Pad Carrier Assembly for Horizontal Pre-Wash Module

Abstract

A pad carrier assembly including a bonding base and a pad carrier coupled to the bonding base, the bonding base and the pad carrier configured to support a buffing pad by a mechanical clamping mechanism.

Description

[Technical field]

[0001]

[0001] The embodiments described herein relate generally to equipment used in the manufacture of electronic devices, and more specifically to horizontal pre-clean (HPC) modules that may be used to clean the surface of a substrate in a semiconductor device manufacturing process. [Background technology]

[0002] In the manufacture of high density integrated circuits, chemical mechanical polishing (CMP) is commonly used to planarize or polish a material layer deposited on a substrate. In the horizontal pre-clean (HPC) module used in the CMP process, a rotating buffing pad is pressed against the material layer on the substrate surface, and material is removed throughout the material layer through a combination of chemical and mechanical activity provided by the polishing fluid and the relative motion of the buffing pad and the substrate. Compared to conventional buffing pads made of materials such as poromeric materials, filled or unfilled polymeric materials, buffing pads made of polyvinyl alcohol (PVA) materials provide high shear forces for chemical and mechanical polishing due to their mechanical strength and wear resistance. PVA materials are absorbent, soft, and elastic, plus they are inherently thicker and larger than conventional materials. Furthermore, larger buffing pads improve performance in chemical mechanical cleaning and reduce buffing time. However, due to their inherent thickness and large size, buffing pads made of PVA materials may sag when supported by a pad carrier.

[0003] Therefore, what is needed is a system and method for supporting large, thick, water-absorbent buffing pads while preventing the buffing pad from sagging. Summary of the Invention

[0004]

[0004] An embodiment of the present disclosure also provides a pad carrier assembly for use in a horizontal pre-clean module, the pad carrier assembly including a mating base and a pad carrier coupled to the mating base, the mating base and the pad carrier configured to support a buffing pad by a mechanical clamping mechanism.

[0005]

[0005] An embodiment of the present disclosure further provides a method of supporting a buffing pad in a horizontal pre-clean module, the method including mechanically clamping the buffing pad at a periphery of the buffing pad with a lip portion of a mating base and a tapered portion of a pad carrier, the mating base and the pad carrier being mated and positioned within the horizontal pre-clean module to support the buffing pad and prevent sagging of the buffing pad through the use of one or more pad retention features.

[0006]

[0006] An embodiment of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm and a support plate including a support body. The pad carrier assembly comprises a clamp plate including a clamp body including one or more ferromagnetic or paramagnetic material-containing elements disposed within the clamp body and a first retention surface disposed on a first side of the clamp body. The support body of the support plate includes a second retention surface disposed on the first side of the support body and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when a lip of the buffing pad is positioned between the first retention surface and the second retention surface. The pad carrier may further include a bonding base including a bonding body including one or more ferromagnetic or paramagnetic material-containing elements disposed within the body, each of the one or more ferromagnetic or paramagnetic material-containing elements in the bonding body of the bonding base configured to face each of the one or more ferromagnetic or paramagnetic material-containing elements in the support body of the support plate when the bonding base is positioned on a second side of the support body of the support plate, the second side of the support body of the support plate being opposite the first side. The one or more ferromagnetic or paramagnetic material-containing elements of the bonding base or clamping plate may include ferromagnetic or paramagnetic material-containing elements formed in a toroidal shape.

[0007]

[0007] An embodiment of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly comprises a coupling base including a coupling body and a support plate including a support body. The coupling body of the coupling base includes an array of magnets and a first retention surface disposed on a first side of the coupling body. The support body of the support plate includes an array of magnets disposed therein, a second retention surface disposed on the first side of the support body, and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when a lip of the buffing pad is positioned between the first retention surface and the second retention surface.

[0008]

[0008] An embodiment of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly comprises a clamp plate including a clamp body and a support plate including a support body. The clamp body of the clamp plate includes one or more magnets disposed within the clamp body and a first retention surface disposed on a first side of the clamp body. The support body of the support plate includes a second retention surface disposed on the first side of the support body and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when a lip of the buffing pad is positioned between the first retention surface and the second retention surface.

[0009]

[0009] An embodiment of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly comprises a support plate including a coupling base including a first retention surface disposed on a first side of the coupling body and a support body including a second retention surface disposed on a first side of the support body. The support plate has a plurality of support plate retention features, each support plate retention feature configured to receive a pad retention feature formed on a buffing pad when a lip of the buffing pad is positioned between the first retention surface and the second retention surface.

[0010]

[0010] In order that the above-mentioned features of the present disclosure may be understood in detail, the present disclosure summarized above will now be more particularly described with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings are merely representative embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0011] [Figure 1A] 1 is a schematic plan view of an exemplary chemical mechanical polishing (CMP) processing system using a horizontal pre-clean (HPC) module described herein in accordance with one or more embodiments. [Figure 1B] FIG. 1B is a top isometric view of an exemplary CMP processing system that may correspond to the schematic diagram shown in FIG. 1A in accordance with one or more embodiments. [Figure 1C] 1B is a top elevation view of the CMP processing system of FIG. 1B, which may correspond to the schematic diagram shown in FIG. 1A, according to one or more embodiments. [Diagram 2] FIG. 1A is a top isometric view of one side of an exemplary HPC module according to one or more embodiments, and FIG. 1B is a side cross-sectional view of an exemplary pad carrier positioning arm according to one or more embodiments. [Figure 3A-B]1A-1D are side cross-sectional views of a bonding base and a pad carrier according to one or more embodiments. [Figure 3C-D] 1A-1D are side cross-sectional views of a bonding base and a pad carrier according to one or more embodiments. [Figure 3E] FIG. 2 illustrates a top isometric view of a pad carrier according to one or more embodiments. [Figure 3F] FIG. 13 is a top exploded view of components within a pad carrier according to one or more embodiments. [Figure 4A] FIG. 2 illustrates a side cross-sectional view of an exemplary bonding base and pad carrier according to one or more embodiments. [Figure 4B-C] 1A-1D are plan and side cross-sectional views of a pad carrier according to one or more embodiments. [Figure 4D] FIG. 2 is a side cross-sectional view of a pad carrier according to one or more embodiments. [Figure 4E-F] FIG. 2 is a top view of a buffing pad according to one or more embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012]

[0023] To facilitate understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0013]

[0024] The embodiments described herein relate generally to equipment used in the manufacture of electronic devices, and more specifically to a horizontal pre-clean (HPC) module that may be used to clean a surface of a substrate during part of a semiconductor device manufacturing processing sequence.

[0014]

[0025] During the cleaning process, buffing pads made of polyvinyl alcohol (PVA) material are used to provide high shear forces across the surface of the substrate being cleaned and remove residues from the surface of the substrate due to the mechanical strength and abrasion resistance of the material. However, because PVA material is absorbent, soft, and elastic, as well as being inherently thicker and larger than conventional pad materials, buffing pads made of PVA material may sag when supported by a pad carrier.

[0015]

[0026] In the embodiments described herein, the pad carrier supports large, thick, water-absorbent buffing pads while preventing sagging of the buffing pads during the chemical-mechanical cleaning process through the use of mechanical clamping mechanisms, interlocking features, magnetic clamping mechanisms, and / or suction clamping mechanisms.

[0016]

[0027] FIG. 1A is a schematic plan view of an exemplary chemical mechanical polishing (CMP) processing system 100 using a horizontal pre-clean (HPC) module described herein, according to one or more embodiments. FIG. 1B is a top isometric view of an exemplary CMP processing system 100, which may correspond to the schematic view shown in FIG. 1A, according to one or more embodiments. FIG. 1C is a top elevational view of the CMP processing system 100 of FIG. 1B, which may correspond to the schematic view shown in FIG. 1A, according to one or more embodiments. In FIGS. 1B and 1C, certain parts of a housing and certain other internal and external components are omitted to more clearly show the HPC module in the CMP processing system 100. Here, the CMP processing system 100 includes a first portion 105 and a second portion 106 coupled to and integral with the first portion 105. The first portion 105 is a substrate polishing portion that includes multiple polishing stations (not shown).

[0017]

[0028] The second section 106 includes one or more post-CMP cleaning systems 110, multiple system loading stations 130, one or more substrate handlers, such as a first robot 124 and a second robot 150, one or more metrology stations 140, one or more location specific polishing (LSP) modules 142, one or more HPC modules 200, and one or more drying units 170. The HPC modules 200 are configured to process substrates 120 disposed in a substantially horizontal orientation (i.e., in the xy plane). In some embodiments, the second section 106 optionally includes one or more vertical cleaning modules 112 configured to process substrates 120 disposed in a substantially vertical orientation (i.e., in the zy plane).

[0018]

[0029] Each LSP module 142 is typically configured to polish only a portion of the substrate surface using a polishing member (not shown) having a surface area smaller than the surface area of ​​the substrate 120 to be polished. The LSP modules 142 are often used to finish, e.g., remove additional material, from a relatively small portion of the substrate 120 after the substrate 120 has been polished in the polishing module.

[0019]

[0030] The metrology station 140 is used to measure the thickness of a material layer disposed on the pre-polished and / or polished substrate 120, to inspect the polished substrate 120 to determine if a material layer has been removed from its field surface, and / or to inspect the pre-polished and / or polished substrate surface for defects. In those embodiments, the substrate 120 may be returned to the LSP module for further polishing and / or may be directed to a different substrate processing module or station, such as a polishing module or an LSP module 142 in the first portion 105, based on the measurement results or surface inspection results obtained using the metrology station 140. As shown in FIG. 1A, the metrology station 140 and the LSP module 142 are located in an area of ​​the second portion 106 above (in the Z direction) one of the portions of the post-CMP cleaning system 110.

[0020]

[0031] The first robot 124 is positioned to transfer the substrate 120 between the multiple system loading stations 130, for example, between the multiple system loading stations 130 and the second robot 150, and / or between the post-CMP cleaning system 110 and the multiple system loading stations 130. In some embodiments, the first robot 124 is positioned to transfer the substrate 120 between any of the system loading stations 130 and a processing system positioned proximate thereto. For example, in some embodiments, the first robot 124 may be used to transfer the substrate 120 between one of the system loading stations 130 and the metrology station 140.

[0021]

[0032] The second robot 150 is used to transfer the substrate 120 between the first portion 105 and the second portion 106. For example, here, the second robot 150 is positioned to transfer the substrate 120 to be polished received from the first robot 124 to the first portion 105 for polishing there. The second robot 150 is then used to transfer the polished substrate 120 from the first portion 105, for example, from a transfer station (not shown) in the first portion 105 to one of the HPC modules 200 and / or between different stations and modules located in the second portion 106. Alternatively, the second robot 150 transfers the substrate 120 from a transfer station in the first portion 105 to one of the LSP modules 142 or the metrology station 140. The second robot 150 can also transfer the substrate 120 from either the LSP module 142 or the metrology station 140 to the first portion 105 for further polishing there.

[0022]

[0033] The CMP processing system 100 of FIG. 1A includes two post-CMP cleaning systems 110 arranged on either side of the second robot 150. In FIG. 1A, at least some modules of one of the post-CMP cleaning systems 110, such as one or more vertical cleaning modules 112, are located below (in the Z direction) the metrology station 140 and the LSP module 142 and are therefore not shown. The metrology station 140 and the LSP module 142 are not shown in FIG. 1C. In some other embodiments, the CMP processing system 100 includes only one post-CMP cleaning system 110, where each of the post-CMP cleaning systems 110 includes an HPC module 200, one or more vertical cleaning modules 112, such as a brush or spray box, a drying unit 170, and a substrate handler 180 for transferring substrates 120 therebetween. Here, each HPC module 200 is arranged in the second portion 106 in a position proximate to the first portion 105.

[0023]

[0034] Typically, the HPC module 200 receives the polished substrate 120 from the second robot 150 through a first opening (not shown) formed in a side panel of the HPC module 200, for example through a door or slit valve disposed in the side panel. The substrate 120 is received in a horizontal orientation by the HPC module 200 for positioning on a horizontally disposed substrate support surface therein. The HPC module 200 then performs a pre-cleaning process, such as a buffing process, on the substrate 120 before the substrate 120 is transferred therefrom using the substrate handler 180.

[0024]

[0035] Substrate 120 is transferred from HPC module 200 through a second opening, here opening 224 (FIG. 1B), which is typically a horizontal slot disposed through a second side panel of HPC module 200 that is closable with a door, e.g., a slit valve. Thus, substrate 120 is also in a horizontal orientation when transferred from HPC module 200. After substrate 120 is transferred from HPC module 200, substrate handler 180 pivots substrate 120 to a vertical position for further processing in vertical cleaning module 112 of post-CMP cleaning system 110.

[0025]

[0036] In this example, the HPC module 200 has a first end 202 facing the first portion 105 of the CMP processing system 100, a second end 204 facing opposite the first end 202, a first side 206 facing the second robot 150, and a second side 208 facing opposite the first side 206. The first and second sides 206, 208 extend orthogonally between the first and second ends 202, 204.

[0026]

[0037] A plurality of vertical cleaning modules 112 are located within the second portion 106. The one or more vertical cleaning modules 112 are any one or combination of contact and non-contact cleaning systems, such as a spray box and / or a brush box, for removing polishing by-products from the surface of the substrate.

[0027]

[0038] The drying unit 170 is used to dry the substrate 120 after it has been processed by the vertical cleaning module 112 and before it is transferred to the system loading station 130 by the first robot 124. Here, the drying unit 170 is a horizontal drying unit and is configured to receive the substrate 120 through an opening (not shown) while the substrate 120 is disposed in a horizontal orientation.

[0028]

[0039] Herein, the substrate 120 is moved between the HPC module 200 and the vertical cleaning module 112, between the individual vertical cleaning modules 112, and between the vertical cleaning module 112 and the drying unit 170 using the substrate handler 180.

[0029]

[0040] In embodiments herein, operation of the CMP processing system 100, including the substrate handler 180, is directed by a system controller 160. The system controller 160 includes a programmable central processing unit (CPU) 161 operable with memory 162 (e.g., non-volatile memory) and support circuits 163. The support circuits 163 conventionally include cache, clock circuits, input / output subsystems, power supplies, etc., and combinations thereof, coupled to the CPU 161 and coupled to various components of the CMP processing system 100 to facilitate its control. The CPU 161 is one of any form of general-purpose computer processor used in industrial environments, such as a programmable logic controller (PLC), to control the various components and sub-processors of the processing system. The memory 162 coupled to the CPU 161 is non-transient and is typically one or more of readily available memory, such as random access memory (RAM), read-only memory (ROM), a floppy disk drive, a hard disk, or any other form of digital storage, local or remote.

[0030]

[0041] Typically, memory 162 is in the form of a non-transitory computer-readable storage medium containing instructions (e.g., non-volatile memory) that, when executed by CPU 161, facilitate operation of CMP processing system 100. The instructions in memory 162 are in the form of a program product, such as a program that implements the methods of the present disclosure. The program code may conform to any one of a number of different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program(s) of the program product define functions of the embodiments (including the methods described herein).

[0031]

[0042] Exemplary non-transitory computer readable storage media include, but are not limited to, (i) non-writable storage media on which information may be permanently stored (e.g., a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory device, e.g., a read-only memory device in a computer such as a solid-state drive (SSD)), and (ii) a writable storage medium on which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random access semiconductor memory). Such computer readable storage media, when carrying computer readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure. In some embodiments, the methods described herein, or portions thereof, are performed by one or more application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other types of hardware implementations. In some other embodiments, the substrate processing and / or handling methods described herein are performed by a combination of software routines, ASIC(s), FPGAs, and / or other types of hardware implementations. One or more system controllers 160 may be used with one or any combination of the various modular polishing systems described herein and / or with individual polishing modules thereof.

[0032]

[0043] 2A is a top isometric view of a second side 208 of an example HPC module 200 that may be used in the CMP processing system 100 described herein. In FIG. 2A, the service access panel has been omitted to more clearly show the internal components of the HPC module 200.

[0033]

[0044] Generally, HPC module 200 includes a chamber 210 formed by a number of side panels that collectively define a processing region 212, a collection area 214, and a lid 216.

[0034]

[0045] A first side panel 218 is formed on a first side 206 of the HPC module 200 facing the second robot 150 and includes a first substrate handler access door (not shown) used to position a substrate 120 on the rotary vacuum table 230 with the second robot 150. A second side panel 222 is formed on a second end 204 of the HPC module 200 facing away from the first portion 105. The second side panel 222 includes a second substrate handler access door opening 224 used to remove a substrate 120 from the rotary vacuum table 230 with the substrate handler 180. A third side panel 226 is formed on a second side 208 of the HPC module 200. The third side panel 226 includes a service access panel opening 228. The symmetry of the first substrate handler access door and the service access panel opening 228 formed in opposing side panels of the HPC module 200 beneficially provides a horizontal buffing module that can be installed on either side of the processing system 100, as shown in FIG. 1C.

[0035]

[0046] The HPC module 200 further includes a rotary vacuum table 230 disposed within the processing region 212 for vacuum chucking the substrate 120, an annular substrate lift mechanism 270 disposed radially outward of the rotary vacuum table 230, a pad conditioning station 280 disposed proximate to the rotary vacuum table 230, and a pad carrier positioning arm 300 movable between a first position on the rotary vacuum table 230 and a second position on the pad conditioning station 280. The rotary vacuum table 230, the annular substrate lift mechanism 270, the pad conditioning station 280, and the pad carrier positioning arm 300 are each independently mounted to the water catchment area 214.

[0036]

[0047] FIG. 2B is a side cross-sectional view of an exemplary pad carrier positioning arm 300 that may be used in the HPC module 200 of FIG. 2A. The pad carrier positioning arm 300 is positioned proximate to the rotary vacuum table 230 and the pad conditioning station 280 (FIG. 2A). A distal end 302 of the pad carrier positioning arm 300 includes a vertically movable pad carrier assembly 304 for supporting a buffing pad 306 at a lower end thereof. The pad carrier assembly 304 includes a head motor 308 for rotating the buffing pad 306 about an axis c2 substantially aligned with the direction of gravity. The pad carrier assembly 304 is coupled to the head motor 308 via a shaft 311 and includes a coupling base 310 that couples the pad carrier 314 to the head motor 308. In some embodiments, the pad carrier 314 is sized to support a buffing pad 306 having a diameter of about 40 mm to 150 mm, such as about 70 mm to 150 mm, e.g., about 134 mm, which is larger than conventional buffing pads used in similar cleaning modules. In some embodiments, the pad carrier positioning arm 300 of the present disclosure supports a larger buffing pad 306 compared to conventional pre-cleaning modules.

[0037]

[0048] During processing in the HPC module 200, the substrate 120 is positioned on the rotary vacuum table 230 by transferring the substrate 120 through an opening formed in the first side panel 226 by use of the second robot 150 and positioning the substrate 120 on a number of lift pins in the lift pin assembly 203. The lift pin assembly 203 includes a number of lift pins that can be raised and lowered by use of a lift pin actuator (not shown) to allow the substrate 120 to be positioned on and removed from the surface of the rotary vacuum table 230. A pump 219 can then be used to generate a vacuum between the substrate 120 and an opening formed in the surface of the rotary vacuum table 230. A head motor 308 and actuator assembly 217 are then used to bring a rotating buffing pad 306 into contact with the surface of the substrate. In some embodiments, the rotary vacuum table 230 and substrate 120 are also rotated during processing by use of a rotation actuator 227. The rotating buffing pad 306 may then be translated across the surface of the substrate 120 in an oscillatory arc motion by use of the rotational actuator 213. In some embodiments, the rotational actuator 213 may rotate the buffing pad 306 in an oscillatory rotation motion that covers less than a full 360 degree rotation. While the rotating buffing pad 306 is translating across the surface of the substrate 120, a first processing fluid, such as deionized water and / or one or more first cleaning fluids, may be flowed from the fluid source 221 onto the surface of the substrate 120. After processing for a desired period of time, processing is stopped and the substrate is removed from the HPC module 200 by performing the steps described above in reverse order. However, as described below, the substrate is beneficially removed from the HPC module 200 through the opening 209 by use of the second robot 150 or a third robot (not shown).

[0038]

[0049] 3A is a side cross-sectional view of a pad carrier 314 according to an embodiment of the present disclosure that may be used in the pad carrier assembly 304 of FIG. 2A. The pad carrier 314 includes a mating base 310, a support plate 315, and a buffing pad 306. In some embodiments, the mating between the mating base 310 and the support plate 315 is coupled via a magnetic attraction force generated by a plurality of magnets 318 disposed within the support plate 315 and a plurality of magnets 316 disposed within the mating base 310. The plurality of magnets 318 disposed within the support plate 315 and the plurality of magnets 316 disposed within the mating base 310 are also configured to provide a clamping force between the mating base 310 and the support plate 315 that is used to compress the lip 306A of the buffing pad 306. In some embodiments, the mating base 310 is a flexible element configured to receive the support plate 315. In some embodiments, the magnet 316 of the coupling base 310 is an electromagnet that receives power from an external power source (not shown) that is connected to an electromagnet disposed within the coupling base 310 by a slip ring that is coupled to the rotating shaft 311 of the head motor 308. In some embodiments, either the magnet 318 or the magnet 316 can be replaced with a ferromagnetic material, or some paramagnetic material, that is attracted by an opposing magnet, such as either the magnet 316 or the magnet 318, respectively. In some embodiments, the magnets 316 and 318 are similarly positioned in an array distributed about the central axis of the pad carrier 314 (e.g., an axis that coincides with the axis c2 shown in FIG. 2B). In some embodiments, either the array of magnets 316 or the array of magnets 318 is replaced by a toroidal shaped element that is ferromagnetic or paramagnetic and has a central axis that coincides with the central axis of the pad carrier 314. Alternatively, as shown in FIG. 3B, the support plate 315 includes a threaded hole 363 on the top surface of the support plate 315. The bonding base 310 and the support plate 315 are coupled together by a number of fasteners 320 and threaded holes 363 that are also configured to provide a clamping force between the bonding base 310 and the support plate 315 used to compress the lip portion 306A of the buffing pad 306.In some embodiments, both magnets and fasteners are used to couple the support plate 315 to the coupling base 310. In one embodiment, the coupling base 310 may be coupled to the shaft 311 by a quick release attachment (not shown) so that the pad carrier 314 can be easily removed for replacement of the buffing pad 306 on the pad carrier 314, and then quickly reattached to the shaft 311, as shown in FIG.

[0039]

[0050] In some embodiments, as shown in Figures 3C-3D, pad carrier 314 includes a mating base 310 and support plate 315 as described above with respect to Figures 3A and 3B, and further includes a clamping plate 312 that, in combination, is configured to clamp and hold lip portion 306A of buffing pad 306. Figure 3E further illustrates a top isometric view of one embodiment of clamping plate 312 coupled to buffing pad 306. Clamping plate 312 includes a body 312E that includes an array of enclosed regions 312F each including a magnet 318, a countersink region 312C, a recess 312D, and a surface 312A. 3C, 3D, and 3E, the coupling base 310, the clamping plate 312, and the support plate 315 may be positioned, coupled, and aligned with respect to one another by using positioning elements 312B and / or mating elements in a central region, such as recess 312D of the clamping plate 312 and mating elements 310B of the coupling base 310. In some embodiments, the mating elements in the central region are formed in a non-cylindrical or non-circular shape, such as a rectangle, oval, or star shape in the XY plane, such that the mating elements can transmit torque between the coupling base 310 and the clamping plate 312. In some embodiments, as shown in FIG. 3C, the mating of the coupling base 310 and the clamping plate 312 is coupled via magnetic attraction caused by a plurality of magnets 318 disposed in the clamping plate 312 and a plurality of magnets 316 disposed in the coupling base 310. Alternatively, in one embodiment shown in FIG. 3D, the clamping plate 312 includes a plurality of countersunk screw holes 362, each configured to receive a fastener 320. The mating of the coupling base 310 and the clamping plate 312 are coupled via a number of fasteners 320 and threaded holes 362. In some embodiments, both magnets and fasteners are used to couple the clamping plate 312 to the coupling base 310.

[0040]

[0051] 3F is an exploded view of one embodiment of the support plate 315 and the buffing pad 306. The support plate 315 includes a number of support plate retention features 315C, a surface 315A, and may optionally include a number of threaded features configured to receive a portion of the fastener 320. In some embodiments, the support plate 315 further includes a number of enclosed areas (not shown) each including a magnet 318, also as described above. In some embodiments, the support plate 315 further includes one or more interlocking features, shown as recesses 315D at the periphery of the support plate 315. The recesses 315D are provided to further improve retention of the lip 306A of the buffing pad 306 between the support plate 315 and the mating base 310, or in some embodiments, between the support plate 315 and the clamp plate 312. In some embodiments, the buffing pad 306 is overmolded onto the support plate 315, resulting in a non-separable assembly.

[0041]

[0052] In some embodiments, the buffing pad 306 is formed of a polyvinyl alcohol (PVA) material. The PVA material is hydrophilic and can absorb and retain water. The PVA material is resilient, flexible, soft, and has mechanical strength and abrasion resistance when wet. Compared to conventional materials used as buffing pads, such as poromeric materials or filled or unfilled polymeric materials, the PVA material provides high shear forces for chemical mechanical cleaning. The buffing pad 306 formed of the PVA material has a diameter of over 70 mm, which is larger than the diameter of a typical buffing pad formed of conventional materials, which is about 67 mm in diameter. The larger buffing pad improves performance in chemical mechanical cleaning and reduces buffing time. Additionally, the buffing pad 306 formed of the PVA material is thicker than a typical buffing pad formed of conventional materials. The pad carrier 314 is designed to support the large, thick, water-absorbent buffing pad 306 while preventing sagging of the buffing pad 306 through mechanical clamping and support mechanisms.

[0042]

[0053] In one embodiment, referring to FIG. 3A, when positioned against the bonding base 310 and ready to perform the buffing process, the lip 306A of the buffing pad 306 is compressed between the two surfaces 310A and 315A of the bonding base 310 and the support plate 315, respectively. A magnetic attraction force between the magnet 318 of the support plate 315 and the magnet 316 of the bonding base 310 is used to generate a force compressing the lip 306A of the buffing pad 306 between the surface 315A of the support plate 315 and the surface 310A of the bonding base 310. In one embodiment, the two surfaces 310A and 315A are substantially parallel to each other. In some embodiments, the surface 315A and / or the opposing surface of the lip 306A include one or more interlocking features, shown in FIG. 3F as a recess 315D in the support plate 315. The interlocking features are provided to further improve retention of the lip 306A of the buffing pad 306 between the surfaces 310A and 315A. In some embodiments, the clamping area of ​​the surfaces 310A and 315A between which the lip 306A is disposed during processing is oriented to be perpendicular to the direction in which the magnets 318 and 316 are aligned (i.e., Z direction) and / or parallel to the polishing surface 306D of the buffing pad 306 (e.g., XY plane). In some embodiments, as shown in Figures 3B, 3C, and 3D, a number of fasteners 320 are configured to provide the clamping force used to compress the lip 306A of the buffing pad 306. In some embodiments, the fasteners 320 may include one or more alignment pins. In either configuration of magnets 316 and 318 or fastener 320, the material in lip 306A may be compressed to about 5% to about 95% of its uncompressed state, for example about 20% to about 80%, or about 40% to about 60% of the original thickness of the material (e.g., PVA) of lip 306A of buffing pad 306.

[0043]

[0054] 3A-3D and 3F, in some embodiments, the pad carrier 314 includes a number of retention features 335 where pad retention features 306C of the buffing pad 306 engage with support plate retention features 315C of the support plate 315. The retention features 335 form part of a mechanical clamping mechanism and are used to position and maintain the position of the buffing pad 306 relative to the support plate 315 during processing, and thus after the buffing pad 306 is immersed in processing chemicals and / or during various shear and compression loads during processing. The retention features 335 are also used to prevent sagging of portions of the buffing pad 306 relative to the support plate 315. Sagging of the buffing pad 306 would undesirably cause the sagging portions of the buffing pad 306 to contact the surface of the substrate when the substrate is moved relative to the pad carrier 314 before or after a buffing process is performed on the substrate.

[0044]

[0055] 3F, in some embodiments, the buffing pad 306 and the support plate 315 are each formed with a desired mating pattern to minimize or prevent sagging of the buffing pad 306 and include pad retention features 306C and support plate retention features 315C, respectively, that mechanically clamp the pad 306 to the support plate to reliably handle loads applied to the buffing pad 306 during processing. In some embodiments, the retention features 335 may be formed such that the pad retention features 306C and support plate retention features 315C form an overlap and / or interference fit that may substantially fix the position of the buffing pad 306 relative to the support plate 315. As shown in FIGS. 3A-3D, the pad retention feature 306C may be formed in an inverted cone shape and the support plate retention feature 315C may be formed in a countersunk configuration such that the top of the pad retention feature 306C overlaps the bottom of the support plate retention feature 315C. In some embodiments, the pad retention features 306C and support plate retention features 315C of each retention feature 335 of the plurality of retention features are formed in a circular, elliptical, spiral, or slot-shaped configuration. In some configurations, the array or pattern of retention features 335 includes two or more different retention feature shapes.

[0045]

[0056] FIG. 4A is a side cross-sectional view of an exemplary pad carrier 314 including a mating base 310 and a support plate 315 that may be used in the pad carrier assembly 304 of FIG. 2B. In some embodiments, the mating base 310 includes a magnet 316 and the support plate 315 includes a magnet 318 such that the mating base 310 and the pad carrier 314 are mated via magnetic forces. In some embodiments, the magnets 316 and the magnets 318 are similarly positioned in an array distributed about a central axis of the pad carrier 314 (e.g., an axis that coincides with axis c2 shown in FIG. 2B). In one embodiment, the magnets 316 and the magnets 318 include ferromagnetic or paramagnetic materials. In some embodiments, either the array of magnets 316 or the array of magnets 318 is replaced by a toroidal shaped element that is ferromagnetic or paramagnetic and has a central axis that coincides with the central axis of the pad carrier 314. The mating base 310 and the support plate 315 are aligned via fasteners 320. In some embodiments, the fasteners 320 may include screws and bolts. In an alternative embodiment, the coupling base 310 and the support plate 315 are aligned via alignment or positioning pins.

[0046]

[0057] The pad carrier 314 may further include a lip ring 321 having a lip ring periphery 322 at the periphery of the lip ring 321. The support plate 315 includes a tapered portion 324 at the periphery of the support plate 315, tapering from a bottom surface to a top surface of the support plate 315 facing the mating base 310 such that the tapered portion 324 is substantially parallel to an inner surface of the lip ring periphery 322 of the lip ring 321. The lip ring periphery 322 of the lip ring 321 and the tapered portion 324 of the support plate 315 together mechanically clamp the buffing pad 306 along the periphery of the lip portion 306A of the buffing pad. The support plate 315 has a diameter at the bottom surface of about 70 mm to 150 mm, for example about 128 mm, and a thickness of about 2 mm to 10 mm, or about 3 mm to 7 mm, for example about 4.2 mm. In some embodiments, the diameter of the support plate 315 at the upper surface is about 1 mm to about 5 mm smaller than the diameter of the support plate 315 .

[0047]

[0058] 4B and 4C are plan and side cross-sectional views of the pad carrier 314 according to one embodiment. Also shown in FIG. 4C is a lip ring 321, a support plate 315, and a portion of the buffing pad 306. In some embodiments, the pad carrier 314 includes a plurality of retention features 335 in which the pad retention features 306C of the buffing pad 306 engage with the support plate retention features 315C of the support plate 315. The support plate 315 includes a support plate retention feature 315C in which the pad retention feature 306C is pressed into the support plate retention feature 315C. The support plate retention feature 315C is a circular through hole having a diameter of about 10 mm to about 25 mm, e.g., about 15 mm, and having a negative taper from the surface facing the bonding base 310 to the surface facing the buffing pad 306 (i.e., the diameter at the surface facing the bonding base 310 is larger than the diameter at the surface facing the buffing pad 306). The pad retention feature 306C is cylindrical with a diameter slightly larger than that of the support plate retention feature 315C so that the pad retention feature 306C is compressed when inserted into the support plate retention feature 315C. The bonding base 310, the lip ring 321 and the support plate 315 may be made of a plastic or polymer such as polyetheretherketone (PEEK). The buffing pad 306 may be securely supported using a mechanical clamping mechanism including the lip periphery 322 of the lip ring 321, the peripheral tapered portion 324 of the support plate 315, the support plate retention feature 315C and the pad retention feature 306C. In Figures 4B and 4C, one circular support plate retention feature 315C and one cylindrical pad retention feature 306C are shown. 3F, the support plate 315 may have multiple support plate retaining features 315C, each of which receives one of the pad retaining features 306C and creates a retaining force to hold the buffing pad 306 in position relative to the pad carrier 314. The pad retaining features 306C may be any raised shape, and the support plate retaining features 315C have a shape that matches the shape of the pad retaining features 306C such that the pad retaining features 306C and the support plate retaining features 315C form an overlap and / or interference fit that is used to retain the buffing pad 306.

[0048]

[0059] 4D is a side cross-sectional view of a pad carrier 314 according to another embodiment. The pad carrier 314 includes a central support plate retaining feature 315C with the pad retaining feature 306C pressed into the support plate retaining feature 315C, similar to the embodiment shown in FIG. 4C. In this embodiment, a backing 330 is placed on the surface of the buffing pad 306 that contacts the buffing pad 306. The backing 330 may be placed on the surface of the buffing pad 306 that faces the support plate 315. The backing 330 may be formed of plastic and adds rigidity to the buffing pad 306, further preventing sagging of the buffing pad 306. In some embodiments, the raised pad retaining feature 306C may include a cavity or hole 327 on the top surface of the pad retaining feature 306C, and a puck 328 that matches the shape of the hole 327 may be inserted into the hole 327. The hole in the pad can be any shape, preferably a shape that matches the shape of the pad retention feature 306C, and the puck 328 has a shape that matches the shape of the hole 327 but is slightly wider in diameter, such that the hole 327 in the pad retention feature 306C and the puck 328 form an overlap and / or interference fit that is used to further form an enhanced pressure fit between the pad retention feature 306C and the support plate retention feature 315C. In this embodiment, the puck 328 may be formed of a plastic or polymer such as polyetheretherketone (PEEK) or other solid chemically resistant material such as ceramic, aluminum, or stainless steel.

[0049]

[0060] 4E and 4F are top views of a buffing pad 306 according to another embodiment. In these embodiments, the buffing pad 306 has raised pad retention features 306C formed on a surface of the buffing pad 306 facing the support plate 315, which has a plurality of support plate retention features 315C, each of which engages one of the pad retention features 306C. The pad retention features 306C of the buffing pad 306 are positioned to be inserted into the support plate retention features 315C of the support plate 315 and overlap and contact each other to create a retention force that holds the buffing pad 306 to the pad carrier 314. In FIG. 4E, the plurality of raised pad retention features 306C are in the shape of pillars, and each of the pad retention features 306C engages a corresponding support plate retention feature 315C of the support plate 315. In FIG. 4F, the pad retention feature 306C includes a central pad retention feature 306C in the shape of a pillar that engages with a circular support plate retention feature 315C that matches the shape of the pillar, and the pad retention feature 306C also includes radial spokes, each of which engages with a support plate retention feature 315C in the shape of a rectangular slot that matches the shape of the radial spokes.

[0050]

[0061] In embodiments described herein, a pad carrier is provided that supports large, thick, water-absorbent buffing pads, such as buffing pads formed from polyvinyl alcohol (PVA) material, while preventing the buffing pad from sagging with a mechanical clamping mechanism during chemical mechanical cleaning. Buffing pads formed from polyvinyl alcohol (PVA) material provide high shear forces for chemical mechanical polishing due to their mechanical strength and abrasion resistance. Large buffing pads improve cleaning performance.

[0051]

[0062] An embodiment of the present disclosure may also provide a horizontal pre-cleaning module. The horizontal pre-cleaning module includes a chamber including a water collection area and a lid that collectively define a processing region, a rotary vacuum table disposed in the processing region and including a substrate receiving surface, a pad conditioning station disposed proximate to the rotary vacuum table, a pad carrier positioning arm having a first end and a second end distal from the first end, a pad carrier assembly coupled to the first end of the pad carrier positioning arm, and an actuator coupled to the second end of the pad carrier positioning arm and configured to move the pad carrier assembly between a first position on the rotary vacuum table and a second position on the pad conditioning station. The pad carrier assembly includes a bonding base and a pad carrier coupled to the bonding base, the bonding base and the pad carrier configured to support a buffing pad by a mechanical clamping mechanism.

[0052]

[0063] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, as determined by the following claims.

Claims

1. 1. A pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A clamping plate including a clamping body, the clamping body comprising: one or more ferromagnetic or paramagnetic material containing elements disposed within the clamp body; a first retaining surface disposed on a first side of the clamp body; a clamp plate including: A support plate including a support body, the support body comprising: a second support surface disposed on the first side of the support body; Multiple support plate retention features and A support plate including: A pad carrier assembly comprising: Equipped with A pad carrier, wherein each support plate retention feature is configured to receive a pad retention feature formed on the buffing pad when the lip portion of the buffing pad is positioned between the first retention surface and the second retention surface.

2. a binding base including a binding plate body, the binding plate body further comprising one or more ferromagnetic or paramagnetic material-containing elements disposed within the binding plate body; each of the one or more ferromagnetic or paramagnetic material-containing elements in the binding plate body of the binding base is configured to face each of the one or more ferromagnetic or paramagnetic material-containing elements in the support body of the support plate when the binding base is positioned on the second side of the support body of the support plate; a second side of the support body of the support plate opposite the first side; The pad carrier of claim 1 .

3. The pad carrier of claim 2 , wherein the one or more ferromagnetic or paramagnetic material containing elements of the coupling base or clamping plate include a ferromagnetic or paramagnetic material containing element formed in a toroidal shape.

4. The pad carrier of claim 1 , wherein the one or more ferromagnetic or paramagnetic material containing elements comprises an array of magnetic ferromagnetic containing elements.

5. The pad carrier of claim 1 , wherein the one or more ferromagnetic or paramagnetic material containing elements comprise a ferromagnetic or paramagnetic material containing element formed in a toroidal shape.

6. The pad carrier of claim 1 , wherein the support plate further includes one or more interlocking features on a periphery of the second support surface.

7. 2. The pad carrier of claim 1, wherein the pad retention feature is formed in an inverted cone shape and the support plate retention feature is formed in a countersink configuration such that a top of the pad retention feature overlaps a bottom of the support plate retention feature.

8. 1. A pad carrier for use in a cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A binding base comprising a binding body, the binding body comprising: an array of magnets disposed within the coupling body; a first retaining surface disposed on a first side of the coupling body; a binding base comprising: A support plate including a support body, the support body comprising: an array of magnets disposed within the support body; a second support surface disposed on the first side of the support body; Multiple support plate retention features and A support plate including: A pad carrier assembly comprising: Equipped with A pad carrier, wherein each support plate retention feature is configured to receive a pad retention feature formed on the buffing pad when the lip portion of the buffing pad is positioned between the first retention surface and the second retention surface.

9. each magnet in the array of magnets in the coupling body of the coupling base is configured to face each magnet in the array of magnets in the support body of the support plate when the coupling base is positioned on the second side of the support body of the support plate; The pad carrier of claim 8 , wherein a second side of the support body of the support plate is opposite the first side.

10. The pad carrier of claim 8 , wherein the array of magnets in the coupling body of the coupling base or the magnets in the support body of the support plate include ferromagnetic or paramagnetic containing elements.

11. The pad carrier of claim 8 , wherein the array of magnets in the coupling body of the coupling base and the array of magnets in the support body of the support plate are formed in a toroidal shape.

12. 9. The pad carrier of claim 8, wherein the pad retention features are formed in an inverted cone shape and the support plate retention features are formed in a countersunk configuration such that a top of each of the pad retention features overlaps a bottom of each of the support plate retention features.

13. 1. A pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A clamping plate including a clamping body, the clamping body comprising: an array of magnets disposed within the clamp body; a first retaining surface disposed on a first side of the clamp body; a clamp plate including: A support plate including a support body, the support body comprising: a second support surface disposed on the first side of the support body; Multiple support plate retention features and A support plate including: A pad carrier assembly comprising: Equipped with A pad carrier, wherein each support plate retention feature is configured to receive a pad retention feature formed on the buffing pad when the lip portion of the buffing pad is positioned between the first retention surface and the second retention surface.

14. a coupling base including a coupling body including an array of magnets disposed within the coupling body; configured such that when the coupling base is positioned on the second side of the support body of the support plate, each magnet of the array of magnets in the coupling body faces each magnet of the array of magnets in the support body of the support plate; a second side of the support body of the support plate opposite the first side; The pad carrier of claim 13.

15. The pad carrier of claim 14 , wherein the array of magnets in the coupling body of the coupling base or the magnets in the support body of the support plate include ferromagnetic or paramagnetic containing elements.

16. The pad carrier of claim 14 , wherein the array of magnets in the coupling body of the coupling base and the array of magnets in the support body of the support plate are formed in a toroidal shape.

17. 14. The pad carrier of claim 13, wherein the pad retention features are formed in an inverted cone shape and the support plate retention features are formed in a countersunk configuration such that a top of each of the pad retention features overlaps a bottom of each of the support plate retention features.

18. 1. A pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A binding base comprising a binding body, the binding body comprising: a first retaining surface disposed on a first side of the coupling body; a binding base comprising: A support plate including a support body, the support body comprising: a second support surface disposed on the first side of the support body; Multiple support plate retention features and A support plate including: A pad carrier assembly comprising: Equipped with A pad carrier, wherein each support plate retention feature is configured to receive a pad retention feature formed on the buffing pad when the lip portion of the buffing pad is positioned between the first retention surface and the second retention surface.

19. 20. The pad carrier of claim 18, wherein the plurality of holes disposed in the support body are a plurality of countersunk screw holes, each screw hole configured to receive a fastener, and the support body is configured to be coupled to the coupling base via the plurality of fasteners and the countersunk screw holes.

20. 20. The pad carrier of claim 18, wherein the pad retention features are formed in an inverted cone shape and the support plate retention features are formed in a countersunk configuration such that a top of each of the pad retention features overlaps a bottom of each of the support plate retention features.

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