Grounding Techniques for ESD Polymer Fluid Lines

Abstract

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid supply conduit that carries fluid from the fluid source into the chemical mechanical polishing system. The polishing system includes a platen that supports a polishing pad, a carrier head that supports a substrate and places the substrate in contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier head. The fluid supply conduit includes a conductive wire that extends through the interior of the conduit for conducting electrostatic discharge to ground, and a conductive wire lead-out fixture that covers and seals where the conductive wire passes through the wall of the fluid supply conduit.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE This disclosure relates to chemical mechanical polishing (CMP), and more particularly to fluid delivery in CMP. [Background technology]

[0002] Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconducting, or insulating layers on a semiconductor wafer. Various manufacturing processes require planarization of layers on the substrate. For example, one manufacturing step involves depositing a fill layer over a non-planar surface and then planarizing the fill layer. In some applications, the fill layer is planarized until the top surface of the patterned layer is exposed or until a predetermined thickness of material remains above the underlying layer.

[0003] Chemical mechanical polishing (CMP) is one accepted planarization method. This planarization method typically requires that the substrate be mounted on a carrier head. The exposed surface of the substrate is typically placed against a rotating polishing pad. The carrier head exerts a controllable load on the substrate to press the carrier head against the polishing pad. A polishing slurry having abrasive particles is typically supplied to the surface of the polishing pad. A cleaning fluid, such as deionized water, can be sprayed onto the polishing pad to remove debris generated by the polishing process. Summary of the Invention

[0004] A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid supply conduit that carries fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen that supports a polishing pad, a carrier head that supports a substrate and places the substrate in contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier pad. The fluid supply conduit includes a conductive wire that extends through the interior of the conduit for conducting electrostatic discharge to ground, and a conductive wire lead-out fixture that covers and seals where the conductive wire passes through the wall of the fluid supply conduit.

[0005] Embodiments may include one or more of the following features: The conductive wire may be made of a precious metal. The fluid supply conduit may be flexible tubing. The conductive lug may be threaded into a threaded portion of the passage. The plastic body may be threaded into a threaded opening of the fluid supply conduit.

[0006] In another aspect, a method of manufacturing a fluid conduit includes placing a conductive wire through piping, the piping configured to flow fluid into a chemical mechanical polishing assembly, and coupling the conductive wire to a ground source to form an electrostatic discharge protection assembly to conduct electrostatic charges.

[0007] Embodiments may include one or more of the following features: The electrostatic discharge protection assembly may be mounted on the chemical mechanical polishing assembly. The tubing may fluidly couple the tubing to a fluid source to flow fluid from the fluid source to the chemical mechanical polishing assembly. The conductive wire may be coupled to a common ground source.

[0008] In another aspect, an assembly for electrically connecting to a volume having a fluid includes a wall forming a boundary of the volume to contain the fluid, a conductive wire extending through the volume, and a drawer fitting providing a sealed electrical connection through the wall. The drawer fitting includes an annular plastic body having a passageway therethrough. The plastic body has a threaded exterior surface that threads into a threaded opening in the wall, the conductive wire is inserted into one end of the passageway and a conductive lug is inserted into an opposite end of the passageway and makes contact with the conductive wire. The conductive lug has a threaded exterior surface that threads into a threaded portion at the opposite end of the passageway.

[0009] Embodiments may include one or more of the following features: A sealant may be disposed between the threaded exterior surface of the plastic body and the threaded opening in the wall. A sealant may be disposed between the threaded exterior surface of the lug body and the threaded portion of the passageway. In either case, the sealant may be a polytetrafluoroethylene (PTFE) tape. The plastic body may be polytetrafluoroethylene (PTFE). The wall may be plastic. The fluid may be steam. The conductive wire may be made of a precious metal.

[0010] Possible advantages may include, but are not limited to, one or more of the following:

[0011] The risk of electrostatic discharge from the fluid supply lines and therefore the risk of damaging the fluid supply lines or other components in the chemical mechanical polishing system can be reduced. The components of the grounding mechanism can be easily and inexpensively manufactured. The fluid flowing in the piping is free from the risk of further contamination as the fluid interacts with the precious metal. Additionally, the systems and methods disclosed herein are high temperature safe and semiconductor clean room compatible.

[0012] The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other aspects, features, and advantages will become apparent from the description and drawings, and from the claims. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic cross-sectional view of an example of a polishing station of a polishing apparatus. [Diagram 2] FIG. 2 is a top view of an example polishing station of a chemical mechanical polishing apparatus. [Figure 3A] 1 is a schematic diagram of a fluid supply line with conductive lines in a chemical mechanical polishing system. [Figure 3B] FIG. 3B is a schematic cross-sectional view of the fluid supply line of FIG. 3A. [Figure 3C] FIG. 2 is a schematic cross-sectional view of a ground drawer fixture assembly. [Figure 4] FIG. 1 is a schematic cross-sectional view of a ground puller fixture assembly attached to a pipe. [Diagram 5] 1 is a schematic cross-sectional view of an electrical connection drawer fixture assembly attached to a conduit for a semiconductor processing system. [Figure 6] 1 is a schematic cross-sectional view of an electrical connection drawer fixture assembly mounted in a processing chamber of a semiconductor processing system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Like reference numbers in the various drawings indicate like elements.

[0015] A chemical mechanical polishing system includes a number of fluid supply lines for supplying a number of fluids, such as deionized water, steam, and nitrogen gas. For example, a typical system may include a fluid supply line that carries a slurry to the polishing pad, a fluid supply line that carries a cleaning liquid to the polishing pad to remove polishing debris, a fluid supply line that carries a heated or cooled fluid to the polishing pad to control the temperature of the polishing process, a fluid supply line that carries a pressurized gas for pneumatic control of the pressure in the carrier head, and the like. Static electricity that accumulates in these fluid supply lines can be caused, for example, by triboelectric charging or electrostatic induction. If the accumulated static electricity becomes excessive, electrostatic discharge can damage components and piping along the fluid supply lines. In particular, static electricity is particularly likely to occur in fluid lines that carry hot gases, such as steam. The combination of steam and temperature can result in triboelectric charging that is not seen in conventional systems that do not use steam.

[0016] A conventional approach for electrostatic discharge (ESD) tubing is to place a conductive layer, for example of carbon, on the inside of the tubing. However, particles of the material coating the inside of the tubing can be carried by the fluid into the polishing system, resulting in contamination of the substrate and defects on the substrate. Furthermore, the polishing environment can be humid and wet with polishing slurry, so the conductive layer on the outside of the tubing can oxidize and be subject to environmental wear.

[0017] Other commercially available options for grounding techniques, such as tubing with integrated carbon impregnated inside and outside the tubing, are unable to adequately dissipate ESD charges from the polymer fluid lines. Additionally, these methods are prone to leaks at the ends of the tubing. These issues are exacerbated at high temperatures, resulting in unpredictable problems in chemical mechanical polishing systems, making temperature regulation even more important for process control.

[0018] Conductive wires formed of conductive precious metals and running through the interior of the tubing can ameliorate these problems. Precious metals such as platinum and gold do not interact with steam even at high temperatures. Thus, placing precious metal wires inside the tubing will not become particulate and is unlikely to cause defects in integrated circuit products. The ground drawer fixture assembly can be designed to maintain a leak-free tubing path while also properly introducing a ground path for the internal precious metal wires. The precious metal wires can be bonded to a ground source and thus dissipate charges generated by friction between the fluid flow and the surrounding polymer tubing.

[0019] 1 and 2 show an example of a polishing system 20 of a chemical mechanical polishing system. The polishing system 20 includes a rotatable disk-like platen 24 on which a polishing pad 30 is disposed. The platen 24 is operable to rotate about an axis 23 (see arrow A in FIG. 2). For example, a motor 22 can turn a drive shaft 26 to rotate the platen 24. The polishing pad 30 can be a two-layer polishing pad having an outer polishing layer 34 and a soft backing layer 32.

[0020] The polishing system 20 may include a supply port 40, for example at the end of a slurry dispenser arm 43, for dispensing a polishing fluid 42, such as a polishing slurry, onto the polishing pad 30. The polishing fluid 42 may be supplied, for example by a pump, from a reservoir 44 (see FIG. 2) via a fluid supply line 46.

[0021] The polishing system 20 can include a pad conditioner 90 having a conditioner disk 92 (see FIG. 2) for maintaining the surface roughness of the polishing pad 30. The conditioner disk 92 can be disposed in a conditioner head 93 at the end of an arm 94. Pressing the conditioner disk 92 against the polishing pad 30 can be accomplished by air pressure, for example, by a pressurized gas, such as N, in a fluid supply line 96. 2 can be controlled by

[0022] Carrier head 50 is operable to hold substrate 10 against polishing pad 30. Carrier head 50 may also include a retaining ring 56 to maintain the lateral position of substrate 10 beneath the carrier head. Carrier head 50 is suspended from a support structure 60, e.g., a carousel or track, and is coupled by a drive shaft 62 to a carrier head rotation motor 64 such that the carrier head can rotate about a central axis 51. Optionally, carrier head 50 can be oscillated laterally by moving along the track or by rotational oscillation of the carousel itself, e.g., on a slider on the carousel.

[0023] Carrier head 50 can include a flexible membrane 54 having a substrate mounting surface that contacts the backside of substrate 10, and a number of pressurizable chambers 52a-52c that apply different pressures to different zones, e.g., different radial zones, on substrate 10. The pressure to chambers 52a-52c can be controlled by pressure regulators 58a-58c that pass a pressurized gas, e.g., N, through a rotary union and a drive shaft 62. 2can be coupled to each of the chambers 52a-52c via a pneumatic line 59 carrying a pressure of 100 psi to each of the chambers 52a-52c.

[0024] During operation, the platen is rotated about the platen central axis 23 and the carrier head is rotated about the carrier head central axis 51 (see arrow B in FIG. 2) and translated laterally across the upper surface of the polishing pad 30 (see arrow C in FIG. 2).

[0025] As the carrier head 50 and the conditioner head 93 move across the polishing pad 30, the exposed surfaces tend to become covered with slurry. For example, the slurry may stick to the outer or inner diameter surfaces of the retaining ring 56. In general, if any surface is not kept wet, the slurry tends to coagulate and / or dry out, resulting in corrosion of the parts and particulates and defects on the substrate. One solution is to wash the components, such as the carrier head 50 and the conditioner head 92, with a jet of, for example, water or steam. A carrier head cleaner, such as a steam handling assembly, for the carrier head can be part of a load cup in the polishing system. Similarly, a conditioner head cleaner, such as a steam handling assembly, for the conditioner head can be part of a conditioner head wash cup. In either case, piping is required to carry the wash fluid, such as liquid water or steam, to the cleaner.

[0026] In some embodiments, the polishing system 20 includes a temperature sensor 80 to monitor the temperature in the polishing station or components of the polishing station, such as the temperature of the polishing pad 30 and / or the polishing liquid 38 on the polishing pad. For example, the temperature sensor 80 can be an infrared (IR) sensor, such as an IR camera. Alternatively or additionally, the temperature sensor can be a contact sensor other than a non-contact sensor. For example, the temperature sensor 80 can be a thermocouple or an IR thermometer on / in the platen 24. Additionally, the temperature sensor 80 can be in direct contact with the polishing pad.

[0027] The polishing system 20 may also include a temperature control system 100 that controls the temperature of the polishing pad 30 and / or the polishing liquid 38 on the polishing pad. The temperature control system 100 may include a cooling system 102 and / or a heating system 104. At least one of the cooling system 102 and the heating system 104, and in some embodiments both, operate by supplying a temperature control medium, such as a liquid, vapor or spray, onto the polishing surface 36 of the polishing pad 30 (or onto polishing liquid already present on the polishing pad).

[0028] 1, an example temperature control system 100 includes one or more arms 110 that extend over the platen 24 and the polishing pad 30. A number of nozzles 120 are suspended from or formed within each arm 110, with each nozzle 120 configured to supply a temperature control fluid onto the polishing pad 30, for example, to spray the fluid onto the polishing pad 30.

[0029] To operate as a cooling system, the temperature control fluid is a coolant. The coolant can be a gas, e.g., air, or a liquid, e.g., water. The coolant can be at room temperature or a lower cooling temperature, e.g., 5-15°C. The coolant used in the cooling system 102 can include, for example, cold water, liquid nitrogen, or a gas formed from liquid nitrogen and / or dry ice. In some embodiments, droplets of a liquid, e.g., water, ethanol, or isopropyl alcohol, can be added to the gas stream. In some embodiments, the cooling system uses a spray of air and liquid, e.g., an aerosolized spray of a liquid, e.g., water. In particular, the cooling system can have a nozzle that produces an aerosolized spray of water cooled below room temperature.

[0030] 2, the cooling system 102 can include a source 130 of liquid coolant medium and / or a source 132 of gas coolant medium. The liquid from source 130 and the gas from source 132 can be conveyed by piping 132, 136 to and within the arm 110 before being directed through the nozzle 120 to form, for example, the spray 122. The coolant can be below room temperature, for example between -100 and 20°C, for example below 0°C, when dispensed.

[0031] Gas, e.g., compressed gas, from a gas source 132 can be connected to a vortex tube 133 that can separate the compressed gas into a cold stream and a hot stream and direct the cold stream to a nozzle 120 onto the polishing pad 30. In some embodiments, the nozzle 120 is the lower end of the vortex tube that directs the cold stream of compressed gas onto the polishing pad 30.

[0032] To operate as a heating system, the temperature control fluid is a heating fluid. The heating fluid can be a gas, e.g. steam or heated air, or a liquid, e.g. heated water, or a mixture of gas and liquid. The heating fluid is above room temperature, e.g. 40-120°C, e.g. 90-110°C. The fluid can be water, such as substantially pure deionized water or water containing additives or chemicals. In some embodiments, the heating system uses a spray of steam or a spray of a mixture of steam and liquid water. The steam can contain additives or chemicals.

[0033] 2, the heating system 104 can include a source 140 of heated liquid, e.g., hot water, and / or a source 142 of heated gas, e.g., steam. For example, the source 142 can be a boiler. The liquid from the source 140 and the gas from the source 142 can be conveyed by piping 144, 146 to and within the arm 110 before being directed through the nozzle 120 to form the spray 122.

[0034] Along the rotation direction of the platen 24, the arm 110b of the heating system 104 may be disposed between the arm 110a of the cooling system 102 and the carrier head 70. Along the rotation direction of the platen 24, the arm 1110b of the heating system 104 may be disposed between the arm 110a of the cooling system 102 and the slurry dispenser arm 43. For example, the arm 110a of the cooling system 102, the arm 110b of the heating system 104, the slurry dispenser arm 43, and the carrier head 70 may be disposed in that order along the rotation direction of the platen 24.

[0035] The temperature control system 100 may include a single arm that dispenses both the coolant and the heating fluid, rather than separate arms.

[0036] Alternatively or additionally, other techniques may be used by the temperature control system 100 to control the temperature of the polishing process. For example, a heating or cooling fluid, such as steam or cold water, may be injected into the polishing liquid 42 (e.g., a slurry) to raise or lower the temperature of the polishing liquid 42 before it is dispensed. As another example, a resistive heater may be supported within the platen 22 to heat the polishing pad 30 and / or within the carrier head 50 to heat the substrate 10.

[0037] Moderating the temperature of the slurry and polishing pad during polishing of the layer allows for increased interaction between charge carrying abrasives such as cerium oxide. Using temperature control, the material removal rate can be beneficially increased by both adjusting the physical parameters of the polishing pad and altering the chemical interaction characteristics between the charged ceria and the filler layer.

[0038] In some embodiments, the controller 90 receives signals from the temperature sensor 80 and executes a closed-loop control algorithm to control the temperature control system 100, e.g., the flow rate, mixture ratio, pressure, or temperature of the coolant or heating fluids involved, to keep the polishing process at a desired temperature.

[0039] In some embodiments, an in-situ monitoring system measures the polishing rate of the substrate, and the controller 90 executes a closed-loop control algorithm to control the flow rate or temperature of a temperature control system, e.g., a coolant or heating fluid related, to keep the polishing rate at a desired rate.

[0040] The polishing system 20 may also include a high pressure rinse system 106. The high pressure rinse system 106 includes a plurality of nozzles 150, e.g., 3-20 nozzles, that direct a cleaning fluid, e.g., water, at high intensity onto the polishing pad 30 to rinse the pad 30 and remove used slurry, polishing debris, etc. The cleaning fluid may flow from a source 156 of cleaning fluid, e.g., a reservoir of deionized water, to the nozzles 150 via piping 152.

[0041] An example of the rinsing system 106 includes an arm 110c that extends over the platen 24 and the polishing pad 30. Along the rotational direction of the platen 24, the arm 110c of the rinsing system 106 can be disposed between the arm 110a of the cooling system 102 and the arm 110b of the heating system 104.

[0042] In some embodiments, the polishing system 20 includes a wiper blade or body 170 to evenly distribute the polishing fluid 42 across the polishing pad 30. Along the direction of rotation of the platen 24, the wiper blade 170 can be positioned between the slurry dispenser 40 and the carrier head 70.

[0043] 2 shows separate arms for each subsystem, e.g., heating system 104, cooling system 102 and rinsing system 106, the various subsystems may be included in a single assembly supported by a common arm. Various fluid supply components, e.g., piping, passages, etc., may extend inside each body.

[0044] 3A and 3B show a fluid supply line 300 that may be suitable for use in a chemical mechanical polishing system, such as polishing system 20. Fluid supply line 300 may function as fluid supply line 44 for polishing fluid, pneumatic line 59 for the carrier head, fluid supply line 96 for the conditioner head, piping 134 or 136 for the cooling system, piping 144 or 146 for the heating system, piping 152 for the high pressure rinse system, piping to carry pneumatic fluid and / or cleaning fluid to the load cup and / or conditioner cleaner cup, e.g., liquid water or steam to the cleaner.

[0045] Fluid line 300 may be particularly well suited for carrying hot gases, e.g., steam, since the combination of steam and high temperatures can result in the build-up of static charges that may not occur in room temperature gases or liquids. For example, fluid supply line 300 may be used as piping 146 that supplies hot gas, e.g., steam, from a source 142, e.g., a boiler, or as piping that supplies steam for cleaning the carrier head and / or conditioner head in the load cup and / or conditioner cleaner cup.

[0046] The fluid supply line 300 includes polymer tubing 310, which may be a material that is electrically insulating and resistant to temperatures up to 100° C., as well as inert to the fluid passing through the supply line 300 and inert to the polishing process. For example, the polymer tubing may be perfluoroalkoxyalkane (PFA). The polymer tubing 310 has an interior channel 312 through which fluid flows. The polymer tubing 310 may have an inlet 314 and an outlet 316 through which fluid flows. The fluid supply line 300 may be formed of multiple pieces, for example, one piece having a threaded exterior surface that is screwed into another piece having a threaded interior surface. Additional sealing between the pieces may be provided with polytetrafluoroethylene (PTFE) (e.g., Teflon™) tape or sealing compound. Additionally, although FIG. 3A illustrates the fluid supply line 300 as straight, the fluid supply line may have one or more bends or curves.

[0047] A conductive wire 340 extends through the internal channel 312 of the polymer tubing 310. The conductive wire 340 may be connected to a common ground. For example, the conductive wire 340 may be connected to a ground wire 342 through a liquid-tight ground drawer fixture assembly 350. The conductive wire 340 may be a precious metal such as gold or platinum. Precious metals such as platinum and gold do not interact with steam even at high temperatures and therefore have a low risk of particulates and corresponding defects. Within the tubing 310, the conductive wire is "bare", i.e., not coated or covered by an insulating sheath, and therefore static charges can be carried away by the conductive wire 340. In contrast, the ground wire 342 may be most conductive wires, for example, a copper wire with an insulating sheath, for example, a plastic sheath, that is stripped upon connection to the ground drawer fixture assembly 350.

[0048] The conductive wire 340 need not extend through the fluid inlet and outlet of the piping, but can extend along at least more than half the distance between the inlet and outlet, e.g., at least 50%, e.g., at least 75%, e.g., at least 90%. Thus, the ground drawer fixture assembly 350 should be located near the inlet and outlet, e.g., within the last 10%, e.g., within the last 5%, of the distance between the inlet and outlet. This prevents static discharge build-up along more than half the fluid path.

[0049] 3A shows a fluid supply line 300 having two ground drawer fitting assemblies 350 and a conductive wire 340 extending between and connected to the two ground drawer fitting assemblies 350. However, this is not required. In some embodiments, the fluid supply line 300 can have a single ground drawer fitting assembly 350, and one end of the conductive wire 340 can be attached to the ground drawer fitting assembly 350, and the other end of the conductive wire hangs "loose" in the fluid supply line 300. In some embodiments, the fluid supply line 300 can have a single ground drawer fitting assembly 350, and the conductive wire 340 forms a loop in the fluid supply line 300 with both ends attached to the single ground drawer fitting assembly 350. The loop of the conductive wire 340 can extend through a loop in the fluid supply line itself.

[0050] In some embodiments, the ground pull fixture assembly 350 can include a valve with an adjustable inner diameter. The conductive wire can be fed through an opening through the valve, and the valve can then be tightened, for example by rotating from the outside of the tubing, so that the inner surface tightens and seals against the conductive wire. The valve can be formed of a plastic that is non-reactive to steam and can withstand high temperatures, such as PFA or polytetrafluoroethylene (PTFE).

[0051] In some embodiments, the ground drawer fixture assembly 350 is simply provided by finely drilled holes through the piping. In some embodiments, the holes are just large enough for one or more of the conductive wires to pass through, so that inserting the conductive wires effectively seals the hole. If necessary, a sealant can be applied where the conductive wires emerge from the hole and then allowed to cure to reduce the possibility of leakage. The ends of the conductive wires can be tapered to aid in inserting and guiding the conductive wires through the hole.

[0052] In some embodiments, the drawer fixture assembly 350 includes a conductive ground lug that allows for electrical connection to the conductive wires 340 .

[0053] 3C and 4 show a mechanism for connecting an external ground wire 342 to a conductive wire 340 in a fluid supply line 300. The ground puller fixture assembly 350 includes a fixture 352, which is an annular body having a passageway 354 therethrough. In some embodiments, the passageway 354 has a narrow portion 354a and a wider portion 354b. The inner surface of the wider portion 354b of the passageway 354 can be threaded.

[0054] The fitting 352 may be a plastic material that will not corrode or degrade when exposed to the fluid, e.g., steam, in the fluid supply line 310. For example, the fitting 352 may be polytetrafluoroethylene (PTFE) (e.g., Teflon™). A lower portion 358 of the exterior surface of the fitting 352 is threaded and threaded into a corresponding threaded receiving hole in the tubing 310 to form a seal between the tubing 310 and the fitting 352. Additional sealing between a piece of the fitting 352 and a piece of the tubing 310 may include providing a polytetrafluoroethylene (PTFE) (e.g., Teflon™) tape or sealing compound between the threads.

[0055] The conductive wire 340 extends through the lower portion 354a of the passage 354 to contact a conductive lug 360 that is inserted into the upper portion 354b of the passage 354. In some embodiments, the fitting 352 is a tapered body with the lower end being the narrower side of the taper. In this case, when the fitting 352 is threaded into the tubing 310, the passage 354 is pinched inward (at 355) such that the plastic of the fitting 352 makes a firm contact and seals around the conductive wire 340. This forms a primary seal that prevents fluid in the fluid supply line 300 from leaking through the passage 354.

[0056] The lug 360 may have a threaded outer surface 362 that screws into a corresponding threaded area 354c in the upper portion 354b of the passageway to form a seal between the lug 360 and the fitting 352. This may provide a secondary seal to prevent fluid leakage through the passageway 354. An additional seal between the piece of fitting 352 and the piece of tubing 310 may include providing polytetrafluoroethylene (PTFE) (e.g., Teflon™) tape or sealing compound between the threads.

[0057] Two lug nuts 356 can be threaded onto the lugs 360 and the external ground wire 342 can be wrapped around the shaft of the lugs 360 and captured and compressed between the two lug nuts 356 .

[0058] One technique for assembling the conductive wires 340 to the fluid supply line 300 is as follows: First, the conductive wires are inserted and run through the tubing 310. This can be done before the inlet, outlet, and outlet fitting assemblies are attached. For example, the conductive wires can be affixed to a guide tube having an outer diameter slightly smaller than the inner diameter of the interior channel 312. This guide tube can be used to guide the conductive wires through the tubing 310, for example, around bends or curves in the tubing 310.

[0059] The portion of the conductive wire 340 that extends past the end of the tubing may then be inserted into the passage 354 in the fitting 352. The narrow portion 354a may be just wide enough for one or more conductive wires to pass through, e.g., the conductive wires sit in the narrow portion 354a of the passage 354 in contact with the sidewall of the narrow portion 354a. The conductive wire 340 may be inserted from the passage 354 until it extends into the wider portion 354b of the passage 354. Optionally, if the conductive wire 340 extends past the top surface 357 of the fitting 352, the conductive wire 350 may be trimmed so that it does not extend substantially past the top surface 357 of the fitting, e.g., by no more than 1 mm.

[0060] A conductive lug 360 is then inserted into the wide portion 354b of the passageway 354. In particular, the conductive lug 360 can have a threaded shaft 362 that is screwed into the threaded wide portion 354b of the passageway such that the lug 360 firmly contacts and electrically connects with the conductive wire 340. The end of the conductive wire 340 can be compressed (at 344) between the bottom of the lug 360 and the bottom of the wide portion 354b of the passageway 354 to provide the electrical connection.

[0061] Finally, the fitting 350 can be either attached directly to the tubing 312 or to the inlet 314 or outlet 316. In particular, a lower portion 358 of the exterior surface of the fitting can be threaded and can screw into a corresponding threaded receiving hole in the tubing 312, inlet 314, or outlet 316.

[0062] The assembly process can include pre-rotating the fluid supply line 300 to prevent clamping beyond a 90° turn, cutting the conductive wires flush, locking the nut against the conductive wires, and taping the locking nut, for example with Teflon tape, to prevent the locking nut from moving.

[0063] In some embodiments, the dimensions of the PFA tubing can be 1 / 8 inch thick and up to 7 feet long.

[0064] This fluid supply line can provide a path to ground for accumulated charges, thus reducing the risk of component damage while still remaining compatible with the polishing process.

[0065] While the above description has focused on fluid supply lines for a chemical mechanical polishing system, as shown in Figures 5 and 6, the ground drawer fixture assembly 350 can be adapted for other uses as a general conductive circuit drawer fixture assembly when a sealed conductive connection is required between an interior volume 502 of a processing system, such as a semiconductor processing system 500, and an external environment 504, particularly where the interior volume 502 contains steam. A semiconductor processing system typically includes a chamber 510, a support 512, such as a pedestal, edge support ring or lift pins, for supporting a substrate 10 within the chamber 510, and a source 514 of gas, such as a boiler for generating steam or hot water, or facility gas lines. Examples of processing systems include steam processing systems, but also include rapid thermal processing systems, etching systems, and deposition systems where steam is required for component temperature control or as a processing gas.

[0066] 5, the connections can penetrate the wall of a line 520 that carries a fluid, e.g., steam, from a source 514, e.g., for injection into the processing chamber 510 or to another component of the processing system for providing temperature control to a component within the processing system 500, e.g., a wall, a support pedestal, etc. Alternatively, as shown in FIG. 6, the connections can penetrate the wall of the processing chamber 510 directly into the interior volume 502 of the chamber. In either case, the conductive line 340' can be for grounding, but can also be for other electrical purposes, e.g., for carrying direct or alternating current from a voltage source 530 to an antenna 540, a sensor 542, or other component within the interior volume 502, or for carrying a signal, e.g., direct or alternating current, from an antenna 540, a sensor 542, or other component within the interior volume 502 to an external monitoring system or controller 532.

[0067] Although several embodiments of the present invention have been described, it should be understood that various modifications may be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims.

Claims

1. 1. A chemical mechanical polishing assembly comprising: a chemical mechanical polishing system including a platen supporting a polishing pad, a carrier head supporting a substrate and placing the substrate in contact with the polishing pad, and a motor for providing relative motion between the platen and the carrier head; A fluid source; a fluid supply conduit for conveying fluid from the fluid source into the chemical mechanical polishing system; wherein the fluid supply conduit comprises: a conductive wire extending through the interior of the conduit for conducting electrostatic discharge to ground; a ground pullout fixture providing a sealed electrical connection through the wall of the fluid supply conduit between the conductive wires and the ground; 1. A chemical mechanical polishing assembly comprising:

2. The assembly of claim 1 , wherein the fluid source comprises a boiler that produces steam.

3. The assembly of claim 1 , wherein the fluid source comprises a reservoir for holding a polishing fluid, the system includes a dispenser for supplying the polishing fluid to the polishing pad, and the fluid supply conduit couples the reservoir to the dispenser.

4. 2. The assembly of claim 1, wherein the fluid source comprises a cleaning fluid source, the system includes a dispenser that supplies the cleaning fluid to the polishing pad, conditioner head or carrier head, and the fluid supply conduit couples the fluid source to the dispenser.

5. The assembly of claim 1 , wherein the fluid source comprises a temperature-controlled fluid source, the system includes a dispenser that supplies the temperature-controlled fluid to the polishing pad, and the fluid supply conduit couples the fluid source to the dispenser.

6. The assembly of claim 1 , wherein the fluid source comprises a pressure line, the carrier head includes one or more pressurizable chambers, and the fluid supply conduit couples the pressure line to the carrier head.

7. The assembly of claim 1 , wherein the fluid source comprises a pressure line, a conditioner head includes one or more pressurizable chambers, and the fluid supply conduit couples the pressure line to the conditioner head.

8. 2. The assembly of claim 1, wherein the fluid supply conduit includes an inlet and an outlet for the fluid, and the conductive wire extends along at least 75% of the distance from the inlet to the outlet.

9. The assembly of claim 1 , wherein the ground lead out fitting covers and seals where the conductive wire passes through the wall of the fluid supply conduit.

10. 10. The assembly of claim 9, wherein the ground puller fixture comprises a plastic body having a passage therethrough, the conductive wire being inserted into one end of the passage and a conductive lug being inserted into an opposite end of the passage and making contact with the conductive wire.

11. 1. A method of manufacturing a fluid conduit, comprising the steps of: placing a conductive wire through tubing, the tubing configured to channel fluid into the chemical mechanical polishing assembly; and The conductive line is configured to couple to a ground source to conduct electrostatic charges to form an electrostatic discharge protection assembly. A method comprising:

12. 1. An assembly for electrically connecting to a volume having a fluid, comprising: a wall bounding said volume to contain said fluid; a conductive line extending through the volume; and a drawer fixture providing a sealed electrical connection through said wall; Equipped with an assembly wherein said drawer fitting includes an annular plastic body having a passage therethrough, said plastic body having a threaded exterior surface that threads into a threaded opening in said wall, said conductive wire being inserted into one end of said passage and a conductive lug being inserted into an opposite end of said passage and contacting said conductive wire, said conductive lug having a threaded exterior surface that threads into a threaded portion at the opposite end of said passage.

13. 13. The assembly of claim 12, wherein the plastic body is tapered such that the one end of the passageway is compressed to form a seal between the conductive wire and an inner surface of the passageway.

14. 13. The assembly of claim 12, wherein the passage includes a lower portion extending from the one end and an upper portion extending from the opposite end, the upper portion being narrower than the lower portion.

15. The assembly of claim 14 , wherein the conductive wire is compressed between a bottom of the lug and a bottom of the upper portion of the passageway.

16. The assembly of claim 12 , wherein the wall forms a conduit for flow of the fluid to a semiconductor processing system or the wall forms a processing chamber of a semiconductor processing system.

17. The assembly of claim 16 , wherein the semiconductor processing system comprises a deposition system, an etching system, or a thermal processing system.

18. The assembly of claim 16 , wherein the conductive line is coupled to an antenna or a sensor inside the processing chamber.

19. 13. The assembly of claim 12, comprising a monitoring system or controller and a second conductive wire connecting the monitoring system or controller to the conductive lug.

20. The assembly of claim 12 further comprising a second conductive line connecting the conductive lug to an electrical ground.

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