Camera module

Abstract

The camera module according to the embodiment includes a base and a filter unit disposed on the base. The base includes a first frame containing an insulating material and a second frame inserted into the first frame and containing a metallic material. The filter unit is disposed on the second frame of the base.

Description

Technical Field

[0001] The embodiments relate to a camera module and an optical device including the same.

Background Art

[0002] Recently, ultra-small camera modules have been developed. The ultra-small camera modules are widely used in small electronic products such as smartphones, notebook computers, and game machines.

[0003] That is, most mobile electronic devices such as smartphones are equipped with a camera device for obtaining an image from an object. At this time, mobile electronic devices are becoming smaller and smaller for convenient portability.

[0004] Such a camera module generally includes a lens through which light is incident, an image sensor that images the light incident through the lens, and a plurality of components for transmitting and receiving an electrical signal for an image obtained from the image sensor to and from an electronic device on which the camera device is mounted. Also, such an image sensor and components are generally mounted on a printed circuit board and connected to an external electronic device.

[0005] At this time, in the case of a camera module applied to an electronic device as described above, an impact can be frequently applied to the camera module during use. Also, the camera module may generate minute vibrations due to the user's hand shake or the like during the shooting operation. In view of this, a camera module having an anti-shake function has been provided.

[0006] On the other hand, such a camera module includes a filter mounting portion called an inner base, a holder, or a sensor base disposed between the lens module and the image sensor.

[0007] However, the filter mounting part according to the prior art is a component manufactured by injection using resin. Thus, according to the prior art, there is a limit to reducing the thickness of the filter mounting part. And due to the limit of the minimum thickness of the filter mounting part, there is a limit to reducing the FBL, which is the vertical distance between the lens and the image sensor. For example, components manufactured by injection have a problem that the extractability in the mold decreases as the thickness decreases. Also, components manufactured by injection have a problem that deformation occurs during extraction in the mold as the thickness decreases. Thus, the filter mounting part according to the prior art should have a thickness above a certain level.

[0008] In addition, as the resolution of the camera module increases, the size of the sensor has become larger, and as the size of the sensor increases, the size of the filter has also become larger. However, in the case of the filter mounting part manufactured by injection according to the prior art, there is a limit to increasing the size due to flatness and warpage problems.

[0009] Thus, there is a need for a filter mounting part with a new structure that can maintain a flatness above a certain level even when the thickness decreases and can maintain a rigidity above a certain level even when the horizontal size increases.

[0010] (Patent Document 1) KR10-2015-0030906A

Summary of the Invention

Problems to be Solved by the Invention

[0011] An embodiment aims to provide a camera module including a base with a new structure and an optical device including the same.

[0012] Also, an embodiment aims to provide a camera module capable of reducing the thickness of the base and an optical device including the same.

[0013] In addition, the embodiments seek to provide a camera module capable of ensuring the rigidity of the base and an optical device including the same.

[0014] In addition, the embodiments seek to provide a camera module capable of improving the flatness of the base and the flatness of the filter and an optical device including the same.

[0015] In addition, the embodiments seek to provide a camera module capable of reducing the FBL, which is the distance between the lens and the sensor, and an optical device including the same.

[0016] The technical problems to be solved by the embodiments are not limited to the technical problems mentioned above. Other technical problems not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which the present invention pertains from the following description.

Means for Solving the Problems

[0017] The camera module according to the embodiment includes a base and a filter unit disposed on the base. The base includes a first frame containing an insulating material and a second frame inserted into the first frame and containing a metallic material. The filter unit is disposed on the second frame of the base.

[0018] In addition, the second frame is coupled to the first frame by an insert injection method.

[0019] In addition, the first frame includes a first opening, the second frame includes a second opening overlapping the first opening on the optical axis, and the second frame is inserted into the inner surface of the first opening of the first frame.

[0020] In addition, the area of the second opening is smaller than the area of the first opening and the area of the filter unit.

[0021] Further, the first frame includes a housing portion into which the second frame is inserted, and the housing portion includes a recess portion formed in an outward direction from the inner surface of the first frame, and a hole portion penetrating the inner surface and the outer surface of the first frame.

[0022] Further, the first frame includes a partition portion that divides the housing portion into a plurality of regions, and the partition portion penetrates the second frame inserted into the housing portion.

[0023] Further, the camera module further includes a reinforcing plate, a circuit board disposed on the reinforcing plate and including a cavity, a sensor disposed on the upper surface of the reinforcing plate vertically overlapping the cavity of the circuit board and located in the cavity of the circuit board, and a connecting member connecting between the terminals of the sensor and the pads of the circuit board, and the uppermost end of the connecting member is located higher than the upper surface of the circuit board.

[0024] Further, the first frame includes a first portion located above the second frame based on the position where the second frame is inserted, and a second portion located below the second frame, and the second frame is spaced apart from the uppermost end of the connecting member in the optical axis direction by the second portion of the first frame.

[0025] Further, the thickness of the second portion of the first frame satisfies the range of 150 μm to 250 μm.

[0026] Further, the base includes a through hole penetrating the first frame and the second frame.

[0027] Further, the thickness of the second frame satisfies the range of 95 μm to 160 μm.

[0028] Further, the total thickness of the base including the first frame and the second frame satisfies the range of 350 μm to 550 μm.

[0029] Further, the second frame includes a non-magnetic metal material.

[0030] Further, the camera module further includes an adhesive portion disposed between the circuit board and the lower surface of the first frame of the base.

Advantages of the Invention

[0031] The camera module of the embodiment includes a base on which a filter portion is mounted. At this time, the base includes a plurality of frames made of different substances. For example, the base includes a first frame of a first substance and a second frame of a second substance. At this time, the first substance includes an insulating substance. And the second substance includes a metal substance different from the first substance. The second frame functions as a mounting portion on the base where the filter portion is mounted. Thus, in the embodiment, since the mounting portion where the filter portion is mounted is made of a metal substance, the filter portion can be stably mounted on the base. Also, in the embodiment, the flatness of the filter portion mounted on the base can be improved.

[0032] On the other hand, in response to the requirement for high resolution, the size of the sensor increases, and correspondingly, the size of the filter portion also increases. At this time, there is a limit to the size of the filter portion that can be mounted on the mounting portion injection-molded with an insulating substance in the comparative example. In contrast, in the embodiment, the second frame corresponding to the mounting portion is formed of a metal substance. Thus, in the embodiment, a base capable of corresponding to an increase in the size of the filter portion can be provided. Further, in the embodiment, the size of the filter portion that can be mounted can be increased while maintaining the flatness of the filter portion as compared with the comparative example.

[0033] Also, in the embodiment, the thickness of the second frame can be reduced compared to the comparative example. Specifically, in the comparative example, since it is necessary to consider the problem of non-formation in the injection process, the landing portion should have a thickness equal to or greater than a certain value. In contrast, in the embodiment, it is not necessary to consider the problem of non-formation of the second frame corresponding to the landing portion. As a result, in the embodiment, the thickness of the second frame corresponding to the landing portion can be reduced compared to the comparative example. That is, in the embodiment, the thickness of the second frame can be reduced under the condition of maintaining the flatness of the filter portion. Thereby, in the embodiment, corresponding to the reduction in the thickness of the second frame, the FBL (Flange Back Length) can be reduced. Thereby, in the embodiment, the overall thickness or volume of the camera module can be reduced.

[0034] Furthermore, in the embodiment, injection of the first frame is performed with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced. For example, in the comparative example, problems of injectability and extractability must be considered. As a result, in the comparative example, there is a limit to the reduction in the total thickness of the base. In contrast, in the embodiment, injection is performed with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced compared to the comparative example. Thereby, in the embodiment, the FBL (Flange Back Length) can be reduced. Also, the embodiment can reduce the overall thickness or volume of the camera module.

[0035] On the other hand, the second frame in the embodiment includes a blackened coating layer. The coating layer prevents light that has passed through the lens and the filter from being reflected through the second frame. Thereby, in the embodiment, the image quality of the camera module can be improved.

[0036] In addition, the second frame in the embodiment is formed of a non-magnetic material. Thereby, in the embodiment, the problem that the operating characteristics of the sensor driving device are deteriorated by the second frame can be solved. For example, when the second frame is made of a magnetic material, magnetic interference may occur in the interaction between the coil and the magnet of the sensor driving device. And the operating characteristics of the sensor driving device may be deteriorated due to the magnetic interference. In contrast, the second frame in the embodiment contains a non-magnetic material. Thereby, in the embodiment, it is possible to achieve the effect of maintaining the flatness of the filter unit and reducing FBL without affecting the operating characteristics of the sensor driving device.

Brief Description of the Drawings

[0037]

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Mode for Carrying Out the Invention

[0038] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0039] However, the technical idea of the present invention is not limited to several embodiments described, but can be realized in various different forms, and within the scope of the technical idea of the present invention, one or more of the components can be selectively combined and replaced for use between embodiments.

[0040] Also, the terms (including technical and scientific terms) used in the embodiments of the present invention are, unless otherwise specifically defined and described, construed to have a meaning generally understood by those of ordinary skill in the technical field to which the present invention pertains, and terms generally used like pre-defined terms can be construed to have their meaning in consideration of the meaning in the context of the related art.

[0041] Also, the terms used in the embodiments of the present invention are for explaining the embodiments and are not intended to limit the present invention. In this specification, the singular form can include the plural form unless otherwise specifically mentioned in the text, and when described as "at least one (or one or more) of A and (or) B, C", one or more of all combinations combined with A, B, and C can be included.

[0042] In addition, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are only for distinguishing the components from other components, and the essence, order, or procedure of the corresponding components are not limited by such terms. When a component is described as "connected", "coupled", or "connected" to another component, the component can include not only the case where it is directly connected or connected to the other component, but also the case where it is "connected", "coupled", or "connected" by another component or other components existing between the component and the other component.

[0043] In addition, when it is described that it is formed or arranged "above (upper part) or below (lower part)" of each component, "above (upper part) or below (lower part)" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or arranged between the two components. Also, when expressed as "above (upper part) or below (lower part)", it can include not only the meaning in the upward direction but also the meaning in the downward direction with respect to one component as a reference.

[0044] The optical axis direction used hereinafter can be defined as the optical axis direction of the lens coupled to the camera actuator and the camera module, and the vertical direction can be defined as the direction perpendicular to the optical axis.

[0045] The autofocus function used hereinafter can be defined as a function of automatically focusing on a subject by moving the lens in the optical axis direction according to the distance of the subject so as to obtain a clear image of the subject on the image sensor and adjusting the distance from the image sensor.

[0046] On the one hand, autofocus can correspond to AF (Auto Focus). Also, the closed-loop auto focus feedback (CLAF) control can be defined as sensing the distance between the image sensor and the lens in order to improve the accuracy of focus adjustment and performing real-time feedback control on the position of the lens.

[0047] Before describing the embodiments of the present invention, the first direction can mean the x-axis direction shown in the drawings, and the second direction can be a direction different from the first direction. As an example, the second direction can mean the y-axis direction shown in the drawings in a direction perpendicular to the first direction. Also, the third direction can be a direction different from the first and second directions. As an example, the third direction can mean the z-axis direction shown in the drawings in a direction perpendicular to the first and second directions. Here, the third direction can mean the optical axis direction.

[0048] Hereinafter, the camera module according to the embodiments and the optical device including the same will be specifically described.

[0049] FIG. 1 is a perspective view of a camera module according to an embodiment, FIG. 2 is an exploded perspective view of the camera module according to the embodiment, FIG. 3 is a cross-sectional view of the camera module of FIG. 1 in the A-A' direction, and FIG. 4 is an enlarged view of a partial region of FIG. 3.

[0050] Referring to FIGS. 1 to 4, the camera module 100 according to the embodiment can include a lens 110, a lens barrel 120, a lens driving device 130, a filter unit 140, a base 150, a circuit board 160, a reinforcing plate 170, a sensor 180, and an adhesive part 190.

[0051] Here, the camera module 100 can be expressed as an alternative to an imaging device or a photographing device. Also, the base 150 can be expressed as an alternative to a holder, a sensor base, an inner base, a filter mounting portion, or a filter attaching portion. Further, the lens driving device 130 can also be said to be an actuator that drives the lens 110 or the lens barrel 120.

[0052] The lens 110 or the lens barrel 120 can be coupled to the lens driving device 130. For example, the lens 110 or the lens barrel 120 can be mounted on the lens driving device 130.

[0053] For example, the lens 110 can be mounted inside the lens barrel 120. And the lens barrel 120 can be mounted on the lens driving device 130.

[0054] At this time, the lens driving device 130 includes a bobbin (not shown). And the lens barrel 120 can be coupled to the bobbin of the lens driving device 130.

[0055] An adhesive portion 190 can be disposed between the outer surface of the lens barrel 120 and the inner surface of the bobbin of the lens driving device 130. And the lens barrel 120 can be coupled to the bobbin of the lens driving device 130 via the adhesive portion 190. At this time, the lens barrel 120 can move together with the bobbin corresponding to the moving portion of the lens driving device 130. As will be described later, the lens driving device 130 includes a fixed portion whose position is fixed and a moving portion that moves with respect to the fixed portion. And the bobbin is included in the moving portion of the lens driving device 130. At this time, the lens barrel 120 is coupled to the bobbin of the moving portion of the lens driving device 130. Thereby, when the moving portion of the lens driving device 130 moves, the lens barrel 120 can move together with the moving portion.

[0056] That is, the lens driving device 130 can drive the lens barrel 120 to which the lens 110 is coupled.

[0057] The lens 110 can be an optical system in which three or more lenses are stacked. The lens 110 can be an optical system in which five or more lenses are stacked. The lens 110 can be an optical system in which eight or more lenses are stacked. At this time, in the drawing, the lens 110 is shown as including eight lenses, but it is not limited thereto. For example, the lens 110 can have a stacked structure of less than eight lenses, and differently, can also have a stacked structure of nine or more lenses.

[0058] The lens 110 can include lenses made of a plastic material. The lens 110 according to an embodiment of the present invention can include a first lens portion made of a plastic material and a second lens portion made of a glass material. And the number of lenses in the first lens portion made of the plastic material may be more than the number of lenses in the second lens portion made of the glass material. For example, the number of lenses in the first lens portion made of the plastic material can be two or more.

[0059] In one embodiment, the lens 110 can be stacked with plastic lenses and / or glass lenses. Here, the plastic material is five times or more higher than the thermal expansion coefficient (CTE) of the glass material, and the change value (|dN / Dt|) of the refractive index due to the function of temperature may be 10 times or more higher for the plastic material than for the glass material. Here, dN is the change value of the refractive index of the lens, and dT indicates the change value of the temperature.

[0060] Also, the camera module 100 can be either an AF (Auto Focus) camera module or an OIS (Optical Image Stabilizer) camera module. The AF camera module refers to one that can perform only the autofocus function. And the OIS camera module refers to one that performs the autofocus function and the OIS function.

[0061] For example, the lens driving device 130 can be an AF lens driving device or an OIS lens driving device. Here, the meanings of "for AF" and "for OIS" may be the same as those described in the AF camera module and the OIS camera module.

[0062] For example, the lens driving device 130 of the camera module 100 can be an OIS lens driving device.

[0063] The lens driving device 130 can include a housing 131 and a bobbin 132 disposed within the housing 131 and coupled to the lens barrel 120.

[0064] Although not specifically shown in the drawings, the lens driving device 130 can include a first coil (not shown) coupled to the bobbin 132. Further, the lens driving device 130 can include a magnet (not shown) coupled to the housing 131 and facing the first coil.

[0065] Also, the lens driving device 130 can include at least one upper elastic member (not shown) coupled to the upper part of the housing 131 and the upper part of the bobbin 132. Further, the lens driving device 130 can include at least one lower elastic member (not shown) coupled to the lower part of the housing 131 and the lower part of the bobbin 132.

[0066] Also, the lens driving device 130 can include a second coil (not shown) disposed under the bobbin 132 or the housing 131. Further, the lens driving device 130 can include a driving substrate (not shown) disposed under the second coil. Further, the lens driving device 130 can include a frame portion (not shown) disposed under the driving substrate.

[0067] On the other hand, the bobbin 132 can also be said to be a "holder" to which the lens barrel 120 is coupled.

[0068] Further, the lens driving device 130 may include a cover member 133 that is coupled to the frame portion and provides a space for accommodating the components of the lens driving device 130 together with the frame portion.

[0069] Also, the lens driving device 130 may further include a support member (not shown) that supports the housing 131 with respect to the frame portion while electrically connecting the driving substrate and the upper elastic member. Each of the first coil and the second coil is electrically connected to the driving substrate and can receive a driving signal (driving current) from the driving substrate.

[0070] For example, the upper elastic member may include a plurality of upper springs. And the support member may include a support member that is connected to the upper springs of the upper elastic member. And the first coil may be electrically connected to the driving substrate via the upper spring and the support member. The driving substrate may include a plurality of terminals. The first coil and / or the second coil may be electrically connected to a part of the plurality of terminals.

[0071] The lens driving device 130 of the embodiment can move the bobbin 132 and the lens barrel 120 coupled to the bobbin 132 in the optical axis direction by an electromagnetic force due to the interaction between the first coil and the magnet. And the position of the lens barrel 120 and the lens 110 coupled to the lens barrel 120 in the optical axis direction can be controlled by the electromagnetic force. And thereby, AF driving can be realized.

[0072] Also, the housing 131 of the lens driving device 130 can be moved in a direction perpendicular to the optical axis direction by an electromagnetic force due to the interaction between the second coil and the magnet. Thereby, shake correction or OIS driving can be realized.

[0073] In addition, the lens driving device 130 of the camera module 100 may include a position sensor unit (not shown) for AF feedback driving. The position sensor unit may include a sensing magnet (not shown) disposed on the bobbin 132 and an AF position sensor (e.g., a hall sensor (not shown)) disposed on the housing 131.

[0074] In addition, the lens driving device 130 may further include a sensor substrate (not shown) disposed on the housing 131 or / and the frame portion for the AF position sensor to be disposed or mounted thereon. In other embodiments, the AF position sensor may be disposed on the bobbin 132 and the sensing magnet may be disposed on the housing 131. Further, the lens driving device 130 may further include a balancing magnet (not shown) disposed on the bobbin 132 corresponding to the sensing magnet.

[0075] The AF position sensor senses the intensity of the magnetic field of the sensing magnet due to the movement of the bobbin 132. And the AF position sensor can generate an output signal based on the result of the sensing. The AF position sensor may be electrically connected to the driving substrate via an upper elastic member (or a lower elastic member) or / and a supporting member. The driving substrate can provide a driving signal to the AF position sensor. And the driving substrate can receive the output signal of the AF position sensor.

[0076] In other embodiments, the lens driving device 130 may be an AF lens driving device, and the AF lens driving device may include a housing 131, a bobbin 132 disposed inside the housing 131, a coil disposed on the bobbin 132, a magnet disposed on the housing 131, at least one elastic member coupled to the bobbin 132 and the housing 131, and a frame portion disposed under the bobbin (or / and the housing).

[0077] For example, the elastic member can include the above-described upper elastic member and lower elastic member.

[0078] A drive signal (e.g., drive current) can be provided to the coil. Then, the bobbin 132 can be moved in the optical axis direction by an electromagnetic force due to the interaction between the coil and the magnet based on the provided drive signal.

[0079] In other embodiments, the coil may be disposed in the housing, and the magnet may be disposed on the bobbin 132.

[0080] Also, for AF feedback driving, the AF lens driving device can further include a sensing magnet disposed on the bobbin 132, an AF position sensor (e.g., a hall sensor) disposed in the housing 131, and a sensor substrate on which the AF position sensor is disposed and which is disposed or mounted on the housing or / and the frame portion. In other embodiments, the AF position sensor may be disposed on the bobbin 132, and the sensing magnet may be disposed in the housing 131.

[0081] A camera module according to another embodiment can include a housing coupled to a lens or a lens barrel 120 instead of the lens driving device 130 of FIG. 1. And the housing can be coupled or attached to the upper surface of the base 150. At this time, the housing may be attached or fixed to the base 150 and may not move. For example, the housing may be fixed in position while being attached to the base 150.

[0082] The circuit board is electrically connected to the coil and the AF position sensor, a drive signal is provided to each of the coil and the AF position sensor via the circuit board, and the output of the AF position sensor can be transmitted to the circuit board.

[0083] The base 150 can be disposed under the lens driving device 130.

[0084] The filter unit 140 can be mounted on the base 150. For this purpose, the base 150 can be provided with a mounting portion on which the filter unit 140 is seated. That is, the base 150 can include a window with an opening in the region where the filter unit 140 is disposed. Thereby, the mounting portion of the base 150 can also be said to be a window.

[0085] At this time, an adhesive portion (not shown) can be applied between the base 150 and the filter unit 140. For example, the adhesive portion can be disposed between the mounting portion (described later) of the base 150 and the filter unit 140. The adhesive portion can be epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, or the like.

[0086] The filter unit 140 can be seated on the base 150. For this purpose, the base 150 can include a plurality of frames.

[0087] At this time, the fact that the base 150 includes a plurality of frames does not mean that the base 150 includes a plurality of different components. The plurality of frames can be a division of the components constituting the base 150 according to the material.

[0088] As will be described later, the base 150 in the embodiment can be an injection molded product injection molded by an insert injection or double injection method. Thereby, the base 150 can include a first frame 151 and a second frame 152 inserted into the first frame 151. And the material constituting the first frame 151 can be different from the material constituting the second frame 152. For example, the first frame 151 can include an insulating material. For example, the first frame 151 can be formed of resin. For example, the first frame 151 can be formed of plastic. The second frame 152 includes a material different from that of the first frame 151. Preferably, the second frame 152 can include a metallic material. More preferably, the second frame 152 can include a non-magnetic metallic material.

[0089] And the second frame 152 is formed of a metallic material and can be inserted into the first frame 151. The second frame 152 can function to improve the rigidity of the first frame 151 and the rigidity of the base 150. Also, the second frame 152 can function to improve the flatness of the first frame 151 and the flatness of the base 150.

[0090] Specifically, the second frame 152 is inserted into the first frame 151. The second frame 152 can be a seating portion where the filter unit 140 is seated. For example, the second frame 152 can be a window.

[0091] The base 150 in the embodiment includes a first frame 151 of an insulating material and a second frame 152 of a metallic material inserted into the first frame 151. And the second frame 152 can function to reduce the minimum injectable thickness of the first frame 151. Also, the second frame 152 can reduce the minimum thickness of the seating portion (or window) necessary for the seating and / or support of the filter unit 140. For example, when the seating portion is formed of an injection product of an insulating material, the seating portion should have a first thickness for the seating and / or support of the filter unit 140. In contrast, when the seating portion is formed of the second frame 152 of a metallic material as in the embodiment, the second frame 152 may have a second thickness smaller than the first thickness for the seating and / or support of the filter unit 140. Thereby, in the embodiment, the thickness of the seating portion can be reduced. Further, the total thickness of the first frame 151 injection-molded by the second frame 152 can be reduced. Thereby, in the embodiment, the total thickness of the base 150 can be reduced. Therefore, in the embodiment, the flatness of the base 150 can be maintained and the warping characteristics of the filter unit 140 can be improved. Also, in the embodiment, the thickness of the base 150 can be decreased, whereby the FBL (Flange Back Length), which is the distance between the lens 110 and the sensor 180, can be reduced.

[0092] In the embodiment, a base 150 is provided in which a first frame 151 and a second frame 152 are integrally formed through double injection. And the second frame 152 inserted into the first frame 151 enables effects such as improvement in the flatness of the base 150, improvement in warpage characteristics, reduction in thickness, and reduction in FBL.

[0093] That is, the first frame 151 has an opening that vertically overlaps the filter unit 140. And the second frame 152 can be a protruding portion that protrudes from the inner surface of the opening of the first frame 151 toward the opening.

[0094] And the second frame 152, which is the protruding portion, can function as a seating portion on which the filter unit 140 is seated.

[0095] At this time, the second frame 152 can also have an opening corresponding to the opening of the first frame 151. However, the area of the opening of the second frame 152 may be smaller than the area of the opening of the first frame 151. Thereby, a part of the opening of the first frame 151 can be covered by the second frame 152. For example, the opening of the first frame 151 includes a first region that overlaps the opening of the second frame 152 on the optical axis and a second region that overlaps the second frame 152 on the optical axis.

[0096] The second frame 152 can prevent the lower end of the lens 110 or the lens barrel 120 from directly contacting or colliding with the filter unit 140 while allowing the filter unit 140 to be seated.

[0097] At this time, the first frame 151 may have a shape protruding in the optical axis direction from the upper surface of the second frame 152. For example, the first frame 151 may include a first portion 151a protruding in the optical axis direction along the side surface of the filter unit 140 seated on the second frame 152. For example, the first portion 151a of the first frame 151 may be disposed around the side surface of the filter unit 140 so as to wrap the side surface of the filter unit 140 seated on the second frame 152.

[0098] Also, the inner surface of the first portion 151a of the first frame 151 may be provided so as to face the side surface of the filter unit 140. At this time, the outer surface of the filter unit 140 may be separated from the inner surface of the first portion 151a of the first frame 151 by a certain distance. This may be for ensuring a process tolerance that allows the filter unit 140 to be easily seated on the second frame 152.

[0099] The upper surface of the first frame 151 may be located above the upper surface of the filter unit 140 in the optical axis direction. This may be for preventing the lens 110 or the lens barrel 120 from contacting the filter unit 140 when the lens 110 or the lens barrel 120 moves toward the filter unit 140 due to the lens driving device 130 or an external impact.

[0100] On the other hand, the shapes of the first frame 151 and the second frame 152 as viewed from above may correspond to the shape of the filter unit 140, but are not limited thereto. For example, the planar shape of at least one of the first frame 151 and the second frame 152 may be different from the planar shape of the filter unit 140.

[0101] On the one hand, the base 150 can include an incident portion corresponding to the opening of the first frame 151 and the opening of the second frame 152. The incident portion can allow the light passing through the filter portion 140 to be incident on the sensor 180. The opening and the incident portion can penetrate the base 150 in the optical axis direction. Thus, the opening and the incident portion can also be referred to as through holes.

[0102] The opening can penetrate the center of the base 150. At this time, the area of the opening formed in the first frame 151 may be larger than the area of the filter portion 140. And the area of the opening formed in the second frame 152 may be smaller than the area of the filter portion 140. Thereby, the filter portion 140 can be located within the opening of the first frame 151 in a state of being seated on the second frame 152.

[0103] The filter portion 140 can be disposed on the base 150. Preferably, the filter portion 140 can be seated on the second frame 152 of the base 150.

[0104] The filter portion 140 can block light in a specific frequency band in the light passing through the lens 110 housed in the lens barrel 120. For example, the filter portion 140 can block light in a specific frequency band from being incident on the sensor 180.

[0105] For example, the filter portion 140 can be an infrared filter, but is not limited thereto. The filter portion 140 can be disposed parallel to the direction perpendicular to the optical axis OA (for example, the x-y plane direction).

[0106] The circuit board 160 can be disposed below the base 150. That is, the base 150 can be attached or coupled onto the circuit board 160.

[0107] For this purpose, an adhesive portion 145 may be disposed between the base 150 and the circuit board 160. And the adhesive portion 145 can stably fix the base 150 on the circuit board 160.

[0108] On the other hand, the circuit board 160 can include a cavity C that is perpendicular to the opening of the base 150 or overlaps the optical axis. The cavity C can mean a through hole penetrating the circuit board 160. For example, the circuit board 160 can include a cavity C in which a region overlapping the opening of the base 150 or the filter unit 140 on the optical axis is open. And the cavity C can penetrate the upper surface of the circuit board 160 and the lower surface opposite to the upper surface.

[0109] The camera module 100 of the embodiment includes a sensor 180. The sensor 180 can also be referred to as an image sensor.

[0110] The sensor 180 can be disposed in the cavity C of the circuit board 160. For example, the sensor 180 can overlap the cavity C of the circuit board 160 in the optical axis direction.

[0111] The camera module 100 of the embodiment can include a reinforcement plate 170.

[0112] The reinforcement plate 170 can be attached to the lower surface of the circuit board 160.

[0113] The reinforcement plate 170 can include an overlapping region that overlaps the cavity C of the circuit board 160 on the optical axis.

[0114] And the sensor 180 can be attached onto the overlapping region of the reinforcement plate 170. For example, the sensor 180 can be attached to the upper surface of the overlapping region of the reinforcement plate 170 while being disposed in the cavity C of the circuit board 160.

[0115] That is, recently, the required resolution of the camera module has been increasing. Along with the increase in the resolution, the size of the sensor 180 has been growing. At this time, when the sensor 180 is arranged on the circuit board 160, it may be difficult to maintain the flatness of the sensor 180, whose size is gradually increasing. Also, when the sensor 180 is arranged on the circuit board 160, the heat dissipation characteristics of the sensor 180 may deteriorate.

[0116] Accordingly, in the embodiment, a reinforcing plate 170 is attached to the lower surface of the circuit board 160. And in the embodiment, the sensor 180 is enabled to be attached to the reinforcing plate 170 instead of the circuit board 160.

[0117] For example, the sensor 180 in the embodiment can be directly attached onto the reinforcing plate 170. Here, directly attaching can mean that the sensor 180 is directly arranged on an adhesion part (described later) arranged on the reinforcing plate 170.

[0118] On the other hand, the sensor 180 can be exposed through the cavity C of the circuit board 160 while being arranged on the reinforcing plate 170. And the terminal 181 of the sensor 180 can be electrically connected to the pad 162 of the circuit board 160. For example, the sensor 180 can be electrically connected to the circuit board 160 via a connecting member W (for example, a wire) or the like.

[0119] The reinforcing plate 170 may be a plate-shaped member having a thickness and hardness equal to or greater than a certain level. Thereby, the reinforcing plate 170 can stably support the sensor 180. Further, the reinforcing plate 170 can prevent the sensor 180 from being damaged by an external impact. For example, the reinforcing plate 170 can protect the sensor 180 from an external impact. Further, the reinforcing plate 170 can release heat generated by the sensor 180. Thereby, while the reinforcing plate 170 functions to improve the flatness of the sensor 180, it can also function as a heat dissipation function to release heat generated by the sensor 180 to the outside.

[0120] For this purpose, the reinforcing plate 170 can include a metallic substance having a high thermal conductivity. As an example, the reinforcing plate 170 can be SUS. However, the embodiments are not limited thereto. For example, the reinforcing plate 170 can be formed of aluminum or the like having a high thermal conductivity other than SUS. Further, as another example, the reinforcing plate 170 can also include glass epoxy, plastic, synthetic resin, or the like.

[0121] The reinforcing plate 170 can be connected to the ground (not shown) of the circuit board 160. For example, the reinforcing plate 170 can be electrically connected to the ground pattern (not shown) of the circuit board 160. Thereby, the reinforcing plate 170 can also serve as a ground for protecting the camera module from ESD (Electrostatic Discharge Protection).

[0122] Light that has passed through the filter unit 140 can be incident on the sensor 180. The sensor 180 can be a portion where an image including light incident through the filter unit 140 is formed.

[0123] The circuit board 160 can convert an image formed on the sensor 180 into an electrical signal and transmit it to an external device. For this purpose, the circuit board 160 can include various circuit parts, element parts, a control part, and the like. Also, a pattern part electrically connected to the element part and the sensor 180 can be formed on the circuit board 160. The pad 162 can be included as one of the pattern parts. The specific configuration of the circuit board 160 will be described later.

[0124] On the other hand, the sensor 180 can receive an image included in incident light and convert the received image into an electrical signal. As an example, the sensor 180 can be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or the like. However, the embodiments are not limited thereto, and the sensor 180 can also be realized by other elements that perform functions similar to those of the CCD or CMOS.

[0125] The filter unit 140 and the sensor 180 can face each other in the optical axis OA direction.

[0126] On the other hand, the filter unit 140 can include a filter 141 having a blocking member 142 formed on its upper surface. The blocking member 142 can be expressed in place of the "masking part".

[0127] The blocking member 142 can be disposed in an edge region of the upper surface of the filter 141. The blocking member 142 can block a part of the light passing through the lens 110. For example, the blocking member 142 can block the light incident on the edge region of the upper surface of the filter 141 among the light passing through the lens 110. For example, the blocking member 142 can block the light passing through the lens 110 from passing through the edge region of the upper surface of the filter 141. The blocking member 142 can be coupled or attached to the upper surface of the filter 141.

[0128] For example, the filter 141 may have a rectangular planar shape. And the blocking member 142 may be formed symmetrically with the filter 141 along each side of the upper surface of the filter 141. The blocking member 142 may be formed to have a constant width in the edge region of the upper surface of the filter 141.

[0129] The blocking member 142 may be formed of an opaque material. For example, the blocking member 142 may be an adhesive substance of an opaque material applied to the filter 141, but is not limited thereto. For example, the blocking member 142 may be a film of an opaque material adhered to the upper surface of the filter unit 140.

[0130] The filter 141 and the sensor 180 may be arranged to face each other in the optical axis direction. And the blocking member 142 may include at least a part that overlaps the pad 162 and / or the connecting member W arranged on the circuit board 160 in the optical axis direction.

[0131] On the other hand, the connecting member W and the pad 162 may be formed of a conductive material. For example, the connecting member W and the pad 162 may be formed of gold (Au), silver (Ag), copper (Cu), and copper alloys, etc. On the other hand, the conductive material constituting the connecting member W and the pad 162 has the property of reflecting light. Thereby, the light passing through the filter 141 may be reflected by the pad 162 of the circuit board 160 and / or the connecting member W. And an instantaneous flare phenomenon may occur due to the reflected light. And the flare phenomenon can distort the image formed on the sensor 180 or degrade the image quality.

[0132] At this time, a part of the blocking member 142 of the filter unit 140 overlaps with the pad 162 and / or the connecting member W in the optical axis direction. Thereby, among the light that has passed through the lens 110, the light traveling toward the pad 162 and / or the connecting member W of the circuit board 160 can be blocked. In an embodiment, the flare phenomenon can be prevented by blocking the light. Thereby, in the embodiment, it is possible to prevent the image formed on the sensor 180 from being distorted. Further, in the embodiment, the image quality of the image acquired by the sensor 180 can be improved.

[0133] On the other hand, a motion sensor (not shown) may be mounted or disposed on the circuit board 160. The motion sensor may be electrically connected to a control element (not shown) via a pattern portion provided on the circuit board 160.

[0134] The motion sensor can acquire rotational angular velocity information regarding the movement of the camera module 100. The motion sensor may be a two-axis or three-axis gyro sensor. The motion sensor may be an angular velocity sensor. The control element may be mounted or disposed on the circuit board 160.

[0135] The circuit board 160 may be electrically connected to the lens driving device 130. For example, the circuit board 160 may be electrically connected to the driving board of the lens driving device 130.

[0136] For example, the circuit board 160 can supply a driving signal to the first coil and the second coil of the lens driving device 130. Also, the circuit board 160 can supply a driving signal to an AF position sensor (or an OIS position sensor). Also, the circuit board 160 can receive an output signal of the AF position sensor (or the OIS position sensor).

[0137] On the other hand, the camera module 100 includes a connector 190.

[0138] The connector 190 can be disposed on the circuit board 160. For example, the connector 190 can be electrically connected to the circuit board 160. The connector 190 can include a port that is electrically connected to an external device.

[0139] On the other hand, the camera module 100 of the embodiment can include a plurality of adhesive portions disposed between components different from each other. The adhesive portions can provide an adhesive force between components different from each other. For example, the adhesive portions can attach or fix one component to another component.

[0140] For example, the camera module 100 can include an adhesive portion 175 disposed between the lower surface of the sensor 180 and the upper surface of the reinforcement plate 170. The sensor 180 can be attached or fixed onto the reinforcement plate 170 by the adhesive portion 175.

[0141] The reinforcement plate 170 can be divided into a plurality of regions.

[0142] The reinforcement plate 170 can include a first region and a second region. The first region of the reinforcement plate 170 can be a region that overlaps with the cavity C of the sensor 180 and / or the circuit board 160 in the optical axis direction.

[0143] The second region of the reinforcement plate 170 can be a region that does not overlap with the sensor 180 and the cavity C in the optical axis direction.

[0144] And the adhesive portion 175 can be disposed on the first region of the reinforcement plate 170. That is, the first region of the reinforcement plate 170 can be a sensor attachment region where the sensor 180 is attached by the adhesive portion 175. The adhesive portion 175 can be any one of epoxy, thermosetting adhesive, ultraviolet curable adhesive, and adhesive film, but is not limited thereto.

[0145] On the other hand, an adhesive portion 165 may also be disposed on the second region of the reinforcing plate 170. The adhesive portion 165 can attach or fix the reinforcing plate 170 to the circuit board 160. The area of the adhesive portion 165 can correspond to the area of the circuit board 160.

[0146] On the other hand, the circuit board 160 may include an insulating layer 161, pads 162, and a protective layer 163.

[0147] The insulating layer 161 can include a prepreg PPG (prepreg). The prepreg can be formed by impregnating a fiber layer in the form of a fabric sheet such as a glass fabric woven with glass yarns with an epoxy resin or the like and then performing thermocompression bonding. However, the embodiments are not limited thereto, and the prepreg constituting the insulating layer 161 can include a fiber layer in the form of a fabric sheet woven with carbon fiber yarns. The insulating layer 161 can include a resin and reinforcing fibers disposed within the resin. The resin can be, but is not limited to, an epoxy resin. The resin is not particularly limited to an epoxy resin, and for example, it can contain one or more epoxy groups in the molecule, alternatively, it can contain two or more epoxy-based groups, and alternatively, it can contain four or more epoxy-based groups. Further, the resin of the insulating layer 161 may contain a naphthalene group, and for example, it can be an aromatic amine type, but is not limited thereto. For example, the resin can be bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type epoxy resin, alalkyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, epoxy resin of a condensate of phenols and aromatic aldehydes having phenolic hydroxyl groups, biphenylaralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, triglycidyl isocyanurate, rubber-modified type epoxy resin, and phosphorus-based epoxy resin, etc., and can include naphthalene-based epoxy resin, bisphenol A type epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, rubber-modified type epoxy resin, and phosphorus-based epoxy resin.In addition, as the reinforcing fiber, glass fiber, carbon fiber, aramid fiber (e.g., aramid-based organic material), nylon, silica-based inorganic material, or titania-based inorganic material can be used. The reinforcing fibers can be arranged in a form that intersects with each other in the planar direction within the resin.

[0148] On the other hand, glass fiber, carbon fiber, aramid fiber (e.g., aramid-based organic material), nylon, silica-based inorganic material, or titania-based inorganic material can be used.

[0149] A pattern portion can be disposed on the insulating layer 161. For example, the pattern portion can include a pad 162 that is electrically connected to the sensor 180 via a connecting member W. At this time, in the drawing, it is shown that only the pad electrically connected to the sensor 180 is disposed on the insulating layer 161, but it is not limited thereto.

[0150] A protective layer 163 is disposed on the insulating layer 161. The protective layer 163 can be disposed not only on the upper surface of the insulating layer 161 but also on the upper surface of the pattern portion. The protective layer 163 can function to protect the upper surface of the insulating layer 161 and the upper surface of the pattern portion.

[0151] The protective layer 163 can include an open region that vertically overlaps with the upper surface of the pad 162 electrically connected to the sensor 180 among the pattern portions. Then, the pad 162 can be exposed through the open region of the protective layer 163. Thereby, in the embodiment, the upper surface of the exposed pad 162 and the terminal 181 of the sensor 180 can be electrically connected via the connecting member W.

[0152] The protective layer 163 can be a solder resist, but is not limited thereto.

[0153] On the other hand, in the embodiment, an electrical connection is established between the pad 162 of the circuit board 160 and the terminal 181 of the sensor 180 via the connecting member W.

[0154] The upper surface of the sensor 180 or the upper surface of the terminal 181 is positioned lower than the upper surface of the circuit board 160. And the uppermost end of the connecting member W is positioned higher than the upper surface of the circuit board 160. For example, the uppermost end of the connecting member W is positioned higher than the upper surface of the protective layer 163.

[0155] Preferably, the connecting member W can be positioned at a certain protruding height t1 higher than the upper surface of the circuit board 160.

[0156] Thereby, the base 150 of the embodiment provides a seating portion for seating the filter unit 140 in a state separated by the protruding height t1 of the connecting member W. That is, the second portion 151b of the first frame 151 of the base 150 can protrude in a downward direction from the first portion 151a of the first frame 151. And in the embodiment, a certain distance can be maintained between the uppermost end of the connecting member W and the second frame 152 or between the uppermost end of the connecting member W and the filter unit 140 via the second portion 151b of the base 150 along the optical axis. This will be described in more detail below.

[0157] On the other hand, in the embodiment, the lens barrel 120 and the bobbin 132 of the lens driving device 130 can be joined without a screw thread. That is, in the embodiment, due to the requirement for a high-performance camera module, the lens barrel 120 and the bobbin 132 are joined using a screwless coupling method that can minimize the error range of optical axis alignment.

[0158] The screwless coupling method can mean a method of fixing the lens barrel 120 to the bobbin 132 using an adhesive portion 190 with the lens barrel 120 inserted into the hollow portion of the bobbin 132 from above or below.

[0159] That is, an adhesive portion 190 can be disposed between the inner surface of the bobbin 132 and the outer surface of the lens barrel 120. The adhesive portion 190 can firmly fix the lens barrel 120 to the bobbin 132. The adhesive portion 190 can include a thermosetting epoxy or a UV epoxy. When the adhesive portion 190 is realized by a thermosetting epoxy, in an embodiment, the adhesive portion 190 can be cured in an oven, or alternatively, heat can be directly applied to the adhesive portion 190 for curing. Also, when the adhesive portion 190 is realized by a UV epoxy, in an embodiment, the adhesive portion 190 can be cured by applying ultraviolet rays.

[0160] Also, the adhesive portion 190 can be realized by an epoxy in which thermosetting and ultraviolet curing are mixed. For example, the adhesive portion 190 can be an epoxy capable of both thermosetting and ultraviolet curing. On the other hand, the adhesive portion 190 in the embodiment is not limited to an epoxy, and any adhesive substance that can fix the lens barrel 120 to the bobbin 132 can be substituted.

[0161] Hereinafter, the filter module will be specifically described.

[0162] The filter module can include a base 150 and a filter portion 140 coupled to the base 150. For example, the filter module can mean a configuration in which the filter portion 140 is coupled to the base 150.

[0163] FIG. 5 is an exploded perspective view of a filter module according to an embodiment, FIG. 6 is a plan view of the filter module according to the embodiment, FIG. 7 is an exploded perspective view of a base according to the embodiment, FIG. 8 is an enlarged view of a region of the base according to the embodiment, FIG. 9 is a first enlarged view of a partial region of a first frame of the base according to the embodiment, FIG. 10 is a second enlarged view of a partial region of the first frame of the base according to the embodiment, FIG. 11 is a cross-sectional view of the filter module according to the embodiment cut along the A-A' direction, and FIG. 12 is a coupling diagram of the filter module and a circuit board according to the embodiment. And, (a) of FIG. 6 is a plan view of the filter module viewed from above (for example, the position where the lens is disposed), and (b) of FIG. 6 is a plan view of the filter module viewed from below (for example, the position where the sensor is disposed).

[0164] Referring to FIGS. 5 to 12, the filter module includes a filter unit 140 and a base 150 on which the filter unit 140 is seated.

[0165] The filter unit 140 includes a filter 141 and a blocking member 142 disposed on one surface of the filter 141.

[0166] The filter 141 can include an upper surface facing the lens 110 and a lower surface facing the sensor 180.

[0167] And the blocking member 142 can be disposed on the upper surface of the filter 141. The blocking member 142 can be partially disposed on the upper surface of the filter 141. Preferably, the blocking member 142 can be selectively disposed in the edge region of the upper surface of the filter 141. For example, the blocking member 142 can include an opening (not shown) that opens the central region of the upper surface of the filter 141. For example, the blocking member 142 can open the region of the upper surface of the filter 141 that overlaps with the optical axis of the sensor 180. The blocking member 142 can be attached or coupled to the upper surface of the filter 141. The blocking member 142 can be formed by applying an opaque substance to the upper surface of the filter 141. The blocking member 142 can be formed by attaching an opaque film to the upper surface of the filter 141.

[0168] A base 150 is disposed below the filter unit 140. The base 150 includes a seating portion on which the filter unit 140 is disposed or seated.

[0169] Prior to the description of the embodiments of the present application, a comparative example (prior art) will be described as follows. The base in the comparative example is an injection molded article made of resin. That is, the base in the comparative example includes only an insulating material such as resin.

[0170] At this time, the base of the comparative example includes a landing portion such as a window where the filter portion lands, a first protruding portion protruding downward from the lower surface of the landing portion, and a second protruding portion protruding upward from the upper surface of the landing portion. The first protruding portion of the base of the comparative example separates the landing portion of the base and the circuit board at a constant interval. For example, a connecting member (wire) that electrically connects the sensor and the circuit board protrudes by a certain protruding height t1 from the upper surface of the circuit board toward the lens 110. Thereby, the first protruding portion is formed to have a certain thickness so that the filter portion landing on the landing portion does not contact the connecting member. At this time, the protruding height t1 exceeds 150 μm. For example, the protruding height t1 exceeds 170 μm. Thereby, the thickness of the first protruding portion of the base of the comparative example exceeds 150 μm. For example, the thickness of the first protruding portion of the base of the comparative example exceeds 170 μm.

[0171] On the other hand, the landing portion of the base of the comparative example has a certain thickness. At this time, the thickness of the landing portion can be determined by the size of the filter. The thickness of the landing portion of the comparative example is about 180 μm. Recently, the size of the sensor has increased, and thereby the size of the filter has also increased. And if the thickness of the landing portion does not have 180 μm or more, a large-sized filter cannot be stably landed. For example, if the thickness of the landing portion does not have 180 μm or more, the flatness of the filter cannot be maintained (or the warping characteristics are improved). This is because the base of the comparative example is an injection product of an insulating material, and thereby the landing portion is also an injection product formed of an insulating material. Also, if the thickness of the landing portion of the comparative example is less than 180 μm, injection defects such as non-formation of the landing portion may occur in the process of manufacturing the base by injection. Also, if the thickness of the landing portion of the comparative example is less than 180 μm, injection defects such as burs occurring during injection may occur in the process of manufacturing the base by injection. Thereby, the landing portion of the comparative example has a thickness of at least 180 μm.

[0172] On the one hand, the second protrusion of the base in the comparative example has a certain thickness. The thickness of the second protrusion is determined by the injectability of the base manufactured by injection. For example, when the total thickness of the base including the second protrusion becomes thin, the extractability may decrease in the process of extracting the injection product from the injection mold. For example, when the total thickness of the base including the second protrusion becomes thin, deformation may occur in the process of extracting the injection product from the injection mold. Accordingly, the total thickness of the base in the comparative example is 720 μm. For example, when the total thickness of the base is less than 720 μm, injection defects such as a decrease in extractability and deformation may occur. Accordingly, the thickness of the second protrusion is 390 μm.

[0173] As described above, in the comparative example, the base is manufactured using only an insulating material such as resin. Accordingly, in the comparative example, since it is necessary to consider injection defects, there is a limit to reducing the total thickness of the base and the thickness of the window. Furthermore, when using a base injected with an insulating material, it may not be possible to stably mount the further enlarged filter portion. For example, in the comparative example, there is a limit to increasing the width of the base in response to an increase in the size of the sensor and the filter portion.

[0174] On the one hand, in the comparative example, the FBL corresponding to the optical axis distance between the sensor and the lens increases due to the thickness of each part of the base as described above. For example, in the comparative example, due to the limit of the minimum thickness of the first protrusion, the mounting portion, and the second protrusion, the FBL (Flange Back Length) has a minimum level of 1.1.

[0175] At this time, since the thickness of the first protrusion in the comparative example is determined by the protruding height t1 of the connecting member, it may be difficult to reduce this. However, the thickness of the mounting portion and the thickness of the second protrusion (for example, the total thickness of the base) can be reduced under conditions for improving injection defects and the warping characteristics of the filter.

[0176] Thus, in the embodiment, different from the comparative example, through the change of the material constituting the base 150, the thickness of the landing portion, the thickness of the second protrusion, and further the total thickness of the base can be reduced. Through this, in the embodiment, the FBL (Flange Back Length) can be reduced compared to the comparative example.

[0177] For this purpose, although briefly described above, the base 150 is formed of a plurality of materials.

[0178] Specifically, the base 150 includes a first frame 151 and a second frame 152. The first frame 151 can be formed of the same material as the base in the comparative example. For example, the first frame 151 can be formed of an insulating material.

[0179] The second frame 152 includes a material different from that of the first frame 151 and the base in the comparative example. Preferably, the second frame 152 includes a metallic material. The second frame 152 can maintain the flatness of the filter unit 140 attached to the base 150 while ensuring the rigidity of the base 150. For this purpose, the second frame 152 can be formed of a metallic material having a certain rigidity.

[0180] At this time, the first frame 151 and the second frame 152 are not joined in a state of being manufactured separately through different processes, but can be integrally manufactured through double injection or insert injection.

[0181] Briefly explaining this manufacturing method, in the embodiment, the second frame 152 is disposed in an injection mold. And in the embodiment, with the second frame 152 disposed, an insulating material can be injected above and below the second frame 152 respectively to form a first frame 151 covering the second frame 152. Thereby, the second frame 152 can be inserted into the first frame 151.

[0182] At this time, the second frame 152 can perform the functions of the base landing portion of the comparative example. That is, in the embodiment, the landing portion on which the filter portion 140 lands is formed of a metallic substance. Thereby, in the embodiment, the thickness of the landing portion can be reduced as compared with the comparative example. For example, the thickness of the second frame 152 in the embodiment may be smaller than the thickness of the landing portion of the comparative example. Further, in the embodiment, the application of the second frame 152 can cope with an increase in the size of the filter.

[0183] Specifically describing the structures of the first frame 151 and the second frame 152, it is as follows. Hereinafter, the structures of the respective frames will be described in a state where the second frame 152 is separated from the first frame 151.

[0184] The first frame 151 is formed of an insulating material. The first frame 151 can have a planar shape corresponding to the shape of the filter portion 140. For example, the planar shape of the first frame 151 can have a square ring shape, but is not limited thereto. For example, it can also have a circular ring shape corresponding to the shape of the lens 110.

[0185] The first frame 151 can be divided into a plurality of portions in the optical axis direction. For example, the first frame 151 can include a first portion 151a and a second portion 151b in the optical axis direction.

[0186] The first part 151a can mean a part located adjacent to the lens 110 in the first frame 151. And the second part 151b can mean a part located adjacent to the sensor 180 in the first frame 151. For example, the first part 151a can also be said to be a first - 1 frame covering the upper part of the second frame 152. For example, the second part 151b can also be said to be a first - 2 frame covering the lower part of the second frame 152. Also, the second part 151b can be said to be a protruding part protruding in the downward direction from the first part 151a. Also, the second part 151b can be said to be a separating part that separates the second frame 152 from the circuit board 160 in the upward direction corresponding to the protruding height t1 of the connecting member W.

[0187] Also, the second part 151b can be said to be a receiving part or a pocket part in which the protruding part of the connecting member W is received. Thereby, the thickness of the second part 151b can correspond to the protruding height t1 of the connecting member W. For example, the thickness T2 of the second part 151b can satisfy the range of 150μm to 250μm. If the thickness T2 of the second part 151b is less than 150μm, problems of physical or electrical reliability may occur in the operating environment of the camera module. For example, if the thickness T2 of the second part 151b is less than 150μm, a problem may occur that the filter part 140 disposed on the second frame 152 contacts the connecting member W. And when the filter part 140 contacts the connecting member W, an electrical disconnection may occur between the sensor 180 and the circuit board 160. Also, if the thickness T2 of the second part 151b exceeds 250μm, the total thickness T1 of the base 150 can increase by the thickness of the second part 151b. And when the total thickness T1 of the base 150 increases, the FBL (Flange Back Length) of the camera module according to the embodiment can increase.

[0188] The first portion 151a of the first frame 151 is located on the second portion 151b. The first portion 151a of the first frame 151 can protect the filter portion 140 that is seated on the second frame 152. For example, the first portion 151a of the first frame 151 can protrude with a certain height from the upper surface of the second frame 152. The first portion 151a of the first frame 151 can be disposed to surround the periphery of the filter portion 140 that is seated on the second frame 152. For example, the first portion 151a of the first frame 151 can be disposed to surround the side surface of the second frame 152 at a position spaced apart from the side surface of the second frame 152 by a certain distance.

[0189] On the other hand, the second portion 151b can be formed to have a certain width on the lower surface of the first portion 151a. For example, the width of the second portion 151b can be in the range of 350 μm to 700 μm. When the width of the second portion 151b is less than 350 μm, the rigidity of the base 150 may become weak. When the width of the second portion 151b is less than 350 μm, the injectability may decrease. For example, when the width of the second portion 151b is less than 350 μm, there may be an open region where an insulating material is not filled in at least a part of the second portion 151b in the injection process. When the width of the second portion 151b exceeds 700 μm, the area of the base 150 can increase by the width of the second portion 151b. As a result, the volume of the camera module may increase. Thus, in the embodiment, the width of the second portion 151b is set to have 350 μm to 700 μm.

[0190] On the one hand, the first frame 151 may include a first opening 151-1. The first opening 151-1 of the first frame 151 may overlap with the filter unit 140 on the optical axis. At this time, the first opening 151-1 of the first frame 151 may have an area larger than the area of the filter unit 140. For example, the first opening 151-1 of the first frame 151 may include a first region that overlaps with the filter unit 140 on the optical axis. For example, the first opening 151-1 of the first frame 151 may include a second region that does not overlap with the filter unit 140 on the optical axis but overlaps with the second frame 152 on the optical axis.

[0191] The first frame 151 may include a housing portion 151-4. The housing portion 151-4 may be formed in an outward direction from the inner surface of the first opening 151-1 of the first frame 151. The housing portion 151-4 may be formed between the first portion 151a and the second portion 151b of the first frame 151. The housing portion 151-4 can be said to be an insertion groove or an insertion hole into which the second frame 152 is inserted.

[0192] The housing portion 151-4 may be divided into a plurality of parts. For example, the housing portion 151-4 may include a groove-shaped recess portion 151-4a that is recessed in an outward direction from the inner surface of the first frame 151. And at least a part of the second frame 152 may be inserted into the recess portion 151-4a of the housing portion 151-4 of the first frame 151.

[0193] Further, the accommodating portion 151-4 may include a hole portion 151-4b connected to the recess portion 151-4a. The hole portion 151-4b may have a hole shape penetrating the inner surface and the outer surface of the first frame 151. At least a part of the second frame 152 is disposed in the hole portion 151-4b of the accommodating portion 151-4. Thereby, at least a part of the second frame 152 may be exposed toward the outer surface of the first frame 151. The hole portion 151-4b may be formed in the process of manufacturing the base 150 including the first frame 151 and the second frame 152 through double injection or insert injection. For example, in an embodiment, a plurality of bases can be manufactured simultaneously. For example, in an embodiment, in a state where a plurality of second frames connected to each other are prepared, a step of injecting an insulating substance and injecting the first frame can be performed. And the hole portion 151-4b may be a portion where the second frames of different bases are connected to each other in the injection process. And the hole portion 151-4b may be a hole for separating (for example, cutting) the second frames of different bases from each other after the injection process is completed.

[0194] The first frame 151 includes a partition portion 151-5. The partition portion 151-5 may be formed in the accommodating portion 151-4 of the first frame 151. For example, the partition portion 151-5 may be disposed between the upper surface and the lower surface of the accommodating portion 151-4 of the first frame 151. The partition portion 151-5 can partition the accommodating portion 151-4 of the first frame 151 into a plurality of regions. The partition portion 151-5 can function to improve the rigidity of the first frame 151. Further, the partition portion 151-5 can improve the bonding strength between the first frame 151 and the second frame 152. For example, at least a part of the partition portion 151-5 can penetrate the second frame 152. And at least a part of the second frame 152 can be coupled to the partition portion 151-5. Through this, the bonding strength by injection of the first frame 151 and the second frame 152 can be increased.

[0195] The first frame 151 may include a through hole 151-2. The through hole 151-2 may penetrate the upper and lower surfaces of the first frame 151. For example, the through hole 151-2 may penetrate the first portion 151a and the second portion 151b of the first frame 151. For example, the through hole 151-2 may communicate with the accommodating portion 151-4 of the first frame 151. The through hole 151-2 may be an air vent hole for enhancing reliability in the injection process or the bonding process. For example, the through hole 151-2 can remove gas in the injection process of manufacturing the base 150 including the first frame 151 and the second frame 152. Thereby, in the embodiment, the injectability and extractability of the base 150 can be improved. Also, the through hole 151-2 can remove gas at the stage of adhering or fixing the base 150 onto the circuit board 160. Thereby, in the embodiment, the bonding property between the circuit board 160 and the base 150 can be improved.

[0196] The first frame 151 may include a recess 151-3. The recess 151-3 may be formed in the first portion 151a of the first frame 151. For example, the recess 151-3 can also be said to be a through hole penetrating the first portion 151a of the first frame 151. The recess 151-3 is formed in the first portion 151a of the first frame 151 and is not formed in the second portion 151b. The recess 151-3 may be an injection hole for injecting an insulating material in the insert injection or double injection process. Also, the recess 151-3 can also function as a gas cylinder and a hole for removing gas in the insert injection or double injection process. Also, the recess 151-3 may communicate with the accommodating portion 151-4. Thereby, at least a part of the second frame 152 inserted into the accommodating portion 151-4 may be exposed above the base 150 through the recess 151-3.

[0197] The second frame 152 is accommodated within the accommodation portion 151-4 of the first frame 151. For example, the second frame 152 may be double-shot or insert-shot so as to be accommodated in the accommodation portion 151-4 of the first frame 151.

[0198] The second frame 152 can have a shape corresponding to that of the first frame 151. For example, the second frame 152 can correspond to the planar shape of the first frame 151. For example, the planar shape of the second frame 152 can be a quadrilateral shape. However, the embodiment is not limited thereto, and the planar shape of the second frame 152 can also have a circular shape or the like.

[0199] The second frame 152 can include a second opening 152-1. The second opening 152-1 can overlap with the first opening 151-1 of the first frame 151 on the optical axis. The second opening 152-1 can overlap with the lens 110 on the optical axis. The second opening 152-1 can overlap with the sensor 180 on the optical axis. The second opening 151-1 can overlap with the filter portion 140 on the optical axis.

[0200] At this time, the area of the second opening 152-1 of the second frame 152 may be smaller than the area of the first opening 151-1 of the first frame 151. Also, the area of the second opening 152-1 of the second frame 152 may be smaller than the area of the filter portion 140. Thereby, a part of the filter portion 140 can overlap with the second opening 152-1 of the second frame 152 on the optical axis. Also, the remaining part of the filter portion 140 can overlap with the second frame 152 on the optical axis. That is, the filter 141 of the filter portion 140 can be in a state of being seated on the upper surface of the second frame 152, and at least a part thereof can overlap with the second opening 152-1 of the second frame 152 on the optical axis.

[0201] The second frame 152 can include a plurality of through holes.

[0202] For example, the second frame 152 may include a first through hole 152-2 and a second through hole 152-3.

[0203] The first through hole 152-2 and the second through hole 152-3 of the second frame 152 can penetrate the upper and lower surfaces of the second frame 152.

[0204] At this time, the first through hole 152-2 and the second through hole 152-3 can have different shapes or opening areas from each other.

[0205] For example, the first through hole 152-2 may not be connected to the outer surface of the second frame 152. As a result, the first through hole 152-2 can penetrate the second frame 152 at a position spaced apart from the outer surface of the second frame 152 by a certain distance.

[0206] The second through hole 152-3 can be connected to the outer surface of the second frame 152. For example, the second through hole 152-3 can also be said to be a recessed portion that recesses from the outer surface of the second frame 152 in the inner direction.

[0207] Either one of the first through hole 152-2 and the second through hole 152-3 can overlap with the through hole 151-2 of the first frame 151 on the optical axis. As a result, at least one of the first through hole 152-2 and the second through hole 152-3 of the second frame 152 can function as an air passage hole through which air passes.

[0208] Also, the other one of the first through hole 152-2 and the second through hole 152-3 can be a hole through which the partition portion 151-5 of the first frame 151 passes. For example, the partition portion 151-5 of the first frame 151 can penetrate either one of the first through hole 152-2 and the second through hole 152-3 of the second frame 152.

[0209] On the one hand, the embodiments are not limited thereto. At least one of the first through holes 152-2 may overlap with the through hole 151-2 of the first frame 151 on the optical axis. At least one of the other first through holes 152-2 may overlap with the partition portion 151-5 on the optical axis. Correspondingly, at least one of the second through holes 152-3 overlaps with the through hole 151-2 of the first frame 151 on the optical axis, and at least one of the other second through holes 152-3 may overlap with the partition portion 151-5 on the optical axis.

[0210] The second frame 152 can have a certain thickness T3. For example, the second frame 152 can have a thickness that can maintain the flatness of the filter portion 140 while stably fixing the filter portion 140.

[0211] At this time, the fixing portion of the comparative example was formed of an injection of an insulating material. As a result, the thickness of the fixing portion of the comparative example exceeded 180 μm.

[0212] In contrast, in the embodiment, double injection or insert injection is used so that the fixing portion where the filter portion 140 is fixed is formed of a metal material. As a result, in the embodiment, the thickness of the second frame 152 corresponding to the fixing portion can be reduced compared to the comparative example. For example, the thickness T3 of the second frame 152 in the embodiment can be 160 μm or less. For example, the thickness T3 of the second frame 152 in the embodiment can be 150 μm or less. For example, the thickness T3 of the second frame 152 in the embodiment can be 140 μm or less. For example, the thickness T3 of the second frame 152 in the embodiment can be 130 μm or less. For example, the thickness T3 of the second frame 152 in the embodiment can be 120 μm or less. For example, the thickness T3 of the second frame 152 in the embodiment can be 110 μm or less.

[0213] Preferably, the thickness T3 of the second frame 152 in the embodiment can satisfy the range of 95 μm to 160 μm. For example, the thickness T3 of the second frame 152 in the embodiment can satisfy the range of 98 μm to 155 μm. For example, the thickness T3 of the second frame 152 in the embodiment can satisfy the range of 100 μm to 150 μm.

[0214] If the thickness T3 of the second frame 152 is less than 95 μm, the rigidity of the base 150 may become weak. Also, if the thickness T3 of the second frame 152 is less than 95 μm, due to the decrease in the total thickness T1 of the first frame 151, the injectability or extractability in the injection process may decrease. Further, if the thickness T3 of the second frame 152 is less than 95 μm, the flatness of the filter portion 140 seated on the second frame 152 may decrease.

[0215] Also, if the thickness T3 of the second frame 152 exceeds 160 μm, the FBL (Flange Back Length) can increase corresponding to the increase in the thickness of the second frame 152.

[0216] On the other hand, in the embodiment, by injecting the base 150 so as to have a structure including the second frame 152, the total thickness T1 of the base 150 can be reduced compared to the comparative example.

[0217] For example, in the embodiment, the thickness of the first portion 151a of the first frame 151 corresponding to the second protrusion of the comparative example can be reduced. That is, in the embodiment, by performing the injection process with the second frame 152 inserted, even if the thickness of the first frame 151 is reduced compared to the comparative example, no problems occur in injectability and extractability. Thereby, in the embodiment, the thickness of the first frame 151, specifically the thickness of the first portion 151a of the first frame 151, can be clearly reduced.

[0218] As a result, the total thickness T1 of the base 150 in the embodiment can have a range of 350 μm to 550 μm. That is, the total thickness of the base in the comparative example was about 720 μm. And in the embodiment, the total thickness T1 of the base 150 can be reduced to the level of 48% to 76% of the thickness of the base in the comparative example. Thereby, in the embodiment, the FBL (Flange Back Length) can be lowered. Also, in the embodiment, the total thickness or volume of the camera module can be reduced.

[0219] Specifically, when applying the base 150 including the first frame 151 and the second frame 152 in the embodiment, the FBL (Flange Back Length) can be lowered to the level of 0.95.

[0220] On the other hand, the second frame 152 can include a coating layer (not shown). For example, the second frame 152 is formed of a metallic substance. Also, at least a part of the second frame 152 may not overlap with the blocking member 142 of the filter unit 140 on the optical axis. As a result, there may occur a problem that the light passing through the lens 110 and the filter unit 140 is reflected by the second frame 152. And when the light is reflected by the second frame 152, a flare phenomenon may occur. Thereby, the second frame 152 includes a coating layer to prevent the reflection of the light. For example, the second frame 152 can include a blackening coating layer, but is not limited thereto. For example, the substance applied to the coating layer of the second frame 152 can include all substances having the property of suppressing the reflection of light.

[0221] On the other hand, the second frame 152 includes a metallic substance, which can affect the operation of the lens driving device of the embodiment. For example, the second frame 152 can generate magnetic interference. For example, the second frame 152 can interfere with the interaction between the coil and the magnet of the lens driving device.

[0222] Accordingly, the second frame 152 in the embodiment can be formed of a non-magnetic metal material. However, the embodiment is not limited thereto, and the second frame 152 can also be formed of a metal material having a magnetic property with a value that does not generate the magnetic interference.

[0223] The camera module of the embodiment includes a base on which the filter unit is seated. At this time, the base includes a plurality of frames made of different materials from each other. For example, the base includes a first frame of a first material and a second frame of a second material. At this time, the first material includes an insulating material. And the second material includes a metal material different from the first material. The second frame functions as a seating portion on the base where the filter unit is seated. Accordingly, in the embodiment, since the seating portion on which the filter unit is seated is made of a metal material, the filter unit can be stably seated on the base. Also, in the embodiment, the flatness of the filter unit seated on the base can be improved.

[0224] On the other hand, in response to the requirement for high resolution, the size of the sensor increases, and correspondingly, the size of the filter unit also increases. At this time, there is a limit to the size of the filter unit that can be seated on the seating portion injection-molded with the insulating material of the comparative example. Different from this, in the embodiment, the second frame corresponding to the seating portion is formed of a metal material. Accordingly, in the embodiment, a base capable of corresponding to an increase in the size of the filter unit can be provided. Further, in the embodiment, the size of the filter unit that can be seated can be increased while maintaining the flatness of the filter unit as compared with the comparative example.

[0225] In addition, in the embodiment, the thickness of the second frame can be reduced compared to the comparative example. Specifically, in the comparative example, since it is necessary to consider the problem of non-formation in the injection process, the landing portion should have a certain thickness or more. In contrast, in the embodiment, it is not necessary to consider the problem of non-formation of the second frame corresponding to the landing portion. As a result, in the embodiment, the thickness of the second frame corresponding to the landing portion can be reduced compared to the comparative example. That is, in the embodiment, the thickness of the second frame can be reduced under the condition of maintaining the flatness of the filter portion. Thereby, in the embodiment, corresponding to the reduction in the thickness of the second frame, the FBL (Flange Back Length) can be reduced. Thereby, in the embodiment, the overall thickness or volume of the camera module can be reduced.

[0226] Furthermore, in the embodiment, the first frame is injected with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced. For example, in the comparative example, problems of injectability and extractability must be considered. As a result, in the comparative example, there is a limit to the reduction in the total thickness of the base. In contrast, in the embodiment, injection is performed with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced compared to the comparative example. Thereby, in the embodiment, the FBL (Flange Back Length) can be reduced. Also, the embodiment can reduce the overall thickness or volume of the camera module.

[0227] On the other hand, the second frame in the embodiment includes a blackened coating layer. The coating layer prevents light that has passed through the lens and the filter from being reflected through the second frame. Thereby, in the embodiment, the image quality of the camera module can be improved.

[0228] FIG. 13 shows a perspective view of the mobile terminal 200A according to the embodiment, and FIG. 14 shows a configuration diagram of the mobile terminal shown in FIG. 13.

[0229] Referring to FIGS. 13 and 14, the mobile terminal 200A (hereinafter referred to as the "terminal") can include a body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

[0230] The body 850 shown in FIG. 13 is in the form of a bar, but is not limited thereto, and may have various structures such as a slide type, a folder type, a swing type, a swirl type, etc., in which two or more sub-bodies are coupled to be relatively movable.

[0231] The body 850 can include a case (such as a casing, a housing, a cover, etc.) that forms the appearance. For example, the body 850 can be divided into a front case 851 and a rear case 852. Various electronic components of the terminal can be installed in the space formed between the front case 851 and the rear case 852.

[0232] The wireless communication unit 710 can be configured to include one or more modules that enable wireless communication between the terminal 200A and a wireless communication system, or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 can be configured to include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-range communication module 714, and a location information module 715.

[0233] The A / V (Audio / Video) input unit 720 is for input of an audio signal or a video signal, and can include a camera 721, a microphone 722, etc.

[0234] The camera 721 can include the camera module according to the embodiment shown in FIG. 1.

[0235] The sensing unit 740 can sense the current state of the terminal device 200A, such as the open / closed state of the terminal device 200A, the position of the terminal device 200A, the presence or absence of user contact, the orientation of the terminal device 200A, the acceleration / deceleration of the terminal device 200A, etc., and generate a sensing signal for controlling the operation of the terminal device 200A. For example, when the terminal device 200A is in the form of a slide phone, it can sense whether the slide phone can be opened or closed. Also, it undertakes a sensing function related to the presence or absence of power supply from the power supply unit 790, the availability of external device connection of the interface unit 770, etc.

[0236] The input / output unit 750 is for generating input or output related to vision, audition, or touch, etc. The input / output unit 750 can generate input data for controlling the operation of the terminal device 200A, and can also display the information processed by the terminal device 200A.

[0237] The input / output unit 750 can include a keypad unit 730, a display module 751, an acoustic output module 752, and a touch screen panel 753. The keypad unit 730 can generate input data by keypad input.

[0238] The display module 751 can include a plurality of pixels whose colors change by an electrical signal. For example, the display module 751 can include at least one of a liquid crystal display, a thin film transistor - liquid crystal display, an organic light - emitting diode, a flexible display, and a 3D display.

[0239] The audio output module 752 can output the audio data received from the wireless communication unit 710 in a call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, etc., or output the audio data stored in the memory unit 760.

[0240] The touch screen panel 753 can convert the change in capacitance generated due to the user's touch on a specific area of the touch screen into an electrical input signal.

[0241] The memory unit 760 may store a program for the processing and control of the control unit 780, and can temporarily store the input / output data (for example, phone book, message, audio, still image, photo, video, etc.). For example, the memory unit 760 can store an image captured by the camera 721, such as a photo or a video.

[0242] The interface unit 770 serves as a connection path to an external device connected to the terminal 200A. The interface unit 770 receives data transmission from the external device, receives power supply and transmits it to each component inside the terminal 200A, or enables the data inside the terminal 200A to be transmitted to the external device. For example, the interface unit 770 can include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and a headphone port, etc.

[0243] The control unit 780 can control the overall operation of the terminal 200A. For example, the control unit 780 can perform related control and processing for voice calls, data communications, video calls, etc.

[0244] The control unit 780 can include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

[0245] The control unit 780 can perform pattern recognition processing to recognize handwritten input or drawing input performed on the touch screen as characters and images, respectively.

[0246] The power supply unit 790 can be applied with an external power supply or an internal power supply under the control of the control unit 780 and supply the power necessary for the operation of each component.

[0247] The camera module of the embodiment includes a base on which the filter unit is seated. At this time, the base includes a plurality of frames made of different substances. For example, the base includes a first frame of a first substance and a second frame of a second substance. At this time, the first substance includes an insulating substance. And the second substance includes a metallic substance different from the first substance. The second frame functions as a seating portion on the base where the filter unit is seated. Thereby, in the embodiment, since the seating portion where the filter unit is seated is made of a metallic substance, the filter unit can be stably seated on the base. Also, in the embodiment, the flatness of the filter unit seated on the base can be improved.

[0248] On the other hand, in response to the requirement for high resolution, the size of the sensor increases, and correspondingly, the size of the filter unit also increases. At this time, there is a limit to the size of the filter unit that can be seated on the seating portion injection-molded with an insulating substance in the comparative example. In contrast, in the embodiment, the second frame corresponding to the seating portion is formed of a metallic substance. Thereby, in the embodiment, a base capable of corresponding to an increase in the size of the filter unit can be provided. Further, in the embodiment, the size of the filter unit that can be seated can be increased while maintaining the flatness of the filter unit as compared with the comparative example.

[0249] Also, in the embodiment, the thickness of the second frame can be reduced compared to the comparative example. Specifically, in the comparative example, since it is necessary to consider the problem of non-formed parts in the injection process, the landing part must have a certain thickness or more. In contrast, in the embodiment, it is not necessary to consider the problem of non-formed parts of the second frame corresponding to the landing part. As a result, in the embodiment, the thickness of the second frame corresponding to the landing part can be reduced compared to the comparative example. That is, in the embodiment, the thickness of the second frame can be reduced under the condition of maintaining the flatness of the filter part. Thereby, in the embodiment, corresponding to the reduction in the thickness of the second frame, the FBL (Flange Back Length) can be reduced. Thereby, in the embodiment, the overall thickness or volume of the camera module can be reduced.

[0250] Furthermore, in the embodiment, the first frame is injected with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced. For example, in the comparative example, problems of injectability and extractability must be considered. As a result, in the comparative example, there is a limit to the reduction in the total thickness of the base. In contrast, in the embodiment, injection is performed with the second frame inserted. Thereby, in the embodiment, the thickness of the first frame and the total thickness of the base corresponding thereto can be reduced compared to the comparative example. Thereby, in the embodiment, the FBL (Flange Back Length) can be reduced. Also, the embodiment can reduce the overall thickness or volume of the camera module.

[0251] On the other hand, the second frame in the embodiment includes a blackened coating layer. The coating layer prevents light that has passed through the lens and the filter from being reflected through the second frame. Thereby, in the embodiment, the image quality of the camera module can be improved.

[0252] In addition, the second frame in the embodiment is formed of a non-magnetic material. Thereby, in the embodiment, the problem that the operating characteristics of the sensor driving device are degraded by the second frame can be solved. For example, when the second frame is made of a magnetic material, magnetic interference may occur in the interaction between the coil and the magnet of the sensor driving device. And the operating characteristics of the sensor driving device may be degraded due to the magnetic interference. In contrast, the second frame in the embodiment contains a non-magnetic material. Thereby, in the embodiment, the flatness maintenance of the filter unit and the FBL reduction effect can be achieved without affecting the operating characteristics of the sensor driving device.

[0253] As described above, the features, structures, effects, etc. described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented for other embodiments by those having ordinary knowledge in the field to which the embodiments belong. Therefore, the content related to such combinations and modifications should be construed as being included in the scope of the embodiments.

Claims

1. A base and a filter unit disposed on the base, comprising: The base includes a first frame containing an insulating material, and a second frame inserted into the first frame and containing a metallic material, The filter unit is a camera module disposed on the second frame of the base.

2. The camera module according to claim 1, wherein the second frame is coupled to the first frame by an insert injection method.

3. The camera module according to claim 1, wherein the first frame includes a first opening, the second frame includes a second opening overlapping the first opening on the optical axis, and the second frame is inserted into an inner surface of the first opening of the first frame.

4. The camera module according to claim 3, wherein an area of the second opening is smaller than an area of the first opening and an area of the filter unit.

5. The first frame includes a receiving portion into which the second frame is inserted, The receiving portion includes a recess portion formed in an outward direction from an inner surface of the first frame, and a hole portion penetrating through inner and outer surfaces of the first frame, the camera module according to claim 3.

6. The first frame includes a partition portion partitioning the receiving portion into a plurality of regions, The camera module according to claim 5, wherein the partition portion penetrates through the second frame inserted into the receiving portion.

7. A reinforcing plate, a circuit board disposed on the reinforcing plate and including a cavity, a sensor disposed on an upper surface of the reinforcing plate vertically overlapping the cavity of the circuit board and positioned within the cavity of the circuit board, and a connecting member connecting between a terminal of the sensor and a pad of the circuit board, further comprising: The camera module according to any one of claims 1 to 6, wherein a top end of the connecting member is positioned higher than an upper surface of the circuit board.

8. The first frame includes a first portion positioned above the second frame and a second portion positioned below the second frame based on a position where the second frame is inserted, The camera module according to claim 7, wherein the second frame is spaced apart from a top end of the connecting member in an optical axis direction by the second portion of the first frame.

9. The camera module according to claim 8, wherein a thickness of the second portion of the first frame satisfies a range of 150 μm to 250 μm.

10. The camera module according to any one of claims 1 to 6, wherein the base includes a through hole that penetrates the first frame and the second frame.

Images