Lid, package for storing optical element, and electronic device

Abstract

To provide a package substrate not requiring a high-cost and numerous-process joining material such as AuSn eutectic solder.SOLUTION: A lid of a package for storing an optical element includes: a transmission member which transmits light; and a first holding member and a second holding member which have an opening transmitting light and which hold and fix an outer edge of the transmission member. The first holding member and the second holding member are joined using a sealing material containing a glass material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a lid for a package for storing an optical element, a package for storing an optical element, and an electronic device. [Background technology]

[0002] Prior Art Document 1 discloses a semiconductor package including a package substrate that houses a semiconductor light-emitting element and a lid member that is made of a material that transmits ultraviolet light and is mounted to cover the semiconductor light-emitting element. The package substrate and the lid member are joined together with a joining member such as AuSn eutectic solder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-132061 Summary of the Invention [Problem to be solved by the invention]

[0004] Expensive materials such as AuSn eutectic solder are used as the bonding material, and a metal film to which the bonding material can adhere must be formed on the bonding surface of the substrate or the lid member. [Means for solving the problem]

[0005] A lid body according to one embodiment of the present disclosure includes a transparent member that transmits light, and a first clamping member and a second clamping member that have an opening through which the light passes and clamp and fix the outer edge of the transparent member, and the first clamping member and the second clamping member are joined together using a sealing material containing a glass material.

[0006] An optical element storage package according to one aspect of the present disclosure includes the above-described lid and a substrate on which an optical element is mounted, the substrate having a storage recess for storing the optical element.

[0007] An electronic device according to one aspect of the present disclosure includes the optical element storage package and an optical element. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, a package substrate can be realized that does not require a bonding member such as AuSn eutectic solder, which is expensive and requires many steps for bonding. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a vertical cross-sectional view of an electronic device according to a first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the lid according to the first embodiment. [Figure 3] 1 is a top view of a first clamping member according to the first embodiment when viewed from above. FIG. [Figure 4] FIG. 10 is a vertical cross-sectional view of a modified example of the lid body. [Figure 5] FIG. 10 is a vertical cross-sectional view of a modified example of the lid body. [Figure 6] FIG. 10 is a vertical cross-sectional view of a lid according to a second embodiment. [Figure 7] FIG. 10 is a vertical cross-sectional view of a modified example of the lid body. [Figure 8] FIG. 10 is a vertical cross-sectional view of a modified example of the lid body. [Figure 9] FIG. 10 is a vertical cross-sectional view of a modified example of the lid body. [Figure 10] FIG. 10 is a top view of a modified example of the first holding member according to the second embodiment, as viewed from above. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Embodiment 1] A lid, an optical element storage package, and an electronic device according to an embodiment of the present disclosure will be described in detail below with reference to the drawings. However, for the sake of convenience, the figures referenced below may show only the components necessary for explaining the embodiment in a simplified form. Therefore, the lid, the optical element storage package, and the electronic device according to the embodiment may include any components not shown in the figures referenced. Furthermore, please note that the dimensions of the components in the figures do not faithfully represent the actual dimensions of the components or the dimensional ratios of each member.

[0011] The distinction between top and bottom in the following description is for convenience and does not limit the top and bottom when the lid, optical element storage package, and electronic device are actually used. In this specification, the top surface is defined as the surface of the substrate on which the optical element is mounted, and the surface of the lid opposite the surface facing the optical element.

[0012] An electronic device 100 according to a first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a longitudinal cross-sectional view of the electronic device 100 according to the first embodiment. The cross-section shown in FIG. 1 is a plane perpendicular to the plane of the electronic device 100, dividing the short side of the electronic device 100 into two, as in the cross-section corresponding to the cross-section along the AA line in FIG. 3. The electronic device 100 includes a package 50 and an optical element 40. The package 50 is an example of a package for storing an optical element according to the present disclosure. The package 50 includes a lid 2 and a substrate 3.

[0013] 2 is an exploded perspective view of the lid body 2. The lid body 2 includes a light-transmitting member 21, and a first clamping member 22 and a second clamping member 23 that clamp and fix the light-transmitting member 21.

[0014] Fig. 3 is a top view of the first clamping member 22 as viewed from above. In Fig. 3, the position of the transparent member 21 in the first clamping member 22 is indicated by a two-dot chain line. Figs. 4 and 5 are vertical cross-sectional views of modified examples of the lid body 2. The cross sections shown in Figs. 4 and 5 also correspond to the cross section taken along the arrow AA in Fig. 3.

[0015] Each part is described in detail below.

[0016] The optical element 40 according to the present disclosure may be an optical element such as an imaging element such as a CCD (Charged-Coupled Device) and a CMOS (Complementary Metal-Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems) element such as an optical switch and a mirror device, a light-emitting element such as a laser diode (LD) and an LED (Light Emitting Diode), or a light-receiving element such as a photodiode and an infrared light-receiving element.

[0017] The package 50 is an optical element housing package for housing these elements, and the electronic device 100 may be a device in which these elements are mounted in the package 50 .

[0018] The package 50 includes a substrate 3 having an accommodating recess 31 for accommodating an optical element 40 , and a lid 2 for closing the accommodating recess 31 of the substrate 3 .

[0019] The lid 2 and the substrate 3 are bonded together by a bonding material C containing a glass material. The bonding material C is positioned over the entire periphery of the bonding surface with the lid 2 to ensure airtight sealing.

[0020] The cover 2 has a transparent member 21 that transmits light, and a first clamping member 22 and a second clamping member 23 that clamp and fix the outer edge of the transparent member 21. The first clamping member 22 and the second clamping member 23 each have an opening OP through which light passes, and the transparent member 21 is arranged so that the outer edge of the transparent member 21 is located outside the outer edges of each opening OP when viewed from above. The first clamping member 22 and the second clamping member 23 are joined together using a sealing material S that contains a glass material.

[0021] The transparent member 21 is made of a material that transmits light. The light that the transparent member 21 transmits can be selected depending on the type of optical element 40, and may be, for example, visible light, infrared light, or ultraviolet light. The transparent member 21 may be, for example, a plate-shaped member made of a hard glass material such as borosilicate glass, soda glass, or sapphire glass, silicon, or germanium.

[0022] Furthermore, the transmitting member 21 may include an optical thin film 212 that adjusts light transmission on at least one of the upper and lower surfaces of the transmitting member 21, which are light-transmitting surfaces. The optical thin film 212 may be, for example, an anti-reflection coating (AR coating), a UV (Ultra Violet) cut filter, or an IR (Infrared rays) cut filter.

[0023] Depending on the application, these optical thin films 212 can be formed by laminating, in multiple layers, for example, magnesium fluoride (MgF2), silicon dioxide (SiO2), lanthanum fluoride (LaO3), lanthanum oxide (La2O3), tantalum pentoxide (Ta2O5), titanium pentoxide (Ti3O5), niobium pentoxide (Nb2O5), zirconium oxide (ZrO2), titanium oxide (TiO2), or a mixture of ZrO2 and TiO2, etc., using a vacuum deposition method, a high-frequency ion plating method, a sputtering method, etc. By including the optical thin films 212 in the transmissive member 21, the optical characteristics of the electronic device 100 can be improved.

[0024] The first clamping member 22 and the second clamping member 23 clamp the transparent member 21. Of the two clamping members, the first clamping member 22 is the clamping member that is located on the substrate 3 side when the cover body 2 is attached to the substrate 3.

[0025] The first clamping member 22 and the second clamping member 23 each have an opening OP that can expose the transparent member 21. The openings OP of the first clamping member 22 and the second clamping member 23 can be provided at positions that overlap with the optical element 40 when the electronic device 100 is seen through from above, and the size and shape thereof can be set arbitrarily depending on the application, etc. The opening OP of the first clamping member 22 and the opening OP of the second clamping member 23 may have the same size and shape or may have different sizes and shapes.

[0026] In the first embodiment, the first clamping member 22 has a first recess 225 that accommodates a portion of the transmitting member 21. The depth of the first recess 225 may be equal to or greater than one-fourth and equal to or less than three-fourths of the height (thickness) of the transmitting member 21. An opening OP is located at the bottom of the first recess 225. In addition, the first clamping member 22 has a first sealing surface 226 that faces the second clamping member 23.

[0027] The second clamping member 23 has a second recess 235 that accommodates a portion of the transparent member 21. The depth of the second recess 235 may be equal to or greater than one-fourth and equal to or less than three-fourths of the height (thickness) of the transparent member 21. The depths of the first recess 225 and the second recess 235 may be the same or different. An opening OP is located at the bottom of the second recess 235. The second clamping member 23 also has a second sealing surface 236 that faces the first clamping member 22.

[0028] The first clamping member 22 and the second clamping member 23 may contain a ceramic material. More specifically, the first clamping member 22 and the second clamping member 23 may be formed of a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, or a mullite sintered body. For example, when the first clamping member 22 and the second clamping member 23 are made of an aluminum oxide sintered body, they can be manufactured as follows.

[0029] First, raw material powders such as aluminum oxide and silicon oxide are formed into sheets with an appropriate organic binder and organic solvent to produce square ceramic green sheets. These ceramic green sheets are then cut to appropriate dimensions, and multiple formed ceramic green sheets are stacked together. This stack is then fired at a temperature of 1300°C to 1600°C. For example, the first clamping member 22 having the opening OP and the first recess 225 can be produced by stacking ceramic green sheets with appropriate through-holes formed by punching. Alternatively, the first clamping member 22 can be produced by grinding and polishing a flat ceramic sintered body to form the opening OP and the first recess 225. Alternatively, the first clamping member 22 may be produced by press-molding ceramic powder into the shape of the first clamping member 22 using a mold and firing the resulting product.

[0030] As shown in FIG. 1 , the sealing material S is located between the first sealing surface 226 of the first clamping member 22 and the second sealing surface 236 of the second clamping member 23, and bonds the first clamping member 22 and the second clamping member 23 together. The sealing material S bonds the first clamping member 22 and the second clamping member 23 together around the entire periphery between the first sealing surface 226 and the second sealing surface 236 of the second clamping member 23. This prevents dust and other foreign matter from entering from the outside. Furthermore, the sealing material S bonds the first clamping member 22 and the second clamping member 23 together, thereby sealing the transparent member 21 within the lid 2.

[0031] The sealing material S is a bonding material containing a glass material, and may be, for example, low-melting-point glass. Specific examples of low-melting-point glass include lead borate glass (PbO-B2O3-based), borate glass (B2O3-based, Li2O-B2O3-based, Na2O-B2O3-based, etc.), lead silicate glass (PbO-SiO2-based, PbO-B2O3-SiO2-based, etc.), phosphate glass (Na2O-P2O5-based, B2O3-P2O5-based, etc.), or tin zinc phosphate glass (P2O5-SnO-ZnO-based). Selecting lead-free glass, such as borate glass, phosphate glass, or tin zinc phosphate glass, can reduce environmental impact.

[0032] Bonding using the sealing material S can be performed as follows. A mixed paste obtained by adding an inorganic filler, an organic solvent, a plasticizer, and the like to a powder of low-melting-point glass as described above is applied by screen printing or a dispenser to the first sealing surface 226 of the first clamping member 22 and / or the second sealing surface 236 of the second clamping member 23. The mixed paste is applied to the entire periphery of the first sealing surface 226 and / or the second sealing surface 236. The first clamping member 22 and the second clamping member 23, which sandwich the transparent member 21, are then heated to melt the sealing material S, thereby bonding the first clamping member 22 and the second clamping member 23 together. Since the volume of the melted sealing material S is smaller than that of the unmelted sealing material S, the transparent member 21 can be firmly clamped. During bonding, the first clamping member 22 and the second clamping member 23 may be fixed and / or weighted in the bonding direction using a jig or the like. This can reduce tilting during joining and enable stronger clamping.

[0033] As shown in FIG. 1 , the sealing material S may be located only between the first sealing surface 226 and the second sealing surface 236. Alternatively, as shown in FIG. 4 , the sealing material S may extend to the inner wall surface 225X of the first recess 225 and / or the inner wall surface 235X of the second recess 235. By extending the sealing material S to the inner wall surface 225X and / or the inner wall surface 235X, the bonding between the first clamping member 22 and the second clamping member 23 can be strengthened. Furthermore, the sealing material S may be bonded to the side surface 217 of the transparent member 21. This strengthens the fixation of the transparent member 21 to the first clamping member 22 and the second clamping member 23. In this case, the sealing material S may bond the inner wall surface 225X and / or the inner wall surface 235X to the transparent member 21 along the entire periphery of the side surface 217 of the transparent member 21. 1, in the package 50, the lid 2 and the substrate 3 are hermetically sealed with a bonding material C. Since the entire periphery of the side surface 217 of the transparent member 21 is sealed with the sealing material S, when used in the electronic device 100, the optical element 40 can be hermetically sealed.

[0034] Alternatively, as shown in FIG. 5 , the lid 2 may have, in addition to the sealing material S, a second sealing material S2 positioned between the transparent member 21 and the bottom surface of the second recess 235, and the transparent member 21 and the bottom surface of the second recess 235 may be bonded via the second sealing material S2. The second sealing material S2 may be the same sealing material as the sealing material S. The second sealing material S2 may be disposed around the entire periphery of the opening OP of the second recess 235. The second sealing material S2 may be positioned between the transparent member 21 and the bottom surface of the first recess 225, or may be positioned both between the transparent member 21 and the bottom surface of the second recess 235 and between the transparent member 21 and the bottom surface of the first recess 225.

[0035] 1, in the package 50, the lid 2 and the substrate 3 are hermetically sealed with the bonding material C. Therefore, the transparent member 21 and the sandwiching member are bonded with the second sealing material S2 at least around the entire circumference of one of the openings OP, and therefore, when the lid 2 is used as the lid of the electronic device 100, the optical element 40 can be hermetically sealed.

[0036] 5, the transparent member 21 may have the optical thin film 212 in an area other than the area where the second sealing material S2 is located. Depending on the materials of the transparent member 21, the second sealing material S2, and the optical thin film 212, the bonding strength between the second sealing material S2 and the transparent member 21 may be stronger than the bonding strength between the second sealing material S2 and the optical thin film 212. In this case, since the transparent member 21 does not have the optical thin film 212 in the area where the second sealing material S2 is located, the bonding strength between the second sealing material S2 and the transparent member 21 is improved and the airtightness of the lid 2 can be improved.

[0037] The substrate 3 may include an insulating substrate made of one or more insulating layers, and a wiring conductor (not shown) for connecting the optical element 40 to an external substrate. The insulating substrate of the substrate 3 may contain a ceramic material. The insulating substrate of the substrate 3, the first clamping member 22, and the second clamping member 23 may be made of the same material. By making the first clamping member 22 and the second clamping member 23 of the same material, thermal stress is reduced, and bonding strength and airtightness can be improved.

[0038] The bonding material C that bonds the lid body 2 and the substrate 3 is a bonding material containing a glass material, and may be, for example, a low-melting point glass as exemplified in the description of the sealing material S. Since both the bonding material C and the sealing material S are bonding materials containing a glass material, the sealing of the lid body by the sealing material S and the bonding of the lid body 2 and the substrate 3 by the bonding material C can be performed simultaneously.

[0039] When the sealing material S and the bonding material C are made of different low-melting point glasses, as long as the difference in optimal sealing temperature between the bonding material C and the sealing material S is within 20°C, the bonding of the lid body 2 and the substrate 3 with the bonding material C can be performed simultaneously at an appropriate sealing temperature (welding temperature). When the sealing material S and the bonding material C are made of the same low-melting point glass, the sealing of the lid body 2 with the sealing material S and the bonding of the lid body 2 and the substrate 3 with the bonding material C can be performed simultaneously at the optimal sealing temperature.

[0040] As described above, the lid 2 according to the first embodiment includes a transparent member 21 that transmits light, and a first clamping member 22 and a second clamping member 23 that have an opening OP through which the light passes and clamp and fix the outer edge of the transparent member 21. The first clamping member 22 and the second clamping member 23 are joined together using a sealing material S containing a glass material.

[0041] In conventional technology, when the transparent member itself is used as a lid and directly bonded to the device mounting substrate, bonding using AuSn eutectic solder or the like is required, which requires many steps and is expensive.However, by configuring the lid 2 so that the transparent member 21 is sandwiched and fixed between the first clamping member 22 and the second clamping member 23, a package substrate can be realized that does not require bonding materials such as AuSn eutectic solder when bonding to the substrate.

[0042] In addition, conventional techniques involve directly bonding a transparent member and an element mounting substrate using low-melting-point glass. However, because low-melting-point glass is difficult to bond to an optical thin film, it is necessary to remove the optical thin film from the bonding area. Furthermore, if the transparent member is made of a material containing Si or Ge, the difference in thermal expansion coefficient between the transparent member and the low-melting-point glass may reduce sealing reliability. The lid 2 according to this embodiment can solve these problems by sandwiching the transparent member 21 between the first sandwiching member 22 and the second sandwiching member 23.

[0043] Furthermore, since the transparent member 21 is configured to be sandwiched and fixed by the first sandwiching member 22 and the second sandwiching member 23, it is possible to reduce the possibility of warping or distortion of the transparent member 21 and peeling of the optical thin film 212 due to the warping or distortion. This reduces the possibility of a decrease in the precision and optical characteristics of the electronic device 100 due to deformation of the transparent member 21, etc.

[0044] [Embodiment 2] Other embodiments of the lid body 2 of the present disclosure will be described below with reference to FIGS. 6 to 10. For ease of explanation, members having the same functions as those described in the above embodiments will be denoted by the same reference numerals, and their description will not be repeated. FIG. 6 is a vertical cross-sectional view of the lid body 2A according to the second embodiment. FIGS. 7, 8, and 9 are vertical cross-sectional views of modified examples of the lid body 2A. FIG. 10 is a top view of a modified example of the first clamping member 22A of the lid body 2A as viewed from above.

[0045] The lid body 2 of embodiment 1 has been described as an example in which both the first clamping member 22 and the second clamping member 23 have recesses that accommodate a portion of the transparent member 21. The lid body 2A of embodiment 2 differs from the lid body 2 of embodiment 1 in that the first clamping member 22A has a first recess 225A that accommodates the transparent member 21, and the second clamping member 23A has a flat plate shape that does not have a recess.

[0046] More specifically, the first clamping member 22A has a first recess 225A that houses the transparent member 21 and has an opening OP at its bottom, and a first sealing surface 226 that faces the second clamping member 23. The second clamping member 23A has a flat plate shape that has a second sealing surface 236 that faces the first clamping member 22A and an opening OP. The first sealing surface 226 and the second sealing surface 236, and the transparent member 21 and the second sealing surface 236 are bonded together via a sealing material S.

[0047] With this configuration, even when the second clamping member 23 and the transparent member 21 are joined by the sealing material S to hermetically seal the space between them as described in Fig. 5, the sealing material S is not divided as shown in Fig. 5, and the width of the sealing material S is increased. This improves the joining strength and sealing reliability.

[0048] The depth of the first recess 225A may be greater than the height (thickness) of the transparent member 21, as shown in FIG. 6, or may be the same as the height of the transparent member 21, as shown in FIG. 7. In other words, the first sealing surface 226 and the upper surface of the transparent member 21 may be located on the same plane. By having the first sealing surface 226 and the upper surface of the transparent member 21 on the same plane, the volume of the sealing material S can be reduced and airtight sealing can be achieved. The term "on the same plane" mentioned here does not necessarily mean that they are exactly the same, and an error of about ±15 μm is acceptable between the height of the transparent member 21 and the depth of the first recess 225A.

[0049] 7, the sealing material S may also be located between the inner wall surface of the first recess 225A and the side surface of the transparent member 21. This makes it possible to strengthen the fixation of the transparent member 21 to the first holding member 22A and improve the reliability of the airtight seal.

[0050] 8, the transparent member 21 may have an optical thin film 212 that adjusts light transmission in an area other than the area where the sealing material S is located. When the transparent member 21 does not have the optical thin film 212 in the area where the sealing material S is located, the bonding strength between the sealing material S and the transparent member 21 is improved, and the airtightness of the lid 2 can be improved.

[0051] 9, in a planar perspective view, the outer edge of the opening OP2 (second opening) of the second clamping member 23A may be located outside the outer edge of the opening OP1 (first opening) of the first clamping member 22A. As shown in FIG. 9, the sealing material S between the second clamping member 23 and the transparent member 21 may spread toward the inside of the transparent member 21. By positioning the outer edge of the opening OP2 outside the outer edge of the opening OP1, it is possible to reduce the possibility that the sealing material S will block the light transmission path defined by the opening OP1. Furthermore, by forming a fillet with the sealing material S that has spread toward the inside of the transparent member 21, the bonding area between the second clamping member 23 and the transparent member 21 is increased, and the bonding strength can be improved.

[0052] The fillet formed by the sealing material S may have a concave curved surface that is easy to relieve stress. In other words, the sealing material S may have a concave curved surface between the opening OP2 of the second clamping member 23A and the transparent member 21. That is, the inner wall surface of the sealing material S may have a concave curved surface. The first clamping member 22 and the second clamping member 23 are made of different materials from the transparent member 21, and therefore have different thermal expansion coefficients. By having the inner wall surface of the sealing material S, which is located between the second clamping member 23A and the transparent member 21 and is prone to stress, as a concave curved surface, the possibility of cracks occurring in the sealing material S due to thermal stress or the like can be significantly reduced, and the airtight sealing performance can be improved.

[0053] Furthermore, in addition to the inner wall surface of the sealing material S, the outer wall surface may also be a concave curved surface. By having the outer wall surface also be a concave curved surface, the possibility of cracks occurring in the sealing material S can be further reduced. Furthermore, the curvature of the inner concave curved surface may be smaller than the curvature of the outer concave curved surface. This configuration can be achieved by making the distance from the inner edge of the second clamping member 23A to the optical thin film 212 larger than the distance from the outer edge of the second clamping member 23A to the outer edge of the first clamping member 22A in a plan view, and adjusting the amount of sealing material S applied. By making the curvature of the inner concave curved surface smaller than the curvature of the outer concave curved surface, the possibility of cracks occurring in the sealing material S due to thermal stress or the like can be significantly reduced, and the airtight sealing performance can be improved.

[0054] 9, the outer dimensions of the second clamping member 23A may be smaller than the outer dimensions of the first clamping member 22A. This reduces the possibility that the outer dimensions of the lid body 2A will change even if misalignment occurs when the first clamping member 22A and the second clamping member 23A are joined.

[0055] 10, the first clamping member 22A may have a notch 225Z at a corner between two adjacent inner wall surfaces 225X and 225Y. If the first clamping member 22A is slightly warped or distorted, the corner of the transparent member 21 may come into contact with the first clamping member 22A. By providing the notch 225Z, the possibility of the corner of the transparent member 21 coming into contact with the first clamping member 22A can be reduced even in such a case. Furthermore, by allowing the sealing material S to flow into the notch 225Z, stress at the four corners of the transparent member 21 is alleviated, and the bonding strength of the transparent member 21 to the first clamping member 22A can be improved.

[0056] In the above-described embodiment, an example was shown in which the planar shapes of the transparent member 21, the clamping members 22 and 23, and the recesses 225 and 235 of the clamping members 22 and 23 are rectangular, but these planar shapes are not limited to rectangular and may be circular or polygonal.

[0057] 〔summary〕 (1) A lid body according to aspect 1 of the present disclosure includes a transparent member that transmits light, and a first clamping member and a second clamping member that have an opening through which the light passes and clamp and fix the outer edge of the transparent member, and the first clamping member and the second clamping member are joined together using a sealing material containing a glass material.

[0058] (2) A lid according to aspect 2 of the present disclosure is the lid body according to aspect 1 above, wherein the first clamping member has a first recess for accommodating a portion of the transparent member, the first recess having the opening at its bottom, and a first sealing surface facing the second clamping member, the second clamping member has a second recess for accommodating a portion of the transparent member, the second recess having the opening at its bottom, and a second sealing surface facing the first clamping member, and the sealing material is positioned between the first sealing surface and the second sealing surface.

[0059] (3) A lid according to a third aspect of the present disclosure is the lid of the second aspect, wherein the sealing material extends to the inner wall surface of the first recess and / or the second recess.

[0060] (4) In the lid body according to aspect 4 of the present disclosure, in the above-mentioned aspect 2 or 3, at least one of the spaces between the transparent member and the bottom surface of the first recess and the spaces between the transparent member and the bottom surface of the second recess is joined via a second sealing material.

[0061] (5) A lid body according to aspect 5 of the present disclosure is the lid body according to aspect 4 above, wherein the transparent member has an optical thin film on the surface of the light-transmitting surface, in an area other than the area where the second sealing material is located, that adjusts the transmission of light.

[0062] (6) A lid according to aspect 6 of the present disclosure is the lid body according to aspect 1 above, wherein the first clamping member has a first recess for accommodating the transparent member, the first recess having the opening at the bottom, and a first sealing surface facing the second clamping member, and the second clamping member has a flat plate shape having a second sealing surface facing the first clamping member, and the first sealing surface and the second sealing surface and the transparent member and the second sealing surface are joined via the sealing material.

[0063] (7) In a lid according to a seventh aspect of the present disclosure, in the sixth aspect, the first sealing surface and the upper surface of the transmitting member are located on the same plane.

[0064] (8) In a lid according to an eighth aspect of the present disclosure, in addition to the sixth or seventh aspect, the sealing material is also positioned between the inner wall surface of the first recess and the side surface of the transmitting member.

[0065] (9) A lid body according to aspect 9 of the present disclosure is any one of aspects 6 to 8 above, wherein the transparent member has an optical thin film on the surface of the light-transmitting surface, in an area other than the area where the sealing material is located, that adjusts the transmission of light.

[0066] (10) In the cover body according to aspect 10 of the present disclosure, in any of aspects 6 to 9 above, when the opening of the first clamping member is defined as a first opening and the opening of the second clamping member is defined as a second opening, in a planar perspective view, the outer edge of the second opening is located outside the outer edge of the first opening.

[0067] (11) The lid according to an eleventh aspect of the present disclosure is in any one of the sixth to tenth aspects, wherein the first clamping member has a notch at a corner between two adjacent inner wall surfaces.

[0068] (12) A lid according to a twelfth aspect of the present disclosure is the lid of any one of the first to eleventh aspects, wherein the first clamping member and the second clamping member include a ceramic material.

[0069] (13) A package for storing an optical element according to aspect 13 of the present disclosure comprises a lid body according to any one of aspects 1 to 12 above, and a substrate on which an optical element is mounted, the substrate having a storage recess for storing the optical element.

[0070] (14) According to a fourteenth aspect of the present disclosure, in the optical element storage package of the thirteenth aspect, the lid and the substrate are bonded together with a bonding material containing a glass material.

[0071] (15) An electronic device according to a fifteenth aspect of the present disclosure includes the optical element storage package of the thirteenth or fourteenth aspect and an optical element.

[0072] [Additional Notes] The invention according to the present disclosure has been described above based on the drawings and examples. However, the invention according to the present disclosure is not limited to the above-described embodiments. In other words, the invention according to the present disclosure can be modified in various ways within the scope of the present disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention according to the present disclosure. In other words, it should be noted that a person skilled in the art would easily be able to make various modifications or corrections based on the present disclosure. It should also be noted that these modifications or corrections are included in the scope of the present disclosure. [Explanation of symbols]

[0073] 2, 2A...Lid body 21. Transparent member 212...Optical thin film 217···Side 22, 22A...first clamping member 225, 225A...First recess 225X...Inner wall surface 226...1st sealing surface OP, OP1...Opening, 1st opening 23, 23A...Second clamping member 235...Second recess 235X...Inner wall surface 236...Second sealing surface OP, OP2...opening, second opening 3. Substrate 31. Storage recess 40 Optical elements 50···Package 100...electronic equipment S···Sealing material S2...Second sealing material C...Joining material

Claims

1. a transparent member that transmits light; a first clamping member and a second clamping member that have an opening through which the light passes and that clamp and fix an outer edge of the transparent member; The lid body, wherein the first clamping member and the second clamping member are joined together using a sealing material containing a glass material.

2. the first clamping member has a first recess that accommodates a part of the transmitting member and has the opening at a bottom thereof, and a first sealing surface that faces the second clamping member; the second holding member has a second recess that accommodates a part of the transmitting member and has the opening at a bottom thereof, and a second sealing surface that faces the first holding member; The closure of claim 1 , wherein the sealant is located between the first sealing surface and the second sealing surface.

3. The lid according to claim 2 , wherein the sealing material extends to an inner wall surface of the first recess and / or the second recess.

4. The lid according to claim 2 , wherein at least one of the transparent member and the bottom surface of the first recess and the transparent member and the bottom surface of the second recess is bonded via a second sealing material.

5. The lid according to claim 4 , wherein the transparent member has an optical thin film for adjusting light transmission on the light-transmitting surface in an area other than an area where the second sealing material is located.

6. the first clamping member has a first recess that houses the transparent member and has the opening at a bottom thereof, and a first sealing surface that faces the second clamping member; the second clamping member has a flat plate shape and a second sealing surface facing the first clamping member; The lid according to claim 1 , wherein the first sealing surface and the second sealing surface, and the transparent member and the second sealing surface are bonded together via the sealing material.

7. The lid according to claim 6 , wherein the first sealing surface and an upper surface of the transparent member are located on the same plane.

8. The lid according to claim 6 , wherein the sealing material is also located between an inner wall surface of the first recess and a side surface of the transmitting member.

9. The cover according to claim 6 , wherein the transparent member has an optical thin film for adjusting light transmission on the light-transmitting surface in an area other than an area where the sealing material is located.

10. When the opening of the first clamping member is a first opening and the opening of the second clamping member is a second opening, The lid according to claim 6 , wherein an outer edge of the second opening is positioned outward from an outer edge of the first opening in a planar perspective view.

11. The lid according to claim 6 , wherein the first clamping member has a notch at a corner between two adjacent inner wall surfaces.

12. The lid according to claim 1 , wherein the first clamping member and the second clamping member include a ceramic material.

13. 13. An optical element storage package comprising: the lid according to claim 1; and a substrate on which an optical element is mounted, the substrate having a storage recess for storing the optical element.

14. 14. The optical element storage package according to claim 13, wherein the lid and the substrate are bonded together with a bonding material containing a glass material.

15. An electronic device comprising the optical element storage package according to claim 14 and an optical element.

Images