Semiconductor module and manufacturing method for semiconductor module

Abstract

To provide a semiconductor module for improving the corrosion resistance, and a manufacturing method for the semiconductor module.SOLUTION: A semiconductor module 100 includes a housing part 20 that accommodates a semiconductor chip, and a nut holding part 40 that includes at least one terminal 30 to be electrically connected to the semiconductor chip and a nut 45 for connecting to the terminal 30 and is inserted to the housing part 20 along a predetermined insertion direction. The nut holding part 40 includes a first narrow part 141, and a first wide part 142 that is provided on an opposite side of the inserting direction relative to the first narrow part 141 and that has a larger width than the first narrow part 141. The housing part 20 includes an engagement member 25 including an engagement part 21 to engage the nut holding part 40 by coming into contact with the first wide part 142.SELECTED DRAWING: Figure 2

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