Lead frame, semiconductor device and method for manufacturing lead frame

Abstract

To prevent a tape from peeling off.SOLUTION: A lead frame includes a die pad, a lead, a bus bar, and a tape. The die pad has a mounting surface for a semiconductor chip. The lead is arranged around the die pad. The bus bar is provided between the die pad and the lead and is supported by a suspension lead. The tape is attached to the lead and the suspension lead. The suspension lead is folded at a position away from the attachment position of the tape toward the bus bar side to be inclined to the lead and arranges a wire connection surface of the bus bar at a position lower than a wire connection surface of the lead.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a lead frame, a semiconductor device, and a method for manufacturing a lead frame. [Background technology]

[0002] In recent years, semiconductor devices have become known in which a semiconductor chip, such as an IC (Integrated Circuit) chip, is mounted on a metal lead frame. Specifically, the semiconductor chip is mounted on a planar die pad provided in the center of the lead frame, and the semiconductor chip is connected to multiple leads provided around the die pad by, for example, wire bonding. The semiconductor chip mounted on the lead frame is then sometimes encapsulated with a resin, such as epoxy resin, to form a semiconductor device.

[0003] Furthermore, in order to prevent an increase in the number of leads, a common wiring called a bus bar is sometimes provided between the die pad and the leads. The bus bar is supported by the suspension leads. When a lead frame with a bus bar is used, the semiconductor chip mounted on the die pad is connected not only to the leads but also to the bus bar by, for example, wire bonding.

[0004] In a lead frame equipped with a bus bar, the leads and the suspension leads supporting the bus bar are fixed with, for example, tape, and the suspension leads are sometimes bent to lower the position of the bus bar. That is, insulating tape is applied to the leads and the suspension leads, and the suspension leads are bent at the tape application position to be inclined downward relative to the leads, so that the wire connection surface of the bus bar is positioned lower than the wire connection surface of the leads. By bending the suspension leads at the tape application position to lower the position of the bus bar, the distance between the wires connected to the leads and the wires connected to the bus bar increases when wire bonding to a semiconductor chip is performed, thereby suppressing short-circuit defects between the wires. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-74572 Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the suspension leads are bent at the tape attachment position to lower the bus bar position, there is a problem that the tape easily peels off from the suspension leads. Specifically, because the tape attachment position overlaps with the bending position of the suspension leads, the flatness of the suspension leads at the tape attachment position is reduced. As a result, the adhesion between the tape and the suspension leads is reduced, and the tape may peel off from the suspension leads. If the tape peels off from the suspension leads, the suspension leads and the bus bar supported by the suspension leads will flap, degrading the quality of the lead frame and semiconductor device.

[0007] The disclosed technology has been made in view of the above, and aims to provide a lead frame, a semiconductor device, and a method for manufacturing a lead frame that can suppress peeling of the tape. [Means for solving the problem]

[0008] In one aspect, the lead frame disclosed herein includes a die pad, leads, a bus bar, and a tape. The die pad has a mounting surface for a semiconductor chip. The leads are arranged around the die pad. The bus bar is provided between the die pad and the leads and is supported by a suspension lead. The tape is attached to the leads and the suspension lead. The suspension lead is bent at a position away from the tape attachment position toward the bus bar and is inclined relative to the leads, so that the wire connection surface of the bus bar is positioned lower than the wire connection surface of the leads. [Effects of the Invention]

[0009] According to one aspect of the lead frame disclosed in the present application, it is possible to suppress peeling of the tape. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view showing the structure of a lead frame according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is an enlarged plan view showing the structure of the suspension lead. [Figure 4] FIG. 4 is a cross-sectional view showing the structure of a suspension lead. [Figure 5] FIG. 5 is a flowchart showing a method for manufacturing a lead frame according to the embodiment. [Figure 6] FIG. 6 is a diagram showing a specific example of a lead frame forming process. [Figure 7] FIG. 7 is a diagram showing a specific example of the tape application step. [Figure 8] FIG. 8 is a diagram showing a specific example of the die pad down-setting step. [Figure 9] FIG. 9 is a flowchart showing a method for manufacturing a semiconductor device according to the embodiment. [Figure 10] FIG. 10 is a diagram showing a specific example of a semiconductor chip mounting process. [Figure 11] FIG. 11 is a diagram showing a specific example of a wire bonding process. [Figure 12] FIG. 12 is a diagram illustrating connection to a semiconductor chip by wires. [Figure 13] FIG. 13 is a diagram illustrating connection to a semiconductor chip by wires. [Figure 14] FIG. 14 is a diagram illustrating connection to a semiconductor chip by a wire. [Figure 15] FIG. 15 is a diagram showing a specific example of the resin sealing step. [Figure 16] FIG. 16 is a diagram showing a specific example of the singulation step. [Figure 17] FIG. 17 is a diagram showing a specific example of the bending process. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the lead frame, semiconductor device, and lead frame manufacturing method disclosed in the present application will be described in detail with reference to the drawings. However, the disclosed technology is not limited to these embodiments.

[0012] FIG. 1 is a plan view showing the structure of a lead frame 100 according to an embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. The lead frame 100 is manufactured as an assembly of multiple connected lead frames 100, and FIG. 1 shows one lead frame 100 in the assembly. In the following description, when a semiconductor chip is mounted on the lead frame 100, the surface facing the semiconductor chip is referred to as the "top surface," and the surface facing the opposite side to the semiconductor chip is referred to as the "bottom surface," and the up-down direction is defined accordingly. However, the lead frame 100 may be manufactured and used upside down, for example, or in any orientation.

[0013] 1 and 2, the lead frame 100 has a frame body 110, leads 120, support bars 130, dam bars 140, a die pad 150, bus bars 160, and suspension leads 170. The lead frame 100 is formed from a metal plate such as copper or a copper alloy having a thickness of, for example, about 0.1 to 0.25 mm. Tape 180 is attached to the leads 120, support bars 130, and suspension leads 170.

[0014] The frame 110 defines the outer periphery of one lead frame 100 and supports the leads 120, support bar 130, die pad 150, bus bar 160, and suspension leads 170. When manufacturing the lead frame 100, a plurality of lead frames 100 are connected via the frame 110 to form an assembly. After a semiconductor chip is mounted on the lead frame 100 and sealed with resin, the dam bars 140 between the leads 120 are cut, and the portion including the leads 120, support bar 130, die pad 150, bus bar 160, and suspension leads 170 is separated from the frame 110. This results in individual semiconductor devices.

[0015] When a semiconductor chip is mounted on the lead frame 100, the leads 120 form terminals that electrically connect the semiconductor chip to external components. That is, when a semiconductor chip is mounted on the lead frame 100, the semiconductor chip is connected to the leads 120 by, for example, wire bonding. A plurality of leads 120 are formed on the lead frame 100 so as to surround the die pad 150, and adjacent leads 120 are connected by a dam bar 140.

[0016] The lead 120 also has an inner lead 121 and an outer lead 122. The inner lead 121 is formed closer to the die pad 150 than the dam bar 140, and is electrically connected to a semiconductor chip mounted on the die pad 150. That is, when the semiconductor chip mounted on the die pad 150 is connected to the lead 120 by, for example, wire bonding, the semiconductor chip is connected to a wire bonding surface 121a of the inner lead 121 via a wire. The wire bonding surface 121a is formed on the upper surface of the tip of the inner lead 121.

[0017] The outer leads 122 are formed farther from the die pad 150 than the dam bar 140, and serve as terminals for electrical connection to external components. When the semiconductor chip mounted on the die pad 150 is sealed with resin, the inner leads 121 are sealed with the resin together with the semiconductor chip, while the outer leads 122 are exposed from the resin.

[0018] The support bar 130 connects the frame body 110 and the die pad 150 and supports the die pad 150. When the semiconductor chip mounted on the die pad 150 is resin-sealed, the support bar 130 is sealed with resin together with the semiconductor chip. After the resin sealing, the support bar 130 is separated from the frame body 110.

[0019] Dam bar 140 connects a plurality of leads 120 and hanging leads 170 that are arranged adjacent to each other, and further connects these plurality of leads 120 and hanging leads 170 to frame body 110. Dam bar 140 is cut after the semiconductor chip mounted on die pad 150 is resin-encapsulated, thereby separating leads 120 and hanging leads 170 connected to dam bar 140.

[0020] The die pad 150 is a planar area formed in the center of the lead frame 100, and is connected to the frame body 110 by, for example, four support bars 130. The die pad 150 has a square or rectangular upper surface 150a (an example of a mounting surface) with a side measuring, for example, about 2 to 20 mm, and a semiconductor chip is mounted on this upper surface 150a. The die pad 150 is disposed at a position lower than the leads 120. This arrangement reduces the difference in height between the upper surface (wire bonding surface) of the semiconductor chip mounted on the die pad 150 and the wire bonding surface 121a of the inner lead 121, thereby improving the efficiency of wire bonding.

[0021] The bus bar 160 is a strip-shaped region formed between the die pad 150 and the leads 120 along each side of the die pad 150, and is connected to the frame 110 by, for example, two suspension leads 170. When a semiconductor chip is mounted on the lead frame 100, the bus bar 160 forms, together with the suspension leads 170, a common wiring that electrically connects the semiconductor chip to an external component. That is, when the semiconductor chip mounted on the die pad 150 is connected to the leads 120 by, for example, wire bonding, the semiconductor chip is connected not only to the leads 120 but also to the bus bar 160. At this time, the semiconductor chip is connected to a wire connection surface 160a of the bus bar 160 via a wire. The wire connection surface 160a is formed on the upper surface of the bus bar 160.

[0022] The suspension lead 170 connects the frame body 110 and the bus bar 160 and supports the bus bar 160. Like the lead 120, the suspension lead 170 has an inner lead and an outer lead. That is, the inner lead of the suspension lead 170 is formed closer to the die pad 150 than the dam bar 140 and is connected to the bus bar 160. On the other hand, the outer lead of the suspension lead 170 is formed farther from the die pad 150 than the dam bar 140 and serves as a terminal for electrically connecting to external components. When a semiconductor chip mounted on the die pad 150 is resin-encapsulated, the inner lead of the suspension lead 170 is encapsulated with resin together with the semiconductor chip, while the outer lead of the suspension lead 170 is exposed from the resin. The suspension lead 170 is bent and inclined relative to the lead 120. The inclined structure of the suspension lead 170 will be described later.

[0023] The tape 180 is a film-like insulating member that can be attached to the leads 120, the support bar 130, and the suspension leads 170, straddling the leads 120, the support bar 130, and the suspension leads 170. For example, an insulating resin such as polyimide can be used as the tape 180. The tape 180 has, for example, a polygonal ring shape in a plan view, and is attached to predetermined attachment positions on the upper surfaces of the support bar 130, the inner leads 121 of the leads 120, and the inner leads of the suspension leads 170, thereby fixing the support bar 130, the leads 120, and the suspension leads 170. By attaching the tape 180 to the leads 120 and the suspension leads 170, flapping of the leads 120, the suspension leads 170, and the bus bar 160 supported by the suspension leads 170 is suppressed.

[0024] Here, the inclined structure of the suspension lead 170 will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is an enlarged plan view showing the structure of the suspension lead 170. Fig. 4 is a cross-sectional view showing the structure of the suspension lead 170. Fig. 4 shows a cross section along the longitudinal direction of the suspension lead 170.

[0025] 3 and 4, the suspension lead 170 is bent at a position P1 away from the attachment position of the tape 180 toward the bus bar 160, and is inclined downward with respect to the inner lead 121. As a result, the suspension lead 170 positions the wire connection surface 160a of the bus bar 160 at a position lower than the wire connection surface 121a of the inner lead 121.

[0026] That is, the suspension lead 170 extends in a direction along the upper surface 150a of the die pad 150 from the attachment position of the tape 180 to position P1 (hereinafter referred to as the "planar direction"), is bent at position P1, and slopes downward on the bus bar 160 side from position P1. The suspension lead 170 is bent at position P1 by plastic deformation. The separation distance between the attachment position of the tape 180 and position P1 is set, for example, to a distance that prevents the plastic deformation of the suspension lead 170 at position P1 from reaching the attachment position of the tape 180. This separation distance may be, for example, a distance greater than 1 / 10 of the width of the tape 180. The width of the tape 180 may be, for example, approximately 0.8 to 1.2 mm.

[0027] In this way, the suspension lead 170 is bent at a position P1 away from the attachment position of the tape 180 toward the bus bar 160, and is inclined downward relative to the inner lead 121. Therefore, the attachment position of the tape 180 and the bending position of the suspension lead 170 do not overlap, and the flatness of the attachment position of the tape 180 on the suspension lead 170 is maintained. As a result, the adhesion between the tape 180 and the suspension lead 170 can be improved, and peeling of the tape 180 from the suspension lead 170 can be suppressed.

[0028] Furthermore, the suspension lead 170 is inclined downward relative to the inner lead 121, and the wire connection surface 160a of the bus bar 160 is positioned lower than the wire connection surface 121a of the inner lead 121. This increases the distance between the wire connected to the inner lead 121 and the wire connected to the bus bar 160 when wire bonding is performed between the bus bar 160 and the semiconductor chip, thereby suppressing short-circuit defects between the wires.

[0029] 3, the suspension lead 170 may be bent in the planar direction at a bending position P2 that is closer to the bus bar 160 than the attachment position of the tape 180. In this case, the suspension lead 170 is bent in the planar direction at a position P1 that is away from the attachment position of the tape 180 toward the bus bar 160 and does not overlap with the bending position P2. If the suspension lead 170 were bent at a position that overlaps with the bending position P2, a twist would occur in the suspension lead 170, and this twist of the suspension lead 170 would be transmitted to the bus bar 160, potentially causing the bus bar 160 to deform in the twisted direction of the suspension lead 170. In contrast, the suspension lead 170 is bent at a position P1 that does not overlap with the bending position P2. This makes it possible to suppress deformation of the bus bar 160 due to twisting of the suspension lead 170.

[0030] Furthermore, it is preferable that the suspension lead 170 is bent in a direction intersecting the planar direction at a position away from the attachment position of the tape 180 toward the bus bar 160 and before reaching the bending position P2. This allows the position of the bus bar 160 to be lowered to a predetermined position with a small amount of bending of the suspension lead 170, thereby preventing damage to the suspension lead 170 due to plastic deformation.

[0031] Furthermore, the suspension lead 170 has the wire connection surface 160a of the bus bar 160 located at a position lower than the wire connection surface 121a of the inner lead 121 and higher than the upper surface 150a of the die pad 150. This makes it possible to suppress an increase in the amount of bending of the suspension lead 170, thereby avoiding damage to the suspension lead 170 due to plastic deformation.

[0032] Next, a method for manufacturing the lead frame 100 configured as above will be described with reference to Fig. 5. Fig. 5 is a flowchart showing the method for manufacturing the lead frame 100 according to the embodiment.

[0033] First, the lead frame 100 is formed by pressing or etching a metal plate made of copper, copper alloy, or the like having a thickness of, for example, about 0.1 to 0.25 mm (step S101). Simultaneously with or after the formation of the lead frame 100, the suspension leads 170 are bent (step S102).

[0034] Specifically, as shown in Fig. 6, unnecessary portions of a metal plate are removed by press working, etching, or the like, thereby forming the leads 120, support bar 130, dam bar 140, die pad 150, bus bar 160, and suspension lead 170 within an area surrounded by a frame body 110. Fig. 6 is a diagram showing a specific example of a lead frame forming process. When the lead frame 100 is formed by press working, the suspension lead 170 is bent at position P1 (see Fig. 3) away from the attachment position of the tape 180 toward the bus bar 160 at the same time as the lead frame 100 is formed. On the other hand, when the lead frame 100 is formed by etching, after the lead frame 100 is formed, the suspension lead 170 is bent at position P1 (see Fig. 3) away from the attachment position of the tape 180 toward the bus bar 160 by press working, for example. By bending the suspension lead, suspension lead 170 is inclined relative to inner lead 121 of lead 120, and wire connection surface 160a of bus bar 160 is disposed at a position lower than wire connection surface 121a of inner lead 121.

[0035] Then, plating is applied to the entire surface of the formed lead frame 100 (step S103). That is, a plating layer is formed on the surfaces of the leads 120, support bars 130, dam bars 140, die pad 150, bus bars 160, and suspension leads 170 that constitute the lead frame 100. The plating layer is formed of, for example, a nickel / palladium / gold layer. Note that the plating layer is not shown in the subsequent drawings. Also, the suspension lead bending process in step S102 may be performed after the plating process in step S103.

[0036] Once the plating layer is formed, tape 180 is applied to the support bar 130, leads 120, suspension leads 170, etc. (step S104). Specifically, as shown in Fig. 7, for example, tape 180 is applied to predetermined application positions on the upper surfaces of the inner leads 121 of the leads 120 and the inner leads of the suspension leads 170. At this time, tape 180 is also applied to predetermined application positions on the support bar 130. Fig. 7 is a diagram showing a specific example of the tape application step.

[0037] After the tape 180 is attached, the die pad 150 is down-set (step S105). That is, as shown in FIG. 8, for example, the support bar 130 (see FIG. 3) is bent to position the die pad 150 lower than the leads 120 and the bus bar 160. As a result, the wire connection surface 160a of the bus bar 160 is positioned lower than the wire connection surface 121a of the inner lead 121 and higher than the upper surface 150a of the die pad 150. FIG. 8 is a diagram showing a specific example of the die pad down-set process.

[0038] The die pad 150 is down-set by bending the support bar 130, for example, at positions P3 and P4 (see FIG. 3) that are farther toward the die pad 150 than the affixing position of the tape 180. Specifically, the support bar 130 is bent downward at position P3 and bent upward at position P4 that is closer to the die pad 150 than position P3. As a result, the die pad 150 is positioned lower than the leads 120 and the bus bar 160. Furthermore, the upper surface 150a of the die pad 150 and the wire connection surface 121a of the inner lead 121 are parallel to each other. Furthermore, the wire connection surface 160a of the bus bar 160 is inclined relative to the upper surface 150a of the die pad 150 and the wire connection surface 121a of the inner lead 121.

[0039] Through the above steps, a lead frame 100 is completed, which includes a bus bar 160 and in which the suspension leads 170 supporting the bus bar 160 are bent at a position P1 away from the attachment position of the tape 180 toward the bus bar 160, so that the suspension leads 170 are inclined relative to the leads 120. If the suspension leads 170 were bent at the attachment position of the tape 180, the flatness of the attachment position of the tape 180 would not be maintained, and the adhesion between the tape 180 and the suspension leads 170 would be reduced. Because the suspension leads 170 of the lead frame 100 manufactured through the above steps are bent at a position P1 away from the attachment position of the tape 180 toward the bus bar 160, the flatness of the attachment position of the tape 180 on the suspension leads 170 can be maintained. As a result, the adhesion between the tape 180 and the suspension leads 170 can be improved, and peeling of the tape 180 from the suspension leads 170 can be suppressed.

[0040] Next, a method for manufacturing a semiconductor device configured using the lead frame 100 will be described with reference to Fig. 9. Fig. 9 is a flowchart showing the method for manufacturing a semiconductor device according to the embodiment.

[0041] First, a semiconductor chip is mounted on the die pad 150 of the lead frame 100 (step S201). Specifically, as shown in Fig. 10, the semiconductor chip 210 is bonded to the upper surface 150a of the die pad 150 by a bonding material such as solder or die attach paste. Fig. 10 is a diagram showing a specific example of the semiconductor chip mounting step.

[0042] Once the semiconductor chip 210 is mounted on the die pad 150, the leads 120 and the bus bar 160 are electrically connected to the semiconductor chip 210 by wire bonding (step S202). Specifically, as shown in Fig. 11, for example, the wire connection surface 121a of the inner lead 121 is connected to a terminal of the semiconductor chip 210 by a wire 220. Furthermore, the wire connection surface 160a of the bus bar 160 is connected to a terminal of the semiconductor chip 210 by a wire 230. Fig. 11 is a diagram showing a specific example of the wire bonding step.

[0043] Here, the connection to the semiconductor chip 210 by the wires 220 and 230 will be described with reference to Figures 12 to 14. Figures 12 to 14 are diagrams for explaining the connection to the semiconductor chip 210 by the wires 220 and 230.

[0044] First, as shown in FIG. 12 , the lead frame 100 on which the semiconductor chip 210 is mounted is placed on a heater stand 250. The heater stand 250 has a first mounting surface 251 and a second mounting surface 252 that is lower than the first mounting surface 251. The leads 120, bus bar 160, and suspension leads 170 are placed on the first mounting surface 251, and the die pad 150 is placed on the second mounting surface 252. The leads 120 and suspension leads 170 placed on the first mounting surface 251 are pressed by a pressing jig 260 at the position of the tape 180. As a result, the suspension leads 170 are elastically deformed along the first mounting surface 251, and the bent portions of the suspension leads 170 are temporarily flattened. Therefore, the leads 120, bus bar 160, and suspension leads 170 are positioned on the same plane.

[0045] 13, when the lead frame 100 is placed on the heater stand 250, the wire connection surfaces 121a of the inner leads 121 and the terminals of the semiconductor chip 210 are connected by wires 220. In addition, the wire connection surfaces 160a of the bus bars 160 and the terminals of the semiconductor chip 210 are connected by wires 230.

[0046] After the semiconductor chip 210 is connected by the wires 220 and 230, the pressure applied by the pressing jig 260 is released, as shown in Fig. 14. This causes an elastic recovery force to act on the suspension lead 170, causing the suspension lead 170 to return to its original state. That is, the suspension lead 170 is inclined downward relative to the inner lead 121, and the wire connection surface 160a of the bus bar 160 is positioned lower than the wire connection surface 121a of the inner lead 121. This increases the distance between the wire 220 connected to the inner lead 121 and the wire 230 connected to the bus bar 160, thereby suppressing short-circuit defects between the wires 220 and 230.

[0047] Returning to Fig. 9, once the leads 120 and bus bar 160 are connected to the semiconductor chip 210 by wire bonding, the semiconductor chip 210 is sealed with a molding resin such as epoxy resin (step S203). Specifically, as shown in Fig. 15, the semiconductor chip 210, die pad 150, inner leads 121, support bar 130, bus bar 160, and suspension leads 170 are sealed with molding resin 190 within a range inside dam bar 140. Fig. 15 is a diagram showing a specific example of the resin sealing process.

[0048] Once the semiconductor chip 210 is resin-encapsulated, the leads 120, support bars 130, and suspension leads 170 are cut from the frame 110 at the dashed line portions shown in FIG. 15, and the dam bars 140 connecting adjacent leads 120 and suspension leads 170 are cut. This results in the semiconductor device using the lead frame 100 being singulated (step S204). The singulated semiconductor device has a shape in which the outer leads 122 and suspension leads 170 (outer lead portions) protrude outward from the mold resin 190, as shown in FIG. 16, for example. These outer leads 122 and suspension leads 170 become terminals to be connected to the outside. FIG. 16 is a diagram showing a specific example of the singulation process.

[0049] 17, the outer leads 122 and the suspension leads 170 are bent (step S205), completing a semiconductor device using the lead frame 100. FIG. 17 is a diagram showing a specific example of the bending process.

[0050] As described above, the lead frame (for example, lead frame 100) according to the embodiment includes a die pad (for example, die pad 150), leads (for example, leads 120), a bus bar (for example, bus bar 160), and a tape (for example, tape 180). The die pad has a mounting surface (for example, upper surface 150a) for a semiconductor chip. The leads are arranged around the die pad. The bus bar is provided between the die pad and the leads and is supported by a suspension lead (for example, suspension lead 170). The tape is attached to the leads and the suspension lead. The suspension lead is bent at a position (for example, position P1) away from the tape attachment position toward the bus bar and inclined relative to the leads, so that the wire connection surface of the bus bar (for example, wire connection surface 121a) is positioned lower than the wire connection surface of the leads. This makes it possible to prevent the tape from peeling off.

[0051] The suspension lead may be bent in the planar direction at a bending position (for example, bending position P2) closer to the bus bar than the tape attachment position, and may be bent in a direction perpendicular to the planar direction at a position away from the tape attachment position toward the bus bar and not overlapping with the bending position, thereby suppressing deformation of the bus bar due to twisting of the suspension lead.

[0052] The suspension lead may be bent in a direction intersecting the planar direction at a position away from the tape attachment position toward the bus bar and before reaching the bending position, thereby preventing damage to the suspension lead due to plastic deformation.

[0053] The die pad may be located at a lower position than the leads. The suspension leads may have wire connection surfaces of the bus bars located at a position lower than the wire connection surfaces of the leads and higher than the mounting surface of the die pad. This makes it possible to prevent damage to the suspension leads due to plastic deformation. [Explanation of symbols]

[0054] 100 lead frames 110 Frame 120 leads 121 Inner Lead 121a Wire connection surface 122 outer lead 130 Support Bar 140 Dambar 150 die pad 150a top 160 Busbar 160a Wire Connection Surface 170 Hanging Lead 180 Tape 190 Molding resin 210 Semiconductor Chips 220, 230 wire

Claims

1. a die pad having a mounting surface for a semiconductor chip; leads arranged around the die pad; a bus bar provided between the die pad and the leads and supported by the suspension leads; a tape attached to the lead and the hanging lead; The suspension lead is The tape is bent at a position away from the affixing position toward the bus bar, and is inclined with respect to the leads, and the wire connection surface of the bus bar is disposed at a position lower than the wire connection surface of the leads. A lead frame characterized by:

2. The suspension lead is The tape is bent in a planar direction at a bending position closer to the bus bar than the tape affixing position, and is bent in a direction intersecting the planar direction at a position away from the tape affixing position toward the bus bar and not overlapping with the bending position.

2. The lead frame according to claim 1.

3. The suspension lead is The tape is bent in a direction intersecting the planar direction at a position away from the tape attachment position toward the bus bar and not reaching the bending position.

3. The lead frame according to claim 2.

4. The die pad is Located at a position lower than the lead, The suspension lead is The wire connection surface of the bus bar is disposed at a position lower than the wire connection surface of the lead and higher than the mounting surface of the die pad.

2. The lead frame according to claim 1.

5. A lead frame; a semiconductor chip mounted on the lead frame; a sealing resin that seals the semiconductor chip, The lead frame is a die pad having a mounting surface for the semiconductor chip; leads arranged around the die pad; a bus bar provided between the die pad and the leads and supported by the suspension leads; a tape attached to the lead and the hanging lead; The semiconductor chip comprises: mounted on the mounting surface of the die pad, connected to the wire connection surface of the lead via a wire and connected to the wire connection surface of the bus bar via a wire; The suspension lead is The tape is bent at a position away from the affixing position toward the bus bar, and is inclined with respect to the leads, and the wire connection surface of the bus bar is disposed at a position lower than the wire connection surface of the leads. A semiconductor device characterized by:

6. a die pad having a mounting surface for a semiconductor chip, leads arranged around the die pad, and a bus bar provided between the die pad and the leads and supported by a suspension lead, the bus bar being formed from a metal plate; a step of applying tape to the leads and the suspension leads; The molding step includes: The suspension lead is bent at a position away from the tape attachment position toward the bus bar, and is inclined relative to the lead, and the wire connection surface of the bus bar is disposed at a position lower than the wire connection surface of the lead. A method for manufacturing a lead frame comprising the steps of:

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