Carrier for holding a substrate, apparatus for depositing a layer on a substrate, and method for supporting a substrate - Patents.com

Abstract

A carrier (100) for holding a substrate (10) in a curved state is provided. The carrier (100) comprises a carrier body (110) having a curved substrate support surface (111), a seal (120) for providing a seal between an edge of the substrate (10) and the carrier body (110), and a substrate fixture (130) for pressing the edge of the substrate (10) against the seal (120). The carrier body (110) comprises one or more gas supply conduits (140) for providing a gas cushion between a backside (10B) of the substrate (10) and the curved substrate support surface (111). Additionally, an apparatus for depositing a layer on a substrate in a curved state and a method for supporting a substrate in a curved state in a vacuum deposition chamber are provided.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to a carrier for holding a substrate, an apparatus for depositing a layer on a substrate, and a method for supporting a substrate.Embodiments of the present disclosure relate in particular to a carrier for holding a substrate in a vacuum environment, a deposition apparatus including a vacuum deposition chamber, and a method for supporting a substrate in a vacuum deposition chamber. [Background technology]

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, chemical vapor deposition (CVD), and physical vapor deposition (PVD), such as sputtering deposition. A sputter deposition process can be used to deposit a material layer, such as a layer of insulating material or a metal layer, on a substrate. During a sputter deposition process, a target having the target material to be deposited on the substrate is bombarded with ions generated in a plasma region to remove atoms of the target material from the surface of the target. The removed atoms can form a material layer on the substrate. In a reactive sputter deposition process, the removed atoms can react with a gas in the plasma region, such as nitrogen or oxygen, to form an oxide, nitride, or oxynitride of the target material on the substrate.

[0003] The coated material can be used in some applications and in some technical fields. For example, the coated material can be used in the field of microelectronics, such as to create semiconductor devices. Also, the substrate of a display can be coated using PVD process. Further applications include insulating panels, organic light-emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters, etc.

[0004] During deposition, the substrate is typically exposed to high temperatures under vacuum conditions, which poses challenges with respect to substrate handling and substrate cooling, especially for large area thin substrates. Summary of the Invention

[0005] In view of the above, there is a need to provide a carrier for holding a substrate, a deposition apparatus for depositing material on a substrate, and a method for supporting a substrate that overcomes at least some of the problems in the art.

[0006] In view of the above, there is provided a carrier for holding a substrate in a curved state, an apparatus for depositing a layer on a substrate in a curved state and a method for supporting a substrate in a curved state according to the independent claims. Further features, details, aspects, implementations and embodiments are given in the dependent claims, the description and the drawings.

[0007] According to an embodiment, a carrier for holding a substrate in a curved state is provided. The carrier includes a carrier body having a curved substrate support surface. In addition, the carrier includes a seal for providing a seal between an edge of the substrate and the carrier body. Furthermore, the carrier includes a substrate fixation for pressing the edge of the substrate against the seal. The carrier body includes one or more gas supply conduits for providing a gas cushion between a backside of the substrate and the curved substrate support surface.

[0008] According to an embodiment, there is provided an apparatus for depositing a layer on a substrate in a curved state, the apparatus including a vacuum deposition chamber, an array of deposition sources, and a carrier for holding the substrate in a curved state according to any embodiment described herein.

[0009] According to an embodiment, there is provided a method of supporting a substrate in a curved state in a vacuum deposition chamber. The method includes providing a carrier according to any embodiment described herein. Further, the method includes providing a gas cushion between a backside of the substrate and the curved substrate support surface.

[0010] The embodiments also relate to apparatus for carrying out the disclosed methods, including apparatus parts for performing each method aspect described. The methods can be performed by hardware components, a computer programmed by appropriate software, by any combination of the two, or in any other manner. Furthermore, the embodiments according to the present disclosure also relate to methods of operating the described apparatus, including method aspects for carrying out all the functions of the apparatus.

[0011] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above can be made by reference to embodiments, the accompanying drawings of which relate to embodiments of the present disclosure and which are described below. [Brief description of the drawings]

[0012] [Figure 1] 2 is a schematic top view of a carrier according to embodiments described herein. FIG. [Diagram 2] 2 is a schematic front view of a carrier according to an embodiment described herein. FIG. [Diagram 3] 1 is a schematic top view of a carrier according to a further embodiment described herein. [Figure 4] 1 is a schematic top view of a carrier according to a further embodiment described herein. [Diagram 5] 1 is a schematic top view of a carrier according to a further embodiment described herein. [Figure 6] 1 is a schematic top view of a carrier according to a further embodiment described herein. [Figure 7] FIG. 1 is a schematic top view of a deposition apparatus according to embodiments described herein. [Figure 8] FIG. 1 is a schematic top view of a deposition apparatus according to embodiments described herein. [Figure 9] 1 is a block diagram illustrating a method of supporting a substrate in a curved state according to embodiments described herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Various embodiments of the present disclosure are described in detail below. One or more examples of the embodiments are shown in the drawings. In the following description of the drawings, the same reference numerals refer to the same components. Generally, only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the present disclosure and is not meant to be a limitation of the present disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to produce further embodiments. The description is intended to include such modifications and variations.

[0014] In the following description of the drawings, the same reference numerals refer to the same or similar components. Generally, only the differences with respect to the individual embodiments are described. Unless otherwise specified, the description of a part or aspect of one embodiment also applies to the corresponding part or aspect of another embodiment.

[0015] 1, a carrier 100 for holding a substrate 10 in a curved state according to the present disclosure is described. According to an embodiment that can be combined with any other embodiment described herein, the carrier 100 includes a carrier body 110 having a curved substrate support surface 111. In addition, the carrier 100 includes a seal 120 for providing a seal between an edge of the substrate 10 and the carrier body 110. Furthermore, the carrier 100 includes a substrate fixture 130 for pressing the edge of the substrate 10 against the seal 120. The carrier body 110 includes one or more gas supply conduits 140 for supplying gas to the backside 10B of the substrate 10, in particular for providing a gas cushion between the backside 10B of the substrate 10 and the curved substrate support surface 111.

[0016] Thus, compared to the prior art, an improved carrier for holding a substrate is provided. In particular, by providing a carrier configured to hold the substrate in a curved state, the substrate holding stability can be improved due to the mechanical tension of the substrate caused by the curved state of the substrate. Furthermore, the embodiments of the carrier described herein can advantageously improve the heat transfer performance from the substrate to the carrier, thereby improving the cooling efficiency of the substrate. Furthermore, it is noted that the carrier according to the embodiments described herein is particularly suitable for cooling thin substrates, particularly large area substrates, having a thickness of 0.1 mm to 1.8 mm. In other words, compared to the state of the art, the carrier described herein advantageously reduces possible damage to the substrate. In addition, the alignment of the substrate to the susceptor, i.e. the carrier, particularly the carrier body, can be improved.

[0017] Before describing the various embodiments of the present disclosure in more detail, some aspects regarding some of the terminology used herein are explained.

[0018] In the present disclosure, a "carrier for holding a substrate in a curved state" can be understood to be a holder configured to hold a substrate as described herein, in particular a large area substrate as described herein, in a curved or bent state. Typically, a substrate held or supported by a carrier as described herein includes a front side 10F and a back side 10B, as exemplarily shown in FIG. 1. The front side is the side of the substrate on which a layer is deposited. The back side of the substrate is the side of the substrate facing the carrier body. In particular, a carrier for holding a substrate is configured to hold the substrate substantially vertically. In the present disclosure, the term "substantially vertical" can be understood to be vertical within a tolerance T of T≦±15°, in particular T≦±10°, more particularly T≦±5°, for example T≦±1°, from the absolute vertical direction. The absolute vertical direction corresponds to the direction of gravity.

[0019] In the present disclosure, a "substrate in a curved state" can be understood to be a substrate that is curved around a bending axis. It should therefore be understood that initially, the substrate is substantially flat, and when the substrate is secured to the carrier, the substrate is bent and has a curved state. It should therefore be understood that in the curved or bent state of the substrate (i.e., when the substrate is secured to the carrier), a mechanical tension is generated in the substrate. Furthermore, it should be understood that typically, when the substrate is removed or released from the carrier, the substrate returns to its initial substantially flat state. It should therefore be understood that typically, the substrate is elastic.

[0020] The radius of curvature of the substrate in the curved or bent state may or may not be constant. Typically, the bending axis is substantially vertical. In the illustrated exemplary embodiment, the substrate bends around a vertical bending axis. Alternatively, the bending axis may be substantially horizontal (not explicitly shown in the figures). In the present disclosure, the term "substantially horizontal" can be understood as horizontal within a tolerance T of T≦±15°, in particular T≦±10°, more particularly T≦±5°, for example T≦±1°, from the absolute horizontal direction. The absolute horizontal direction is perpendicular to the absolute vertical direction.

[0021] In the present disclosure, the term "substrate" may specifically include a substantially non-flexible substrate, such as a glass plate or a metal plate. The term "substantially non-flexible" is understood to be distinguished from "flexible". Specifically, a substantially non-flexible substrate may have some degree of flexibility, such as a glass plate having a thickness of 0.5 mm or less, and the flexibility of a substantially non-flexible substrate is small compared to a flexible substrate. Typically, the substrates described herein are elastic substrates. Furthermore, it should be understood that the substrates described herein can be bent into a curved state. Thus, an initially flat or planar substrate may be secured to a carrier body having a curved substrate support surface as described herein, such that the substrate is held in a curved or bent state. For example, the substrate may have a thickness of 0.1 mm to 1.8 mm. According to the embodiments described herein, the substrate may be formed from any material suitable for material deposition. For example, the substrate may be formed from a material selected from the group consisting of glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process.

[0022] According to some embodiments, the substrate may be a "large area substrate" and may be used in the manufacture of displays. For example, the substrate may be a glass or plastic substrate. For example, the substrates described herein include substrates commonly used in LCDs (liquid crystal displays), PDPs (plasma display panels), and the like. For example, a "large area substrate" may be a substrate having a size of 0.5 m 2 Above, especially 1m 2 In some embodiments, the large area substrate may have a major surface having an area of ​​about 0.67 m 2 GEN4.5, equivalent to a board (0.73 x 0.92 m), approximately 1.4 m 2 GEN5, which corresponds to a board (1.1m x 1.3m), is approximately 4.29m 2 GEN7.5, equivalent to a board (1.95m x 2.2m), approximately 5.7m 2GEN8.5, which corresponds to a board (2.2m x 2.5m), or even approx. 8.7m 2 The embodiment may be GEN10, which corresponds to a substrate (2.85m x 3.05m). Further generations such as GEN11 and GEN12 and corresponding substrate areas can be implemented similarly.

[0023] In the present disclosure, a "carrier body" can be understood to be a rigid body of a carrier configured to support a substrate. Typically, the carrier body has a curved substrate support surface. A "substrate support surface" can be understood to be a surface of the carrier facing the substrate, in particular the backside of the substrate. For example, the curved substrate support surface can be convex or concave. The curved substrate support surface can include a constant or non-constant radius of curvature. Typically, the curved substrate support surface is fully convex or fully concave. In other words, the curved substrate support surface can be simply convex with a constant or non-constant radius of curvature. Alternatively, the curved substrate support surface can be simply concave with a constant or non-constant radius of curvature. It should be understood that when the gas cushion is provided between the backside 10B of the substrate 10 and the curved substrate support surface 111, the curved substrate support surface 111 and the backside 10B of the substrate 10 are not in contact. In other words, in an operating state in which the gas cushion is provided, the substrate can be held without contact against the substrate support surface 111.

[0024] In the present disclosure, a "seal" can be understood as a seal configured to provide an airtight seal between the edge of the substrate and the carrier body described herein, so as to provide a gas cushion between the backside of the substrate and the substrate support surface. Typically, the seal is configured to provide a line contact, in particular a sealing line contact, between the backside of the substrate and the seal. Thus, typically, the seal is configured to provide a line contact, in particular a sealing line contact, between the seal and the front side of the carrier body, in particular the curved substrate support surface.

[0025] In the present disclosure, the "edge of the substrate" can be understood to be the edge of the front surface of the substrate, particularly the edge region of the front surface of the substrate. In particular, the "edge of the substrate" can be understood to be the entire edge of the substrate. In other words, the term "edge of the substrate" can include all edges on all sides of the substrate. More specifically, in the case of a vertically held substrate as exemplarily shown in FIG. 2, the term "edge of the substrate" can include the upper edge 10UE, the lower edge 10BE, and the side edge 10LE between the upper edge 10UE and the lower edge 10BE of the substrate 10 as exemplarily shown in FIG. 2.

[0026] In the present disclosure, a "substrate fixing part" can be understood as a fixing part configured to fix a substrate to a carrier, in particular to a carrier body. Typically, the substrate fixing part is configured to press an edge of the substrate against a seal as described herein. In other words, the substrate fixing part can be configured to apply a compressive force to the edge of the substrate. Furthermore, it should be understood that typically, the substrate fixing part is configured to hold the substrate in the described curved state. In other words, typically, the substrate fixing part is configured to counter reaction forces such as substrate tension and substrate stress that occur when the substrate is fixed to the carrier body in the curved or bent state as described herein.

[0027] In the present disclosure, the expression "the carrier body comprises one or more gas supply conduits for providing a gas cushion between the backside of the substrate and the substrate support surface" can be understood as meaning that at least one gas supply conduit is provided in the carrier body, through which gas can be supplied to the space between the backside of the substrate and the substrate support surface, so that a gas cushion can be provided. In Fig. 1, one or more gas supply conduits 140 are shown diagrammatically by arrows. Typically, the gas supply conduit comprises a gas outlet opening provided in the substrate support surface of the carrier body.

[0028] In the present disclosure, a "gas cushion" may be understood to be a volume filled with gas, particularly at a certain pressure. In particular, in the embodiments described herein, the gas-filled volume, i.e. the gas cushion, is provided between the backside 10B of the substrate 10 and the substrate support surface 111, the backside of the substrate being sealed against the substrate support surface via a seal 120 as described herein.

[0029] According to an embodiment, which may be combined with any other embodiment described herein, the substrate fixture 130 may include a plurality of clamps. As exemplarily shown in FIG. 2, the substrate fixture 130, in particular the plurality of clamps, may be distributed over an edge of the carrier and configured to press the edge of the substrate 10 against the seal 120. It should be understood that typically the substrate fixture 130, in particular the plurality of clamps, is connected to the carrier body 110.

[0030] According to an embodiment, which may be combined with any other embodiment described herein, the seal 120 is formed from a flexible material. In particular, the seal 120 may be formed from a flexible polymeric material. Thus, when the edge of the substrate is pressed against the seal 120 by the substrate fixture 130, an airtight seal may be provided.

[0031] According to an embodiment that can be combined with any other embodiment described herein, as shown diagrammatically in FIG. 3, the carrier includes a gas source 150 connected to one or more gas supply conduits 140 to provide a gas cushion. For example, the gas source can include a gas tank that can be part of the deposition system described herein. The gas source 150 can be configured to provide a gas cushion pressure p of up to 1 bar, in particular the gas cushion pressure p can be 1 Pa≦p≦1 bar, more particularly 5 Pa≦p≦1 bar. According to an example, the gas cushion pressure p can be 1 Pa≦p≦50 Pa, in particular 1 Pa≦p≦20 Pa. Furthermore, the gas source can be configured to provide an inert gas, for example argon, helium, or another inert gas.

[0032] According to an embodiment, which can be combined with any other embodiment described herein, as exemplarily shown in Fig. 1, the curved substrate support surface 111 is convex to hold a convex substrate. The convex substrate support surface is advantageous because it allows the convex substrate to self-align well to the convex substrate support surface. The term "self-alignment" can be understood as the substrate aligning substantially parallel to the substrate support surface due to the substrate tension in the curved or bent state of the substrate.

[0033] Alternatively, the curved substrate support surface 111 may be concave to hold a concave substrate, as exemplarily shown in FIG. 4, which may also improve the self-alignment of the substrate compared to the state of the art. Furthermore, compared to a convex substrate support surface, a concave substrate support surface may be advantageous in reducing the risk of substrate lift-off. In addition, compared to a convex substrate support surface, fixing the substrate, in particular pressing the substrate against the seal, may be easier. In other words, in a concave configuration, the compressive force that results in an airtight seal between the substrate and the seal may be smaller compared to a convex configuration.

[0034] Referring exemplarily to FIG. 4, according to an embodiment that can be combined with any other embodiment described herein, the carrier 100 can include a cooling system 190 for cooling the carrier body 110. Although the cooling system 190 system is shown in combination with a concave configuration in FIG. 4, it should be understood that the cooling system 190 can be provided in any embodiment described herein. For example, the cooling system 190 can include a cooling liquid supply source for supplying a cooling liquid. For example, the cooling system 190 can be a closed-loop cooling system, in particular a closed-loop refrigeration system. Typically, the cooling system includes a tube for the cooling liquid. The tube can be embedded in the carrier body. Additionally or alternatively, the tube can be provided on the back side of the carrier body. The cooling liquid can be understood to be a cooling fluid, in particular an incompressible cooling fluid, capable of cooling the substrate to a substrate temperature of 100° C. or less, in particular 80° C. or less. For example, the cooling liquid can be water or oil. Thus, according to an embodiment that can be combined with any other embodiment described herein, the carrier body can be a cooled carrier body, for example an oil-cooled carrier body or a water-cooled carrier body.

[0035] 5 by way of example, according to an embodiment that may be combined with any other embodiment described herein, the carrier further includes an electrostatic chuck 160 for holding the substrate via electrostatic force. In particular, the electrostatic chuck 160 may include an electrode assembly having a plurality of electrodes 161 for providing an electrostatic force to the substrate. Typically, the electrode assembly is embedded in the carrier body 110. It should therefore be understood that the electrode assembly may provide an electrostatic field acting on the substrate to hold the substrate.

[0036] According to some embodiments, which may be combined with other embodiments described herein, the electrostatic chuck 160 may include one or more voltage sources (not explicitly shown) configured to apply one or more voltages to the plurality of electrodes 161. In some implementations, the one or more voltage sources are configured to ground at least some of the plurality of electrodes. As an example, the one or more voltage sources may be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and / or ground to the plurality of electrodes. According to some embodiments, each electrode, every other electrode, every third electrode, or every third electrode of the plurality of electrodes may be connected to a separate voltage source. The term "polarity" refers to electrical polarity, i.e., negative (-) and positive (+). As an example, the first polarity may be negative and the second polarity may be positive, or the first polarity may be positive and the second polarity may be negative. According to some embodiments, which may be combined with other embodiments described herein, the electrostatic chuck 160 of the substrate support may be a monopolar or bipolar electrostatic chuck.

[0037] 5, according to some embodiments, which may be combined with other embodiments described herein, a controller 170 may be provided that may be configured to control one or more voltage sources for applying one or more voltages and / or grounds to the plurality of electrodes 161. The controller 170 may be configured to regulate an electrostatic chuck, i.e., the controller may be configured to control electrostatic chucking. Although not explicitly shown, it should be understood that the controller 170 may be configured to regulate the gas source 150. The controller 170 may be divided into individual controllers, i.e., a controller for the electrostatic chuck and another controller for the gas source. It should be understood that if an electrostatic chuck is not provided, only a controller for controlling the gas source may be provided.

[0038] Typically, the controller described herein comprises a central processing unit (CPU), memory, and, for example, support circuits. The CPU may be one of any form of general-purpose computer processor that can be used in an industrial environment to control various chambers and sub-processors. The memory is coupled to the CPU. The memory or computer-readable medium may be one or more readily available memory devices, such as random access memory, read-only memory, hard disk, or any other form of digital storage, local or remote. The support circuits may be coupled to the CPU to support the processor in a conventional manner. The support circuits typically include cache, power supply, clock circuits, input / output circuits, and related subsystems, etc. The control instructions are generally stored in the memory as software routines, commonly known as recipes. The software routines may be stored and / or executed by a second CPU located remotely from the hardware controlled by the CPU.

[0039] Referring exemplarily to FIG. 6, according to an embodiment that may be combined with any other embodiment described herein, the curved substrate support surface 111 comprises a plurality of filaments 180 of a dry adhesive material for attaching the backside 10B of the substrate 10. For illustrative purposes only, some filaments are labeled with reference numbers. Typically, the plurality of filaments 180 are attached to the curved substrate support surface 111 and extend away from the curved substrate support surface 111. It should therefore be understood that the plurality of filaments 180 typically have free ends for attaching the substrate described herein. More specifically, the free ends of the plurality of filaments are typically configured to attach to the substrate by van der Waals forces. It should therefore be understood that the plurality of filaments 180 can provide an adhesive arrangement that provides a permeable or porous arrangement of the adhesive arrangement. In other words, the structure of the adhesive arrangement may be configured to be porous or spongy so that gas can reach the backside 10B of the substrate 10.

[0040] According to one example, the dry adhesive material may be a synthetic setae material. In particular, the dry adhesive material may be Gecko glue. Typically, the dry adhesive material is configured to provide adhesion through van der Waals forces. For example, the filaments may be nanotubes or carbon nanotubes.

[0041] 7, an apparatus 200 for depositing a layer on a curved substrate 10 according to the present disclosure is depicted. According to an embodiment that may be combined with any other embodiment described herein, the apparatus 200 includes a vacuum deposition chamber 210, an array of deposition sources 220, and a carrier 100 according to any embodiment described herein. In particular, the array of deposition sources 220 and the carrier 100 for holding the substrate 10 are disposed within the vacuum deposition chamber 210.

[0042] In the present disclosure, the term "vacuum" can be understood in the sense of a technical vacuum, e.g. having a vacuum pressure of less than 10 mbar. Typically, the pressure in the vacuum chamber described herein is less than 10 -5 Millibar to about 10 -8 millibar, more commonly 10 -5 millibars ~ 10 -7 millibars, more commonly around 10 -6 Millibar to about 10 -7 It may be in millibars.

[0043] In the present disclosure, an "array of deposition sources" may be understood to be an array of multiple deposition sources. The individual deposition sources in the array of deposition sources may be of the same configuration or of different configurations.

[0044] In the present disclosure, a "deposition source" can be understood to be a source configured to deposit a material, in particular by using a sputter deposition process, in particular a magnetron sputtering process. Typically, the deposition source is a vertical deposition source, i.e. having a main longitudinal axis extending in a substantially vertical direction. It is understood that in order to deposit a layer on the substrate, the carrier with the substrate can pass continuously through the deposition source during deposition ("dynamic coating"). Alternatively, the carrier with the substrate can be placed in an essentially constant position during layer deposition ("static coating"). Furthermore, sweeping of the substrate or wobbling of the substrate can also be possible. The embodiments described in the present disclosure relate to both dynamic and static coating processes. For the example of moving the carrier, a transport system can be used, in particular including a magnetic levitation system. Typically, the magnetic levitation system is configured to levitate or hold the carrier without mechanical contact or with small mechanical contact by magnetic forces. Furthermore, the magnetic levitation system can be configured to move the carrier by magnetic forces.

[0045] According to some embodiments described herein, which can be combined with other embodiments described herein, the deposition material of the deposition source can be selected according to the deposition process and the subsequent use of the coated substrate. For example, the deposition material can be a material selected from the group consisting of metals such as aluminum, molybdenum, titanium, copper, silicon, indium tin oxide, and other transparent conductive oxides. The oxide, nitride, or carbide layer that may include such materials can be deposited by providing a material of the material deposition source, or by reactive deposition, i.e., the material of the material deposition source can react with elements such as oxygen, nitride, or carbon of the process gas.

[0046] According to some embodiments, which may be combined with any other embodiments described herein, the arrangement of the deposition sources 220 follows the curvature of the substrate, as exemplarily shown in Figure 8. In other words, the deposition sources 220 may be substantially parallel to the front side 10F of the substrate.

[0047] With exemplarily reference to the block diagram shown in FIG. 7, a method 300 for supporting a substrate in a curved state according to the present disclosure is described. According to an embodiment that can be combined with any other embodiment described herein, the method 300 includes providing a carrier 100 for supporting a substrate 10 according to any embodiment described herein (illustrated by block 310). Furthermore, the method includes providing a gas cushion between the backside 10B of the substrate 10 and the curved substrate support surface 111 (illustrated by block 320). Typically, providing the gas cushion includes introducing gas into one or more gas supply conduits 140 by using a gas supply source 150. In particular, the gas cushion is provided with a gas cushion pressure p of 1 Pa≦p≦20 Pa.

[0048] Considering the embodiments described herein, it should be understood that improved carriers, apparatuses, and methods for substrates are provided compared to the state of the art. In particular, by providing a carrier configured to hold the substrate in a curved or bent state, the mechanical tension of the substrate caused by the curved or bent state can improve the holding stability of the substrate. Furthermore, the embodiments described herein can advantageously improve the heat transfer performance from the substrate to the carrier, improving the cooling efficiency of the substrate. Furthermore, it should be noted that the embodiments described herein reduce possible damage to the substrate, which is particularly advantageous. In addition, the alignment of the substrate to the susceptor, i.e., the carrier, can be improved, improving the overall layer deposition quality.

[0049] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. A carrier (100) for holding a substrate (10) in a curved state, comprising: a carrier body (110) having a curved substrate support surface (111); a seal (120) for providing a seal between an edge of the substrate (10) and the carrier body (110); a substrate fixing portion (130) for pressing the edge portion of the substrate (10) against the seal (120); Equipped with A carrier (100), wherein the carrier body comprises one or more gas supply conduits (140) for providing a gas cushion between a backside (10B) of the substrate (10) and the curved substrate support surface (111).

2. The carrier (100) of claim 1 , wherein the substrate fixture (130) comprises a plurality of clamps.

3. The carrier (100) according to claim 1 or 2, wherein the seal (120) is made from a flexible material, in particular a flexible polymer material.

4. The carrier (100) of any one of claims 1 to 3, further comprising a gas supply (150) connected to said one or more gas supply conduits to establish said gas cushion.

5. The carrier (100) of claim 4, wherein the gas source (150) is configured to provide a gas cushion pressure p in the range of 1 Pa≦p≦20 Pa.

6. The carrier (100) of any one of claims 1 to 5, wherein the curved substrate support surface (111) is convex so as to hold the substrate (10) in a convex state.

7. The carrier (100) of any one of claims 1 to 5, wherein the curved substrate support surface (111) is concave to hold the substrate (10) in a concave state.

8. The carrier (100) of any one of the preceding claims, further comprising a cooling system (190) for cooling the carrier body (110).

9. The carrier (100) of any one of claims 1 to 8, further comprising an electrostatic chuck (160) for holding the substrate (10) via electrostatic forces.

10. The carrier (100) of any one of claims 1 to 9, wherein the curved substrate support surface (111) comprises a plurality of filaments of a dry adhesive material for attaching a back side (10B) of the substrate (10), the plurality of filaments extending away from the curved substrate support surface (111).

11. The carrier (100) of claim 10, wherein the dry adhesive material is a synthetic bristle material, in particular a gecko adhesive.

12. An apparatus (200) for depositing a layer on a curved substrate (10), comprising: a vacuum deposition chamber (210); an array of deposition sources (220); A carrier (100) for holding the substrate (10) in a curved state according to any one of claims 1 to 11; An apparatus (200).

13. The apparatus (200) of claim 12, wherein the arrangement of the deposition sources (220) follows the curvature of the substrate (10).

14. A method (300) for supporting a substrate (10) in a curved state in a vacuum deposition chamber (210), comprising: Providing (310) a carrier (100) for supporting the substrate (10) in said curved state according to any one of claims 1 to 11; providing (320) a gas cushion between the backside (10B) of the substrate (10) and the curved substrate support surface (111); A method comprising:

15. The method of claim 14, wherein providing the gas cushion comprises introducing gas into one or more gas supply conduits by using a gas source (150).

16. 16. The method according to claim 14 or 15, wherein the gas cushion is provided at a pressure p, where 1 Pa≦p≦20 Pa.

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