Microfabrication apparatus and method using a laser

Abstract

Provided are a microfabrication apparatus and method using a laser capable of finely fabricating a processing hole. 【Solution means】 The microfabrication apparatus using the laser of the present invention includes a laser beam irradiation unit that irradiates a crystallized object to be processed through which a laser beam passes to form a processing hole, an optical unit that irradiates the shape of the laser beam to locally irradiate the laser beam inside the object to be processed and amorphize the crystallized object to be processed, a laser beam irradiation unit that irradiates the pulse width and pulse energy of the laser beam, and a chemical reaction furnace that chemically removes the processing hole formed in the amorphized region of the object to be processed precipitated in the reaction solution contained therein by a chemical reaction. The processing hole can process a narrow hole in which the ratio of the thickness of the object to be processed to the processing hole diameter is several to tens of thousands of times.

Description

Technical Field

[0001] The present invention relates to a microfabrication apparatus and method, and more particularly, to a microfabrication apparatus and method using a laser to finely fabricate the surface and / or interior of an object to be processed.

Background Art

[0002] Generally, as transparent ceramic materials such as glass, quartz, and sapphire have characteristics such as brittleness, chemical resistance, amorphousness, and non-conductivity, the processing methods for microfabrication are very limited. Especially in the case of fine shapes, only a few processing steps such as laser processing using an extreme ultraviolet laser are applicable.

[0003] However, even in such laser processing, problems such as the occurrence of cracks or an increase in shape error make it difficult to develop an effective processing method for ceramic materials.

[0004] Conventionally, a method has been used in which a laser is irradiated onto a ceramic material to form grooves or cracks, and then the processed portion is etched using a reaction solution for microfabrication.

[0005] For example, in Patent Document 1 below, as a step of using laser wet backside etching in glass shaping, a laser irradiated through a glass as a workpiece heats a metal ion electrolyte located on the backside of the workpiece to indirectly process the workpiece, and a processing method is disclosed.

[0006] In Patent Document 2 below, in indirect processing of glass using a laser, the irradiation path for laser irradiation is set in units of points or lines, and the units of points or lines are set to be randomly distributed to prevent the setting of a repetitive irradiation path of a specific pattern, reduce the interaction between the laser and bubbles, and improve the processing accuracy, and the configuration of a glass shaping apparatus is described.

[0007] Therefore, there is a need to develop a technology that can microfabricate a desired shape without damaging transparent ceramic materials such as glass, quartz, and sapphire using a laser and an etching method.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0009] An object of the present invention is to solve the above problems, and to provide a microfabrication apparatus and method using a laser that can microfabricate a processing hole into a desired shape without damaging the processing object by using a laser beam and a reaction solution that causes a chemical reaction with the processing object.

Means for Solving the Problems

[0010] To achieve the above object, a microfabrication apparatus using a laser according to the present invention includes a laser beam irradiation unit that irradiates a crystallized processing object through which a laser beam passes to form a processing hole, an optical unit that irradiates the shape of the laser beam so as to locally irradiate the laser beam inside the processing object to amorphize the crystallized processing object, a laser beam irradiation unit that irradiates the pulse width and pulse energy of the laser beam, and a chemical reaction furnace that chemically removes the processing hole formed in the amorphized region of the processing object precipitated in the reaction solution contained therein by a chemical reaction. The processing hole is characterized in that the ratio of the thickness of the processing object to the diameter of the processing hole is processed to be several times to tens of thousands of times.

[0011] In order to achieve the above object, a laser-based microfabrication method according to the present invention includes: (a) irradiating a crystallized workpiece through which a laser beam passes with the laser beam using a laser beam irradiation unit to form a processing hole; (b) irradiating the shape of the laser beam using an optical unit to locally irradiate the laser beam inside the workpiece so as to amorphize the crystallized workpiece; (c) irradiating the pulse width and pulse energy of the laser beam using a laser beam irradiation unit; (d) depositing the workpiece in a chemical reactor containing a reaction solution, and chemically removing the processing hole formed in the amorphized region by a chemical reaction with the reaction solution. The processing hole is processed such that the ratio of the thickness of the workpiece to the diameter of the processing hole is several times to tens of thousands of times.

Advantages of the Invention

[0012] According to the laser-based microfabrication apparatus and method of the present invention, a laser beam having high energy per unit volume and a very short pulse width is irradiated onto a workpiece made of a crystallized material through which the laser beam passes. The laser beam is absorbed inside the workpiece, and the inside of the crystallized workpiece can be amorphized.

[0013] Also, according to the present invention, by increasing the reaction rate at which a chemical reaction with a reaction solution such as a strongly acidic or strongly basic chemical substance occurs in the amorphized region, the processing hole formed in the workpiece is chemically removed by the chemical reaction, and a fine pattern using the fine processing hole can be processed.

[0014] Furthermore, according to the present invention, a very fine three-dimensional shape inside the crystallized workpiece and a very narrow hole having a ratio of the thickness of the workpiece to the diameter of the processing hole of several times to tens of thousands of times can be processed while minimizing cracks and damage to the workpiece.

Brief Description of the Drawings

[0015]

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BEST MODE FOR CARRYING OUT THE INVENTION

[0016] Hereinafter, a microfabrication apparatus and method using a laser according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0017] FIG. 1 is a configuration diagram of a microfabrication apparatus using a laser according to a preferred embodiment of the present invention.

[0018] Hereinafter, terms indicating directions such as "left side", "right side", "front", "rear", "upper side" and "lower side" are defined to indicate each direction based on the state shown in each drawing.

[0019] In the present embodiment, the configuration of a microfabrication apparatus and method using a laser for forming a pattern with a fine shape on the surface and / or inside of a workpiece having a certain area and thickness will be described.

[0020] In addition, in this embodiment, although it is described that an object to be processed made of a material of a transparent ceramic material such as glass, quartz, or sapphire is processed, it should be noted that the present invention is not limited to this, and it can be changed to process objects to be processed made of various materials such as silicon and metal.

[0021] Such an object to be processed is in an amorphous state. In this embodiment, a laser beam is irradiated onto the crystallized object to be processed to make the object to be processed amorphous, and after a fine pattern is processed on the surface or inside of the object to be processed, it will be described that the region processed by a chemical reaction using a reaction solution such as a strongly acidic or strongly basic chemical substance is removed at high speed.

[0022] That is, when a laser beam having a high energy per unit volume and a very short pulse width is irradiated onto a crystallized material through which the laser beam can pass, the surface and / or inside of the corresponding material absorbs the energy of the laser beam and becomes amorphous.

[0023] For a strong acid and a strong base used as the reaction solution, in a crystallized material, the processed region is removed very slowly by a very slow chemical reaction.

[0024] On the other hand, in an amorphous material, the processed region is removed very quickly by a chemical reaction with a strong acid or a strong base.

[0025] Such a difference in reaction rate varies depending on the types, concentrations, and processes of the material and the chemical used as the reaction solution, but a difference in rate can occur from several times to tens of thousands of times.

[0026] Thereby, the present invention can form a fine pattern in an amorphous state by irradiating a crystallized material with a laser beam, and can perform fine processing at high speed by a chemical reaction using a reaction solution.

[0027] In addition, the present invention can machine a very narrow hole with a ratio of the thickness of the object to be machined to the diameter of the machined hole being several times to tens of thousands of times while minimizing cracks and damage to the object to be machined.

[0028] For this purpose, as shown in FIG. 1, a fine processing apparatus 10 using a laser according to a preferred embodiment of the present invention irradiates a crystallized object 11 through which a laser beam passes with the laser beam to form a fine pattern using a machined hole. A laser beam irradiation unit 20, an optical unit 30 that irradiates the laser beam locally inside the object 11 to irradiate the shape of the laser beam so as to amorphize the crystallized object 11, a laser beam adjustment unit 40 that adjusts the pulse width and pulse energy of the laser beam, and a chemical reaction furnace 70 that chemically removes along the machined hole by a chemical reaction in the amorphized region of the object 11 precipitated in the reaction solution contained therein. It is configured to machine at a high speed several times to tens of thousands of times faster than the crystallized object 11 to have a ratio of the thickness of the object 11 to the diameter of the machined hole of several times to tens of thousands of times.

[0029] At the same time, the fine processing apparatus 10 using a laser according to a preferred embodiment of the present invention further includes a transfer unit 50 that moves the laser beam along the fine pattern to be formed and a control unit 60 that controls the driving of each device.

[0030] The transfer unit 50 functions to move the laser beam output by the optical unit 30 along the shape to be machined.

[0031] For this purpose, the transfer unit 50 can be configured to move only the optical unit 30 or to move the laser beam irradiation unit 20, the optical unit 30, and the laser beam adjustment unit 40 as a whole.

[0032] The control unit 60 generates a control signal for controlling the driving of the laser beam irradiation unit 20 and the optical unit 30 so as to change and irradiate the shape of the laser beam, the pulse width of the laser beam, and the pulse energy based on the processing conditions of the object 11 to be machined.

[0033] Then, the laser beam adjustment unit 40 can drive the laser beam irradiation unit 20 and the optical unit 30 according to the control signal from the control unit 60.

[0034] The object to be processed 11 is made of a material of a transparent ceramic material such as glass, quartz, or sapphire. Of course, the object to be processed 11 may also be made of silicon or a metal material.

[0035] For example, FIG. 2 is an exemplary diagram in which solid objects to be processed are classified according to the regularity of the arrangement.

[0036] In FIGS. 2(a) to 2(c), objects to be processed in single crystal, polycrystalline, and amorphous states are shown, respectively.

[0037] The object to be processed 11 provided as glass, quartz, sapphire, silicon, a metal material, etc. usually exists in a single crystal or polycrystalline state as shown in FIGS. 2(a) or 2(b).

[0038] When such a crystallized object to be processed 11 is irradiated with a laser beam having high energy per unit volume and a very short pulse width, the object to be processed 11 is amorphized as shown in FIGS. 2(c).

[0039] In addition, the region amorphized in the object to be processed 11 can be removed at a very high speed, for example, several to tens of thousands of times faster than the reaction speed in the crystallized state, by a chemical reaction with a reaction solution such as a strongly acidic or strongly basic chemical substance.

[0040] Therefore, the laser beam irradiation unit 20 can be provided as a laser beam generator that generates a laser beam according to the control signal from the control unit 60.

[0041] The optical unit 30 includes one or more lenses that focus the laser beam generated by the laser beam irradiation unit 21 and irradiate it toward the workpiece 11 to adjust the shape of the laser beam.

[0042] Therefore, the laser beam is irradiated onto the crystallized workpiece 11 through which the laser beam can pass, so as to locally amorphize the surface and / or the interior of the crystallized workpiece 11, having high energy per unit volume and a very short pulse width.

[0043] For example, the laser beam is irradiated with a pulse width of about 10-4 seconds to 10-15 seconds and an energy of about 10 μJ to 100 μJ / μm3, does not penetrate the workpiece 11, and can locally amorphize the interior of the crystallized workpiece 11.

[0044] Alternatively, the laser beam can also locally amorphize the interior of the crystallized workpiece 11 with a pulse width of about 10-4 seconds to 10-18 seconds.

[0045] That is, the laser beam can adjust the energy and pulse width per unit volume under various conditions such as the material, thickness, and size of the workpiece 11 so as to locally amorphize the crystallized workpiece 11.

[0046] On the other hand, the control unit 60 can control the driving of the chemical reaction furnace 70 so as to activate a reaction solution such as a chemical substance such as a strong acid or a strong base in the region amorphized in the workpiece 11 on which the fine pattern is formed by using the laser beam.

[0047] The chemical reaction furnace 70 is provided as a container for accommodating the reaction solution and includes one or more of an ultrasonic vibrator (not shown) and a heating unit (not shown) driven by a control signal of the control unit 60.

[0048] That is, the control unit 60 generates a control signal for controlling the driving of the ultrasonic vibrator so as to adjust the period, intensity, and direction of the ultrasonic vibration generated in the chemical reaction furnace 70 according to the output of the laser beam irradiated by the laser beam irradiation unit 20.

[0049] Here, the ultrasonic vibration is applied in a direction parallel to the direction of the processing hole formed in the object to be processed 11. Alternatively, the ultrasonic vibration can also be applied in a direction perpendicular to the direction of the processing hole formed in the object to be processed 11.

[0050] In addition, the control unit 60 generates a control signal for controlling the drive of the heating unit so as to heat the reaction solution and the object to be heated at a predetermined temperature in order to activate the reaction solution by heating.

[0051] The set temperature is set to correspond to the melting point of the chemical components contained in the reaction solution. The transfer unit 50 moves the irradiation position of the laser beam.

[0052] Of course, in the present invention, instead of removing the chemical reactor and precipitating the object to be processed in the reaction solution, the reaction solution can be sprayed onto the object to be processed to chemically remove the processing holes formed in the object to be processed for microfabrication.

[0053] Thus, in the present invention, a laser beam having high energy per unit volume and a very short pulse width is irradiated onto an object to be processed made of a crystallized material through which the laser beam passes, and the laser beam is absorbed inside the object to be processed, so that the inside of the crystallized object to be processed can be made amorphous.

[0054] Thereby, in the present invention, in the amorphous region, by increasing the reaction rate at which a chemical reaction with a reaction solution such as a strongly acidic or strongly basic chemical substance occurs, the processing holes formed in the object to be processed are chemically removed by a chemical reaction, and a fine pattern using the fine processing holes can be processed.

[0055] Thereby, the present invention can process a very fine three-dimensional shape inside the crystallized object to be processed and a very narrow hole in which the ratio of the thickness of the object to be processed to the diameter of the processing hole is several times to tens of thousands of times, while minimizing cracks and damage to the object to be processed.

[0056] Next, with reference to FIGS. 3 to 5, a laser microfabrication method according to a preferred embodiment of the present invention will be described in detail.

[0057] FIG. 3 is a process diagram for explaining step by step a laser microfabrication method according to a preferred embodiment of the present invention.

[0058] Further, FIG. 4 is a diagram showing an object to be processed microfabricated according to a preferred embodiment of the present invention, and FIG. 5 is a diagram showing an object to be processed microfabricated into a three-dimensional shape according to another embodiment of the present invention. In FIGS. 4(a) to (c), the plane, cross-section, and bottom surface of the microfabricated object to be processed are shown, and in FIGS. 5(a) to (c), the plane, cross-section, and bottom surface of the object to be processed microfabricated into a three-dimensional shape are shown.

[0059] In step S10 of FIG. 3, the laser beam irradiation unit 20 generates a laser beam with an output set by a control signal from the control unit 60 and irradiates the object to be processed 11. Then, the optical unit 30 irradiates the shape of the irradiated laser beam.

[0060] Here, the laser beam is a laser beam having high energy per unit volume and a very short pulse width.

[0061] Then, the irradiated laser beam is absorbed inside the object to be processed 11, amorphizes the inside of the object to be processed 11, and forms an amorphous region (S12).

[0062] At the same time, in step S14, the laser beam forms one or more processing holes in the amorphized region to form a fine pattern.

[0063] The processing holes have a very fine three-dimensional shape, but are formed as very narrow holes where the ratio of the thickness of the object to be processed 11 to the diameter of the processing holes is several times to tens of thousands of times.

[0064] For example, as shown in FIG. 4, the processing hole 12 is formed linearly on one surface of the object 11 to be processed irradiated with the laser beam, for example, on the upper surface, and extends toward the opposite surface, that is, the lower surface.

[0065] In addition, the processing hole 12 is not only linear but also formed to include one or more right-angle portions 13 or horizontal portions formed horizontally so as to be parallel to the surface of the object 11 to be processed, as shown in FIG. 5.

[0066] In addition, the processing hole 12 can be formed not only linearly perpendicular to the surface of the object 11 to be processed but also inclined by a predetermined angle.

[0067] In this way, the processing hole 12 is formed in various three-dimensional shapes according to the fine pattern to be formed.

[0068] In particular, the cross-section of the processing hole 12 can be formed in a substantially circular shape, but depending on the direction in which ultrasonic vibration is applied, it can be formed not only in a circular shape but also in a substantially elliptical shape in cross-section.

[0069] In the process of forming the fine pattern in this way, the control unit 60 controls the driving of the laser beam irradiation unit 20 and the optical unit 30 so as to change the shape of the laser beam, the pulse width of the laser beam, and the pulse energy based on the processing conditions of the object 11 to be processed and irradiate them.

[0070] When the operation of forming the fine pattern is completed, in step S16, the object 11 to be processed is deposited in the chemical reaction furnace 70 in which the reaction solution is accommodated inside.

[0071] In step S18, in the object 11 deposited in the chemical reaction furnace 70, the amorphous region is chemically removed from the processing hole 12 by a chemical reaction with the reaction solution and is finely processed at high speed.

[0072] Here, the ultrasonic vibrator provided in the chemical reaction furnace 70 can be driven by the control signal of the control unit 60 to apply ultrasonic vibration to the object 11 to be processed at a predetermined cycle.

[0073] Further, the control unit 60 can control the driving of the ultrasonic vibrator so as to adjust the period, intensity, and direction of the ultrasonic vibration generated in the chemical reactor 70 by the output of the laser beam irradiated by the laser beam irradiation unit 20.

[0074] Here, the ultrasonic vibration is applied in a direction parallel to the direction of the processing hole 12 formed in the object to be processed 11, or in a direction perpendicular to the direction of the processing hole 12.

[0075] In addition, the heating unit provided in the chemical reactor can be driven by a control signal of the control unit to heat the reaction solution and the object to be heated to a predetermined temperature in order to heat and activate the reaction solution.

[0076] For this purpose, the control unit 60 generates a control signal for controlling the driving of the heating unit so as to heat the reaction solution and the object to be heated at a predetermined temperature.

[0077] In addition, the set temperature is set to correspond to the melting point of the chemical components contained in the reaction solution.

[0078] Of course, the object to be processed 11 is finely processed by chemical reaction by injecting the reaction solution using an injection nozzle.

[0079] Through the above process, the present invention irradiates an object to be processed made of a crystallized material through which a laser beam passes with a laser beam having high energy per unit volume and a very short pulse width, and the laser beam is absorbed into the interior of the object to be processed, and the interior of the crystallized object to be processed is made amorphous.

[0080] Thereby, the present invention increases the reaction rate of a chemical reaction with a reaction solution such as a strongly acidic or strongly basic chemical substance in the amorphized region, chemically removes the processing hole formed in the object to be processed by the chemical reaction, and can process a fine pattern using the fine processing hole.

[0081] Accordingly, the present invention can machine a very fine three-dimensional shape inside the crystallized object to be machined and very narrow holes in which the ratio of the thickness of the object to be machined to the diameter of the machining holes is several times to tens of thousands of times, with cracks and damage to the object to be machined minimized.

[0082] [Example 1] The object to be machined 11 is quartz with a thickness of about 0.1 mm, and the laser beam irradiation unit 20 irradiates a picosecond ultraviolet laser beam capable of outputting about 100 W.

[0083] The pulse width of the laser beam is 1 ps. The laser beam adjustment unit 40 sets the overlapping ratio of the laser beams to about 50%. The laser beam machined the inside of the object to be machined 11 with a diameter of about 10 μm.

[0084] Also, using a strongly acidic reaction solution such as sulfuric acid (H2SO4) or hydrochloric acid (HCl), only the machined holes 12 formed in the laser beam machined part, that is, the amorphous region, were chemically removed.

[0085] As a result, it can be confirmed that the machining holes 12 are finely machined in the object to be machined 11 as shown in FIGS. 4(a) to 4(c).

[0086] [Example 2] The object to be machined 11 is sapphire having a thickness of about 1 mm, and the laser beam irradiation unit 20 irradiates a femtosecond ultraviolet laser beam capable of outputting about 30 W.

[0087] The pulse width of the laser beam is 10 fs. The laser beam adjustment unit 40 sets the overlapping ratio of the laser beams to about 80%. The laser beam machined the inside of the object to be machined 11 with a diameter of about 30 μm.

[0088] In addition, only the fine pattern formed by the amorphized region was chemically removed using a strongly basic reaction solution such as sodium hydroxide (NaOH) or barium hydroxide (Ba(OH)₂).

[0089] As a result, it can be confirmed that the processing holes 12, in which the ratio of the thickness to the diameter of the holes is realized as 30:1, are finely processed in the object to be processed 11.

[0090] [Example 3] The object to be processed 11 is a silicon wafer with a thickness of about 730 μm, and the laser beam irradiation unit 20 irradiates a femtosecond ultraviolet laser beam that can output an output of about 30 W.

[0091] The pulse width of the laser beam is 30 fs. The laser beam adjustment unit sets the ratio at which the laser beams overlap to about 10%, and the laser beam processes the inside of the object to be processed with a diameter of about 7 μm.

[0092] In addition, only the fine pattern formed in the amorphized region is chemically removed using a strong acid solution, and it can be confirmed that the processing holes 12, in which the ratio of the thickness to the diameter of the holes is realized as 100:1, are finely processed in the object to be processed 11.

[0093] On the other hand, in the above-described example, it was described that linear fine holes are processed in the object to be processed. However, the present invention is not limited to this, and not only linear fine holes but also fine patterns having various three-dimensional shapes can be processed.

[0094] As shown in FIG. 5, the object to be processed 11 is glass with a horizontal, vertical, and thickness of about 50 mm each, and the laser beam irradiation unit 20 irradiates a nanosecond laser beam having a deep ultraviolet (Deep UV) wavelength that can output an output of about 10 W.

[0095] In addition, the laser beam adjustment unit 40 adjusts the wavelength, pulse width, and beam mode of the laser beam according to the control signal of the control unit 60, and the optical unit 30 adjusts the beam shape of the laser beam.

[0096] For example, the shape of the beam can be changed into various shapes such as circular or elliptical.

[0097] In addition, the beam mode includes a Gaussian beam mode and a non-Gaussian beam mode.

[0098] Here, the laser beam pre-processed the object to be processed 11 in a Gaussian beam mode and a circular beam shape, and etching was performed for about 2 hours using an approximately 5% strong acid solution to chemically remove only the fine pattern formed in the amorphous region.

[0099] As a result, holes having a diameter of about 50 μm were processed at intervals of about 0.2 mm in the horizontal and vertical directions, 48×48, that is, a total of 2304 holes, and a fine pattern using the processed holes 12 in which the hole diameter was embodied at a ratio of 100:1 compared to the thickness of the object to be processed 11 was processed.

[0100] Here, as shown in FIGS. 5(a) to 5(c), the processed holes 12 can be formed not only in a linear shape along the vertical direction but also to include a right-angle portion 13 along the horizontal direction at a certain depth inside the object to be processed 11.

[0101] That is, the present invention can process a processed hole having one or more right-angle portions horizontally along the left-right direction as well as in a linear shape along the up-down direction inside the object to be processed while controlling the focal length of the laser beam and moving the laser beam inside the object to be processed.

[0102] In addition, the present invention can form a processed hole by inclining at a predetermined angle from one surface of the object to be processed toward the opposite surface.

[0103] That is, the present invention can also process fine patterns of various three-dimensional shapes by adjusting the beam mode, the shape of the beam, etc. of the laser beam together with the depth at which the laser beam is irradiated, and processing holes, for example, along the inclined direction, to have various diameters and shapes.

[0104] For example, FIGS. 6 to 8 are diagrams showing an object to be microfabricated according to the present invention.

[0105] In FIG. 6, the object to be processed has a thickness of about 5 mm, and the processing holes formed in the object to be processed are formed with a diameter of about 20 μm to 80 μm.

[0106] FIG. 7(a) shows a microfabricated object to be processed, and FIG. 7(b) shows an enlarged cross-sectional view of a pair of processing holes formed in the object to be processed.

[0107] In FIGS. 7(a) and 7(b), the object to be processed has a thickness of about 2 mm, and the processing holes formed in the object to be processed are formed with a diameter of about 40 μm.

[0108] FIG. 8 is a diagram comparing an object to be processed processed by the prior art and the present invention.

[0109] FIG. 8(a) shows a cross-section of an object to be processed with processing holes processed by the prior art, and FIG. 8(b) shows a cross-section of an object to be processed with processing holes processed by the present invention.

[0110] According to the prior art, as shown in FIG. 8(a), since the reaction solution is not sufficiently introduced into the laser-processed processing hole 12, it can be seen that the central portion of the processing object 11 is processed to a smaller diameter than the upper and lower portions of the processing hole 12 and is formed in a substantially mortar shape.

[0111] On the other hand, according to the present invention, as shown in FIG. 8(b), a laser beam having high energy per unit volume and a very short pulse width is irradiated onto the object to be processed 11 made of a crystallized material through which the laser beam passes. The laser beam is absorbed inside the object to be processed, and the inside of the crystallized object to be processed is amorphized. By increasing the reaction rate at which a chemical reaction with the reaction solution occurs in the amorphized region, it was confirmed that the processing hole 12 formed in the object to be processed 11 was chemically removed by the chemical reaction and was microfabricated.

[0112] Thus, the present invention controls the focal length, wavelength, pulse width, beam mode, and beam shape of a laser beam to form processing holes of various shapes, chemically removes a fine pattern by a chemical reaction with an etching solution, and can process patterns of various three-dimensional shapes at high speed.

[0113] Further, the present invention can process a very fine three-dimensional shape inside a crystallized object to be processed and a very narrow hole in which the ratio of the thickness of the object to be processed to the diameter of the processing hole is several to several tens of thousands of times, while minimizing cracks and damage to the object to be processed.

[0114] As described above, the invention made by the present inventor has been specifically described by the above embodiments. However, the present invention is not limited to the above embodiments, and can be variously modified without departing from the gist thereof.

Industrial Applicability

[0115] The present invention is applied to a technique for finely processing by irradiating a laser beam onto an object to be processed made of a crystallized material, absorbing the laser beam inside the object to be processed, amorphizing the inside of the crystallized object to be processed, and chemically removing a fine pattern formed in the amorphized region by a chemical reaction.

Explanation of Reference Numerals

[0116] 10 Microfabrication apparatus 11 Object to be processed 12 Processing hole 13 Right-angled part 20 Laser beam irradiation unit 30 Optical unit 40 Laser beam adjustment unit 50 Transfer unit 60 Control unit 70 Chemical reaction furnace

Claims

1. A laser beam irradiation unit that irradiates a crystallized object to be processed through which a laser beam passes to form a processing hole, An optical unit that irradiates the shape of the laser beam so as to locally irradiate the laser beam inside the object to be processed and amorphize the crystallized object to be processed, A laser beam irradiation unit that irradiates the pulse width and pulse energy of the laser beam, A transfer unit that moves the laser beam along a fine pattern, A control unit that controls the driving of each device, and includes, The processing hole formed in the amorphized region of the object to be processed is chemically removed by a chemical reaction using a chemical substance, and the ratio of the thickness of the crystallized object to be processed to the diameter of the processing hole is processed to be several times to tens of thousands of times, The object to be processed is made of a material of a transparent ceramic material, or a material of silicon or a metal material, The laser beam is irradiated on the crystallized object to be processed through which the laser beam can pass with energy and pulse width per predetermined unit volume, Based on the processing conditions of the object to be processed, the control unit generates a control signal for controlling the driving of the laser beam irradiation unit and the optical unit so as to change and irradiate the shape of the laser beam, the pulse width of the laser beam, and the pulse energy, Depending on the material and specifications of the object to be processed, control is performed so as to irradiate the wavelength, pulse width, beam mode of the laser beam, and the beam shape of the laser beam, The processing hole is formed linearly from one surface of the object to be processed irradiated with the laser beam toward the opposite surface, or is formed including one or more right-angle portions, or is formed inclined by a predetermined angle. A fine processing apparatus using a laser, characterized in that.

2. The chemical reaction is performed using a strongly acidic or strongly basic chemical substance. The fine processing apparatus using a laser according to claim 1, characterized in that.

3. Further includes a chemical reaction furnace for precipitating the object to be processed and processing the processing hole by a chemical reaction, The chemical reaction furnace uses an ultrasonic vibrator to apply ultrasonic vibration to the object to be processed at a predetermined cycle, The ultrasonic vibration is applied in a direction parallel to the direction of the processing hole formed in the object to be processed. The fine processing apparatus using a laser according to claim 2, characterized in that.

4. The chemical reaction furnace uses a heating unit to heat the reaction solution and the object to be heated to a predetermined set temperature so as to activate the reaction solution that is the chemical substance, The laser microfabrication apparatus according to claim 3, wherein the set temperature is set to correspond to the melting point of the chemical components contained in the reaction solution.

5. (a) A step of irradiating a crystallized object to be processed through which a laser beam passes with the laser beam using a laser beam irradiation unit to form a processing hole; (b) A step of irradiating the shape of the laser beam using an optical unit so as to locally irradiate the laser beam inside the object to be processed and amorphize the crystallized object to be processed; (c) A step of irradiating the pulse width and pulse energy of the laser beam using a laser beam irradiation unit; (d) A step of depositing the object to be processed in a chemical reaction furnace containing a reaction solution and chemically removing the processing hole formed in the amorphized region by a chemical reaction with the reaction solution; (e) A step of moving the laser beam to a pattern where the processing hole is to be formed using a transfer unit, and including: In the process of performing the steps (a) to (e), using a control unit, based on the processing conditions of the object to be processed, the shape of the laser beam, the pulse width, and the pulse energy of the laser beam are changed and irradiated, and the driving of the laser beam irradiation unit, the optical unit, and the transfer unit is controlled; The object to be processed is made of a material of a transparent ceramic material, or a material of silicon or a metal material; The laser beam is irradiated on the crystallized object to be processed through which the laser beam can pass with energy and pulse width per predetermined unit volume; In the step (c), the control unit controls to irradiate the wavelength, pulse width, beam mode of the laser beam, and the beam shape of the laser beam according to the material and specifications of the object to be processed; The processing hole is processed such that the ratio of the thickness of the object to be processed to the diameter of the processing hole is several times to tens of thousands of times; The laser microfabrication method characterized in that the laser beam is formed linearly from one surface of the object to be processed irradiated with the laser beam toward the opposite surface, or is formed including one or more right-angle portions, or is formed inclined at a predetermined angle.

6. The laser microfabrication method according to claim 5, wherein the chemical reaction is performed using a strong acid or a strongly basic chemical substance as the reaction solution.

7. In the step (d), the chemical reactor applies ultrasonic vibration to the object to be processed at a predetermined period by using an ultrasonic vibrator. The method for laser microfabrication according to claim 6, wherein the ultrasonic vibration is applied in a direction parallel to or perpendicular to the direction of the processing hole formed in the object to be processed.

8. The chemical reactor heats the reaction solution and the object to be heated to a predetermined set temperature by using a heating unit so as to activate the reaction solution. The method for laser microfabrication according to claim 7, wherein the set temperature is set to correspond to the melting point of the chemical components contained in the reaction solution.

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