Gripper head, device, and method for handling and changing spacing of electronic components arranged in a matrix structure

Abstract

The present invention relates to a gripper head for handling and varying the spacing of electronic components arranged in a matrix structure, the gripper head comprising a plurality of grippers arranged in a matrix arrangement of X rows and Y columns of grippers and individually controllable displacement drives acting between adjacent gripper rows and between adjacent gripper columns. The present invention also relates to an apparatus and a method for handling and varying the spacing of electronic components.

Description

[Technical field]

[0001] The present invention relates to a gripper head for handling electronic components arranged in a matrix structure and changing the spacing between them, and to an apparatus for handling electronic components arranged in a matrix structure and changing the spacing between them. The present invention also relates to a method for handling electronic components arranged in a matrix structure and changing the spacing between them using such a gripper head. [Background technology]

[0002] Regrouping of electronic components supplied in a matrix structure is known, for example in the manufacture of semiconductors. During the manufacture of semiconductors, for example, semi-finished parts and / or finished semiconductors will pass through various successive processes, which may or may not be carried out in different processing stations. The (semi-finished) semiconductors may be transported between different locations, for example using standardized carriers. The various processing stations require and deliver electronic components in a matrix structure, but not always in the same number, spacing and / or configuration of matrices. Therefore, the mutual spacing, the relative arrangement and / or - in the case of batch-type manufacturing steps - the size of the groups in the initial matrix structure may not correspond to the arrangement of the electronic components when successive processing stations or successive process steps are carried out.

[0003] The electronic components in a matrix structure are grouped in rows and columns, the direction of the rows being usually substantially perpendicular to the direction of the columns of the matrix structure, although different mutual angle ratios are also conceivable. The electronic components are usually supported by a carrier, usually but not necessarily a flat carrier, examples of which are carriers in the form of carrier plates optionally equipped with individual product holders, carriers with multiple parallel guide channels for the electronic components, conveyor belts or any other type of carrier accessible from above. During the transfer of electronic components from one carrier to another, the pitch between the components and / or the number of rows and columns may be modified. As an example, smaller electronic components (here, for example, with a maximum surface area of ​​only a few mm 2 In the case of a separation process (assuming electronic components of type 100), for example, it may be desirable to reduce the number of rows in the matrix array into which the electronic components are supplied immediately after separating the electronic components, thereby enabling the rows of electronic components to be spaced apart while preventing the resulting width of the matrix array of electronic components from becoming excessively large.

[0004] The geometry of the matrix of electronic components may be altered by individual engagement of the electronic components by a manipulator with a gripper head having multiple grippers (e.g., vacuum cups or mechanical grippers), the relative positions of the individual grippers corresponding to the position of the group of electronic components being engaged. Before the electronic components held by the grippers are discarded, the relative positions of the individual grippers can be altered to match (or partially match) the matrix shape required for a subsequent processing step.

[0005] An example of a method and apparatus for correcting the relative arrangement of electronic components supplied in a matrix form is notably described in the applicant's International Patent Application No. WO2007 / 011218, which describes a method and apparatus that, although working satisfactorily, limits the versatility of efficiently regrouping electronic components. Summary of the Invention [Problem to be solved by the invention]

[0006] It is an object of the present invention to provide a gripper head, apparatus and method that provides greater versatility than the prior art in terms of manipulating electronic components arranged in a matrix configuration and modifying their relative placement, all while using a relatively simple gripper head. [Means for solving the problem]

[0007] The invention provides for this purpose a gripper head for handling electronic components and for changing their spacing, the gripper head being configured in a matrix structure, the gripper head comprising a plurality of grippers arranged in a matrix arrangement of X rows of grippers, where X≧2, and Y columns of grippers, where Y≧3, and individual displacement drives between every adjacent gripper row and every adjacent gripper row, in particular for changing the distance between adjacent gripper rows and between adjacent gripper rows, The displacement drives provide gripper heads which are individually controllable so as to allow for a change in the distance between all adjacent gripper rows and / or columns. In such gripper heads, the structure of the matrix arrangement may be relatively simple, and only a limited number of drives are required to provide the necessary structural flexibility of the tool. Preferably, the displacement drives act between all adjacent gripper rows and / or the displacement drives act between all adjacent gripper columns, so that only a single displacement drive is required between adjacent gripper rows and / or adjacent gripper columns. In this respect, the terms "between" adjacent gripper columns and / or "between" adjacent gripper rows should be understood as allowing for a displacement between columns and / or rows, which may be realized by the displacement drives being located between adjacent gripper columns and / or adjacent gripper rows. This can also be achieved by the displacement drives being positioned at a distance from the gripper columns and rows, but connected to the columns and / or rows, for example by means of extensions / protrusions / lugs. As the displacement drives are individually controllable, the intervening distance between the rows and / or columns can be changed, thus allowing a high degree of versatility in the use of the gripper head. For example, if an electronic component matrix has to be placed on two carriers (and thus with carrier transitions that will be incorporated into the geometry of the electronic component matrix), this allows the spacing of the carriers bordering to be changed.

[0008] In a preferred embodiment, the grippers in each row are movably mounted to an individual row guide and the grippers in each column are movably mounted to an individual column guide, and in such an embodiment, the displacement drives may be mounted between adjacent row guides and between adjacent column guides. Because the rows and / or columns of grippers are mounted on individual (and dedicated) guides, the groups and / or rows of grippers are coupled such that the intervening distance between two adjacent rows / columns can be changed by a single displacement drive relatively simply connected to two adjacent guides.

[0009] In further embodiments, the gripper function of each gripper head may be individually controllable. Individually controllable grippers provide increased usability options. For example, the gripper heads can be used to change the size of the electronic component matrix configuration between subsequent processing steps by using only a portion of the grippers during pick-up and / or put-down of electronic components. In practice, individual control can also be achieved by individually controllable vacuum cups at each gripper location, although individually controllable mechanical grippers are also contemplated.

[0010] Preferably, the grippers are furthermore linearly displaceable in a direction perpendicular to the plane determined by the rows and columns of the grippers. By moving the grippers in this vertical direction, it is possible to change the number of "active" grippers, for example by lowering a part of the matrix of grippers to be used in the process steps of picking up and / or putting down the electronic components, while the "non-active" grippers remain in a "raised" position. Even more preferably, the vertical linear working position of each gripper is individually controllable, since such individual control of the grippers allows maximum flexibility in making the grippers assume "activating" and "non-activating" positions. To realize such vertical movement of the grippers, the grippers (preferably all grippers) can be equipped with a height drive for realizing the vertical linear displacement. To control the movement (and stoppage) of the grippers driven by the height drive, the height drive may be force-controllable. If the force is to be controlled, the drive can be stopped when resistance is encountered, for example when the gripper touches the electronic component. Another advantage of a force-controlled vertical gripper movement is that this can prevent damage to the gripper when a resistance is encountered (for example when an object is placed between the gripper and the electronic component or at the placement position of the electronic component). Gripper force control can also be (indirectly) realized in the control of the current for steering the height drive. Examples of height drives can be selected from the group of pneumatic cylinders, hydraulic cylinders and (servo) motors. In addition to the use options already mentioned above, a vertically displaceable gripper can also be used to select only a portion of the electronic component to be gripped. For example, electronic components that have failed the quality control in the front end can be left as they are and treated, for example, as waste.

[0011] The invention also provides a device for handling electronic components arranged in a matrix configuration and for changing the spacing between them, the device comprising a feeder for electronic components arranged in an initial matrix configuration, at least one gripper head according to the invention, a manipulator for moving the gripper head and a discharger for the handled electronic components in the modified matrix configuration. Such a handling device allows the gripper head according to the invention to be controlled in its movement between a pick-up position (feeder) and a put-down position (discharger), thereby making it possible to provide all the advantages according to the invention as already described in relation to the gripper head, which are incorporated herein by reference in relation to the handling device according to the invention. Preferably, the handling device comprises a control device configured to determine the position of the initial matrix of electronic components, to compare the position of the initial matrix of electronic components with a predefined reference position and to control the manipulator and the drive device based on the relative position of the initial matrix of electronic components, thereby making possible an automatic transfer of electronic components in which the pitch between the electronic components and / or the number of rows and columns can be freely modified during the transfer.

[0012] The present invention also provides a method for the manipulation and spacing of electronic components arranged in a matrix structure using a gripper head according to the present invention, comprising the steps of: a) providing electronic components arranged in at least one initial matrix structure; b) arranging the grippers of the X rows and Y columns of the gripper head in correspondence with the arrangement of electronic components in the at least one initial matrix structure; c) bringing at least some of the grippers of the gripper head into contact with and gripping at least some of the electronic components arranged in the at least one initial matrix structure; d) relative displacement of the rows and columns of the grippers to the modified matrix structure; and e) releasing the electronic components by the grippers. With such a method, the pitch between the electronic components arranged in a matrix and / or the number of rows and columns of such a matrix electronic component can be modified during the transfer of the electronic components from an initial position (e.g. a carrier) to a subsequent position (e.g. another carrier), with all the advantages as mentioned above. The grippers can for example be actuated to grip by applying a low pressure to the grippers and released by applying a high pressure to the grippers.

[0013] The present invention will now be described with reference to the non-limiting exemplary embodiments illustrated in the following figures, in which corresponding elements are indicated with corresponding reference numerals and in which: [Brief description of the drawings]

[0014] [Figure 1A] 1A-1C are schematic perspective views of a 2x3 gripper head according to the present invention with different gripper positions; [Figure 1B] 1A-1C are schematic perspective views of a 2x3 gripper head according to the present invention with different gripper positions; [Figure 1C] 1A-1C are schematic perspective views of a 2x3 gripper head according to the present invention with different gripper positions; [Diagram 2] FIG. 2 is a schematic perspective view of a 3×3 gripper head according to the present invention; [Diagram 3]FIG. 2 is a schematic perspective view of a 3×4 gripper head according to the present invention; [Figure 4] 1 is a schematic diagram of an apparatus for routing and varying the spacing of electronic components according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] FIG. 1A shows a schematic diagram of a 2×3 gripper head 1 in which six grippers 2 are arranged in a matrix configuration. The grippers 2 are arranged in two rows 3′, 3″ (with a distance D1 between the rows 3′, 3″′″) and three columns 4′, 4″, 4′″ (with a distance E1 between the columns 4′, 4″, 4′″). Between the two rows 3′, 3″ of grippers 2, a displacement drive 5 is acting, which can change the distance between the two rows 3′, 3″ of grippers 2, as shown in the following FIG. 1B and FIG. 1C. Two displacement drives 6′, 6″ are provided acting between adjacent pairs of the three columns 4′, 4″, 4′″ of grippers 2 for changing the distance between corresponding adjacent columns 4′, 4″ and 4″, 4′″. The displacement drives 5 between the rows 3', 3'' and the displacement drives 6', 6'' between adjacent columns 4', 4'', 4''' are individually controllable. It can also be seen that the grippers 2 are (slidably) mounted to row guides 7', 7'' and to column guides 8', 8'', 8''' (also slidably) such that the matrix arrangement of grippers 2 is fixed.

[0016] 1A further shows that the grippers 2 can also be displaced in a direction perpendicular to the plane determined by the rows 3', 3'' and columns 4', 4'', 4'''' of grippers, since the grippers are individually mounted to vertical displacement drives 9'-9'''''', which individually control the vertical position of each gripper 2. Preferably, the actuation of the displacement drives 9'-9'''''' is individually force controlled.

[0017] FIG. 1B shows the gripper head 1 of FIG. 1A, where the arrangement of the grippers has been modified with respect to the arrangement depicted in FIG. 1A. By activating the displacement drives 5, the gripper rows 3', 3'' have now been brought closer together, such that the distance D2 between the gripper rows 3', 3'' in this figure is smaller than the distance D1 between the gripper rows 3', 3'' in FIG. 1A. Similarly, the two displacement drives 6', 6'' between the corresponding gripper rows 4', 4'' and 4'', 4''' have been activated (differently) compared to the situation depicted in FIG. 1A, so that the distances E2' and E2'' between the gripper rows 4', 4'' and 4'', 4'''' in this figure are smaller than the distance E1 between the gripper rows 4', 4'' and 4'', 4'''' in FIG. 1A, where again the distances E2', E2'' do not coincide with each other.

[0018] Figure 1C shows the gripper head 1 of Figure 1A, where the arrangement of the grippers in the two gripper rows 3', 3'' and gripper columns 4', 4'', 4''' is the same as that depicted in Figure 1A, but where the vertical position of the grippers 2 has now been changed with respect to the position depicted in Figure 1A. For the situation depicted in Figure 1A, the vertical displacement drives 9'-9'''''' have been activated, so that the grippers are raised compared to the previously shown situation.

[0019] FIG. 2 shows a schematic diagram of a 3×3 gripper head 10, in which nine grippers 2 are arranged in a matrix configuration. The grippers 2 are arranged in three rows 3′, 3″, 3′″ (with a distance D1 between the rows 3′, 3″, 3′″) and three columns 4′, 4″, 4′″ (with a distance E1 between the columns 4′, 4″, 4′″). Between the three rows 3′, 3″, 3′″ of grippers 2, there act displacement drives 5′, 5″ that make it possible to vary the distance between adjacent columns 3′, 3″ and 3″, 3′″ of grippers 2. Between adjacent pairs 4′, 4″ and 4″, 4′″ of the three columns of grippers 2, there act two displacement drives 6′, 6″ for varying the distance between corresponding adjacent columns 4′, 4″ and 4″, 4′″. The displacement drives 5', 5'' between the rows 3', 3'', 3''' and the displacement drives 6', 6'' between adjacent columns 4', 4'', 4''' are individually controllable. It can also be seen that the grippers 2 are (slidably) mounted on row guides 7', 7'', 7'''' and on column guides 8', 8'', 8''' (also slidably) so that the matrix structure of the grippers 2 is fixed. For further manner of functioning of this 3x3 gripper head 10, reference is made to Figures 1A-1C, where the changer of the distances D1 and E1 is described.

[0020] 3 shows a further embodiment of a gripper head 20 according to the invention, here a 3x4 gripper head 20 with 12 grippers 2 arranged in a matrix structure. The grippers 2 are arranged in three rows 3', 3'', 3''' (with a distance D1 between the rows 3', 3'', 3''') and four columns 4', 4'', 4''', 4'''' (with a distance E1 between the columns 4', 4'', 4''', 4''''). Acting between the three rows 3', 3'', 3''' of grippers 2 are displacement drives 5', 5'', which make it possible to vary the distance between adjacent columns 3', 3'' and 3'', 3''' of grippers 2. Between adjacent pairs 4', 4'' and 4'', 4''' and 4''', 4'''' of the four rows of grippers 2, three displacement drives 6', 6'', 6''' act for varying the distance between corresponding adjacent rows 4', 4'' and 4'', 4''''. For further manner of functioning of this 3x4 gripper head 20, reference is likewise made to Figures 1A-1C, in which the means for varying the distances D1 and E1 are described.

[0021] 4 shows a schematic representation of an apparatus 30 for handling and changing the spacing of electronic components 31, comprising a feed system 32 for electronic components 31 arranged in an initial matrix configuration 33. The electronic components 31 are gripped by a gripper head 34, for example a 4×4 gripper head 34, with grippers 35. The gripper head 34 is held and manipulated by positioning means 36, here embodied as a robot arm, enabling the gripper head 34 to reach the feed system 32 and subsequently to eject the gripped electronic components 31 into an ejection system 37. During the transfer of the electronic components 31 from the feed system 32 to the ejection system 37, the matrix configuration in which the electronic components 31 are held by the gripper head 34 may be changed (for further description of the operation of the gripper head 34, see FIGS. 1A-1C). The electronic component 31 may then be released in one operation or in a two- or multi-stage release operation as may be required in situations where the electronic component 31 is modified herein into a modified (more compact) structure 38. Also shown is a control device 39 which controls the gripper head 34 and the positioning means 36, inter alia, based on information received from, for example, a vision system 40 and / or any other source.

Claims

1. A gripper head for handling electronic components configured in a matrix structure and changing the spacing between them, a plurality of grippers configured in a matrix arrangement of X rows of grippers, where X≧2, and Y columns of grippers, where Y≧3; individual displacement drives between every adjacent gripper row and every adjacent gripper row for changing the distance between adjacent gripper rows and between adjacent gripper rows; A gripper head, wherein the displacement drives are individually controllable to allow the distance between all adjacent rows of grippers and / or columns of grippers to be changed.

2. 2. The gripper head according to claim 1, wherein a displacement drive acts between all adjacent gripper rows and between all adjacent gripper columns to change the distance between adjacent gripper rows and between adjacent gripper columns.

3. 3. A gripper head according to claim 1 or 2, wherein the grippers in each row are movably mounted on respective row guides and the grippers in each column are movably mounted on respective column guides.

4. 4. The gripper head of claim 3, wherein the displacement drives are mounted between adjacent row guides and between adjacent column guides.

5. 3. Gripper heads according to claim 1 or 2, characterized in that the gripper function of each gripper head is individually controllable.

6. 3. A gripper head according to claim 1 or 2, characterized in that the gripper comprises a vacuum cup.

7. 3. A gripper head according to claim 1, wherein the grippers are displaceable in a linear direction perpendicular to a plane defined by the gripper rows and the gripper columns.

8. 8. The gripper head according to claim 7, wherein the working position of each gripper in the vertical linear direction is individually controllable.

9. 8. The gripper head according to claim 7, wherein the gripper comprises a height direction drive device for realizing displacement in the vertical linear direction.

10. 10. The gripper head of claim 9, wherein at least one height drive is force controllable.

11. An apparatus for routing and changing the spacing of electronic components configured in a matrix structure, comprising: a supply device for electronic components arranged in an initial matrix structure; At least one gripper head according to claim 1 or 2; a manipulator for moving the gripper head; and an ejection device for routed electronic components in a modified matrix configuration.

12. 12. The apparatus of claim 11, wherein the handling device comprises a control device configured to determine a position of an initial matrix of electronic components, compare the position of the initial matrix of electronic components with a predetermined reference position, and control the manipulator and the drive device based on the relative position of the initial matrix of electronic components.

13. 3. A method for handling and changing the spacing of electronic components configured in a matrix structure using the gripper head according to claim 1 or 2, comprising: a) providing an electronic component configured with at least one initial matrix structure; b) arranging grippers in X rows and Y columns of the gripper head to correspond to the configuration of the electronic components in the at least one initial matrix structure; c) bringing at least some of the grippers of the gripper head into contact with at least some of the electronic components arranged in the at least one initial matrix structure to grip the at least some of the electronic components; d) relative displacement of rows and columns of said grippers into a modified matrix configuration; e) releasing the electronic component by the gripper.

14. 14. The method of claim 13, wherein the gripper is actuated by applying a low pressure to the gripper.

15. 14. The method of claim 13, wherein a large pressure is applied to the gripper after the gripper releases the electronic component.

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