

[0110] In this way, the tip end of the flexible wiring member 4 is provided with the resin 21 that covers the widthwise end of the tip end. Between the flexible substrate 1 and the printed wiring board 9, the resin 21 and the solder 11 are arranged at a distance from each other.

[0111] Due to the presence of the space 20 between the resin 21 and the solder 11, when a tensile force is generated in the flexible wiring member 4, the force acting on the solder 11 is reduced compared to when there is no space 20 between the resin 21 and the solder 11, because the flexible substrate 1 is flexible. This improves connection reliability.

[0112] On the other hand, if the resin 21 and the solder 11 are in contact with each other and there is no space between them, the force pulling the flexible wiring member 4 is directly applied to the solder 11. For this reason, it is preferable that the resin 21 is made of a material having a lower Young's modulus than the solder 11.

[0113] 8A, 8B, and 8C show other structures of the connection portion between flexible wiring member 4 and printed wiring board 9 in the cross-sectional views along lines AA', BB', and CC' in FIG.

[0114] The intermediate member 22 is made of a material having a smaller Young's modulus than the resin 21 and the solder 11. For example, the intermediate member 22 may be an elastic body having a low Young's modulus, such as a resin, or a flux contained in a solder paste used to connect the solder 11.

[0115] In this way, the electronic module 100 may include an intermediate member 22 having a Young's modulus smaller than that of the resin 21 and the solder 11. In this case, between the flexible substrate 1 and the printed wiring board 9, the resin 21 and the intermediate member 22 are in contact with each other, and the intermediate member 22 and the solder 11 are in contact with each other.

[0116] By providing the intermediate member 22, the force acting on the solder 11 when a tensile force is generated in the flexible wiring member 4 is reduced, and is reduced compared to when the resin 21 and the solder 11 are in contact with each other, thereby improving the connection reliability.

[0117] Resin 21 is not particularly limited, but may be, for example, an epoxy resin. However, because resin 21 is provided after solder 11 is connected, there is a risk that the flux will re-melt when heat is applied to harden resin 21. If the flux re-melts, it will also adhere to flexible wiring member 4 and printed wiring board 9 on the resin 21 side, hindering adhesion between resin 21 and flexible wiring member 4 or printed wiring board 9. For this reason, resin 21 is preferably a resin that can be hardened at room temperature or an ultraviolet-curable resin.

[0118] (electronic equipment) [Fifth embodiment] An electronic device according to a fifth embodiment of the present invention will be described with reference to Fig. 9. Fig. 9 is an explanatory diagram showing a schematic configuration of an imaging device as an example of the electronic device according to this embodiment.

[0119] Digital camera (camera) 2, which serves as an imaging device and is an example of an electronic device, is, for example, a digital single-lens reflex camera, and includes a camera body 200 and an interchangeable lens (lens barrel) 300 that is detachable from the camera body 200. In Fig. 9, the interchangeable lens 300 is attached to the camera body 200. Below, a case where the imaging device is configured with the interchangeable lens 300 attached to the camera body 200 will be described.

[0120] Camera body 200 includes housing 201, and, arranged inside housing 201, mirror 222, shutter 223, imaging unit 400 which is an electronic module, and image processing circuit 224. Camera body 200 also includes liquid crystal display 225 which is fixed to housing 201 so as to be exposed to the outside. Imaging unit 400 includes image stabilization unit 410, imaging sensor module 14 which includes printed wiring board 9, and electronic module 226.

[0121] The interchangeable lens 300 has a housing 301, which is an interchangeable lens housing, and an imaging optical system 311 that is arranged inside the housing 301 and forms an optical image on the imaging sensor module 14 when the housing 301 (interchangeable lens 300) is attached to the housing 201. The imaging optical system 311 is configured to have a plurality of lenses.

[0122] The housing 301 has a lens-side mount 301a with an opening formed therein, and the housing 201 has a camera-side mount 201a with an opening formed therein. The interchangeable lens 300 (housing 301) is attached to the camera body 200 (housing 201) by fitting the lens-side mount 301a and the camera-side mount 201a together. The direction of the arrow X in FIG. 9 is the optical axis direction of the imaging optical system 311.

[0123] Light traveling in the direction of arrow X by imaging optical system 311 is guided into housing 201 through an opening in lens-side mount 301a in housing 301 and an opening in camera-side mount 201a in housing 201. Inside housing 201, along the direction of arrow X, a mirror 222, a shutter 223, etc. are provided in front of imaging unit 400 in the direction of arrow X.

[0124] The image sensor module 14 housed in the housing 201 has an image sensor element 15 mounted on a printed wiring board 9, and is composed of a frame 17 and a cover glass 16. A flexible wiring member 4 is connected to the printed wiring board 9. The image sensor element 15 is a solid-state image sensor such as a CMOS image sensor or a CCD image sensor that photoelectrically converts a formed optical image.

[0125] In addition, a cover glass 16 is formed on the frame portion 17 so as to face the image sensor element 15 without contacting the image sensor element 15. The image sensor element 15 is disposed in a hollow portion surrounded by the frame portion 17 and the cover glass 16.

[0126] The image sensor element 15 is electrically connected to the printed wiring board 9 via a metal wire 18 at a wire pad 23 .

[0127] (display device) [Sixth embodiment] An electronic device according to a sixth embodiment of the present invention will be described with reference to Figures 10A and 10B. Figures 10A and 10B are explanatory diagrams showing a schematic configuration of a display device as an example of the electronic device according to this embodiment.

[0128] A display device 700, which is an example of an electronic device, is, for example, a display and can be used as a monitor portion of an imaging device. As shown in FIG. 10A , a silicon substrate 9F, which is a wiring substrate, is provided with a light-emitting element 39, a second insulating layer 8F, a color filter 37, a resin 36, and a cover glass 33, which are stacked in this order on the silicon substrate 9F. A package 32 forms the outer periphery of the display device and surrounds the light-emitting element 39, the second insulating layer 8F, the color filter 37, the resin 36, and the cover glass 33. A dustproof glass 31 is provided on the package 32 via an adhesive (not shown).

[0129] The light-emitting element 39 is an organic light-emitting element and has a pair of electrodes, an anode and a cathode, and an organic compound layer disposed between the electrodes. The organic compound layer is a laminate consisting of one layer or multiple layers including at least a light-emitting layer. When the organic compound layer is a laminate consisting of multiple layers, the organic compound layer may have the following layers in addition to the light-emitting layer. That is, the organic compound layer may have, for example, any of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer (hole blocking layer, hole / exciton blocking layer), an electron transport layer, and an electron injection layer.

[0130] The second insulating layer 8F is a protective layer for suppressing deterioration of the light emitting element 39 over time, and is made of a highly insulating metal nitride or metal oxide such as SiN or Al2O3.

[0131] The color filter 37 may be, for example, a filter that transmits three colors: red, green, and blue.

[0132] The resin 36 is used for sealing purposes, and is provided so as to fill spaces between the cover glass 33, the color filter 37, the sealant 34, and the second insulating layer 8F.

[0133] FIG. 10B is an enlarged view of the area enclosed by the dashed line in FIG. 10A. The flexible wiring member 4 is composed of a flexible substrate 1 having flexibility, a flexible wiring layer 2, and a coverlay 3. The coverlay 3 is not formed at the tip of the flexible wiring member 4, and the flexible wiring layer 2 is exposed. The exposed portion of the flexible wiring layer 2 forms a first electrode 5.

[0134] A second insulating layer 8F is provided on a silicon substrate 9F, and an opening 12 is formed in the second insulating layer 8F. A second electrode 10F, which is a Cu pad, is formed in the opening 12. As shown in FIG. 10B, the first electrode 5 and the second electrode 10F are connected by an anisotropic conductive film (ACF) 11F, which is a conductive connecting member. The tip of the flexible wiring member 4 is arranged so as to bend obliquely and drop into the opening 12 formed in the second insulating layer 8F. By adopting such a shape for the flexible wiring member 4, the connection area between the flexible wiring member 4 and the silicon substrate 9F can be reduced, as in the first to fifth embodiments.

[0135] 10B, at the connection portion between the flexible wiring member 4 and the anisotropic conductive film (ACF) 11F, a reinforcing resin 21F is provided on the flexible substrate 1. By providing the resin 21F, when a tensile force is generated in the flexible wiring member 4, the force acting on the anisotropic conductive film 11F, which is the conductive connecting member, is reduced, thereby improving connection reliability.

[0136] [Modified embodiment] The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, in the third embodiment, the image sensor module 14 has been described as an example of a device having a printed wiring board 9, but the present invention is not limited to this. Any type of device may be used, and in addition to the image sensor module 14, various devices having printed wiring boards 9, such as printed wiring boards 9 equipped with LSIs, can be connected.

[0137] Furthermore, the electronic module according to the above embodiment can be housed in a housing to configure various electronic devices in addition to the imaging device. [Explanation of symbols]

[0138] 1. Flexible substrate 2. Flexible wiring layer 3. Coverlay 4. Flexible wiring material 5...1st electrode 6. Printed wiring substrate 7...Wiring layer 8, 8F... Second insulating layer 9. Printed wiring board 9F: Silicon substrate 10, 10F...2nd electrode 11. Solder 11a Solder-containing interconnect material 11F: Anisotropic conductive film 12 Opening 13. Via 14. Imaging sensor module 15. Image sensor element 16···Cover glass 17. Frame 18. Metal wire 19. Imaging unit 21, 21F...resin 22 Intermediate member 23 Wire pad 31. Dustproof glass 32. Packaging section 33···Cover glass 34. Sealing material 37. Color filter 39. Light-emitting element 100, 226... Electronic module 200···Camera body 201···Case 201a···Camera side mount 222···Mirror 223...Shutter 224...Image processing circuit 225···LCD display 300···Interchangeable Lens 301···Housing 301a···Lens side mount 311 Imaging optical system 400 Imaging unit 410···Correction unit 600···Digital camera 700...Display device

Claims

[Claim 1] A wiring board; an electronic component mounted on the wiring board; A flexible wiring member; A conductive connection member; a circuit connected to the flexible wiring member and transmitting data to and from the electronic component via the flexible wiring member, The flexible wiring member is a first substrate that is an insulating and flexible substrate; a first wiring layer formed on the first substrate; a first insulating layer formed on the first base material so that a portion of the first wiring layer is disposed between the first insulating layer and the first base material; The wiring board is A second substrate; a second wiring layer formed on the second base material; a second insulating layer formed on the second base material so that a portion of the second wiring layer is disposed between the second insulating layer and the second base material; the flexible wiring member has a plurality of first electrodes formed by the first wiring layer, the wiring board has a plurality of second electrodes formed by the second wiring layer, and the plurality of first electrodes and the plurality of second electrodes are connected to each other via the conductive connecting member between the first base material and the second base material; the first base material has a first portion, a second portion, a third portion, and a fourth portion, the second portion being farther from a tip of the flexible wiring member than the first portion, the third portion being farther from the tip of the flexible wiring member than the second portion, the fourth portion being farther from the tip of the flexible wiring member than the third portion, and the tip being disposed on the wiring board in a direction perpendicular to the wiring board; the conductive connection member is disposed between the second substrate and both the first portion and the second portion in the perpendicular direction; a distance from the plurality of second electrodes to the first substrate in the perpendicular direction is smaller between the first portion and the plurality of second electrodes than between the second portion and the plurality of second electrodes; the first insulating layer and the second insulating layer are disposed between the second substrate and both the third portion and the fourth portion in the perpendicular direction; An electronic device in which the distance from the second insulating layer to the first insulating layer in the vertical direction is smaller between the third portion and the second insulating layer than between the fourth portion and the second insulating layer.

Images