Temperature control device and epitaxial growth device thereof

Abstract

The present invention discloses a temperature control device and an epitaxial growth device thereof, the temperature control device is used in an epitaxial growth device, the epitaxial growth device includes a heating device, a reflector device, and a temperature control device provided in the reflector device to control the temperature of the reflector device, the temperature control device includes an outer ring, an inner ring provided inside the outer ring, and a temperature control assembly provided in the outer ring and / or the inner ring, the temperature control assembly includes an inlet for a cooling medium, an outlet for a cooling medium, and a cooling passage passing through both. The advantage is that the temperature control device is composed of at least two rings, so the width of each ring is reduced compared to an integrated water-cooled plate structure, and therefore, when warping occurs due to thermal deformation, the gap between each ring and the reflector device is not large, ensuring close contact with the reflector device.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor equipment, and in particular to temperature control devices and epitaxial growth equipment thereof. [Background technology]

[0002] The production of semiconductor chips requires a large amount of microfabrication, among which a commonly used method is to use deposition or plasma treatment processes to treat and process semiconductor substrates in a vacuum reaction chamber. Depending on whether the deposition process involves chemical reactions, deposition can be divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD). Here, CVD is the most widely used technique in the semiconductor industry to deposit a variety of materials, including a wide range of insulating materials, most metal materials and metal alloy materials.

[0003] Chemical vapor deposition refers to the method in which chemical gases or vapors react on the surface of a substrate to synthesize coatings or nanomaterials. Generally speaking, the principle is to use a carrier gas to carry gaseous reactants or precursors into a reaction chamber where a substrate is placed, where an epitaxial growth apparatus (a type of chemical vapor deposition apparatus) uses multiple heating devices to deliver thermal energy into the reaction chamber to increase the temperature in the chamber, heat the substrate and the gaseous reactants in the chamber to increase their temperatures, and then cause a chemical reaction between one or more gases at high temperature, and each gaseous reactant will decompose and recombine to form a new solid material, which will then be deposited on the surface of the substrate to form the required thin film.

[0004] Generally, in order to increase the efficiency of thermal radiation transfer from the heating device to the chamber, a reflector device can be used to maximize the thermal radiation generated by the heating device and transfer it to the reaction chamber. However, during the process, the reflector device will inevitably absorb part of the thermal energy generated by the heating device, which will cause the temperature of the reflector device to be too high. When the temperature is too high, not only will the metal layer on the surface of the reflector device peel off, but also the stress of individual components will increase, resulting in damage to the components. Therefore, it is also necessary to provide a water-cooled plate structure to adjust the temperature of the reflector device. However, when the epitaxial growth process is carried out, the process temperature can reach 1000°C, and the temperature changes are large, ranging from hundreds to thousands, and the water-cooled plate structure will warp and deform due to the effects of thermal expansion and cold contraction. In the long term, the bonding between the water-cooled plate structure and the reflector device is not very good, and the gap between the two will be large. When the gap is large, the efficiency of heat exchange between the water-cooled plate structure and the reflector device is low, which will affect the temperature adjustment of the reflector device. Summary of the Invention

[0005] The present invention aims to provide a temperature control device and its epitaxial growth equipment, which combines an inner ring, an outer ring and a temperature control assembly to reduce the gap caused by thermal deformation when the temperature control device is connected to the reflector device, help ensure the adhesion with the reflector device, avoid the problem of warping and deformation of the temperature control device after long-term use, improve the efficiency of heat exchange between the temperature control device and the reflector device, and ensure the efficiency of its temperature adjustment.

[0006] In order to achieve the above objectives, the present invention is realized by the following technical solutions.

[0007] 1. A temperature control device for use in an epitaxial growth apparatus, comprising: a heating device; a reflector device; and a temperature control device provided in the reflector device for controlling a temperature of the reflector device,

[0008] An outer ring; an inner ring disposed inside the outer ring; a temperature control assembly provided on the outer ring and / or the inner ring and including a cooling medium inlet, a cooling medium outlet, and a cooling passage passing through both.

[0009] Optionally, the temperature control assembly is mounted only on the inner ring, and the temperature control device further comprises a pressure assembly for applying pressure to the inner ring through the outer ring in the direction of the reflector arrangement.

[0010] Optionally, the pressure assembly is provided between an inner ring and an outer ring.

[0011] Optionally, the pressure assembly includes at least one protruding structure on an outer periphery of the inner ring and a stepped recessed groove on an inner periphery of the outer ring that mates with the protruding structure.

[0012] Optionally, the thermal conductivity of the material of the outer ring is less than the thermal conductivity of the material of the inner ring; And / or the wear resistance of the material of the outer ring is greater than the wear resistance of the material of the inner ring.

[0013] Optionally, the material of the outer ring comprises stainless steel and the material of the inner ring comprises copper.

[0014] Optionally, the temperature control assembly is mounted only on the outer ring, and the temperature control device further comprises a pressure assembly for applying pressure to the outer ring through the inner ring in the direction of the reflector arrangement.

[0015] Optionally, the pressure assembly is provided between an inner ring and an outer ring.

[0016] Optionally, the pressure assembly includes at least one protruding structure on an inner circumference of the outer ring and a stepped recessed groove on an outer circumference of the inner ring that mates with the protruding structure.

[0017] Optionally, the thermal conductivity of the material of the inner ring is less than the thermal conductivity of the material of the outer ring; And / or the wear resistance of the material of the inner ring is greater than the wear resistance of the material of the outer ring.

[0018] Optionally, the material of the inner ring comprises stainless steel and the material of the outer ring comprises copper.

[0019] Optionally, the contour of the at least one protruding structure is one or more of a continuous wave shape, a continuous polyline, and a continuous zigzag shape.

[0020] Optionally, the temperature control device further includes a base for removably mounting a heating device, removably connected to the outer ring or the inner ring via a connection assembly.

[0021] Optionally, the connection assembly includes a sliding guide member and a positioning member disposed between the base and the outer ring or the inner ring for guiding the base to slide in a sliding direction relative to the outer ring or the inner ring, and the positioning member is used to fix the base in an attachment position relative to the outer ring or the inner ring when the base slides to the attachment position.

[0022] Optionally, the sliding guide member includes a T-shaped boss and a T-shaped groove corresponding thereto, the T-shaped groove being used for guiding the T-shaped boss by sliding therein; The T-shaped boss is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the T-shaped groove is provided on a contact surface of the outer ring or the inner ring that contacts the base, or the T-shaped groove is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the T-shaped boss is provided on a contact surface of the outer ring or the inner ring that contacts the base.

[0023] Optionally, the positioning member includes a resilient structure and a matching positioning groove, the resilient structure includes an extension, and when in an attached position, the extension of the resilient structure forms a locking relationship with the positioning groove;

[0024] The elastic structure is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the positioning groove is provided on a contact surface of the base that contacts the base of the outer ring or the inner ring, or the elastic structure is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the positioning groove is provided on a contact surface of the base that contacts the outer ring or the inner ring.

[0025] Optionally, the resilient structure extension is a ball plunger.

[0026] Optionally, the number of the positioning members is at least two, and the positioning members are symmetrically disposed with respect to the sliding guide member; The sliding guides extend radially along the outer ring or the inner ring.

[0027] Optionally, the temperature control device comprises: The reflector device further includes a fastening member provided on the outer ring and / or the inner ring for fixing the outer ring and the inner ring to the reflector device.

[0028] Optionally, an epitaxial growth tool comprising: a reaction chamber for carrying out an epitaxial growth process, the reaction chamber including a tray therein for placing a substrate; a heating device disposed above and / or below the reaction chamber for providing thermal radiation during the epitaxial growth process; a reflector device for reflecting thermal radiation generated by the heating device into the reaction chamber; and a temperature control device for controlling the temperature of the reflector device.

[0029] The present invention has the following advantages over the conventional techniques.

[0030] In the temperature control device and its epitaxial growth equipment provided by the present invention, the outer ring water-cooled plate structure is composed of at least two rings, so the width of each ring is reduced compared with the integrated water-cooled plate structure, and the gap between each ring of the water-cooled plate structure and the reflector device is not large when the water-cooled plate structure is warped due to thermal deformation, which helps to ensure the adhesion with the reflector device and improve the efficiency of heat exchange between the temperature control device and the reflector device. In addition, there is a pressure assembly between the inner ring and the outer ring, which can ensure the adhesion between the inner ring or the outer ring and the reflector device. In addition, the inner ring and the outer ring are not integrated, the materials of the two rings are different, and the base is only placed on one of the wear-resistant materials of the inner ring or the outer ring, so that the levelness and stability of the heating device in a high-temperature environment are ensured. [Brief description of the drawings]

[0031] [Figure 1] 1 is a structural schematic diagram of an epitaxial growth apparatus according to the present invention; [Diagram 2] FIG. 2 is a schematic diagram of the local structure of an epitaxial growth apparatus according to the present invention. [Diagram 3] 1 is a schematic diagram of an outer ring water-cooled plate structure according to the present invention. [Figure 4] 4 is a schematic diagram of another outer ring water-cooled plate structure according to the present invention; FIG. [Diagram 5] FIG. 2 is a structural schematic diagram of an inner ring according to the present invention. [Figure 6a] FIG. 2 is a schematic diagram of the top surface of an outer ring according to the present invention. [Figure 6b] FIG. 2 is a schematic view of the underside of an outer ring according to the present invention. [Figure 7] FIG. 2 is a schematic diagram of the connection of the heating device, the base and the outer ring according to the present invention. [Figure 8a] FIG. 2 is a schematic diagram of the three-dimensional structure of a base according to the present invention. [Figure 8b] FIG. 2 is a schematic view of the underside of a base according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described below clearly and completely in conjunction with the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments that can be obtained by those skilled in the art without any creative effort based on the embodiments of the present invention belong to the protection scope of the present invention.

[0033] It should be noted that in this document, the terms "comprise", "contain", "have", or any other variation thereof, cover a non-exclusive inclusion, such that a process, method, article, or device that includes a set of elements includes not only those elements, but also other elements not expressly listed or other elements inherent to such process, method, article, or device. In the absence of further limitations, an element qualified by a statement "including" or "comprises" does not exclude the presence of other elements in the process, method, article, or device that includes said element.

[0034] It should be noted that the drawings are in highly simplified form and are all not to scale and are used only to aid in conveniently and clearly illustrating the purpose of one embodiment of the invention.

[0035] Example 1 1 and 2 are structural schematic diagrams of an epitaxial growth apparatus of the present invention, which includes a reaction chamber 100 for carrying out an epitaxial growth process, and the reaction chamber 100 is used to process one or more substrates W, including depositing material on the upper surface of the substrate W. The reaction chamber 100 has an upper wall 101 located at an upper end, a lower wall 102 located at a bottom end, and a side wall extending between the upper wall 101 and the lower wall 102, and optionally the upper wall 101 and the lower wall 102 are made of optically transparent or semi-transparent material (such as quartz material transparent to a certain infrared band) that is transparent to thermal energy.

[0036] The reaction chamber 100 has a gas inlet 103 at one end and a gas outlet 104 at the other end. The reaction chamber 100 includes a gas inlet region corresponding to the gas inlet 103, a gas outlet region corresponding to the gas outlet 104, and a reaction region between the gas inlet region and the gas outlet region. The substrate W is located in the reaction region, and a reaction gas for deposition flows into the internal space of the chamber from the gas inlet 103, as shown by the arrows in FIG. 1, a chemical vapor deposition process is carried out in the reaction region, and the reaction gas is exhausted from the chamber through the gas outlet 104 of the chamber.

[0037] 1, the lower wall 102 is provided with an extension tube extending downward, the extension tube is used to accommodate an internal space through which a rotating shaft 105 is inserted into the reaction chamber 100 through the extension tube, and the upper part of the rotating shaft 105 includes a plurality of support bars for supporting the tray and the substrate W on the tray, so as to rotate and drive the tray and the substrate W placed thereon in the reaction region, and further ensure the uniformity of the thin film deposition effect on the substrate W. Optionally, the rotating shaft 105 is made of quartz to reduce the risk of contamination by granules.

[0038] In addition, the epitaxial growth equipment further includes a plurality of heating devices 106 for providing thermal radiation to the reaction chamber 100 and the substrate W when the epitaxial growth process is performed, and each of the heating devices 106 is disposed outside the reaction chamber 100 so as to heat the reaction chamber 100 and the substrate W therein. In order to easily understand the status of the temperature change in the reaction chamber 100, the epitaxial growth equipment further includes a thermometer 107.

[0039] In this embodiment, heating devices 106 are disposed above and below the reaction chamber 100, and during the epitaxial growth process, the inside of the reaction chamber 100 and the substrate W of the epitaxial growth equipment are made to reach a required process temperature by providing thermal radiation to the inside of the reaction chamber 100 and the substrate W through the heating devices 106, so as to facilitate the pyrolysis of the reaction gas in the reaction chamber 100, and thus depositing a thin film material on the upper surface of the substrate W, and at the same time, the temperature in the reaction chamber 100 is measured in real time using a thermometer 107, thereby adjusting the process. Optionally, the thin film material deposited on the upper surface of the substrate W is a semiconductor material such as silicon or germanium, and may also include other doping materials such as group III, group IV, and / or group V materials. In addition, optionally, the heating device 106 is a high-intensity tungsten lamp with a transparent quartz shell and containing halogen gas such as iodine, and only a small portion of the radiant heat energy generated by the high-intensity tungsten lamp is absorbed by the upper wall 101 and the lower wall 102 of the reaction chamber 100, so that the heat energy generated by each heating device 106 is maximally transferred to the substrate W and the reaction gas in the reaction chamber 100. Of course, the heating device 106 can be other devices capable of achieving thermal radiation, and the present invention is not limited thereto.

[0040] In order to improve the efficiency of the heat radiation of the heating device 106 to the reaction chamber 100, the epitaxial growth equipment of the present invention further includes a reflector device, which is used to reflect the heat radiation generated by the heating device 106 to the reaction chamber 100, and has high reflectivity to the heat radiation of the heating device 106. As shown in FIG. 2, in this embodiment, an inner ring reflector device 108 and an outer ring reflector device 109 are installed according to the distribution of the heating devices 106 to ensure the efficiency of the heat radiation transfer of each heating device 106. From the above, it can be seen that although each reflector device has a very high reflectivity to the heat radiation, there is still some heat radiation absorbed by the inner ring reflector device 108 and the outer ring reflector device 109, so that the epitaxial growth equipment is further correspondingly provided with an inner ring water-cooled plate structure 110 and an outer ring water-cooled plate structure 120 to adjust the temperature of the inner ring reflector device 108 and the outer ring reflector device 109 respectively. Optionally, the inner ring water-cooled plate structure 110 and the outer ring water-cooled plate structure 120 may be partially or completely the same in structure. Next, the outer ring water-cooled plate structure 120 (i.e., the temperature control device) will be taken as an example to describe the structure.

[0041] 3, the outer ring water-cooled plate structure 120 is provided in the outer ring reflector device 109, which is used to control the temperature of the outer ring reflector device 109. The outer ring water-cooled plate structure 120 includes an outer ring 121, an inner ring 122 provided inside the outer ring 121, and a temperature control assembly 123, the temperature control assembly 123 is provided in the inner ring 122 and / or the outer ring 121, the temperature control assembly 123 includes a cooling medium inlet 1231, a cooling medium outlet 1232, and a cooling passage passing through both, and the cooling medium flows in the cooling passage so as to realize heat exchange between the temperature control assembly 123 and the outside and other components. In the present invention, the outer ring water-cooled plate structure 120 includes an inner ring 122 and an outer ring 121, and the width of the water-cooled plate structure of the integral structure is reduced because the outer ring water-cooled plate structure 120 is composed of two rings, and the width of each ring is reduced compared with the integrated water-cooled plate structure. Due to the reduced width, when the water-cooled plate structure is warped due to thermal deformation, the gap between the water-cooled plate structure and the reflector device is not large, which is helpful to improve the adhesion between the outer ring water-cooled plate structure 120 and the outer ring reflector device 109, and improve the efficiency of the heat exchange between them, and is helpful to uniformly control the temperature of the outer ring water-cooled plate structure 120 relative to the outer ring reflector device 109. At the same time, the outer ring water-cooled plate structure 120 does not have too many components, and the degree of connection and fastening is easy to control, the structure is simple, and the assembly and disassembly are more convenient. Of course, the water-cooled plate structure can optionally further include more rings other than the inner ring and the outer ring, and thus the width of each ring can be further reduced.

[0042] Example 2 Based on the structural characteristics of the epitaxial growth equipment of the first embodiment, this embodiment makes modifications to the outer ring water-cooled plate structure 120, mainly changing the installation position of the temperature control assembly 123. As shown in Figs. 4 to 6b, this embodiment shows a situation in which the temperature control assembly 123 is installed on the inner ring 122, and in this embodiment, the temperature control assembly 123 is only installed on the inner ring 122, and the temperature control of the outer ring reflector device 109 is realized through the temperature control assembly 123 of the inner ring 122. The outer ring water-cooled plate structure 120 further includes a pressure assembly, which applies pressure to the inner ring 122 in the direction of the outer ring reflector device 109 through the outer ring 121, so as to make the connection between the inner ring 122 and the outer ring reflector device 109 stronger and reduce the gap between the inner ring 122 and the outer ring reflector device 109.

[0043] In the present invention, the pressure assembly is disposed between the inner ring 122 and the outer ring 121, and the inner ring 122 and the outer ring 121 are detachably connected. Optionally, the pressure assembly includes at least one protrusion structure 124 provided on the outer periphery of the inner ring 122, and a stepped groove 125 provided on the inner periphery of the outer ring 121 and matching the protrusion structure 124. The inner ring 122 and the outer ring 121 of the outer ring water-cooled plate structure 120 are detachably connected via the pressure assembly, and disassembly and installation are both convenient.

[0044] As shown in FIG. 5, in this embodiment, a plurality of one-step stepped protrusion structures 124 (i.e., skirt-shaped protrusion structures or rectangular protrusion structures) are arranged in the circumferential direction of the peripheral portion of the inner ring 122, and a one-step stepped groove 125 of a skirt-shaped protrusion structure matching the plurality of one-step stepped protrusion structures 124 is correspondingly arranged along the circumferential direction on the inner circumference of the outer ring 121, and the plurality of one-step stepped protrusion structures 124 are fitted into the one-step stepped groove 125 to help the outer ring 121 apply a downward force (i.e., a force toward the outer ring reflector device 109) to the inner ring 122, thereby making the inner ring 122 tightly attached to the outer ring reflector device 109 and improving the efficiency of heat conduction, and at the same time, the stepped groove 125 can guide the protrusion structures 124 to perform thermal expansion radially therein, ensuring stability after connection. Of course, the protrusion structure 124 and the stepped groove 125 are not limited to a single-step structure, and may be a multi-step structure according to the need for adhesion, and the present invention is not limited thereto. Furthermore, the protrusion structure 124 is not limited to a stepped protrusion structure, and its peripheral contour may be one or more of a continuous wave shape, a continuous polyline, and a continuous zigzag, that is, the protrusion structure 124 can be continuously installed in the circumferential direction along the periphery of the inner ring 122, and the inner circumference of the outer ring 121 is correspondingly installed, thereby expanding the engagement range between the inner ring 122 and the outer ring 121, and further ensuring the robustness of the outer ring water-cooled plate structure 120.

[0045] Optionally, the outer ring water-cooled plate structure 120 further includes a fastening member, which is provided on the outer ring 121 and / or the inner ring 122 so as to fix the outer ring 121 and the inner ring 122 to the outer ring reflector device 109 and further realize the fixing of the outer ring water-cooled plate structure 120.

[0046] When mounting the outer ring water-cooled plate structure 120, the one-step protrusion structure 124 of the inner ring 122 is inserted into the one-step recessed groove 125 of the outer ring 121 through the engagement between the one-step protrusion structure 124 and the one-step recessed groove 125, so that the two do not rotate opposite to each other. In addition, the outer ring 121 and the inner ring 122 are fixed to the outer ring reflector device 109 via fastening members, and the outer ring water-cooled plate structure 120 is further fixed.

[0047] Further, the thermal conductivity of the material of the outer ring 121 is less than the thermal conductivity of the material of the inner ring 122 and / or the wear resistance of the material of the outer ring 121 is greater than the wear resistance of the material of the inner ring 122, and optionally the material of the outer ring 121 includes stainless steel and the material of the inner ring 122 includes pure copper. In this embodiment, the temperature control assembly 123 is only provided on the inner ring 122. Because the temperature control assembly 123 exists and the thermal conductivity of the material of the outer ring 121 is smaller than that of the material of the inner ring 122, the heat is mainly absorbed by the inner ring 122, and the outer ring 121 absorbs less heat, so the thermal deformation is small. Moreover, because the outer ring 121 and the inner ring 122 are not integrated but joined together, a gap is generated between the inner circumference of the outer ring 121 and the outer circumference of the inner ring 122, which reduces the efficiency of heat transfer from the inner ring 122 to the outer ring 121, so the temperature of the outer ring 121 is not high. Moreover, because the outer ring 121 is made of stainless steel, its linear expansion coefficient is smaller than that of copper, so the outer ring 121 is more stable, which has better benefits when the base 126 is installed, which will be described in detail below. In addition, since the hardness of stainless steel is greater than that of copper, even if the copper inner ring 122 is thermally deformed, the stainless steel outer ring 121 can firmly fix the copper inner ring 122 to the surface of the outer ring reflector device 109.

[0048] 7, in this embodiment, the outer ring water-cooled plate structure 120 (i.e., temperature control device) further includes a base 126 for detachably mounting the heating device 106, and the base 126 is detachably connected to the outer ring 121 through a connection assembly. The base 126 further includes an inverted L-shaped fixed frame 1261 provided thereon.

[0049] The heating device 106 includes a socket 1061 and a heating lamp 1062. The socket 1061 includes an upper socket and a lower socket. The socket 1061 is fixed to the inverted L-shaped fixing frame 1261 of the base 126. The inverted L-shaped fixing frame 1261 is provided with four through holes. The upper socket and the lower socket are also provided with corresponding through holes. The screw assembly is inserted into the corresponding through holes on the inverted L-shaped fixing frame 1261, the upper socket and the lower socket to fix the heating device 106 to the base 126. The upper socket is attached above the inverted L-shaped fixing frame 1261 of the base 126, and the lower socket is attached below the inverted L-shaped fixing frame 1261 of the base 126. The upper and lower sockets are provided with female pins on the side edges close to the heat lamp 1062, and these female pins match with male pins at the end of the heat lamp 1062. The heat lamp 1062 is connected to the socket 1061 via these male and female pins, and the heat lamp 1062 is further removably attached to the base 126.

[0050] In order to fully utilize the installation space of the epitaxial growth equipment, the outer ring water-cooled plate structure 120 can fix the heating device 106 through the base 126 (as shown in FIG. 2), but in the prior art, the heating device 106 is usually directly fixed using a screw assembly. Due to the narrow installation space of the outer ring water-cooled plate structure 120, it is inconvenient to use a disassembly tool to disassemble the screw assembly within the field of view, and at the same time, during the disassembly and installation process, there is a risk that the screw assembly will fall into the equipment and cannot be taken out, which makes the installation and disassembly very inconvenient. On the other hand, due to the constraints of the mounting space, the screw assembly can only be mounted on the edge of the heating device 106 and the outer ring water-cooled plate structure 120, and due to the processing error of the equipment, it is difficult to ensure that an absolute plane is maintained between the heating device 106 and the outer ring water-cooled plate structure 120. When the screw assembly is mounted and locked, a torque is generated on the whole heating device 106, which causes the other end of the heating device 106 to bend upward, so that the heating lamp 1062 cannot maintain a good levelness, and the levelness of the heating lamp 1062 affects the uniformity of the temperature field of the substrate W in the reaction chamber 100, and furthermore, the temperature uniformity of the airflow field cannot be ensured, so that the heating effect of the airflow field of the process gas in the substrate W and reaction region does not achieve the expected uniformity, and the uniformity of the thin film deposition cannot be ensured.

[0051] As is well known, during the entire epitaxial growth process, the growth environment of the thin film on the substrate W is very harsh, and factors such as the temperature uniformity of the substrate W material itself, the temperature uniformity of the airflow field, and the accuracy of the reaction temperature are all important, which directly determine the quality of the thin film deposited on the substrate W. Therefore, the stable fixation of the outer ring water-cooled plate structure 120 and the heating device 106 is particularly important, and when the outer ring water-cooled plate structure 120 is in close contact with the outer ring reflector device 109, the heating device 106 placed on the outer ring water-cooled plate structure 120 can also maintain good horizontality.

[0052] In view of the above problems, as shown in the combination of Figures 4, 7, 8a and 8b, in this embodiment, the base 126 of the outer ring water-cooled plate structure 120 detachably mounts the heating device 106, and the base 126 is detachably connected to the outer ring 121 via a connection assembly, and optionally, the heating devices 106 are multiple and arranged in a ring shape on the upper surface of the outer ring water-cooled plate structure 120, and each of the heating devices 106 is mounted on one base 126, which is convenient for attaching and detaching any heating device 106. When the outer ring 121 and the inner ring 122 of the outer ring water-cooled plate structure 120 are stably connected and fixed to the outer ring reflector device 109, it is conducive to the stable installation of the heating device 106 placed on the base 126, and further ensures the levelness and heating stability of the heating device 106, and does not cause instability in the levelness and direction of the heating device 106. In particular, the base 126 is only provided on the outer ring 121, and the stainless steel outer ring 121 is installed separately from the inner ring 122, so that the outer ring 121 is not easily deformed, and therefore the levelness and direction stability of the heating device 106 can be better ensured. Moreover, the material of the outer ring 121 has good wear resistance and can better adapt to disassembly of the base 126.

[0053] In terms of disassembly, the connection assembly includes a sliding guide member and a positioning member, the sliding guide member being disposed between the base 126 and the outer ring 121 for guiding the base 126 to slide in a sliding direction relative to the outer ring 121, and the positioning member being used to fix the base 126 in the mounting position relative to the outer ring 121 when the base 126 slides to the mounting position.

[0054] When the heating device 106 is mounted, the heating device 106 is mounted on the base 126 of the outer ring water-cooled plate structure 120, and the base 126 on which the heating device 106 is mounted is slid along the axial direction of the sliding guide member relative to the outer ring 121 from the initial position to the mounting position. The initial position is the initial connection position when the base 126 is connected to the outer ring 121 via the sliding guide member, and the mounting position is a predetermined mounting position reached after the base 126 and the outer ring 121 slide opposite each other via the sliding guide member, at which time the lower surface of the base 126 and the upper surface of the outer ring 121 come into contact with each other. Correspondingly, when the lamp holder structure is disassembled, the base 126 is slid along the axial direction of the sliding guide member relative to the outer ring 121 to completely separate the lower surface of the base 126 from the upper surface of the outer ring 121.

[0055] Optionally, the sliding guide member includes a T-shaped boss 127 and a corresponding T-shaped groove 128, and the T-shaped groove 128 is used to guide the T-shaped boss 127 by sliding therein. The vertical structure of the T-shaped structure ensures the sliding guide action, and the horizontal structure prevents it from falling off, so that the two are integrated and locked, and no vertical displacement occurs. The sliding guide member further ensures the adhesion of the two connections, and its structure is simple and easy to process. The T-shaped boss 127 and the T-shaped groove 128 are used as sliding guide members, so that the heating device 106 can be kept stable during the assembly and disassembly process, and there is no need to constantly apply external force to prevent the base 126 from falling off, which is easy to operate, and at the same time, the heating device 106 is more stable after assembly.

[0056] 4, 7 and 8a, in this embodiment, a plurality of sliding guide members are provided at equal intervals along the circumferential direction on the upper surface of the outer ring 121, each sliding guide member extends in the radial direction along the outer ring 121, and each sliding guide member is selectively attached to a corresponding base 126. Specifically, the T-shaped boss 127 is provided on a contact surface of the outer ring 121 that contacts the base 126, and a T-shaped groove 128 that matches the T-shaped boss 127 is provided on a contact surface of the base 126 that contacts the outer ring 121.

[0057] Furthermore, the T-shaped groove 128 is arranged symmetrically with respect to the central axis of the base 126, so as to ensure that both sides of the heating device 106 placed on the base 126 receive a uniform force. When a torque occurs at one end of the heating device 106 after assembly, causing the heating lamp 1062 to bend upward or sink, the T-shaped groove 128 and the corresponding T-shaped boss 127 can resist the torque, so that the base 126 and the heating device 106 placed thereon are more stable.

[0058] Optionally, the length of the T-shaped boss 127 is equal to or less than the length of the T-shaped groove 128, and the T-shaped groove 128 penetrates the entire underside of the base 126. When assembling or disassembling the base 126, the T-shaped boss 127 on the upper surface of the outer ring 121 slides in the T-shaped groove 128 that penetrates the underside of the base 126, thus realizing the assembly process of sliding from the initial position to the installation position, or the disassembly process from the installation position to the initial position.

[0059] In this embodiment, the T-shaped boss 127 is provided on the upper surface of the outer ring 121, and the installation and disassembly of the heating device 106 can be realized through the sliding insertion of the T-shaped boss 127 of the outer ring 121 and the T-shaped groove 128 of the base 126. In order to ensure the service life of the components, the wear resistance of the material of the outer ring 121 is greater than that of the material of the inner ring 122, and repeated sliding insertion will not cause significant wear or damage to the outer ring 121, which is helpful in extending the service life of the outer ring 121. As mentioned above, in this embodiment, the material of the outer ring 121 includes stainless steel, and the material of the inner ring 122 includes copper or pure copper. The outer ring 121 made of stainless steel material greatly enhances its wear resistance, and the guiding and positioning function and reliability of the T-shaped boss 127 will not be reduced by frequent replacement of the heating device 106, while ensuring the thermal conductivity of each component, and at the same time, taking into consideration the wear resistance of the outer ring 121.

[0060] It is understood that in other embodiments, the installation positions of the T-shaped groove 128 and the T-shaped boss 127 can be exchanged, but their functions and relative sliding relationship remain unchanged. Illustratively, the T-shaped boss 127 is provided on the contact surface of the base 126 that contacts the outer ring 121, and the T-shaped groove 128 that matches the T-shaped boss 127 is provided on the contact surface of the outer ring 121 that contacts the base 126. Optionally, the T-shaped boss 127 is symmetrically installed with respect to the central axis of the lower surface of the base 126, and the length of the T-shaped boss 127 is equal to or less than the length of the T-shaped groove 128. When assembling or disassembling the base 126, the T-shaped boss 127 of the base 126 is slid into the T-shaped groove 128 of the outer ring 121, and the installation or disassembly of the heating device 106 is realized.

[0061] Of course, the sliding guide member is not limited to the fitting of the T-shaped boss 127 and the T-shaped groove 128, and may adopt other sliding guide structures commonly seen in the prior art, such as a slide rail. The number of sliding guide members is not limited to one, but may be two, and the two sliding guide members are symmetrically installed with respect to the central axis of the base 126, or may be three, with one sliding guide member installed on the central axis and the other two equally spaced on both sides thereof. Of course, a greater number or arrangement may be used as required, and the present invention is not limited thereto.

[0062] In this embodiment, when assembling the heating device 106, first, the heating device 106 is mounted on the base 126 of the outer ring water-cooled plate structure 120, and the heating device 106 slides on the outer ring 121 together with the base 126 under the guiding action of the sliding guide member. When the heating device 106 slides to the mounting position, the relative positions of the base 126 and the outer ring 121 are fixed by the action of the positioning member, and the heating device 106 is further fixed.

[0063] Furthermore, the positioning member includes an elastic structure and a matching positioning groove 129 (shown in FIG. 8b), the elastic structure includes an extension, and when in an installation position, the extension of the elastic structure forms a locking relationship with the positioning groove 129. In actual use, when the extension of the elastic structure slides into the positioning groove 129, the extension presses the upper part of the positioning groove 129, causing the elastic structure to elastically deform, and the elastic structure contracts inwardly into a state of elastic compression, and due to the elastic force, the extension always contacts the upper part of the positioning groove 129, thereby achieving the positioning function. The positioning member has a simple structure and is easy to use and operate.

[0064] In this embodiment, the elastic structure is provided on the contact surface of the outer ring 121 that contacts the base 126, and the positioning groove 129 that matches the elastic structure is provided on the contact surface of the base 126 that contacts the outer ring 121. Specifically, the lower surface of each base 126 is provided with two positioning grooves 129 correspondingly, and at the position corresponding to the base 126, the outer ring 121 is provided with two elastic structures, which are symmetrically installed on both sides of the T-shaped boss 127 on the upper surface of the outer ring 121, and the pair of positioning grooves 129 are correspondingly installed on both sides of the T-shaped groove 128 on the lower surface of the base 126. When the base 126 slides to the mounting position relative to the outer ring 121, the extension of the elastic structure slides into the positioning groove 129 to achieve positioning.

[0065] When assembling the heating element 106 of this embodiment, the heating element 106 is first mounted on the base 126. When it is in the initial position, the T-shaped boss 127 on the upper surface of the outer ring 121 is placed in the T-shaped groove 128 of the base 126, at this time, the upper surface of a part of the outer ring 121 and the lower surface of a part of the base 126 are tightly connected, so that the extension of the elastic structure on the upper surface of the outer ring 121 is compressed under the action of the base 126. When the relative position between the outer ring 121 and the base 126 slides to the mounting position with the T-shaped boss 127 sliding in the T-shaped groove 128, the epitaxial growth of the elastic structure just faces the positioning groove 129 on the lower surface of the base 126, at this time, the extension of the elastic structure pops out and extends into the corresponding positioning groove 129, so that the relative position between the base 126 and the outer ring 121 is fixed at the mounting position. When the heating device 106 needs to be disassembled, the base 126 on which the heating device 106 is placed can be taken out first, and the extension of the elastic structure can be pulled out of the positioning groove 129 simply by applying an upward force to the base 126 .

[0066] By adopting the above-mentioned symmetrical elastic structure and the corresponding positioning groove 129 as the positioning member between the base 126 on which the heating device 106 is placed and the outer ring 121, not only is there no asymmetrical torque during the installation process, but the heating lamp 1062 of the heating device 106 installed on the base 126 is not bent upward and can be kept at a good horizontality, which is helpful for the substrate W and the reaction gas in the reaction chamber 100 to receive heat uniformly.

[0067] Although the number of elastic structures and positioning grooves 129 in this embodiment is two, other numbers of elastic structures and positioning grooves 129 can be used to achieve the same effect, as long as the elastic structures are symmetrical with respect to the T-shaped boss 127 on the upper surface of the outer ring 121, and the positioning grooves 129 are symmetrical with respect to the T-shaped groove 128 on the lower surface of the base 126. That is, the present invention does not limit the number of positioning members, and it is sufficient that the positioning members can realize that there is no asymmetric torque during the installation process and that the heating device 106 does not bend upward. Preferably, each positioning member is installed symmetrically with respect to the sliding guide member, that is, the positioning members are installed symmetrically with respect to the central axis of the base 126, which is helpful in maintaining the levelness of the heating device 106.

[0068] Of course, in other embodiments, the positions of the elastic structure and the positioning groove 129 can be exchanged without changing their functions, i.e., the elastic structure is provided on the contact surface of the base 126 that contacts the outer ring 121, and the positioning groove 129 corresponding to the elastic structure is provided on the contact surface of the outer ring 121 that contacts the base 126. The elastic structure is symmetrical with respect to the T-shaped boss 127 or the T-shaped groove 128 on the lower surface of the base 126, and the positioning groove 129 is symmetrical with respect to the T-shaped groove 128 or the T-shaped boss 127 on the upper surface of the outer ring 121.

[0069] Optionally, the extension of the elastic structure is a ball plunger, and the positioning groove 129 is a spherical hole structure (as shown in FIG. 8b). Of course, the structure of the extension is not limited to the above, and it can be other members that can achieve the same function, and the present invention is not limited thereto.

[0070] Example 3 Based on the structural characteristics of the epitaxial growth equipment in Example 2, this example makes modifications to the outer ring water-cooled plate structure, mainly changing the installation position of the temperature control assembly. In this example, the outer ring water-cooled plate structure includes an inner ring, an outer ring and a temperature control assembly, and the difference from Example 2 is that the temperature control assembly in this example is only installed on the outer ring.

[0071] In this embodiment, only the outer ring is provided with a temperature control assembly including a cooling passage, and at the same time, the base is detachably connected with the inner ring through a connection assembly.

[0072] Similar to embodiment 2, in this embodiment, the outer ring water-cooled plate structure further includes a pressure assembly, which is used to apply pressure to the outer ring toward the outer ring reflector device through the inner ring. In this embodiment, the pressure assembly is disposed between the inner ring and the outer ring, and the inner ring and the outer ring cooperate with each other to ensure the stability of the outer ring water-cooled plate structure.

[0073] Furthermore, the pressure assembly of this embodiment includes at least one protruding structure provided on the inner circumference of the outer ring, and a stepped recessed groove provided on the outer circumference of the inner ring, which mates with the protruding structure.

[0074] The thermal conductivity of the material of the inner ring is less than that of the material of the outer ring, and / or the wear resistance of the material of the inner ring is greater than that of the material of the outer ring. The material of the inner ring includes stainless steel, and the material of the outer ring includes copper and pure copper. Similar to the above embodiment, in this embodiment, the temperature control assembly is only provided on the outer ring, and since the temperature control assembly exists and the thermal conductivity of the material of the inner ring is smaller than that of the material of the outer ring, the heat is mainly absorbed by the outer ring, and the heat absorbed by the inner ring is small, so the thermal deformation is small; in addition, since the outer ring and the inner ring are not integrated but joined, a gap occurs between the inner circumference of the outer ring and the outer circumference of the inner ring, which reduces the efficiency of heat transfer from the outer ring to the inner ring, and therefore the temperature of the inner ring is not high; and since the inner ring uses stainless steel, its linear expansion coefficient is smaller than that of copper, so the inner ring is more stable, and therefore the base connected to the inner ring is more stable, ensuring the stability of the levelness and direction of the heating device. In addition, since the hardness of stainless steel is greater than that of copper, even if the copper outer ring is thermally deformed, the stainless steel inner ring can firmly fix the copper outer ring to the surface of the outer ring reflector device.

[0075] In this embodiment, the base is mounted on the inner ring, so that the sliding guide members and the positioning members of the connection assembly also act between the inner ring of the base.

[0076] In addition, other structures and the operating modes of each assembly in this embodiment are similar or the same as those in the first or second embodiment, and will not be described here in detail.

[0077] In summary, in the temperature control device and its epitaxial growth equipment according to the present invention, the outer ring water-cooled plate structure 120 is composed of at least two rings, so the width of each ring is reduced compared with that of an integrated water-cooled plate structure. Due to the reduced width, when the water-cooled plate structure is warped due to thermal deformation, the gap between each ring of the water-cooled plate structure and the reflector device is not large, which helps to ensure close contact with the reflector device and improves the efficiency of heat exchange between the temperature control device and the reflector device.

[0078] Furthermore, the inner ring 122 and the outer ring 121 are not integrated, the materials of the two rings are different, and the base 126 is placed only on one of the wear-resistant materials of the inner ring 122 or the outer ring 121, thereby ensuring the levelness and stability of the heating device 106 in high-temperature environments.

[0079] Although the contents of the present invention have been described in detail in the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation on the present invention. After those skilled in the art read the above contents, various modifications and alternatives of the present invention will become apparent. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. 1. A temperature control device for use in an epitaxial growth apparatus, comprising: a heating device; a reflector device; and a temperature control device provided in the reflector device for controlling a temperature of the reflector device, An outer ring; an inner ring disposed inside the outer ring; a temperature control assembly provided on the outer ring and / or the inner ring, the temperature control assembly including a cooling medium inlet, a cooling medium outlet, and a cooling passage passing through both.

2. 2. The temperature control device of claim 1, wherein the temperature control assembly is mounted only on the inner ring, and the temperature control device further includes a pressure assembly for applying pressure to the inner ring through the outer ring in the direction of the reflector device.

3. 3. The temperature control device of claim 2, wherein the pressure assembly is disposed between an inner ring and an outer ring.

4. The temperature control device according to claim 3 , wherein the pressure assembly includes at least one protruding structure provided on an outer periphery of the inner ring, and a stepped groove provided on an inner periphery of the outer ring, the stepped groove matching the protruding structure.

5. the thermal conductivity of the material of the outer ring is less than the thermal conductivity of the material of the inner ring; and / or the wear resistance of the material of the outer ring is greater than the wear resistance of the material of the inner ring.

6. 6. The temperature control device of claim 5, wherein the material of the outer ring comprises stainless steel and the material of the inner ring comprises copper.

7. 2. The temperature control device of claim 1, wherein the temperature control assembly is mounted only on the outer ring, and the temperature control device further includes a pressure assembly for applying pressure to the outer ring through the inner ring in the direction of the reflector device.

8. 8. The temperature control device of claim 7, wherein the pressure assembly is disposed between an inner ring and an outer ring.

9. The temperature control device of claim 8 , wherein the pressure assembly includes at least one protruding structure provided on an inner circumference of the outer ring, and a stepped groove provided on an outer circumference of the inner ring that matches the protruding structure.

10. the thermal conductivity of the material of the inner ring is less than the thermal conductivity of the material of the outer ring; and / or the wear resistance of the material of the inner ring is greater than the wear resistance of the material of the outer ring.

11. 11. The temperature control device of claim 10, wherein the material of the inner ring comprises stainless steel and the material of the outer ring comprises copper.

12. 10. The temperature control device according to claim 4 or 9, wherein the contour of the at least one protrusion structure is one or more of a continuous wave shape, a continuous polyline, and a continuous zigzag shape.

13. The temperature control device according to claim 2 or 7, further comprising a base for removably mounting a heating device, the base being removably connected to the outer ring or the inner ring via a connection assembly.

14. The temperature control device of claim 13, wherein the connection assembly includes a sliding guide member and a positioning member disposed between the base and the outer ring or the inner ring for guiding the base to slide in a sliding direction relative to the outer ring or the inner ring, and the positioning member is used to fix the base to the mounting position relative to the outer ring or the inner ring when the base slides to the mounting position.

15. The sliding guide member includes a T-shaped boss and a T-shaped groove corresponding thereto, the T-shaped groove being used for guiding the T-shaped boss by sliding therein; 15. The temperature control device of claim 14, wherein the T-shaped boss is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the T-shaped groove is provided on a contact surface of the outer ring or the inner ring that contacts the base, or the T-shaped groove is provided on a contact surface of the base that contacts the outer ring or the inner ring, and the T-shaped boss is provided on a contact surface of the outer ring or the inner ring that contacts the base.

16. the positioning member includes an elastic structure and a positioning groove corresponding thereto, the elastic structure includes an extension, and when in an installation position, the extension of the elastic structure forms a locking relationship with the positioning groove; The temperature control device according to claim 14, characterized in that the elastic structure is provided on a contact surface that contacts the outer ring or the inner ring of the base, and the positioning groove is provided on a contact surface that contacts the base of the outer ring or the inner ring, or the elastic structure is provided on a contact surface that contacts the base of the outer ring or the inner ring, and the positioning groove is provided on a contact surface that contacts the outer ring or the inner ring of the base.

17. 17. The temperature control device of claim 16, wherein the extension of the resilient structure is a ball plunger.

18. The number of the positioning members is at least two, and the positioning members are symmetrically disposed with respect to the sliding guide member; The temperature control device of claim 14, wherein the sliding guide extends radially along the outer ring or the inner ring.

19. The temperature control device includes:

2. The temperature control device according to claim 1, further comprising a fastening member provided on the outer ring and / or the inner ring for fixing the outer ring and the inner ring to the reflector device.

20. a reaction chamber for carrying out an epitaxial growth process, the reaction chamber including a tray therein for placing a substrate; A heating device disposed above and / or below the reaction chamber for providing thermal radiation in the epitaxial growth process; and a reflector device for reflecting the thermal radiation generated by the heating device to the reaction chamber. and a temperature control device according to any one of claims 1 to 19 for controlling the temperature of the reflector device.

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