Apparatus for manufacturing enameled copper wire and method for manufacturing enameled copper wire

Abstract

To provide an apparatus for manufacturing an enameled copper wire and a method for manufacturing an enameled copper wire that can reduce generation of an appearance defect.SOLUTION: An apparatus for manufacturing an enameled copper wire includes a first paint application section, a first die, a second paint application section, a second die, and a baking section, wherein the first paint application section applies a first paint to a surface of a conductor traveling along a travel path, the conductor to which the first paint has been applied by the first paint application section passes through the first die, the second paint application section applies a second paint to a surface of the conductor that has passed through the first die and in which the first paint remains in an uncured state, the conductor to which the second paint has been applied by the second paint application section passes through the second die, and the baking section performs baking on the conductor that has passed through the second die.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus for manufacturing an enameled copper wire and a method for manufacturing an enameled copper wire. [Background technology]

[0002] An enameled copper wire comprises a conductor and an enamel coating. The conductor is mainly made of copper. The enamel coating covers the surface of the conductor. Patent Document 1 describes a method for manufacturing an enameled copper wire. In this method, an enamel paint is applied to the surface of the conductor to form a coating. The enamel coating is then formed by baking. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-3913 Summary of the Invention [Problem to be solved by the invention]

[0004] When applying enamel paint to the surface of a conductor, a coating die is used. Foreign matter can get stuck in the coating die. In this case, the foreign matter stuck in the coating die can cause an abnormal appearance of the enameled copper wire.

[0005] The reasons for the appearance defects are as follows: If a foreign object is lodged inside the coating die, the center of the conductor will be misaligned with the center of the hole in the coating die. In this case, the distance between the inner surface of the coating die and the surface of the conductor (hereinafter referred to as the coating gap) will be uneven. As a result, the thickness of the coating film will also be uneven. In areas with thick coating, the solvent in the enamel paint will have difficulty evaporating, causing foaming and resulting in appearance defects.

[0006] In one aspect of the present disclosure, it is preferable to provide an apparatus for manufacturing an enameled copper wire and a method for manufacturing an enameled copper wire that can suppress the occurrence of appearance defects. [Means for solving the problem]

[0007] One aspect of the present disclosure is an apparatus for manufacturing enameled copper wire, comprising: a first paint application unit configured to apply a first paint to the surface of a conductor traveling along a traveling path; a first die through which the conductor, to which the first paint has been applied by the first paint application unit, passes; a second paint application unit configured to apply a second paint to the surface of the conductor that has passed through the first die and on which the first paint is in an uncured state; a second die through which the conductor, to which the second paint has been applied by the second paint application unit, passes; and a baking unit configured to bake the conductor that has passed through the second die.

[0008] An enameled copper wire manufacturing apparatus according to one aspect of the present disclosure can suppress the occurrence of appearance defects in the manufactured enameled copper wire.

[0009] Another aspect of the present disclosure is a method for manufacturing an enameled copper wire, which includes applying a first paint to the surface of a conductor traveling along a traveling path, passing the conductor with the first paint applied thereto through a first die, applying a second paint to the surface of the conductor after it has passed through the first die and the first paint is still in an uncured state, passing the conductor with the second paint applied thereto through a second die, and baking the conductor after it has passed through the second die.

[0010] A method for producing an enameled copper wire according to another aspect of the present disclosure can suppress the occurrence of appearance defects in the produced enameled copper wire. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is an explanatory diagram showing the configuration of a manufacturing device for a rectangular enameled copper wire. [Figure 2] FIG. 2 is a cross-sectional view showing the cross-sectional shape of a rectangular copper wire. [Figure 3] FIG. 2 is a cross-sectional view showing the cross-sectional shape of a drawn rectangular copper wire. [Figure 4] FIG. 2 is a plan view showing the configuration of a paint applicator and a baking oven. [Figure 5] FIG. 2 is an explanatory diagram showing a drawn flat copper wire material running through a first pass P1. [Figure 6] 1 is an explanatory diagram showing a drawn flat copper wire material traveling on the j-th pass Pj, where j is an arbitrary natural number between 2 and N. [Figure 7] FIG. 2 is a perspective view illustrating the configuration of a first die that can be separated. [Figure 8] FIG. 2 is a front view showing the configuration of a first die that can be separated. [Figure 9] 9 is a cross-sectional view showing a cross section IX-IX in FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0012] Exemplary embodiments of the present disclosure will be described with reference to the drawings. First Embodiment 1.Outline of manufacturing method for rectangular enamelled copper wire An outline of a method for manufacturing a rectangular enameled copper wire will be explained with reference to Figs. 1 to 3. The rectangular enameled copper wire corresponds to an enameled copper wire. The method for manufacturing a rectangular enameled copper wire uses a manufacturing apparatus 1 for rectangular enameled copper wire shown in Fig. 1. The manufacturing apparatus 1 includes a dance ring or bobbin 3, a round wire drawing machine 5, a rectangular rolling mill 7, an annealing furnace 9, a rectangular wire drawing machine 11, an annealing furnace 13, a paint applicator 15, a baking furnace 17, and a winder 19. The baking furnace 17 corresponds to the baking section.

[0013] A linear conductor 23 is wound around the dance ring or bobbin 3. The conductor 23 is drawn out from the dance ring or bobbin 3, travels along a travel path that passes through the round wire drawing machine 5, the flat rolling mill 7, the annealing furnace 9, the flat wire drawing machine 11, the annealing furnace 13, the paint applicator 15, and the baking furnace 17 in this order, and is wound onto the winder 19. However, the processed conductor 23, which is a flat copper drawn wire material 23B described below, passes through the section including the paint applicator 15 and the baking furnace 17 multiple times.

[0014] The conductor 23 is made of copper or a copper alloy. The cross-sectional shape of the conductor 23 is circular until it is subjected to flat-rolling, which will be described later. The cross-section of the conductor 23 is a cross section perpendicular to the longitudinal direction of the conductor 23.

[0015] The round wire drawing machine 5 draws the conductor 23, which has a circular cross-sectional shape. The flat rolling machine 7 performs flat rolling on the traveling conductor 23. The conductor 23 that has undergone flat rolling is called a flat copper wire 23A. As shown in FIG. 2, the cross-sectional shape of the flat copper wire 23A is a shape consisting of two parallel sides 24A, 24B and two arc-shaped end faces 26A, 26B. In the cross-section, the sides 24A, 24B are straight. In the cross-section, the length of the sides 24A, 24B is greater than the length of the end faces 26A, 26B. The annealing furnace 9 anneals the flat copper wire 23A.

[0016] The flat wire drawing machine 11 performs flat wire drawing on the running flat copper wire 23A. Flat wire drawing is a process of continuously cold drawing the flat copper wire 23A using a flat wire drawing die. The conductor 23 that has undergone flat wire drawing is referred to as a flat copper wire material 23B.

[0017] The cross-sectional shape of the drawn rectangular copper wire material 23B is a rounded rectangle, as shown in Fig. 3. The long sides of the rounded rectangle are sides 24A and 24B. The short sides 22A and 22B of the rounded rectangle are sides that originate from end faces 26A and 26B of the rectangular copper wire 23A.

[0018] The annealing furnace 13 anneals the drawn rectangular copper wire material 23B. The paint applicator 15 applies enamel paint to the surface of the drawn rectangular copper wire material 23B traveling along the travel path, thereby forming a coating of enamel paint of a predetermined thickness on the surface of the drawn rectangular copper wire material 23B.

[0019] In the baking furnace 17, a coating of enamel paint of a predetermined thickness is applied to the drawn rectangular copper wire material 23B traveling along the traveling path by applying heat to bake the wire material. As shown in FIG. 1, the application of enamel paint by the paint applicator 15 and the formation of the coating by the baking furnace 17 are repeated. As a result, a rectangular enameled copper wire 25 having a predetermined coating thickness is produced. The rectangular enameled copper wire 25 is wound on the winder 19. As shown in FIG. 1, the direction in which the conductor 23 travels in the paint applicator 15 and the baking furnace 17 is referred to as the traveling direction TR. The opposite direction to the traveling direction TR is referred to as the upstream direction US.

[0020] The coating is formed, for example, by the following method: An enamel coating is applied to the surface of the drawn rectangular copper wire 23B. The enamel coating is, for example, a coating containing a resin and a solvent. Next, the solvent in the enamel coating applied to the surface of the drawn rectangular copper wire 23B is evaporated, and the resin in the enamel coating is hardened. After the solvent has evaporated and the resin has hardened, the rectangular enameled copper wire 25 is formed.

[0021] 2. Configuration of the paint applicator 15 and the baking oven 17 (2-1) Overall configuration of the paint applicator 15 and the baking oven 17 The overall configuration of the paint applicator 15 and the baking furnace 17 will be described with reference to Figures 1 and 4. After the flat copper drawn wire material 23B first passes through the paint applicator 15 and the baking furnace 17, its running direction is changed by rollers 31, 33, 35, and 37, it returns to a position in the upstream direction US of the paint applicator 15, and again passes through the paint applicator 15 and the baking furnace 17. By repeating this operation, the flat copper drawn wire material 23B passes through the paint applicator 15 and the baking furnace 17 N times, where N is a natural number greater than or equal to 2.

[0022] The travel path of the flat copper wire material 23B when it passes through the paint applicator 15 and the baking furnace 17 for the ith time is designated as the ith pass Pi. i is a natural number between 1 and N. For example, the travel paths of the flat copper wire material 23B when it passes through the paint applicator 15 and the baking furnace 17 for the first, second, and third times are the first pass P1, the second pass P2, and the third pass P3, respectively. As shown in FIG. 4, the jth pass Pj is shifted horizontally in a certain direction compared to the (j-1)th pass P(j-1). j is an arbitrary natural number between 2 and N.

[0023] (2-2) Configuration of the first path P1 The drawn rectangular copper wire material 23B traveling on the first pass P1 is shown in Figure 5. The paint applicator 15 includes a first paint applicator 41 and a first die 43 corresponding to the drawn rectangular copper wire material 23B traveling on the first pass P1.

[0024] The first paint application unit 41 applies a first paint 45 to the surface of the flat copper wire 23B traveling on the first path P1. The first paint 45 is an enamel paint. The first paint application unit 41 includes a first paint tank 47, a first paint 45, and a roll coater 49. The first paint tank 47 contains the first paint 45. The roll coater 49 is in contact with both the first paint 45 contained in the first paint tank 47 and the surface of the flat copper wire 23B. As the roll coater 49 rotates, the first paint 45 is applied to the surface of the flat copper wire 23B.

[0025] The first die 43 is a cylindrical member. The first die 43 has a hole 43A through which the flat copper wire material 23B passes. The axial direction of the hole 43A is parallel to the longitudinal direction of the flat copper wire material 23B. The hole 43A becomes larger as it progresses in the upstream direction US, at least on the upstream direction US side. The hole 43A has a constant shape and size on the traveling direction TR side. In the part where the shape and size of the hole 43A are constant, the shape of the hole 43A is similar to the cross-sectional shape of the flat copper wire material 23B and is slightly larger than the flat copper wire material 23B.

[0026] The first die 43 is located further in the traveling direction TR than the first paint application section 41. The flat copper drawn wire material 23B, to which the first paint 45 has been applied by the first paint application section 41, passes through the first die 43. When passing through the first die 43, the portion of the first paint 45 adhering to the surface of the flat copper drawn wire material 23B that is located on the outer periphery of the hole 43A is removed. Therefore, the thickness of the coating film of the first paint 45 adhering to the surface of the flat copper drawn wire material 23B that has passed through the first die 43 remains constant. The first paint 45 removed from the flat copper drawn wire material 23B by the first die 43 returns to the first paint tank 47.

[0027] The paint applicator 15 includes a second paint applicator 51 and a second die 53 corresponding to the drawn flat copper wire material 23B traveling on the first path P1. The second paint applicator 51 and the second die 53 are located further in the traveling direction TR than the first die 43.

[0028] The second paint application unit 51 applies a second paint 55 to the surface of the drawn rectangular copper wire material 23B traveling on the first path P1. When the second paint application unit 51 applies the second paint 55, the first paint 45 applied by the first paint application unit 41 is in an uncured state. The second paint application unit 51 includes a second paint tank 57, a second paint 55, and a roll coater 59. The second paint tank 57 contains the second paint 55. The second paint tank 57 is separated from the first paint tank 47. Therefore, the first paint 45 is less likely to be mixed into the second paint tank 57.

[0029] The roll coater 59 is in contact with both the second paint 55 contained in the second paint tank 57 and the surface of the drawn rectangular copper wire 23B. As the roll coater 59 rotates, the second paint 55 is applied to the surface of the drawn rectangular copper wire 23B. The second paint 55 has the same composition as the first paint 45. The drawn rectangular copper wire 23B does not come into contact with rollers, pulleys, etc. between passing through the first die 43 and reaching the second paint application section 51. The drawn rectangular copper wire 23B between the first die 43 and the second die 53 is linear. This allows the thickness of the coating of the first paint 45 to be maintained more uniformly.

[0030] The second die 53 is a cylindrical member. The second die 53 has a hole 53A through which the flat copper wire material 23B passes. The axial direction of the hole 53A is parallel to the longitudinal direction of the flat copper wire material 23B. The hole 53A becomes larger as it progresses in the upstream direction US, at least on the upstream direction US side. The hole 53A has a constant shape and size on the traveling direction TR side. In the part where the shape and size of the hole 53A are constant, the shape of the hole 53A is similar to the cross-sectional shape of the flat copper wire material 23B and is slightly larger than the flat copper wire material 23B.

[0031] The second die 53 is located further in the traveling direction TR than the second paint application section 51. The drawn rectangular copper wire 23B, to which the second paint 55 has been applied by the second paint application section 51, passes through the second die 53. When passing through the second die 53, the portion of the second paint 55 adhering to the surface of the drawn rectangular copper wire 23B that is located on the outer periphery of the hole 53A is removed. Therefore, the thickness of the coating film of the second paint 55 adhering to the surface of the drawn rectangular copper wire 23B that has passed through the second die 53 remains constant. The second paint 55 removed from the drawn rectangular copper wire 23B by the second die 53 is returned to the second paint tank 57.

[0032] The drawn copper wire material 23B that has passed through the second die 33 proceeds to the baking furnace 17. The baking furnace 17 bakes the drawn copper wire material 23B. At this time, the second paint 55 hardens. The paint gap at the first die 43 is referred to as the first paint gap. The paint gap at the second die 53 is referred to as the second paint gap. For example, the first paint gap is smaller than the second paint gap.

[0033] The first die 43 has, for example, the configuration shown in Figures 7 to 9. The first die 43 can be separated into a first part 61 and a second part 62 at a separation surface 63. The separation surface 63 is a surface that passes through the hole 43A and follows the axial direction 44 of the hole 43A. As the separable first die 43, for example, the one described in JP 2013-161675 A can be used.

[0034] (2-3) Configuration of the jth pass Pj The drawn rectangular copper wire material 23B traveling on the j-th pass Pj is shown in Figure 6, where j is any natural number between 2 and N. For example, the paint applicator 15 does not include the first paint applicator 41 and the first die 43 for the drawn rectangular copper wire material 23B traveling on the j-th pass Pj.

[0035] The paint applicator 15 includes a second paint applicator 51 and a second die 53 corresponding to the drawn rectangular copper wire material 23B traveling on the jth pass Pj. The second paint applicator 51 and the second die 53 have the same configuration and function as those corresponding to the drawn rectangular copper wire material 23B traveling on the first pass P1. For example, the second paint applicator 51 corresponding to the first pass P1 to the second paint applicator 51 corresponding to the Nth pass PN share a single second paint tank 57.

[0036] 3. Effects of the manufacturing device 1 and the manufacturing method (1A) If foreign matter 71 is attached to the surface of the drawn rectangular copper wire material 23B, the foreign matter 71 is captured by the first die 43 as shown in Fig. 5. This prevents the foreign matter 71 from clogging the second die 53. As a result, the appearance of the rectangular enameled copper wire 25 can be prevented from being deteriorated.

[0037] Note that foreign matter 71 captured by the first die 43 may cause the thickness of the coating of the first paint 45 to be uneven on the drawn rectangular copper wire material 23B that has passed through the first die 43. However, even in this case, the second paint application unit 51 applies the second paint 55 while the first paint 45 is still uncured, so the thickness of the coating becomes uniform. As a result, the occurrence of appearance abnormalities in the rectangular enameled copper wire 25 can be suppressed.

[0038] (1B) For example, the first coating gap is smaller than the second coating gap. In this case, the first die 43 can capture the foreign matter 71 more reliably. (1C) For example, the first die 43 can be divided into a first part 61 and a second part 62. In this case, the first die 43 can be divided, and the foreign matter 71 trapped inside can be easily removed.

[0039] (1D) Of the travel path of the drawn rectangular copper wire material 23B, the section in which it passes through the second paint application section 51, the second die 53, and the baking furnace 17 once each is defined as section A. The first pass P1 is composed of a section in which it passes through the first paint application section 41 and the first die 43 once each, and section A. The second pass P2 to the Nth pass PN are each composed only of section A. Therefore, after passing through the first paint application section 41 and the first die 43, the drawn rectangular copper wire material 23B passes through section A N times.

[0040] This reduces the number of times that the drawn rectangular copper wire 23B passes through the first paint application section 41 and the first die 43, thereby simplifying the configuration of the manufacturing device 1 and shortening the time required to carry out the manufacturing method.

[0041] (1E) For example, the first paint tank 47 containing the first paint 45 and the second paint tank 57 containing the second paint 55 are separated. In this case, it is possible to prevent the first paint 45 containing the foreign matter 71 from being mixed into the second paint tank 57.

[0042] <Other embodiments> Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and can be implemented in various modified forms.

[0043] (1) In the first embodiment, the manufacturing apparatus 1 includes one first paint application section 41 and one first die 43. The manufacturing apparatus 1 may include multiple units each consisting of one first paint application section 41 and one first die 43. The multiple units are arranged along the travel path of the drawn rectangular copper wire material 23B. For example, if the manufacturing apparatus 1 includes three units, the drawn rectangular copper wire material 23B passes through the first paint application section 41, the first die 43, the first paint application section 41, the first die 43, the first paint application section 41, the first die 43, the first paint application section 41, and the first die 43 in this order. In this case, the first die 43 is more effective in capturing foreign matter 71.

[0044] (2) The paint applicator 15 may also be provided with a first paint applicator 41 and a first die 43 for the drawn flat copper wire material 23B traveling on the j-th pass Pj, where j is any natural number between 2 and N. (3) The first paint gap and the second paint gap may be the same, or the first paint gap may be larger than the second paint gap.

[0045] (4) The first die 43 may be an indivisible, one-piece die. (5) The manufacturing apparatus 1 may manufacture an enameled copper wire other than a rectangular enameled copper wire, for example, a round enameled copper wire.

[0046] (6) The function of one component in each of the above embodiments may be shared among multiple components, or the functions of multiple components may be performed by one component. Also, part of the configuration of each of the above embodiments may be omitted. Furthermore, at least part of the configuration of each of the above embodiments may be added to or substituted for the configuration of another of the above embodiments.

[0047] (7) In addition to the enameled copper wire manufacturing apparatus described above, the present disclosure can also be realized in various forms, such as a system including the manufacturing apparatus as a component, a foreign matter removal method, and a foreign matter removal apparatus.

[0048] [Technical idea disclosed in this specification] [Item 1] a first paint application unit configured to apply a first paint to a surface of the conductor traveling along the traveling path; a first die through which the conductor coated with the first paint by the first paint coating unit passes; a second coating material applying unit configured to apply a second coating material to the surface of the conductor that has passed through the first die and on which the first coating material is still uncured; a second die through which the conductor coated with the second paint by the second paint application unit passes; a printing unit configured to print the conductor that has passed through the second die; An apparatus for manufacturing enameled copper wire comprising: [Item 2] The enameled copper wire manufacturing apparatus according to item 1, a gap between the inner surface of the first die and the conductor is smaller than a gap between the inner surface of the second die and the conductor; Enamelled copper wire manufacturing equipment. [Item 3] Item 1 or 2: The apparatus for producing an enameled copper wire, A plurality of units each consisting of the first paint application unit and the first die are arranged along the travel path. Enamelled copper wire manufacturing equipment. [Item 4] An apparatus for producing an enameled copper wire according to any one of items 1 to 3, The first die is configured to pass through a hole through which the conductor passes and be divisible at a dividing surface along the axial direction of the hole. Enamelled copper wire manufacturing equipment. [Item 5] An apparatus for producing an enameled copper wire according to any one of items 1 to 4, The conductor is configured to pass through a section including the second paint application section, the second die, and the baking section a plurality of times after passing through the first paint application section and the first die. Enamelled copper wire manufacturing equipment. [Item 6] An apparatus for producing an enameled copper wire according to any one of items 1 to 5, a first paint tank containing the first paint and a second paint tank containing the second paint are separated from each other; Enamelled copper wire manufacturing equipment. [Item 7] A first paint is applied to a surface of the conductor running along the running path; passing the conductor coated with the first coating material through a first die; A second coating material is applied to the surface of the conductor that has passed through the first die and has the first coating material still uncured; Passing the conductor coated with the second coating material through a second die; The conductor that has passed through the second die is baked. Manufacturing method of enamelled copper wire. [Explanation of symbols]

[0049] 1... manufacturing equipment, 3... dance ring or bobbin, 5... round wire drawing machine, 7... flat wire rolling machine, 9... annealing furnace, 11... flat wire drawing machine, 13... annealing furnace, 15... paint application machine, 17... baking furnace, 19... winding machine, 22A, 22B... short side, 23... conductor, 23A... flat copper wire, 23B... flat copper wire drawing material, 24A, 24B... side, 25... flat enameled copper wire, 26A, 26B... end face, 31 , 33, 35, 37...roller, 41...first coating material application section, 43...first die, 43A...hole, 45...first coating material, 47...first coating material tank, 49...roll coater, 51...second coating material application section, 53...second die, 53A...hole, 55...second coating material, 57...second coating material tank, 59...roll coater, 61...first section, 62...second section, 63...partition surface, 71...foreign matter

Claims

1. a first paint application unit configured to apply a first paint to a surface of the conductor traveling along the traveling path; a first die through which the conductor coated with the first paint by the first paint coating unit passes; a second coating material applying unit configured to apply a second coating material to the surface of the conductor that has passed through the first die and on which the first coating material is still uncured; a second die through which the conductor coated with the second paint by the second paint application unit passes; a printing unit configured to print the conductor that has passed through the second die; An apparatus for manufacturing enameled copper wire comprising:

2. The enameled copper wire manufacturing apparatus according to claim 1, a gap between the inner surface of the first die and the conductor is smaller than a gap between the inner surface of the second die and the conductor; Enamelled copper wire manufacturing equipment.

3. The enameled copper wire manufacturing apparatus according to claim 1 or 2, a plurality of units each including the first paint application unit and the first die are arranged along the travel path; Enamelled copper wire manufacturing equipment.

4. The enameled copper wire manufacturing apparatus according to claim 1 or 2, The first die is configured to pass through a hole through which the conductor passes and be divisible at a dividing surface along the axial direction of the hole. Enamelled copper wire manufacturing equipment.

5. The enameled copper wire manufacturing apparatus according to claim 1 or 2, The conductor is configured to pass through a section including the second paint application section, the second die, and the baking section a plurality of times after passing through the first paint application section and the first die. Enamelled copper wire manufacturing equipment.

6. The enameled copper wire manufacturing apparatus according to claim 1 or 2, a first paint tank containing the first paint and a second paint tank containing the second paint are separated from each other; Enamelled copper wire manufacturing equipment.

7. Applying a first paint to a surface of the conductor running along the running path; Passing the conductor coated with the first coating material through a first die; Applying a second coating material to the surface of the conductor that has passed through the first die and has the first coating material still uncured; Passing the conductor coated with the second coating material through a second die; performing a burning process on the conductor that has passed through the second die; Manufacturing method of enamelled copper wire.

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