Substrate Processing Equipment

Abstract

The present invention relates to a substrate processing apparatus including a chamber having a lid on an upper portion, a first plate installed under the lid and having a plurality of ventilation holes formed therein, a second plate including a plurality of ventilation holes communicating with some of the plurality of ventilation holes of the first plate and coupled to the first plate, and a gap adjustment part connected to the second plate and adjusting a gap between the lid and the first plate, the gap adjustment part being connected to an RF power supply line.

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus for performing processing steps such as a deposition step and an etching step on a substrate. [Background technology]

[0002] Generally, in order to manufacture solar cells, semiconductor devices, flat panel displays, etc., a predetermined thin film layer, thin film circuit pattern, or optical pattern must be formed on a substrate. For this purpose, a deposition process for depositing a thin film of a specific material on the substrate, a photo process for selectively exposing the thin film using a photosensitive material, an etching process for removing the thin film at the selectively exposed portion to form a pattern, and other substrate processing processes are performed by a substrate processing apparatus.

[0003] A substrate processing apparatus according to the related art includes a substrate support for supporting a substrate, a plate disposed on the substrate support, and a chamber in which the plate is disposed, the plate being coupled to the chamber so as to be disposed inside the chamber.

[0004] In the conventional substrate processing apparatus, since the plate is only connected to the chamber and supported only by the chamber, the plate is deflected due to its own weight, and therefore the gap between the plate and the substrate supported by the substrate support varies partially, resulting in a problem of degraded quality of the substrate after the processing process. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been devised to solve the problems described above, and aims to provide a substrate processing apparatus that can prevent deterioration in the quality of substrates that have undergone a processing process due to deflection of the plate. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, the present invention can include the following configurations.

[0007] The substrate processing apparatus according to the present invention may include a chamber including a lid at an upper portion, a first plate installed under the lid and having a plurality of gas holes formed therein, a second plate including a plurality of gas holes communicating with some of the plurality of gas holes of the first plate and coupled to the first plate, and a gap adjuster connected to the second plate and adjusting a gap between the lid and the first plate. The gap adjuster may be connected to an RF power supply line (feeding line).

[0008] The substrate processing apparatus according to the present invention may include a supply unit coupled to the first plate. When applying RF power to the first plate, the supply unit may essentially apply RF power to the first plate, and the gap adjustment unit may selectively apply RF power to the first plate. Effect of the Invention

[0009] According to the present invention, the following effects can be obtained.

[0010] The present invention may be embodied such that the gap adjuster supports the first plate. As a result, the present invention can reduce deflection caused by the weight of the first plate. Therefore, the present invention can reduce the degree of partial change in the gap between the first plate and the substrate, thereby improving the quality of the substrate after the processing process.

[0011] The present invention is embodied to be capable of adjusting the gap between the cover and the first plate using a gap adjuster, and therefore, the present invention can reduce deflection occurring in the first plate, thereby improving the ease of work for solving the deflection occurring in the first plate.

[0012] The present invention may be embodied such that the gap adjuster is electrically connected to the first plate, thereby improving the ease of work for imparting electrical characteristics to the first plate. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic configuration diagram of a substrate processing apparatus according to the present invention; [Diagram 2] 4 is a schematic side cross-sectional view showing a coupling relationship between a first plate, a second plate, and a gap adjusting unit in the substrate processing apparatus according to the present invention; [Diagram 3] 3 is a schematic cross-sectional side view showing an embodiment of an adapter provided on a second plate, with a portion A of FIG. 2 enlarged. FIG. [Figure 4] 3 is a schematic cross-sectional side view showing an embodiment of an adapter provided on a second plate, with a portion A of FIG. 2 enlarged. FIG. [Diagram 5] 3 is a schematic cross-sectional side view showing an embodiment of an adapter provided on a second plate, with a portion A of FIG. 2 enlarged. FIG. [Figure 6] 4 is a schematic side cross-sectional view showing a coupling relationship between a first plate, an upper plate, an upper adaptor, a lower adaptor, an upper distance adjusting part, and a lower distance adjusting part in the substrate processing apparatus according to the present invention. [Figure 7] 2 is a schematic plan view of a first plate in the substrate processing apparatus according to the present invention. FIG. [Figure 8] 2 is a schematic cross-sectional side view of an embodiment of a substrate processing apparatus according to the present invention, including a protruding electrode and an opening. [Figure 9] 1 is a schematic side cross-sectional view of an embodiment of a substrate processing apparatus according to the present invention, including a supply unit; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. Figures 2 to 6, 8, and 9 may be side cross-sectional views taken along line II in Figure 7. In Figure 7, the ventilation holes formed in the first plate and the adapter coupled to the first plate are omitted.

[0015] Referring to FIG. 1, a substrate processing apparatus 1 according to the present invention performs a processing process on a substrate (S). The substrate (S) may be a silicon substrate, a glass substrate, a metal substrate, or the like. The substrate processing apparatus 1 according to the present invention can perform a deposition process for depositing a thin film on the substrate (S), an etching process for removing a part of the thin film deposited on the substrate (S), and the like. Hereinafter, an embodiment in which the substrate processing apparatus 1 according to the present invention performs a deposition process will be described as an example, but it will be obvious to those skilled in the art to which the present invention pertains that embodiments in which the substrate processing apparatus 1 according to the present invention performs a different processing process, such as an etching process, can be derived from this.

[0016] The substrate processing apparatus 1 according to the present invention may include a chamber 2 , a first plate 3 , a second plate 4 , and a distance adjusting unit 5 .

[0017] Referring to FIG. 1, the chamber 2 provides a processing space 20. In the processing space 20, processing processes such as a deposition process and an etching process can be performed on a substrate (S). The processing space 20 can be disposed inside the chamber 2. The chamber 2 can be coupled with an exhaust port (not shown) for exhausting gas from the processing space 20. A first plate 3, an adapter 43, and a distance adjustment unit 5 can be disposed inside the chamber 2. A part of the distance adjustment unit 5 can also be disposed outside the chamber 2.

[0018] A substrate support part 21 can be installed in the chamber 2. The substrate support part 21 supports a substrate (S). The substrate support part 21 can support one substrate (S), and can also support multiple substrates (S). When multiple substrates (S) are supported on the substrate support part 21, processing steps can be performed on the multiple substrates (S) at one time. The substrate support part 21 can be coupled to the chamber 2. The substrate support part 21 can be disposed inside the chamber 2.

[0019] 1 and 2, the first plate 3 is installed in the chamber 2. The first plate 3 may be coupled to the chamber 2 so as to be disposed inside the chamber 2. The first plate 3 may be disposed to face the substrate support 21. The first plate 3 may be disposed above the substrate support 21 based on the vertical direction (Z-axis direction). The vertical direction (Z-axis direction) is an axial direction parallel to the direction in which the first plate 3 and the substrate support 21 are spaced apart from each other. A processing space 20 may be disposed between the first plate 3 and the substrate support 21. The first plate 3 may be coupled to a lid 22. The lid 22 may be disposed to cover the upper part of the chamber 2.

[0020] The first plate 3 can inject gas toward the substrate support 21. To this end, the first plate 3 can be formed with a plurality of ventilation holes 31 (hereinafter referred to as "lower ventilation holes 31"). The gas can be injected toward the substrate support 21 through the lower ventilation holes 31. The gas is used in the processing process for the substrate (S) and can be supplied from a storage unit (not shown). The lower ventilation holes 31 can be formed penetrating the first plate 3. The lower ventilation holes 31 can be arranged spaced apart from each other.

[0021] 1 to 4, the second plate 4 is disposed inside the chamber 2. The second plate 4 may be coupled to the first plate 3. The second plate 4 may include a plurality of vent holes 41 (hereinafter referred to as "upper vent holes 41"). The upper vent holes 41 may be in communication with some of the lower vent holes 31. The upper vent holes 41 may be spaced apart from each other. Gas may be sprayed toward a substrate (S) supported by the substrate support 21 through the upper vent holes 41 and the lower vent holes 31.

[0022] 1 to 5, the gap adjustment unit 5 is connected to the second plate 4. The gap adjustment unit 5 may be connected to the first plate 3 via the second plate 4. As a result, the gap adjustment unit 5 may realize a support function for the first plate 3 by supporting the first plate 3 via the second plate 4. In this case, one side of the gap adjustment unit 5 may be connected to the first plate 3 via the second plate 4, and the other side may be supported by the lid 22. As a result, the gap adjustment unit 5 may realize a support function for the first plate 3 by supporting the second plate 4 using the supporting force supported by the lid 22. Although not shown in the figures, the other side of the gap adjustment unit 5 may be supported by another structure disposed outside the chamber 2.

[0023] The gap adjuster 5 may be connected to an RF power supply line 50 (shown in FIG. 1). The RF power supply line 50 may apply RF power for generating plasma. The gap adjuster 5 may be electrically connected to the first plate 3 via the second plate 4, thereby implementing an electrical connection function for determining electrical characteristics of the first plate 3. In this case, one side of the gap adjuster 5 may be connected to the first plate 3 via the second plate 4, and the other side may be connected to the RF power supply line 50. The gap adjuster 5 may implement both a support function and an electrical connection function.

[0024] The gap adjuster 5 can adjust the gap between the lid 22 and the first plate 3. The gap adjuster 5 can adjust the gap between the lid 22 and the first plate 3 by lifting the first plate 3 via the second plate 4. By adjusting the gap between the lid 22 and the first plate 3, the gap between the first plate 3 and the substrate (S) supported by the substrate supporter 21 can be adjusted. For example, when a deflection occurs in a portion of the first plate 3, the gap adjuster 5 can lift the portion of the first plate 3 where the deflection occurs via the second plate 4 by lifting the second plate 4. Therefore, the substrate processing apparatus 1 according to the present invention can reduce the deflection occurring in the first plate 3 using the gap adjuster 5, and therefore can reduce the change in the gap between the first plate 3 and the substrate (S) supported by the substrate supporter 21. As a result, the substrate processing apparatus 1 according to the present invention can improve the quality of the substrate (S) subjected to the processing process. In addition, the substrate processing apparatus 1 according to the present invention can reduce the deflection occurring in the first plate 3 by using the gap adjustment part 5, thereby improving the ease of the work required to resolve the deflection occurring in the first plate 3.

[0025] The distance adjusting portion 5 may include a connecting member 51 (shown in FIG. 5).

[0026] The coupling member 51 is fastened to the second plate 4 through a fastening hole 42 (shown in FIG. 3) formed in the second plate 4. A screw thread can be formed on the outer peripheral surface of the coupling member 51. A screw thread corresponding to the screw thread formed on the outer peripheral surface of the coupling member 51 can be formed on the inner surface of the second plate 4 facing the fastening hole 42.

[0027] The coupling member 51 can lift the second plate 4 by fastening to the second plate 4 through the fastening hole 42. For example, when a deflection occurs in a portion of the first plate 3 to which the second plate 4 is coupled, as shown in FIG. 3, the coupling member 51 can lift the second plate 4 by rotating in a direction of fastening to the second plate 4. The second plate 4 can lift the portion of the first plate 3 to which the second plate 4 is coupled. Therefore, the substrate processing apparatus 1 according to the present invention can reduce the deflection occurring in the first plate 3 by using the fastening between the coupling member 51 and the second plate 4, and can reduce the change in the gap between the first plate 3 and the substrate (S) supported by the substrate support unit 21. As a result, the substrate processing apparatus 1 according to the present invention can improve the quality of the substrate (S) subjected to the processing process. In addition, the substrate processing apparatus 1 according to the present invention can reduce the deflection occurring in the first plate 3 through the rotation of the gap adjustment unit 5, and can improve the ease of the work for solving the sagging occurring in the first plate 3. The coupling member 51 can rotate by the rotation of the gap adjustment unit 5 about the rotation axis 5a. The rotation axis 5a of the distance adjusting part 5 can be arranged parallel to the vertical direction (Z-axis direction).

[0028] The distance adjustment portion 5 may include a connecting member 52 and a supporting member 53 .

[0029] The connecting member 52 is connected to each of the joining member 51 and the support member 53. The joining member 51 and the support member 53 can be connected to each other via the joining member 52. The connecting member 52 can be disposed between the joining member 51 and the support member 53.

[0030] The support member 53 is connected to the connecting member 52. The support member 53 may be disposed on the opposite side of the connecting member 52 to the connecting member 51. As shown in FIG. 2, the support member 53 may be supported by the lid 22. As a result, the support member 53 may support the first plate 3 via the second plate 4 using the supporting force supported by the lid 22. The support member 53 may be supported by the lid 22 by being inserted into and connected to an upper portion of the lid 22. The connecting member 52 may protrude downward from the lower surface of the support member 53. In this case, the connecting member 52 may be connected to the connecting member 51, which is inserted into the lid 22 at one side and connected to the support member 53 at the other side.

[0031] Referring to FIGS. 1 to 5, the second plate 4 can include an adapter 43 .

[0032] The adaptor 43 is coupled to the first plate 3. The gap adjustment part 5 can be coupled to the adaptor 43. This allows the adaptor 43 to function as a medium connecting the gap adjustment part 5 and the first plate 3 to each other. Therefore, the substrate processing apparatus 1 according to the present invention can achieve the following effects.

[0033] First, the substrate processing apparatus 1 according to the present invention may be embodied such that the gap adjuster 5 supports the first plate 3 via the adaptor 43. In this case, the first plate 3 may be supported by the chamber 2 and also by the gap adjuster 5. As a result, the substrate processing apparatus 1 according to the present invention may reduce deflection caused by the weight of the first plate 3. Therefore, the substrate processing apparatus 1 according to the present invention may reduce the degree to which the gap between the lid 22 and the first plate 3 changes partially. As a result, the substrate processing apparatus 1 according to the present invention may reduce the degree to which the gap between the first plate 3 and the substrate (S) supported by the substrate support 21 changes partially, thereby improving the quality of the substrate (S) after the processing process.

[0034] Secondly, in the substrate processing apparatus 1 according to the present invention, since the gap adjusting unit 5 is connected to the first plate 3 via the adapter 43, if damage or breakage occurs during use or during an assembly process for connecting the gap adjusting unit 5 to the first plate 3, the adapter 43 can be induced to be damaged or broken. As a result, the substrate processing apparatus 1 according to the present invention can reduce the possibility of the first plate 3 being damaged or broken, thereby reducing maintenance and repair costs. In addition, the substrate processing apparatus 1 according to the present invention can induce damage or breakage to occur on the adapter 43, which is relatively easier to maintain and repair than the first plate 3, thereby improving the ease of maintenance and repair work.

[0035] Third, the substrate processing apparatus 1 according to the present invention may be embodied such that the gap adjuster 5 is electrically connected to the first plate 3 via the adapter 43. In this case, the adapter 43 may electrically connect the gap adjuster 5 and the first plate 3. Thus, power for generating plasma may be applied to the first plate 3 via the gap adjuster 5 and the adapter 43. Therefore, the substrate processing apparatus 1 according to the present invention may improve the ease of work for imparting electrical characteristics to the first plate 3, as compared with the comparative example using separate wiring, etc.

[0036] The adapter 43 may be inserted in whole or in part into the first plate 3. As shown in FIG. 2 and FIG. 3, the adapter 43 may be inserted in whole into the insertion hole 32 formed in the first plate 3. In this case, the upper surface 43a of the adapter 43 and the upper surface 3a of the first plate 3 may be disposed at the same height. As shown in FIG. 4, the adapter 43 may also be partially inserted into the insertion hole 32 formed in the first plate 3. In this case, the upper surface 43a of the adapter 43 may be disposed at a higher height than the upper surface 3a of the first plate 3. As shown in FIG. 5, the adapter 43 may be coupled to the upper surface 3a of the first plate 3 so as to protrude upward from the upper surface 3a of the first plate 3. In this case, the first plate 3 does not have an insertion hole 32 formed therein. The lower surface 43b of the adapter 43 may contact the upper surface 3a of the first plate 3. The adapter 43 may be coupled to the first plate 3 so as to be fixed thereto via an adhesive or the like. The adapter 43 may be coupled to the first plate 3 so as to be fixed thereto via bonding, welding, or the like.

[0037] When the adapter 43 is provided, the coupling member 51 of the gap adjusting unit 5 can be coupled to the adapter 43. The coupling member 51 can also be coupled to the adapter 43 by fastening. In this case, the fastening hole 42 can be formed in the adapter 43. A thread corresponding to the thread formed on the outer peripheral surface of the coupling member 51 can be formed on the inner surface of the adapter 43 facing the fastening hole 42. The coupling member 51 can be fastened to the adapter 43 through the fastening hole 42 to lift the adapter 43. For example, when a deflection occurs in the portion of the first plate 3 to which the adapter 43 is coupled, as shown in FIG. 3, the coupling member 51 can be rotated in the direction of fastening to the adapter 43 to lift the adapter 43. The portion of the first plate 3 to which the adapter 43 is coupled can be lifted by lifting the adapter 43. Therefore, the substrate processing apparatus 1 according to the present invention can reduce the deflection occurring in the first plate 3 by using the fastening between the coupling member 51 and the adapter 43, and therefore can reduce the change in the gap between the first plate 3 and the substrate (S) supported by the substrate support unit 21. On the other hand, when the adapter 43 is provided, the connecting member 52 of the gap adjustment part 5 can be inserted into the cover 22 on one side and connected to the support member 53, and the other side can be connected to the connecting member 51 connected to the adapter 43.

[0038] The substrate processing apparatus 1 according to the present invention may include a plurality of adapters 43 and a plurality of gap adjustment units 5. In this case, the adapters 43 may be arranged to be spaced apart from each other and coupled to different portions of the first plate 3. The gap adjustment units 5 may be arranged to be spaced apart from each other and supported on different portions of the cover 22. Thus, the gap adjustment units 5 support different portions of the first plate 3 via the adapters 43, thereby reducing the degree to which the first plate 3 is generally deflected. In addition, the gap adjustment units 5 may be independently rotated to independently lift different portions of the first plate 3. Thus, when the first plate 3 is partially deflected, the gap adjustment units 5 may lift only the portion where the deflection occurs, thereby maintaining a uniform gap between the first plate 3 and the substrate (S) supported by the substrate support units 21.

[0039] 1-6, the second plate 4 may include a top plate 44 (shown in FIG. 6).

[0040] The upper plate 44 is disposed above the first plate 3. The upper plate 44 and the first plate 3 may be disposed apart from each other along the vertical direction (Z-axis direction). A space 45 may be disposed between the upper plate 44 and the first plate 3. The upper plate 44 and the first plate 3 may be disposed so as not to be electrically connected to each other through the space 45. Although not shown in the figure, an insulator for electrically insulating the upper plate 44 and the first plate 3 may be disposed in the space 45. As shown in FIG. 6, the lower surface 44a of the upper plate 44 may be formed flat. The lower surface 44a of the upper plate 44 is a surface disposed toward the space 45. In this case, the upper surface 3a of the first plate 3 may be disposed so as to face the space 45.

[0041] The upper plate 44 may have upper vent holes 41. The upper vent holes 41 may be formed at positions spaced apart from each other to penetrate the upper plate 44. Gas may be injected toward the separated space 45 through the upper vent holes 41.

[0042] When the substrate processing apparatus 1 according to the present invention includes the upper plate 44 and the first plate 3, the substrate processing apparatus 1 may include a plurality of adapters 43 and a plurality of distance adjusters 5.

[0043] Of the adaptors 43, the lower adaptor 431 can be coupled to the first plate 3. Of the adaptors 43, the upper adaptor 432 can be coupled to the upper plate 44.

[0044] Of the spacing adjustment parts 5, the lower spacing adjustment part 54 may be coupled to the lower adaptor 431 and connected to the first plate 3. In this case, one side of the lower spacing adjustment part 54 may be coupled to the lower adaptor 431 and the other side may be coupled to the cover 22 or another structure. The other side of the lower spacing adjustment part 54 may be coupled to the RF power supply line 50 or grounded. The lower spacing adjustment part 54 may be inserted into the upper plate 44. In this case, an insulating member 541 may be disposed between the lower spacing adjustment part 54 and the upper plate 44. The insulating member 541 may insulate the lower spacing adjustment part 54 from the upper plate 44.

[0045] The lower gap adjusting part 54 may be fastened to the lower adaptor 431. In this case, the lower gap adjusting part 54 may rotate in a direction fastened to the lower adaptor 431 to raise the lower adaptor 431, thereby raising the part of the first plate 3 to which the lower adaptor 431 is coupled. Therefore, the substrate processing apparatus 1 according to the present invention may reduce the deflection generated in the first plate 3 by using the fastening between the lower gap adjusting part 54 and the lower adaptor 431, and thus may reduce the change in the gap between the first plate 3 and the substrate (S) supported by the substrate support part 21. As a result, the substrate processing apparatus 1 according to the present invention may improve the quality of the substrate (S) subjected to the processing process. In addition, the substrate processing apparatus 1 according to the present invention may reduce the deflection generated in the first plate 3 through the rotation of the lower gap adjusting part 54, and thus may improve the ease of the work for solving the deflection generated in the first plate 3. The lower gap adjusting part 54 may include the coupling member 51, the connecting member 52, and the supporting member 53 described above.

[0046] Of the spacing adjustment parts 5, the upper spacing adjustment part 55 may be coupled to the upper adapter 432 and connected to the upper plate 44. In this case, one side of the upper spacing adjustment part 55 may be coupled to the upper adapter 432, and the other side may be coupled to the lid 22 or another structure. The other side of the upper spacing adjustment part 55 may be coupled to the RF power supply line 50 or grounded. In this case, when the other side of the upper spacing adjustment part 55 is coupled to the RF power supply line 50, the other side of the lower spacing adjustment part 54 may be grounded. When the other side of the upper spacing adjustment part 55 is grounded, the other side of the lower spacing adjustment part 54 may be coupled to the RF power supply line 50.

[0047] The upper gap adjustment part 55 can be fastened to the upper adaptor 432. In this case, the upper gap adjustment part 55 can be rotated in a fastening direction to the upper adaptor 432 to raise the upper adaptor 432, thereby raising the part of the upper plate 44 to which the upper adaptor 432 is coupled. Therefore, the substrate processing apparatus 1 according to the present invention can reduce the deflection generated in the upper plate 44 by fastening between the upper gap adjustment part 55 and the upper adaptor 432, and therefore can reduce the change in the gap between the upper plate 44 and the first plate 3. As a result, the substrate processing apparatus 1 according to the present invention can improve the quality of the substrate (S) subjected to the processing process. In addition, the substrate processing apparatus 1 according to the present invention can reduce the deflection generated in the upper plate 44 through the rotation of the upper gap adjustment part 55, and therefore can improve the ease of the work for solving the deflection generated in the upper plate 44. The upper gap adjustment part 55 can include the above-mentioned coupling member 51, the connecting member 52, and the supporting member 53.

[0048] The upper distance adjustment portion 55 can be disposed outwardly of the lower distance adjustment portion 54. In other words, the lower distance adjustment portion 54 can be disposed inwardly of the upper distance adjustment portion 55.

[0049] 7, the lower gap adjusting part 54 may be coupled to the first plate 3 in the first area (FA). In this case, a lower adaptor 431 is coupled to the part of the first plate 3 belonging to the first area (FA). Thus, the lower gap adjusting part 54 may be coupled to the lower adaptor 431 and connected to the part of the first plate 3 belonging to the first area (FA) through the lower adaptor 431. A plurality of lower gap adjusting parts 54 and lower adaptors 431 may be disposed in the first area (FA).

[0050] The upper gap adjustment part 55 can be coupled to the upper plate 44 in a region corresponding to the second region (SA). The second region (SA) is disposed so as to surround the first region (FA). In this case, the first region (FA) can be disposed inside the second region (SA). The upper adapter 432 is coupled to a portion of the upper plate 44 belonging to the region corresponding to the second region (SA). Thus, the upper gap adjustment part 55 can be coupled to the upper adapter 432 and connected to the portion of the upper plate 44 belonging to the region corresponding to the second region (SA) via the upper adapter 432. A plurality of upper gap adjustment parts 55 and upper adapters 432 can be disposed in the region corresponding to the second region (SA).

[0051] Here, the lower vent holes 31 formed in the first plate 3 may be arranged to be spaced apart from each other at a distance (D, shown in FIG. 2) of 8 mm or more and 13 mm or less. Thus, even when the adaptor 43 is coupled to the first plate 3, the lower vent holes 31 may be arranged to be spaced apart from each other at the same distance (D) overall. In this case, the adaptor 43 may be formed to have a horizontal cross-sectional area smaller than the distance (D) at which the lower vent holes 31 are spaced apart from each other. The horizontal cross-sectional area may be a cross-sectional area based on a horizontal direction perpendicular to the vertical direction (Z-axis direction). For example, the adaptor 43 may be formed to have a horizontal cross-sectional area of ​​less than 13 mm. When the upper plate 44 is provided, a lower adaptor 431 may be coupled to the first plate 3. The lower adaptor 431 may be formed to have a horizontal cross-sectional area smaller than the distance (D) at which the lower vent holes 31 are spaced apart from each other.

[0052] Meanwhile, the upper vent holes 41 formed in the upper plate 44 may be arranged to be spaced apart from one another at intervals of 8 mm or more and 13 mm or less. Thus, even when the upper adapter 432 is coupled to the upper plate 44, the upper vent holes 41 may be arranged to be spaced apart from one another at the same interval overall. In this case, the upper adapter 432 may be formed to have a horizontal cross-sectional area smaller than the interval at which the upper vent holes 41 are spaced apart from one another. For example, the upper adapter 432 may be formed to have a horizontal cross-sectional area of ​​less than 13 mm.

[0053] 1 to 8, in a substrate processing apparatus 1 according to the present invention, the second plate 4 may include a plurality of protruding electrodes 46. In this case, the first plate 3 may include a plurality of openings 33.

[0054] The protruding electrodes 46 each protrude downward from the lower surface 44a of the upper plate 44. The protruding electrodes 46 may be arranged to be spaced apart from each other. An upper air hole 41 may be formed in each of the protruding electrodes 46. The upper air hole 41 may be formed to penetrate the upper plate 44 and the protruding electrode 46. The protruding electrodes 46 and the upper plate 44 may also be formed integrally.

[0055] The openings 33 are formed in the first plate 3. The openings 33 may be formed penetrating the first plate 3 at positions spaced apart from each other. The openings 33 may be disposed at positions corresponding to the protruding electrodes 46. As shown in FIG. 8, the protruding electrodes 46 may protrude to a length inserted into each of the openings 33. In this case, the lower end of the protruding electrode 46 may be disposed in the opening 33. Although not shown in the figure, the protruding electrodes 46 may also protrude to a length disposed at a position spaced upward from each of the openings 33. In this case, the lower end of the protruding electrode 46 may be disposed between the lower surface 44a of the upper plate 44 and the upper surface 3a of the first plate 3. The lower end of the protruding electrode 46 may also be disposed on the same line as the upper surface 3a of the first plate 3. Although not shown in the figure, the protruding electrodes 46 may also protrude to a length protruding downward from the first plate 3 through each of the openings 33. In this case, the lower end of the protruding electrode 46 may be disposed in the processing space 20.

[0056] 1 to 9, a substrate processing apparatus 1 according to the present invention can include a supply section 6. As shown in FIG.

[0057] The supply unit 6 may be coupled to the first plate 3. When RF power is applied to the first plate 3, the supply unit 6 may essentially apply RF power to the first plate 3. In this case, the gap adjustment unit 5 may selectively apply RF power to the first plate 3. When RF power is applied to the first plate 3, the supply unit 6 may function as a main RF feeding and the gap adjustment unit 5 may function as a sub RF feeding. Therefore, the substrate processing apparatus 1 according to the present invention may be embodied so that the number of positions of the first plate 3 to which RF power is directly applied can be adjusted according to process conditions, etc., thereby improving versatility that can be applied to process processes under various process conditions. In this case, the lower gap adjustment unit 54 of the gap adjustment unit 5 may function as a sub RF feeding. The upper gap adjustment unit 55 of the gap adjustment unit 5 may be grounded. The supply unit 6 may be coupled to the first plate 3 at a position spaced apart from each of the lower gap adjustment unit 54 and the upper gap adjustment unit 55.

[0058] The supply unit 6 and the gap adjustment unit 5 may each be connected to an RF power supply line 50. The supply unit 6 may also be connected to a separately provided RF power supply line. The supply unit 6 may be inserted into the upper plate 44 and coupled to the first plate 3. In this case, an insulating unit 61 may be disposed between the supply unit 6 and the upper plate 44. The insulating unit 61 may insulate the supply unit 6 from the upper plate 44.

[0059] The present invention described above is not limited to the above-mentioned embodiments and the accompanying drawings, and it will be apparent to those skilled in the art to which the present invention pertains that various substitutions, modifications and alterations are possible without departing from the technical spirit of the present invention.

Claims

1. a chamber including a lid on top; a first plate disposed under the lid and having a plurality of ventilation holes; a second plate coupled to the first plate, the second plate including a plurality of vent holes communicating with some of the plurality of vent holes of the first plate; and a gap adjusting portion connected to the second plate and configured to adjust a gap between the cover and the first plate; 4. The substrate processing apparatus, wherein the gap adjusting portion is connected to an RF power supply line.

2. The second plate has a fastening hole for fastening the gap adjusting part, The substrate processing apparatus of claim 1 , wherein the gap adjuster includes a coupling member that is coupled to the second plate through the coupling hole.

3. The substrate processing apparatus of claim 1 , wherein the plurality of ventilation holes formed in the first plate are spaced apart from each other at intervals of 8 mm to 13 mm.

4. the second plate includes an adapter coupled to the first plate; The substrate processing apparatus of claim 1 , wherein the gap adjuster is coupled to the adaptor and is connected to the first plate via the adaptor.

5. The adapter has a fastening hole for fastening the gap adjusting part, the gap adjusting portion includes a coupling member that is coupled to the adapter through the coupling hole, 5. The substrate processing apparatus according to claim 4, wherein the coupling member rotates in a direction in which the coupling member is fastened to the adaptor to lift the adaptor.

6. the gap adjusting portion includes a support member supported by the cover, and a connecting member connected between the support member and the connecting member and connected to each of the support member and the connecting member, The substrate processing apparatus according to claim 5 , wherein the support member supports the first plate via the adaptor by using a supporting force supported by the lid.

7. The substrate processing apparatus of claim 4 , wherein the second plate includes an upper plate disposed above the first plate.

8. The adapter and the space adjustment part are provided in a plurality of pieces, Among the adapters, a lower adapter is coupled to the first plate; Among the gap adjusting parts, a lower gap adjusting part is coupled to the lower adapter and connected to the first plate, Among the adapters, an upper adapter is coupled to the upper plate; 8. The substrate processing apparatus of claim 7, wherein the upper gap adjusting portion of the gap adjusting portions is coupled to the upper adapter and connected to the upper plate.

9. The substrate processing apparatus according to claim 8 , wherein the lower gap adjustment portion is disposed more inward than the upper gap adjustment portion.

10. 9. The substrate processing apparatus according to claim 8, wherein the lower gap adjustment part is fastened to the lower adaptor and rotates in a direction of fastening to the lower adaptor to lift the lower adaptor.

11. the second plate includes a plurality of protruding electrodes protruding downward from a lower surface of the upper plate, The substrate processing apparatus according to claim 8 , wherein the first plate is formed with a plurality of openings into which the protruding electrodes are inserted.

12. An insertion hole for inserting the adapter is formed on an upper surface of the first plate, The substrate processing apparatus according to claim 4 , wherein the adaptor is inserted into the insertion hole so that an upper surface of the adaptor is positioned at a height higher than an upper surface of the first plate.

13. An insertion hole for inserting the adapter is formed on an upper surface of the first plate, The substrate processing apparatus according to claim 4 , wherein the adaptor is inserted into the insertion hole so that an upper surface of the adaptor is positioned at the same height as an upper surface of the first plate.

14. The substrate processing apparatus according to claim 4 , wherein the adaptor is coupled to the upper surface of the first plate so as to protrude upward from the upper surface of the first plate.

15. a supply coupled to the first plate; 2. The substrate processing apparatus of claim 1, wherein, when RF power is applied to the first plate, the supply unit essentially applies RF power to the first plate, and the gap adjustment unit selectively applies RF power to the first plate.

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