Stainless steel soaking plate processing method and soaking plate

Abstract

The present invention discloses a stainless steel heat sink processing method and a heat sink, and relates to the technical field of heat exchange. The stainless steel heat sink processing method includes the steps of connecting a stainless steel upper cover and a first copper body, immersing the first copper body, the second copper body, and the stainless steel upper cover in an electrolytic solution containing CuSO 4 and H 2 SO 4 and, electrically connecting the positive electrode of a power source to the first copper body and the negative electrode of the power source to the second copper body, starting the power source, and electroplating a porous copper plating layer on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method to form, and low-temperature oxidizing the stainless steel upper cover and the porous copper plating layer, and vacuum heating the stainless steel upper cover and the porous copper plating layer. By electroplating on the stainless steel upper cover by the stainless steel heat sink processing method to form a porous copper plating layer as a wick, efficient phase change heat dissipation can be realized, the thickness of the porous copper plating layer can be controlled, and processing requirements can be met.

Description

Technical Field

[0001] The present invention relates to the field of heat exchange technology, and particularly to a method for processing a stainless steel heat spreader and a heat spreader.

Background Art

[0002] The heat spreader has excellent heat conduction performance, and has advantages such as a relatively large heat transfer area, relatively good heat equalization performance, and high reliability, and is the most important means to solve the heat dissipation problem of electronic devices.

[0003] At present, in order to meet the heat dissipation requirements of modern miniaturized electronic devices in the 5G era, the ultra-thinning of the heat spreader is a current research hotspot in the industry and academia. The current wick structure of the heat spreader may be a single structure such as a microgroove, powder sintering, foamed metal, screen sintering, or a composite structure formed by the combination of two types of single structures. The thickness of the composite structure is relatively thick, but for the single-structured wick structure, it is generally difficult to comprehensively control its porosity, capillary pressure, permeability, and overall size. These factors comprehensively determine the excellent capillary performance of the ultra-thin heat spreader wick. Here, the goodness of the capillary performance of the wick plays a decisive role in the performance of the heat spreader. However, as the design of the heat spreader becomes thinner and thinner, the thickness of the wick is constantly compressed, which further leads to a sharp decline in the heat transfer performance of the heat spreader and the inability to ensure the heat dissipation effect of the heat spreader.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a method for processing a stainless steel heat spreader that can form a porous copper plating layer as a wick by electrodeposition to achieve efficient phase change heat dissipation.

[0005] The present invention further proposes a heat spreader using the method for processing a stainless steel heat spreader.

Means for Solving the Problems

[0006] The method for processing a stainless steel soaking plate according to an embodiment of the first aspect of the present invention includes: connecting a stainless steel upper cover and a first copper body; immersing the first copper body, the second copper body, and the stainless steel upper cover in an electrolytic solution containing CuSO 4 and H 2 SO 4 ; electrically connecting the positive electrode of a power source to the first copper body and the negative electrode of the power source to the second copper body; starting the power source and electroplating a porous copper plating layer on the nickel plating layer of the stainless steel upper cover by a hydrogen bubble template method; low-temperature oxidizing the stainless steel upper cover and the porous copper plating layer; and vacuum heating the stainless steel upper cover and the porous copper plating layer.

[0007] The method for processing a stainless steel soaking plate according to an embodiment of the present invention has at least the following beneficial effects. A nickel plating layer is plated on the surface of the stainless steel upper cover. By connecting the stainless steel upper cover and the first copper body, the stainless steel upper cover is electrically connected to the first copper body. The stainless steel upper cover, the first copper body, and the second copper body are immersed in an electrolytic solution containing CuSO 4 and H 2 SO 4It is immersed in an electrolytic solution containing [specific substances], the positive electrode of the power supply is electrically connected to the first copper body, and the negative electrode of the power supply is electrically connected to the second copper body. After starting the power supply, a copper plating layer can be electrodeposited on the nickel plating layer of the stainless steel upper cover. In the process of copper electrodeposition, in addition to the reduction reaction of copper ions, it further includes a hydrogen generation reaction. Hydrogen bubbles precipitate from the nickel plating layer of the stainless steel upper cover. Using the hydrogen bubbles as a template, a deposition layer cannot be formed at the positions occupied by the bubbles. Copper ions can only be reduced and deposited in the gaps between the templates formed by the hydrogen bubbles. Due to the fast deposition rate, the copper ions around the copper deposits are quickly depleted, and the continuous precipitation of hydrogen gas is added to interrupt the diffusion of reaction ions from the electrolytic solution to the ion depletion region. Therefore, copper can only grow continuously in the gaps between the bubbles, and finally a porous copper plating layer with a self-supporting structure having a high porosity and a high specific surface area is obtained. The porous copper plating layer has high-efficiency fluid flow and low permeability of the liquid working substance. By integrally constructing a super-hydrophilic porous copper plating layer as a wick on the surface of the stainless steel upper cover to achieve efficient phase change heat dissipation and controlling the time to start the power supply, the thickness of the porous copper plating layer can be controlled, and the thickness of the porous copper plating layer can be accurately controlled. After the electroplating is completed, first place the stainless steel upper cover and the porous copper plating layer in an oxygen gas environment for low-temperature heating, and then place the stainless steel upper cover and the porous copper plating layer in a vacuum environment for heating to form an oxide film on the surface of the stainless steel upper cover, which can improve the rust resistance of the stainless steel upper cover, strengthen the structural stability of the copper plating layer, and further improve the stability of the operation of this heat pipe. By forming a porous copper plating layer as a wick by electrodeposition on the stainless steel upper cover by the stainless steel heat pipe processing method, efficient phase change heat dissipation can be realized, the thickness of the porous copper plating layer can be controlled, and the processing requirements can be met.

[0008] According to some embodiments of the present invention, the step of "starting the power supply and electroplating a porous copper plating layer on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method" includes the step of adjusting the electrolyte to 25 °C, starting the power supply for 25 seconds, and the power supply outputting a current with a current density of 0.5 A / cm 2 and electroplating the porous copper plating layer on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method.

[0009] According to some embodiments of the present invention, the step of "immersing the first copper body, the second copper body and the stainless steel upper cover in an electrolyte containing CuSO 4 and H 2 SO 4 includes the step of immersing the first copper body, the second copper body and the stainless steel upper cover in an electrolyte composed of 0.2 mol / L CuSO 4 , 1 mol / L H 2 SO 4 and sodium dodecyl sulfate.

[0010] According to some embodiments of the present invention, before the step of "vacuum heating the stainless steel upper cover and the porous copper plating layer", the steps of placing the stainless steel lower cover on the side of the stainless steel upper cover where the porous copper plating layer is electroplated, pressing the stainless steel upper cover and the stainless steel lower cover, and laser welding the stainless steel upper cover and the stainless steel lower cover to package the porous copper plating layer are further included.

[0011] According to some embodiments of the present invention, the step of "vacuum heating the stainless steel upper cover and the porous copper plating layer" includes the steps of placing the stainless steel upper cover and the stainless steel lower cover in a vacuum environment and heating the stainless steel upper cover and the stainless steel lower cover to 850 °C for 120 minutes.

[0012] According to some embodiments of the present invention, the step of "low-temperature oxidizing the stainless steel upper cover and the porous copper plating layer" includes the step of placing the stainless steel upper cover and the porous copper plating layer in an oxygen environment, and the step of heating the stainless steel upper cover and the porous copper plating layer to 500 °C for a heating time of 120 minutes.

[0013] According to some embodiments of the present invention, both the first copper body and the second copper body can be phosphor bronze and brass.

[0014] According to some embodiments of the present invention, before the step of "connecting the stainless steel upper cover and the first copper body", the steps further include immersing the stainless steel upper cover in acetone, immersing the stainless steel upper cover in ethanol, immersing the stainless steel upper cover in deionized water, and immersing the stainless steel upper cover in a 100 ml / L hydrochloric acid solution.

[0015] According to some embodiments of the present invention, before the step of "connecting the stainless steel upper cover and the first copper body", the steps further include immersing the stainless steel upper cover in deionized water, electroplating a nickel plating layer on the surface of the stainless steel upper cover to form, and immersing the stainless steel upper cover in deionized water again.

[0016] The heat pipe according to an embodiment of the second aspect of the present invention includes a stainless steel upper cover and a heat dissipation copper plating layer. The stainless steel upper cover includes a stainless steel body and a nickel plating layer installed on one side of the stainless steel body. The heat dissipation copper plating layer is installed on the nickel plating layer, and several fine holes are installed on the surface of the heat dissipation copper piece.

[0017] The heat pipe according to an embodiment of the present invention has at least the following beneficial effects. The heat pipe can be made according to the stainless steel heat pipe processing method of the embodiment of the first aspect. A nickel plating layer is plated on the surface of the stainless steel upper cover, and the stainless steel upper cover is electrically connected to the first copper body by connecting the stainless steel upper cover and the first copper body. The stainless steel upper cover, the first copper body and the second copper body are made of CuSO 4 and H 2 SO 4Immerse it in an electrolytic solution containing [specific components], electrically connect the positive electrode of the power supply to the first copper body, and electrically connect the negative electrode of the power supply to the second copper body. After starting the power supply, a copper plating layer can be electrodeposited on the nickel plating layer of the stainless steel upper cover. In addition to the reduction reaction of copper ions in the process of copper electrodeposition, it further includes a hydrogen generation reaction. Hydrogen bubbles precipitate from the nickel plating layer of the stainless steel upper cover. Using the hydrogen bubbles as a template, a deposition layer cannot be formed at the positions occupied by the bubbles, and copper ions can only be reduced and deposited in the gaps between the templates formed by the hydrogen bubbles. Due to the high deposition rate, the copper ions around the copper deposit are quickly depleted, and the continuous precipitation of hydrogen gas is added to interrupt the diffusion of reaction ions from the electrolytic solution to the ion depletion region. Therefore, copper can only grow continuously in the gaps between the bubbles, and finally a porous copper plating layer with a self-supporting structure having a high porosity and a high specific surface area is obtained. The porous copper plating layer has high-efficiency fluid flow and low permeability of the liquid working substance. Integrally construct a super-hydrophilic porous copper plating layer on the surface of the stainless steel upper cover as a wick to realize efficient phase change heat dissipation. By controlling the time when the power supply is started, the thickness of the porous copper plating layer can be controlled, and the thickness of the porous copper plating layer can be accurately controlled. Here, since the heat dissipation copper plating layer is installed on the nickel plating layer and several fine holes are installed on the surface of the heat dissipation copper piece, the multilayer copper plating layer is the heat dissipation copper plating layer. After the electroplating is completed, first place the stainless steel upper cover and the heat dissipation copper plating layer in an oxygen gas environment for low-temperature heating, and then place the stainless steel upper cover and the heat dissipation copper plating layer in a vacuum environment for heating to form an oxide film on the surface of the stainless steel upper cover, which can improve the rust resistance of the stainless steel upper cover, strengthen the structural stability of the copper plating layer, and further improve the stability of the operation of this heat pipe. By the stainless steel heat pipe processing method, an electroplated heat dissipation copper plating layer is formed as a wick on the stainless steel upper cover to realize efficient phase change heat dissipation, control the thickness of the heat dissipation copper plating layer, and meet the processing requirements.

[0018] Additional aspects and advantages of the present invention are partially shown in the following description, partially will become apparent from the following description, or will be understood by the practice of the present invention. The above and / or additional aspects and advantages of the present invention will become apparent and easier to understand in the description of embodiments in conjunction with the following drawings.

Brief Description of the Drawings

[0019]

Figure 1

Modes for Carrying Out the Invention

[0020] Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals from beginning to end represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are only used for interpreting the present invention and should not be understood as limiting the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by descriptions related to orientation, such as up, down, left, right, front, back, etc., is the orientation or positional relationship shown based on the drawings and is only for facilitating the description of the present invention and simplifying the description, and does not indicate or imply that the device or element mentioned must have a specific orientation and be configured and operated in a specific orientation. Therefore, it should not be understood as limiting the present invention.

[0022] In the description of the present invention, unless otherwise clearly defined, terms such as installation, attachment, connection, etc. should be understood in a broad sense, and those skilled in the art may reasonably determine the specific meaning of the above terms in the present invention in combination with the specific content of the technical solution.

[0023] Referring to FIG. 1, the method for processing a stainless steel soaking plate according to an embodiment of the first aspect of the present invention includes the following steps. S100: Connect the stainless steel upper cover and the first copper body. S200: Immerse the first copper body, the second copper body, and the stainless steel upper cover in an electrolytic solution containing CuSO 4 and H 2 SO 4 and. S300: Electrically connect the positive electrode of the power supply to the first copper body and the negative electrode of the power supply to the second copper body. S400: Start the power supply and electroplate a porous copper plating layer on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method. S500: Low-temperature oxidize the stainless steel upper cover and the porous copper plating layer. S600: Vacuum heat the stainless steel upper cover and the porous copper plating layer.

[0024] A nickel plating layer is plated on the surface of the stainless steel upper cover. By connecting the stainless steel upper cover and the first copper body, the stainless steel upper cover is electrically connected to the first copper body. The stainless steel upper cover, the first copper body, and the second copper body are immersed in an electrolytic solution containing CuSO 4 and H 2 SO 4Immerse it in an electrolytic solution containing the following, electrically connect the positive electrode of the power supply to the first copper body, and electrically connect the negative electrode of the power supply to the second copper body. After starting the power supply, a copper plating layer can be electrodeposited on the nickel plating layer of the stainless steel upper cover. In addition to the reduction reaction of copper ions in the process of copper electrodeposition, it further includes a hydrogen generation reaction. Hydrogen bubbles precipitate from the nickel plating layer of the stainless steel upper cover. Using the hydrogen bubbles as a template, a deposition layer cannot be formed at the position occupied by the bubbles. Copper ions can only be reduced and deposited in the gaps between the templates in the form of hydrogen bubbles. Due to the high deposition rate, the copper ions around the copper deposit are quickly depleted, and the continuous precipitation of hydrogen gas is added to interrupt the diffusion of the reaction ions from the electrolytic solution to the ion depletion region. Therefore, copper can only grow continuously in the gaps between the bubbles, and finally a porous copper plating layer with a self-supporting structure having a high porosity and a high specific surface area is obtained. The porous copper plating layer has high-efficiency fluid flow and low permeability of the liquid working substance. Integrally construct a super-hydrophilic porous copper plating layer on the surface of the stainless steel upper cover as a wick to achieve efficient phase change heat dissipation. By controlling the start-up time of the power supply, the thickness of the porous copper plating layer can be controlled, and the thickness of the porous copper plating layer can be accurately controlled. After the electroplating is completed, first place the stainless steel upper cover and the porous copper plating layer in an oxygen gas environment for low-temperature heating, and then place the stainless steel upper cover and the porous copper plating layer in a vacuum environment for heating to form an oxide film on the surface of the stainless steel upper cover, which can improve the rust resistance of the stainless steel upper cover, strengthen the structural stability of the copper plating layer, and further improve the stability of the operation of this heat pipe. By electroplating on the stainless steel upper cover by the stainless steel heat pipe processing method to form a porous copper plating layer as a wick, efficient phase change heat dissipation can be realized, the thickness of the porous copper plating layer can be controlled, and the processing requirements can be met.

[0025] In some embodiments of the present invention, the step of "S400: Start the power supply and electroplate and form a porous copper plating layer on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method" is The step of adjusting the electrolytic solution to 25 °C, and Start the power supply for 25 seconds, and the power supply outputs a current with a current density of 0.5 A / cm 2 and forming a porous copper plating layer by electroplating on the nickel plating layer of the stainless steel upper cover by the hydrogen bubble template method.

[0026] By controlling the temperature of the electrolyte, the temperatures of the first copper body, the second copper body and the stainless steel upper cover can be controlled, thereby controlling the temperature environment in the electroplating process and ensuring the stability of the electroplating process. By controlling the startup time of the power supply and the current output from the power supply, the electroplating time and the electroplating efficiency can be controlled, thereby controlling the porous copper plating layer and making the porous copper plating layer conform to the processing requirements of heat sink thinning.

[0027] In some embodiments of the present invention, the step of "S200: Immerse the first copper body, the second copper body and the stainless steel upper cover in an electrolyte containing CuSO 4 and H 2 SO 4 " includes immersing the first copper body, the second copper body and the stainless steel upper cover in an electrolyte composed of 0.2 mol / L CuSO 4 , 1 mol / L H 2 SO 4 and sodium dodecyl sulfate.

[0028] By immersing the first copper body, the second copper body and the stainless steel upper cover in the electrolyte, since the electrolyte contains CuSO 4 and H 2 SO 4 , a chemical environment for electrodepositing copper can be provided. By introducing sodium dodecyl sulfate, which is a chemical reducing agent, into the electrochemical deposition process, the generation of the plating layer in the direction of instantaneous nucleation growth can be induced to obtain an electrodeposited plating layer sample and improve the electroplating efficiency.

[0029] In some embodiments of the present invention, before the step of "S600: Vacuum heat the stainless steel upper cover and the porous copper plating layer", placing the stainless - steel lower cover on the side of the stainless - steel upper cover where the porous copper plating layer is electroplated; crimping the stainless - steel upper cover and the stainless - steel lower cover; further comprising the step of packaging the porous copper plating layer by laser - welding the stainless - steel upper cover and the stainless - steel lower cover.

[0030] The porous copper plating layer is located between the stainless - steel upper cover and the stainless - steel lower cover, crimps the stainless - steel upper cover and the stainless - steel lower cover to each other, and fixes and welds the stainless - steel upper cover and the stainless - steel lower cover by laser - welding, so as to package the porous copper plating layer between the stainless - steel upper cover and the stainless - steel lower cover, and the porous copper plating layer can be protected.

[0031] In some embodiments of the present invention, the step of "S600: vacuum - heating the stainless - steel upper cover and the porous copper plating layer" includes placing the stainless - steel upper cover and the stainless - steel lower cover in a vacuum environment; heating the stainless - steel upper cover and the stainless - steel lower cover to 850 °C and setting the heating time to 120 minutes.

[0032] By vacuum - heating the stainless - steel upper cover and the stainless - steel lower cover, wrinkles and deformations caused by stainless - steel welding can be flattened, and the porous copper plating layer can be further strengthened, improving the structural strength of the porous copper plating layer.

[0033] In some embodiments of the present invention, the step of "S500: low - temperature oxidizing the stainless - steel upper cover and the porous copper plating layer" includes placing the stainless - steel upper cover and the porous copper plating layer in an oxygen environment; heating the stainless - steel upper cover and the porous copper plating layer to 500 °C and setting the heating time to 120 minutes.

[0034] By placing the stainless steel upper cover and the porous copper plating layer in an oxygen environment, an oxide film can be formed on the surfaces of the stainless steel upper cover and the stainless steel lower cover, and the corrosion resistance of the stainless steel upper cover and the stainless steel lower cover can be improved.

[0035] In some embodiments of the present invention, both the first copper body and the second copper body can be phosphor bronze and brass.

[0036] Specifically, the first copper body is brass, the second copper body is phosphor bronze, with phosphor bronze as the anode and brass as the cathode. The crystal grains of phosphor bronze are fine and uniformly distributed, the formation of the anode film is rapid and uniform during electroplating, the release of copper ions is stable, and the copper plating layer formed after electroplating is brighter and more uniform. On the other hand, brass has a relatively high thermal conductivity, has good heat conduction efficiency, and can conduct heat more efficiently.

[0037] In some embodiments of the present invention, before the step of "connecting the stainless steel upper cover and the first copper body", immersing the stainless steel upper cover in acetone, immersing the stainless steel upper cover in ethanol, immersing the stainless steel upper cover in deionized water, and further including the step of immersing the stainless steel upper cover in a hydrochloric acid solution of 100 ml / L.

[0038] By immersing the stainless steel upper cover in acetone, ethanol and hydrochloric acid solution, the oil stains and oxide layer on the surface of the stainless steel upper cover can be removed, and the stability of subsequent electroplating can be improved. By immersing the stainless steel upper cover in deionized water, the acetone and ethanol adhering to the stainless steel upper cover can be washed away.

[0039] In some embodiments of the present invention, before the step of "connecting the stainless steel upper cover and the first copper body", immersing the stainless steel upper cover in deionized water, The step of electroplating a nickel plating layer on the surface of the stainless steel upper cover to form it, It further includes the step of immersing the stainless steel upper cover in deionized water again.

[0040] By immersing the stainless steel upper cover in deionized water, the stainless steel upper cover can be cleaned. By electroplating a nickel plating layer on the stainless steel upper cover, the stainless steel upper cover can be given relatively good corrosion resistance. Specifically, the part of the stainless steel upper cover where the nickel plating layer is plated is immersed in the electrolytic solution, and H 2 SO 4 is used to avoid the corrosion of the stainless steel upper cover.

[0041] Referring to FIG. 1, according to the heat pipe of the embodiment of the second aspect of the present invention, the heat pipe includes a stainless steel upper cover and a heat dissipation copper plating layer. The stainless steel upper cover includes a stainless steel body and a nickel plating layer. The nickel plating layer is installed on one side of the stainless steel body. The heat dissipation copper plating layer is installed on the nickel plating layer, and several fine holes are installed on the surface of the heat dissipation copper piece.

[0042] The heat pipe can be made according to the stainless steel heat pipe processing method of the embodiment of the first aspect. A nickel plating layer is plated on the surface of the stainless steel upper cover. The stainless steel upper cover is electrically connected to the first copper body by connecting the stainless steel upper cover and the first copper body. The stainless steel upper cover, the first copper body and the second copper body are connected with CuSO 4 and H 2 SO 4It is immersed in an electrolytic solution containing the like, the positive electrode of the power source is electrically connected to the first copper body, and the negative electrode of the power source is electrically connected to the second copper body. After starting the power source, a copper plating layer can be electrodeposited on the nickel plating layer of the stainless steel upper cover. In addition to the reduction reaction of copper ions in the process of copper electrodeposition, it further includes a hydrogen generation reaction. Hydrogen bubbles precipitate from the nickel plating layer of the stainless steel upper cover. Using the hydrogen bubbles as a template, a deposition layer cannot be formed at the position occupied by the bubbles. Copper ions can only be reduced and deposited in the voids between the templates formed by the hydrogen bubbles. Since the deposition rate is fast, the copper ions around the copper deposit are quickly depleted, and the continuous precipitation of hydrogen gas is added to interrupt the diffusion of the reaction ions from the electrolytic solution to the ion depletion region. Therefore, copper can only grow continuously in the voids between the bubbles, and finally a porous copper plating layer with a self-supporting structure having a high porosity and a high specific surface area is obtained. The porous copper plating layer has high-efficiency fluid flow and low permeability of the liquid working substance. An ultrathin hydrophilic porous copper plating layer is integrated on the surface of the stainless steel upper cover as a wick to achieve efficient phase change heat dissipation. By controlling the starting time of the power source, the thickness of the porous copper plating layer can be controlled, and the thickness of the porous copper plating layer can be accurately controlled. Here, since the heat dissipation copper plating layer is installed on the nickel plating layer and several fine holes are installed on the surface of the heat dissipation copper piece, the multilayer copper plating layer is the heat dissipation copper plating layer. After the electroplating is completed, first place the stainless steel upper cover and the heat dissipation copper plating layer in an oxygen gas environment for low-temperature heating, and then place the stainless steel upper cover and the heat dissipation copper plating layer in a vacuum environment for heating to form an oxide film on the surface of the stainless steel upper cover, which can improve the rust resistance of the stainless steel upper cover, strengthen the structural stability of the copper plating layer, and further improve the stability of the operation of this heat pipe. The heat dissipation copper plating layer is formed as a wick by electrodeposition on the stainless steel upper cover by the stainless steel heat pipe processing method, realizing efficient phase change heat dissipation, controlling the thickness of the heat dissipation copper plating layer, and meeting the processing requirements.

[0043] In the description of this specification, descriptions such as "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples", which are reference terms, mean that the specific features, structures, materials, or characteristics described in this embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. And the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0044] Although embodiments of the present invention have been shown and described, as can be understood by those skilled in the art, various changes, modifications, replacements, and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the claims and their equivalents.

Claims

1. connecting the stainless steel top cover and the first copper body; The first copper body, the second copper body and the stainless steel top cover are sealed with CuSO ４ and H ２ SO ４ and immersing the metal in an electrolyte solution comprising: electrically connecting a positive terminal of a power source to the first copper body and a negative terminal of the power source to the second copper body; activating the power source and electroplating a porous copper plating layer on the nickel plating layer of the stainless steel top cover by a hydrogen bubble template method; low-temperature oxidation of the stainless steel top cover and the porous copper plating layer; A method for processing a stainless steel hot plate, comprising the step of vacuum heating the stainless steel top lid and the porous copper plating layer.

2. The step of "activating the power source and electroplating a porous copper plating layer on the nickel plating layer of the stainless steel top cover by a hydrogen bubble template method" is Adjusting the electrolyte to 25° C.; The power supply was turned on for 25 seconds, and the power supply was set to a current density of 0.5 A / cm ２ and forming the porous copper plating layer on the nickel plating layer of the stainless steel top cover by electroplating using a hydrogen bubble template method.

3. "The first copper body, the second copper body and the stainless steel top cover are made of CuSO ４ and H ２ SO ４ and "immersing the electrode in an electrolyte solution containing the electrode" The first copper body, the second copper body and the stainless steel top cover are sealed in a 0.2 mol / L CuSO ４ , 1 mol / L H ２ SO ４ 2. The method for processing a stainless steel hot plate according to claim 1, further comprising a step of immersing the stainless steel hot plate in the electrolyte solution consisting of sodium dodecyl sulfate and sodium dodecyl sulfate.

4. Before the step of "heating the stainless steel top cover and the porous copper plating layer in a vacuum," placing a stainless steel bottom lid on the side of the stainless steel top lid on which the porous copper plating layer is electroplated; a step of crimping the stainless steel upper lid and the stainless steel lower lid together; 2. The method for processing a stainless steel hot plate according to claim 1, further comprising a step of packaging the porous copper plating layer by laser welding the stainless steel upper lid and the stainless steel lower lid.

5. The step of "heating the stainless steel top cover and the porous copper plating layer in a vacuum" is placing the stainless steel top cover and the stainless steel bottom cover in a vacuum environment; 5. The method for processing a stainless steel hot plate according to claim 4, further comprising the steps of heating the stainless steel upper cover and the stainless steel lower cover to 850° C. for a heating time of 120 minutes.

6. The step of "low-temperature oxidizing the stainless steel top cover and the porous copper plating layer" includes: placing the stainless steel top cover and the porous copper plating layer in an oxygen environment; 2. The method for processing a stainless steel hot plate according to claim 1, further comprising the step of heating the stainless steel top cover and the porous copper plating layer to 500° C. for a heating time of 120 minutes.

7. The method for processing a stainless steel hot plate according to claim 1, wherein the first copper body and the second copper body are made of phosphorus copper and brass.

8. Before the step of "connecting the stainless steel top cover and the first copper body", immersing the stainless steel top cover in acetone; immersing the stainless steel top cover in ethanol; immersing the stainless steel top cover in deionized water; The method for processing a stainless steel hot plate according to claim 1, further comprising the step of immersing the stainless steel top cover in a 100 ml / L hydrochloric acid solution.

9. Before the step of "connecting the stainless steel top cover and the first copper body", immersing the stainless steel top cover in deionized water; forming a nickel plating layer on the surface of the stainless steel top cover by electroplating; The method for processing a stainless steel hot plate according to claim 8, further comprising the step of immersing the stainless steel top cover in deionized water again.

10. A heat equalizing plate, A stainless steel top cover including a stainless steel body and a nickel plating layer disposed on one side of the stainless steel body; a heat dissipation copper plating layer disposed on the nickel plating layer and having a number of micro-holes formed on its surface.

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