Optical communication system with simple remote optical power supply

Abstract

An electro-optical chip includes a plurality of transmit macros, each of the transmit macros including an optical waveguide and a plurality of ring resonators disposed along the optical waveguide. An optical distribution network is implemented on the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network transmits a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of the light transmitted to the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to an optical waveguide in a corresponding one of the plurality of transmit macros. The electro-optical chip is optically connected to a remote optical power supply.

Description

[Technical field]

[0001]

[0002] The disclosed embodiments relate to optical data communications. [Background technology]

[0003]

[0004] Optical data communication systems operate by modulating laser light to encode a digital data pattern. The modulated laser light is transmitted from a sending node to a receiving node through an optical data network. Upon reaching the receiving node, the modulated laser light is demodulated to obtain the original digital data pattern. Thus, the implementation and operation of optical data communication systems depends on having a reliable and efficient laser source. It is also desirable for the laser source of an optical data communication system to have a minimal form factor and be designed as efficiently as possible in terms of cost and energy consumption. It is in this context that the embodiments disclosed herein arise. Summary of the Invention

[0005] In one example embodiment, an electro-optical chip is disclosed. The electro-optical chip includes a plurality of transmitter macros. Each of the plurality of transmitter macros includes an optical waveguide and a plurality of ring resonators disposed along the optical waveguide. The plurality of ring resonators are disposed within an evanescent optical coupling distance of the optical waveguide. The electro-optical chip further includes an optical distribution network implemented on the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network is configured to transmit a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of the light transmitted to the plurality of optical inputs. Each of the plurality of optical outputs is optically coupled to an optical waveguide in a corresponding one of the plurality of transmitter macros.

[0006] In one example embodiment, an optical data communication system is disclosed. The optical data communication system includes an optical power supply. The optical power supply includes a plurality of lasers. Each of the plurality of lasers is configured to generate and output a continuous wave optical beam of a different one of a plurality of wavelengths such that the continuous wave optical beams output by the plurality of lasers collectively include all of the plurality of wavelengths. The optical data communication system further includes an electro-optic chip that is separate and apart from the optical power supply. The electro-optic chip includes a plurality of transmitter macros. Each of the plurality of transmitter macros includes an optical waveguide and a plurality of ring resonators disposed along the optical waveguide. The plurality of ring resonators are disposed within an evanescent optical coupling distance of the optical waveguide. The electro-optic chip further includes an optical distribution network implemented on the electro-optic chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network is configured to transmit a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of the light transmitted to the plurality of optical inputs. Each of the plurality of optical outputs of the optical distribution network is optically connected to an optical waveguide in a corresponding one of the plurality of transmit macros. The optical data communication system further comprises an optical network configured to optically transmit the continuous wave optical beams output by the plurality of lasers in the optical power supply to each of the plurality of optical inputs of the optical distribution network in the electro-optical chip. Each of the plurality of optical inputs of the optical distribution network is connected to receive a different one of the continuous wave optical beams output by the plurality of lasers.

[0007] In an example embodiment, a method for generating modulated optical data communication signals is disclosed. The method comprises operating an optical power supply to generate a plurality of continuous wave optical beams, each of the plurality of continuous wave optical beams having a different wavelength. The method further comprises communicating the plurality of continuous wave optical beams from the optical power supply to an electro-optic chip that is separate and apart from the optical power supply. The method further comprises operating the electro-optic chip to multiplex the plurality of continuous wave optical beams onto an optical waveguide in the electro-optic chip such that all wavelengths of the plurality of continuous wave optical beams are coupled into the optical waveguide. The method further comprises communicating the optical waveguide through the plurality of continuous wave optical beams to an optical transmitter portion of an optical macro in the electro-optic chip. The method further comprises operating the optical transmitter portion of the optical macro in the electro-optic chip to modulate one or more of the continuous wave optical beams from within the optical waveguide to generate one or more modulated optical signals conveying digital data.

[0008] In an example embodiment, an electro-optical chip is disclosed. The electro-optical chip includes a plurality of transmitter macros. Each of the plurality of transmitter macros includes an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide. The electro-optical chip includes an optical distribution network implemented on the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network is configured to transmit a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs such that the light transmitted to one or more of the plurality of optical outputs includes wavelengths of light transmitted to the subset of the plurality of optical inputs. The subset of the plurality of optical inputs includes at least two of the plurality of optical inputs. Each of the plurality of optical outputs is optically coupled to an optical waveguide in a corresponding one of the plurality of transmitter macros.

[0009] In one example embodiment, an optical data communication system is disclosed. The optical data communication system includes an optical power supply including a plurality of lasers. Each of the plurality of lasers is configured to generate and output a continuous wave optical beam of a different one of a plurality of wavelengths such that the continuous wave optical beam output by the plurality of lasers collectively includes all of the plurality of wavelengths. The optical data communication system further includes an electro-optic chip that is separate and apart from the optical power supply. The electro-optic chip includes a plurality of transmit macros. Each of the plurality of transmit macros includes an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide. The electro-optic chip includes an optical distribution network implemented on the electro-optic chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network is configured to transmit a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs such that light transmitted to each of the one or more of the plurality of optical outputs includes the wavelengths of light transmitted to the subset of the plurality of optical inputs. The subset of the plurality of optical inputs includes at least two of the plurality of optical inputs. Each of the plurality of optical outputs of the optical distribution network is optically connected to an optical waveguide in a corresponding one of the plurality of transmit macros. The optical data communication system further includes an optical network configured to optically transmit the continuous wave optical beams output by the plurality of lasers in the optical power supply to each of the plurality of optical inputs of the optical distribution network in the electro-optical chip. Each of the plurality of optical inputs of the optical distribution network is connected to receive a different one of the continuous wave optical beams output by the plurality of lasers.

[0010] In one example embodiment, a method is disclosed for generating a modulated optical data communication signal. The method comprises operating an optical power supply to generate a plurality of continuous wave optical beams, each of the plurality of continuous wave optical beams having a different wavelength. The method further comprises communicating the plurality of continuous wave optical beams from the optical power supply to an electro-optic chip that is separate and apart from the optical power supply. The method further comprises operating the electro-optic chip to multiplex at least a subset of the plurality of continuous wave optical beams onto an optical waveguide within the electro-optic chip such that at least a subset of the wavelengths of the plurality of continuous wave optical beams are coupled to the optical waveguide. The subset of wavelengths of the plurality of continuous wave optical beams includes at least two different wavelengths of continuous wave light. The method further comprises communicating at least a subset of the plurality of continuous wave optical beams through the optical waveguide to an optical transmitter portion of an optical macro within the electro-optic chip. The method further includes operating an optical transmitter portion of the optical macro in the electro-optical chip to modulate one or more of the continuous wave optical beams from within the optical waveguide to generate one or more modulated optical signals that convey digital data.

[0011] Other aspects and advantages of the disclosed embodiments will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate disclosed embodiments. [Brief description of the drawings]

[0012] [Figure 1A] FIG. 2 illustrates an example block-level architecture of a system implementing an electro-optical chip in accordance with some embodiments.

[0013] [Figure 1B] 1B is a vertical cross-sectional view of the substrate of FIG. 1A according to some embodiments.

[0014] [Diagram 2] 2 is an organizational diagram illustrating an example of an electro-optical chip as referred to herein according to some embodiments.

[0015] [Diagram 3] 1 illustrates an example layout of an electro-optical chip, according to some embodiments.

[0016] [Figure 4] 4A-4C illustrate example layouts of a given one of the light macros according to some embodiments.

[0017] [Figure 5A] 1 illustrates a first computer system optically connected to a second computer system through an optical link according to some embodiments.

[0018] [Figure 5B] 2 illustrates in greater detail an optical connection between an electro-optical chip of a first computer system and an electro-optical chip of a second computer system, according to some embodiments.

[0019] [Figure 6A] 1 illustrates an example of a remote optical power supply for an optical data communication system in accordance with some embodiments.

[0020] [Figure 6B] 1 illustrates how each of the optical fibers of an M-port optical fiber array receives a respective one of multiple wavelengths (λ1 to λN) of continuous wave laser light from a remote optical power supply, according to some embodiments.

[0021] [Figure 6C] FIG. 2 illustrates an example of an electro-optic chip connected to an M-port fiber array containing optical fibers, according to some embodiments.

[0022] [Figure 7A] 1 illustrates an example of an electro-optic chip implementing an N×M optical distribution network on an electro-optic chip in accordance with some embodiments.

[0023] [Figure 7B] FIG. 2 illustrates an example of an optical distribution network configured to deliver CW light of a subset of N wavelengths (λ1 to λN) to each of one or more of M optical outputs in accordance with some embodiments.

[0024] [Figure 7C] 1 illustrates an example of an optical distribution network configured to implement two 4×4 optical multiplexing functions, where N=8 and M=8, in accordance with some embodiments.

[0025] [Figure 8A] 1 illustrates a high-bandwidth, multi-wavelength WDM optical data communications system in accordance with some embodiments.

[0026] [Figure 8B] 1 illustrates continuous wave laser light of each of N wavelengths (λ1 through λN) output from a laser array and delivered by N optical fibers to an electro-optic chip, in accordance with some embodiments.

[0027] [Figure 9A] 1 illustrates a remote optical power supply implementing a lens array in accordance with some embodiments.

[0028] [Figure 9B] 9B is a perspective view of the remote optical power supply of FIG. 9A according to some embodiments.

[0029] [Figure 9C] 9B is a side view of the remote optical power supply of FIG. 9A according to some embodiments.

[0030] [Figure 10] 4 is a flow chart illustrating a method for generating a modulated optical data communication signal in accordance with some embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] In the following description, numerous specific details are set forth in order to provide an understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that the present invention may be practiced without some or all of these specific details. Additionally, detailed descriptions of well-known process operations are omitted in order to avoid unnecessarily obscuring the present invention.

[0032] The present invention relates to optical data communications. High bandwidth, multi-wavelength WDM (wavelength division multiplexing) systems are necessary to meet increasing interconnect bandwidth requirements. In some embodiments of these WDM systems, a laser source comprises a remote laser array configured to generate multiple wavelengths of continuous wave (CW) laser light that are combined through an optical distribution network to provide multiple wavelengths of laser light to each of many optical output ports of the laser source. The multiple wavelengths of laser light are transmitted from any one or more of the optical output ports of the laser source to an electro-optical chip (such as a CMOS (complementary metal oxide semiconductor) and / or SOI (silicon-on-insulator) photonic / electronic chip) that transmits and receives data in an optical data communications system. In some embodiments, a multi-wavelength laser source comprises an array of lasers having outputs optically connected to respective optical inputs of an optical distribution network that routes the CW laser light of each input wavelength to each of the multiple optical output ports of the optical distribution network. The multiple wavelengths of CW laser light are then routed from a given optical output port of the optical distribution network to a given optical input feed port of the electro-optical chip.

[0033] In some embodiments, the multi-wavelength laser source comprises an array of lasers having outputs optically connected to respective optical fibers. Each laser in the array of lasers is configured to generate CW laser light of a single wavelength. And, each laser in the array of lasers is configured to generate a CW of a different wavelength than the other lasers in the array of lasers. In these embodiments, the optical fibers convey the CW laser light of each wavelength to a respective optical supply input of the electro-optic chip. The optical supply inputs of the electro-optic chip are optically connected to an optical distribution network on the electro-optic chip. Each of the multiple optical inputs of the optical distribution network is optically connected to receive the CW laser light of each wavelength from each laser in the array of lasers of the multi-wavelength laser source via a respective optical fiber. The optical distribution network on the electro-optic chip is configured to route the CW laser light of each input wavelength to each of the multiple optical outputs of the optical distribution network such that each of the multiple wavelengths of CW laser light received across the multiple optical inputs of the optical distribution network is conveyed to each of the multiple optical outputs of the optical distribution network. The multiple wavelengths of CW laser light are then routed from a given optical output of the optical distribution network on the electro-optic chip to an optical feed input of a transmitter portion of a given optical macro within the electro-optic chip.

[0034] FIG. 1A illustrates an example of a block-level architecture of a system 100 implementing an electro-optical chip 101 according to some embodiments. In some embodiments, the electro-optical chip 101 is a TeraPHY™ chip manufactured by Ayar Labs, Inc., Santa Clara, Calif., as described in U.S. Patent Application No. 17 / 184,537, which is incorporated herein by reference in its entirety for all purposes. The system 100 illustrates a general representation of a multi-chip package (MCP) that is implemented with the electro-optical chip 101. The system 100 includes the electro-optical chip 101 mounted on a substrate 103. The electro-optical chip 101 includes an optical interface that is optically connected to an optical link 105 through which bidirectional optical data communication with another electro-optical device (such as another electro-optical chip 101) is performed. In some embodiments, the system 100 further includes one or more integrated circuit chips 107 (semiconductor chips) mounted on the substrate 103. In various embodiments, the one or more integrated circuit chips 107 include one or more of a central processing unit (CPU), a graphics processing unit (GPU), a visual processing unit (VPU), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a memory chip, an HBM stack, an SoC, a microprocessor, a microcontroller, a digital signal processor (DSP), an accelerator chip, and / or essentially any other type of semiconductor chip. In various embodiments, the substrate 103 is an organic package and / or an interposer. In some embodiments, the substrate 103 comprises electrical connections / wiring 109 between the electro-optical chip 101 and the one or more integrated circuit chips 107. In some embodiments, the electrical connections / wiring 109 are formed in a redistribution layer (RDL) formed in the substrate 103. In various embodiments, the RDL structure is implemented according to essentially any RDL structure topology and technology available within the semiconductor packaging industry.Some of the electrical connections / wirings 109 in the substrate 103 are configured and utilized to provide power and a reference ground potential to the electro-optical chip 101 and each of the one or more semiconductor chips 107. Additionally, some of the electrical connections / wirings 109 in the substrate 103 are configured and utilized to transmit electrical signals that provide bidirectional digital data communication between the electro-optical chip 101 and the one or more semiconductor chips 107. In various embodiments, digital data communication through the electrical connections / wirings 109 between the electro-optical chip 101 and the one or more semiconductor chips 107 is performed in accordance with a digital data interconnect standard, such as the Peripheral Component Interconnect Express (PCIe) standard, the Compute Express Link (CXL) standard, the Gen-Z standard, the Open Coherent Accelerator Processor Interface (OpenCAPI), and / or the Open Memory Interface (OMI), among essentially any digital data interconnect standard.

[0035] The system 100 further comprises an optical power supply 111 optically connected to supply one or more controlled wavelengths of CW laser light to the electro-optic chip 101. In some embodiments, the optical power supply 111 is a SuperNova multi-wavelength multi-port optical supply from Ayar Labs. The optical power supply 111 supplies CW light that provides optical power to the electro-optic chip 101. In some embodiments, the optical power supply 111 is configured as a photonic integrated circuit (PIC) that generates multiple wavelengths of CW light for transmission to multiple corresponding CW light input ports of the electro-optic chip 101, multiplexes the multiple wavelengths of CW light onto a common optical fiber or optical waveguide, and splits and amplifies the multiplexed optical power to multiple output ports of the optical power supply 111. In some other embodiments, the optical power supply 111 is configured as an array of lasers, where each laser in the array of lasers is configured to generate a respective wavelength of CW laser light. In these embodiments, the CW laser light generated by a given one of the lasers is transmitted to a corresponding one of a plurality of output ports of the optical power supply 111 for transmission to a corresponding one of a plurality of CW light input ports of the electro-optic chip 101.

[0036] In various embodiments, the optical power supply 111 is optically connected to the electro-optic chip 101 through one or more optical waveguides 113. In various embodiments, the one or more optical waveguides 113 include one or more optical fibers and / or one or more optical waveguide structures formed in the substrate 103. In some embodiments, the optical power supply 111 is optically connected to the electro-optic chip 101 through an optical fiber array including a plurality of optical fibers, where each optical fiber in the optical fiber array is connected to carry each of a plurality of wavelengths of CW light generated by the array of lasers in the optical power supply 111. In some embodiments, the optical power supply 111 is attached to the substrate 103. In some embodiments, the optical power supply 111 receives electrical power and electrical control signals through electrical connections / wiring formed in the substrate 103. Alternatively, in some embodiments, the optical power supply 111 is implemented as a device that is physically separate from the substrate 103. In some of these embodiments, the optical power supply 111 is physically separate from the electro-optic chip 101. In some of these embodiments, the optical power supply 111 is optically connected to the electro-optical chip 101 through one or more optical fibers optically connected to the substrate 103 and one or more optical waveguides formed within the substrate 103.

[0037] 1B is a vertical cross-sectional view of the substrate 103 of FIG. 1A according to some embodiments. In some embodiments, the electrical connections / wirings 109 of the RDL structure are formed on multiple levels of the substrate 103. In some embodiments, the electrical connections / wirings 109 comprise conductive via structures formed to provide electrical connections between electrical traces formed on different levels of the substrate 103, as represented by the vertical lines between the electrical connections / wirings 109 on different levels in FIG. 1B. It should be understood that in various embodiments, the electrical connections / wirings 109 are configured in essentially any manner as needed to provide the electrical connections required between the one or more integrated circuit chips 107 and the electro-optical chip 101, provide electrical power to each of the one or more integrated circuit chips 107 and the electro-optical chip 101, and provide a reference ground potential connection to each of the one or more integrated circuit chips 107 and the electro-optical chip 101.

[0038] FIG. 2 is an organizational diagram illustrating an example of an electro-optic chip 101 referred to herein, according to some embodiments. The organizational diagram has an electrical interface 201 that is isolated (separated) from a photonic interface 203. The photonic interface 203 is configured to optically couple with an optical fiber array. In the example of FIG. 2, the electrical interface 201 is on the left side of the electro-optic chip 101, and the photonic interface 203 is on the right side of the electro-optic chip 101. A plurality of (1 to N) optical macros 205-1 to 205-N are disposed between the photonic interface 203 and the electrical interface 201. The electrical interface 201 is connected to the optical macros 205-1 to 205-N by glue logic 207. The electrical interface 201 of the electro-optic chip 101 is compatible with the logic of the integrated circuit chip to which the electro-optic chip 101 is connected. In the example of FIG. 2, the data flow from electronics to optical devices is from left to right, and the data flow from optical to electronic is from right to left.

[0039] The electrical interface 201 is a block of circuitry configured to handle all electrical I / O to and from integrated circuit chips to which the electro-optical chip 101 is connected, such as an Ethernet switch chip / die or other type of integrated circuit chip. The optical macros 205-1 to 205-N are responsible for converting data signals between the optical domain and the electrical domain. Specifically, each of the optical macros 205-1 to 205-N is configured to convert electrical data signals received through the electrical interface 201 to optical data signals for transmission through the photonic interface 203. Also, each of the optical macros 205-1 to 205-N is configured to convert optical data signals received through the photonic interface 203 to electrical data signals for transmission through the electrical interface 201. The photonic interface 203 is responsible for coupling optical signals to and from the optical macros 205-1 to 205-N. The glue logic 207 enables flexible (dynamic or static) mapping of the electrical interface 201 to the optical macros 205-1-205-N and associated optical wavelengths. Thus, the glue logic 207 (also referred to as a crossbar circuit) provides dynamic routing of electrical signals between the optical macros 205-1-205-N and the electrical interface 201. The glue logic 207 also provides retiming, rebuffering, and flit reorganization functionality at the physical layer level. In some embodiments, the glue logic 207 also performs various error correction and data level link protocols to offload some processing from the integrated circuit chips to which the electro-optical chip 101 is connected.

[0040] FIG. 3 illustrates an example layout of electro-optic chip 101, according to some embodiments. The layout of the optical and electrical components of electro-optic chip 101 is designed to optimize area efficiency, energy efficiency, performance, and implementation considerations (such as avoiding optical waveguide crossings). In some embodiments, electrical interface 201 is laid out along one chip edge (left edge in FIG. 3 ) and photonic interface 203 for optically coupling to the optical fiber array is laid out along the opposite chip edge (right edge in FIG. 3 ). In some embodiments, photonic interface 203 comprises an optical grating coupler for each of the optical fibers in the optical fiber array. In various embodiments, photonic interface 203 comprises a vertical optical grating coupler, an edge optical coupler, or essentially any other type of optical coupler device, or a combination thereof, to enable optical coupling between the optical fibers in the optical fiber array and optical macros 205-1 to 205-N. In some embodiments, photonic interface 203 is configured to interface with 24 optical fibers in the optical fiber array. In some embodiments, photonic interface 203 is configured to interface with 16 optical fibers in an optical fiber array, although in various embodiments photonic interface 203 may be configured to interface with essentially any number of optical fibers in an optical fiber array.

[0041] The glue logic 207 routes data between the electrical interface 201 and the optical macros 205-1-205-N. The glue logic 207 includes crossbar switches and other circuits as necessary to interface the electrical interface 201 connections with the optical macros 205-1-205-N. In some embodiments, the optical transmitters (Tx) and optical receivers (Rx) of the optical macros 205-1-205-N are paired together, with each Tx / Rx pair forming an optical transceiver. The glue logic 207 enables dynamic mapping of electrical lanes / channels to optical lanes / channels. The optical macros 205-1-205-N (for data transmission (Tx) and data reception (Rx)) are laid out between the glue logic 207 and the photonic interface 203, which couples with the optical fibers of the optical fiber array. The optical macros 205-1-205-N include both optical and electrical circuits involved in converting electrical signals to optical signals and converting optical signals to electrical signals.

[0042] In some embodiments, electrical interface 201 is configured to implement an Advanced Interface Bus (AIB) protocol to facilitate an electrical interface between electro-optical chip 101 and one or more other integrated circuit chips. However, it should be understood that in other embodiments, electrical interface 201 may be configured to implement essentially any electrical data communication interface other than AIB. For example, in some embodiments, electrical interface 201 comprises a high bandwidth memory (HBM) and a Kandou Bus for serialization / deserialization of data.

[0043] In some embodiments, the electro-optic chip 101 has a length d1 and a width d2, where d1 is about 8.9 millimeters (mm) and d2 is about 5.5 mm. As used herein, the term "about" should be understood to mean + / - 10% of a given value. In some embodiments, the length d1 is less than about 8.9 mm. In some embodiments, the length d1 is greater than about 8.9 mm. In some embodiments, the width d2 is less than about 5.5 mm. In some embodiments, the width d2 is greater than about 5.5 mm. In some embodiments, the electrical interface 201 has a width d3 of about 1.3 mm. In some embodiments, the width d3 is less than about 1.3 mm. In some embodiments, the width d3 is greater than about 1.3 mm. In some embodiments, the photonic interface 203 for the optical fiber array has a length d4 of about 5.2 mm and a width d5 ​​of about 2.3 mm. In some embodiments, the length d4 is less than about 5.2 mm. In some embodiments, the length d4 is greater than about 5.2 mm. In some embodiments, the optical macros 205-1 to 205-N have a width d6 of about 1.8 mm. In some embodiments, the width d6 is less than about 1.8 mm. In some embodiments, the width d6 is greater than about 1.8 mm. In some embodiments, each pair of optical macros 205-1 to 205-N for the transmitter Tx and the receiver Rx has a length d7 of about 0.75 mm. In some embodiments, the length d7 is less than about 0.75 mm. In some embodiments, the length d7 is greater than about 0.75 mm. In some embodiments, the optical macros 205-1 to 205-N for the transmitter Tx and the receiver Rx are arranged to align with the optical fiber pitch in the photonic interface 203. In some embodiments, the length d7 of each optical macro 205-1 to 205-N (a pair of optical macros for a transmitter (Tx) and a receiver (Rx)) is matched to the pitch of optical fibers in a standard optical fiber ribbon.For example, if the optical fiber pitch is 250 micrometers and three of the optical fibers in the optical fiber ribbon correspond to one optical macro 205-1 to 205-N (one optical fiber brings CW light from the laser to the optical macro for the transmitter (Tx), one optical fiber carries modulated light from the optical macro for the transmitter (Tx), and one optical fiber brings modulated light representing encoded data to the optical macro for the receiver (Rx)), then the length d7 of the optical macro is 750 micrometers.

[0044] In some embodiments, the number N of the optical macros 205-1 to 205-N is 8. In some embodiments, the number N of the optical macros 205-1 to 205-N is less than 8. In some embodiments, the number N of the optical macros 205-1 to 205-N is greater than 8. Also, each of the optical macros 205-1 to 205-N represents at least one optical port. In some embodiments, a dual phase-locked loop (PLL) circuit is shared by each transmitter Tx / receiver Rx pair in the optical macros 205-1 to 205-N. In some embodiments, the dual PLL comprises a PLLU covering a frequency range of 24 gigahertz (GHz) to 32 GHz and a PLLD covering a frequency range of 15 GHz to 24 GHz.

[0045] The electro-optical chip 101 further comprises a management circuit 301 and a general purpose input / output (GPIO) component 303 for communicating electrical data signals to / from the electro-optical chip 101. In various embodiments, the GPIO component 303 comprises a serial peripheral interface (SPI) component and / or another type of component to enable off-chip data communication. In some embodiments, the electro-optical chip 101 also comprises a number of other circuits, such as memory (e.g., SRAM), a CPU, analog circuitry, and / or any other circuitry that can be implemented in CMOS. In some embodiments, the electro-optical chip 101 has a coarse wavelength division multiplexing 4-lane (CWDM4) configuration in which each of the optical macros 205-1 to 205-N comprises four serializer / deserializer (SerDes) slices (FR-4) or eight SerDes slices (FR-8). In some embodiments, the optical macros 205-1 to 205-N are divided into wavelength transmit (Tx) / receive (Rx) slices, with each Tx / Rx slice including a fully integrated analog Tx / Rx front-end, serialization / deserialization, clock data recovery, and micro-ring resonator thermal tuning digital control. In some embodiments, the photonic components integrated into the optical ports of each Tx / Rx slice / optical macro 205-x are based on micro-ring resonators (modulators, filters, etc.). In some embodiments, the electro-optic chip 101 optically couples to the optical fibers of the optical fiber array through an edge-coupled V-groove structure with embedded mode converters.

[0046] 4 illustrates an example layout of a given one of the optical macros 205-1 to 205-N (say optical macro 205-x) according to some embodiments. The optical macro 205-x includes M transmit (Tx) slices 401-1 to 401-M ​​and M receive (Rx) slices 403-1 to 403-M. An optical slice of the optical macro 205-x refers to either one of the optical transmit slices 401-1 to 401-M, or one of the optical receive slices 403-1 to 403-M, or a combination of one of the optical transmit slices 401-1 to 401-M ​​and a corresponding one of the optical receive slices 403-1 to 403-M, where one of the optical transmit slices 401-1 to 401-M ​​and one of the optical receive slices 403-1 to 403-M are controlled to operate with light of a single wavelength. The example layout of FIG. 4 illustrates the routing of the optical waveguide 405 and the arrangement of the optical micro-ring resonators 407-1 to 407-M in the transmit (Tx) portion of the optical macro 205-x. In some embodiments, the micro-ring resonators 407-1 to 407-M function as modulators. The example layout of FIG. 4 also illustrates the routing of the optical waveguide 409 and the arrangement of the optical micro-ring resonators 411-1 to 411-M in the receive (Rx) portion of the optical macro 205-x. In some embodiments, the micro-ring resonators 411-1 to 411-M function as photodetectors. In some embodiments, one or more of the micro-ring resonators 407-1 to 407-M and 411-1 to 411-M are controlled to function as optical multiplexers and / or optical demultiplexers.

[0047] Each corresponding pair of transmit (Tx) slices 401-1 to 401-M ​​and receive (Rx) slices 403-1 to 403-M forms a Tx / Rx slice of the optical macro 205-x. For example, Tx slice 1 401-1 and Rx slice 1 403-1 together form slice 1 of the optical macro 205-x. The transmit (Tx) slices 401-1 to 401-M ​​include electrical circuitry for directing conversion of electrical data in the form of a bit stream into a stream of modulated light by operating the micro-ring resonators 407-1 to 407-M to modulate a CW laser light of a given wavelength received from the optical supply input 413 through the optical waveguide 405 into a stream of modulated light of a given wavelength, which is transmitted from the optical macro 205-x through the optical waveguide 405 to the optical signal output 415. In some embodiments, each of the transmit (Tx) slices 401-1-401-M ​​includes electrical circuitry for in-phase and / or quadrature signal generation, an injection-locked oscillator circuit, and a phase interpolator. The receive (Rx) slices 403-1-403-M include electrical circuitry for detecting light of a given wavelength in a stream of modulated light coming from the optical signal input 417 through the optical waveguide 409 by operating the micro-ring resonators 411-1-411-M. The electrical circuitry in the receive (Rx) slices 403-1-403-M converts the light detected by the micro-ring resonators 411-1-411-M of the corresponding wavelength into a bit stream in the electrical domain. In some embodiments, each of the receive (Rx) slices 403-1 through 403-M includes electrical circuits for in-phase and / or quadrature signal generation (I / Q signal generation), an injection-locked oscillator (ILO) circuit, a phase interpolator (PI) circuit, a transimpedance amplifier (TIA) circuit, and a signal equalization (EQ) circuit. In some embodiments, the receive (Rx) slices 403-1 through 403-M utilize respective dummy microring photodetectors (PDs) for better matching at the receiver analog front-end and for robustness to common-mode noise (e.g., feed).

[0048] The optical waveguide 405 routes CW laser light from the optical supply input 413 to each of the micro-ring resonators 407-1-407-M in the transmit (Tx) slices 401-1-401-M. The optical waveguide 405 also routes modulated light from the micro-ring resonators 407-1-407-M in the transmit (Tx) slices 401-1-401-M ​​to the optical signal output 415 for transmission from the electro-optic chip 101. In some embodiments, each of the micro-ring resonators 407-1-407-M in the transmit (Tx) slices 401-1-401-M ​​is tunable to operate at a predetermined optical wavelength. Also, in some embodiments, the predetermined optical wavelength at which a given micro-ring resonator 407-x is tuned to operate is different from the predetermined wavelength at which the other micro-ring resonators 407-1-407-M other than 407-x are tuned to operate. In some embodiments, a corresponding heating device 408-1-408-M is disposed near each of the micro-ring resonators 407-1-407-M to provide thermal tuning of the resonant wavelength of the micro-ring resonator. In some embodiments, a corresponding heating device 408-1-408-M is disposed within an interior region surrounded by a given micro-ring resonator 407-x to provide thermal tuning of the resonant wavelength of the given micro-ring resonator 407-x. In some embodiments, the heating device 408-1-408-M of each of the micro-ring resonators 407-1-407-M is connected to a corresponding electrical control circuit in the corresponding transmit (Tx) slice that is operated to thermally tune the resonant wavelength of the micro-ring resonator. In some embodiments, each of the micro-ring resonators 407-1-407-M is connected to a corresponding electrical tuning circuit in the corresponding transmit (Tx) slice that is operated to electrically tune the resonant wavelength of the micro-ring resonator. In various embodiments, each of the micro-ring resonators 407-1 through 407-M operates as part of an optical modulator and / or an optical multiplexer.

[0049] The optical waveguide 409 routes input modulated light from the optical signal input 417 to the micro-ring resonators 411-1-411-M in the receive (Rx) slices 403-1-403-M. In some embodiments, each of the micro-ring resonators 411-1-411-M in the receive (Rx) slices 403-1-403-M is tunable to operate at a predetermined optical wavelength. Also, in some embodiments, the predetermined optical wavelength at which a given micro-ring resonator 411-x is tuned to operate is different than the predetermined wavelength at which the other micro-ring resonators 411-1-411-M other than 411-x are tuned to operate. In some embodiments, a corresponding heating device 412-1-412-M is disposed near each of the micro-ring resonators 411-1-411-M to provide thermal tuning of the resonant wavelength of the micro-ring resonator. In some embodiments, a corresponding heating device 412-1-412-M is disposed within an interior region surrounded by a given micro-ring resonator 411-x to provide thermal tuning of the resonant wavelength of the given micro-ring resonator 411-x. In some embodiments, the heating device 412-1-412-M of each of the micro-ring resonators 411-1-411-M is connected to a corresponding electrical control circuit in the corresponding receive (Rx) slice that is operated to thermally tune the resonant wavelength of the micro-ring resonator. In some embodiments, each of the micro-ring resonators 411-1-411-M is connected to a corresponding electrical tuning circuit in the corresponding receive (Rx) slice that is operated to electrically tune the resonant wavelength of the micro-ring resonator. In various embodiments, each of the micro-ring resonators 411-1-411-M operates as part of a photodetector and / or an optical demultiplexer.

[0050] In some embodiments, the architecture and floor plan of the optical macro 205-x can be varied by including different numbers of PLLs at various locations within the optical macro 205-x. For example, in some embodiments, a centralized PLL is placed in the clock spine and fanned out to slices on both sides of the optical macro 205-x. In various embodiments, the PLL is replicated as multiple PLLs across the optical macro 205-x, with each PLL dedicated to a given transmit (Tx) / receive (Rx) slice or shared with a portion of the transmit (Tx) / receive (Rx) slices. In various embodiments, other floor plan configurations of the optical macro 205-x include multiple columns of optical macros with pass-through photonic rows to increase edge bandwidth density, and / or transmit (Tx) and receive (Rx) optical macros that are staggered side-by-side to increase edge bandwidth density.

[0051] The optical macro 205-x comprises both photonic and electronic components. The optical waveguides 405 and 409 are laid out in the optical macro 205-x to avoid optical waveguide crossings and minimize optical waveguide length (minimize optical losses), thereby improving the energy efficiency of the system. The optical macro 205-x is laid out in such a way as to minimize the distance between the electronic and optical components to minimize the electrical trace length, which improves the energy efficiency of the optical macro 205-x, enables faster signal transmission, and reduces chip size.

[0052] The electro-optical chip 101 comprises a set of (N) optical macros 205-1 to 205-N. Each optical macro 205-x comprises a set of (M) optical transmitting slices 401-1 to 401-M ​​and optical receiving slices 403-1 to 403-M logically grouped to transmit or receive bits at a number (W) of different optical wavelengths on respective optical waveguides 405 and 409. Considering that in various embodiments, any number of optical transmitting slices 401-1 to 401-M ​​and / or optical receiving slices 403-1 to 403-M are adjustable to a given one of the number (W) of optical waveguides, the number (M) of optical transmitting slices 401-1 to 401-M ​​and optical receiving slices 403-1 to 403-M and the number (W) of different optical waveguides can be defined as needed. However, channel / wavelength contention is managed when data bits are transmitted or received by multiple resonators among the optical micro-ring resonators 407-1-407-M or multiple resonators among the optical micro-ring resonators 411-1-411-M tuned to the same optical wavelength. The floor plan and organization of the optical macro 205-x represents adjustable degrees of freedom to control the following metrics: length of the optical waveguides 405 and 409 (which directly correlates to optical loss), area of ​​the optical macro 205-x (which correlates to manufacturing cost), energy consumed per bit (energy efficiency), electrical signaling integrity (which correlates to performance), electrical package escape (amount of electrical data input and output physically available for a given set of chip dimensions and for electrical bumps of a given spacing / pitch), and optical package escape (amount of optical data input and output physically available for a given set of chip dimensions and for optical fiber of a given spacing / pitch).

[0053] FIG. 5A illustrates a first computer system 501 optically connected to a second computer system 503 through an optical link 505, according to some embodiments. In various embodiments, the first computer system 501 represents essentially any packaged semiconductor chipset including at least one integrated circuit chip 107-1 electrically connected to at least one electro-optical chip 101-1, as shown by electrical connections / wiring 109-1. In some embodiments, the at least one integrated circuit chip 107-1 and the at least one electro-optical chip 101-1 are packaged on a common substrate 103-1. The at least one electro-optical chip 101-1 is connected to receive optical power from an optical power supply 111-1 through one or more optical waveguides 113-1 (such as an optical fiber array). The at least one electro-optical chip 101-1 corresponds to the electro-optical chip 101 discussed herein. In some embodiments, the optical power supply 111-1 is the same as the optical power supply 111 described above with respect to FIG. 1A.

[0054] In various embodiments, the second computer system 503 represents essentially any packaged semiconductor chipset including at least one integrated circuit chip 107-2 electrically connected to at least two electro-optical chips 101-2 as shown by electrical connections / wiring 109-2. In some embodiments, the at least two integrated circuit chips 107-2 and the at least two electro-optical chips 101-2 are packaged on a common substrate 103-2. The at least one electro-optical chip 101-2 is connected to receive optical power from an optical power supply 111-2 through one or more optical waveguides 113-2 (such as an optical fiber array). The at least one electro-optical chip 101-2 corresponds to the electro-optical chip 101 discussed herein. In some embodiments, the optical power supply 111-2 is the same as the optical power supply 111 described above with respect to FIG. 1A. Also, in some embodiments, the optical power supplies 111-1 and 111-2 are the same optical power supply. Electro-optic chip 101-1 of first computer system 501 is optically connected to electro-optic chip 101-2 of second computer system 503 through optical link 505. In some embodiments, optical link 505 is an optical fiber array.

[0055] 5B is a diagram illustrating in more detail the optical connections between electro-optical chip 101-1 of first computer system 501 and electro-optical chip 101-2 of second computer system 503, according to some embodiments. In some embodiments, electro-optical chips 101-1 and 101-2 are each configured similarly to electro-optical chip 101 described herein. Electro-optical chip 101-1 includes at least one optical macro 205A. Electro-optical chip 101-2 includes at least one optical macro 205B. Each of optical macros 205A and 205B is configured similarly to optical macros 205-x described herein.

[0056] The optical supply input 413 of the optical macro 205A is optically connected to the optical power supply 111-1 through one or more optical waveguides 113-1. The optical signal output 415 of the optical macro 205A is optically connected to the optical signal input 417 of the optical macro 205B. In this manner, the modulated optical signals generated by the transmitting slices 401-1 to 401-M ​​of the optical macro 205A are transmitted to the receiving slices 403-1 to 403-M of the optical macro 205B. In some embodiments, the modulated optical signals generated by the transmitting slices 401-1 to 401-M ​​convey data received by the optical macro 205A from the integrated circuit chip 107-1 in the form of electrical signals. The modulated optical signals carrying data are optically coupled to the optical micro-ring resonators 411-1 to 411-M of the optical macro 205B and demodulated by the receiving slices 403-1 to 403-M of the optical macro 205B into electrical signals that are transmitted through the electrical connections / wirings 109-2 to the integrated circuit chip 107-2.

[0057] The optical supply input 413 of the optical macro 205B is optically connected to the optical power supply 111-2 through one or more optical waveguides 113-2. The optical signal output 415 of the optical macro 205B is optically connected to the optical signal input 417 of the optical macro 205A. In this manner, the modulated optical signals generated by the transmitting slices 401-1 to 401-M ​​of the optical macro 205B are transmitted to the receiving slices 403-1 to 403-M of the optical macro 205A. In some embodiments, the modulated optical signals generated by the transmitting slices 401-1 to 401-M ​​of the optical macro 205B convey data provided by the integrated circuit chip 107-2 to the optical macro 205B through the electrical connections / wirings 109-2. Modulated optical signals carrying data provided by integrated circuit chip 107-2 are optically coupled to optical micro-ring resonators 411-1 through 411-M of optical macro 205A and demodulated by receiving slices 403-1 through 403-M of optical macro 205A into electrical signals that are transmitted through electrical connection / wiring 109-1 to chip 107-1.

[0058] The electro-optic chip 101 has a small footprint due to the high density of IP building blocks on the chiplet. These IP building blocks include optical micro-ring resonators in a very small chip area that are used to multiplex and demultiplex multiple wavelengths of light onto a single waveguide and to modulate the light and act as photodetectors. In some embodiments, each of the optical micro-ring resonators of the electro-optic chip 101 has an outer diameter of less than 10 micrometers. Also, the electrical circuits that control the optical devices are tightly integrated on the same chip as the optical devices they control, allowing for a high density of IP building blocks on the chip and optimization of space efficiency.

[0059] 6A illustrates an example of a remote optical power supply 111A for an optical data communication system, according to some embodiments. The remote optical power supply 111A includes a laser array 601, an N×M optical distribution network 603, and an optional optical amplification module 605. The laser array 601 includes a plurality of (N) lasers 601-1 to 601-N, where N is greater than 1. Each laser 601-1 to 601-N outputs a different wavelength λ1 to λ2, respectively. N 6. The optical distribution network 603 is configured to generate and output CW laser light of N wavelengths generated by the plurality of laser elements 601-1 to 601-N. The optical distribution network 603 routes the laser light of each of the N wavelengths generated by the plurality of laser elements 601-1 to 601-N to a plurality (M) optical output ports 607 of the optical distribution network 603. In some embodiments, the optional optical amplification module 605 is not present and the laser light of the plurality of wavelengths (λ1 to λ2) directed to a given one of the (M) optical output ports 607 of the optical distribution network 603 is N ) CW laser light is directly transmitted to a corresponding one of the optical fibers 113-1 through 113-M of the M-port optical fiber array 113. In some embodiments, an optional optical amplifier module 605 is present to transmit multiple wavelengths (λ1 through λ2) directed to a given one of the (M) optical output ports 607 of the optical distribution network 603. N) is sent via the optical amplifier module 605 for amplification in a route to a corresponding one of the optical fibers 113-1 to 113-M of the M-port optical fiber array 113. In this manner, the remote optical power supply 111 outputs the CW laser light of the multiple wavelengths (λ1 to λ2) in each of the multiple optical fibers 113-1 to 113-M of the M-port optical fiber array 113. N ) CW laser light. In some embodiments, each of the optical fibers 113-1 to 113-M of the M-port optical fiber array 113 is operable to provide CW laser light of multiple wavelengths (λ1 to λM) received from the remote optical power supply 111. N ) to a corresponding optical feed port on the electro-optic chip 101 (e.g., to an optical feed input 413 corresponding to a transmit macro on the electro-optic chip 101, as described above with respect to FIG. 4). FIG. 6B illustrates how, according to some embodiments, each of the optical fibers 113-1 through 113-M of the M-port optical fiber array 113 receives multiple wavelengths (λ1 through λ2) from the remote optical power supply 111. N ) is received. In some embodiments, the CW laser light of multiple wavelengths (λ1 to λ N ) are output from the remote optical power supply 111 with substantially equal intensity (power). However, in some embodiments, the CW laser light having multiple wavelengths (λ1 to λ2) output from the remote optical power supply 111 may be output from the remote optical power supply 111 with substantially equal intensity (power). N The optical power level of the CW laser light of one or more wavelengths among the multiple wavelengths (λ1 to λ N ) is different from the optical power level of the CW laser light of other wavelengths.

[0060] 6C illustrates an example of an electro-optic chip 101 connected to an M-port optical fiber array 113 including optical fibers 113-1 through 113-M, in accordance with some embodiments. The electro-optic chip 101 includes M transmit / receive macros 205-1 through 205-M. Each transmit / receive macro 205-1 through 205-M includes a transmit macro having a micro-ring resonator 407-x-1 through 407-xM and a corresponding transmit slice circuit 401-x-1 through 401-xN, where x identifies a particular one of the M transmit / receive macros 205-1 through 205-M. Each transmit / receive macro 205-1 to 205-M further includes a receive macro having a micro-ring resonator 411-x-1 to 411-xM and a corresponding receive slice circuit 403-x-1 to 403-xN, where x identifies a particular one of the M transmit / receive macros 205-1 to 205-M. Each transmit / receive macro 205-1 to 205-M receives multiple wavelengths (λ1 to λ2) from a remote optical power supply 111. N 1 and 2, each of the optical fiber supply inputs 413-1 through 413-M is connected to a corresponding one of the optical fiber 113-1 through 113-M to receive a CW laser light of 100 Hz or less. In some embodiments, the number (M) of optical fiber 113-1 through 113-M required from the remote optical power supply 111 is equal to the number of transmit / receive macros 205-1 through 205-M of the electro-optic chip 101.

[0061] The optical feed inputs 413-1 through 413-M are respectively connected to optical waveguides 405-1 through 405-M. Each of the optical waveguides 405-1 through 405-M extends past N micro-ring resonators 407-x-1 through 407-xN, where x identifies a particular one of the M transmit / receive macros 205-1 through 205-M, to enable evanescent coupling of light between the optical waveguides 405-1 through 405-M and a corresponding set of micro-ring resonators 407-x-1 through 407-xN, where x identifies a particular one of the M transmit / receive macros 205-1 through 205-M. Each of the micro-ring resonators 407-x-1 through 407-xN receives N wavelengths (λ1 through λ2) of input CW laser light. N) that have a corresponding wavelength (λ) having a modulation pattern that carries digital data represented by an electrical signal. y , where y is a set of 1 to N), modulated light of a particular wavelength (λ , ... y 415-1 to 415-M。 After extending past each of the microring resonators 407-x-1 to 407-xN, each of the optical waveguides 405-1 to 405-M extends to a respective optical signal output 415-1 to 415-M. The modulated light is transmitted from the optical signal outputs 415-1 to 415-M to a respective optical fiber 609-1 to 609-M which carries the modulated light to a destination somewhere within the optical data communication system.

[0062] Each receiver macro of the transmit / receive macros 205-1 to 205-M includes an optical signal input 417-1 to 417-M, respectively, connected to a corresponding one of the optical fibers 611-1 to 611-M for receiving modulated light of various wavelengths from other devices in the optical data communication system. The optical signal inputs 417-1 to 417-M are connected to optical waveguides 409-1 to 409-M, respectively. Each of the optical waveguides 409-1 to 409-M extends past N micro-ring resonators 411-x-1 to 411-xN to enable evanescent coupling of light between the optical waveguides 409-1 to 409-M and a corresponding set of micro-ring resonators 411-x-1 to 411-xN, where x identifies a particular one of the M transmit / receive macros 205-1 to 205-M. In some embodiments, each of the microring resonators 411-x-1 to 411-xN receives N wavelengths (λ1 to λN) of the input modulated light. N) on a corresponding optical waveguide 409-1 through 409-M. In some embodiments, each of the micro-ring resonators 411-x-1 through 411-xN is operated as an optical ring detector (photodetector) tuned to a corresponding one of the optical waveguides 409-1 through 409-M. y , where y is a set of 1 to N), the microring resonators 411-x-1 to 411-xN function together with the corresponding receive slice circuits 403-x-1 to 403-xN to convert the input modulated optical signal into a corresponding electrical signal according to the modulation pattern of the input light. The resulting electrical signal is processed by the receive slice circuits 403-x-1 to 403-xN to reconstruct the original digital data onto which the input modulated light was modulated.

[0063] FIG. 7A illustrates an example of an electro-optic chip 701 implementing an N×M optical distribution network 703 on the electro-optic chip 701, according to some embodiments. The electro-optic chip 701 includes M transmit / receive optical macros 205-1 through 205-M, as described above with respect to the electro-optic chip 101 of FIG. 6C. The electro-optic chip 701 further includes glue logic 207 and an electrical interface 201, as described above with respect to the electro-optic chip 101. The electro-optic chip 701 further includes a photonic interface similar to the photonic interface 203, as described above with respect to the electro-optic chip 101. In some embodiments, the electro-optic chip 701 is a variation of the TeraPHY™ chip from Ayar Labs, Inc., mentioned above.

[0064] The N×M optical distribution network 703 includes N optical inputs 707-1 to 707-N that are optically connected to receive CW light from N optical fibers 710-1 to 710-N of the optical fiber array 710, respectively. In some embodiments, the N optical inputs 707-1 to 707-N of the N×M optical distribution network are optically connected to N optical supply input ports 705-1 to 705-N of the electro-optic chip 701, respectively, via N corresponding optical waveguides 706-1 to 706-N formed in the electro-optic chip 701. In some embodiments, the optical fibers 710-1 to 710-N carry CW light of different wavelengths, where each of the optical fibers 710-1 to 710-N carries CW light of one wavelength. In some embodiments, the N×M optical distribution network 703 distributes the N wavelengths (λ1 to λ2) received at the N optical inputs 707-1 to 707-N. N ) to each of the M on-chip optical outputs 708-1 to 708-M of the N×M optical distribution network 703. In this manner, the N×M optical distribution network 703 routes the CW laser light of each of the N wavelengths (λ1 to λ N ) is transmitted to a respective optical output of the M on-chip optical outputs 708-1 through 708-M. In some embodiments, the N×M optical distribution network 703 multiplexes the CW light received at the N optical inputs 707-1 through 707-N into the M optical outputs 708-1 through 708-M such that a respective CW light of a wavelength among the N wavelengths received at the N optical inputs 707-1 through 707-N is transmitted to a respective optical output of the M on-chip optical outputs 708-1 through 708-M. In some embodiments, the N×M optical distribution network 703 multiplexes a subset of the wavelengths (λ1 through λ2) of the N wavelengths received at the N optical inputs 707-1 through 707-N into the M on-chip optical outputs 708-1 through 708-M. N ) to one or more of the M on-chip optical outputs 708-1 through 708-M of the N×M optical distribution network 703. In these embodiments, the CW laser light of the subset of N wavelengths (λ1 through λ N A subset of N wavelengths (λ1 to λ N ), which may or may not be in order of wavelength magnitude. Also, in these embodiments, the N×M optical distribution network 703 distributes different subsets (λ1 through λ2) of the N wavelengths received at the N optical inputs 707-1 through 707-N. N) to different optical outputs among the M on-chip optical outputs 708-1 through 708-M of the N×M optical distribution network 703. In some embodiments, each of the M optical outputs 708-1 through 708-M is optically connected to a respective one of the M transmit / receive optical macros 205-1 through 205-M. For example, in some embodiments, the N wavelengths (λ1 through λ2) may be configured to route different subsets of the N wavelengths (λ2 through λ3) to different optical outputs among the M on-chip optical outputs 708-1 through 708-M of the N×M optical distribution network 703. In some embodiments, each of the M optical outputs 708-1 through 708-M is optically connected to a respective one of the M transmit / receive optical macros 205-1 through 205-M. N ) (or N wavelengths (λ1 to λ N M optical waveguides 709-1 through 709-M are formed within the electro-optic chip 701 for transmitting CW light of wavelengths (a subset of wavelengths) from M corresponding optical outputs 708-1 through 708-M to M corresponding optical waveguides 405-1 through 405-M of M transmit / receive optical macros 205-1 through 205-M, respectively. In some embodiments, the optical distribution network 703 is a passive photonic device formed within the electro-optic chip 701.

[0065] FIG. 7B illustrates a graph of N wavelengths (λ1 to λ2) according to some embodiments. N 7 illustrates an example of an optical distribution network 703 configured to deliver CW light at a subset of wavelengths of N (λ1 through λM) to each of one or more of M optical outputs 708-1 through 708-M. In various embodiments, the optical distribution network 703 delivers CW light at a subset of wavelengths of N (λ1 through λM). N ) are delivered to various optical outputs of the M optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to deliver N wavelengths (λ1 through λ2) received at the N optical inputs 707-1 through 707-N to the optical distribution network 703. N) to different optical outputs among the M optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to communicate a set of two or more optical inputs among the N optical inputs 707-1 through 707-N to each of the M optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to communicate a set of two or more optical inputs among the N optical inputs 707-1 through 707-N to a set of two or more optical outputs among the M optical outputs 708-1 through 708-M. It should be appreciated that in various embodiments, the optical distribution network 703 is configured to communicate any particular subset of the N optical inputs 707-1 through 707-N to any particular optical output or outputs among the M optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is implemented in a static configuration where the communication of any particular subset of the N optical inputs 707-1 through 707-N to any particular one or more of the M optical outputs 708-1 through 708-M is fixed at the time of manufacture of the optical distribution network 703. In some embodiments, the optical distribution network 703 is implemented in a dynamic configuration where the communication of any particular subset of the N optical inputs 707-1 through 707-N to any particular one or more of the M optical outputs 708-1 through 708-M is configurable after manufacture of the optical distribution network 703 and / or during operation of the electro-optical chip 701.

[0066] 7C illustrates an example of an optical distribution network 703A configured to implement two 4×4 optical multiplexing functions (where N=8 and M=8) in accordance with some embodiments. The optical distribution network 703A is optically connected to receive CW light of eight different wavelengths (λ1 through λ8) received at eight optical inputs 707-1 through 707-8. The optical distribution network 703A is configured to convey CW light of a first subset of four wavelengths {λ1, λ3, λ5, λ7} of the eight different wavelengths (λ1 through λ8) received at the eight optical inputs 707-1 through 707-8 to a first subset of four optical outputs {708-1, 708-2, 708-3, 708-4} of the eight optical outputs 708-1 through 708-8. The optical distribution network 703A is further configured to transmit the CW light of four wavelengths {λ2, λ4, λ6, λ8} of the second subset of eight distinct wavelengths (λ1 to λ8) received at the eight optical inputs 707-1 to 707-8 to four optical outputs {708-5, 708-6, 708-7, 708-8} of the second subset of eight optical outputs 708-1 to 708-8. It should be understood that the configuration of the optical distribution network 703A is provided by way of example. In other embodiments, the optical distribution network 703 can be configured to transmit the light received at any particular subset of the N optical inputs 707-1 to 707-N to any particular subset of the M optical outputs 708-1 to 708-M.

[0067] 8A illustrates a high-bandwidth, multi-wavelength WDM optical data communications system 800 in accordance with some embodiments. The system 800 transmits N wavelengths (λ1 to λ2) in accordance with some embodiments. N ) is configured to provide CW laser light at each of the wavelengths. The remote optical power supply 801 comprises a laser array 803 including N lasers 803-1 to 803-N, where each of the N lasers 803-1 to 803-N has a different wavelength (λ) than the other lasers of the N lasers 803-1 to 803-N. x, where x is one of 1 to N). In some embodiments, each of the lasers 803-1 to 803-N is a distributed feedback (DFB) laser. In some embodiments, at least one of the N lasers 803-1 to 803-N is thermally coupled to at least one other of the N lasers 801-1 to 803-N, such that a temperature change of one of the thermally coupled lasers leads to a temperature change of the other of the thermally coupled lasers. In some embodiments, the N lasers 803-1 to 803-N are thermally coupled collectively, such that the temperatures of each of the N lasers 803-1 to 803-N change / drift together. In some embodiments, each of the N lasers 803-1 to 803-N are thermally connected to a common thermally conductive substrate / plate 802, such that the temperature of each of the N lasers 803-1 to 803-N is normalized to an average temperature based on the collective thermal output of the N lasers 803-1 to 803-N, and the temperatures of the N lasers 803-1 to 803-N drift together in direction and magnitude.

[0068] In some embodiments, the optical outputs 804-1 to 804-N of the N lasers 803-1 to 803-N are optically connected directly to a respective one of the N optical outputs 807-1 to 807-N of the remote optical power supply 801. In some embodiments, the remote optical power supply 801 optionally comprises an optical amplifier 805 connected between the laser array 803 and the N optical outputs 807-1 to 807-N of the remote optical power supply 801. The optical amplifier 805 has N optical inputs 806-1 to 806-N and N optical outputs 808-1 to 808-N. Optical amplifier 805 is configured to amplify the optical signals received from each of the N lasers 803-1 to 803-N (increase the optical power of the light) such that an amplified version of the CW laser light received at optical inputs 806-1 to 806-N of optical amplifier 805 is transmitted through corresponding optical outputs 808-1 to 808-N of optical amplifier 805. In this manner, the CW laser light output from a given one of optical outputs 808-1 to 808-N of optical amplifier 805 is an amplified version of the CW laser light output by a corresponding one of the N lasers 803-1 to 803-N. Each of the N optical outputs 808-1 to 808-N of optical amplifier 805 is configured to amplify the optical signals received from each of the N lasers 803-1 to 803-N (increase the optical power of the light) such that an amplified version of the CW laser light received at optical inputs 806-1 to 806-N of optical amplifier 805 is transmitted through corresponding optical outputs 808-1 to 808-N of optical amplifier 805. N ) are output from the N optical outputs 807-1 to 807-N of the remote optical power supply 801, respectively. The N optical outputs 807-1 to 807-N of the remote optical power supply 801 are optically connected to respective optical fibers 710-1 to 710-N of the optical fiber array 710. In this manner, each of the optical fibers 710-1 to 710-N transmits N wavelengths (λ1 to λ2) from the remote optical power supply 801 to the electro-optic chip 701. N ) transmits a CW laser beam of a different wavelength.

[0069] FIG. 8B illustrates N wavelengths (λ1 to λ2) output from laser array 803 and transmitted by N optical fibers 710-1 to 710-N to electro-optic chip 701, according to some embodiments.N ) is a diagram showing the CW laser light of each of the N optical fibers 710-1 to 710-N. In some embodiments, the remote optical power supply 801 is configured to supply N wavelengths (λ1 to λ2) of CW laser light of each of the N optical fibers 710-1 to 710-N. N ) at substantially equal intensity (power) per wavelength through N optical fibers 710-1 to 710-N. N ) CW laser light. However, in some embodiments, the remote optical power supply 801 is operable to provide N wavelengths (λ1 to λ N The optical power level of the CW laser light of one or more wavelengths among the N wavelengths (λ1 to λ N ) is different from the optical power level of the CW laser light of other wavelengths.

[0070] In a high bandwidth, multi-wavelength WDM optical data communication system 800, the N×M optical distribution network 603 has been moved from a remote optical power supply 111 (such as that shown in FIG. 6A) to an N×M optical distribution network 703 on an electro-optic chip 701. The remote optical power supply 801 provides optical power for multiple wavelengths (λ1 to λ N ) to the optical fiber array 710 such that a unique one of the N optical fibers 710-1 to 710-N of the optical fiber array 710 is delivered to a given optical supply input 705-1 to 705-N of the electro-optic chip 701 and, in turn, to a given optical input 707-1 to 707-N of the N×M optical distribution network 703 on the electro-optic chip 701. N) CW laser light. In comparison to the remote optical power supply 111, the remote optical power supply 801 is beneficially simplified because it does not include the N×M optical distribution network 603, and each laser 803-1 through 803-N is directly coupled to a single corresponding output optical fiber 710-1 through 710-N, respectively. It will be appreciated that by moving the N×M optical distribution network 603 from the remote optical power supply 111 (as shown in FIG. 6A ), the manufacturing complexity and cost of the remote optical power supply 801 is significantly reduced.

[0071] FIG. 9A illustrates a remote optical power supply 801A implementing a lens array 903 according to some embodiments. The remote optical power supply 801A is a variation of the remote optical power supply 801. The lens array 903 provides a lens-based laser array fiber coupling system for optically coupling the laser array 803 to the optical fiber array 710. In some embodiments, the remote optical power supply 801A is used in place of the remote optical power supply 801 of FIG. 8A. The laser array 903 includes N lens elements 903-1 to 903-N respectively disposed between the optical outputs 804-1 to 804-N of the N lasers 803-1 to 803-N of the laser array 803 and the N optical outputs 807-1 to 807-N of the remote optical power supply 801A (corresponding to the cores of the N optical fibers 710-1 to 710-N of the optical fiber array 710). In some embodiments, each of the N lens elements 903-1 to 903-N images CW laser light from a corresponding one of the N lasers 803-1 to 803-N, represented by a respective set of arrows 907-1 to 907-N, onto a facet of a corresponding one of the optical fibers 710-1 to 710-N, represented by a respective set of arrows 909-1 to 909-N. In some embodiments, the optical fibers 710-1 to 710-N are single mode optical fibers. In some embodiments, the optical fibers 710-1 to 710-N are polarization maintaining optical fibers.

[0072] In some embodiments, the remote optical power supply 801A includes an optional passive optical element 901 disposed between the laser array 803 and the lens array 903. In some embodiments, the remote optical power supply 801A also includes an optional passive optical element 905 disposed between the lens array 903 and the N optical outputs 807-1 to 807-N of the remote optical power supply 801A corresponding to the facets of the N optical fibers 710-1 to 710-N. In various embodiments, the optional passive optical elements 901 and 905 include one or more passive discrete optical components, such as optical filters, optical isolators, optical waveplates, optical collimators, refractive optical elements, and / or diffractive optical elements, among others. In some embodiments, the passive optical element 901 is an optical isolator. In some embodiments, the passive optical element 905 is an optical isolator. In some embodiments, the passive optical element 905 is an optical isolator and an optical waveplate, and the optical fibers 710-1 through 710-N are polarization-maintaining optical fibers. In some embodiments, the optical components of the remote optical power supply 801A (laser array 801, lens array 903, optional passive optical elements 901 and / or 905) are mounted directly or indirectly to a shared mechanical mount or substrate 911.

[0073] FIG. 9B is a perspective view of the remote optical power supply 801A of FIG. 9A, according to some embodiments. FIG. 9C is a side view of the remote optical power supply 801A of FIG. 9A, according to some embodiments. A lens array 903 is disposed between the laser array 803 and the optical fiber array 710. The lens array 903 includes a separate lens assembly for each of the lasers 803-1 to 803-N. An optical isolator 905 is disposed between the lens array 903 and the optical fiber array 710. In some embodiments, the positions of the laser array 803, the lens array 903, and the optical fiber array 710 are indexed to a common substrate 902. In some embodiments, the laser array 803 is mounted to a thermally conductive substrate 904 to thermally couple the lasers 803-1 to 803-N such that the temperature of any one of the lasers 803-1 to 803-N affects the temperature of the other lasers 803-1 to 803-N.

[0074] In one embodiment, an electro-optic chip 701 is disclosed, which includes a plurality of transmitting macros 205-1 to 205-M and an optical distribution network 703. Each of the plurality of transmitting macros 205-1 to 205-M includes an optical waveguide 405-1 to 405-M and a plurality of ring resonators 407-1-1 to 407-MN arranged along the optical waveguide 405-1 to 405-M within an evanescent optical coupling distance of the optical waveguide 405-1 to 405-M. The optical distribution network 703 is implemented on the electro-optic chip 701. The optical distribution network 703 includes a plurality of optical inputs 707-1 to 707-N and a plurality of optical outputs 708-1 to 708-M. In some embodiments, the optical distribution network 703 may be configured such that the light delivered to each of the plurality of optical outputs 708-1 through 708-M is equal to or greater than all wavelengths (λ1 through λ2) of the light delivered to the plurality of optical inputs 707-1 through 707-N. N), to each of the plurality of optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to transmit a portion of the light received at each one of the plurality of optical inputs 707-1 through 707-N to each of the plurality of optical outputs 708-1 through 708-M such that the light transmitted to one or more of the M optical outputs 708-1 through 708-M is a subset of the wavelengths (λ1 through λ2) of the light transmitted to the N optical inputs 707-1 through 707-N. N 708-M。 In some embodiments, each of the optical outputs 708-1 to 708-M is optically coupled to an optical waveguide 405-1 to 405-M in a corresponding one of the transmit macros 205-1 to 205-M.

[0075] In some embodiments, each of the optical inputs 707-1 to 707-N of the optical distribution network 703 is optically connected to a corresponding optical fiber (one of 710-1 to 710-N). N 7, the CW light having a first optical fiber 705-1 through 705-N is transmitted through a corresponding optical fiber 706-1 through 706-N. In some embodiments, the electro-optic chip 701 comprises a plurality of optical feed ports 705-1 through 705-N and a plurality of optical waveguides 706-1 through 706-N formed within the electro-optic chip 703 to optically couple a plurality of optical inputs 707-1 through 707-N of the optical distribution network 703 to the plurality of optical feed ports 705-1 through 705-N, respectively. In some embodiments, the plurality of optical feed ports 705-1 through 705-N are formed as respective edge coupling devices. In some embodiments, the plurality of optical feed ports 705-1 through 705-N are formed as respective vertical optical grating devices.

[0076] In some embodiments, the electro-optic chip 701 is configured to receive multiple wavelengths (λ1 to λ2) of CW light received through multiple optical inputs 707-1 to 707-N of the optical distribution network 703, respectively.N Each of the resonant wavelengths (λ1 to λ N 1 to 407-MN). In some embodiments, the plurality of heating devices 408-1 to 408-M are disposed adjacent to the plurality of ring resonators 407-1 to 407-M, respectively. The plurality of heating devices 408-1 to 408-M are configured to control the resonant wavelengths of the plurality of ring resonators 407-1 to 407-M, respectively.

[0077] In some embodiments, each optical waveguide 405-1-405-M in each of the plurality of transmitting macros 205-1-205-M comprises a first substantially linear segment, a second substantially linear segment, and a U-shaped segment extending between the first substantially linear segment and the second substantially linear segment such that an optical input of the first substantially linear segment and an optical input of the second substantially linear segment are disposed on the same side of the transmitting macro 205-1-205-M comprising the optical waveguide 405-1-405-M. In some embodiments, the plurality of ring resonators 407-1-407-M comprising a given one of the plurality of transmitting macros 205-1-205-M are disposed spaced apart along either the first substantially linear segment or the second substantially linear segment of the optical waveguide 405-1-405-M in the given one of the plurality of transmitting macros 205-1-205-M.

[0078] In one embodiment, an optical data communication system is disclosed. The optical data communication system includes optical power supplies 801, 801A, an electro-optic chip 701, and an optical network disposed between the optical power supplies 801, 801A and the electro-optic chip 701. The optical power supplies 801, 801A include a plurality of lasers 803-1 to 803-N. Each of the plurality of lasers 803-1 to 803-N is configured such that the beams of CW light output by the plurality of lasers 803-1 to 803-N collectively have a plurality of wavelengths (λ1 to λ2). N ) to include all wavelengths (λ1 to λ N) and outputs a CW optical beam of a different wavelength. The electro-optic chip 701 exists separately from the optical power supplies 801, 801A. The electro-optic chip 701 includes a plurality of transmitting macros 205-1 to 205-M. Each of the plurality of transmitting macros 205-1 to 205-M includes an optical waveguide 405-1 to 405-M and a plurality of ring resonators 407-1-1 to 407-MN arranged along the optical waveguide 405-1 to 405-M within the range of the evanescent optical coupling distance of the optical waveguide 405-1 to 405-M.

[0079] The electro-optical chip 701 includes an optical distribution network 703 implemented on the electro-optical chip 701. The optical distribution network 703 has a plurality of optical inputs 707-1 through 707-N and a plurality of optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to distribute the light transmitted to each of the plurality of optical outputs 708-1 through 708-M across all wavelengths (λ1 through λ2) of the light transmitted to the plurality of optical inputs 707-1 through 707-N. N ), to each of the plurality of optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to transmit a portion of the light received at each one of the plurality of optical inputs 707-1 through 707-N to each of the plurality of optical outputs 708-1 through 708-M such that the light transmitted to one or more of the M optical outputs 708-1 through 708-M is a subset of the wavelengths (λ1 through λ2) of the light transmitted to the N optical inputs 707-1 through 707-N. N , 703-1 through 703-N。 In some embodiments, each of the optical outputs 708-1 through 708-M of the optical distribution network 703 is optically connected to an optical waveguide 405-1 through 405-M in a corresponding one of the transmit macros 205-1 through 205-M. In some embodiments, the electro-optical chip 701 is configured to transmit a portion of light received at a subset of the N optical inputs 707-1 through 707-N to one or more of the M optical outputs 708-1 through 708-M such that the subset of N optical inputs 707-1 through 707-N includes a subset of the M optical outputs 708-1 through 708-M. In some embodiments, each of the optical outputs 708-1 through 708-M of the optical distribution network 703 is optically connected to an optical waveguide 405-1 through 405-M in a corresponding one of the transmit macros 205-1 through 205-M. In some embodiments, the electro-optical chip 701 is configured to transmit a portion of light received at a subset of the N optical inputs 707-1 through 707-N to one or more of the M optical outputs 708-1 through 708-M such that the subset of the M optical outputs 708-1 through 708-M of the optical distribution network 703 includes a subset of the M optical outputs 708-1 through 708-M of the optical distribution network 703. In some embodiments, the electro-optical chip 701 is configured to transmit a portion of light received at a subset of the N optical inputs 707-1 through 707-N to one or more of the M optical outputs 708-1 through 708-M. NThe ring resonators 407-1-1 through 407-MN are configured to tune each of the ring resonators 407-1-1 through 407-MN to a respective resonant wavelength that substantially coincides with one of the wavelengths.

[0080] The optical network is configured to optically transmit the CW optical beams output by the multiple lasers 803-1 to 803-N in the optical power supply 801, 801A to each of multiple optical inputs 707-1 to 707-N of the optical distribution network 703 in the electro-optic chip 701. Each of the multiple optical inputs 707-1 to 707-N of the optical distribution network 703 is connected to receive a different one of the CW optical beams output by the multiple lasers 803-1 to 803-N.

[0081] In some embodiments, each of the plurality of lasers 803-1 to 803-N is thermally coupled to at least one other of the plurality of lasers 803-1 to 803-N. In some embodiments, the plurality of lasers 803-1 to 803-N are thermally coupled together such that a temperature change of any one of the plurality of lasers 803-1 to 803-N causes a temperature change of the other lasers of the plurality of lasers 803-1 to 803-N. In some embodiments, each of the plurality of lasers 803-1 to 803-N is thermally coupled to a common thermally conductive substrate 904 in the optical power supply 801, 801A. In some embodiments, the optical power supply 801, 801A comprises an optical amplifier 805 configured to increase an optical power level of each of the CW optical beams output by the plurality of lasers 803-1 to 803-N.

[0082] In some embodiments, the optical network comprises a plurality of optical fibers 710-1-710-N optically connected to a plurality of optical inputs 707-1-707-N of the optical distribution network 703, respectively. In some embodiments, the optical power supply 801, 801A comprises a lens array 903 disposed between the outputs of the plurality of lasers 803-1-803-N and the plurality of optical fibers 710-1-710-N of the optical network. In some embodiments, the lens array 903 comprises a lens corresponding to each of the plurality of lasers 803-1-803-N, respectively. In some embodiments, the lens for a given one of the plurality of lasers 803-1-803-N is configured to direct a CW optical beam output by the given one of the plurality of lasers 803-1-803-N onto a facet of a corresponding one of the plurality of optical fibers 710-1-710-N. In some embodiments, the optical power supply 801, 801A includes an optical isolator 905 disposed between the lens array 903 and the plurality of optical fibers 710-1 through 710-N. The optical isolator 905 is configured to prevent light from entering the plurality of lasers 803-1 through 803-N.

[0083] 10 is a flow chart illustrating a method for generating a modulated optical data communication signal, according to some embodiments. In some embodiments, the method of FIG. 10 is performed by a high-bandwidth, multi-wavelength WDM optical data communication system 800. The method comprises a step 1001 of operating an optical power supply 801, 801A to generate a plurality of CW optical beams, where each of the plurality of CW optical beams has N wavelengths (λ1 through λ N ) different from each other. The method further comprises a step 1003 of transmitting the multiple CW optical beams from the optical power supplies 801, 801A to an electro-optic chip 701 that is separate and apart from the optical power supplies 801, 801A. In this way, the multiple wavelengths (λ1 to λ N ) is transmitted from optical power supplies 801, 801A to electro-optic chip 701 through an optical network (eg, through each of optical fibers 710-1 to 710-N).

[0084] In some embodiments, the method further comprises: determining the N wavelengths (λ1 to λ2) of the plurality of CW optical beams; N 405-M。 ) are all coupled to the optical waveguides in the electro-optic chip 701. In some embodiments, step 1005 includes operating the electro-optic chip 701 to multiplex the plurality of CW optical beams onto optical waveguides in the electro-optic chip 701 (e.g., any one or more of optical waveguides 709-1 through 709-M that are optically connected to optical waveguides 405-1 through 405-M, respectively). In some embodiments, step 1005 includes multiplexing a subset of the N wavelengths (λ1 through λ2) corresponding to the subset of the plurality of CW optical beams. N The method is performed to have the electro-optic chip 701 multiplex a subset of the plurality of beams of CW light onto optical waveguides (any one or more of optical waveguides 709-1 through 709-M optically connected to optical waveguides 405-1 through 405-M, respectively) within the electro-optic chip 701 such that a subset of the plurality of beams of CW light is coupled to the optical waveguides. In some embodiments, the method comprises operating the electro-optic chip 701 to multiplex the plurality of CW light beams onto each of M optical waveguides (e.g., 405-1 through 405-M) passing through transmit portions of M optical macros (e.g., 205-1 through 205-M) within the electro-optic chip 701. The method further comprises transmitting 1007 the plurality of CW light beams through the optical waveguides (e.g., 405-1 through 405-M) to optical transmitter portions of the optical macros (e.g., 205-1 through 205-M) within the electro-optic chip 701. In this way, N wavelengths (λ1 to λ N ) is transmitted to an optical transmitter portion of an optical macro (eg, 205-1 to 205-M) in the electro-optic chip 701 through an optical waveguide (eg, 405-1 to 405-M).

[0085] The method further comprises operating 1009 an optical transmitter portion of the optical macros (e.g., 205-1 through 205-M) in the electro-optic chip 701 to modulate one or more of the CW optical beams from within the optical waveguides (e.g., 405-1 through 405-M) to generate one or more modulated optical signals carrying digital data for output from the electro-optic chip 701. In this manner, the optical transmitter portion of the optical macros (e.g., 205-1 through 205-M) in the electro-optic chip 701 modulates N wavelengths (λ1 through λ2) of the CW optical beams from within the optical waveguides (e.g., 405-1 through 405-M) at N wavelengths (λ1 through λ2) to generate corresponding modulated optical signals carrying the digital data for output from the electro-optic chip 701. N ) CW laser light of one or more wavelengths is modulated.

[0086] In some embodiments, step 1005 includes transmitting the multiple CW optical beams received from the optical power supplies 801, 801A through an optical distribution network 703 implemented on the electro-optic chip 701. The optical distribution network 703 has multiple optical inputs 707-1 through 707-N and multiple optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to transmit ... such that the light transmitted to each of the multiple optical outputs 708-1 through 708-M is a mixture of all N wavelengths (λ1 through λ2) of light transmitted from the remote optical power supplies 801, 801A to the multiple optical inputs 707-1 through 707-N. N ), to each of the plurality of optical outputs 708-1 through 708-M. In some embodiments, the optical distribution network 703 is configured to transmit a portion of the light received at each one of the plurality of optical inputs 707-1 through 707-N to each of the plurality of optical outputs 708-1 through 708-M such that the light transmitted to one or more of the plurality of optical outputs 708-1 through 708-M is a subset of the N wavelengths (λ1 through λ2) of light transmitted from the remote optical power supply 801, 801A to a subset of the plurality of optical inputs 707-1 through 707-N. N705-1 through 705-M)。 In some embodiments, one of the optical outputs 708-1 through 708-M of the optical distribution network 703 is optically connected to one of the optical waveguides (e.g., 405-1 through 405-M) in the electro-optical chip 701.

[0087] In some embodiments, generating 1001 the multiple beams of CW light includes operating the multiple lasers 803-1-803-N to generate the multiple CW light beams, respectively. In some embodiments, the multiple lasers 803-1-803-N are thermally coupled together such that a temperature change in any one of the multiple lasers 803-1-803-N causes a temperature change in the other lasers of the multiple lasers 803-1-803-N. In this manner, a temperature induced drift in the wavelength of any one of the multiple CW light beams is accompanied by a corresponding temperature induced drift in the wavelength of the other beams of the multiple CW light beams. In these embodiments, the electro-optic chip 701 is configured to compensate for temperature induced drift in the wavelengths of the multiple CW light beams received from the remote optical power supply 801, 801A.

[0088] The above description of the embodiments is for illustrative and descriptive purposes and is not intended to be exhaustive or limiting. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment and, where applicable, can be substituted and utilized in selected embodiments unless otherwise shown or described. Thus, one or more features from one or more embodiments disclosed herein can be combined with one or more features from one or more other embodiments disclosed herein to form another embodiment that is not explicitly disclosed herein but is implicitly disclosed herein. This other embodiment may also be modified in many ways. Such variations of the embodiments are not considered departures from the present disclosure, and all such variations and modifications of the embodiments are intended to be included within the scope of the disclosure provided herein.

[0089] Although some method steps may be described in a particular order herein, it should be understood that other housekeeping steps may be performed between method steps, and / or method steps may be coordinated to be performed at slightly different times or simultaneously, or distributed into a system that permits process steps to be performed at various intervals related to the process, so long as the processing of the method steps is performed in a manner such that the method is successfully performed.

[0090] Although the present embodiments have been described in some detail for ease of understanding, it will be apparent that certain changes and modifications may be made within the scope of the appended claims. Accordingly, the embodiments disclosed herein are considered to be illustrative and not restrictive, and therefore should not be limited to only the details set forth herein, but may be modified within the scope and equivalents of the appended claims.

Claims

1. 1. An electro-optic chip, comprising: a plurality of transmitter macros, each of the plurality of transmitter macros comprising an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide; an optical distribution network implemented on the electro-optical chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network being configured to transmit a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of light transmitted to the plurality of optical inputs, each of the plurality of optical outputs being optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros.

2. 10. The electro-optic chip of claim 1, wherein each of the plurality of optical inputs of the optical distribution network is optically connected to a corresponding optical fiber.

3. 3. The electro-optic chip of claim 2, wherein continuous wave light having a single wavelength is transmitted through the corresponding optical fiber.

4. 2. The electro-optic chip of claim 1, further comprising: A plurality of light supply ports; a plurality of optical waveguides formed within the electro-optical chip for optically connecting the plurality of optical inputs of the optical distribution network to the plurality of optical feed ports, respectively; An electro-optical chip comprising:

5. 5. The electro-optic chip of claim 4, wherein the plurality of light supply ports are formed as respective edge coupling devices.

6. 5. The electro-optic chip of claim 4, wherein the plurality of light supply ports are formed as respective vertical optical grating devices.

7. 2. The electro-optical chip of claim 1, wherein the electro-optical chip is configured to tune each of the plurality of ring resonators to a respective resonant wavelength that substantially corresponds to one of a plurality of wavelengths of continuous wave light respectively received through the plurality of optical inputs of the optical distribution network.

8. 2. The electro-optic chip of claim 1, further comprising: an electro-optic chip comprising: a plurality of heating devices disposed adjacent to the plurality of ring resonators, the heating devices configured to respectively control resonant wavelengths of the plurality of ring resonators.

9. 2. The electro-optical chip of claim 1, wherein each optical waveguide in each of the plurality of transmit macros has a first generally linear segment, a second generally linear segment, and a U-shaped segment extending between the first generally linear segment and the second generally linear segment such that an optical input of the first generally linear segment and an optical input of the second generally linear segment are located on the same side of the transmit macro that includes the optical waveguide.

10. 10. The electro-optical chip of claim 9, wherein the plurality of ring resonators comprising a given one of the plurality of transmitter macros are spaced apart along either the first or second generally linear segment of the optical waveguide in the given one of the plurality of transmitter macros.

11. 10. The electro-optic chip of claim 1, wherein the optical distribution network is a passive photonic device.

12. 1. An optical data communication system, comprising: an optical power supply comprising a plurality of lasers, each of the plurality of lasers configured to generate and output a different continuous wave optical beam of the plurality of wavelengths, such that the continuous wave optical beams output by the plurality of lasers collectively include all of the plurality of wavelengths; an electro-optic chip separate and apart from the optical power supply; the electro-optic chip comprising a plurality of transmit macros, each of the plurality of transmit macros comprising an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide; the electro-optic chip comprising an optical distribution network implemented on the electro-optic chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network being configured to transmit a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of light transmitted to the plurality of optical inputs, each of the plurality of optical outputs of the optical distribution network being optically coupled to the optical waveguide of a corresponding one of the plurality of transmit macros; an optical network configured to optically transmit the continuous wave optical beams output by the plurality of lasers in the optical power supply to each of a plurality of optical inputs of the optical distribution network in the electro-optical chip, each of the plurality of optical inputs of the optical distribution network being connected to receive a different one of the continuous wave optical beams output by the plurality of lasers.

13. 13. An optical data communication system according to claim 12, wherein each of the plurality of lasers is thermally connected to at least one other of the plurality of lasers.

14. 13. The optical data communication system of claim 12, wherein the plurality of lasers are thermally connected together such that a change in temperature of any one of the plurality of lasers causes a change in temperature of other lasers of the plurality of lasers.

15. 13. The optical data communication system of claim 12, wherein each of the plurality of lasers is thermally connected to a common thermally conductive substrate within the optical power supply.

16. 13. The optical data communication system of claim 12, wherein the optical power supply comprises an optical amplifier configured to increase the optical power level of each of the continuous wave light beams output by the plurality of lasers.

17. 13. An optical data communication system according to claim 12, wherein the optical network comprises a plurality of optical fibres optically connected respectively to the plurality of optical inputs of the optical distribution network.

18. 13. The optical data communication system of claim 12, wherein the electro-optic chip is configured to tune each of the plurality of ring resonators to a respective resonant wavelength that substantially corresponds to one of the plurality of wavelengths of the continuous wave light beams output by the plurality of lasers.

19. 13. The optical data communications system of claim 12, wherein each optical waveguide in each of the plurality of transmit macros has a first generally linear segment, a second generally linear segment, and a U-shaped segment extending between the first generally linear segment and the second generally linear segment such that an optical input of the first generally linear segment and an optical input of the second generally linear segment are located on the same side of the transmit macro comprising the optical waveguide.

20. 20. The optical data communication system of claim 19, wherein the plurality of ring resonators comprising a given one of the plurality of transmit macros are spaced apart along either the first generally linear segment or the second generally linear segment of the optical waveguide in the given one of the plurality of transmit macros.

21. 13. The optical data communications system of claim 12, wherein the optical network comprises a plurality of optical fibers optically connected to the optical power supply, the optical power supply comprising a lens array disposed between outputs of the plurality of lasers and the plurality of optical fibers of the optical network, the lens array comprising a respective lens corresponding to each of the plurality of lasers, the lens for a given one of the plurality of lasers being configured to direct the continuous wave light beam output by the given one of the plurality of lasers onto a facet of a corresponding one of the plurality of optical fibers.

22. 22. The optical data communication system of claim 21 , wherein the optical power supply comprises an optical isolator disposed between the lens array and the plurality of optical fibers, the optical isolator configured to prevent light from entering the plurality of lasers.

23. 1. A method for generating a modulated optical data communication signal, comprising: operating the optical power supply to generate a plurality of continuous wave optical beams, each of the plurality of continuous wave optical beams having a different wavelength; transmitting the plurality of continuous wave optical beams from the optical power supply to an electro-optic chip that is separate and apart from the optical power supply; operating the electro-optic chip to multiplex the plurality of continuous wave optical beams onto the optical waveguides within the electro-optic chip such that all the wavelengths of the plurality of continuous wave optical beams are coupled into optical waveguides; transmitting the plurality of continuous wave optical beams through the optical waveguide to an optical transmitter portion of an optical macro within the electro-optic chip; operating the optical transmitter portion of the optical macro in the electro-optical chip to modulate one or more of the continuous wave optical beams from within the optical waveguide to generate one or more modulated optical signals conveying digital data; A method comprising:

24. 24. The method of claim 23, wherein operating the electro-optical chip to multiplex the multiple continuous wave optical beams onto the optical waveguides within the electro-optical chip comprises transmitting the multiple continuous wave optical beams received from the optical power supply through an optical distribution network implemented on the electro-optical chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network being configured to transmit a portion of the light received at each one of the plurality of optical inputs to each of the plurality of optical outputs such that the light transmitted to each of the plurality of optical outputs includes all wavelengths of light transmitted to the plurality of optical inputs, and one of the plurality of optical outputs of the optical distribution network being optically connected to the optical waveguides within the electro-optical chip.

25. 24. The method of claim 23, wherein operating the optical power supply to generate the plurality of continuous wave optical beams comprises operating a plurality of lasers to generate the plurality of continuous wave optical beams, the plurality of lasers being thermally coupled together such that a change in temperature of any one of the plurality of lasers causes a change in temperature of other lasers of the plurality of lasers such that a temperature induced drift in the wavelength of any one of the plurality of continuous wave optical beams is accompanied by a corresponding temperature induced drift in the wavelength of the other beams of the plurality of continuous wave optical beams.

26. 1. An electro-optic chip, comprising: a plurality of transmitter macros, each of the transmitter macros comprising an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide; an optical distribution network implemented on the electro-optical chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network configured to transmit a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs such that light transmitted to the one or more of the plurality of optical outputs comprises wavelengths of light transmitted to the subset of the plurality of optical inputs, the subset of the plurality of optical inputs including at least two of the plurality of optical inputs, each of the plurality of optical outputs optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros.

27. 27. The electro-optic chip of claim 26, wherein each of the plurality of optical inputs of the optical distribution network is optically connected to a corresponding optical fiber.

28. 28. The electro-optic chip of claim 27, wherein continuous wave light having a single wavelength is transmitted through the corresponding optical fiber.

29. 27. The electro-optic chip of claim 26, further comprising: A plurality of light supply ports; a plurality of optical waveguides formed within the electro-optical chip for optically connecting the plurality of optical inputs of the optical distribution network to the plurality of optical feed ports, respectively; An electro-optical chip comprising:

30. 30. The electro-optic chip of claim 29, wherein the plurality of light supply ports are formed as respective edge coupling devices.

31. 30. The electro-optic chip of claim 29, wherein the plurality of light supply ports are formed as respective vertical optical grating devices.

32. 27. The electro-optical chip of claim 26, wherein the electro-optical chip is configured to tune each of the plurality of ring resonators to a respective resonant wavelength that substantially corresponds to one of a plurality of wavelengths of continuous wave light respectively received through the plurality of optical inputs of the optical distribution network.

33. 27. The electro-optic chip of claim 26, further comprising: an electro-optic chip comprising: a plurality of heating devices disposed adjacent to the plurality of ring resonators, the heating devices configured to respectively control resonant wavelengths of the plurality of ring resonators.

34. 27. The electro-optical chip of claim 26, wherein each optical waveguide in each of the plurality of transmit macros has a first generally linear segment, a second generally linear segment, and a U-shaped segment extending between the first generally linear segment and the second generally linear segment such that an optical input of the first generally linear segment and an optical input of the second generally linear segment are located on the same side of the transmit macro that includes the optical waveguide.

35. 35. The electro-optical chip of claim 34, wherein the plurality of ring resonators comprising a given one of the plurality of transmitter macros are spaced apart along either the first generally linear segment or the second generally linear segment of the optical waveguide in the given one of the plurality of transmitter macros.

36. 27. The electro-optic chip of claim 26, wherein the optical distribution network is a passive photonic device.

37. 1. An optical data communication system, comprising: an optical power supply comprising a plurality of lasers, each of the plurality of lasers configured to generate and output a continuous wave optical beam of a different one of the plurality of wavelengths, such that the continuous wave optical beams output by the plurality of lasers collectively include all of the plurality of wavelengths; an electro-optical chip that is separate and apart from the optical power supply; the electro-optical chip comprising a plurality of transmit macros, each of the plurality of transmit macros comprising an optical waveguide and a plurality of ring resonators disposed along the optical waveguide within an evanescent optical coupling distance of the optical waveguide; the electro-optical chip comprising an optical distribution network implemented on the electro-optical chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network being configured to transmit a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs such that light transmitted to each of one or more of the plurality of optical outputs comprises a wavelength of light transmitted to the subset of the plurality of optical inputs, the subset of the plurality of optical inputs including at least two of the plurality of optical inputs, each of the plurality of optical outputs of the optical distribution network being optically coupled to the optical waveguide in a corresponding one of the plurality of transmit macros; an optical network configured to optically transmit the continuous wave optical beams output by the plurality of lasers in the optical power supply to each of a plurality of optical inputs of the optical distribution network in the electro-optical chip, each of the plurality of optical inputs of the optical distribution network being connected to receive a different one of the continuous wave optical beams output by the plurality of lasers.

38. 38. An optical data communication system according to claim 37, wherein each of the plurality of lasers is thermally connected to at least one other of the plurality of lasers.

39. 38. An optical data communication system according to claim 37, wherein the plurality of lasers are thermally connected together such that a change in temperature of any one of the plurality of lasers causes a change in temperature of other lasers of the plurality of lasers.

40. 38. The optical data communication system of claim 37, wherein each of the plurality of lasers is thermally connected to a common thermally conductive substrate within the optical power supply.

41. 38. An optical data communication system according to claim 37, wherein the optical power supply comprises an optical amplifier configured to increase the optical power level of each of the continuous wave light beams output by the plurality of lasers.

42. 38. An optical data communication system according to claim 37, wherein the optical network comprises a plurality of optical fibres optically connected respectively to the plurality of optical inputs of the optical distribution network.

43. 38. The optical data communication system of claim 37, wherein the electro-optic chip is configured to tune each of the plurality of ring resonators to a respective resonant wavelength that substantially corresponds to one of the plurality of wavelengths of the continuous wave light beams output by the plurality of lasers.

44. 38. The optical data communications system of claim 37, wherein each optical waveguide in each of the plurality of transmit macros has a first generally linear segment, a second generally linear segment, and a U-shaped segment extending between the first generally linear segment and the second generally linear segment such that an optical input of the first generally linear segment and an optical input of the second generally linear segment are located on the same side of the transmit macro comprising the optical waveguide.

45. 45. An optical data communication system as recited in claim 44, wherein the plurality of ring resonators comprising a given one of the plurality of transmit macros are spaced apart along either the first generally linear segment or the second generally linear segment of the optical waveguide in the given one of the plurality of transmit macros.

46. 38. The optical data communications system of claim 37, wherein the optical network comprises a plurality of optical fibers optically connected to the optical power supply, the optical power supply comprising a lens array disposed between outputs of the plurality of lasers and the plurality of optical fibers of the optical network, the lens array comprising a respective lens corresponding to each of the plurality of lasers, the lens for a given one of the plurality of lasers being configured to direct the continuous wave light beam output by the given one of the plurality of lasers onto a facet of a corresponding one of the plurality of optical fibers.

47. 47. The optical data communications system of claim 46, wherein the optical power supply comprises an optical isolator disposed between the lens array and the plurality of optical fibers, the optical isolator configured to prevent light from entering the plurality of lasers.

48. 1. A method for generating a modulated optical data communication signal, comprising: operating the optical power supply to generate a plurality of continuous wave optical beams, each of the plurality of continuous wave optical beams having a different wavelength; transmitting the plurality of continuous wave optical beams from the optical power supply to an electro-optic chip that is separate and apart from the optical power supply; operating the electro-optic chip to multiplex at least a subset of the plurality of continuous wave light beams onto the optical waveguide within the electro-optic chip such that at least a subset of the wavelengths of the plurality of continuous wave light beams are coupled into an optical waveguide, the subset of wavelengths of the plurality of continuous wave light beams comprising at least two distinct wavelengths of continuous wave light; transmitting said at least a subset of said plurality of continuous wave optical beams through said optical waveguide to an optical transmitter portion of an optical macro within said electro-optic chip; operating the optical transmitter portion of the optical macro in the electro-optical chip to modulate one or more of the continuous wave optical beams from within the optical waveguide to generate one or more modulated optical signals conveying digital data; A method comprising:

49. 49. The method of claim 48, comprising: operating the electro-optical chip to multiplex the multiple continuous wave optical beams onto the optical waveguides within the electro-optical chip; and transmitting the multiple continuous wave optical beams received from the optical power supply through an optical distribution network implemented on the electro-optical chip, the optical distribution network having a plurality of optical inputs and a plurality of optical outputs, the optical distribution network being configured to transmit a portion of the light received at the subset of the multiple optical inputs to one or more of the multiple optical outputs such that the light transmitted to one or more of the multiple optical outputs includes all wavelengths of light transmitted to the subset of the multiple optical inputs, one of the multiple optical outputs of the optical distribution network being optically connected to the optical waveguides within the electro-optical chip.

50. 49. The method of claim 48, wherein operating the optical power supply to generate the plurality of continuous wave optical beams comprises operating a plurality of lasers to generate each of the plurality of continuous wave optical beams, the plurality of lasers being thermally coupled together such that a change in temperature of any one of the plurality of lasers causes a change in temperature of other lasers of the plurality of lasers such that a temperature induced drift in the wavelength of any one of the plurality of continuous wave optical beams is accompanied by a corresponding temperature induced drift in the wavelength of the other beams of the plurality of continuous wave optical beams.

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