Device comprising a thermally anisotropic conduction channel and a thermal insulation material

Abstract

A device comprising: a region including a component configured to generate heat; and a heat conduction layer coupled to the region, the heat conduction layer including a plurality of segmented thermally anisotropic conduction channels. Each of the plurality of segmented thermally anisotropic conduction channels is aligned in a first direction. Each of the plurality of segmented thermally anisotropic conduction channels is configured to provide a heat transfer capability in the first direction. The heat conduction layer is configured to (i) reduce the junction temperature of the component and / or (ii) reduce the surface temperature of the device.

Description

Technical Field

[0001] Various features relate to a device including a heat dissipation component.

Background Art

[0002] Electronic devices include many components that generate heat, such as integrated devices. Integrated devices may tend to overheat, which can affect the performance of the integrated device and other components of the electronic device. An overheated integrated device has a high junction temperature, and as a result, the surface temperature of the electronic device may increase. This can ultimately affect the performance of the electronic device. There is a continuing need to improve the heat dissipation performance of electronic devices including components that generate heat. For example, there is a continuing need to lower the junction temperature of components that generate heat and / or to lower the surface temperature of an electronic device including components that generate heat.

Summary of the Invention

[0003] Various features relate to a device including a heat dissipation device.

[0004] One embodiment provides a device comprising a region including a component configured to generate heat and a heat conducting layer coupled to the region, the heat conducting layer including a plurality of segmented thermally anisotropic conduction channels.

[0005] Another embodiment provides a device comprising a region including a first integrated device configured to generate heat and a second integrated device configured to generate heat. The device comprises means for segmented anisotropic heat transfer coupled to the region.

[0006] The "Detailed Description of the Invention" described below, when read in conjunction with the drawings that identify corresponding elements throughout with like reference numerals, may make various features, properties, and advantages apparent.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] In the following description, specific details are set forth in order to provide a thorough understanding of various aspects of the present disclosure. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams in order to avoid obscuring the aspects with unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail so as not to obscure the aspects of the present disclosure.

[0009] The present disclosure describes a device (e.g., an electronic device) comprising a region including components configured to generate heat and a thermal conduction layer coupled to the region, the thermal conduction layer including a plurality of segmented thermally anisotropic conduction channels. Each of the plurality of segmented thermally anisotropic conduction channels is aligned in a first direction. Each of the plurality of segmented thermally anisotropic conduction channels has a high thermal conductivity in the first direction and a low thermal conductivity in another direction. For example, each of the plurality of segmented thermally anisotropic conduction channels is configured to primarily (e.g., initially) provide heat transfer mainly in the first direction. The thermal conduction layer may include graphite (e.g., a graphite sheet). The thermal conduction layer is configured to provide local directional heat transfer to enable thermal isolation between components within the device. For example, as further described below, the region can include a first integrated device and a second integrated device, and the thermal conduction layer can be configured to provide heat transfer and / or dissipate heat such that heat generated by one integrated device does not (or minimally) dissipate towards the other integrated device. As further described below, the use of the plurality of thermally anisotropic conduction channels helps to reduce the integrated device junction temperature and the device surface temperature.

[0010] Exemplary device comprising a layer having a heat conduction channel Figures 1 and 2 show a device 100 that can include at least one thermally conductive layer having a thermally conductive channel. The device 100 can include an electronic device such as a mobile phone (e.g., a smartphone). FIG. 1 shows an exemplary front view of the device 100 including a display 102 and a casing body 104. FIG. 2 shows an exemplary rear view of the device 100. The device 100 includes an integrated device 205, an integrated device 215, and a camera 220. The integrated device 205 can be a first integrated device. The integrated device 215 can be a second integrated device. The integrated device 205 and the second integrated device 215 are disposed inside the device 100. For example, the integrated device 205 and the integrated device 215 are disposed inside the casing body 104. The camera 220 may be at least partially embedded in the casing body 104 of the device 100.

[0011] As will be further described below, device 100 can include at least one thermally conductive layer having a thermally conductive channel. The thermally conductive channel may be a thermally anisotropic conductive channel configured to provide (i) a high thermal conductivity along a first direction (e.g., length) and (ii) a low thermal conductivity along another direction (e.g., width). For example, the thermally conductive channel may be a thermally anisotropic conductive channel configured to (i) primarily (e.g., substantially, mostly, almost completely) provide heat transfer along the length of the thermally conductive channel first and (ii) provide little or no heat transfer along other directions (e.g., a second direction, a third direction, width) first. This configuration can help ensure that heat generated by integrated device 205 does not first dissipate towards integrated device 215 and / or heat generated by integrated device 215 does not dissipate towards integrated device 205. Thus, local directional heat transfer is provided to enable thermal separation between components (e.g., integrated devices) within device 100 while still providing effective and efficient heat dissipation from one or more components configured to generate heat. Accordingly, a layer (e.g., a thermally conductive layer, a heat transfer layer) can be configured.

[0012] FIG. 3 shows an exemplary cross-sectional profile view of cross-section AA of device 100 of FIG. 2. Device 100 includes display 102, back cover 304, substrate 302, a plurality of components 303, integrated device 205, integrated device 215, thermal interface material 306, thermal interface material 316, shield 307, shield 317, thermal interface material 308, thermal interface material 318, heat transfer component 320, thermally conductive layer 330, and display module 340. Back cover 304 may be part of the casing body 104 of device 100.

[0013] The thermal conduction layer 330 includes a thermally anisotropic conduction channel configured to provide high thermal conductivity along a first direction (e.g., length) and low thermal conductivity along another direction (e.g., width, second direction). Examples of the thermal conduction layer will be further described below, at least in FIGS. 5-12.

[0014] The substrate 302 may be a printed circuit board (PCB). The plurality of components 303 can be coupled to the back surface of the substrate 302. The plurality of components 303 can face the back cover 304 of the device 100. The integrated device 205 and / or the integrated device 215 can be coupled to the front surface of the substrate 302 via a plurality of solder interconnects (not shown). The thermal interface material 306 can be coupled to the back surface of the integrated device 205. The shield 307 can be coupled to the substrate 302 and may surround the integrated device 205. The shield 307 can be coupled to the integrated device 205 via the thermal interface material 306. The thermal interface material 316 can be coupled to the back surface of the integrated device 215. The shield 317 can be coupled to the substrate 302 and may surround the integrated device 215. The shield 317 can be coupled to the integrated device 215 via the thermal interface material 316. The shield 307 and / or the shield 317 may include a conductive material (e.g., metal, copper) and can be configured to operate as an electromagnetic interference (EMI) shield. The shield 307 and / or the shield 317 can be configured to be coupled to ground.

[0015] The thermal interface material 308 is coupled to the shield 307. The thermal interface material 318 is coupled to the shield 317. The thermal interface materials 308 and 318 are coupled to the heat transfer component 320. The thermal conduction layer 330 can be disposed inside the heat transfer component 320. The thermal conduction layer 330 can include one or more thermal conduction layers. In some implementations, the thermal conduction layer 330 may be partially covered by the heat transfer component 320. For example, one side of the thermal conduction layer 330 is coupled to the heat transfer component 320, and the other side of the thermal conduction layer 330 is directly coupled to the thermal interface material 308 and / or the thermal interface material 318. The heat transfer component 320 may have different shapes and / or sizes. For example, the heat transfer component 320 can be configured to be a case and / or a plate for the thermal conduction layer 330. The heat transfer component 320 is coupled to the display module 340. The display module 340 may or may not be in contact with the display 102. The heat transfer component 320 can assist in handling and disposing of the thermal conduction layer 330 within the device. In some implementations, the heat transfer component 320 may be optional. In such cases, the thermal conduction layer 330 can be directly coupled to (e.g., directly in contact with) the display module 340, the thermal interface material 308, and / or the thermal interface material 318.

[0016] FIG. 3 shows an example of a device 100 including a region that includes at least one component configured to generate heat, and the thermal conduction layer is coupled (e.g., directly or indirectly) to the region that includes at least one component configured to generate heat. The region of the device 100 that includes components configured to generate heat can include an integrated device 205 (e.g., a first integrated device) and / or an integrated device 215 (e.g., a second integrated device). Thus, the integrated device 205 and / or the integrated device 215 are examples of components that can be configured to generate heat. In some implementations, the thermal conduction layer 330 can be considered to be within the region that includes at least one component configured to generate heat. Different implementations can define the regions of the device 100 differently. The region of the device 100 can include an internal region of the device 100. The thermal conduction layer (e.g., 330) coupled to the region of the device 100 can mean that the thermal conduction layer is coupled (e.g., directly coupled, indirectly coupled, mechanically coupled) to one or more components and / or one or more portions within the region of the device 100. As will be described in more detail below, the thermal conduction layer 330 can be configured to provide local directional heat transfer to enable thermal isolation between the integrated device 205 and the integrated device 215 (and optionally other components) through the use of thermally anisotropic conduction channels. The thermal conduction layer 330 can have different shapes, sizes, configurations, and / or arrangements. In one example, the thermal conduction layer 330 can have a thickness of about 0.8 millimeters. In one example, the heat transfer component 320 can have a total thickness of about 1 millimeter. However, the heat transfer component 320 can have other thicknesses. FIGS. 5-12 below illustrate and describe different examples of the configuration of the thermal conduction layer that can be implemented as and / or with the thermal conduction layer 330 within the device 100. The thermal conduction layer 330 can be a means for segmented anisotropic heat transfer.

[0017] Note that the configurations and / or arrangements shown in FIG. 3 are exemplary. In some implementations, other components may be present, some of the components may be arranged differently within device 100, and / or some of the components may be optional.

[0018] Note that in this disclosure, a number of coordinate systems (X-Y-Z, X'-Y'-Z', X''-Y''-Z'') are used and described. These exemplary coordinate systems are used to help explain the anisotropic thermal properties of the thermal conduction layer and / or the segmented thermal conduction channels. These different coordinate systems may be independent of each other or may be related to one or more coordinate systems. Other coordinate systems may be used to illustrate orientation and / or alignment.

[0019] An integrated device (e.g., 205, 215) can include a die (e.g., a semiconductor bare die). The integrated device can include a power management integrated circuit (PMIC). The integrated device can include an application processor. The integrated device can include a modem. The integrated device can include a radio frequency (RF) device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, a gallium arsenide (GaAs)-based integrated device, a surface acoustic wave (SAW) filter, a bulk acoustic wave (BAW) filter, a light emitting diode (LED) integrated device, a silicon (Si)-based integrated device, a silicon carbide (SiC)-based integrated device, a memory, a power management processor, and / or combinations thereof. An integrated device (e.g., 205, 215) can include at least one electronic circuit (e.g., a first electronic circuit, a second electronic circuit, etc.). The integrated device can include a transistor. The integrated device can be an example of an electrical component and / or an electrical device. In some implementations, the integrated device can be a chiplet. A chiplet can be manufactured using one or more manufacturing processes that provide a better yield compared to manufacturing processes used for other types of integrated devices, thereby reducing the overall cost of manufacturing the chiplet. Different chiplets can have different sizes and / or shapes. Different chiplets can be configured to provide different functions. Different chiplets can have different interconnect densities (e.g., interconnects having different widths and / or spacings). In some implementations, a plurality of chiplets can be used to perform the functions of one or more chips (e.g., one or more integrated devices). Using a plurality of chiplets to perform some functions can reduce the overall cost of the package compared to using a single chip to perform all of the functions of the package.

[0020] One or more of the integrated devices can be implemented within a radio frequency (RF) package. The RF package can be a radio frequency front end (RFFE) package. The package can be configured to provide Wireless Fidelity (WiFi) communication and / or cellular communication (e.g., 2G, 3G, 4G, 5G). The package can be configured to support Global System for Mobile (GSM) communication, Universal Mobile Telecommunications System (UMTS), and / or Long-Term Evolution (LTE). The package can be configured to transmit and receive signals having different frequencies and / or different communication protocols.

[0021] FIG. 4 shows an exemplary view of the thermal conductive sheet 400. The thermal conductive sheet 400 may be thermally anisotropic along a plane. The thermal conductive sheet 400 is configured to provide (e.g., dissipate) high heat transfer capability mainly along a plane (e.g., the X'-Y' plane). Thus, heat can be dissipated well along any direction of the plane (e.g., X'-Y'). However, the thermal conductive sheet 400 has low, little (relatively compared to heat transfer along the plane), or no heat transfer capability in other directions and / or other planes. For example, the thermal conductive sheet 400 has little or no heat transfer capability in the Z' direction, the Z' direction of the X'-Z' plane, and / or the Z' direction of the Y'-Z' plane. The thermal conductive sheet 400 may include graphite (e.g., a graphite sheet). In some implementations, the thermal conductive sheet 400 in the X'-Y' plane has a thermal conductivity in the range of about 1000 to 1900 watts per meter kelvin (W / (mk)). Thus, along any direction of the plane (e.g., X'-Y'), the thermal conductive sheet 400 has a thermal conductivity in the range of about 1000 to 1900 watts per meter kelvin (W / (mk)). In some implementations, the thermal conductive sheet 400 in the Z' direction has a thermal conductivity of less than 30 watts per meter kelvin (W / (mk)) (e.g., 3.5 W / (mk)).

[0022] FIG. 5 shows an exemplary diagram of the thermal conduction layer 500. The thermal conduction layer 500 may be thermally anisotropic conductive along a direction in the plane. The thermal conduction layer 500 includes a plurality of segmented thermal conduction channels 502 (e.g., segmented thermally anisotropic conduction channels). The thermal conduction layer 500 is configured to provide (e.g., dissipate) heat transfer mainly along a direction (e.g., the Y' direction) in a plane (e.g., the Y'-Z' plane). Thus, heat can be dissipated well along the Y' direction of the plane (e.g., Y'-Z'). However, the thermal conduction sheet 400 may provide little or no heat transfer capacity in other directions and / or other planes (relative to the direction that can provide the most heat transfer). For example, the thermal conduction layer 500 may provide little or no heat transfer capacity in the Z' direction (e.g., may provide little or no heat transfer between the segmented thermal conduction channels 502). The thermal conduction layer 500 can include graphite (e.g., a graphite sheet). In some implementations, the thermal conduction layer 500 in the Y' direction of the Y'-Z' plane has a thermal conductivity in the range of about 1000 to 1900 watts per meter kelvin (W / (mk)). In some implementations, the thermal conduction layer 500 in the Z' direction has a thermal conductivity of less than 30 watts per meter kelvin (W / (mk)) (e.g., 3.5 W / (mk)). The segmented thermal conduction channels (e.g., 502) can include a thermally conductive material that has a high thermal conductivity value in a first direction but a low thermal conductivity value in at least a second direction. For example, at least one segmented thermal conduction channel includes a thermally conductive material that has a high thermal conductivity value along the length of the segmented thermal conduction channel but a low thermal conductivity value toward an adjacent segmented thermal conduction channel. The segmented thermal conduction channels include a thermally conductive material that has a relatively high thermal conductivity value in a first direction but a relatively low thermal conductivity value in at least a second direction. The segmented thermal conduction channels have a relatively high thermal conductivity value in a first direction (e.g., along the length of the channel) but a relatively low thermal conductivity value in at least a second direction (e.g., along the width of one or more channels (singular or plural)).Accordingly, the thermal conduction layer 500 includes segmented thermally anisotropic conduction channels (e.g., 502) configured to provide a high thermal conductivity along a first direction (e.g., length) and a low thermal conductivity along another direction (e.g., width, second direction).

[0023] The term "high thermal conductivity value" may be high absolutely and / or relatively with respect to another thermal conductivity value. The term "low thermal conductivity value" may be low absolutely and / or relatively with respect to another thermal conductivity value. As used in the present disclosure, the term "relatively high thermal conductivity value" can mean a thermal conductivity value that is at least five times higher than the thermal conductivity value of a "relatively low thermal conductivity value". For example, the relatively high thermal conductivity value can have a thermal conductivity value that is at least five times higher than the relatively low thermal conductivity value. In another example, the relatively high thermal conductivity value can have a thermal conductivity value that is at least ten times higher than the relatively low thermal conductivity value. In yet another example, the relatively high thermal conductivity value can have a thermal conductivity value that is at least one hundred times higher than the relatively low thermal conductivity value. Accordingly, the thermal conductivity value in the first direction (e.g., high thermal conductivity value) can have a thermal conductivity value that is at least five times higher (e.g., at least ten times higher, at least one hundred times higher) than the thermal conductivity value in the second direction (e.g., relatively low thermal conductivity value). It should be noted that the ranges of thermal conductivity values mentioned and described in the present disclosure are exemplary. Different materials can have different thermal conductivity values, such as values higher and / or lower than the thermal conductivity values mentioned and described in the present disclosure.

[0024] The plurality of segmented thermal conduction channels 502 includes a first segmented thermal conduction channel 502a, a second segmented thermal conduction channel 502b, a third segmented thermal conduction channel 502c, and a fourth segmented thermal conduction channel 502d.

[0025] As shown in FIG. 5, each of the segmented heat conduction channels from the plurality of segmented heat conduction channels 502 is aligned in a first direction (e.g., the Y' direction) along a plane (e.g., the Y'-Z' plane). For example, the length of each of the segmented heat conduction channels from the plurality of segmented heat conduction channels 502 is aligned in a first direction (e.g., the Y' direction) along a plane (e.g., the Y'-Z' plane). Further, each of the segmented heat conduction channels (e.g., 502a, 502b, 502c, 502d) from the plurality of segmented heat conduction channels 502 includes a thermally anisotropic conduction channel configured to provide heat transfer mainly in a first direction (e.g., the Y' direction along the length of the segmented heat conduction channel) of a first plane (e.g., the Y'-Z' plane). The plurality of segmented heat conduction channels 502 are coupled via at least one adhesive 503. The at least one adhesive 503 may include glue and / or a binder. The at least one adhesive 503 can include adhesive 503a, adhesive 503b, adhesive 503c, and adhesive 503d. The at least one adhesive 503 may be disposed between the segmented heat conduction channels (e.g., 502a, 502b, 502c, 502d). For example, the adhesive 503a can be disposed between the first segmented heat conduction channel 502a and the second segmented heat conduction channel 502b. The adhesive 503b can be disposed between the second segmented heat conduction channel 502b and the third segmented heat conduction channel 502c. The adhesive 503c can be disposed between the third segmented heat conduction channel 502c and the fourth segmented heat conduction channel 502d. It should be noted that the adhesive does not necessarily have to be present between the segmented heat conduction channels and / or along the entire length of the segmented heat conduction channels. Each of the segmented heat conduction channels may be defined by a cut graphite sheet.

[0026] In some implementations, each segmented heat conduction channel (e.g., 502a, 502b, 502c, 502d) in the Y'-direction of the Y'-Z' plane has a thermal conductivity within the range of about 1000 to 1900 watts per meter kelvin (W / (mk)). In some implementations, each segmented heat conduction channel (e.g., 502a, 502b, 502c, 502d) in the Z'-direction, the Z'-direction of the X'-Z' plane, and / or the Z'-direction of the Y'-Z' plane has a thermal conductivity of less than 30 watts per meter kelvin (W / (mk)) (e.g., 3.5 W / (mk)). Each segmented heat conduction channel may be a thermally anisotropic conduction channel (e.g., the first thermally anisotropic conduction channel, the second thermally anisotropic conduction channel, the third thermally anisotropic conduction channel, the fourth thermally anisotropic conduction channel). Each segmented heat conduction channel can have a high thermal conductivity (e.g., a high thermal conductivity value, a relatively high thermal conductivity value, the thermal conductivity in the first direction, the thermal conductivity value in the first direction) along the length of the segmented heat conduction channel. Each segmented heat conduction channel can have a low thermal conductivity (e.g., a low thermal conductivity value, a relatively low thermal conductivity value, the thermal conductivity in the second direction, the thermal conductivity value in the second direction) along the width of the segmented heat conduction channel. Each segmented heat conduction channel can have a low thermal conductivity (e.g., a low thermal conductivity value, a relatively low thermal conductivity value, the thermal conductivity in the second direction, the thermal conductivity value in the second direction) between adjacent and / or neighboring segmented heat conduction channels. Thus, the thermal conductivity value between adjacent and / or neighboring heat conduction channels (e.g., the first heat conduction channel and the second heat conduction channel) may be low and / or lower than the thermal conductivity value of the heat conduction channel along the length of the heat conduction channel.

[0027] In some implementations, each of the segmented heat conduction channels 502 can have a width in the range of about 25 to 50 micrometers. However, it should be noted that the segmented heat conduction channels 502 may have a width outside the above range. In some implementations, the segmented heat conduction channels 502 can have the same or different widths. The plurality of segmented heat conduction channels 502 are configured such that heat transfer initially occurs mainly along the length of the segmented heat conduction channels and there is little or no heat transfer between adjacent segmented heat conduction channels initially. However, over a period of time, there can be more heat transfer (e.g., heat dissipation) occurring in other non-primary directions. The term "little or no heat transfer capacity" in a particular direction means that there is a minimum or negligible heat transfer capacity in that particular direction relative to the heat transfer capacity in the direction where the maximum, primary, and / or most heat transfer capacity exists (e.g., the heat transfer capacity represents less than 5% of the heat transfer capacity in the direction where the maximum heat transfer capacity exists). The thickness or the thinnest thickness (in the X' direction) of the heat conduction layer 500 (relative to the length of the heat conduction layer and / or the length of the segmented heat conduction channels) is such that heat transfer (e.g., heat dissipation) initially occurs mostly and mainly in the Y' direction. For example, if there is a heat source located under the center of the heat conduction layer 500, the heat initially and mostly moves in the Y' direction along the segmented heat conduction channels 502, and some heat then and / or finally escapes and / or dissipates in the X' direction and / or Z' direction. The heat transfer capacity can be expressed in absolute terms and / or relative terms. The heat transfer capacity can be represented by a thermal conductivity value.

[0028] The heat conduction layer 500 can be implemented in many configurations and / or implementation forms. FIGS. 6-12 show examples of how the heat conduction layer 500 can be implemented, combined, and / or modified to provide different heat conduction layers. Therefore, the characteristics described with respect to the heat conduction layer 500 and the heat conduction channel 502 (e.g., anisotropic characteristics) may be applicable to at least any of the heat conduction layers and / or any of the heat conduction channels shown and described in FIGS. 6-12. An exemplary sequence for manufacturing a heat conduction layer with a plurality of segmented heat conduction channels will be described below with respect to at least FIGS. 17-18.

[0029] FIG. 6 shows a plan view of a heat conduction layer 600 including a plurality of segmented heat conduction channels 602. The heat conduction layer 600 is shown positioned over integrated devices 205 and 215. The heat conduction layer 600 is similar to the heat conduction layer 500 of FIG. 5. The plurality of segmented heat conduction channels 602 may be similar to the plurality of segmented heat conduction channels 502. As shown in FIG. 6, the heat conduction layer 600 is disposed over the region (of the device) including integrated device 205 and / or integrated device 215 such that heat transfer (e.g., heat dissipation) initially occurs primarily along the X'' direction in the X''-Y'' plane. The heat conduction layer 600 can be directly or indirectly coupled to integrated device 205 and / or integrated device 215. As shown in FIG. 6, the lengths of the plurality of segmented heat conduction channels 602 are aligned in the X'' direction in the X''-Y'' plane. In this configuration and / or arrangement, the plurality of segmented heat conduction channels 602 are aligned in the X'' direction (e.g., the first direction) in the X''-Y'' plane, and heat transfer initially occurs primarily along the X'' direction in the X''-Y'' plane. Thereby, there is little or no heat transfer in the Y'' direction in the X''-Y'' plane initially, providing thermal isolation between integrated device 205 and integrated device 215. Thus, the heat conduction layer 600 includes segmented thermally anisotropic conduction channels configured to provide (i) high thermal conductivity along a first direction (e.g., the length of the channel) and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the second direction).

[0030] Note that in the part(s) of the thermal conduction layer 600 above the integrated device 205 and / or the integrated device 215, there can be a heat transfer capability in the Z’’ direction (perpendicular to both the Y’’ direction and the X’’ direction). In some implementations, two separate thermal conduction layers (e.g., 600) can be used, and each thermal conduction layer (e.g., 600) is disposed on top of each respective integrated device. For example, the first thermal conduction layer (e.g., 600) may be disposed on top of the integrated device 205, and the second thermal conduction layer (e.g., 600) may be disposed on top of the integrated device 215.

[0031] FIG. 7 shows a plan view of a thermal conduction layer 700 including a first portion 705, a second portion 715, and a heat insulating material 710 (e.g., a heat insulating layer). The first portion 705 includes a first plurality of segmented thermal conduction channels 707 (e.g., segmented thermally anisotropic conduction channels). The second portion 715 includes a second plurality of segmented thermal conduction channels 717 (e.g., segmented thermally anisotropic conduction channels). The first portion 705 is coupled to the second portion 715 via the heat insulating material 710. The heat insulating material 710 may include an aerogel. The heat insulating material 710 can have a thermal conductivity of about 0.018 watts per meter kelvin (W / (mk)). However, different implementations and / or different materials can have different thermal conductivity values. For example, the heat insulating material 710 (and / or any heat insulating material described in the present disclosure) can have a thermal conductivity of 0.1 W / mk or less. Foam sponge is another example of a heat insulating material. The first plurality of segmented thermal conduction channels 707 are coupled to the second plurality of segmented thermal conduction channels 717 via the heat insulating material 710. An adhesive can be used to couple the first portion 705 to the heat insulating material 710. Similarly, an adhesive can be used to couple the second portion 715 to the heat insulating material 710. However, it should be noted that other methods can be used to combine the first portion 705, the heat insulating material 710, and the second portion 715. The first plurality of segmented thermal conduction channels 707 and the second plurality of segmented thermal conduction channels 717 are part of a plurality of segmented thermal conduction channels for the thermal conduction layer 700. The first plurality of segmented thermal conduction channels 707 and the second plurality of segmented thermal conduction channels 717 are aligned in the X'' direction of the X''-Y'' plane. Accordingly, the segmented thermal conduction channels 707 and 717 are configured to provide (i) a high thermal conductivity along a first direction (e.g., the length of the channel) and (ii) a low thermal conductivity along another direction (e.g., the width of the channel, the second direction).

[0032] As shown in FIG. 7, the thermal conduction layer 700 is disposed over the region (of the device) that includes the integrated device 205 and / or the integrated device 215 such that heat transfer (e.g., heat dissipation) initially occurs primarily along the X'' direction of the X''-Y'' plane. The thermal conduction layer 700 can be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. The use of the thermal insulation material 710 helps to further reduce and / or eliminate heat transfer in the Y'' direction of the X''-Y'' plane, thus helping to improve the thermal separation between the integrated device 205 and the integrated device 215. It should be noted that in the portion(s) of the thermal conduction layer 700 above the integrated device 205 and / or the integrated device 215, there can be a heat transfer capability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction).

[0033] FIG. 8 shows a plan view of a thermal conduction layer 800 that alternately includes segmented thermal conduction channels and thermal insulation materials. The thermal conduction layer 800 includes a plurality of segmented thermal conduction channels 707a, a plurality of segmented thermal conduction channels 707b, a plurality of segmented thermal conduction channels 707c, a plurality of segmented thermal conduction channels 717a, a plurality of segmented thermal conduction channels 717b, a plurality of segmented thermal conduction channels 717c, thermal insulation materials 710a, thermal insulation materials 710b, thermal insulation materials 710c, thermal insulation materials 710d, thermal insulation materials 710e, thermal insulation materials 710f, and thermal insulation materials 710g. An adhesive can be used to couple the plurality of segmented conduction channels and the thermal insulation material(s). The thermal insulation material (e.g., 710a - 710g) may include an aerogel.

[0034] A plurality of segmented heat conduction channels 707a (e.g., segmented heat anisotropic conduction channels), a plurality of segmented heat conduction channels 707b (e.g., segmented heat anisotropic conduction channels), a plurality of segmented heat conduction channels 707c (e.g., segmented heat anisotropic conduction channels), a plurality of segmented heat conduction channels 717a (e.g., segmented heat anisotropic conduction channels), a plurality of segmented heat conduction channels 717b (e.g., segmented heat anisotropic conduction channels), and / or a plurality of segmented heat conduction channels 717c (e.g., segmented heat anisotropic conduction channels) can be aligned in the X'' direction of the X''-Y'' plane.

[0035] A plurality of segmented heat conduction channels 707a, a plurality of segmented heat conduction channels 707b, a plurality of segmented heat conduction channels 707c, a plurality of segmented heat conduction channels 717a, a plurality of segmented heat conduction channels 717b, and / or a plurality of segmented heat conduction channels 717c can be configured to provide heat transfer mainly along the X'' direction of the X''-Y'' plane. Thus, the heat conduction layer 800 includes segmented heat anisotropic conduction channels configured to provide high thermal conductivity along a first direction (e.g., the length of the channel) and low thermal conductivity along another direction (e.g., the width of the channel, the second direction). The heat conduction layer 800 can be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. The heat conduction layer 800 can provide improved thermal separation between the integrated device 205 and the integrated device 215 by using additional thermal insulation materials. It should be noted that there can be a heat transfer ability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction) in the portion(s) of the heat conduction layer 800 above the integrated device 205 and / or the integrated device 215.

[0036] FIG. 9 shows a plan view of a heat conduction layer 900 including a first heat conduction layer 905 and a second heat conduction layer 915. The first heat conduction layer 905 may be a first portion of the heat conduction layer 900. The second heat conduction layer 915 may be a second portion of the heat conduction layer 900. Although not shown, the heat conduction layer 900 may include a heat insulating material (e.g., 710) between the first heat conduction layer 905 and the second heat conduction layer 915. The first heat conduction layer 905 includes a first plurality of segmented heat conduction channels 907 (e.g., segmented thermally anisotropic conduction channels). The second heat conduction layer 915 includes a second plurality of segmented heat conduction channels 917 (e.g., segmented thermally anisotropic conduction channels). The first heat conduction layer 905 is coupled to the second heat conduction layer 915 (e.g., by using an adhesive). In some implementations, the first heat conduction layer 905 is coupled to the second heat conduction layer 915 via a heat insulating material 710.

[0037] The first plurality of segmented heat conduction channels 907 and the second plurality of segmented heat conduction channels 917 are part of a plurality of segmented heat conduction channels for the heat conduction layer 900. The first plurality of segmented heat conduction channels 907 are aligned in the Y'' direction of the X''-Y'' plane. For example, the lengths of the first plurality of segmented heat conduction channels 907 are aligned in the Y'' direction of the X''-Y'' plane. The first plurality of segmented heat conduction channels 907 are configured to primarily provide heat transfer along the Y'' direction of the X''-Y'' plane (e.g., provide a high heat conductivity value in the first direction). The second plurality of segmented heat conduction channels 917 are aligned in the X'' direction of the X''-Y'' plane. For example, the lengths of the second plurality of segmented heat conduction channels 917 are aligned in the X'' direction of the X''-Y'' plane. The second plurality of segmented heat conduction channels 917 are configured to primarily provide heat transfer along the X'' direction of the X''-Y'' plane (e.g., provide a high heat conductivity value in the second direction). The Y'' direction (e.g., the second direction) may be perpendicular to the X'' direction (e.g., the first direction).

[0038] The segmented heat conduction channels 907 are configured to provide high thermal conductivity along (i) a first direction (e.g., the length of the channel, the Y'' direction) and low thermal conductivity along (ii) another direction (e.g., the width of the channel, the second direction, the X'' direction). The segmented heat conduction channels 917 are configured to provide high thermal conductivity along (i) a second direction (e.g., the length of the channel, the X'' direction) and low thermal conductivity along (ii) another direction (e.g., the width of the channel, the first direction, the Y'' direction).

[0039] This configuration and / or arrangement of the plurality of segmented heat conduction channels can be used when heat transfer (e.g., heat dissipation) in a particular direction and / or towards a particular location is desired.

[0040] The heat conduction layer 900 can be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. As shown in FIG. 9, the heat conduction layer 900 is disposed over the region including the integrated device 205 and / or the integrated device 215 such that (i) heat transfer (e.g., heat dissipation) primarily occurs first along the Y'' direction in the X''-Y'' plane in a first region including the integrated device 205, and (ii) heat transfer (e.g., heat dissipation) primarily occurs first along the X'' direction in the X''-Y'' plane in a second region including the integrated device 215. It should be noted that there can be a heat transfer capability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction) in the portion(s) of the heat conduction layer 900 above the integrated device 205 and / or the integrated device 215.

[0041] FIG. 10 shows a plan view of a heat conduction layer 1000 including a first heat conduction layer 1005 and a second heat conduction layer 915. The first heat conduction layer 1005 may be a first portion of the heat conduction layer 1000. The second heat conduction layer 915 may be a second portion of the heat conduction layer 1000. Although not shown, the heat conduction layer 1000 may include a heat insulating material (e.g., 710) between the first heat conduction layer 1005 and the second heat conduction layer 915. The first heat conduction layer 1005 includes a first plurality of segmented heat conduction channels 1007 (e.g., segmented heat anisotropic conduction channels). The second heat conduction layer 915 includes a second plurality of segmented heat conduction channels 917 (e.g., segmented heat anisotropic conduction channels). The first heat conduction layer 1005 is coupled to the second heat conduction layer 915 (e.g., by using an adhesive). In some implementations, the first heat conduction layer 1005 is coupled to the second heat conduction layer 915 via a heat insulating material 710.

[0042] The first plurality of segmented heat conduction channels 1007 and the second plurality of segmented heat conduction channels 917 are part of a plurality of segmented heat conduction channels for the heat conduction layer 1000. The first plurality of segmented heat conduction channels 1007 are aligned in the diagonal direction of the X''-Y'' plane. For example, the length of the first plurality of segmented heat conduction channels 1007 is aligned in the diagonal direction of the X''-Y'' plane. The first plurality of segmented heat conduction channels 1007 are configured to primarily provide heat transfer along the diagonal direction of the X''-Y'' plane initially (e.g., provide a high thermal conductivity value in the first direction). The second plurality of segmented heat conduction channels 917 are aligned in the X'' direction of the X''-Y'' plane. For example, the length of the second plurality of segmented heat conduction channels 917 is aligned in the X'' direction of the X''-Y'' plane. The second plurality of segmented heat conduction channels 917 are configured to primarily provide heat transfer along the X'' direction of the X''-Y'' plane initially (e.g., provide a high thermal conductivity value in the second direction). The diagonal direction (e.g., the second direction) may be oblique with respect to the X'' direction (e.g., the first direction).

[0043] The segmented heat conduction channel 1007 is configured to provide high thermal conductivity along the first direction (e.g., the length of the channel, the diagonal direction) and low thermal conductivity along another direction (e.g., the width of the channel, the second direction, another diagonal direction). The segmented heat conduction channel 917 is configured to provide high thermal conductivity along the third direction (e.g., the length of the channel, the X'' direction) and low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y'' direction).

[0044] This configuration and / or arrangement of the plurality of segmented heat conduction channels can be used when heat transfer (e.g., heat dissipation) in a specific direction and / or towards a specific position is desired.

[0045] The heat conduction layer 1000 can be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. As shown in FIG. 10, the heat conduction layer 1000 is arranged over the region including the integrated device 205 and / or the integrated device 215 such that (i) heat transfer (e.g., heat dissipation) primarily occurs first along the diagonal direction in the X''-Y'' plane in the first region including primarily the integrated device 205, and (ii) heat transfer (e.g., heat dissipation) primarily occurs first along the X'' direction in the X''-Y'' plane in the second region including primarily the integrated device 215. It should be noted that in the portion(s) of the heat conduction layer 1000 above the integrated device 205 and / or the integrated device 215, there can be a heat transfer capability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction).

[0046] FIG. 11 shows a plan view of a heat conduction layer 1100 including a first heat conduction layer 1125, a second heat conduction layer 1135, a third heat conduction layer 1145, a fourth heat conduction layer 1155, a heat insulating material 710, a heat insulating material 1110, and a heat insulating material 1111. The first heat conduction layer 1125 may be a first portion of the heat conduction layer 1100. The second heat conduction layer 1135 may be a second portion of the heat conduction layer 1100. The third heat conduction layer 1145 may be a third portion of the heat conduction layer 1100. The fourth heat conduction layer 1155 may be a fourth portion of the heat conduction layer 1100. The first heat conduction layer 1125 includes a first plurality of segmented heat conduction channels 1127 (e.g., segmented heat anisotropic conduction channels). The second heat conduction layer 1135 includes a second plurality of segmented heat conduction channels 1137 (e.g., segmented heat anisotropic conduction channels). The third heat conduction layer 1145 includes a third plurality of segmented heat conduction channels 1147 (e.g., segmented heat anisotropic conduction channels). The fourth heat conduction layer 1155 includes a fourth plurality of segmented heat conduction channels 1157 (e.g., segmented heat anisotropic conduction channels). The first heat conduction layer 1125 is coupled to the second heat conduction layer 1135 and the third heat conduction layer 1145 via the heat insulating material 710. The second heat conduction layer 1135 is coupled to the third heat conduction layer 1145 via the heat insulating material 1110. The first heat conduction layer 1125 is coupled to the fourth heat conduction layer 1155 via the heat insulating material 1111. The third heat conduction layer 1145 is coupled to the fourth heat conduction layer 1155 via the heat insulating material 710. Note that the heat insulating materials shown in FIG. 11 are optional. In some implementations, a portion of the heat conduction layer 1100 can be coupled to another portion of the heat conduction layer 1100 via an adhesive.

[0047] The first plurality of segmented heat conduction channels 1127 are aligned in a first diagonal direction of the X''-Y'' plane. For example, the lengths of the first plurality of segmented heat conduction channels 1127 are aligned in the first diagonal direction of the X''-Y'' plane. The first plurality of segmented heat conduction channels 1127 are configured to primarily provide heat transfer along the first diagonal direction of the X''-Y'' plane first (e.g., provide a high heat conductivity value in the first direction). The second plurality of segmented heat conduction channels 1137 are aligned in the X'' direction of the X''-Y'' plane. For example, the lengths of the second plurality of segmented heat conduction channels 1137 are aligned in the X'' direction of the X''-Y'' plane. The second plurality of segmented heat conduction channels 1137 are configured to primarily provide heat transfer along the X'' direction of the X''-Y'' plane first (e.g., provide a high heat conductivity value in the second direction). The third plurality of segmented heat conduction channels 1147 are aligned in the X'' direction of the X''-Y'' plane. For example, the lengths of the third plurality of segmented heat conduction channels 1147 are aligned in the X'' direction of the X''-Y'' plane. The third plurality of segmented heat conduction channels 1147 are configured to primarily provide heat transfer along the X'' direction of the X''-Y'' plane first (e.g., provide a high heat conductivity value in the third direction). The fourth plurality of segmented heat conduction channels 1157 are aligned in a second diagonal direction of the X''-Y'' plane. For example, the lengths of the fourth plurality of segmented heat conduction channels 1157 are aligned in the second diagonal direction of the X''-Y'' plane. The fourth plurality of segmented heat conduction channels 1157 are configured to primarily provide heat transfer along the second diagonal direction of the X''-Y'' plane first (e.g., provide a high heat conductivity value in the fourth direction). The second diagonal direction may be the same as or different from the first diagonal direction. The first diagonal direction (e.g., the second direction) may be oblique to the X'' direction (e.g., the first direction) and / or the Y'' direction. The second diagonal direction (e.g., the second direction) may be oblique to the X'' direction (e.g., the first direction) and / or the Y'' direction.

[0048] The segmented heat conduction channels 1127 are configured to provide high thermal conductivity along (i) a first direction (e.g., the length of the channel, the first diagonal direction) and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the second diagonal direction). The segmented heat conduction channels 1137 are configured to provide high thermal conductivity along (i) a third direction (e.g., the length of the channel, the X'' direction) and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y'' direction). The segmented heat conduction channels 1147 are configured to provide high thermal conductivity along (i) a third direction (e.g., the length of the channel, the X'' direction) and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y'' direction). The segmented heat conduction channels 1157 are configured to provide high thermal conductivity along (i) a first direction (e.g., the length of the channel, the first diagonal direction) and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the second diagonal direction).

[0049] This configuration and / or arrangement of the plurality of segmented heat conduction channels can be used when heat transfer (e.g., heat dissipation) in a specific direction and / or towards a specific position is desired.

[0050] The heat conduction layer 1100 can be directly or indirectly coupled to the integrated device 205, the integrated device 215, the component 1105, and / or the component 1115. As shown in FIG. 11, the heat conduction layer 1000 is arranged over the region (of the device) including the integrated device 205, the integrated device 215, the component 1105, and the component 1115 such that (i) heat transfer (e.g., heat dissipation) first occurs mainly along a first diagonal direction in the X''-Y'' plane in a first region including the integrated device 205, (ii) heat transfer (e.g., heat dissipation) first occurs mainly along the X'' direction in the X''-Y'' plane in a second region including the integrated device 215, (iii) heat transfer (e.g., heat dissipation) first occurs mainly along the X'' direction in the X''-Y'' plane in a third region including the component 1115, and (iv) heat transfer (e.g., heat dissipation) first occurs mainly along a first diagonal direction in the X''-Y'' plane in a fourth region including the component 1105. Note that there can be a heat transfer capability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction) in the portion(s) of the heat conduction layer 1100 above the integrated device 205, the integrated device 215, the component 1105, and / or the component 1115.

[0051] FIG. 12 shows a plan view of a heat conduction layer 1200 including a first heat conduction layer 1225, a second heat conduction layer 1135, a third heat conduction layer 1245, a fourth heat conduction layer 1155, a heat insulating material 710, a heat insulating material 1110, and a heat insulating material 1111. The first heat conduction layer 1225 may be a first portion of the heat conduction layer 1200. The second heat conduction layer 1135 may be a second portion of the heat conduction layer 1200. The third heat conduction layer 1245 may be a third portion of the heat conduction layer 1200. The fourth heat conduction layer 1155 may be a fourth portion of the heat conduction layer 1200. The first heat conduction layer 1225 includes a first plurality of segmented heat conduction channels 1227 (e.g., segmented heat anisotropic conduction channels). The second heat conduction layer 1135 includes a second plurality of segmented heat conduction channels 1137 (e.g., segmented heat anisotropic conduction channels). The third heat conduction layer 1245 includes a third plurality of segmented heat conduction channels 1247 (e.g., segmented heat anisotropic conduction channels). The fourth heat conduction layer 1155 includes a fourth plurality of segmented heat conduction channels 1157 (e.g., segmented heat anisotropic conduction channels). The first heat conduction layer 1225 is coupled to the second heat conduction layer 1135 and the third heat conduction layer 1245 via the heat insulating material 710. The second heat conduction layer 1135 is coupled to the third heat conduction layer 1245 via the heat insulating material 1110. The first heat conduction layer 1225 is coupled to the fourth heat conduction layer 1155 via the heat insulating material 1111. The third heat conduction layer 1245 is coupled to the fourth heat conduction layer 1155 via the heat insulating material 710. Note that the heat insulating material(s) shown in FIG. 12 is / are optional. In some implementations, a portion of the heat conduction layer 1200 can be coupled to another portion of the heat conduction layer 1200 via an adhesive.

[0052] The first plurality of segmented heat conduction channels 1227 are aligned in a second diagonal direction of the X''-Y'' plane. For example, the lengths of the first plurality of segmented heat conduction channels 1227 are aligned in a second diagonal direction of the X''-Y'' plane. The first plurality of segmented heat conduction channels 1227 are configured to primarily provide heat transfer along a second diagonal direction of the X''-Y'' plane first (e.g., provide a high thermal conductivity value in a first direction). The second plurality of segmented heat conduction channels 1137 are aligned in the X'' direction of the X''-Y'' plane. For example, the lengths of the second plurality of segmented heat conduction channels 1137 are aligned in the X'' direction of the X''-Y'' plane. The second plurality of segmented heat conduction channels 1137 are configured to primarily provide heat transfer along the X'' direction of the X''-Y'' plane first (e.g., provide a high thermal conductivity value in a second direction). The third plurality of segmented heat conduction channels 1247 are aligned in the Y'' direction of the X''-Y'' plane. For example, the lengths of the third plurality of segmented heat conduction channels 1247 are aligned in the Y'' direction of the X''-Y'' plane. The third plurality of segmented heat conduction channels 1247 are configured to primarily provide heat transfer along the Y'' direction of the X''-Y'' plane first (e.g., provide a high thermal conductivity value in a third direction). The fourth plurality of segmented heat conduction channels 1157 are aligned in a first diagonal direction of the X''-Y'' plane. For example, the lengths of the fourth plurality of segmented heat conduction channels 1157 are aligned in a first diagonal direction of the X''-Y'' plane. The fourth plurality of segmented heat conduction channels 1157 are configured to primarily provide heat transfer along a first diagonal direction of the X''-Y'' plane first (e.g., provide a high thermal conductivity value in a fourth direction). The second diagonal direction may be a direction different from the first diagonal direction. The first diagonal direction and / or the second diagonal direction may be oblique with respect to the X'' direction and / or the Y'' direction.

[0053] The segmented heat conduction channels 1227 are configured to provide high thermal conductivity along (i) a second direction (e.g., the length of the channel, the second diagonal direction), and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the first direction, the first diagonal direction). The segmented heat conduction channels 1137 are configured to provide high thermal conductivity along (i) a third direction (e.g., the length of the channel, the X'' direction), and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y'' direction). The segmented heat conduction channels 1247 are configured to provide high thermal conductivity along (i) a fourth direction (e.g., the length of the channel, the Y'' direction), and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the third direction, the X'' direction). The segmented heat conduction channels 1157 are configured to provide high thermal conductivity along (i) a first direction (e.g., the length of the channel, the first diagonal direction), and (ii) low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the second diagonal direction).

[0054] This configuration and / or arrangement of the plurality of segmented heat conduction channels can be used when heat transfer (e.g., heat dissipation) in a particular direction and / or towards a particular position is desired.

[0055] The heat conduction layer 1200 can be directly or indirectly coupled to the integrated device 205, the integrated device 215, the component 1105, and / or the component 1115. As shown in FIG. 12, the heat conduction layer 1000 is such that (i) heat transfer (e.g., heat dissipation) initially mainly occurs along the second diagonal direction of the X''-Y'' plane in a first region including the integrated device 205, (ii) heat transfer (e.g., heat dissipation) initially mainly occurs along the X'' direction of the X''-Y'' plane in a second region including the integrated device 215, (iii) heat transfer (e.g., heat dissipation) initially mainly occurs along the Y'' direction of the X''-Y'' plane in a third region including the component 1115, and (iv) heat transfer (e.g., heat dissipation) initially mainly occurs along the first diagonal direction of the X''-Y'' plane in a fourth region including the component 1105, and is disposed over the regions including the integrated device 205, the integrated device 215, the component 1105, and the component 1115. It should be noted that in the part(s) of the heat conduction layer 1200 above the integrated device 205, the integrated device 215, the component 1105, and / or the component 1115, there can be a heat transfer capability in the Z'' direction (perpendicular to both the Y'' direction and the X'' direction).

[0056] It should be noted that the use of terms such as directions (e.g., X'' direction, Y'' direction, X' direction, Y' direction) in the present disclosure can mean positive and / or negative directions. The heat conduction layer with segmented heat conduction channels in FIGS. 5 - 12 can be used instead of, or in combination with, the heat conduction layer 330 in FIG. 3. FIGS. 6 - 12 show how a heat conduction layer including segmented heat conduction channels can be used to control how and / or where heat is dissipated within a device. It should be noted that other implementations can use other configurations and / or arrangements of segmented thermally anisotropic conduction channels.

[0057] Figures 13 and 14 show exemplary temperature maps and / or heat maps showing the temperature at the junction points of components configured to generate heat. FIG. 13 shows an exemplary junction temperature map 1300 of a device that does not include a heat conduction layer having a plurality of segmented heat conduction channels. The junction temperature map 1300 includes the junction temperature in the integrated device 205 and the junction temperature in the integrated device 215. As shown in FIG. 13, when the device does not include a heat conduction layer having a plurality of segmented heat conduction channels, the junction temperature in the integrated device 205 and the junction temperature in the integrated device 215 can reach 100 degrees Celsius.

[0058] FIG. 14 shows an exemplary junction temperature map 1400 of a device that includes a heat conduction layer having a plurality of segmented heat conduction channels. The junction temperature map 1400 includes the junction temperature in the integrated device 205 and the junction temperature in the integrated device 215. As shown in FIG. 14, when the device includes a heat conduction layer having a plurality of segmented heat conduction channels, the junction temperature in the integrated device 205 and the junction temperature in the integrated device 215 can reach 93 degrees Celsius.

[0059] Therefore, as shown in FIGS. 13 and 14, the use of a heat conduction layer having a plurality of segmented heat conduction channels (e.g., segmented thermally anisotropic conduction channels) helps to reduce the junction temperature of the integrated device, thereby helping to prevent the integrated device from overheating. This can result in better performance of the integrated device and / or devices that include these integrated devices.

[0060] Figures 15 and 16 show exemplary temperature maps and / or heat maps indicating the temperature at display points of the device. Figure 15 shows an exemplary display surface temperature map 1500 of a device that does not include a thermal conduction layer with a plurality of segmented thermal conduction channels. The display surface temperature map 1500 includes the display surface temperature on the integrated device 205 and the display surface temperature on the integrated device 215. As shown in Figure 15, when the device does not include a thermal conduction layer with a plurality of segmented thermal conduction channels, the display surface temperature on the integrated device 205 and the display surface temperature on the integrated device 215 can reach 52 degrees Celsius.

[0061] Figure 16 shows an exemplary display surface temperature map 1600 of a device that includes a thermal conduction layer with a plurality of segmented thermal conduction channels. The display surface temperature map 1600 includes the display surface temperature on the integrated device 205 and the display surface temperature on the integrated device 215. Figure 15 shows how the display surface temperature can be reduced by using a thermal conduction layer that includes a plurality of segmented thermal conduction channels (e.g., segmented thermally anisotropic conduction channels). As shown in Figure 16, when the device includes a thermal conduction layer with a plurality of segmented thermal conduction channels, the display surface temperature on the integrated device 205 and the display surface temperature on the integrated device 215 can reach 44 degrees Celsius. Figure 16 shows that with the help of the thermal conduction channels that help reduce the surface temperature of the device (e.g., the display surface temperature), more of the heat generated by the integrated device 205 and the integrated device 215 spreads over a larger surface. Figure 16 also shows how the thermal conduction channels help thermally isolate two adjacent integrated devices. The thermal conduction channels help dissipate heat away from other adjacent integrated devices.

[0062] Accordingly, as shown in FIGS. 15 and 16, the use of a thermally conductive layer comprising a plurality of segmented thermally conductive channels (e.g., segmented thermally anisotropic conductive channels) helps to reduce the display surface temperature of the device, thereby helping to hold and handle the device more comfortably. Note that the figures in FIGS. 13-16 are for illustrative purposes only. The numerical values used in FIGS. 13-16 are exemplary and are used to show the performance advantages of a thermally conductive layer including a plurality of segmented thermally conductive channels. Different implementations can provide different results and performance in heat maps and temperature maps depending on the use, location, configuration, size, shape, and / or arrangement of the thermally conductive layer including a plurality of segmented thermally conductive channels.

[0063] Exemplary sequence for manufacturing a thermally conductive layer comprising a thermally conductive channel FIG. 17 shows an exemplary sequence for providing or manufacturing a thermally conductive layer comprising a thermally conductive channel. In some implementations, the sequence of FIG. 17 can be used to provide or manufacture the thermally conductive layer 500 described in this disclosure.

[0064] Note that the sequence of FIG. 17 can combine one or more steps to simplify and / or clarify the sequence for providing or manufacturing a thermally conductive layer. In some implementations, the order of the process can be changed or modified. In some implementations, one or more of the processes can be exchanged or replaced without departing from the gist of this disclosure.

[0065] Step 1 shows the state after a plurality of thermally conductive sheets 400 are provided, as shown in FIG. 17. The plurality of thermally conductive sheets 400 include graphite (e.g., graphite sheets). Each thermally conductive sheet 400 may be thermally anisotropic conductive along a plane. The thermally conductive sheet 400 is configured to provide (e.g., dissipate) heat transfer mainly along a plane (e.g., the X'-Y' plane). There is little or no heat transfer ability in the Z' direction.

[0066] Stage 2 shows the state after a plurality of heat conduction layers are stacked, laminated, and bonded to form the stacked block 1700 of the heat conduction sheet. At least one adhesive can be used to bond the plurality of heat conduction sheets to each other to form the stacked block 1700 of the heat conduction sheet. The stacked block 1700 of the heat conduction sheet is configured to provide (e.g., dissipate) heat transfer capability mainly along a plane (e.g., the X'-Y' plane). There is little or no heat transfer capability in the Z' direction. Each sheet from the stacked block 1700 of the heat conduction sheet is configured to provide (e.g., dissipate) heat transfer capability mainly along a plane (e.g., the X'-Y' plane).

[0067] Stage 3 shows the state after the stacked block 1700 of the heat conduction sheet is cut (e.g., sliced) to form individual heat conduction layers 500 each having a plurality of segmented heat conduction channels 502. The stacked block 1700 of the heat conduction sheet is cut along various Y'-Z' planes of the stacked block 1700 of the heat conduction sheet to form the individual heat conduction layers 500. The plurality of segmented heat conduction channels 502 may be in the same plane as each other. The plurality of segmented heat conduction channels 502 are aligned in the Y' direction. For example, the lengths of the plurality of segmented heat conduction channels 502 are aligned in the Y' direction. The plurality of segmented heat conduction channels 502 are initially configured to provide (e.g., dissipate) heat transfer capability mainly along the Y' direction and / or along the length of the plurality of segmented heat conduction channels 502 (e.g., provide a high heat conductivity value). The heat conduction layer 500 includes segmented heat conduction channels 502 configured to provide a high heat conductivity along a first direction (e.g., the length of the channel, the Y' direction) and a low heat conductivity along another direction (e.g., the width of the channel, a second direction, the Z' direction).

[0068] Exemplary sequence for manufacturing a heat conduction layer with heat conduction channels FIG. 18 shows an exemplary sequence for providing or manufacturing a thermally conductive layer with thermally conductive channels aligned in different directions. In some implementations, the sequence of FIG. 18 can be used to provide or manufacture the thermally conductive layer 1200 described in this disclosure. However, the sequence of FIG. 18 can be used to provide any of the thermally conductive layers described in this disclosure.

[0069] Note that the sequence of FIG. 18 can combine one or more steps to simplify and / or clarify the sequence for providing or manufacturing a thermally conductive layer. In some implementations, the order of the process can be changed or modified. In some implementations, one or more of the processes can be exchanged or replaced without departing from the gist of this disclosure.

[0070] Step 1 shows the state after several thermally conductive layers (e.g., 1815, 1805, 1835, 1825) are provided as shown in FIG. 18. Each thermally conductive layer includes a plurality of segmented thermally anisotropic conductive channels aligned in different directions (e.g., a first direction, a second direction, a first diagonal direction, a second diagonal direction). In some implementations, some of the thermally conductive layers can include thermally conductive channels aligned in the same direction as the thermally conductive channels from other thermally conductive layers. The thermally conductive layers may have the same, similar, and / or different shapes and / or sizes. FIG. 18 shows an example of the manufacture of a thermally conductive layer with a plurality of segmented thermally anisotropic conductive channels.

[0071] Stage 2 shows the state after several layers are combined using thermal insulation materials. The first thermal conduction layer 1805 is coupled to the second thermal conduction layer 1815 and the third thermal conduction layer 1825 via the thermal insulation material 710. The second thermal conduction layer 1815 is coupled to the third thermal conduction layer 1825 via the thermal insulation material 1110. The first thermal conduction layer 1205 is coupled to the fourth thermal conduction layer 1835 via the thermal insulation material 1111. The third thermal conduction layer 1825 is coupled to the fourth thermal conduction layer 1835 via the thermal insulation material 710. Note that the illustrated thermal insulation materials are optional. In some implementations, a portion of the thermal conduction layer can be coupled to another portion of the thermal conduction layer and / or the thermal insulation material via an adhesive (e.g., glue, binder). Note that other methods and / or materials may be used to couple a portion of the thermal conduction layer to another portion of the thermal conduction layer and / or the thermal insulation material.

[0072] Exemplary flowchart of a method for coupling thermal conduction layers comprising thermal conduction channels FIG. 19 shows an exemplary flowchart of a method 1900 for manufacturing a thermal conduction layer comprising a plurality of segmented thermal conduction channels. In some implementations, the thermal conduction layer 1200 can be manufactured using the method 1900 of FIG. 19. However, any of the thermal conduction layers described in the present disclosure can be manufactured using the method 1900.

[0073] Note that the method 1900 of FIG. 19 can combine one or more processes to simplify and / or clarify the method for manufacturing a thermal conduction layer. In some implementations, the order of the processes can be changed or modified.

[0074] The method provides (in 1905) a plurality of heat conduction sheets 400 (e.g., heat anisotropic conduction sheets). The plurality of heat conduction sheets 400 includes graphite (e.g., graphite layers). Each heat conduction sheet 400 may be thermally anisotropic conductive along a plane. The heat conduction sheet 400 is initially configured to provide (e.g., dissipate) heat transfer ability mainly along a plane (e.g., the X'-Y' plane). The heat conduction layer has little or no heat transfer ability in the Z' direction. Stage 1 of FIG. 17 shows an example of a plurality of heat conduction layers.

[0075] This method combines (in 1910) a plurality of heat conduction sheets by using stacking, laminating, and bonding to form a stacked block 1700 of heat conduction sheets. At least one adhesive can be used to bond the plurality of heat conduction sheets to each other to form a stacked block 1700 of heat conduction sheets. The stacked block 1700 of heat conduction sheets is initially configured to provide (e.g., dissipate) heat transfer ability mainly along a plane (e.g., the X'-Y' plane). The stacked block 1700 of heat conduction sheets has little or no heat transfer ability in the Z' direction. Each layer from the stacked block 1700 of heat conduction sheets is initially configured to provide (e.g., dissipate) heat transfer ability mainly along a plane (e.g., the X'-Y' plane). Stage 2 of FIG. 17 shows an example of a stacked block of heat conduction sheets.

[0076] This method cuts (in 1915) the stacked block 1700 of heat conduction sheets into individual heat conduction layers 500 each having a plurality of segmented heat conduction channels 502. The stacked block 1700 of heat conduction sheets is cut along various Y'-Z' planes of the stacked block 1700 of heat conduction sheets to form individual heat conduction layers 500. The plurality of segmented heat conduction channels 502 are aligned in the Y' direction. The plurality of segmented heat conduction channels 502 are initially configured to provide (e.g., dissipate) heat transfer ability mainly along the Y' direction. Stage 3 of FIG. 17 shows an example of a plurality of segmented heat conduction channels.

[0077] This method combines several layers using a thermal insulation material (in 1920). For example, the first thermal conduction layer 1225 is coupled to the second thermal conduction layer 1135 and the third thermal conduction layer 1245 via a thermal insulation material 710. The second thermal conduction layer 1135 is coupled to the third thermal conduction layer 1245 via a thermal insulation material 1110. The first thermal conduction layer 1225 is coupled to the fourth thermal conduction layer 1155 via a thermal insulation material 1111. The third thermal conduction layer 1245 is coupled to the fourth thermal conduction layer 1155 via a thermal insulation material 710. Note that the illustrated thermal insulation materials are optional. In some implementations, a portion of a thermal conduction layer can be coupled to another portion of a thermal conduction layer and / or a thermal insulation material via an adhesive. Note that the use of one or more thermal insulation materials is optional. Step 2 of FIG. 18 shows an example of coupling different layers to each other.

[0078] Note that in the present disclosure, a number of coordinate systems (X - Y - Z, X' - Y' - Z', X'' - Y'' - Z'') are used and described. These exemplary coordinate systems are used to help explain the anisotropic thermal properties of the thermal conduction layers and / or the segmented thermal conduction channels. These different coordinate systems may be independent of each other or may be related to one or more coordinate systems. Other coordinate systems may be used to illustrate directions, orientations, and / or alignments.

[0079] Exemplary electronic device FIG. 20 shows various electronic devices that can be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package-on-package (PoP), system-in-package (SiP), or system-on-chip (SoC). For example, a mobile phone device 2002, a laptop computer device 2004, a fixed-position terminal device 2006, a wearable device 2008, or an autonomous vehicle 2010 can include a device 2000 as described herein. The device 2000 can be, for example, any of the devices and / or integrated circuit (IC) packages described herein. The devices 2002, 2004, 2006, and 2008, and the vehicle 2010 shown in FIG. 20 are merely illustrative. Other electronic devices including, but not limited to, mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS)-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed-position data units such as meter reading devices, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of things (IoT) devices, servers, routers, electronic devices implemented within autonomous vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof, can also incorporate the device 2000.

[0080] One or more of the components, processes, features, and / or functions shown in FIGS. 3-12 and / or FIGS. 17-20 can be reconfigured and / or combined into a single component, process, feature, or function, or embodied in several components, processes, or functions. Additional elements, components, processes, and / or functions can also be added without departing from the present disclosure. Also note that FIGS. 3-12 and / or FIGS. 17-20, and their corresponding descriptions in the present disclosure, are not limited to dies and / or ICs. In some implementations, FIGS. 3-12 and / or FIGS. 17-20, and their corresponding descriptions can be used to manufacture, fabricate, provide, and / or produce devices and / or integrated devices. In some implementations, the device can include a die, integrated device, integrated passive device (IPD), die package, integrated circuit (IC) device, device package, integrated circuit (IC) package, wafer, semiconductor device, package on package (PoP) device, heat sink device, and / or interposer.

[0081] Note that the figures in the present disclosure can represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some cases, the figures may not be to exact scale. In some cases, not all components and / or parts may be shown for purposes of clarity. In some cases, the positions, locations, sizes, and / or shapes of various parts and / or components in the figures can be exemplary. In some implementations, various components and / or parts in the figures can be optional.

[0082] The term "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any implementation or aspect described herein as "exemplary" should not necessarily be construed as being more preferred or advantageous than other aspects of the present disclosure. Similarly, the term "aspect" does not necessarily require that all aspects of the present disclosure include the features, advantages, or modes of operation being described. The term "coupled" is used herein to refer to a direct or indirect coupling (e.g., a mechanical coupling) between two objects. For example, if object A is physically in contact with object B and object B is in contact with object C, then object A and object C can still be considered to be coupled to each other even if they are not physically in direct contact with each other. The term "electrically coupled" can mean that two objects are directly or indirectly integrally coupled such that an electric current (e.g., a signal, power, ground) can propagate between the two objects. Two objects that are electrically coupled may or may not have an electric current propagating between them. Electromagnetic coupling can mean that a signal from one circuit and / or component affects the signal of another circuit and / or component. Electromagnetic coupling can cause crosstalk. Electromagnetic coupling can be a form of signal coupling. The use of the terms "first," "second," "third," and "fourth" (and / or anything greater than the fourth) is discretionary. Any of the components being described can be the first component, the second component, the third component, or the fourth component. For example, a component referred to as the second component can also be the first component, the second component, the third component, or the fourth component. The terms "top" and "bottom" are discretionary. A component located at the top may be located above a component arranged at the bottom. A top component may be considered a bottom component, and vice versa.As described in the present disclosure, a first component located "over" a second component can mean that the first component is located above or below the second component, depending on how the bottom or top is optionally defined. In another example, the first component may be located on (e.g., above) the first surface of the second component, and the third component may be located on (e.g., below) the second surface of the second component, where the second surface is on the opposite side of the first surface. In the context of one component being located on top of another component, the term "on top of" as used in this application should be further noted to be used to mean a component that exists on and / or within another component (e.g., exists on the surface of the component or is embedded within the component). Therefore, for example, a first component existing on top of a second component means that (1) the first component exists on top of the second component but is not in direct contact with the second component, (2) the first component exists on top of the second component (e.g., on the surface of the second component), and / or (3) the first component exists within the second component (e.g., is embedded within the second component). The term "encapsulating" means that an object can partially or completely encapsulate another object. The term "surrounding" means that an object (singular or plural) can partially or completely surround another object. The term "extending through" means that an object can partially or completely extend through another object. In the context of one component being located on top of another component, the term "on top of" as used in this application should be further noted to be used to mean a component that exists on and / or within another component (e.g., exists on the surface of the component or is embedded within the component).Therefore, for example, the first component being on the second component may mean that: (1) the first component is on the second component but not in direct contact with the second component; (2) the first component is on the second component (e.g., on the surface of the second component); and / or (3) the first component is within the second component (e.g., embedded within the second component). The first component located “in” the second component may be partially located within the second component or may be completely located within the second component. As used in this disclosure, the terms “about ‘value X’” or “approximately value X” mean within a range of 10 percent of “value X”. For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9 to 1.1.

[0083] In some implementations, an interconnect is an element or component of a device or package that enables or facilitates an electrical connection between two points, elements, and / or components. In some implementations, the interconnect may include traces, vias, pads, pillars, redistribution metal layers, and / or under bump metallization (UBM) layers. The interconnect may include one or more metal components (e.g., a seed layer + a metal layer). In some implementations, the interconnect may include a conductive material that can be configured to provide an electrical path for signals (e.g., data signals), ground, and / or power. The interconnect can be part of a circuit. The interconnect may include two or more elements or components. The interconnect may be defined by one or more interconnects. Different implementations can use different processes and / or sequences to form the interconnect. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating, and / or a plating process may be used to form the interconnect.

[0084] Also, note that various disclosures included in this specification may be described as processes shown as flowcharts, flow diagrams, structural diagrams, or block diagrams. Flowcharts can describe operations as sequential processes, but many of those operations can also be executed in parallel or simultaneously. Furthermore, the order of operations can be rearranged. A process ends when its operations are completed.

[0085] In the following, further examples will be described to facilitate the understanding of the present disclosure.

[0086] Aspect 1: A device comprising a region including a component configured to generate heat, and a heat conduction layer coupled to this region, the heat conduction layer including a plurality of segmented thermally anisotropic conduction channels.

[0087] Aspect 2: The device according to Aspect 1, wherein at least one of the plurality of segmented thermally anisotropic conduction channels is aligned in a first direction.

[0088] Aspect 3: The device according to Aspect 2, wherein each of the segmented thermally anisotropic conduction channels from the plurality of segmented thermally anisotropic conduction channels is configured to provide a high thermal conductivity in a first direction and a low thermal conductivity in a second direction.

[0089] Aspect 4: The device according to Aspect 2 or 3, wherein the heat conduction layer includes at least one adhesive that bonds the plurality of segmented thermally anisotropic conduction channels.

[0090] Aspect 5: The device according to Aspect 4, wherein the plurality of segmented thermally anisotropic conduction channels includes a first segmented thermally anisotropic conduction channel and a second segmented thermally anisotropic conduction channel, and at least one adhesive is disposed between at least the first segmented thermally anisotropic conduction channel and the second segmented thermally anisotropic conduction channel.

[0091] Aspect 6: A first plurality of segmented thermally anisotropic conduction channels from a plurality of segmented thermally anisotropic conduction channels are aligned in a first direction, and a second plurality of segmented thermally anisotropic conduction channels from the plurality of segmented thermally anisotropic conduction channels are aligned in a second direction, the device according to Aspect 1.

[0092] Aspect 7: Each segmented thermally anisotropic conduction channel from a first plurality of segmented thermally anisotropic conduction channels is configured to provide a high first thermal conductivity value in a first direction, and each segmented thermally anisotropic conduction channel from a second plurality of segmented thermally anisotropic conduction channels is configured to provide a high second thermal conductivity value in a second direction, the device according to Aspect 6.

[0093] Aspect 8: The second direction is perpendicular to the first direction, the device according to Aspect 6 or 7.

[0094] Aspect 9: The second direction is oblique to the first direction, the device according to Aspect 6 or 7.

[0095] Aspect 10: A segmented thermally anisotropic conduction channel from a plurality of segmented thermally anisotropic conduction channels is configured to provide a high thermal conductivity along the length of the segmented thermally conductive channel, the device according to Aspect 1.

[0096] Aspect 11: The thermally anisotropic conduction channel includes a thermally anisotropic conduction material configured to provide a high thermal conductivity along a first direction, the device according to Aspect 10.

[0097] Aspect 12: The thermally anisotropic conduction material has a high thermal conductivity value in a first direction, and the thermally anisotropic conduction material has a low thermal conductivity value in at least a second direction, the device according to Aspect 11.

[0098] Aspect 13: The device according to aspect 12, wherein the first direction is along the length of the thermally anisotropic conduction channel and the second direction is along the width of the thermally anisotropic conduction channel.

[0099] Aspect 14: The device according to aspect 12 or 13, wherein the thermally conductive material has a thermal conductivity value in the first direction within the range of about 1000 to 1900 watts per meter kelvin (W / (mK)), and the thermally conductive material has a thermal conductivity value in the second direction of less than 30 watts per meter kelvin (W / (mK)).

[0100] Aspect 15: The device according to aspect 1, comprising a first portion comprising a first plurality of segmented thermally anisotropic conduction channels from a plurality of segmented thermally anisotropic conduction channels, a second portion comprising a second plurality of segmented thermally anisotropic conduction channels from a plurality of segmented thermally anisotropic conduction channels, and a heat insulating material coupled to the first portion and the second portion.

[0101] Aspect 16: The device according to aspect 15, wherein the first plurality of segmented thermally anisotropic conduction channels are aligned in a first direction and the second plurality of segmented thermally anisotropic conduction channels are aligned in a second direction.

[0102] Aspect 17: The device according to aspect 15 or 16, wherein the heat insulating material includes an aerogel and / or the thermally conductive layer includes graphite.

[0103] Aspect 18: The device according to any one of aspects 1 to 17, wherein the region includes a first integrated device, the component includes a second integrated device, and the thermally conductive layer is configured to thermally isolate the first integrated device from the second integrated device.

[0104] Aspect 19: The device is configured to provide Wireless Fidelity (WiFi) communication and / or cellular communication, and a thermal conduction layer including a plurality of segmented thermal conduction channels is configured to reduce the junction temperature of components, and the thermal conduction layer including the plurality of segmented thermal conduction channels is further configured to reduce the surface temperature of the device. The device according to any one of Aspects 1 to 18.

[0105] Aspect 20: The device according to any one of Aspects 1 to 19, wherein the device is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed position terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in an autonomous vehicle.

[0106] Aspect 21: A device comprising a region including a first integrated device configured to generate heat and a second integrated device configured to generate heat. The device comprises means for segmented anisotropic heat transfer coupled to this region.

[0107] Aspect 22: The device according to Aspect 21, wherein the means for segmented anisotropic heat transfer includes a plurality of thermally anisotropic conduction channels aligned in a first direction, and each thermally anisotropic conduction channel from the plurality of thermally anisotropic conduction channels is configured to provide a high heat transfer capacity in the first direction and a low heat transfer capacity in a direction parallel to the width of the thermally anisotropic conduction channel.

[0108] Aspect 23: The means for segmented anisotropic heat transfer comprises a plurality of first heat anisotropic conduction channels aligned in a first direction and a plurality of second heat anisotropic conduction channels aligned in a second direction, each first heat anisotropic conduction channel from the plurality of first heat anisotropic conduction channels being configured to provide a high heat transfer capacity along the length of the first heat anisotropic conduction channel, and each second heat anisotropic conduction channel from the plurality of second heat anisotropic conduction channels being configured to provide a high heat transfer capacity along the length of the second heat anisotropic conduction channel, the device according to Aspect 21.

[0109] Aspect 24: The means for segmented anisotropic heat transfer comprises a heat insulating material, the plurality of first heat anisotropic conduction channels being part of a first portion of the means for segmented anisotropic heat transfer, the plurality of second heat anisotropic conduction channels being part of a second portion of the means for segmented anisotropic heat transfer, the first portion being coupled to the second portion via the heat insulating material, the device according to Aspect 23.

[0110] Aspect 25: The means for segmented anisotropic heat transfer comprises a plurality of heat anisotropic conduction channels aligned in a first direction, the plurality of heat anisotropic conduction channels having a high thermal conductivity value along the length of the plurality of heat anisotropic conduction channels and having a low thermal conductivity value in a direction parallel to the width of one or more of the heat anisotropic conduction channels, the device according to Aspect 21.

[0111] Aspect 26: The means for segmented anisotropic heat transfer is configured to reduce the junction temperature of the first integrated device and the second integrated device, and the means for segmented anisotropic heat transfer is further configured to reduce the surface temperature of the device, the device according to any one of Aspects 21 to 25.

[0112] The various features of the present disclosure described herein can be implemented in various systems without departing from the present disclosure. It should be noted that the above aspects of the present disclosure are merely examples and should not be construed as limiting the present disclosure. The description of the aspects of the present disclosure is intended to be illustrative and not intended to limit the scope of the claims. Therefore, the present teachings can be readily applied to other types of devices, and many alternative forms, modifications, and variations will be apparent to those skilled in the art.

Explanation of Signs

[0113] 100 Device 102 Display 104 Casing Body 205 Integrated Device 215 Second Integrated Device 220 Camera 302 Substrate 303 Component 304 Back Cover 306 Thermal Interface Material 307 Shield 308 Thermal Interface Material 316 Thermal Interface Material 317 Shield 318 Thermal Interface Material 320 Heat Transfer Component 330 Thermal Conductive Layer 340 Display Module 400 Thermal Conductive Sheet 500 Thermal Conductive Layer 502 Thermal Conductive Channel 502a~d Thermal Conductive Channels 503 Adhesive 503a~d Adhesives 600 Thermal Conductive Layer 602 Thermal Conductive Channel 700 Thermal Conductive Layer 705 First Portion 707 Thermal Conductive Channel 707a~c Thermal Conductive Channels 710 Heat Insulating Material 710a~g Heat insulation material 715 Second part 717 Heat conduction channel 717a~c Heat conduction channel 800 Heat conduction layer 900 Heat conduction layer 905 First heat conduction layer 907 Heat conduction channel 915 Second heat conduction layer 917 Heat conduction channel 1000 Heat conduction layer 1005 First heat conduction layer 1007 Heat conduction channel 1100 Heat conduction layer 1105 Component 1110 Heat insulation material 1111 Heat insulation material 1115 Component 1125 First heat conduction layer 1127 Heat conduction channel 1135 Second heat conduction layer 1137 Heat conduction channel 1145 Third heat conduction layer 1147 Heat conduction channel 1155 Fourth heat conduction layer 1157 Heat conduction channel 1200 Heat conduction layer 1205 First heat conduction layer 1225 First heat conduction layer 1227 Heat conduction channel 1245 Third heat conduction layer 1247 Heat conduction channel 1300 Bonding temperature map 1400 Bonding temperature map 1500 Display surface temperature map 1600 Display surface temperature map 1700 Laminated block 1805 First heat conduction layer 1815 Second heat conduction layer 1825 Third heat conduction layer 1835 Fourth heat conduction layer

Claims

1. A region including a component configured to generate heat, A heat conduction layer coupled to the region, the heat conduction layer including a plurality of segmented thermally anisotropic conduction channels, A device comprising:

2. The device according to claim 1, wherein at least one of the plurality of segmented thermally anisotropic conduction channels is aligned in a first direction.

3. The device according to claim 2, wherein each of the segmented thermally anisotropic conduction channels from the plurality of segmented thermally anisotropic conduction channels is configured to provide a high thermal conductivity in the first direction and a low thermal conductivity in a second direction.

4. The device according to claim 2, wherein the heat conduction layer includes at least one adhesive that binds the plurality of segmented thermally anisotropic conduction channels.

5. The plurality of segmented thermally anisotropic conduction channels include a first segmented thermally anisotropic conduction channel and a second segmented thermally anisotropic conduction channel, The at least one adhesive is disposed between at least the first segmented thermally anisotropic conduction channel and the second segmented thermally anisotropic conduction channel. The device according to claim 4.

6. A first plurality of segmented thermally anisotropic conduction channels from the plurality of segmented thermally anisotropic conduction channels are aligned in a first direction, A second plurality of segmented thermally anisotropic conduction channels from the plurality of segmented thermally anisotropic conduction channels are aligned in a second direction. The device according to claim 1.

7. Each of the segmented thermally anisotropic conduction channels from the first plurality of segmented thermally anisotropic conductions is configured to provide a high first thermal conductivity value in the first direction, Each of the segmented thermally anisotropic conduction channels from the second plurality of segmented thermally anisotropic conduction channels is configured to provide a high second thermal conductivity value in the second direction. The device according to claim 6.

8. The device according to claim 7, wherein the second direction is perpendicular to the first direction.

9. The device according to claim 7, wherein the second direction is oblique to the first direction.

10. The device according to claim 1, wherein the segmented thermally anisotropic conductive channels from the plurality of segmented thermally anisotropic conductive channels are configured to provide a high thermal conductivity along the length of the segmented thermally anisotropic conductive channels.

11. The device according to claim 10, wherein the thermally anisotropic conductive channel includes a thermally anisotropic conductive material configured to provide a high thermal conductivity along a first direction.

12. The thermally anisotropic conductive material has a high thermal conductivity value in the first direction, The thermally anisotropic conductive material has a low thermal conductivity value in at least a second direction, The device according to claim 11.

13. The first direction is along the length of the thermally anisotropic conductive channel, The second direction is along the width of the thermally anisotropic conductive channel, The device according to claim 12.

14. The thermally anisotropic conductive material has a thermal conductivity value in the first direction within a range of about 1000 to 1900 watts per meter kelvin (W / (mk)), The thermally anisotropic conductive material has a thermal conductivity value in the second direction of less than 30 watts per meter kelvin (W / (mk)), The device according to claim 12.

15. The thermal conduction layer Comprises a first portion comprising a first plurality of segmented thermally anisotropic conductive channels from the plurality of segmented thermally anisotropic conductive channels, A second portion comprising a second plurality of segmented thermally anisotropic conductive channels from the plurality of segmented thermally anisotropic conductive channels, And a heat insulating material bonded to the first portion and the second portion, Comprises, The device according to claim 1.

16. The first plurality of segmented thermally anisotropic conductive channels are aligned in a first direction, The second plurality of segmented thermally anisotropic conductive channels are aligned in a second direction, The device according to claim 15.

17. The heat insulating material includes an aerogel, and / or The thermal conduction layer includes graphite, The device according to claim 15.

18. The region includes a first integrated device, The component includes a second integrated device, The thermal conduction layer is configured to thermally isolate the first integrated device from the second integrated device, The device according to claim 1.

19. The device according to claim 1, wherein the device is configured to provide wireless fidelity (WiFi) communication and / or cellular communication.

20. The device according to claim 1, wherein the device is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed position terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in an automated vehicle.

21. A region comprising: a first integrated device configured to generate heat; a second integrated device configured to generate heat; and a segmental anisotropic heat transfer means coupled to the region. A device comprising: the segmental anisotropic heat transfer means.

22. The segmental anisotropic heat transfer means includes a plurality of heat anisotropic conduction channels aligned in a first direction, each heat anisotropic conduction channel from the plurality of heat anisotropic conduction channels is configured to provide a high heat transfer capacity in the first direction and a low heat transfer capacity in a direction parallel to the width of the heat anisotropic conduction channel. The device according to claim 21.

23. The segmental anisotropic heat transfer means comprises: a plurality of first heat anisotropic conduction channels aligned in a first direction; a plurality of second heat anisotropic conduction channels aligned in a second direction; each first heat anisotropic conduction channel from the plurality of first heat anisotropic conduction channels is configured to provide a high heat transfer capacity along the length of the first heat anisotropic conduction channel, each second heat anisotropic conduction channel from the plurality of second heat anisotropic conduction channels is configured to provide a high heat transfer capacity along the length of the second heat anisotropic conduction channel. The device according to claim 21.

24. The segmental anisotropic heat transfer means comprises a heat insulating material, the plurality of first heat anisotropic conduction channels are part of a first portion of the segmental anisotropic heat transfer means, the plurality of second heat anisotropic conduction channels are part of a second portion of the segmental anisotropic heat transfer means, the first portion is coupled to the second portion via the heat insulating material. ​ The device according to claim 23. **Claim 25** wherein the means for segmented anisotropic heat transfer includes a plurality of thermally anisotropic conduction channels aligned in a first direction, wherein the plurality of thermally anisotropic conduction channels have a high thermal conductivity value along the length of the plurality of thermally anisotropic conduction channels, wherein the plurality of thermally anisotropic conduction channels have a low thermal conductivity value in a direction parallel to the width of one or more of the thermally anisotropic conduction channels; The device according to claim 21. **Claim 26** wherein the means for segmented anisotropic heat transfer is configured to reduce the junction temperature of the first integrated device and the second integrated device, wherein the means for segmented anisotropic heat transfer is further configured to reduce the surface temperature of the device; The device according to claim 21.

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