Eddy Current (EC) Inspection Configuration Systems and Technology

Abstract

Various approaches can be used to perform eddy current inspection of a structure. The sensor configuration described herein can include a flex circuit with multiple EC sensor elements. The flex circuit can conform to an area of ​​the structure under test, such as a desired portion of the profile and supported by a spacer, to maintain a desired standoff distance between the object under test and the probe assembly. The techniques of the specification can be used to establish inspection configuration data that defines the activation or deactivation of each EC sensor in the probe assembly. For example, a graphical user interface (GUI) can be used to provide graphical feedback regarding one or more attributes of the test, such as an indication of the location of the test probe or other attributes.

Description

[Technical field]

[0001] Claiming priority This patent application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 268,784 to Beaulieu et al., entitled “EDDY CURRENT (EC) PROBE CONFIGURATION, TECHNIQUES FOR EC TESTING, AND EC TESTING USER INTERFACE,” filed March 2, 2022, and is incorporated by reference in its entirety herein.

[0002] This document relates generally, but not exclusively, to apparatus and techniques for non-destructive testing, such as facilitating eddy current testing, and more specifically, to apparatus and techniques for performing eddy current testing, including establishing configurations for enabling or disabling respective eddy current sensor elements within an eddy current probe assembly. [Background technology]

[0003] Non-destructive testing (NDT) can refer to the use of one or more different techniques to inspect an area on or within an object, for example, to ascertain whether flaws or defects are present in the inspected object, or to otherwise characterize the inspected object. An example of a non-destructive testing technique can include the use of eddy current testing techniques, in which electromagnetic energy is applied to an object, and the resulting induced current on or within the object creates an electrical signature that can be detected. For example, the value of the detected current (or associated impedance) can provide an indication of the structure of the object under test, such as indicating the presence of cracks, voids, porosity, or other non-uniformities, such as at or near the surface of the conductive object under test. Eddy current testing can be used as a surface inspection technique for steel structures, such as combined with other inspection techniques (e.g., acoustic inspection) to achieve surface coverage or subsurface coverage. Summary of the Invention [Means for solving the problem]

[0004] Eddy current (EC) testing can be used as a non-destructive testing technique, such as to aid in inspection operations during or after the manufacture of an article. For example, steel structures such as railroad rails can be inspected as part of the production or receiving process, such as using eddy current techniques or a combination of eddy current with other inspection modalities such as visual inspection or acoustic inspection. In one approach, the inspection can be performed by a technician using a pencil probe or other probe configuration. Such approaches can present various challenges. For example, eddy current testing generally involves maintaining a desired spatial relationship between an eddy current sensor and the surface of the object under test. Lifting the sensor away from the surface of the object under test can affect test coverage and may require rescanning. Also, scanning a structure by hand using a raster or other pattern can be time consuming and can lack consistency. Automation, such as using a fixture to house the EC probe assembly, can help improve inspection consistency, but such fixtures are still sensitive to misorientation of the probe or incorrect probe location relative to the object under test.

[0005] The inventors have recognized that EC inspection can be facilitated by, among other things, the use of machine-implemented tools (e.g., computer-implemented tools, such as those providing a user or operator interface) for planning and executing EC inspection. An array of eddy current sensors can be used to enhance testing productivity by providing greater coverage for each scan or pass, etc. By way of illustration, such machine-implemented tools can include or use models that represent respective eddy current array (ECA) probe configurations and associated models of respective objects to be inspected. For example, the present subject matter can include or use such models to assist a user in one or more of: (a) establishing a designated probe location relative to an object under test for a specified inspection configuration; (b) selecting or deselecting each of the ECA probe sensors for a specified inspection configuration; or (c) storing a specified inspection configuration for use in controlling EC inspection operations.

[0006] The apparatus and techniques described herein can be used to implement an "offline" inspection plan for future inspection operations, or can be used in an "online" fashion, where such apparatus and techniques can be used to configure and trigger such inspections. The apparatus and techniques described herein can also be used to facilitate evaluation of inspection results, such as providing a visual representation of EC inspection operation findings superimposed on a representation of the object under test for evaluation, reporting, or record-keeping purposes. The apparatus and techniques described herein can include the use of ECA probe assemblies having a flexible substrate, such as respective probe assemblies configured for inspection of portions of an object under test having a complex profile. By way of illustration, the apparatus and techniques described herein can be used to facilitate EC inspection of railroad rails, such as to support simultaneous inspection of railroad rails using multiple ECA inspection probes. For example, such inspection using configuration techniques as described herein can provide coverage of multiple portions of a rail profile using multiple ECA inspection probe assemblies in a single pass.

[0007] In one embodiment, a technique such as a machine-implemented method can support eddy current (EC) inspection, the machine-implemented method including receiving a model defining an outline of an object under test, receiving a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors, receiving an indication of the location of the ECA probe relative to the location of the object under test, and responsively indicating each of the eddy current sensors to be activated among the plurality of eddy current sensors using the received model defining an outline of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe. The machine-implemented method can include generating a presentation for a user that identifies each of the indicated eddy current sensors to be activated. The machine-implemented method can include the received model defining the ECA probe defining a plurality of spacers, the plurality of spacers establishing a specified standoff distance between the plurality of eddy current sensors and the object under test when each of the plurality of spacers is in contact with the object under test. For example, the machine-implemented method may include generating a presentation for a user indicating the location of the ECA probe, including the location of at least one of the spacers among the plurality of spacers and whether at least one of the spacers among the plurality of spacers is within a specified trajectory.

[0008] In one embodiment, a system may support eddy current (EC) inspection, the system comprising: a processor circuit, a display communicatively coupled to the processor circuit, a user input communicatively coupled to the processor circuit, and a memory circuit including instructions that, when executed by the processor circuit, cause the processor circuit to: receive a model defining an outline of an object under test, receive a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors, receive an indication of a location of the ECA probe relative to a location of the object under test using the user input, and, in response, generate a presentation for a display using the received model defining an outline of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe to indicate each of the eddy current sensors to be activated among the plurality of eddy current sensors. The instructions may include instructions for storing an EC inspection configuration including data indicative of each of the eddy current sensors to be activated and including data indicative of a location of the ECA probe relative to a location of the object under test. The instructions may also include instructions for storing a plurality of EC test configurations corresponding to respective ECA probe definitions and corresponding locations.

[0009] This Summary is intended to provide an overview of the subject matter of this patent application. It is not intended to provide an exclusive or exhaustive description of the invention. The Detailed Description is included to provide further information regarding this patent application.

[0010] In the drawings, which are not necessarily drawn to scale, like numerals may describe like components in different views. Like numerals with different letter suffixes may represent different instances of similar components. The drawings generally illustrate by way of example, but not by way of limitation, various embodiments discussed in the present document. [Brief description of the drawings]

[0011] [Figure 1] An example is generally illustrated that includes a non-destructive inspection system such as may be used to implement at least a portion of one or more of the techniques as shown and described herein. [Figure 2A] Generally illustrated is an example involving an eddy current array (ECA) probe assembly having a curved shape. [Figure 2B] Generally illustrated are examples including eddy current array (ECA) probe assemblies with respective spacers that maintain a specified standoff distance between the ECA probe assembly and an object under test. [Figure 2C] Generally illustrated is an example including an eddy current array (ECA) probe assembly included as part of a test fixture, the test fixture having a respective actuator. [Diagram 3] 1 generally illustrates illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user to assist in establishing an EC test configuration. [Figure 4A] Illustrative examples of techniques that can be used to provide an indication of each EC sensor being activated based on different criteria are generally illustrated. [Figure 4B] Illustrative examples of techniques that can be used to provide an indication of each EC sensor being activated based on different criteria are generally illustrated. [Diagram 5] Generally illustrating illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 5 defines a probe selection context. [Figure 6A] Generally illustrating further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6A defines a probe location situation. [Figure 6B]FIG. 6B generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that can be presented to a user, and the illustrative example of FIG. 6B defines a further probe location situation showing an enlarged (e.g., “zoomed”) view. [Figure 6C] Illustrating further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6C defines an inspection zone situation. [Figure 6D] Generally illustrating further illustrative examples of presentations (e.g., graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6D defines an overall EC inspection configuration, such as using different EC probe assemblies to facilitate respective inspection operations. [Figure 7] To generally illustrate further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 7 defines a lab result reporting context. [Figure 8] The present invention generally illustrates techniques, such as machine implementation methods, that may include indicating each of the eddy current sensors to be actuated in support of an inspection operation, such as using a received model. [Figure 9] 9 illustrates an example block diagram comprising a machine 900 upon which any one or more of the techniques (eg, methodologies) discussed herein may be implemented. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Eddy current (EC) testing can be used as a non-destructive inspection technique, such as to assist in inspection operations during or after the manufacture of an article. The systems and techniques described herein can provide a graphical user interface (GUI) and associated machine-implemented tools to assist in EC testing and facilitate such testing, such as assisting a user in establishing an EC inspection configuration. Such a configuration can be defined as a stored data structure that provides details regarding probe selection, the object under test, the probe location, and the respective sensors that are activated or deactivated for the corresponding inspection operation. The subject matter of the present invention can also include flaw visualization tools, such as providing an indication of detected flaws superimposed on a visualization of at least a portion of the object under test. Such visualization can be facilitated using inspection configuration data corresponding to the inspection operation, as such inspection configuration data can indicate probe type, location, or other information that allows for localizing flaws on the object under test.

[0013] FIG. 1 generally illustrates an example including a non-destructive inspection system 100, such as may be used to implement at least a portion of one or more of the techniques shown and described herein. The non-destructive inspection system 100 may include a test instrument 140, such as a handheld or portable assembly. The test instrument 140 may be electrically coupled, such as using a multi-conductor interconnect 130, to a probe assembly 150. The probe assembly 150 may include one or more transducers, such as an eddy current (EC) transducer array 152 including respective EC sensors 154A-154N. The transducer array 152 may follow a linear or curved contour or may include an array of elements extending in multiple axes. The size and pitch of the elements may vary depending on the inspection application.

[0014] A modular probe assembly 150 configuration may be used that allows the test instrument 140 to be used with a variety of different probe assemblies. Generally, the transducer array 152 includes an EC coil, for example, located on or in a substrate. The EC coil is electromagnetically coupled to a target 158 ​​(e.g., a test sample or "subject under test"). The test instrument 140 may include digital and analog electrical circuitry, such as a front-end circuit 122 that includes one or more transmit signal chains, receive signal chains, or switching circuitry (e.g., transmit / receive switching circuitry). The transmit signal chain may include amplifier and filter circuitry to provide transmit pulses for delivery to the probe assembly 150 through the interconnect 130. A flaw 160 associated with the target 158 ​​may be detected, for example, by monitoring an impedance or other electrical characteristic associated with each sensor 154A-154N in the transducer array 152.

[0015] 1 shows a single probe assembly 150 and a single transducer array 152, other configurations can be used, such as multiple probe assemblies connected to a single test instrument 140, or multiple transducer arrays 152 used with a single probe assembly 150. Similarly, test protocols can be performed using coordination between multiple test instruments 140, for example, in response to an overall test scheme established from each test instrument 140, or established by another remote system, such as the computing facility 108, or a general-purpose computing device, such as a laptop 132, tablet, smartphone, desktop computer, etc. The test scheme can be established according to published standards or regulatory requirements, and can be performed at initial production or repeatedly for ongoing monitoring, as illustrative examples. In general, as described elsewhere herein, the EC test configuration can be established separately, such as to be performed by the test instrument 140 in a fully automated or semi-automated manner.

[0016] The front-end circuitry 122 may be coupled to and control one or more processor circuits, such as the processor circuitry 102 included as part of the test instrument 140. The processor circuit may be coupled to the memory circuitry 104, for example, to cause the test instrument 140 to execute instructions that cause the test instrument 140 to perform one or more of EC testing, processing, or storing data related to the EC testing, or otherwise implement techniques as shown and described herein. The test instrument 140 may be communicatively coupled to other portions of the system 100, such as using a wired or wireless communication interface 120.

[0017] For example, performance of one or more techniques as shown and described herein may be accomplished on the test instrument 140 or using other processing or storage facilities, such as using the computing facility 108 or general purpose computing devices such as laptops 132, tablets, smartphones, desktop computers, etc. For example, processing tasks that would be unnecessarily slow if performed on the test instrument 140 or beyond the capabilities of the test instrument 140 may be performed remotely (e.g., on a separate system), e.g., in response to a request from the test instrument 140. The test instrument 140 may include a display 110, such as for presenting configuration information or results, and input devices 112, including one or more of a keyboard, trackball, function keys or soft keys, mouse interface, touch screen, stylus, etc., for receiving operator commands, configuration information, or responses to queries.

[0018] FIG. 2A generally illustrates an example including an eddy current array (ECA) probe assembly 250 having a curved shape. The probe assembly 250 can include a rigid portion 266 that can include an interconnect for coupling electrical conductors in the probe assembly 250 to other test instruments. The probe assembly 250 can include a flexible substrate 264 having a curved profile. The flexible substrate 264 can include or support each eddy current sensor (e.g., EC sensors 254A-254N). For example, the probe assembly 250 can include a linear array of EC sensors including 16 coils. Other fixtures, such as a rigid core, can provide a shape that the flexible substrate 264 can conform to. In this manner, a common flexible probe configuration can be used across multiple different profiles by bending or curving the flexible substrate 264 as needed.

[0019] FIG. 2B generally illustrates an example including an eddy current array (ECA) probe assembly with respective spacers to maintain a specified standoff distance between the ECA probe assembly 250 and an object under test. Similar to the example of the probe assembly 250 of FIG. 2A, the probe assembly 250 of FIG. 2B includes a rigid portion 266, a flexible substrate 264, and sensors such as EC sensors 254A-N. The first spacer 262A, the second spacer 262B, and the third spacer 262C can maintain a specified standoff distance between the probe assembly 250 and the object under test 258 (e.g., a leg of a railroad rail in the example of FIG. 2B). Illustratively, the spacers (the first spacer 262A, the second spacer 262B, and the third spacer 262C) can include a carbide material to define a carbide pin or cylindrical structure. In this manner, the first spacer 262A, the second spacer 262B, and the third spacer 262C can be wear- and damage-resistant to protect the EC sensors 254A-254N of the probe assembly 250 from damage and to maintain a specified distance "h" between the flexible substrate 264 having the EC sensors 254A-254N and the object under test 258.

[0020] 2C generally illustrates an example including an eddy current array (ECA) probe assembly 250 included as part of a test fixture 268, with the test fixture having a respective actuator. As described above, a flexible portion of the probe assembly 250 can be attached to the test fixture 268. The test fixture 268 can be robotically manipulated to be translated along the object under test 258, or, as illustratively shown in FIG. 2C, the test fixture 268 can be supported by or incorporated into a frame assembly, with the object under test 258 being translated relative to the probe assembly 250 and the test fixture 268. For example, as illustratively shown in FIG. 2C, the object under test 258 can include a railroad rail, and the rail can be transported past the test fixture 268.

[0021] As shown and described elsewhere herein, the location of the probe assembly 250 can be defined by a stored test configuration, and sensors in the probe assembly can be activated or deactivated according to the stored configuration. The probe assembly 250 can be positioned robotically or using actuators to establish the probe assembly 250 at a designated memory location corresponding to the stored test configuration. For example, as shown in FIG. 2C, a combination of two pivot elements and two linear actuators can be used to provide various degrees of freedom for positioning the probe. Such an example is merely illustrative, and other configurations can be used. Multiple probe assemblies 250 can be positioned either collectively or independently, such as using respective fixtures 268, to achieve coverage of different areas of the object under test 258. In this manner, multiple test operations can be performed simultaneously as the object under test 258 is translated relative to the respective fixtures 268. Such test operations can include longitudinal, lateral, and diagonal probe configurations relative to the long axis of the object under test 258.

[0022] FIG. 3 generally illustrates an illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user to assist in establishing an EC test configuration. FIG. 3 conceptually illustrates various aspects of a test configuration that may be established, retrieved, or stored and supported by machine implementation techniques and graphical presentation to a user. For example, in the probe position display 374, the probe assembly 250 may be shown as corresponding to a selected probe ("E400115"). A representation of the probe assembly 250 may be defined by a model including a point cloud that includes the locations of the flexible substrate 264, the spacers 262A, 262B, and 262C, and the respective EC sensors, such as the sensor 254A and the sensor 254C. The object under test 258 may also be defined by a model including a point cloud, such as defining a coordinate system with an origin (0,0), as illustratively shown in the probe position display 374. Test coverage along the longitudinal extent of the object under test 258 can be controlled, such as using coverage control area 372, and groups of EC sensors to be activated or deactivated can be controlled using sensor configuration area 370. For example, as shown and described elsewhere below, machine-implemented techniques can provide an indication (e.g., suggestion or selection) of each sensor to be activated or deactivated based on various criteria. For example, such indication can include shading, texturing, or coloring of each sensor element, as illustratively shown in FIG. 3 (sensors indicated as active for an inspection operation are shaded and sensors indicated as inactive are unshaded). For example, EC sensor 254A is unshaded and EC sensor 254C is shaded. In general, when an inspection operation is stored, retrieved, and then executed, EC inspection can be accomplished using the indicated active sensors. Depending on the configuration of the machine-implemented tool, the automatic selection of sensors can be a suggestion to the user, and the user can override the automatically determined assignment of active and inactive sensors.

[0023] 4A and 4B generally illustrate respective illustrative examples of techniques that can be used to provide an indication of each activated EC sensor based on different criteria. As described above, the indication of each activated EC sensor can be automated or semi-automated. For example, as shown in FIGS. 4A and 4B, a model such as a point cloud or other data indicative of the geometry of the object under test 458 (in this example, the head of a railroad rail) can be received, such as retrieved from a data file. In FIGS. 4A and 4B, a model of the test probe assembly 450 can also be received, such as retrieved from a data file. For example, a user can select the object under test 458 and the corresponding probe assembly 450 to be used for an inspection operation. The location of the probe assembly 450 can be displayed, and the user can manipulate the probe location of the probe assembly 450. As discussed below, an indication can be provided that indicates whether the location of the probe assembly 450 is nominal, such as by changing the color, texture, or shading of an element in a graphical user interface. For example, such a visual indicator may be presented in relation to the location of one or more of spacers 462A, 462B, or 462C.

[0024] Each EC sensor 454A in the ECA of the probe assembly 450 may have an associated normal vector 442A (defined as being perpendicular to a tangent defined at a location along the substrate of the probe assembly 450, e.g., extending outward from a plane defined by the corresponding EC sensor or substrate). If the normal vector 442A fails to intersect the contour of the object under test 458 within a specified distance of the probe assembly 450, the respective EC sensor 454A may be deactivated (or an indication of such deactivation may be presented as a proposed EC sensor configuration). Similarly, if each EC sensor 454C has a corresponding normal vector 442C that intersects the contour of the object under test 458, the sensor may be activated (or an indication of such activation may be presented as a proposed EC sensor configuration). In this manner, a common probe assembly may be used for different object under test 458 geometries, with activation or deactivation of the respective sensors performed to provide a nominal inspection configuration, such as suppressing acquisition of inspection data from a particular sensor that is spaced or elevated from the surface of the object under test 458 due to the geometry of the probe assembly 450 extending beyond the contour of the object under test 458. As an illustrative example, a sensor may be indicated as activated if the distance between the sensor and the contour of the object under test is less than 3 millimeters as indicated by the corresponding normal vector (e.g., 3 millimeters may be the lift-off or detection limit of the probe assembly 450).

[0025] Other criteria can be used to provide an indication of an EC sensor that is activated or deactivated. For example, referring to FIG. 4B, the probe assembly 450, spacers 462A, 462B, and 462C, and the object under test 458 can be in the same location relative to one another as in FIG. 4A. In FIG. 4B, normal vectors, such as normal vector 442M corresponding to EC sensor 454M and normal vector 442N corresponding to EC sensor 454N, can be determined in a manner similar to FIG. 4A. An indication of curvature can be determined, such as by determining the distance between each EC sensor 454M or 454N and the contour of the object under test 458, such as using the corresponding normal vectors 442M and 442M. Illustratively, a radius of curvature or other value can be determined to be compared against a specified threshold value. For example, if such a determination indicates a relatively sharp radius of curvature, one or more EC sensors located at or near such curvature can be indicated as deactivated. As shown in the illustration of Figure 4B, EC sensor 454N is shown as unshaded and thus shown to be deactivated even though EC sensor 454N meets the criteria for activation according to the technique of Figure 4A. Such deactivation in Figure 4B is due to EC sensor 454N being in an area of ​​relatively sharp curvature.

[0026] FIG. 5 generally illustrates an illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user, and the illustrative example of FIG. 5 defines a probe selection context. In the example of FIG. 5, an ECA probe assembly 550 may be selected by a user, such as using a probe and object under test selection pane 578. As shown in the illustration of FIG. 5, a machine-implemented method may receive an ECA probe assembly 550 definition that is retrieved in response to a user selection. Other aspects of the test configuration may also be input by the user, such as a selection of an object under test, a test type, or other information, such as a size of a spacer (e.g., "carbide") pin, associated with the ECA probe assembly 550 and an associated test fixture. As with other examples described herein, the probe display pane 576 may show a representation of the received model of the ECA probe assembly 550, including the probe substrate shape, the locations of spacers 562A, 562B, and 562C, and individual EC sensors, such as EC sensor 554A and corresponding normal vector 542A. A simplified probe shape identifier ("3") may also be displayed as illustratively shown in FIG.

[0027] 6A generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6A defining a probe location context. As with other examples herein, such as shown in FIG. 5, the location of the ECA probe assembly 550 may be displayed, such as relative to a model of the object under test 658. A probe position display 674 may be presented in a pane, such as with a configuration and position control pane 673. For example, a probe may be selected at 682, and a machine implemented method may receive and display a representation of the model of the ECA probe assembly 550. The probe position relative to the object under test 658 may be determined, such as by using a translation control at 686 or by rotating the probe representation. A quick shortcut input may be provided as shown at 684 to roughly position the representation of the ECA probe assembly 550, and the translation control may be used for fine adjustments. The locations of the spacers 562A, 562B, and 562C may be shown. When each one (or more) of the spacers 562A, 562B, or 562C is within the designated trajectory, a representation in the probe position display 674 can indicate that each one (or more) of the spacers 562A, 562B, or 562C is in a nominal or otherwise designated location for testing. For example, because EC testing is sensitive to the distance between each EC sensor in the ECA probe assembly 550 and the object under test 658, a visual aid can assist the user in establishing a proper probe location for testing. By way of illustration, the circles representing the spacers 562A, 562B, and 562C can automatically change color, texture, or shape to indicate, as an illustrative example, whether each one (or more) of the spacers 562A, 562B, and 562C is in a proper location for testing.

[0028] FIG. 6B generally illustrates a further illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user, with the illustrative example of FIG. 6B defining a further probe location situation showing an enlarged (e.g., “zoomed”) view. As with the example of FIG. 6A, in the enlarged view of FIG. 6B, the location or orientation (or both) of the ECA probe assembly 550 may be manipulated (such as with greater precision than in the view of FIG. 6A). The example of FIG. 6B includes a probe position display 674, a configuration and position control pane 673, a representation of a model of the ECA probe assembly 550 relative to a representation of a model of the object under test 658, spacers 562A, 562B, 562C, and shortcut inputs at 684 and translation inputs at 686. The representation of the ECA probe assembly 550 may include respective representations of vectors perpendicular to the respective EC sensors, as shown and described elsewhere herein. For example, as shown in FIG. 6B, each EC sensor 554A can have a corresponding vector that extends vertically outward, such as normal vector 542A, and each EC sensor 554N can have a corresponding vector that extends vertically outward, such as normal vector 542N. Because the ECA probe assembly 550 may be used in a different orientation in which the opposite surface of the substrate faces the object under test 658, the vectors may extend in the opposite direction, as shown in FIG. 6B. As with the example of FIG. 6A and other examples herein, an indication of probe location or alignment may be provided by shading, texturing, coloring, or the like of indicia in the probe position display 674. For example, when the ECA probe assembly 550 is in a proper orientation for an inspection operation, each one (or more) of the spacers 562A, 562B, or 562C may change color. The location of the ECA probe assembly 550 can be stored to facilitate subsequent inspection operations or to display received EC inspection results correlated with the spatial location of the fault based on the stored location of the ECA probe assembly 550 relative to the object under test 658, etc.

[0029] FIG. 6C generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6C defines an inspection zone context. A user may select and manipulate a representation of the ECA probe assembly 550 as shown and described elsewhere, such as discussed above in connection with FIG. 6A and FIG. 6B. In the inspection zone context, the established location of the ECA probe assembly 550 may be used along with a normal vector or other criteria to provide an indication of each EC sensor that is activated or deactivated for an inspection operation. For example, a group of EC sensors may be assigned an identifier in the sensor group pane 680, and an inspection zone pane 688 may be provided to display an inspection zone 690 (e.g., an area of ​​surface coverage for an EC inspection operation). For example, a visual indication may be provided for each of the EC sensors in the ECA probe assembly 550 that is activated or deactivated based on the normal vector and the distance between each sensor and the contour of the object under test 658. For example, in the illustration of FIG. 6C, EC sensor 554A is shown as deactivated (and farther away from object under test 658 compared to the other sensors). In contrast, sensor 554N is shown as active. The user can accept the proposed probe activation configuration that is automatically provided, or, in one example, the user can override the automatic indication and manually activate or deactivate the EC sensor. Once the sensor configuration and corresponding test zones are established, the probe location and the EC sensor selected to be activated can be stored, for example, to facilitate subsequent test operations. Alternatively (or in addition), a user interface similar to the example of FIG. 6C or other examples herein can be provided to facilitate testing in an "online" manner.

[0030] FIG. 6D generally illustrates a further illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user, the illustrative example of FIG. 6D defining an overall EC inspection configuration, such as facilitating respective inspection operations using different EC probe assemblies. The sequence of selecting a probe, establishing a probe location relative to the object under test, and selecting an activated sensor may be performed for a variety of different ECA probe assembly configurations. In general, an EC inspection protocol may include multiple scans corresponding to different sensor configurations and positions to achieve a desired inspection coverage. For example, as illustratively shown in FIG. 6D, an overall inspection configuration may be established or selected by a user in a selection pane 692, and the corresponding selected probe assemblies, probe assembly positions, active EC sensors, or other attributes may be graphically depicted in relation to the object under test 658, as shown in a probe configuration view 694. For example, for a selected test configuration, models and corresponding visual representations of eight different probe assemblies 650A, 650B, 650C, 650D, 650E, 650F, 650G, and 650H may be displayed relative to the object under test 658. Probe attributes such as selected EC sensors to be activated or deactivated may be displayed similar to other examples herein, and a simplified probe number may be displayed to assist in identifying each probe (e.g., "8" in relation to the first probe assembly 650A). The configurations shown in the configuration view 694 may correspond to test operations performed simultaneously by different probes attached to respective fixtures, facilitating the testing of all display areas along the object under test 658 in as little as a single pass. The configurations selected in the selection pane 692 may be stored to be retrieved by the automated or semi-automated test equipment for use in controlling the test operations. For example, a user may provide an input selecting a desired test configuration, and a test operation may be triggered using the corresponding test configuration.

[0031] FIG. 7 generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 7 defining an inspection result reporting context. Stored inspection configuration data, as established or modified using other examples herein, may also be used to facilitate visualization or reporting of inspection results. For example, the location of the ECA probe assembly is established as part of the inspection configuration, so that the ECA probe assembly and corresponding sensor locations are known relative to the contours of the object under test 658. Thus, recorded inspection results corresponding to individual sensors, groups of sensors, or probe assemblies may be correlated with such location information to overlay a representation of a flaw, defect, or other feature on a visual representation of the object under test 658. For example, in a first view 796A (e.g., an end view) of the object under test, the first location 760A may be highlighted (e.g., using a color, texture, or shading that provides an indication of the flaw or defect location). In another view 796B, such as an elevation or side view of the object under test 658, the corresponding indication in the second location 760B can be highlighted. In this way, potential flaw or defect locations can be localized along the actual object under test 658, such as during or after the inspection operation. The visualization in FIG. 7 is not limited to eddy current inspection data. For example, acoustic inspection results can also be superimposed, such as showing the flaw or defect highlighted at 761A in the first view 796A and highlighted at 761B in the second view 796B. Inspection results (e.g., suspected flaw or defect locations) can also be shown in a tabular format, as generally illustrated in the bottom pane of FIG. 7.

[0032] FIG. 8 generally illustrates a technique 800, such as a machine-implemented method, that may include indicating each of the eddy current sensors to assist and actuate an inspection operation, such as using a received model. At 805, a model defining an outline of an object under test may be received. As described above, such a model may include a data structure including a point cloud representation or other representation. At 810, a model of an eddy current array probe may be received, such as including a data structure including a point cloud representation or other representation. The models described above may be selected or established by a user, such as stored, and the machine-implemented method may receive such models by retrieving them from storage in response to a user selection. At 815, an indication of a location of the ECA probe (e.g., a location of a model representing the ECA probe) relative to the object under test (e.g., a model of the object under test, or at least a portion thereof) may be received. Receiving such an indication may include retrieving data indicative of a stored location, such as using a graphical user interface, as shown and described in connection with other examples herein, or receiving a user input to orient or position a representation of the ECA probe relative to the object under test. At 825, each of the eddy current sensors among the plurality of eddy current sensors of the ECA probe may be indicated as active (e.g., indicated as activated during a corresponding inspection operation). Such indication may be implemented using a received model defining the contour of the object under test, a received model of the ECA probe, and a received indication of the location of the ECA probe. For example, such indication may be the result of one or more criteria, such as using a normal vector, and the respective EC sensor distance from the object under test, as described elsewhere herein. Optionally, as shown at 830, a presentation for the user may be generated indicating the location of the ECA probe, including the location of at least one spacer, including whether the at least one spacer is within a specified trajectory. Such an approach may assist the user in guiding the probe location to a nominal probe location.The stored locations of the ECA probe relative to the object under test can also be used to generate a presentation of the inspection results, such as overlaying flaw or defect locations onto a representation of the object under test.

[0033] 9 illustrates an example block diagram comprising a machine 900 on which any one or more of the techniques (e.g., methodologies) discussed herein may be implemented. The machine 900 (e.g., a computer system) may include a hardware processor 902 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 904, and a static memory 906, which are connected via an interlink 930 (e.g., a link or bus), and some or all of these components may constitute hardware for the systems and related implementations discussed above.

[0034] Specific examples of main memory 904 include semiconductor memory devices that may include storage locations in a semiconductor, such as Random Access Memory (RAM) and registers. Specific examples of static memory 906 include non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices, magnetic disks, such as internal hard disks and removable disks, magneto-optical disks, RAM, or optical media, such as CD-ROM and DVD-ROM disks.

[0035] The machine 900 may further include a display device 910, an input device 912 (e.g., a keyboard), and a user interface (UI) navigation device 914 (e.g., a mouse). In one example, the display device 910, the input device 912, and the UI navigation device 914 may be touch screen displays. The machine 900 may further include a mass storage device (e.g., a drive unit) 908, a signal generating device 918 (e.g., a speaker), a network interface device 920, and one or more sensors 916, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensor. The machine 900 may include an output controller 928, such as a serial (e.g., Universal Serial Bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, for communicating with or controlling one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0036] The mass storage device 908 may comprise a machine-readable medium 922 on which is stored one or more sets of data structures or instructions 924 (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein. The instructions 924 may also reside, completely or at least partially, within the main memory 904, within the static memory 906, or within the hardware processor 902 during execution thereof by the machine 900. In one example, one or any combination of the hardware processor 902, the main memory 904, the static memory 906, or the mass storage device 908 comprises a machine-readable medium.

[0037] Specific examples of machine-readable media include one or more of non-volatile memory, such as semiconductor memory devices (e.g., EPROM or EEPROM) and flash memory devices, magnetic disks, such as internal hard disks and removable disks, magneto-optical disks, RAM, or optical media, such as CD-ROM and DVD-ROM disks. Although the machine-readable medium is illustrated as a single medium, the term "machine-readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database, or associated caches and servers) configured to store one or more instructions 924.

[0038] The apparatus of the machine 900 includes one or more of a hardware processor 902 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 904 and static memory 906, a sensor 916, a network interface device 920, an antenna, a display device 910, an input device 912, a UI navigation device 914, a mass storage device 908, an instruction device 924, a signal generation device 918, or an output controller 928. The apparatus may be configured to perform one or more of the methods or operations disclosed herein.

[0039] The term "machine-readable medium" includes any medium capable of storing, encoding, or carrying instructions for execution by the machine 900, causing the machine 900 to perform any one or more of the techniques of this disclosure, or causing another device or system to perform any one or more of the techniques, or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media include solid-state memory, and optical or magnetic media. Specific examples of machine-readable media include non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices, magnetic disks, such as internal hard disks and removable disks, magneto-optical disks, random access memory (RAM), or optical media, such as CD-ROM disks and DVD-ROM disks. In some embodiments, the machine-readable medium includes a non-transitory machine-readable medium. In some embodiments, the machine-readable medium includes a machine-readable medium that is not a transitory propagating signal.

[0040] The instructions 924 may be transmitted or received over a communications network 926 using a transmission medium via the network interface device 920, for example, utilizing any one of a number of transmission protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Exemplary communication networks include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile telephone networks (e.g., cellular networks), Plain Old Telephone (POTS) networks, and wireless data networks (e.g., the Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi®), the IEEE 802.15.4 family of standards, the Long Term Evolution (LTE) 4G or 5G family of standards, the Universal Mobile Telecommunications System (UMTS) family of standards, peer-to-peer (P2P) networks, and satellite networks, among others.

[0041] In one example, network interface device 920 includes one or more physical jacks (e.g., Ethernet, coaxial, or interconnect) or one or more antennas for accessing communication network 926. In one example, network interface device 920 includes one or more antennas that communicate wirelessly using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. In some embodiments, network interface device 920 communicates wirelessly using multi-user MIMO technology. The term "transmission medium" should be understood to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 900, including digital or analog communication signals or other intangible media for facilitating communication of such software.

[0042] Various notes Each of the above non-limiting aspects may stand alone or may be combined in various permutations or combinations with one or more of the other aspects or other subject matter described herein.

[0043] The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are also generally referred to as "examples". Such examples may include elements in addition to those shown or described. However, the inventors also contemplate examples in which only the elements shown or described are provided. Furthermore, the inventors also contemplate examples that use any combination or permutation of those elements (or one or more aspects thereof) shown or described with respect to a particular example (or one or more aspects thereof) or with respect to other examples (or one or more aspects thereof) shown or described herein.

[0044] In the event of a conflict of usage between this document and any document so incorporated by reference, the usage in this document shall control.

[0045] In this document, the terms "a" or "an" are used to include one or more, as is common in patent documents, regardless of any other instance or usage of "at least one" or "one or more." In this document, the term "or" is used to refer to a non-exclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain English equivalents of the terms "comprising" and "wherein," respectively. Also, in the following claims, the terms "including" and "comprising" are not limiting, i.e., a system, device, article, composition, formulation, or process that includes elements in addition to those recited after such terms in the claim are still considered to be within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels and are not intended to impose numerical requirements on their objects.

[0046] The method embodiments described herein may be at least partially implemented by a machine or computer. Some examples may include a computer-readable medium or machine-readable media encoded with instructions operable to configure an electronic device to perform the methods described in the above examples. Implementations of such methods may include code, such as microcode, assembly language code, higher level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Such instructions may be read and executed by one or more processors to enable performance of operations including the methods, for example. The instructions may be in any suitable form, such as, but not limited to, source code, compiled code, interpreted code, executable code, static code, dynamic code, etc. Furthermore, in one example, the code may be tangibly stored in one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer readable media include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), and the like.

[0047] The above description is intended to be illustrative and not limiting. For example, the examples described above (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, for example, by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to enable the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be construed as intending that an unclaimed disclosed feature is essential to any claim. Rather, the subject matter of the invention may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are incorporated into the Detailed Description as an example or embodiment, and it is contemplated that each claim stands alone as a separate embodiment, and that such embodiments can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. [Explanation of symbols]

[0048] 100 Non-destructive Inspection System 102 Processor Circuit 104 Memory Circuit 110 Display 112 Input Devices 120 Wireless communication interface 122 Front-end circuit 130 Multi-Conductor Interconnect 132 Laptop 140 Test Equipment 150 Modular Probe Assembly 152 Eddy Current (EC) Transducer Array 154 EC sensor 158 Target 160 Wounds 250 Eddy Current Array (ECA) Probe Assembly 254 EC sensor 258 Test object 262 Spacer 264 Flexible substrate 266 Rigid part 268 Inspection Fixture 268 Fixtures 370 Sensor Configuration Area 372 Coverage Control Area 374 Probe Position Display 442 Normal Vector 450 Test Probe Assembly 454 EC sensor 458 Test object 462 Spacer 542 Normal Vector 550 ECA Probe Assembly 554 EC sensor 562 Spacer 576 Probe Display Pane 578 Test Object Selection Pane 650 First Probe Assembly 658 Test object 673 Position Control Pane 674 Probe Position Display 680 Sensor Group Pane 688 Inspection Zone Pane 690 Inspection Zone 692 Selection Pane 694 Probe Configuration View 796 Views 900 Machines 902 Hardware Processor 904 Main memory 906 Static Memory 908 Mass Storage Devices 910 Display Device 912 Input Devices 914 User interface (UI) navigation devices 916 Sensors 918 Signal Generating Device 920 Network Interface Device 922 Machine-readable media 924 command 926 Communication Network 928 Output Controller 930 Interlink

Claims

1. 1. A machine implementation method for supporting eddy current (EC) inspection, the machine implementation method comprising: Receiving a model defining a contour of an object under test; receiving a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors; receiving an indication of a location of the ECA probe relative to a location of the object under test; In response, indicating each of the eddy current sensors to be activated among the plurality of eddy current sensors using the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

2. The machine-implemented method of claim 1 including generating a presentation for a user that identifies the indicated each of the eddy current sensors to be activated.

3. 3. The machine implementation method of claim 1 or 2, wherein the received model defining the ECA probe defines a plurality of spacers, the plurality of spacers establishing a specified standoff distance between the plurality of eddy current sensors and the object under test when each of the plurality of spacers is in contact with the object under test.

4. the location of the ECA probe including a location of at least one of the spacers among the plurality of spacers; 4. The machine-implemented method of claim 3, further comprising generating a presentation for a user indicating whether the at least one of the spacers in the plurality of spacers is within a specified trajectory.

5. 5. The machine-implemented method of claim 1, wherein the indicating of each of the plurality of eddy current sensors to be activated comprises determining an orientation of each of the eddy current sensors relative to the contour of the object under test in accordance with the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

6. 6. The machine-implemented method of claim 5, wherein the indicating each of the plurality of eddy current sensors to be activated includes determining a respective vector extending in a direction perpendicular to a plane of each of the eddy current sensors.

7. 7. The machine-implemented method of claim 6, wherein indicating each of the plurality of eddy current sensors to be activated includes indicating each of the others of the eddy current sensors to be deactivated, each of the others of the eddy current sensors having a respective normal vector that cannot intersect with the contour of the object under test according to the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

8. 7. The machine-implemented method of claim 6, wherein the indicating each of the plurality of eddy current sensors to be activated includes indicating each of the others of the eddy current sensors to be deactivated, each of the others of the eddy current sensors having a respective normal vector associated with a trajectory along the contour of the object under test having a curvature that exceeds a specified threshold in accordance with the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

9. The machine implemented method of any one of claims 1 to 8, comprising triggering an inspection operation with an ECA probe array using the indicated each of the eddy current sensors in the plurality of eddy current sensors.

10. 10. A machine-implemented method according to any one of claims 1 to 9, comprising generating a presentation of results of inspection operations performed using the indicated each of the plurality of eddy current sensors, comprising graphically overlaying an indication of inspection results on a representation of the model defining the contour of the object under test.

11. The machine-implemented method of claim 10 , comprising presenting at least two different views of the representation of the object under test.

12. A machine implemented method according to any preceding claim, comprising receiving an indication of a model of an eddy current array (ECA) probe from among a plurality of ECA probe configurations and corresponding models.

13. The machine-implemented method of claim 12 , wherein the indication is a user selection.

14. The machine mounting method according to any one of claims 1 to 13, wherein the object under test is a railway rail.

15. 1. A system for supporting eddy current (EC) inspection, the system comprising: A processor circuit; a display communicatively coupled to the processor circuit; and A user input communicatively coupled to the processor circuit; and A memory circuit containing instructions that, when executed by the processor circuit, cause the processor circuit to: receiving a model defining a contour of an object under test; receiving a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors; receiving an indication of a location of the ECA probe relative to a location of the object under test using the user input; and and a memory circuit that in response generates a presentation for the display indicating each activated eddy current sensor among the plurality of eddy current sensors using the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

16. 16. The system of claim 15, wherein the instructions include instructions to store an EC inspection configuration including data indicative of each of the eddy current sensors to be activated and including data indicative of the location of the ECA probe relative to the location of the object under test.

17. The system of claim 16 , wherein the instructions include instructions for storing a plurality of EC inspection configurations corresponding to respective ECA probe definitions and corresponding locations.

18. at least one ECA probe and corresponding EC inspection tool; 18. The system of claim 16 or 17, wherein the EC test instrument is configured to use at least one stored EC test configuration to perform an EC test.

19. A plurality of ECA probes are provided, 20. The system of claim 18, wherein the EC test instrument is configured to use respective stored EC test configurations to perform the EC test using multiple ECA probes simultaneously.

20. 20. The system of claim 18 or 19, wherein the at least one stored EC inspection configuration comprises a data structure defining a probe identification, a probe location, and the respective eddy current sensor to be activated among the plurality of eddy current sensors.

21. the object under test is translated relative to the at least one ECA probe; 21. The system of claim 18, wherein the system comprises at least one actuator for positioning the at least one ECA probe at an indicated location of the ECA probe relative to a pre-established location of the object under test.

22. The system of any one of claims 15 to 21, wherein the instructions include instructions for generating a presentation of results of an inspection operation performed using the indicated each of the plurality of eddy current sensors, the instructions including graphically overlaying an indication of inspection results on a representation of the model defining the contour of the object under test.

23. The system according to any one of claims 15 to 22, wherein the object under test is a railway rail.

24. 1. A system for supporting eddy current (EC) inspection, the system comprising: means for receiving a model defining an outline of an object under test and a model of an eddy current array (ECA) probe, the model of the ECA probe defining spatial locations of a plurality of eddy current sensors; means for receiving an indication of a location of the ECA probe relative to a location of the object under test; and means for indicating each eddy current sensor to be activated among the plurality of eddy current sensors using the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

25. 25. The system of claim 24, comprising means for performing an EC inspection operation with an ECA probe array using the indicated each of the eddy current sensors in the plurality of eddy current sensors.

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