Electronic circuit board

JP2025187745APending Publication Date: 2025-12-25HITACHI VANTARA LTD
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Patent Information

Application Number
JP2024096774
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-12-25

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Abstract

To reduce the crosstalk noise while achieving both the ease of extracting wires and the high density in a through hole of an electronic circuit board.SOLUTION: An electronic circuit board includes a plurality of through-hole units including a combination of a pair of signal through-holes 1a and 1b for differential signals, ground through-holes 2a and 2b disposed on a line connecting the pair of signal through-holes 1a and 1b, guard through-holes 10a to 10d, and an anti-pad 3 disposed surrounding the pair of signal through-holes 1a and 1b. The through-hole units are arranged in an X-axis direction and a Y-axis direction while the arrangement positions in the X-axis direction are displaced alternately in the Y-axis direction. The guard through-holes 10a and 10b are disposed to have the pair of signal through-holes 1a and 1b therebetween on an equal distance line 200 existing at an equal distance from the pair of signal through-holes 1a and 1b.SELECTED DRAWING: Figure 4
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    JP1991165473A