Measurement jig and measurement apparatus for electrical characteristic measurement
The measuring jig addresses measurement errors by using a tilting mechanism and flexible board to ensure perpendicular contact and consistent pressure, enhancing measurement accuracy.
Patent Information
- Application Number
- JP2024095267
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-12-24
AI Technical Summary
Existing measurement devices face issues with measurement errors due to varying pin angles and contact pressures when multiple pins contact electrodes, especially when the electrode surface is tilted, leading to inconsistent measurements.
A measuring jig with a tilting mechanism that allows the probe head to conform to the electrode surface, ensuring perpendicular contact and consistent contact pressure, using a tilting mechanism with a spherical connecting ball and clamping spring to maintain stable contact, and a flexible measurement board to accommodate positional differences.
The solution ensures stable and consistent contact pressure, reducing measurement errors and preventing damage to electrodes by maintaining perpendicular contact, thereby improving measurement accuracy.
Smart Images

Figure 2025186856000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a measuring jig used for measuring electrical characteristics and a measuring device including the measuring jig. [Background technology]
[0002] Measurement devices that measure electrical characteristics by contacting terminals with electrodes of a measurement target are known. Patent Document 1 below shows a measurement terminal (11) that is movable in the vertical direction (direction indicated by arrow Y in FIG. 1 ) and biased toward electrode portions (1, 2) of a chip-type resistor element (10). Patent Document 2 below shows a device that measures electrical characteristics at multiple locations on a plate-shaped object under test (50). Multiple metal terminal electrodes (11, 12) biased by springs (13) are brought into contact with the front and back surfaces of the object under test (50), and electrical characteristics between the metal terminal electrodes selected by terminal switches (31, 32) are measured. The reference symbols in parentheses above are the same as those used in Patent Documents 1 and 2 below, and are unrelated to the reference symbols used in the description of the embodiments of the present application. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Publication No. 10-148651 [Patent Document 2] Japanese Patent Application Publication No. 5-215771 Summary of the Invention [Problem to be solved by the invention]
[0004] It is desirable that the terminal or pin that contacts the electrode be positioned at a fixed angle, especially perpendicular, to the electrode surface. This is because a change in the pin angle changes the shape of the gap between the electrode and the pin around the contact point, which may result in measurement errors. Furthermore, when multiple terminals or pins are placed in contact with an electrode, if the electrode surface is tilted relative to the pin, the contact pressure of each pin will vary, which may result in measurement errors.
[0005] The present invention aims to at least one of positioning the pin that contacts the electrode to be measured perpendicular to the electrode surface, and reducing the variation in contact pressure between the pins when multiple pins are brought into contact with the electrode. [Means for solving the problem]
[0006] A measuring jig according to the present invention is a measuring jig used for measuring electrical characteristics of an object to be measured, and includes a measurement probe that contacts an electrode of the object to be measured and an advancing / retracting mechanism for advancing and retracting the measurement probe relative to the electrode. The measurement probe includes a probe base that is advanced and retracted by the advancing / retracting mechanism, a probe head that advances and retracts together with the probe base and has a contact surface that contacts the contact surface of the electrode when advanced, the probe head having at least one socket hole that opens on the contact surface, at least one contact pin that is housed in the socket hole and has a tip that is biased toward the electrode by a built-in spring and that is electrically connected to the electrode when it contacts the electrode, and a tilting mechanism that connects the probe base and the probe head so that the probe head can tilt relative to the probe base.
[0007] When the measurement probe advances, the tilting mechanism causes the contact surface of the probe head to conform to the contact surface of the electrode and come into close contact with it.
[0008] The above-mentioned measurement jig may include two measurement probes respectively corresponding to the two electrodes to be measured, and may further include a measurement board that is hung over the probe heads of the two measurement probes and has a flexible portion to allow for differences in position in the advancing / retracting direction of the two probe heads and for allowing for tilt relative to the advancing / retracting direction, and on which printed wiring is formed that is electrically connected to contact pins and a connector for connecting to a measurement instrument.
[0009] The flexibility of the measurement substrate allows the contact surface of the probe head to be brought into close contact with the contact surface of the electrode even if the positions in the advancing direction and the inclinations of the top surfaces of the contact surfaces of the two electrodes are different.
[0010] In the above measurement jig, the two measurement probes may each have a plurality of contact pins, and the printed wiring may include a first printed wiring connected to half of the plurality of contact pins of one measurement probe, a second printed wiring connected to the remaining contact pins, a third printed wiring connected to half of the plurality of contact pins of the other measurement probe, and a fourth printed wiring connected to the remaining contact pins.
[0011] By providing four printed wirings, it is possible to support wiring connections using the four-terminal method, the four-terminal pair method, and the four-terminal shunt-through method.
[0012] In the above-described measuring jig, the advancing / retracting mechanism may have a head biasing spring that biases the probe head toward the electrode when the probe head comes into contact with the electrode.
[0013] In the above-mentioned measuring jig, the tilting mechanism may have a spherical connecting ball arranged between the probe base and the probe head, ball receiving portions formed on the probe base and the probe head, respectively, for receiving the connecting ball, a clamping spring that urges the probe base and the probe head toward each other and clamps the connection ball between the probe base and the probe head, and a connecting bolt that connects the probe base and the probe head via the clamping spring.
[0014] Another aspect of the measuring device of the present invention is a measuring device that includes the above-mentioned measuring jig, and includes a measuring instrument that measures the high-frequency impedance between two electrodes of the measurement object, and a connection wire that connects the measuring instrument to a connector, and the measurement board includes first to fourth printed wirings, and the first printed wiring, second printed wiring, third printed wiring, and fourth printed wiring, as well as the connection wires that are respectively connected to these, are connected in accordance with the four-terminal method, the four-terminal pair method, or the shunt-through method.
[0015] Furthermore, the measurement object of the measuring jig and measuring device of the present invention may be a battery. [Effects of the Invention]
[0016] The tilting mechanism allows the contact surface of the probe head to conform to the contact surface of the electrode, thereby maintaining the contact pin in the socket hole perpendicular to the contact surface of the electrode. Furthermore, when multiple contact pins are brought into contact with the electrode, the variation in contact pressure between the contact pins can be reduced. [Brief explanation of the drawings]
[0017] [Figure 1] 1 is a diagram showing a schematic configuration of a measurement device according to an embodiment of the present invention; [Figure 2] FIG. 2 is an enlarged perspective view showing a main part of the measuring device of the present embodiment. [Figure 3] FIG. 2 is a cross-sectional view showing a main part of the measurement probe. [Figure 4] FIG. 10 shows contact pins housed in sockets of a probe head. [Figure 5] FIG. 10 is a view showing a contact pin alone. [Figure 6] FIG. 2 is a diagram illustrating an example of a measurement substrate. [Figure 7] FIG. 10 is a diagram showing another configuration example of the measurement substrate. [Figure 8] FIG. 10 is a diagram showing yet another configuration example of the measurement substrate. [Figure 9] FIG. 10 is a diagram showing yet another configuration example of the measurement substrate. [Figure 10] FIG. 10 is a diagram showing yet another configuration example of the measurement substrate. [Figure 11] 10A and 10B are diagrams illustrating another example of a tilting mechanism. DETAILED DESCRIPTION OF THE INVENTION
[0018] An embodiment of the present invention will now be described with reference to the drawings. Figures 1 and 2 show a schematic configuration of a measurement device 10 of this embodiment. Figure 1 is a front view showing the entire device, and Figure 2 is a partially enlarged perspective view.
[0019] The measurement device 10 measures the electrical characteristics of an object to be measured, such as high-frequency impedance characteristics. The object to be measured is, for example, a battery 12. The measurement device 10 includes a measurement jig 16 for contacting terminals (pins) for measurement with electrodes 14 of the battery 12, and a measurement instrument 18 for measuring the electrical characteristics based on the current flowing through the battery 12, etc. The measurement instrument 18 may be, for example, a network analyzer, an impedance analyzer, or a high-frequency sensor.
[0020] The measurement jig 16 has measurement probes 20 for establishing electrical connection with the electrodes 14 of the battery 12. Two measurement probes 20 having the same structure are provided corresponding to the two electrodes 14 of the battery 12. When it is necessary to distinguish between the two measurement probes 20, the measurement probe on the right side in the drawing will be referred to as measurement probe 20A, and the measurement probe on the left side will be referred to as measurement probe 20B. In the drawing, the measurement probe 20A on the right side is shown in an advanced position, with its tip in contact with the electrode 14. On the other hand, the measurement probe 20B on the left side is shown in a retracted position, with its tip away from the electrode 14.
[0021] The measurement jig 16 includes a mounting table 22 on which the battery 12 is placed and a gate-shaped frame 24 erected on the mounting table 22. The frame 24 supports two measurement probes 20 above the battery 12 and is equipped with an advance / retract mechanism 26 that moves the measurement probes 20 forward and backward relative to the electrodes 14 of the battery 12. In this measurement jig 16, the advance / retract direction coincides with the up / down direction. The advance / retract mechanism 26 includes an advance / retract base 28 that supports the measurement probes 20 and a toggle clamp 30 that moves the advance / retract base 28 forward and backward. The toggle clamp 30 is fixed to the frame 24 and supports the advance / retract base 28 in a suspending manner. Rotating a toggle lever 32 of the toggle clamp 30 advances and retracts a toggle rod 34. As the toggle rod 34 advances and retracts, the advance / retract base 28, which is connected to the end of the toggle rod 34, advances and retracts. The advance / retract base 28 has a support plate 36 that supports the measurement probes 20. A probe rod 38 of the measurement probe 20 slidably passes through the support plate 36. Instead of the toggle clamp 30, the advance / retract base 28 may be driven by an actuator such as an air cylinder or an electric motor.
[0022] The measurement probe 20 has a probe base 40 connected to the tip of the probe rod 38, and a probe head 42 connected to the probe base 40 so as to be tiltable relative to the probe base 40. The probe base 40 and the probe head 42 are connected by four connecting bolts 46 via springs 44. The probe head 42 has a socket 50 at its tip that houses a contact pin 48 (see FIG. 4) that comes into contact with the electrode 14 for electrical conduction.
[0023] A measurement board 52 is bridged between the two probe heads 42. The measurement board 52 is a printed circuit board with wiring formed on its surface. A connector 53 is mounted on the measurement board 52 to electrically connect the contact pins 48 housed in the probe head 42 to the measuring device 18. The measurement board 52 has a flexible portion to allow for differences in position between the two probe heads 42 in the advance / retract direction and changes in tilt relative to the advance / retract direction.
[0024] Fig. 3 is a cross-sectional view of the measurement probe 20. In Fig. 3, the portion to the left of the center line C of the probe rod 38 shows a cross section passing through the center line C, and the portion to the right shows a cross section parallel to the center line C and including the center lines of the two connecting bolts 46.
[0025] A head biasing spring 54, which is a coil spring, is provided coaxially with the probe rod 38 of the measurement probe 20. When the measurement probe 20 advances and the probe head 42 abuts against the electrode 14, the head biasing spring 54 contracts, and a reaction force is generated that biases the probe head 42 toward the electrode 14. This biasing force causes the probe head 42, and in particular its abutment surface 42 a, to come into close contact with the contact surface, which is the top surface 14 a of the electrode 14. The measurement probe 20 is provided with a tilting mechanism 56 for tilting the probe head 42 so that the abutment surface 42 a of the probe head can come into close contact with the top surface 14 a of the electrode 14 even if the top surface 14 a of the electrode 14 is tilted.
[0026] The tilting mechanism 56 includes a connection ball 58 disposed between the probe base 40 and the probe head 42. Ball receiving portions for receiving the connection ball 58 are formed on the opposing surfaces of the probe base 40 and the probe head 42. The ball receiving portion of the probe base 40 is referred to as the base receiving recess 60, and the ball receiving portion of the probe head 42 is referred to as the head receiving recess 62. The connection ball 58 is a sphere, and the base receiving recess 60 and the head receiving recess 62 are configured as a spherical crown or a spherical band that conforms to the surface of the connection ball 58. The spherical crown is the side of a spherical indentation, which is a portion of a sphere cut by a single plane, and the spherical band is the side of a spherical truncation, which is a portion of a sphere sandwiched between two parallel planes that intersect the sphere. The base receiving recess 60 and the head receiving recess 62 are components of the tilting mechanism 56. The probe base 40 and the probe head 42 tilt relative to each other by moving along the surface of the connection ball 58.
[0027] The tilting mechanism 56 further includes the aforementioned spring 44 and connecting bolt 46. The connecting bolt 46 passes through a through-hole 64 formed in the probe base 40, and its tip is threadedly connected to the probe head 42. The spring 44 is disposed in a compressed state between the head of the connecting bolt 46 and the probe base 40. The force of the compressed spring 44 urges the probe base 40 and the probe head 42 toward each other, and the connection ball 58 is sandwiched between the probe base 40 and the probe head 42. The spring 44 generates this sandwiching force, and this spring 44 will be referred to hereinafter as the sandwiching spring 44. The sandwiching spring 44 also allows the probe head 42 to tilt along the surface of the connection ball 58 by its expansion and contraction. At this time, the connecting bolt 46 tilts relative to the probe base 40. To allow this tilting, the end of the through-hole 64 on the probe head 42 side is provided with a tapered portion that widens toward the probe head 42. Furthermore, when no external force is applied, the biasing force of the clamping spring 44 holds the probe head 42 in a neutral position, that is, a position in which the contact surface 42 a of the probe head 42 is perpendicular to the advancing and retracting direction of the measurement probe 20 .
[0028] When the measurement probe 20 contacts the electrode 14, the head biasing spring 54 presses the probe head 42 against the top surface 14a of the electrode. If the top surface 14a of the electrode is tilted, that is, if the normal to the top surface 14a is tilted with respect to the direction of advancement and retreat of the measurement probe 20, the tilting mechanism 56 tilts the probe head 42 in accordance with the tilt of the top surface 14a. The top surface 14a of the electrode and the contact surface 42a of the probe head then come into close contact. The probe head 42 can be tilted in any direction from a neutral position where the contact surface 42a is perpendicular to the direction of advancement and retreat.
[0029] In the tilting mechanism 56, the connection ball 58 is a separate component from the probe base 40 and the probe head 42, but may be configured as an integral part of either the probe base 40 or the probe head 42. For example, the tilting mechanism can be configured so that a spherically-notched protrusion is provided on the probe base 40, and the probe head 42 moves and tilts along the surface of this protrusion.
[0030] 4A and 4B are enlarged cross-sectional views of the tip of the probe head 42, in which (a) shows the state when the measurement probe 20 is in the retracted position, and (b) shows the state when it is in the advanced position.
[0031] A plate-shaped socket 50 is disposed at the tip of the probe head 42, and the underside of the socket 50 in FIG. 4 defines the contact surface 42a of the probe head 42. The socket 50 is formed with a plurality of socket holes 66 that penetrate the socket 50 in the thickness direction of the socket 50. The socket holes 66 extend in a direction perpendicular to the contact surface 42a of the probe head. The socket holes 66 are arranged vertically and horizontally, and each one houses a contact pin 48. The socket hole 66 is a stepped cylindrical hole having two cylindrical portions with different diameters. The diameter of the portion of the socket hole 66 facing the contact surface 42a of the probe head is smaller than the diameter of the portion on the opposite side. A measurement substrate 52 is disposed on the side of the socket 50 opposite the contact surface 42a.
[0032] FIG. 5 is a perspective view of the contact pin 48. When placed in the socket 50, the contact pin 48 has a pin base 68 that faces the measurement substrate 52 and a pin tip 70 that faces the abutment surface 42a. The pin base 68 and pin tip 70 are generally cylindrical, with the diameter of the pin tip 70 being larger than the diameter of the pin base 68. The pin tip 70 also has a large-diameter portion 70a that has a larger diameter. A step formed by this large-diameter portion 70a engages with the stepped portion of the socket hole 66, preventing the contact pin 48 from falling out of the socket 50. The tip of the pin tip 70 is provided with four contact protrusions 72 that contact the electrode 14. Each contact protrusion 72 may be shaped like a cone, with the tip of the cone contacting the electrode 14. The number of contact protrusions 72 is not limited to four. The end face of the pin base 68 is spherical and contacts a printed wiring 74 on the measurement substrate 52.
[0033] The contact pin 48 has a built-in spring that urges the pin base 68 and the pin tip 70 in directions that move them away from each other. When the contact pin 48 is accommodated in the socket hole 66, the urging force of the built-in spring causes the pin base 68 to abut against the measurement substrate 52 and the large-diameter portion 70a to abut against the stepped portion of the socket hole 66, thereby holding the contact pin 48 in the socket hole 66. At this time, the tip of the contact protrusion 72 protrudes from the opening of the abutment surface 42a of the socket hole 66. When the probe head 42 abuts against the electrode 14, the pin tip 70 is pushed into the socket hole 66 by the electrode 14, but contact with the electrode 14 is maintained. The movement of the pin tip 70 as the contact pin 48 extends and retracts is along a direction perpendicular to the abutment surface 42a of the probe head.
[0034] The contact pressure of the contact pin 48 against the electrode 14 is determined by the amount of compression from when the tip of the contact pin 48 protrudes from the contact surface 42a to when it is flush with the contact surface 42a. Even if the force pressing the probe head 42 against the electrode 14 changes, the amount of compression does not change, and therefore the contact pressure of the contact pin 48 does not change. Stable contact pressure helps reduce errors when measuring electrical characteristics. Furthermore, preventing excessive contact pressure can suppress damage to the surface of the electrode 14. Note that the contact pressure when the tip of the contact pin 48 is flush with the contact surface 42a is set by the spring constant of the spring built into the contact pin 48 or the thickness of the socket 50, etc., so as not to damage the surface of the electrode 14.
[0035] Furthermore, by providing the tilting mechanism 56, when the probe head 42 contacts the electrode 14, the contact surface 42a of the probe head conforms to the top surface 14a of the electrode. As a result, even if the top surface 14a of the electrode is tilted, the contact surface 42a of the probe head adheres tightly to the top surface 14a. The multiple contact pins 48 are uniformly compressed, suppressing variations in contact pressure between the contact pins 48. This also helps reduce errors when measuring electrical characteristics. Furthermore, by having the probe head 42 conform to the top surface 14a of the electrode, the contact pins 48 contact the top surface 14a at a constant angle, particularly perpendicularly. As a result, the distance between the surface of the contact pin 48 and the top surface 14a of the electrode is stabilized around the contact point of the contact pin 48, helping to reduce errors when measuring electrical characteristics. Furthermore, when a single pin, such as contact pin 48, contacts the electrode at multiple points, contacting the electrode with contact pin 48 in a vertical position can prevent some contact points from being lost or the contact pressure from varying between contact points.
[0036] 6 is a diagram showing the measurement substrate 52, where (a) shows the state as viewed from below in FIG. 1, and (b) is a perspective view as viewed from above. The measurement substrate 52 is roughly rectangular, with both longitudinal ends and the center portion made of stiff rigid substrates, and the space between the rigid substrates made of flexible substrates. The rigid substrates at the ends are referred to as end rigid substrates 76, the rigid substrate at the center is referred to as center rigid substrate 78, and the flexible substrate connecting the end rigid substrates 76 and the center rigid substrate 78 is referred to as flexible substrate 80. The center rigid substrate 78 is positioned so as to be equidistant from the end rigid substrates 76 at both ends.
[0037] The two end rigid boards 76 are housed in the left and right probe heads 42, respectively. In addition, the central rigid board 78 is mounted with two connectors 53 to which connection wires 82 for connection to the measuring instrument 18 are coupled. The connection wires 82 are coaxial cables, and the connectors 53 are connectors for coaxial cables. When it is necessary to distinguish between the two connectors 53, one is indicated by the reference symbol 53A and the other by the reference symbol 53B. Printed wiring 74 that electrically connects the contact pins 48 and the connectors 53 is formed on the underside of the measurement board 52 in FIG. 1.
[0038] The printed wiring 74 includes a first printed wiring 74A that connects half of the contact pins 48 belonging to the right-side measurement probe 20A to the core wires 84A of the first connector 53A, and a second printed wiring 74B that connects the remaining half of the contact pins 48 belonging to the measurement probe 20A to the core wires 84B of the second connector 53B. The printed wiring 74 further includes a third printed wiring 74C that connects half of the contact pins 48 belonging to the left-side measurement probe 20B to the shield portion 86A of the first connector 53A, and a fourth printed wiring 74D that connects the remaining half of the contact pins 48 belonging to the measurement probe 20B to the shield portion 86B of the second connector 53B. The first to fourth printed wirings 74A to 74D have contact terminals 88A to 88D that come into contact with the corresponding contact pins 48 on the end rigid substrate 76.
[0039] This measurement board 52 is suitable for impedance measurement using a four-terminal shunt-through method. In this case, the measurement device 18 is a network analyzer, and one of the first printed wiring 74A and the second printed wiring 74B is connected to a first port of the network analyzer via a connection line 82, and the other is connected to a second port. The third printed wiring 74C and the fourth printed wiring 74D are also connected to a ground conductor via the connection line 82. Using a coaxial cable for the connection line 82 reduces the effects of inductive coupling between the wiring, helping to reduce measurement errors. Generally, if the contact pin 48 and the electrode 14 are simply pressed against each other rather than connected by soldering or bolting, the contact resistance fluctuates with each contact, contributing to measurement errors. However, the four-terminal shunt-through method shown in FIG. 6 can cancel the contact resistance between the contact pin 48 and the electrode 14, thereby reducing measurement errors.
[0040] Measurement methods other than the four-terminal shunt-through method, such as the four-terminal method and the four-terminal pair method, can also be used. Fig. 7 shows the configuration of a measurement substrate 90 and connection lines 92 compatible with the four-terminal method, and Fig. 8 shows the configuration of a measurement substrate 100 and connection lines 102 compatible with the four-terminal pair method. Components similar to those in the measurement substrate 52 described above are given the same reference numerals and their description will be omitted.
[0041] In the measurement board 90, the first printed wiring 74A and the third printed wiring 74C are connected to a voltmeter 94 via connecting wires. The wires connected to the first printed wiring 74A and the wires connected to the third printed wiring 74C are twisted together to form a twisted connecting wire 92A. Furthermore, the second printed wiring 74B and the fourth printed wiring 74D are connected to an ammeter 96 via connecting wires. The wires connected to the second printed wiring 74B and the wires connected to the fourth printed wiring 74D are twisted together to form a twisted connecting wire 92B. Furthermore, the connecting wire 92 may be formed by twisting together the four wires connected to the first to fourth printed wirings 74A to 74D. By twisting the wires together, the influence of inductive coupling between the wires can be reduced.
[0042] In the measurement board 100, four connectors 106, each with a shield 104 connected to it, are mounted on the central rigid board 78. The connectors 106 are connectors for coaxial cables. A coaxial cable is connected to each connector 106. A measurement signal 108 is input to the first printed wiring 74A and the shield 104. The third printed wiring 74C and the shield 104 are connected to an ammeter 96, and the second printed wiring 74B and the fourth printed wiring 74D are connected to a voltmeter 94. Currents flow in opposite directions through the core wire and shield of the coaxial cable connected to the connector 106, thereby reducing the effects of inductive coupling.
[0043] 9 shows an example of a measurement board compatible with the two-terminal method. Components similar to those in the measurement board 52 described above are assigned the same reference numerals, and their description will be omitted. The measurement board 110 has a fifth printed wiring 74E that contacts the contact pin 48 belonging to the measurement probe 20A on the right side in FIGS. 1 and 2 and extends to the central rigid board 78, and a sixth printed wiring 74F that contacts the contact pin 48 belonging to the measurement probe 20B on the left side and extends to the central rigid board 78. The ends of the fifth printed wiring 74E and the sixth printed wiring 74F on the central rigid board 78 are connected to a voltmeter 94 and an ammeter 96.
[0044] FIG. 10 shows an example of a measurement board compatible with the two-terminal shunt-through method. Components similar to those in the measurement board 52 described above are assigned the same reference numerals and will not be described again. The measurement board 110 includes a fifth printed wiring 74E that contacts the contact pin 48 belonging to the measurement probe 20A on the right side in FIGS. 1 and 2 and extends to the central rigid substrate 78, and a sixth printed wiring 74F that contacts the contact pin 48 belonging to the measurement probe 20B on the left side and extends to the central rigid substrate 78. The fifth printed wiring 74E is connected to the first and second ports of the network analyzer, which is the measuring instrument 18, and the sixth printed wiring 74F is connected to a ground terminal. When using a measurement board 110 compatible with the two-terminal method or a measurement board 120 compatible with the two-terminal shunt-through method, at least one contact pin 48 may be provided for each measurement probe 20.
[0045] 11A to 11C are diagrams showing other aspects of the tilting mechanism. The tilting mechanisms 130, 140, and 150 shown in FIGS. 11A to 11C are composed of elastic bodies provided between the probe base 40 and the probe head 42. The elastic body of the tilting mechanism 130 is composed of a sponge 132. The elastic body of the tilting mechanism 140 is composed of a spring, particularly a coil spring 142. The elastic body of the tilting mechanism 150 is composed of rubber 144. When the probe head 42 abuts against the electrode 14, the probe head 42 tilts due to deformation of the elastic body so that the abutment surface 42 a of the probe head 42 follows the top surface 14 a of the electrode 14.
[0046] [Configuration of the present invention] [Configuration 1] A measurement jig used to measure electrical characteristics of a measurement object, a measurement probe that contacts the electrode of the measurement target; an advancing / retracting mechanism for advancing / retracting the measurement probe relative to the electrode; Equipped with The measurement probe includes: a probe base portion that is advanced and retracted by the advancement and retraction mechanism; a probe head having a contact surface that moves forward and backward together with the probe base and contacts the contact surface of the electrode when the probe base moves forward, the probe head having at least one socket hole that opens onto the contact surface; at least one contact pin housed in the socket hole, the tip of which is biased toward the electrode by a built-in spring, and which is electrically connected to the electrode when it comes into contact with the electrode; a tilting mechanism that connects the probe base and the probe head so that the probe head can tilt with respect to the probe base; and When the measurement probe advances, the tilting mechanism causes the abutment surface of the probe head to conform to and come into close contact with the contact surface of the electrode. Measuring fixture. [Configuration 2] The measurement jig according to claim 1, The measurement jig includes two measurement probes respectively corresponding to two electrodes of the measurement object, and further includes: a measurement board that is bridged over the probe heads of the two measurement probes, the measurement board having a flexible portion for allowing for a difference in position between the two probe heads in the advance / retract direction and for allowing for tilt with respect to the advance / retract direction, and on which printed wiring electrically connected to the contact pins and a connector for connecting to a measurement device is formed; A measuring jig comprising: [Configuration 3] The measuring jig according to claim 2, each of the two measurement probes has a plurality of the contact pins; the printed wiring includes a first printed wiring connected to half of the plurality of contact pins of one of the measurement probes, a second printed wiring connected to the remaining contact pins, a third printed wiring connected to half of the plurality of contact pins of the other measurement probe, and a fourth printed wiring connected to the remaining contact pins; Measuring fixture. [Configuration 4] The measurement jig according to any one of claims 1 to 3, the advancing / retracting mechanism has a head biasing spring that biases the probe head toward the electrode when the probe head abuts against the electrode. Measuring fixture. [Configuration 5] The measurement jig according to any one of claims 1 to 4, The tilting mechanism includes: a spherical connecting ball disposed between the probe base and the probe head; ball receiving portions formed on the probe base and the probe head, respectively, for receiving the connection balls; a clamping spring that biases the probe base and the probe head toward each other, thereby clamping the connection ball between the probe base and the probe head; a coupling bolt that couples the probe base and the probe head via the clamping spring; having Measuring fixture. [Configuration 6] A measuring device including the measuring jig according to claim 3, the measuring device that measures the high frequency impedance between the two electrodes of the measurement target; a connection line connecting the measuring instrument and the connector; Including, the first printed wiring, the second printed wiring, the third printed wiring, and the fourth printed wiring, and the connecting lines respectively connected thereto, are connected in accordance with a four-terminal method, a four-terminal pair method, or a shunt-through method; Measuring equipment. [Configuration 7] 7. The measurement jig according to claim 1, wherein the measurement object is a battery. [Explanation of symbols]
[0047] 10 measuring device, 12 battery, 14 electrode, 14a top surface (contact surface) of electrode, 16 measuring jig, 18 measuring machine, 20 measuring probe, 22 mounting table, 24 frame, 26 advance / retract mechanism, 28 advance / retract base, 30 toggle clamp, 38 probe rod, 40 probe base, 42 probe head, 42a contact surface of probe head, 44 clamping spring, 46 connecting bolt, 48 contact pin, 50 socket, 52, 90, 100, 110, 120 measuring board, 53, 106 connector, 54 head biasing spring, 56 tilting mechanism, 58 connecting ball, 60 base receiving recess, 62 head receiving recess, 66 socket hole, 68 pin base, 70 pin tip, 72 contact protrusion, 74 printed wiring, 76 end rigid board, 78 central rigid board, 80 flexible board, 82, 92, 102 connecting wires.
Claims
1. A measurement jig used to measure electrical characteristics of a measurement object, a measurement probe that contacts the electrode of the measurement target; an advancing / retracting mechanism for advancing / retracting the measurement probe relative to the electrode; Equipped with The measurement probe includes: a probe base portion that is advanced and retracted by the advancement and retraction mechanism; a probe head having a contact surface that moves forward and backward together with the probe base and contacts the contact surface of the electrode when the probe base moves forward, the probe head having at least one socket hole that opens onto the contact surface; at least one contact pin housed in the socket hole, the tip of which is biased toward the electrode by a built-in spring, the contact pin electrically conducting with the electrode when it comes into contact with the electrode; a tilting mechanism that connects the probe base and the probe head so that the probe head can tilt with respect to the probe base; and When the measurement probe advances, the tilting mechanism causes the abutment surface of the probe head to conform to and come into close contact with the contact surface of the electrode. Measuring fixture.
2. The measurement jig according to claim 1, The measurement jig includes two measurement probes respectively corresponding to two electrodes of the measurement object, and further includes: a measurement board that is bridged over the probe heads of the two measurement probes, the measurement board having a flexible portion for allowing for a difference in position of the two probe heads in the advancing / retracting direction and an inclination with respect to the advancing / retracting direction, and on which printed wiring electrically connected to the contact pins and a connector for connecting to a measuring device is formed; A measuring jig comprising:
3. The measurement jig according to claim 2, each of the two measurement probes has a plurality of the contact pins; the printed wiring includes a first printed wiring connected to half of the plurality of contact pins of one of the measurement probes, a second printed wiring connected to the remaining contact pins, a third printed wiring connected to half of the plurality of contact pins of the other measurement probe, and a fourth printed wiring connected to the remaining contact pins; Measuring fixture.
4. The measurement jig according to claim 1, the advancing / retracting mechanism has a head biasing spring that biases the probe head toward the electrode when the probe head abuts against the electrode. Measuring fixture.
5. The measurement jig according to claim 1, The tilting mechanism includes: a spherical connecting ball disposed between the probe base and the probe head; ball receiving portions formed on the probe base and the probe head, respectively, for receiving the connection balls; a clamping spring that biases the probe base and the probe head toward each other to clamp the connection ball between the probe base and the probe head; a coupling bolt that couples the probe base and the probe head via the clamping spring; having Measuring fixture.
6. A measuring device including the measuring jig according to claim 3, the measuring device that measures the high-frequency impedance between the two electrodes of the measurement target; a connection line connecting the measuring instrument and the connector; Including, the first printed wiring, the second printed wiring, the third printed wiring, and the fourth printed wiring, and the connecting lines respectively connected thereto, are connected in accordance with a four-terminal method, a four-terminal pair method, or a shunt-through method; Measuring equipment.
7. The measurement jig according to claim 1 or the measurement device according to claim 6, wherein the measurement object is a battery.
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