Power conversion device

Abstract

To provide a power conversion device that can suppress vibration of a circuit board without increasing the number of parts.SOLUTION: A power conversion device 100 includes a housing 60, a capacitor device 20 mounted in the housing 60, and wiring portions 40, 50 that are part of a current path connected to the capacitor device 20. The power conversion device 100 also includes a circuit board 10 that is mounted in the housing 60 and includes a non-contact portion that is not in contact with the housing 60. The circuit board 10 has a configuration in which the non-contact portion is fixed to the wiring portions 40, 50.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] As disclosed in Patent Document 1, there is a power conversion device in which a circuit board is mounted on a mounting member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-58050 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the circuit board is mounted on the mounting base, a portion of the circuit board that is not in contact with the mounting base may be formed, and in this case, there is a risk that the portion of the circuit board that is not in contact with the mounting base may vibrate in the power conversion device.

[0005] One disclosed object is to provide a power conversion device that can suppress vibration of a circuit board without increasing the number of parts. [Means for solving the problem]

[0006] The power conversion device disclosed herein comprises: A mounted member (60), a circuit board (10) mounted on a mounting member and including a non-contact portion that is not in contact with the mounting member; a wiring board (40, 40a, 40b, 50, 50a, 50b) that is part of a current path; The non-contact portion of the circuit board is fixed to the wiring board.

[0007] In this way, the non-contact portion of the circuit board is fixed to the wiring board in the power conversion device, so that the power conversion device can suppress vibration of the circuit board without using a member solely for fixing the non-contact portion.

[0008] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims and in this section are intended to exemplify correspondences with the following embodiments and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view showing a schematic configuration of a power conversion device according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a plan view showing a schematic configuration of a circuit board according to the embodiment. [Figure 4] FIG. 2 is a plan view showing a schematic configuration of a wiring portion in the embodiment. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] 10 is a plan view showing a schematic configuration of a wiring section in Modification 1. FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] 10 is a plan view showing a schematic configuration of a wiring section in Modification 2. FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment may be assigned the same reference numerals, and duplicated explanations may be omitted. In each embodiment, when only a part of the configuration is described, the other parts of the configuration may be applied by referring to the other embodiment described previously.

[0011] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment may be assigned the same reference numerals, and duplicated explanations may be omitted. In each embodiment, when only a part of the configuration is described, the other parts of the configuration may be applied by referring to the other embodiment described previously.

[0012] A power conversion device 100 of this embodiment will be described with reference to Figures 1 to 5. The power conversion device 100 is an inverter circuit, a converter circuit, a charging device, etc. In this embodiment, as an example, the power conversion device 100 applied to an inverter circuit is adopted.

[0013] The power conversion device 100 includes a circuit board 10, a capacitor device 20, power modules 31 to 33, wiring boards 40 and 50, and a housing 60. The power conversion device 100 may also include a current detection device, output terminals, etc. In this case, the power conversion device 100 includes a U-phase terminal, a V-phase terminal, and a W-phase terminal as output terminals. Each phase terminal is connected to a corresponding terminal of a three-phase AC motor. The capacitor device 20 corresponds to a circuit component. The housing 60 corresponds to a mounted member.

[0014] The power conversion device 100 is configured to be mountable on, for example, a mobile object. Examples of the mobile object include vehicles such as electric cars, hybrid cars, and fuel cell cars, flying objects such as electric vertical take-off and landing aircraft and drones, ships, construction machinery, agricultural machinery, etc. However, the power conversion device 100 may also be mounted on devices other than mobile objects.

[0015] <Case> As shown in FIGS. 1 and 2, the housing 60 is configured to mount the circuit board 10, the capacitor device 20, the power modules 31 to 33, and the wiring boards 40 and 50. The housing 60 is primarily made of a metal such as aluminum or copper. The housing 60 includes, for example, an annular side wall 61 and a bottom wall 62 continuous with the side wall 61. The side wall 61 protrudes in the Z direction relative to the bottom wall 62. The protruding direction of the side wall 61 can also be referred to as the height direction. Therefore, the bottom wall 62 is positioned lower than the end of the side wall 61.

[0016] The side wall 61 is a portion on which the circuit board 10 is mounted. The side wall 61 has screw holes formed at positions facing the corners of the circuit board 10. The housing 60 may also have a fixing base, to which the circuit board 10 is fixed, at a portion different from the side wall 61.

[0017] The housing 60 includes a capacitor mounting portion on which the capacitor device 20 is mounted, and a module mounting portion on which the power modules 31 to 33 are mounted. The capacitor mounting portion and the module mounting portion are provided at positions lower than the ends of the side wall portion 61. For example, the capacitor device 20 is mounted on the bottom wall portion 62. A part of the bottom wall portion 62 can be considered to be the capacitor mounting portion. It can also be said that the capacitor device 20 and the power modules 31 to 33 are fixed to the housing 60.

[0018] The capacitor device 20 and the power modules 31 to 33 are mounted on the housing 60 so as to face the circuit board 10 in the Z direction. That is, at least a portion of the capacitor device 20 is arranged in an opposing region of the circuit board 10 in the Z direction. Similarly, at least a portion of the power modules 31 to 33 is arranged in an opposing region of the circuit board 10 in the Z direction. It can also be said that the capacitor device 20 and the power modules 31 to 33 are arranged between the circuit board 10 and the housing 60 in the Z direction. It can also be said that the capacitor device 20 is mounted on the housing 60 in an opposing region of the non-contact portion of the circuit board 10. The non-contact portion will be explained later.

[0019] The portion of the circuit board 10 facing the capacitor device 20 can also be called a capacitor-facing portion. The portions of the circuit board 10 facing the power modules 31 to 33 can also be called module-facing portions.

[0020] A refrigerant path 63 is provided in the bottom wall portion 62. The refrigerant path 63 is a flow path through which a refrigerant such as cooling water flows. The refrigerant cools, for example, the capacitor device 20, the power modules 31 to 33, etc. The refrigerant path 63 may be connected to a refrigerant supply device provided outside the housing 60.

[0021] <Circuit board> As shown in Figures 1, 2, and 3, circuit board 10 includes wiring board 11 and a plurality of circuit elements mounted on wiring board 11. Circuit board 10 has one surface S11 and a surface S12 opposite to surface S11. Circuit board 10 also has side surfaces S13 to S16 connected to surface S11 and surface S12 opposite to surface S11. Side surface S13 and side surface S15 are positioned opposite each other. Side surface S14 and side surface S16 are positioned opposite each other.

[0022] The distance between the one surface S11 and the opposite surface S12 corresponds to the thickness of the circuit board 10. Hereinafter, the direction along the thickness will also be referred to as the thickness direction.

[0023] In this embodiment, as an example, a circuit board 10 having a rectangular planar shape is used. The planar shape can also be referred to as the shape of one surface S11 or the opposite surface S12. Therefore, it can be said that the circuit board 10 has four corners. The four corners are corners of the circuit board 10 in a planar view. The four corners can also be said to be four corners of the circuit board 10. The planar view shows the circuit board 10 as seen from the Z direction.

[0024] However, the present disclosure is not limited to the above and may employ a circuit board 10 having a rectangular portion in plan view and a protruding portion protruding in a planar direction from the rectangular portion. In other words, the circuit board 10 may have five or more corners. The planar direction is the direction along one surface S11 or the opposite surface S12.

[0025] The circuit board 10 is mounted on an end of the side wall portion 61. Then, while the circuit board 10 is placed on the side wall portion 61, it is fixed to the side wall portion 61 with bolts 90. The circuit board 10 is fixed to the side wall portion 61 at, for example, its four corners.

[0026] The circuit board 10 may be fixed to the housing 60 at four or more corners. The fixing member for fixing the circuit board 10 to the housing 60 is not limited to the bolts 90. The circuit board 10 may be fixed to the housing 60 by a press-fit mechanism or the like.

[0027] The wiring board 11 comprises an electrically insulating base material and conductive wiring provided on the base material. The wiring is provided on the surface or inside of the base material. The wiring includes a wiring pattern 13 formed by patterning a conductive thin film (metal foil), pads to which surface-mounted components are connected, and lands to which insertion-mounted components are connected. For example, the wiring board 11 can be a multilayer wiring board in which wiring patterns are stacked via a base material. The stacked wiring patterns are connected via an interlayer connecting member that is part of the wiring.

[0028] Circuit elements are mounted on at least one of the surface S11 and the opposite surface S12 of the wiring board 11. A plurality of circuit elements are mounted on the wiring board 11. In the circuit board 10, the circuit elements are electrically connected via wiring to form a circuit.

[0029] FIG. 3 shows, as an example, a circuit board 10 on which a voltage detection circuit 12, which is one of the circuit elements, is mounted. The voltage detection circuit 12 is mounted, for example, on one surface S11. The voltage detection circuit 12 is connected to two wiring patterns 13. Each wiring pattern is connected to a different land 14. One land 14 is connected to a first wiring section 40, which will be described later. The other land 14 is connected to a second wiring section 50, which will be described later. In other words, the voltage detection circuit 12 is connected to the first wiring section 40 via the wiring pattern 13 and the land 14, and is also connected to the second wiring section 50 via the wiring pattern 13 and the land 14. The voltage detection circuit 12 detects the voltage between the first wiring section 40 and the second wiring section 50.

[0030] In this embodiment, the voltage detection circuit 12 is used as an example of a circuit element. However, various circuit elements other than the voltage detection circuit 12 are mounted on the wiring board 11. The circuit elements are not particularly limited. Examples of the circuit elements include a microcomputer, a semiconductor switching element, a capacitor, a resistor, and a coil.

[0031] As shown in FIG. 2 and other figures, the wiring board 11 is provided with a wire fixing hole 15. The wire fixing hole 15 is a through hole provided from one surface S11 to the opposite surface S12. The opening of the wire fixing hole 15 on the opposite surface S12 side is surrounded by a land 14. Furthermore, the wiring board 11 may be provided with copper plating or the like on the wall surface forming the wire fixing hole 15. In other words, it can be said that the wiring board 11 is provided with a through hole including the land 14 and the wire fixing hole 15. The two wire fixing holes 15 may be arranged on a diagonal line on one surface S1.

[0032] The wiring fixing holes 15 are provided in a non-contact portion, which will be described later. Therefore, it can be said that the lands 14 are provided in a non-contact portion. The wiring fixing holes 15 are holes into which bolts 81, 82 are inserted for fixing the circuit board 10 to the wiring portions 40, 50. The circuit board 10 is fixed to the wiring portions 40, 50 by the bolts 81, 82.

[0033] As shown in FIGS. 2 and 3, the circuit board 10 is provided with housing fixing holes 16. The housing fixing holes 16 are through holes provided from one surface S11 to the opposite surface S12. The housing fixing holes 16 are provided at the four corners of the circuit board 10. The housing fixing holes 16 are holes into which bolts 90 are inserted to fix the circuit board 10 to the housing 60. The circuit board 10 is mounted on the housing 60 with the opposite surface S12 facing the housing 60.

[0034] In this way, the four corners of the circuit board 10 are fixed to the side wall portions 61. Therefore, when the circuit board 10 is mounted in the housing 60, the four corners of the circuit board 10 come into contact with the side wall portions 61, which are part of the housing 60.

[0035] However, in the power conversion device 100, the capacitor device 20 is provided between the circuit board 10 and the bottom wall portion 62. Furthermore, the housing 30 does not have a fixing base in the area where the capacitor device 20 is mounted.

[0036] Therefore, when the circuit board 10 is mounted on the housing 60, there are portions that are not in contact with the housing 60. In other words, the capacitor facing portions are portions that are not in contact with the housing 60. Furthermore, the portions that are not in contact with the housing 60 can also be referred to as portions that are floating relative to the housing 60 or non-contact portions. For example, the central portion of the circuit board 10 in the planar direction or the periphery of the central portion are non-contact portions. Furthermore, the non-contact portions are at least a part of the area surrounded by multiple corners of the circuit board 10. The non-contact portions can also be referred to as portions where vibration of the circuit board 10 increases.

[0037] Furthermore, circuit elements may be mounted on the opposite surface S2 of the circuit board 10. Therefore, even if the capacitor device 20 is not provided opposite the circuit board 10, the circuit board 10 has a non-contact portion.

[0038] <Capacitor device> 1 and 2, the capacitor device 20 includes a capacitor element 21, capacitor terminals 22 and 23, a sealing portion 24, and a housing 25. The capacitor device 20 is used, for example, as a smoothing capacitor.

[0039] Capacitor terminals 22 and 23 are connected to both electrodes of capacitor element 21. Capacitor element 21 is disposed in housing 25. Capacitor element 21 is sealed in housing 25 by sealing portion 24. Parts of capacitor terminals 22 and 23 protrude from sealing portion 24.

[0040] One capacitor terminal 22 is connected to the first wiring portion 40. The other capacitor terminal 23 is connected to the second wiring portion 50. The capacitor terminal 22 and the first wiring portion 40 are fastened together with a bolt 71. The capacitor terminal 23 and the second wiring portion 50 are fastened together with a bolt 72. Thus, the capacitor terminal 22 is electrically connected to the first wiring portion 40. On the other hand, the capacitor terminal 23 is electrically connected to the second wiring portion 50.

[0041] The capacitor device 20 is larger in size than the circuit elements mounted on the circuit board 10. Therefore, the capacitor device 20 can also be considered a large circuit component. The capacitor device 20 can also be considered a circuit component that is too large to be mounted on the circuit board 10.

[0042] <Power module> Each of the power modules 31 to 33 is an integrated unit of a plurality of semiconductor switching elements. The power module 31 is a U-phase module. The power module 32 is a V-phase module. The power module 33 is a W-phase module. Each of the power modules 31 to 33 is electrically connected to a first wiring section 40 and a second wiring section 50.

[0043] The power modules 31 to 33 are larger in size than the circuit elements mounted on the circuit board 10. The power modules 31 to 33 can also be considered large circuit components. The power modules 31 to 33 can also be considered circuit components that are too large to be mounted on the circuit board 10.

[0044] In this embodiment, the capacitor device 20 is used as the circuit component. However, the power modules 31 to 33 may also be used as the circuit component.

[0045] <First wiring section, second wiring section> Here, the first wiring section 40 and the second wiring section 50 will be described with reference to Figures 1, 2, 4, and 5. The first wiring section 40 corresponds to a wiring board. Similarly, the second wiring section 50 corresponds to a wiring board.

[0046] The first wiring section 40 and the second wiring section 50 are part of a current path. As shown in Fig. 1, the wiring sections 40, 50 are, for example, a current path between the input terminal of the power conversion device 100 and the power modules 31 to 33. The wiring sections 40, 50 are connected to the capacitor terminal 22 on the input end side.

[0047] The first wiring portion 40 and the second wiring portion 50 have different potentials. In other words, the wiring board can be said to include the first wiring portion 40 and the second wiring portion 50, which has a different potential from the first wiring portion 40. For example, the first wiring portion 40 is a wiring member on the high potential side, and the second wiring portion 50 is a wiring member on the low potential side.

[0048] The wiring portions 40, 50 are plate-shaped conductive members. The wiring portions 40, 50 are preferably made of a material with good conductivity so that a large current (for example, 10 A or more) can flow. The wiring portions 40, 50 are made mainly of a metal such as aluminum or copper. The wiring portions 40, 50 can be manufactured by casting, for example. In this embodiment, as an example, the wiring portions 40, 50 are manufactured by aluminum die casting. The wiring portions 40, 50 may be made of a different material from the capacitor terminals 22, 23, or may be made of the same material.

[0049] Furthermore, the wiring portions 40, 50 are fixed to non-contact portions of the circuit board 10 in order to suppress vibration of the circuit board 10. In other words, the wiring portions 40, 50 hold (support) the non-contact portions of the circuit board 10.

[0050] Therefore, the wiring portions 40, 50 are configured to have higher vibration resistance than the circuit board 10. It can also be said that the wiring portions 40, 50 are provided with rigidity to ensure higher vibration resistance than the circuit board 10. The first wiring portion 40 can also be called a first frame member or a first bus bar. Similarly, the second wiring portion 50 can also be called a second frame member or a second bus bar.

[0051] The wiring portions 40, 50 are manufactured by aluminum die-casting. Therefore, the wiring portions 40, 50 can be lighter than cast members (copper wiring plates) whose main component is copper. Furthermore, the electrical resistance of the wiring portions 40, 50 can be reduced by increasing the cross-sectional area. When the wiring portions 40, 50 have the same electrical resistance as a copper wiring plate, the cross-sectional area of ​​the wiring portions 40, 50 is larger than that of a copper wiring plate. However, the vibration resistance of the wiring portions 40, 50 can be improved by increasing the cross-sectional area. As described above, the wiring portions 40, 50 function as a current path and also function to suppress vibration of the circuit board 10. Therefore, it is preferable to use wiring portions 40, 50 manufactured by aluminum die-casting.

[0052] The first wiring portion 40 includes a wiring base 41 and a substrate fixing portion 44 protruding from the wiring base 41. The wiring base 41 has an opposing surface S41 that faces the second wiring portion 50 and the circuit board 10, and an opposite surface S42 of the opposing surface S41. The opposite surface S42 faces the capacitor device 20. As shown in FIG. 4 and other figures, the wiring base 41 includes a first connecting portion 42 and a second connecting portion 43.

[0053] The first connection portion 42 is a portion within a predetermined range from the first end portion 411 of the wiring base 41. The first connection portion 42 is a portion that is connected to the capacitor terminal 22. The first connection portion 42 can be said to be a portion on one end side of the first wiring portion 40.

[0054] 1 and 4, the first connecting portion 42 is provided with a fixing hole 42h. The fixing hole 42h is a through hole provided from the opposing surface S41 to the opposite surface S42. The fixing hole 42h is a hole into which a bolt 71 is inserted for fastening the first wiring portion 40 and the capacitor terminal 22. Therefore, the first connecting portion 42 is fastened to the capacitor terminal 22 by the bolt 71.

[0055] In this way, one end of the first wiring portion 40 is fixed to the capacitor device 20. The capacitor device 20 is fixed to the housing 60 as described above. Therefore, one end of the first wiring portion 40 can be considered to be fixed to the housing 60 via the capacitor device 20. The first connection portion 42 can also be said to be a first fixed portion of the first wiring portion 40.

[0056] The second connection portion 43 is a portion that protrudes in the Y direction from the second end portion 412 of the wiring base 41. The wiring base 41 is provided with three second connection portions 43. Each second connection portion 43 is provided corresponding to each power module 31 to 33. The second connection portion 43 can be said to be a portion on the other end side of the first wiring portion 40.

[0057] As shown in FIGS. 1 and 4, each second connection portion 43 is provided with a fixing hole 43h. The fixing hole 43h is a through hole provided from the opposing surface S41 to the opposite surface S42. The fixing hole 43h is a hole into which a bolt 73 is inserted for fastening the first wiring portion 40 to each of the power modules 31 to 33. Therefore, the second connection portion 43 is fastened to each of the power modules 31 to 33 by the bolt 73. The second connection portion 43 is connected to the terminal of each of the power modules 31 to 33.

[0058] In this way, the other end of the first wiring section 40 is fixed to the power modules 31 to 33. The power modules 31 to 33 are fixed to the housing 60 as described above. Therefore, the other end of the first wiring section 40 can be considered to be fixed to the housing 60 via the power modules 31 to 33. In other words, the first wiring section 40 is arranged with both ends fixed to the housing 60.

[0059] As described above, the first connection portion 42 and the second connection portion 43 can also be considered to be high-voltage portions (for example, 40 V or more). In the first wiring portion 40, a current flows between the first connection portion 42 and the second connection portion 43.

[0060] As shown in FIG. 5, the board fixing portion 44 is a portion that protrudes in the Z direction from the opposing surface S41 of the wiring base 41. The board fixing portion 44 is a portion to which a non-contact portion of the circuit board 10 is fixed. The board fixing portion 44 is provided with a board fixing hole 44h. The board fixing hole 44h is a bottomed hole that opens at an end of the board fixing portion 44. The board fixing hole 44h is provided with a female screw.

[0061] 2, the board fixing holes 44h are holes into which bolts 81 are inserted to fix the circuit board 10 to the first wiring portion 40. The board fixing portion 44 is in contact with the lands 14 while connected to the circuit board 10. In other words, the first wiring portion 40 is electrically connected to the voltage detection circuit 12 of the circuit board 10.

[0062] The second wiring portion 50 includes a wiring base 51 and a substrate fixing portion 54 protruding from the wiring base 51. The wiring base 51 has an opposing surface S51 that faces the first wiring portion 40 and the capacitor device 20, and an opposite surface S52 of the opposing surface S51. The opposite surface S52 faces the circuit board 10. As shown in FIG. 4 and other figures, the wiring base 51 includes a first connection portion 52 and a second connection portion 53.

[0063] The first connection portion 52 is a portion within a predetermined range from the first end portion 511 of the wiring base 51. The first connection portion 52 is a portion that is connected to the capacitor terminal 23. The first connection portion 52 can be said to be a portion on one end side of the second wiring portion 50.

[0064] 1 and 4, the first connecting portion 52 is provided with a fixing hole 52h. The fixing hole 52h is a through hole provided from the opposing surface S51 to the opposite surface S52. The fixing hole 52h is a hole into which a bolt 72 is inserted for fastening the second wiring portion 50 and the capacitor terminal 23. Therefore, the first connecting portion 52 is fastened to the capacitor terminal 23 by the bolt 72.

[0065] The second connection portion 53 is a portion that protrudes in the Y direction from the second end portion 512 of the wiring base 51. The wiring base 51 is provided with three second connection portions 53. Each second connection portion 53 is provided corresponding to each power module 31 to 33. The second connection portion 53 can be said to be a portion on the other end side of the second wiring portion 50.

[0066] As shown in FIGS. 1 and 4, each second connection portion 53 is provided with a fixing hole 53h. The fixing hole 53h is a through hole provided from the opposing surface S51 to the opposite surface S52. The fixing hole 53h is a hole into which a bolt 74 is inserted for fastening the second wiring portion 50 to each of the power modules 31 to 33. Thus, the second connection portion 53 is fastened to each of the power modules 31 to 33 by the bolt 74. The second connection portion 53 is connected to the terminals of each of the power modules 31 to 33. Like the first wiring portion 40, the second wiring portion 50 is arranged with both ends fixed to the housing 60.

[0067] As described above, the first connection portion 52 and the second connection portion 53 can also be considered to be high voltage portions (for example, 40 V or more). In the second wiring portion 50, a current flows between the first connection portion 52 and the second connection portion 53.

[0068] As shown in FIG. 5, the board fixing portion 54 is a portion that protrudes in the Z direction from the opposite surface S52 of the wiring base 51. The board fixing portion 54 is a portion to which the circuit board 10 is fixed. The board fixing portion 54 is provided with a board fixing hole 54h. The board fixing hole 54h is a bottomed hole that opens at the end of the board fixing portion 54. The board fixing hole 54h is provided with a female screw.

[0069] 2, the board fixing holes 54h are holes into which bolts 82 are inserted to fix the circuit board 10 to the second wiring part 50. The board fixing part 54 is in contact with the lands 14 while connected to the circuit board 10. In other words, the second wiring part 50 is electrically connected to the voltage detection circuit 12 of the circuit board 10.

[0070] In this way, the wiring portions 40, 50 are members that electrically connect the capacitor device 20 and the power modules 31 to 33. In other words, the power conversion device 100 is not configured such that the portions of the capacitor terminals 22, 23 that protrude from the sealing portion 24 are directly connected to the power modules 31 to 33. In the power conversion device 100, the capacitor terminals 22, 23 and the power modules 31 to 33 are electrically connected via the wiring portions 40, 50.

[0071] In other words, the wiring portions 40, 50 are members that electrically connect the capacitor device 20 and the power modules 31 to 33, and can be considered separate members independent of the capacitor device 20. Therefore, the wiring portions 40, 50 do not need to be arranged inside the housing 25. This makes it easy to increase the cross-sectional area of ​​the wiring portions 40, 50. Furthermore, the wiring portions 40, 50 can be arranged in an area facing the capacitor device 20 in the Z direction. Therefore, in the power conversion device 100, it is easy to fix the non-contact portions of the circuit board 10 to the wiring portions 40, 50.

[0072] The fixing members for fixing the circuit board 10 and the wiring portions 40, 50 are not limited to the bolts 81, 82. The circuit board 10 may be fixed to the wiring portions 40, 50 by a press-fit mechanism or the like. In this case, the first wiring portion 40 is provided with a press-fit mechanism including, for example, a shaft portion protruding from the board fixing portion 44 and an elastically deformable connecting portion provided on the shaft portion. The first wiring portion 40 is fixed to the circuit board 10 by a restoring force generated by elastic deformation of the connecting portion inserted into the wiring fixing hole 15. The same applies to the second wiring portion 50.

[0073] 2 and 5, the first wiring portion 40 and the second wiring portion 50 are disposed opposite each other in the Z direction. The first wiring portion 40 and the second wiring portion 50 have different potentials. Therefore, it is preferable that the first wiring portion 40 and the second wiring portion 50 are provided in a state where a spatial insulation distance is ensured. The spatial insulation distance is, for example, 1 mm or more.

[0074] It is preferable that the first wiring portion 40 and the second wiring portion 50 are arranged so that at least a portion thereof runs parallel to each other. In this embodiment, as described above, an example is adopted in which the first wiring portion 40 and the second wiring portion 50 run parallel to each other and face each other in the Z direction. It can also be said that the first wiring portion 40 and the second wiring portion 50 are arranged so as to be electrically capacitively coupled. This allows the first wiring portion 40 and the second wiring portion 50 to reduce inductance. For example, it is preferable that 30% or more of the area of ​​the facing surface S41 faces the facing surface S51.

[0075] The first wiring portion 40 and the second wiring portion 50 may be arranged parallel to each other and facing each other in the X direction. In other words, the first wiring portion 40 and the second wiring portion 50 may be arranged so that their surfaces face each other.

[0076] In the power conversion device 100, the first wiring portion 40 and the second wiring portion 50 are disposed between the circuit board 10 and the capacitor device 20. Therefore, it is preferable that the circuit board 10 is disposed so as not to be capacitively coupled to the first wiring portion 40 and the second wiring portion 50. In other words, it is preferable that the circuit board 10 is disposed with a gap therebetween so as not to be capacitively coupled to the first wiring portion 40 and the second wiring portion 50.

[0077] The distance here is the closest distance in the Z direction between the circuit board 10 and the wiring portions 40, 50 excluding the board fixing portions 44, 54. For example, it is the distance between the opposite surface S12 and the opposing surface S41 or the opposite surface S52. The distance is, for example, 3 mm or more. This allows the circuit board 10 to suppress malfunctions due to capacitive coupling with the wiring portions 40, 50.

[0078] Incidentally, the non-contact portions of the circuit board 10 are more susceptible to vibration than the portions in contact with the housing 60. The wiring portions 40, 50 are configured such that the board fixing portions 44, 54 are fixed to the non-contact portions. In other words, the wiring portions 40, 50 hold the portions of the circuit board 10 that are more susceptible to vibration. In other words, the non-contact portions of the circuit board 10 are fixed to the wiring portions 40, 50.

[0079] Furthermore, the vibration state of the circuit board 10 varies depending on the weight and arrangement of the circuit elements mounted on the non-contact portion. For example, areas where heavy circuit elements are mounted tend to vibrate more significantly than areas where lighter circuit elements are mounted. In other words, areas where heavy circuit elements are mounted tend to vibrate more easily and have larger amplitudes.

[0080] Therefore, it is preferable that the board fixing portions 44, 54 are fixed to locations where vibrations in the non-contact portions of the circuit board 10 tend to be significant, since this suppresses the vibrations. Note that the locations on the circuit board 10 where vibrations tend to be significant can be identified in advance by simulation, experiment, or the like.

[0081] <Effects> As described above, in the power conversion device 100, the non-contact portions of the circuit board 10 are fixed to the wiring portions 40, 50. Therefore, the power conversion device 100 can suppress vibration of the circuit board 10 without using a member that is solely for fixing the non-contact portions.

[0082] That is, with both ends of the wiring sections 40, 50 fixed to the housing 60, the board fixing sections 44, 54 hold the non-contact section of the circuit board 10. It can also be said that the non-contact section of the circuit board 10 is held by the wiring sections 40, 50 fixed to the housing 60.

[0083] Therefore, the power conversion device 100 can reduce vibration of the circuit board 10 more than a configuration in which the non-contact portion of the circuit board 10 is not fixed. Furthermore, since the power conversion device 100 can suppress vibration of the circuit board 10, it can reduce stress applied to the connection portion between the circuit element and the wiring board 11.

[0084] Furthermore, the power converter 100 can fix the parts of the circuit board 10 that are prone to vibrate to the wiring parts 40, 50. Therefore, the power converter 100 can reduce the parts of the circuit board 10 that are prone to vibrate.

[0085] The power conversion device 100 can be made smaller in size than a configuration in which the non-contact portion of the circuit board 10 is fixed to a fixing member different from the wiring portions 40, 50. In particular, the power conversion device 100 can be made smaller in size in the Z direction.

[0086] Furthermore, the voltage detection circuit 12 is electrically connected to the first wiring section 40 and the second wiring section 50. The voltage detection circuit 12 detects the voltage between the first wiring section 40 and the second wiring section 50. Therefore, the power conversion device 100 can detect the voltage while suppressing vibration of the circuit board 10.

[0087] Furthermore, the power conversion device 100 does not require a connector, harness, or detection terminal for voltage detection. Therefore, the power conversion device 100 can reduce the number of components mounted on the circuit board 10. Furthermore, the power conversion device 100 can reduce the size of the circuit board 10.

[0088] In this embodiment, the power conversion device 100 is employed in which the wiring sections 40, 50 are arranged between the circuit board 10 and the capacitor device 20. However, the power conversion device 100 may have the circuit board 10 arranged between the capacitor device 20 and the wiring sections 40, 50.

[0089] In this embodiment, the circuit board 10 is fixed to both the first wiring portion 40 and the second wiring portion 50. However, the circuit board 10 may be fixed to only one of the first wiring portion 40 and the second wiring portion 50. For example, the circuit board 10 may be fixed to only the second wiring portion 50. In this case, the first wiring portion 40 does not need to be provided with the board fixing portion 44.

[0090] In this embodiment, both the first wiring portion 40 and the second wiring portion 50 are arranged between the circuit board 10 and the capacitor device 20. However, only one of the first wiring portion 40 and the second wiring portion 50 may be arranged between the circuit board 10 and the capacitor device 20.

[0091] In this embodiment, as an example, a first wiring section 40 and a second wiring section 50 are employed as wiring boards. However, the present disclosure is not limited to this. For example, the power conversion device 100 may use each phase terminal (output terminal) as the wiring board. In this case, the circuit board 10 is fixed to each phase terminal. The circuit board 10 may also include a current detection circuit that detects the current flowing through each phase terminal.

[0092] The above describes preferred embodiments of the present disclosure. However, the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the present disclosure. Below, Modifications 1 and 2 are described as other embodiments of the present disclosure. The above embodiment and Modifications 1 and 2 can be implemented independently, or can be implemented in appropriate combinations. The present disclosure is not limited to the combinations shown in the embodiments, and can be implemented in various combinations. Naturally, Modifications 1 and 2 can achieve the same effects as the above embodiment.

[0093] (Variation 1) 6 and 7, the first wiring portion 40a and the second wiring portion 50a of Modification 1 will be described. The wiring portions 40a and 50a differ from the wiring portions 40 and 50 in that they have ribs 45 and 55. The ribs 45 and 55 correspond to reinforcing protrusions.

[0094] As shown in Fig. 6, the first wiring portion 40a is provided with a rib 45 extending from the first end portion 411 to the second end portion 412. That is, the rib 45 is provided along the longitudinal direction of the first wiring portion 40a. As shown in Fig. 7, the rib 45 is a portion that protrudes from the opposing surface S41. The rib 45 may also be provided on the opposite surface S42.

[0095] As shown in Fig. 6, the second wiring portion 50a is provided with a rib 55 extending from the first end 511 to the second end 512. That is, the rib 55 is provided along the longitudinal direction of the second wiring portion 50a. As shown in Fig. 7, the rib 55 is a portion that protrudes from the opposite surface S52. The rib 55 may also be provided on the opposing surface S51.

[0096] Therefore, the wiring portions 40a, 50a have improved vibration resistance compared to the wiring portions 40, 50. Furthermore, since the wiring portions 40a, 50a are provided with the ribs 45, 55, they have a larger cross-sectional area than the wiring portions 40, 50. Therefore, the wiring portions 40a, 50a can improve power consumption and suppress heat generation compared to the wiring portions 40, 50.

[0097] The shapes of the ribs 45, 55 are not limited to the above shapes. For example, the ribs 45, 55 may be provided on both surfaces of the wiring bases 41, 51. The ribs 45, 55 may also be provided only in a portion between the first end 411, 511 and the second end 412, 512. Furthermore, the wiring portions 40a, 50a may be provided with a draw as a reinforcing protrusion. The ribs 45, 55 may protrude in different directions. The ribs 45, 55 may also be provided linearly in a plan view.

[0098] The ribs 45, 55 may be provided only on one of the wiring portions 40, 50 to which the circuit board 10 is fixed. In a configuration in which the circuit board 10 is fixed only to the second wiring portion 50, the second wiring portion 50 is provided with the rib 55. On the other hand, the first wiring portion 40 is not provided with the rib 45.

[0099] There are no particular limitations on the positions of the ribs 45, 55 in the X direction. However, by providing the ribs 45, 55 at the center of each wiring portion 40a, 50a in the X direction, the vibration resistance of the wiring portions 40a, 50a can be improved.

[0100] (Variation 2) 8 and 9, the first wiring portion 40b and the second wiring portion 50b of Modification 2 will be described. The wiring portions 40b, 50b differ from the wiring portions 40a, 50a mainly in that they have slits 46, 56.

[0101] 8 and 9, the first wiring portion 40b has a slit 46 formed in the region facing the rib 55. The slit 46 is formed so as to extend from the facing surface S41 to the opposite surface S42. The rib 55 is disposed in the slit 46. The slit 46 may be a bottomed hole that opens to the facing surface S41.

[0102] 8 and 9, the second wiring portion 50b has a slit 56 formed in the region facing the rib 45. The slit 56 is formed so as to extend from the facing surface S51 to the opposite surface S52. The rib 45 is disposed in the slit 56. The slit 56 may be a bottomed hole that opens to the facing surface S51.

[0103] The wiring portions 40b and 50b can increase the area in which they run parallel to each other compared to the wiring portions 40 and 50. This allows the wiring portions 40b and 50b to strengthen the electrical capacitive coupling. Therefore, the wiring portions 40b and 50b can reduce inductance while improving vibration resistance compared to the wiring portions 40 and 50.

[0104] Note that a rib may be provided on only one of the wiring portions 40b, 50b, and a slit may be provided on only the other. For example, a rib may be provided on only one of the wiring portions 40b, 50b to which the circuit board 10 is fixed. In a configuration in which the circuit board 10 is fixed only to the second wiring portion 50b, the second wiring portion 50b is provided with a rib 55. On the other hand, the first wiring portion 40b is provided with a slit 46.

[0105] Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more, or less than one element are also within the scope and spirit of the present disclosure.

[0106] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0107] (Technical thought 1) A mounted member (60), a circuit board (10) mounted on the mount member and including a non-contact portion that is not in contact with the mount member; a wiring board (40, 40a, 40b, 50, 50a, 50b) that is part of a current path; The circuit board is a power conversion device in which the non-contact portion is fixed to the wiring board.

[0108] (Technical thought 2) the wiring board includes a first wiring portion and a second wiring portion having a different potential from the first wiring portion; The power conversion device according to Technical Idea 1, wherein the first wiring section and the second wiring section are provided in a state where a spatial insulation distance is ensured.

[0109] (Technical Thought 3) The power conversion device according to Technical Concept 2, wherein the circuit board includes a voltage detection circuit (12) that detects a voltage between the first wiring portion and the second wiring portion.

[0110] (Technical Thought 4) The power conversion device according to Technical Concept 2 or 3, wherein the first wiring section and the second wiring section are at least partially arranged to run parallel to each other.

[0111] (Technical Thought 5) The power conversion device according to Technical Concept 4, wherein the circuit board is disposed at a distance from the first wiring portion and the second wiring portion so as not to be capacitively coupled to the first wiring portion and the second wiring portion.

[0112] (Technical Thought 6) The power converter according to any one of Technical Concepts 1 to 5, wherein the wiring board is made of aluminum or copper as a main component.

[0113] (Technical Thought 7) The power converter according to any one of Technical Ideas 1 to 6, wherein the wiring board has higher vibration resistance than the circuit board.

[0114] (Technical Thought 8) The power converter according to any one of Technical Concepts 1 to 7, wherein the wiring board is provided with reinforcing protrusions (45, 55).

[0115] (Technical Thought 9) four or more corners of the circuit board are fixed to the mounting member, The power conversion device according to any one of Technical Concepts 1 to 8, wherein the non-contact portion is at least a part of the area surrounded by the corner portion.

[0116] (Technical Thought 10) The power converter according to Technical Concept 9, wherein the mounted member has a circuit component (20) mounted in an area facing the non-contact portion. [Explanation of symbols]

[0117] 10...circuit board, 12...voltage detection circuit, 20...capacitor device, 40...first wiring section, 50...second wiring section, 100...power conversion device

Claims

1. A mounted member (60), a circuit board (10) mounted on the mounted member and including a non-contact portion that is not in contact with the mounted member; a wiring board (40, 40a, 40b, 50, 50a, 50b) that is part of a current path; The circuit board is a power conversion device in which the non-contact portion is fixed to the wiring board.

2. the wiring board includes a first wiring portion and a second wiring portion having a different potential from the first wiring portion; The power conversion device according to claim 1 , wherein the first wiring portion and the second wiring portion are provided in a state where a spatial insulation distance is ensured.

3. The power conversion device according to claim 2, wherein the circuit board includes a voltage detection circuit (12) that detects a voltage between the first wiring portion and the second wiring portion.

4. The power conversion device according to claim 2 or 3, wherein at least a portion of the first wiring section and the second wiring section are arranged to run parallel to each other.

5. The power conversion device according to claim 4 , wherein the circuit board is disposed at a distance from the first wiring portion and the second wiring portion so as not to be capacitively coupled to the first wiring portion and the second wiring portion.

6. 4. The power conversion device according to claim 1, wherein the wiring board is made of aluminum or copper as a main component.

7. 4. The power conversion device according to claim 1, wherein the wiring board has higher vibration resistance than the circuit board.

8. The power conversion device according to any one of claims 1 to 3, wherein the wiring board is provided with a reinforcing protrusion (45, 55).

9. four or more corners of the circuit board are fixed to the mounting member, The power conversion device according to any one of claims 1 to 3, wherein the non-contact portion is at least a part of the area surrounded by the corner portion.

10. The power conversion device according to claim 9, wherein the mounted member has a circuit component (20) mounted in an area facing the non-contact portion.

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