Photosensitive resin composition, photosensitive resin film produced using the same, and color filter

Abstract

The present disclosure relates to a photosensitive resin composition, a photosensitive resin film produced using the same, and a color filter. Specifically, one embodiment includes (A) a photopolymerizable compound; (B) a photoinitiator; (C) a colorant; (D) a binder resin; and (E) a solvent, wherein the solvent includes a first solvent to a third solvent, the first solvent has a flash point of less than 40°C, the second solvent has a flash point of 40°C or higher and less than 60°C, and the third solvent has a flash point of 60°C or higher, and provides a photosensitive resin composition.

Description

Technical Field

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film manufactured using the same, and a color filter.

Background Art

[0002] An image sensor corresponds to a semiconductor that can convert photons into electrons so as to be displayed on a display or stored in a storage device.

[0003] The image sensor is classified into a charge coupled device (CCD) image sensor and a complementary metal oxide semiconductor (CMOS) image sensor according to the manufacturing process and application method.

[0004] Specifically, the image sensor includes a color filter including filter segments of additive primary colors of red, green, and blue. External light passing through such a color filter is converted into color image data (R, G, B data) and driven by a display device through a process of being processed as a signal.

[0005] The color filter usually has coloring patterns of three primary colors of red (R), green (G), and blue (B) and is responsible for decomposing transmitted light into the three primary colors. Recently, in order to improve the color uniformity of the color filter, the uniformity of the pattern has been emphasized.

[0006] However, on the surface with a dimple pattern among the pattern shapes of the color filter, light scattering, color non-uniformity, etc. may become intense.

Summary of the Invention

Problems to be Solved by the Invention

[0007] One embodiment Photosensitive resin composition according to is for providing a photosensitive resin composition capable of suppressing diagonal line defects and foreign matters while uniformly forming the color and thickness of the photosensitive resin film.

[0008] Another embodiment is for providing a photosensitive resin film manufactured using the photosensitive resin composition.

[0009] Still another embodiment is for providing a color filter manufactured using the photosensitive resin film.

Means for Solving the Problems

[0010] One embodiment includes (A) a photopolymerizable compound; (B) a photoinitiator; (C) a colorant; (D) a binder resin; and (E) a solvent. The solvent includes a first solvent to a third solvent. The first solvent has a flash point of less than 40°C, the second solvent has a flash point of 40°C or more and less than 60°C, and the third solvent may have a flash point of 60°C or more.

[0011] The first solvent, the second solvent, and the third solvent can satisfy the following mathematical formula 1:

[0012] [Mathematical formula 1] M1 > (M2 + M3)

[0013] In the above mathematical formula 1, M1 is the weight of the first solvent, M2 is the weight of the second solvent, and M3 is the weight of the third solvent.

[0014] In 100 parts by weight of the total weight of the solvent, the first solvent is contained in an amount of 40 parts by weight or more and 80 parts by weight or less, the second solvent is contained in an amount of 1 part by weight or more and 50 parts by weight or less, and the third solvent may be contained in an amount of 0.1 part by weight or more and 40 parts by weight or less.

[0015] The first solvent may have a boiling point of 110°C or more and less than 140°C under 1 atm.

[0016] The first solvent may be an acetate-based first solvent or an alcohol-based first solvent.

[0017] The first solvent may be n-butyl acetate (n-BA).

[0018] The first solvent may be contained in the photosensitive resin composition in an amount of 1% by weight or more and 50% by weight or less based on 100% by weight of the photosensitive resin composition.

[0019] The second solvent may have a boiling point of 125°C or higher and less than 150°C under 1 atm.

[0020] The second solvent may be an acetate-based second solvent.

[0021] The second solvent may be propylene glycol monomethyl ether acetate (PGMEA), ethylene glycol monomethyl ether acetate (EGMEA), or a combination thereof.

[0022] The second solvent may be contained in the photosensitive resin composition in an amount of 1% by weight or more and 50% by weight or less based on 100% by weight of the photosensitive resin composition.

[0023] The third solvent may have a boiling point of 150°C or higher under 1 atm.

[0024] The third solvent may have a structure containing two or more ether groups.

[0025] The third solvent may be diethylene glycol methyl ethyl ether (MEDG).

[0026] The third solvent may be contained in an amount of 0.1% by weight or more and 25% by weight or less based on 100% by weight of the photosensitive resin composition.

[0027] The colorant contains a pigment, and the pigment can include a blue pigment, a purple pigment, or a mixture thereof.

[0028] The photosensitive resin composition can contain, based on the total amount of the photosensitive resin composition: 0.1% by weight to 20% by weight of the (A) photopolymerizable compound; 0.1% by weight to 5% by weight of the (B) photoinitiator; 5% by weight to 50% by weight of the (C) colorant; 0.1% by weight to 20% by weight of the (D) binder resin; and the balance of the (E) solvent.

[0029] Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

[0030] Another embodiment provides a color filter including the photosensitive resin film.

[0031] Another embodiment provides a CMOS image sensor including the color filter.

[0032] Specific matters of other aspects of the present invention are included in the following detailed description.

Advantages of the Invention

[0033] The photosensitive resin composition according to one embodiment can suppress moiré defects and foreign matters while uniformly forming the color and thickness of the photosensitive resin film by including three solvents having different flash points.

Embodiments for Carrying Out the Invention

[0034] Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example and does not limit the present invention, which is defined only by the scope of the claims described below.

[0035] Unless otherwise specified in this specification, "substituted" means that at least one hydrogen atom in a compound is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, an alkoxy group having 1 to 20 carbon atoms, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkenyl group having 3 to 20 carbon atoms, a cycloalkynyl group having 3 to 20 carbon atoms, a heterocycloalkyl group having 2 to 20 carbon atoms, a heterocycloalkenyl group having 2 to 20 carbon atoms, a heterocycloalkynyl group having 2 to 20 carbon atoms, or a substituent combination thereof.

[0036] Unless otherwise specified in this specification, "heterocycloalkyl group", "heterocycloalkenyl group", "heterocycloalkynyl group", and "heterocycloalkylene group" each mean that at least one heteroatom of N, O, S, or P is present in a cycloalkyl, cycloalkenyl, cycloalkynyl, and cycloalkylene ring compound.

[0037] Unless otherwise specified in this specification, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible.

[0038] In the chemical formulas in this specification, unless otherwise defined, when a chemical bond is not drawn at a position where a chemical bond must be drawn, it means that a hydrogen atom is bonded to that position.

[0039] (Photosensitive resin composition) One embodiment provides a photosensitive resin composition comprising (A) a photopolymerizable compound; (B) a photoinitiator; (C) a colorant; (D) a binder resin; and (E) a solvent, wherein the solvent includes a first solvent to a third solvent, the first solvent has a flash point of less than 40°C, the second solvent has a flash point of 40°C or higher and less than 60°C, and the third solvent has a flash point of 60°C or higher.

[0040] The "flash point" of a volatile substance means the lowest temperature at which a combustible substance is created in air and can be ignited. The flash point of a volatile substance (here, each of the solvents) can be measured by the ASTM D56 test method using a Tag closed cup apparatus (Anton Paar TAG4).

[0041] On the other hand, the "boiling point" of a liquid substance is the temperature at which the vapor pressure of the liquid substance becomes equal to the external pressure and begins to boil, and it changes depending on the external pressure. In the above embodiment, the boiling point under 1 atm is dealt with.

[0042] Also, "volatilization" means the phenomenon in which a liquid becomes a gas and scatters at normal temperature, and "volatility" refers to such a property.

[0043] Generally, a color filter for a CMOS IMAGE SENSOR (hereinafter referred to as CIS) is composed of three colors: red, green, and blue.

[0044] A photosensitive resin composition containing a colorant for a specific color is coated on a substrate or a patterned photosensitive resin film thereon, soft-baked, exposed, developed, and hard-baked to form a photosensitive resin film. Such a series of processes can be repeated for each color of the colorant to complete a color filter. The formation order of the photosensitive resin film is generally in the order of green → blue → red; or in the order of green → red → blue.

[0045] Although the coating is generally performed using a spin coating method, this method causes various problems. Specifically, the thickness uniformity may be low due to limitations in the coating method, or light scattering, color non-uniformity, diagonal line defects, etc. may occur due to the influence of the pattern of the underlying photosensitive resin film. In particular, since the color filter for CIS is realized as a thin film, if foreign matter is mixed in during the coating process, defects may be induced and the product yield may decrease.

[0046] On the other hand, the higher the volatility of the solvent in the photosensitive resin composition, the faster the drying rate during the coating process. However, if the volatility of the solvent is excessively high and volatilization occurs not only on the coating surface but also in the lower part, color non-uniformity, thickness non-uniformity, etc. may occur in the formed photosensitive resin film.

[0047] In contrast, the lower the volatility of the solvent in the photosensitive resin composition, the slower the drying rate during the coating process may be. If the colorant particles become non-uniform or foreign matter is mixed in during the long drying process, diagonal line defects, foreign matter, etc. may occur in the formed photosensitive resin film.

[0048] The one embodiment is for providing a photosensitive resin composition capable of suppressing diagonal line defects and foreign matter while forming the color and thickness of the photosensitive resin film uniformly.

[0049] Generally, the higher the flash point of a substance, the higher the boiling point and the lower the volatility tend to be. The photosensitive resin composition of the one embodiment can be controlled to harmonize the volatilization rate and volatilization position of the solvent by containing three kinds of solvents having different flash points from each other.

[0050] As a result, when forming a blue photosensitive resin film in a state patterned in the order of green alone or green and red, the volatilization of the solvent mainly occurs on the surface rather than at the lower part of the coating, so that the embedding characteristics of blue, the surface roughness, etc. are improved, and the color uniformity, thickness uniformity, etc. can be improved. Further, by making the volatilization of the solvent proceed at an appropriate rate, streak defects and foreign matters in the photosensitive resin film can be suppressed.

[0051] Hereinafter, the photosensitive resin composition of the above embodiment will be described in detail.

[0052] [(E) Solvent] [Relationship between the first solvent to the third solvent] By using a solvent containing at least one kind of each of the first solvent, the second solvent, and the third solvent in the photosensitive resin composition of the above embodiment, a photosensitive resin film with uniform color and thickness while suppressing streak defects and foreign matters can be formed.

[0053] Specifically, among the solvents, the first solvent with the lowest flash point and the highest volatility has the highest content as the main solvent, and the content of the second solvent and the third solvent as auxiliary solvents may be less than that of the first solvent.

[0054] In particular, the first solvent, the second solvent, and the third solvent can satisfy the following formula (1):

[0055] [Formula (1)] M1 > (M2 + M3)

[0056] In the above formula (1), M1 is the weight of the first solvent, M2 is the weight of the second solvent, and M3 is the weight of the third solvent.

[0057] On the one hand, the content of the third solvent with the highest flash point and the lowest volatility is the least, the content of the first solvent with the lowest flash point and the highest volatility is higher than the content of the third solvent, and the content of the second solvent with an intermediate level of flash point and volatility may be similar to or even less than the content of the first solvent.

[0058] More specifically, in 100 parts by weight of the total weight of the solvent, the first solvent is contained in an amount of 40 parts by weight or more to 80 parts by weight or less, 50 parts by weight or more to 80 parts by weight or less, or 55 parts by weight or more to 80 parts by weight or less; the second solvent is contained in an amount of 1 part by weight or more to 50 parts by weight or less, 5 parts by weight or more to 40 parts by weight or less, or 10 parts by weight or more to 30 parts by weight or less; the third solvent may be contained in an amount of 0.1 part by weight or more to 40 parts by weight or less, or 1 part by weight or more to 30 parts by weight or less.

[0059] In particular, the closer the content of the first solvent is to 55 parts by weight or more to 80 parts by weight or less; the closer the content of the second solvent is to 10 parts by weight or more to 30 parts by weight or less; the closer the third solvent is to 1 part by weight or more to 10 parts by weight or less, the more the synergistic effect of the first to third solvents can be improved.

[0060] The total amount of the first to third solvents may be contained in the photosensitive resin composition in an amount of 5% to 70% by weight, for example, 40% to 50% by weight. When the solvent is contained within the above range, the photosensitive resin composition has excellent coatability and a coating film with excellent flatness can be obtained.

[0061] [First Solvent] The first solvent may have a flash point of less than 40°C, 20°C or more to 35°C or less, or 25°C or more to 35°C or less. Further, the first solvent may have a boiling point of 114°C or more to less than 138°C, 118°C or more to 134°C or less, or 122°C or more to 130°C or less under 1 atm.

[0062] The first solvent having the flash point and boiling point may be an acetate-based first solvent or an alcohol-based first solvent. For example, the first solvent may be an acetate-based first solvent and may be n-butyl acetate (n-BA).

[0063] The first solvent may be contained in the photosensitive resin composition in an amount of 1% by weight or more to 50% by weight or less, 4% by weight or more to 40% by weight or less, or 25% by weight or more to 40% by weight or less based on 100% by weight of the photosensitive resin composition.

[0064] [Second Solvent] The second solvent may have a flash point of 40°C or more to less than 60°C, 40°C or more to 55°C or less, or 40°C or more to 50°C or less. Further, the second solvent may have a boiling point of 125°C or more to less than 150°C, 130°C or more to 149°C or less, or 140°C or more to 148°C or less under 1 atm. The second solvent having the flash point and boiling point may be an acetate-based second solvent. For example, the second solvent may be an acetate-based second solvent and may be propylene glycol monomethyl ether acetate (PGMEA), ethylene glycol monomethyl ether acetate (EGMEA), or a combination thereof.

[0065] The second solvent may be contained in the photosensitive resin composition in an amount of 1% by weight or more to 50% by weight or less, 4% by weight or more to 40% by weight or less, or 4% by weight or more to 15% by weight or less based on 100% by weight of the photosensitive resin composition.

[0066] [Third Solvent] The third solvent may have a flash point of 65°C or more, 65°C or more to 89°C or less, or 65°C or more to 85°C or less. Further, the third solvent may have a boiling point of 150°C or more, 160°C or more to 190°C or less, or 170°C or more to 180°C or less under 1 atm.

[0067] The third solvent having the flash point and boiling point may have a structure containing two or more ether groups. For example, the third solvent may be diethylene glycol methyl ethyl ether (MEDG).

[0068] The third solvent may be contained in an amount of 0.1% by weight or more to 25% by weight or less, 0.1% by weight or more to 20% by weight or less, or 0.4% by weight or more to 15% by weight or less in 100% by weight of the photosensitive resin composition.

[0069] [(A) Photopolymerizable compound] As the photopolymerizable compound, a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond can be used.

[0070] By having the ethylenically unsaturated double bond, the photopolymerizable compound can form a pattern excellent in heat resistance, light resistance, and chemical resistance by causing sufficient polymerization during exposure in the pattern forming process.

[0071] Specific examples of the photopolymerizable compound include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolak epoxy (meth)acrylate, and the like.

[0072] Examples of commercially available products of the photopolymerizable compound are as follows. Examples of the monofunctional ester of the (meth)acrylic acid include Aronix M-101 (registered trademark), M-111 (registered trademark), M-114 (registered trademark), etc. of Toagosei Co., Ltd.; KAYARAD TC-110S (registered trademark), TC-120S (registered trademark), etc. of Nippon Kayaku Co., Ltd.; V-158 (registered trademark), V-2311 (registered trademark), etc. of Osaka Organic Chemical Industry Co., Ltd. Examples of the difunctional ester of the (meth)acrylic acid include Aronix M-210 (registered trademark), M-240 (registered trademark), M-6200 (registered trademark), etc. of Toagosei Co., Ltd.; KAYARAD HDDA (registered trademark), HX-220 (registered trademark), R-604 (registered trademark), etc. of Nippon Kayaku Co., Ltd.; V-260 (registered trademark), V-312 (registered trademark), V-335 HP (registered trademark), etc. of Osaka Organic Chemical Industry Co., Ltd. Examples of the trifunctional ester of the (meth)acrylic acid include Aronix M-309 (registered trademark), M-400 (registered trademark), M-405 (registered trademark), M-450 (registered trademark), M-710 (registered trademark), M-8030 (registered trademark), M-8060 (registered trademark), etc. of Toagosei Co., Ltd.; KAYARAD TMPTA (registered trademark), DPCA-20 (registered trademark), -30 (registered trademark), -60 (registered trademark), -120 (registered trademark), etc. of Nippon Kayaku Co., Ltd.; V-295 (registered trademark), -300 (registered trademark), -360 (registered trademark), -GPT (registered trademark), -3PA (registered trademark), -400 (registered trademark), etc. of Osaka Organic Chemical Industry Co., Ltd. The above products can be used alone or in combination of two or more kinds.

[0073] The photopolymerizable compound can also be used after being treated with an acid anhydride in order to impart more excellent developability.

[0074] The photopolymerizable compound may be contained in an amount of 0.1% by weight to 20% by weight, specifically 1% by weight to 15% by weight, for example 2% by weight to 13% by weight, based on the total amount of the photosensitive resin composition. When the photopolymerizable compound is contained within the above range, sufficient curing occurs during exposure in the pattern forming process, resulting in excellent reliability and excellent developability in an alkaline developer.

[0075] [(B) Photoinitiator] The photoinitiator is an initiator generally used in the photosensitive resin composition, and for example, an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof can be used. Examples of the acetophenone-based compound include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.

[0076] Examples of the benzophenone-based compound include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0077] Examples of the thioxanthone-based compound include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like.

[0078] Examples of the benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

[0079] Examples of the triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3’,4’-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4’-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0080] Examples of the oxime-based compounds include O-acryloyloxime-based compounds, 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, and the like. Specific examples of the O-acryloyloxime-based compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate, and the like.

[0081] In addition to the above compounds, the photopolymerization initiator may also be a carbazole-based compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, a fluorene-based compound, or the like.

[0082] The photopolymerization initiator can also be used together with a photosensitizer that absorbs light and enters an excited state, and then causes a chemical reaction by transferring its energy.

[0083] Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

[0084] The photoinitiator may be contained in an amount of 0.1% by weight to 5% by weight, specifically 0.3% by weight to 4.5% by weight, for example 0.5% by weight to 4% by weight, based on the total amount of the photosensitive resin composition. When the photoinitiator is contained within the above range, sufficient curing occurs during exposure in the pattern forming process, and excellent reliability can be obtained. The pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion, and it is possible to prevent a decrease in transmittance due to unreacted initiator.

[0085] [(C) Colorant] The colorant may include a pigment, and at this time, the resin composition of this embodiment can be a pigment type composition. As the pigment, a green pigment, a blue pigment, a red pigment, a purple pigment, a yellow pigment, a black pigment, etc. can be used.

[0086] As the red pigment, C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, etc. within the Color Index can be used, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0087] As the purple pigment, C.I. Violet Pigment 23 (V.23), C.I. Violet Pigment 29, dioxazine violet, Fast Violet B, methyl violet lake, indanthrene brilliant violet, etc. within the Color Index can be used, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0088] As the green pigment, C.I. Green Pigment 7, C.I. Green Pigment 36, C.I. Green Pigment 58, C.I. Green Pigment 59, etc. within the Color Index can be used, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0089] The cyan pigment can use copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, C.I. Pigment Blue 15:6, C.I. Pigment Blue 16, etc. within the Color Index, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0090] The yellow pigment can use isoindoline pigments such as C.I. Pigment Yellow 185, C.I. Pigment Yellow 139, etc., quinophthalone pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, etc. within the Color Index, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0091] The black pigment can use aniline black, perylene black, titanium black, carbon black, etc. within the Color Index, and these can be used alone or in a mixture of two or more, but it is not necessarily limited thereto.

[0092] The pigments can be used alone or in a mixture of two or more. For example, as the pigments, a cyan pigment, a purple pigment, or a mixture thereof can be used.

[0093] The pigments may be contained in the photosensitive resin composition for color filters in the form of a dispersion. Such a pigment dispersion can be composed of the pigment, a solvent, a dispersant, a dispersion resin, etc. The solid pigment may be contained in an amount of 5% by weight to 20% by weight, for example, 8% by weight to 15% by weight, based on the total amount of the pigment dispersion.

[0094] As the solvent, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc. can be used, and among these, preferably propylene glycol methyl ether acetate can be used.

[0095] The dispersant helps the pigment to be uniformly dispersed in the dispersion liquid, and nonionic, anionic or cationic dispersants can be used respectively. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylic acid ester, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc. can be used, and these can be used alone or in combination of two or more.

[0096] As the dispersion resin, an acrylic resin containing a carboxy group can be used, which can not only improve the stability of the pigment dispersion liquid but also improve the pattern property of the pixel.

[0097] The colorant can contain the pigment and further contain a dye. At this time, the resin composition of the above-mentioned embodiment can be a hybrid type composition. Also, the dye is not particularly limited, but can contain a metal complex dye.

[0098] As the metal complex dye, a compound having a maximum absorbance in the wavelength range of 200 nm to 650 nm can be used, and any metal complex dye of all colors soluble in an organic solvent can be used as long as it is a compound having an absorbance in the above range to match the color coordinates in the combination of pigments.

[0099] Specifically, as the metal complex dye, a green dye having a maximum absorbance in the wavelength range of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength range of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength range of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength range of 500 nm to 650 nm, or a combination thereof can be used.

[0100] As the metal complex dye, a direct dye, an acid dye, a basic dye, an acid mordant dye, a sulfur dye, a vat dye, an azoic dye, a disperse dye, a reactive dye, an oxidation dye, an oil-soluble dye, an azo dye, an anthraquinone dye, an indigoid dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye, or a combination thereof can be used.

[0101] The metal complex dye can contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

[0102] The metal complex dye includes C.I. solvent dyes such as C.I. Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35; C.I. acid dyes such as C.I. Acid Green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109; C.I. direct dyes such as C.I. Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82; C.I. basic dyes such as C.I. Basic Green 1; C.I. mordant dyes such as C.I. Mordant Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41, 43, 53; C.I. pigment dyes such as C.I. Pigment Green 7, 36, 58 C.I. Pigment dye; A complex of at least one selected from the group consisting of Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132, and Solvent Red 218 with the metal ion can be used.

[0103] The dye containing the metal complex may be used in a solvent used in a photosensitive resin composition according to one embodiment, that is, the solubility in the solvents described below may be 5 or more, specifically, it may be 5 to 10. The solubility can be obtained by the amount (g) of the dye dissolved in 100 g of the solvent. When the solubility of the dye containing the metal complex is within the above range, the compatibility and coloring power with other components constituting the photosensitive resin composition according to one embodiment can be ensured, and precipitation of the dye can be prevented.

[0104] For example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof can be used as the solvent.

[0105] By having the specific range, it can be usefully used for color filters such as LCDs and LEDs that exhibit high brightness and high contrast ratio at desired color coordinates.

[0106] The dye containing the metal complex may be contained in an amount of 0.01% to 1% by weight, for example, 0.01% to 0.5% by weight based on the total amount of the photosensitive resin composition. When the dye containing the metal complex is used within the above range, high luminance and contrast ratio can be exhibited at desired color coordinates.

[0107] When the dye and the pigment are used in combination, they can be mixed and used at a weight ratio of 0.1:99.9 to 99.9:0.1, specifically, a weight ratio of 1:9 to 9:1. When mixed within the above weight ratio range, the chemical resistance and the maximum absorption wavelength can be controlled within an appropriate range, and high luminance and contrast ratio can be exhibited at desired color coordinates.

[0108] The colorant may be contained in an amount of 5% to 50% by weight, specifically 6% to 40% by weight, for example, 7% to 30% by weight based on the total amount of the photosensitive resin composition on a solid content basis. When the colorant is contained within the above range, it is excellent in coloring effect and developability.

[0109] [(D) Binder resin] The binder resin may contain an acrylic resin.

[0110] The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0111] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxy groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

[0112] The first ethylenically unsaturated monomer may be contained in an amount of 5% to 50% by weight, for example, 10% to 40% by weight based on the total amount of the acrylic binder resin.

[0113] The second ethylenically unsaturated monomer includes aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether; unsaturated carboxylic acid ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate; unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate; vinyl carboxylate compounds such as vinyl acetate, vinyl benzoate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc. These can be used alone or in combination of two or more.

[0114] Specific examples of the acrylic resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These can be used alone or in combination of two or more.

[0115] The binder resin can include an epoxy-based binder resin.

[0116] By further including an epoxy-based binder resin in the binder resin, the heat resistance can be improved. Examples of the epoxy-based binder resin include, but are not limited to, phenol novolac epoxy resin, tetramethylbiphenyl epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, or a combination thereof, etc.

[0117] Furthermore, the binder resin containing the epoxy-based binder resin ensures the dispersion stability of colorants such as pigments described later, and at the same time helps to form pixels with a desired resolution in the development process.

[0118] The epoxy-based binder resin may be contained in an amount of 1% by weight to 10% by weight, for example, 5% by weight to 10% by weight based on the total amount of the binder resin. When the epoxy-based binder resin is contained within the above range, the residual film ratio and chemical resistance can be greatly improved.

[0119] The epoxy equivalent weight of the epoxy-based binder resin may be 150 g / eq to 200 g / eq. When an epoxy-based binder resin having an epoxy equivalent weight within the above range is contained in the binder resin, it has an advantageous effect on improving the degree of curing of the formed pattern and fixing the colorant in the structure on which the pattern is formed.

[0120] The binder resin can be dissolved in a solvent described later in a solid form to constitute a photosensitive resin composition. In this case, the binder resin in solid form may be about 0.1% by weight to 30% by weight, for example, 20% by weight to 30% by weight based on the total amount of the binder resin solution dissolved in the solvent.

[0121] The binder resin may be contained in an amount of 0.1% by weight to 20% by weight, specifically 0.5% by weight to 15% by weight, for example, 1% by weight to 10% by weight based on the total amount of the photosensitive resin composition on a solid content basis. When the binder resin is contained within the above range, it has excellent developability during color filter manufacturing and improved crosslinkability, and an excellent surface smoothness can be obtained.

[0122] [(F) Other Additives] The photosensitive resin composition may further contain at least one additive selected from malonic acid; 3-amino-1,2-propanediol; a coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a surfactant; and a radical polymerization initiator in order to prevent bleeding and spotting during coating, improve leveling performance, and prevent the generation of residues due to undevelopment.

[0123] The additive can be easily adjusted according to the desired physical properties.

[0124] The coupling agent may be a silane-based coupling agent. Examples of the silane-based coupling agent include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-epoxycyclohexyl 、 ethyltrimethoxysilane, etc. These can be used alone or in combination of two or more.

[0125] Specifically, the silane-based coupling agent can be used in an amount of 0.01 parts by weight to 1 part by weight based on 100 parts by weight of the photosensitive resin composition.

[0126] In addition, the photosensitive resin composition for color filters may further contain a surfactant, for example, a fluorine-based surfactant, if necessary.

[0127] Examples of the fluorine-based surfactant include, but are not limited to, F-482, F-484, F-478 manufactured by DIC Corporation.

[0128] The surfactant is preferably contained in an amount of 0.01% by weight to 5% by weight, more preferably 0.01% by weight to 2% by weight, based on the total amount of the photosensitive resin composition. If the range is deviated from, problems such as the generation of foreign matters after development may occur, which is not preferable.

[0129] Also, within a range that does not inhibit the physical properties, other additives such as antioxidants and stabilizers may be added in a certain amount to the photosensitive resin composition.

[0130] (Photosensitive Resin Film, Color Filter, and CMOS Image Sensor) According to another embodiment, a photosensitive resin film manufactured using the photosensitive resin composition according to an embodiment is provided.

[0131] According to still another embodiment, a color filter manufactured using the aforementioned photosensitive resin composition is provided.

[0132] The manufacturing method of the color filter is as follows.

[0133] On a glass substrate, using an appropriate method such as spin coating, roller coating, or spray coating, for example, the aforementioned photosensitive resin composition is coated with a thickness of 0.1 μm to 10 μm to form a photosensitive resin composition layer.

[0134] Next, the substrate on which the photosensitive resin composition layer is formed is irradiated with light so as to form a pattern necessary for the color filter. As the light source used for irradiation, UV, electron beam, or X-ray can be used. For example, UV in the range of 190 nm to 450 nm, specifically in the range of 200 nm to 400 nm can be irradiated. In the aforementioned irradiation step, it can also be carried out using a photoresist mask. After performing the irradiation step in this way, the photosensitive resin composition layer irradiated with the light source is treated with a developer. At this time, the unexposed portion in the photosensitive resin composition layer is dissolved to form a pattern necessary for the color filter. By repeating such steps according to the number of required colors, a color filter having a desired pattern can be obtained. Also, if the image pattern obtained by development in the aforementioned step is heated again or cured by irradiation with actinic rays, etc., the crack resistance, solvent resistance, etc. can be improved.

[0135] According to another embodiment, a CMOS image sensor including the color filter is provided.

[0136] Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are merely preferred examples of the present invention, and the present invention is not limited to the following examples.

Examples

[0137] (Production of photosensitive resin composition) (Examples 1 to 14 and Comparative Examples 1 to 4 ) Photosensitive resin compositions of Examples 1 to 14 and Comparative Examples 1 to 4 were produced with the compositions shown in Tables 1 to 6.

[0138]

[0139] Specifically, after dissolving a photoinitiator in a solvent and stirring at room temperature for 30 minutes, a binder resin and a photopolymerizable compound were added thereto and stirred at room temperature for 60 minutes. Next, a dye and a pigment dispersion were added as colorants and stirred at room temperature for 30 minutes. After adding additives thereto, stirring was performed at room temperature for 1 hour, and filtration was performed three times to remove impurities, thereby producing a photosensitive resin composition.

Table 1

[0140]

Table 2

[0141]

Table 3

[0142] Each component used in Tables 1 to 3 above is as follows.

[0143] (A) Photopolymerizable compound (A-1) Dipentaerythritol hexaacrylate (DPHA, Manufacturer: Nippon Kayaku Co., Ltd.)

[0144] (B) Photoinitiator (B-1) Oxime-based initiator (SPI-03, Manufacturer: Sanso Co., Ltd.)

[0145] (C) Colorant (C-1) Phthalocyanine-based blue pigment dispersion (B15:6, Manufacturer: SAKATA) (C-2) Violet pigment dispersion (V23, Manufacturer: SAKATA)

[0146] (D) Binder resin (D-1) Acrylic binder resin with an acid value of 30 - 180 KOHmg / g and a weight average molecular weight of 5000 - 20000 g / mol (RY-100, Manufacturer: Showa Denko)

[0147] (E) Solvent (E-1) n-Butyl acetate (n-BA, boiling point: 126 ℃ @ 1 atm, flash point: 28.2 °C (by Tag closed cup test method), Manufacturer: Sigma-Aldrich) (E-2) Propylene glycol monomethyl ether acetate (PGMEA, boiling point: 146.4 °C @ 1 atm, flash point: 47.7 °C (by Tag closed cup test method), Manufacturer: Sigma-Aldrich) (E-3) Diethylene glycol methyl ethyl ether (MEDG, boiling point: 176 °C @ 1 atm, flash point: 68.5 °C (by Tag closed cup test method), Manufacturer: Sigma-Aldrich) (E-4) Cyclohexanone (boiling point: 155.6 °C @ 1 atm, flash point: 44 °C (by Tag closed cup test method), Manufacturer: Sigma-Aldrich )

[0148] (F) Additive (F-1) Fluorine-based surfactant (F-554, Manufacturer: DIC (using 10% dilution))

[0149] For reference, the flash point of each of the solvents can be measured using a Tag closed apparatus (Anton Paar TAG4) by the ASTM D56 test method.

[0150] (Evaluation) (Evaluation Example 1: Color Uniformity Evaluation) From each of the photosensitive resin compositions of Examples 1 to 14 and Comparative Examples 1 to 4 After manufacturing a color filter test piece including a patterned photosensitive resin film, the color uniformity of the photosensitive resin film was evaluated.

[0151] Specifically, using a spin-coater (K-Spin8 manufactured by KDNS), the photosensitive resin composition was applied to a transparent square glass substrate (bare glass) to a thickness of 0.4 μm each. Thereafter, baking was performed at 90° C. for 180 seconds using a hot plate, exposure was performed at an output of 500 mJ using an exposure apparatus (I10C manufactured by Nikon), and then baking was performed on a hot plate at 230° C. for 5 minutes to manufacture a color filter test piece (thickness: 4000 Å, horizontal * vertical = 2 cm * 2 cm) including a photosensitive resin film.

[0152] After measuring and saving the image of the color filter test piece (in transmission mode) using an optical microscope (equipment name: MX61, manufacturing company: OLYMPUS), a graph was obtained using the Microscope Color uniformity program, and the sum (integral value, unit: ea) of the number of pixels in the section where L is from -20% to 5% in the Color uniformity graph of the photosensitive resin film was determined to grasp the level of color uniformity. The results are shown in Tables 4 to 6 below.

[0153] For reference, the smaller the sum (integral value, unit: ea) of the number of pixels in the section where L is from -20% to 5% in the Color uniformity graph of the photosensitive resin film, the more uniform the color of the photosensitive resin film.

[0154] (Evaluation Example 2: Thickness Uniformity Evaluation) Examples 1 to 14 and Comparative Examples 1 to 4After manufacturing a color filter test piece including a photosensitive resin film from each of the photosensitive resin compositions, the thickness uniformity of the photosensitive resin film was evaluated.

[0155] Specifically, after manufacturing a color filter test piece in the same manner as in Evaluation Example 1, using ST-5000 (K-MAC), the difference (T Max -T Min ) between the maximum thickness and the minimum thickness of the photosensitive resin film was measured to grasp the level of thickness uniformity. The results are shown in Tables 4 to 6 below.

[0156] For reference, the smaller the difference (T Max -T Min ) between the maximum thickness and the minimum thickness of the photosensitive resin film, the more uniform the thickness of the photosensitive resin film.

[0157] (Evaluation Example 3: Oblique Line Defect Evaluation) After manufacturing a color filter test piece including a photosensitive resin film from each of the photosensitive resin compositions of Examples 1 to 14 and Comparative Examples 1 to 4 , the oblique line defect of the photosensitive resin film was evaluated. Specifically, after manufacturing a color filter test piece in the same manner as in Evaluation Example 1, a photograph of the photosensitive resin film was taken from above through an optical microscope, and the presence or absence of an oblique line defect was evaluated as O (good), △ (partial defect), or X (defect). The results are shown in Tables 4 to 6 below.

[0158] (Evaluation Example 4: Foreign Object Area Evaluation) After manufacturing a color filter test piece including a photosensitive resin film from each of the photosensitive resin compositions of Examples 1 to 14 and Comparative Examples 1 to 4 , the area of foreign objects in the patterned photosensitive resin film was evaluated.

[0159] Specifically, after manufacturing a color filter test piece in the same manner as in Evaluation Example 1, a photograph of the photosensitive resin film was taken from above through CDSEM (HITACHI), and the area of foreign objects per total area (100 sq%) of the photosensitive resin film was confirmed. The results are shown in Tables 4 to 6 below.

[0160]

Table 4

[0161] [Table 5]

[0162] [Table 6]

[0163] According to Tables 4 to 6, it can be seen that the color filter specimens produced using the photosensitive resin compositions of Examples 1 to 14 had uniform color and thickness of the photosensitive resin film while the slant line defects and foreign matters were suppressed. Specifically, when only two of the first solvent having a flash point of less than 40°C, the second solvent having a flash point of 40°C or higher and less than 60°C, and the third solvent having a flash point of 60°C or higher were mixed (Comparative Examples 1 to 3), the color and thickness of the photosensitive resin film were not uniform or slant line defects and foreign matters occurred.

[0164] Even when mixing is carried out differently from one embodiment, such as mixing two of the second solvents and one of the third solvents (Comparative Example 4 ), the color and thickness of the photosensitive resin film are not uniform or slant line defects and foreign matters occur.

[0165] However, when at least one kind of each of the first solvent, the second solvent, and the third solvent is used as in one embodiment (Examples 1 to 14), the color and thickness of the photosensitive resin film are uniform while the slant line defects and foreign matters are suppressed.

[0166] In particular, among Examples 1 to 14, the contents of the first to third solvents satisfy the following Mathematical Formula 1; the closer the content of the first solvent is to 55 parts by weight or more and 80 parts by weight or less; the closer the content of the second solvent is to 10 parts by weight or more and 30 parts by weight or less; the closer the third solvent is to 1 part by weight or more and 30 parts by weight or less, the synergistic effect by the first to third solvents can be improved.

[0167] [Mathematical Formula 1] M1 > (M2 + M3)

[0168] In the above formula (1), M1 is the weight of the first solvent, M2 is the weight of the second solvent, and M3 is the weight of the third solvent.

[0169] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited thereto, and various modifications can be made and implemented within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and it is natural that these also belong to the scope of the present invention.

Claims

1. (A) A photopolymerizable compound; (B) A photoinitiator; (C) A colorant; (D) A binder resin; and (E) A solvent which contains, wherein the solvent contains a first solvent to a third solvent, the first solvent has a flash point of less than 40°C, the second solvent has a flash point of 40°C or higher and less than 60°C, the third solvent has a flash point of 60°C or higher, A photosensitive resin composition.

2. The photosensitive resin composition according to claim 1, wherein the first solvent, the second solvent, and the third solvent satisfy the following Mathematical Formula 1: [Mathematical Formula 1] M1 > (M2 + M3) In the above Mathematical Formula 1, M1 is the weight of the first solvent, M2 is the weight of the second solvent, M3 is the weight of the third solvent.

3. The photosensitive resin composition according to claim 1, wherein in 100 parts by weight of the total weight of the solvent, the first solvent is contained in an amount of 40 parts by weight or more and 80 parts by weight or less, the second solvent is contained in an amount of 1 part by weight or more and 50 parts by weight or less, and the third solvent is contained in an amount of 0.1 part by weight or more and 40 parts by weight or less.

4. The photosensitive resin composition according to claim 1, wherein the first solvent has a boiling point of 110°C or higher and less than 140°C under 1 atm.

5. The photosensitive resin composition according to claim 1, wherein the first solvent is an acetate first solvent or an alcohol-based first solvent.

6. The photosensitive resin composition according to claim 1, wherein the first solvent is n-butyl acetate (n-butyl acetate, n-BA).

7. The photosensitive resin composition according to claim 1, wherein the first solvent is contained in an amount of 1% by weight or more and 50% by weight or less in 100% by weight of the photosensitive resin composition.

8. The photosensitive resin composition according to claim 1, wherein the second solvent has a boiling point of 125°C or higher and less than 150°C under 1 atm.

9. The photosensitive resin composition according to claim 1, wherein the second solvent is an acetate-based second solvent.

10. The photosensitive resin composition according to claim 1, wherein the second solvent is propylene glycol monomethyl ether acetate (propylene glycol monomethyl ether acetate, PGMEA), ethylene glycol monomethyl ether acetate (ethylene glycol monomethyl ether acetate, EGMEA), or a combination thereof.

11. The photosensitive resin composition according to claim 1, wherein the second solvent is contained in an amount of 1% by weight or more and 50% by weight or less based on 100% by weight of the photosensitive resin composition.

12. The photosensitive resin composition according to claim 1, wherein the third solvent has a boiling point of 150°C or higher under 1 atm.

13. The photosensitive resin composition according to claim 1, wherein the third solvent has a structure containing two or more ether groups.

14. The photosensitive resin composition according to claim 1, wherein the third solvent is diethylene glycol methyl ethyl ether (MEDG).

15. The photosensitive resin composition according to claim 1, wherein the third solvent is contained in an amount of 0.1% by weight or more and 25% by weight or less based on 100% by weight of the photosensitive resin composition.

16. The photosensitive resin composition according to claim 1, wherein the colorant contains a pigment, and the pigment contains a blue pigment, a purple pigment, or a mixture thereof.

17. The photosensitive resin composition is, based on the total amount of the photosensitive resin composition, 0.1% by weight to 20% by weight of the (A) photopolymerizable compound; 0.1% by weight to 5% by weight of the (B) photoinitiator; 5% by weight to 50% by weight of the (C) colorant; 0.1% by weight to 20% by weight of the (D) binder resin; and the balance of the (E) solvent The photosensitive resin composition according to claim 1.

18. A photosensitive resin film produced using the photosensitive resin composition according to any one of claims 1 to 17.

19. A color filter including the photosensitive resin film according to claim 18.

20. A CMOS image sensor including the color filter according to claim 19.

Images