Method for manufacturing a spectrometer device

Abstract

The present invention relates to a method for manufacturing at least one spectrometer device (110) for evaluating electromagnetic radiation, the method comprising the following steps: a) providing at least one electro-optical system (114) configured to generate at least one electronic signal in response to electromagnetic radiation; b) providing at least one readout integrated circuit (ROIC) (116) for processing at least one electronic signal; c) providing at least one circuit carrier (112); d) disposing the electro-optical system (114) on the ROIC (116); e) coupling the electro-optical system (114) and the ROIC (116) so as to establish at least one electrical connection between the electro-optical system (114) and the ROIC (116); f) placing the ROIC (116) on the circuit carrier (112) such that the ROIC (116) is located between the electro-optical system (114) and the circuit carrier (112); Includes. Additionally, a spectrometer device (110) for evaluating electromagnetic radiation is disclosed.

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing at least one spectrometer device for evaluating electromagnetic radiation.Furthermore, the present invention relates to a spectrometer device for evaluating electromagnetic radiation.Spectrometer devices can generally be employed in various fields for sensing, monitoring and detection purposes, such as, for example, medical and physiological diagnostics and research, as well as quality control and various other fields.However, further applications are possible. [Background technology]

[0002] Various spectrometer devices for evaluating electromagnetic radiation and methods for their manufacture are known. Thus, in general, spectrometer devices are known that collect information on the composition of electromagnetic radiation from an object when it irradiates, reflects and / or absorbs electromagnetic radiation. Depending on the intended application, the size and complexity of the spectrometer devices vary. In order to integrate the spectrometer device in known devices, such as consumer devices, household devices, portable devices, etc., the spectrometer device must be very compact. In particular, the substrate or lateral space, such as the available installation space for the spectrometer device on a circuit board of a consumer device, is limited.

[0003] Furthermore, stray and diffracted light can lead to erroneous or distorted measurements, phenomena that are becoming increasingly sensitive with the trend towards smaller footprints and higher system densities. Summary of the Invention [Problem to be solved by the invention]

[0004] It is therefore desirable to provide a method and apparatus which at least substantially avoids the disadvantages of known methods and apparatus. In particular, it is an object of the present invention to provide a method and apparatus which aims at a compact yet reliable spectrometer device. [Means for solving the problem]

[0005] This problem is addressed by a method for manufacturing at least one spectroscopic device for evaluating electromagnetic radiation and a spectroscopic device for evaluating electromagnetic radiation with the features of the independent claims. Advantageous embodiments, which can be realized independently or in any combination, are set out in the dependent claims and in the entire specification.

[0006] The terms "having", "comprises" or "including" as used herein, or any grammatical variants thereof, are used non-exclusively. Thus, these terms refer both to the situation where, apart from the features introduced by these terms, no further features are present in the entity described in this context, and to the situation where one or more further features are present. As an example, the expressions "A has B", "A comprises B" and "A includes B" refer both to the situation where, apart from B, no other elements are present in A (i.e., A consists solely and exclusively of B), and to the situation where, apart from B, one or more further elements are present in the entity A, such as element C, elements C and D, or further elements.

[0007] Furthermore, it should be noted that the terms "at least one," "one or more," or similar language indicating that a feature or element may be present more than one time, are typically used only once when introducing each feature or element. In most cases, when referring to each feature or element, the language "at least one" or "one or more" will not be repeated, despite the fact that each feature or element may be present more than one time.

[0008] Furthermore, as used herein, the terms "preferably", "more preferably", "particularly", "more particularly", "particularly", "more particularly" or similar terms are used in connection with any feature without limiting the possibility of alternatives. Features introduced by these terms are thus optional features and are not intended to limit the scope of the claims in any way. The invention can be practiced with alternative features, as will be recognized by those skilled in the art. Similarly, features introduced by "in one embodiment of the invention" or similar expressions are intended to be optional features, without any limitation regarding alternative embodiments of the invention, without any limitation regarding the scope of the invention, and without any limitation regarding the possibility of combining the feature so introduced with other optional or non-optional features of the invention.

[0009] Aspects of the invention In a first aspect, the present invention relates to a method for manufacturing at least one spectrometer device for evaluating electromagnetic radiation. The method may also be referred to as a "manufacturing method". The method comprises the following method steps, which may be performed in a given order. However, different orders are possible. Furthermore, one, more than one or all of the method steps may be performed once or repeatedly. Furthermore, the method steps may be performed sequentially, or two or more method steps may be performed with overlapping time or in parallel. The method may further comprise additional method steps not listed.

[0010] The method includes the steps of: a) providing at least one electro-optical system configured to generate at least one electronic signal in response to electromagnetic radiation; b) providing at least one readout integrated circuit (ROIC) for processing at least one electronic signal; c) providing at least one circuit carrier; d) disposing an electro-optical system on the ROIC; e) mating the electro-optical system and the ROIC so as to establish at least one electrical connection between the electro-optical system and the ROIC; f) placing the ROIC on the circuit carrier such that the ROIC is located between the electro-optical system and the circuit carrier;

[0011] The term "spectrometer device" as used herein is a broad term and should be given its ordinary and customary meaning to those skilled in the art, and is not limited to any special or customized meaning. The term may specifically, but not exclusively, refer to an apparatus for obtaining at least one item of spectral information about at least one object by using electromagnetic radiation. In particular, the at least one item of spectral information may represent at least one optical or optically measurable property determined as a function of wavelength for one or more different wavelengths of electromagnetic radiation. More particularly, the at least one item of spectral information may relate to at least one property characterizing at least one of transmission, absorption, reflection, and emission of the at least one object. The at least one optical property may be determined for one or more wavelengths of electromagnetic radiation. The spectrometer device may specifically refer to an apparatus capable of recording and processing signal intensities of electromagnetic radiation for a portion thereof, such as a corresponding wavelength or wavelength interval of the spectrum, the signal intensities being provided as electronic signals by an electro-optical system and processed by a ROIC.

[0012] The term "electro-optical system" as used herein is a broad term and should be given its usual and customary meaning to those skilled in the art and should not be limited to any special or customized meaning. The term may particularly, but not exclusively, refer to an optical sensor configured to generate an electronic signal in response to electromagnetic radiation, particularly in response to exposure to electromagnetic radiation. As an example, the electro-optical system may comprise an array of individual pixel sensors, each of which has at least a photosensitive area adapted to generate an electronic signal and / or an electrical signal in response to illumination of the photosensitive area by at least a portion of the electromagnetic radiation, for example in response to the intensity of the electromagnetic radiation. Here, the photosensitive area as included in each of the individual pixel sensors may be a single uniform photosensitive area configured to receive the electromagnetic radiation incident on the individual pixel sensor. As an example, the photosensitive area may be or include at least one photoconductor, particularly an inorganic photoconductor, particularly PbS, PbSe, Ge, InGaAs, ext.InGaAs, InSb, or HgCdTe. Other photosensitive areas are possible. The electro-optical system may be specifically designed to generate an electrical or electronic signal related to the intensity of electromagnetic radiation incident on the individual pixel sensors. For example, the electro-optical system may include one or more filters and / or an analog-to-digital converter, i.e. a converter for converting an optical signal into an electronic signal. The electronic signals for adjacent individual pixel sensors may thus be generated simultaneously or else in a time-sequential manner. As an example, during a row or line scan, it is possible to generate a series of electronic signals corresponding to a sequence of individual pixel sensors arranged in a row or matrix.

[0013] The term "readout integrated circuit" as used herein, usually abbreviated as "ROIC", is a broad term and should be given its usual and customary meaning to those skilled in the art, and should not be limited to a special or customized meaning. The term may specifically, but not exclusively, denote a signal processing device including at least one integrated circuit and configured to process at least one electronic signal generated by an electro-optical system. For example, the ROIC may be configured to transmit these processed electronic signals, for example via a printed circuit board (substrate), to an evaluation unit configured to determine at least one item of spectral information according to the electromagnetic radiation. In particular, the ROIC may be configured to accumulate the electronic signals of the individual pixel sensors of the electro-optical system. Additionally or alternatively, the ROIC may be adapted to one or more of accumulating and amplifying the electronic signals, i.e. while maintaining a signal-to-noise ratio. For this purpose, the ROIC may include, for example, one or more filters and / or other components for processing the electronic signals. In particular, the ROIC may be or include one or more application specific integrated circuits (ASICs) and / or one or more data processing devices.

[0014] The term "circuit carrier" as used herein is a broad term and is given its usual and customary meaning to those skilled in the art, and is not limited to any special or customized meaning. The term may specifically refer to, but is not limited to, an element including a substrate configured to mechanically support an electrical module, such as a die, specifically an integrated circuit die, specifically a planar, electrically non-conductive substrate material. The substrate may include glass epoxy. However, other non-conductive materials may be used as substrate materials. The circuit carrier may further include layers and / or lines of conductive material in addition to the non-conductive, i.e. electrically insulating, substrate material. By way of example, the circuit carrier may be or include a support case configured to prevent damage or erosion of a printed circuit board, usually abbreviated as "PCB", which represents an electrically non-conductive planar substrate, also referred to as a "board", on which at least one conductive material, specifically a copper layer, is applied, specifically laminated, and which further includes one or more electronic, electrical, and / or optical elements. Other terms for this type of circuit carrier are a printed circuit assembly, abbreviated "PCA," a printed board assembly, abbreviated "PCB assembly" or "PCBA," a circuit card assembly, abbreviated "CCA," or simply a "card." Other forms and / or arrangements of circuit carriers are possible.

[0015] In particular, step f) of the method comprises placing the ROIC, in particular the ROIC with the electro-optical system bonded thereon, on the circuit carrier such that the ROIC is located between the electro-optical system and the circuit carrier. Thus, by way of example, the electro-optical system may be placed on a side of the ROIC facing away from the circuit carrier, such that the electro-optical system and the ROIC form a stack, such as a chip stack, placed on the circuit carrier. Here, the stack of the electro-optical system and the ROIC may also be referred to as a spectrometer on chip stack, e.g., abbreviated as "SoC-stack".

[0016] In step b), as an example, the at least one ROIC may be provided as a ROIC wafer. The term "ROIC wafer" as used herein is a broad term and is given its ordinary and customary meaning to those skilled in the art and is not limited to any special or customized meaning. The term may specifically, but not exclusively, refer to a slice including a semiconductor such as crystalline silicon (c-Si) forming a plurality of ROICs. In particular, the ROIC wafer may be or include a disk of semiconductor material, i.e., a slice of a monocrystalline silicon ingot, that has been processed and / or worked, such as by deposition, removal, patterning and / or alteration of electrical properties, to include and / or form a plurality of ROICs.

[0017] Specifically, when the ROICs are provided as a ROIC wafer in step b), the method may further comprise step g) of singulating the ROICs from the ROIC wafer. The term "singulation" as used herein is a broad term and is given its ordinary and customary meaning to those skilled in the art and is not limited to any special or customized meaning. The term may specifically refer to a process of dicing and / or separation by one or more of, but not limited to, scribing, breaking, sawing, e.g., mechanical sawing using a dicing saw, and laser cutting. The singulation and / or dicing may be an automated process. In particular, the ROIC wafer may be singulated into individual ROICs, e.g., into individual ROIC dies, e.g., into individual bare semiconductor chip elements.

[0018] Step g) may be performed after performing step d). Thus, by way of example, when manufacturing the spectrometer device, i.e., when performing the manufacturing method, at least one electro-optical system may be disposed on the ROIC wafer, and in particular, one electro-optical system may be disposed on each of the ROICs from the wafer. In particular, the electro-optical systems may be disposed on the ROICs while they are still part of the wafer, i.e., part of the ROIC wafer (e.g., at wafer level).

[0019] Step g) may be performed after performing step d) and before performing steps and e). In particular, singulation, i.e. step g), may be performed between steps d) and e). Thus, the electro-optical system may be placed on the ROIC while it is still part of the wafer, but singulated before coupling the electro-optical system to the ROIC.

[0020] Step g) may be performed after performing step e). In particular, the singulation, i.e. step g), may occur after step e). Thus, the electro-optical system may be placed on and bonded to the ROIC while the ROIC is still part of a wafer. For example, wafer-level bonding of the electro-optical system onto the ROIC may be performed such that an electrical connection between the electro-optical system and the ROIC is established while the ROIC is still part of a wafer, i.e., a ROIC wafer.

[0021] In step b), by way of example, at least one ROIC may be provided as a singulated ROIC, i.e. as an individual bare semiconductor chip component. Thus, instead of providing an ROIC wafer in step b), at least one ROIC may be provided as a previously singulated ROIC. In particular, at least steps d) and e) may be performed using a singulated ROIC. Thus, by way of example, an electro-optical system may be disposed on a single crystal ROIC and bonded to the singulated ROIC.

[0022] As an example, in step e), the bonding step may include performing one or more of the processes selected from the group consisting of a wire bonding process, a flip chip bonding process, and a tape automated bonding process. In particular, the bonding, i.e., the electrical interconnection of the electro-optical system and the ROIC, may use at least one of these processes.

[0023] Step d) further comprises adhering the electro-optical system to the ROIC by applying at least one adhesive material. By way of example, the adhering may be performed before performing the bonding process of step e). In particular, step d) may further comprise adhering the electro-optical system to the ROIC using at least one electrically insulating adhesive material, for example before performing the wire bonding process of step e). By way of example, in step d) the electro-optical system is adhered to the ROIC by applying at least one adhesive material, which may be, for example, a non-conductive adhesive or glue for mechanically stabilizing the arrangement. For this purpose, in step d) a non-conductive adhesive or glue may be used. In particular, in step d), the adhesive material is selected from the group consisting of: thermosetting materials, in particular epoxy resins; thermoplastic materials; plastic materials; polymeric materials; silicone-based adhesives.

[0024] In particular, when the electro-optical system is disposed on a ROIC wafer, i.e., when step d) is performed prior to singulating the ROICs from the ROIC wafer, the electro-optical system may be bonded onto the ROIC. Thus, the electro-optical system may be bonded onto the ROIC while the ROIC is still part of the ROIC wafer, e.g., the electro-optical system may be bonded onto the ROIC at wafer level.

[0025] Step f) may further comprise gluing the ROIC with the electro-optical system, e.g. the spectrometer-on-chip stack or SoC-stack, to the circuit carrier, e.g. using an adhesive material as outlined above for any gluing in step d).Thus, as an example, when placing the ROIC on the circuit carrier in step f), i.e. when placing the spectrometer-on-chip stack or SoC-stack on the circuit carrier, an adhesive material may be used to mechanically stabilize the arrangement.

[0026] Additionally or alternatively, step f) may comprise bonding the ROIC, in particular the ROIC comprising an electro-optical system such as a spectrometer-on-chip stack, i.e. SoC-stack, to the circuit carrier, so as to establish at least one electrical connection between the ROIC and the circuit carrier, for example by a flip-chip bonding process, although other bonding processes are also possible, such as one or more of a wire bonding process and / or a tape automated bonding process.

[0027] Additionally or alternatively, step f) may include packaging the ROIC with an electro-optical system, i.e., at least partially encapsulating the bonded ROIC and electro-optical system, thereby producing a packaged chip, e.g., a packaged spectrometer-on-chip stack, i.e., a packaged SoC stack. Further, step f) may include placing and coupling the packaged chip onto a circuit carrier to establish at least one electrical connection between the packaged chip and the circuit carrier. Thus, as an example, step f) may include packaging the ROIC with an electro-optical system, i.e., producing a packaged SoC stack, and then placing and coupling the packaged SoC stack onto a circuit carrier to establish at least one electrical connection between the packaged SoC and the circuit carrier.

[0028] Furthermore, the method may include the steps of: h) providing at least one housing and adhering the ROIC (including in particular the electro-optical system arranged thereon) to the housing by applying at least one further adhesive material.

[0029] The further adhesive may be selected from the group consisting of: thermosetting materials, in particular epoxy resins; thermoplastic materials; plastic materials; polymeric materials; silicone adhesives. In particular, further adhesives optionally configured for adhering the ROIC to the housing may be selected from the group. In particular, further adhesives that may be used for adhering the ROIC on which the electro-optical system is arranged may be selected from the group. By way of example, the further adhesive material may be the same as the adhesive material applied in step d) for adhering the electro-optical system to the ROIC. However, alternatively, the adhesive material applied in step d) may be different from the further adhesive material.

[0030] In particular, the housing may be configured to provide a stabilizing means for the spectrometer device and may be or include at least one housing material, such as one or more of a plastic and / or metal material.

[0031] In a further aspect of the present invention, a spectrometer device for evaluating electromagnetic radiation is disclosed. The spectrometer device comprises at least one circuit carrier, at least one electro-optical system configured to generate at least one electronic signal according to the electromagnetic radiation; and at least one readout integrated circuit (ROIC) for processing the at least one electronic signal, the ROIC being disposed between the circuit carrier and the electro-optical system. In particular, the electro-optical system is bonded to the ROIC by at least one adhesive material selected from the group consisting of: thermosetting materials; thermoplastic materials; plastic materials; polymeric materials; and silicone-based adhesives.

[0032] It is disclosed that the spectrometer device may in particular be manufactured by at least partly carrying out a method for manufacturing a spectrometer device as described elsewhere in this specification, i.e. as outlined above or as described in more detail below, and is therefore a spectrometer device. Therefore, in particular with regard to the definition of the terms, reference may be made to the description of at least one method for manufacturing a spectrometer device, in particular the manufacturing method. In particular, the spectrometer device may be obtainable by carrying out the manufacturing method described herein.

[0033] The electro-optical system may in particular be or include an array of individual pixel sensors, such as a detector array. As an example, each of the individual pixel sensors may have at least one photosensitive area adapted to generate at least one electronic signal in response to illumination of the photosensitive area by at least a portion of the electromagnetic radiation. Thus, the electro-optical system may be or include an array of pixel sensors and may generate a plurality of electronic signals, such as by generating at least one electronic signal by one or more of the pixel sensors.

[0034] The ROIC may be or may include at least one bare semiconductor chip device previously separated from a wafer.

[0035] The electro-optical system may be bonded, in particular electrically connected, to the ROIC by at least one interconnection element. As an example, the electro-optical system may be electrically connected to the ROIC by at least one interconnection element. Thus, at least one interconnection element may be further included by the spectrometer device. In particular, the interconnection element may be or may include a wire and / or a solder bump. As an example, the interconnection element, in particular the interconnection element electrically connecting the ROIC and the electro-optical system, may be generated and / or established by one or more of a wire bonding process, a flip chip bonding process, and a tape automated bonding process.

[0036] Further, the spectrometer device may include at least one wavelength-selective element configured to separate the electromagnetic radiation into a spectrum of constituent wavelength signals, where the wavelength-selective element is positioned in an optical path between a source of the electromagnetic radiation, in particular an external source, and the electro-optical system.

[0037] The described method and device have considerable advantages compared to the prior art. In particular, the method and device of the invention can therefore make it possible to reduce the risk of erroneous measurements by increasing the precision and accuracy of spectroscopic measurements. In particular, the method and device of the invention can increase measurement precision by avoiding stray light, for example stray light reflected by or transmitted through a substrate, for example a circuit carrier.

[0038] Furthermore, the spectrometer device proposed herein may be smaller and more compact than known devices, while at the same time exhibiting a simpler and less complicated structure. In particular, the present method and device may enable the integration of spectroscopic functions into portable devices, in particular in widespread consumer applications. In particular, the spectrometer device described herein, for example due to its compactness, may be integrated into portable devices, thereby expanding the field of application of spectroscopy, for example by enabling the transfer of applications from analytical laboratories to a wide range of consumer applications.

[0039] Furthermore, the methods and apparatus proposed herein, in particular the adhesive method, may allow for less complex, cheaper and therefore simpler manufacture of spectrometer devices, since the components do not need to be constructed to be temperature stable, as compared to, for example, welding and / or other fastening and / or fixing means. In particular, the proposed methods and apparatus cannot be exposed to high temperature fluctuations, for example by being glued.

[0040] In summary, the following embodiments can be envisaged in the context of the present invention, without excluding further possible embodiments:

[0041] Embodiment 1: 1. A method for manufacturing at least one spectrometer device for evaluating electromagnetic radiation, comprising the steps of: a) providing at least one electro-optical system configured to generate at least one electronic signal in response to electromagnetic radiation; b) providing at least one readout integrated circuit (ROIC) for processing at least one electronic signal; c) providing at least one circuit carrier; d) placing an electro-optical system on the ROIC; e) coupling the electro-optical system and the ROIC so as to establish at least one electrical connection between the electro-optical system and the ROIC; f) placing the ROIC on a circuit carrier such that the ROIC is located between the electro-optical system and the circuit carrier; The method includes:

[0042] Embodiment 2: In step b), at least one ROIC is provided as an ROIC wafer, and further comprising the steps of: g) singulating (separating) the ROICs from the ROIC wafer; 2. The method of embodiment 1, comprising:

[0043] Embodiment 3: The method according to embodiment 2, wherein step g) is performed after performing step d), in particular after performing step e).

[0044] Embodiment 4: 2. The method of embodiment 1, wherein in step b), at least one ROIC is provided as a unified ROIC.

[0045] Embodiment 5: 5. The method according to any one of the preceding claims, wherein in step e), the bonding comprises performing one or more processes selected from the group consisting of a wire bonding process, a flip chip bonding process, and a tape automated bonding process.

[0046] Embodiment 6: 6. The method according to any one of the preceding claims, wherein step d) further comprises adhering the electro-optical system to the ROIC by applying at least one adhesive material, in particular at least one electrically insulating adhesive material.

[0047] Embodiment 7: 7. The method of embodiment 6, wherein the adhesive material is selected from the group consisting of: thermosetting materials, particularly epoxy resins; thermoplastic materials; plastic materials; polymeric materials; silicone adhesives.

[0048] Embodiment 8: 8. The method of any one of claims 1 to 7, wherein step f) comprises bonding the ROIC to the circuit carrier, for example by a flip-chip bonding process, to establish at least one electrical connection between the ROIC and the circuit carrier.

[0049] Embodiment 9: 9. The method of any one of claims 1 to 8, wherein step f) comprises packaging the ROIC with an electro-optical system to produce a packaged chip, and then placing and coupling the packaged chip onto a circuit carrier to establish at least one electrical connection between the packaged chip and the circuit carrier.

[0050] Embodiment 10: The method according to any one of embodiments 1 to 9, wherein the method further comprises the steps of: h) providing at least one housing and adhering the ROIC, in particular the ROIC including the electro-optical system arranged thereon, to the housing by applying at least one further adhesive material.

[0051] Embodiment 11: 11. The method of embodiment 10, wherein the further adhesive material is selected from the group consisting of: thermosetting materials, particularly epoxy resins; thermoplastic materials; plastic materials; polymeric materials; and silicone adhesives.

[0052] Embodiment 12: 1. A spectrometer device for evaluating electromagnetic radiation, comprising: a. at least one circuit carrier; b. at least one electro-optical system configured to generate at least one electronic signal in accordance with the electromagnetic radiation; and c. at least one readout integrated circuit (ROIC) for processing at least one electronic signal, the ROIC being disposed between the circuit carrier and the electro-optical system; 1. A spectrometer device comprising:

[0053] Embodiment 13: 13. The spectrometer device of embodiment 12, wherein the electro-optical system is adhered to the ROIC by at least one adhesive material selected from the group consisting of: thermosetting materials; thermoplastic materials; plastic materials; polymeric materials; and silicone-based adhesives.

[0054] Embodiment 14: The spectrometer device described in any one of the previous embodiments referring to a spectrometer device, wherein the spectrometer device is at least partially manufactured by performing a method for manufacturing a spectrometer device described in any one of the previous method embodiments.

[0055] Embodiment 15: A spectrometer device as described in any one of the preceding embodiments referring to a spectrometer device, wherein the electro-optical system comprises an array of individual pixel sensors, each of the individual pixel sensors comprising at least one photosensitive area adapted to generate at least one electronic signal in response to illumination of the photosensitive area by at least a portion of the electromagnetic radiation.

[0056] Embodiment 16: A spectrometer device described in any one of the preceding embodiments referring to a spectrometer device, wherein the ROIC comprises at least one bare semiconductor chip element pre-separated from a wafer.

[0057] Embodiment 17: A spectrometer device as described in any one of the previous embodiments referring to a spectrometer device, wherein the electro-optical system is bonded, particularly electrically connected, to the ROIC by at least one interconnect element such as a wire and / or a solder bump, particularly established by one or more of a wire bonding process, a flip chip bonding process, and a tape automated bonding process.

[0058] Embodiment 18: A spectrometer device described in any one of the previous embodiments referring to a spectrometer device, further comprising at least one wavelength selection element configured to separate the electromagnetic radiation into a spectrum of constituent wavelength signals, the wavelength selection element being arranged in an optical path between a source of electromagnetic radiation, in particular an external source, and the electro-optical system. [Brief description of the drawings]

[0059] Further optional features and characteristics are preferably disclosed in more detail in the following description of the embodiments in conjunction with the dependent claims, whereby a person skilled in the art will understand that each optional feature may be implemented individually or in combination with any other optional features. The scope of the present invention is not limited to the preferred embodiments. The embodiments are illustrated diagrammatically in the figures. The same reference numbers in these figures refer to identical or functionally equivalent elements.

[0060] In the diagram below: [Figure 1] In Figures 1a, 1b and 1c different embodiments of a spectrometer device are shown in cross-sectional views; [Diagram 2] In Fig. 2a and Fig. 2b different flow charts of a method for manufacturing at least one spectrometer device are shown. [Diagram 3-6] 3 to 6 show different schematic illustrations of a method for manufacturing at least one spectrometer device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0061] In figures 1a, 1b and 1c different embodiments of a spectrometer device 110 for evaluating electromagnetic radiation are depicted.

[0062] The spectrometer device 110 comprises a circuit carrier 112, an electro-optical system 114 configured to generate at least one electronic signal according to the electromagnetic radiation, and a readout integrated circuit (ROIC) 116 for processing the at least one electronic signal. The ROIC 116 is disposed between the circuit carrier 112 and the electro-optical system 114. In particular, the electro-optical system 114 may be disposed on a side of the ROIC 116 facing away from the circuit carrier 112. Furthermore, the electro-optical system 114 may be coupled to the ROIC 116 by one or more interconnection elements 118. Such interconnection elements 118 may be, for example, solder bumps 120 and / or wires 122, such as interconnection wires. Furthermore, the electro-optical system 114 may additionally be attached onto the ROIC 116, in particular to the one or more interconnection elements 118, using an adhesive material 124.

[0063] Additionally, additional interconnect elements 118 may be used to electrically connect the ROIC 116 and the circuit carrier 112. As an example, the ROIC 116 and the circuit carrier 112 may be connected by solder bumps 120, such as connections created in a flip-chip bonding process. However, other forms of electrically connecting the ROIC 116 and the circuit carrier 112 are possible. As an example, the ROIC 116 and the electro-optical system 114 may be combined into a packaged chip 126, which may include, for example, a lead frame 128, one or more interconnect wires 122, and a housing 130, and the packaged chip 126 may be disposed on the circuit carrier 112.

[0064] The spectrometer device 110 may be manufactured by a method for manufacturing at least one spectrometer device 110 for evaluating electromagnetic radiation, namely a manufacturing method 132. Different embodiments of the manufacturing method 132 are illustrated in Figures 2a and 2b. The manufacturing method 132 comprises at least the following steps: a) providing at least one electro-optical system 114 configured to generate at least one electronic signal in response to electromagnetic radiation (denoted by reference numeral 134); b) providing at least one readout integrated circuit (ROIC) 116 (indicated by reference numeral 136) for processing at least one electronic signal; c) providing at least one circuit carrier 112 (denoted by reference numeral 138); d) disposing the electro-optical system 114 (denoted by reference numeral 140) on the ROIC 116; e) coupling the electro-optical system 114 and the ROIC 116 so as to establish at least one electrical connection between the electro-optical system 114 and the ROIC 116 (as shown by reference numeral 142); f) placing the ROIC 116 (denoted by reference numeral 144 ) on the circuit carrier 112 such that the ROIC 116 is located between the electro-optical system 114 and the circuit carrier 112 .

[0065] As an example, manufacturing method 132 may further include step g) (shown as reference numeral 146) of singulating an ROIC from ROIC wafer 148. Thus, in step b), ROIC 116 may be provided in the form of ROIC wafer 148. However, in step b), ROIC 116 may be provided as a singulated ROIC 150, i.e., as a previously singulated bare semiconductor chip.

[0066] In Fig. 3, a schematic diagram of the manufacturing method 132 is shown. In particular, the ROIC 116 may be provided as an ROIC wafer 148, i.e. in step b), and the electro-optical system 114 may be placed on the ROIC 116 while the ROIC 116 is still part of the wafer 148, i.e. in step d), and may be bonded to the ROIC 116, i.e. in step e). Thereby, a stack of the electro-optical system 114 and the ROIC 116, which are still part of the ROIC wafer 148, for example as an intermediate product, may be produced, for example as a spectrometer-on-chip stack on a wafer 152, i.e. as a SoC-stack-wafer 154. Before placing the ROIC 116 on the circuit carrier 112 so that the ROIC 116 is located between the electro-optical system 114 and the circuit carrier 112, i.e. before performing step f), the SoC-stack-wafer 154 may be singulated into separate SoC-stacks 152. Furthermore, when the SoC stack 152 is placed on the circuit carrier 112, an adhesive material 124 may be applied between the SoC stack 152 and the circuit carrier 112, for example, to mechanically stabilize the SoC stack 152 on the circuit carrier 112.

[0067] 4 shows a different schematic view of the manufacturing method 132. In particular, the ROIC 116 may be provided as a singulated ROIC 150, i.e., in step b), and the electro-optical system 114 may be arranged on the singulated ROIC 150, i.e., in step d), and may be bonded to the singulated ROIC 150, i.e., in step e). This may result in, for example, an intermediate product, a SoC stack 152, which may then be arranged on the circuit carrier 112, i.e., in step f), such that the ROIC 116 is located between the electro-optical system 114 and the circuit carrier 112. Furthermore, when the SoC stack 152 is arranged on the circuit carrier 112, an adhesive material 124 may be applied between the SoC stack 152 and the circuit carrier 112, for example, to mechanically stabilize the SoC stack 152 on the circuit carrier 112.

[0068] Figure 5 shows a schematic diagram similar to Figure 3, and Figure 6 shows a schematic diagram similar to Figure 4. However, instead of using solder bumps 120 to couple the electro-optical system 114 and the ROIC 116 to establish at least one electrical connection between them, i.e., within the SoC stack 152, a number of wires 122 may be used to establish the electrical connection, while an adhesive material 124 may be used to mechanically stabilize the arrangement of the SoC stack, i.e., the arrangement of the electro-optical system 114 on the ROIC 116. [Explanation of symbols]

[0069] TIFF2025510383000002.tif125146

Claims

1. A method for manufacturing at least one spectrometer device (110) for evaluating electromagnetic radiation, comprising the steps of: a) providing at least one electro-optical system (114) configured to generate at least one electronic signal in response to electromagnetic radiation; b) providing at least one read out integrated circuit (ROIC) (116) for processing said at least one electronic signal; c) providing at least one circuit carrier (112); d) placing the electro-optical system (114) on the ROIC (116), further comprising adhering the electro-optical system (114) to the ROIC (116) by applying at least one adhesive material (124), the adhesive material (124) being selected from the group consisting of: a thermosetting material; a thermoplastic material; a plastic material; a polymeric material; and a silicone adhesive; e) coupling the electro-optical system (114) and the ROIC (116) to establish at least one electrical connection between the electro-optical system (114) and the ROIC (116); f) placing the ROIC (116) on the circuit carrier (112) such that the ROIC (116) is located between the electro-optical system (114) and the circuit carrier (112); The method includes:

2. In step b), at least one ROIC (116) is provided as a ROIC wafer (148), and further g) separating the ROIC (116) from the ROIC wafer (148); The method of claim 1 , comprising:

3. The method according to claim 1 or 2, wherein step g) is performed after performing step d).

4. The method of claim 1 , wherein in step b) at least one ROIC (116) is provided as a unified ROIC (150).

5. The method of claim 1 or 2, wherein in step e) the bonding comprises performing one or more processes selected from the group consisting of a wire bonding process, a flip chip bonding process, and a tape automated bonding process.

6. 3. The method of claim 1, wherein step f) comprises coupling the ROIC (116) to the circuit carrier (112) so as to establish at least one electrical connection between the ROIC (116) and the circuit carrier (112).

7. 3. The method of claim 1 or 2, wherein step f) comprises packaging the ROIC (116) with an electro-optical system (114) to produce a packaged chip (126), and then placing and bonding the packaged chip (126) on the circuit carrier (112) so as to establish at least one electrical connection between the packaged chip (126) and the circuit carrier (112).

8. Additionally, the following steps: h) providing at least one housing and adhering the ROIC (116) to the housing by applying at least one further adhesive material (124); The method of claim 1 or 2, comprising:

9. 9. The method according to claim 8, wherein the further adhesive material (124) is selected from the group consisting of: thermosetting materials, in particular epoxy resins; thermoplastic materials; plastic materials; polymeric materials; silicone-based adhesives.

10. A spectrometer device (110) for evaluating electromagnetic radiation, comprising: - at least one circuit carrier (112); at least one electro-optical system (114) configured to generate at least one electronic signal in accordance with the electromagnetic radiation; and at least one readout integrated circuit (ROIC) (116) for processing said at least one electronic signal, said readout integrated circuit (ROIC) (116) being arranged between the circuit carrier (112) and an electro-optical system (114), said electro-optical system (114) being adhered to said ROIC (116) by at least one adhesive material (124) selected from the group consisting of: thermosetting materials; thermoplastic materials; plastic materials; polymeric materials; silicone-based adhesives; A spectrometer device (110) comprising:

11. The spectrometer device (110) of claim 10, wherein the spectrometer device (110) is at least partially manufactured by performing a method for manufacturing a spectrometer device (110) according to claim 1 or 2.

12. 11. The spectrometer device of claim 10, wherein the electro-optical system comprises an array of individual pixel sensors, each of the individual pixel sensors having at least one photosensitive area adapted to generate at least one electronic signal in response to illumination of the photosensitive area by at least a portion of the electromagnetic radiation.

13. The spectrometer device (110) of claim 10, wherein the ROIC (116) comprises at least one bare semiconductor chip component pre-separated from a wafer (148).

14. The spectrometer device (110) of claim 10, wherein the electro-optical system (114) is coupled to the ROIC (116) by at least one interconnect element (118).

15. The spectrometer device (110) of claim 10, further comprising at least one wavelength-selecting element configured to separate the electromagnetic radiation into a spectrum of constituent wavelength signals, the wavelength-selecting element being disposed in an optical path between a source of the electromagnetic radiation, in particular an external source, and an electro-optical system.

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