Ground Side Assembly for Inductive Charging Device

Abstract

The present invention relates to a ground side assembly (1) for an inductive charging device (2) for charging a vehicle (3) on the ground (6), the ground side assembly (1) comprising a coil (1), a core device (10) with at least one core body (11), and a base plate (8). A support post (15) supporting the core device (10) on the base plate (8) has a contoured portion (19), and an electronic device (16) provided in a hollow space (14) between the base plate (8) and the core device (10) is mechanically pressed toward the base plate (8) by means of the contoured portion (19), thereby achieving a higher output of the ground side assembly (1), simplifying its manufacture, and improving its durability.

Description

[Technical field]

[0001] The present invention relates to a ground side assembly for an inductive charging system for inductively charging a motor vehicle.

[0002] A motor vehicle usually has an electric energy storage device, for example a rechargeable battery, for supplying electric loads. In particular, in the case of at least partially electrically driven motor vehicles, an electric energy storage device, also referred to hereinafter as a battery, is also used to drive the motor vehicle, i.e., in particular a traction battery.

[0003] In order to recharge such an energy accumulator, it is conceivable to electrically connect the energy accumulator directly to a source of electrical energy, such as a charging point, a mains terminal, and the like, which usually requires manual action by the user, among other things, to make the aforementioned electrical connection.

[0004] It is also known to inductively charge motor vehicles, i.e. in particular the battery. A corresponding charging device has one assembly inside and one assembly outside the motor vehicle. A primary coil is located in a stationary assembly outside the motor vehicle, which inductively cooperates with a secondary coil of an assembly inside the motor vehicle in order to charge the motor vehicle. The assembly inside the motor vehicle is also called the vehicle side assembly or "vehicle assembly". The assembly outside the motor vehicle is essentially located below the motor vehicle during operation and is also called the ground side assembly or "ground assembly".

[0005] During operation of the ground side assembly, heat is generated which may result in damage to the ground side assembly and / or reduced power output of the ground side assembly.

[0006] The object of the present invention is to provide an improved or at least another embodiment of a ground side assembly of the above-mentioned type, which in particular overcomes the drawbacks of the prior art, and in particular to provide an improved or at least another embodiment of a ground side assembly which excels in terms of higher power output and / or improved durability and / or simplified manufacture.

[0007] The above problem is solved according to the invention by the subject matter of the independent claim 1. Advantageous embodiments are the subject matter of the dependent claims.

[0008] The invention is therefore based on the general idea of ​​mechanically pressing the electronics of the ground side assembly towards the base plate of the ground side assembly by means of the profile of the support pillar. This allows the electronics to be easily positioned in a defined manner relative to the base plate, thus improving the heat transfer between the electronics and the base plate and simplifying the manufacture. Due to the improved heat transfer between the electronics and the base plate, the electronics can be cooled more easily during operation. This allows the ground side assembly to be operated with a higher power output. In particular, a power reduction, also known as "derating", which is deliberately carried out to avoid thermal damage, is thus avoided or at least reduced. As a result, the ground side assembly can be operated with a higher power output even in the case of an increased ambient temperature. Furthermore, damage to the ground side assembly, in particular to the electronics, which occurs due to an increased temperature is thus avoided or at least reduced. As a result, the life span of the ground side assembly is extended and thus its durability is improved.

[0009] According to the concept of the invention, the ground side assembly comprises a base plate and a coil, which are spaced apart from each other in a direction, hereinafter also referred to as the spacing direction. The ground side assembly further comprises a core arrangement with at least one core body for guiding the magnetic flux. The core arrangement is spaced apart from the base plate and the coil in the spacing direction. Furthermore, the core arrangement is arranged between the base plate and the coil. Between the core arrangement and the base plate, a hollow space is formed. At least one body extends between at least one of the at least one core bodies and the base plate, which body extends through the hollow space in the spacing direction and supports the core arrangement on the base plate. This body is hereinafter also referred to as a support pillar. At least one of the support pillars has a contoured portion. In the hollow space, electronic devices of the ground side assembly are further arranged. In this case, the electronic devices are mechanically pressed against the base plate in the spacing direction by means of at least one of the at least one contoured portion.

[0010] A "contour" of a support column in this context is to be understood as a cross-section of the support column that varies in the spacing direction, meaning that the extent of the support column varies along the spacing direction and transversely to the spacing direction, whereby at least one such contour is present.

[0011] At least one contoured portion may extend in a circular manner around the corresponding support post in the spacing direction, in particular in a circular manner around the corresponding support post, and in particular the contoured portion may be symmetrical with respect to a rotation about the spacing direction.

[0012] It is likewise conceivable that at least one contour is arranged only locally around the spacing direction in a circular manner, the contour being accordingly asymmetric with respect to rotation about the spacing direction.

[0013] Each support pillar may have any basic shape. In particular, each support pillar may have a basic shape that is at least two-fold symmetric with respect to a rotation about the spacing direction. In particular, it is conceivable that at least one support pillar has a cylindrical basic shape.

[0014] The ground side assembly is used in a charging device for inductively charging an electric energy store, also referred to below as a battery, of a motor vehicle. In this case, the ground side assembly is stationary and cooperates for this purpose with an assembly of the motor vehicle. In the charging device, the coil of the ground side assembly as a primary coil cooperates with a secondary coil of an assembly on the side of and / or within the motor vehicle. During operation, the primary coil generates an alternating magnetic field which inductively cooperates with the secondary coil.

[0015] For this purpose the ground side assembly is usually located on the ground or inserted into a recess in the ground, with the spacing direction extending along the vertical direction so that the base plate of the ground side assembly is arranged downward along the vertical direction.

[0016] The ground side assembly is designed to transfer mechanical loads acting on it during operation without damage to the base plate and from there to the ground or into a recess formed in the ground, meaning that the ground side assembly is designed so that a car can park on it and / or drive over it without causing damage to the ground side assembly, in which case at least one support pillar is used inter alia to transfer the loads to the base plate so that the core device remains undamaged.

[0017] Each support pillar extends only locally in the cavity in a direction transverse to the spacing direction, which means, inter alia, that at least one support pillar penetrates the cavity but does not fill it.

[0018] Preferably, at least one of the at least one core body, particularly preferably each core body, rests locally with its underside facing the base plate on one of the at least one support pillar, which means that the underside rests on the support pillar over a smaller area than the entire underside, i.e. a local load transfer from the core body to the support pillar is achieved, which reduces the risk of damage, in particular the risk of breakage, of the core body due to the resulting reduction in bending loads.

[0019] In principle, the ground side assembly may have only one such support pillar, but preferably the ground side assembly has at least two support pillars spaced apart from each other in a direction transverse to the spacing direction.

[0020] Each support pillar is advantageously fixed to the base plate, at least when the ground-side assembly is located on and / or in the ground, resulting in a defined and set distance from the support pillar to the base plate and thus a corresponding defined and set distance from the contour to the base plate, resulting in a defined and / or set mechanical pressure on the electronic device in the direction of the base plate.

[0021] The fixing of the respective support column on the base plate can be carried out optionally, for example by a material-bonded connection between the support column and the base plate, for example via an adhesive connection, alternatively or additionally, the respective support column can also be fixed to the base plate via a screw connection.

[0022] The electronics are advantageously used to operate the ground side assembly, and may in particular be used to power the coils of the ground side assembly, i.e. the electronics may in particular be power electronics.

[0023] The electronic device advantageously comprises a printed circuit board, also known to those skilled in the art by the abbreviation "PCB", and / or at least one electronic component, in particular at least one electronic power component. Advantageously, at least one of the electronic components is arranged on the side of the electronic device that faces the base plate. Since such components usually generate high heat during operation, the cooling of the component via the base plate is thereby improved.

[0024] Preferably, the electronic device comprises at least a printed circuit board on which such electronic components are mounted, whereby an embodiment in which at least one of the components is arranged on the side of the printed circuit board facing the base plate is particularly preferred.

[0025] That is, the base plate is used not only for supporting the support mast and thus for transferring loads to the ground and / or to the recess in the ground, but also for temperature regulation, in particular for cooling, of the ground-side assemblies, in particular the electronic devices, i.e. the base plate is at the same time a cooling plate.

[0026] Preferably, the base plate is further adapted to shield against magnetic and / or electromagnetic radiation, for which purpose it is for example manufactured from a metal or a metal alloy.

[0027] The base plate may have at least one flowable channel through which fluid may flow during operation to, among other things, absorb heat in order to improve thermal regulation of the ground side assembly.

[0028] In an advantageous embodiment, a thermal interface material, also known as "TIM", is arranged between the electronic device and the base plate, which improves the heat transfer between the electronic device and the base plate and thus, inter alia, the cooling of the electronic device.

[0029] In this case, it is preferred if the thermal interface material is in direct contact with the electronic device and / or the base plate, which further improves the heat transfer between the electronic device and the base plate.

[0030] In a preferred embodiment, the thermal interface material is pressed against the base plate by a pressure acting on the electronic device with a contour, which means that the electronic device is mechanically pressed against the base plate with a contour, thereby pressing the thermal interface material against the base plate. This results in an improved and / or larger area of ​​thermal contact between the base plate and the thermal interface material and between the thermal interface material and the electronic device. As a result, the heat transfer between the electronic device and the base plate is improved.

[0031] It is considered to be preferred that the thermal interface material is elastic in the spacing direction and that the thermal interface material is compressed in the spacing direction by pressing. The thermal interface material is compressed, which reduces the thermal contact resistance between the electronic device and the base plate. As a result, the heat transfer between the electronic device and the base plate is further improved. In addition, the thermal interface material provides compensation for changes in the spacing direction that may occur during operation and / or during the life of the assembly due to its elastic properties. In other words, the elastic properties of the thermal interface material and the pressing of the thermal interface material against the base plate with at least one contour additionally ensure that compensation for possible spacing changes that may be due to heat and / or wear is performed and at the same time that the thermal connection between the base plate and the electronic device remains obtained. This means that the heat transfer over the life of the ground side assembly and / or during the operation of the ground side assembly is improved and stabilized.

[0032] In principle, it is possible to place the thermal interface material completely and entirely between the electronic circuitry and the base plate, which means that the interface material is completely placed between the electronic circuitry and the base plate.

[0033] It is also conceivable to arrange the thermal interface material only in areas where high heat is generated. These areas include, inter alia, electronic components of the electronic device. Correspondingly, the thermal interface material may be arranged only locally between at least one electronic component and the base plate.

[0034] The thermal interface material can in principle be any material.

[0035] In particular, the thermal interface material may be made of at least one polymer filled with thermally conductive particles. In this case, the filled polymer may be applied as a curable paste, for example by screen printing, dispensing, etc. Curing may be performed in the fully assembled state, i.e. in a sandwich structure between the base plate and the electronics. Similarly, curing may be performed only on one side, i.e. applied to the base plate or applied to the electronics.

[0036] In a preferred embodiment, the thermal interface material is compressed against the base plate by pressing the electronic device towards the base plate with a set pressure, advantageously this pressure being at least 0.1 bar, preferably at least 0.5 bar, particularly preferably at least 1 bar.

[0037] The pressing of the electronic device towards the base plate by means of the at least one contour may be performed directly by means of the at least one contour or indirectly by means of the at least one contour. Of course, it is also conceivable that the at least one contour directly presses the electronic device towards the base plate and that the at least one contour indirectly presses the electronic device or another electronic device against the base plate.

[0038] In the case of direct pressing with the contour, the electronic device, preferably a printed circuit board, is in direct mechanical contact with the contour.

[0039] In this case, at least one of the at least one contour preferably mechanically presses the electronic device, in particular the printed circuit board, directly against the base plate in the distance direction, whereby the contour is advantageously arranged on the side of the electronic device, in particular the printed circuit board, facing away from the base plate.

[0040] In the case of indirect pressing by means of a contour, a further body, also referred to below as a pressing part, is provided between the contour and the electronic device. In this case, the contour acts mechanically on the pressing part, which itself mechanically presses the electronic device in the direction of the base plate. Advantageously, in this case, the pressing part is in direct mechanical contact with both the contour and the electronic device.

[0041] At least one pressing part is preferably arranged in the hollow chamber, whereby at least one of the at least one contour parts of the at least one support post mechanically presses at least one of the at least one pressing part in the direction of the base plate, whereby the at least one pressing part mechanically presses the electronic device against the base plate in the spacing direction.

[0042] In a preferred embodiment, the presser parts are manufactured from a material that is as magnetically and / or electromagnetically inert as possible, preferably plastic, i.e. at least one presser part is preferably a plastic body. This eliminates or at least reduces the interaction of the presser parts with the magnetic and / or electromagnetic fields present in the cavity during operation. This reduces the interference with the function of the ground side assembly. The plastic is preferably a plastic with a low creep tendency, in particular polyamide, abbreviated as "PA", and / or polyethersulfone, abbreviated as "PES".

[0043] An embodiment is advantageous in which at least one of the at least one pressing portion is a spring element acting in the spacing direction, which makes it possible to compensate for spacing changes in the spacing direction, which occur, inter alia, during operation, for example due to heat, so that the electronic device and / or the thermal interface material are pressed towards the base plate with a set and / or defined pressure. Furthermore, the spring element makes it possible to simplify the manufacture of the ground side assembly.

[0044] In order to form the pressure element as a spring element, the pressure element can be manufactured from a flat material by material deformation.

[0045] At least one of the profiles may be molded into, or monolithic with, the corresponding support post.

[0046] Likewise, at least one of the profiles may be non-displaceably attached to the corresponding support post, which means that the profile and the support post can be manufactured separately and then attached to one another.

[0047] It is also conceivable that at least one of the at least one profile can be displaced in the spacing direction on the corresponding support column, so that the distance from the profile to the electronic device and thus the mechanical pressure, in particular the pressure, caused by the profile can be changed by the displacement of the profile. As a result, in particular if necessary, for example after a certain period of operation of the ground-side assembly, the profile can be displaced in the spacing direction in order to adapt the pressure acting on the electronic device accordingly. Likewise, when installing the ground-side assembly, this allows a simple adaptation of the pressure to the local situation.

[0048] The spacing-wise displacement of the contours on the corresponding support posts may in principle be realised in any way.

[0049] For this purpose it is conceivable to attach the profile to the support post by means of screws.

[0050] The coil of the ground side assembly may in principle be of any configuration. Advantageously, the coil has at least one coil winding. It is also conceivable that the coil has two or more coil windings.

[0051] In a preferred embodiment, the coil is formed as a flat coil, which allows for a compact construction of the ground side assembly and / or a larger area of ​​cooperation with the secondary coil.

[0052] At least one core body of the core device is used to guide the magnetic flux of the magnetic field generated by the coil, as described above. The at least one core body is configured accordingly. In this case, the core device ensures that the propagation of the magnetic field in the direction of the base plate is blocked or at least reduced. This, inter alia, reduces energy losses and, as a result, increases efficiency. For this purpose, the at least one core body preferably has a relative permeability μ of at least 2. r That is, the relative permeability μ r Regarding μ r ≧2. Furthermore, at least one core body is electrically isolated from the coil for this purpose. In particular, the core body is a ferrite body. In this case, it is advantageous if at least one core body extends in a plate-like manner in a direction transverse to the spacing direction, i.e. each core body is preferably a ferrite plate.

[0053] Preferably, the core device comprises at least two core bodies and the ground side assembly comprises one corresponding support post for each core body.

[0054] It is particularly preferred if the assembly has one such corresponding support column for each core body. In this case, each support column extends between the corresponding core body and the base plate in the spacing direction and supports the corresponding core body on the base plate. Particularly preferably, at least one of the at least one core body, advantageously each core body, rests exclusively on the corresponding support column with its underside facing towards the base plate. The transmission of loads in the spacing direction in the direction of the base plate is therefore carried out exclusively via the corresponding support column. This reduces the bending loads of the at least one core body and thus the risk of damage and / or destruction of the at least one core body in a particularly effective manner.

[0055] It is conceivable for the electronics to extend over the entire base plate, meaning that the electronics can cover the entire base plate.

[0056] It is conceivable that the electronic device has at least two electronics modules, each of which can have a printed circuit board and at least one electronic component, whereby at least one of the electronics modules, preferably each electronics module, is pressed towards the base plate by means of at least one such contour.

[0057] Advantageously, the electronics or electronics module only partially covers the base plate, whereby the base plate remains partially exposed, and thus the base plate also temperature-conditions, in particular cools, the cavity and / or the core device and / or the coil.

[0058] Further important features and advantages of the invention are evident from the dependent claims, the drawings and the corresponding drawing description based on the drawings.

[0059] It is self-evident that the features mentioned above and those further described below can be used not only in the respective combinations described, but also in other combinations or alone without departing from the scope of the invention.

[0060] Preferred embodiments of the present invention are illustrated in the drawings and will be described in more detail in the following description, where like reference numbers refer to the same or similar or functionally identical components. [Brief description of the drawings]

[0061] [Figure 1] FIG. 1 is a highly simplified schematic diagram of an inductive charging system including a ground side assembly and a vehicle. [Diagram 2] FIG. 2 is a schematic diagram showing another embodiment of FIG. 1. [Diagram 3] FIG. 2 is a schematic cross-sectional view of the ground side assembly in the region of the support pillars. [Figure 4] 13 is a schematic cross-sectional view of a ground side assembly according to another embodiment. [Diagram 5] 11A-11C are schematic side views of a support column in another embodiment. [Figure 6] 11A-11C are schematic side views of a support column in another embodiment. [Figure 7] 11A-11C are schematic side views of a support column in another embodiment. [Figure 8] 11A-11C are schematic side views of a support column in another embodiment.

[0062] A ground side assembly 1, as shown for example in Figs. 1 to 4, is used in a charging device 2, which is shown by way of example in a highly simplified manner in Figs. 1 and 2, for inductively charging an electric energy store, not shown, of a motor vehicle 3. To inductively charge the electric energy store, the ground side assembly 1 cooperates with a corresponding assembly 4 of the motor vehicle 3. This interaction is performed by a coil 5 of the ground side assembly 1, which is used as a primary coil 5 of the charging device 2, and a secondary coil, not shown, of the assembly 4 of the motor vehicle 3. In the embodiment shown in Figs. 3 and 4, the coil 5 has at least one coil winding 9 and is formed as a flat coil 20. The motor vehicle 3 is located on the ground 6, in particular parked on the ground 6, for inductive charging with the charging device 2. In the embodiment shown in Fig. 1, the ground side assembly 1 is arranged on the ground 6 and rests on the ground 6. In the embodiment shown in Fig. 2, the ground side assembly 1 is arranged in a recess and inserted into the ground 6, so that the ground side assembly 1 more or less terminates at the ground 6.

[0063] The ground side assembly 1 comprises a plate 8 by means of which it rests on the ground 6 or in a recess, the plate 8 being also called base plate 8 in the following. The base plate 8 is spaced apart from the coil 5 in a direction 7, also called spacing direction 7 in the following. In this case, the spacing direction 7 extends along the vertical direction and corresponds in particular to a surface normal of the base plate 8.

[0064] As can be seen from Figs. 3 and 4, the ground side assembly 1 further comprises a core arrangement 10 including at least one core body 11 for guiding the magnetic flux. The core arrangement 10 is spaced apart from the base plate 8 in the spacing direction 7. Furthermore, the core arrangement 10 is arranged between the base plate 8 and the coil 5 in the spacing direction 7. That is, a cavity 14 is formed between the core arrangement 10 and the base plate 8. In the illustrated embodiment, the core arrangement 10 comprises at least two core bodies 11 spaced apart from each other. In the illustrated embodiment, the core bodies 11 are formed as ferrite bodies 21 extending in a plate shape in a direction transverse to the spacing direction 7. At least one body 15 extends between at least one of the at least one core bodies 11 and the base plate 8, which body 15 extends through the cavity 14 in the spacing direction 7 and supports the core arrangement 10 on the base plate 8. The body 15 is also referred to as a support column 15 in the following. In the illustrated embodiment, a corresponding support column 15 is provided for each core body 11, which extends in the spacing direction 7 from the base plate 8 towards the corresponding core body 11, thereby inter alia supporting the corresponding core body 11 on the base plate 8. Preferably, in this case, each support column 15 abuts locally on the center of the corresponding core body 11. In the hollow space 14, electronic devices 16 for feeding, for example, the coils 5 of the ground side assembly 1 are arranged. As can be seen from Figs. 3 to 8, in this case at least one of the at least one support column 15 has a contour 19. As can be seen from Figs. 3 and 4, the electronic device 16 is mechanically pressed against the base plate 8 in the spacing direction 7 by means of at least one of the at least one contour 19. This improves the heat transfer between the electronic device 16 and the base plate 8. As a result, the temperature regulation of the electronic device 16 via the base plate 8 is improved. In particular, the cooling of the electronic device 16 via the base plate 8 is thus improved. As a result, temperature regulation of the electronic device 16 is thus simplified.Correspondingly, the electronics 16 and thus the ground side assembly 1 can be operated at a higher power output and / or at least the so-called "derating", where the power output of the ground side assembly 1 is intentionally reduced due to an increase in temperature in order to avoid, among other things, damage, can be reduced, resulting in the ground side assembly 1 being operated at a higher power output and / or at least damage to the ground side assembly 1 due to heat generated during operation can be reduced.

[0065] By "contour 19" is to be understood a cross-section of the corresponding support post 15 which varies along the spacing direction 7, as can be seen by way of example from figures 3 to 8. In this case, this variation in cross-section is such that a mechanical pressure can be exerted on the electronic device 16 in the direction of the base plate 8, preferably by means of a form-locking connection.

[0066] The mechanical pressing of the electronic device 16 by means of the contour 19 may be performed directly by means of the contour 19, as can be seen from Fig. 3. Alternatively or additionally, the mechanical pressing of the electronic device 16 may be performed indirectly via a body 23, also referred to below as a pressing part 23, which mechanically cooperates with the contour 19 and the electronic device 16, as can be seen from Fig. 4. The pressing part 23 is arranged between the contour 19 and the electronic device 16 in the illustrated embodiment and is in direct contact with the contour 19 and the electronic device 16.

[0067] Each support column 15 is in contact with the base plate 8 at least during operation of the ground-side assembly 1. In the illustrated embodiment, each support column 15 is preferably mechanically fixed to the base plate 8 on the side of the support column 15 facing the base plate 8. This results in a defined support of the core device 10 on the base plate 8. This further makes it possible to set a defined distance in the distance direction 7 between the support column 15, and thus the contour 19, and the base plate 8 and / or to limit the variation of this distance. As a result, the electronic device 16 is mechanically pressed uniformly or constantly against the base plate 8 by means of the at least one contour 19. This improves the heat transfer between the electronic device 16 and the base plate 8. The fixing of the respective support column 15 to the base plate 8 can in this case be realized by material bonding via an adhesive connection 27, as can be seen from FIGS. 3 and 4, and / or via a screw connection 28, as can be seen from FIG. 3. If a screw connection 28 is provided, then preferably in the region of the screw connection 28 a seal 31 is provided, as can also be seen in FIG. 3, by which the opening required for the screw connection 28 is sealed so that the cavity 14 is sealed against the outside.

[0068] The electronic device 16 is held in the cavity 14 in the spacing direction 7 by mechanically pressing the electronic device 16 in the direction towards the base plate 8 by means of at least one contour 19. As can be seen from Fig. 4, other measures can be implemented to hold the electronic device 16 in a direction transverse to the spacing direction 7. In the embodiment shown in Fig. 4, at least one connecting dome 29 protrudes from the base plate 8 for this purpose. In this case, the connecting dome 29 advantageously allows a movement of the electronic device 16 in the spacing direction 7.

[0069] In the embodiment shown, the electronic device 16 comprises, by way of example only, a printed circuit board 17 and an electronic component 18, which is only shown in Fig. 4 and is mounted on the printed circuit board 17. The electronic component 18 is, in particular, an electronic component of power electronics. As can be seen from Fig. 4, the electronic component 18 is preferably arranged on the side of the electronic device 16, in particular of the printed circuit board 17, which faces towards the base plate 8. Since the component 18 usually generates a high amount of heat during operation, the cooling of the component 18 via the base plate 8 is thereby made more efficient and improved.

[0070] In the illustrated embodiment, as can be seen from Figs. 3 and 4, a thermal interface material 22, also known by the abbreviation "TIM", is arranged between the electronic device 16 and the base plate 8. The thermal interface material 22 is preferably placed planarly on the electronic device 16 and on the base plate 8 and improves the heat transfer between the electronic device 16 and the base plate 8. This improves, among other things, the cooling of the electronic device 16, which results in a higher possible power output of the ground side assembly 1 and / or a reduced derating and / or an increased life span. In this case, the thermal interface material 22 is pressed against the base plate 8 by a pressure acting on the electronic device 16 by means of the contour 19 in the illustrated embodiment. This improves the contact of the thermal interface material 22 with both the electronic device 16 and the base plate 8, i.e. the heat transfer between the electronic device 16 and the base plate 8 as a whole is improved. In the illustrated embodiment, the thermal interface material 22 is elastic in the spacing direction 7, and the thermal interface material 22 is compressed in the spacing direction 7 by the pressure. This reduces the thermal resistance between the base plate 8 and the electronic device 16, which results in a further improvement in the heat transfer between the electronic device 16 and the base plate 8. The elastic properties of the thermal interface material 22 and the mechanical pressing further compensate for spacing changes in the spacing direction 7, which occur, for example, over the life of the ground-side assembly 1. This improves the thermal connection between the electronic device 16 and the base plate 8 even if such spacing changes occur. Furthermore, the elastic properties of the thermal interface material 22 compensate for changes in the mechanical pressing on the electronic device 16. This means that in this way the electronic device 16 is pressed against the base plate 8 with a defined force or a defined pressure, which remains maintained even if the aforementioned spacing changes occur. This further improves the heat transfer between the electronic device 16 and the base plate 8 even if the aforementioned spacing changes occur. Furthermore, damage to the electronic device 16 can be avoided or at least reduced in this way.As can be seen from Fig. 3, in this case the thermal interface material 22 may be arranged all over between the electronic device 16 and the base plate 8, the thermal interface material 22 being cut out in the area of ​​the support pillars 15, so that the support pillars 15 are supported on the base plate 8 through the electronic device 16 and the thermal interface material 22. Alternatively, as can be seen from Fig. 4, the thermal interface material 22 may be arranged only in the areas where high heat is generated between the base plate 8 and the electronic device 16. These areas where high heat is generated are the electronic components 18 as mentioned above, therefore in the embodiment shown in Fig. 4 the thermal interface material 22 is only arranged locally between the components 18 and the base plate 8.

[0071] 3, in which the contour 19 of the visible support post 15 mechanically presses the electronic device 16 directly against the base plate 8 in the spacing direction 7, the contour 19 is formed step-like by way of example only and rests directly on the side of the electronic device 16 facing away from the base plate 8. As a result, the support post 15 mechanically presses the electronic device 16 in the direction of the base plate 8 via the contour 19.

[0072] In the case of the embodiment shown in FIG. 4, in which the visible contours 19 of the support columns 15 indirectly press the electronic device 16 towards the base plate 8 via the pressure elements 23 arranged in the cavity 14, each support column 15 has at least one projection 30 which projects transversely to the spacing direction 7, merely by way of example, in order to form the corresponding contours 19. The pressure elements 23 are sandwiched between the projection 30 and the electronic device 16, in particular between the printed circuit board 17, so that the pressure elements 23 mechanically press the electronic device 16 towards the base plate 8. In this case, the pressure elements 23 abut against at least one corresponding contour 19 of each of the at least one support column 15 and against the electronic device 16. In the embodiment shown, the pressure elements 23 abut directly against the corresponding contours 19 associated with the two support columns 15 and against the printed circuit board 17.

[0073] The pressure element 23 is manufactured from a magnetically and / or electromagnetically inert, preferably dielectric and / or electrically insulating material so as to influence as little as possible the magnetic and / or electromagnetic fields present in the cavity 14 during operation. In this case, the pressure element 23 is in particular a plastic body 24. In the exemplary embodiment shown in FIG. 4, the pressure element 23 is further formed as a spring element 25 which acts resiliently in the spacing direction 7. For this purpose, the pressure element 23 is manufactured from a thin-walled material in the exemplary embodiment shown and is correspondingly shaped.

[0074] The base plate 8 is advantageously manufactured from a metal or metal alloy, which improves the heat transfer between the base plate 8 and the electronics 16. Furthermore, the base plate 18 can thus simultaneously be used as a magnetic and / or electromagnetic shield for the ground-side assembly 1. In the illustrated embodiment, the base plate 8 is further provided with channels 32 through which a fluid can flow during operation. This allows for a heat transfer between the base plate 8 and the fluid, which improves the temperature regulation of the electronics 16. During operation, the fluid absorbs heat, inter alia, from the base plate 8, which in turn cools the electronics 16 better.

[0075] 3 and 4, the base plate 8 extends over the electronics 16 in a direction transverse to the spacing direction 7. The base plate 8 therefore also temperature-conditions the cavity 14, so that the cavity 14 and thus also the core arrangement 10 and / or the coil 5 are temperature-conditioned and in particular cooled by the base plate 8.

[0076] Each profile 19 may be molded on the corresponding support column 15 and therefore monolithic with the corresponding support column 15. Likewise, the profile 19 may be manufactured separately and subsequently attached to the corresponding support column 15. It is also conceivable that at least one of the profiles 19 is attached to the corresponding support column 15 so as to be displaceable in the spacing direction 7. Thus, for example, the mechanical pressure on the electronic device 16 in the direction of the base plate 8 can be varied as required. Furthermore, the ground side assembly 1 can be easily assembled in this way. The arrangement of the profile 19 on the corresponding support column 15 so as to be displaceable in the spacing direction may be carried out, for example, via a screw 26, which is only shown in FIG. 4.

[0077] 5 to 8 show further embodiments of the contour 19 in a side view of the support pillar 15. In the embodiment of FIG. 5, the support pillar 15 is formed in a stepped manner, the cross section of which increases stepwise in the spacing direction 7 on the core device 10 in order to form the contour 19. The embodiment of FIG. 6 differs from the embodiment shown in FIG. 4 in that a protrusion 30 is arranged in the center of the support pillar 15 in the spacing direction 7. In the embodiment of FIG. 7, the support pillar 15 has a depression 33 extending transversely to the spacing direction 7 in order to form the contour 19. In the embodiment shown in FIG. 8, the support pillar 15 has at least one projection 34 protruding outward in a transverse direction to the spacing direction 7. The respective contour 19 may in this case be symmetrically and annularly circumferential and / or may only be provided locally on the corresponding support pillar 15.

[0078] As can be seen from Figures 3 and 4, the ground side assembly 1 has a holding part 12 for holding the core device 10 in the illustrated embodiment. The core device 10 is held in this case by the holding part 12 on the ground side assembly 1 and supported on the base plate 8. The holding part 12 has support columns 15 for supporting the core device 10. Furthermore, the holding part 12 has a holding structure 13 spaced apart from the base plate 8 in the spacing direction 7, and the at least one core body 11 is arranged on the side of the holding structure 13 opposite the base plate 8 and is positioned by the holding structure 13 in a plane extending in a direction transverse to the spacing direction 7.

[0079] As can further be seen from Figures 3 and 4, the ground side assembly 1 has, on the side opposite the core device 10 in the spacing direction 7, an upper structure 35 which holds the coils 5 and is mechanically connected with the holder 12 in such a way that loads acting on the ground side assembly 1, for example by the vehicle 3, are transferred from this structure 35 to the support pole 15 and then to the base plate 8. The structure 35 and the holder 12 are in this case designed in such a way that this can be done without damage. Accordingly, the structure 35, the holder 12 and the base plate 8, among others, are designed with regard to their mechanical stability and supporting capacity.

Claims

1. A ground side assembly (1) for an inductive charging device (2) for inductively charging a vehicle (3) above the ground (6), comprising: The ground side assembly (1) comprises a base plate (8) and a coil (5) spaced apart from each other in a spacing direction (7); The ground side assembly (1) includes a core device (10) having at least one core body (11) for guiding magnetic flux, the core device (10) being spaced apart from the base plate (8) and the coil (5) in the spacing direction (7) and being disposed between the base plate (8) and the coil (5); A cavity (14) is formed between the core device (10) and the base plate (8), at least one support pillar (15) extends between at least one of the at least one core body (11) and the base plate (8), the support pillar (15) extending through the cavity (14) in the spacing direction (7) and supporting the core device (10) on the base plate (8); An electronic device (16) is disposed within the cavity (14); At least one of the at least one support posts (15) has a contoured portion (19); the electronic device (16) is mechanically pressed against the base plate (8) in the spacing direction (7) by means of at least one of the at least one contour portion (19); Ground side assembly (1).

2. a thermal interface material (22) is disposed between the electronic device (16) and the base plate (8), and the thermal interface material (22) is pressed against the base plate (8) by the pressing force acting on the electronic device (16) using the contoured portion (19); The ground side assembly of claim 1 .

3. The thermal interface material (22) is elastic in the spacing direction (7); The thermal interface material (22) is compressed in the spacing direction (7) by the pressing. The ground side assembly of claim 2.

4. At least one of the at least one contour portion (19) mechanically presses the electronic device (16) directly against the base plate (8) in the spacing direction (7). A ground side assembly according to any one of claims 1 to 3.

5. The contour portion (19) is placed on a side of the electronic device (16) opposite to the base plate (8).

5. The ground side assembly of claim 4.

6. At least one pressing portion (23) is disposed within the cavity (14); at least one of the at least one contour portion (19) mechanically presses at least one of the at least one pressing portion (23) in the direction of the base plate (8), whereby the at least one pressing portion (23) mechanically presses the electronic device (16) against the base plate (8) in the spacing direction (7); A ground side assembly according to any one of claims 1 to 5.

7. At least one of the at least one pressing portion (23) abuts against at least one of the at least one corresponding contour portion (19) and against the electronic device (16).

7. The ground side assembly of claim 6.

8. At least one of the at least one pressing part (23) is electrically insulating, in particular a plastic body (24); A ground side assembly according to claim 6 or 7.

9. At least one of the at least one pressing portion (23) is a spring member (25) acting in the spacing direction (7). A ground side assembly according to any one of claims 6 to 8.

10. At least one of the at least one contour portion (19) is displaceable in the spacing direction (7) on the corresponding support column (15). A ground side assembly according to any one of the preceding claims.

11. At least one of the at least one support pillars (15) is attached to the corresponding support pillar (15) via a screw (26) and is thereby displaceable in the spacing direction (7). The ground side assembly of claim 10.

12. The electronic device (16) has a printed circuit board (17), and the electronic device (16) is mechanically pressed against the base plate via the printed circuit board (17). A ground side assembly according to any one of the preceding claims.

13. The electronic device (16) has at least one electronic component (18), the electronic component (18) being arranged on a side of the electronic device (16) facing the base plate (8). A ground side assembly according to any one of claims 1 to 12.

14. at least one of the at least one support pillars (15) is connected to the base plate (8) by a material bond, in particular via an adhesive connection (27); A ground side assembly according to any one of the preceding claims.

15. At least one of the at least one support pillars (15) is connected to the base plate (8) via a screw connection (28). A ground side assembly according to any one of claims 1 to 14.

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