Substrate process apparatus

Abstract

To provide a linear electrical machine comprising a frame with a level reference plane and an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane.SOLUTION: In a transport apparatus 1599, an array of electromagnets (actuators 1700) is arranged so that a series of electromagnets of the array of electromagnets defines at least one drive line within a drive plane, where each of the electromagnets is coupled to an alternating current power source 1585 energizing each electromagnet. At least one reaction platen 1510 is made of paramagnetic, diamagnetic, or non-magnetic conductive material and disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets with alternating current generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along at least one drive line, in a controlled attitude relative to the drive plane.SELECTED DRAWING: Figure 16C

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a nonprovisional application of and claims the benefit of U.S. Provisional Patent Application No. 62 / 979,195, filed February 20, 2020, the entire disclosure of which is incorporated herein by reference.

[0002] FIELD The exemplary embodiments relate generally to substrate processing apparatus, and more particularly to a substrate transport apparatus of a substrate processing apparatus. [Background technology]

[0003] [Brief description of related developments] Semiconductor automation generally includes a set of building blocks required to support the execution of processes that ultimately achieve a predetermined level of quality and repeatability in semiconductor chip manufacturing. One component of semiconductor automation is the wafer handler (also called substrate) that transports wafers or substrates between load locks and process modules and / or between process modules (e.g., in the case of a continuous process tool architecture).

[0004] Generally, wafer handlers include a robotic manipulator with a rotary or prismatic joint and a respective linkage-based mechanism driven by an actuator away from the robotic manipulator's end effector, where the end effector contacts or otherwise interfaces with a wafer. Such conventional manipulator designs generally involve the use of bearings in a vacuum environment at different portions of the manipulator structure, typically at the mechanical interface between each arm link of the manipulator. The use of bearings in a vacuum environment generally can result in lubricant outgassing, particle generation, and friction fluctuations during operation of the bearings in a vacuum environment during wafer handling at high temperatures (e.g., above 400°C). Wafer handlers are also generally mounted in vacuum cluster tools, and their mechanical stroke is limited by the design of the associated arm link length. As a result, conventional wafer handlers operating in a vacuum are not suitable for "long" vacuum cluster tools, such as those known in the industry as "linear tool configurations."

[0005] In linear tool configurations, "long-reach" manipulators with long arm link lengths and articulating end effectors are typically utilized to transfer wafers between load locks and the linear tool's process modules. These long-reach manipulators typically have mechanical designs with low natural frequencies, increased actuator counts, undesirable arm link flexure, mechanical position hysteresis, high sensitivity to thermal expansion, expensive bearings, limited ability to level the end effector relative to the wafer-holding station, and limited motion throughput. Additionally, linear tool configurations can be scalable, meaning end users can extend the length of the linear tool with minimal impact to existing automation. Another desirable feature of linear tools is the ability to maintain the linear tool (such as performing scheduled maintenance on a wafer handler) with minimal interruption to tool operations.

[0006] As an alternative to the wafer handler described above, a magnetic levitation wafer conveyor may be used, in which an AC electromagnetic levitation device is provided above a line of AC electromagnets to float and transport a conductive floating body or a paramagnetic or non-magnetic metal material. The AC magnetic levitation device generally includes a single-phase AC power supply having a first frequency for floating the floating body, a three-phase AC power supply having a second frequency for transporting the floating body, an adder for adding AC currents from the two AC power supplies, and a supply circuit for supplying the added AC current to the line of the AC electromagnets. The floating body can be efficiently transported and stopped at a desired position.

[0007] 33 to 36 show examples of induction-repulsion type magnetic levitation mechanisms. In FIGS. 33 to 36, number 01 indicates an AC electromagnet, and number 02 indicates the floating body to be transported. A lightweight, highly conductive material such as aluminum is suitable for the floating body 02. Typically, the object to be transported is placed on the floating body 02. In FIGS. 33 to 36, when a single-phase AC current indicated by number 04 in FIG. 35 is supplied to the AC electromagnet 01, an AC magnetic field is generated above the electromagnet. Because the floating body exists in a magnetic field, an AC current called an eddy current is generated in the aluminum material that forms the floating body.

[0008] The magnetic field generated by the eddy current repels the magnetic field generated by the electromagnet. Therefore, a floating force indicated by F1 in Figures 33 and 34 acts on the floating body due to this repulsion. When three-phase alternating current indicated by numbers 05, 06, and 07 in Figure 36 is supplied to the three-phase electromagnet 03 in Figures 33 and 34, a moving force indicated by F2 in Figures 33 and 34 acts on the floating body 02, and the floating body 02 is transported. Summary of the Invention

[0009] The foregoing aspects and other features of the disclosed embodiments are explained in the following description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0010] [Figure 1A]1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 1B] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 2] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 3] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 4] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 5] 1 is a schematic plan view of a substrate processing system incorporating aspects of the disclosed embodiment; [Figure 6] 10 illustrates an exemplary substrate handler operation of a substrate processing apparatus as described herein in accordance with aspects of the disclosed embodiment; [Figure 7] 1 is a schematic plan view of a substrate processing system incorporating aspects of the disclosed embodiment; [Figure 8] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 8A] 1 is a schematic perspective view of a portion of a substrate handler in accordance with aspects of the disclosed embodiment; [Figure 9] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 10] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 10A] 11 is a schematic perspective view of a portion of the substrate handler of FIG. 10 in accordance with aspects of the disclosed embodiment; [Figure 11] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 11A] 12 is a schematic perspective view of a portion of the substrate handler of FIG. 11 in accordance with aspects of the disclosed embodiment; [Figure 12A] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 12B]12B is a schematic elevation view of the substrate processing apparatus of FIG. 12A in accordance with aspects of the disclosed embodiment; [Figure 13A] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 13B] 13B is a schematic elevation view of the substrate processing apparatus of FIG. 13A in accordance with aspects of the disclosed embodiment; [Figure 14] 1 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiment; [Figure 14A] 15 is a schematic plan view of a portion of the substrate processing apparatus of FIG. 14 in accordance with aspects of the disclosed embodiment. [Figure 14B] 1 is a schematic elevational view of a substrate transport cart in accordance with aspects of the disclosed embodiment; [Figure 14C] FIG. 14C is a schematic top view of the substrate transport cart of FIG. 14B in accordance with aspects of the disclosed embodiment; [Figure 15A] 1 is a front elevation view of a substrate handler in accordance with aspects of the disclosed embodiment; [Figure 15B] FIG. 15B is a schematic side elevation view of the substrate handler of FIG. 15A in accordance with aspects of the disclosed embodiment; [Figure 15C] FIG. 15B is a schematic plan view of the substrate handler of FIG. 15A in accordance with aspects of the disclosed embodiment; [Figure 16A] 1 is a schematic plan view of a substrate handler in accordance with aspects of the disclosed embodiment; [Figure 16B] FIG. 16B is a schematic side elevation view of the substrate handler of FIG. 16A in accordance with aspects of the disclosed embodiment; [Figure 16C] 16B is a schematic plan view of a portion of a substrate processing apparatus including the substrate handler of FIG. 16A in accordance with aspects of the disclosed embodiment; [Figure 17] FIG. 1 is a schematic diagram of an exemplary actuator control system network in accordance with aspects of the disclosed embodiment; [Figure 18] 1 is a schematic diagram of a portion of a sensor control system network in accordance with aspects of the disclosed embodiment; [Figure 19] 1 is a schematic diagram of an exemplary sensor control system network in accordance with aspects of the disclosed embodiment; [Figure 20] FIG. 20 is a schematic diagram of a portion of the sensor control system network of FIG. 19 in accordance with aspects of the disclosed embodiment; [Figure 21] 1 is a schematic illustration of an exemplary motion control of a substrate handler in accordance with aspects of the disclosed embodiment; [Figure 21A] 1 is a schematic perspective view of a substrate handler operation in accordance with aspects of the disclosed embodiment; [Figure 22] 1 is a free body force diagram for maximum allowable acceleration in a conventional substrate transport apparatus. [Figure 23] 11A-11C are free body force diagrams illustrating the effect of pitch angle on acceleration of the substrate handler relative to substrate slippage in accordance with aspects of the disclosed embodiment; [Figure 24] 10 is a free body force diagram of a substrate illustrating the effect of pitch angle without friction on substrate sliding in accordance with aspects of the disclosed embodiment; [Figure 24A] 10 is an exemplary graph illustrating propulsion acceleration in relation to pitch angle without friction for sliding of a substrate, in accordance with aspects of the disclosed embodiment; [Figure 25A] 10 is a free body force diagram of a substrate illustrating the effect of pitch angle with friction on substrate sliding in accordance with aspects of the disclosed embodiment; [Figure 25B] 10 is a free body force diagram of a substrate illustrating the effect of pitch angle with friction on substrate sliding in accordance with aspects of the disclosed embodiment; [Figure 26] 10 is an exemplary graph illustrating acceleration limits related to pitch angle with friction for substrate sliding, in accordance with aspects of the disclosed embodiment; [Figure 27] 1 is a schematic elevational view of a substrate handler illustrating pitch control of the substrate handler in accordance with aspects of the disclosed embodiment; [Figure 28] 1 is a schematic elevation view of one substrate handler passing by another substrate handler in a transport chamber in accordance with aspects of the disclosed embodiment; [Figure 29]1 is a schematic elevation view of one substrate handler passing by another substrate handler in a transport chamber in accordance with aspects of the disclosed embodiment; [Figure 30] FIG. 10 is a schematic diagram of a portion of an actuator control system network illustrating dynamic phase allocation in accordance with aspects of the disclosed embodiment; [Figure 31A] 1 illustrates platen tilt control utilizing a conventional linear drive system and static phase control. [Figure 31B] 1 illustrates platen tilt control utilizing a conventional linear drive system and static phase control. [Figure 32A] 10 illustrates tilt control of a portion of a substrate handler utilizing dynamic phase allocation and an actuator control system network having substantially multi-phase actuator units, in accordance with aspects of the disclosed embodiment; [Figure 32B] 10 illustrates tilt control of a portion of a substrate handler utilizing dynamic phase allocation and an actuator control system network having substantially multi-phase actuator units, in accordance with aspects of the disclosed embodiment; [Figure 32C] 10 illustrates electrical phase angle control by an actuator control system network to provide independent propulsion and levitation control of a substrate handler in accordance with aspects of the disclosed embodiment; [Figure 33] FIG. 1 is a schematic front view of a conventional conveying device. [Figure 34] FIG. 34 is a schematic plan view of the conventional transport device of FIG. [Figure 35] FIG. 34 is a diagram showing the waveform of a floating current in the conventional carrier device of FIG. 33. [Figure 36] FIG. 34 is a diagram showing waveforms of three AC currents used for transportation in the conventional transportation device of FIG. 33. [Figure 37] FIG. 1 is a schematic plan view of a conventional substrate processing apparatus. [Figure 38] FIG. 1 is a schematic plan view of a conventional substrate processing apparatus. [Figure 39] FIG. 1 is a schematic diagram of a clustered control architecture in accordance with aspects of the disclosed embodiment; [Figure 40A] FIG. 1 is a schematic diagram of a PVT frame in accordance with aspects of the disclosed embodiment; [Figure 40B] FIG. 1 is a schematic diagram of a PVT-FG frame in accordance with aspects of the disclosed embodiment; [Figure 41] 1 is a flowchart of an exemplary method according to an aspect of the disclosed embodiment; [Figure 42] 1 is a flowchart of an exemplary method according to an aspect of the disclosed embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0011] 1-14 illustrate exemplary substrate processing apparatus 100, 100A, 200, 300, 400, 500, 800, 900, 1200, and 1300 in accordance with aspects of the disclosed embodiment. While aspects of the disclosed embodiment will be described with reference to the drawings, it should be understood that aspects of the disclosed embodiment can be embodied in many forms. Furthermore, any suitable size, shape, or type of elements or materials may be used.

[0012] Based on the challenges and limitations of conventional substrate processing equipment discussed above, it would be desirable to have a new and innovative substrate handler and associated control framework configured to operate in a vacuum environment, substantially without bearings and lubricants, perform substrate transfer over scalable distances without impacting the substrate handler design, transport substrates at higher accelerations than the conventional solutions discussed above (i.e., without requiring substantially new end effector materials), avoid collisions, and operate multiple substrate handlers in a coordinated manner to reduce the footprint of the substrate processing equipment.

[0013] 15A-15C, a wafer handler 1500 is part of a linear electric (or electronic) machine 1599 (as described in more detail herein and referred to as an electromagnetic conveyor substrate transport apparatus) included in the substrate processing apparatus of FIGS. 1-14. The wafer handler 1500 includes a paramagnetic base 1510 (also referred to as a reaction platen) (e.g., made of copper, aluminum, or other suitable diamagnetic or nonmagnetic material capable of inducing eddy currents) shaped to provide at least bidirectional linear induction propulsion and independent rotation of the base 1510 along a linear track 1550 formed by at least one linear induction motor stator 1560. The wafer handler 1500 also includes an end effector 1520 rigidly attached to the base 1510 and configured to stably hold a substrate for transport throughout each chamber of the substrate processing apparatus. The wafer handler 1500 is controlled by an actuator and sensor control unit, as described herein, such that the configuration of the wafer handler 1500 is independent of the stroke distance that the wafer handler 1500 can cover (or extend). The independence of the wafer handler configuration 1500 is provided by utilizing a network of actuators 1700 and sensors 2000 (shown and described in more detail with respect to FIGS. 17-20 and 39 ) that are physically distributed at least along the length of the substrate processing equipment (such as along the length of the transfer chamber 118), as described herein. In aspects of the disclosed embodiment, the actuators 1700 and sensors 2000 are not coupled to any particular substrate handler 1500, but rather are common to multiple substrate handlers 1500 and can control them simultaneously, reducing the cost of ownership of the substrate handler 1500 because the substrate handler 1500 can be added or removed from the substrate processing equipment without adding additional actuators or sensors.Simultaneous control of multiple substrate handlers 1500 with a common actuator 1700 and sensor 2000 is provided by a control system according to aspects of the disclosed embodiment (described in more detail below) configured to dynamically allocate the excitation phase of each actuator coil unit (also called electromagnet) of the common actuator 1700 between different excitation phases in a manner that provides continuity of force vectors for performing wafer handler operations in three-dimensional space through control of up to six degrees of freedom from the common (set) actuator 1700. As described herein, simultaneously controlled substrate handlers 1500 may be controlled in roll, pitch, and / or yaw such that two or more independently operated substrate handlers 1500 may reduce the distance between the substrate handlers 1500 by tilting each (or at least one) of the substrate handlers 1500 along a rotation axis that is substantially parallel to the motion thrust direction (see, e.g., FIG. 29 ).

[0014] As mentioned above, conventional robotic manipulators with articulated links require substantially different mechanical designs due to the increased manipulator stroke required to reach more process modules, which can increase the cost of the robotic manipulator and reduce its service intervals. Contrary to conventional substrate handling systems, aspects of the disclosed embodiments are highly scalable compared to existing commonly accepted substrate handling solutions (such as those described above) without the added complexity and reliability concerns that result from an increased number of mechanical components.

[0015] Aspects of the disclosed embodiments also result in substantially higher substrate processing throughput compared to conventional substrate handling solutions. As described herein, aspects of the disclosed embodiments include an innovative motion sensing and control framework that tilts the substrate holding surface of the end effector of the substrate handler in the direction of movement to result in higher acceleration compared to conventional substrate handling solutions while maintaining contact between the wafer and the end effector without slippage.

[0016] As described in more detail herein, aspects of the disclosed embodiments provide a magnetically levitated substrate transport apparatus based on linear induction technology configured to provide levitation, lateral stability, and propulsion for a substrate handler. Aspects of the disclosed embodiments also provide linear induction motor stators that operate in independently controlled linear trajectories that are orthogonal or otherwise angled in an orientation between a generally parallel and a substantially orthogonal orientation, forming independently controlled linear trajectories, and / or forming arcuate or rotational paths over a two-dimensional region. Aspects of the disclosed embodiments provide coil controllers configured to generate alternating current at a predetermined frequency and amplitude for each phase of each linear induction motor stator associated with a respective linear trajectory 1550. The propulsion force provided by the linear trajectory is controlled to rotate the base 1510 independently of the linear motion of the base along the trajectory, where the propulsion force generates a moment load about the axis of rotation of the base 1510.

[0017] Aspects of the disclosed embodiment include a control system configured to track the position of the base 1510 and control the phase currents of the independent linear tracks 1550 to control motion of the base 1510 along a desired propulsion direction along the independent linear tracks 1550. The control system according to aspects of the disclosed embodiment also provides motion of the base 1510 in the levitation direction while maintaining lateral stability of the base 1510. The control system is configured to generate propulsion forces in the linear tracks 1550 to control the roll, pitch, and yaw of the substrate handler 1500, where the roll, pitch, and yaw motion of the substrate handler 1500 can be utilized to maximize substrate production throughput by adjusting the tilt of the substrate handler 1500 (e.g., see FIG. 21 ) in response to a desired acceleration of the substrate handler 1500 in the linear and / or rotational directions of motion to increase an acceleration threshold along the thrust direction of the substrate handler 1500.

[0018] Aspects of the disclosed embodiments include a sensor processing unit 1850 (see FIG. 18 ) that may be part of the sensor and that controls a network such as EtherCat® (Ethernet For Control Automation Technology, referred to as ECat in FIG. 18 ), EtherNet® (referred to as ENet in FIG. 18 ), or other suitable sensor and control network. The sensor processing unit includes general-purpose sensor and processing hardware (including non-transitory computer program code or software) configured to interface with multiple sensor technologies, such as a camera 1810, a CCD array 1811, an accelerometer 1812, a temperature sensor 1813, a proximity or distance sensor 1814, a magnetic sensor 1815, a vibration sensor 1816, or any other suitable sensor.

[0019] Referring to FIG. 1A, a schematic plan view of a substrate processing apparatus 100 incorporating aspects of the disclosed embodiments is shown. The substrate processing apparatus 100 is connected to an environmental front end module (EFEM) 114 having a number of load ports 112 as shown in FIG. 1A. The load ports 112 are capable of supporting a number of substrate storage canisters 171, such as conventional FOUP canisters, although any other suitable type may be provided. The EFEM 114 communicates with the processing apparatus via load locks 116, which are connected to the processing apparatus, as described further below. The EFEM 114 (which may be open to atmosphere) has a substrate transport apparatus (not shown, but similar in some aspects to the linear electric machine 1599 described herein) capable of transporting substrates from the load ports 112 to the load locks 116. The EFEM 114 may further include substrate alignment capabilities, batch processing capabilities, substrate and carrier identification capabilities, etc. In other embodiments, the load lock 116 may interface directly with the load port 112, such as when the load lock has batch processing capabilities or when the load lock has the ability to transfer wafers directly from a FOUP to the lock. Some examples of such devices are disclosed in U.S. Pat. Nos. 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472, 6,120,229, and 6,869,263, the entire disclosures of which are incorporated herein by reference. In other embodiments, other load lock options may be provided.

[0020] Still referring to FIG. 1A , the processing apparatus 100 may be used to process semiconductor substrates (e.g., 200 mm, 300 mm, 450 mm, or other suitable sized wafers), panels for flat panel displays, or any other desired type of substrate, and generally comprises a transport chamber 118 (which, in one embodiment, holds a sealed atmosphere therein), processing modules 120, and at least one substrate transport apparatus or linear electric machine 1599. The substrate transport apparatus 1599 in the embodiment shown may be integrated with or coupled to the chamber 118 in any suitable manner as described herein. In this embodiment, the processing modules 120 are mounted on both sides of the chamber 118. In other embodiments, the processing modules 120 may be mounted on one side of the chamber 118, as shown, for example, in FIG. 2 . In the embodiment shown in FIG. 1A , the processing modules 120 are mounted opposite each other in columns Y1, Y2, or in the vertical plane. In other embodiments, the processing modules 120 may be staggered on opposite sides of the transfer chamber 118 or stacked vertically relative to one another. Referring to FIGS. 15A-15C, a transfer apparatus 1599 includes a substrate handler 1500 that moves within the chamber 118 to transfer substrates between the load lock 116 and the processing chamber 120. While only one substrate handler 1500 is provided in the embodiment shown, in other embodiments, one or more substrate handlers may be provided. As seen in FIG. 1A, the transfer chamber 118 (the interior of which is exposed to a vacuum, an inert atmosphere, or simply a clean environment, or a combination thereof) has a configuration that utilizes a novel substrate transfer apparatus 1599 to allow the processing modules 120 to be mounted in the chamber 118 in a Cartesian arrangement with the processing modules 120 arranged in substantially parallel vertical planes or rows. This results in the processing apparatus 100 having a more compact footprint than comparable conventional processing apparatus, such as those described herein.Additionally, the transfer chamber 118 can be provided with any desired length (i.e., the length is scalable) to add any desired number of processing modules 120, as described in more detail below, to increase throughput. The transfer chamber 118 can also support any desired number of transport apparatuses 1599 therein, allowing the transport apparatuses 1599 to reach any desired processing chambers 120 coupled to the transfer chamber 118 without interfering with each other. This effectively decouples the throughput of the processing apparatus 100 from the processing capacity of the transport apparatuses 1599, and thus the throughput of the processing apparatus 100 is processing-limited rather than handling-limited. Thus, throughput can be increased as needed by adding processing modules 120 and corresponding processing capacity on the same platform.

[0021] Still referring to FIG. 1A , the transfer chamber 118 in this embodiment has a generally rectangular shape, although in other embodiments, the chamber may have any other suitable shape. The chamber 118 has an elongated shape (i.e., a length that is much longer than a width) and defines a generally linear transport path therein for the transport apparatus 1599. The chamber 118 has longitudinal sidewalls 118S. The sidewalls 118S have transfer openings or ports 1180 (also referred to as substrate pass-through openings) formed therethrough. The transfer ports 1180 are sized large enough to allow substrates to enter and exit the transfer chamber 118 through the ports (which are sealable via valves). As can be seen in FIG. 1A , the processing modules 120 in this embodiment are mounted outside the sidewalls 118S, and each processing module 120 is aligned with a corresponding transfer port 1180 in the transfer chamber 118. As can be appreciated, each processing module 120 can be sealed against the side 118S of the chamber 118 around the corresponding transfer opening to maintain a vacuum within the transfer chamber. Each processing module 120 can have a valve controlled by any suitable means to close the transfer port as needed. The transfer ports 1180 can be positioned in the same horizontal plane. Thus, the processing modules on the chamber are also aligned in the same horizontal plane. In other embodiments, the transfer ports 1180 can be disposed in different horizontal planes. As seen in FIG. 1A , in this embodiment, the load lock 116 is attached to the chamber side 118S at the two front-most transfer ports 1180. This allows the load lock 116 to be adjacent to the EFEM 14 at the front of the processing device. In other embodiments, the load lock 116 can be positioned at any other transfer port 1180 on the transfer chamber 118, such as the one shown in FIG. 2 . The hexahedral shape of the transport chamber 118 allows the length of the chamber to be selected as needed to mount rows of as many processing modules 120 as needed (see, for example, Figures 1B, 3, 4-7, which show other embodiments in which the length of the transport chamber 118 is long enough to accommodate any number of processing modules 120).

[0022] 1A includes a substrate transport apparatus 1599 having a single substrate handler 1500. The transport apparatus 1599 is integrated with the chamber 118 to translate the substrate handler 1500 back and forth between a front portion 118F and a rear portion 118R of the chamber 118. The substrate handler 1500 of the substrate transport apparatus 1599 includes at least one end effector 1520 for holding one or more substrates.

[0023] 1A is a representative transport apparatus and should be understood to include a substrate handler 1500 magnetically supported from a linear track 1550. The transport apparatus 1599 is described in more detail below. The transport chamber 118 may form a frame having a horizontal reference plane 1299 (e.g., defining or otherwise corresponding to (e.g., substantially parallel to) the wafer transport plane 1290 (see FIG. 12B )), and the linear track 1550 may be attached to a sidewall 118S or floor of the transport chamber 118 and may extend the length of the chamber 118. This allows the substrate handler 1500 to traverse the length of the chamber 118. As described in more detail below, each of the linear tracks 1550 in FIG. 1A includes an electromagnet array or actuator 1700, also referred to as a network of actuators as in FIGS. 14A, 15B, 15B, 16B, 16C, and 17A, (e.g., forming at least one linear induction motor stator 1560) connected to the transport chamber 118 to form a drive surface 1598 at a predetermined height H relative to the reference plane 1299, the array of electromagnets 1700 being arranged such that the series of electromagnets 1700 define at least one drive line within the drive surface 1598, and each of the electromagnets 1700A-1700n (see FIG. 15B) being coupled to an alternating current (AC) power source 1585 that energizes each of the electromagnets 1700A-1700n, where the AC power source is, in one embodiment, a three-phase AC power source. As described above (see FIG. 15A ), the base or reaction platen 1510 is formed of a paramagnetic, diamagnetic, or non-magnetic conductive material arranged to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 such that excitation of the electromagnets 1700A-1700n with alternating current from the AC power supply 1585 generates a levitation force FZ and a propulsion force FP (see FIG. 21 ) on the base 1510 that controllably levitates and propels the base 1510 along at least one drive line 177-180 (see, e.g., FIGS. 1-8 ) at a controlled attitude relative to the drive surface 1598.

[0024] FIG. 1B shows another embodiment of a substrate processing apparatus 100A that is generally similar to apparatus 100. In this embodiment, the transfer chamber 118 has two substrate handlers 1500A, 1500B that are independently operated by an array of electromagnets 1700 (as in FIG. 16C). The substrate handlers 1500A, 1500B are generally similar to the substrate handler 1500 of the previous embodiment. Both substrate handlers 1500A, 1500B may be supported from a common array of electromagnets 1700, as previously described. The base 1510 of each substrate handler 1500A, 1500B may be driven by the same at least one linear induction motor stator 1560, as described herein, by individually controlling each coil element or electromagnet 1700A-1700n (as in FIG. 15B). Thus, as can be seen, the end effector 1520 of each substrate handler 1500 can be moved independently in linear motion and / or rotation using at least one linear induction motor stator 1560, and the generally parallel drive lines cannot pass each other in the transport chamber 118 because they include only one drive line 177 (as compared to transport chambers having multiple generally parallel drive lines as shown in FIGS. 8-10 ). Thus, the processing modules 120 are positioned along the length of the transport chamber 118 so that substrates can be transported to be processed in the processing modules in an arrangement that avoids the substrate handlers 1500A, 1500B interfering with each other. For example, a processing module for coating may be positioned before the heating module, and the cooling and etching modules may be positioned last.

[0025] 8-10, however, the transport chamber 118 may have any suitable width to provide two or more generally parallel drive lines 177, 178 extending along at least a portion of the longitudinal length of the transport chamber 118 to allow two substrate handlers 1500A, 1500B to pass adjacent to one another (similar to side rails or bypass rails). In the embodiment illustrated in Figures 8-10, the transport apparatus 1599 has two drive lines 177, 178, although in other embodiments any suitable number of generally parallel longitudinally extending drive lines may be provided.

[0026] According to some aspects of the disclosed embodiments, the array of electromagnets 1700 (or at least a portion thereof) may also be used as a heater for the wafer handler (e.g., to control the heating of the reaction platen and / or water to a desired predetermined temperature for a desired predetermined time), such as in cases where it is desired to remove water vapor (e.g., gas) or preheat a wafer / substrate, e.g., picked from a load port, potentially en route to a process module, or alternatively, to reduce a temperature gradient between the wafer and the end effector of the wafer handler at the process module. Heating of the wafer handler may occur during transfer of the reaction platen or while the reaction platen is held stationary at a predetermined location / position. Still according to some aspects of the disclosed embodiments, the array of electromagnets 1700 (or at least a portion thereof) may also be used as a heater, such as in cases where it is desired to heat the transfer chamber for degassing, e.g., to remove water vapor. Controlled heating of the transfer chamber 118 to a predetermined temperature for a predetermined time may occur while the reaction platen is stationary. Controlled heating of the transport chamber 118 can facilitate thermal scanning by appropriate thermal / infrared sensors of the transport chamber 118 to identify the presence and map the location of the reaction platen within the transport chamber 118 when the transport chamber 118 and drives begin to cool or are powered off.

[0027] Referring now to Figures 4 and 5, other substrate processing apparatus 400, 500 are shown according to other aspects of the disclosed embodiments. As seen in Figures 4 and 5, the transfer chambers 118, 118A, 118B, 118C in these aspects are extended to accommodate additional processing modules 120. The apparatus shown in Figure 4 has 12 processing modules 120 connected to the transfer chamber 118. The processing apparatus 500 in Figure 5 is illustrated as having two transfer chambers 118A, 118B, which are connected to each other by a bridging chamber 118C that provides for movement of the substrate handler 1500 between the transfer chambers 118A, 118B. Here, 24 processing modules 120 are connected to each transfer chamber 118A, 118B in Figure 5. The number of processing modules 120 shown in these aspects is merely exemplary, and the substrate processing apparatus may have any other number of processing modules 120, as previously described. The processing modules 120 in these embodiments are arranged along the sides of each transport chamber 118A, 118B in a Cartesian arrangement similar to that described above. However, the number of rows of processing modules 120 in these embodiments is significantly increased (e.g., six rows in the apparatus of FIG. 4 and twelve rows in each of the apparatuses of FIG. 5). In the embodiment shown in FIG. 4, the EFEM is removed, and the load port 112 may be directly mated to the load lock 116. The transport chambers of the substrate processing apparatuses 400, 500 in FIGS. 4 and 5 may have multiple substrate handlers 1500 for handling substrates between the load lock 116 and the processing chambers 120. The number of substrate handlers 1500 shown is merely exemplary; more or fewer apparatuses may be used. The substrate transport apparatus 1599 in these embodiments (some of which are illustrated in FIGS. 4 and 5) is generally similar to that described above and includes a linear track 1550 and one or more substrate handlers 1500.4 and 5, only a single longitudinal drive line (e.g., drive line 177, 178, 179) is illustrated in each chamber 118, 118A, 118B, 118C, it should be understood that in other embodiments, multiple drive lines may extend longitudinally along each chamber 118, 118A, 118B, 118C in a manner generally similar to that illustrated in Figures 8-10. As can be appreciated, like the other substrate transport apparatuses 100, 100A, 200, 300, 800, 900, 1200, 1300 described herein, the substrate transport apparatus 400, 500 has a controller 199 for controlling movement of one or more substrate handlers 1500 of the substrate transport apparatus 1599.

[0028] Still referring to FIG. 5, the transport chambers 118A, 118B in this case may be directly coupled to a tool 300 (e.g., a stocker, a photolithography cell, or other suitable processing tool), where substrates are delivered to and removed from the tool 300 through chamber 118C.

[0029] As can be seen from FIGS. 1B, 3, and 4-5, the transfer chamber 118 can extend throughout the entire processing facility P as needed (FIG. 5, and an example thereof is illustrated in FIG. 7). As seen in FIG. 5 and described in more detail below, the transfer chamber (generally referred to as the transfer chamber 118) can connect and communicate with various sections or bays 118P-118P4 in the processing facility P, such as, for example, storage, lithography tools, metal deposition tools, or any other suitable tool bay. The bays interconnected by the transfer chamber 118 can also be configured as process bays or processes 118P1, 118P3. Each bay contains tools (e.g., lithography, metal deposition, thermal soak, cleaning) desired to accomplish a given manufacturing process on the semiconductor workpieces. In either case, the transfer chamber 118 is communicatively connected to process modules 120 corresponding to the various tools in the facility bays, as previously described, thereby enabling the transfer of semiconductor workpieces between the chambers 118 and the process modules 120. Thus, the transfer chamber 118 may be heated to atmospheric, vacuum, ultra-high vacuum (e.g., 10 -5 The chamber sections 118 may include various environmental conditions, such as oxygen (e.g., torr), inert gas, or any other. Thus, section 118P1 of the chamber in a given process or bay, or within a portion of a bay, may have, for example, one environmental condition (e.g., atmospheric), while another section 118P2, 118P3 of the chamber 118 may have a different environmental condition. As previously mentioned, sections 118P1-118P4 of the chamber 118 having various environments therein may be located in various bays of a facility, or may all be located in one bay of a facility. For illustrative purposes only, FIG. 5 shows a chamber 118 having four sections 118P-118P4 with various environments. The chamber 118 in this embodiment may have as many sections with various environments as needed.

[0030] 5, the substrate handlers 1500 in the transfer chamber 118 can have different environments therein and transition between sections 118P1-118P4 of the chamber 118. Thus, as can be seen from FIG. 5, each of the substrate handlers 1500 can move a semiconductor workpiece from a tool in one process or bay of the processing equipment to another tool with a different environment in a different process or bay of the processing equipment in a single pick-up. For example, the substrate handler 1500A can pick up a substrate in a process module 301 of the transfer chamber 118, which can be an atmospheric module in section 118P1, a lithography module, an etch module, or any other desired process module. The substrate handler 1500A may then move along drive line 177 (or a substantially parallel drive line thereto, along which one or more longitudinal drive lines are provided) from section 118P1 to section 118P3 of the chamber 118 (e.g., where the other substrate handler 1500 is controller to avoid interference with the substrate handler 1500A in any suitable manner). In section 118P3, the substrate handler 1500A may place a substrate in a process module 302, which may be any desired process module.

[0031] As can be seen from FIG. 5, the transfer chamber 118 can be modular, with chamber modules connected as needed to form the chamber 118 (e.g., formed by three chamber sections 118A, 118B, 118C, where each chamber section 118A, 118B, 118C can include one or more chamber modules coupled to each other in any suitable manner). Also referring to FIG. 1A, the module can include an interior wall 118I, similar to the walls 118F, 118R of FIG. 1A, for separating the sections 118P1-118P4 of the chamber 118. The interior wall 118I can include a slot valve, or any other suitable valve, that allows one section of the chambers 118P1-118P4 to communicate with one or more adjacent sections. The slot valve 118V can be sized to allow one or more substrate handlers 1500 to transition from one section 118P1-118P4 to another section through the valve 118V. In this manner, the substrate handler 1500 may be moved anywhere throughout the chamber 118. Valves 118V may be closed to isolate sections 118P1-118P4 of the chamber 118 so that the various sections may contain different environments, as previously described. Additionally, the interior walls 118I of the chamber module may be positioned to form load locks (see section 118P4), as shown in FIG. 5. Load locks 118P4 (only one shown in FIG. 5 for illustrative purposes) may be positioned in the chamber 118 as needed and may hold any desired number of substrate handlers 1500 therein.

[0032] In the embodiment shown in FIG. 5 , the process in chamber sections 118A and 118B can be the same process, e.g., etch, where processing equipment 500, including tool 300 (e.g., stocker), can process substrates without any associated material handling overhead associated with transporting FOUPS from the stocker to individual process modules 120 via an automated material handling system and transporting individual wafers to their respective process modules 120 via EFEM. Instead, a robot in the stocker transfers FOUPS 171 directly to load ports (three load ports per chamber section are shown, but more or fewer load ports may be provided depending on throughput requirements), where wafers are moved in batches to a lock and dispatched to their respective process module(s) depending on the desired process and / or required throughput. Chamber sections 118A, 118B or stocker 300 can further include metrology, sorting, material identification, testing, inspection, etc., as needed to effectively process and test substrates.

[0033] In the aspects of the disclosed embodiment shown in FIG. 5 , more or fewer chamber sections 118A and 118B having various processes, e.g., etch, CMP, copper deposition, PVD, CVD, etc., may be provided, where chamber sections 118A, 118B, etc., in combination with tool 300, e.g., a photolithography cell, can process substrates without the associated material handling overhead associated with transporting FOUPs from a stocker to individual process tool bays and lithography bays via an automated material handling system and transporting individual wafers to their respective processing tools via an EFEM. Instead, automation within the lithography cell transfers FOUPs, substrates, or materials directly to load ports 112 (again, note that while three load ports per chamber section / process type are shown, more or fewer load ports may be provided depending on throughput requirements), where substrates are dispatched to their respective processes depending on the desired process and / or required throughput. One example of such an alternative is shown in FIG. 7 . In this manner, the apparatus of FIG. 5 processes substrates at lower cost, with a smaller footprint, and with less WIP required (compared to conventional processing systems described herein), thereby providing significant advantages to manufacturing facility operators as a result of lower inventory, faster turnaround when it comes to processing single carrier lots (or "hot lots"), and more advanced contamination control. Chamber sections 118A, 118B (which may each be referred to as a tool or tool section) or tool or cell 300 may further include metrology, processing, sorting, material identification, testing, inspection, etc., as needed to effectively process and test substrates. As can be seen from FIG. 5, chamber sections 118A, 118B and tool 300 may be coupled to share a common controller environment (e.g., an inert atmosphere or vacuum).This ensures that the substrate remains in a controlled environment from tool 300 throughout the substrate processing apparatus 500. This eliminates the use of special environmental controls in the FOUP as in conventional substrate processing apparatus such as those shown in Figures 37 and 38.

[0034] 7, an exemplary manufacturing facility layout 601 incorporating aspects of the disclosed embodiment shown in FIG. 5 is shown. Wafer handler 406, similar to wafer handler 1500, transports substrates or wafers through process steps within manufacturing facility 601 through transfer chambers 602, 604, 606, 608, 610, 612, 614, 616, 618, 620, 624, 626. Process steps may include epitaxial silicon 630, dielectric deposition 632, photolithography 634, etching 636, ion implantation 638, rapid thermal processing 640, metrology 642, dielectric deposition 644, etching 646, metal deposition 648, electroplating 650, and chemical-mechanical polishing 652. In other aspects, more or less of the processes, such as the etching, metal deposition, heating, and cooling operations in the same order, may be included or may be combined. As previously mentioned, the wafer handler 406 can transport a single wafer or multiple wafers and can have transfer capabilities, such as when the wafer handler 406 has the ability to remove a processed wafer and place an unprocessed wafer in the same module. The wafer handler 406 can move through isolation valves 654 for direct inter-tool or inter-bay or inter-process transfers. The valves 654 can be hermetic valves or simply conductance-type valves, depending on the pressure or gas species difference on either side of a given valve 654. In this way, wafers or substrates can be moved from one process step to the next in a single processing step or "one-touch." As a result, process contamination is minimized. Examples of such pressure or species differences include clean air on one side and nitrogen on the other, or roughing vacuum levels on one side and high vacuum on the other, or vacuum on one side and nitrogen on the other. 5, may be used to transition from one environment to another, for example, between vacuum and nitrogen or argon. In other embodiments, other pressures or species may be provided in any number of combinations.The load lock 656 can transition a single wafer handler or multiple wafer handlers in a manner generally similar to that described herein, where a single drive line or multiple generally parallel and / or orthogonal drive lines are provided. Alternatively, the substrate(s) may be transferred to the load lock 656 on a shelf (not shown), where it is not otherwise desirable for the wafer handler 406 to pass through a valve. Additional features 658, such as alignment modules, metrology modules, cleaning modules, process modules (e.g., etch, deposition, polishing, etc.), thermal conditioning modules, etc., may be incorporated into the lock 656 or transfer chamber. A service port 660 may be provided for removing the wafer handler 406 or wafers from the tool. Wafer or carrier stockers 662, 664 may be provided for storing and buffering and / or testing wafers. In other embodiments, stockers 662, 664 may not be provided, such as when a cart is oriented directly to the lithography tool. Another example is when an indexer or wafer storage module 666 is provided in the tool set. A recirculation unit 668 may be provided to circulate and / or filter air or gaseous species in any given section, such as tool section 612. The recirculation unit 668 may have a gas purge, particle filter, chemical filter, temperature control, humidity control, or other features to condition the gaseous species being processed. More or fewer circulation and / or filter or conditioning units may be provided in a given tool section. An isolation stage 670 may be provided to isolate the wafer handler 406 and / or wafers from various processes or tool sections where they may not be cross-contaminated. A lock or interconnect 672 may be provided to change the orientation or direction of the wafer handler 406, where the wafer handler 406 can be retrieved or placed within a common workspace without changing its orientation. In other aspects or methods, any suitable combination of process sequences or configurations may be provided.

[0035] 6 , the controller 199 controls the propulsive forces generated by the array of electromagnets 1700 across the base 1510 to impart a controlled yaw moment to the base, causing it to yaw about a yaw axis (e.g., rotation axis 777) generally perpendicular to the drive plane 1598 from a first predetermined orientation relative to the frame of the chamber 118 (such as when the end effector 1520 is substantially aligned with the drive line 177) to a second, different predetermined orientation relative to the frame of the chamber 118 (such as when the end effector is extended into the process module 120). As can be appreciated, yawing of the base 1510 can be performed in combination with a propulsive motion of the base 1510 (such as when a single drive line is provided to the chamber 118) or with the base remaining in place (such as when the base 1510 rotates while remaining substantially stationary along the X and Y axes). In one embodiment, and with reference to FIG. 15C , the controller 199 controls the momentum (e.g., Fx ) generated by the array of electromagnets 1700 to impart a moment couple (illustrated in FIG. 15C with movement of the substrate handler 1500 along the X-axis) to the base 1510 to effect yaw control of the base 1510 to effect at least one of positioning and centering of a substrate (also referred to as a wafer payload or payload) on the base 1510 relative to a predetermined substrate-holding location (load lock, process module, etc.) in the frame of the chamber 118. right , Fx left ). As can be appreciated, control of pitch (rotation about the Y axis) and roll (rotation about the X axis) (see FIGS. 15A and 15B) can be performed by controller 199 while simultaneously yaw motion countering the dynamic couple (which controls the lift force Fz across the reaction platen) and maintaining a generally planar yaw of the wafer holder / reaction platen in the wafer transport plane.

[0036] In the case where a single drive line 177 is provided for each transport chamber (as illustrated in Figures 1A, 1B, 2, 4, and 5), or in the case of access to a process module such as process module 120A (see Figure 8) from drive line 178 closest to process module 120A (such as when multiple substantially parallel longitudinal drive lines 177, 178 are provided (see Figure 8)), the controller 199 is configured to drive the base 1510 in two or more yaw, pitch, roll, and thrust forces (as described herein) while simultaneously retrieving and placing substrates from any suitable substrate holding station (e.g., load lock 116, process module 120, etc.). For example, the controller 199 is configured to energize the actuators 1700 as described herein to cause the base to move along the drive lines 177 and rotate about the base rotation axis 777, thereby causing the substrate seating surface 1520A of the substrate handler 1520 to enter a process module 120 or other suitable holding station where the substrate S moves along a substantially linear path 790 in a predetermined wafer / substrate transfer plane. Referring to Figures 8-11, in other embodiments, when multiple longitudinal drive lines 177, 178 are provided in the transport chamber 118, the base 1510 may be rotated to align the substrate handler 1520 with a desired / predetermined substrate holding station before entering the substrate holding station. For example, base 1510 may be positioned at the intersection between drive lines 178 and 179A, where drive line 179 provides extension and retraction of the substrate handler to substrate holding station 120BH of process module 120B (e.g., in a propulsion direction substantially perpendicular to the propulsion direction along drive lines 177, 178 (or any suitable angle that allows access to the process module)). Base 1510 may rotate about rotation axis 777 to align substrate handler 1520 with substrate holding station 120BH, and the base may move along drive line 179A to move or extend substrate handler 1520 to substrate holding station 120BH to pick / place substrate(s).

[0037] 14 and 14A-14C, the substrate handler 1500 is described as including an end effector 1520; however, in other embodiments, one or more substrate handlers may be configured as a cart 1500C configured to support one or more substrates on a base 1510. For example, the base 1510 may include one or more substrate supports 1431-1433 configured to stably hold a substrate (e.g., from a bottom or edge grip) such that the substrate handler 1500, 1500A, 1500B or a substrate transport apparatus, e.g., in a load or other substrate holding station, transfers the substrate(s) to or from the substrate supports 1431-1433. In one embodiment, the substrate supports 1431-1433 may be configured to substantially center one or more substrates on the base 1510 such that the center of the substrate(s) is approximately coincident with the axis of rotation 777 of the base (i.e., the supports are passive supports or are self-centering supports that may be actuated (e.g., piezoelectric) from a suitable power source energized to the reaction platen). In some embodiments, one or more carts 1500C may include a substrate support rack 1440 for holding two or more substrates in a stack, where each rack level includes a respective substrate support 1431-1433, 1431A-1433A. 14 and 14A, the cart 1500C may provide an interface between the substrate handler 1500A, 1500B and the load lock 116, where the transport apparatus 116R (SCARA arm, linear sliding arm, etc.) of the load lock transfers substrate(s) to the cart 1500C and the substrate handler 1500A, 1500B retrieves substrates from the cart, and vice versa. In other embodiments, if the process module 120 includes a transport apparatus 120R (SCARA arm, linear sliding arm, etc.), the cart 1500C may be utilized to transfer substrate(s) to or from the process module 120.Although the base 1510 of the cart 1500C (and of the substrate handlers 1500, 1500A, 1500B) is illustrated as having a circular shape when viewed from above (see FIG. 14C), in other embodiments the base 1510 may have any suitable shape (e.g., square, rectangular, circular, etc. when viewed from above) that otherwise interfaces with the array of electromagnets 1700 to provide one or more of linear propulsion, levitation, yaw, pitch, roll, and rotational control of the base 1510.

[0038] 12A, 12B, 13A, and 13B, the transfer chamber 118 is described above as a longitudinally elongated chamber forming part of a linear processing tool, although in other embodiments, the transfer chamber may have a cluster tool configuration. For example, with reference to FIGS. 12A and 12B, the transfer chamber 118T1 has a substantially square configuration (although in other embodiments, the transfer chamber may have any suitable shape, such as a hexagonal, octagonal, etc.). In this embodiment, the electric machine 1599R (which is generally similar to the linear electric machine 1599) is configured as a side-by-side transfer apparatus including at least two side-by-side substrate handlers 1500A, 1500B, which are generally similar to the substrate handler 1500 described herein. The array of electromagnets 1700 in this embodiment is configured to move the substrate handlers 1500A, 1500B to rotate about a common axis of rotation 1277 (such axis being similar, for example, to the θ-axis of a conventional SCARA-type robot) to change the direction of the "extension and retraction" of the side-by-side transport apparatus (note that the terms extension and retraction are used herein for convenience, and extension and retraction are effected by linear propulsion of the substrate handlers 1500, 1500A, 1500B along their respective drive lines). For example, the array of electromagnets 1700 has an arrangement that forms drive lines 177, 178, 179, 180, where drive lines 177, 178 are spaced apart and generally parallel to one another so as to be substantially aligned with the respective transport openings 1180A, 1180F and 1180B, 1180E. Drive lines 179, 180 are substantially perpendicular to drive lines 177, 178, spaced apart from one another, and generally parallel to one another so as to be substantially aligned with respective transport openings 1180C, 1180H and 1180D, 1180G. The drive lines may be in any suitable pattern (such as arcuate or curved segments having constant or varying radii) and orientation, and the following description is for illustrative purposes.Electromagnets 1700A-1700N (illustrated in FIG. 12A but not numbered for clarity of the drawing) provide at least linear propulsion of substrate handlers 1500A, 1500B through transport openings 1180A-1180H. In this embodiment, the array of electromagnets 1700 also includes rotary electromagnet sub-arrays 1231-1234 that, under the control of controller 199, provide rotation of substrate handlers 1500A, 1500B about a common axis of rotation 1277 by electromagnets forming drive lines 177-180. Alternatively, the electromagnets may form a sufficiently dense and large grid without being specifically designated for propulsion or rotation, and may perform that function based on the position of base 1510 and the control laws of the controller. As can be appreciated, the substrate handlers 1500A, 1500B may rotate simultaneously about a common axis of rotation 1277, but the extension and contraction of the substrate handlers 1500A, 1500B may be independent of the extension and contraction of one of the other substrate handlers 1500A, 1500B. Generally, the motions of the substrate handlers 1500A, 1500B are independent of each other, and the complexity of the motions can range from one to six degrees of freedom.

[0039] 12B, in one embodiment, the electric machine 1599R includes multiple transport levels 1220A, 1220B stacked one on top of the other. In this embodiment, each level 1220A, 1220B is formed by a respective horizontal support 1221, each having a respective reference surface 1299R that is generally parallel to the horizontal reference surface 1299 of the frame of the transport chamber 118T1. Each level support 1221 includes an array of electromagnets 1700, generally similar to that illustrated in FIG. 12A, for linearly driving the parallel substrate handlers 1500A, 1500B along drive lines 177-180 and for rotating the parallel substrate handlers 1500A, 1500B about a common rotational axis 1277 (e.g., with full six degrees of freedom control). Each level support 1221 is coupled to a common Z-axis drive 1211 that moves the level support 1221 and the substrate handlers 1500A, 1500B thereon in the Z direction to align the end effectors 1520 of the substrate handlers 1500A, 1500B on the respective level support 1221 with the substrate transport surface 1290 of the transport opening 1180 of the transport chamber 118T1. The Z-axis drive 1211 may be any suitable linear actuator, such as a screw drive, an electromagnetic drive, a pneumatic drive, a hydraulic drive, etc.

[0040] 13A and 13B, in another embodiment, the transfer chamber 118T2 has a substantially hexagonal configuration (although in other embodiments, the transfer chamber may have any suitable shape as noted herein). In this embodiment, an electric machine 1599R (generally similar to the linear electric machine 1599 of FIG. 15C) is configured as a radial transport apparatus including a substrate handler 1500 having a double end / face end effector 1520D, as described herein (although in other embodiments, a single end / face end effector may be utilized). The array of electromagnets 1700 in this embodiment is configured to rotate the substrate handler 1500 about a common rotation axis 1377 (such an axis being similar to the θ-axis of a conventional SCARA-type robot, for example) to change the direction of "extension and retraction" (note that the terms extension and retraction are used herein for convenience, and that extension and retraction are effected by linear propulsion of the substrate handler 1500 along respective drive lines), thereby linearly propelling the substrate handler 1500 through the transport openings 1180A-1180F. For example, the array of electromagnets 1700 has an arrangement that forms radially offset drive lines 177, 178, 179, where the angle α between adjacent drive lines depends on the number of side / facet of the transport chamber 118T2 in which the transport openings 1180A-1180F are located. Electromagnets 1700A-1700N (illustrated in FIG. 12A but not numbered for clarity of the drawing) provide at least linear propulsion of the substrate handler 1500 through the transport openings 1180A-1180H to maintain linear transport and rotation at the desired orientation during pitch and roll, and rotation of the substrate handler 1500 about the rotation axis 1377 with up to six degrees of freedom of control.

[0041] 13B, in one embodiment, the electric machine 1599R includes multiple transport levels 1320A, 1320B stacked one on top of the other in a manner generally similar to that described above with respect to FIG. 12B. For example, each level 1320A, 1320B is formed by a respective horizontal support 1321, each having a respective reference surface 1299R that is generally parallel to the horizontal reference surface 1299 of the frame of the transport chamber 118T1. Each level support 1321 includes an array of electromagnets 1700, generally similar to that illustrated in FIG. 13A, for linearly driving (along drive lines 177-179) and rotating (about axis 1377) the substrate handler 1500. Each level support 1321 is connected to a common Z-axis drive 1311 (substantially similar to the Z-axis drive 1211) that moves the level support 1321 and the substrate handler 1500 thereon in the Z direction so as to align each of the end effectors 1520D of the substrate handler 1500 on the respective level support 1321 at the substrate transport surface 1390 of the transport opening 1180 of the transport chamber 118T2.

[0042] 12B and 13B, the vertical motion provided by the Z actuator 1211 can be used to enable the wafer handler 1220A or 1220B to perform wafer handoff operations, such as retrieval or placement between wafer process stations. The supports 1221, 1321 can include a single module (level) for the purpose of providing additional lift capability to the wafer handler 1220A, 1220B to achieve a large vertical stroke during wafer handoff operations. For example, if a process module or load lock has one or more stacked wafer slots, it would be advantageous to have a vertical levitation device, such as the Z-axis actuator 1211, 1311, that can reach each of the stacked wafer slots without increasing the applied levitation force provided by the electric machine 1599R.

[0043] 12A and 12B, vertical levitation device (or Z-axis actuator) 1211 and level 1221, in another embodiment, have dual (or more) separate, independently operable devices (e.g., one for each wafer handler 1520), thereby providing the ability to perform independent vertical strokes for different wafer handlers that may access different slots on at least two independent stations (e.g., process modules, load locks, etc.).

[0044] 15A, 15B, 15C, 16A, 16B, and 16C, the linear electric machine 1599 will be described in more detail (note again that the electric machine 1599R is generally similar to the linear electric machine 1599). Generally, the linear electric machine 1599 includes a structure 1500 that does not include magnets and moving parts such as bearings, rotary or linear joints, metal bands, pulleys, steel cables, or belts. As mentioned above, the base 1510 is formed of a paramagnetic material, a diamagnetic material, or a non-magnetic conductive material. The base 1510 may have any suitable shape and size for cooperating with the electromagnets 1700A-1700n of the array of electromagnets 1700 to stably transport the substrate S in the manner(s) described herein. In one embodiment, as illustrated in Figures 9 and 11-16C, the base 1510 is shown with a frusto-conical shape, where the tapered side 1510TS of the frusto-conical shape faces the array of electromagnets 1700 (although other suitable shapes are operable). Here, the tapered side 1510TS of the frusto-conical shape has an angle λ (see Figure 15B) that is between about 50° and about 60° with respect to the plane of the frusto-conical shape 151QFR, although in other embodiments, the angle λ may be greater than about 60° or less than about 50°. In other embodiments, the base may have a conical-pyramidal shape as shown in Figures 8, 8A, and 10. Here, each side 1510TSP of the truncated cone 1510FRP has an angle λ (see FIG. 8B ) that is between about 50° and about 60° relative to the plane of the truncated cone 1510FRP, although in other embodiments, the angle λ may be greater than about 60° or less than about 50°. While the conical-pyramidal shape is illustrated as having four sides, in other embodiments, the conical-pyramidal shape may have any suitable number of sides, such as, for example, six or eight sides, or may be circular or have curved sides. In other embodiments, the base 1510 may not have a truncated-conical or conical-pyramidal shape, but may instead have a planar shape with an asymmetrical contour and size suitable for being appropriately controlled by the electromagnet 1700.

[0045] The end effectors 1520, 1520D may be generally similar to conventional end effectors, except that, as described herein, the end effectors are rigidly coupled to the base 1510. By way of example, the end effectors may be single-sided / ended having a single substrate holding position 1520A, double-sided / ended having two longitudinally spaced substrate holding positions 1520A, 1520B (see end effector 1520D), a side-by-side configuration in which multiple substrate holding positions are arranged side-by-side (e.g., laterally spaced apart) and supported from a common base to extend through side-by-side substrate transport openings, or a stacked configuration in which multiple substrate holding positions are arranged one above the other and supported from a common base to extend through vertically aligned substrate transport openings, although in other embodiments the end effectors may have any suitable configuration. The end effectors 1520, 1520D may be made of a material that can withstand high temperatures, have a low mass density, have low thermal expansion, have low thermal conductivity, and have low outgassing. A suitable material from which the end effectors 1520, 1520D may be constructed is alumina oxide (Al2O3), although any suitable material may be used.

[0046] In one embodiment, the end effectors 1520, 1520D are coupled to the base 1510 by substantially rigid, non-articulating columns 1510S to set the end effectors 1520, 1520D at an appropriate nominal height H2, for example, relative to the horizontal reference plane 1299. The substrate handler 1500 moves in space (with at least three degrees of freedom) using electrodynamic levitation principles, as described herein. The actuation elements (e.g., actuators 1700) include independently controlled coils or electromagnets 1700A-1700n (also referred to herein as coil segments) that generate desired magnetic fields that induce thrust and lift vectors within the base 1510, as shown in Figures 15A-15C, 16B, and 16C.

[0047] 10, 10A, 11, and 11A, multiple substrate handlers may be nested relative to one another to move linearly along drive lines 177-180 as a single unit, with the end effectors 1520 of the nested substrate handlers arranged stacked one on top of the other. For example, with reference to FIGS. 10 and 10A, nested bases 1510FP (which may be rotationally symmetric, e.g., a truncated cone, or both symmetric, e.g., a conical pyramid, or a channel-shaped cross section, as illustrated in FIG. 10A) are configured such that one base 1510FP can be inserted into another base 1510FP to stack the bases 1510FP in a manner similar to the way cups are stacked inside one another. The base 1510FP may be configured such that the vertical spacing between the end effectors 1520 is approximately the same as the vertical spacing between the stacked substrate holding stations, so as to provide simultaneous pick-up and placement of substrates by the stacked end effectors 1520 when stacked (i.e., when the end effectors 1520 are approximately level with the horizontal reference plane 1299). The stacking of the bases 1510FP, in one aspect, provides independent vertical or Z-axis movement of at least one of the bases 1510FP (and respective substrate handlers 1500A, 1500B, of which the base is a part) in response to levitation forces generated by the array of electromagnets 1700. In this embodiment, the top substrate handler 1500B can move in the Z axis independently of the bottom substrate handler 1500A, but when the top substrate handler 1500B is lifted off the bottom substrate handler 1500A, the bottom substrate handler 1500A can also move in the Z axis independently of the top substrate handler 1500B. Here, both symmetrical bases are interlocked and the rotation of the substrate handlers 1500A, 1500B is linked by the shape of the base 1510FP so that the substrate handlers 1500A, 1500B rotate in unison.The stackable configuration of the base 1510FF allows any suitable number of substrate handlers to be stacked one above the other (in this example, two are shown stacked one above the other, but in other embodiments, more than two substrate handlers may be stacked one above the other).

[0048] 11 and 11A, the rotationally symmetric bases 1510FC may be stacked one on top of the other, move in a propulsion direction, and move relative to one another along the Z-axis in a manner generally similar to that described above with respect to the conical pyramid bases 1510FP. However, in this embodiment, the rotationally symmetric shape of the bases 1510FC does not interlock and provides for independent rotation of each substrate handler 1500A, 1500B about the substrate handler's axis of rotation relative to the other of the substrate handlers 1500A, 1500B. The independent rotation of the frustum-based substrate handlers 1500A, 1500B provides for rapid swapping of substrates from a single substrate holding station, such as when the end effector 1520 of substrate handler 1500A is aligned with substrate holding station 120BH to remove substrate S1, where the end effector 1520 of substrate handler 1500B rotates to a position that does not extend into substrate holding station 120BH. Once substrate S1 has been removed from substrate holding station 120BH by substrate handler 1500A, the positions of the end effectors 1520 of the substrate handler 1500B may be swapped so that they are aligned with substrate holding station 120BH and rotated to a position such that they do not extend into substrate holding station 120BH, in order to place substrate S2 therein. As can be appreciated, substrate handlers 1500A, 1500B may move along the Z axis to accommodate the stack height of the end effectors relative to the height of substrate holding station 120BH. While a symmetrical (rotating about one or more axes) base is illustrated, in other embodiments, one or more bases may be asymmetrical or lack an axis of symmetry.

[0049] As described herein, linear propulsion is generally provided by two parallel linear tracks 1550 (which may be a single track) of independently controlled electromagnets 1700A-1700n, spaced apart according to the dimensions of the base 1510 to control all six degrees of freedom of the substrate handler in space (roll, pitch, yaw, and translation in each of the X, Y, and Z directions). For example, as illustrated in FIG. 15B, the electromagnets 1700A-1700n may be spaced apart from one another such that two or more electromagnets 1700A-1700n (which cooperate to form a motor actuator (primary) 1701 and in combination with a motor in the base (secondary) 1510) of respective parallel linear tracks 1550 are positioned below the base 1510 at all times, in the direction of motion of the base, to stably levitate and propel the base 1510 (as may be understood, FIGS. 15A and 15B are provided to schematically illustrate a typical configuration of the system and generally show illustrative representatives of the interrelationship between the base 1510 and the electromagnets 1700A-1700n, and are in no way intended to be limiting). The size, number, and spacing (e.g., pitch) of the electromagnets 1700A-1700n in both the X-axis and Y-axis can vary, as can the size and shape of the base 1510 relative to the electromagnets 1700A-1700n. In one embodiment, as illustrated in FIG. 8 , the array of electromagnets 1700 can also include a stabilizing track 15505 disposed laterally outward of the track 1550. The stabilizing track can be generally similar to the track 1550 and configured to provide additional stabilization of the base 1510 through the generation of additional lift and / or thrust forces acting on the base 1510 (e.g., in addition to the lift and thrust forces generated by the electromagnets of the parallel linear track 1550). As a result, the substrate handler 1500 can move along the direction of the track 1550 (i.e., the thrust direction) while changing the orientation of one or more of roll, pitch, and yaw. According to the magnetic induction principle, where electromagnets 1700A-1700n are analogous to the "primary side", base 1510 corresponds to the "secondary side" where current is induced by the eddy current effect.

[0050] 17 illustrates an actuator control system network 1799 configured to provide individual control of each electromagnet 1700A-1700n to provide the desired force components and degrees of freedom described and illustrated with respect to FIGS. 15A-16C in accordance with one aspect of the disclosed embodiment. In one aspect, the actuator control system is configured such that the electromagnets 1700A-1700n form motor actuator units (collectively referred to as motor actuators), each motor actuator unit having m electromagnets / coils that cooperate to form a motor (where m is a dynamically selectable number of two or more electromagnets that form one or more of the motor actuator units, as described further below). Thus, the actuator control system network 1799 is a scalable motion control system having a clustered architecture comprising at least a master controller 1760 and distributed local drive controllers 1750A-1750n, as described in more detail below. In this embodiment, the groups of electromagnets 1700G1-1700Gn are coupled to respective local drive controllers 1750A-1750n configured to control the current on the electromagnets 1700A-1700n in their respective groups of electromagnets 1700G1-1700Gn. The local drive controllers 1750A-1750n may be "slaves" in the network connected to a master controller 1760 configured to specify desired forces (e.g., thrust and lift) for each individual electromagnet 1700A-1700n to effect desired movement of the substrate handler 1500 in space. As described herein, the physical electromagnets / coils are fixed (e.g., stationary) as explained further below, but the electromagnets 1700A-1700n may be dynamically configured in their respective "phase" definitions relative to the "phase" definitions of the other electromagnets / coils of a given motor actuator unit such that the position of a given motor actuator unit (formed by the excitation phases of the associated motors under thrust) can effectively be considered as moving in unison with the base thrust, resulting in the desired force vector continuity for substrate handler motion control.

[0051] 18 and 19 , in accordance with aspects of the disclosed embodiment, position feedback sensors 2000 are distributed on the frame of chamber 118. Sensors 2000 are configured to sense the position of base 1510 along drive surface 1598 and are communicatively coupled to controller 199 such that controller 199 registers the sensed position of base 1510, wherein controller 199 is configured to sequentially energize electromagnets 1700A-1700n of the array of electromagnets 1700 that correspond to the sensed position in a manner described herein.

[0052] 18 and 19 illustrate a sensor control system network 1899 according to aspects of the disclosed embodiment configured to provide position feedback of the substrate handler 1500 in space, for example, relative to the frame of the transport chamber 118. The sensor control system network 1899 may be a scalable sensor control system having a clustered architecture comprising at least a master controller 1760 and distributed local sensor controllers 1850A-1850n, as described in more detail below. In this aspect, a group of sensors 1800G1-1800Gn is coupled to a respective local sensor controller 1850A-1850n (also referred to herein as a sensor processing unit) configured as a “slave” in the network connected to the master controller 1760 (or other suitable master controller in communication with the master controller 1760). Each of the local sensor controllers 1850A-1850n includes a central processing unit 1851 and associated hardware interfaces 1852 that can support various types of sensor technologies, such as those described herein. The local sensor controllers 1850A-1850n may be integrated into a real-time network such as EtherCat and / or a non-real-time network such as Ethernet. The sensors 2000 may be distributed along the propulsion path (e.g., drive lines 177-180) of the substrate handler to detect the location / position of the substrate handler in space, for example relative to the frame of the transport chamber 118.

[0053] Figure 20 illustrates a distributed sensor array 2001 including sensors 2000A-2000n relative to the base 1510 of the substrate handler 1500, and how the relationship between characteristic dimensions of the base 1510 and sensors 2000A-2000n provides continuous feedback of the position of the substrate handler 1500. As can be seen in Figure 20, the sensors 2000A-2000n are arranged at a predetermined spacing or sensor pitch Ps, providing a sensor spacing Δ between adjacent sensors 2000A-2000n. Each sensor 2000A-2000n has a length to provide a predetermined sensing range Ls, and the base 1510 has a length Lb. The relationship between these characteristics to provide continuous feedback is as follows: Ls / 2 > Ps-Ls => Ps<(3 / 2)Ls [2] where the length Lb of the base 1510 is: Lb=nPs+LS / 2 (in the formula, n=1, 2, 3,...) [3]

[0054] According to aspects of the disclosed embodiment, each sensor 2000A-2000n includes any suitable device(s) capable of measuring longitudinal displacement and / or air gap between the base 1510 of the substrate handler 1500 and a bottom reference surface, such as the horizontal reference surface 1299 (see, e.g., FIG. 15A). The master controller 1760 is configured to track the position of the substrate handler 1500 by directing which local sensor controllers 1850A-1850n should actively report feedback from the appropriate sensors 1700A-1700n. The combination of the actuator control system network 1799 and the sensor control system network 1899 forms a motion control infrastructure for six degrees of freedom of the substrate handler 1500 as shown in FIGS. 15A-16C.

[0055] Referring to Figure 39, a control system network 3999 having a clustered architecture is depicted, which is representative of the actuator control system network 1799 and the sensor control system network 1899. In the example illustrated in Figure 39, there are three drive lines 177, 179A, 179B, each of which has a respective electromagnet array forming a respective track 1550A-1550F (shown as linear, but which may also be arc-shaped). For example, drive line 177 is formed by tracks 1550A and 1550B having electromagnets 177ER1-177ERn and 177EL1-177ELn. Drive line 179A is formed by tracks 1550C and 1550D having electromagnets 179AER1-179AERn and 179AEL1-179AELn. Drive line 179B is formed by tracks 1550E and 1550F having electromagnets 179BER1-179BERn and 179BEL1-179BELn. The configuration of the electric machine illustrated in Figure 39 is exemplary and may have any other suitable configuration.

[0056] 39, the control system network includes master controller 1760, cluster controllers 3950A-3950C, and local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, and 1850DLB. Local controller 1750DL corresponds to drive line 177, local controller 1750DLA corresponds to drive line 179A, and local controller 1750DLB corresponds to drive line 179B. Each of local controllers 1750DL, 1750DLA, 1750DLB is generally similar to distributed local drive controllers 1750A-1750n, whereby each drive line 177, 179A, 179B includes a distributed arrangement of local drive controllers 1750A-1750n, as described above with respect to Figure 17, for controlling respective groups 1700G1-1700Gn of electromagnets 1700A-1700n. Similarly, local controller 1850DL corresponds to drive line 177, local controller 1850DLA corresponds to drive line 179A, and local controller 1850DLB corresponds to drive line 179B. Each of the local controllers 1850DL, 1850DLA, 1850DLB is generally similar to a distributed local sensor controller 1850A-1850n, whereby each drive line 177, 179A, 179B includes a distributed arrangement of local sensor controllers 1850A-1850n as described above with respect to FIG. 18 to control a respective group 1800G1-1800Gn of sensors 2000A-2000n.

[0057] 39, each of the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB is connected (e.g., via wireless and / or wired connections) to a respective cluster controller 3950A-3950C. For example, each of the local controllers 1750DL, 1850DL for drive line 177 is coupled to cluster controller 3950B, each of the local controllers 1750DDLA, 1850DLA for drive line 179A is coupled to cluster controller 3950A, and each of the local controllers 1750DLB, 1850DLB for drive line 179B is coupled to cluster controller 3950C. In other embodiments, the local controllers may be connected (e.g., via wireless or wired connections) directly to the master controller 1760, as shown in FIGS. 17 and 19. In yet other aspects, the local controllers may be connected (e.g., via wireless or wired connections) to both the master controller 1760 and the respective cluster controllers 3950A-3950C to provide redundant and substantially fail-safe control of the local controllers.

[0058] Each of the cluster controllers 3950A-3950C is connected (e.g., via a wireless or wired connection) to the master controller 1760. The master controller 1760, the cluster controllers 3950A-3950C, and each of the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB include any suitable processor and non-transitory computer program code to provide operational control of the substrate handler 1500 as described herein. The master controller 1760 monitors the overall operation of the control system network 3999, and each of the cluster controllers 3950A-3950C monitors the operation of a respective local controller 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB, each of which is used to drive an electromagnet and / or provide position feedback (of the substrate handler 1500) corresponding to a respective drive line 177, 179A, 179B.

[0059] The clustered architecture provides both centralized and distributed control network capabilities within a network topology, as needed. The architecture disclosed herein is advantageous because clusters may be distributed where needed within the network, providing highly centralized control within the clusters managed by each cluster controller 3950A-3950C. Network traffic associated with highly centralized control is generally limited to each cluster, and local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB may be located near the electromagnets or sensors they control, reducing issues associated with power and signal cabling. Furthermore, the clustered architecture allows direct control of the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB by the master controller 1760, when needed. Furthermore, because bursty network traffic is generally confined within a cluster and the cluster allows for a high level of control, the architecture can accommodate a large number of clusters. Thus, the architecture provides a high level of scalability and allows for efficient distribution of controllers. While a clustered control architecture is described above, it is noted that the clustered architecture is merely illustrative of a suitable control architecture and that any suitable control architecture may be employed.

[0060] 39 may be directly connected to the master controller 1760. In this aspect, the master controller software manages (e.g., the master controller is configured to control) some aspects of the real-time control of the wafer handler's operation, and the local controllers manage (e.g., are configured to control) all low-level feedback and actuation aspects of the control architecture.

[0061] 39 and 15A-16C, according to aspects of the disclosed embodiment, the processor 3901 of the master controller 1760 is programmed with a dynamic model 3910 of the base 1510, with and without a payload thereon (e.g., substrate(s) S) (e.g., the dynamic model is stored in any suitable memory 3902 accessible by the processor 3901). The processor 3901 is also programmed with a dynamic model 3911 of the friction force μ between the substrate S and the end effector 1520. A mechatronics form factor 3912 (e.g., the number of electromagnets, the spacing between the electromagnets, the number of drive lines and their respective orientations, the thrust versus lift relationship, etc.) relative to the base 1510 may also be stored in the memory 3902 and accessible by the processor 3901.

[0062] The master controller 1760 is programmed or otherwise configured to determine the kinematic motion of the base 1510 from an initial substrate handler posture to a final substrate handler posture. The master controller 1760 is also programmed or otherwise configured to determine the attitude / yaw control kinematics (three degrees of freedom: pitch, roll, and yaw) associated with the determined kinematic motion. In one aspect, the attitude / yaw kinematic motion and kinematics are determined using one or more of the dynamic model 3910, the dynamic model 3911, and the form factor 3912, for example, in combination with a predetermined substrate process recipe (e.g., where and when the substrate is transferred and what process is to be performed on the substrate).

[0063] One method for controlling a machine such as the electric machines described herein is to calculate a trajectory for each of thrust (along the X and / or Y axes), lift (along the Z axis), roll, pitch, and yaw. Such a trajectory may be preferably defined by a series of position, velocity, and time values ​​that are preferably grouped into frames called PVT frames.

[0064] FIG. 40A shows an example PVT frame 4005. The PVT frame 4005 includes position data 4010 (which may include a start position (X, Y, Z), an end position (X, Y, Z), and an attitude (roll, pitch, yaw)), velocity data 4015, and time data 4020. In one aspect, the data is in binary format grouped together into one or more bytes. In another aspect, the position data 4010, velocity data 4015, and time data 4020 each occupy four bytes (while in other aspects, the position data 4010, velocity data 4015, and time data 4020 each occupy more or less than four bytes). The PVT frame 4005 may optionally include header information 4025 and trailing information 4030, both of which may include identification, parity, error correction, or other types of data. The PVT frame 4005 may include additional data of varying lengths or amounts between two or more of the header, position, velocity, time, and trailing data. It should be noted that the PVT frame 4005 is not limited to any particular length. In other aspects, the PVT frame is reduced to either a PT frame or a P frame only. Communications from the master controller 1760 to the cluster / local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DL3 may include various sets of values ​​peripherally related to the desired operation; for example, these values ​​may be frequency, phase offset, current and / or voltage values ​​of the electromagnets / coils under control. The master controller 1760 performs the desired algorithmic transformations (effectively for all coils via a hierarchical scheme of cluster and local controllers) and calculates and streams such quantities through the motion network.

[0065] A feature of aspects of the disclosed embodiment is to use these sets of values ​​as inputs to dynamic models 3910, 3911 of the controlled electric machine to calculate the theoretical lift and thrust forces exerted by a given electromagnet 1700A-1700n to cause base 1510 to follow a desired trajectory. A feature of aspects of the disclosed embodiment is also to use elements of the dynamic models 3910, 3911 to scale the feedback control signals used by local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB for each electromagnet under their control.

[0066] The lift, thrust, and scaling terms may advantageously account for nonlinearities and dynamic interconnections between the individual drive lines 177, 179A, 179B. The lift, thrust, and scaling terms may be referred to herein as feedforward terms, and the scaling terms may be referred to as gain terms.

[0067] As an example, using the electric machine 1599 shown in FIG. 39 (see also FIGS. 15A-16C), the master controller 1760 may generate a trajectory for each drive line 177, 179A, 179B in terms of a commanded position, velocity, and acceleration along which the substrate handler 1500 moves. Using an inverse motion model of one or more of the base 1510 and / or friction forces, the master controller 1760 may utilize the trajectory information to generate corresponding feedforward and gain terms. These terms may be grouped with the trajectory information in a frame specific to each drive line 177, 179A, 179B, referred to as a PVT-FG frame. FIG. 40B illustrates an exemplary PVT-FG frame 4095. The PVT-FG frame 4095 includes an optional header 4025, position data 4010, velocity data 4015, time data 4020, and optional trailing information 4030, similar to the PVT frame 4005. Additionally, the PVT-FG frame 4095 includes at least one feedforward term 4050 and at least one gain term 4060. The data may be in binary format grouped together with one or more bytes. In one embodiment of the PVT-FG frame 4095, the position data 4010, velocity data 4015, time data 4020, feedforward term 4050, and gain term 460 each occupy four bytes (while in other embodiments, they may each occupy more or less than four bytes). Like the PVT frame 4005, the PVT-FG frame 4095 may include other data of various lengths or amounts distributed between two or more of the various terms.

[0068] The PVT-FG frame (or PVT frame in other embodiments) may then be distributed over the control system network 3999. The cluster controllers 3950A-3950C receive the data and interpolate between two consecutive frames to obtain instantaneous position, velocity, feedforward terms, and gain values, and utilize this information to effect control of the substrate handler 1500. For example, each cluster controller 3950A-3950C utilizes the PVT-FG frame (or PVT frame in some embodiments) or other suitable information / commands from the master controller 1760 to generate thrust forces Fx (thrust along the X-axis), Fy (thrust along the Y-axis), and lift force Fz (along the Z-axis) to effect one or more of leveling, propulsion, and three-degree-of-freedom attitude control (roll, pitch, yaw) of the substrate handler 1500 and its base 1510. In some embodiments, the mechatronics form factor 3912 may not be programmed by the master controller 1760, or may be programmed at the cluster controller 3950A-3950C level in addition to, where the form factor establishes a lift force versus thrust force relationship(s) and is used to generate said lift and thrust forces with data provided by the master controller 1760. In other embodiments, the cluster controllers 3950A-3950C and local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB receive corresponding data from the master controller 1760 and utilize that data to control the electromagnets 1700A-1700n and movement of the substrate handler 1500 along one or more of the drive lines 177, 179A, 179B.

[0069] Cluster controllers 3950A-3950C (or alternatively local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) command the modulation of electromagnets 1700A-1700n, which commands are sent and received by the respective local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB, resulting in one or more of dynamic phase allocation and the creation of a substantial polyphase motor actuator unit, as described in more detail herein.

[0070] 21 illustrates exemplary controlled operation(s) of the substrate handler 1500 according to aspects of the disclosed embodiment related to increasing throughput of the substrate handler while transporting substrates S. Here, the controller 199 controls a predetermined reaction platen attitude in at least one of pitch (shown in FIGS. 15B, 21, and 27) and roll (shown in FIGS. 15A and 29), and controls a levitation force (e.g., FZ) generated by an array of electromagnets 1700 to impart a differential levitation force (illustrated in FIG. 21) across the base 1510, resulting in a controlled tilt (e.g., e+ or e−) of the base 1510 relative to the drive surface 1598. T , F.Z. L ) to produce a predetermined bias attitude BA+ or BA− of the base 1510 relative to the drive surface 1598 that applies a bias reaction force F2 ( FIG. 23 ) from a base payload seating surface (e.g., substrate seating surface 1520SS of end effector 1520 ( FIGS. 23, 25A, 25B ) or a seating surface defined by the substrate supports of carts 1431-1433 of cart 1500C) on a substrate S supported by the base seating surface in a direction that counteracts the payload inertial force resulting from acceleration of the reaction platen along the drive surface 1598. T , F.Z. L) The controller 199 is configured to determine the acceleration of the base 1510 (and its substrate handler) along the drive surface 1598 from changes in the position of the base 1510 sensed by at least the sensor 2000, and to control the bias attitude of the base 1510 in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from the acceleration of the base 1510. In other aspects, the controller 199 may apply a predetermined acceleration from a commanded trajectory for control of the bias attitude. Here, the controller 199 controls the excitation of electromagnets 1700A-1700n of the substantially moving motor actuator unit of the array of electromagnets 1700 to set a bias position BA+ or BA- to urge the base 1510 against inertial forces that tend to seat and displace the substrate S (e.g., on its end effector 1520 or on its substrate supports 1431-1433) relative to the base 1510 along a seating area between the substrate S and the base 1510 (see, for example, Figures 23, 25A, and 25B).

[0071] As an example of countering payload inertial forces, starting from the left side of Figure 21, a substrate handler 1500 (which may be any of the substrate handlers described herein) is shown at the start of movement in direction 2122 of Figure 21. As the substrate handler begins to move, a series of thrust force vectors FP and lift force vectors FZ are generated by a control system (e.g., actuator control system network 1799 and sensor control system network 1899, which may be part of the controller 199), causing the substrate handler 1500 to accelerate in the direction of movement (e.g., the end effector 1520 is tilted, e.g., in a clockwise direction) at an increased pitch angle e+. To produce the increased pitch angle e+, the lift force vector FZ is forced to increase by a trailing lift force vector FZ T The magnitude of the leading lift vector FZ L(where leading and trailing are relative to the direction of motion). When the substrate handler reaches approximately its midpoint towards the end of its motion (e.g., when the acceleration of the substrate handler 1500 is substantially zero), the magnitude of the pitch angle e+ is reduced, causing the tilted orientation of the end effector 1520 to flip from a clockwise orientation to zero (e.g., approximately parallel to the horizontal reference plane 1299, relative to the magnitude of the trailing lift vector FZ T and the leading lift vector FZ L At this point in the trajectory, the substrate handler 1500 begins a deceleration phase in which the pitch angle e− is decreased so that the end effector 1520 pitches to a counterclockwise orientation. To produce the decreased pitch angle e−, the lift vector FZ is forced to move in a direction perpendicular to the trailing lift vector FZ T The magnitude of the leading lift vector FZ L When the substrate handler 1500 reaches its final destination, the pitch angle e is increased to zero so that the tilted orientation of the end effector 1520 is approximately parallel to the horizontal reference plane 1299, as it was at the start of the operation.

[0072] As can be appreciated, the pitch of the end effector is increased or decreased to accommodate acceleration and deceleration of the substrate handler 1500 while moving along a generally straight / linear path (such as along drive lines 177-180) without substantial slippage of the substrate S relative to the end effector, although in other embodiments the roll r and / or pitch e of the substrate handler 1500 may be increased or decreased to result in higher rotational acceleration of the substrate handler 1500 (such as about one or more of axes 1277, 1377) in a manner generally similar to that described above with respect to linear motion (lift force vector FZ). left is the lift vector FZ right See FIG. 21A, which illustrates a rotational end effector roll with roll control as shown in FIG. 15A, which is greater than that shown in FIG.

[0073] The motion control illustrated in FIG. 21 results in substantially faster substrate motion transport (e.g., higher acceleration without substantial slippage of the substrate relative to the end effector) compared to conventional substrate transport where the end effector is parallel to the wafer transport plane throughout the end effector motion. As an example, if the pitch angle e in FIG. 21 is set to zero during the entire motion (as in conventional substrate transport apparatus), the maximum allowable thrust acceleration is limited to the static coefficient of friction (μ) between the substrate S and the contact surface of the end effector 1520. This is illustrated in FIG. 22 and constitutes a typical use case in conventional substrate transport apparatus where the substrate S is held by its backside in contact with the end effector. As can be seen in FIG. 22, the maximum acceleration applied to the substrate S is μg before wafer slippage occurs, where “g” is the acceleration of gravity (approximately 9.8 m / s 2 ), μ is the coefficient of friction, M is the mass of the substrate, W is the weight of the substrate, and N is the normal force.

[0074] FIG. 23 illustrates the case where a substrate S (having mass m) is carried by a substrate handler 1500 (having mass M) at a pitch angle e while the substrate handler 1500 is accelerated in the X direction. The force diagram in FIG. 23 illustrates the dynamics of the motion of the substrate S and the substrate handler 1500. In FIG. 23, the substrate handler 1500 is accelerated along the propulsion direction X with an acceleration a. The resulting force on the substrate handler is represented by the variable F1. The acceleration a along the X direction affects a reaction (normal) force N on the substrate S such that, when added to the weight of the substrate W, a wafer force F2 results. It is possible to relate the angle e and the acceleration a such that the substrate S does not substantially slip relative to the end effector 1520 of the substrate handler 1500. To substantially prevent wafer slippage, two situations can be considered for clarity. First, it is assumed that there is no friction between the substrate and the end effector 1520. Figure 24 illustrates a free body diagram of the substrate S on the end effector 1520 in the absence of friction μ. As can be seen in Figure 24, despite the absence of friction μ, the acceleration a can be determined with respect to the pitch angle e as the substrate mass m moves along the X direction. This relationship is expressed in equation (4) below: a = g tan e [4] In the formula, g is the gravitational acceleration (9.8 m / s 2 ) FIG. 24A illustrates the slippage region of the wafer with respect to pitch angle e. It is noted that when the pitch angle e is near zero, the substrate S will slip relative to the end effector 1520 without friction μ. The curve illustrated in FIG. 24A represents the desired pitch angle “e” to maintain the substrate S moving along the X direction with acceleration “a” without slippage. Alternatively, the same curve in FIG. 24A can be interpreted as the acceleration “a” required of the substrate handler 1500 to prevent the substrate S from slipping while moving along the X direction at pitch angle “e”. Deviations from the curve illustrated in FIG. 24A will cause the substrate S to slide either “downhill” or “uphill” (here the terms downhill and uphill are used for convenience with respect to pitch) relative to the end effector 1520 depending on the acceleration value.

[0075] 25A and 25B show the effect of a non-zero static friction coefficient μ on the relationship between acceleration a and pitch angle e. For example, FIG. 25A illustrates the minimum thrust acceleration before slippage of the substrate S relative to the end effector 1520 occurs. In this case, the friction force direction is "tilt up" to substantially prevent the wafer mass m from sliding "tilt down" (again relative to the direction of pitch). The expected "slowest" acceleration to prevent wafer slippage is now calculated as follows: a min =[-μ + tan e] / [1 + μ tan e] [5]

[0076] 25B illustrates the case of the maximum (e.g., fastest) expected propulsive acceleration a prior to sliding of the substrate S relative to the end effector 1520. In this case, the friction force direction exhibits a "downward tilt" to substantially prevent the wafer mass m from sliding at an "upward tilt" (again relative to the direction of pitch). The expected "fastest" acceleration a is now calculated as follows: a max =[μ + tan e] / [1 - μ tan e] [6]

[0077] As a result, in the presence of a non-zero coefficient of static friction μ, the propulsion acceleration a will remain within the following limit to prevent slippage of the substrate S for a given pitch angle: a min < a < a max [7]

[0078] FIG. 26 presents an example of the dependence between acceleration a and pitch angle e for a static coefficient of μ of about 0.1, a typical value for substrate handlers used in high-temperature applications. The curves in FIG. 24A are repeated in FIG. 26 for the case of μ equal to about 0. The region between the upper and lower curves (μ equal to about 0.1) represents the non-slip region (e.g., the acceleration region for a given pitch angle where substantially no substrate slippage occurs relative to the end effector). Regions outside this region may have wafer slippage in either the upward or downward direction relative to the tilt of the substrate handler (i.e., pitch angle e). In the example of FIG. 26, the maximum acceleration at a substantially zero pitch angle is about 0.1 g, which is the fastest acceleration a conventional substrate handler can provide for a typical high-temperature application. When the pitch angle e is set to about a 16-degree tilt, substrates can be transported with accelerations as high as 0.4 g using the same end effector material (as in a conventional substrate handler), which may constitute a significant throughput improvement compared to conventional substrate handlers. The pitch angle e can be set according to a given acceleration to maximize throughput, such as that shown in FIG.

[0079] 27 illustrates active control of the orientation of the substrate handler 1500 in roll, pitch, and yaw with respect to leveling the substrate handler 1500 relative to a substrate station, such as a process module 120. Mechanical deflections pose challenges in entering and exiting process module openings 2780, which have increasingly smaller heights H3 due to the demands of optimizing processing time for the process module 120. Note that conventional substrate transport apparatuses generally suffer from inherent potential mechanical deflections due to the presence of articulating links with bearings that add weight and reduce stiffness, and compensation for the end effector orientation as the wafer passes through the process module opening 2780 may be impractical. In these cases, compliance with more restrictive mechanical deflection constraints becomes increasingly difficult. Aspects of the disclosed embodiments provide a solution to mechanical deflection that dynamically compensates for mechanical deflection by controlling the orientation of the substrate handler in space relative to a horizontal reference plane (e.g., by adjusting the roll, pitch, and yaw angles as described herein), so that the substrate passes through the opening 2780 of the process module without substantial contact between the substrate S and the opening 2780, and without substantial contact between the end effector 1520 and the opening 2780.

[0080] 15A-16C illustrate controlled adjustment of the roll and yaw angles of the substrate handler 1500, in addition to the pitch angle, by the local drive controllers 1750A-1750n and local sensor controllers 1850A-1850n. Also referring to FIG. 27 , controlled adjustment of each of the roll, yaw, and pitch angles (e.g., by differentially varying at least the lift force vectors acting on the base 1510 as described herein) results in leveling of the position of the substrate handler 1500 at any suitable substrate holding station, such as a process module 120, such that a plane 2770 of the substrate S (and the end effector 1520 on which the substrate S is supported) is approximately the same as a plane 2771 defined by a substrate support surface 2760 of the substrate holding station 120. In some embodiments, the roll, yaw, and pitch angles are adjusted independently of one another. Controlled adjustment of the orientation angles (e.g., roll, pitch, and yaw) of the substrate handler 1500 also compensates for mechanical deflections of the end effector 1520 due to, for example, the substrate loading as well as the structure of the substrate handler 1500.

[0081] 8-11, 28, and 29, as noted above, in some embodiments, multiple drive lines 177, 178 are provided extending longitudinally along the length of the transport chamber 118, allowing one substrate handler 1500 to pass another along the length of the transport chamber 118. FIG. 28 illustrates two substrate handlers 1500A, 1500B passing each other, with substrate handler 1500A traveling along an inbound track 1550A and substrate handler 1500B traveling along an outbound track 1550B, each of which has roll, pitch, and yaw angles such that the plane 2770 of the end effector 1520 (and the substrate S held thereon) is approximately parallel (i.e., horizontal) to the horizontal reference plane 1299. Here, with the end effector 1520 horizontal, the transport chamber 118 has a lateral width W1. However, according to aspects of the disclosed embodiment, the width of the transport chamber 118 may be minimized or otherwise reduced from lateral width W1 to lateral width W2 by adjusting one or more of the roll, pitch, and yaw of the substrate handlers 1500A, 1500B as they pass each other along the length of the transport chamber 118. For example, as illustrated in FIG. 29 , the roll angle of each substrate handler 1500A, 1500B may be adjusted to a predetermined angle β relative to the horizontal reference plane 1299 to avoid contact between the substrate handlers 1500A, 1500B as they move past each other during a period of time when both substrate handlers 1500A, 1500B would otherwise occupy the same space. The predetermined roll angle β may depend on the configuration of the end effector (e.g., to prevent the substrate S from slipping relative to the end effector). As can be appreciated, there are advantages to having control over the roll, pitch, and / or yaw angles of each substrate handler 1500 to reduce the footprint of the transport chamber 118 housing the wafer handling automation equipment, whereby reduced footprint can increase tool density at least on the manufacturing facility floor and reduce pump-down times of the transport chamber, resulting in increased throughput.

[0082] 17 and 30, an exemplary control of an array of electromagnets 1700 utilizing dynamic phase allocation is depicted. As described herein, a controller 199 (which in one aspect is a clustered controller or a master controller as described herein (see FIG. 39)) is operably coupled to the array of electromagnets 1700 and an AC power supply 1585 (the power supply may be of any suitable type and may be DC, in which case a controller drive circuit modulates it to a desired frequency / phase for a desired number of AC power phases) and configured to sequentially excite the electromagnets 1700A-1700n with polyphase AC, such that the base 1510 of the substrate handler 1500 is levitated and propelled by at least one of attitude control and yaw control via a common set of electromagnets 1700A-1700n (such as the electromagnets of respective drive lines 177-180). As described above, the controller 199 is configured to sequentially excite the associated electromagnets 1700A-1700n with polyphase AC excitation, forming the motor actuator unit 1701 corresponding to the position of the base 1510 sensed by the sensor 2000. The number n of the electromagnets 1700A-1700n of each motor actuator unit 1701 (in this embodiment, an integer of three or more, but in other embodiments, may be two or more) and the (static) positions of each of the n electromagnets 1700A-1700n of each motor actuator unit 1701 can be dynamically selected by the controller 199 to effect levitation and propulsion of the base (secondary side) 1510 at any point throughout the operation of the motor actuator. Each of the electromagnets 1700A-1700n generates both separately controllable levitation and propulsion forces on the base 1510 from excitation by a common polyphase alternating current having a single common frequency per phase, to control the base 1510 in up to six independent degrees of freedom, including at least one of the attitude and yaw of the base 1510 while it is levitated.The common single frequency for each phase (here, each of phases A, B, and C) can be selectively variable from a variety of desired excitation frequencies such that the levitation and propulsion forces generated by the motor actuator units 1701 enable substantially independent control of the base 1510 in each of up to six independent degrees of freedom. In one embodiment, the controller 199 controls the roll, pitch, and yaw angles generated by the array of electromagnets 1700A-1700n disposed in each motor actuator unit 1701, including at least the attitude, of the base 1510 in a levitated and propulsive state, such that the base 1510 moves relative to the array of electromagnets 1700 along at least one drive line 177-180 from a first predetermined position P1 (see FIG. 1B) relative to the frame of the chamber 118 to a second, different predetermined position P2 (see FIG. 1B) relative to the frame of the chamber 118. In one embodiment, the controller 199 controls the roll, pitch, and yaw angles generated by the array of electromagnets 1700, including at least the attitude of the base 1510 and the yaw of the base 1510, while the base 1510 is levitated and stationary relative to the array of electromagnets 1700 at a predetermined position (such as position P2 in FIG. 1B) along at least one drive line 177-180 relative to the frame of the chamber 118.

[0083] 32A and 32B illustrate an example in which each electromagnet (or coil unit) 1700A-1700n grouped to define a motor actuator unit 1701 having a dynamically selected number of electromagnets, for example, three electromagnets (n=3), and three corresponding phases (m=3) with an electrical angle between phases of 120° (see also FIG. 17), is also dynamically associated with three different phases A, B, C, such that the association of each phase A, B, C with a corresponding electrostatic magnet 1700A-1700n adapts to the dynamic state of the motor actuator unit 1701. Thus, as the electromagnets of the motor actuator unit 1701 propel the base 1510 (e.g., along direction 3100), each phase A, B, C changes or moves, respectively, from one static electromagnet to another static electromagnet (i.e., progresses in the assignment or allocation of each phase to successive electromagnets 1700A-1700n to generate substantial (operating) multi-phase actuator units 3000, 3000tP1, 3000tP2 of each of the linear electric machines 1599 and 1599R, which proceed in the direction of motion 3100, corresponding to the motion of the base 1510 generated by the excitation of the electromagnets 1700A-1700n corresponding to the substantial operating multi-phase actuating units 3000, 3000tP1, 3000tP2). This dynamic relationship or association between the coil units and phases that produces the substantially operative multi-phase actuator unit 3000, 3000tP1, 3000tP2 is conveniently referred to herein as "dynamic phase allocation," where the substantially operative multi-phase actuator unit 3000, 3000tP1, 3000tP2, which produces a motive force for the base 1510, is illustrated schematically in FIG. 30 (see also FIG. 17). Here, the substantially operative multi-phase actuator unit (or "MAU" in FIG. 17) 3000 has three dynamically selected electromagnets and associated phases A, B, C, shown at an initial (representative) position P=0 at time t=t0. Energization of each of the electromagnets of the substantially operative multi-phase actuator unit 3000 produces a motive force that moves the platen / base 1510 between t1 and t2 (see also FIGS. 32A-32B).Here, as shown, at p=0 and t=t0, electromagnets 1700A-1700C are grouped to form a substantially operative multi-phase actuator unit 3000 and are associated with phases A, B, and C, respectively. Concurrent with the generation of a thrust force Fx, the energization of each of the electromagnets 1700A-1700C of the substantially operative multi-phase actuator unit 3000 generates an independently controllable lift force Fy having a controlled variable height relative to the platen / base 1510, thereby simultaneously levitating the platen / base 1510 and providing tilt adjustment (see FIGS. 32A-32B). As can be seen, at time t=t0 and position P=0, under the influence of the lift force Fy and thrust force Fx imparted by each electromagnet 1700A-17G0C of the substantially operating multi-phase actuator unit 3000, the platen / base 1510 moves (relative to the transport chamber, and therefore the electrostatic magnets 1700A-1700C) with a predetermined levitation and tilt. To maintain a steady state tilt of the platen / base 1510 during movement away from the group of electromagnets 1700A-1700C (which define a substantially operative multi-phase actuator unit 3000 at P=0 and T=T0), the controller 199 and circuitry 3050 for each electromagnet in the electromagnet array 1700A-1700n corresponds to movement of the platen / base 1510 at time t=t1 and position P=1 to a corresponding electromagnet 1700B-1700D which now defines a substantially operative multi-phase actuator unit 3000tP1 located at position P=1 at time t=t1 (initial substantially operative multi-phase actuator unit 3000tP1 at P=0 and t=t0). 17. The platen / base 1510 is configured to dynamically "move" (or "change") the assignment of each phase A, B, C (from the substantially operational multi-phase actuator unit 3000tP1 at P=1 and t=t1) corresponding to the movement of the platen / base 1510 at time t=t2 and position P=2 to corresponding electromagnets 1700C-1700E which now define the substantially operational multi-phase actuator unit 3000tP2 located at position P=2 at time t=t2.The dynamic phase allocation is repeated throughout the operation of the platen / base 1510 so that the phase distribution for the platen and the excitation by each phase (here A, B, C) of the platen / base 1510 remains substantially steady throughout the operation of the platen / base 1510.

[0084] The substantial multi-phase actuator units 3000, 3000tP1, 3000tP2 may comprise a series of electromagnets 1700A-1700n of an array of electromagnets 1700 coupled to at least one multi-phase AC power source 1585 defining at least one drive line 177-180 within the drive surface 1598, wherein the electromagnets 1700A-1700n of the series of electromagnets 1700A-1700n are dynamically grouped into at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3, each of the at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3 coupled to at least the multi-phase AC power source 1585. In this case, at the start of propulsion (resulting in movement of the base / secondary) by energizing the corresponding electromagnet groups of the motor actuation units at an initial position (P=0, t-0), the definition of phases A, B, C and associated "motors" (e.g., DLIM1, DLIM2, DLIM3) varies in space and time (Pi, t i) as described above to maintain substantially steady-state force vectors FZ1, FZ2, FX1, FX2 imparted to the base 1510 throughout its range of motion, thereby resulting in a desired substantially steady-state or constant tilt orientation of the substrate handler 1500 throughout its range of motion. An exemplary actuator control system network 1799 configured to provide dynamic phase allocation as described herein is depicted with reference to FIG. As can be seen in Figures 32A and 32B, the dynamic phase allocation is controlled by the controller 199 so that each electromagnet 1700A-1700n grouped in a corresponding motor actuation unit (such as those described herein) energized by polyphase alternating currents A, B, C imparts a substantially steady-state polyphase distribution across each electromagnet 1700A-1700n of at least one polyphase actuator unit DLIM1, DLIM2, DLIM3 that moves substantially relative to the base 1510 (represented by the front portion 3110 and the rear portion 3111).Phase currents A, B, and C are illustrated within each electromagnet 1700A to 1700n, and it is noted that the phase current distribution across at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3 remains constant or steady state relative to the base 1510 (for example, as an example of a steady state, phase current A remains at the end of the rear 3111, phase current C remains at the tip of the rear 3111, and phase current B remains at the center of the rear 3111 throughout the movement of the base 1510 and at least one (substantially moving) multi-phase actuator unit DLIM1, DLIM2, DLIM3 in direction 3100).

[0085] As further detail on dynamic phase allocation, Figure 30 shows electromagnets 1700A, 1700B, 1700C at time tl defined as phases A, B, C (Figures 30 and 32A) respectively generating spatial force vector(s) resulting in separately controllable lift and thrust forces for a given substrate handler 1500 (i.e., a wafer handler identified by sensor 2000 and selected for movement by controller 199). As the substrate handler 1500 moves through space (e.g., along drive lines associated with the array of electromagnets 1700), at time t2, electromagnets 1700B, 1700C, 1700D are at phases A, B, C, respectively (Figures 30 and 32B). As the substrate handler 1500 continues to move along the drive line (which in this example is in direction 3100 as shown in FIGS. 32A, 32B, and 32C), at time t3, phases A, B, and C are associated with electromagnets 1700C, 1700D, and 1700E, respectively. This dynamic phase allocation results in continuous spatial and temporal control of the force vectors that maintain the propulsion, levitation, and orientation of a given substrate handler 1500. In one embodiment, an AC power supply 1585 is coupled to each of the electromagnets 1700A-1700n in the array of electromagnets 1700 via any suitable signal conditioning circuitry 3050, which may include a current amplifier power supply unit 3011 or any other suitable signal conditioning. The phase A, B, and C currents are provided to respective local drive controllers 1750A-1750n which, under the control of or in response to commands from the master controller 1760, provide a designated one of the phase A, B, and C currents to their respective electromagnets in the manner described above to effect dynamic phase allocation.

[0086] As described herein, the base 1510 of the substrate handler ( FIG. 16B ) cooperates with electromagnets 1700A-1700n of at least one multi-phase actuator unit ( FIG. 32B ) DLIM, DLIM2, DLIM3, such that excitation of the electromagnets 1700A-1700n with alternating current generates levitation and propulsion forces on the base 1510, controllably levitating and propelling the base 1510 along at least one drive line 177-180 at a controlled attitude relative to a drive surface 1598. A controller 199 (which in some embodiments includes at least a master controller 1760 and any controllers slaved to the master controller, such as local drive controllers 1750A-1750n, although in other embodiments the controllers may have any suitable configuration) is operably coupled to the AC power source 1585 and the array of electromagnets 1700. The AC power source 1585 may include any suitable associated circuitry 3050 through which it is connected to the array of electromagnets 1700. The AC power source 1585 is controlled by any other suitable controller, such as a local drive controller or master controller 1760. Typical control parameters for the AC power source consist of signal amplitude, signal frequency, and phase shift relative to a reference coil unit. Other types of control parameters may also be defined. As used herein, "phases" A, B, C as illustrated in FIG. 30 are analogous to particular coils in a polyphase electric motor, although the phase definitions (such as A, B, C in FIG. 30) are not physically bound to any particular coils.

[0087] In comparison to the prior art, segmented linear induction motors using static phase assignments, when used with their own dedicated controls, would have difficulty providing angle / tilt control as the substrate handler transitions from one segment to the next. Figures 31A and 31B illustrate the problem of maintaining pitch control across a static segmented linear induction motor. Figure 31A shows the front 3110 and rear 3111 of a base 1510 or secondary with induced forces along the Z and X axes. A first motor segment (SLIM1) with phases A, B, and C generates forces Fz1 and Fx1 to levitate and propel the rear 3111 of the base. A second motor segment (SLIM2) uses its respective phases A, B, and C to generate forces Fz2 and Fx2 for the front 3110 of the base. As the base moves in direction 3100, the front 3110 and rear 3111 of the base transition to the next linear induction motor segment. This is shown in Figure 31B. In this position, the rear part 3111 of the base overlaps with phases B and C of SLIM1 and phase A of SLIM2. At the same time, the front part 3110 of the base overlaps with phases B and C of SLIM2 and phase A of SLIM3. As a result, it is not possible to maintain the same required forces Fz1, Fx1, Fz2, Fx2, for example, because the phase of SLIM2 is shared by both the front part 3110 and the rear part 3111 of the base.

[0088] As mentioned above, and now referring to FIG. 32C in one embodiment, simultaneous and separate control of propulsion and levitation (thus propulsion and lift forces may be completely separately controllable, whereby control of each may be considered independent of one another, but both forces are provided by excitation with a common polyphase alternating current having a single common frequency per phase, which common frequency per phase is selectively variable from different desired frequencies) may be provided by variations of the dynamic phase allocation described herein, where one or more dynamic linear motors (DLIMs) may include n selectable phases associated with electromagnets that define a substantially operative polyphase actuator unit, where n may be an integer greater than 3. The number n of electromagnets that define the substantially operative polyphase actuator unit may be dynamically selected to provide various movements of the platen / base 1510 depending, for example, on the kinematic characteristics of the desired movement. Here, the commonly applied excitation frequency per phase of the substantially operative polyphase actuator unit is selected by the controller 199 to produce the desired kinematic performance and control of the platen / base 1510. Here, the phase control algorithm maintains the same electrical phase angle difference between phases (e.g., electromagnets of the motor) as shown in FIG. 32C. The electrical phase difference is calculated relative to a reference phase or for each phase. The electrical phase angle difference φ between the phases can range from approximately −180 degrees to approximately 180 degrees, where a value of approximately 0 degrees means no thrust, while positive and negative values ​​result in thrust in positive and negative directions, respectively. Depending on the value of the electrical phase angle difference φ, the number of electromagnets in each dynamic linear motor changes. Here, the boundary between DLIM1 (illustrated with six electromagnets for illustrative purposes) and DLIM2 as shown in FIG. 32C is dynamic. In another aspect of electromagnet / phase assignment of a dynamic linear motor, not all electromagnets of a dynamic linear motor need be energized simultaneously.Referring to DLIM1, only m (in this example m=4) electromagnets (where m is the number of electromagnets covered by the base (or secondary)) out of all n (in this example n=6) electromagnets of the dynamic linear motor DLIM1 can be energized to provide levitation and propulsion of the base 1510, while other electromagnets of the n electromagnets of the dynamic linear motor DLIM1 can be turned off.

[0089] 1A-11, 15A-15C, 17, 28, 29, 30, and 41, for example, an exemplary method is described for a linear electric machine 1599 in accordance with one or more aspects of the disclosed embodiments. In the method, a frame is provided for the linear electric machine 1599 (FIG. 41, block 4100), where the frame has a horizontal reference plane 1299. A drive surface 1598 is formed with an array of electromagnets 1700 connected to the frame (FIG. 41, block 4110). The drive surface 1598 is positioned at a predetermined height H relative to the horizontal reference plane 1299. The array of electromagnets 1700 is arranged such that a series of electromagnets in the electromagnet array define at least one drive line 177, 178 in a drive surface 1598, and each of the electromagnets 1700A-1700n (see FIG. 15B) is coupled to an alternating current (AC) power supply 1585 that energizes each electromagnet 1700A-1700n. At least one reaction platen 1510 is provided ( FIG. 41 , block 4120), wherein the at least one reaction platen 1510 is made of a paramagnetic, diamagnetic, or non-magnetic conductive material that is arranged to cooperate with the electromagnets 1700A-1700n in the array of electromagnets 1700. The electromagnets 1700A-1700n are energized with alternating current to generate a levitation force FZ and a propulsion force FP on the reaction platen 1510 that controllably levitates and propels the reaction platen 1510 along at least one drive line at a controlled attitude relative to the drive surface 1598 (Figure 41, block 4130).In the method for the linear electric machine 1599, the electromagnets 1700A-1700n are sequentially energized with polyphase alternating current by a controller 199 operatively coupled to the array of electromagnets 1700 and to an AC power source 1585, such that each reaction platen 1510 is levitated and propelled in up to six degrees of freedom, including at least one of attitude control and yaw control, by a common set of electromagnets 1700A-1700n, each of which generates both a levitation force FZ and a propulsion force FP on the reaction platen 1510 from excitation by a common polyphase alternating current having a single common frequency per phase, so as to control the reaction platen 1510 in up to six degrees of freedom, including at least one of reaction platen attitude and reaction platen yaw, with the reaction platen 1510 at least in a state where the reaction platen 1510 is levitated.

[0090] 1A-11, 15A-15C, 17, 28, 29, 30, and 42, for example, a method for an electromagnetic conveyor substrate transport apparatus 1599 is depicted in accordance with one or more aspects of the disclosed embodiment. In the method, the electromagnetic conveyor substrate transport apparatus 1599 is provided with a chamber 118 (FIG. 42, block 4200), configured to hold a sealed atmosphere therein and having a horizontal reference surface 1299 and at least one substrate passage opening 1180, and transports substrates into and out of the chamber 118 via the substrate passage opening 1180. An array of electromagnets 1700 is formed on the drive surface 1598 and connected to the chamber 118 (FIG. 42, block 4210). The drive surface 1598 is positioned at a predetermined height H relative to the horizontal reference surface 1299. The array of electromagnets 1700 is arranged such that a series of electromagnets 1700A-1700n in the array of electromagnets 1700 define at least one drive line 177, 178 in the drive surface 1598, and the electromagnets 1700A-1700n in the series of electromagnets 1700A-1700n are grouped into at least one multi-phase actuator unit, each of the at least one multi-phase actuator unit being coupled to a multi-phase alternating current (AC) power source 1585. At least one reaction platen 1510 is provided ( FIG. 42 , block 4220), wherein the at least one reaction platen 1510 is made of a paramagnetic, diamagnetic, or non-magnetic conductive material arranged to cooperate with the electromagnets 1700A-1700n of the at least one multi-phase actuator unit. The electromagnets 1700A-1700n are energized with alternating current and generate a levitation force FZ and a propulsion force FP on the reaction platen 1510 that controllably levitates and propels the reaction platen 1510 along at least one drive line 177, 178 in a controlled orientation relative to the drive surface 1598 (Figure 42, block 4230).The electromagnets 1700A-1700n are sequentially excited by polyphase AC by a controller 199 operatively coupled to the array of electromagnets 1700 and to an AC power supply 1585 to levitate and propel the reaction platen 1510, wherein each AC phase of the polyphase AC is dynamically allocated between each electromagnet 1700A-1700n of the electromagnet group of at least one polyphase actuator unit such that the AC phase of each respective electromagnet 1700A-1700n changes from a first AC phase to a second, different AC phase, so that, in effect, the electromagnet group moves substantially and at least one polyphase actuator unit formed by the electromagnet group moves substantially along drive lines 177, 178 due to the dynamic phase allocation.

[0091] In accordance with one or more aspects of the disclosed embodiment a linear electric machine includes: a frame having a horizontal reference plane; an electromagnet array connected to the frame to define a drive plane at a predetermined height relative to a horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive plane, each of the electromagnets being coupled to an AC power source that energizes each of the electromagnets; at least one reaction platen made of a paramagnetic, diamagnetic, or non-magnetic conductive material, arranged in cooperation with the electromagnets of the electromagnet array such that excitation of the electromagnets with an alternating current generates levitation and propulsion forces on the reaction platen that controllably levitate and propel the reaction platen along at least one drive line at a controlled attitude relative to the drive surface; a controller operatively coupled to the electromagnet array and the AC power source, configured to sequentially excite the electromagnets with polyphase AC such that each reaction platen is levitated and propelled with up to six degrees of freedom, including at least one of attitude control and yaw control, by the common set of electromagnets, each of the electromagnets generating both levitation and propulsion forces on the reaction platen from excitation with the common polyphase AC having a single common frequency per phase, so as to control the reaction platen with up to six degrees of freedom, including at least one of reaction platen attitude and reaction platen yaw, at least with the reaction platen levitated; Equipped with.

[0092] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the attitude of the reaction platen, while levitated and propelled, such that the reaction platen moves relative to the electromagnet array from a first predetermined position relative to the frame to a second, different predetermined position relative to the frame along at least one drive line.

[0093] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the reaction platen's attitude and reaction platen's yaw, with the reaction platen levitated and stationary relative to the electromagnet array at a predetermined position along at least one drive line relative to the frame.

[0094] In accordance with one or more aspects of the disclosed embodiment, the controller controls a thrust force generated by an electromagnet array across the reaction platen to impart a controlled yaw moment to the reaction platen, causing the reaction platen to yaw about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame.

[0095] In accordance with one or more aspects of the disclosed embodiment, the controller controls the thrust generated by the electromagnet array to impart a force couple to the reaction platen that effects yaw control of the reaction platen to effect at least one of positioning and centering of a wafer payload on the reaction platen relative to a predetermined wafer-holding position of the frame.

[0096] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the reaction platen that results in a controlled tilt of the reaction platen relative to the drive surface, controlling a predetermined reaction platen attitude in at least one of reaction platen pitch and reaction platen roll.

[0097] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to result in a predetermined bias attitude of the reaction platen relative to the drive surface that imparts a bias reaction force from the reaction platen payload seating surface on a payload supported by the reaction platen seating surface in a direction that counteracts a payload inertial force resulting from acceleration of the reaction platen along the drive surface.

[0098] In accordance with one or more aspects of the disclosed embodiment, the linear electric machine further comprises position feedback sensors distributed on the frame, the position feedback sensors configured to sense a position of the reaction platen along the drive surface and communicatively coupled to the controller such that the controller registers the sensed position of the reaction platen, the controller configured to sequentially energize electromagnets of the electromagnet array corresponding to the sensed position.

[0099] According to one or more aspects of the disclosed embodiment, the controller is configured to determine an acceleration of the reaction platen along the drive surface from at least the sensed change in position, and to control a bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from the acceleration of the reaction platen.

[0100] According to one or more aspects of the disclosed embodiment, the controller controls the energization of the electromagnets of the electromagnet array to set the attitude of the reaction platen and urge the reaction platen against inertial forces that tend to displace a payload seated on the reaction platen relative to the reaction platen along a seating area between the payload and the reaction platen.

[0101] In accordance with one or more aspects of the disclosed embodiment an electromagnetic conveyor substrate transport apparatus includes: a chamber configured to hold a sealed atmosphere therein, the chamber having a horizontal reference surface and at least one substrate passage opening for transferring a substrate into and out of the chamber through the opening; an electromagnet array connected to the chamber to define a drive surface at a predetermined height relative to a horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line in the drive surface, the electromagnets in the series of electromagnets being grouped into at least one multi-phase actuator unit, each of the at least one multi-phase actuator unit being coupled to a multi-phase AC power source; at least one reaction platen made of a paramagnetic, diamagnetic, or non-magnetic conductive material, arranged to cooperate with the electromagnets of the at least one multi-phase actuator unit such that excitation of the electromagnets with an alternating current generates a levitation and propulsion force on the reaction platen that controllably levitates and propels the reaction platen along at least one drive line at a controlled attitude relative to the drive surface; a controller operably coupled to the electromagnet array and the AC power supply and configured to sequentially energize the electromagnets with polyphase AC so as to levitate and propel the reaction platen; Equipped with Each AC phase of the multi-phase AC current is dynamically allocated among the respective electromagnets of the electromagnet groups of the at least one multi-phase actuator unit such that the AC phase of each respective electromagnet of the electromagnet groups changes from a first AC phase to a second different AC phase, thereby effectively causing the electromagnet groups to move substantially, and at least one multi-phase actuator unit formed by the electromagnet groups to move substantially along the drive line due to the dynamic phase allocation.

[0102] In accordance with one or more aspects of the disclosed embodiment, the reaction platen is levitated and propelled with up to six degrees of freedom, including at least one of attitude control and yaw control, by at least one multi-phase actuator unit that moves substantially.

[0103] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the attitude of the reaction platen, while levitated and propelled, such that the reaction platen moves relative to the electromagnet array from a first predetermined position relative to the chamber to a second, different predetermined position relative to the chamber along at least one drive line.

[0104] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the reaction platen's attitude and reaction platen's yaw, with the reaction platen levitated and stationary relative to the electromagnet array at a predetermined position relative to the chamber along at least one drive line.

[0105] In accordance with one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled such that the substantially moving at least one multi-phase actuator unit moves substantially along the drive line in a manner that generally coincides with the movement of the reaction platen along the drive line under the impetus of the substantially moving at least one multi-phase actuator unit.

[0106] In accordance with one or more aspects of the disclosed embodiment, the controller controls a thrust force generated by the electromagnet array across the reaction platen to impart a controlled yaw moment to the reaction platen, causing the reaction platen to yaw about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the chamber to a second, different predetermined orientation relative to the chamber.

[0107] In accordance with one or more aspects of the disclosed embodiment, the controller controls the thrust generated by the electromagnet array to impart a force couple to the reaction platen that provides yaw control of the reaction platen to provide at least one of positioning and centering of a wafer payload on the reaction platen relative to a predetermined wafer-holding position of the chamber.

[0108] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the reaction platen that results in a controlled tilt of the reaction platen relative to the drive surface, controlling a predetermined reaction platen attitude in at least one of reaction platen pitch and reaction platen roll.

[0109] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to result in a predetermined bias attitude of the reaction platen relative to the drive surface that imparts a bias reaction force from the reaction platen payload seating surface on a payload supported by the reaction platen seating surface in a direction that counteracts a payload inertial force resulting from acceleration of the reaction platen along the drive surface.

[0110] In accordance with one or more aspects of the disclosed embodiment, the electromagnetic conveyor substrate transport apparatus further comprises position feedback sensors distributed over the chamber, the position feedback sensors configured to sense a position of the reaction platen along the drive surface and communicatively coupled to the controller such that the controller registers the sensed position of the reaction platen, and the controller configured to sequentially energize electromagnets of the electromagnet array corresponding to the sensed position.

[0111] According to one or more aspects of the disclosed embodiment, the controller is configured to determine an acceleration of the reaction platen along the drive surface from at least the sensed change in position, and to control a bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from the acceleration of the reaction platen.

[0112] According to one or more aspects of the disclosed embodiment, the controller controls the energization of the electromagnets of the electromagnet array to set the attitude of the reaction platen so as to bias the reaction platen against inertial forces that tend to displace a payload seated on the reaction platen relative to the reaction platen along a seating area between the payload and the reaction platen.

[0113] In accordance with one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled to impart a substantially steady-state multiphase distribution across the respective electromagnets of the at least one multiphase actuator unit, each of which is energized with multiphase alternating current, with respect to the reaction platen.

[0114] In accordance with one or more aspects of the disclosed embodiment there is provided a method for a linear electric machine, the method comprising: providing a frame on a linear electric machine, the frame having a horizontal reference plane; forming a drive surface with an electromagnet array connected to a frame, the drive surface being positioned at a predetermined height relative to a horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive surface, each of the electromagnets being coupled to an AC power source that energizes each electromagnet; providing at least one reaction platen made of a paramagnetic, diamagnetic, or non-magnetic conductive material positioned in cooperation with the electromagnets of the electromagnet array; energizing the electromagnet with an alternating current to generate a levitation and propulsion force on the reaction platen that controllably levitates and propels the reaction platen along at least one drive line at a controlled attitude relative to the drive surface; Including, The electromagnets are sequentially excited with polyphase alternating current by a controller operatively coupled to the electromagnet array and the alternating current power source so that each reaction platen is levitated and propelled in up to six degrees of freedom, including at least one of attitude control and yaw control, by the common set of electromagnets, and each of the electromagnets generates both a levitation force and a propulsion force on the reaction platen from excitation with a common polyphase alternating current having a single common frequency per phase, so as to control the reaction platen in up to six degrees of freedom, including at least one of reaction platen attitude and reaction platen yaw, at least with the reaction platen levitated.

[0115] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the attitude of the reaction platen, while levitated and propelled, such that the reaction platen moves relative to the electromagnet array from a first predetermined position relative to the frame to a second, different predetermined position relative to the frame along at least one drive line.

[0116] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the reaction platen's attitude and reaction platen's yaw, with the reaction platen levitated and stationary relative to the electromagnet array at a predetermined position relative to the frame along at least one drive line.

[0117] In accordance with one or more aspects of the disclosed embodiment, the controller controls a thrust force generated by the electromagnet array across the reaction platen to impart a controlled yaw moment to the reaction platen, causing the reaction platen to yaw about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame.

[0118] In accordance with one or more aspects of the disclosed embodiment, the controller controls the thrust generated by the electromagnet array to impart a couple of forces to the reaction platen that effect yaw control of the reaction platen to effect at least one of positioning and centering of a wafer payload on the reaction platen relative to a predetermined wafer-holding position of the frame.

[0119] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the reaction platen that results in a controlled tilt of the reaction platen relative to the drive surface, controlling a predetermined reaction platen attitude in at least one of reaction platen pitch and reaction platen roll.

[0120] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to result in a predetermined bias attitude of the reaction platen relative to the drive surface that imparts a bias reaction force from the reaction platen payload seating surface on a payload supported by the reaction platen seating surface in a direction that counteracts a payload inertial force resulting from acceleration of the reaction platen along the drive surface.

[0121] In accordance with one or more aspects of the disclosed embodiment, the method further includes sensing a position of the reaction platen along the drive surface by position feedback sensors distributed on the frame and communicatively coupled to the controller such that the controller registers a sensed position of the reaction platen, and the controller sequentially energizes electromagnets of the electromagnet array corresponding to the sensed position.

[0122] According to one or more aspects of the disclosed embodiment, the controller determines an acceleration of the reaction platen along the drive surface from at least the sensed change in position, and controls a bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from the acceleration of the reaction platen.

[0123] In accordance with one or more aspects of the disclosed embodiment, the controller controls the energization of the electromagnets of the electromagnet array to set the attitude of the reaction platen and urge the reaction platen against inertial forces that tend to displace a payload seated on the reaction platen relative to the reaction platen along a seating portion between the payload and the reaction platen.

[0124] In accordance with one or more aspects of the disclosed embodiment there is provided a method for an electromagnetic conveyor substrate transport apparatus, the method comprising: providing an electromagnetic conveyor substrate transport apparatus with a chamber configured to hold an enclosed atmosphere therein, the chamber having a horizontal reference surface and at least one substrate passage opening for transferring substrates into and out of the chamber through the opening; forming a drive surface with an electromagnet array connected to the chamber, the drive surface being positioned at a predetermined height relative to a horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive surface, the electromagnets in the series of electromagnets being grouped into at least one multi-phase actuator unit, each of the at least one multi-phase actuator unit being coupled to a multi-phase AC power source; providing at least one reaction platen made of a paramagnetic, diamagnetic, or non-magnetic conductive material arranged to cooperate with the electromagnet of the at least one multi-phase actuator unit; energizing the electromagnet with an alternating current to generate a levitation and propulsion force on the reaction platen that controllably levitates and propels the reaction platen along at least one drive line at a controlled attitude relative to the drive surface; Including, the electromagnets are sequentially energized with polyphase alternating current by a controller operatively coupled to the electromagnet array and the alternating current power supply such that the reaction platen is levitated and propelled; Each AC phase of the multi-phase AC current is dynamically allocated among the respective electromagnets of the electromagnet groups of the at least one multi-phase actuator unit such that the AC phase of each respective electromagnet of the electromagnet groups changes from a first AC phase to a second different AC phase, thereby effectively causing the electromagnet groups to move substantially, and at least one multi-phase actuator unit formed by the electromagnet groups to move substantially along the drive line due to the dynamic phase allocation.

[0125] In accordance with one or more aspects of the disclosed embodiment, the reaction platen is levitated and propelled with up to six degrees of freedom, including at least one of attitude control and yaw control, by at least one multi-phase actuator unit that moves substantially.

[0126] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the attitude of the reaction platen, while levitated and propelled, such that the reaction platen moves relative to the electromagnet array from a first predetermined position relative to the chamber to a second, different predetermined position relative to the chamber along at least one drive line.

[0127] In accordance with one or more aspects of the disclosed embodiment, the controller controls up to six degrees of freedom generated by the electromagnet array, including at least the reaction platen's attitude and reaction platen's yaw, with the reaction platen levitated and stationary relative to the electromagnet array at a predetermined position relative to the chamber along at least one drive line.

[0128] In accordance with one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled such that the substantially moving at least one multi-phase actuator unit moves substantially along the drive line in a manner that generally coincides with the movement of the reaction platen along the drive line under the impetus of the substantially moving at least one multi-phase actuator unit.

[0129] In accordance with one or more aspects of the disclosed embodiment, the controller controls a thrust force generated by the electromagnet array across the reaction platen to impart a controlled yaw moment to the reaction platen, causing the reaction platen to yaw about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the chamber to a second, different predetermined orientation relative to the chamber.

[0130] In accordance with one or more aspects of the disclosed embodiment, the controller controls the thrust generated by the electromagnet array to impart a couple of forces to the reaction platen that effect yaw control of the reaction platen to effect at least one of positioning and centering of a wafer payload on the reaction platen relative to a predetermined wafer-holding position of the chamber.

[0131] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the reaction platen that results in a controlled tilt of the reaction platen relative to the drive surface, controlling a predetermined reaction platen attitude in at least one of reaction platen pitch and reaction platen roll.

[0132] In accordance with one or more aspects of the disclosed embodiment, the controller controls the levitation force generated by the electromagnet array to result in a predetermined bias attitude of the reaction platen relative to the drive surface that imparts a bias reaction force from the reaction platen payload seating surface on a payload supported by the reaction platen seating surface in a direction that counteracts a payload inertial force resulting from acceleration of the reaction platen along the drive surface.

[0133] In accordance with one or more aspects of the disclosed embodiment, the method further includes sensing a position of the reaction platen along the drive surface by position feedback sensors distributed over the chamber and communicatively coupled to the controller such that the controller registers the sensed position of the reaction platen, and the controller sequentially energizes electromagnets of the electromagnet array corresponding to the sensed position.

[0134] According to one or more aspects of the disclosed embodiment, the controller determines an acceleration of the reaction platen along the drive surface from at least the sensed change in position, and controls a bias attitude of the reaction platen in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from the acceleration of the reaction platen.

[0135] According to one or more aspects of the disclosed embodiment, the controller controls the excitation of the electromagnets of the electromagnet array to set the attitude of the reaction platen so as to bias the reaction platen against inertial forces that tend to displace a payload seated on the reaction platen relative to the reaction platen along a seating portion between the payload and the reaction platen.

[0136] In accordance with one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled to impart a substantially steady-state multiphase distribution across the respective electromagnets of the at least one multiphase actuator unit, each of which is energized with multiphase alternating current, with respect to the reaction platen.

[0137] It should be understood that the foregoing description is merely illustrative of aspects of the disclosed embodiments. Various substitutions and modifications may be contemplated by those skilled in the art without departing from the aspects of the disclosed embodiments. Accordingly, aspects of the disclosed embodiments are intended to embrace all such substitutions, modifications, and variations that are within the scope of any claims appended hereto. Furthermore, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be used to advantage and that such combination remains within the scope of the aspects of the present disclosure.

Claims

1. 1. A linear electric substrate transport machine, comprising: a semiconductor substrate transfer vacuum chamber having a plurality of transfer ports each configured to connect to a respective processing chamber, the semiconductor substrate transfer vacuum chamber comprising a frame having a horizontal reference surface and capable of being sealed under vacuum from an external environment; an electromagnet array connected to the frame to form a drive surface at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive surface, each of the electromagnets being coupled to a power source that energizes the respective electromagnet; a substrate handler comprising at least one reaction platen made of a conductive material and an end effector for carrying a substrate, the reaction platen being arranged to cooperate with the electromagnets of the electromagnet array such that energization of a plurality of the electromagnets generates levitation and propulsion forces on the reaction platen that controllably levitate and propel the substrate handler along the at least one drive line at a controlled attitude relative to the drive surface, the end effector being configured to stably hold a semiconductor substrate for transfer through the semiconductor substrate transfer vacuum chamber by movement of the reaction platen; a controller operably coupled to the electromagnet array and the power source, the controller configured to individually energize the plurality of electromagnets with current to control six degrees of freedom of each reaction platen; Equipped with the controller is configured to calculate a trajectory and an attitude along the trajectory for the substrate handler and the end effector for levitation and propulsion through the semiconductor substrate transport vacuum chamber, the trajectory and attitude being determined by control of any combination of two or more of the six degrees of freedom based at least in part on a weight of the semiconductor substrate and a maximum acceleration of the semiconductor substrate, whereby the controller controls the trajectory and the attitude along the trajectory of the substrate handler in a combination of two or more of the six degrees of freedom in real time via feedback control of the plurality of electromagnets as the substrate handler moves along the at least one drive line to transport the semiconductor substrate through the semiconductor substrate transport vacuum chamber; the six degrees of freedom being x, y, z, roll, pitch, and yaw; Linear electric board transport machine.

2. the controller monitors and controls the position and movement of the end effector as the semiconductor substrate is transported and moved by the six degrees of freedom control of the substrate handler generated by the electromagnet array to move the semiconductor substrate from a first known position relative to the frame to a second different position relative to the frame; 2. A linear electric substrate transport machine according to claim 1.

3. the controller controls the six degrees of freedom of the substrate handler generated by the electromagnet array, whereby, as the substrate handler and the end effector move from a first known position to a second different position, the controller calculates the tilt of the end effector and the direction of movement of the semiconductor substrate such that the controller controls at least one of yaw or roll of the substrate handler and the end effector to urge the semiconductor substrate against slippage relative to the end effector; 2. A linear electric substrate transport machine according to claim 1.

4. the controller considers a coefficient of friction between the semiconductor substrate and the end effector when calculating the threshold acceleration of the substrate handler.

2. A linear electric substrate transport machine according to claim 1.

5. The controller imparting a controlled yaw moment to the substrate handler to yaw the substrate handler about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame; or imparting a force couple to the substrate handler to effect yaw control of the substrate handler to effect at least one of positioning and centering of a substrate payload on the substrate handler relative to a predetermined substrate holding position of the frame; controlling the motive force generated by the electromagnet array across the substrate handler; 2. A linear electric substrate transport machine according to claim 1.

6. the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the at least one reaction platen that results in a controlled tilt of the substrate handler relative to the drive surface, controlling a predetermined substrate handler attitude in at least one of a pitch of the substrate handler and a roll of the substrate handler; 2. A linear electric substrate transport machine according to claim 1.

7. the controller controls the levitation force generated by the electromagnet array to produce a predetermined bias attitude of the substrate handler relative to the drive surface that imparts a bias reaction force from a substrate handler payload seating surface to a payload supported by an end effector of the substrate handler in a direction that counteracts a payload inertial force resulting from acceleration of the substrate handler along the drive surface.

2. A linear electric substrate transport machine according to claim 1.

8. further comprising a plurality of position feedback sensors distributed on the frame; the position feedback sensors are each configured to sense a position of the substrate handler along the drive surface and are communicatively coupled to the controller such that the controller registers the sensed position of the substrate handler; the controller is configured to sequentially energize the electromagnets of the electromagnet array corresponding to the sensed position; 2. A linear electric substrate transport machine according to claim 1.

9. the controller is configured to determine an acceleration of the substrate handler along the drive surface from at least the sensed change in position, and to control a bias attitude of the substrate handler in response to the determined acceleration to provide a predetermined bias attitude that counteracts payload inertial forces resulting from acceleration of the at least one reaction platen.

2. A linear electric substrate transport machine according to claim 1.

10. the controller controls excitation of the electromagnets of the electromagnet array to set the attitude of the substrate handler so as to bias the substrate handler against an inertial force tending to displace the semiconductor substrate seated on the end effector of the substrate handler.

2. A linear electric substrate transport machine according to claim 1.

11. at least one sensor for detecting position information of the substrate handler without using a magnetic field, and the controller controls the substrate handler in the six degrees of freedom using the position information; 11. A linear electric substrate transport machine according to claim 10.

12. at least one camera for detecting position information of the substrate handler, the position information being provided to the controller; 11. A linear electric substrate transport machine according to claim 10.

13. and during transfer of the semiconductor substrate into the processing chamber through one of the plurality of transfer ports, the controller controls the substrate handler such that at least a portion of the end effector carrying the substrate moves from the semiconductor substrate transfer vacuum chamber through the transfer port into the processing chamber, and a base of the substrate handler does not move into the processing chamber.

2. A linear electric substrate transport machine according to claim 1.

14. the controller controls the substrate handler such that at least a portion of the end effector arranged to carry the substrate moves from the processing chamber through one of the plurality of transfer ports into the semiconductor substrate transfer vacuum chamber, and a base of the substrate handler does not move into the processing chamber.

2. A linear electric substrate transport machine according to claim 1.

15. the end effector having a self-centering support for the semiconductor substrate; 2. A linear electric substrate transport machine according to claim 1.

16. the transfer ports are each connected to a respective processing chamber; 2. A linear electric substrate transport machine according to claim 1.

17. the end effector extends laterally from a base of the substrate handler; 2. A linear electric substrate transport machine according to claim 1.

18. the end effector is substantially common to the at least one reaction platen forming a base; 2. A linear electric substrate transport machine according to claim 1.

19. the semiconductor substrate transfer vacuum chamber comprises two separate transfer chambers connected to each other by an isolation stage; 2. A linear electric substrate transport machine according to claim 1.

20. The semiconductor substrate is for a photolithography cell.

2. A linear electric substrate transport machine according to claim 1.

21. the semiconductor substrate transfer vacuum chamber having a selectably variable length formed by a plurality of transfer chamber modules, the variable length being selected by connecting or disconnecting a transfer chamber module from the plurality of transfer chamber modules to provide an increase or decrease in travel distance of the substrate handler, the end effector, and the semiconductor substrate; 2. A linear electric substrate transport machine according to claim 1.

22. A linear electric substrate transport machine is provided, the linear electric substrate transport machine comprising: a semiconductor substrate transfer vacuum chamber having a plurality of transfer ports each configured to connect to a respective processing chamber, the semiconductor substrate transfer vacuum chamber comprising a frame having a horizontal reference surface and capable of being sealed under vacuum from an external environment; an electromagnet array connected to the frame to form a drive surface at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive surface, each of the electromagnets being coupled to a power source that energizes the respective electromagnet; a substrate handler comprising at least one reaction platen made of a conductive material and an end effector, the reaction platen being arranged to cooperate with the electromagnets of the electromagnet array such that energization of a plurality of the electromagnets generates levitation and propulsion forces on the at least one reaction platen that controllably levitate and propel the substrate handler along the at least one drive line at a controlled attitude relative to the drive surface, the end effector being configured to stably hold a semiconductor substrate for transfer through the semiconductor substrate transfer vacuum chamber upon movement of the substrate handler; a controller operably coupled to the electromagnet array and the power source, the controller configured to individually energize the plurality of electromagnets with current to control six degrees of freedom of the substrate handler; a linear electric substrate transport machine comprising: calculating, by the controller, a trajectory and an attitude along the trajectory for the substrate handler and the end effector for levitation and propulsion through the semiconductor substrate transport vacuum chamber, the trajectory and the attitude being defined by control of any combination of two or more of the six degrees of freedom based at least in part on a weight of the semiconductor substrate and a frictional force between the semiconductor substrate and the end effector, whereby the controller controls, via feedback control of the plurality of electromagnets, the trajectory and the attitude along the trajectory of the substrate handler in a combination of two or more of the six degrees of freedom in real time as the substrate handler moves along the at least one drive line to transport the semiconductor substrate through the semiconductor substrate transport vacuum chamber; A method comprising: The six degrees of freedom are x, y, z, pitch, roll, and yaw; method.

23. the controller monitors and controls the position and movement of the end effector as the semiconductor substrate is transported and moved by the six degrees of freedom control of the substrate handler generated by the electromagnet array to move the semiconductor substrate from a first known position relative to the frame to a second different position relative to the frame; 23. The method of claim 22.

24. the controller controls the six degrees of freedom of the substrate handler generated by the electromagnet array, whereby, with the substrate handler and the semiconductor substrate moving from a first known position to a second different position, the controller calculates a tilt of the substrate handler and a direction of movement of the end effector such that the controller controls at least one of a yaw or a roll of the substrate handler and the end effector to urge the semiconductor substrate against slippage relative to the end effector; 23. The method of claim 22.

25. the controller considers a coefficient of friction between the semiconductor substrate and the end effector when calculating the threshold acceleration of the end effector; 23. The method of claim 22.

26. The controller imparting a controlled yaw moment to the substrate handler to yaw the substrate handler about a yaw axis generally perpendicular to the drive surface from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame; or imparting a force couple to the substrate handler to effect yaw control of the substrate handler to effect at least one of positioning and centering of a substrate payload on the substrate handler relative to a predetermined substrate holding position of the frame; controlling the motive force generated by the electromagnet array across the at least one reaction platen; 23. The method of claim 22.

27. the controller controls the levitation force generated by the electromagnet array to impart a differential levitation force across the substrate handler that results in a controlled tilt of the substrate handler relative to the drive surface, controlling a predetermined substrate handler attitude in at least one of a pitch of the substrate handler and a roll of the substrate handler; 23. The method of claim 22.

28. the controller controls the levitation force generated by the electromagnet array to effect a predetermined bias attitude of the substrate handler relative to the drive surface that imparts a bias reaction force from the end effector to a payload supported by the end effector in a direction that counteracts a payload inertial force resulting from acceleration of the at least one reaction platen along the drive surface.

23. The method of claim 22.

29. the controller controls excitation of the electromagnets of the electromagnet array to set the attitude of the substrate handler so as to bias the substrate handler against an inertial force that tends to displace the semiconductor substrate seated on the end effector.

23. The method of claim 22.

30. and during transfer of the semiconductor substrate into the processing chamber through one of the plurality of transfer ports, the controller controls the substrate handler such that at least a portion of the end effector carrying the substrate moves from the semiconductor substrate transfer vacuum chamber through the transfer port into the processing chamber, and a base of the substrate handler does not move into the processing chamber.

23. The method of claim 22.

31. the controller controls the substrate handler such that the end effector, positioned to carry the substrate, moves from the processing chamber through one of the plurality of transfer ports into the semiconductor substrate transfer vacuum chamber, and the base of the substrate handler does not move into the processing chamber.

23. The method of claim 22.

Images