Data center cooling system, machine room and method

Abstract

The present disclosure provides a cooling system, a machine room, and a method for a data center. The system has a first channel and a second channel, and includes a stacked structure located between the first channel and the second channel. The stacked structure includes at least one stacked electronic device and at least one surface cooler. Each electronic device has a first air inlet and a first air outlet, and each surface cooler has a second air inlet and a second air outlet. The first air outlet and the second air inlet all face one side of the first channel, and the first air inlet and the second air outlet all face one side of the second channel. The cooling system of the data center of the present disclosure can simplify the cooling method of the data center and reduce the difficulty of operation and maintenance and the risk of liquid leakage.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This disclosure claims the priority of Chinese Patent Application No. 202210884483.0 filed on July 25, 2022, and all the content disclosed in the above - mentioned Chinese patent application is incorporated herein by reference in its entirety.

[0002] Embodiments of the present disclosure relate to a cooling system, a machine room, and a method for a data center.

Background Art

[0003] A data center is a specific device network that collaborates globally and is used to transmit, accelerate, display, calculate, and store data information on the network infrastructure of the Internet. It has a large energy consumption and high heat dissipation. Therefore, improving the energy utilization efficiency of the data center and controlling the Power Usage Effectiveness (abbreviated as PUE) has become an important issue.

[0004] Among many solutions for reducing the PUE usage efficiency of a data center, the full - cold - plate solution can dissipate heat from all heat - generating components in the server. However, the design of the cold plate in the full - cold - plate solution is complex, and the difficulty of component replacement and operation and maintenance is high. Therefore, it is not suitable for actual use. In addition, there are many pipe joints in the server, so the risk of liquid leakage is very high.

Summary of the Invention

[0005] An object of the present disclosure is to provide a cooling system, a machine room, and a method for a data center so as to simplify the cooling method of the data center and reduce the difficulty of operation and maintenance and the risk of liquid leakage.

[0006] In a first aspect, the present disclosure provides a cooling system for a data center, the cooling system of the data center having a first channel and a second channel, the cooling system of the data center including a stacked structure located between the first channel and the second channel, the stacked structure including at least one stacked electronic device and at least one surface cooler, each electronic device having a first air inlet and a first air outlet, each surface cooler having a second air inlet and a second air outlet, the first air outlet and the second air inlet all facing one side of the first channel, and the first air inlet and the second air outlet all facing one side of the second channel.

[0007] Within the stacked structure of the cooling system of the data center according to the present disclosure, the second air inlet of each surface cooler and the first air outlet of each electronic device all face one side of the first channel, and the second air outlet of each surface cooler and the first air inlet of each electronic device all face one side of the second channel. Based on this, the first air outlet of the electronic device can discharge hot air into the first channel, the second air inlet of the surface cooler introduces the hot air in the first channel into the surface cooler, the hot air is cooled by the surface cooler, and then the second air outlet of the surface cooler discharges cold air into the second channel. Therefore, since the stacked structure is located between the adjacent first channel and the second channel, the first channel and the second channel can be separated by the stacked structure, and the probability of the airflows in the first channel and the second channel contacting each other is reduced. Thus, after the second air outlet of the surface cooler discharges cold air into the second channel, it basically does not contact the hot air in the first channel, and it is possible to avoid the hot air in the first channel affecting the cooling capacity of the cold air in the second channel. From this, the cold air in the first channel enters the interior of the electronic device through the first air inlet of the electronic device, and the cold air absorbs the heat dissipated from the internal assembly of the electronic device.

[0008] As can be understood hereinafter, the cooling system of the data center according to the present disclosure can circulate and cool the internal assembly of electronic equipment by using a surface cooler, eliminating the need to separately lay cooling pipelines on the surface of the internal assembly of electronic equipment. The surface cooler can be used as a cooling device for the internal assembly of electronic equipment, and its cooling capacity is close to that of the related air-cooling capacity system, thereby reducing the PUE and operating costs of the data center. Also, within the same stacking structure, at least one electronic device and at least one surface cooler are integrally stacked, so that operation and maintenance can be independently performed on the surface cooler or the electronic device without the need for special equipment or operations, making it far superior to immersion systems and full cold plate systems. It can effectively reduce the difficulty of operation and maintenance of the cooling device for the internal assembly of electronic equipment, reduce the internal pipe joints of electronic equipment such as servers, and reduce the risk of liquid leakage during the cooling process of electronic equipment. Also, within the same stacking structure, at least one electronic device and at least one surface cooler are integrally stacked, so that the design difficulty of the cooling method for the data center is low. In actual production and installation, it is only necessary to stack and install the surface cooler and the electronic device, without the need for special production conditions and installation handover processes, effectively simplifying the cooling method for the data center.

[0009] As can be understood from the above, the cooling system of the data center according to the present disclosure can simplify the cooling method of the data center, reduce the difficulty of operation and maintenance and the risk of liquid leakage, and at the same time, effectively reduce the cooling cost of the data center from three aspects: equipment investment, cooling capacity, and operation and maintenance.

[0010] In a second aspect, the present disclosure further provides a data center machine room including the cooling system of the data center described in the technical solution of the present disclosure.

[0011] The beneficial effects of the data center machine room according to the present disclosure are the same as those of the cooling system of the data center described in the technical solution of the present disclosure, and will not be elaborated here.

[0012] The present disclosure further provides a method for cooling a data center applied to the cooling system of the data center described in the technical solution of the present disclosure. The cooling of the data center has a plurality of cooling cycles, and each of the cooling cycles includes a step of discharging hot air from a first air outlet of each electronic device to a first channel; a step of introducing the hot air in the first channel into a surface cooler through a second air inlet of each surface cooler, and cooling the hot air by the surface cooler; a step of discharging cold air from a second air outlet of each of the surface coolers to a second channel; a step of introducing the cold air in the second channel into the electronic device through a first air inlet of each of the electronic devices, and absorbing heat dissipated from an internal assembly of the electronic device by the cold air.

[0013] The beneficial effects of the method for cooling a data center according to the present disclosure are the same as those of the cooling system of the data center described in the technical solution of the present disclosure, and will not be described in detail herein.

[0014] Here, the drawings described are used to provide a further understanding of the present disclosure, constitute a part of the present disclosure, and the exemplary embodiments and their descriptions of the present disclosure are used to interpret the present disclosure and do not unduly limit the present disclosure.

Brief Description of the Drawings

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[0016] In order to more clearly illustrate the technical problems to be solved, the technical solutions and the beneficial effects of the present disclosure, the present disclosure will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only for the purpose of interpreting the present disclosure and are not intended to limit the present disclosure.

[0017] It should be noted that when a particular element is described as "fixed" or "installed" on another element, it may be directly present on the other element or may be indirectly present on the other element. When a particular element is described as "connected" to another element, it may be directly connected to the other element or may be indirectly connected to the other element.

[0018] Also, terms such as "first", "second", etc. do not indicate or imply relative importance or implicitly indicate the number of technical features shown, but are merely for the purpose of description. Thus, the features limited by "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present disclosure, unless otherwise specified, "a plurality" means two or more. Unless otherwise specified, "several" means one or more.

[0019] In the description of the present disclosure, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", etc. indicate the orientation or positional relationship shown based on the drawings, and are merely for facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the indicated device or element must have a specific orientation and be constructed and operated in a specific orientation. Therefore, it should not be understood as limiting the present disclosure.

[0020] In addition, in the description of the present disclosure, unless specifically defined and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, they may be fixedly connected, removably connected, or integrally connected, and may be mechanical connections or electrical connections. They may be directly connected or indirectly connected through an intermediate medium. They may also be internal communication between two elements or an interaction relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in the present disclosure according to specific situations.

[0021] Power Usage Effectiveness (abbreviated as PUE) is an indicator showing the energy efficiency of a data center, which is the ratio of all the energy consumed by the data center to the energy used by the Internet Technology (abbreviated as IT) load, and is the inverse ratio of the data center infrastructure efficiency (abbreviated as DCIE). The reference value of PUE is 2, and the closer it is to 1, the higher the level of the energy efficiency of the data center.

[0022] In related technologies, a data center can be cooled by using an immersion liquid cooling solution and a full cold plate solution. The immersion liquid cooling solution is not widely used for cooling data centers. When cooling a data center with an immersion liquid cooling solution, although the network equipment of the data center can be immersed in the cooling liquid, the cooling liquid is expensive and the operation and maintenance are complicated, resulting in a not-high overall benefit of the immersion liquid cooling solution. When cooling a data center with a full cold plate solution, the heat dissipation fans inside the network equipment are omitted, and all heat-generating components inside the server are cooled by the cold plate structure. The biggest problem is that the structure of the cold plate is complicated and the cost is very high. When it is necessary to replace individual components inside the network equipment, the cold plate structure needs to be removed from the network equipment, and then the components inside the network equipment need to be replaced, making the operation and maintenance of the data center complicated. Also, when all heat-generating components of the network equipment are cooled by the cold plate structure, the cold plate structure is not only complicated but also has a large number of joints and a high risk of potential liquid leakage.

[0023] In response to the above problems, exemplary embodiments of the present disclosure provide a data center cooling system and method. The data center cooling system of the exemplary embodiments of the present disclosure applies surface cooling technology to the cooling of the data center, uses a surface cooler to cool down the hot air flow discharged from the electronic equipment, and then discharges the cold air to the side where the air intake of the electronic equipment is located. The cold air enters the electronic equipment through the air intake of the electronic equipment and absorbs the heat dissipated from the internal components of the electronic equipment, thereby achieving the purpose of cooling the electronic equipment, effectively simplifying the data center cooling method, and reducing the difficulty of operation and maintenance and the risk of liquid leakage. Hereinafter, the data center cooling system and method of the exemplary embodiments of the present disclosure will be described with reference to the drawings.

[0024] FIG. 1 shows a basic schematic plan view of a cooling system for a data center according to an exemplary embodiment of the present disclosure. As shown in FIG. 1, the cooling system 100 of the data center according to the exemplary embodiment of the present disclosure has a first channel 101 and a second channel 102. The cooling system 100 of the data center according to the exemplary embodiment of the present disclosure may include a stacked structure 103, and by positioning the stacked structure 103 between the first channel 101 and the second channel 102, the stacked structure 103 can separate the first channel 101 and the second channel 102.

[0025] FIG. 2 shows a basic structural schematic view of the stacked structure according to an exemplary embodiment of the present disclosure. As shown in FIG. 2, the stacked structure 103 according to the exemplary embodiment of the present disclosure includes at least one stacked electronic device 1031 and at least one surface cooler 1032. In this aspect, the assembly of the electronic device 1031 and the surface cooler 1032 is simple and does not require special production, assembly conditions, and delivery processes, and can effectively reduce the difficulty of assembling the stacked structure 103. It should be understood that the electronic device 1031 is not limited to various network devices such as switches, storage servers, computing servers, and graphics processing unit (GPU for short) servers.

[0026] As shown in FIG. 2, in the same stacked structure 103 according to the exemplary embodiment of the present disclosure, each electronic device 1031 has a first air inlet and a first air outlet. External air flow can enter the electronic device 1031 through the first air inlet and be discharged from the electronic device 1031 through the first air outlet. Each surface cooler 1032 has a second air inlet and a second air outlet, and external air flow can enter the surface cooler 1032 through the second air inlet and be discharged from the surface cooler 1032 through the second air outlet.

[0027] In actual application examples, as shown in FIGS. 1 and 2, the first air inlet and the first air outlet may be symmetrically provided on two end faces of the electronic device 1031 along a preset direction, and the second air inlet and the second air outlet may be symmetrically provided on two end faces of the surface cooler 1032 along a preset direction. Moreover, the first air inlets of each electronic device 1031 and the second air outlets of each surface cooler 1032 all face one side of the second channel 102, and the first air outlets of each electronic device 1031 and the second air inlets of each surface cooler 1032 all face one side of the first channel 101.

[0028] In a specific implementation, as shown in FIGS. 1 and 2, since the first air outlets of each electronic device 1031 and the second air inlets of each surface cooler 1032 all face one side of the first channel 101, and the first air inlets of each electronic device 1031 and the second air outlets of each surface cooler 1032 all face one side of the second channel 102, the heat dissipated from the internal assembly of the electronic device 1031 can discharge hot air into the first channel 101 through the first air outlet. Subsequently, the second air inlet of the surface cooler 1032 introduces the hot air in the first channel 101 into the surface cooler 1032, cools the hot air through surface heat exchange, and then discharges the cold air into the second channel 102 through the second air outlet of the surface cooler 1032. Therefore, since the laminated structure 103 is located between the adjacent first channel 101 and the second channel 102, the first channel 101 and the second channel 102 can be separated by the laminated structure 103, and the probability of the airflows in the first channel 101 and the second channel 102 contacting each other is reduced. Accordingly, after the second air outlet of the surface cooler 1032 discharges the cold air into the second channel 102, it basically does not contact the hot air in the first channel 101, and it can be avoided that the hot air in the first channel 101 affects the cooling capacity of the cold air in the second channel 102. Therefore, the cold air in the first channel enters the interior of the electronic device 1031 through the first air inlet of the electronic device 1031, and the heat dissipated from the internal assembly of the electronic device 1031 is absorbed by the cold air.

[0029] As will be understood hereinafter, as shown in FIGS. 1 and 2, the cooling system 100 of the data center according to the exemplary embodiments of the present disclosure can circulate and cool the internal assembly of the electronic device 1031 by using the surface cooler 1032. Such a cooling method essentially realizes the cooling of the electronic device 1031 by the ambient air flow, and is a method of internally circulating cold air and hot air by the air flow for cooling. There is no need to separately lay cooling pipelines on the surface of the internal assembly of the electronic device 1031. The surface cooler 1032 can be used as a cooling device for the internal assembly of the electronic device 1031, and its cooling capacity is close to that of the air cooling capacity system of related technologies.

[0030] For example, in a data center, based on the full cold plate solution, an air conditioner can be used to cool the data center. An additional power supply is required for the compressor inside the air conditioner. Therefore, the PUE of the data center increases. In the cooling system of the data center of the exemplary embodiments of the present disclosure, the method of internally circulating cold air and hot air by the air flow for cooling cools the electronic device 1031 by cooling the air flow using the surface cooler 1032. In this way, the PUE of the data center, the unit energy consumption, and the total cost of ownership (abbreviated as TCO) can be reduced.

[0031] In related technologies, when cooling electronic devices using a full liquid cooling method, liquid cooling pipes are all arranged for main heat-generating components of electronic devices such as central processors and image processors, or secondary heat-generating components such as memory sticks. Therefore, the internal liquid cooling pipes are complex and there is a risk of liquid leakage. Consequently, the design of a full liquid cooling solution is complex and the costs of installation, operation, and maintenance are high. As shown in FIGS. 1 and 2, in the cooling system 100 of the data center according to an exemplary embodiment of the present disclosure, the liquid cooling pipeline for the secondary heat-generating component in the electronic device 1031 is omitted, and the airflow is cooled by the surface cooler 1032 laminated with the electronic device 101, thereby providing cold air inside the electronic device and absorbing the heat dissipated from the secondary heat-generating component by the cold air. Based on this, the cooling system 100 of the data center according to an exemplary embodiment of the present disclosure can reduce the internal pipe joints of electronic devices such as servers and reduce the risk of liquid leakage during the cooling process of the electronic devices. And within the same stacking structure 103, at least one electronic device 1031 and at least one surface cooler 1032 are integrally stacked. Therefore, there is no need to specifically design and arrange a liquid cooling pipeline for the secondary heat-generating component. Consequently, the difficulty and complexity of the design of the cooling system of the data center can be effectively simplified. Not only that, at least one electronic device 1031 and at least one surface cooler 1032 are integrally stacked, and the surface cooler 1032 and the electronic device 1031 are independent of each other. Therefore, the operation and maintenance of the electronic device 1031 and the operation and maintenance of the surface cooler 1032 can be carried out independently without affecting each other, without the need for special equipment or operations, and are far superior to the immersion system and the full cold plate system, effectively reducing the difficulty of the operation and maintenance of the cooling equipment for the internal assembly of the electronic device 1031.

[0032] In addition, in the cooling system of the data center of the exemplary embodiment of the present disclosure, at least one electronic device 1031 and at least one surface cooler 1032 are integrally stacked within the same stacked structure 103. Therefore, in actual production, the electronic device 1031 and the surface cooler 1032 can be produced separately. In assembly or delivery, it is only necessary to stack and attach the surface cooler 1032 and the electronic device 1031, without the need for special production conditions and installation and delivery processes. Thus, the cooling method of the data center can be effectively simplified.

[0033] As can be seen from the above, the cooling system of the data center according to the present disclosure can simplify the cooling method of the data center, reduce the difficulty of operation and maintenance and the risk of liquid leakage, and at the same time, effectively reduce the cooling cost of the data center from three aspects: equipment investment, operation cost and operation and maintenance cost.

[0034] In an alternative form, as shown in FIG. 2, the numbers of the electronic device 1031 and the surface cooler 1032 of the exemplary embodiment of the present disclosure can be designed according to actual needs. The number of electronic devices included in the stacked structure may be one or more. Similarly, the number of surface coolers may be one or more.

[0035] When the number of electronic devices included in the stacked structure is more than one, the number of surface coolers may be one or more. When there are multiple surface coolers, the multiple surface coolers can be integrally stacked to form a surface cooling module, and then can be stacked with multiple electronic devices, and may be provided at intervals at different parts of the stacked structure.

[0036] Exemplarily, when the number of surface coolers is one, or when the number of surface coolers is more than one but is integrally stacked with multiple electronic devices in the form of a surface cooling module, the surface cooler may be located at the center of the multiple electronic devices, at the bottom of the multiple electronic devices, or even at the top of the multiple electronic devices. When the surface cooler is provided at the center of the multiple stacked electronic devices, the center is the center in a broad sense, not the center in a narrow sense.

[0037] The following will be described by taking the case where one surface cooler is located at the center of a plurality of electronic devices as an example. Although the exemplary embodiments of the present disclosure disclose an example where one surface cooler is located at the center of a plurality of electronic devices, it should be understood that the implementation method of replacing one surface cooler with a surface cooling module to realize related functions is not excluded.

[0038] FIG. 3 shows a schematic structural view of the stacked structure of an exemplary embodiment of the present disclosure. As shown in FIG. 3, the stacked structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031. Along the direction indicated by the first arrow A, the surface cooler 1032 is provided between the third electronic device and the fourth electronic device. At this time, the surface cooler is located in the middle of the six stacked electronic devices. The surface cooler 1032 can symmetrically cool the three electronic devices 1031 below it and the three electronic devices 1031 above it, and can ensure the temperature balance of the electronic devices 1031 included in the entire stacked structure 103.

[0039] FIG. 4 shows another schematic structural view of the stacked structure of an exemplary embodiment of the present disclosure. As shown in FIG. 4, the stacked structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031. Along the direction indicated by the second arrow B, the surface cooler 1032 is provided between the second electronic device and the third electronic device. At this time, the surface cooler 1032 is located at the lower part of the six stacked electronic devices 1031, and mainly cools the electronic devices 1031 located below in the stacked structure 103. Based on this, among the plurality of electronic devices 1031 included in the stacked structure 103, compared with the fourth to sixth electronic devices, the first to third electronic devices are more likely to generate heat or have lower heat dissipation performance, and the surface cooler 1032 can be used to mainly cool the first to third electronic devices. It should be understood that the surface cooler 1032 can also cool the fourth to sixth electronic devices, and the cooling capacity for the fourth to sixth electronic devices is relatively lower compared with the first to third electronic devices.

[0040] FIG. 5 shows yet another structural schematic diagram of the stacked structure of an exemplary embodiment of the present disclosure. As shown in FIG. 5, the stacked structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031. Along the direction indicated by the third arrow C, the surface cooler 1032 is provided between the fifth electronic device and the sixth electronic device. At this time, the surface cooler 1032 is located above the six stacked electronic devices and mainly cools the electronic devices 1031 located above in the stacked structure 103. Based on this, among the plurality of electronic devices included in the stacked structure 103, compared with the first to third electronic devices, the fourth to sixth electronic devices are more likely to generate heat or have lower heat dissipation, and the surface cooler 1032 can be used to mainly cool the fourth to sixth electronic devices. It should be understood that the surface cooler 1032 can also cool the first to third electronic devices, but its cooling ability for the first to third electronic devices is relatively lower compared with that for the fourth to sixth electronic devices.

[0041] When the number of electronic devices and surface coolers included in the stacked structure is plural, the plural surface coolers can be integrally stacked with a space from the plural electronic devices, and some of them can be stacked and combined into a surface cooling module, and some other surface coolers can be integrally stacked with a space from the plural stacked structures together with the surface cooling module.

[0042] FIG. 6 shows yet another structural schematic diagram of the stacked structure of an exemplary embodiment of the present disclosure. As shown in FIG. 6, the stacked structure 103 of the exemplary embodiment of the present disclosure includes four electronic devices 1031 and three surface coolers 1032. Along the direction indicated by the fourth arrow D, the electronic devices 1031 and the surface coolers 1032 are alternately distributed. In this case, each surface cooler 1032 can be used to make the temperature distribution of the entire stacked structure uniform and avoid the problem of local heat generation.

[0043] In an alternative form, the number of stacked structures in the exemplary embodiments of the present disclosure may be one or more. These stacked structures may be divided into at least one group, and the first channel and the second channel are alternately distributed along a first preset direction, and each group of stacked structures is located between adjacent first channels and second channels. The stacked structures in the same group may include at least one stacked structure. When the stacked structures in the same group include a plurality of stacked structures, the plurality of stacked structures are alternately distributed along a second preset direction. It should be understood that the first preset direction and the second preset direction here may be perpendicular to each other or set according to the actual situation. At the same time, the first preset direction may be the positive direction of the first preset direction or the negative direction of the first preset direction.

[0044] In an actual application example, as shown in FIG. 1, the cooling system 100 of the data center of the exemplary embodiment of the present disclosure may further include a sealed housing 104. At least one group of stacked structures 103 may be located within the sealed housing 104. The first channel 101 and the second channel 102 are alternately distributed within the sealed housing 104 along a first preset direction. As shown in FIGS. 1 and 2, since the stacked structure 103 is located within the sealed housing 104, during the internal circulation of cold air and hot air for cooling the electronic device 1031, external heat can be prevented from entering the sealed housing 104 and affecting the cooling effect, and leakage of cold air inside the sealed housing 104 during the internal circulation of cold air and hot air for cooling can also be reduced, thereby further reducing the PUE. At the same time, the environmental noise, air flow, and electromagnetic radiation of the data center (abbreviated as Internet Data Center, IDC) can be reduced, and the operation and maintenance environment can be further improved. It should be understood that the number of the first channel and the second channel in the exemplary embodiment of the present disclosure is related to the number of groups of stacked structures, which will be described below by way of examples.

[0045] FIG. 7 shows a schematic plan view of a cooling system of a data center according to an exemplary embodiment of the present disclosure. As shown in FIG. 7, the number of the first channel 101 and the second channel 102 of the cooling system 100 of the exemplary embodiment of the present disclosure is one, and the first channel 101 and the second channel 102 are distributed along a first preset direction. The cooling system 100 of the data center includes a group of laminated structures, and the group of laminated structures is located between the first channel 101 and the second channel 102, and the group of laminated structures, the first channel 101 and the second channel 102 are all located in a sealed housing 104. At this time, regardless of whether the first channel 101 and the second channel 102 are distributed along the positive direction A of the first preset direction or the negative direction B of the first preset direction, the number of the first channel 101 and the second channel 102 is one. The group of laminated structures includes five laminated structures 103, and the five laminated structures 103 are laminated and distributed along a second preset direction C. FIG. 7 only shows the case where the number of the laminated structures 103 is five, but does not exclude the case where the number of the laminated structures 103 is less than five. Furthermore, when the number of the laminated structures 103 is one, the case where the number of the laminated structures 103 is greater than five is not excluded. For these non-excluded cases, reference can be made to the relevant description in FIG. 7.

[0046] When the number of groups of laminated structures is two or more, the number of the first channels and the number of the second channels are also related to the distribution modes of the first channels and the second channels in the first preset direction.

[0047] When the first channel and the second channel are distributed along the positive direction of the first preset direction, assuming that the number of the first channels is larger than that of the second channels and the number of the first channels is N, the number of the second channels may be N - 1, where N is an integer greater than or equal to 2. FIG. 8 shows another schematic plan view of the cooling system of the data center according to an exemplary embodiment of the present disclosure. As shown in FIG. 8, the number of the first channels 101 of the cooling system 100 of the data center in the exemplary embodiment of the present disclosure is two, the number of the second channels 102 is one, and the first channels 101 and the second channels 102 are alternately distributed along the positive direction A of the first preset direction. Inside the sealed housing 104, two groups of laminated structures 103 distributed along the first preset direction are distributed. Each group of laminated structures 103 includes five laminated structures 103 laminated along the second preset direction C, and the two groups of laminated structures 103 share one second channel 102.

[0048] When the first direction and the second direction are distributed along the negative direction of the preset direction, if the number of the first channels is less than that of the second channels and the number of the first channels is M, the number of the second channels may be M + 1, where M is an integer greater than or equal to 1. FIG. 9 shows still another schematic distribution view of the cooling system of the data center according to an exemplary embodiment of the present disclosure. As shown in FIG. 9, the number of the first channels 101 of the cooling system 100 of the data center in the exemplary embodiment of the present disclosure is one, the number of the second channels 102 is two, and the first channels 101 and the second channels 102 are alternately distributed along the negative direction B of the first preset direction. Inside the sealed housing 104, two groups of laminated structures distributed along the first preset direction are distributed. Each group of laminated structures 103 includes five laminated structures 103 laminated along the second preset direction C, and the two laminated structures 103 share one first channel 101.

[0049] FIG. 8 and FIG. 9 show only the case where the number of groups of stacked structures is two and each group of stacked structures includes five stacked structures 103. However, the case where the number of groups of stacked structures is less than two is not excluded. When the number of groups of stacked structures is greater than two, the case where each group of stacked structures includes less than five, or even includes one stacked structure 103, is not excluded, and the case where each group of stacked structures includes more than five stacked structures 103 is not excluded either.

[0050] As shown in FIGS. 7 to 9, the sealed housing 104 of the exemplary embodiment of the present disclosure may be a cabinet in a broad sense, and can be called a container as long as it is a container capable of accommodating the stacked structure 103. For example, the sealed housing 104 may be a general cabinet in a data center or a machine room. When the sealed housing 104 is a cabinet, the stacked structure 103 in any one, a plurality, or all of the cabinets in the machine room of the data center can be set as the structure of the cooling system of the data center of the exemplary embodiment of the present disclosure. In addition, the sealed housing 104 of the exemplary embodiment of the present disclosure not only needs to be provided with various thread passing holes, but also needs to be opened with through holes for passing pipelines for transporting the cooling fluid.

[0051] Figures 10A and 10B show schematic three-dimensional structures of a sealed housing from two angles of exemplary embodiments of the present disclosure. As shown in Figures 10A and 10B, the sealed housing 104 is a rectangular cabinet, and openings 1040 such as thread-passing holes and through holes (in Figures 10A and 10B, the thread-passing holes and through holes are not distinguished and are all represented by the opening 1040) are opened at the topmost part thereof. In order to achieve sealing, the opening 1040 is sealed with a sealing structure, and the sealing structure may be sealing by rubber, sealing by a sealing tape, etc., ensuring the overall sealing performance inside the cabinet and improving the cooling effect. At the same time, the rectangular cabinet has a sealed front door 1041 and a sealed rear door 1042, which can reduce the environmental noise, air flow and electromagnetic radiation of a data center (abbreviated as Internet Data Center, IDC), and further improve the operation and maintenance environment. When not considering the sealing performance, the front and back of the cabinet are designed without a mesh door or a door. Further, a power management unit is provided inside the cabinet, which may be provided at a location close to the rear end of the first channel cabinet and used for performing power management on electronic devices.

[0052] In an alternative form, Figure 11A shows a schematic rear view of a cooling system of a data center of an exemplary embodiment of the present disclosure, Figure 11B shows a schematic side view of a cooling system of a data center of an exemplary embodiment of the present disclosure, and Figure 11C shows a schematic front view of a cooling system of a data center of an exemplary embodiment of the present disclosure. In the solutions shown in Figures 11A to 11C, the first air inlet and the second air outlet are located on the same side, and the first air outlet and the second air inlet are located on the same side. For example, as shown in Figures 11A and 11B, the first air outlet and the second air inlet face the same first channel 101, and the first air inlet and the second air outlet face the same second channel 102. The first air inlet and the second air outlet are located at the front end of the electronic device 1031 or the front end of the surface cooler 1032, and the first air outlet and the second air inlet are located at the rear end of the electronic device 1031 or the rear end of the surface cooler 1032.

[0053] As shown in FIGS. 10A and 11A-11C, the stacked structure 103 of an exemplary embodiment of the present disclosure is provided within the enclosed housing 104. The first channel 101 is located at the rear ends of the electronic device 1031 and the surface cooler 1032, near the sealed rear door 1042. As shown in FIGS. 10B and 11A-11C, the second channel 102 is located at the rear ends of the electronic device 1031 and the surface cooler 1032, near the sealed front door 1041.

[0054] The electronic devices within the stacking mechanism of the exemplary embodiments of the present disclosure can be cooled by a cooling fluid such as a liquid cooling method, an air cooling method, or a combination of both. Exemplarily, different electronic devices such as different network devices can be arranged in the stacked structure according to actual needs. For example, a standard air-cooled switch, a computing type air-cooled and / or cold plate server, a storage type air-cooled and / or cold plate server, and a GPU air-cooled and / or cold plate server, etc. For example, in the solution shown in FIGS. 11A-11C, the stacked structure 103 includes, from bottom to top, two GPU type air-cooled / cold plate servers 1031A, two storage type air-cooled / cold plate servers 1031B, two computing type air-cooled / cold plate servers 1031C, a surface cooler 1032, one air-cooled / cold plate server 1031A, two storage type air-cooled / cold plate servers 1031B, two computing type air-cooled / cold plate servers 1031C, and two air-cooled switches 1031D. The air-cooled / cold plate may be a cooling method that enables both air cooling and liquid cooling, but the cooling methods of single air cooling and single liquid cooling are not excluded.

[0055] The surface coolers and electronic devices of the exemplary embodiment of the present disclosure can all be cooled by cooling fluid. Based on this, as shown in Fig. 11A, the cooling system of the data center of the exemplary embodiment of the present disclosure further includes a transport pipe 105, which includes a first transport pipe and a second transport pipe (in Figs. 11A and 11B, the first transport pipe and the second transport pipe are not distinguished, and both are represented by the transport pipe 105). Each surface cooler 1032 has a cooler housing and a cooling pipe provided in the cooler housing, the cooling pipe communicates with the first transport pipe and the second transport pipe, respectively, and a second intake port and a second outlet port are opened in the cooler housing.

[0056] In a specific implementation, as shown in Figures 11A and 11B, the first transport pipe can introduce the cooling fluid into the cooling fluid pipe. The hot air in the first channel 101 can enter the inside of the cooler housing through the second air inlet. At this time, the cooling fluid in the cooling pipe can cool the hot air entering the inside of the cooler housing, and the temperature of the hot air gradually decreases, turns into cold air, and is discharged from the second air inlet to the second channel 102. Each surface cooler 1032 in the exemplary embodiment of the present disclosure may be a liquid-cooled surface cooler, and the cooling liquid transported by the first transport pipe and the second transport pipe may be water, or other cooling liquid capable of achieving cooling, and the present disclosure is not limited thereto.

[0057] Each electronic device in the exemplary embodiment of the present disclosure may be a liquid-cooled electronic device. Based on this, each electronic device may have a cooling structure, and the cooling structure may have a cooling chamber. The cooling chamber is respectively connected to a first transport pipe and a second transport pipe. At this time, the cooling pipes of each surface cooler and the cooling chambers of the electronic device are all connected to the first transport pipe and the second transport pipe. Based on this, when the first transport pipe introduces a cooling fluid into the cooling pipe of the surface cooler, the cooling fluid can be introduced into the cooling chamber of the electronic device, and the cooling fluid can be used to simultaneously absorb the heat dissipated from the main heat-generating component of the electronic device, and the second transport pipe can lead out the cooling pipe of the surface cooler and lead out the cooling fluid in the cooling chamber of the electronic device at the same time.

[0058] FIG. 12 shows another schematic side view of the cooling system of the data center of an exemplary embodiment of the present disclosure. The difference between the cooling system of the data center shown in FIG. 12 and the cooling systems of the data centers shown in FIGS. 11A-11C is that there are two stacked structures inside the cabinet and there is one first channel 101 between the two stacked structures. For the layout plan view of the cooling system of the data center shown in FIG. 12, reference can be made to FIG. 8.

[0059] In a specific implementation, as shown in FIG. 12, the two groups of stacked structures are located inside the sealed housing 104, and the heat inside the electronic devices included in the two groups of stacked structures can be discharged from the first air outlet in the form of hot air into the first channel 101 between the two stacked structures, and the two stacked structures can share one first channel 101. At the same time, the hot air from the electronic devices included in the two stacked structures interferes with each other in the first channel 101, which can increase the probability of the hot air entering the surface coolers included in the two stacked structures, thereby further improving the internal circulation speed of the cold air and the hot air and improving the cooling capacity of the surface coolers.

[0060] Hereinafter, with reference to the schematic side view shown in FIG. 11B, the cooling principle of the cooling system of the data center of an exemplary embodiment of the present disclosure will be described when the network device is used as the electronic device and the liquid-cooled surface cooler is used as the surface cooler. For the cooling principle of the cooling system of the data center shown in FIG. 12, reference can be made to FIG. 11B and will not be described in detail below.

[0061] Exemplary embodiments of the present disclosure dissipate heat from main heat - generating devices such as CPUs and GPUs in network equipment by a liquid - cooled surface cooler, suck cold air in the second channel 102 through the air intake at the front end of the network equipment, that is, the front end of the system, and can cool and dissipate heat from other heat - generating members (located inside the network equipment). Next, the hot air is discharged from the exhaust port at the rear end of the network equipment to the first channel 101. The hot air enters the interior of the surface cooler 1032 through the air intake at the rear end of the surface cooler 1032, is cooled by a liquid - cooling method, and the cooled cold air is discharged from the front end of the surface cooler 1032, that is, the front end of the system, to the second channel 102. Thereby, a circulation system of cold air and hot air in the sealed system is formed to dissipate heat from the network equipment in the sealed system. Based on this, in the cooling system of the data center of the exemplary embodiments of the present disclosure, only the provision of a cooling water system by the machine room side is required, no additional cooling system is needed, and the PUE and the construction cost of the machine room are reduced.

[0062] Exemplarily, as shown in FIG. 11B, the cooling system of the data center of the exemplary embodiments of the present disclosure may include at least one exhaust device 106. Each exhaust device 106 is provided at the second air outlet of the corresponding surface cooler 1032. Thereby, by using the exhaust device 106, the speed at which the corresponding surface cooler 1032 discharges cold air is accelerated, the flow rate of the air flow inside the electronic device 1031 is increased, and the purpose of rapid temperature reduction is further achieved. The exhaust device 106 may include one or more exhaust fans or other devices capable of realizing exhaust. The arrangement method of the exhaust fan or the exhaust device can be set according to actual needs.

[0063] Exemplarily, there is an air suction device inside at least one electronic device of the exemplary embodiments of the present disclosure. This may be an air suction device such as an air suction fan that can suck the cold air in the second channel into the interior of the electronic device. When there is an air suction device inside the electronic device, the cold air in the second channel can enter the interior of the electronic device faster, and the heat - generating members inside the electronic device can be cooled down.

[0064] Exemplarily, the cooling system of the data center of the exemplary embodiment of the present disclosure includes at least one exhaust device, and at the same time, there may be an air suction device inside the electronic device. The air suction device and the exhaust device can be configured as an engine for driving the circulation of cold air and hot air in the closed system, ensuring that the pressure difference between the first channel and the second channel is close to stably cool the electronic device.

[0065] In an actual application example, the cooling structure of the exemplary embodiment of the present disclosure has a first fluid inlet and a first fluid outlet communicating with the cooling chamber. The first fluid inlet and the first fluid outlet can be designed according to the actual situation. The cooler housing has a second fluid inlet and a second fluid outlet communicating with the cooling pipes respectively, and the second fluid inlet and the second fluid outlet can be designed according to the actual situation.

[0066] The electronic device of the exemplary embodiment of the present disclosure may exemplarily have one first fluid inlet and one first fluid outlet, and the surface cooler may have a pair of second fluid inlets and a pair of second fluid outlets, but the number may be designed in other possible implementation forms. As is clear from FIGS. 11A and 11B, the electronic device 1031 of the exemplary embodiment of the present disclosure may exemplarily have one first fluid inlet and one first fluid outlet, and the surface cooler 1032 may have a pair of second fluid inlets and a pair of second fluid outlets.

[0067] Both the first fluid inlet and the second fluid inlet of the exemplary embodiment of the present disclosure communicate with the first transport pipe, thereby ensuring that the cooling fluid can be simultaneously introduced into the cooling chamber in the electronic device and the cooling pipes of the surface cooler by using the first transport pipe. Both the first fluid outlet and the second fluid outlet communicate with the second transport pipe, thereby ensuring that the cooling fluid in the cooling chamber in the electronic device and the cooling pipes of the surface cooler can be simultaneously led out by using the second transport pipe.

[0068] FIG. 13A shows a schematic rear view of a surface cooler according to an exemplary embodiment of the present disclosure, FIG. 13B shows a schematic side view of the surface cooler 1032 according to an exemplary embodiment of the present disclosure, and FIG. 13C shows a schematic front view of the surface cooler 1032 according to an exemplary embodiment of the present disclosure. As shown in FIGS. 13A to 13C, the second air inlet of the surface cooler 1032 according to the exemplary embodiment of the present disclosure is opened at the rear end of the surface cooler 1032, and the rear end of the surface cooler 1032 has a liquid supply port 1302a and a liquid return port 1302b. The liquid supply port 1302a is used as the second fluid inlet, and the liquid return port 1302b is used as the second fluid outlet. As shown in FIG. 13C, the second air outlet of the surface cooler 1032 according to the exemplary embodiment of the present disclosure is opened at the front end of the surface cooler 1032, and two rows of exhaust fans are fixed to the front end of the surface cooler 1032. Each row has four exhaust fans, which are used as the exhaust device 106.

[0069] To reduce the complexity of piping laying, as shown in FIG. 11B, the first fluid inlet, the second fluid inlet, the first fluid outlet, and the second fluid outlet all face the same first channel 101. At this time, for the same laminated structure, the first transport pipe and the second transport pipe can be laid on the same side of the laminated structure. If there are multiple laminated structures, a group of transport pipes including the first transport pipe and the second transport pipe can be arranged for each laminated structure.

[0070] In an actual application example, the first transport pipeline and the second transport pipeline of the exemplary embodiments of the present disclosure can be realized in the form of a liquid separation and collection device, and the liquid separation and collection device can be connected to the cooling water system of the machine room. The first transport pipeline corresponds to the main pipeline for liquid separation of the liquid separation and collection device, and the second transport pipeline corresponds to the main pipeline for liquid return of the liquid separation and collection device. As shown in FIGS. 11A and 11B, the first transport pipeline has a plurality of first branch ports 1051 and can be connected to the first fluid inlet of each electronic device and the second fluid inlet of the surface cooler. The second transport pipeline has a plurality of second branch ports 1052 and can be connected to the first fluid outlet of each electronic device and the second fluid outlet of the surface cooler. And at each first branch port 1051 and / or second branch port 1052, a controllable valve such as an electromagnetic valve is installed to adjust the inflow and outflow amount of the cooling fluid, and further indirectly adjust the cooling structure of the electronic device and the cooling capacity of the surface cooler.

[0071] The cooling pipe of the exemplary embodiments of the present disclosure includes a plurality of main pipes and at least one connecting pipe, and each connecting pipe communicates two adjacent main pipes. One of the plurality of main pipes communicates with the first transport pipe as an inlet pipeline, and another main pipe communicates with the second transport pipe as an outlet pipeline. The extending direction of the main pipe of the exemplary embodiments of the present disclosure can be set according to the actual situation. It should be understood that each main pipe extends along the distribution direction of the second air inlet and the second air outlet or along the height direction of the laminated structure. Here, each main pipe extends along the height direction of the laminated structure.

[0072] When the distribution directions of the second air inlet and the second air outlet are the positive directions of the first preset direction, in the transport pipe, each main pipe is distributed along the positive direction of the first preset direction. In this case, along the height direction of the laminated structure, the cooling fluid in each main pipe can uniformly cool the hot air entering the cooler housing, and the cooling capacity of the cooling fluid in each main pipe decreases along the positive direction of the first preset direction. Since the second air inlet and the second air outlet are distributed along the positive direction of the first preset direction, along the positive direction of the first preset direction, the hot air entering the cooler housing becomes lower in temperature and turns into cold air. Therefore, even if the cooling capacity of the cooling fluid in each main pipe decreases along the positive direction of the first preset direction, the supply of cold energy for cooling the hot air can be ensured.

[0073] To accelerate the temperature reduction rate of the hot air by the cooling fluid, each surface cooler further has a heat dissipation fin module provided in the cooler housing, and the heat dissipation fin module is provided on the cooling pipe. The cooling fluid in the cooling pipe can transfer cold energy to the heat dissipation fin module through the cooling pipe. Since the heat dissipation fin module has a large heat dissipation area, it provides a large surface contact area for the hot air, and the cooling efficiency of the surface cooler can be further improved. For example, the heat dissipation fin module of the exemplary embodiment of the present disclosure may be a fin-shaped heat dissipation module, or may include a plurality of heat dissipation fins provided on the cooling pipe.

[0074] FIG. 14 shows an electrical circuit diagram of the automated control of the exemplary embodiment of the present disclosure. As shown in FIG. 14, the cooling system of the data center of the exemplary embodiment of the present disclosure may further include a first sensing assembly 107 and a first control module 108 that communicates with the first sensing assembly. The first control module 108 further communicates with the exhaust device 106 and the surface cooler 1032 respectively. The communication method may be a normal wired communication method or a wireless communication method.

[0075] Exemplarily, the first sensing assembly is used to collect the temperature of at least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet. The first control module is used to obtain at least one temperature and increase the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler when it is determined that at least one temperature meets the preset cooling condition. It should be understood that a temperature sensor or a humidity sensor can be installed at at least one location of the first air inlet, the second air inlet, the first air outlet, and the second air outlet.

[0076] In one example, when at least one temperature includes the temperature of the first air inlet, the temperature of the second air inlet, the temperature of the first air outlet, or the temperature of the second air outlet, the preset cooling condition may be that at least one temperature is below the preset temperature. The preset temperature may be a fixed value or a range value.

[0077] When at least one temperature includes the temperature of the first air inlet or the temperature of the second air outlet, essentially, the temperature of the cold air entering the electronic device or the temperature of the cold air introduced into the second channel from the surface cooler is detected. At this time, the preset temperature may be selected as 45°C. When at least one temperature includes the temperature of the second air inlet or the temperature of the first air outlet, essentially, the temperature of the hot air introduced into the first channel from the electronic device or the temperature of the hot air entering the surface cooler is detected. At this time, the preset temperature may be selected as 65°C.

[0078] In another example, when at least one temperature includes the temperature of the first air inlet and the temperature of the first air outlet, the preset cooling condition is that the temperature difference between the first air inlet and the first air outlet is below the preset temperature difference threshold. That is, when the temperature difference between the first air inlet and the first air outlet is below the preset temperature difference threshold, it means that the cold air provided by the surface cooler does not effectively cool the heat-generating components inside the electronic device. Therefore, it is necessary to increase the exhaust capacity of the exhaust device or increase the cooling capacity of the surface cooler, and further, the exhaust capacity of the exhaust device and the cooling capacity of the surface cooler can be increased simultaneously.

[0079] When at least one temperature includes the temperature of the second air inlet and the temperature of the second air outlet, the preset cooling condition is that the temperature difference between the second air inlet and the second air outlet is equal to or less than a preset temperature difference (such as 5 °C). That is, when the temperature difference between the second air inlet and the second air outlet is less than the preset temperature difference, it means that the cooling capacity of the surface cooler is not sufficient, and the exhaust capacity of the exhaust device can be increased, or the cooling capacity of the surface cooler can be increased. Furthermore, the exhaust capacity of the exhaust device and the cooling capacity of the surface cooler can be increased simultaneously.

[0080] In one example, regardless of what preset cooling conditions are used, when increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler, the influence of the ambient temperature can be considered. For example, in summer, the ambient temperature is high, and after the temperature is reduced by the surface cooler, the cold air may rapidly warm up. Therefore, the factor of the ambient temperature can be introduced into the adjustment of the exhaust capacity and / or the cooling capacity. For example, in the case of the same temperature or temperature difference, in order to balance the influence of the ambient temperature, it is necessary to appropriately increase the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler in summer compared to winter.

[0081] In an actual application example, a theoretical adjustment parameter can be determined based on at least one temperature, and the theoretical adjustment parameter can be corrected using a correction parameter.

[0082] When the theoretical adjustment parameter includes the theoretical adjustment parameter of the exhaust device, the correction parameter includes the ambient temperature correction parameter for correcting the exhaust device. When the theoretical adjustment parameter includes the theoretical adjustment parameter of the surface cooler, the correction parameter includes the ambient temperature correction parameter of the surface cooler.

[0083] Here, when increasing the exhaust capacity of the exhaust device, taking the exhaust fan as an example, by increasing the rotational speed of the drive motor of the exhaust fan, the exhaust capacity of the exhaust fan can be improved. When increasing the cooling capacity of the surface cooler, the flow rate of the cooling fluid at the second fluid inlet and the second fluid outlet of the surface cooler can be accelerated. For example, by controlling the controllable valve at the first branch port connected to the second fluid inlet and / or the controllable valve at the second branch port connected to the second fluid outlet to increase the flow rate of the cooling fluid at the second fluid inlet and the second fluid outlet, the cooling capacity of the surface cooler can be improved.

[0084] Taking the temperature of the second exhaust port as an example, when the temperature of the second exhaust port is higher than the preset temperature, it can be set so that the flow rate adjustment parameter of the cooling fluid corresponding to the temperature of the second exhaust port can be obtained based on the correspondence between the temperature and the flow rate adjustment parameter of the cooling fluid. Similarly, taking the temperature of the second intake port and the temperature of the second exhaust port as an example, when the temperature difference between the second intake port and the second exhaust port is higher than the preset temperature, it can be set so that the flow rate adjustment parameter of the cooling fluid can be obtained based on the correspondence between the temperature difference and the flow rate adjustment parameter of the cooling fluid.

[0085] From this, the influence of the ambient temperature on the adjustment parameter of the cooling fluid can be selectively considered, the adjustment parameter of the cooling fluid can be corrected using the correction parameter related to the ambient temperature to offset the error caused by the ambient temperature, or the flow rate of the surface cooler can also be adjusted directly using the adjustment parameter of the cooling fluid.

[0086] Considering that the ambient temperature in summer is high and it is difficult for the surface cooler to cool down the hot air, the cooling capacity of the surface cooler can be further increased. For example, when the ambient temperature is 30°C to 35°C, the first correction parameter of the adjustment parameter of the cooling fluid exists correspondingly. When the ambient temperature is higher than 35°C, the second correction parameter of the adjustment parameter of the cooling fluid exists correspondingly, and the ability of the second correction parameter to correct the adjustment parameter of the cooling fluid is greater than the ability of the first correction parameter to correct the adjustment parameter of the cooling fluid. Assuming that the ambient temperature is 38°C, after obtaining the flow rate adjustment parameter of the cooling fluid, add the influence parameter of the second ambient temperature to the flow rate adjustment parameter of the cooling fluid to obtain the corrected flow rate adjustment parameter of the cooling fluid.

[0087] Considering that the ambient temperature in winter is high, the surface cooler can easily cool down the hot air. The cooling capacity of the surface cooler can be reduced. For example, when the ambient temperature is -15°C to -5°C, the third correction parameter of the adjustment parameter of the cooling fluid exists correspondingly. When the ambient temperature is higher than -5°C and below 5°C, the fourth correction parameter of the adjustment parameter of the cooling fluid exists correspondingly, and the ability of the third correction parameter to correct the adjustment parameter of the cooling fluid is greater than the ability of the fourth correction parameter to correct the adjustment parameter of the cooling fluid. Assuming that the ambient temperature is -8°C, after obtaining the flow rate adjustment parameter of the cooling fluid, subtract the influence parameter of the fourth ambient temperature from the flow rate adjustment parameter of the cooling fluid to obtain the corrected flow rate adjustment parameter of the cooling fluid.

[0088] In addition, the first control module of the exemplary embodiment of the present disclosure can monitor the temperatures of the main heat-generating components of electronic devices such as CPUs and GPUs. When the temperature of any one of the main heat-generating components in a specific electronic device exceeds the temperature limit (80°C or 80°C and above, etc.), by increasing the opening degrees of the controllable valves at the first branch port connected to the first fluid inlet and the second branch port connected to the first fluid outlet of the electronic device, the electronic device can be rapidly cooled down. The cooling method, the selection of the opening degree, etc. can refer to the related technologies and will not be described in detail here.

[0089] FIG. 15 shows an electrical circuit diagram of another automated control of an exemplary embodiment of the present disclosure. As shown in FIG. 15, the cooling system of the data center of the exemplary embodiment of the present disclosure further includes a second sensing assembly 109 and a second control module 110 that communicates with the second sensing assembly 109. The second control module 110 further communicates with an exhaust device 106 and an air suction device 111 respectively. The communication method can select wired communication or wireless communication and can be selected according to the actual situation. Integrating the functions of the first control module and the second control module, it can be used as a control platform for the cooling system of the data center to optimize the performance of the cooling system of the data center.

[0090] The second sensing assembly of the exemplary embodiment of the present disclosure is used to collect the pressure values of the first channel and the second channel. The second control module obtains the pressure values of the first channel and the second channel, and when it is determined that the pressure difference between the first channel and the second channel is equal to or greater than a preset pressure difference, it is used to reduce the exhaust capacity of the exhaust device and / or the air suction capacity of the air suction device. The preset pressure difference may be 10% of the standard atmospheric pressure or less than 10% of the standard atmospheric pressure so that the pressure difference between the first channel and the second channel can be as close as possible to 1 atmosphere. When the laminated structure is located in the sealed housing and the pressure difference is controlled within this range, the inside of the sealed housing does not easily leak, thereby reducing the possibility of heat exchange with the external environment.

[0091] In an actual application example, the second sensing assembly may include a plurality of pressure sensors, which are divided into two groups and are respectively provided in the first channel and the second channel. The pressure value collected by each pressure sensor provided in the first channel is the pressure value of the first channel, and the pressure value collected by each pressure sensor provided in the second channel is the pressure value of the second channel.

[0092] When the exhaust capacity is an exhaust fan and the air suction device is an air suction fan, the pressure difference between the first channel and the second channel can be controlled by adjusting the motor rotation speed of the exhaust fan and / or the air suction fan. For example, a correspondence relationship between the pressure difference and the motor rotation speed of the exhaust fan and / or the air suction fan can be created. When the pressure difference between the first channel and the second channel is equal to or greater than a preset pressure difference, the target motor rotation speed of the exhaust fan and / or the air suction fan is obtained from the correspondence relationship based on the pressure difference, and then the motor rotation speed of the exhaust fan and / or the air suction fan is controlled based on the target motor rotation speed, whereby the pressure difference between the first channel and the second channel can be controlled.

[0093] Exemplary embodiments of the present disclosure may further provide a data center machine room that may include a cooling system for the data center of the exemplary embodiments of the present disclosure, and the beneficial effects thereof can be referred to the above description and will not be described in detail here.

[0094] In an alternative form, the data center machine room of the exemplary embodiments of the present disclosure may include a plurality of cabinets, and these cabinets can be arranged according to actual needs. One or more of the plurality of cabinets may be the various possible data center cooling systems described above.

[0095] In an alternative form, the data center machine room of the exemplary embodiments of the present disclosure may include a plurality of stacked structures, the data center machine room is sealed, and the plurality of stacked structures may be distributed in the manner shown in FIG. 12 or in a manner similar to the principle of FIG. 12.

[0096] In an alternative form, the data center machine room of the exemplary embodiments of the present disclosure may include one or more cabinets and one or more stacking structures. The structure of the cabinet may be a normal structure, or may be the various possible data center cooling systems described above. The stacking structure may be any of the various possible stacking structures described above, and the cooling principle of the included electronic devices may similarly refer to the related descriptions above.

[0097] The exemplary embodiments of the present disclosure further disclose a data center cooling method applicable to the data center cooling system of the exemplary embodiments of the present disclosure. The cooling of the data center has a plurality of cooling cycles. FIG. 16 shows a schematic flow chart of the method of each cooling cycle of the exemplary embodiments of the present disclosure. As shown in FIG. 16, each cooling cycle includes Step 201 of discharging hot air from the first air outlet of each electronic device to the first channel, Step 202 of introducing the hot air in the first channel into the surface cooler through the second air inlet of each surface cooler and cooling the hot air by the surface cooler, Step 203 of discharging cold air from the second air outlet of each surface cooler to the second channel, Step 204 of introducing the cold air in the second channel into the electronic device through the first air inlet of each electronic device and absorbing the heat dissipated from the internal assembly of the electronic device by the cold air.

[0098] In an alternative form, when the data center cooling system to which the data center cooling method of the exemplary embodiments of the present disclosure is applied includes a first control module and a first sensing assembly, FIG. 17 shows a schematic diagram of the cooperation process between the first control module and the first sensing assembly of the exemplary embodiments of the present disclosure. As shown in FIG. 17, each cooling cycle includes Step 301 of the first sensing assembly collecting the temperature of at least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet, The first control module further includes step 302 of obtaining at least one temperature and increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler when it is determined that at least one temperature meets a preset cooling condition.

[0099] Exemplarily, when at least one temperature includes the temperature of the first air inlet, the temperature of the second air inlet, the temperature of the first air outlet, or the temperature of the second air outlet, the preset cooling condition is that at least one temperature is below a preset temperature.

[0100] When at least one temperature includes the temperature of the first air inlet and the temperature of the first air outlet, the preset cooling condition is that the temperature difference between the first air inlet and the first air outlet is below a preset temperature difference.

[0101] When at least one temperature includes the temperature of the second air inlet and the temperature of the second air outlet, the preset cooling condition is that the temperature difference between the second air inlet and the second air outlet is below a preset temperature difference.

[0102] Exemplarily, the step of increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler includes determining a theoretical adjustment parameter based on at least one temperature and correcting the theoretical adjustment parameter using a correction parameter.

[0103] When the theoretical adjustment parameter includes the theoretical adjustment parameter of the exhaust device, the correction parameter includes the ambient temperature correction parameter for correcting the exhaust device, and / or when the theoretical adjustment parameter includes the theoretical adjustment parameter of the surface cooler, the correction parameter includes the ambient temperature correction parameter of the surface cooler.

[0104] In an alternative form, the cooling method of the exemplary embodiment of the present disclosure is applied to the cooling system of the data center. The cooling system of the data center has a second sensing module and a second control module. FIG. 18 shows a schematic diagram of the cooperation process between the second control module and the second sensing assembly of the exemplary embodiment of the present disclosure. As shown in FIG. 18, each of the cooling cycles includes Step 401 in which the second sensing assembly collects the pressure difference between the first channel and the second channel, The second control module further includes step 402 of obtaining the pressure difference between the first channel and the second channel, and reducing the exhaust capacity of the exhaust device and / or the air suction capacity of the air suction device when it is determined that the pressure difference is greater than or equal to a preset pressure difference.

[0105] The cooling method of the data center of the exemplary embodiment of the present disclosure can refer to the beneficial effects of the cooling system of the data center of the exemplary embodiment of the present disclosure, and will not be described in detail here.

[0106] In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0107] The above content is only a specific embodiment of the present disclosure, and the protection scope of the present disclosure is not limited thereto. Within the technical scope disclosed by the present disclosure, all changes and substitutions that can be easily conceived by those skilled in the art should fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should follow the protection scope of the claims.

Claims

1. A cooling system for a data center, having a first channel and a second channel, wherein the cooling system of the data center includes a laminated structure located between the first channel and the second channel, the laminated structure includes at least one stacked electronic device and at least one surface cooler, each of the electronic devices has a first air inlet and a first air outlet, each of the surface coolers has a second air inlet and a second air outlet, the first air outlet and the second air inlet all face one side of the first channel, and the first air inlet and the second air outlet all face one side of the second channel. A cooling system for a data center.

2. Further including a first transport pipe and a second transport pipe, each of the surface coolers has a cooler housing and a cooling pipe provided in the cooler housing, the second air inlet and the second air outlet are opened in the cooler housing, and the cooling pipes communicate with the first transport pipe and the second transport pipe respectively. The cooling system for a data center according to claim 1.

3. The cooling pipe includes a plurality of main pipes and at least one connection channel, each of the connection pipes communicates two adjacent main pipes, one of the main pipes communicates with the first transport pipe, and another one of the main pipes communicates with the second transport pipe. The cooling system for a data center according to claim 2.

4. Each of the surface coolers further has a heat dissipation fin module provided in the cooler housing, and the heat dissipation fin module is provided on the cooling pipe. The cooling system for a data center according to claim 2 or 3.

5. Each of the electronic devices has a cooling structure, the cooling structure has a cooling chamber, and the cooling chambers communicate with the first transport pipe and the second transport pipe respectively. The cooling system for a data center according to any one of claims 2 to 4.

6. The cooling structure has a first fluid inlet and a first fluid outlet communicating with the cooling chamber, and the cooler housing has a second fluid inlet and a second fluid outlet communicating with the cooling pipe respectively. Both the first fluid inlet and the second fluid inlet communicate with the first transport pipe, both the first fluid outlet and the second fluid outlet communicate with the second transport pipe, and the first fluid inlet, the second fluid inlet, the first fluid outlet, and the second fluid outlet all face the same first channel. The cooling system for a data center according to claim 5.

7. Further including a sealed housing, at least one group of the laminated structures is located within the sealed housing, the first channel and the second channel are alternately distributed within the sealed housing along a first preset direction, each group of the laminated structures is located between the adjacent first channel and the second channel, and the laminated structures of the same group include at least one laminated structure. The cooling system for a data center according to any one of claims 1 to 6.

8. Each of the electronic devices is a liquid-cooled electronic device, and each of the surface coolers is a liquid-cooled surface cooler. The cooling system for a data center according to any one of claims 1 to 7.

9. Further including at least one exhaust device, each exhaust device is provided at the first air outlet of the corresponding surface cooler, and there is an air suction device inside at least one of the electronic devices. The cooling system for a data center according to any one of claims 1 to 8.

10. Further including a first sensing assembly and a first control module communicating with the first sensing assembly, the first control module further communicates with the exhaust device and the surface cooler respectively, The first sensing assembly is used to collect at least one temperature of the first air inlet, the second air inlet, the first air outlet, and the second air outlet, and the first control module is used to obtain the at least one temperature and increase the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler when it is determined that the at least one temperature matches a preset cooling condition. The cooling system for a data center according to claim 9.

11. Further including a second sensing assembly and a second control module communicating with the second sensing assembly, the second control module further communicates with the exhaust device and the air suction device respectively, The second sensing assembly is used to collect the pressure values of the first channel and the second channel. The second control module obtains the pressure values of the first channel and the second channel, and when it is determined that the pressure difference between the first channel and the second channel is greater than or equal to a preset pressure difference, it is used to reduce the exhaust capacity of the exhaust device and / or the air suction capacity of the air suction device. The cooling system of the data center according to claim 10.

12. A data center machine room including the cooling system of the data center according to any one of claims 1 to 11.

13. A cooling method for a data center, which is applied to the cooling system of the data center according to any one of claims 1 to 11. The cooling method for the data center has a plurality of cooling cycles, and each of the cooling cycles includes: A step in which a first air outlet of each electronic device discharges hot air into a first channel; A step in which a second air inlet of each surface cooler introduces the hot air in the first channel into the surface cooler, and the surface cooler cools the hot air; A step in which a second air outlet of each of the surface coolers discharges cold air into a second channel; A step in which a first air inlet of each of the electronic devices introduces the cold air in the second channel into the electronic device, and the cold air absorbs heat dissipated from an internal assembly of the electronic device. The cooling method for a data center.

14. The cooling method for the data center is applied to the cooling system of the data center according to claim 10. Each of the cooling cycles includes: A step in which a first sensing assembly collects the temperature of at least one of the first air inlet, the second air inlet, the first air outlet, and the second air outlet; A step in which a first control module obtains the at least one temperature, and when it is determined that the at least one temperature matches a preset cooling condition, increases the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler. The cooling method for the data center according to claim 13.

15. The at least one temperature includes the temperature of the first air inlet, the temperature of the second air inlet, the temperature of the first air outlet, or the temperature of the second air outlet. The preset cooling condition is that the at least one temperature is less than or equal to a preset temperature, or The at least one temperature includes the temperature of the first air inlet and the temperature of the first air outlet, and the preset cooling condition is that the temperature difference between the first air inlet and the first air outlet is equal to or less than a preset temperature difference, or The at least one temperature includes the temperature of the second air inlet and the temperature of the second air outlet, and the preset cooling condition is that the temperature difference between the second air inlet and the second air outlet is equal to or less than a preset temperature difference. The method for cooling a data center according to claim 14.

16. The step of increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler includes determining a theoretical adjustment parameter based on the at least one temperature and correcting the theoretical adjustment parameter using a correction parameter, wherein the theoretical adjustment parameter includes a theoretical adjustment parameter of the exhaust device, and the correction parameter includes an ambient temperature correction parameter for correcting the exhaust device, and / or the theoretical adjustment parameter includes a theoretical adjustment parameter of the surface cooler, and the correction parameter includes an ambient temperature correction parameter of the surface cooler. The method for cooling a data center according to claim 14 or 15.

17. The method for cooling the data center is applied to the cooling system of the data center according to claim 11, and each of the cooling cycles The second sensing assembly collects the pressure values of the first channel and the second channel, and The second control module obtains the pressure values of the first channel and the second channel, and when it is determined that the pressure difference between the first channel and the second channel is equal to or greater than a preset pressure difference, further includes the step of reducing the exhaust capacity of the exhaust device and / or the air suction capacity of the air suction device. The method for cooling a data center according to any one of claims 13 to 16.

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