Liquid cooling and heat dissipation structure for chips and manufacturing method thereof, and electronic device

Abstract

The present application discloses a liquid cooling and heat dissipation structure for a chip, a manufacturing method thereof, and an electronic device. The liquid cooling and heat dissipation structure for a chip includes a bare chip (100) and a cover plate (200). The bare chip (100) is provided with a chip body (120). A plurality of micro-channels (121) are etched on the surface of the chip body (120). The cover plate (200) is used to cover the micro-channels (121). The cover plate (200) is detachably connected to the bare chip (100). The cover plate (200) is provided with a water inlet (210) and a water outlet (220). The micro-channels (121) are respectively connected to the water inlet (210) and the water outlet (220).

Description

[Technical Field]

[0001] This application is based on and claims priority from a Chinese patent application bearing application number 202210736620.6 and filed on June 27, 2022, the entire contents of which are incorporated herein by reference.

[0002] The embodiments of the present application relate to the technical field of semiconductors, and more particularly to a liquid-cooled heat dissipation structure for a chip, a method for manufacturing the same, and electronic equipment. [Background technology]

[0003] As chip development follows Moore's Law, power density gradually increases, and in some industries, for example, gallium nitride power devices have already reached 1000W / cm 2 The conventional air cooling and normal liquid cooling can no longer meet the heat dissipation requirements of the chip.

[0004] Currently, conventional heat dissipation methods, such as air cooling and conventional liquid cooling, use a combination of a standard-sized radiator and a chip to dissipate heat, and as the heat density increases, the proportion of interface thermal resistance increases, the convection heat exchange capacity reaches its limit, and there is a problem of insufficient heat dissipation capacity. In related technology, the field of gallium nitride devices uses an integrated design of the chip and the radiator, but this integrated design has low reliability and is difficult to maintain, and if the heat dissipation path becomes clogged or other reliability issues occur, the entire chip will become unusable. Summary of the Invention [Problem to be solved by the invention]

[0005] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0006] The embodiments of the present application provide a liquid-cooled heat dissipation structure for a chip, a method for manufacturing the same, and an electronic device. [Means for solving the problem]

[0007] In a first aspect, an embodiment of the present application provides a liquid-cooled heat dissipation structure for a chip, which includes a bare chip having a chip body with a plurality of microchannels etched on its surface, and a cover plate used to cover the microchannels, removably connected to the bare chip, having a water inlet and an outlet, and the microchannels communicating with the water inlet and the outlet, respectively.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device including the liquid-cooled heat dissipation structure for a chip according to the first aspect.

[0009] In a third aspect, an embodiment of the present application provides a method for fabricating a liquid-cooled heat dissipation structure for a chip, the method for fabricating a liquid-cooled heat dissipation structure for a chip including the steps of etching a plurality of microchannels on the surface of a chip body within a bare chip, and covering the microchannels by attaching a cover plate to the bare chip, the cover plate being detachably connected to the bare chip, the cover plate having a water inlet and a water outlet, and the microchannels respectively communicating with the water inlet and the water outlet.

[0010] Other features and advantages of the present application will be set forth in the specification which follows, and in part will be obvious from the specification, or may be learned by the practice of the present application. The objectives and other advantages of the present application may be realized and obtained by the structure particularly pointed out in the written description, claims and drawings.

[0011] The drawings are intended to provide a further understanding of the technical solutions of the present application, constitute a part of the specification, and are used to interpret the technical solutions of the present application together with the examples of the present application, but are not intended to limit the technical solutions of the present application. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a schematic diagram of the structure of a bare chip. [Figure 2] 1 is a schematic diagram of a liquid-cooled heat dissipation structure for a chip according to an embodiment of the present application; [Figure 3] 1 is a structural schematic diagram of a bare chip according to an embodiment of the present application; [Figure 4] FIG. 2 is a front structural view of a cover plate according to an embodiment of the present application. [Figure 5] FIG. 2 is a rear structural view of a cover plate according to an embodiment of the present application. [Figure 6] 1 is a cross-sectional view of a bare chip according to an embodiment of the present invention; [Figure 7] FIG. 10 is a structural diagram of another cover plate according to an embodiment of the present application. [Figure 8] 1 is a structural schematic diagram of a chip body according to an embodiment of the present application. [Figure 9] 1 is a flowchart of a method for fabricating a chip liquid cooling heat sink according to an embodiment of the present application. [Figure 10] 1 is a sub-flowchart of a method for fabricating a chip liquid cooling heat sink according to an embodiment of the present application; [Figure 11] 1 is another sub-flowchart of a method for fabricating a chip liquid cooling heat sink according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0013] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in more detail below in combination with drawings and examples. The specific examples described herein are only for the purpose of interpreting the present application, and are not intended to limit the present application.

[0014] In describing the embodiments of the present application, plural (or pluralities) means two or more, and terms such as "greater than," "less than," "exceed," etc. are understood to be exclusive of reference values, while terms such as "greater than," "less than," "within," etc. are understood to be inclusive. Terms such as "first," "second," etc. are merely used to distinguish technical features and should not be understood to indicate or imply relative importance, or to imply the number of the indicated technical features, or to imply the context of the indicated technical features.

[0015] Currently, conventional heat dissipation methods, such as air cooling and conventional liquid cooling, use a combination of a standard-sized radiator and a chip to dissipate heat, and as the heat density increases, the proportion of interface thermal resistance increases, the convection heat exchange capacity reaches its limit, and there is a problem of insufficient heat dissipation capacity. In related technology, the field of gallium nitride devices uses an integrated design of the chip and the radiator, but this integrated design has low reliability and is difficult to maintain, and if the heat dissipation path becomes clogged or other reliability issues occur, the entire chip will become unusable.

[0016] In response to the above-mentioned problems, the present application provides a liquid-cooled heat dissipation structure for a chip, a manufacturing method thereof, and an electronic device, the liquid-cooled heat dissipation structure for a chip including a bare chip and a cover plate, the bare chip having a chip body and a plurality of microchannels etched on the surface of the chip body, the cover plate being used to cover the microchannels and detachably connected to the bare chip, the cover plate being provided with a water inlet and an outlet, the microchannels respectively communicating with the water inlet and the outlet. Based on this, the present application fabricates the microchannels on the surface of the chip body, and the separate design of the cover plate and the bare chip ensures ultra-high heat dissipation capacity and enables removable maintenance of the chip microchannels, improving product reliability and reusability, reducing costs, and ultimately enhancing product competitiveness.

[0017] 1, a bare chip 100 is surrounded by a chip protection ring 110, which protects a central chip body 120. The bottom layer of the chip body 120 is a wiring area and a heat source, and the top layer of the chip body 120 is single-crystal silicon. Conventional system-level heat dissipation uses a radiator to dissipate heat from the bare chip. The bottom of the radiator is a long boss, and the center is connected via an interface material such as thermally conductive silicone grease, thereby achieving heat dissipation capabilities.

[0018] 2 to 8 , the liquid cooling heat dissipation structure for a chip of the present application includes a bare chip 100 and a cover plate 200. The bare chip 100 is provided with a chip body 120, and a plurality of microchannels 121 are etched on the surface of the chip body 120. The cover plate 200 is used to cover the microchannels 121, and is detachably connected to the bare chip 100. The cover plate 200 is provided with a water inlet 210 and a water outlet 220, and the microchannels 121 are connected to the water inlet 210 and the water outlet 220, respectively. Heat dissipated from a heat source at the bottom of the chip body 120 is conducted from bottom to top to the plurality of microchannels 121 on the top surface of the chip body 120, and the cooling liquid flowing in from the water inlet 210 of the cover plate 200 flows through the plurality of microchannels 121 and out from the water outlet 220, thereby removing heat and fulfilling the role of efficient heat dissipation. The cover plate 200 and the bare chip 100 are designed to be detachably connected, so that if the microchannel 121 becomes clogged, the cover plate 200 can be easily removed to clean the microchannel 121, thereby realizing detachable maintenance. The microchannel is a heat dissipation passage with a width of 10 μm to 100 μm.

[0019] In one exemplary embodiment, taking a single plate installed in an instrument as an example, the specific maintenance process is as follows: When it is detected that the pressure in the microchannel 121 of the chip body 120 in the single plate is abnormal, i.e., the microchannel 121 is clogged, the single plate is pulled out, the screws 250 are loosened, the cover plate 200 and the rubber pad 300 are removed, the microchannel 121 is cleaned and dried, a new rubber pad 300 is prepared and installed, the cover plate 200 is covered, the screws 250 are tightened, and the single plate is reinserted into the instrument.

[0020] 7, a guide structure may be further provided on one side of the cover plate 200 facing the microchannels 121, the guide structure including a liquid supply manifold 230 and a liquid drainage manifold 240, the liquid supply manifold 230 being connected to the water inlet 210, and the liquid drainage manifold 240 being connected to the water outlet 220. The liquid supply manifold 230 and the liquid drainage manifold 240 can enhance heat exchange and reduce flow resistance, and the cover plate 200 can be replaced with a different structural form according to usage requirements, for example, the number of liquid supply and drainage manifolds can be changed, or other guide forms can be used.

[0021] In one exemplary embodiment, as shown in FIG. 3, the bare chip 100 further includes a chip protection ring 110, and the chip body 120 is located inside the chip protection ring 110, which provides protection for the chip body 120.

[0022] 6, a rubber pad 300 is provided between the cover plate 200 and the chip protection ring 110. The rubber pad 300 is attached to the surface of the chip protection ring 110, and the top of the rubber pad 300 presses the cover plate 200, and the cover plate 200 and the bare chip 100 can be combined together by a spring screw 250.

[0023] In one exemplary embodiment, as shown in FIG. 3, the distance between the microchannel 121 and the chip protection ring 110 is less than 1 mm, thereby minimizing the gap between the microchannel 121 and the chip protection ring 110 in the chip body 120, compressing the coolant flow in the microchannel 121 as much as possible, and avoiding ineffective flow of the coolant, thereby further improving the heat dissipation effect.

[0024] In one exemplary embodiment, as shown in FIGS. 2 to 6, the cover plate 200 and the bare chip 100 can be connected via screws 250, and the cover plate 200 and the bare chip 100 are combined together via the screws 250.

[0025] 8, microchannels 121 can be etched into the single crystal silicon on the top surface of the chip body 120, and the width of the microchannels 121 is 10 μm to 100 μm. Note that the arrangement of the multiple microchannels 121 is not limited.

[0026] Based on this, the present application creates micro-channels 121 on the surface of the chip body 120, and through the separate design of the cover plate 200 and the bare chip 100, ensures ultra-high heat dissipation capacity and enables removable maintenance of the chip's micro-channels 121, thereby improving the reliability and reusability of the product, reducing costs, and ultimately enhancing the competitiveness of the product.

[0027] In addition to directly etching the microchannels on the surface of the chip body, a bottom plate may be provided on top of the bare chip and the microchannels may be etched on the bottom plate, or the bottom plate may be integrally combined with the bare chip by bonding, welding, or other methods. Compared to the previously described embodiment in which the microchannels are directly etched on the surface of the chip body, this embodiment has less impact on the chip design and is more feasible, but heat dissipation capacity may be reduced due to interfacial thermal resistance. Regarding the material of the bottom plate, a silicon plate with excellent heat dissipation capacity is preferred, but a bottom plate containing a metal material may also be selected, and this embodiment is not limited thereto.

[0028] An embodiment of the present application further provides an electronic device, which includes the above-mentioned liquid-cooled heat dissipation structure for a chip.

[0029] In one embodiment, an electronic device uses the above-mentioned liquid-cooled heat dissipation structure for a chip, so that the electronic device can achieve the same technical effect as the above-mentioned liquid-cooled heat dissipation structure for a chip. The liquid-cooled heat dissipation structure for a chip in the electronic device includes a bare chip 100 and a cover plate 200, the bare chip 100 is provided with a chip body 120, and a plurality of micro-channels 121 are etched on the surface of the chip body 120, the cover plate 200 is used to cover the micro-channels 121, the cover plate 200 is detachably connected to the bare chip 100, and the cover plate 200 is provided with a water inlet 210 and a water outlet 220, and the micro-channels 121 are respectively connected to the water inlet 210 and the water outlet 220. Based on this, the present application creates micro-channels 121 on the surface of the chip body 120, and through the separate design of the cover plate 200 and the bare chip 100, ensures ultra-high heat dissipation capacity and enables removable maintenance of the chip's micro-channels 121, thereby improving the reliability and reusability of the product, reducing costs, and ultimately enhancing the competitiveness of the product.

[0030] As shown in FIG. 9, the embodiment of the present application further provides a method for fabricating a liquid-cooled heat dissipation structure for a chip, which includes, but is not limited to, the following steps S901 to S902.

[0031] Step S901: Etch a plurality of micro-channels on the surface of the chip body in the bare chip.

[0032] Step S902: Cover the microchannels by attaching a cover plate to the bare chip, the cover plate is removably connected to the bare chip, the cover plate has a water inlet and a water outlet, and the microchannels are respectively connected to the water inlet and the water outlet.

[0033] The bare chip includes a chip body, and during fabrication, multiple microchannels are etched on the surface of the chip body, for example, by reactive ions. A cover plate is attached to the bare chip to cover the microchannels. The cover plate is removably connected to the bare chip, and is provided with a water inlet and an outlet, with the microchannels communicating with the water inlet and outlet, respectively. Heat dissipated from a heat source at the bottom of the chip body is conducted upward to the multiple microchannels on the top surface of the chip body. Coolant flows through the water inlet of the cover plate, through the multiple microchannels, and out through the outlet, thereby removing heat and providing efficient heat dissipation. The cover plate and bare chip are removably connected, allowing the cover plate to be easily removed and the microchannels to be cleaned if they become clogged, thereby enabling removable maintenance.

[0034] In one exemplary embodiment, the width of the microchannel is 10 μm to 100 μm, and the arrangement of the multiple microchannels is not limited.

[0035] As shown in FIG. 10, the upper part of the chip body is made of single crystal silicon, and step S901 may include, but is not limited to, the following steps S1001 to S1003.

[0036] Step S1001: A photoresist is spin-coated on the surface of single-crystal silicon and dried.

[0037] Step S1002: Cover the single crystal silicon with a mask and expose it to ultraviolet light to form a microchannel photo-etching pattern.

[0038] Step S1003: Etch the microchannel photo-etching pattern with reactive ions to obtain the microchannel.

[0039] In one exemplary embodiment, a photoresist is spin-coated on the surface of the single crystal silicon and dried, the single crystal silicon is covered with a mask and exposed to ultraviolet light to form a microchannel photo-etching pattern, and the microchannel photo-etching pattern is etched with reactive ions, thereby etching the microchannels.

[0040] As shown in FIG. 11, the bare chip further includes a chip protection ring, the chip body is located inside the chip protection ring, and step S902 may include, but is not limited to, the following steps S1101 to S1103.

[0041] Step S1101: A rubber pad is attached to the surface of the tip protection ring.

[0042] Step S1102: Press the cover plate onto the rubber pad.

[0043] Step S1103: The cover plate and bare chip are attached together with screws via rubber pads, and the cover plate is brought into close contact with the chip body.

[0044] In one exemplary embodiment, a rubber pad can be attached to the surface of the chip protection ring, the top of the rubber pad can press the cover plate, and the cover plate and the bare chip can be combined together by a spring screw.

[0045] In one exemplary embodiment, a guide structure may be further provided on one side of the cover plate facing the microchannels, the guide structure including a supply manifold and a drain manifold, the supply manifold being connected to the water inlet and the drain manifold being connected to the water outlet. The supply manifold and the drain manifold can enhance heat exchange and reduce flow resistance, and cover plates with different structural configurations can be replaced according to usage requirements, for example, the number of supply and drain manifolds can be changed, or other guide configurations can be used.

[0046] In one exemplary embodiment, the distance between the microchannel and the chip protection ring is less than 1 mm, thereby minimizing the gap between the microchannel and the chip protection ring in the chip body, compressing the coolant flow into the microchannel as much as possible, and avoiding ineffective flow of the coolant, thereby further improving the heat dissipation effect.

[0047] In one exemplary embodiment, taking a single plate installed in an instrument as an example, the specific maintenance process is as follows: when it is detected that the pressure of the microchannel of the chip body in the single plate is abnormal, that is, the microchannel is clogged, pull out the single plate, loosen the screws, remove the cover plate and rubber pad, clean and dry the microchannel, prepare and install a new rubber pad, cover the cover plate, tighten the screws, and reinsert the single plate into the instrument.

[0048] Based on this, the present application creates microchannels on the surface of the chip body, and through a separate design of the cover plate and bare chip, ensures ultra-high heat dissipation capacity and enables removable maintenance of the chip's microchannels, thereby improving product reliability and reusability, reducing costs, and ultimately enhancing the competitiveness of the product.

[0049] The embodiments of the present application include a liquid-cooled heat dissipation structure for a chip and a method for fabricating the same, and an electronic device. The liquid-cooled heat dissipation structure for a chip includes a bare chip and a cover plate, the bare chip is provided with a chip body, and a plurality of microchannels are etched on the surface of the chip body, the cover plate is used to cover the microchannels, and the cover plate is detachably connected to the bare chip, and the cover plate is provided with water inlets and outlets, and the microchannels are respectively connected to the water inlets and outlets. Based on this, the present application fabricates the microchannels on the surface of the chip body, and by using a separate design for the cover plate and the bare chip, it ensures ultra-high heat dissipation capacity and enables removable maintenance of the chip microchannels, thereby improving product reliability and reusability, reducing costs, and ultimately enhancing product competitiveness.

[0050] Although some implementations of the present application have been specifically described above, the present application is not limited to the above embodiments, and those skilled in the art may make various equivalent modifications or substitutions under common conditions that do not violate the essence of the present application, and all of these equivalent modifications or substitutions are included in the scope limited by the claims of the present application.

Claims

1. a bare chip having a chip body with a plurality of microchannels etched on a surface thereof; a cover plate used to cover the microchannel, removably connected to the bare chip, having a water inlet and an outlet, and the microchannel communicating with the water inlet and the water outlet, respectively.

2. 2. The liquid cooling and heat dissipation structure for a chip as described in claim 1, wherein a guide structure is provided on one side of the cover plate facing the microchannel, the guide structure including a liquid supply manifold and a liquid discharge manifold, the liquid supply manifold being connected to the water inlet and the liquid discharge manifold being connected to the water outlet.

3. 2. The liquid cooling and heat dissipating structure for a chip according to claim 1, wherein the bare chip further comprises a chip protection ring, and the chip body is located inside the chip protection ring.

4. 4. The liquid cooling and heat dissipating structure for a chip according to claim 3, further comprising a rubber pad provided between said cover plate and said chip protection ring.

5. 5. The liquid cooling and heat dissipation structure for a chip as claimed in claim 4, wherein the distance between the microchannel and the chip protection ring is less than 1 mm.

6. 2. The liquid cooling and heat dissipating structure for a chip according to claim 1, wherein the cover plate and the bare chip are connected by means of screws.

7. 7. The liquid cooling and heat dissipation structure for a chip according to claim 1, wherein the width of the microchannel is 10 μm to 100 μm.

8. 8. An electronic device comprising the liquid cooling and heat dissipation structure for a chip according to claim 1.

9. A method for manufacturing a liquid cooling and heat dissipation structure for a chip, comprising the steps of: Etching a plurality of microchannels into a surface of a chip body in a bare chip; and covering the microchannel by attaching a cover plate to the bare chip, the cover plate being removably connected to the bare chip, the cover plate having a water inlet and an outlet, and the microchannel communicating with the water inlet and the water outlet, respectively.

10. the upper portion of the chip body is single crystal silicon; The step of etching a plurality of microchannels into a surface of a chip body in a bare chip includes: spin-coating a photoresist on the surface of the single crystal silicon and drying it; Covering the single crystal silicon with a mask and exposing it to ultraviolet light to form a microchannel photoetching pattern; 10. The method of claim 9, further comprising the step of: etching the microchannel photoetch pattern with reactive ions to obtain the microchannel.

11. The bare chip further includes a chip protection ring, the chip body is located inside the chip protection ring, The step of attaching a cover plate to the bare chip includes: A step of attaching a rubber pad to a surface of the tip protection ring; pressing the cover plate onto a rubber pad; 10. The method according to claim 9, further comprising the step of attaching the cover plate and the bare chip together via the rubber pad with a screw to bring the cover plate into close contact with the chip body.

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