Cable Assembly, Circuit Board, Connection Structure, and Electronic Device

The cable assembly with elastically deformable connection portions addresses heat dissipation and impedance issues in high-speed systems by allowing direct connection to the circuit board without sockets, improving signal transmission and maintenance efficiency.

JP2025520554APending Publication Date: 2025-07-03ZTE CORP
View PDF 8 Cites 0 Cited by

Patent Information

Application Number
JP2024573975
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-06-29
Filing Date
2023-02-06
Publication Date
2025-07-03

AI Technical Summary

Technical Problem

Current cable assemblies in high-speed systems face issues with increased circuit board losses, heat dissipation limitations, and impedance discontinuities due to sockets, which also complicate maintenance and reprocessing.

Method used

A cable assembly design featuring elastically deformable connection portions that allow direct connection to a circuit board without sockets, reducing impedance discontinuities and enabling easy removal for maintenance.

Benefits of technology

Improves signal transmission bandwidth and facilitates cost-effective maintenance by eliminating the need for sockets, enhancing heat dissipation and simplifying cable assembly detachment from the circuit board.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025520554000001_ABST
    Figure 2025520554000001_ABST
Patent Text Reader

Abstract

The present application provides a cable assembly, a circuit board, a connection structure, and an electronic device. The cable assembly (100) includes a cable (110), a first connection member, and a second connection member. The cable (110) includes a signal line (101) and a shield layer (102). The first connection member includes a first connection portion (121) and a second connection portion (122). The first connection portion (121) is connected to the signal line (101). The second connection portion (122) may be configured to be elastically connected to a circuit board (200) provided with a first conductive interface (210). The second connection member includes a third connection portion (131) and a fourth connection portion (132). The third connection portion (131) is connected to the shield layer (102). Both the second connection portion (122) and the fourth connection portion (132) are elastically deformable. The fourth connection portion (132) may be configured to be elastically connected to a circuit board (200) provided with a second conductive interface (220).
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application is filed based on a Chinese patent application with application number 202210747601.3 and filing date of June 29, 2022, and claims the priority of the Chinese patent application. All the contents of the Chinese patent application are incorporated herein by reference.

[0002] This application relates to the technical field of electronics, and in particular, to cable assemblies, circuit boards, connection structures, and electronic devices.

Background Art

[0003] Currently, most cable assemblies adopt a structure combining a socket and a cable. However, in future 112G / 224G systems, the losses of the circuit board continue to increase, and the socket itself has a certain height, so it is not suitable for the heat dissipation of the system. In addition, when a socket is installed in the cable assembly, the end of the cable is connected to the socket, and then the socket is connected to the circuit board, the contact surface increases, so the impedance discontinuity points increase, and the bandwidth of signal transmission is limited. In the related art, the cable is directly connected to the printed circuit board (PCB) through a fish-eye structure to reduce the usage amount of the socket. However, since the cable is directly connected to the PCB through the fish-eye structure, the device with the fish-eye structure cannot be removed from the PCB, increasing the costs of maintenance and reprocessing.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of this application provide a cable assembly, a circuit board, a connection structure, and an electronic device.

Means for Solving the Problems

[0005] In a first aspect, embodiments of this application are A cable including a signal line and a shield layer, A first connection member including a first connection portion and a second connection portion, the first connection portion being connected to the signal line, the second connection portion being elastically deformable, and the second connection portion being configured to be elastically connected to a circuit board provided with a first conductive interface, A second connection member including a third connection portion and a fourth connection portion, the third connection portion being connected to the shield layer, the fourth connection portion being elastically deformable, and the fourth connection portion being configured to be elastically connected to the circuit board provided with a second conductive interface, and providing a cable assembly.

[0006] In a second aspect, an embodiment of the present application is, A first conductive interface configured to be connected to the cable assembly described in the first aspect, A second conductive interface configured to be connected to the cable assembly, and providing a circuit board.

[0007] In a third aspect, an embodiment of the present application also includes, A cable, a first connection member, and a second connection member, the cable including a signal line and a shield layer, the first connection member including a first connection portion and a second connection portion, the first connection portion being connected to the signal line, the second connection portion being elastically deformable, the second connection member including a third connection portion and a fourth connection portion, the third connection portion being connected to the shield layer, the fourth connection portion being elastically deformable, and a cable assembly, A circuit board including a first conductive interface and a second conductive interface, The first conductive interface is elastically connected to the second connection portion, and the second conductive interface is elastically connected to the fourth connection portion, providing a connection structure.

[0008] In a fourth aspect, an embodiment of the present application also includes, Provided is an electronic device including the cable assembly according to the first aspect, or the circuit board according to the second aspect, or the connection structure according to the third aspect.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Modes for Carrying Out the Invention

[0010] To make the objectives, technical solutions, and advantages of this application more explicit, the following will further elaborate on this application in greater detail with reference to the drawings and embodiments. The specific embodiments described in this specification are for the purpose of explaining this application and not for limiting it.

[0011] Although a logical order is shown in the flowchart, in some cases, the steps illustrated or described in an order different from the flowchart may be executed. In this specification, the claims, and the description of the above drawings, the meaning of a plurality (or multiple items) is two or more. Understand that "greater than", "less than", "exceeding", etc. do not include the number, and "greater than or equal to", "less than or equal to", "within", etc. include the number. When there are descriptions such as "first", "second", etc., it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance, or implying the number of technical features shown, or implying the precedence relationship of the technical features shown.

[0012] This application provides a cable assembly, a circuit board, a connection structure, and an electronic device. By providing an elastically deformable second connection portion on the first connection member and an elastically deformable fourth connection portion on the second connection member, after the second connection portion is elastically connected to the first conductive interface of the circuit board and the fourth connection portion is elastically connected to the second conductive interface of the circuit board, the cable assembly can be removed from the circuit board, reducing the costs of maintenance and reprocessing. Also, the first connection member and the second connection member may be directly connected to the circuit board, eliminating the need to provide a socket on the cable assembly, thereby reducing the height of the cable assembly, which is beneficial for the heat dissipation of the system, and reducing the impedance discontinuities caused by the circuit board and the socket and the impedance discontinuities caused by the socket and the cable assembly, thereby improving the signal transmission bandwidth.

[0013] As shown in FIG. 1, currently, most cable assemblies 100 adopt a structure combining a socket 600 and a cable 110. That is, the socket 600 is installed on the cable assembly 100, the end of the cable 110 is connected to the socket 600, and when the socket 600 is connected to the circuit board 200, the contact surface increases, so the impedance discontinuity points increase and the signal transmission bandwidth is limited. For this reason, in the related art, the cable 100 is directly connected to a printed circuit board (PCB) through a fish-eye structure to reduce the use of the socket 600. However, since the cable 100 is directly connected to the PCB through the fish-eye structure, the device having the fish-eye structure cannot be removed from the PCB, increasing the maintenance and reprocessing costs.

[0014] Based on the above analysis, the embodiments of the present application will be further described below with reference to the drawings.

[0015] Referring to FIG. 2, FIG. 2 is a schematic structural diagram of a cable assembly according to an embodiment of the present application. To facilitate the description of the structural principle of the cable assembly, in FIG. 2, it will be described in combination with the circuit board 200. The cable assembly 100 includes a cable 110, a first connection member (not shown), and a second connection member (not shown). Among these, the cable 110 includes a signal line 101 and a shield layer 102. The first connection member includes a first connection portion 121 and a second connection portion 122. The first connection portion 121 is connected to the signal line 101. The second connection portion 122 is elastically deformable, and the second connection portion 122 may be configured to be elastically connected to the circuit board 200 provided with the first conductive interface 210. The second connection member includes a third connection portion 131 and a fourth connection portion 132. The third connection portion 131 is connected to the shield layer 102. The fourth connection portion 132 is elastically deformable, and the fourth connection portion 132 may be configured to be elastically connected to the circuit board 200 provided with the second conductive interface 220.

[0016] In this embodiment, a second connecting portion 122 that can be elastically deformed is provided on the first connecting member, and a fourth connecting portion 132 that can be elastically deformed is provided on the second connecting member. As a result, after the second connecting portion 122 is elastically connected to the first conductive interface 210 of the circuit board 200 and the fourth connecting portion 132 is elastically connected to the second conductive interface 220 of the circuit board 200, the cable assembly 100 can be removed from the circuit board 200, making replacement and repair easier and reducing the costs of maintenance and reprocessing. Further, the first connecting member and the second connecting member may be directly connected to the circuit board 200 for signal transmission, eliminating the need to provide a socket on the cable assembly 100. Thereby, the height of the cable assembly 100 is reduced, which is advantageous for heat dissipation of the system, and the impedance discontinuities due to the circuit board 200 and the socket and the impedance discontinuities due to the socket and the cable assembly 100 are reduced, thereby improving the signal transmission bandwidth.

[0017] In one embodiment, the connection method between the first connecting portion 121 and the signal line 101 and the connection method between the third connecting portion 131 and the shield layer 102 are numerous, such as welding (e.g., laser welding) or injection molding, etc., but are not particularly limited herein.

[0018] In one embodiment, both the first conductive interface 210 and the second conductive interface 220 may be metallized holes, and the finished hole diameters of the first conductive interface 210 and the second conductive interface 220 may be less than 0.5 mm. For example, the finished hole diameter may be 0.3 mm, 0.2 mm or other values, but will not be described in detail herein. A metallized hole is a hole formed by chemically plating a copper thin layer on the inner wall of a hole between the top layer and the bottom layer of the circuit board 200 to connect the top layer and the bottom layer of the circuit board 200 to each other.

[0019] In one embodiment, the first connecting member and the second connecting member may have a cylindrical structure or other shapes, but are not particularly limited herein.

[0020] In one embodiment, the material of the shield layer 102 may be a metallic material or a semiconductive material. For example, the metallic material may be a metallic wire woven in a net shape or a metallic thin film. Also, the outside of the shield layer 102 of the cable 110 may or may not be coated with an insulating medium. When the outside of the shield layer 102 is coated with an insulating medium (i.e., an insulating layer), it is necessary to expose the shield layer 102 of the cable 110 so as to connect the shield layer 102 to the third connection portion 131. Thereby, electromagnetic interference between the cables 110 is blocked and shield performance is ensured. Further, the shield layer 102 is at the same potential as the cable 110 to be shielded and contacts the insulating layer, thereby avoiding partial discharge between the cable 110 and the insulating layer.

[0021] In one embodiment, the shield layer 102 may be a single shield layer or a plurality of shield layers. Here, the single shield layer may be a single shield mesh or a shield film, and the plurality of shield layers may be a plurality of shield meshes or shield films.

[0022] In one embodiment, a guide structure is provided in both the second connection portion and the fourth connection portion. The guide structure is a chamfered or tapered structure. The guide structure may have other shapes having a guiding function and may be determined according to actual needs, but is not particularly limited herein. Also, the guide structure has a guiding function, and the shape of the guide structure does not affect the conductivity of the guide structure itself. Here, the guide structure 128 of the second connection portion 122 is shown in FIG. 3.

[0023] In one example, as shown in FIG. 2, the second connection portion 122 may include a first sub-connection portion 123 and a second sub-connection portion 124 provided opposite to each other, and the fourth connection portion 132 may include a third sub-connection portion 133 and a fourth sub-connection portion 134 provided opposite to each other. The first sub-connection portion 123, the second sub-connection portion 124, the third sub-connection portion 133, and the fourth sub-connection portion 134 are all elastically deformable.

[0024] In one embodiment, a guide structure is provided for each of the first sub-connection portion 123, the second sub-connection portion 124, the third sub-connection portion 133, and the fourth sub-connection portion 134. The guide structure is a chamfered or tapered structure. This guide structure may have other shapes with a guiding function and may be determined according to actual needs, but is not particularly limited here. Also, the guide structure has a guiding function, and the shape of the guide structure does not affect the electrical conductivity of the guide structure itself.

[0025] Based on the above embodiments, as shown in FIGS. 2, 4, and 5, when the first sub-connection portion 123 and the second sub-connection portion 124 are in an elastically deformed state, the distance between the first sub-connection portion 123 and the second sub-connection portion 124 becomes shorter. When the third sub-connection portion 133 and the fourth sub-connection portion 134 are in an elastically deformed state, the distance between the third sub-connection portion 133 and the fourth sub-connection portion 134 becomes shorter. Here, FIG. 4 is a schematic diagram of the elastic deformation direction of the first sub-connection portion 123 and the second sub-connection portion 124.

[0026] In another embodiment, as shown in FIG. 3, the second connection portion 122 is provided with a first elastic structure 127 communicating with the first connection portion 121, and the fourth connection portion (not shown) is provided with a second elastic structure (not shown) communicating with the third connection portion (not shown). When the second connection portion 122 is elastically connected to a first conductive interface (not shown) and the fourth connection portion is elastically connected to a second conductive interface (not shown), both the first elastic structure 127 and the second elastic structure are in an elastically deformed state.

[0027] In another embodiment, as shown in FIG. 6, the first connection member includes a first connection arm 125 communicating the first connection portion 121 and the second connection portion 122, and a second connection arm 126 communicating the first connection portion 121 and the second connection portion 122. The second connection member includes a third connection arm 135 communicating the third connection portion 131 and the fourth connection portion 132, and a fourth connection arm 136 communicating the third connection portion 131 and the fourth connection portion 132.

[0028] In one embodiment, as shown in FIG. 7, the cable assembly 100 includes a cable 110, a first connection member (not shown), and a second connection member (not shown). Among them, the cable 110 includes a signal line 101 and a shield layer 102. The first connection member includes a fifth connection portion 161 and a sixth connection portion 162. The fifth connection portion 161 is connected to the signal line 101. The sixth connection portion 162 cannot be elastically deformed, and the sixth connection portion 162 may be configured to be connected to a circuit board 200 provided with a first conductive interface 210. The second connection member includes a seventh connection portion 163 and an eighth connection portion 164. The seventh connection portion 163 is connected to the shield layer 102. The eighth connection portion 164 cannot be elastically deformed, and the eighth connection portion 164 may be configured to be connected to a circuit board 200 provided with a second conductive interface 220. The cable assembly 100 may include a fixing sheet 140. The fixing sheet 140 is provided with screw holes, and the fixing sheet 140 is fixed to the circuit board through screws 150, but the embodiments of the present application do not particularly limit this.

[0029] In one embodiment, as shown in FIG. 2, the cable assembly 100 includes a fixing sheet 140. The fixing sheet 140 includes a first fixing portion (not shown) and a second fixing portion (not shown). The first fixing portion is connected to the connection location between the first connection portion 121 and the signal line 101, and the second fixing portion is connected to the connection location between the third connection portion 131 and the shield layer 102. The cable assembly 100 can be stably connected to the circuit board 200 by the fixing sheet 140. There are many embodiments in which the cable assembly 100 is stably connected to the circuit board 200 by the fixing sheet 140. In order to make the cable assembly 100 removable from the circuit board 200, for example, connections by structures such as buckles, rivets, or hole-and-pin structures can be mentioned. As shown in FIGS. 6 and 7, screw holes may be provided in the fixing sheet 140, and the fixing sheet 140 may be fixed to the circuit board by screws 150, but it is not particularly limited here.

[0030] The thickness of the fixing sheet 140 is smaller than the thickness of the socket, and the thickness of the fixing sheet 140 may be set according to actual needs, but is not particularly limited here.

[0031] In one embodiment, the fixing sheet 140 may be polygonal, for example, triangular, square, rectangular, rhombic, trapezoidal or other shapes, but will not be described in detail here.

[0032] Furthermore, as shown in FIG. 8, another embodiment of the present application also provides a circuit board. The circuit board 200 includes a first conductive interface 210 and a second conductive interface 220, and both the first conductive interface 210 and the second conductive interface 220 can be connected to the cable assembly in the above embodiment for transmitting signals. Therefore, the circuit board 200 has the beneficial effects of the cable assembly in any of the above embodiments, that is, a second connectable portion that is elastically deformable is provided on the first connection member of the cable assembly, and a fourth connectable portion that is elastically deformable is provided on the second connection member. As a result, the cable assembly can be elastically connected to the first conductive interface 210 of the circuit board 200 and elastically connected to the second conductive interface 220 of the circuit board 200. Also, after the cable assembly is connected to the circuit board 200, the cable assembly can be removed from the circuit board 200, reducing the cost of maintenance and rework. In addition, the first connection member and the second connection member of the cable assembly may be directly connected to the circuit board 200, eliminating the need to provide a socket on the cable assembly, thereby reducing the height of the cable assembly, which is beneficial to the heat dissipation of the system, and reducing the contact surface, and reducing the impedance discontinuities between the circuit board 200 and the socket and the impedance discontinuities between the socket and the cable assembly, thereby improving the signal transmission bandwidth.

[0033] In one embodiment, as shown in FIG. 8, both the first conductive interface 210 and the second conductive interface 220 are filled with an elastically deformable conductive material, and both the first conductive interface 210 and the second conductive interface 220 can be elastically connected to the cable assembly by the conductive material.

[0034] In one embodiment, the conductive material may be conductive rubber, conductive silver adhesive, metal filament, snap button, or metal spring, etc., or other materials having conductivity and elasticity, but is not particularly limited herein. Also, the conductivity of the conductive material is greater than 100 S / m. For example, it may be 101 S / m, 120 S / m, or other values, but will not be described in detail herein.

[0035] Since the conductive material has good elasticity, the contact force between the first conductive interface 210 and the cable 110 is good, the contact force between the second conductive interface 220 and the cable 110 is good, and the stability of the electrical contact between the first conductive interface 210 and the cable 110 and the stability of the electrical contact between the second conductive interface 220 and the cable 110 can be ensured.

[0036] In one embodiment, as shown in FIG. 8, the circuit board 200 is provided with a relief groove 230, and both the first conductive interface 210 and the second conductive interface 220 are connected to the relief groove 230. Here, the shape of the relief groove 230 is not limited. In a cross-sectional view of the relief groove 230, the cross-section of the relief groove 230 may be a polygon, for example, a triangle, a square, a rectangle, a rhombus, a trapezoid, or other shapes, but will not be described in detail herein.

[0037] Based on the above embodiments, the relief groove includes a first relief opening and a second relief opening. The first conductive interface is connected to the first relief opening, and the second conductive interface is connected to the second relief opening, but is not particularly limited herein.

[0038] In another embodiment, as shown in FIG. 9, a transfer hole 240 may be provided between the first relief opening 231 and the first conductive interface 210, and a transfer hole 240 may be provided between the second relief opening 232 and the second conductive interface 220. The first relief opening 231 serves to avoid the second connection portion 122 and guide the insertion of the second connection portion 122 into the first conductive interface 210, and the second relief opening 232 can serve to avoid the fourth connection portion 132 and guide the insertion of the fourth connection portion 132 into the first conductive interface 210. The transfer hole 240 may be filled with an elastically deformable conductive material, and the first conductive interface 210 and the second conductive interface 220 may not be filled with an elastically deformable conductive material.

[0039] In addition, as shown in FIG. 2, another embodiment of the present application also provides a connection structure, which includes a cable assembly 100 and a circuit board 200. Among them, the cable assembly 100 includes a cable 110, a first connection member (not shown), and a second connection member (not shown). The cable 110 includes a signal line 101 and a shield layer 102. The first connection member includes a first connection portion 121 and a second connection portion 122. The first connection portion 121 is connected to the signal line 101, and the second connection portion 122 is elastically deformable. The second connection member includes a third connection portion 131 and a fourth connection portion 132. The third connection portion 131 is connected to the shield layer 102, and the fourth connection portion 132 is elastically deformable. The circuit board 200 includes a first conductive interface 210 and a second conductive interface 220.

[0040] When the first conductive interface 210 is elastically connected to the second connection portion 122 and the second conductive interface 220 is elastically connected to the fourth connection portion 132, both the second connection portion 122 and the fourth connection portion 132 are in an elastically deformed state.

[0041] In this embodiment, a second connection part 122 that can be elastically deformed is provided on the first connection member, and a fourth connection part 132 that can be elastically deformed is provided on the second connection member. As a result, after the second connection part 122 is elastically connected to the first conductive interface 210 of the circuit board 200 and the fourth connection part 132 is elastically connected to the second conductive interface 220 of the circuit board 200, the cable assembly 100 can be removed from the circuit board 200, and the costs of maintenance and reprocessing are reduced. Further, the first connection member and the second connection member may be directly connected to the circuit board 200 to transmit signals, eliminating the need to provide a socket on the cable assembly 100. Thereby, the height of the cable assembly 100 is reduced, which is advantageous for heat dissipation of the system, and the impedance discontinuities caused by the circuit board 200 and the socket and the impedance discontinuities caused by the socket and the cable assembly 100 are reduced, thereby improving the signal transmission bandwidth.

[0042] Due to the skin effect, even if the second connection part 122 and the fourth connection part 132 are elastically deformed after the second connection part 122 is inserted into the first conductive interface 210 and the fourth connection part 132 is inserted into the second conductive interface 220, it will not affect the signal integrity (SI). Also, the signal transmission bandwidth is affected by the hole diameters of the first conductive interface 210 and the second conductive interface 220, but as long as the second connection part 122 contacts the first conductive interface 210 and the fourth connection part 132 contacts the second conductive interface 220, the signal transmission bandwidth will not be affected. Here, the signal distribution in the first connection member and the second connection member is not uniform, and a large amount of signals gather on the surfaces of the first connection member and the second connection member. As going towards the centers of the first connection member and the second connection member, the signals decrease. Such a phenomenon is called the skin effect.

[0043] In one embodiment, as shown in FIG. 2, the cable assembly 100 includes a fixing sheet 140. The fixing sheet 140 includes a first fixing portion (not shown) and a second fixing portion (not shown). The first fixing portion is connected to the connection location between the first connection portion 121 and the signal line 101, and the second fixing portion is connected to the connection location between the third connection portion 131 and the shield layer 102. The cable assembly 100 can be stably connected to the circuit board 200 by the fixing sheet 140. There are many embodiments in which the cable assembly 100 is stably connected to the circuit board 200 by the fixing sheet 140. In order to make the cable assembly 100 removable from the circuit board 200, for example, connections by structures such as buckles, rivets, or hole - peg are included. As shown in FIGS. 6 and 7, screw holes may be provided in the fixing sheet 140, and the fixing sheet 140 may be fixed to the circuit board by screws 150, but it is not particularly limited here.

[0044] Based on the above embodiment, as shown in FIG. 2, in one embodiment, a relief groove 230 is provided in the circuit board 200, and both the first conductive interface 210 and the second conductive interface 220 are connected to the relief groove 230, and the size of the relief groove 230 matches the size of the fixing sheet 140. In order to reduce the height of the cable assembly 100, the fixing sheet 140 may be mounted in the relief groove 230, which is advantageous for the heat dissipation of the system.

[0045] In one embodiment, the thickness of the relief groove 230 is equal to the thickness of the fixing sheet 140. In order to reduce the height generated by the cable assembly 100 with the fixing sheet 140, the fixing sheet 140 may be completely fitted into the relief groove 230, which is advantageous for the heat dissipation of the system.

[0046] In one embodiment, as shown in FIG. 2, the cable assembly 100 includes a cable 110, a first connection member, and a second connection member. The cable 110 includes a signal line 101 and a shield layer 102. The first connection member includes a first connection portion 121 and a second connection portion 122. The second connection member includes a third connection portion 131 and a fourth connection portion 132. The first connection portion 121 is connected to the signal line 101. The third connection portion 131 is connected to the shield layer 102. Both the second connection portion 122 and the fourth connection portion 132 are elastically deformable. The circuit board 200 includes a first conductive interface 210 and a second conductive interface 220. When the second connection portion 122 is connected to the first conductive interface 210 and the fourth connection portion 132 is connected to the second conductive interface 220, both the second connection portion 122 and the fourth connection portion 132 are in an elastically deformed state. Although the first conductive interface 210 and the second conductive interface 220 may not be filled with an elastically deformable conductive material, it is not particularly limited here.

[0047] Since the second connection portion 122 and the fourth connection portion 132 have good elasticity, the contact force between the first conductive interface 210 and the second connection portion 122 is good, the contact force between the second conductive interface 220 and the fourth connection portion 132 is good, and also, the stability of the electrical contact between the first conductive interface 210 and the second connection portion 122 and the stability of the electrical contact between the second conductive interface 220 and the fourth connection portion 132 can be ensured.

[0048] In this embodiment, a second connection part 122 that can be elastically deformed is provided on the first connection member, and a fourth connection part 132 that can be elastically deformed is provided on the second connection member. As a result, after the second connection part 122 is elastically connected to the first conductive interface 210 of the circuit board 200 and the fourth connection part 132 is elastically connected to the second conductive interface 220 of the circuit board 200, the cable assembly 100 can be removed from the circuit board 200, and the costs of maintenance and reprocessing are reduced. Further, the first connection member and the second connection member may be directly connected to the circuit board 200 to transmit signals, eliminating the need to provide a socket on the cable assembly 100. Thereby, the height of the cable assembly 100 is reduced, which is advantageous for heat dissipation of the system, and the impedance discontinuities caused by the circuit board 200 and the socket and the impedance discontinuities caused by the socket and the cable assembly 100 are reduced, thereby improving the signal transmission bandwidth.

[0049] Based on the above embodiment, in one embodiment, as shown in FIG. 2, the second connection part 122 may include a first sub-connection part 123 and a second sub-connection part 124 provided opposite to each other, and the fourth connection part 132 may include a third sub-connection part 133 and a fourth sub-connection part 134 provided opposite to each other. The first sub-connection part 123, the second sub-connection part 124, the third sub-connection part 133, and the fourth sub-connection part 134 are all elastically deformable. Both the first sub-connection part 123 and the second sub-connection part 124 are connected to the first conductive interface 210, and both the third sub-connection part 133 and the fourth sub-connection part 134 are connected to the second conductive interface 220. When the first sub-connection part 123, the second sub-connection part 124, the third sub-connection part 133, and the fourth sub-connection part 134 are all in an elastically deformed state, the distance between the first sub-connection part 123 and the second sub-connection part 124 becomes shorter, and the distance between the third sub-connection part 133 and the fourth sub-connection part 134 becomes shorter.

[0050] In one embodiment, any of the first sub-connection part 123, the second sub-connection part 124, the third sub-connection part 133, and the fourth sub-connection part 134 may be arc-shaped, but may also have other shapes and are not particularly limited herein.

[0051] The arc-shaped sides of the first sub-connection part 123 and the second sub-connection part 124 have an elastic and guiding function. When the first sub-connection part 123 and the second sub-connection part 124 come into contact with the first conductive interface 210, since the cross-sectional areas of the bottom of the first sub-connection part 123 and the bottom of the second sub-connection part 124 are smaller than the cross-sectional area of the first conductive interface 210, the first sub-connection part 123 and the second sub-connection part 124 can receive guidance to the first conductive interface 210. In the process of the first sub-connection part 123 and the second sub-connection part 124 being inserted into the first conductive interface 210, when the cross-sectional area of the first conductive interface 210 becomes smaller than the cross-sectional areas of the first sub-connection part 123 and the second sub-connection part 124, the first sub-connection part 123 and the second sub-connection part 124 deform elastically, the distance between the first sub-connection part 123 and the second sub-connection part 124 becomes shorter, and when the first sub-connection part 123 and the second sub-connection part 124 are completely inserted into the first conductive interface 210, the first sub-connection part 123 and the second sub-connection part 124 are electrically connected to the first conductive interface 210. Since the process of connecting the third sub-connection part 133 and the fourth sub-connection part 134 to the second conductive interface 220 is similar, detailed description is omitted.

[0052] In another embodiment, as shown in FIGS. 7 and 8, the first connection member includes a fifth connection portion 161 and a sixth connection portion 162, the second connection member includes a seventh connection portion 163 and an eighth connection portion 164, the fifth connection portion 161 is connected to the signal line 101, the seventh connection portion 163 is connected to the shield layer 102, and neither the sixth connection portion 162 nor the eighth connection portion 164 can be elastically deformed. Both the first conductive interface 210 and the second conductive interface 220 are filled with an elastically deformable conductive material. The first conductive interface 210 is elastically connected to the sixth connection portion 162 by the conductive material, and the second conductive interface 220 is elastically connected to the eighth connection portion 164 by the conductive material, thereby achieving the purpose of transmitting signals.

[0053] Since the conductive material has good elasticity, the contact force between the first conductive interface 210 and the sixth connection portion 162 is good, the contact force between the second conductive interface 220 and the eighth connection portion 164 is good, and the stability of the electrical contact between the first conductive interface 210 and the sixth connection portion 162 and the stability of the electrical contact between the second conductive interface 220 and the eighth connection portion 164 can be ensured. In addition, the sixth connection portion 162 and the eighth connection portion 164 can be protected from damage.

[0054] In this embodiment, by filling the first conductive interface 210 and the second conductive interface 220 with an elastically deformable conductive material, after the sixth connection portion 162 is elastically connected to the first conductive interface 210 of the circuit board 200 and the eighth connection portion 164 is elastically connected to the second conductive interface 220 of the circuit board 200, the cable assembly 100 can be removed from the circuit board 200, and the costs of maintenance and reprocessing are reduced. Further, the first connection member and the second connection member may be directly connected to the circuit board 200 for signal transmission, eliminating the need to provide a socket on the cable assembly 100. As a result, the height of the cable assembly 100 is reduced, which is advantageous for heat dissipation of the system, and the impedance discontinuities caused by the circuit board 200 and the socket and the impedance discontinuities caused by the socket and the cable assembly 100 are reduced, thereby improving the signal transmission bandwidth.

[0055] In another embodiment, as shown in FIGS. 6 and 9, the first connection member includes a first connection arm 125 that communicates the first connection portion 121 and the second connection portion 122, and a second connection arm 126 that communicates the first connection portion 121 and the second connection portion 122. The second connection member includes a third connection arm 135 that communicates the third connection portion 131 and the fourth connection portion 132, and a fourth connection arm 136 that communicates the third connection portion 131 and the fourth connection portion 132. Both the first conductive interface 210 and the second conductive interface 220 are filled with an elastically deformable conductive material. The first conductive interface 210 is elastically connected to the second connection portion 122 by the conductive material, and the second conductive interface 220 is elastically connected to the fourth connection portion 132 by the conductive material, thereby achieving the purpose of signal transmission.

[0056] The first conductive interface 210 can accommodate the first connection arm 125 and the second connection arm 126, and the second conductive interface 220 can accommodate the third connection arm 135 and the fourth connection arm 136. When the first conductive interface 210 is elastically connected to the second connection portion 122 by a conductive material and the second conductive interface 220 is elastically connected to the fourth connection portion 132 by a conductive material, the elastically deformable conductive material can protect the first connection arm 125, the second connection arm 126, the third connection arm 135, and the fourth connection arm 136 from damage.

[0057] Since the conductive material has good elasticity, the contact force between the first conductive interface 210 and the second connection portion 122 is good, the contact force between the second conductive interface 220 and the fourth connection portion 132 is good, and also, the stability of the electrical contact between the first conductive interface 210 and the second connection portion 122 and the stability of the electrical contact between the second conductive interface 220 and the fourth connection portion 132 can be ensured.

[0058] In this embodiment, by filling the first conductive interface 210 and the second conductive interface 220 with an elastically deformable conductive material, after the second connection portion 122 is elastically connected to the first conductive interface 210 of the circuit board 200 and the fourth connection portion 132 is elastically connected to the second conductive interface 220 of the circuit board 200, the cable assembly 100 can be removed from the circuit board 200, and the costs of maintenance and reprocessing are reduced. Also, the first connection member and the second connection member may be directly connected to the circuit board 200 to transmit signals, eliminating the need to provide a socket on the cable assembly 100. Thereby, the height of the cable assembly 100 is reduced, which is advantageous for the heat dissipation of the system, and the impedance discontinuities caused by the circuit board 200 and the socket and the impedance discontinuities caused by the socket and the cable assembly 100 are reduced, thereby improving the signal transmission bandwidth.

[0059] In one embodiment, the circuit board is provided with a first relief opening and a second relief opening. The first conductive interface is connected to the first relief opening, and the second conductive interface is connected to the second relief opening. The first conductive interface and / or the second conductive interface may be filled with an elastically deformable conductive material. Alternatively, as shown in FIG. 9, a transition hole 240 may be provided between the first relief opening 231 and the first conductive interface 210, and a transition hole 240 may be provided between the second relief opening 232 and the second conductive interface 220. The first relief opening 231 serves to avoid the second connection portion 122 and guide the insertion of the second connection portion 122 into the first conductive interface 210, and the second relief opening 232 serves to avoid the fourth connection portion 132 and guide the insertion of the fourth connection portion 132 into the first conductive interface 210. The transition hole 240 may be filled with an elastically deformable conductive material, and the first conductive interface 210 and the second conductive interface 220 may not be filled with an elastically deformable conductive material. When the transition hole 240 is filled with an elastically deformable conductive material, the hole diameter of the first relief opening 231 is sufficient to accommodate the second connection portion 122, the hole diameter of the second relief opening 232 is sufficient to accommodate the fourth connection portion 132, and the hole diameter of the transition hole 240 may be smaller than the hole diameters of the first relief opening 231 and the second relief opening 232 and larger than the hole diameters of the first conductive interface 210 and the second conductive interface 220, but is not particularly limited herein.

[0060] In one embodiment, the cable assembly 100 in the embodiment shown in FIG. 6 and the circuit board 200 in the embodiment shown in FIG. 9 may be used in combination, but are not particularly limited herein.

[0061] In one embodiment, as shown in FIG. 3, the second connection portion 122 is provided with a first elastic structure 127 communicating with the first connection portion 121, and the fourth connection portion (not shown) is provided with a second elastic structure (not shown) communicating with the third connection portion (not shown). When the second connection portion 122 is elastically connected to a first conductive interface (not shown) and the fourth connection portion is elastically connected to a second conductive interface (not shown), both the first elastic structure 127 and the second elastic structure are in an elastically deformed state. Here, the first conductive interface 210 and the second conductive interface 220 may or may not be filled with an elastically deformable conductive material, and are not particularly limited herein.

[0062] Since both the first elastic structure 127 and the second elastic structure have good elasticity, the contact force between the first conductive interface and the second connection portion 122 is good, the contact force between the second conductive interface and the fourth connection portion is good, and the electrical contact stability between the first conductive interface and the second connection portion 122 and the electrical contact stability between the second conductive interface and the fourth connection portion can be ensured.

[0063] In this embodiment, by providing the first elastic structure 127 on the second connection portion 122 and the second elastic structure on the fourth connection portion, after the second connection portion 122 is elastically connected to the first conductive interface of the circuit board and the fourth connection portion is elastically connected to the second conductive interface of the circuit board, the cable assembly can be removed from the circuit board, and the maintenance and reprocessing costs are reduced. In addition, the first connection member and the second connection member may be directly connected to the circuit board to transmit signals, eliminating the need to provide a socket on the cable assembly. As a result, the height of the cable assembly is reduced, which is beneficial to the heat dissipation of the system. Also, the impedance discontinuities caused by the circuit board and the socket and the impedance discontinuities caused by the socket and the cable assembly are reduced, improving the SI performance, thereby improving the signal transmission bandwidth.

[0064] In one embodiment, both the first relief opening and the second relief opening in all of the above embodiments may be non-metallized holes, while the transition holes, the first conductive interface, and the second conductive interface may be metallized holes, which may be determined according to actual needs, but are not particularly limited herein.

[0065] In addition, there is no limitation on the number of any of the first connection member, the second connection member, and the cable of the cable assembly in all of the above embodiments. For example, as shown in FIG. 10, the first connection member 120, the second connection member 130, and the cable 110 may be plural or may be one, but will not be described in detail herein. Similarly, there is no limitation on the number of the first conductive interface and the second conductive interface of the circuit board. For example, the first conductive interface and the second conductive interface may be one or may be plural, but will not be described in detail herein.

[0066] Regarding the connection structure according to the above embodiments, in the following examples, tests are performed on the performance of the connection structure in the present application.

[0067] In one example, when the completed hole diameter of the first conductive interface and the completed hole diameter of the second conductive interface are both 0.3 mm, and all of the conductive materials of the first conductive interface and the second conductive interface are faz buttons, the bandwidth of the signal transmission of this connection structure is as high as 40 GHz. As shown in FIG. 11, the abscissa represents the frequency, the unit of the frequency is GHz, the ordinate represents the amplitude, the unit of the amplitude is dB, and between the frequencies of 0 to 40 GHz, the difference between the two curves all exceeds 5 dB.

[0068] Note that the cable 110 of the cable assembly 100 may be connected to the circuit board 200 (see FIG. 12), or may be connected to a chip 300 (see FIG. 13), for example, an application specific integrated circuit (ASIC) chip, but is not particularly limited herein. When the cable assembly is connected to a chip, since the chip has the same inventive concept as the circuit board in all of the above embodiments and has the same mounting principle and technical effects as the circuit board, it will not be described in detail here. As shown in FIG. 12, the cable 110 of the plug-in cable connector 400 in the optical module is directly connected to the chip 300, while the chip 300 may be connected to the circuit board 200 by solder balls 500. Alternatively, as shown in FIG. 13, the cable 110 of the plug-in cable connector 400 in the optical module is directly connected to the circuit board 200, and the chip 300 may be connected to the circuit board 200 by solder balls 500.

[0069] In addition, an embodiment of the present application also provides an electronic device, which includes the cable assembly of the above embodiment, or the circuit board of the above embodiment, or the connection structure of the above embodiment. Therefore, the electronic device has the beneficial effects of the cable assembly, circuit board, or connection structure in any of the above embodiments, that is, a second connection portion that is elastically deformable is provided on the first connection member of the cable assembly, and a fourth connection portion that is elastically deformable is provided on the second connection member. After the second connection portion is elastically connected to the first conductive interface of the circuit board and the fourth connection portion is elastically connected to the second conductive interface of the circuit board, the cable assembly can be removed from the circuit board, reducing the costs of maintenance and reprocessing. In addition, the first connection member and the second connection member may be directly connected to the circuit board for signal transmission, eliminating the need to provide a socket on the cable assembly. As a result, the height of the cable assembly is reduced, which is beneficial to the heat dissipation of the system. Also, the impedance discontinuities between the circuit board and the socket and between the socket and the cable assembly are reduced, thereby improving the signal transmission bandwidth of the electronic device.

[0070] The embodiment of the present application has at least the following beneficial effects. A second connection portion that is elastically deformable is provided on the first connection member, and a fourth connection portion that is elastically deformable is provided on the second connection member. After the second connection portion is elastically connected to the first conductive interface of the circuit board and the fourth connection portion is elastically connected to the second conductive interface of the circuit board, the cable assembly can be removed from the circuit board, reducing the costs of maintenance and reprocessing. In addition, the first connection member and the second connection member may be directly connected to the circuit board for signal transmission, eliminating the need to provide a socket on the cable assembly. As a result, the height of the cable assembly is reduced, which is beneficial to the heat dissipation of the system. Also, the impedance discontinuities between the circuit board and the socket and between the socket and the cable assembly are reduced, thereby improving the signal transmission bandwidth.

[0071] All or part of the steps in the method disclosed above, the system may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor such as a central processor, a digital signal processor, a microprocessor, etc., or as hardware, or as an integrated circuit such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium that may include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (e.g., computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage devices, magnetic cartridges, magnetic tape, magnetic disk storage devices or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Further, it is well known to those skilled in the art that communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and may include any information distribution medium.

Claims

1. A cable including a signal line and a shield layer, A first connection member including a first connection portion and a second connection portion, the first connection portion being connected to the signal line, the second connection portion being elastically deformable, and the second connection portion being configured to be elastically connected to a circuit board provided with a first conductive interface, A second connection member including a third connection portion and a fourth connection portion, the third connection portion being connected to the shield layer, the fourth connection portion being elastically deformable, and the fourth connection portion being configured to be elastically connected to the circuit board provided with a second conductive interface, the cable assembly including the second connection member.

2. The second connection portion includes a first sub-connection portion and a second sub-connection portion provided opposite to each other, the fourth connection portion includes a third sub-connection portion and a fourth sub-connection portion provided opposite to each other, and the first sub-connection portion, the second sub-connection portion, the third sub-connection portion, and the fourth sub-connection portion are all elastically deformable. The cable assembly according to claim 1.

3. When the first sub-connection portion and the second sub-connection portion are in an elastically deformed state, the distance between the first sub-connection portion and the second sub-connection portion becomes shorter, and when the third sub-connection portion and the fourth sub-connection portion are in an elastically deformed state, the distance between the third sub-connection portion and the fourth sub-connection portion becomes shorter. The cable assembly according to claim 2.

4. The second connection portion is provided with a first elastic structure communicating with the first connection portion, the fourth connection portion is provided with a second elastic structure communicating with the third connection portion, and when the second connection portion is elastically connected to the first conductive interface and the fourth connection portion is elastically connected to the second conductive interface, both the first elastic structure and the second elastic structure are in an elastically deformed state. The cable assembly according to claim 1.

5. The cable assembly further includes a fixing sheet, the fixing sheet includes a first fixing portion and a second fixing portion, the first fixing portion is connected to the connection location between the first connection portion and the signal line, and the second fixing portion is connected to the connection location between the third connection portion and the shield layer. The cable assembly according to claim 1.

6. Both the second connection portion and the fourth connection portion are provided with a chamfered or tapered guide structure. The cable assembly according to claim 1, 2 or 4.

7. A first conductive interface configured to be connected to the cable assembly according to any one of claims 1 to 6, A second conductive interface configured to be connected to the cable assembly, and a circuit board including the same.

8. The first conductive interface is filled with an elastically deformable conductive material, and the first conductive interface is elastically connected to the cable assembly by the conductive material. The second conductive interface is filled with the conductive material, and the second conductive interface is elastically connected to the cable assembly by the conductive material. The circuit board according to claim 7.

9. The circuit board is provided with a relief groove, and both the first conductive interface and the second conductive interface are connected to the relief groove. The circuit board according to claim 7.

10. The relief groove includes a first relief opening and a second relief opening. The first conductive interface is connected to the first relief opening, and the second conductive interface is connected to the second relief opening. The circuit board according to claim 9.

11. Including a cable, a first connection member, and a second connection member. The cable includes a signal line and a shield layer. The first connection member includes a first connection portion and a second connection portion. The first connection portion is connected to the signal line, and the second connection portion is elastically deformable. The second connection member includes a third connection portion and a fourth connection portion. The third connection portion is connected to the shield layer, and the fourth connection portion is elastically deformable. A cable assembly, A circuit board including a first conductive interface and a second conductive interface, The first conductive interface is elastically connected to the second connection portion, and the second conductive interface is elastically connected to the fourth connection portion. A connection structure.

12. An electronic device including the cable assembly according to any one of claims 1 to 6, or the circuit board according to any one of claims 7 to 10, or the connection structure according to claim 11.

Citation Information

Patent Citations

  • JP1991091669U

  • Press fit pin structure

    JP1993006707U

  • Shield connector and electric connection structure

    JP2018049722A

  • Low-profile electrical connector

    JP2018516442A

  • Plug-in Contact

    JP2019516223A