Photoelectric conversion module

By using first and second marks for precise alignment, the photoelectric conversion module addresses alignment challenges, reducing optical coupling loss and improving structural stability.

JP2025187560APending Publication Date: 2025-12-25KYOCERA CORP
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Patent Information

Application Number
JP2024096480
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-12-25

AI Technical Summary

Technical Problem

Existing photoelectric conversion modules face challenges in aligning the light receiving and emitting units of the photoelectric conversion element with high precision relative to the mirror, leading to optical coupling loss between the optical waveguide and the photoelectric conversion element.

Method used

The photoelectric conversion module incorporates a first mark on the photoelectric conversion element and second marks on the mirror member made of the same material as the optical waveguide, ensuring precise alignment by overlapping these marks in the extension direction of the waveguide, thereby minimizing optical coupling loss.

Benefits of technology

This alignment method allows for high-precision positioning of the photoelectric conversion element, reducing optical coupling loss and enhancing the structural stability of the module.

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Abstract

To provide a technique for reducing optical coupling loss between an optical waveguide and a photoelectric conversion element.SOLUTION: The photoelectric conversion module comprises a substrate, an optical waveguide, a photoelectric conversion element, and a mirror member. The optical waveguide is positioned on the substrate and transmits an optical signal. The photoelectric conversion element includes a light receiving / emitting part positioned on the optical waveguide and emitting / receiving the optical signal to / from the optical waveguide. The mirror member includes a mirror surface facing an end of the optical waveguide in an extension direction and inclined to a plate surface of the substrate. The photoelectric conversion element includes a first mark with a predetermined positional relation to the light receiving / emitting part. The mirror member includes a second mark containing the same material as that of the optical waveguide. The first mark and the second mark overlap each other in the extension direction of the optical waveguide in plane perspective of the substrate.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present disclosure relates to a photovoltaic conversion module. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there is known a module in which a photoelectric conversion element that converts an electrical signal into an optical signal or an optical signal into an electrical signal is mounted on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-174834 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for reducing optical coupling loss between an optical waveguide and a photoelectric conversion element. [Means for solving the problem]

[0005] An optoelectronic conversion module according to one embodiment of the present disclosure includes a substrate, an optical waveguide, a photoelectric conversion element, and a mirror member. The optical waveguide is located on the substrate and transmits an optical signal. The photoelectric conversion element is located on the optical waveguide and has a light receiving / emitting unit that emits or receives an optical signal to or from the optical waveguide. The mirror member faces an end of the optical waveguide in the extension direction and has a mirror surface that is inclined with respect to the surface of the substrate. The photoelectric conversion element has a first mark that has a predetermined positional relationship with the light receiving / emitting unit. The mirror member has a second mark that contains the same material as the optical waveguide. In a planar perspective view of the substrate, the first mark and the second mark overlap in the extension direction of the optical waveguide. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to reduce optical coupling loss between an optical waveguide and a photoelectric conversion element. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing the configuration of a photoelectric conversion module according to the first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing the configuration of the photoelectric conversion module according to the first embodiment. [Figure 3] FIG. 3 is a schematic plan view perspective view showing the configuration of the photoelectric conversion module according to the first embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module according to the second embodiment. [Figure 5] FIG. 5 is a schematic plan view perspective view showing the configuration of a photoelectric conversion module according to the second embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module according to the third embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module according to the fourth embodiment. [Figure 8] FIG. 8 is a schematic plan view perspective view showing the configuration of a photoelectric conversion module according to the fifth embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module according to the sixth embodiment. [Figure 10] FIG. 10 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module according to the seventh embodiment. [Figure 11] FIG. 11 is a schematic plan view perspective view showing the configuration of a photoelectric conversion module according to the seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a mode for carrying out a photoelectric conversion module according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment. Furthermore, each embodiment can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, the same components in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0009] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0010] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being perpendicular to each other, and the positive Z-axis direction is the vertically upward direction.

[0011] Patent document 1 discloses an optical waveguide module (hereinafter also referred to as a photoelectric conversion module) in which an optical element (hereinafter also referred to as a photoelectric conversion element) having a light receiving and emitting portion is mounted on the upper surface of an optical waveguide.

[0012] However, in the photoelectric conversion module configured as described above, when mounting the photoelectric conversion element, it is difficult to align the light receiving and emitting portion of the photoelectric conversion element with high precision relative to the mirror so as to minimize optical coupling loss between the optical waveguide and the photoelectric conversion element.

[0013] Therefore, there is a need to provide a photoelectric conversion module that reduces the optical coupling loss between the optical waveguide and the photoelectric conversion element.

[0014] (First embodiment) First, the configuration of a photovoltaic conversion module 1 according to the first embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a schematic plan view showing the configuration of a photovoltaic conversion module 1 according to the first embodiment. Fig. 2 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to the first embodiment. Fig. 3 is a schematic plan perspective view showing the configuration of a photovoltaic conversion module 1 according to the first embodiment.

[0015] As shown in FIGS. 1 and 2, the photoelectric conversion module 1 includes a substrate 10, a plurality of optical waveguides 20, a mirror member 25, and a photoelectric conversion element 40.

[0016] The substrate 10 has, for example, a rectangular plate shape in a plan view. The substrate 10 has a mounting surface 101 on which the plurality of optical waveguides 20 and the mirror member 25 are mounted. The substrate 10 may be, for example, an organic substrate. Alternatively, the substrate 10 may be a semiconductor substrate.

[0017] The plurality of optical waveguides 20 transmit optical signals. The plurality of optical waveguides 20 are located on a substrate 10. In the example of FIGS. 1 to 3, the plurality of optical waveguides 20 are located on the negative X-axis side of the mounting surface 101 of the substrate 10. The optical waveguides 20 extend along a fixed direction (here, the X-axis direction). The plurality of optical waveguides 20 are arranged in a direction (here, the Y-axis direction) perpendicular to the extension direction of the optical waveguides 20. One end of the optical waveguide 20 is connected to the connector 60, and the other end faces the mirror surface 25a of the mirror member 25.

[0018] As shown in FIG. 2 , the optical waveguide 20 has a core 21 and clads 22 and 23. The clads 22 and 23 cover at least a portion of the core 21. Specifically, the optical waveguide 20 has an upper clad 22 and a lower clad 23. The upper clad 22 covers the top surface of the core 21. The upper clad 22 may cover the side surface of the core 21. The lower clad 23 covers the bottom surface of the core 21. That is, the optical waveguide 20 is formed by laminating the lower clad 23, the core 21, and the upper clad 22 in this order on the substrate 10.

[0019] The mirror member 25 reflects an optical signal output from the photoelectric conversion element 40 or the core 21 (described later). As shown in FIG. 2, the mirror member 25 has a mirror surface 25a that faces the other end of the optical waveguide 20 in the extension direction. The mirror member 25 is formed by vapor-depositing the mirror surface 25a on one surface of a prismatic base made of silicon, glass, resin, metal, or the like. The mirror surface 25a may be formed of aluminum, silver, or gold. The mirror surface 25a is inclined with respect to the surface of the substrate 10. The outer surface of the mirror member 25 further includes a first surface 25b (here, the bottom surface) that faces the substrate 10, and a second surface 25c (here, the top surface) located opposite the first surface 25b. The first surface 25b and the second surface 25c may be surfaces of the prismatic base that are connected to the surface on which the mirror surface 25a is formed.

[0020] The mirror member 25 reflects an optical signal incident from the thickness direction of the substrate 10 (here, the Z-axis direction) and introduces it into the core 21. Specifically, the mirror member 25 reflects an optical signal output from the photoelectric conversion element 40 in the negative direction of the Z-axis and introduces it into the core 21 of the optical waveguide 20. The mirror member 25 also reflects an optical signal incident from the core 21 in the thickness direction of the substrate 10. Specifically, the mirror member 25 reflects an optical signal irradiated from the core 21 of the optical waveguide 20 in the positive direction of the Z-axis and inputs it into the photoelectric conversion element 40. Note that the traveling directions of the optical signals output from the photoelectric conversion element 40 to the mirror member 25 and the optical signals input from the mirror member 25 to the photoelectric conversion element 40 do not need to completely coincide with the positive direction of the Z-axis and may be inclined with respect to the positive direction of the Z-axis.

[0021] The photoelectric conversion element 40 is an element including a photoelectric conversion circuit. For example, the photoelectric conversion element 40 converts an optical signal transmitted through the optical waveguide 20 into an electrical signal. The photoelectric conversion element 40 also converts an electrical signal transmitted through wiring (not shown) into an optical signal. The photoelectric conversion element 40 is located above the optical waveguide 20. The photoelectric conversion element 40 has a light receiving / emitting unit 41. The light receiving / emitting unit 41 may include one or more light receiving units and light emitting units.

[0022] The light receiving and emitting unit 41 includes, for example, a light emitting element, and emits an optical signal to the optical waveguide 20. The optical signal emitted from the light receiving and emitting unit 41 as a light emitting element is output to the outside of the photoelectric conversion element 40, and then the optical path is converted by the mirror surface 25a of the mirror member 25, and the optical signal is output to the outside through the optical waveguide 20.

[0023] The light receiving and emitting unit 41 includes, for example, a light receiving element, and receives an optical signal from the optical waveguide 20. An optical signal input from the outside passes through the optical waveguide 20, has its optical path converted by the mirror surface 25a of the mirror member 25, and is input to the photoelectric conversion element 40. The light receiving and emitting unit 41 as a light receiving element receives the optical signal input to the photoelectric conversion element 40.

[0024] The light emitting elements and light receiving elements included in the light receiving and emitting unit 41 do not have to be arranged adjacent to each other. For example, the light emitting and receiving unit 41 may include a plurality of light emitting elements arranged adjacent to each other and a plurality of light receiving elements arranged adjacent to each other.

[0025] The photoelectric conversion module 1 configured as described above is fabricated, for example, by arranging the mirror member 25 on the substrate 10, and then forming the optical waveguide 20. Then, the photoelectric conversion element 40 is arranged on the optical waveguide 20.

[0026] Here, when the photoelectric conversion element 40 is disposed on the optical waveguide 20, it is necessary to align the photoelectric conversion element 40 in accordance with the positions of the optical waveguide 20 and the mirror member 25. Specifically, when an optical signal passes through the core 21 of the optical waveguide 20 and is reflected by the mirror member 25, it is necessary to align the light receiving and emitting unit 41 of the photoelectric conversion element 40 with the mirror member 25 so that the optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40 is minimized.

[0027] Patent Document 1 discloses an optical waveguide module in which a first recess that functions as a mirror and a second recess that is used as an alignment mark are formed in the core of the optical waveguide. In this optical waveguide module, when aligning the mirror with another member, the second recess that is used as an alignment mark can be aligned with the other member, thereby indirectly aligning the mirror with the other member.

[0028] However, with the technology described in Patent Document 1, it is difficult to align the photoelectric conversion element with the position or extension direction of the core of the optical waveguide. Furthermore, when manufacturing an optical waveguide module, the position of the mirror surface of the mirror facing the center of the core may change depending on the film thickness of the core and lower cladding. In such cases, the photoelectric conversion element 40 cannot be positioned at the desired position, which may result in optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40.

[0029] In contrast, the photoelectric conversion element 40 of the photoelectric conversion module 1 according to the first embodiment has a first mark 50 that has a predetermined positional relationship with the light-emitting / receiving unit 41. The first mark 50 is provided on the surface of the photoelectric conversion element 40 where the light-emitting / receiving unit 41 is exposed. The predetermined positional relationship refers to, for example, being in a predetermined direction and distance from the light-emitting / receiving unit 41. The mirror member 25 also has one or more second marks 30 that contain the same material as the optical waveguide 20. In the first embodiment, two second marks 30 are provided for each optical waveguide 20. For example, the second marks 30 may contain the same material as the core 21. As shown in FIG. 3 , when the photoelectric conversion element 40 is properly positioned, the first mark 50 and the multiple second marks 30 overlap in the extension direction of the optical waveguide 20 in a planar perspective view of the substrate 10. The appropriate arrangement may be an arrangement in which the position of mirror member 25 directly facing the center of core 21 and the light emitting and receiving unit 41 are directly opposite each other. Alternatively, it may be an arrangement in which an optical signal output from light emitting and receiving unit 41 as a light emitting element is incident on the position of mirror member 25 directly facing the center of core 21. Alternatively, it may be an arrangement in which an optical signal output from core 21 and reflected by mirror member 25 is incident on light emitting and receiving unit 41 as a light receiving element.

[0030] 3, if the coordinates of the midpoint M1 of the line connecting two of the four second marks 30 that are positioned so as not to overlap in the X-axis direction are (Xc, Yc), and the coordinates of the midpoint M2 of the line connecting the two first marks 50 of the appropriately placed photoelectric conversion element 40 are (Xp, Yp), then Yc = Yp. In other words, in the first embodiment, the first mark 50 and the two second marks 30 provided in the extension direction of the optical waveguide 20 are provided at positions that coincide in the Y-axis direction when the photoelectric conversion element 40 is appropriately placed.

[0031] That is, in the photoelectric conversion module 1 according to the first embodiment, by using the first mark 50 and the second mark 30, the photoelectric conversion element 40 can be aligned according to the position in the Y-axis direction or the extension direction of the core 21 of the optical waveguide 20.

[0032] <Method of manufacturing photoelectric conversion module 1> Next, an example of a method for manufacturing the photoelectric conversion module 1 according to the first embodiment, specifically a method for aligning the photoelectric conversion elements 40 with the mirror member 25, will be described with reference to FIGS.

[0033] First, the mirror member 25 is placed on the mounting surface 101 of the substrate 10.

[0034] Next, the lower clad 23 of the optical waveguide 20 is formed on the mounting surface 101 of the substrate 10. Specifically, the lower clad 23 is formed at a position where the mirror surface 25a of the mirror member 25 arranged on the mounting surface 101 of the substrate 10 comes into contact with the end of the lower clad 23 of the optical waveguide 20. The lower clad 23 is formed, for example, by applying a resin having a predetermined refractive index to a predetermined thickness on the mounting surface 101 of the substrate 10 and curing the resin by heat, light, or the like.

[0035] Next, the core 21 is formed on the surface of the lower cladding 23 of the optical waveguide 20. Similarly, the second mark 30 is formed on the second surface 25c of the mirror member 25. The core 21 and the second mark 30 are formed, for example, by applying a resin having a predetermined refractive index to a predetermined thickness on the surface of the lower cladding 23 and the second surface 25c of the mirror member 25, curing the resin with heat or light, and then patterning the cured resin into a predetermined planar shape using a known method. That is, in the first embodiment, the second mark 30 is formed in the process of forming the core 21. The second mark 30 and the core 21 are formed of the same material.

[0036] Next, the upper cladding 22 is formed on the surface of the core 21 of the optical waveguide 20. The upper cladding 22 is formed, for example, by applying a resin having a predetermined refractive index to a predetermined thickness on the surface of the core 21 and curing the resin with heat, light, or the like.

[0037] Next, the photoelectric conversion element 40 is placed on the optical waveguide 20. A first mark 50 is provided on the lower surface of the photoelectric conversion element 40. This first mark 50 is provided as a reference when aligning the mirror member 25 and the photoelectric conversion element 40. In this procedure, as shown in FIG. 3 , by placing the photoelectric conversion element 40 so that the first mark 50 provided on the photoelectric conversion element 40 and the second mark 30 provided on the second surface 25c of the mirror member 25 overlap in the extension direction of the optical waveguide 20, the position of the light receiving and emitting unit 41 of the photoelectric conversion element 40 in the Y-axis direction can be aligned with high precision with respect to the mirror member 25.

[0038] Furthermore, by forming the second mark 30 from the same material as the optical waveguide 20, the positional accuracy of the second mark 30 relative to the core 21 is improved, so that, for example, the photoelectric conversion element 40 can be aligned with high precision relative to the Y-axis position or extension direction of the core 21 of the optical waveguide 20, compared to when the second mark 30 is formed from a material different from that of the optical waveguide 20.

[0039] Furthermore, the second mark 30 is located on the second surface 25c of the mirror member 25. That is, by positioning the second mark 30 closer to the light receiving and emitting unit 41 of the photoelectric conversion element 40 than the core 21, more accurate alignment is possible compared to when the second mark 30 is located farther from the light receiving and emitting unit 41. Furthermore, if the second mark 30 were located on the substrate 10, there is a risk that the placement locations of electrodes and the like on the substrate 10 would be limited. By positioning the second mark 30 on the second surface 25c of the mirror member 25, electrodes and the like can be freely placed on the substrate 10.

[0040] The positions of the first mark 50 and the second mark 30 may be confirmed using, for example, a camera. Specifically, the position of the photoelectric conversion element 40 may be aligned while checking the positions of both the first mark 50 on the photoelectric conversion element 40 and the second mark 30 on the mirror member 25 using a camera that photographs the photoelectric conversion module 1 from the side.

[0041] Although an example in which the first mark 50 and the second mark 30 are circular has been shown here, the first mark 50 and the second mark 30 may have various shapes and sizes. The first mark 50 and the second mark 30 may have any shape, such as a square, a circle, a cross, or any other shape.

[0042] Furthermore, the first mark 50 and the second mark 30 may be marks, convex portions, or concave portions that are different in color from the second surface 25c of the mirror member 25, for example.

[0043] 3 shows an example in which there are two first marks 50 and four second marks 30, but the number of first marks 50 and second marks 30 is not limited to this. For example, three or more first marks 50 may be provided for one core 21, and five or more second marks 30 may be provided. This allows for more accurate alignment of the photoelectric conversion element 40.

[0044] In addition, although an example in which the second mark 30 is located on the second surface 25c of the mirror member 25 has been shown here, the position of the second mark 30 is not limited to this. The second mark 30 may be located on the mirror surface 25a of the mirror member 25, for example.

[0045] In addition, although an example in which the second mark 30 contains the same material as the core 21 has been described here, the material of the second mark 30 is not limited to this. For example, the second mark 30 may contain the same material as the claddings 22 and 23.

[0046] As described above, the photoelectric conversion element 40 of the photoelectric conversion module 1 according to the first embodiment has the first mark 50 that has a predetermined positional relationship with the light receiving and emitting unit 41. In addition, the mirror member 25 has a plurality of (here, two) second marks 30 that are made of the same material as the optical waveguide 20. In a planar perspective view of the substrate 10, the first mark 50 and the plurality of second marks 30 overlap in the extension direction of the optical waveguide 20. This allows the light receiving and emitting unit 41 of the photoelectric conversion element 40 to be aligned with high precision with respect to the mirror member 25 so as to minimize optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40.

[0047] (Second embodiment) Fig. 4 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to the second embodiment. Fig. 5 is a schematic planar perspective view showing the configuration of a photovoltaic conversion module 1 according to the second embodiment. The mirror member 25 of the photovoltaic conversion module 1 may have a third mark 70 that has a predetermined positional relationship with the position where the mirror surface 25a and the second surface 25c of the mirror member 25 are connected. As shown in Fig. 5, in a planar perspective view of the substrate 10, the first mark 50 and the third mark 70 may overlap in a direction perpendicular to the extension direction of the optical waveguide 20.

[0048] In the photoelectric conversion module 1 according to the second embodiment, the photoelectric conversion element 40 can be aligned in the X-axis direction by using the first mark 50 and the second mark 30. Specifically, in the step of arranging the photoelectric conversion element 40 on the optical waveguide 20, as shown in FIG. 5 , the photoelectric conversion element 40 is arranged so that the first mark 50 provided on the photoelectric conversion element 40 and the third mark 70 provided on the second surface 25c of the mirror member 25 overlap in a direction perpendicular to the extension direction of the optical waveguide 20. This allows the position of the light receiving and emitting unit 41 of the photoelectric conversion element 40 in the X-axis direction to be aligned with high precision with respect to the mirror member 25. In other words, in the second embodiment, the third mark 70 and the first mark 50 are arranged at positions that coincide in the X-axis direction when the photoelectric conversion element 40 is appropriately arranged.

[0049] Although an example in which the third mark 70 is circular has been shown here, the third mark 70 may have various shapes and sizes. The third mark 70 may have any shape, such as a square, a circle, a cross, or any other shape.

[0050] Moreover, the third mark 70 may be, for example, a mark, a convex portion, or a concave portion that has a color different from that of the second surface 25c of the mirror member 25.

[0051] (Third embodiment) Fig. 6 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to the third embodiment. In the example of Fig. 2, the mirror member 25 is located on the substrate 10, but the position of the mirror member 25 is not limited to this. As shown in Fig. 6, the mirror member 25 may be located on the lower clad 23 of the optical waveguide 20.

[0052] Generally, the shorter the distance between the photoelectric conversion element 40 and the substrate 10, the thinner the photoelectric conversion module 1, resulting in a more stable structure of the photoelectric conversion module 1. In the photoelectric conversion module 1 shown in FIG. 2, reducing the thickness of the mirror member 25 and the optical waveguide 20 is one way to reduce the distance between the photoelectric conversion element 40 and the substrate 10. Because the core 21 requires a certain thickness, reducing the thickness of the optical waveguide 20 in the photoelectric conversion module 1 of FIG. 2 requires thinning the clads 22 and 23. However, if the lower clad 23 is made too thin, there is a risk that the lower clad 23 will not function properly.

[0053] On the other hand, in the photovoltaic conversion module 1 according to the third embodiment, the mirror member 25 is located on the lower clad 23. With this configuration, the lower clad 23 can be formed thinner than when the mirror member 25 is located on the substrate 10, and the distance between the photovoltaic conversion element 40 and the substrate 10 can be reduced. As a result, the thickness of the photovoltaic conversion module 1 is reduced, making the photovoltaic conversion module 1 structurally stable.

[0054] (Fourth embodiment) FIG. 7 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to a fourth embodiment. In the example shown in FIG. 2, the cross-sectional shape of the mirror member 25 is rectangular, but the cross-sectional shape of the mirror member 25 is not limited to this. For example, as shown in FIG. 7, the cross-sectional shape of the mirror member 25 may be pentagonal. Specifically, the surface of the mirror member 25 facing the lower clad 23 of the optical waveguide 20 may be perpendicular to the mounting surface 101 of the substrate 10. With this configuration, compared to when the other end side of the lower clad 23 has an inclined shape, it is easier to form the lower clad 23 by stacking a film-like material (not shown), and the uniformity of the film thickness of the lower clad 23 can be improved.

[0055] (Fifth embodiment) FIG. 8 is a schematic planar perspective view showing the configuration of a photovoltaic conversion module 1 according to a fifth embodiment. In the example of FIG. 3, the mirror member 25 has a plurality of second marks 30, but the number of second marks 30 is not limited to this. As shown in FIG. 8, the mirror member 25 may have only one second mark 30. In this case, the second mark 30 may have a shape whose longitudinal direction is the extension direction of the optical waveguide 20. For example, the second mark 30 may have an elongated shape extending in the extension direction of the optical waveguide 20.

[0056] According to this configuration, the extension direction of the optical waveguide 20 can be indicated by the extension direction of the second mark 30, so it is sufficient to place one second mark 30. Therefore, compared to the case where a plurality of second marks 30 are provided, the preparation process for aligning the photoelectric conversion element 40 is easier.

[0057] (Sixth embodiment) 9 is a schematic cross-sectional view showing the configuration of the photoelectric conversion module 1 according to the sixth embodiment. As shown in Fig. 9, the core 21 of the optical waveguide 20 and the second mark 30 may be continuous. With this configuration, the positional accuracy of the second mark 30 can be improved compared to when the core 21 and the second mark 30 are separately arranged, thereby enabling more accurate alignment.

[0058] (Seventh embodiment) FIG. 10 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module 1 according to a seventh embodiment. FIG. 11 is a schematic planar perspective view showing the configuration of a photoelectric conversion module 1 according to the seventh embodiment. As shown in FIG. 10, the third mark 70 may be a recess formed on the second surface 25c of the mirror member 25. Furthermore, the second mark 30 may be a protrusion located within the third mark 70. In other words, as shown in FIG. 11, the second mark 30 and the third mark 70 may at least partially overlap in a planar perspective view of the substrate 10.

[0059] If the second mark 30 and the third mark 70 were located in different positions, it would be necessary to move the camera according to the positions of each mark when checking the positions of the second mark 30 and the third mark 70. On the other hand, according to the photoelectric conversion module 1 of the seventh embodiment, the second mark 30 and the third mark 70 are located in the same position, so there is no need to move the camera, and it becomes easy to check the positions of the second mark 30 and the third mark 70.

[0060] 10, the shape of the third mark 70 may be a tapered shape that decreases in diameter from the second surface 25c side toward the first surface 25b side of the mirror member 25. With this configuration, when forming the mirror member 25 using a mold, the mirror member 25 can be more easily removed from the mold, and the yield of the mirror member 25 can be improved, compared to when the third mark 70 has a shape that increases in diameter from the second surface 25c side toward the first surface 25b side of the mirror member 25.

[0061] Although an example has been shown here in which the first mark 50 is positioned so as not to overlap the second mark 30 and the third mark 70, the position of the first mark 50 is not limited to this. For example, the first mark 50 may also overlap at least partially with the second mark 30 and the third mark 70. This eliminates the need to move the camera when checking the position of the first mark 50, making it even easier to check the positions of the first mark 50, the second mark 30, and the third mark 70.

[0062] Although the example in which the third mark 70 is a recess has been described here, the shape of the third mark 70 is not limited to this. For example, the third mark 70 may be in the form of a thin film. In this case, the second mark 30 may be located on the third mark 70.

[0063] Additionally, although an example has been described here in which the shape of the third mark 70 is a shape that decreases in diameter from the second surface 25c side toward the first surface 25b side of the mirror member 25, the shape of the third mark 70 is not limited to this. For example, the shape of the third mark 70 may be a shape that increases in diameter from the second surface 25c side toward the first surface 25b side of the mirror member 25. Furthermore, the shape of the third mark 70 may be a shape in which the diameter is approximately constant from the second surface 25c side toward the first surface 25b side of the mirror member 25.

[0064] The present technology can also be configured as follows. (1) The photoelectric conversion module (for example, the photoelectric conversion module 1) includes a substrate (for example, the substrate 10), an optical waveguide (for example, the optical waveguide 20), a photoelectric conversion element (for example, the photoelectric conversion element 40), and a mirror member (for example, the mirror member 25). The optical waveguide is located on the substrate and transmits an optical signal. The photoelectric conversion element is located on the optical waveguide and includes a light-receiving and light-emitting unit (for example, the light-receiving and light-emitting unit 41) that emits or receives an optical signal to or from the optical waveguide. The mirror member faces an end of the optical waveguide in the extension direction and has a mirror surface (for example, the mirror surface 25a) that is inclined with respect to the surface of the substrate. The photoelectric conversion element includes a first mark (for example, the first mark 50) that has a predetermined positional relationship with the light-receiving and light-emitting unit. The mirror member includes a second mark (for example, the second mark 30) that includes the same material as the optical waveguide. In a planar perspective view of the substrate, the first mark and the second mark overlap in the extending direction of the optical waveguide. (2) In the photoelectric conversion module described in (1) above, the mirror member may further have an upper surface (for example, the second surface 25c) connected to the mirror surface, and the second mark may be located on the upper surface. (3) The photoelectric conversion module according to (1) or (2) above may have a plurality of second marks, and the first mark and the plurality of second marks may overlap in the extending direction of the optical waveguide. (4) In the photoelectric conversion module described in (1) or (2) above, the second mark may have a shape whose longitudinal direction is the extension direction of the optical waveguide. (5) In the photoelectric conversion module described in any one of (1) to (4) above, the optical waveguide is laminated on the substrate in the order of a lower clad (for example, lower clad 23), a core (for example, core 21), and an upper clad (for example, upper clad 22), and the mirror member may be located on the lower clad. (6) In the photoelectric conversion module according to any one of (1) to (5) above, the optical waveguide is formed by laminating a lower clad, a core, and an upper clad in this order on the substrate, and the core and the second mark may be continuous. (7) In the photoelectric conversion module described in any one of (1) to (6) above, the mirror member has an upper surface connected to the mirror surface and a third mark (for example, third mark 70) that has a predetermined positional relationship with the position where the upper surface and the mirror surface are connected, and in a planar perspective view of the substrate, the first mark and the third mark may overlap in a direction perpendicular to the extension direction of the optical waveguide.

[0065] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0066] 1 Photoelectric conversion module 10 Substrate 20 Optical waveguide 21 cores 22 Upper Cladding 23 Lower Cladding 25 Mirror material 25a mirror surface 25b 1st page 25c 2nd side 30 Second Mark 40 Photoelectric conversion element 41 Light receiving and emitting unit 50 First Mark 70 Third Mark 101 Mounting surface

Claims

1. A substrate; an optical waveguide located on the substrate and transmitting an optical signal; a photoelectric conversion element located on the optical waveguide and having a light receiving / emitting portion that emits or receives an optical signal to or from the optical waveguide; a mirror member having a mirror surface that faces an end of the optical waveguide in the extending direction and is inclined with respect to the plate surface of the substrate; and the photoelectric conversion element has a first mark having a predetermined positional relationship with the light receiving and emitting portion, the mirror member has a second mark containing the same material as the optical waveguide; In a planar perspective view of the substrate, the first mark and the second mark overlap in the extension direction of the optical waveguide.

2. the mirror member further has an upper surface connected to the mirror surface; The photoelectric conversion module according to claim 1 , wherein the second mark is located on the top surface.

3. a plurality of the second marks; The photoelectric conversion module according to claim 1 , wherein the first mark and the plurality of second marks overlap in the extending direction of the optical waveguide.

4. The photoelectric conversion module according to claim 1 , wherein the second mark has a shape whose longitudinal direction is the extension direction of the optical waveguide.

5. the optical waveguide is formed by stacking a lower clad, a core, and an upper clad on the substrate in this order; The photoelectric conversion module according to claim 1 , wherein the mirror member is located above the lower clad.

6. the optical waveguide is formed by stacking a lower clad, a core, and an upper clad on the substrate in this order; The photoelectric conversion module according to claim 1 , wherein the core and the second mark are continuous.

7. the mirror member has an upper surface connected to the mirror surface, and a third mark having a predetermined positional relationship with a position where the upper surface and the mirror surface are connected; The photoelectric conversion module according to claim 1 , wherein, in a planar perspective view of the substrate, the first mark and the third mark overlap in a direction perpendicular to an extending direction of the optical waveguide.

Citation Information

Patent Citations

  • Manufacturing method for optical waveguide and manufacturing method for optical waveguide module

    JP2013174834A