Modular MRI system

Abstract

The present disclosure relates to a modular magnetic resonance imaging device comprising an assembly of a plurality of modules (100) connected to one another, the shape and / or size of the modules being adapted to the shape of the assembly, each module (100) being adapted to conduct an electric current to generate a magnetic field and having a first structural part (106) assembled with a second structural part (102), the first structural part having a groove (202) separating the modules into at least two different conductive regions.

Description

[Technical field]

[0001] TECHNICAL FIELD The disclosure herein relates to the field of magnetic devices, and more particularly to the field of magnetic devices used in medical imaging that are modular and scalable. [Background technology]

[0002] Doctors and medical professionals use magnetic imaging techniques to more accurately identify problems in the human body that may be too difficult to diagnose by other means. Currently, magnetic resonance imaging machines are large machines with a small opening, roughly the size of a person. Imaging tests require a person to remain inside the machine for a period of time in a space that is at least laterally enclosed, which may cause anxiety and other complications for the person being examined. Furthermore, MRI examinations may be too uncomfortable or even impossible for people who suffer from claustrophobia or related conditions. Summary of the Invention [Problem to be solved by the invention]

[0003] Currently, MRI machines are constructed with a large magnet in the form of coils that generate a magnetic field. These coils are housed in a support structure for the machine. During an examination, the coils are energized to generate or affect a magnetic field. The excitation of the magnetic field creates a loud noise, sometimes described as hammering. This noise can be annoying to people, and requires that the housing be designed with this noise in mind. These additional design considerations necessitate the inclusion of noise absorbers and limiting the materials that can be used to construct the housing.

[0004] Currently, MRI machines as designed and built require multiple magnetic coils that are arranged around the examination region. The magnetic coils are arranged in a solenoid configuration with a cylindrical hole in the center. The person undergoing the examination lies inside the hole, which is called the examination region or examination table. The magnetic field of the MRI machine needs to be uniform and homogenous for proper operation, so it is necessary to have a stronger magnetic field closer to the exit of the examination region. Currently, the stronger magnetic field closer to the exit is created by adding additional magnetic coils around the exit.

[0005] Therefore, the geometry of the MRI device is limited by the shape of the coil.The magnetic field for MRI applications needs to be strong, and currently the only way to achieve a sufficiently strong magnetic field is to use a solenoid arrangement.

[0006] An alternative to large coils is described in U.S. Patent No. 8,838,193 to Maher et al. Maher describes modules that must be used with other similar modules to create a particular magnetic field configuration. The modules described in Maher must be sufficient in number and size, and must be arranged and oriented in a very specific manner to generate a usable magnetic field. Maher describes these modules as useful in MRI machines, but it is not clear how a uniform, homogenous magnetic field can be generated throughout the examination volume by using such modules. In addition, since each module generates its own magnetic field, if one module fails during operation, all operations are disabled. The Maher device may not be easily able to identify which module is malfunctioning, making the system quite limited. In addition, the Maher modules must have a specific size in order to operate properly, limiting the geometric configuration and size of an MRI machine built from the modules. It is not clear from Maher how a machine smaller than currently constructed machines could be realized. Additionally, larger devices that can accommodate a variety of shapes, such as half-cylinders, tunnels or cubes, may not be possible to realize using the modules described.

[0007] Other alternative coil configurations include the superconducting coil described in U.S. Patent No. 8,655,423 to Miyazaki, et al. Miyazaki describes a superconducting coil formed of multiple layers of various materials. A group of these layers are described as making up the superconducting coil portion formed of thin film superconducting wire. The coil described in Miyazaki, and coils common in the art, are constructed in the shape of a wire by placing a superconducting film, also referred to as a superconducting tape, which is then further configured in the shape of a coil. A review of the prior art reveals that a superconducting coil is formed by stacking superconducting films or layers such that current can flow in a desired direction to generate the appropriate magnetic field configuration. To the best of the inventor's knowledge and understanding, the prior art does not teach any other manner in which a superconducting film or tape may be used to conduct electrical current.

[0008] The superconducting tape itself is also in short supply, with the demand increasing year by year. Furthermore, there is a problem with the size and shape of the superconducting tape, which can only be constructed to a width of a few centimeters. In addition, the process of forming the superconducting tape into a wire and then into a coil is long and prone to defects.

[0009] It can therefore be summarized that there is a significant need for an MRI device that can be constructed in a variety of shapes and sizes. There is also a need for an alternative to large magnet coils that can generate an effective magnetic field even when the housing has a different shape, such as a half cylinder or a cube. In addition, any solution to the current limitations of MRI devices must further address that the MRI device should not exacerbate anxiety or claustrophobia-related conditions, provide a substantially quieter alternative, and reduce overall cost and design complexity. These are all limitations of current technology. [Means for solving the problem]

[0010] One embodiment addresses all or some of the shortcomings of known Magnetic Resonance Imaging (MRI) devices.

[0011] One embodiment provides a modular magnetic resonance imaging device comprising an assembly of multiple modules connected to each other, the shape and / or size of the modules being adapted to the shape of the assembly, each module being adapted to conduct an electric current to generate a magnetic field, the magnetic resonance imaging device having a first structural part assembled with a second structural part, the first structural part having a groove separating the modules into at least two different conductive regions.

[0012] In one embodiment, the grooves of the multiple modules are adapted to direct the flow of current in specific directions or different paths through the modules, and the characteristics of the current flow through the modules determine the shape of the magnetic field within the magnetic resonance imaging device.

[0013] In one or more embodiments, - at least one module of the plurality of modules is mechanically and / or electrically coupled to another module of the plurality of modules; and / or - the second structural part of at least one of the modules comprises a connection means, e.g. a mechanical connector such as a hinge or a flange, adapted to connect the module to another module of the plurality of modules; and / or at least one module of the plurality of modules has at least a flow path across the first structural portion, for example to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module, each flow path being adapted, for example, to form a flow path together with a flow path of another module of the plurality of modules; and / or - the first structural portion and the second structural portion of at least one module of the plurality of modules are adapted to be separated.

[0014] In one embodiment, at least one module, eg, the plurality of modules, is configured to exhibit superconducting properties.

[0015] In one embodiment, at least one of the plurality of modules comprises a stack of different materials, the stack comprising at least: a structural layer formed of or covered by a material such as, for example, Hastelloy; a superconducting layer disposed on the structural layer and including a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide; Contains At least one modular groove is patterned in at least said superconducting layer.

[0016] In one embodiment, the structural layer has at least flow channels to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module.

[0017] In one embodiment, the stack further comprises at least one buffer layer, preferably multiple buffer layers, between the structural layer and the superconducting layer, the at least one buffer layer being formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate, and the grooves being patterned in the at least one buffer layer and the superconducting layer.

[0018] In one embodiment, the stack further includes a shunt layer on the superconducting layer and in the groove, the shunt layer being formed of a metal, for example silver.

[0019] In one or more embodiments, the laminate comprises: a repeater layer provided under the shunt layer and including a repeat, preferably a plurality of repeats, for example 4 to 80 repeats, of the buffer layer and the superconducting layer; and / or a finishing layer provided on said shunt layer and including another superconducting layer, preferably not perforated; Further comprising: The trenches are patterned in the buffer layer, the superconducting layer and the repeater layer.

[0020] In one particular embodiment, the first structural portion comprises the structural layer, the at least one buffer layer, the superconducting layer, the repeater layer, the trench, and the shunt layer, and / or the second structural portion comprises the finishing layer.

[0021] An embodiment provides a module adapted to a modular magnetic resonance imaging device according to an embodiment.

[0022] An embodiment provides a module that is one of a number of modules that are included in a magnetic resonance imaging device according to an embodiment and are coupled to one another.

[0023] The modules may be arranged in the shape of, for example, a tunnel, a cylinder, a half-cylinder, an armband, a half-pipe, a parallelepiped, a box, etc.

[0024] One embodiment is a method for manufacturing a module according to an embodiment, comprising the steps of: - preparing a structural layer; - depositing a superconducting layer on said structural layer, for example by metal-organic chemical vapor deposition, - removing material from at least said superconducting layer, for example by laser etching techniques, to form a groove; filling the grooves with a metal, for example silver, and depositing a layer of said metal on the superconducting layer to form a shunt layer.

[0025] In one embodiment, the method further comprises forming at least one buffer layer, preferably multiple buffer layers, using, for example, a sputtering technique, prior to forming the superconducting layer, the at least one buffer layer being formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate.

[0026] In one embodiment, removing material further comprises removing material from the at least one buffer layer.

[0027] In one embodiment, the method further comprises: - forming a repeater layer including a repeat, preferably a plurality of repeats, for example 4 to 80 repeats, of the buffer layer and the superconducting layer before forming the grooves; and / or - forming a finishing layer, preferably comprising another non-perforated superconducting layer, on said shunt layer; Effect of the Invention

[0028] advantage Advantages of the embodiment of the modular MRI device can be described as follows: A simpler and less prone to defects configuration of the various modules allows for a more rapid assembly; A high containment of the magnetic field is achieved by layers that can at least partially shed the magnetic field, such as the Meissner effect or a similar effect; The devices are cheaper and the overall costs are reduced, since each module can be easily serviced and quickly replaced; The coils can be easily replaced and exchanged, allowing maintenance as well as testing of the device; The magnetized space is larger, allowing medical imaging of anxious and claustrophobic patients, making all patients more comfortable and possibly allowing simultaneous imaging of several patients; On the other hand, the magnetized space is smaller, making the device portable and suitable for imaging of limbs. Other technical advantages will be apparent to the skilled person from the detailed description, the drawings and the claims. Moreover, although certain advantages have been enumerated above, the various embodiments may include all, none or some of the enumerated advantages. [Brief description of the drawings]

[0029] The above and other features and advantages are explained in more detail in the following specific embodiments, given as non-limiting examples with reference to the accompanying drawings, in which:

[0030] [Figure 1] FIG. 1 is a general perspective view of a first embodiment of a module of the disclosed modular MRI device. [Diagram 2] FIG. 1 is an exploded perspective view of a first embodiment of a module of the disclosed modular MRI device. [Diagram 3] FIG. 2 is a perspective close-up view showing grooves of modules of a first embodiment of the disclosed modular MRI device. [Figure 4] FIG. 1 is a perspective view showing a modular MRI device assembled from modules according to a first embodiment. [Diagram 5] FIG. 1 is a perspective view of a modular MRI device assembled from modules according to a first embodiment showing magnetic field lines. [Figure 6] FIG. 13 is a perspective view of a second embodiment of a modular MRI device assembled from the disclosed modules. [Figure 7] FIG. 1 shows a second embodiment of a modular MRI device assembled from the disclosed modules in an open configuration with an expanded perspective view showing separation of the modules. [Figure 8] FIG. 13 is a perspective view of a third embodiment of a modular MRI device assembled from disclosed modules. [Figure 9] FIG. 13 is a perspective view of a fourth embodiment of a modular MRI device assembled from disclosed modules. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] In the various figures, similar features are indicated by similar reference numerals, and in particular, structural and / or functional features common to the various embodiments may have the same reference numerals and may have the same structural, dimensional and material characteristics.

[0032] For clarity, only those acts and elements useful for understanding the embodiments described herein have been shown and described in detail.

[0033] Unless otherwise indicated, when referring to two elements connected together, this refers to a direct connection without any intermediate elements other than conductors, and when referring to two elements coupled together, this refers to the two elements being either connected or coupled through one or more other elements.

[0034] In the following disclosure, unless otherwise indicated, when reference is made to terms that qualify absolute positions, such as "front", "back", "top", "bottom", "left", "right", or relative positions, such as "upper", "lower", "high", "low", or orientations, such as "horizontal", "vertical", etc., this term refers to the orientation of the drawings.

[0035] Unless otherwise specified, the terms "about," "approximately," "substantially," and "to the extent of" refer to within 10%, preferably within 5%, of the relevant value.

[0036] The drawings are not drawn to scale. It should be noted that the drawings show an embodiment of the disclosed modular MRI device, which may also be referred to simply as a device or apparatus when no ambiguity is assumed. Other embodiments may be possible, as a person with appropriate training may readily recognize. The actual size and / or shape of each of the parts of the embodiment may vary. Only the essential details of the embodiment are shown, but one of ordinary skill in the art will recognize how the entire device may be constructed without undue experimentation. Although some details have been omitted from the drawings, the inventor believes that the addition of these details is not necessary for an overall appreciation of the disclosed features of the invention. These omitted details include, among others, elements for holding or securing the device or its functional parts. Some features of the embodiments may be exaggerated for ease of understanding. The disclosed embodiments and the alternatives described should not be considered as limiting the invention in any manner.

[0037] In a first embodiment of the disclosed modular MRI device, the MRI device is composed of a module 100. One possible configuration of the module 100 is shown in FIG. 1. This module 100 may be divided into two parts, a first structural part 106 and a second structural part 102, which may be configured with a flow passage 108. The flow passage 108 of the first structural part 106 may be used to carry a cooling fluid or other type of material to cool the module 100 or to ensure its proper operation. For example, the flow passage 108 may also be used as a housing for wiring. The second structural part 102 may be configured with a means for connecting the modules 100 to each other. In the first embodiment, said means are fitted with a hinge 104, but may also be flanges, connectors or others.

[0038] Without limiting the disclosed invention, any module 100 may be configured to allow separation of the module 100 into a first structural portion 106 and a second structural portion 102, as shown in Figure 2. The first structural portion 106 may include a pattern defined by ridges, wedges, or grooves 202.

[0039] The grooves 202 separate the first structural portion 106 into different conductive regions so that electrical current can flow in specific directions or along different paths depending on the needs of a particular use.

[0040] The module may include multiple grooves.

[0041] The width of the groove may be in the range of 0.1 to 20 mm, for example in the range of 1 to 5 mm, for example about 1 mm.

[0042] The distance between adjacent grooves in adjacent modules and / or the distance between adjacent grooves in the same module may be in the range of 0.5 to 30 cm, for example in the range of 2 to 10 cm.

[0043] Adjacent grooves between adjacent modules and / or adjacent grooves within the same module may be non-uniformly spaced.

[0044] When referring to a groove, the groove includes a raised portion or a wedge portion.

[0045] Module configuration example The configuration of each module 100 is such that it allows the generation of a magnetic field. Therefore, every module 100 needs to conduct an electric current in order to generate a magnetic field. In a first embodiment, the current is conducted by the configuration of modules 100 as shown in FIG. 3. The configuration of modules 100 according to this first embodiment can be realized by deposition by methods such as metal-organic chemical vapor deposition (MOCVD) or similar techniques.

[0046] In a first embodiment shown in FIG. 3, the first structural portion 106 has a structural layer 300 made of a material such as Hastelloy or made of a different material and covered with Hastelloy. On top of the structural layer 300 of Hastelloy is placed a superconducting layer 302 forming a stack of layers. The superconducting layer 302 may be deposited by a technique such as metalorganic chemical vapor deposition (MOCVD) and is made of REBCO, YBCO or other suitable superconducting material. A buffer layer may be placed between the structural layer 300 and the superconducting layer 302. The buffer layer may be made of a number of other materials such as alumina, yttria, magnesium oxide and lanthanum manganate. These buffer layers may be deposited by a technique such as sputtering before depositing the superconducting layer 302. The buffer layer may form a suitable template for forming the superconducting layer.

[0047] The trenches 202 may be formed at least through the superconducting layer 302 using a patterning method such as laser etching or another technique such as mechanical or photolithography. In some embodiments, the trenches may also be formed through the buffer layer.

[0048] A shunt layer 304 may be disposed on top of the superconducting layer 302, filling the grooves 202. The shunt layer 304 may provide a path for quenching the superconducting layer 302. The shunt layer 304 may be formed of a material with good electrical conductivity, such as silver. The shunt layer 304 is optional. There are other solutions to address the quenching problem, such as operating at a sufficiently low current, temperature and / or magnetic field. Quenching is a problem for superconductivity in general, and is not related to the problem addressed by the embodiments.

[0049] Before forming the grooves 202, the described sequence of buffer layers and superconducting layers may be repeated several times (forming a repeater layer), with best results being achieved with 4-80 repetitions of the sequence of buffer layers and superconducting layers, e.g., 20-40 repetitions of the sequence of buffer layers and superconducting layers for a magnetic field of about 10 Tesla, so that further grooves may be formed in the repeater layer.

[0050] For example, the depth of the groove 202 is in the range of 3-5 μm for a series of buffer layers and superconducting layers. If a series of buffer layers and superconducting layers is repeated, the depth of the groove may be multiplied by the number of times the series of buffer layers and superconducting layers is repeated. For example, the depth of the groove is in the range of 3×N to 5×N μm, where N is the number of repetitions.

[0051] A finishing layer 306 may be deposited over the shunt layer 304. The finishing layer 306 comprises a preferably non-perforated (non-grooved) layer of superconducting material, at least in part to produce a phenomenon known as the Meissner effect or a similar effect. The Meissner effect prevents magnetic fields from crossing the finishing layer 306.

[0052] The finishing layer 306 may form part of the second structural portion 102. The first structural portion 106 further comprises, in some embodiments, a superconducting layer 302 and a shunt layer 304, and possibly a repeater layer and a groove 202. The first structural portion 106, and in particular the structural layer 300, may further comprise channels 108 through which a coolant may flow to allow cooling of the entire structure. In particular, the superconducting layer 302 may require significant cooling during operation.

[0053] According to an embodiment, the module is a modular coil.

[0054] Other layer configurations and / or methods for constructing a magnetic module, e.g., a modular coil, as stacked layers of different materials should be apparent to one of ordinary skill in the art. Another example of a method or modular coil is described in European Patent Application No. 22305437, filed on April 4, 2022 by the same applicant "Renaissance Fusion", entitled "METHOD FOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE", the contents of which are incorporated by reference to the maximum extent permitted by law.

[0055] A number of modules 100 may be assembled into a modular MRI machine as shown in Figure 4. A modular MRI machine assembled in this configuration may be referred to as a tunnel 400. The tunnel 400 is assembled from modules 100. The modules 100 may be configured in different sizes and shapes depending on the needs of a particular use. In this first embodiment, the tunnel 400 may be large enough to accommodate a person 402 and long enough for a person to walk from one side to the other.

[0056] Example of operation An example of the operation of the modular MRI device will be described with reference to the tunnel 400 shown in Figures 4 and 5. During operation, the modules 100 forming the structure of the tunnel 400 conduct an electric current 502. The conduction of the electric current generates a magnetic field, whose magnetic field lines pass inside the tunnel 400. For magnetic resonance imaging applications, the magnetic field lines may need to be particularly straight and the magnetic field particularly uniform over space. The configuration of the magnetic field may be changed by changing the characteristics of the electric current 502 conducted by the modules 100. For example, the strength of the electric current 502 may be changed, or even the path of the electric current 502 may be changed.

[0057] The tunnel 400 is large enough for a person 402 to walk comfortably inside, such that a person using the tunnel 400 for testing will not suffer from anxiety associated with medical conditions such as claustrophobia. Nevertheless, it should be understood that the modules may be configured in any size and other embodiments are also possible.

[0058] Additional Embodiments The module 100 may have a variety of shapes and sizes depending on the needs of a particular use. Below are described other embodiments that may be constructed by utilizing other module 100 shapes and sizes.

[0059] A second embodiment of a modular MRI device is shown in Figure 6. This second embodiment may be referred to as a wristwatch or armband 600. The armband 600 configuration is assembled from modules 100, and hinges 104 may be used to assemble several of the modules together. The armband 600 is sized to allow a leg or arm 602 to fit comfortably inside.

[0060] The armband 600 may be configured so that it can be easily opened and closed as shown in Fig. 7. Additionally, as also shown in Fig. 7, the modules 100 may have different sizes and some of the modules may not have hinges 104. If hinges are not used, other methods should be used to connect the modules 100 together. The connection of the modules 100 may be both mechanical and electrical depending on the needs of the use.

[0061] Yet another embodiment is shown in Figure 8. In this third embodiment, modules 100 are assembled into a half-pipe configuration 800 large enough for a person 402 to walk inside.

[0062] A fourth embodiment is shown in Figure 9. In this fourth embodiment, modules 100 are assembled in a box-like configuration 900 large enough for a person 402 to walk inside.

[0063] Exemplary embodiments of the present invention are summarized below: Other embodiments may be further understood from the entire specification and claims of this application.

[0064] Example 1. A modular magnetic resonance imaging device (400; 600; 800; 900), comprising: The system comprises an assembly of a plurality of modules (100) connected to each other, the shape and / or size of the module is adapted to the shape of the assembly; Each module (100) is adapted to conduct an electric current to generate a magnetic field and has a first structural portion (106) assembled with a second structural portion (102); The first structural portion has a groove (202) separating the module into at least two different conductive regions.

[0065] Example 2. The grooves of the modules are adapted to direct the flow of electrical current in specific directions or along different paths through the modules; 2. The magnetic resonance imaging device of example 1, wherein a characteristic of the current flow through the module determines a shape of a magnetic field within the magnetic resonance imaging device.

[0066] Example 3. A magnetic resonance imaging apparatus according to example 1 or 2, wherein at least one module (100) of the plurality of modules is mechanically and / or electrically coupled to another module of the plurality of modules.

[0067] Example 4. A magnetic resonance imaging apparatus as described in any one of Examples 1 to 3, wherein the second structural part (102) of at least one module (100) of the plurality of modules has a connection means (104) adapted to connect the module to another module of the plurality of modules, such as a mechanical connector such as a hinge or flange.

[0068] Example 5. A magnetic resonance imaging device as described in any one of Examples 1 to 4, wherein at least a module (100) of the plurality of modules has at least a flow path (108) crossing a first structural portion (106) to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module, each flow path being adapted, for example, to form a single flow path together with a flow path of another module of the plurality of modules.

[0069] Example 6. A magnetic resonance imaging device according to any one of Examples 1 to 5, wherein the first structural portion (106) and the second structural portion (102) of at least one module (100) among the plurality of modules are adapted to be separated.

[0070] Example 7. The magnetic resonance imaging apparatus of any one of Examples 1-6, wherein at least one module, such as a plurality of modules (100), is configured to exhibit superconducting properties.

[0071] Example 8. At least one module of the plurality of modules has a stack of different materials, the stack having at least: a structural layer (300) made of or covered with a material such as Hastelloy, a superconducting layer (302) disposed on the structural layer (300) and comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide; Contains A magnetic resonance imaging device according to any one of the preceding embodiments, wherein the grooves (202) of at least one module are patterned in at least the superconducting layer.

[0072] Example 9. A magnetic resonance imaging device as described in Example 8, wherein the structural layer (300) has at least a flow path (108) to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module.

[0073] Example 10. A magnetic resonance imaging device as described in Example 8 or 9, wherein the stack further comprises at least one buffer layer, preferably multiple buffer layers, between the structural layer and the superconducting layer, the at least one buffer layer being formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate, and the grooves (202) are patterned in the at least one buffer layer and the superconducting layer.

[0074] Example 11. A magnetic resonance imaging device according to any one of Examples 8 to 10, wherein the stack further comprises a shunt layer (304) on the superconducting layer (302) and within the groove (202), the shunt layer being formed of a metal, for example silver.

[0075] Example 12. The laminate is - a repeater layer disposed beneath the shunt layer (304) and including a repeat, preferably a plurality of repeats, for example 4 to 80 repeats, of the buffer layer and the superconducting layer; and / or a finishing layer (306) disposed on the shunt layer (304) and including another superconducting layer, preferably not perforated; Further comprising: The magnetic resonance imaging device of example 11 in combination with example 10, wherein the grooves (202) are patterned in the buffer layer, the superconducting layer and the repeater layer.

[0076] Example 13. A first structural portion (106) includes a structural layer (300), at least one buffer layer, a superconducting layer (302), a repeater layer, a trench (202), and a shunt layer (304), and / or 13. The magnetic resonance imaging device of claim 12, wherein the second structural portion (102) has a finishing layer (306).

[0077] Example 14. A module adapted to a magnetic resonance imaging device according to any one of Examples 1 to 13.

[0078] Example 15. A method for producing the module of Example 14, comprising the steps of: - providing a structural layer (300); - depositing a superconducting layer (302) on the structural layer (300), for example by metalorganic chemical vapor deposition, - removing material from at least the superconducting layer, for example by laser etching techniques, to form a groove (202); - filling the grooves with a metal, for example silver, and depositing a layer of said metal on the superconducting layer to form the shunt layer (304).

[0079] Example 16. The method of example 15, further comprising forming at least one buffer layer, preferably multiple buffer layers, using, for example, a sputtering technique, prior to forming the superconducting layer, the at least one buffer layer being formed of a material such as, for example, alumina, yttria, magnesium oxide, and / or lanthanum manganate.

[0080] Example 17. The method of example 16, further comprising removing material from at least one buffer layer when removing material.

[0081] Example 18. Furthermore, - forming a repeater layer including a repeat, preferably a plurality of repeats, e.g., 4 to 80 repeats, of the buffer layer and the superconducting layer prior to forming the grooves (202); and / or The method according to any one of embodiments 15 to 17, wherein a finishing layer (306), preferably comprising another non-perforated superconducting layer, is formed on the shunt layer (304).

[0082] Various embodiments and variations have been described, and those skilled in the art will understand that certain features of these embodiments can be combined, and other variations will readily occur to those skilled in the art.

[0083] Finally, the actual implementation of the embodiments and variations described herein is within the skill of those of ordinary skill in the art based on the functional representations provided above.

[0084] List of acronyms MRI Magnetic Resonance Imaging MOCVD Metal-organic chemical vapor deposition REBCO Rare Earth Barium Copper Oxide YBCO Yttrium Barium Copper Oxide

[0085] This application is based on and claims priority to European Patent Application No. 22305447, filed April 4, 2022, entitled "MODULAR MRI MACHINE," and European Patent Application No. 22305437, filed April 4, 2022, entitled "METHOD FOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE," which are incorporated by reference to the fullest extent permitted by law.

Claims

1. A modular magnetic resonance imaging system, It comprises an assembly of multiple interconnected modules, The shape and / or size of the module is adapted to the shape of the assembly. Each module is adapted to conduct electric current to generate a magnetic field and has a first structural part assembled with a second structural part. The first structural component of the magnetic resonance imaging apparatus has grooves that separate the module into at least two different conductive regions.

2. The grooves of the aforementioned modules are adapted to guide the flow of current through the modules in a specific direction or along different paths. The magnetic resonance imaging apparatus according to claim 1, wherein the characteristics of the current flow through the module determine the shape of the magnetic field in the magnetic resonance imaging apparatus.

3. - At least one of the plurality of modules is mechanically and / or electrically connected to another module among the plurality of modules, and / or - At least a second structural component of one of the plurality of modules has connecting means, such as mechanical connectors like hinges or flanges, adapted for connecting the module to another module among the plurality of modules, and / or - At least one of the plurality of modules has at least one channel that crosses the first structural portion to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module, and each channel is adapted to form a single channel together with, for example, a channel of another module among the plurality of modules, and / or - The magnetic resonance imaging apparatus according to claim 1 or 2, wherein at least the first structural portion and the second structural portion of one of the plurality of modules are adapted to be separable.

4. The magnetic resonance imaging apparatus according to claim 1 or 2, wherein at least one module, for example, the plurality of modules, is configured to exhibit superconducting properties.

5. At least one of the plurality of modules has a laminate of different materials, and the laminate comprises at least, - A structural layer formed or covered with a material such as Hastelloy, - A superconducting layer provided on the structural layer, comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide. It includes, The magnetic resonance imaging apparatus according to claim 1 or 2, wherein at least one module groove is patterned in at least the superconducting layer.

6. The magnetic resonance imaging apparatus according to claim 5, wherein the structural layer has at least a channel to allow a cooling fluid, such as nitrogen or helium, to flow through the module and / or to allow wiring through the module.

7. The laminate further includes at least one buffer layer, preferably a plurality of buffer layers, between the structural layer and the superconducting layer, wherein the at least one buffer layer is formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate. The magnetic resonance imaging apparatus according to claim 5, wherein the grooves are patterned in the at least one buffer layer and the superconducting layer.

8. The magnetic resonance imaging apparatus according to claim 5, wherein the laminate further includes a shunt layer on the superconducting layer and in the groove, and the shunt layer is made of a metal, for example, silver.

9. The laminate further includes at least one buffer layer, preferably a plurality of buffer layers, between the structural layer and the superconducting layer, wherein the at least one buffer layer is formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate. The grooves are patterned in the at least one buffer layer and the superconducting layer. The laminated body is - A repeater layer provided below the shunt layer, comprising repeats, preferably multiple repeats, for example, 4 to 80 repeats, of the buffer layer and the superconducting layer, and / or - A finishing layer provided on the shunt layer, preferably including another non-perforated superconducting layer. It also includes, The magnetic resonance imaging apparatus according to claim 8, wherein the grooves are patterned in the buffer layer, the superconducting layer, and the repeater layer.

10. The first structural component comprises the structural layer, the at least one buffer layer, the superconducting layer, the repeater layer, the groove, and the shunt layer, and / or The magnetic resonance imaging apparatus according to claim 9, wherein the second structural portion has the finishing layer.

11. A module that is one of a plurality of modules connected to each other and included in the magnetic resonance imaging apparatus according to claim 1 or 2.

12. A method for manufacturing the module described in claim 11, - Prepare the structural layers, - For example, by depositing a superconducting layer on the structural layer using metal-organic vapor deposition, - For example, by using laser etching technology to remove material from at least the superconducting layer and form grooves, - A method comprising filling the groove with a metal, such as silver, and depositing a layer of the metal on the superconducting layer to form a shunt layer.

13. The method according to claim 12, wherein, prior to forming the superconducting layer, at least one buffer layer, preferably a plurality of buffer layers, is formed using, for example, a sputtering technique, and the at least one buffer layer is formed of a material such as alumina, yttria, magnesium oxide and / or lanthanum manganate.

14. The method according to claim 13, wherein when removing the material, the material is further removed from at least one buffer layer.

15. - Before forming the groove, a repeater layer is formed which includes repeats of the buffer layer and the superconducting layer, preferably a plurality of repeats, for example, 4 to 80 repeats, and / or - The method according to claim 13, wherein a finishing layer, preferably comprising another non-perforated superconducting layer, is formed on the shunt layer.

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