Immersion cooling equipment and systems

Abstract

The embodiments of the present disclosure provide an immersion cooling apparatus and an immersion cooling system, the immersion cooling apparatus comprising: a cooling groove suitable for sealingly receiving a main cooling liquid so that an electronic device requiring cooling is immersed in the main cooling liquid; a main heat dissipation device including a lumen attached to the cooling groove and surrounded by a case; a main circulation member and a heat exchanger received in the lumen, the lumen sealingly communicating with the cooling groove, the main circulation member suitable for circulating the main cooling liquid between the cooling groove and an outside of the heat exchanger; and a cooling source interface coupled to the main heat dissipation device and configured to allow an auxiliary cooling liquid to circulate inside the cooling groove and the heat exchanger to exchange heat between the auxiliary cooling liquid and the main cooling liquid in the heat exchanger. The adoption of the modularized immersion cooling apparatus significantly simplifies the deployment of the immersion cooling system in a data center, makes the deployment of the immersion cooling system more flexible, and greatly improves the deployment efficiency.

Description

[Technical field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to Chinese application No. 202111580493.7, entitled "Immersion Cooling Equipment and Immersion Cooling System," filed on December 22, 2021, the entire disclosure of which is incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to the data center field, and more specifically to submersion cooling equipment and systems for providing cooling to data centers. [Background technology]

[0003] With the rapid development of the Internet, artificial intelligence, cloud computing and high-performance computing, data centers are not only driving major changes in enterprise operations, but also greatly improving the quality of life. At present, data centers have been formally incorporated into new infrastructure construction, and have expanded from serving a few enterprises to serving the whole society, becoming a new kind of infrastructure.

[0004] The new infrastructure places higher requirements on data center heat dissipation solutions and overall energy efficiency. On the one hand, with the advent of the big data era, data is growing at a speed beyond imagination. Large-scale data processing, storage and transmission require IT equipment to double its power consumption, and chip heat dissipation has become a huge challenge. Traditional data center cooling solutions have already found it difficult to meet the demand for efficient heat dissipation of electronic information equipment. At the same time, national, local and industrial energy policies are being launched one after another, which places higher requirements on data center energy conservation indicators. There is a strong demand for more energy-saving, intensive and efficient IT equipment and overall data center solutions, and the immersion cooling solution is being emphasized for its advantages in terms of energy efficiency and rapid delivery. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure provide an immersion cooling apparatus and system to at least partially address the above-mentioned problems and other potential problems existing in the prior art. [Means for solving the problem]

[0006] One aspect of the present disclosure provides an immersion cooling apparatus, comprising: a cooling channel suitable for sealingly receiving a primary cooling liquid such that an electronic device requiring cooling is immersed in the primary cooling liquid; a primary heat dissipation device including a lumen attached to the cooling channel and surrounded by a case, and a primary circulation member and a heat exchanger received in the lumen, the lumen sealingly communicating with the cooling channel, the primary circulation member suitable for circulating the primary cooling liquid between the cooling channel and an exterior of the heat exchanger; and a cooling source interface coupled to the main heat dissipation device and configured to allow an auxiliary cooling liquid to circulate between an external cooling source and the interior of the heat exchanger to exchange heat between the auxiliary cooling liquid and the primary cooling liquid in the heat exchanger.

[0007] By deploying the immersion cooling equipment according to the embodiment of the present disclosure, on the one hand, the main heat dissipation device itself has an internal circulation capability (main coolant circulation) and an external circulation interface (allowing auxiliary coolant circulation), so that the main heat dissipation device itself does not require an additional cooling amount allocation unit, and forms a modularized device. In this manner, the immersion cooling equipment according to the embodiment of the present disclosure can improve the cooling efficiency by providing main heat dissipation devices with various specifications for factors such as different electronic devices. On the other hand, a modularized immersion cooling equipment is further formed by adding a main heat dissipation device with an internal circulation capability and an external circulation interface and a cooling groove. When deploying the immersion cooling equipment according to the embodiment of the present disclosure, the deployment is completed by simply connecting the reserved interface of the data center and the cooling source interface of the immersion cooling equipment, thereby forming a distributed immersion cooling system. In this manner, the deployment of the immersion cooling equipment is greatly simplified. Note that the user can select different numbers of immersion cooling equipment according to the required scale. It is only necessary to reserve a certain amount of reserved interfaces, and the user can increase or decrease the required immersion cooling equipment at any time according to the adjustment of the business volume. This makes the deployment of immersion cooling equipment in data centers more flexible and significantly improves deployment efficiency.

[0008] In some embodiments, the main heat dissipation device is removably attached to the cooling groove. For example, in some embodiments, the main heat dissipation device may be indirectly attached to the cooling groove via a bracket. In this manner, different specifications of the main heat dissipation device can be selected for different electronic devices, which can improve the cooling efficiency and further promote the realization of carbon neutrality.

[0009] In some embodiments, the immersion cooling apparatus further comprises a bracket adapted to mount the cooling channel and the main heat dissipation device. Employing a bracket to mount the cooling channel and the main heat dissipation device makes the immersion cooling apparatus easier to deploy.

[0010] In some embodiments, a plurality of the electronic devices are disposed in the cooling groove along the extension direction, and the size of the immersion cooling device in the extension direction is 1.5 times or less than the height of the immersion cooling device. Compared with a conventional immersion cooling device in which the length of the cooling groove itself is 2 to 3 times its height, and thus higher, the size of the immersion cooling device according to the present disclosure in the extension direction including the main heat dissipation device is 1.5 times or less, for example, 1 time or less, of the height. This method realizes a compact immersion cooling device. The compactness brings many advantages, and is further advantageous for flexible adjustment according to the required cooling scale, for example. This improves the utilization rate of the immersion cooling system and the immersion cooling medium therein. On the other hand, the compactness allows for more precise control of the cooling liquid, thereby saving the cooling medium and improving precise cooling control of the electronic device at the same time.

[0011] In some embodiments, a size of the immersion cooling device in the extension direction is smaller than a size of a height of the immersion cooling device.

[0012] In some embodiments, the size of the immersion cooling device in the extension direction is smaller than half the size of the height of the immersion cooling device, which allows for further miniaturization of the immersion cooling device, thereby further saving cooling medium and improving precise cooling control of the electronic device.

[0013] In some embodiments, the submersion cooling apparatus further includes a plurality of access holes sealingly disposed between the cooling channel and the lumen of the main heat dissipation device for circulating the main cooling liquid between the cooling channel and an exterior of the heat exchanger. Providing a redundant arrangement of access holes improves the reliability of the submersion cooling apparatus.

[0014] In some embodiments, the cooling grooves have different specifications, the cooling grooves of the different specifications have different depths and / or different sizes in the extending direction, and the bracket is suitable for receiving the cooling grooves of at least one of the different specifications. In this manner, users can rationally select the cooling grooves of the required specifications according to the size of the electronic device that needs to be cooled, thereby further saving the main coolant and enabling precise control of the main coolant.

[0015] In some embodiments, the immersion cooling apparatus further includes an elevated rack coupled to the bracket and adapted to support at least one of the cooling channel and the main heat dissipation device. The elevated rack can improve the structural stability and reliability of the immersion cooling apparatus by elevating the cooling channel having a relatively low depth. This arrangement also improves the convenience of coupling between the cooling source interface and the reserve interface of the immersion cooling system.

[0016] In some embodiments, the main heat dissipation device has different specifications, the main heat dissipation devices of the different specifications have different heat circulation and dissipation capabilities, and the bracket is suitable for receiving the main heat dissipation device of at least one of the various specifications, in this manner, a user can improve the circulation and cooling efficiency of the main heat dissipation device by selecting a main heat dissipation device of a required specification according to the cooling grooves of different specifications and / or the number of electronic devices.

[0017] In some embodiments, the immersion cooling equipment further includes a lid coupled to the cooling channel to seal a top opening of the cooling channel, in this manner making it easier to maintain the primary coolant and electronics in the cooling channel, thereby improving maintenance efficiency.

[0018] In some embodiments, the lid is pivotally coupled to the cooling channel via a hinge, which further improves the convenience of immersion cooling equipment maintenance, thereby further improving maintenance efficiency.

[0019] In some embodiments, the primary heat dissipation device further includes a liquid occupying block disposed in the lumen, the liquid occupying block effectively reducing the usage of the primary cooling liquid, thereby reducing the cost of the immersion cooling equipment.

[0020] In some embodiments, the cooling-source interfaces include at least two sets of cooling-source interfaces, in which case the cooling-source interfaces also form a redundant arrangement, thereby further improving the reliability of the immersion cooling equipment.

[0021] In some embodiments, the cooling source interface is at least partially disposed in the case, making the immersion cooling device easier to deploy.

[0022] A second aspect of the present disclosure provides an immersion cooling system, comprising at least one immersion cooling apparatus according to the first aspect of the preamble, and an auxiliary cooling device coupled to a cooling source interface of the at least one immersion cooling apparatus and suitable for circulating an auxiliary cooling liquid between an external cooling source and an interior of the heat exchanger.

[0023] In some embodiments, the at least one immersion cooling device comprises a plurality of immersion cooling devices, and the immersion cooling system further comprises a plurality of reservation interfaces, the plurality of reservation interfaces adapted to be coupled to the cooling source interface.

[0024] In some embodiments, the immersion cooling system further includes a base including a plurality of receiving sections that are installed at predetermined positions to install the plurality of immersion cooling devices, the plurality of receiving sections corresponding to the plurality of reserved interfaces. When large-scale deployment is performed on servers, the installation of the base can further reduce the deployment time of the data center.

[0025] In some embodiments, the primary coolant comprises a fluorinated liquid or a mineral oil, and / or the auxiliary coolant comprises deionized water.

[0026] The third aspect of the present disclosure provides an immersion cooling system to be deployed in a large-scale cluster. The immersion cooling system includes a base including a plurality of receiving parts installed at predetermined positions, a plurality of reserved interfaces corresponding to the positions of the plurality of receiving parts, an auxiliary cooling device arranged between the plurality of reserved interfaces and an external cooling source, and a plurality of immersion cooling devices described in the first aspect of the preceding sentence arranged in the receiving parts, the cooling source interfaces of the immersion cooling devices being coupled to the plurality of reserved interfaces. When the immersion cooling devices are deployed in a large-scale cluster, the base and reserved interfaces are installed in a data center in advance, the immersion cooling devices are installed in a machine room of the data center in advance, and a commissioning operation is completed by connecting a return water pipe on the external cooling source side, without first installing electronic equipment and a main cooling liquid, so that the immersion cooling system to be deployed in a large-scale cluster can be formed. When there is a business demand, electronic equipment is purchased and installed in this system, and finally the immersion cooling equipment in which the electronic equipment is placed is filled with the main cooling liquid. This completes the deployment of the entire data center. This method can significantly reduce the deployment time of the data center.

[0027] It should be understood that this section is not intended to identify key or important features of the embodiments of the disclosure, nor is it intended to limit the scope of the disclosure. Other features of the disclosure will become more readily apparent from the following description. [Brief description of the drawings]

[0028] The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description of exemplary embodiments of the present disclosure in conjunction with the drawings, in which like reference numerals generally represent like elements. [Figure 1] 1 shows a schematic diagram of a cooling channel used in a conventional immersion cooling system. [Diagram 2] 1 shows a schematic perspective view of an immersion cooling device according to an embodiment of the present disclosure. [Diagram 3] 1 shows a schematic perspective view of an immersion cooling device according to an embodiment of the present disclosure viewed from a different angle. [Figure 4] 1 shows a perspective schematic view of an immersion cooling device according to an embodiment of the present disclosure viewed from another angle, where the lid is opened to easily view the electronics therein. [Diagram 5] 1 shows a schematic side view of an immersion cooling device according to an embodiment of the present disclosure. [Figure 6] 1 shows a schematic diagram of various types of electronic devices arranged in an immersion cooling device according to an embodiment of the present disclosure. [Figure 7] 1 shows a schematic diagram of various types of electronic devices arranged in an immersion cooling device according to an embodiment of the present disclosure. [Figure 8] 1 shows a schematic diagram of various types of electronic devices arranged in an immersion cooling device according to an embodiment of the present disclosure. [Figure 9] 1 illustrates a schematic diagram of a main heat dissipation device of an immersion cooling apparatus according to an embodiment of the present disclosure being pulled out from a bracket. [Figure 10] 1 shows a schematic diagram of a main cooling fluid circulating inside an immersion cooling device according to an embodiment of the present disclosure. [Figure 11] 1 shows a schematic side view of a main heat dissipation device according to an embodiment of the present disclosure. [Figure 12] 1 shows a schematic diagram of a deployment of an immersion cooling system according to an embodiment of the present disclosure. [Figure 13] FIG. 1 shows a schematic diagram of an array of immersion cooling devices in an immersion cooling system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] The principles of the present disclosure will now be described with reference to various exemplary embodiments shown in the drawings. It should be understood that the description of these embodiments is only used to enable those skilled in the art to better understand and further realize the present disclosure, and is not intended to limit the scope of the present disclosure in any manner. It should be noted that similar or identical symbols may be used in the drawings where possible. Also, similar or identical symbols may represent similar or identical functions. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods described herein may be adopted without departing from the principles of the present disclosure described herein.

[0030] With the rapid development of the information and communication industry, the integration density and heat density of electronic devices are becoming higher and higher. In the face of the ever-increasing power consumption of chips and the ever-increasing integration density of electronic devices, the traditional technology of using air as a medium to dissipate heat from electronic products is increasingly unable to meet the demand. The industry has begun to seek more intensive heat dissipation solutions, and immersion cooling has come into people's sights.

[0031] Immersion cooling, also known as liquid immersion cooling, is a method of controlling the temperature of an electronic device 200 such as a server within a reasonable range by immersing the electronic device in a non-conductive liquid to dissipate heat. The following mainly describes the concept of the present disclosure by taking as an example that the electronic device is various types of servers employed in data centers. It should be understood that the liquid immersion cooling device 100 or liquid immersion cooling system according to the embodiments of the present disclosure is similarly applicable to any other suitable cases where electronic devices need to be cooled. FIG. 1 shows a cooling channel 500 that is generally used in a conventional immersion cooling scheme. In a data center, an electronic device adopting immersion cooling is immersed in a cooling liquid in the cooling channel 500, and the cooling liquid exchanges heat with an auxiliary cooling liquid such as air or water in a heat exchanger, thereby achieving efficient cooling.

[0032] In the early days of immersion cooling, in order to meet the demands of data centers of a relatively large scale, a cooling groove 500 having a relatively large capacity is generally adopted to accommodate a relatively large number of electronic devices in one cooling groove 500. A plurality of electronic devices such as servers are arranged in the cooling groove 500 along the extension direction. The size (i.e., length) of the conventional cooling groove 500 in the extension direction can generally reach 50U or more, and the physical length is about 2-3 meters or even longer. U is a unit that represents the external size of an electronic device, and is an abbreviation of unit. With the rapid development of the information and communication industry, the cooling groove 500 with a relatively large capacity also faces many problems. For example, due to the relatively large capacity, the flexibility of deployment is low, thereby increasing the complexity and cost in terms of operation and maintenance. In addition, due to the relatively long length of the cooling groove, when performing maintenance of electronic devices immersed therein, the user can generally only operate and maintain these electronic devices in the width direction of the cooling groove 500, which brings some inconvenience to the maintenance of the electronic devices.

[0033] In addition, the cooling fluid of the current cooling channel 500 is generally relatively expensive. Since the cooling channel 500 has a relatively large capacity, more cooling fluid is required. This will inevitably lead to increased costs, especially in some cases where not many electronic devices are required in the cooling channel 500. For example, if the cooling channel 500 has a capacity of 50 electronic devices, some small businesses may only need 10 electronic devices. When using such a cooling channel 500, the installation of 10 electronic devices and the installation of 50 electronic devices will both require the same cooling channel, and therefore more cooling fluid, which will significantly increase costs.

[0034] In addition, the stability of the current immersion cooling system is relatively poor, and there is a high risk of problems such as clogging at the interface of the cooling liquid, which increases the risk of the electronic device immersed in the cooling groove 500 becoming inoperable, and also causes a relatively large loss.

[0035] As mentioned above, the submersion cooling system can cool various models and different sizes of electronic devices. However, the current cooling channels 500 generally have a uniform and relatively large depth to accommodate the largest size of electronic devices. In such a case, when a relatively small size of electronic device is submerged therein, most of the space therein will be empty, which will also lead to waste of space and cooling liquid therein.

[0036] In addition, the conventional cooling channel 500 cannot currently realize the heat exchange between the cooling liquid and the auxiliary cooling liquid such as water in the heat exchanger by itself. Currently, the conventional cooling channel 500 also needs to be equipped with a specialized cold distribution unit (CDU) to realize the heat exchange. However, the deployment of the cold distribution unit, the deployment of the cooling channel 500, and the deployment of the electronic equipment installed therein all require a certain correlation and ratio relationship, which makes the design of the conventional immersion cooling system complicated, thereby leading to problems such as slow design and construction, reduced efficiency, etc. In addition, due to the correlation and ratio relationship between the cold distribution unit, the cooling channel, and the electronic equipment, the immersion cooling system has difficulty in adjusting the number of electronic equipment according to the adjustment of the business volume after the deployment is completed, which leads to various problems such as poor flexibility.

[0037]

[0023] Embodiments of the present disclosure provide an immersion cooling apparatus 100 and an immersion cooling system 300 to at least address or at least partially address the above-mentioned or other potential problems in conventional immersion cooling apparatuses and systems. Figures 2, 3 and 4 show perspective schematic views of an immersion cooling apparatus 100 according to an embodiment of the present disclosure viewed from different angles. Figure 5 shows a side schematic view of the immersion cooling apparatus 100, where in Figure 4 the lid 106 of the immersion cooling apparatus 100 has been opened to facilitate viewing of the electronics therein.

[0038] As shown in FIGS. 2 to 5, the immersion cooling device 100 according to the embodiment of the present disclosure generally includes a cooling channel 102, a main heat dissipation device 103, and a cooling source interface 104. The cooling channel 102 is used to hermetically receive the cooling liquid and the electronic device 200 that needs to be cooled so that the electronic device 200 is immersed in the cooling liquid. One or more electronic devices 200 may be installed in the cooling channel 102. The multiple electronic devices 200 may be arranged in the cooling channel 102 along the extending direction E. The electronic devices 200 in the cooling channel 102 may be various types of servers. For example, as shown in FIGS. 6 to 8, the electronic devices 200 may include, but are not limited to, a storage type server, a computing type server, and a computing / storage integrated server.

[0039] 6 to 8 show top views of the cooling groove 102. Here, various types of electronic devices 200 accommodated in the cooling groove 102 are shown, respectively. As can be seen from FIGS. 6 to 8, in order to maximize the deployment density, the electronic devices 200 in the cooling groove 102 may be inserted into the cooling groove 102 substantially vertically along the extension direction E. The cooling groove 102 may be provided with a structure or module for inserting the electronic devices 200 to facilitate the arrangement of the electronic devices 200. In this manner, on the one hand, the electronic devices 200 can be arranged in the cooling groove 102 with a greater density. On the other hand, an operator can more easily perform maintenance of the electronic devices 200.

[0040] The cooling liquid stored in the cooling groove 102 is a non-conductive liquid. The non-conductive liquid may include, but is not limited to, a fluorinated liquid or a mineral oil. Hereinafter, the cooling liquid in the cooling groove 102 is referred to as a main cooling liquid to distinguish it from other cooling liquids.

[0041] To facilitate maintenance of the electronic device 200 and the primary cooling fluid therein, the cooling channel 102 has a top opening. In some embodiments, the entire top area of ​​the cooling channel 102 may be a top open area to facilitate maintenance of the electronic device 200 and the primary cooling fluid. To provide a seal, the immersion cooling device 100 further includes a lid 106 disposed at the top opening of the cooling channel 102. The lid 106 is sealingly coupled to the cooling channel 102 to provide a seal for the cooling fluid. In some embodiments, the lid 106 may be pivotally disposed on the cooling channel 102 in a manner such as a hinge. When maintenance needs to be performed on the electronic device 200 or the primary cooling fluid, the lid 106 may be opened by manipulating the lid 106 to pivot about the hinge. To provide a seal, a seal ring may be disposed at the location where the lid 106 and the cooling channel 102 join.

[0042] It should be understood that the embodiment in which the lid 106 is coupled to the cooling channel 102 in a manner such as a hinge is merely schematic and is not intended to limit the scope of protection of the present disclosure. Any other suitable manner or arrangement is possible. For example, in some alternative embodiments, the lid 106 may be placed directly on the cooling channel 102 or may be removed from the cooling channel 102 altogether.

[0043] To facilitate the placement of the main heat dissipation device 103 and the cooling channel 102, in some embodiments, the immersion cooling apparatus 100 according to the embodiments of the present disclosure may further include a bracket 101. The bracket 101 may be a load-bearing structure for carrying the cooling channel 102 and the main heat dissipation device 103. Although FIGS. 2 to 5 show that the bracket 101 has a generally frame-type structure, it should be understood that such a scheme shown in FIGS. 2 to 5 is merely schematic and is not intended to limit the scope of protection of the present disclosure. Any other suitable structure or arrangement is also possible. For example, in some alternative embodiments, the bracket 101 may be a fully-closed or semi-closed case 1031 structure constructed of plate-like members.

[0044] In some embodiments, the cooling channel 102 may be fixedly mounted to a first portion of the bracket 101. The main heat dissipation device 103 may be fixedly mounted to a second portion adjacent to the first portion. The cooling channel 102 may be fixedly mounted to the first portion in a manner such as, for example, welding, fastener connection, and interference fit. The main heat dissipation device 103 may be disposed in the second portion of the bracket 101 in a removable manner to facilitate maintenance and replacement of the main heat dissipation device 103.

[0045] In some embodiments, to save space and facilitate deployment, a first portion of the bracket 101 for carrying the cooling grooves 102 and a second portion of the bracket 101 for carrying the main heat dissipation device 103 may have different heights. For example, as shown in FIG. 4, the height of the portion of the bracket 101 for carrying the cooling grooves 102 may be greater than the height of the portion of the bracket 101 for carrying the main heat dissipation device 103. Of course, it should be understood that this is merely a schematic and is not intended to limit the scope of protection of the present disclosure. In some alternative embodiments, each portion of the bracket 101 may have a uniform height. The use of the bracket 101 promotes modularity of the immersion cooling apparatus 100, thereby making it easier to deploy the immersion cooling apparatus 100.

[0046] In order to facilitate removal of the main heat dissipation device 103, in some embodiments, the main heat dissipation device 103 may include a handle 1035 installed at a predetermined position. For example, FIG. 9 shows that the handle 1035 is installed on the ceiling wall of the main heat dissipation device 103. In addition, in order to facilitate locking the main heat dissipation device 103 on the bracket 101, in some embodiments, a locking device may be installed on the bracket 101. A locking structure, such as a groove, a hole, or a buckle that fits with the locking device, may be installed at a corresponding position of the main heat dissipation device 103. After the main heat dissipation device 103 is placed at a predetermined position on the bracket 101, the locking device can be automatically or manually engaged with the locking structure to realize the locking of the main heat dissipation device 103 on the bracket 101. When replacement or maintenance of the main heat dissipation device 103 is required, the main heat dissipation device 103 can be removed from the bracket 101 and replaced with a new main heat dissipation device 103 simply by operating the locking device to release the lock and then further operating the handle 1035.

[0047] It should be understood that the above embodiment in which the main heat dissipation device 103 is indirectly attached to the cooling groove 102 by using the bracket 101 is merely schematic and is not intended to limit the scope of protection of the present disclosure. The main heat dissipation device 103 and the cooling groove 102 may adopt any other suitable attachment manner. For example, in some alternative embodiments, the main heat dissipation device 103 may be directly attached to the cooling groove 102 in a removable manner, such as by card buckle, fastener and locking groove. The following mainly describes the concept according to the present disclosure in the manner in which the main heat dissipation device 103 and the cooling groove 102 are coupled to the bracket 101 and deployed. It should be understood that other coupling manners between the main heat dissipation device 103 and the cooling groove 102 are similar, and therefore the detailed description of each will be omitted in the following description.

[0048] The main heat dissipation device 103 is a sealed structure. It includes an inner cavity sealed by the case 1031, and a main circulation member 1032 and a heat exchanger 1033 received in the inner cavity. In this manner, the main heat dissipation device 103 forms a modularized device. The main heat dissipation device 103 is installed adjacent to the cooling groove 102 when placed on the bracket 101. The inner cavity of the main heat dissipation device 103 is sealingly connected to the cooling groove 102. The main circulation member 1032 is used to circulate the main coolant through the cooling groove 102 and the inner cavity, more specifically, to the outside of the cooling groove 102 and the heat exchanger 1033.

[0049] The heat exchanger 1033, also called a heat exchanger, is a device that transfers heat from one medium to another. In the present disclosure, the heat exchanger 1033 is a device for transferring heat of the electronic device 200 from the main cooling liquid to an auxiliary cooling liquid such as deionized water. Heat is conducted through the structure and material of the heat exchanger 1033. The structure of the heat exchanger 1033 separates the main cooling liquid from the auxiliary cooling liquid. For example, the main cooling liquid flows outside the heat exchanger 1033, and the auxiliary cooling liquid flows inside the heat exchanger. In this specification, the liquid outside the heat exchanger 1033 is referred to as the main cooling liquid, and the liquid inside the heat exchanger 1033 is referred to as the auxiliary cooling liquid, but it should be understood that this is only for distinguishing the cooling liquids, and is not intended to represent a difference in cooling effect. The heat exchange between the main cooling liquid and the auxiliary cooling liquid in the heat exchanger 1033 in the present disclosure realizes effective cooling of the electronic device 200. In some cases, the main coolant is also referred to as a primary coolant, an auxiliary coolant, or a secondary coolant.

[0050] In this manner, the above-mentioned arrangement manner of the main circulation member 1032 and the heat exchanger 1033 in the main heat dissipation device 103 forms a modularized device. Main heat dissipation devices 103 with various specifications may be installed according to different circulation heat dissipation capabilities. Users can further improve the cooling efficiency by selecting the main heat dissipation device 103 with the appropriate specifications according to different electronic devices 200 to be cooled and different cooling channels 102, which will be described further below.

[0051] In some embodiments, to improve the cooling efficiency, the heat exchanger 1033 may have a microstructure, such as a labyrinth type, to ensure a large contact area between the cooling medium and the heat exchanger 1033, and thus the heat of the electronic device 200 can be dissipated more efficiently.

[0052] 10 illustrates a side cross-sectional view of an immersion cooling device 100 according to an embodiment of the present disclosure. As illustrated in FIG. 10, in some embodiments, the immersion cooling device 100 further includes a plurality of access through-holes. The access through-holes are disposed between the cooling channel 102 and the inner cavity of the main heat dissipation device 103. For example, in some embodiments, the access through-holes may be disposed in a plate or wall disposed between the cooling channel 102 and the inner cavity of the main heat dissipation device 103. The access through-holes provide communication of the main cooling liquid between the cooling channel 102 and the inner cavity of the main heat dissipation device 103.

[0053] In some embodiments, the inlet / outlet through-hole may include a plurality of inlets arranged at the top and a plurality of outlets arranged at the bottom. Here, "in" and "out" refer to the flow direction of the main coolant relative to the inner cavity of the main heat dissipation device 103. The main circulation member 1032 causes the main coolant to enter the cooling groove 102 from the outlet at the bottom. By driving the main circulation member 1032, the main coolant entering the cooling groove 102 flows from bottom to top, and finally enters the inner cavity of the main heat dissipation device 103 again from the inlet at the top. The main coolant passes through the outside of the heat exchanger 103 in the main heat dissipation device 103 in the inner cavity of the main heat dissipation device 103, loses heat, and is cooled, and then enters the cooling groove 102 again from the outlet at the bottom. This reciprocating circulation realizes cooling of the electronic device 200 in the cooling groove 102.

[0054] On the one hand, such a bottom-up circulation manner of the main coolant in the cooling groove 102 is more advantageous for removing heat from the electronic device 200. On the other hand, in the inner cavity of the main heat dissipation device 103, the main coolant passes through the heat exchanger 1033 from top to bottom under the action of gravity and the driving force of the main circulation member 1032, which is more advantageous for heat exchange between the main coolant and the auxiliary coolant inside the heat exchanger 1033, and further improves the heat exchange efficiency. In some embodiments, the main circulation member 1032 may include one or more circulation pumps.

[0055] As can be seen from the above description, the heat exchanger 1033 employed in this specification employs liquid-liquid heat exchange, which is more efficient than the conventional gas-liquid heat exchange, thereby improving the cooling efficiency of the entire immersion cooling apparatus 100.

[0056] In some embodiments, a plurality of inlet / outlet through-holes may be provided for communicating between the cooling groove 102 and the inner cavity of the main heat dissipation device 103. This provides a redundant design of the inlet / outlet through-holes, and even if one of the through-holes is clogged or otherwise broken, it will not affect the effective flow and circulation of the main coolant between the cooling groove 102 and the inner cavity of the main heat dissipation device 103, thereby ensuring the cooling effect.

[0057] It should be further explained that the immersion cooling device 100 according to the embodiment of the present disclosure employs a miniaturized device. Specifically, in some embodiments, the size of the immersion cooling device 100 in the extension direction E may be 1.5 times or less than its height H, or the size of the immersion cooling device 100 may be up to 30U. For example, the size of the immersion cooling device 100 in the extension direction E may be smaller than its height H. In some alternative embodiments, the size of the immersion cooling device 100 in the extension direction E may be smaller than half the size of its height H. Considering the size of many electronic devices 200, the height H of the immersion cooling device 100 is generally about 1 meter. That is, in some embodiments, the size of the immersion cooling device 100 in the extension direction E may be 1.5 meters or less, for example, smaller than 1 meter or 0.5 meters. As a result, the immersion cooling device 100 has a miniaturized size. As mentioned above, in the conventional immersion cooling equipment 100, the length (i.e., the size in the extension direction E) of a single cooling groove 102 is about 2 to 3 meters, which is a size that does not include the necessary immersion cooling allocation units, etc. As mentioned above, the large capacity of the cooling groove 102 also brings about various problems.

[0058] In contrast, for the immersion cooling equipment 100 according to the present disclosure, the size of the entire immersion cooling equipment 100 (including the cooling groove 102 and the main heat dissipation device 103) in the extension direction E is 1.5 meters or less, for example 1 meter or less. The immersion cooling equipment 100 according to the embodiment of the present disclosure adopts a small size, on the one hand, an operator can operate and maintain the electronic device 200 therein in each direction of the immersion cooling equipment 100, which makes the maintenance easier and thus avoids erroneous operation. This improves the reliability and efficiency of the maintenance.

[0059] On the other hand, because the miniaturized immersion cooling apparatus 100 employs miniaturized cooling channels 102, the number of electronic devices 200 placed in each cooling channel 102 is not large. This can reduce the operating costs of the electronic devices 200 for some enterprises that only require a relatively small number of electronic devices 200, but does not affect the application of the immersion cooling apparatus 100 according to the embodiment of the present disclosure to a large data center. Specifically, although the number of electronic devices 200 placed in the cooling channels 102 according to the embodiment of the present disclosure is not large, due to the advantages of the modular structure and ease of deployment mentioned above, multiple immersion cooling modules can be quickly and conveniently deployed to meet the needs of a large data center in a more convenient manner.

[0060] Furthermore, an advantage of adopting the compact immersion cooling equipment 100 is that because the number of electronic devices 200 placed in the cooling groove 102 is not large, if a malfunction occurs in one of the immersion cooling equipment 100, the impact and loss caused by the malfunction is significantly reduced compared to a conventional large cooling groove 102, thereby further reducing malfunction costs and maintenance costs.

[0061] Furthermore, the combination of the miniaturized cooling channel 102 and the main heat dissipation device 103 allows for more accurate control of the level of the main coolant in the cooling channel 102. In the conventional solution with a large cooling channel 102, the control accuracy of the coolant level can be up to a centimeter level. In the immersion cooling device 100 according to the embodiment of the present disclosure, the control accuracy of the main coolant level can be down to a millimeter level. The improved control accuracy of the main coolant level is also beneficial for further optimization of the heat dissipation and cost of the electronic device 200.

[0062] In some embodiments, the cooling grooves 102 may have different specifications to accommodate different types of electronic devices 200 with different sizes. The depths of the cooling grooves 102 with different specifications may be different. For some electronic devices 200 with relatively small sizes, cooling grooves 102 with relatively small depth specifications may be adopted. For some electronic devices 200 with relatively large sizes, cooling grooves 102 with relatively large depth specifications may be adopted. Such an arrangement can further reduce the waste of the main coolant, and thus improve the utilization rate of the main coolant.

[0063] To facilitate deployment of cooling channels 102 of different depths, in some embodiments, the immersion cooling equipment 100 may further include an elevated rack 105 for use with cooling channels 102 having smaller specifications. The elevated rack 105 can be used to compensate for the height deficiency of the immersion cooling equipment 100 for cooling channels 102 having smaller specifications, thereby matching the immersion cooling equipment 100 for cooling channels 102 having higher specifications. For example, the cooling source interfaces 104 may be kept at the same level to facilitate easier large-scale deployment of the immersion cooling equipment 100.

[0064] In some embodiments, alternatively or additionally, the sizes of the cooling grooves 102 with different specifications in the extension direction E may be different. In this manner, the cooling grooves 102 with different specifications may be used to accommodate different numbers or types of electronic devices 200. This can avoid waste of the main coolant and further reduce costs by selecting the cooling grooves 102 with appropriate specifications according to the type and number of electronic devices that need to be cooled.

[0065] Similar to the cooling channel 102, in some embodiments, due to the modular design of the main heat dissipation device 103, the main heat dissipation device 103 may have various different specifications to facilitate application to cooling channels 102 and / or electronic devices 200 with different specifications. The main heat dissipation devices 103 with different specifications may have different heat dissipation capacities by cooling liquid circulation and can be sized to cooling channels 102 with different specifications. First, the circulation capacities of the main heat dissipation devices 103 with different specifications may be different. The circulation capacity represents the amount of cooling liquid that can be processed per unit time. The higher the circulation capacity, the higher the amount of cooling liquid processed per unit time, and the lower the circulation capacity, the lower the amount of cooling liquid processed per unit time. For example, for some cooling channels 102 with a relatively small depth specification, it can be mated with a main heat dissipation device 103 with a relatively small circulation capacity because the main cooling liquid used therein is relatively small. Similarly, for some cooling channels 102 with a relatively large depth specification, it can be mated with a main heat dissipation device 103 having a relatively large circulation capacity because the main coolant used therein is relatively large. Such an arrangement is advantageous by providing more precise control over the heat dissipation of the electronic device 200 in a more cost-effective manner.

[0066] Then, alternatively or additionally, the heat dissipation capacity of the main heat dissipation device 103 with different specifications may be different. The heat dissipation capacity may be embodied by the difference in the volume and / or microstructure of the heat exchanger. For example, the larger the volume of the heat exchanger and / or the more optimized the microstructure in the heat exchanger, the better the heat dissipation capacity, and the smaller the volume of the heat exchanger and / or the larger the microstructure in the heat exchanger, the worse the heat dissipation capacity. In this manner, the main heat dissipation device 103 with the appropriate heat dissipation capacity can be selected according to factors such as the number of electronic devices 200 to be cooled. This can provide more precise control over the heat dissipation of the electronic devices 200 in a more cost-effective manner.

[0067] In addition, as mentioned above, since the main heat dissipation device 103 is removably disposed on the bracket 101, as shown in FIG. 9, when it is broken or the circulation capacity of the main heat dissipation device 103 used is insufficient, the original main heat dissipation device 103 can be removed from the bracket 101 and a new main heat dissipation device 103 can be assembled in a predetermined position on the bracket 101. Then, the inlet and outlet through holes between the inner cavity of the main heat dissipation device 103 and the cooling groove 102 are sealed with a sealing ring to prevent leakage of the main coolant. After assembly, the main circulation member 1032 with suitable circulation capacity can be used to circulate the main coolant between the inner cavity of the main heat dissipation device 103 and the cooling groove 102. In this manner, on the one hand, the modular and removable installation of the main heat dissipation device 103 makes the maintenance of the main heat dissipation device 103 or the entire immersion cooling equipment 100 easier. On the other hand, the main heat dissipation device 103 can be flexibly adjusted according to the cooling groove 102 and the situation of the electronic device 200, so that the cooling effect can be ensured with a relatively high cooling efficiency.

[0068] In some embodiments, considering the space occupied by the main circulation member 1032 and the heat exchanger 1033 in the main heat dissipation device 103, as shown in FIG. 11 , the main heat dissipation device 103 may further be provided with a liquid occupying block 1034 to further reduce the usage of the main cooling liquid. The liquid occupying block 1034 is a suitable object for occupying the free space in the inner cavity of the main heat dissipation device 103. In some embodiments, the liquid occupying block 1034 is also provided above the heat exchanger 1033. By using the liquid occupying block 1034, the usage of the main cooling liquid can be further reduced, thus further reducing the cost.

[0069] The liquid occupying block 1034 can occupy a volume in the lumen of the main heat dissipation device 103 to reduce the usage of the main coolant, while it does not impede the circulation of the main coolant by allowing the main coolant to flow through or near it. The liquid occupying block 1034 may adopt a variety of different structures or formats. For example, in some embodiments, the liquid occupying block 1034 may include a plurality of independent small blocks. The plurality of independent small blocks may be arranged in a manner such as stacked or parallel arrangement in the vacant space of the lumen of the main heat dissipation device 103, with gaps between them to facilitate the flow of the main coolant and avoid the obstruction of the flow of the main coolant by the liquid occupying block 1034. Alternatively or additionally, in some embodiments, the liquid occupying block 1034 may adopt a porous structure to facilitate the flow of the main coolant.

[0070] Of course, it should be understood that the above described embodiments of the main heat dissipation device 103 in conjunction with Figures 9-11 are merely schematic and are not intended to limit the scope of protection of the present disclosure. The main heat dissipation device 103 may have any other suitable structure or configuration. For example, in some embodiments, the liquid occupying block 1034 may be located below the heat exchanger 1033 or in any other suitable location.

[0071] In some embodiments, a control device may be provided in the main heat dissipation device 103 so as to be able to monitor at least the state (e.g., liquid level, temperature, etc.) of the main coolant in the immersion cooling apparatus 100 and / or control the main circulation member 1033. In some embodiments, the control device may further include a display unit. The display unit may have a touch unit to facilitate control of the main circulation member 1033. Of course, in some alternative embodiments, the control device may further include buttons or the like to facilitate control of the main circulation member 1033.

[0072] By employing the control device, parameters such as the power of the main circulation member 1033 can be controlled according to information such as the heat generation and number of electronic devices 200 to be cooled in the cooling channel 102, thereby improving the cooling efficiency and reducing the cooling cost at the same time. For example, when the number of electronic devices 200 placed in the cooling channel 102 is reduced, the device can be controlled to reduce the power of the main circulation member 1033, thereby further reducing the operating cost. Of course, in some alternative embodiments, the control device can display other information and / or control other members. For example, in some embodiments, the display unit of the control device can display the type and number of electronic devices 200 to be cooled in the immersion cooling device 100, etc.

[0073] To facilitate deployment, the immersion cooling apparatus 100 includes a cooling source interface 104 coupled to the main heat dissipation device 103. For example, in some embodiments, the cooling source interface 104 may be at least partially disposed on a case 1031 of the main heat dissipation device 103. The cooling source interface 104 is adapted to communicate the auxiliary cooling liquid with the external cooling source 302 inside the heat exchanger 1033, thereby allowing the auxiliary cooling liquid in the external cooling source 302 to exchange heat with the main cooling liquid in the heat exchanger 1033. In some embodiments, the auxiliary cooling liquid may include deionized water. By employing deionized water, the corrosion and influence on the internal structure of the heat exchanger 1033 and the metal of the cooling pipes can be effectively avoided, thereby improving the reliability of the immersion cooling system.

[0074] In some embodiments, the cooling source interface 104 may be configured to have at least two sets. This provides a redundant design of the cooling source interface 104. The auxiliary cooling liquid processing capacity of each set of the cooling source interface 104 can fully meet the circulation requirements of the auxiliary cooling liquid. In this case, even if one set of the cooling source interface 104 has a problem such as clogging, it will not affect the circulation of the auxiliary cooling liquid at all, thereby ensuring the cooling effect.

[0075] A modularized immersion cooling equipment is formed by integrating the main heat dissipation device 103 with internal and external circulation capabilities and the cooling channel 102. When deploying the immersion cooling equipment 100 according to the embodiment of the present disclosure, the deployment can be completed by simply coupling the reserved port of the data center with the cooling source interface 104 of the immersion cooling equipment, thereby forming a distributed immersion cooling system 300. This method greatly simplifies the deployment of the immersion cooling equipment.

[0076] Fig. 12 shows a schematic diagram of a system architecture of an immersion cooling system 300 employing an immersion cooling apparatus 100 according to an embodiment of the present disclosure. Fig. 13 shows a schematic diagram of an immersion cooling system 300 in which multiple immersion cooling apparatuses 100 are arranged in an array according to an embodiment of the present disclosure.

[0077] Generally, an immersion cooling system 300 according to an embodiment of the present disclosure includes at least one immersion cooling apparatus 100 as described above and an auxiliary cooling device 301. Although there are multiple immersion cooling apparatuses 100 in the immersion cooling system 300 shown in Figures 12 and 13, it should be understood that this is merely schematic and is not intended to limit the scope of protection of the present disclosure. According to the needs of different data centers, the number of immersion cooling apparatuses 100 may be one or more.

[0078] As mentioned above, in some embodiments, the immersion cooling system 300 may include multiple reserve interfaces to facilitate deployment of the immersion cooling apparatus 100. The reserve interfaces may be used to communicate with the external cooling source 302 via the auxiliary cooling device and to be coupled to the multiple cooling source interfaces 104 of the immersion cooling apparatus 100 according to embodiments of the present disclosure. In this manner, the heat exchanger 1033 in the immersion cooling apparatus 100 may be in communication with the external cooling source 302 via the auxiliary cooling device 301. The external cooling source 302 may be a cooling tower in some embodiments.

[0079] This method can effectively reduce the investment and overall operating costs of the data center, and control the center's overall power consumption efficiency index to 1.1 or even lower. For example, when designing an immersion cooling system for a data center, considering the relatively large future scale of the data center, a certain number of reserved interfaces and immersion cooling devices 100 can be set when designing the immersion cooling system 300 to meet the demand for a large number of servers in the future data center. Regarding the number of electronic devices 200, considering that the number of servers required by the data center at first is relatively small, a relatively small number of electronic devices 200 may be adopted and placed in some of the immersion cooling devices 100. For the immersion cooling devices 100 where no electronic devices 200 are placed, the main coolant may not be temporarily installed and circulated. With the continuous development of business, when the scale of the data center needs to be expanded in the later stage, it is only necessary to increase the required servers and install them in the immersion cooling equipment 100 where the main cooling liquid is installed, and there is no need to redesign and remanufacture the entire immersion cooling system, thereby effectively reducing the initial investment and overall operating costs of the data center, and making the adjustment of the center easier and more flexible.

[0080] Of course, in some alternative embodiments, only the number of immersion cooling apparatuses 100 corresponding to the number of servers may be deployed, and the servers may be effectively cooled by coupling the cooling source interfaces 104 of the immersion cooling apparatuses 100 with some of the reserved interfaces. If it is necessary to increase the number of servers due to an increase in business volume, it is only necessary to increase the number of servers, increase the number of immersion cooling apparatuses 100 accordingly according to the increased number of servers, and finally couple the cooling source interfaces 104 of the immersion cooling apparatuses 100 with the remaining reserved interfaces until the deployment of the entire immersion cooling system is completed.

[0081] It should be noted that, when deploying the immersion cooling apparatus 100 of the embodiment of the present disclosure, no additional cold quantity allocation unit is required, and a cooling source can be simply connected to the immersion cooling apparatus 100 via the cooling source interface 104. This greatly simplifies the design and deployment difficulties of the immersion cooling system 300, thus effectively improving efficiency and reducing costs.

[0082] In some embodiments, to further simplify deployment, the immersion cooling system 300 may further include a base 303. A groove or receiving portion for mounting the immersion cooling apparatus 100 and a corresponding retention interface may be provided at a predetermined position on the base 303. In this manner, when the immersion cooling apparatus 100 needs to be deployed, the immersion cooling apparatus 100 only needs to be mounted in the receiving portion of the base 303 and its cooling source interface 104 connected to the corresponding retention interface. This further simplifies deployment of the immersion cooling system 300.

[0083] For example, when a large-scale cluster deployment of electronic devices 200 is performed, the base 303 can be installed in the data center in advance to complete the external cooling source 302, the auxiliary cooling device 301, and the reserved interface debugging. In the initial stage of the data center construction, only a relatively small number of electronic devices 200 can be used to meet the demand of a relatively small amount of business in the initial stage. With the continuous development of business, the deployment of the entire system can be completed by purchasing electronic devices 200 and deploying them in the immersion cooling system 300. The adoption of the base 303 can further shorten the deployment time of the data center and improve the deployment efficiency.

[0084] It should be understood that the above detailed embodiments of the present disclosure are only used to exemplify or explain the principles of the present disclosure, and are not intended to limit the present disclosure. Therefore, any modifications, equivalent replacements, improvements, etc. made in the spirit and principles of the present disclosure should be included within the protection scope of the present disclosure. At the same time, the claims attached to the present disclosure are intended to include all changes and modifications within the scope and boundaries of the claims, or within the equivalent scope and boundaries.

Claims

1. a cooling channel (102) adapted to sealingly receive a primary cooling liquid such that an electronic device (200) requiring cooling is immersed in said primary cooling liquid; a main heat dissipation device (103) including an inner cavity attached to the cooling groove (102) and surrounded by a case (1031), a main circulation member (1032) received in the inner cavity, and a heat exchanger (1033), wherein the inner cavity is in sealing communication with the cooling groove (102), and the main circulation member (1032) is suitable for circulating the main cooling liquid between the cooling groove (102) and the outside of the heat exchanger (1033); a cooling source interface (104) coupled to the main heat dissipation device (103) and configured to allow an auxiliary cooling liquid to circulate between an external cooling source (302) and the heat exchanger (1033) to exchange heat between the auxiliary cooling liquid and the main cooling liquid in the heat exchanger (1033); The liquid immersion cooling device comprises:

2. A main heat dissipation device (103) is removably attached to the cooling groove (102). The immersion cooling device of claim 1 .

3. and a bracket (101) suitable for carrying said cooling groove (102) and said main heat dissipation device (103). The liquid immersion cooling device according to claim 1 or 2.

4. One or more of the electronic devices (200) are arranged in the cooling groove (102) along an extension direction (E); and The size of the immersion cooling equipment (100) in the extension direction (E) is 1.5 times or less than the height (H) of the immersion cooling equipment. The liquid immersion cooling device according to claim 1 or 2.

5. The size of the immersion cooling equipment (100) in the extension direction (E) is smaller than the size of the height (H) of the immersion cooling equipment. The immersion cooling device according to claim 4.

6. The size of the immersion cooling equipment (100) in the extension direction (E) is smaller than half the height (H) of the immersion cooling equipment. The immersion cooling device according to claim 4.

7. a plurality of inlet and outlet through-holes disposed between the cooling groove (102) and the inner cavity of the main heat dissipation device (103) for circulating the main cooling liquid between the cooling groove (102) and the outside of the heat exchanger (1033); The liquid immersion cooling device according to any one of claims 1, 2, 5 and 6.

8. the cooling grooves (102) have different specifications, the cooling grooves (102) of different specifications having different depths and / or different sizes in the extension direction (E); and The bracket (101) is adapted to receive a cooling groove (102) of at least one of the various specifications. The immersion cooling device according to claim 7.

9. and an overhead rack (105) coupled to the bracket (101) and adapted to support at least one of the cooling channel (102) and the main heat dissipation device (103). The immersion cooling apparatus of claim 8.

10. The main heat dissipation device (103) has various specifications, and the main heat dissipation devices (103) of various specifications have different circulating heat dissipation capabilities; and The bracket (101) is suitable for receiving the main heat dissipation device (103) of at least one of the various specifications. The liquid immersion cooling device according to any one of claims 1 to 9.

11. a lid (106) coupled to the cooling channel (102) to seal a top opening of the cooling channel (102); The liquid immersion cooling device according to any one of claims 1 to 9.

12. The lid (106) is pivotally coupled to the cooling channel (102) via a hinge. The immersion cooling apparatus of claim 11.

13. the primary heat dissipation device (103) further comprises a liquid occupying block (1034) disposed in the internal cavity; The liquid immersion cooling equipment according to any one of claims 1 to 12.

14. The cooling source interface (104) includes at least two sets of cooling source interfaces (104). The liquid immersion cooling equipment according to any one of claims 1 to 12.

15. The cooling source interface (104) is at least partially disposed in the case (1031). The liquid immersion cooling equipment according to any one of claims 1 to 12.

16. At least one immersion cooling apparatus (100) according to any one of claims 1 to 15; an auxiliary cooling device (301) coupled to the cooling source interface (104) of the at least one immersion cooling device (100), and adapted to circulate an auxiliary cooling liquid between an external cooling source (302) and the interior of the heat exchanger (1033); The liquid immersion cooling system includes:

17. the at least one immersion cooling device (100) comprises a plurality of immersion cooling devices; and The immersion cooling system further comprises a plurality of reserve interfaces, the plurality of reserve interfaces being adapted to be coupled to the cooling source interface (104).

17. The immersion cooling system of claim 16.

18. a base (303) including a plurality of receiving portions that are set at predetermined positions for setting the plurality of immersion cooling devices (100), the plurality of receiving portions corresponding to the plurality of holding interfaces; 20. The immersion cooling system of claim 17.

19. the primary coolant comprises a fluorinated liquid or a mineral oil; and / or The auxiliary cooling fluid comprises deionized water. The immersion cooling system according to any one of claims 16 to 18.

20. 1. A liquid immersion cooling system for deployment in a large cluster, comprising: A base (303) including a plurality of receiving portions that are installed at predetermined positions; a plurality of reservation interfaces corresponding to the locations of the plurality of receptacles; an auxiliary cooling device (301) disposed between the plurality of retention interfaces and an external cooling source (302); a plurality of immersion cooling devices (100) according to any one of claims 1 to 15, disposed in the receiving portion, the cooling source interfaces (104) of the immersion cooling devices (100) being coupled to the plurality of reserve interfaces; The liquid immersion cooling system includes:

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