Nozzle Design for Microfabrication by Laser Water Jet

Abstract

A water jet nozzle assembly for a water jet guided laser processing system includes a housing, a nozzle disposed within the housing, and a nozzle nut configured to hold the nozzle within the housing. The nozzle is configured to receive and inject a laser and a water stream exiting from an outlet of the water jet nozzle assembly through a flow path defined within the nozzle and the nozzle nut. A gas flow path in fluid communication with the flow path is defined within the water jet nozzle assembly. A plate is disposed between the nozzle and the nozzle nut to separate the flow path into a first portion within the nozzle and a second portion within the nozzle nut, allowing gas to flow from the gas flow path through the plate to the nozzle and preventing gas flow from the second portion of the flow path to the first portion of the flow path.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the benefit of U.S. Provisional Application No. 63 / 344,848, filed May 23, 2022. The entire disclosure of the above application is incorporated herein by reference.

[0002] The present disclosure relates to a water - jet - guided laser processing system, and more particularly, to a laser - water - jet nozzle for a water - jet - guided laser processing system.

Background Art

[0003] The background art described herein is intended to generally present the content of the present disclosure. Information described in this background art section and aspects of the description that do not fall within the prior art at the time of filing are not admitted as prior art to the present disclosure, either expressly or implicitly.

[0004] A liquid (e.g., water - jet) - guided laser processing system includes a water - jet nozzle configured to direct a jet or stream of water toward the surface of a workpiece.

Summary of the Invention

[0005] A water - jet nozzle assembly for a water - jet - guided laser processing system includes a housing, a nozzle disposed within the housing, and a nozzle nut configured to hold the nozzle within the housing. The nozzle is configured to receive and inject a laser and a water stream that exits from an outlet of the water - jet nozzle assembly through a flow path defined within the nozzle and the nozzle nut. A gas flow path is defined within the water - jet nozzle assembly and is in fluid communication with the flow path. A plate is disposed between the nozzle and the nozzle nut, separating the flow path into a first portion within the nozzle and a second portion within the nozzle nut, and configured to allow gas to flow from the gas flow path through the plate into the nozzle and prevent gas flow from the second portion of the flow path within the nozzle nut into the first portion of the flow path within the nozzle.

[0006] In other features, the plate includes a central opening that is in line with the laser and the water stream, and at least one outer opening radially outside the central opening. At least one outer opening is located directly above the gas flow path. The upper surface of the plate defines a plenum between the upper and lower surfaces of the nozzle, and the plate is configured to allow gas to flow from the gas flow path through at least one opening into the plenum and from the plenum into the first portion of the flow path within the nozzle. The plate includes an annular rim extending upward from the outer periphery of the upper surface, and the plenum is defined between the annular rim, the upper surface of the plate, and the lower surface of the nozzle.

[0007] In other features, the plate includes at least one clock tab extending downward from the outer periphery of its lower surface, and at least one clock tab is configured to align at least one opening with the gas flow path. The lower end of the nozzle includes a recess configured to hold the plate. The upper end of the nozzle nut includes a recess configured to hold the plate. The plate is made of at least one of brass and copper. The water jet nozzle further includes a diaphragm disposed below the nozzle nut and above the outlet of the water jet nozzle assembly. The diaphragm includes a central hole that is in line with the laser and the water stream. The diaphragm includes at least one side opening located radially outside the central hole. At least one side opening is configured to allow water to flow out of the water jet nozzle assembly through the outlet.

[0008] Further applicable fields of the present disclosure will become apparent from the embodiments for carrying out the invention, the claims, and the drawings. The embodiments and specific examples for carrying out the invention are intended for illustrative purposes only and are not intended to limit the scope of the present disclosure.

Brief Description of the Drawings

[0009] The present disclosure will be more deeply understood from the embodiments for carrying out the invention and the accompanying drawings.

[0010]

Fig. 1A

[0011]

Fig. 1B

[0012]

Fig. 2A

[0013]

Fig. 2B

Fig. 2C

[0014] In the drawings, reference numbers may be repeated for identifying similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0015] The water jet nozzle is configured to inject a laser into a water stream to cut and / or remove material from the surface of a workpiece, such as a component of a substrate processing system. The water guides the laser, removes debris, and cools the surface of the workpiece. For example, the water stream is directed through a central opening or central hole at the lower end of the nozzle assembly, and the laser is injected into the water stream passing through the central opening.

[0016] During operation, debris from the workpiece (e.g., dust consisting of removed material such as silicon dust removed from a silicon component of a substrate processing system) enters the nozzle assembly and deposits on the nozzle and other surfaces within the nozzle assembly. The debris interferes with the nozzle operation and reduces the nozzle life.

[0017] The water jet nozzle assembly according to the present disclosure includes a plate disposed adjacent to the nozzle within the nozzle assembly. For example, the plate is disposed between the nozzle and the nozzle nut. The plate is configured to allow a protective gas (e.g., helium) to flow above the plate inside the nozzle to prevent debris from entering the nozzle. Accordingly, all debris entering the nozzle assembly is restricted to the lower part of the nozzle assembly below the nozzle and the plate.

[0018] FIG. 1A shows an exemplary water jet nozzle assembly 100 according to the present disclosure. The nozzle assembly 100 includes a nozzle 104 within a housing 108. For example, the nozzle 104 is made of brass. In some examples, the nozzle assembly 100 includes a nozzle nut 112 configured to hold the nozzle 104 within the housing 108.

[0019] The laser focusing assembly 116 focuses a laser (as shown at 118 in the figure) using a window (e.g., a quartz window) 120 disposed above the nozzle 104. The laser 122 is directed downward into a cavity or flow path 124 defined within the nozzle 104 and the housing 108 (e.g., within the nozzle nut 112) and exits the nozzle assembly 100 through an outlet 126. A liquid such as water is injected into the nozzle assembly 100 through a water inlet 128 and into a water channel 132 defined around the nozzle 104 within the housing 108. The water forms a flow 134 that is injected downward into the nozzle 104 through the flow path 124. The flow 134 guides and maintains the aligned lasers 122. The water flow within the nozzle assembly 100 is typically represented by solid arrows.

[0020] In some examples, a gas, such as helium, is injected into the nozzle assembly 100 through the gas inlet 140 and into the gas flow path 142 defined within the housing 108 and the nozzle nut 112, as well as into the flow path 124 below the nozzle 104. The gas flows downward through the flow path 124 to maintain a flow 134 of a desired flow pattern (e.g., a laminar flow pattern). The flow path 124 defined within the nozzle nut 112 is configured to maintain and stabilize the flow 134 and the flow pattern of the gas. The gas flow within the nozzle assembly 100 is typically represented by dashed arrows.

[0021] The gas typically flows downward, but there is a possibility of backflow upward from the outlet 126 and the nozzle 104. Water and / or debris (e.g., silicon dust) may re-enter the nozzle assembly 100 through the outlet 126. For example, the bounce-back from the workpiece may protrude upward. The upward gas flow within the flow path 124 will carry water and debris to the nozzle 104. The debris may deposit on and / or damage surfaces such as the nozzle 104, the optical head (e.g., an optical head made of sapphire or diamond) 144 disposed in the opening between the laser focusing assembly 116 and the nozzle 104, and the window 120.

[0022] Accordingly, in some examples, a plate or diaphragm (e.g., a brass diaphragm) 148 is disposed in the flow path 124 above the outlet 126 to prevent water and debris from re-entering the nozzle assembly 100. For example, the diaphragm nut 152 holds the position of the diaphragm 148 relative to the nozzle nut 112. As shown in the plan view of FIG. 1B, the diaphragm 148 includes a central hole 154. The laser 122 and the water flow 134 pass through the central hole 154. The diaphragm 148 includes one or more side openings 158. The side openings 158 allow excess water within the nozzle assembly 100 to drain from the flow path 124 through the diaphragm 148 and out the outlet 126. However, the side openings 158 also allow water and debris to re-enter the flow path 124 through the outlet 126.

[0023] Next, referring to FIGS. 2A, 2B, and 2C, another exemplary nozzle assembly 100 according to the present disclosure includes a plate 200 (e.g., a plate made of brass, copper, etc.) disposed adjacent and below the nozzle 104. The plate 200 may be provided instead of, or in addition to, the diaphragm 148. For example, the plate 200 is disposed in the flow path 124 between the nozzle 104 and the nozzle nut 112. The plate 200 divides and separates the flow path 124 into an upper portion defined within the nozzle 104 and a lower portion defined within the nozzle nut 112 and the diaphragm nut 152. The plate 200 is configured to allow gas to flow above the plate 200 inside the nozzle 104 to prevent debris from entering the nozzle 104 and contacting the surfaces of the nozzle 104, the window 120, the optical head 144, etc. Accordingly, all debris entering the nozzle assembly 100 through the outlet 126 and the diaphragm 148 is restricted to the lower portion of the nozzle assembly 100 below the plate 200.

[0024] For example, the plate 200 includes a central opening 204 that allows the laser 122 and the flow 134 to exit the nozzle 104 through the plate 200. The plate 200 further includes outer gas holes or openings 208. The openings 208 are positioned such that a protective gas (i.e., helium injected into the gas flow path 142) can flow upward from the gas flow path 142 through the plate 200 into the flow path 124 within the nozzle 104. For example, the openings 208 are aligned with the respective outlets of the gas flow path 142. The gas flows upward along the outer ends of the flow path 124 and then downward toward the central opening 204 and along the flow 134. In this way, the plate 200 prevents debris from entering the nozzle 104, and the gas flow pattern within the nozzle 104 prevents debris from entering the nozzle 104 through the central opening 204.

[0025] As shown in the figure, the opening 208 is located radially outside the flow path 124 in the nozzle nut 112. That is, the opening 208 is directly above the gas flow path 142 but not directly above the flow path 124 passing through the nozzle nut 112. Therefore, the opening 208 is located outside the gas flow pattern of the gas in the nozzle nut 112. Thus, the water and debris in the nozzle 112 carried by the gas are not close to the opening 208, preventing them from entering the opening 208.

[0026] More detailed top and bottom views of the plate 200 are shown in FIGS. 2B and 2C, respectively. The plate 200 is shown as a single piece, but in some examples it may be composed of separate components. As shown in FIG. 2B, the top surface 212 of the plate 200 includes a recess or plenum 216. For example, the plate 200 includes an annular rim 220 that extends upward from the outer periphery of the top surface 212 to define the plenum 216. The plenum 216 is further defined between the top surface 212 of the plate 200 and the bottom surface of the nozzle 104. In this way, the gas flowing upward through the opening 208 enters the plenum 216 and fills the plenum 216, and then flows from the plenum 216 into the interior of the nozzle 104. The opening 208 is generally shown as a circular hole, but in other examples it may be implemented as a slot or other types of openings.

[0027] As shown in FIG. 2A, the lower end of the nozzle 104 includes a recess or notch 228 configured to receive and hold the plate 200. In other examples, the plate 200 may instead be disposed within the nozzle nut 112 (e.g., a notch defined at the upper end of the nozzle nut 112) (such as partially in each of the nozzle 104 and the nozzle nut 112).

[0028] As shown in FIG. 2C, the lower surface 232 of the plate 200 includes one or more clock tabs 236 that extend downward from the outer periphery of the lower surface 232. The clock tabs 236 facilitate alignment of the plate 200 with the gas flow path 142 of the opening 208. For example, the clock tabs 236 are configured to align the openings with the respective outlets of the gas flow path 142.

[0029] As described above, debris entering the nozzle assembly 100 is limited to only the lower portion of the flow path 124 within the nozzle nut 112 and is prevented from entering the upper portion of the flow path 124 within the nozzle 104. Accordingly, the plate 200 protects the interior of the nozzle 104, the window 120, the optical head 144, etc. from deposits and damage caused by water and debris re-entering the nozzle assembly through the outlet 126 and the diaphragm 148.

[0030] The foregoing description is merely exemplary in nature and is not intended to limit the present disclosure, its application, or its use. The broad teachings of the present disclosure can be implemented in a variety of forms. Thus, while the present disclosure includes specific examples, other modifications will become apparent upon consideration of the drawings, the specification, and the following claims, and the true scope of the present disclosure should not be so limited. It should be understood that one or more steps in a method may be performed in a different order (or simultaneously) without changing the principles of the present disclosure. Further, while each embodiment is described as having specific features, any one or more of those features described with respect to an embodiment of the present disclosure may be implemented in other embodiments and / or combined with the features of other embodiments (even if not explicitly stated), i.e., the described embodiments are not mutually exclusive, and rearrangement of one or more embodiments is within the scope of the present disclosure.

[0031] Spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.) are described using various terms including "connected", "engaged", "coupled", "adjacent", "proximate", "on", "above", "below", and "disposed". When the relationship between a first element and a second element is described in the above disclosure, unless explicitly stated to be "direct", the relationship can be a direct relationship with no other intervening elements between the first element and the second element, but can also be an indirect relationship with one or more intervening elements (spatially or functionally) between the first element and the second element. The expression "at least one of A, B, and C" as used herein should be interpreted to mean a logic (A OR B OR C) using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C".

[0032] In some embodiments, the controller is part of a system that can be part of the above examples. Such a system can include a semiconductor processing apparatus comprising a processing tool, a chamber, a processing platform, and / or specific processing components (such as a wafer pedestal, a gas flow system, etc.). These systems can be integrated with electronics for controlling the operation of the semiconductor wafer or substrate before, during, and after processing. This electronics is called a "controller" and can control various components or sub-components of the system. The controller can, depending on the processing requirements and / or the type of system, control any process disclosed herein including the supply of processing gases, temperature setting (e.g., heating and / or cooling), pressure setting, vacuum setting, power setting, setting of radio frequency (RF) generators, setting of RF matching circuits, frequency setting, flow rate setting, fluid supply setting, position movement setting, wafer loading and unloading to and from tools and other transfer tools, and / or wafer loading and unloading to and from a load lock connected or coupled to a specific system, and can be programmed accordingly.

[0033] Generally, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. The integrated circuits may include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). The program instructions are instructions transmitted to the controller in the form of various individual settings (or program files) that define operating parameters for performing a particular process on or for a semiconductor wafer or for a system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to implement one or more processing steps during the manufacture of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0034] In some embodiments, the controller may be part of a computer integrated with or coupled to the system, otherwise network-connected to the system, or a combination thereof, or may be coupled to the computer. For example, the controller may be within a "cloud" that enables remote access to wafer processing, or may be all or part of a fab host computer system. The computer enables remote access to the system, monitors the progress of manufacturing operations, examines the history of past manufacturing operations, examines trends or implementation criteria from multiple manufacturing operations to change the parameters of the current process, set the process steps following the current process, or start a new process. In some examples, a remote computer (e.g., a server) can provide a process recipe to the system through a network that can include a local network or the Internet. The remote computer may then include a user interface that enables parameter and / or setting entries or programming transmitted from the remote computer to the system. In some examples, the controller receives instructions in a data format that specify the parameters of each process step performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool configured to be connected or controlled by the controller. Thus, as described above, the controller may be distributed, for example, by including one or more separate controllers network-connected to each other and cooperating towards a common purpose such as the processes and controls described herein. An example of a controller distributed for such a purpose would be one or more integrated circuits on a chamber that are installed remotely (e.g., at the platform level or as part of a remote computer) and communicate with one or more integrated circuits that cooperate to control the process in the chamber.

[0035] Rather than being restrictive, the exemplary system may include a plasma etching chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etching chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etching (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and other semiconductor processing systems that may be relevant or used in the fabrication and / or manufacture of semiconductor wafers.

[0036] As described above, depending on the processing steps performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools installed throughout the factory, a main computer, another controller, or a tool used for material transport to load and unload wafer containers with respect to tool positions and / or load ports in a semiconductor manufacturing facility.

Claims

1. A water jet nozzle assembly for a water jet guided laser processing system, comprising: a housing; a nozzle disposed within the housing; a nozzle nut configured to hold the nozzle within the housing, the nozzle being configured to receive and inject a laser and a water stream passing through a flow path defined within the nozzle and the nozzle nut and exiting from an outlet of the water jet nozzle assembly; a gas flow path defined within the water jet nozzle assembly and in fluid communication with the flow path; a plate disposed between the nozzle and the nozzle nut, the plate being configured to (i) separate the flow path into a first portion within the nozzle and a second portion within the nozzle nut, (ii) allow gas to flow from the gas flow path through the plate to the nozzle, and (iii) prevent gas flow from the second portion of the flow path within the nozzle nut to the first portion of the flow path within the nozzle; A water jet nozzle assembly comprising the above components.

2. The water jet nozzle assembly according to claim 1, wherein the plate includes (i) a central opening aligned with the laser and the water stream, and (ii) at least one outer opening radially outside the central opening.

3. The water jet nozzle assembly according to claim 2, wherein the at least one outer opening is located directly above the gas flow path.

4. The water jet nozzle assembly according to claim 3, wherein an upper surface of the plate defines a plenum between an upper surface and a lower surface of the nozzle, and the plate is configured to allow gas to flow from the gas flow path through the at least one opening to the plenum and from the plenum to the first portion of the flow path within the nozzle.

5. The water jet nozzle assembly according to claim 4, wherein the plate includes an annular rim extending upward from an outer periphery of the upper surface, and the plenum is defined between the annular rim, the upper surface of the plate, and the lower surface of the nozzle.

6. The water jet nozzle assembly according to claim 1, wherein the plate includes at least one clock tab extending downward from the outer periphery of the lower surface of the plate, and the at least one clock tab is configured to align the at least one opening with the gas flow path. The water jet nozzle assembly.

7. The water jet nozzle assembly according to claim 1, wherein the lower end of the nozzle includes a recess configured to hold the plate. The water jet nozzle assembly.

8. The water jet nozzle assembly according to claim 1, wherein the upper end of the nozzle nut includes a recess configured to hold the plate. The water jet nozzle assembly.

9. The water jet nozzle assembly according to claim 1, wherein the plate is made of at least one of brass and copper. The water jet nozzle assembly.

10. The water jet nozzle assembly according to claim 1, further comprising a diaphragm disposed below the nozzle nut and above the outlet of the water jet nozzle assembly, the diaphragm including a central hole aligned with the laser and the water stream. The water jet nozzle assembly.

11. The water jet nozzle assembly according to claim 10, wherein the diaphragm includes at least one side opening located radially outside the diameter of the central hole, and the at least one side opening is configured to allow water to flow out of the water jet nozzle assembly through the outlet. The water jet nozzle assembly.

Images